JP6872261B2 - Electronic component processing equipment - Google Patents

Electronic component processing equipment Download PDF

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JP6872261B2
JP6872261B2 JP2019187451A JP2019187451A JP6872261B2 JP 6872261 B2 JP6872261 B2 JP 6872261B2 JP 2019187451 A JP2019187451 A JP 2019187451A JP 2019187451 A JP2019187451 A JP 2019187451A JP 6872261 B2 JP6872261 B2 JP 6872261B2
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suction
unit
electronic component
region
imaging
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JP2021064658A (en
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一矢 大場
一矢 大場
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Ueno Seiki Co Ltd
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Ueno Seiki Co Ltd
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Priority to JP2019187451A priority Critical patent/JP6872261B2/en
Priority to MYPI2022001837A priority patent/MY195241A/en
Priority to CN202080070534.5A priority patent/CN114556538A/en
Priority to PCT/JP2020/037743 priority patent/WO2021070782A1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Description

本開示は、電子部品の処理装置に関する。 The present disclosure relates to a processing device for electronic components.

特許文献１には、チップの中心と、チップを吸着するための吸着ノズルの中心と、チップを吸着ノズル側に突き出すニードルの中心とが一致するように、吸着ノズル及びニードルを移動させる電子部品実装方法が開示されている。 In Patent Document 1, an electronic component is mounted in which the suction nozzle and the needle are moved so that the center of the chip, the center of the suction nozzle for sucking the chip, and the center of the needle protruding toward the suction nozzle side coincide with each other. The method is disclosed.

特開２００９−４４０４４号公報JP-A-2009-44044

本開示は、電子部品の位置と、電子部品をピックアップする吸着部の位置と、電子部品を吸着部側に突き出す突き出し部の位置とを揃えるための構成の簡素化に有効な装置を提供する。 The present disclosure provides an apparatus effective for simplifying the configuration for aligning the position of the electronic component, the position of the suction portion for picking up the electronic component, and the position of the protrusion portion for projecting the electronic component toward the suction portion.

本開示の一側面に係る電部品の処理装置は、電子部品が貼付された貼付面を有するシートを保持するシート保持部と、シートとの間に電子部品を挟む吸着領域を通る円軌道に沿って並ぶ複数の吸着部と、複数の吸着部を保持する旋回部と、円軌道の中心軸線に沿うように固定された回転軸まわりに旋回部を旋回させる旋回駆動部と、電子部品との間にシートを挟むように配置されシートを吸着領域側に突き出す突き出し部と、貼付面に沿う方向において、シート保持部の位置を変更するシート位置調節部と、貼付面に沿う方向において、突き出し部の位置を変更する突き出し位置調節部と、を備える。 The electronic component processing apparatus according to one aspect of the present disclosure is along a circular orbit that passes through a suction region that sandwiches an electronic component between a sheet holding portion that holds a sheet having an attached surface to which an electronic component is attached. Between a plurality of suction portions arranged side by side, a swivel portion that holds the plurality of suction portions, a swivel drive unit that swivels the swivel portion around a rotation axis fixed along the central axis of a circular orbit, and an electronic component. A protruding portion that is arranged so as to sandwich the sheet and projects the sheet toward the suction region, a sheet position adjusting portion that changes the position of the sheet holding portion in the direction along the sticking surface, and a protruding portion in the direction along the sticking surface. It is provided with a protrusion position adjusting unit for changing the position.

本開示によれば、電子部品の位置と、電子部品をピックアップする吸着部の位置と、電子部品を吸着部側に突き出す突き出し部の位置とを揃えるための構成の簡素化に有効な装置を提供することができる。 According to the present disclosure, an apparatus effective for simplifying a configuration for aligning the position of an electronic component, the position of a suction portion for picking up an electronic component, and the position of a protrusion for protruding the electronic component toward the suction portion is provided. can do.

電子部品の処理装置を模式的に示す平面図である。It is a top view which shows typically the processing apparatus of an electronic component. ピックアップ部の側面図である。It is a side view of a pickup part. 図２中のＩＩＩ−ＩＩＩ線に沿う断面図である。It is sectional drawing which follows the line III-III in FIG. 図３中のＩＶ−ＩＶ線に沿う断面図である。It is sectional drawing which follows the IV-IV line in FIG. コントローラの機能上の構成を例示するブロック図である。It is a block diagram which illustrates the functional configuration of a controller. コントローラのハードウェア構成を例示するブロック図である。It is a block diagram which illustrates the hardware configuration of a controller. キャリブレーション手順を例示するフローチャートである。It is a flowchart which illustrates the calibration procedure. ピックアップ手順を例示するフローチャートである。It is a flowchart which illustrates the pickup procedure. 受け渡し手順を例示するフローチャートである。It is a flowchart which illustrates the delivery procedure. 電子部品の撮像手順を例示するフローチャートである。It is a flowchart which illustrates the imaging procedure of an electronic component.

以下、実施形態について、図面を参照しつつ詳細に説明する。説明において、同一要素又は同一機能を有する要素には同一の符号を付し、重複する説明を省略する。 Hereinafter, embodiments will be described in detail with reference to the drawings. In the description, the same elements or elements having the same function are designated by the same reference numerals, and duplicate description will be omitted.

〔処理装置〕
本実施形態に係る電子部品の処理装置１は、所謂ダイソータであり、ダイシングなどの前工程で形成された電子部品Ｗを搬送しながら、外観検査、電気特性検査、マーキング等の処理を施した上でテープ、コンテナチューブ等に梱包する装置である。図１及び図２に示すように、処理装置１は、搬送装置１０と、複数の処理部２０と、コントローラ２００とを有する。 [Processing device]
The electronic component processing device 1 according to the present embodiment is a so-called die sorter, and is subjected to processing such as appearance inspection, electrical characteristic inspection, marking, etc. while transporting the electronic component W formed in the previous process such as dicing. It is a device that packs tapes, container tubes, etc. As shown in FIGS. 1 and 2, the processing device 1 includes a transport device 10, a plurality of processing units 20, and a controller 200.

搬送装置１０は、電子部品Ｗを円軌道ＣＲ１に沿って搬送する。搬送対象の電子部品Ｗは、互いに平行な二か所の主面Ｗａ，Ｗｂを有する。搬送装置１０は、ターンテーブル１１と、複数の保持部１２と、旋回駆動部１３と、複数の昇降駆動部１８とを有する。ターンテーブル１１は、鉛直な回転軸Ａｘ１まわりに回転可能となるように設けられている。複数の保持部１２は、回転軸Ａｘ１を中心とする円周に沿って等間隔に配置されており、ターンテーブル１１に固定されている。複数の保持部１２のそれぞれは、電子部品Ｗを保持する。保持部１２はいかなる方式で電子部品Ｗを保持してもよい。電子部品Ｗを保持する方式の具体例としては、真空吸着、静電気式の吸着、及び把持等が挙げられる。例えば保持部１２は、ターンテーブル１１に直交する方向（回転軸Ａｘ１に平行な方向）の一方側から主面Ｗａ，Ｗｂのいずれか（例えば主面Ｗａ）を真空吸着する。 The transport device 10 transports the electronic component W along the circular orbit CR1. The electronic component W to be transported has two main surfaces Wa and Wb parallel to each other. The transport device 10 includes a turntable 11, a plurality of holding units 12, a swivel drive unit 13, and a plurality of elevating drive units 18. The turntable 11 is provided so as to be rotatable around the vertical rotation axis Ax1. The plurality of holding portions 12 are arranged at equal intervals along the circumference centered on the rotation axis Ax1 and are fixed to the turntable 11. Each of the plurality of holding portions 12 holds the electronic component W. The holding unit 12 may hold the electronic component W by any method. Specific examples of the method of holding the electronic component W include vacuum suction, electrostatic suction, and gripping. For example, the holding unit 12 vacuum-sucks either the main surface Wa or Wb (for example, the main surface Wa) from one side in a direction orthogonal to the turntable 11 (a direction parallel to the rotation axis Ax1).

一例として、保持部１２は、吸着ノズル１５と、ホルダ１６と、スプリング１７とを有する。吸着ノズル１５は、電子部品Ｗの主面Ｗａを上方から真空吸着する。例えば吸着ノズル１５は、ターンテーブル１１に垂直に配置されており、吸着ノズル１５の下端部が鉛直下方に開口している。ホルダ１６は、ターンテーブル１１の外周部に固定され、吸着ノズル１５を昇降可能に保持する。スプリング１７は、その弾力により、吸着ノズル１５の下降に抗する。吸着ノズル１５の上端部に下向きの外力が付与された場合、スプリング１７は、吸着ノズル１５の下降に応じて弾性変形し、下向きの外力がなくなると弾性復帰して吸着ノズル１５を下降前の高さに押し戻す。 As an example, the holding portion 12 has a suction nozzle 15, a holder 16, and a spring 17. The suction nozzle 15 vacuum sucks the main surface Wa of the electronic component W from above. For example, the suction nozzle 15 is arranged vertically on the turntable 11, and the lower end portion of the suction nozzle 15 opens vertically downward. The holder 16 is fixed to the outer peripheral portion of the turntable 11 and holds the suction nozzle 15 so as to be able to move up and down. The spring 17 resists the lowering of the suction nozzle 15 due to its elasticity. When a downward external force is applied to the upper end of the suction nozzle 15, the spring 17 elastically deforms as the suction nozzle 15 descends, and when the downward external force disappears, the spring 17 elastically returns to the height before the suction nozzle 15 descends. Push it back.

旋回駆動部１３は、例えば電動モータを動力源とし、ギヤを介さないダイレクトドライブによって回転軸Ａｘ１まわりにターンテーブル１１を旋回させる。これにより、回転軸Ａｘ１を中心とする水平な円軌道ＣＲ１まわりに複数の保持部１２が移動する。旋回駆動部１３は、隣り合う保持部１２同士の角度ピッチ（回転軸Ａｘ１まわりの角度ピッチ）と同じピッチにて、ターンテーブル１１の回転と停止とを繰り返すように制御される。以下、旋回駆動部１３がターンテーブル１１を停止させる際に複数の保持部１２がそれぞれ配置される複数の位置を「複数の停止位置ＳＰ１」という。 The swivel drive unit 13 uses an electric motor as a power source, for example, and swivels the turntable 11 around the rotation shaft Ax1 by a direct drive that does not mediate a gear. As a result, the plurality of holding portions 12 move around the horizontal circular orbit CR1 centered on the rotation axis Ax1. The swivel drive unit 13 is controlled so as to repeatedly rotate and stop the turntable 11 at the same pitch as the angle pitch between the adjacent holding units 12 (the angle pitch around the rotation axis Ax1). Hereinafter, a plurality of positions where the plurality of holding units 12 are arranged when the turning drive unit 13 stops the turntable 11 are referred to as "plurality of stop positions SP1".

複数の昇降駆動部１８は、複数の保持部１２の吸着ノズル１５を個別に昇降させる。複数の昇降駆動部１８は、ターンテーブル１１と共には回転しないように、複数の停止位置ＳＰ１の上方にそれぞれ固定されている。昇降駆動部１８は、その下方に保持部１２が位置する状態にて、例えば電動モータ又はエアシリンダ等を動力源として吸着ノズル１５の上端部に下向きの力を付与する。これにより、吸着ノズル１５が下降する。吸着ノズル１５の上端部に下向きの力を付与した状態を昇降駆動部１８が解除すると、スプリング１７の弾力によって吸着ノズル１５が下降前の高さまで上昇する。 The plurality of elevating drive units 18 individually elevate and elevate the suction nozzles 15 of the plurality of holding units 12. The plurality of elevating drive units 18 are fixed above the plurality of stop positions SP1 so as not to rotate together with the turntable 11. The elevating drive unit 18 applies a downward force to the upper end portion of the suction nozzle 15 by using, for example, an electric motor or an air cylinder as a power source in a state where the holding unit 12 is located below the holding unit 12. As a result, the suction nozzle 15 is lowered. When the elevating drive unit 18 releases the state in which the upper end portion of the suction nozzle 15 is applied with a downward force, the suction nozzle 15 rises to the height before lowering due to the elasticity of the spring 17.

複数の処理部２０は、複数の停止位置ＳＰ１にそれぞれ対応するように設けられている。なお、必ずしも全ての停止位置ＳＰ１に処理部２０が設けられていなくてもよい。各処理部２０は、停止位置ＳＰ１（当該処理部２０に対応する停止位置ＳＰ１）に配置された電子部品Ｗに対し予め定められた処理を施す。ここでの「処理」は、電子部品Ｗの状態を変化させるあらゆる行為を含む。例えば電子部品Ｗにマーキング等を施すこと、電子部品Ｗを保持部１２に保持させること、及び保持部１２が解放した電子部品Ｗを回収することは「処理」に該当する。また、保持部１２による電子部品Ｗの保持位置を補正することも「処理」に該当する。更に、電子部品Ｗに対する何らかの検査を実行することも、検査データが未知の状態を検査データが既知の状態に変化させるので「処理」に該当する。 The plurality of processing units 20 are provided so as to correspond to the plurality of stop positions SP1. It should be noted that the processing unit 20 may not necessarily be provided at all the stop positions SP1. Each processing unit 20 performs a predetermined process on the electronic component W arranged at the stop position SP1 (stop position SP1 corresponding to the processing unit 20). The "processing" here includes any act of changing the state of the electronic component W. For example, marking the electronic component W, holding the electronic component W in the holding unit 12, and collecting the electronic component W released by the holding unit 12 correspond to "processing". Further, correcting the holding position of the electronic component W by the holding unit 12 also corresponds to "processing". Further, executing some kind of inspection on the electronic component W also corresponds to "processing" because the inspection data changes the unknown state to the known state of the inspection data.

処理部２０の具体例としては、ピックアップ部１００が挙げられる。ピックアップ部１００は、ウェハシートから電子部品Ｗをピックアップしていずれかの停止位置ＳＰ１の近傍まで搬送し、当該停止位置ＳＰ１の保持部１２に引き渡す。処理部２０の他の例としては、位置補正部、外観検査部、電気特性検査部、マーキング部、良品回収部、不良品回収部等が挙げられる。位置補正部は、保持部１２による電子部品Ｗの保持位置を補正する。外観検査部は、電子部品Ｗの撮像画像に基づいて電子部品Ｗの外観を検査する。電気特性検査部は、電子部品Ｗの電気特性を検査する。電気特性の具体例としては、端子間の電気抵抗、静電容量等が挙げられる。マーキング部は、レーザマーキング等により電子部品Ｗにマーキングを施す。良品回収部は、全ての検査において異常のなかった電子部品Ｗをテープ又はトレー等に収容する。不良品回収部は、いずれかの検査において異常のあった電子部品Ｗをボックス等に回収する。 A specific example of the processing unit 20 is the pickup unit 100. The pickup unit 100 picks up the electronic component W from the wafer sheet, conveys it to the vicinity of any stop position SP1, and delivers it to the holding unit 12 of the stop position SP1. Other examples of the processing unit 20 include a position correction unit, an appearance inspection unit, an electrical characteristic inspection unit, a marking unit, a non-defective product collection unit, a defective product collection unit, and the like. The position correction unit corrects the holding position of the electronic component W by the holding unit 12. The visual inspection unit inspects the appearance of the electronic component W based on the captured image of the electronic component W. The electrical characteristic inspection unit inspects the electrical characteristics of the electronic component W. Specific examples of electrical characteristics include electrical resistance between terminals, capacitance, and the like. The marking portion marks the electronic component W by laser marking or the like. The non-defective product collection unit stores the electronic component W, which has no abnormality in all inspections, in a tape, a tray, or the like. The defective product collection unit collects the electronic component W having an abnormality in any of the inspections in a box or the like.

以下、ピックアップ部１００の構成を説明する。図２に示すように、ピックアップ部１００は、シート保持部１１０と、シート位置調節部１２０と、ロータリピックアップ１３０と、突き出し部１５０と、突き出し位置調節部１６０とを有する。 Hereinafter, the configuration of the pickup unit 100 will be described. As shown in FIG. 2, the pickup unit 100 includes a seat holding unit 110, a seat position adjusting unit 120, a rotary pickup 130, a protruding unit 150, and a protruding position adjusting unit 160.

シート保持部１１０は、電子部品Ｗが貼付された貼付面を有するシートを保持する。シートの具体例としては、電子部品Ｗが貼付されたウェハシート９１が挙げられる。ウェハシート９１は、半導体ウェハが貼付された粘着性の貼付面９３を有する。半導体ウェハは、ダイシングにより複数の電子部品Ｗ（例えば半導体チップ）に切り分けられた状態で貼付面９３に貼付されている。貼付面９３には、電子部品Ｗの主面Ｗａが貼付されている。ウェハシート９１の周縁部には、リングフレーム９２が貼付されていてもよい。この場合、シート保持部１１０は、リングフレーム９２を保持するように構成されていてもよい。シート保持部１１０は、貼付面９３が鉛直に起立して回転軸Ａｘ１に面するように、搬送装置１０の周囲においてリングフレーム９２を保持する。 The sheet holding unit 110 holds a sheet having a sticking surface to which the electronic component W is stuck. Specific examples of the sheet include a wafer sheet 91 to which the electronic component W is attached. The wafer sheet 91 has an adhesive sticking surface 93 to which a semiconductor wafer is stuck. The semiconductor wafer is attached to the attachment surface 93 in a state of being cut into a plurality of electronic components W (for example, semiconductor chips) by dicing. The main surface Wa of the electronic component W is attached to the attachment surface 93. A ring frame 92 may be attached to the peripheral edge of the wafer sheet 91. In this case, the seat holding portion 110 may be configured to hold the ring frame 92. The sheet holding portion 110 holds the ring frame 92 around the transport device 10 so that the sticking surface 93 stands vertically and faces the rotation axis Ax1.

シート位置調節部１２０は、貼付面９３に沿う方向において、シート保持部１１０の位置を変更する。例えばシート位置調節部１２０は、貼付面９３に沿う方向において、シート保持部１１０の位置を２方向に変更する。一例として、シート位置調節部１２０は、第１駆動部１２１と第２駆動部１２２とを有する。第１駆動部１２１は、例えば電動モータ等を動力源とし、リングフレーム９２を貼付面９３に沿って鉛直方向に変位させる。第２駆動部１２２は、例えば電動モータ等を動力源とし、リングフレーム９２を貼付面９３に沿って水平方向に変位させる。 The seat position adjusting unit 120 changes the position of the seat holding unit 110 in the direction along the sticking surface 93. For example, the seat position adjusting unit 120 changes the position of the seat holding unit 110 in two directions in the direction along the sticking surface 93. As an example, the seat position adjusting unit 120 has a first driving unit 121 and a second driving unit 122. The first drive unit 121 uses, for example, an electric motor or the like as a power source, and displaces the ring frame 92 in the vertical direction along the sticking surface 93. The second drive unit 122 uses, for example, an electric motor or the like as a power source, and displaces the ring frame 92 in the horizontal direction along the sticking surface 93.

ロータリピックアップ１３０は、シート保持部１１０が保持するウェハシート９１から１つずつ電子部品Ｗをピックアップし、搬送して保持部１２に引き渡す。ロータリピックアップ１３０は、ターンテーブル１１の下方において、回転軸Ａｘ１とシート保持部１１０との間に配置されている。 The rotary pickup 130 picks up the electronic components W one by one from the wafer sheet 91 held by the sheet holding unit 110, conveys them, and delivers them to the holding unit 12. The rotary pickup 130 is arranged below the turntable 11 between the rotation shaft Ax1 and the seat holding portion 110.

例えばロータリピックアップ１３０は、複数の吸着部１３１と、旋回部１３２と、旋回駆動部１３３とを有する。複数の吸着部１３１は、ウェハシート９１との間に電子部品Ｗを挟む吸着領域Ａ１を通る円軌道ＣＲ２に沿って並んでいる。吸着領域Ａ１は、ロータリピックアップ１３０によるピックアップ対象の電子部品Ｗをウェハシート９１との間に挟む。換言すると、吸着領域Ａ１とウェハシート９１との間が、ピックアップ対象の電子部品Ｗを配置するための位置となる。円軌道ＣＲ２は、回転軸Ａｘ１を含む鉛直な平面に沿っている。当該平面は、シート保持部１１０が保持する貼付面９３に垂直である。複数の吸着領域Ａ１は、円軌道ＣＲ２に沿って等間隔（回転軸Ａｘ１まわりの等角度ピッチ）に並んでいてもよい。図２は、４つの吸着部１３１が９０°ピッチで並ぶ場合を例示しているが、吸着部１３１の数は４つに限定されない。 For example, the rotary pickup 130 has a plurality of suction portions 131, a swivel portion 132, and a swivel drive unit 133. The plurality of suction portions 131 are arranged along the circular orbit CR2 passing through the suction region A1 sandwiching the electronic component W with the wafer sheet 91. The suction region A1 sandwiches the electronic component W to be picked up by the rotary pickup 130 between the wafer sheet 91 and the electronic component W. In other words, the space between the suction region A1 and the wafer sheet 91 is a position for arranging the electronic component W to be picked up. The circular orbit CR2 is along a vertical plane including the rotation axis Ax1. The plane is perpendicular to the sticking surface 93 held by the sheet holding portion 110. The plurality of suction regions A1 may be arranged at equal intervals (equal pitch around the rotation axis Ax1) along the circular orbit CR2. FIG. 2 illustrates a case where four suction portions 131 are arranged at a pitch of 90 °, but the number of suction portions 131 is not limited to four.

円軌道ＣＲ２は、受け渡し領域Ａ２を更に通る。換言すると、受け渡し領域Ａ２は円軌道ＣＲ２に沿って吸着領域Ａ１と並ぶ。受け渡し領域Ａ２は、円軌道ＣＲ２の最上部に位置する。受け渡し領域Ａ２の位置は、ピックアップ部１００に対応する停止位置ＳＰ１に一致している。以下、この停止位置ＳＰ１を「受け渡し用の停止位置ＳＰ１」という。ロータリピックアップ１３０は、受け渡し領域Ａ２に位置する吸着部１３１から保持部１２に電子部品Ｗを引き渡す。換言すると、搬送装置１０は、受け渡し領域Ａ２においていずれか一つの吸着部１３１から電子部品Ｗを取得し、当該電子部品Ｗを搬送する。例えば搬送装置１０は、受け渡し用の停止位置ＳＰ１に配置した保持部１２により、受け渡し領域Ａ２の電子部品Ｗを吸着する。 The circular orbit CR2 further passes through the delivery region A2. In other words, the delivery region A2 is aligned with the suction region A1 along the circular orbit CR2. The delivery area A2 is located at the uppermost part of the circular orbit CR2. The position of the delivery area A2 coincides with the stop position SP1 corresponding to the pickup unit 100. Hereinafter, this stop position SP1 will be referred to as "stop position SP1 for delivery". The rotary pickup 130 delivers the electronic component W from the suction portion 131 located in the delivery region A2 to the holding portion 12. In other words, the transport device 10 acquires the electronic component W from any one of the suction portions 131 in the delivery region A2, and transports the electronic component W. For example, the transfer device 10 attracts the electronic component W in the transfer region A2 by the holding unit 12 arranged at the transfer stop position SP1.

複数の吸着部１３１は、いずれか一つの吸着部１３１が吸着領域Ａ１に位置するときに、他の一つの吸着部１３１が受け渡し領域Ａ２に位置するように配置されていてもよい。例えば、円軌道ＣＲ２の中心まわりにて、隣り合う吸着部１３１同士の間隔（角度ピッチ）が、吸着領域Ａ１と受け渡し領域Ａ２との間隔（角度ピッチ）に一致している。 The plurality of suction portions 131 may be arranged so that when any one of the suction portions 131 is located in the suction region A1, the other suction portion 131 is located in the delivery region A2. For example, around the center of the circular orbit CR2, the distance (angle pitch) between the adjacent suction portions 131 coincides with the distance (angle pitch) between the suction region A1 and the transfer region A2.

各吸着部１３１は、ピックアップ対象の電子部品Ｗを吸着する。吸着部１３１はいかなる方式で電子部品Ｗを吸着してもよい。電子部品Ｗを吸着する方式の具体例としては、真空吸着、静電気式の吸着等が挙げられる。例えば吸着部１３１は、吸着ノズル１３４を有する。吸着ノズル１３４は、円軌道ＣＲ２の径方向の外方に開口し、電子部品Ｗの主面Ｗｂを真空吸着する。 Each suction unit 131 sucks the electronic component W to be picked up. The suction unit 131 may suck the electronic component W by any method. Specific examples of the method of adsorbing the electronic component W include vacuum adsorption, electrostatic adsorption, and the like. For example, the suction unit 131 has a suction nozzle 134. The suction nozzle 134 opens outward in the radial direction of the circular orbit CR2, and vacuum sucks the main surface Wb of the electronic component W.

旋回部１３２は、複数の吸着部１３１を保持する。旋回駆動部１３３は、円軌道ＣＲ２の中心軸線に沿うように固定された回転軸Ａｘ２まわりに旋回部１３２を旋回させる。旋回駆動部１３３は、例えば電動モータを動力源とし、ギヤを介さないダイレクトドライブによって回転軸Ａｘ２まわりに旋回部１３２を旋回させる。旋回駆動部１３３は、回転軸Ａｘ２が回転軸Ａｘ１に対して変位しないように、回転軸Ａｘ１の周囲に固定されている。 The swivel portion 132 holds a plurality of suction portions 131. The swivel drive unit 133 swivels the swivel unit 132 around a rotation shaft Ax2 fixed along the central axis of the circular orbit CR2. The swivel drive unit 133 uses, for example, an electric motor as a power source, and swivels the swivel unit 132 around the rotation shaft Ax2 by a direct drive that does not mediate a gear. The swivel drive unit 133 is fixed around the rotary shaft Ax1 so that the rotary shaft Ax2 is not displaced with respect to the rotary shaft Ax1.

ロータリピックアップ１３０は、複数の緩衝部１３５を更に有してもよい。複数の緩衝部１３５は、旋回駆動部１３３と複数の吸着部１３１との間にそれぞれ介在している。それぞれの緩衝部１３５は、内向きの外力（回転軸Ａｘ２に向かう外力）が吸着部１３１（当該緩衝部１３５に対応する吸着部１３１）に作用するのに応じて、当該吸着部１３１を後退させる。なお、ここでの後退は、回転軸Ａｘ２に向かって変位することを意味する。緩衝部１３５は、スプリング１３６を有する。スプリング１３６は、その弾力により、吸着ノズル１３４の後退に抗する。吸着ノズル１３４に内向きの外力が付与された場合、スプリング１３６は、吸着ノズル１３４の後退に応じて弾性変形し、内向きの外力がなくなると弾性復帰して吸着ノズル１３４を後退前の位置に押し戻す。 The rotary pickup 130 may further have a plurality of shock absorbers 135. The plurality of shock absorbers 135 are interposed between the swivel drive unit 133 and the plurality of suction units 131, respectively. Each buffer portion 135 retracts the suction portion 131 in response to an inward external force (external force toward the rotation axis Ax2) acting on the suction portion 131 (the suction portion 131 corresponding to the buffer portion 135). .. Note that the retreat here means displacement toward the rotation axis Ax2. The buffer 135 has a spring 136. The spring 136 resists the retreat of the suction nozzle 134 due to its elasticity. When an inward external force is applied to the suction nozzle 134, the spring 136 elastically deforms in response to the retreat of the suction nozzle 134, and when the inward external force disappears, the spring 136 elastically returns to the position before the suction nozzle 134 retreats. Push back.

突き出し部１５０は、ピックアップ対象の電子部品Ｗとの間にウェハシート９１を挟むように配置され、ウェハシート９１及びピックアップ対象の電子部品Ｗを吸着領域Ａ１側に突き出す。突き出し部１５０は、ウェハシート９１の裏面９４（貼付面９３の裏面）に向かって突出する突き出しピン１５１を有する。突き出しピン１５１は、貼付面９３及び裏面９４に垂直なライン（以下、「突き出しライン」という。）１５２に沿っている。突き出し部１５０は、例えば電動モータ等を動力源とし、突き出しライン１５２に沿って突き出しピン１５１を進出又は後退させる。 The protruding portion 150 is arranged so as to sandwich the wafer sheet 91 with the electronic component W to be picked up, and projects the wafer sheet 91 and the electronic component W to be picked up toward the suction region A1. The protrusion 150 has a protrusion pin 151 that protrudes toward the back surface 94 of the wafer sheet 91 (the back surface of the sticking surface 93). The protrusion pin 151 is along a line (hereinafter, referred to as “protrusion line”) 152 perpendicular to the sticking surface 93 and the back surface 94. The protrusion 150 uses, for example, an electric motor or the like as a power source, and advances or retracts the protrusion pin 151 along the protrusion line 152.

突き出し位置調節部１６０は、貼付面９３に沿う方向（貼付面９３に平行な面に沿う方向）において、突き出し部１５０の位置を変更する。例えば突き出し位置調節部１６０は、貼付面９３に沿う方向において、突き出し部１５０の位置を２方向に変更する。一例として、突き出し位置調節部１６０は、第１駆動部１６１と第２駆動部１６２とを有する。第１駆動部１６１は、例えば電動モータ等を動力源とし、突き出し部１５０を貼付面９３に平行な面に沿って鉛直方向に変位させる。第２駆動部１６２は、例えば電動モータ等を動力源とし、突き出し部１５０を貼付面９３に平行な面に沿って水平方向に変位させる。 The protrusion position adjusting portion 160 changes the position of the protrusion portion 150 in the direction along the sticking surface 93 (the direction along the plane parallel to the sticking surface 93). For example, the protrusion position adjusting unit 160 changes the position of the protrusion 150 in two directions in the direction along the sticking surface 93. As an example, the protrusion position adjusting unit 160 has a first driving unit 161 and a second driving unit 162. The first drive unit 161 uses, for example, an electric motor or the like as a power source, and displaces the protrusion 150 in the vertical direction along a surface parallel to the sticking surface 93. The second drive unit 162 uses, for example, an electric motor or the like as a power source, and displaces the protrusion 150 in the horizontal direction along a surface parallel to the sticking surface 93.

ピックアップ部１００は、第１撮像部１７０を更に有してもよい。円軌道ＣＲ２は、第１撮像部１７０による撮像対象となる第１撮像領域Ａ３を更に通る。換言すると、第１撮像領域Ａ３は円軌道ＣＲ２に沿って吸着領域Ａ１と並ぶ。第１撮像部１７０は、第１撮像領域Ａ３を円軌道ＣＲ２の外周側から撮像するように配置されており、第１撮像領域Ａ３に位置する電子部品Ｗ又は吸着部１３１を撮像する。例えば第１撮像部１７０は、カメラ１７１を有する。カメラ１７１は、ＣＣＤ（Ｃｈａｒｇｅ Ｃｏｕｐｌｅｄ Ｄｅｖｉｃｅ）イメージセンサ、又はＣＭＯＳ（Ｃｏｍｐｌｅｍｅｎｔａｒｙ Ｍｅｔａｌ Ｏｘｉｄｅ Ｓｅｍｉｃｏｎｄｕｃｔｏｒ）イメージセンサ等の撮像素子と、撮像素子に画像を結像させるレンズとを有する。カメラ１７１は、回転軸Ａｘ２との間に第１撮像領域Ａ３を挟むように配置されており、カメラ１７１のレンズは第１撮像領域Ａ３に向けられている。図２において、第１撮像領域Ａ３は円軌道ＣＲ２の最下部に位置している。 The pickup unit 100 may further include a first imaging unit 170. The circular orbit CR2 further passes through the first imaging region A3 to be imaged by the first imaging unit 170. In other words, the first imaging region A3 is aligned with the adsorption region A1 along the circular orbit CR2. The first imaging unit 170 is arranged so as to image the first imaging region A3 from the outer peripheral side of the circular orbit CR2, and images the electronic component W or the suction unit 131 located in the first imaging region A3. For example, the first imaging unit 170 has a camera 171. The camera 171 has an image pickup element such as a CCD (Charge Coupled Device) image sensor or a CMOS (Complementary Metal Oxide Sensor) image sensor, and a lens for forming an image on the image pickup element. The camera 171 is arranged so as to sandwich the first imaging region A3 with the rotation axis Ax2, and the lens of the camera 171 is directed to the first imaging region A3. In FIG. 2, the first imaging region A3 is located at the lowermost part of the circular orbit CR2.

ピックアップ部１００は、第２撮像部１８０を更に有してもよい。第２撮像部１８０は、吸着領域Ａ１を円軌道ＣＲ２の内周側から撮像する。内周側から撮像するとは、吸着領域Ａ１から、第２撮像部１８０による撮像画像の結像位置までの光路が、円軌道ＣＲ２の内周に位置する視点を経ていることを意味する。第２撮像部１８０による撮像画像の結像位置は、必ずしも円軌道ＣＲ２の内周に位置していなくてもよい。 The pickup unit 100 may further include a second imaging unit 180. The second imaging unit 180 images the suction region A1 from the inner peripheral side of the circular orbit CR2. Imaging from the inner peripheral side means that the optical path from the adsorption region A1 to the imaging position of the image captured by the second imaging unit 180 passes through a viewpoint located on the inner circumference of the circular orbit CR2. The imaging position of the image captured by the second imaging unit 180 does not necessarily have to be located on the inner circumference of the circular orbit CR2.

吸着領域Ａ１を撮像するための視点を円軌道ＣＲ２の内周に設けるために、旋回部１３２は、円軌道ＣＲ２の中心に形成された空洞部と、隣り合う吸着部１３１同士の間に設けられ旋回部１３２の外方から空洞部に光を導く窓部とを有してもよい。例えば図３及び図４に示すように、旋回部１３２は、筒状部１３７と、旋回プレート１３８と、複数の窓部１３９とを有する。筒状部１３７は、回転軸Ａｘ２を囲んで空洞部１４１を構成し、複数の吸着部１３１を保持している。筒状部１３７は円筒形状を有し、その中心軸は回転軸Ａｘ２に一致している。以下、筒状部１３７の両端のうち旋回駆動部１３３側の端を「駆動端」といい、旋回駆動部１３３の逆側の端部を「開放端」という。旋回プレート１３８は、筒状部１３７の駆動端を塞ぎ、旋回駆動部１３３に接続されている。複数の窓部１３９は、筒状部１３７に形成されており、複数の吸着部１３１と交互に並んでいる。換言すると、それぞれの窓部１３９が、隣り合う吸着部１３１同士の間に形成されている。窓部１３９は、例えば貫通孔であり、筒状部１３７の外方から空洞部１４１に光を導入する。 In order to provide a viewpoint for imaging the suction region A1 on the inner circumference of the circular orbit CR2, the swivel portion 132 is provided between the hollow portion formed at the center of the circular orbit CR2 and the adjacent suction portions 131. It may have a window portion that guides light from the outside of the swivel portion 132 to the cavity portion. For example, as shown in FIGS. 3 and 4, the swivel portion 132 has a tubular portion 137, a swivel plate 138, and a plurality of window portions 139. The tubular portion 137 surrounds the rotation shaft Ax2 to form a cavity portion 141, and holds a plurality of suction portions 131. The tubular portion 137 has a cylindrical shape, and its central axis coincides with the rotation axis Ax2. Hereinafter, of both ends of the tubular portion 137, the end on the swivel drive unit 133 side is referred to as a “drive end”, and the end on the opposite side of the swivel drive unit 133 is referred to as an “open end”. The swivel plate 138 closes the drive end of the tubular portion 137 and is connected to the swivel drive unit 133. The plurality of window portions 139 are formed in the tubular portion 137, and are arranged alternately with the plurality of suction portions 131. In other words, each window portion 139 is formed between adjacent suction portions 131. The window portion 139 is, for example, a through hole, and light is introduced into the cavity portion 141 from the outside of the tubular portion 137.

第２撮像部１８０は、空洞部１４１から窓部１３９を通して吸着領域Ａ１を撮像する。例えば第２撮像部１８０は、ミラー１８１と、カメラ１８２とを有する。ミラー１８１は、空洞部１４１に設けられている。ミラー１８１は、窓部１３９により吸着領域Ａ１側から空洞部１４１に導入された光を筒状部１３７の開放端側に反射する。なお、ミラー１８１は、上記光を筒状部１３７の開放端側に反射する反射面を有していればいかなるものであってもよい。ミラー１８１は板状のミラーであってもよいし、一面が上記反射面となるように構成・配置されたプリズムであってもよい。カメラ１８２は、ミラー１８１を介して吸着領域Ａ１を撮像する。例えばカメラ１８２は、ＣＣＤイメージセンサ、又はＣＭＯＳイメージセンサ等の撮像素子と、撮像素子に画像を結像させるレンズとを有する。カメラ１８２は、レンズが筒状部１３７の開放端に対向するように、空洞部１４１外に配置されている。このため、ミラー１８１により開放端側に反射された光がカメラ１８２のレンズに入射する。このように、ミラー１８１が空洞部１４１に設けられることによって、円軌道ＣＲ２の内周に位置する視点を経た光路が形成される。円軌道ＣＲ２の内周に位置する視点を経た画像を撮像し得る限り、カメラ１８２はいかようにも配置可能である。例えばカメラ１８２は空洞部１４１内に配置されていてもよいし、円軌道ＣＲ２の外に配置されていてもよい。 The second imaging unit 180 images the adsorption region A1 from the cavity 141 through the window 139. For example, the second imaging unit 180 has a mirror 181 and a camera 182. The mirror 181 is provided in the cavity 141. The mirror 181 reflects the light introduced into the cavity 141 from the suction region A1 side by the window portion 139 toward the open end side of the tubular portion 137. The mirror 181 may be any mirror as long as it has a reflecting surface that reflects the light on the open end side of the tubular portion 137. The mirror 181 may be a plate-shaped mirror, or may be a prism configured and arranged so that one surface is the reflection surface. The camera 182 takes an image of the adsorption region A1 through the mirror 181. For example, the camera 182 has an image pickup element such as a CCD image sensor or a CMOS image sensor, and a lens for forming an image on the image pickup element. The camera 182 is arranged outside the cavity 141 so that the lens faces the open end of the tubular portion 137. Therefore, the light reflected by the mirror 181 toward the open end side is incident on the lens of the camera 182. By providing the mirror 181 in the cavity 141 in this way, an optical path is formed through the viewpoint located on the inner circumference of the circular orbit CR2. The camera 182 can be arranged in any way as long as it can capture an image from a viewpoint located on the inner circumference of the circular orbit CR2. For example, the camera 182 may be arranged inside the cavity 141 or outside the circular orbit CR2.

コントローラ２００は、複数の吸着部１３１を吸着領域Ａ１に順次配置するように、旋回駆動部１３３により旋回部１３２を間欠的に旋回させることと、複数の吸着部１３１のいずれか一つの吸着部１３１が吸着領域Ａ１に配置される度に、当該吸着部１３１の位置に電子部品Ｗの位置を合わせるようにシート位置調節部１２０を制御し、当該吸着部１３１の位置に突き出し部１５０の位置を合わせるように突き出し位置調節部１６０を制御することと、を実行するように構成されている。 The controller 200 intermittently swivels the swirl unit 132 by the swivel drive unit 133 so that the plurality of suction units 131 are sequentially arranged in the suction region A1, and the suction unit 131 of any one of the plurality of suction units 131. Is placed in the suction region A1, the sheet position adjusting unit 120 is controlled so as to align the position of the electronic component W with the position of the suction unit 131, and the position of the protrusion 150 is aligned with the position of the suction unit 131. It is configured to control and execute the protrusion position adjusting unit 160 as described above.

例えば図５に示すように、コントローラ２００は、機能上の構成（以下、「機能ブロック」という。）として、旋回制御部２１１と、第１撮像制御部２１２と、基準位置算出部２１３と、第２撮像制御部２１４と、部品位置算出部２１５と、第３撮像制御部２１６と、突き出し位置算出部２１７と、位置情報記憶部２１８と、第４撮像制御部２１９と、位置合わせ制御部２２１と、吸着制御部２２２と、受け渡し制御部２２３と、搬送制御部２２４とを有する。以下、各機能ブロックについて説明する。各機能ブロックが実行する処理は、コントローラ２００が実行する処理に相当する。 For example, as shown in FIG. 5, the controller 200 has a swivel control unit 211, a first imaging control unit 212, a reference position calculation unit 213, and a second as a functional configuration (hereinafter, referred to as “functional block”). 2 Imaging control unit 214, component position calculation unit 215, third imaging control unit 216, protrusion position calculation unit 217, position information storage unit 218, fourth imaging control unit 219, and alignment control unit 221. , A suction control unit 222, a delivery control unit 223, and a transfer control unit 224. Hereinafter, each functional block will be described. The process executed by each functional block corresponds to the process executed by the controller 200.

旋回制御部２１１は、複数の吸着部１３１を吸着領域Ａ１に順次配置するように、旋回駆動部１３３により旋回部１３２を間欠的に旋回させる。なお、間欠的に回転させるとは、回転と停止とを繰り返すことを意味する。例えば旋回制御部２１１は、いずれかの吸着部１３１が吸着領域Ａ１に配置された状態を起点として、隣り合う吸着部１３１同士の角度ピッチと同じピッチで旋回駆動部１３３により旋回部１３２を間欠的に旋回させる。また、旋回制御部２１１は、各吸着部１３１が、吸着領域Ａ１、第１撮像領域Ａ３、及び受け渡し領域Ａ２を順に経る方向（図２における時計回りの方向）に旋回部１３２を旋回させる。 The swivel control unit 211 intermittently swivels the swivel unit 132 by the swivel drive unit 133 so that the plurality of suction units 131 are sequentially arranged in the suction region A1. Note that intermittent rotation means repeating rotation and stop. For example, the swivel control unit 211 intermittently rotates the swivel unit 132 by the swivel drive unit 133 at the same pitch as the angle pitch between the adjacent suction units 131, starting from the state where one of the suction units 131 is arranged in the suction region A1. Turn to. Further, the swivel control unit 211 swivels the swivel unit 132 in a direction in which each suction unit 131 sequentially passes through the suction region A1, the first imaging region A3, and the transfer region A2 (clockwise direction in FIG. 2).

第１撮像制御部２１２は、複数の吸着部１３１のいずれかが電子部品Ｗを保持せずに第１撮像領域Ａ３に位置した状態で、第１撮像領域Ａ３の吸着部１３１の画像を第１撮像部１７０に取得させる。 The first imaging control unit 212 first captures an image of the suction unit 131 of the first imaging region A3 in a state where any of the plurality of suction units 131 is located in the first imaging region A3 without holding the electronic component W. The image pickup unit 170 is made to acquire the image.

基準位置算出部２１３は、第１撮像制御部２１２が第１撮像部１７０に取得させた吸着部１３１の画像（以下、単に「吸着部１３１の画像」という。）に基づいて、当該吸着部１３１が吸着領域Ａ１に配置されたときの位置を算出する。基準位置算出部２１３は、吸着部１３１の画像に基づいて、第１撮像領域Ａ３における吸着部１３１の位置（以下、「吸着部１３１の実際の位置」という。）を算出する。その後基準位置算出部２１３は、第１撮像領域Ａ３における吸着部１３１の設計上の位置（以下、「吸着部１３１の理想位置」という。）を基準として、吸着部１３１の実際の位置の誤差を算出する。その後基準位置算出部２１３は、吸着領域Ａ１における吸着部１３１の設計上の位置に上記誤差を加算して、吸着領域Ａ１における吸着部１３１の位置を算出する。例えば基準位置算出部２１３は、貼付面９３に沿った（貼付面９３に平行な面に沿った）２方向における吸着部１３１の位置を算出する。一例として、基準位置算出部２１３は、貼付面９３に平行な面における鉛直方向及び水平方向の吸着部１３１の位置を算出する。なお、吸着部１３１の位置は、吸着部１３１のどの部位の位置であってもよい。例えば吸着部１３１の位置は、吸着ノズル１３４の中心位置である。 The reference position calculation unit 213 is based on the image of the suction unit 131 acquired by the first imaging control unit 212 by the first imaging unit 170 (hereinafter, simply referred to as “the image of the suction unit 131”). Is placed in the adsorption region A1 to calculate the position. The reference position calculation unit 213 calculates the position of the suction unit 131 in the first imaging region A3 (hereinafter, referred to as “the actual position of the suction unit 131”) based on the image of the suction unit 131. After that, the reference position calculation unit 213 determines the error of the actual position of the suction unit 131 with reference to the design position of the suction unit 131 in the first imaging region A3 (hereinafter, referred to as “ideal position of the suction unit 131”). calculate. After that, the reference position calculation unit 213 adds the above error to the design position of the suction unit 131 in the suction region A1 to calculate the position of the suction unit 131 in the suction region A1. For example, the reference position calculation unit 213 calculates the position of the suction unit 131 in two directions along the sticking surface 93 (along the plane parallel to the sticking surface 93). As an example, the reference position calculation unit 213 calculates the position of the suction unit 131 in the vertical direction and the horizontal direction on the surface parallel to the sticking surface 93. The position of the suction unit 131 may be any part of the suction unit 131. For example, the position of the suction unit 131 is the center position of the suction nozzle 134.

第２撮像制御部２１４は、ピックアップ対象の電子部品Ｗが吸着領域Ａ１とウェハシート９１との間に位置した状態で、当該電子部品Ｗの画像を第２撮像部１８０に取得させる。例えば第２撮像制御部２１４は、窓部１３９が空洞部１４１と吸着領域Ａ１との間に位置したタイミングで、窓部１３９を通して吸着領域Ａ１の画像を第２撮像部１８０に取得させる。これにより、ピックアップ対象の電子部品Ｗの画像が、吸着領域Ａ１を経て第２撮像部１８０に取得される。 The second image pickup control unit 214 causes the second image pickup unit 180 to acquire an image of the electronic component W in a state where the electronic component W to be picked up is located between the suction region A1 and the wafer sheet 91. For example, the second image pickup control unit 214 causes the second image pickup unit 180 to acquire an image of the suction region A1 through the window unit 139 at the timing when the window unit 139 is located between the cavity portion 141 and the suction region A1. As a result, the image of the electronic component W to be picked up is acquired by the second imaging unit 180 via the suction region A1.

部品位置算出部２１５は、第２撮像制御部２１４が第２撮像部１８０に取得させた電子部品Ｗの画像に基づいて、当該電子部品Ｗの位置を算出する。例えば部品位置算出部２１５は、貼付面９３に沿った２方向における電子部品Ｗの位置を算出する。一例として、部品位置算出部２１５は、貼付面９３における鉛直方向及び水平方向の電子部品Ｗの位置を算出する。なお、電子部品Ｗの位置は、電子部品Ｗのどの部位の位置であってもよい。例えば電子部品Ｗの位置は、電子部品Ｗの中心位置である。 The component position calculation unit 215 calculates the position of the electronic component W based on the image of the electronic component W acquired by the second imaging control unit 214 by the second imaging control unit 180. For example, the component position calculation unit 215 calculates the position of the electronic component W in two directions along the sticking surface 93. As an example, the component position calculation unit 215 calculates the positions of the electronic components W in the vertical direction and the horizontal direction on the sticking surface 93. The position of the electronic component W may be any part of the electronic component W. For example, the position of the electronic component W is the central position of the electronic component W.

第３撮像制御部２１６は、ウェハシート９１が第２撮像部１８０と突き出し部１５０との間に位置していない状態で、吸着領域Ａ１を経て突き出し部１５０の画像を第２撮像部１８０に取得させる。 The third image pickup control unit 216 acquires an image of the protrusion 150 through the suction region A1 from the second image pickup unit 180 in a state where the wafer sheet 91 is not located between the second image pickup unit 180 and the protrusion 150. Let me.

突き出し位置算出部２１７は、第３撮像制御部２１６が第２撮像部１８０に取得させた突き出し部１５０の画像に基づいて、突き出し部１５０の位置を算出する。例えば突き出し位置算出部２１７は、貼付面９３に沿った（貼付面９３に平行な面に沿った）２方向における突き出し部１５０の位置を算出する。一例として、突き出し位置算出部２１７は、貼付面９３に平行な面における鉛直方向及び水平方向の突き出し部１５０の位置を算出する。なお、突き出し部１５０の位置は、突き出し部１５０のどの部位の位置であってもよい。例えば突き出し部１５０の位置は、突き出しピン１５１の中心位置である。 The protrusion position calculation unit 217 calculates the position of the protrusion 150 based on the image of the protrusion 150 acquired by the second image pickup control unit 216 by the third imaging control unit 216. For example, the protrusion position calculation unit 217 calculates the position of the protrusion 150 in two directions along the sticking surface 93 (along the plane parallel to the sticking surface 93). As an example, the protrusion position calculation unit 217 calculates the positions of the protrusion 150 in the vertical direction and the horizontal direction on a surface parallel to the sticking surface 93. The position of the protruding portion 150 may be the position of any portion of the protruding portion 150. For example, the position of the protrusion 150 is the center position of the protrusion pin 151.

位置情報記憶部２１８は、基準位置算出部２１３により算出された位置を吸着部１３１ごとに記憶し、突き出し位置算出部２１７により算出された位置を記憶する。 The position information storage unit 218 stores the position calculated by the reference position calculation unit 213 for each suction unit 131, and stores the position calculated by the protrusion position calculation unit 217.

第４撮像制御部２１９は、複数の吸着部１３１のいずれかが電子部品Ｗを保持して第１撮像領域Ａ３に位置した状態で、第１撮像領域Ａ３の電子部品Ｗの画像を第１撮像部１７０に取得させる。第４撮像制御部２１９により撮像された画像は、電子部品Ｗの主面Ｗａの外観検査等に用いられる。 The fourth imaging control unit 219 first captures an image of the electronic component W in the first imaging region A3 in a state where any of the plurality of suction units 131 holds the electronic component W and is located in the first imaging region A3. Have unit 170 acquire it. The image captured by the fourth imaging control unit 219 is used for visual inspection of the main surface Wa of the electronic component W and the like.

位置合わせ制御部２２１は、いずれか一つの吸着部１３１が吸着領域Ａ１に配置される度に、当該吸着部１３１の位置にピックアップ対象の電子部品Ｗの位置を合わせるようにシート位置調節部１２０を制御し、当該吸着部１３１の位置に突き出し部１５０の位置を合わせるように突き出し位置調節部１６０を制御する。例えば位置合わせ制御部２２１は、基準位置算出部２１３が算出した位置と、部品位置算出部２１５が算出した位置とに基づいて、貼付面９３に沿った方向における吸着ノズル１３４の中心位置に、ピックアップ対象の電子部品Ｗの中心位置を合わせるようにシート位置調節部１２０を制御する。また、位置合わせ制御部２２１は、基準位置算出部２１３が算出した位置と、突き出し位置算出部２１７が算出した位置とに基づいて、貼付面９３に沿った方向における吸着ノズル１３４の中心位置に、突き出しピン１５１の中心位置を合わせるように突き出し位置調節部１６０を制御する。 The alignment control unit 221 adjusts the seat position adjusting unit 120 so that the position of the electronic component W to be picked up is aligned with the position of the suction unit 131 each time any one of the suction units 131 is arranged in the suction region A1. The protrusion position adjusting unit 160 is controlled so as to align the position of the protrusion portion 150 with the position of the suction portion 131. For example, the alignment control unit 221 picks up at the center position of the suction nozzle 134 in the direction along the sticking surface 93 based on the position calculated by the reference position calculation unit 213 and the position calculated by the component position calculation unit 215. The seat position adjusting unit 120 is controlled so as to align the center position of the target electronic component W. Further, the alignment control unit 221 is set at the center position of the suction nozzle 134 in the direction along the sticking surface 93 based on the position calculated by the reference position calculation unit 213 and the position calculated by the protrusion position calculation unit 217. The protrusion position adjusting unit 160 is controlled so as to align the center position of the protrusion pin 151.

吸着制御部２２２は、吸着領域Ａ１の吸着部１３１の位置にピックアップ対象の電子部品Ｗの位置及び突き出し部１５０の位置が合わせられた状態にて、突き出しピン１５１により当該電子部品Ｗを吸着領域Ａ１まで押し出すように突き出し部１５０を制御し、当該電子部品Ｗを吸着領域Ａ１の吸着部１３１により吸着するようにロータリピックアップ１３０を制御する。更に吸着制御部２２２は、ピックアップ対象の電子部品Ｗが吸着部１３１に吸着された状態で、突き出しピン１５１を後退させるように突き出し部１５０を制御する。これにより、電子部品Ｗを吸着領域Ａ１に残してウェハシート９１が元の位置に戻る。 The suction control unit 222 uses the protrusion pin 151 to suck the electronic component W in the suction region A1 in a state where the position of the electronic component W to be picked up and the position of the protrusion 150 are aligned with the position of the suction portion 131 of the suction region A1. The protrusion 150 is controlled so as to push out to, and the rotary pickup 130 is controlled so that the electronic component W is sucked by the suction portion 131 of the suction region A1. Further, the suction control unit 222 controls the protrusion 150 so as to retract the protrusion pin 151 in a state where the electronic component W to be picked up is sucked by the suction unit 131. As a result, the wafer sheet 91 returns to its original position, leaving the electronic component W in the suction region A1.

受け渡し制御部２２３は、複数の吸着部１３１のいずれかが電子部品Ｗを保持して受け渡し領域Ａ２に位置した状態で、受け渡し領域Ａ２の電子部品Ｗを解放するようにロータリピックアップ１３０を制御し、受け渡し領域Ａ２の電子部品Ｗを取得するように搬送装置１０を制御する。 The transfer control unit 223 controls the rotary pickup 130 so as to release the electronic component W in the transfer area A2 while one of the plurality of suction units 131 holds the electronic component W and is located in the transfer area A2. The transfer device 10 is controlled so as to acquire the electronic component W in the delivery area A2.

例えば受け渡し制御部２２３は、受け渡し用の停止位置ＳＰ１において、昇降駆動部１８により保持部１２を受け渡し領域Ａ２の電子部品Ｗに接するまで下降させ、当該保持部１２により当該電子部品Ｗを吸着させ、当該保持部１２を昇降駆動部１８により下降前の高さまで上昇させる。また、受け渡し制御部２２３は、受け渡し領域Ａ２の電子部品Ｗを吸着した保持部１２が上昇を開始するまでに、受け渡し領域Ａ２の吸着部１３１による当該電子部品Ｗの吸着を解除させる。 For example, the delivery control unit 223 lowers the holding unit 12 until it comes into contact with the electronic component W in the delivery region A2 by the elevating drive unit 18 at the transfer stop position SP1, and the holding unit 12 attracts the electronic component W. The holding portion 12 is raised to the height before lowering by the raising / lowering drive portion 18. Further, the delivery control unit 223 releases the suction of the electronic component W by the suction unit 131 of the delivery region A2 by the time the holding unit 12 that has attracted the electronic component W in the delivery region A2 starts to rise.

搬送制御部２２４は、受け渡し領域Ａ２において取得した電子部品Ｗを円軌道ＣＲ１に沿って搬送するように搬送装置１０を制御する。例えば搬送制御部２２４は、受け渡し領域Ａ２の電子部品Ｗを吸着した保持部１２が上昇を完了した後に、旋回駆動部１３によりターンテーブル１１を旋回させる。 The transfer control unit 224 controls the transfer device 10 so as to transfer the electronic component W acquired in the transfer area A2 along the circular orbit CR1. For example, the transport control unit 224 rotates the turntable 11 by the swivel drive unit 13 after the holding unit 12 that has attracted the electronic component W in the delivery region A2 completes the ascent.

図６は、コントローラ２００のハードウェア構成を例示するブロック図である。図６に示すように、コントローラ２００は回路２９０を有する。回路２９０は、一つ又は複数のプロセッサ２９１と、メモリ２９２と、ストレージ２９３と、入出力ポート２９４とを含む。ストレージ２９３は、例えばハードディスク、又は不揮発性の半導体メモリ等、コンピュータによって読み取り可能な記憶媒体を有する。ストレージ２９３は、複数の吸着部１３１を吸着領域Ａ１に順次配置するように、旋回駆動部１３３により旋回部１３２を間欠的に旋回させることと、複数の吸着部１３１のいずれか一つの吸着部１３１が吸着領域Ａ１に配置される度に、当該吸着部１３１の位置に電子部品Ｗの位置を合わせるようにシート位置調節部１２０を制御し、当該吸着部１３１の位置に突き出し部１５０の位置を合わせるように突き出し位置調節部１６０を制御することと、コントローラ２００に実行させるためのプログラムを記憶している。例えばストレージ２９３は、コントローラ２００に上述の各機能ブロックを構成させるためのプログラムを記憶している。 FIG. 6 is a block diagram illustrating a hardware configuration of the controller 200. As shown in FIG. 6, the controller 200 has a circuit 290. Circuit 290 includes one or more processors 291 and memory 292, storage 293, and input / output ports 294. The storage 293 has a computer-readable storage medium, such as a hard disk or a non-volatile semiconductor memory. The storage 293 intermittently swivels the swivel portion 132 by the swivel drive unit 133 so that the plurality of suction portions 131 are sequentially arranged in the suction region A1, and the suction portion 131 of any one of the plurality of suction portions 131. Is placed in the suction region A1, the sheet position adjusting unit 120 is controlled so as to align the position of the electronic component W with the position of the suction unit 131, and the position of the protrusion 150 is aligned with the position of the suction unit 131. It stores the program for controlling the protrusion position adjusting unit 160 and causing the controller 200 to execute the protrusion position adjusting unit 160. For example, the storage 293 stores a program for causing the controller 200 to configure each of the above-mentioned functional blocks.

メモリ２９２は、ストレージ２９３からロードしたプログラム及びプロセッサ２９１による演算結果を一時的に記憶する。プロセッサ２９１は、メモリ２９２と協働して上記プログラムを実行することで、コントローラ２００に各機能ブロックを構成させる。入出力ポート２９４は、プロセッサ２９１からの指令に従って、旋回駆動部１３３、シート位置調節部１２０、突き出し位置調節部１６０、突き出し部１５０、吸着部１３１、保持部１２、昇降駆動部１８及び旋回駆動部１３等との間で電気信号の入出力を行う。なお、回路２９０は、必ずしもプログラムにより各機能を構成するものに限られない。例えば回路２９０は、専用の論理回路又はこれを集積したＡＳＩＣ（Ａｐｐｌｉｃａｔｉｏｎ Ｓｐｅｃｉｆｉｃ Ｉｎｔｅｇｒａｔｅｄ Ｃｉｒｃｕｉｔ）により少なくとも一部の機能を構成してもよい。 The memory 292 temporarily stores the program loaded from the storage 293 and the calculation result by the processor 291. The processor 291 causes the controller 200 to configure each functional block by executing the above program in cooperation with the memory 292. The input / output port 294 has a swivel drive unit 133, a seat position adjustment unit 120, a protrusion position adjustment unit 160, a protrusion 150, a suction unit 131, a holding unit 12, an elevating drive unit 18, and a swivel drive unit in accordance with a command from the processor 291. Input and output of electric signals to and from 13 mag. The circuit 290 is not necessarily limited to the one in which each function is configured by a program. For example, the circuit 290 may have at least a part of its functions configured by a dedicated logic circuit or an ASIC (Application Specific Integrated Circuit) that integrates the logic circuit.

〔処理装置の制御手順〕
続いて、電子部品の処理方法の一例として、コントローラ２００が実行する制御手順を、キャリブレーション手順と、ピックアップ手順と、受け渡し手順と、電子部品の撮像手順とに分けて説明する。 [Processing device control procedure]
Subsequently, as an example of the electronic component processing method, the control procedure executed by the controller 200 will be described separately for the calibration procedure, the pickup procedure, the delivery procedure, and the imaging procedure of the electronic component.

（キャリブレーション手順）
キャリブレーション手順は、ピックアップ部１００による電子部品Ｗのピックアップに先立って、吸着領域Ａ１における各吸着部１３１の位置情報と、突き出し部１５０の位置情報とを取得・記憶する制御手順である。例えば図７に示すように、コントローラ２００は、まずステップＳ０１，Ｓ０２，Ｓ０３，Ｓ０４，Ｓ０５を実行する。ステップＳ０１では、旋回制御部２１１が、旋回駆動部１３３に旋回部１３２の旋回を開始させる。ステップＳ０２では、電子部品Ｗを保持していない吸着部１３１が第１撮像領域Ａ３に配置されるのを第１撮像制御部２１２が待機する。ステップＳ０３では、第１撮像制御部２１２が、第１撮像領域Ａ３の吸着部１３１の画像を第１撮像部１７０に取得させる。ステップＳ０４では、第１撮像制御部２１２が第１撮像部１７０に取得させた吸着部１３１の画像に基づいて、当該吸着部１３１が吸着領域Ａ１に配置されたときの位置を基準位置算出部２１３が算出し、位置情報記憶部２１８に記録する。ステップＳ０５では、第１撮像制御部２１２が、全ての吸着部１３１について、吸着領域Ａ１に配置されたときの位置を算出・記録したかを確認する。 (Calibration procedure)
The calibration procedure is a control procedure for acquiring and storing the position information of each suction unit 131 in the suction region A1 and the position information of the protrusion 150 prior to the pickup of the electronic component W by the pickup unit 100. For example, as shown in FIG. 7, the controller 200 first executes steps S01, S02, S03, S04, and S05. In step S01, the turning control unit 211 causes the turning drive unit 133 to start turning the turning unit 132. In step S02, the first imaging control unit 212 waits for the suction unit 131 that does not hold the electronic component W to be arranged in the first imaging region A3. In step S03, the first imaging control unit 212 causes the first imaging unit 170 to acquire the image of the suction unit 131 of the first imaging region A3. In step S04, the reference position calculation unit 213 determines the position when the suction unit 131 is arranged in the suction region A1 based on the image of the suction unit 131 acquired by the first imaging control unit 212 in the first imaging unit 170. Is calculated and recorded in the position information storage unit 218. In step S05, it is confirmed whether the first imaging control unit 212 has calculated and recorded the positions of all the suction units 131 when they are arranged in the suction region A1.

ステップＳ０５において、位置の算出が完了していない吸着部１３１が残っていると判定した場合、コントローラ２００は処理をステップＳ０２に戻し、次の吸着部１３１の撮像と、位置の算出・記録とを行う。 If it is determined in step S05 that the suction unit 131 whose position calculation has not been completed remains, the controller 200 returns the process to step S02, and the next imaging of the suction unit 131 and the calculation / recording of the position are performed. Do.

ステップＳ０５において、全ての吸着部１３１について位置の算出・記録が完了したと判定した場合、コントローラ２００はステップＳ０６，Ｓ０７，Ｓ０８，Ｓ０９を実行する。ステップＳ０６では、第２撮像部１８０による突き出し部１５０の撮像が可能となるのを第３撮像制御部２１６が待機する。例えば第３撮像制御部２１６は、窓部１３９が空洞部１４１と吸着領域Ａ１との間に配置されるのを待機する。ステップＳ０７では、第３撮像制御部２１６が、突き出し部１５０の画像を第２撮像部１８０に取得させる。ステップＳ０８では、第３撮像制御部２１６が第２撮像部１８０に取得させた突き出し部１５０の画像に基づいて、突き出し位置算出部２１７が突き出し部１５０の位置を算出し、位置情報記憶部２１８に記録する。ステップＳ０９では、旋回制御部２１１が、旋回駆動部１３３に旋回部１３２の旋回を停止させる。以上でキャリブレーション手順が完了する。 When it is determined in step S05 that the calculation / recording of the positions of all the suction units 131 is completed, the controller 200 executes steps S06, S07, S08, and S09. In step S06, the third imaging control unit 216 waits for the protruding unit 150 to be imaged by the second imaging unit 180. For example, the third imaging control unit 216 waits for the window portion 139 to be arranged between the cavity portion 141 and the suction region A1. In step S07, the third imaging control unit 216 causes the second imaging unit 180 to acquire the image of the protruding unit 150. In step S08, the protrusion position calculation unit 217 calculates the position of the protrusion 150 based on the image of the protrusion 150 acquired by the second image pickup unit 180 by the third imaging control unit 216, and the position information storage unit 218 calculates the position of the protrusion 150. Record. In step S09, the swivel control unit 211 causes the swivel drive unit 133 to stop the swivel of the swivel unit 132. This completes the calibration procedure.

（ピックアップ手順）
ピックアップ手順は、ウェハシート９１からの電子部品Ｗのピックアップをピックアップ部１００に順次実行させる制御手順である。例えば図８に示すように、コントローラ２００は、まずステップＳ１１，Ｓ１２，Ｓ１３，Ｓ１４，Ｓ１５を実行する。ステップＳ１１では、旋回制御部２１１が、旋回駆動部１３３に旋回部１３２の旋回を開始させる。ステップＳ１２では、ピックアップ対象の電子部品Ｗを吸着領域Ａ１とウェハシート９１との間に配置するように、位置合わせ制御部２２１がシート位置調節部１２０によりシート保持部１１０を移動させる。ステップＳ１３では、ピックアップ対象の電子部品Ｗの第２撮像部１８０による撮像が可能となるのを第２撮像制御部２１４が待機する。例えば第２撮像制御部２１４は、窓部１３９が空洞部１４１と吸着領域Ａ１との間に配置されるのを待機する。ステップＳ１４では、第２撮像制御部２１４が、ピックアップ対象の電子部品Ｗの画像を第２撮像部１８０に取得させる。ステップＳ１５では、第２撮像制御部２１４が第２撮像部１８０に取得させた電子部品Ｗの画像に基づいて、部品位置算出部２１５が当該電子部品Ｗの位置を算出する。 (Pickup procedure)
The pickup procedure is a control procedure in which the pickup unit 100 sequentially executes the pickup of the electronic component W from the wafer sheet 91. For example, as shown in FIG. 8, the controller 200 first executes steps S11, S12, S13, S14, and S15. In step S11, the turning control unit 211 causes the turning drive unit 133 to start turning the turning unit 132. In step S12, the alignment control unit 221 moves the sheet holding unit 110 by the sheet position adjusting unit 120 so that the electronic component W to be picked up is arranged between the suction region A1 and the wafer sheet 91. In step S13, the second image pickup control unit 214 waits for the second image pickup unit 180 of the electronic component W to be picked up to take an image. For example, the second imaging control unit 214 waits for the window portion 139 to be arranged between the cavity portion 141 and the suction region A1. In step S14, the second imaging control unit 214 causes the second imaging unit 180 to acquire an image of the electronic component W to be picked up. In step S15, the component position calculation unit 215 calculates the position of the electronic component W based on the image of the electronic component W acquired by the second imaging control unit 214 by the second imaging unit 180.

次に、コントローラ２００はステップＳ１６，Ｓ１７，Ｓ１８を実行する。ステップＳ１６では、位置合わせ制御部２２１が、次の吸着部１３１が吸着領域Ａ１に配置されたときの位置（以下、「次の吸着部１３１の位置」という。）にピックアップ対象の電子部品Ｗの位置を合わせるようにシート位置調節部１２０を制御することと、次の吸着部１３１の位置に突き出し部１５０の位置を合わせるように突き出し位置調節部１６０を制御することとを開始する。例えば位置合わせ制御部２２１は、次の吸着部１３１の位置と、突き出し部１５０の位置とを位置情報記憶部２１８から読み出す。位置合わせ制御部２２１は、位置情報記憶部２１８から読み出した次の吸着部１３１の位置と、部品位置算出部２１５が算出した電子部品Ｗの位置とに基づいて、次の吸着部１３１の位置に電子部品Ｗの位置を合わせるようにシート位置調節部１２０を制御する。また、位置合わせ制御部２２１は、位置情報記憶部２１８から読み出した次の吸着部１３１の位置と、位置情報記憶部２１８から読み出した突き出し部１５０の位置とに基づいて、次の吸着部１３１の位置に突き出し部１５０の位置を合わせるように突き出し位置調節部１６０を制御する。 Next, the controller 200 executes steps S16, S17, and S18. In step S16, the alignment control unit 221 of the electronic component W to be picked up at the position when the next suction unit 131 is arranged in the suction region A1 (hereinafter, referred to as “the position of the next suction unit 131”). Controlling the seat position adjusting unit 120 so as to align the positions and controlling the protrusion position adjusting unit 160 so as to align the position of the protrusion 150 with the position of the next suction unit 131 is started. For example, the alignment control unit 221 reads the position of the next suction unit 131 and the position of the protrusion 150 from the position information storage unit 218. The alignment control unit 221 moves to the position of the next suction unit 131 based on the position of the next suction unit 131 read from the position information storage unit 218 and the position of the electronic component W calculated by the component position calculation unit 215. The seat position adjusting unit 120 is controlled so as to align the positions of the electronic components W. Further, the alignment control unit 221 is based on the position of the next suction unit 131 read from the position information storage unit 218 and the position of the protrusion 150 read from the position information storage unit 218, and is based on the position of the next suction unit 131. The protrusion position adjusting unit 160 is controlled so as to align the position of the protrusion portion 150 with the position.

ステップＳ１７では、次の吸着部１３１が吸着領域Ａ１に配置されるのを吸着制御部２２２が待機する。ステップＳ１８では、ピックアップ対象の電子部品Ｗの位置と、突き出し部１５０の位置とが次の吸着部１３１の位置に合わせられるのを吸着制御部２２２が待機する。 In step S17, the suction control unit 222 waits for the next suction unit 131 to be arranged in the suction region A1. In step S18, the suction control unit 222 waits for the position of the electronic component W to be picked up and the position of the protrusion 150 to be aligned with the position of the next suction unit 131.

次に、コントローラ２００はステップＳ２１，Ｓ２２，Ｓ２３を実行する。ステップＳ２１では、吸着制御部２２２が、突き出しピン１５１により当該電子部品Ｗを吸着領域Ａ１まで押し出すように突き出し部１５０を制御する。ステップＳ２２では、吸着制御部２２２が、吸着領域Ａ１まで押し出された電子部品Ｗを吸着領域Ａ１の吸着部１３１により吸着させる。ステップＳ２３では、吸着制御部２２２が、突き出しピン１５１を後退させる。これにより、電子部品Ｗを吸着領域Ａ１に残してウェハシート９１が元の位置に戻る。その後、コントローラ２００は処理をステップＳ１２に戻す。以後、ステップＳ１２〜ステップＳ２３が繰り返されることにより、ウェハシート９１の複数の電子部品Ｗがピックアップ部１００により順次ピックアップされる。 Next, the controller 200 executes steps S21, S22, and S23. In step S21, the suction control unit 222 controls the protrusion 150 so that the electronic component W is pushed out to the suction region A1 by the protrusion pin 151. In step S22, the suction control unit 222 sucks the electronic component W extruded to the suction region A1 by the suction unit 131 of the suction region A1. In step S23, the suction control unit 222 retracts the protrusion pin 151. As a result, the wafer sheet 91 returns to its original position, leaving the electronic component W in the suction region A1. After that, the controller 200 returns the process to step S12. After that, by repeating steps S12 to S23, the plurality of electronic components W of the wafer sheet 91 are sequentially picked up by the pickup unit 100.

（受け渡し手順）
受け渡し手順は、搬送装置１０とピックアップ部１００とに受け渡し領域Ａ２の電子部品Ｗの受け渡しを実行させる制御手順である。例えば図９に示すように、コントローラ２００は、ステップＳ３１，Ｓ３２，Ｓ３３，Ｓ３４，Ｓ３５を実行する。ステップＳ３１では、電子部品Ｗを吸着した吸着部１３１が受け渡し領域Ａ２に配置されるのを受け渡し制御部２２３が待機する。ステップＳ３２では、受け渡し制御部２２３が、受け渡し用の停止位置ＳＰ１において、昇降駆動部１８により保持部１２を受け渡し領域Ａ２の電子部品Ｗに接するまで下降させる。ステップＳ３３では、受け渡し制御部２２３が、受け渡し領域Ａ２の電子部品Ｗを保持部１２に吸着させ、受け渡し領域Ａ２の吸着部１３１による当該電子部品Ｗの吸着を解除させる。ステップＳ３４では、受け渡し制御部２２３が、受け渡し領域Ａ２の電子部品Ｗを吸着した保持部１２を、昇降駆動部１８により下降前の高さまで上昇させる。ステップＳ３５では、搬送制御部２２４が、旋回駆動部１３によりターンテーブル１１を１ピッチ旋回させる。これにより、受け渡し領域Ａ２で保持部１２により吸着された電子部品Ｗが搬送され、次の保持部１２が受け渡し用の停止位置ＳＰ１に配置される。その後、コントローラ２００は処理をステップＳ３１に戻す。以後、受け渡し領域Ａ２における電子部品Ｗの受け渡しが繰り返される。 (Delivery procedure)
The delivery procedure is a control procedure for causing the transfer device 10 and the pickup unit 100 to deliver the electronic component W in the delivery area A2. For example, as shown in FIG. 9, the controller 200 executes steps S31, S32, S33, S34, and S35. In step S31, the delivery control unit 223 waits for the suction unit 131 that has attracted the electronic component W to be arranged in the delivery region A2. In step S32, the transfer control unit 223 is lowered by the elevating drive unit 18 until it comes into contact with the electronic component W in the transfer area A2 at the transfer stop position SP1. In step S33, the transfer control unit 223 attracts the electronic component W in the transfer area A2 to the holding unit 12, and releases the adsorption of the electronic component W by the suction unit 131 in the transfer area A2. In step S34, the delivery control unit 223 raises the holding unit 12 that has attracted the electronic component W in the delivery region A2 to the height before lowering by the elevating drive unit 18. In step S35, the transport control unit 224 turns the turntable 11 by one pitch by the turning drive unit 13. As a result, the electronic component W attracted by the holding unit 12 is conveyed in the delivery region A2, and the next holding unit 12 is arranged at the stop position SP1 for delivery. After that, the controller 200 returns the process to step S31. After that, the delivery of the electronic component W in the delivery area A2 is repeated.

（電子部品の撮像手順）
電子部品の撮像手順は、第１撮像領域Ａ３の電子部品Ｗの画像を第１撮像部１７０に順次撮像させる制御手順である。例えば図１０に示すように、コントローラ２００は、ステップＳ４１，Ｓ４２を実行する。ステップＳ４１では、電子部品Ｗを吸着した吸着部１３１が第１撮像領域Ａ３に配置されるのを第４撮像制御部２１９が待機する。ステップＳ４２では、第４撮像制御部２１９が、第１撮像領域Ａ３の電子部品Ｗの画像を第１撮像部１７０に取得させる。その後、コントローラ２００は処理をステップＳ４１に戻す。以後、第１撮像領域Ａ３における電子部品Ｗの撮像が繰り返される。上述したように、電子部品Ｗの画像は、電子部品Ｗの主面Ｗａの外観検査等に用いられる。 (Procedure for imaging electronic components)
The imaging procedure of the electronic component is a control procedure in which the image of the electronic component W in the first imaging region A3 is sequentially imaged by the first imaging unit 170. For example, as shown in FIG. 10, the controller 200 executes steps S41 and S42. In step S41, the fourth imaging control unit 219 waits for the suction unit 131 that has attracted the electronic component W to be arranged in the first imaging region A3. In step S42, the fourth imaging control unit 219 causes the first imaging unit 170 to acquire an image of the electronic component W in the first imaging region A3. After that, the controller 200 returns the process to step S41. After that, the imaging of the electronic component W in the first imaging region A3 is repeated. As described above, the image of the electronic component W is used for visual inspection of the main surface Wa of the electronic component W and the like.

以上に説明したように、処理装置１は、電子部品Ｗが貼付された貼付面９３を有するウェハシート９１を保持するシート保持部１１０と、ウェハシート９１との間に電子部品Ｗを挟む吸着領域Ａ１を通る円軌道ＣＲ２に沿って並ぶ複数の吸着部１３１と、複数の吸着部１３１を保持する旋回部１３２と、円軌道ＣＲ２の中心軸線に沿うように固定された回転軸Ａｘ２まわりに旋回部１３２を旋回させる旋回駆動部１３３と、電子部品Ｗとの間にウェハシート９１を挟むように配置されウェハシート９１を吸着領域Ａ１側に突き出す突き出し部１５０と、貼付面９３に沿う方向において、シート保持部１１０の位置を変更するシート位置調節部１２０と、貼付面９３に沿う方向において、突き出し部１５０の位置を変更する突き出し位置調節部１６０と、を備える。 As described above, the processing apparatus 1 has a suction region that sandwiches the electronic component W between the sheet holding portion 110 that holds the wafer sheet 91 having the attachment surface 93 to which the electronic component W is attached and the wafer sheet 91. A plurality of suction portions 131 arranged along the circular orbit CR2 passing through A1, a swivel portion 132 holding the plurality of suction portions 131, and a swivel portion around the rotation axis Ax2 fixed along the central axis of the circular orbit CR2. The sheet is arranged along the sticking surface 93 with the protruding portion 150 which is arranged so as to sandwich the wafer sheet 91 between the swirling drive unit 133 which swivels the 132 and the electronic component W and projects the wafer sheet 91 toward the suction region A1. It includes a sheet position adjusting unit 120 that changes the position of the holding portion 110, and a protruding position adjusting unit 160 that changes the position of the protruding portion 150 in the direction along the sticking surface 93.

処理装置１によれば、吸着部１３１ごとの位置の個体差に応じて、電子部品Ｗ及び突き出し部１５０の位置を変更し、吸着部１３１、電子部品Ｗ及び突き出し部１５０の３者の位置を揃えることができる。これにより、吸着部１３１、電子部品Ｗ及び突き出し部１５０間の位置ずれに起因するピックアップ不良を抑制することができる。ここで、３者の位置を揃えるために吸着部１３１の位置を変更する場合、吸着領域Ａ１の吸着部１３１を入れ替える構成（旋回部１３２及び旋回駆動部１３３）に加え、吸着領域Ａ１における吸着部１３１の位置を変更する構成が必要となり、装置構成が複雑化する。これに対し、電子部品Ｗ及び突き出し部１５０の位置を変更する処理装置１は、３者の位置を揃えるための構成の簡素化に有効である。 According to the processing device 1, the positions of the electronic component W and the protruding portion 150 are changed according to the individual difference in the positions of the suction portions 131, and the positions of the suction portion 131, the electronic component W and the protruding portion 150 are changed. Can be aligned. As a result, it is possible to suppress pickup defects caused by misalignment between the suction portion 131, the electronic component W, and the protrusion portion 150. Here, when the position of the suction unit 131 is changed in order to align the positions of the three parties, in addition to the configuration in which the suction unit 131 of the suction region A1 is replaced (swivel unit 132 and rotation drive unit 133), the suction unit in the suction region A1 A configuration for changing the position of 131 is required, which complicates the apparatus configuration. On the other hand, the processing device 1 that changes the positions of the electronic component W and the protruding portion 150 is effective in simplifying the configuration for aligning the positions of the three parties.

処理装置１は、円軌道ＣＲ２に沿って吸着領域Ａ１と並ぶ第１撮像領域Ａ３を円軌道ＣＲ２の外周側から撮像するように配置された第１撮像部１７０を更に備えてもよい。この場合、吸着部１３１に保持された電子部品Ｗの外観の把握と、吸着部１３１の位置の把握とに第１撮像部１７０を共用できる。従って、装置構成の簡素化に更に有効である。 The processing device 1 may further include a first imaging unit 170 arranged so as to image the first imaging region A3 along the circular orbit CR2 along with the suction region A1 from the outer peripheral side of the circular orbit CR2. In this case, the first imaging unit 170 can be shared for grasping the appearance of the electronic component W held by the suction unit 131 and grasping the position of the suction unit 131. Therefore, it is more effective in simplifying the device configuration.

処理装置１は、吸着領域Ａ１を円軌道ＣＲ２の内周側から撮像する第２撮像部１８０を更に備えてもよい。この場合、３者の位置を揃える基準となる吸着部１３１側から見た（撮像した）電子部品Ｗの位置に基づいて、位置合わせを行うことができる。従って、より高精度な位置合わせに有効である。 The processing device 1 may further include a second imaging unit 180 that images the suction region A1 from the inner peripheral side of the circular orbit CR2. In this case, the alignment can be performed based on the position of the electronic component W viewed (imaged) from the suction portion 131 side, which is a reference for aligning the positions of the three parties. Therefore, it is effective for more accurate alignment.

処理装置１は、複数の吸着部１３１を吸着領域Ａ１に順次配置するように、旋回駆動部１３３により旋回部１３２を間欠的に旋回させる旋回制御部２１１と、複数の吸着部１３１のいずれか一つの吸着部１３１が吸着領域Ａ１に配置される度に、当該吸着部１３１の位置に電子部品Ｗの位置を合わせるようにシート位置調節部１２０を制御し、当該吸着部１３１の位置に突き出し部１５０の位置を合わせるように突き出し位置調節部１６０を制御する位置合わせ制御部２２１と、を更に備えてもよい。この場合、吸着部１３１ごとの位置の個体差に応じて、３者の位置を自動で揃えることができる。 The processing device 1 includes a swivel control unit 211 that intermittently swivels the swivel unit 132 by the swivel drive unit 133 so that the plurality of suction units 131 are sequentially arranged in the suction region A1, and any one of the plurality of suction units 131. Each time one of the suction portions 131 is arranged in the suction region A1, the sheet position adjusting portion 120 is controlled so as to align the position of the electronic component W with the position of the suction portion 131, and the protrusion portion 150 is positioned at the position of the suction portion 131. A positioning control unit 221 that controls the protrusion position adjusting unit 160 so as to align the positions of the above may be further provided. In this case, the positions of the three parties can be automatically aligned according to the individual difference in the positions of the suction portions 131.

処理装置１は、円軌道ＣＲ２に沿って吸着領域Ａ１と並ぶ受け渡し領域Ａ２において複数の吸着部１３１のいずれか一つの吸着部１３１から電子部品Ｗを取得し、当該電子部品Ｗを搬送する搬送装置１０を更に備え、複数の吸着部１３１は、いずれか一つの吸着部１３１が吸着領域Ａ１に位置するときに、他の一つの吸着部１３１が受け渡し領域Ａ２に位置するように配置されていてもよい。この場合、吸着部１３１を変位させることなく３者の位置を揃えることが可能な構成を利用して、吸着領域Ａ１における電子部品Ｗの吸着と、受け渡し領域Ａ２における電子部品Ｗの受け渡しとを少なくとも部分的に同時進行させ、処理時間の短縮を図ることができる。 The processing device 1 is a transport device that acquires an electronic component W from any one of the plurality of suction portions 131 in the transfer region A2 along with the suction region A1 along the circular orbit CR2, and conveys the electronic component W. 10 is further provided, and the plurality of suction portions 131 are arranged so that when any one of the suction portions 131 is located in the suction region A1, the other suction portion 131 is located in the delivery region A2. Good. In this case, at least the suction of the electronic component W in the suction region A1 and the delivery of the electronic component W in the delivery region A2 are performed by utilizing a configuration in which the positions of the three parties can be aligned without displace the suction portion 131. The processing time can be shortened by partially proceeding at the same time.

以上、実施形態について説明したが、本発明は必ずしも上述した実施形態に限定されるものではなく、その要旨を逸脱しない範囲で様々な変更が可能である。 Although the embodiments have been described above, the present invention is not necessarily limited to the above-described embodiments, and various modifications can be made without departing from the gist thereof.

１…処理装置、Ｗ…電子部品、１０…搬送装置、１１０…シート保持部、１２０…シート位置調節部、１５０…突き出し部、１６０…突き出し位置調節部、９１…ウェハシート、９３…貼付面、１３１…吸着部、１３２…旋回部、１３３…旋回駆動部、Ａ１…吸着領域、ＣＲ２…円軌道、Ａ２…受け渡し領域、Ａｘ２…回転軸、１７０…第１撮像部、Ａ３…第１撮像領域、１８０…第２撮像部、１３９…窓部、１４１…空洞部、２１１…旋回制御部、２２１…位置合わせ制御部。 1 ... Processing device, W ... Electronic component, 10 ... Conveying device, 110 ... Sheet holding part, 120 ... Sheet position adjusting part, 150 ... Protruding part, 160 ... Protruding position adjusting part, 91 ... Wafer sheet, 93 ... Sticking surface, 131 ... suction unit, 132 ... swivel unit, 133 ... swivel drive unit, A1 ... suction region, CR2 ... circular orbit, A2 ... transfer region, Ax2 ... rotation axis, 170 ... first imaging unit, A3 ... first imaging region, 180 ... Second imaging unit, 139 ... Window unit, 141 ... Cavity unit, 211 ... Swivel control unit, 221 ... Alignment control unit.

Claims (5)

電子部品が貼付された貼付面を有するシートを保持するシート保持部と、
前記シートとの間に前記電子部品を挟む吸着領域を通る円軌道に沿って並ぶ複数の吸着部と、
前記複数の吸着部を保持する旋回部と、
前記円軌道の中心軸線に沿うように固定された回転軸まわりに前記旋回部を旋回させる旋回駆動部と、
前記電子部品との間に前記シートを挟むように配置され前記シートを前記吸着領域側に突き出す突き出し部と、
前記貼付面に沿う方向において、前記シート保持部の位置を変更するシート位置調節部と、
前記貼付面に沿う方向において、前記突き出し部の位置を変更する突き出し位置調節部と、
前記円軌道に沿って前記吸着領域と並ぶ第１撮像領域を前記円軌道の外周側から撮像するように配置された第１撮像部と、を備え、
前記第１撮像部は、前記複数の吸着部それぞれについて、撮像対象の吸着部が前記電子部品を保持していない状態で前記第１撮像領域に位置する際に当該吸着部の撮像を実行する電子部品の処理装置。 A sheet holding part that holds a sheet having a sticking surface to which electronic components are stuck,
A plurality of suction portions arranged along a circular orbit passing through a suction region sandwiching the electronic component between the sheet and the sheet.
A swivel part that holds the plurality of suction parts and
A swivel drive unit that swivels the swivel unit around a rotation axis fixed along the central axis of the circular orbit.
A protruding portion that is arranged so as to sandwich the sheet between the electronic component and projects the sheet toward the suction region.
A seat position adjusting portion that changes the position of the seat holding portion in a direction along the sticking surface, and a seat position adjusting portion.
A protrusion position adjusting portion that changes the position of the protrusion portion in a direction along the sticking surface, and a protrusion position adjusting portion.
A first imaging unit arranged so as to image a first imaging region along the circular orbit along with the suction region from the outer peripheral side of the circular orbit is provided .
The first image pickup unit, for each of the plurality of suction portion, said that perform imaging of the suction unit when positioned in the first imaging area in a state where the adsorbing portion of the imaging target does not hold the electronic component Electronic component processing equipment. 前記第１撮像部は、前記複数の吸着部のいずれか一つが前記電子部品を保持している状態で前記第１撮像領域に位置する際に前記電子部品の撮像を更に実行する、請求項１記載の電子部品の処理装置。 1. The first imaging unit further executes imaging of the electronic component when any one of the plurality of suction units holds the electronic component and is located in the first imaging region. The electronic component processing device described. 前記吸着領域を前記円軌道の内周側から撮像する第２撮像部を更に備える、請求項１又は２記載の電子部品の処理装置。 The electronic component processing apparatus according to claim 1 or 2, further comprising a second imaging unit that images the adsorption region from the inner peripheral side of the circular orbit. 前記複数の吸着部を前記吸着領域に順次配置するように、前記旋回駆動部により前記旋回部を間欠的に旋回させる旋回制御部と、
前記複数の吸着部のいずれか一つの吸着部が前記吸着領域に配置される度に、当該吸着部の位置に前記電子部品の位置を合わせるように前記シート位置調節部を制御し、当該吸着部の位置に前記突き出し部の位置を合わせるように前記突き出し位置調節部を制御する位置合わせ制御部と、を更に備える請求項１〜３のいずれか一項記載の電子部品の処理装置。 A swivel control unit that intermittently swivels the swivel unit by the swivel drive unit so that the plurality of suction units are sequentially arranged in the suction region.
Each time any one of the plurality of suction portions is arranged in the suction region, the seat position adjusting portion is controlled so as to align the position of the electronic component with the position of the suction portion, and the suction portion is controlled. The electronic component processing apparatus according to any one of claims 1 to 3, further comprising an alignment control unit that controls the protrusion position adjusting unit so as to align the position of the protrusion with the position of. 前記円軌道に沿って前記吸着領域と並ぶ受け渡し領域において前記複数の吸着部のいずれか一つの吸着部から前記電子部品を取得し、当該電子部品を搬送する搬送装置を更に備え、
前記複数の吸着部は、いずれか一つの吸着部が前記吸着領域に位置するときに、他の一つの吸着部が前記受け渡し領域に位置するように配置されている、請求項１〜４のいずれか一項記載の電子部品の処理装置。 A transport device for acquiring the electronic component from any one of the plurality of suction portions in the transfer region along the circular orbit and transporting the electronic component is further provided.
Any of claims 1 to 4 , wherein the plurality of suction portions are arranged so that when any one suction portion is located in the suction region, the other suction portion is located in the delivery region. The electronic component processing device according to the first paragraph.
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