TWI720992B - Peeling device - Google Patents

Peeling device Download PDF

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Publication number
TWI720992B
TWI720992B TW105119566A TW105119566A TWI720992B TW I720992 B TWI720992 B TW I720992B TW 105119566 A TW105119566 A TW 105119566A TW 105119566 A TW105119566 A TW 105119566A TW I720992 B TWI720992 B TW I720992B
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Taiwan
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peeling
sheet
shaped member
plate
holding
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TW105119566A
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Chinese (zh)
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TW201724337A (en
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高澤徹
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日商迪思科股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/7806—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices involving the separation of the active layers from a substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3512—Cracking
    • H01L2924/35121—Peeling or delaminating

Abstract

提供不用複雜構成，或運轉成本之負擔大的 剝離用的膠帶，就能夠剝離被貼附於半導體晶圓(板狀構件)之保護膠帶(薄片)的剝離裝置。 Provides that do not require complicated structure or heavy burden of operating cost The peeling tape is a peeling device that can peel the protective tape (sheet) attached to the semiconductor wafer (plate member).

若藉由本案發明，則提供一種剝離方法 及能夠實行該剝離方法之剝離裝置，其係至少由下述工程所構成：第1剝離工程，其係使前端針狀構件之前端部抵接於被保持在保持載置台之板狀構件之薄片之外周之至少一部分，使該一部分從該板狀構件剝離；剝離起點部生成工程，其係對該一部分剝離的該薄片和該板狀構件之間噴吹氣體，生成藉由包含該一部分之擴大的剝離區域所形成之剝離起點部；及最終剝離工程，其係以該剝離起點部為起點，從該板狀構件剝離該薄片之無被剝離之剩餘部分。 If invented by this case, a peeling method is provided And the peeling device capable of performing the peeling method is constituted by at least the following process: the first peeling process is to make the front end of the tip needle-shaped member abut against the sheet of the plate-shaped member held on the holding table At least a part of the outer periphery is peeled off from the plate-shaped member; the peeling starting point generation process is to blow a gas between the sheet and the plate-shaped member that is peeled off the part to generate an expansion by including the part The peeling starting point formed by the peeling area; and the final peeling process, which uses the peeling starting point as a starting point to peel off the remaining part of the sheet that is not peeled from the plate-shaped member.

Description

剝離裝置 Peeling device

本發明係關於剝離被貼附在半導體晶圓等之板狀構件之薄片的剝離裝置。 The present invention relates to a peeling device for peeling a sheet attached to a plate-shaped member such as a semiconductor wafer.

在半導體裝置之製造工程中，藉由在略圓板形狀之半導體晶圓之表面被配置成格子狀之分割預定線區劃複數區域，在該被區劃之區域形成IC、LSI等之裝置。而且，於藉由研削裝置對該半導體晶圓之背面進行研削，且於形成規定的厚度之後，藉由切割裝置、雷射加工裝置等沿著分割預定線進行切斷，將形成有裝置之區域予以分割製造各個半導體裝置。 In the manufacturing process of semiconductor devices, a plurality of regions are divided by predetermined dividing lines arranged in a grid on the surface of a substantially disc-shaped semiconductor wafer, and devices such as ICs, LSIs, etc. are formed in the divided regions. Furthermore, after grinding the back surface of the semiconductor wafer with a grinding device, and after forming a predetermined thickness, it is cut along the planned dividing line by a dicing device, a laser processing device, etc., to cut the area where the device is formed Separately manufacture individual semiconductor devices.

應使上述IC、LSI等之半導體晶片小型化，在上述研削工程中，以盡量可以使半導體晶圓(板狀構件)之背面更薄為佳，於研削之時，為了保護形成有半導體晶圓之裝置之表面，貼附由黏貼薄膜等所構成之保護膠帶(薄片)。 The semiconductor wafers such as ICs and LSIs should be miniaturized. In the above-mentioned grinding process, it is better to make the back surface of the semiconductor wafer (plate-shaped member) as thin as possible. During grinding, in order to protect the formed semiconductor wafer The surface of the device is attached with a protective tape (sheet) composed of adhesive film, etc.

研削工程結束之後，必須使上述保護膠帶從半導體晶圓予以剝離，作為該保護膠帶之剝離方法，所知 的有在被貼附於半導體晶圓之表面的保護膠帶之端部熱壓接剝離用之黏著膠帶，且拉伸該黏著膠帶，使該保護膠帶從半導體晶圓剝離(例如，參照專利文獻1、2)。 After the grinding process is completed, the above-mentioned protective tape must be peeled off from the semiconductor wafer. As a peeling method of the protective tape, it is known There is an adhesive tape for thermal compression bonding and peeling off the end of the protective tape attached to the surface of the semiconductor wafer, and the adhesive tape is stretched to peel off the protective tape from the semiconductor wafer (for example, refer to Patent Document 1 ,2).

[先前技術文獻] [Prior Technical Literature] [專利文獻] [Patent Literature]

[專利文獻1]日本特開平11-016862號公報 [Patent Document 1] Japanese Patent Application Laid-Open No. 11-016862

[專利文獻2]日本特開2003-338477號公報 [Patent Document 2] JP 2003-338477 A

在藉由上述以往技術的保護膠帶之剝離裝置中，由於保護膠帶藉由研削工程之時所產生之推壓力而被黏貼於半導體晶圓之表面，故成為藉由將從半導體晶圓之表面剝離保護膠帶之時發揮強黏著力之剝離用膠帶黏貼於保護膠帶而拉伸該剝離用膠帶，使保護膠帶剝離之構成，為了實現該構成，至少需要剝離用膠帶之進給機構、剝離用膠帶之切斷機構、剝離用膠帶之壓接機構，有構造變得複雜之問題。而且，如上述般，有剝離用膠帶被要求強黏接力，同時要求能耐被牢固黏貼之保護膠帶之剝離工程的強度，作為消耗品所使用之該剝離裝置的剝離用膠帶之運轉成本變高之問題。 In the peeling device of the protective tape of the above-mentioned prior art, since the protective tape is stuck to the surface of the semiconductor wafer by the pressing force generated during the grinding process, it becomes a method of peeling off the surface of the semiconductor wafer. When protecting the tape, a peeling tape that exerts a strong adhesive force is attached to the protective tape and the peeling tape is stretched to peel off the protective tape. In order to achieve this structure, at least the feeding mechanism of the peeling tape and the peeling tape are required. The cutting mechanism and the crimping mechanism of the stripping tape have the problem that the structure becomes complicated. In addition, as mentioned above, there are peeling tapes that require strong adhesion and strength that can withstand the peeling process of the protective tape that is firmly attached. The operating cost of the peeling tape for the peeling device used as a consumable becomes higher. problem.

再者，在上述以往技術中，有下述問題：在 將剝離用膠帶壓接於保護膠帶之端部而進行剝離之後，將剝離後之保護膠帶廢棄於剝離裝置之廢棄容器之時，剝離用膠帶之黏貼面附著於廢棄容器之側壁等，不管廢棄容器之容量是否還有空間，剝離後之保護膠帶塞住廢棄容器之開口部，無法充分利用廢棄容器的容量。 Furthermore, in the above-mentioned prior art, there are the following problems: After the peeling tape is crimped to the end of the protective tape and peeled off, when the peeled protective tape is discarded in the waste container of the peeling device, the adhesive surface of the peeling tape is attached to the side wall of the waste container, etc., regardless of the waste container Whether there is room for the capacity of the waste container, the protective tape after peeling off plugs the opening of the waste container, and the capacity of the waste container cannot be fully utilized.

若藉由本發明，則提供一種剝離裝置，其係從板狀構件剝離被貼附在板狀構件之薄片，該剝離裝置具有：保持載置台，其具有保持貼附該薄片之板狀構件的保持面；剝離起點部生成手段，其係使針狀構件之前端部抵接於被保持在該保持載置台之該板狀構件之該薄片之外周之至少一部分，使該一部分從該板狀構件剝離，對該一部分剝離之該薄片和該板狀構件之間噴吹氣體，生成藉由包含該一部分之擴大的剝離區域所形成之剝離起點部；挾持手段，其係挾持該剝離的剝離起點部；間隔手段，其係使挾持該剝離起點部之該挾持手段對該保持載置台朝上方間隔開；折彎輥，其係在朝上方間隔開之該挾持手段之下方，作用於從該板狀構件剝離之該薄片之黏接面側，邊使該薄片從該板狀構件剝離，邊朝剝離方向折彎；移動手段，其係以該薄片從該板狀構件被剝離之方式，使該折彎輥和該保持載置台之至少一方朝與該板狀構件並列之剝離方向做相對性移動，藉由該移動手段之移動，使該薄片從該板狀構件完全剝離。 According to the present invention, there is provided a peeling device that peels a sheet attached to a plate-shaped member from a plate-shaped member, and the peeling device has a holding table having a holding table for holding the plate-shaped member attached to the sheet Surface; peeling starting point generating means, which is to make the needle-shaped member front end abut at least a part of the outer periphery of the sheet of the plate-shaped member held in the holding table, so that the part is peeled from the plate-shaped member , Blowing a gas between the part of the peeled sheet and the plate-shaped member to generate a peeling starting point formed by an enlarged peeling area including the part; a pinching means that pinches the peeling starting point of the peeling; Spacer means that the holding means holding the peeling starting point is spaced upward from the holding table; the bending roller is located below the holding means spaced upward and acts on the plate-shaped member The adhesive surface side of the peeled sheet is bent in the peeling direction while peeling the sheet from the plate-shaped member; the moving means is such that the sheet is peeled from the plate-shaped member to make the bending At least one of the roller and the holding table moves relative to the peeling direction parallel to the plate-shaped member, and the sheet is completely peeled from the plate-shaped member by the movement of the moving means.

在上述剝離裝置中，以構成下述般為佳，具備吸引保持從該板狀構件剝離之該薄片的薄片保持手段，和收容剝離後之上述薄片之廢棄容器，該薄片保持手段係於吸引保持該薄片之後，在該廢棄容器的正上方移動，且解除在該廢棄容器的正上方吸引保持的該薄片之吸引，將該薄片收容在該廢棄容器內。 In the above-mentioned peeling device, it is preferable to have the following structure: a sheet holding means for sucking and holding the sheet peeled from the plate-shaped member, and a waste container for accommodating the peeled sheet, and the sheet holding means is sucked and held. After that, the sheet moves directly above the waste container, the suction of the sheet sucked and held directly above the waste container is released, and the sheet is stored in the waste container.

藉由本發明之剝離裝置，係從板狀構件剝離被貼附在板狀構件之薄片的剝離裝置，由於被構成具有：保持載置台，其具有保持貼附該薄片之板狀構件的保持面；剝離起點部生成手段，其係使前端針狀構件之前端部抵接於被保持在該保持載置台之該板狀構件之該薄片之外周之至少一部分，使該一部分剝離，對該一部分剝離之該薄片和該板狀構件之間噴吹氣體，生成藉由包含該一部分之擴大的剝離區域所形成之剝離起點部；挾持手段，其係挾持該剝離的剝離起點部；間隔手段，其係使挾持該剝離起點部之該挾持手段對該保持載置台朝上方間隔開；折彎輥，其係在朝上方間隔開之該挾持手段之下方，作用於從該板狀構件剝離之該薄片之黏接面側，邊使該薄片從該板狀構件剝離，邊朝剝離方向折彎；移動手段，其係以該薄片從該板狀構件被剝離之方式，使該折彎輥和該保持載置台之至少一方朝與該板狀構件並列之剝離方向做相對性移動，藉由該移動手段之移動使該薄片從該板狀構件完全剝 離，故與上述相同，不需要剝離用之膠帶的進給、切斷、壓接機構，且不需要高額的剝離用膠帶等之消耗品，可以抑制從板狀構件剝離薄片之時的運轉成本。 With the peeling device of the present invention, the peeling device that peels the sheet attached to the plate-shaped member from the plate-shaped member is configured to have: a holding table having a holding surface for holding the plate-shaped member attached to the sheet; A means for generating a peeling start point is to make the front end of the tip needle-shaped member abut at least a part of the outer periphery of the sheet of the plate-shaped member held on the holding table, to peel the part, and to peel the part A gas is sprayed between the sheet and the plate-shaped member to generate a peeling starting point formed by the enlarged peeling area including the part; a pinching means, which pinches the peeling starting point of the peeling; a spacing means, which makes The holding means holding the peeling starting point are spaced upward from the holding table; the bending roller is located below the holding means spaced upward and acting on the adhesion of the sheet peeled from the plate-shaped member On the junction side, while peeling the sheet from the plate-shaped member, bend it in the peeling direction; the moving means is such that the sheet is peeled from the plate-shaped member to make the bending roller and the holding table At least one of them moves relative to the peeling direction parallel to the plate-shaped member, and the sheet is completely peeled off from the plate-shaped member by the movement of the moving means. Since it is the same as the above, there is no need for the feeding, cutting, and crimping mechanism of the peeling tape, and no expensive consumables such as the peeling tape, and the running cost when peeling the sheet from the plate member can be suppressed. .

再者，上述剝離裝置，以具備吸引保持從該板狀構件剝離之該薄片的薄片保持手段，和收容剝離後之上述薄片之廢棄容器，該薄片保持手段具備於吸引保持該薄片之後，在該廢棄容器的正上方移動，且解除在該廢棄容器的正上方吸引保持的該薄片之吸引，將該薄片收容在該廢棄容器內的廢棄手段為佳。本發明被利用之剝離裝置中，因為不使用具有剝離用膠帶等之黏接性的消耗品，故在將該薄片收納於廢棄容器之時無附著於廢棄容器之入口部或內側側面之虞，可以更容易藉由薄片保持手段將該薄片從廢棄容器之底部以重疊之方式進行廢棄，並可以充分地運用廢棄容器之容量。 Furthermore, the peeling device includes a sheet holding means for sucking and holding the sheet peeled from the plate-shaped member, and a waste container for accommodating the peeled sheet, and the sheet holding means is provided for sucking and holding the sheet. It is preferable that the waste container moves directly above the waste container and releases the suction of the sheet held directly above the waste container and stores the sheet in the waste container. Since the peeling device used in the present invention does not use adhesive consumables such as peeling tape, there is no risk of sticking to the inlet or the inner side of the waste container when the sheet is stored in the waste container. The sheet can be more easily discarded from the bottom of the waste container in an overlapping manner by the sheet holding means, and the capacity of the waste container can be fully utilized.

1:剝離裝置 1: Stripping device

2:靜止基台 2: Stationary abutment

3:保持載置台機構(保持載置台) 3: Hold the mounting table mechanism (holding the mounting table)

4:薄片保持手段 4: Flake retention means

5:折彎輥移動手段 5: Moving means of bending roll

6:剝離起點部生成手段 6: Means for generating peeling starting point

7:廢棄容器 7: Abandoned container

10:半導體晶圓(板狀構件) 10: Semiconductor wafer (plate-shaped member)

11:保護膠帶(薄片) 11: Protective tape (sheet)

12:剝離起點部 12: Peeling starting point

31、31:導軌 31, 31: rail

32:移動基台 32: Mobile abutment

36:載置台本體 36: The main body of the stage

41:第1汽缸 41: 1st cylinder

44:第2汽缸 44: 2nd cylinder

47:第3汽缸 47: 3rd cylinder

48:挾持構件 48: Holding components

55:折彎輥 55: bending roll

61:第4汽缸 61: 4th cylinder

64:前端構件 64: front-end components

65:前端針狀構件 65: Needle-shaped front end

66:氣體噴嘴 66: gas nozzle

圖1為依本發明所構成之剝離裝置之斜視圖。 Fig. 1 is a perspective view of a peeling device constructed according to the present invention.

圖2為表示圖1所示之剝離裝置之薄片保持手段的斜視圖。 Fig. 2 is a perspective view showing a sheet holding means of the peeling device shown in Fig. 1;

圖3為表示構成圖1所示之剝離裝置之折彎輥之支撐框架的斜視圖。 Fig. 3 is a perspective view showing a supporting frame of a bending roll constituting the peeling device shown in Fig. 1;

圖4為圖1所示之剝離裝置之剝離起點部生成手段之斜視圖。 Fig. 4 is a perspective view of the peeling starting point generating means of the peeling device shown in Fig. 1.

圖5為圖1所示之剝離裝置之重要部位側面圖。 Fig. 5 is a side view of important parts of the peeling device shown in Fig. 1.

圖6為表示在圖5所示之狀態下，在保持載置台上載置貼附保護膠帶之半導體晶圓之狀態的重要部位側面圖。 6 is a side view of important parts showing a state where a semiconductor wafer with a protective tape attached to a holding table is placed on the holding table in the state shown in FIG. 5.

圖7為表示從圖6之狀態使保持載置台移動而使半導體晶圓移動之狀態的重要部位側面圖。 7 is a side view of important parts showing a state in which the holding stage is moved from the state of FIG. 6 to move the semiconductor wafer.

圖8為表示從圖7之狀態使前端針狀構件朝下方移動而接近於半導體晶圓之狀態的重要部位側面圖。 Fig. 8 is a side view of important parts showing a state in which the tip needle-shaped member is moved downward from the state shown in Fig. 7 to approach the semiconductor wafer.

圖9為表示從圖8之狀態使前端針狀構件抵接於半導體晶圓之狀態的重要部位側面圖。 FIG. 9 is a side view of important parts showing a state in which the tip needle-shaped member is in contact with the semiconductor wafer from the state shown in FIG. 8.

圖10為表示從圖9之狀態從氣體噴嘴對保護膠帶之剝離部分和半導體晶圓之間噴射氣體之狀態的重要部位側面圖。 FIG. 10 is a side view of important parts showing a state in which gas is sprayed between the peeled portion of the protective tape and the semiconductor wafer from the gas nozzle from the state in FIG. 9.

圖11為表示從圖10之狀態使挾持構件作動而挾持剝離之保護膠帶之外周端部之狀態的重要部位側面圖。 Fig. 11 is a side view of important parts showing a state in which the pinching member is actuated from the state of Fig. 10 to pinch the outer peripheral end of the peeled protective tape.

圖12為表示從圖11之狀態使折彎輥移動而接觸於保護膠帶之黏接面之狀態的重要部位側面圖。 Fig. 12 is a side view of an important part showing a state where the bending roller is moved from the state of Fig. 11 and is in contact with the adhesive surface of the protective tape.

圖13為從圖12之狀態使折彎輥和保持載置台移動而朝折彎保護膠帶之剝離前進之狀態的圖示。 Fig. 13 is a diagram showing a state in which the bending roller and the holding table are moved from the state of Fig. 12 to advance the peeling of the bend protective tape.

圖14為表示從圖13之狀態使折彎輥移動而從半導體晶圓使保護膠帶剝離之狀態的圖示。 FIG. 14 is a diagram showing a state where the bending roller is moved from the state of FIG. 13 and the protective tape is peeled from the semiconductor wafer.

圖15為表示從圖14之狀態將剝離之保護膠帶吸引保持在薄片保持板之下面之狀態的圖示。 Fig. 15 is a diagram showing a state in which the peeled protective tape is sucked and held under the sheet holding plate from the state of Fig. 14.

圖16為表示從圖15之狀態在薄片保持板之下面吸引保持保護膠帶之狀態下，使薄片保持手段移動至廢棄容器 正上方之狀態的重要部位側面圖。 Fig. 16 shows the state in which the protective tape is sucked and held under the sheet holding plate from the state of Fig. 15 and the sheet holding means is moved to the waste container Side view of important parts in the state directly above.

圖17為表示從圖16之狀態使薄片保持板下降至廢棄容器內之狀態的圖示。 Fig. 17 is a diagram showing a state in which the sheet holding plate is lowered into the waste container from the state of Fig. 16;

以下，針對依本發明構成的剝離裝置之最佳的實施型態，參照附件圖面詳細說明。 Hereinafter, the best implementation mode of the peeling device constructed according to the present invention will be described in detail with reference to the drawings of the accessories.

圖1表示依本發明所構成之剝離裝置1之一實施型態之斜視圖。圖示之實施型態中之剝離裝置1具備靜止基台2、保持載置台機構3、薄片保持手段4、折彎輥移動手段5、剝離起點部生成手段6及廢棄容器7。 Fig. 1 shows a perspective view of an embodiment of a peeling device 1 constructed according to the present invention. The peeling device 1 in the embodiment shown in the figure includes a stationary base 2, a holding table mechanism 3, a sheet holding means 4, a bending roller moving means 5, a peeling starting point generating means 6, and a waste container 7.

上述保持載置台機構3如圖所示般，由下述構成：在靜止基台2上沿著以箭號X所示之剝離加工進給方法(剝離方向)而配設之2根導軌31、31；以滑動自如之方式被配設在該2根導軌31、31上之移動基台32；沿著導軌31、31與該移動基台32之下面之螺帽部卡合之滾珠螺桿軸33；在該滾珠螺桿軸33之一端側，以旋轉自如之方式支撐該滾珠螺桿軸33之軸承34；和在另一端側，使該滾珠螺桿軸33旋轉，以在X方向往返自如之方式使該移動基台32移動之脈衝馬達35。 As shown in the figure, the above-mentioned holding table mechanism 3 is composed of two guide rails 31 arranged on the stationary base 2 along the peeling processing and feeding method (peeling direction) indicated by the arrow X. 31; A movable base 32 arranged on the two guide rails 31, 31 in a slidable manner; a ball screw shaft 33 engaged with the nut portion below the movable base 32 along the guide rails 31, 31 ; On one end side of the ball screw shaft 33, the bearing 34 of the ball screw shaft 33 is rotatably supported; and on the other end side, the ball screw shaft 33 is rotated to make the ball screw shaft 33 reciprocate freely in the X direction The pulse motor 35 that moves the base 32 to move.

該移動基台32具備被配設在該移動基台32上之圓筒狀之載置台本體36，和被配設在該載置台本體36之上面的吸附挾盤37。吸附挾盤37係藉由多孔陶瓷所形成，且被連接於無圖示之吸引手段，在該吸附挾盤37 之表面產生適當負壓。因此，構成被載置在吸附挾盤37上之本發明之板狀構件的半導體晶圓10，藉由使無圖示之吸引手段作動，被吸引保持在吸附挾盤37上。 The moving base 32 includes a cylindrical mounting base body 36 arranged on the moving base 32 and a suction nip plate 37 arranged on the upper surface of the mounting base body 36. The suction nip 37 is formed by porous ceramics and is connected to a suction means (not shown). The suction nip 37 Appropriate negative pressure is generated on the surface. Therefore, the semiconductor wafer 10 constituting the plate-shaped member of the present invention placed on the suction nip 37 is sucked and held on the suction nip 37 by actuating a suction means (not shown).

如圖1、圖2(a)~(c)所示般，薄片保持手段4被配設在靜止基台2，具有被豎立設置在該靜止基台2之第1汽缸41，和藉由該第1汽缸41延伸之軸42被支撐的保持基座43。在該保持基座43配設有：被豎立設置在上面之第2汽缸44；從該第2汽缸44貫通至保持基座43之下面側，且被支撐於第2汽缸44之進退自如的軸45之薄片保持板46；被配設在該保持基座43上，在端部具備挾持片48a，且具備在水平方向進退自如的軸之第3汽缸47；及在上述保持基座43之下面側，被配置在與該挾持片48a對向之位置，與挾持片48a同時構成挾持手段48之挾持片48b。 As shown in Figs. 1 and 2(a)~(c), the sheet holding means 4 is arranged on the stationary base 2 and has a first cylinder 41 erected on the stationary base 2, and by the The holding base 43 is supported by the shaft 42 on which the first cylinder 41 extends. The holding base 43 is provided with a second cylinder 44 erected on the upper surface; a shaft that penetrates from the second cylinder 44 to the lower surface of the holding base 43 and is supported by the second cylinder 44 to move forward and backward. 45 of the sheet holding plate 46; is arranged on the holding base 43, has a pinching piece 48a at the end, and has a third cylinder 47 that can move forward and backward in the horizontal direction; and below the holding base 43 The side is arranged at a position opposite to the pinching piece 48a, and forms the pinching piece 48b of the pinching means 48 at the same time as the pinching piece 48a.

上述薄片保持板46內部被構成中空，在下面全面設置多數無圖示之微孔，被構成經由連結第2汽缸44和薄片保持板46之軸內部而能夠吸引薄片保持板46內部，經由上述微孔能夠在薄片保持板下面產生負壓。 The inside of the sheet holding plate 46 is hollow, and a large number of micro holes (not shown) are provided on the entire bottom surface. The inside of the sheet holding plate 46 is sucked through the shaft connecting the second cylinder 44 and the sheet holding plate 46. The holes can generate negative pressure under the sheet holding plate.

上述保持基座43被構成與藉由上述第1汽缸41被驅動成能夠進退之軸42同時能夠上下移動，而且，如圖2(b)中之箭號所示般，能夠以該軸42為中心朝水平方向旋轉。另外，從該保持基座43位於導軌31、31之圖2(a)之位置，朝向圖2(b)所示之位置，順時鐘方向旋轉，依此可以使上述薄片保持板46在被設置在靜止 基台2之附近的廢棄容器7之正上方移動。 The holding base 43 is configured to be able to move up and down at the same time as the shaft 42 that is driven to advance and retreat by the first cylinder 41, and, as shown by the arrow in Figure 2(b), the shaft 42 can be used as The center rotates in the horizontal direction. In addition, the holding base 43 is located at the position shown in Fig. 2(a) of the guide rails 31 and 31, toward the position shown in Fig. 2(b), and rotated clockwise, thereby enabling the sheet holding plate 46 to be installed At rest The waste container 7 in the vicinity of the base 2 moves directly above.

上述折彎輥移動手段5係如圖3所示般，藉由呈門型形狀之支撐框51而構成，該支撐框51具備沿著支撐基台2上之導軌31、31而隔著間隔排列設置之柱部52、52，和連結該柱部52、52之上端的支撐部53，和沿著該支撐部53之導引孔54而藉由被內藏在該支撐部53內之無圖示之驅動機構使被移動的折彎輥55。該折彎輥55能夠朝長邊方向之軸中心旋轉，至少被黏貼於半導體晶圓10，較構成本發明之薄片之保護膠帶11之直徑長，再者，以不附著於剝離後之保護膠帶之黏接面之方式，在其表面塗佈氟樹脂。 As shown in FIG. 3, the bending roller moving means 5 is constituted by a support frame 51 having a gate shape. The support frame 51 is provided with guide rails 31 and 31 along the support base 2 and arranged at intervals. The pillar portions 52, 52 are provided, the support portion 53 connecting the upper ends of the pillar portions 52, 52, and the guide hole 54 along the support portion 53 are not shown by being embedded in the support portion 53 The driving mechanism shown causes the bending roller 55 to be moved. The bending roller 55 can rotate toward the center of the axis in the longitudinal direction, and is adhered to the semiconductor wafer 10 at least, which is longer than the diameter of the protective tape 11 constituting the sheet of the present invention. Furthermore, it does not adhere to the peeled protective tape The bonding surface is coated with fluorine resin on the surface.

上述剝離起點部生成手段6係如圖4所示般，係由第4汽缸61，和從該第4汽缸61延伸以進退自如之方式能夠微調在高度方向中之位置的軸62，和臂構件63，和被設置在該臂構件63之前端部，且具備前端針狀構件65和氣體噴嘴66之前端構件64所構成。藉由該構成，前端構件64被構成能夠上下移動，藉由其高度位置被調整，被構成針狀構件之前端部能夠位於該板狀構件上之保護膠帶之高度。再者，氣體噴嘴66經由第4氣缸61、軸62而供給氣體，因應所需被構成能夠噴出氣體。 The above-mentioned peeling starting point generating means 6 is as shown in FIG. 4, consisting of a fourth cylinder 61, a shaft 62 extending from the fourth cylinder 61 so as to advance and retreat in a manner that can finely adjust the position in the height direction, and an arm member 63, and is provided at the front end of the arm member 63, and includes a front end needle member 65 and a gas nozzle 66 front end member 64. With this configuration, the front end member 64 is configured to be movable up and down, and its height position is adjusted, so that the front end of the needle-shaped member can be configured to be at the height of the protective tape on the plate-shaped member. Furthermore, the gas nozzle 66 supplies gas via the fourth cylinder 61 and the shaft 62, and is configured to eject gas as required.

廢棄容器7係如圖1所記載般，被配置在靜止基台2之薄片保持手段4之附近，形成上方釋放之圓筒狀，被形成較藉由被切割成略圓形狀而使用的保護膠帶11大一圈，構成能夠在容器內疊層藉由本發明之剝離裝 置被剝離之該保護膠帶11。 The waste container 7 is arranged in the vicinity of the sheet holding means 4 of the stationary base 2 as shown in Fig. 1, and is formed into a cylindrical shape that is released upward, and is formed as a protective tape that is used by being cut into a slightly rounded shape. 11 large circles, which can be laminated in the container by the peeling device of the present invention Set the protective tape 11 that has been peeled off.

圖示之實施型態中之剝離裝置1被構成上述般，針對其作用，一面參照圖5至17一面予以說明。另外，圖5至15係圖1之剝離裝置1重要部位側面圖，為了容易說明動作，適當省略與靜止基台2、支撐框51、第1汽缸41、第4汽缸61、馬達35等在作動說明上無直接關係的構成。 The peeling device 1 in the illustrated embodiment is configured as described above, and its function will be described with reference to FIGS. 5 to 17. In addition, FIGS. 5 to 15 are side views of important parts of the peeling device 1 in FIG. 1. In order to facilitate the description of the operation, the operation of the stationary base 2, the support frame 51, the first cylinder 41, the fourth cylinder 61, and the motor 35 are appropriately omitted. The composition is not directly related to the description.

在該剝離裝置1中，每次開始進行剝離被黏貼於半導體晶圓10之保護膠帶11之剝離工程，首先，如圖5所示般，在保持載置台機構3之導軌31、31上使移動基台32在待機位置(圖中右側)待機，同時薄片保持板46藉由第2汽缸44被拉引至最上位位置。再者，折彎輥55較氣體噴嘴66更位於移動基台32之待機位置側。 In this peeling apparatus 1, each time the peeling process of peeling the protective tape 11 pasted on the semiconductor wafer 10 is started, first, as shown in FIG. 5, the guide rails 31, 31 of the holding table mechanism 3 are moved The base 32 stands by at the standby position (right side in the figure), and the sheet holding plate 46 is pulled to the uppermost position by the second cylinder 44 at the same time. Furthermore, the bending roller 55 is located on the side of the standby position of the moving base 32 rather than the gas nozzle 66.

如圖5、6所示般，首先，將保護膠帶11被黏貼在表面之半導體晶圓10載置在移動基台32之載置台本體36之吸附挾盤37上。此時，藉由吸附挾盤37背側之空間和無圖示之吸引手段被連結，使在以多孔陶瓷形成能夠在表背間通氣之吸附挾盤37上產生負壓，半導體晶圓10被吸引固定於吸附挾盤37上。 As shown in FIGS. 5 and 6, first, the semiconductor wafer 10 with the protective tape 11 adhered to the surface is placed on the suction nip 37 of the mounting table body 36 of the moving base 32. At this time, the space on the back side of the suction nip 37 and the suction means (not shown) are connected, so that a negative pressure is generated on the suction nip 37 formed of porous ceramic that can ventilate between the front and back, and the semiconductor wafer 10 is The suction is fixed on the suction nip 37.

於將半導體晶圓10固定在吸附挾盤37上之後，驅動脈衝馬達35，且使滾珠螺桿軸33旋轉，使該移動基台32從圖6之待機位置沿著導軌31而移動至薄片保持手段4及剝離起點部生成手段6之下方。此時，被黏貼在半導體晶圓10之保護膠帶11之外周端部之略外側部分 以成為剝離起點部生成手段6中之前端針狀構件65之前端之正下方之方式，被定位(參照圖7)。 After the semiconductor wafer 10 is fixed on the suction nip 37, the pulse motor 35 is driven, and the ball screw shaft 33 is rotated, so that the moving base 32 is moved from the standby position in FIG. 6 along the guide rail 31 to the sheet holding means 4 and below the peeling starting point generating means 6. At this time, the outer part of the protective tape 11 that is pasted on the semiconductor wafer 10 is slightly outside of the outer peripheral end It is positioned so as to be directly below the front end of the front end needle-shaped member 65 in the peeling starting point generating means 6 (refer to FIG. 7).

(第1剝離工程) (The first stripping process)

半導體晶圓10之外周端部之略外側部分被定位在剝離起點部生成手段6之前端針狀構件65之正下方之後，使第4汽缸61作動，且使前端針狀構件65之前端部下降至接近半導體晶圓10之保護膠帶11之外周端部的位置(參照圖8)。 After the slightly outer portion of the outer peripheral end of the semiconductor wafer 10 is positioned directly below the front end needle member 65 of the peeling start point generating means 6, the fourth cylinder 61 is actuated, and the front end of the front end needle member 65 is lowered To a position close to the outer peripheral end of the protective tape 11 of the semiconductor wafer 10 (refer to FIG. 8).

以前端針狀構件65之前端接近於半導體晶圓10之保護膠帶11之外周部分之方式，配合該保護膠帶11之表面高度而微調整該前端針狀構件65之前端部之高度，在該前端部接近之狀態下，使該移動基台稍微移動至圖中右方，依此該前端針狀構件65之前端抵接於該保護膠帶11之外周部位(參照圖9)。另外，如圖9所示般，即使設為從保護膠帶11之周方向外側抵接該前端部亦可，也可設為從該保護膠帶11之外周部分之上方抵接該前端部。 The front end of the needle-shaped member 65 is close to the outer peripheral portion of the protective tape 11 of the semiconductor wafer 10, and the height of the front end of the needle-shaped member 65 is finely adjusted according to the surface height of the protective tape 11. When the parts are close, the moving base is slightly moved to the right in the figure, and the front end of the needle-shaped member 65 abuts against the outer periphery of the protective tape 11 (see FIG. 9). In addition, as shown in FIG. 9, even if the front end portion is contacted from the outer side of the protective tape 11 in the circumferential direction, the front end portion may be contacted from above the outer peripheral portion of the protective tape 11.

而且，該前端部抵接於該保護膠帶11之外周部分之後，使該第4汽缸61作動，僅使該前端針狀構件65上升，同時使該移動基台進一步移動至右方，依此該保護膠帶11之外周部分之一部分良好地被剝離。 Furthermore, after the front end portion abuts the outer peripheral portion of the protective tape 11, the fourth cylinder 61 is actuated to raise only the front end needle-shaped member 65, and at the same time, the movable base is further moved to the right. A part of the outer peripheral portion of the protective tape 11 is peeled off well.

(剝離起點部生成工程) (Generation project of peeling start point)

該保護膠帶11之該一部分被剝離之後，如圖10所示般，該前端構件64被上升，同時從氣體噴嘴66噴射高壓氣體，該保護膠帶11之外周部分從該前端針狀構件65之前端部分離，且包含在該保護膠帶11之外周部分先剝離之該一部分之剝離區域擴大，生成適合在後述之挾持手段48挾持的剝離起點部12。另外，剝離起點部生成工程中之該保持基座43之高度，被調整成當該剝離起點部12藉由來自氣體噴嘴66之高壓氣體被剝離時，該剝離起點部12被收在設置於該保持基座43之挾持手段48之挾持片48a、48b間。另外，即使藉由上述氣體噴嘴66噴射高壓氣體而放大剝離區域之時，進一步抵接藉由上述第1剝離工程使用之前端針狀構件65亦可。如此一來，適合生成剝離起點部。 After the part of the protective tape 11 is peeled off, as shown in FIG. 10, the front end member 64 is raised, and at the same time high-pressure gas is sprayed from the gas nozzle 66, and the outer peripheral portion of the protective tape 11 starts from the front end of the front end needle member 65. The part is separated, and the peeling area including the part that is peeled off first in the outer peripheral part of the protective tape 11 is enlarged, and a peeling starting point 12 suitable for being held by the holding means 48 described later is generated. In addition, the height of the holding base 43 in the peeling starting point generating process is adjusted so that when the peeling starting point 12 is peeled by the high-pressure gas from the gas nozzle 66, the peeling starting point 12 is stored in the A space between the pinching pieces 48a and 48b of the pinching means 48 of the base 43 is maintained. In addition, even when the peeling area is enlarged by spraying high-pressure gas from the gas nozzle 66, the needle-shaped member 65 at the front end may be used by the first peeling process. In this way, it is suitable for generating a peeling starting point.

(最終剝離工程) (Final stripping project)

當上述保護膠帶11之外周端部藉由來自氣體噴嘴66之高壓氣體而被抬起時，暫時停止朝該移動基台32之待機位置方向移動，且藉由第3汽缸47之作動，使挾持片48a移動至挾持片48b側，藉由挾持手段48挾持剝離的保護膠帶11之外周端部(參照圖11)。而且，藉由使第1汽缸41作動，以能夠使折彎輥55進入至挾持手段48之下方之程度之方式，使薄片保持手段4全體移動至上方。 When the outer peripheral end of the protective tape 11 is lifted by the high-pressure gas from the gas nozzle 66, the movement to the standby position of the movable base 32 is temporarily stopped, and the third cylinder 47 is actuated to pinch The piece 48a moves to the pinching piece 48b side, and the outer peripheral end of the peeled protective tape 11 is pinched by the pinching means 48 (refer to FIG. 11). Furthermore, by activating the first cylinder 41, the entire sheet holding means 4 is moved upward so that the bending roller 55 can enter below the pinching means 48.

使上述薄片保持手段4移動至上方，一面使 移動基台32移動至待機方向，一面沿著上述門型之支撐框51之支撐部53之導引孔54而使折彎輥55移動至薄片保持手段4側(參照圖12)。另外，由於折彎輥55一面相對於保護膠帶11之半導體晶圓10抵接於黏接面側，一面進行剝離，故能夠在長邊方向之軸中心旋轉，且以接觸之保護膠帶11之黏接面不附著之方式，在其表面塗佈氟樹脂。 Move the above-mentioned sheet holding means 4 to the upper side, The moving base 32 moves to the standby direction, and moves the bending roller 55 to the sheet holding means 4 side along the guide hole 54 of the support part 53 of the above-mentioned door-shaped support frame 51 (refer to FIG. 12). In addition, since the bending roller 55 abuts on the side of the bonding surface with respect to the semiconductor wafer 10 of the protective tape 11, and peels off on the same side, it can be rotated in the axial center of the longitudinal direction, and the contacting protective tape 11 is adhered. Coating fluororesin on the surface without adhesion.

在本實施型態中，半導體晶圓10上之保護膠帶11雖然朝剝離之方向(圖中左方)折彎180度(參照圖13)，但是該折彎角度不一定要180度。但是，半導體晶圓10之背面被研削而形成極薄之板狀，當該折彎角度小時，保護膠帶11之剝離時，會引起半導體晶圓10之破裂、破損等之虞，以盡量以180度，或接近此之角度被折彎為佳。 In this embodiment, although the protective tape 11 on the semiconductor wafer 10 is bent 180 degrees in the peeling direction (left in the figure) (refer to FIG. 13), the bending angle does not have to be 180 degrees. However, the back surface of the semiconductor wafer 10 is ground to form an extremely thin plate shape. When the bending angle is small, when the protective tape 11 is peeled off, the semiconductor wafer 10 may be cracked or damaged. It is better to bend the angle at or close to this.

當折彎輥55移動至薄片保持板46下面之圖中左方側另一端部時，保護膠帶11從半導體晶圓10完全被剝離(參照圖14)。如此一來，完成最終剝離工程。 When the bending roller 55 moves to the other end on the left side in the figure below the sheet holding plate 46, the protective tape 11 is completely peeled from the semiconductor wafer 10 (see FIG. 14). In this way, the final stripping project is completed.

如圖15所示般，當剝離之保護膠帶11被展開於薄片保持板46之下面時，藉由無圖示之吸引手段，吸引被形成中空且在下面設置有微孔之薄片保持板46之內部，吸引保持被剝離之保護膠帶11。而且，移動基台32和折彎輥55於剝離工程開始時被移動至定位的待機位置，同時藉由第3汽缸47之作動，使挾持片48a從一方之挾持片48b離開，釋放保護膠帶11之外周端部。 As shown in FIG. 15, when the peeled protective tape 11 is unfolded under the sheet holding plate 46, the sheet holding plate 46 which is hollow and is provided with micropores is attracted by a suction means (not shown). Inside, the peeled protective tape 11 is sucked and held. In addition, the moving base 32 and the bending roller 55 are moved to the standby position at the beginning of the peeling process, and the third cylinder 47 is actuated to separate the pinching piece 48a from one of the pinching pieces 48b, and the protective tape 11 is released. The outer peripheral end.

接著，藉由圖2、16、17，接著上述剝離工程，針對將剝離之保護膠帶11廢棄至廢棄容器7之廢棄工程進行說明。 Next, with reference to FIGS. 2, 16, and 17, following the above-mentioned peeling process, the discarding process of discarding the peeled protective tape 11 to the discarding container 7 will be described.

如上述般，從半導體晶圓10被剝離之保護膠帶11在薄片保持板46被定位在靜止基台2之導軌31、31之上方之狀態下被吸引保持。 As described above, the protective tape 11 peeled from the semiconductor wafer 10 is attracted and held in a state where the sheet holding plate 46 is positioned above the guide rails 31 and 31 of the stationary base 2.

從其狀態將保護膠帶11吸引保持在薄片保持板46之原樣下，使第1汽缸41之軸42繞俯視順時鐘轉，在被配設在靜止基台2之附近的廢棄容器7之正上方定位該薄片保持板46(參照圖2(b)、圖16)。另外，圖16、17係從配設有靜止基台2之廢棄容器之側觀看的側面圖，為了方便說明，僅表示薄片保持手段4和廢棄容器7，廢棄容器7以剖面圖呈現。 From its state, the protective tape 11 is sucked and held under the sheet holding plate 46, and the shaft 42 of the first cylinder 41 is rotated clockwise in a plan view, directly above the waste container 7 arranged near the stationary base 2 The sheet holding plate 46 is positioned (see Fig. 2(b) and Fig. 16). 16 and 17 are side views viewed from the side of the waste container where the stationary base 2 is provided. For the convenience of description, only the sheet holding means 4 and the waste container 7 are shown, and the waste container 7 is presented in a cross-sectional view.

將薄片保持板46定位在廢棄容器7之正上方之後，使第2汽缸44作動而使薄片保持板46下降至廢棄容器7內(參照圖17)。該下降之時的下端位置即使使用設置在廢棄容器7內之無圖示之位準感測器，而因應廢棄之保護膠帶11之疊層位準而適當變化亦可，即使計數廢棄之片數而因應計數之片數變化亦可。 After positioning the sheet holding plate 46 directly above the waste container 7, the second cylinder 44 is actuated to lower the sheet holding plate 46 into the waste container 7 (see FIG. 17). Even if the lower end position at the time of descent uses a level sensor (not shown) installed in the waste container 7, it can be appropriately changed according to the lamination level of the discarded protective tape 11, even if the number of discarded pieces is counted. It can also change according to the number of counted pieces.

於使薄片保持板46下降至廢棄容器內之後，在最下端停止從薄片保持板46之下面之微孔的吸引，使保護膠帶11落下。此時，藉由使空氣從薄片保持板46之下面之微孔噴出，可以更確實地實行保護膠帶11之脫離。而且，藉由廢棄容器7之位準感測器，檢測出被疊層 至廢棄容器之剝離後之保護膠帶11在廢棄容器積存特定量之情況下，或是被切割之片數到達特定量之情況下，實行應促使積存於廢棄容器7之保護膠帶11之廢棄，告知該剝離裝置之操作員之警報聲音之產生、警報燈之點燈等。 After the sheet holding plate 46 is lowered into the waste container, the suction from the micro holes under the sheet holding plate 46 is stopped at the lowermost end, and the protective tape 11 is dropped. At this time, by ejecting air from the micro-holes under the sheet holding plate 46, the protective tape 11 can be detached more reliably. Moreover, the level sensor of the waste container 7 detects the laminated When the protective tape 11 after peeling off the waste container is stored in a certain amount or the number of cut pieces reaches a certain amount, the protective tape 11 stored in the waste container 7 should be discarded and notified The generation of the alarm sound of the operator of the stripping device, the lighting of the alarm lamp, etc.

根據本發明之剝離裝置被構成上述般，由於保護膠帶之剝離能夠在所需的各種領域廣泛被利用，容易處理，且不使用剝離用之膠帶等之消耗品，故可以以不會成為複雜化之方式來構成該剝離裝置，再者，由於可以效率佳地將剝離之保護膠帶疊層廢棄在廢棄容器，故可以充分地運用廢棄容器之容量。 The peeling device according to the present invention is constructed as described above. Since the peeling of the protective tape can be widely used in various fields required, it is easy to handle, and does not use consumables such as tape for peeling, so it can not become complicated The peeling device is constructed in this way. Furthermore, since the peeled protective tape stack can be efficiently discarded in the waste container, the capacity of the waste container can be fully utilized.

另外，在上述本發明之實施型態中，雖然將板狀構件設為半導體晶圓，但是並不限定於此，例如若採用藍寶石基板當作板狀構件，對該藍寶石基板貼附保護膠帶之情況等，使用在表面貼附薄片狀之構件之板狀構件，且使薄片狀之構件剝離時，則可以適用本案發明。 In addition, in the foregoing embodiment of the present invention, although the plate-shaped member is used as a semiconductor wafer, it is not limited to this. For example, if a sapphire substrate is used as the plate-shaped member, a protective tape is attached to the sapphire substrate. In the case of using a plate-shaped member in which a sheet-shaped member is attached to the surface, and the sheet-shaped member is peeled off, the present invention can be applied.

1:剝離裝置 1: Stripping device

2:靜止基台 2: Stationary abutment

3:保持載置台機構(保持載置台) 3: Hold the mounting table mechanism (holding the mounting table)

4:薄片保持手段 4: Flake retention means

5:折彎輥移動手段 5: Moving means of bending roll

6:剝離起點部生成手段 6: Means for generating peeling starting point

7:廢棄容器 7: Abandoned container

10:半導體晶圓(板狀構件) 10: Semiconductor wafer (plate-shaped member)

11:保護膠帶(薄片) 11: Protective tape (sheet)

31:導軌 31: Rail

32:移動基台 32: Mobile abutment

33:滾珠螺桿軸 33: Ball screw shaft

34:軸承 34: Bearing

35:脈衝馬達 35: Pulse motor

36:載置台本體 36: The main body of the stage

37:吸附挾盤 37: Adsorption holding plate

41:第1汽缸 41: 1st cylinder

44:第2汽缸 44: 2nd cylinder

47:第3汽缸 47: 3rd cylinder

55:折彎輥 55: bending roll

61:第4汽缸 61: 4th cylinder

62:軸 62: axis

63:臂構件 63: Arm member

64:前端構件 64: front-end components

65:前端針狀構件 65: Needle-shaped front end

66:氣體噴嘴 66: gas nozzle

Claims (3)

一種剝離裝置，其係從板狀構件剝離被貼附在板狀構件之薄片，該剝離裝置之特徵在於，具有：保持載置台，其係具有保持貼附該薄片之板狀構件的保持面；剝離起點部生成手段，其係使針狀構件之前端部抵接於被保持在該保持載置台之該板狀構件之該薄片之外周之至少一部分，使該一部分從該板狀構件剝離，對該一部分剝離之該薄片和該板狀構件之間噴吹氣體，生成藉由包含該一部分之擴大的剝離區域所形成之剝離起點部；挾持手段，其係挾持該剝離的剝離起點部；間隔手段，其係使挾持該剝離起點部之該挾持手段對該保持載置台朝上方間隔開；折彎輥，其係在朝上方間隔開之該挾持手段之下方，作用於從該板狀構件剝離之該薄片之黏接面側，邊使該薄片從該板狀構件剝離，邊朝剝離方向折彎；及移動手段，其係以該薄片從該板狀構件被剝離之方式，使該折彎輥和該保持載置台之至少一方朝與該板狀構件並列之剝離方向做相對性移動，藉由該移動手段之移動使該薄片從該板狀構件完全剝離。 A peeling device, which peels a sheet attached to a plate-shaped member from a plate-shaped member, the peeling device is characterized by having: a holding table having a holding surface for holding the plate-shaped member attached to the sheet; A means for generating a peeling starting point is to make the front end of the needle-shaped member abut at least a part of the outer periphery of the sheet of the plate-shaped member held on the holding table, and peel the part from the plate-shaped member, A gas is sprayed between the partly peeled sheet and the plate-shaped member to generate a peeling starting point formed by an enlarged peeling area including the part; a pinching means that pinches the peeling starting point of the peeling; a spacing means , Which makes the holding means holding the peeling starting point spaced upward from the holding table; the bending roller, which is located below the holding means spaced upward, acts on the peeling from the plate-shaped member The adhesive surface side of the sheet is bent in the peeling direction while peeling the sheet from the plate-shaped member; and the moving means is such that the sheet is peeled from the plate-shaped member to make the bending roller At least one of the holding and placing table moves relative to the peeling direction parallel to the plate-shaped member, and the sheet is completely peeled off from the plate-shaped member by the movement of the moving means. 如請求項1之剝離裝置，其中具備吸引保持從該板狀構件被剝離之該薄片的薄片保持手段。 The peeling device according to claim 1, which is provided with a sheet holding means for sucking and holding the sheet peeled from the plate-shaped member. 如請求項2之剝離裝置，其中具備收容剝離後之該薄片的廢棄容器，該薄片保持手段係於吸引保持該薄片之後，在該廢棄容器的正上方移動，解除在該廢棄容器的正上方吸引保持之該薄片之吸引，且將該薄片收容在該廢棄容器內。 For example, the peeling device of claim 2, which is provided with a waste container for accommodating the peeled sheet, and the sheet holding means moves directly above the waste container after sucking and holding the sheet to release the suction right above the waste container The holding of the sheet is attracted, and the sheet is contained in the waste container.
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