JP5783652B2 - Attitude correction device and electrical component inspection device - Google Patents

Description

  The present invention relates to an attitude correction apparatus that forms a process processing unit of an electrical component inspection apparatus that performs process processing on a device such as a semiconductor device or an electronic component, and corrects the position of the conveyed device, and an electrical component inspection apparatus.

  In the manufacturing process of electronic components, an apparatus for transporting products while inspecting them is indispensable. For example, in a manufacturing process of a discrete semiconductor such as a diode or a small semiconductor product such as a small pin IC, an electrical component inspection apparatus is used as an apparatus for transporting the product while inspecting it. The most common electrical inspection equipment is equipped with a test device for testing the electrical characteristics of products, a marking device for marking on the product surface, a taping device for packing the product in a carrier tape, etc., a turntable, etc. The process of each process is performed while transporting electronic components to each apparatus by the transport unit.

  The method of supplying the electronic component from the assembly process to the electrical component inspection apparatus includes a method of supplying an electronic component that is affixed to an adhesive sheet (such as a UV sheet) on a wafer ring and separated into pieces by dicing, There are a method in which electronic components are mounted on a lead frame and supplied by a lead frame supply unit, or a method in which the electronic components are supplied in a predetermined direction and orientation by a vibrating parts feeder.

  In these supply methods, for example, when picking up from a wafer ring by a push-up pin, a positional deviation occurs when the electronic component is sucked and held by a collet or a suction nozzle of an electric component inspection apparatus. In addition, there is a risk that the posture may change after being separated into pieces by the mold even in the lead frame supply, and even in the supply of the parts feeder, the electronic parts are not necessarily supplied in an accurate posture due to the vibration of the parts feeder or the like. .

  If the electronic component is not held in the correct posture in the collet or suction nozzle, it will go through each processing step as it is, and the electronic component will not be processed accurately in each processing step, resulting in a semiconductor The processing accuracy of the manufacturing apparatus is lowered and the operation rate is lowered.

  Further, the cause of the deviation of the posture of the electronic component held by the collet or the suction nozzle of the electric component inspection apparatus and conveyed between the process steps is not limited to the time of supply to the electric component inspection apparatus. For example, at the time of delivery of an electronic component being transported to each process processing mechanism or at the time of contact with an electronic component (electrical test), the transport itself becomes a cause of a deviation in posture.

  Therefore, an apparatus for correcting the posture of an electronic component as in Patent Document 1 is known. In this attitude correction device, the attitude information of the electronic component captured at the previous imaging position of the attitude correction apparatus is compared with the attitude information of the electronic component registered in advance, whereby the deviation amount of the attitude of the electronic component is expressed in the XYθ axis. Calculate for each direction. Then, the posture correction apparatus at the next stage of the imaging position corrects the posture of the electronic component based on the calculated shift amount for each calculated XYθ axis direction.

JP 2009-286490 A

  However, in the invention of Patent Document 1, it is necessary to register the posture information of the electronic component, but there is no guarantee that the posture of the electronic component to be registered is correct. That is, it is difficult to prepare an electronic component that holds the correct posture in order to register the correct posture.

  The present invention has been proposed in order to solve the above-described problems of the prior art, and its purpose is not to register posture information in advance, that is, to put a product in a correct posture for registration. It is an object to provide an attitude correction device and an electrical component inspection device that do not need to be performed.

In order to achieve the above object, the present invention provides an attitude correction device that corrects the attitude of an electronic component conveyed along a conveyance path, the conveyance unit conveying the electronic component along the conveyance path, A jig that removably attaches to the transport means and imitates the position and orientation of an electronic component that is transported in a correct posture, an imaging means that is installed on the transport path and images the electronic component, and the imaging means The imaging means, comprising: a detecting means for detecting a deviation of the posture of the electronic component based on the obtained image; and a correcting means that is installed on the conveyance path and that eliminates the deviation detected by the detecting means. Is pre-adjusted prior to transporting the electronic component such that the jig is imaged, and the position and orientation of the imaged jig and the origin in the imaging system of the imaging means coincide. Inspection Means, detecting a deviation of the posture of the electronic component to be transported relative to the origin in the imaging system of the imaging means, characterized by.

The defined area is defined by one point in the image and each direction of two orthogonal axes, a predetermined point of the jig coincides with one point in the image, and two orthogonal sides of the jig are The installation position and orientation of the imaging unit may be adjusted along the two orthogonal axes.
The origin in the imaging system of the imaging means is defined by one point and two orthogonal directions, and one predetermined point of the jig coincides with the origin in the imaging system of the imaging means and is orthogonal to the jig. as the two sides along the two orthogonal axes, the installation position and orientation of the imaging means may be adjusted.

  The tip portion of the jig may be rectangular.

The correction unit includes a biaxial movement mechanism that performs correction for eliminating a positional deviation in the image of an electronic component that is actually conveyed and an origin of the image pickup unit in the image pickup unit, and an image pickup system in the image pickup unit. You may provide the origin and the 1-axis direction moving mechanism which correct | amends which eliminates the shift | offset | difference of the direction in the said image of the electronic component actually conveyed.

  Furthermore, an electronic component inspection apparatus including the attitude correction apparatus as described above is also an aspect of the present invention.

  According to the present invention, posture correction of a device such as a semiconductor device or an electronic component can be performed without having to register posture information in advance, and the posture of the electronic component can be recognized by the posture correction apparatus. Thereby, the attitude | position correction apparatus which raised the positioning precision, and an electrical component inspection apparatus provided with the same can be provided.

It is a figure which shows schematic structure of the electrical component inspection apparatus in embodiment of this invention. It is a figure which shows schematic structure of the imaging unit in embodiment of this invention. It is a figure which shows the acquisition method of XY (theta) origin in the imaging means of embodiment of this invention. It is a figure which shows schematic structure of the correction | amendment unit in embodiment of this invention. It is a block diagram which shows the structure of the control part of the correction | amendment unit of embodiment of this invention. It is a flowchart which shows the effect | action of the attitude | position correction apparatus in embodiment of this invention.

  DESCRIPTION OF EMBODIMENTS Embodiments of an attitude correction apparatus according to the invention and an electrical component inspection apparatus including the same will be described in detail with reference to the drawings. First, with reference to FIG. 1 and 2, the structure of an attitude | position correction apparatus and an electrical component inspection apparatus provided with the same is demonstrated. FIG. 1 is a diagram showing a schematic configuration of an electrical component inspection apparatus. FIG. 2 is a diagram illustrating a schematic configuration of the posture correction apparatus.

[1. Constitution]
[1-1. Configuration of electrical component inspection apparatus equipped with attitude correction device]
The role when the posture correction apparatus of this embodiment is incorporated in the electrical component inspection apparatus 1 is shown in FIG. 1 as an example. The electrical component inspection apparatus 1 shown in FIG. 1 is attached to a turntable T having 12 positions P1 to P12 as positions P that are stopped while rotating intermittently, and to each of the 12 divided positions of the turntable T. A suction holding mechanism V for sucking and holding the electronic component W, and a motor M for rotating the turntable T into 12 parts intermittently.

  The suction holding mechanism V is a suction nozzle V1 that sucks and detaches the electronic component W. The suction nozzle V1 is movable up and down with respect to the turntable T by a support portion (not shown) attached to the outer peripheral end of the turntable T. A drive unit including an operation rod is disposed immediately above the suction nozzle V1, and the suction nozzle V1 descends when the operation rod comes into contact with the upper end of the suction nozzle V1 and is pushed downward. The inside of the pipe of the suction nozzle V1 communicates with a pneumatic circuit of a vacuum generator (not shown). The suction nozzle V1 sucks the electronic component W by generating a negative pressure and releases the electronic component W by vacuum break.

  The electrical component inspection apparatus 1 further includes a process processing device E that performs various processes on the electronic component W as described below immediately below the 12 stop positions P1 to P12. The various process processes are mainly inspection processes after each assembly process such as dicing, mounting, bonding, and sealing. Position correction, appearance inspection, test contact, marking, sorting, sorting, and packing process Is included.

  As shown in FIG. 1, the electrical component inspection apparatus 1 sets the supply device A to which an electronic component W is supplied from an external device such as a parts feeder, a lead frame, a wafer ring, or a tube as the most upstream (P1). Various process processing apparatuses E (P2 to P12) are provided in the rotation direction of the turntable T.

  An imaging unit B that performs imaging process processing is provided at a position downstream of the most upstream supply position P1. The imaging unit B detects the posture of the electronic component W that is sucked and held by the sucking and holding mechanism V. At the next position of the imaging unit B, there is provided a stage for temporarily placing the electronic component W sucked and held by the sucking and holding mechanism V, and an attitude correction unit C for correcting the attitude of the electronic component W. Prepare. At the next position of the posture correction unit C, an imaging unit D that performs an imaging process is provided. Similar to the imaging unit B, the imaging unit D detects the attitude of the electronic component W sucked and held by the suction holding mechanism V.

  The image pickup unit B and the posture correction unit C cooperate to constitute a posture correction device that performs correction processing of the posture of the electronic component W sucked and held by the suction holding mechanism V. That is, the posture information of the electronic component W is detected by the imaging unit B, and when the deviation of the posture of the electronic component W is detected from the posture information, the posture correction unit C is configured to correct the posture of the electronic component W. Is done.

  As described above, as a process processing mechanism other than the posture correction device that performs the posture correction processing of the electronic component W, a marking unit, an appearance inspection unit, an electrical test unit, a defective product discharge unit, a sorting / sorting unit, a taping unit, and the like are arranged. ing. These various process processing mechanisms surround the turntable T and are arranged at equal intervals in the outer circumferential direction. The arrangement interval is the same as or equal to an integral multiple of the rotation angle of one pitch of the turntable T.

  The electrical component inspection apparatus 1 includes a control unit (not shown), and sends electrical signals to a direct drive motor that rotates the turntable T, a drive unit that moves the suction nozzle V1 up and down, a vacuum generation device, and various process processing mechanisms. By doing so, these operation timings are controlled.

  That is, the control unit includes a ROM, a CPU, and a driver that store a control program, and outputs an operation signal at each timing to each drive mechanism via the interface according to the control program.

[1-3. Configuration of Imaging Units B and D]
Next, the configuration of the imaging units B and D will be described with reference to FIG. FIG. 2 is a schematic diagram illustrating a configuration of the imaging unit. As shown in FIG. 2, the imaging unit 24 of the imaging unit is disposed below and below the position where the electronic component W attracted and held by the suction holding mechanism V is stopped. The image pickup means 24 of the image pickup unit is configured to take an image of the electronic component W from below and recognize the posture deviation.

  Specifically, an illumination 21 for facilitating imaging is disposed below the electronic component W at a position close to the position where the electronic component W stops. Further, a prism 22 that converts the optical axis from the electronic component W to a right angle direction is disposed at a position away from the illumination 21 in a direction opposite to the position where the electronic component W stops. In the present embodiment, the prism 22 is configured to convert the optical axis that has entered in the vertical direction from the position where the electronic component W stops to the horizontal direction. Then, the image pickup means 24 which is an image pickup means provided with a lens 23 at a position which is converted from the position vertically lowered from the position where the electronic component W stops to the horizontal direction and toward the outer peripheral direction of the turntable T. Is provided.

  Here, in the imaging means 24 of the present embodiment, the optical axis is converted by the prism 22 and the imaging means 24 is arranged in the horizontal direction in consideration of the arrangement space to the electrical component inspection apparatus 1. It is a configuration. That is, as shown in FIG. 1, the electrical component inspection apparatus 1 includes a turntable T in the upper part, and a motor M that rotationally drives the turntable T and a drive control of the entire electrical part inspection apparatus 1 in the lower part. In general, a space in a lower region of the suction nozzle V1 is limited because the control device, the vacuum mechanism for the suction holding mechanism V, and the like are provided. Therefore, in the present embodiment, the configuration of the posture recognition means 2 is arranged in the outer peripheral direction of the turntable T to deal with such an arrangement space problem.

[1-4. Method for obtaining XYθ origin in imaging unit of imaging unit]
A method of acquiring the XY origin and the θ-axis reference line of the imaging unit 24 of the imaging unit will be described with reference to FIG. The imaging unit detects a deviation in the posture of the electronic component W that is sucked and held by the sucking and holding mechanism V. Since this positional deviation is based on the XY origin and the θ-axis reference line of the imaging means 24 of the imaging unit, an accurate origin acquisition method is required.

  This origin acquisition method does not store the attitude information of the electronic component W to be conveyed, and the tangential direction of the conveyance path on the circumference of the turntable T is the X axis, and the circumference of the turntable T is accurately determined. The divided radial direction is set as the Y axis, and the intersection of the XY axes is set as the origin O ′. A straight line connecting the origin O ′ and the origin and the center O of the turntable T is used as a reference line of the θ axis, and the intersection of these XY axes is obtained from the origin O ′ and the reference line of the θ axis.

  Specifically, a jig having a square tip is attached instead of the suction nozzle of the suction holding mechanism V. This jig is attached so that the reference line of the θ axis and one side of the square of the jig are parallel.

  Next, the suction surface of the jig is recognized by the imaging means 24 of the imaging unit, and a quadrangle that matches the jig tip shape is set in the field of view (FIG. 3A). The midpoint of this rectangle is set as the origin XY of the XY axis, and the XY origin is registered as the reference line of the θ axis parallel to one side of the rectangle.

  Then, the transfer table coordinate origin, the coordinate origin of various processing units, the XY origin of the imaging means of the imaging unit, and the θ reference line are matched (FIG. 3B). Thereby, if the attitude | position correction | amendment of the electronic component W conveyed by the detection result in an imaging unit is performed, the electronic component W can be conveyed with a correct attitude | position to a conveyance table and various processing units.

[1-5. Posture correction unit]
Next, the configuration of the posture correction unit will be described with reference to FIG. FIG. 4 is a schematic diagram illustrating a configuration of an attitude correction unit including an XYθ moving mechanism. As shown in FIG. 4, the posture correction unit includes an X-axis movement mechanism E1 in the X-axis direction that is a tangential direction (depth direction in the drawing) of the turntable T and a radial direction ( And a Y-axis moving mechanism E2 in the Y-axis direction that is the left-right direction in the drawing). Further, a θ-direction moving mechanism E4 that rotates the suction stage S by θ degrees with respect to the reference line of the θ-axis by moving the suction stage base E3 is provided.

  More specifically, the suction stage base E3 including the suction stage S is mounted on an arm E5 extending in the Y-axis direction. This arm E5 is arranged on the upper base E6, and is configured to be movable in the Y-axis direction by a Y-axis ball screw E7 via the power of the Y-axis drive motor M1 also arranged on the upper base E6.

  Further, the upper pedestal E6 is mounted on a lower pedestal E8 provided below the lower pedestal E8. The lower pedestal E8 is an X-axis drive motor M2 having a rotational axis directed in the depth direction in the figure, which is the X direction. The rotational force is transmitted by the pulley E9 and the belt E10, and the X-axis ball screw E11 provided immediately below the lower base E8 is driven to move in the X direction.

  Further, a θ-axis drive motor M3 that rotates the suction stage base E3 by θ angle is disposed below the end of the arm E5 where the suction stage base E3 is disposed. The θ-axis drive motor M3 is configured to rotate the suction stage base E3 via a θ-axis attenuator.

[1-6. Configuration of control unit]
The captured image captured by the imaging unit of the imaging unit is output to a control unit (not shown). The control unit 3 detects the shift amount of the electronic component W based on the input captured image, and outputs signals to the X-axis motor M2, the Y-axis motor M1, and the θ-axis motor M3 of the posture correction unit. The suction stage S is configured to move. This control unit is configured to move the suction stage S on which the electronic component W is placed based on the detection result of the imaging means of the imaging unit in combination with the attitude correction unit. Hereinafter, an image processing method using binarization will be described as a method for detecting the amount of deviation of the electronic component W.

  FIG. 5 is a diagram illustrating a configuration of the control unit. The control unit 3 detects a deviation amount from the imaging data of the imaging means of the input imaging unit, and based on the result detected by the detection unit 31, the X-axis motor M2, the Y-axis motor M1, and θ of the attitude correction unit. The signal generator 35 outputs a control signal to the shaft motor M3.

  In the control unit 3, the binarization conversion unit 32 that binarizes the input captured image, the contour extraction unit 33 that detects a contour based on the binarized data, and the electronic component W based on the detected contour And a deviation amount calculation unit 34 for detecting the deviation.

  The signal generation unit 35 calculates the moving distance of the suction stage S necessary for the electronic component W to have a correct posture according to the calculated deviation amount, and drives the X-axis drive motor M1, the Y-axis drive motor M2, and the θ-axis drive. A drive signal for driving the motor M3 by that distance is generated and output.

  Although the embodiment of the present invention has been described above, this embodiment is presented as an example and is not intended to limit the scope of the invention. The novel embodiment can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. And this embodiment and its deformation | transformation are included in the invention described in the claim, and its equivalent range while being included in the range and summary of invention.

For example, the following changes (1) to (5) can be made.
(1) In the present embodiment, the image processing method by binarization is given as the image processing method for the method of calculating the deviation amount of the electronic component W, but other processing methods can also be used. For example, the imaged image may be handled as a grayscale image with 256 gradations, and the amount of deviation may be calculated by a normalized correlation method of a gray image that recognizes the pattern shape of the object or other image processing methods.
(2) The combination of one set of imaging unit and attitude correction unit calculates all the deviations in the XY direction and the deviation in the θ direction by one imaging, and corrects the attitude of the electronic component W. A combination of the imaging unit and the posture correction unit may be used. That is, a deviation in the θ direction is detected by the combination of the first set of imaging unit and the attitude correction unit, and the attitude of the electronic component W in the θ direction is corrected. After that, another combination of the imaging unit and the posture correction unit may be used to detect a deviation in the XY direction and correct the posture of the electronic component W in the XY direction. Although it is theoretically possible to calculate all of the deviation in the XY direction and the deviation in the θ direction based on the imaging result of one imaging, the deviation in the θ direction and the deviation in the XY direction are divided into two images. However, the amount of deviation may be calculated separately. Performing imaging twice is advantageous in terms of calculation amount and processing amount.
(3) Posture correction unit An example in which the posture is corrected and then transported to the next processing step has been described. However, the correction unit may perform storage processing for packing the electronic component W and various processing steps.
(4) The optical system of the image pickup means 24 of the image pickup unit of the image pickup unit only needs to reach the image pickup means 24 from the lower position where the electronic component W stops, and may have a configuration other than the above.
(5) As the suction holding mechanism V, a chuck mechanism that mechanically clamps the electronic component W may be provided instead of the suction nozzle V1 that sucks and releases the electronic component W by generating and breaking a vacuum.
(6) The various process processing mechanisms are not limited to the types described above, and can be replaced with various process processing mechanisms, and the arrangement order can be changed as appropriate.

[2. Operation of the embodiment]
The operation of the present embodiment having the above configuration will be described with reference to the flowchart of FIG.

  In the present embodiment, the combination of the pair of imaging units and the attitude correction unit calculates all the deviations in the XY direction and the deviation in the θ direction by one imaging, and corrects the attitude of the electronic component W. Then, the electronic component W picked up by the image pickup means 24 of the image pickup unit is placed on the suction stage S of the posture correction unit. Then, the posture is corrected by moving the suction stage S. Hereinafter, an operation at the time of posture control in the posture correction unit of the present embodiment will be described with reference to a flowchart.

  When the turntable T rotates forward by one pitch, the electronic component W sucked and held by the sucking and holding mechanism V stops at the image pickup position of the image pickup unit (S601). In this state, the electronic component W1 stopped at the imaging position is imaged by the imaging means of the imaging unit (S602). At this time, the imaging unit 24 captures an image by converting the optical axis from the vertical direction to the horizontal direction by the prism 22. In addition, the image of the electronic component W can be easily captured by the imaging unit 24 by the light of the illumination 21 that irradiates the electronic component W from the lower part of the electronic component W that is attracted and held by the suction holding mechanism V and conveyed.

  The imaging result of the electronic component W held by the suction nozzle V1 in the imaging unit 24 is output to the control unit 3. The control unit 3 calculates posture deviation information in the XYθ directions (S603). Specifically, the imaging result input to the control unit 3 is binarized by the binarization conversion unit 32 of the control unit 3. By binarizing, it becomes easy to distinguish the electronic component W from the background. Then, the contour extraction unit 33 extracts the contour of the electronic component W from the binarized imaging result. Next, the deviation amount calculation unit 34 calculates the deviation amount of the electronic component W in the XYθ direction from the imaging result obtained by extracting the contour.

  Next, when the turntable T rotates forward by one pitch, the electronic component W1 sucked and held by the suction holding mechanism V is stopped above the suction nozzle of the position correction unit, and the electronic component W2 is imaged. It moves to the imaging position of the unit (S604). In this state, the suction nozzle is lowered, and the electronic component W1 is placed on the suction stage S of the position correction unit (S605).

  Thereafter, when the deviation amount calculation unit 34 calculates the deviation amount in the XYθ direction, a signal for moving the posture correction unit in a direction to eliminate the deviation from the signal generation unit based on the result of the deviation amount calculation unit 34. Is output to the X-axis drive motor M2, the Y-axis drive motor M1, and the θ-axis drive motor M3 (S606).

  The X-axis drive shaft motor M2, the Y-axis drive motor M1, and the θ-axis drive motor M3 are driven based on signals from the control unit 3. Accordingly, the Y-axis drive motor M1 rotates the Y-axis drive ball screw E7 so as to move the suction stage S by the amount of deviation in the Y direction of the electronic component W based on the signal from the control unit. As a result, the suction stage S mounted on the arm E5 moves in the Y direction. Further, the X-axis drive motor M2 rotates the X-axis drive ball screw E7 based on a signal from the control unit 3. By rotating the X-axis drive ball screw E7, the suction stage S is indirectly moved in the X direction via the pulley E9 and the belt E10. In this way, the deviation of the posture in the XY directions is corrected. Further, the θ drive shaft motor M3 performs rotational drive based on a signal from the control unit. This rotation is transmitted to the suction stage S via the θ-axis speed reducer, and the suction stage S rotates by an angle θ (S607).

  Next, the suction nozzle is lowered, and the electronic component W1 on the suction stage S of the posture correction unit is sucked and raised (S608). Then, returning to S601, the turntable T is rotated forward by one pitch, whereby the electronic component W1 that has finished the posture processing by the posture correction unit is moved from the suction stage S, and the image pickup unit 24 of the image pickup unit performs image pickup. The electronic component W2 is positioned on the suction stage S of the posture correction unit.

[3. effect]
In the posture correction unit of the present embodiment as described above, when the holding position of the electronic component W conveyed by the holding unit is deviated, the electronic component W is imaged by the imaging unit 24 of the imaging unit. The deviation can be calculated from the imaging result. The electronic component W is mounted on the suction stage S of the posture correction unit, and the posture of the electronic component W can be corrected by moving the stage according to the amount of deviation detected by the imaging unit.

  When the correction unit is used as an electronic component storage device that performs storage processing for packing electronic components W, the electronic components W can be accurately packed by correcting the position of the electronic components W.

  Furthermore, when the position correction unit of this embodiment is used as one unit of an electrical component inspection device, it is transported to various processing process units such as an electrical test unit, an appearance inspection unit, a taping unit, and a marking unit constituting the electrical inspection device. The holding position of the electronic component W to be corrected can be accurately performed. By carrying the electronic component W in the correct posture with respect to each processing process unit, it is possible to perform an accurate process on the electronic component W in each processing process, thus providing an electrical inspection device with high accuracy and high availability. can do.

[4. Other Embodiments]
The present invention includes not only the aspects exemplified in the above-described embodiments but also the following aspects.

  In the electrical test unit of the present embodiment as described above, the imaging unit B is arranged in the previous stage of the attitude correction unit C. However, the unit D may be added to the next stage of the attitude correction unit C. The posture correction unit C may be configured to confirm whether posture control has been performed reliably by detecting posture information of the electronic component W after posture correction by the posture correction unit C.

  Specifically, when the imaging unit D that performs the imaging process is positioned at the next position of the posture correction unit C, the posture of the electronic component W that has been posture corrected by the posture correction unit C in the imaging unit D is detected. To do. In the imaging unit D, when a certain deviation occurs in the plurality of electronic components W, the information is used to offset the correction unit of the posture correction unit C.

  For example, the position of the potential component W after the correction by the correction unit C is detected by the imaging unit D based on the information (X: +0.3 mm Y: −0.1 mm) acquired by the imaging unit B. If the electronic component W transported to the imaging unit D is deviated by +0.1 mm in the X direction from the origin, the posture correction unit adds the correction acquired by the imaging unit B to +0.1 mm in the X direction. Perform the correction.

  Furthermore, the posture correction apparatus of the present invention is a first device that detects a deviation between the intersection of the turntable with the X-axis as the tangential direction of the turntable and the Y-axis as the radial direction and the midpoint of the conveyed electronic component. Detecting means, second detecting means for detecting a deviation of the angle of the electronic component with respect to the θ reference line connecting the intersection of the XY axes and the center of the turntable, and a stage for placing the conveyed electronic component And a moving means for correcting the posture of the electronic component by moving the stage in a direction to return the deviation detected by the first detecting means and the second detecting means. .

  In addition, the first detection unit and the second detection unit include an imaging unit, and the X axis, the Y axis, and the intersection point of the imaging unit coincide with the X axis, the Y axis, and the intersection point of the imaging unit. The imaging means may be provided.

  In addition, a jig that is attached in advance so that the X-axis and tangential direction of the radial direction of the turntable coincide with the intersection of the Y-axis and the XY-axis, and images the jig with the imaging means, Based on the image, the imaging means may be moved so that the intersection of the X axis, the Y axis, and the XY axis of the imaging means matches the intersection of the X axis, the Y axis, and the XY axis of the jig.

  Furthermore, the attitude correction device as described above may be applied to an electrical component storage device and an electrical component inspection device.

DESCRIPTION OF SYMBOLS 1 ... Electrical component inspection apparatus 21 ... Illumination 22 ... Prism 23 ... Lens 24 ... Imaging means 3 ... Control part 31 ... Detection part 32 ... Binarization conversion part 33 ... Contour extraction part 34 ... Deviation amount calculation part 35 ... Signal generation part A ... Supply device B, D ... Imaging unit C ... Attitude correction unit E ... Processing device E3 ... Suction stage base E5 ... Arm E6 ... Upper base E7 ... Y-axis drive ball screw E8 ... Lower base E9 ... Pulley E10 ... Belts P1-12 … Stop position S… Suction stage T… Turntable V… Suction holding mechanism V1… Suction nozzle W… Electronic components

Claims (8)

An attitude correction device that corrects the attitude of an electronic component conveyed along a conveyance path,
Transport means for transporting the electronic component along the transport path;
A jig that is detachably attached to the transport means and imitates the position and orientation of an electronic component that is transported in a correct posture;
An imaging means installed on the transport path and imaging the electronic component;
Detecting means for detecting a deviation in posture of the electronic component based on an image obtained by the imaging means;
A correction unit that is installed on the conveyance path and that eliminates the deviation detected by the detection unit;
With
The imaging means images the jig and adjusts the installation position and orientation in advance of transporting the electronic component so that the position and orientation of the imaged jig coincide with the origin of the imaging system of the imaging means. And
The detection means detects a deviation of the attitude of the electronic component to be conveyed with reference to the origin in the imaging system of the imaging means ;
An attitude correction device characterized by the above. The origin in the imaging system of the imaging means is defined by one point and each direction of two orthogonal axes,
The installation position and orientation of the imaging means are adjusted so that one predetermined point of the jig coincides with the origin in the imaging system of the imaging means and two orthogonal sides of the jig are along the two orthogonal axes. That
The posture correction apparatus according to claim 1 . The tip portion of the jig, the posture correction device according to claim 1 or claim 2, characterized in that it is rectangular. The correction means includes
A biaxial movement mechanism for correcting the origin of the image pickup means in the image pickup system and the displacement of the position of the electronic component actually conveyed in the image;
An origin in the imaging system of the imaging means, and a uniaxial movement mechanism that performs correction to eliminate the deviation of the orientation of the electronic components that are actually conveyed in the image;
The posture correction apparatus according to any one of claims 1 to 3 , further comprising: An electrical component inspection apparatus including an attitude correction device that corrects an attitude of an electronic component conveyed along a conveyance path,
Transport means for transporting the electronic component along the transport path;
A jig that removably attaches to the transport means and imitates the position and orientation of an electronic component that is transported in a correct posture;
An imaging means installed on the transport path and imaging the electronic component;
Detecting means for detecting a deviation in posture of the electronic component based on an image obtained by the imaging means;
A correction unit that is installed on the conveyance path and that eliminates the deviation detected by the detection unit;
With
The imaging means images the jig and adjusts the installation position and orientation in advance of transporting the electronic component so that the position and orientation of the imaged jig coincide with the origin of the imaging system of the imaging means. And
The detection means detects a deviation of the attitude of the electronic component to be conveyed with reference to the origin in the imaging system of the imaging means ;
Electrical component inspection device characterized by. The origin in the imaging system of the imaging means is defined by one point in the image and each direction of two orthogonal axes,
The installation position and orientation of the imaging means are adjusted so that one predetermined point of the jig coincides with one point in the image and two orthogonal sides of the jig are along the two orthogonal axes. ,
The electrical component inspection apparatus according to claim 5 . The electrical component inspection apparatus according to claim 5 or 6 , wherein a tip portion of the jig is rectangular. The correction means includes
A biaxial movement mechanism for correcting the origin of the image pickup means in the image pickup system and the displacement of the position of the electronic component actually conveyed in the image;
An origin in the imaging system of the imaging means, and a uniaxial movement mechanism that performs correction to eliminate the deviation of the orientation of the electronic components that are actually conveyed in the image;
The electrical component inspection apparatus according to claim 5, further comprising:

Images