JP2013077772A - Manufacturing apparatus for electronic component packaging body - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing apparatus for an electronic component packaging body in which a yield of the packaging body can be improved by surely correcting positional displacement in a rotating direction that occurs to an electronic component.SOLUTION: A manufacturing apparatus comprises a conveyance path 211 on which an electronic component Ch is conveyed, transfer means 22 which adsorbs the conveyed electronic component Ch and transfers it onto a base member F, and correction means 23 which corrects positional displacement on a virtual surface crossing an adsorbing direction of the electronic component Ch adsorbed by the transfer means 22 in a rotating direction around the adsorbing direction during a period from when the electronic component Ch on the conveyance path 211 is adsorbed by the transfer means 22 to when the electronic component Ch is transferred onto the base member F. The correction means 23 is provided at a separated position separated from the transfer means 22 so as not to contact the electronic component Ch adsorbed by the transfer means 22, holds a positionally displaced electronic component among the electronic components Ch adsorbed by the transfer means, corrects it into a right position, and releases the holding after the correction.

Description

  The present invention relates to an apparatus for manufacturing an electronic component mounting body used for mounting an electronic component on a base member on which an electronic circuit is formed.

  Recently, IC tags that communicate in a non-contact manner using radio waves have been used for various purposes such as transportation cards and cash cards. This IC tag can read and write data in a non-contact manner using a dedicated communication device, and is generally in the form of a card or a seal.

  This IC tag includes an IC chip mounting body which is an electronic component mounting body as shown in FIG. This IC chip mounting body is obtained by mounting an IC chip Ch as an electronic component on an antenna film on which a communication antenna F1 as an electronic circuit is formed. As shown in FIG. 6, an IC tag generally has a built-in IC chip mounting body as a so-called inlet I.

  As an apparatus for manufacturing this electronic component mounting body, for example, there is one described in Patent Document 1. As shown in FIG. 7, the manufacturing apparatus of the invention according to Patent Literature 1 includes a feeder 101 and a synchronization roller 102, and an IC chip 103 conveyed by the feeder 101 is attached to the synchronization roller 102. It is adsorbed by the nozzle 102a, conveyed, and supplied to the surface of the antenna film 104. At this time, bumps (electrical contacts) of the IC chip 103 are electrically connected to the electronic circuit 104 a of the communication antenna formed on the antenna film 104.

  The manufacturing apparatus of the invention according to Patent Document 1 obtains positional information of the antenna film 104 and the IC chip 103 from the CCD cameras 106 and 107, and moves a stage (not shown) in the X-axis direction (antenna film 104) according to the positional information. In the longitudinal direction) and the Y-axis direction (the width direction of the antenna film 104) to perform position correction (paragraph 0018 of Patent Document 1).

  Incidentally, there is a case where the IC chip 103 is displaced while the IC chip 103 is being transferred from the feeder 101 to the antenna film 104. As this positional deviation, for example, a positional deviation in the rotation direction, that is, a direction that rotates around the axis when an axis that passes through the center of the IC chip 103 and is orthogonal to the surface of the IC chip 103 is assumed ( In another expression, the displacement of the IC chip 103 sucked by the suction nozzle 102a in the virtual plane intersecting the suction direction (the direction of the suction force) in the rotation direction around the suction direction), or the positional shift in the plane direction, In addition, a deviation in which the center of the suction nozzle 102a and the center of the IC chip 103 do not coincide with each other, and a positional deviation in which the aforementioned deviations are combined are exemplified.

  As described above, when the IC chip 103 is displaced, there is a problem that the mounting accuracy is lowered. In other words, the position and angle of the IC chip 103 that can be mounted with respect to the antenna film 104 are usually determined in a single way, and if the mounting and mounting are out of the determined position and angle, the bumps of the IC chip 103 are not connected to the antenna. The film 104 is displaced with respect to the electronic circuit 104a of the communication antenna, and the two are not electrically connected, resulting in a defective mounting body. Incidentally, regarding the positional deviation in the rotation direction, if the deviation from a predetermined angle becomes large to some extent, the bump of the IC chip 103 may not be connected to the electronic circuit 104a of the communication antenna.

  The cause of the positional deviation in the rotational direction is, for example, that the IC chip 103 is affected by the vibration of the feeder 101, and the IC chip 103 after being attracted to the synchronization roller 103 contacts a part of the feeder 101. It is conceivable that the suction on the synchronization roller 103 is not made uniform on the surface of the IC chip 103 and is attracted to the synchronization roller 103 at an angle.

  If this misalignment in the rotational direction is left unattended, the mounting accuracy of the IC chip 103 on the antenna film 104 is lowered, and a defective mounting body is generated, or the sorting means provided in the manufacturing apparatus causes the misaligned IC chip 103 to be mounted. By eliminating before mounting, there is a possibility that defective products not mounted with the IC chip 103 (only antenna film) may be generated, which becomes an obstacle to improving the yield of the mounted body.

  However, the positional deviation that can be corrected by the manufacturing apparatus of the invention according to Patent Document 1 is only in the plane direction (X-axis direction and Y-axis direction), and the positional deviation in the rotational direction cannot be corrected.

  Therefore, as an example of a device having a function of correcting misalignment in the rotation direction, the device of the invention according to Patent Document 2 can be given. In this apparatus, the feeder cover that covers the upper part of the feeder serves as a correction guide, and the IC chip on the feeder is attracted by the suction nozzle while being in contact with the feeder cover, thereby correcting the positional deviation in the rotation direction of the IC chip. it can.

JP 2006-252170 A JP 2010-225867 A JP 2006-309541 A

  However, the feeder of the invention according to Patent Document 2 conveys the IC chip by vibration, and the feeder cover also vibrates due to the vibration of the feeder, so correction under such vibration is incomplete. Met. In addition, in this apparatus, since all the IC chips are in contact with the feeder cover, an IC chip that is not misaligned in the rotational direction abuts on the feeder cover that is vibrating, and a new misalignment occurs. It was also possible. In other words, it is difficult to improve the correction accuracy in the apparatus according to the invention according to Patent Document 2.

  In addition to the above, the manufacturing apparatus of the invention according to Patent Document 3 is given as an example of a device having a function of correcting misalignment in the rotation direction. As shown in FIG. 8, this manufacturing apparatus is provided with a feeder 201, a rotary head unit 202, and a synchronization roller 203, and sequentially conveys the IC chip 204 and supplies it to the surface of the antenna film 205. ing. The IC chip 204 is transferred from the feeder 201 to the rotary head unit 202 and then from the rotary head unit 202 to the synchronization roller 203. This transfer is performed by each of the nozzle units 202a provided in the rotary head unit 202 and the suction holes 203a of the synchronous roller 203 sucking the IC chip 204 with a suction force by air pressure (negative pressure).

  The manufacturing apparatus of the invention according to Patent Literature 3 has a configuration in which the cylinder portion of the nozzle unit 202a of the rotary head portion 202 rotates (the description 0027 paragraph of Patent Literature 3), and the configuration is positioned in the rotational direction. This corresponds to deviation correction means. That is, by rotating the IC chip 204 adsorbed to the nozzle unit 202a, it is possible to perform positional deviation correction in the rotation direction (paragraph 0045). However, according to this configuration, it is necessary to be able to rotate all the cylinder portions of the plurality of nozzle units 202a provided, and the configuration of the manufacturing apparatus and the control of correction are complicated. Therefore, this configuration has a problem because the manufacturing cost of the manufacturing apparatus increases.

  Therefore, in view of the above-described problems, the present invention provides an electronic component mounting body manufacturing apparatus that can reliably correct a positional deviation in the rotation direction generated in an electronic component while having a simple configuration, and can improve the yield of the mounting body. This is the issue.

  An electronic component mounting body manufacturing apparatus according to the present invention includes an electronic component mounting body manufacturing apparatus used for mounting an electronic component on a base member on which an electronic circuit is formed. An electronic component supply unit that supplies the electronic component onto the base member, the electronic component supply unit adsorbing the conveyed electronic component up to the base member, and a conveyance path that conveys the electronic component Between the transfer means for transferring and the electronic components on the transfer path from being picked up by the transfer means to being transferred onto the base member, it intersects the suction direction of the electronic parts picked up by the transfer means. Correction means for correcting a positional deviation in the rotation direction around the suction direction on the virtual surface, and the correction means does not contact the electronic component sucked by the transfer means. It is provided at a separation position that is separated from the step, holds the electronic component that has been displaced among the electronic parts sucked by the transfer means, corrects it to the correct position, and releases the holding after the correction. It is characterized by.

  According to the above configuration, the correcting means is provided at the separation position so as not to come into contact with the electronic component sucked by the transfer means, and the electronic component sucked by the transfer means is shifted in position. Since the electronic component in the correct position does not come into contact with the electronic component at the correct position, the correct position is maintained because the electronic component in the correct position is not contacted. Correct correction is made. Therefore, the correction accuracy can be increased. And since this correction | amendment means is provided separately from a transfer means, it can be set as a simple structure compared with what corrects position shift with a transfer means.

  The correction means is configured to be movable between the separation position and an approach position closer to the transfer means than the separation position, and the positional deviation of the electronic components adsorbed by the transfer means. It is preferable to correct the correct position after it is positioned at the approach position.

  According to the preferred configuration, the correction means is configured to be movable, and the electronic component that is displaced by the transfer means is corrected to the correct position after being positioned at the approach position. The electronic component can be corrected at a position closer to the transfer means, or the electronic component can be corrected after being received from the transfer means at a position closer to the transfer means.

  And the manufacturing apparatus of the electronic component mounting body of this invention is based on the said correction | amendment means among the electronic components adsorbed by the said transfer means in the transfer direction upstream in the said transfer means rather than the position in which the said correction means was provided. It is preferable that a determination unit for determining what needs correction is provided.

  According to the preferable configuration, since the determination unit is provided, it is possible to reliably determine an electronic component that requires correction.

  In the electronic component mounting body manufacturing apparatus according to the present invention, the transfer means includes a plurality of suction portions for sucking the electronic components, and stops the transfer when sucking the electronic components by one suction portion. The correction means is configured to place the electronic component that is displaced among the electronic parts sucked by other suction portions while the transfer means stops the transfer at a correct position. It is preferable to correct.

  According to the preferable configuration, since the correction unit corrects the positional deviation of the electronic component while the transfer unit stops the transfer, the correction can be reliably performed.

  Each of the embodiments described below relates to an IC chip mounting apparatus, but the technical scope of the present invention is not limited to this, and an electronic circuit is formed on a base member on which an electronic circuit is formed. It covers all manufacturing equipment for electronic component mounting bodies used to supply components. The “electronic circuit” exhibits a function by being electrically connected to an electronic component, and the electronic circuit of the communication antenna F1 corresponds to each of the following embodiments. The “base member” is formed with the electronic circuit, and corresponds to the antenna film F in the following embodiments. The “electronic component” corresponds to the IC chip Ch in each of the following embodiments, but various other electronic components such as integrated circuits and LEDs can be exemplified.

  Although the present invention has a simple configuration, it is possible to reliably correct the positional deviation in the rotation direction generated in the electronic component, and to improve the yield of the mounted body.

It is the schematic which shows the manufacturing apparatus of the IC chip mounting body which concerns on one Embodiment of this invention. It is the schematic which shows the principal part of the manufacturing apparatus of the IC chip mounting body which concerns on the same embodiment. It is the schematic for demonstrating the concept of a buffer. It is a timing chart when position shift correction is performed by the correction means. It is the schematic which showed the positional relationship of the adsorption | suction nozzle of a synchronous roller and the adsorption | suction suction nozzle for correction | amendment of a correction means at the time of performing position shift correction. It is the schematic which shows an example of the structure of an IC tag. It is the schematic which shows the manufacturing apparatus of the IC chip mounting body of patent document 1. FIG. It is the schematic which shows the manufacturing apparatus of the IC chip mounting body of patent document 3. FIG.

  Hereinafter, an embodiment of the present invention will be taken up and described with reference to the drawings.

  The outline of the manufacturing apparatus of the IC chip mounting body of the present embodiment is shown in FIG. 1, and includes a film transport unit (base member transport unit) 1, an IC chip supply unit (electronic component supply unit) 2, and an antenna film supply unit. 3, a protective paper supply unit 4, an adhesive cure unit 5, a protective paper winding unit 6, a product test unit 7, and a product winding unit 8. The film transport unit 1 includes a clock roller 11. As shown in FIG. 2, the IC chip supply unit 2 includes a conveyance path 211, a synchronization roller (transfer means) 22, a correction means 23, an image pickup means (chip confirmation camera) Ca2 as a determination means, and a control means 24. Prepare. In addition, the description in this specification about the component of the manufacturing apparatus except the film conveyance part 1 and the IC chip supply part 2 is limited to the range required for description.

  As shown in FIG. 1, the film transport unit 1 transports a long antenna film F on which a communication antenna F1 is formed. The conveyance is performed at a constant speed in the longitudinal direction of the antenna film F. As shown in FIG. 2, the clock roller 11 is provided so that an outer peripheral surface faces a later-described synchronization roller 22, and an antenna film F is wound around the outer peripheral surface of the clock roller 11 as shown in FIG. 1. Then, the antenna film F is conveyed as the clock roller 11 rotates in the direction R11 (see FIG. 2).

  In this embodiment, the conveyance path 211 is configured as a part of the trough of the parts feeder 21, and a plurality of IC chips Ch are sequentially conveyed along the conveyance surface 211 a. The IC chip Ch is transferred by, for example, electromagnetic vibration, but may be transferred by various principles other than vibration. The IC chip Ch transported in the present embodiment has a flat rectangular shape in plan view, and bumps that are electrical contacts protrude from the back surface. However, the shape of the IC chip Ch is not limited to that of the present embodiment.

  In the present embodiment, as shown in FIG. 2, the transport surface 211a is provided with an angle with respect to the horizontal direction. In the IC chip Ch being transported, the bumps as electrical contacts face the transport surface 211a. The front and back of the IC chip Ch in the transport path 211 is monitored by a CCD camera (not shown), and the IC chip Ch whose bumps face away from the transport surface 211a is transported before the synchronization roller 22 is sucked. 211 is excluded.

  The synchronous roller 22 is a cylindrical roller, and as shown in FIG. 2, a plurality of cylindrical suction nozzles 221 protrude outwardly from the outer periphery thereof. The suction nozzles 221 are provided on the outer periphery of the synchronization roller 22 at equal intervals in the circumferential direction. In the present embodiment, the transfer means for adsorbing the IC chip Ch, which is an electronic component conveyed by the parts feeder 21, and transferring it to the antenna film F, which is a base member, comprises only the synchronization roller 22, but for example, a patent A combination of a plurality of means such as the rotary head unit 202 and the synchronization roller 203 described in Document 3 may be used. Thus, when a plurality of means are combined, the transfer means is provided at a position closest to the antenna film F among the plurality of means in order to perform correction at the end of the transfer process. It is desirable to provide the correction means 23 in one means.

  The synchronizing roller 22 rotates in the direction R22 (see FIG. 2), and the rotating shaft of the synchronizing roller 22 is arranged in parallel to the rotating shaft of the clock roller 11 described above. This synchronous roller 22 is the same as that described in Patent Document 1, and has a structure in which the inside is fixed and the outside rotates. Inside, as shown in FIG. 2, a first compartment 222a that can switch between atmospheric pressure and negative pressure, a second compartment 222b that is always negative pressure, and a third compartment that can switch between atmospheric pressure and positive pressure. The chamber 222c is provided, and when the air passage 221a of the suction nozzle 221 coincides with the first compartment 222a by rotating the outside with respect to each compartment, the IC chip Ch is adsorbed by negative pressure. The suction is continued by the negative pressure when it coincides with the second compartment 222b, and the IC chip Ch separates from the suction nozzle 221 when it coincides with the third compartment 222c. As a result, the synchronous roller 22 individually picks up the IC chips Ch on the conveyance path 211 and rotates while being held on the outer periphery of the synchronous roller 22, so that the outer peripheral surface of the clock roller 11 and the outer peripheral surface of the synchronous roller 22 face each other. At this time, the IC chip Ch is discharged to the antenna film F. The air pressure in each of the compartments 222a to 222c may be set to be constant, or may be changed according to the internal air pressure of the correction unit 23.

  The synchronization roller 22 rotates intermittently, and the synchronization roller 22 sucks the IC chip Ch onto the suction nozzle 221 when stopped. This adsorption is performed on the surface of the IC chip Ch (the surface opposite to the surface on which the bumps protrude). When the synchronization roller 22 rotates, the synchronization roller 22 rotates in synchronization with the clock roller 11 and supplies the IC chip Ch to the antenna film F conveyed at the same speed as the clock roller 11. The “synchronous rotation” is not required until the rotational speeds of the synchronous roller 22 and the clock roller 11 coincide with each other. When the IC chip Ch is supplied to the antenna film F, the “synchronous rotation” is applied to the antenna film F and the suction nozzle 221. The synchronization roller 22 may be rotated so that the attracted IC chip Ch is at a constant speed. The positional deviation of the IC chip Ch in the longitudinal direction of the antenna film F is corrected by adjusting the rotation of the synchronization roller 22.

  When the IC chip Ch is supplied to the antenna film F, the adhesive G supplied from the adhesive supply means 12 is applied on the antenna film F, and the IC placed on the antenna film F as described above is applied. The chip Ch is fixed, and the bumps of the IC chip Ch are electrically connected to the electronic circuit of the communication antenna F1. In order to recognize the position of the communication antenna F1, an antenna confirmation camera Ca1, which is a CCD camera, is provided at a position outside the diameter of the clock roller 11 and where the antenna film F can be photographed. The application timing of the adhesive G in the adhesive supply means 12 and the synchronous rotation of the synchronization roller 22 with respect to the clock roller 11 are controlled so as to match the recognized position of the communication antenna F1. These controls are performed by the control means 24 shown in FIG.

  The synchronization roller 22 is provided so as to be movable in the width direction with respect to the clock roller 11, and the position where the IC chip Ch is placed on the antenna film F can be adjusted. In this adjustment, the antenna confirmation camera Ca1 recognizes the position of the communication antenna F1 in the width direction, and an IC in which the chip confirmation camera Ca2, which is a CCD camera provided outside the position of the synchronization roller 22, is attracted to the synchronization roller 22. The position adjustment motor provided on the synchronization roller 22 based on the position information recognized by the cameras Ca1 and Ca2 (same configuration as described in Patent Documents 3 and 2) (Not shown). Thereby, the position shift of the IC chip Ch in the width direction of the antenna film F is corrected. In other words, the chip confirmation camera Ca2 is used to determine which of the IC chips Ch attracted to the synchronization roller 22 needs to be corrected for positional deviation in the width direction.

  As described above, the correction unit 23 of the present embodiment adjusts the rotational speed of the synchronization roller 22 (corrects the displacement of the IC chip Ch in the longitudinal direction of the antenna film F) and moves the synchronization roller 22 in the width direction. It is provided to correct the positional deviation of the IC chip Ch in the rotation direction, which cannot be dealt with only by correcting the positional deviation of the IC chip Ch in the width direction of the antenna film F. The “rotation direction” is a rotation direction around the suction direction on a virtual plane that intersects the suction direction (the direction of suction force) of the IC chip Ch sucked by the suction nozzle 221. The “intersection” is “orthogonal” in the present embodiment, but is not limited thereto. Further, when the “rotation direction” is expressed with the antenna film F as a reference, the rotation direction is centered on a normal line of the antenna film F (a virtual line extending in a direction orthogonal to the surface of the antenna film F).

  The correction means 23 is provided on the downstream side in the rotation direction of the synchronization roller 22 from the position where the chip confirmation camera Ca2 is provided. The correction means 23 is provided at one place. Therefore, since the displacement correction can be performed without using a configuration in which all the cylinder portions of the nozzle unit 102a rotate as in the invention according to Patent Document 3, the structure of the present embodiment is relatively simple. The cost increase of the manufacturing apparatus can be minimized.

  As shown in FIG. 2, the correcting unit 23 includes a correcting unit main body 231 arranged so that its axis is along the radial direction of the synchronizing roller 22, and an IC located at the tip of the correcting unit main body 231 near the synchronizing roller in the axial direction. And a suction nozzle for correction 232 as a chip holding means. More specifically, regarding the arrangement of the correction means 23, among the suction nozzles 221 of the synchronous roller 22 when rotation is stopped, a predetermined suction nozzle 221 (specifically, a suction located downstream in the rotational direction from the chip confirmation camera Ca2). The axis of one of the nozzles 221 and the axis of the correction means 23 are coaxial.

  The correction means 23 changes the internal pressure (negative pressure, atmospheric pressure, positive pressure) so that the correction suction nozzle 232 sucks the IC chip Ch or releases the IC chip Ch from the correction suction nozzle 232. You can. Also, the attractive force can be adjusted. Thereby, the IC chip Ch can be exchanged with the suction nozzle 221 of the synchronous roller 22.

  The correcting means 23 includes an actuator. With this actuator, the correction means 23 can be approached and separated in the coaxial direction with reference to the tip position of the predetermined suction nozzle 221 when the synchronous roller 22 that rotates intermittently is stopped (with respect to the tip position). You can move forward and backward). In order to make the approach and separation in this way, at least the correction suction nozzle 232 of the correction means 23 is configured to be movable in the axial direction. The approach / separation of the correction means 23 is made in response to an instruction from the control unit 24.

  The correcting means 23 is configured to be rotatable around the axial direction by the actuator. In order to rotate in this way, at least the correction suction nozzle 232 of the correction means 23 is configured to be rotatable. The correction means 23 is rotated in response to an instruction from the control unit 24.

  By the way, when the suction nozzle 232 for correction of the correction unit 23 is separated from the suction nozzle 221, the distance from the synchronization roller 22 is maintained so as not to contact the IC chip Ch sucked by the suction nozzle 221. In other words, at the time of separation, the tip of the correction suction nozzle 232 is positioned outside the outermost locus of the IC chips Ch sucked by the suction nozzle 221 in accordance with the rotation of the synchronization roller 22. ing. Thus, by maintaining the distance between the correction suction nozzle 232 and the synchronization roller 22 at the time of separation, the correction suction nozzle 232 does not need to be corrected, that is, the IC chip Ch (that is, a normal posture with no positional deviation in the rotation direction). The IC chip Ch) is not in contact with the IC chip Ch), so that the IC chip Ch is not newly displaced.

  On the other hand, when the suction nozzle 232 for correction approaches the suction nozzle 221, it is desirable that the correction suction nozzle 232 contacts the back surface (surface on which the bump protrudes) of the IC chip Ch sucked by the suction nozzle 221 (FIG. 5B ) (E)). As a result, when the IC chip Ch is exchanged between the suction nozzle 221 and the correction suction nozzle 232, the IC chip Ch does not move in the air, and the IC chip Ch is displaced during the air movement. I will not let you.

  However, when the IC chip Ch is exchanged between the correction suction nozzle 232 and the suction nozzle 221, the correction suction nozzle 232 when the IC chip Ch approaches the suction nozzle 221 to such an extent that the IC chip Ch is not displaced. Can be slightly separated from the back surface of the IC chip Ch.

  Next, the control unit 24 recognizes the positional deviation based on the image of the IC chip Ch captured by the chip confirmation camera Ca2, and controls the synchronization roller 22 (rotation speed and position with respect to the clock roller 11) and the correction unit 23. . Thereby, the manufacturing apparatus of the IC chip mounting body of this embodiment can perform the positional deviation correction of the IC chip Ch in the longitudinal direction and the width direction of the antenna film F and the positional deviation correction in the rotation direction.

  The control of the correction unit 23 by the control unit 24 is related to the positional deviation correction in the rotation direction of the IC chip Ch. The correction unit 23 is not operated for the IC chip Ch sucked by the suction nozzle 221 at the correct position. The IC chip Ch having a positional deviation in the rotational direction (a positional deviation exceeding the allowable range) is corrected by operating the correction means 23, and the positional deviation can be corrected without waste.

  In the control means 24, a buffer (empty area) capable of storing information is set for each stop position of the synchronization roller 22 between the position of the chip check camera Ca2 and the mounting position. When the synchronous roller 22 shown in FIG. 2 is used in the illustrated positional relationship, this buffer is shown in each column in the vertical direction of FIGS. 3 (A) to (H). In each row, the buffer corresponding to the position of the chip confirmation camera Ca2 is the seventh buffer, the buffer number assigned to the mounting position is decreased by one, and the buffer corresponding to the mounting position is the zeroth buffer. Become. Note that the buffer corresponding to the position of the correction means 23 is the fourth buffer.

  Each buffer stores identification information for identifying each IC chip Ch on the synchronization roller 22 detected based on the image of the IC chip Ch obtained by the chip confirmation camera Ca2. This identification information also includes positional deviation information, whereby the control means 24 can recognize the positional deviation of the IC chip Ch.

  Here, the column (A) in FIG. 3 shows a state in which the position information (marked with ○ in the figure) of the IC chip Ch at the position of the chip confirmation camera Ca2 is stored in the seventh buffer (other buffers). The identification information of the other IC chip Ch is also stored in FIG. As the synchronization roller 22 rotates intermittently, the identification information sequentially moves in the order of the 6th buffer and the 5th buffer. To the 0th buffer corresponding to the mounting position. By storing the identification information in each buffer in this way, the control unit 24 can grasp the position of each IC chip Ch in the IC chip supply unit 2 at a specific time. Then, by using the positional deviation information included in the identification information, the control unit 24 can appropriately control the correction unit 23 to correct the positional deviation.

  According to the correction means 23 of the present embodiment, adjustment of the rotational speed of the synchronization roller 22 that has been conventionally performed (correction of positional deviation of the IC chip Ch in the longitudinal direction of the antenna film F) and the width direction of the synchronization roller 22 are performed. In addition to the movement of the IC chip Ch in the width direction of the antenna film F, in addition to further correcting the positional deviation of the IC chip Ch in the rotation direction, it is possible to mount the IC chip Ch without any positional deviation. Yield improvement can be expected.

  Next, regarding the operation of the correction unit 23, a timing chart (FIG. 4) when the positional deviation correction in the rotation direction is performed, and a schematic diagram showing the positional relationship between the suction nozzle 221 and the correction suction nozzle 232 (FIG. 5). Will be described with reference to FIG. FIG. 4 shows one operation of intermittent rotation of the synchronous roller 22 (from the start of rotation until it stops and immediately before the start of the next rotation) as “one cycle”. In the present embodiment, the time required for one cycle is 0.12 seconds.

  First, the rotating synchronous roller 22 stops (symbol a in FIG. 4). The positional relationship between the suction nozzle 221 and the correction suction nozzle 232 at this time is as shown in FIG. That is, at this time, the suction nozzle 221 and the correction suction nozzle 232 are coaxial, and the tips of the nozzles 221 and 232 face each other. Next, based on the image of the IC chip Ch captured by the chip confirmation camera Ca2, the control unit 24 recognizes identification information including the angle of the IC chip Ch with respect to the suction nozzle 221 (symbol i). By the recognition of the control means 24, the IC chip Ch that needs to be corrected is specified because the angle of positional deviation in the rotational direction is larger than a predetermined angle. The identification information is stored in the buffer as described above, and is used for grasping the position of the IC chip Ch in the IC chip supply unit 2.

  When the control unit 24 specifies an IC chip Ch that needs to be corrected for displacement, the correction suction nozzle 232 of the correction unit 23 moves forward toward the suction nozzle 221 and stops when it moves a predetermined distance (symbol b). The positional relationship between the nozzles 221 and 232 at this time is as shown in FIG. 5B, and the surface of the IC chip Ch is in contact with the suction nozzle 221 and the back surface is in contact with the correction suction nozzle 232. Yes.

  Next, the inside of the correction suction nozzle 232 is set to a negative pressure, and the IC chip Ch is sucked by the correction suction nozzle 232 (symbol d). At this time, since the inside of the suction nozzle 221 is also at a negative pressure, it is necessary to set the pressure so that the suction force of the correction suction nozzle 232 is stronger than the suction force of the suction nozzle 221. . As a result, the IC chip Ch is held by the correction suction nozzle 232. The correction suction nozzle 232 moves backward from the suction nozzle 221 and stops when it moves a predetermined distance (symbol c). The positional relationship between the nozzles 221 and 232 at this time is as shown in FIG.

  Next, the correction suction nozzle 232 rotates, and the IC chip Ch sucked by the correction suction nozzle 232 is set to the correct position in the rotation direction (symbol e). Then, as shown in FIG. 5D, the correction suction nozzle 232 advances toward the suction nozzle 221 and stops when it moves a predetermined distance (symbol f). The positional relationship between the nozzles 221 and 232 at this time is as shown in FIG. 5E (the same state as shown in FIG. 5B).

  Next, the inside of the correction suction nozzle 232 is set to a positive pressure or atmospheric pressure, and the IC chip Ch is discharged from the correction suction nozzle 232 or is not sucked by the correction suction nozzle 232 (symbols d and g). Even at this time, the suction nozzle 221 still has a negative pressure, so that the suction force of the correction suction nozzle 232 is weaker than the suction force of the suction nozzle 221, and the IC chip Ch is applied to the suction nozzle 221 of the synchronous roller 22. It is adsorbed again. Thereby, the holding of the IC chip Ch by the correction suction nozzle 232 is released.

  Next, the correction suction nozzle 232 moves backward from the suction nozzle 221 and stops when it moves a predetermined distance (symbol h). The positional relationship between the nozzles 221 and 232 at this time is as shown in FIG. 5F (the same state as shown in FIG. 5A). This completes one cycle, and the synchronous roller 22 that has been stopped rotates again (symbol a).

  As mentioned above, although several embodiments have been taken up and described, the specific configuration of the electronic component mounting body manufacturing apparatus according to the present invention is not limited to the above-described embodiments, and does not depart from the gist of the present invention. Various modifications are possible within the range.

  For example, unlike the present embodiment, the correction suction nozzle 232 may not be moved toward and away from the synchronization roller 22. In this case, the IC chip Ch is spaced from the suction nozzle 221 so as not to touch the IC chip Ch, and the internal pressure of the correction means 23 is changed so that the IC chip Ch is connected to the suction nozzle 221 of the synchronization roller 22. Can be exchanged.

  Further, the suction and release of the IC chip Ch are not performed only by adjusting the pressure of the correction suction nozzle 232, but the internal pressures of both the suction nozzle 221 of the synchronous roller 22 and the correction suction nozzle 232 of the correction means 23 are changed. And may be performed by a balance between the pressures of the two.

  Further, the correction means 23 may be corrected by mechanical movement means such as clamping means instead of suction as in the present embodiment. That is, various configurations are adopted as long as the electronic component (IC chip) Ch adsorbed by the transfer means (synchronous roller) 22 can hold and correct the position of the electronic component (IC chip) Ch in the rotational direction. it can.

  Further, the determination means is not limited to the one that performs imaging like the chip confirmation camera Ca2 of the present embodiment, and various means such as a sensor that can perform image recognition, posture recognition, position recognition, and the like can be used. .

DESCRIPTION OF SYMBOLS 1 Base member conveyance part, Film conveyance part 2 Electronic component supply part, IC chip supply part 211 Conveyance path 22 Transfer means, Synchronous roller 221 Adsorption part, Adsorption nozzle 23 Correction means Ca2 Imaging means, Chip confirmation camera Ch Electronic component, IC chip F Base member, antenna film

Claims (4)

In an electronic component mounting body manufacturing apparatus used for mounting an electronic component on a base member on which an electronic circuit is formed,
A base member transport unit that transports the base member; and an electronic component supply unit that supplies an electronic component onto the base member.
The electronic component supply unit includes a transport path for transporting the electronic component, a transport unit that sucks the transported electronic component and transfers it to the base member, and an electronic component on the transport path is sucked by the transport unit. Correction means for correcting a positional deviation in the rotation direction around the suction direction on a virtual plane intersecting the suction direction of the electronic component sucked by the transfer means between With
The correction means is provided at a separation position separated from the transfer means so as not to contact the electronic parts adsorbed by the transfer means, and the position of the electronic components adsorbed by the transfer means is the position. An apparatus for manufacturing an electronic component mounting body, characterized by holding a shift and correcting it to a correct position and releasing the holding after the correction.   The correction means is configured to be movable between the separation position and an approach position that is closer to the transfer means than the separation position, and is configured to shift the position of the electronic components adsorbed by the transfer means. 2. The apparatus for manufacturing an electronic component mounting body according to claim 1, wherein the device is corrected to a correct position after being positioned at the approach position.   A discriminating unit for discriminating an electronic component adsorbed by the transfer unit that needs to be corrected by the correction unit on the upstream side in the transfer direction of the transfer unit from the position where the correction unit is provided. The apparatus for manufacturing an electronic component mounting body according to claim 1 or 2, further comprising: The transfer means is provided with a plurality of suction portions for sucking electronic components, and is configured to stop the transfer when sucking electronic components with one suction portion,
The correction means corrects the electronic component that is displaced by another suction part to the correct position while the transfer means stops the transfer. The manufacturing apparatus of the electronic component mounting body in any one of Claims 1-3.

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