JP2010206088A - Tape peeling device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a tape peeling device which can peel off a protective tape certainly and excellently without causing damage to a semiconductor wafer even if there is a variation in the thickness of the semiconductor wafer. <P>SOLUTION: The tape peeling device includes a table 54 for mounting the semiconductor wafer 12 having the protective tape 14 stuck to the surface thereof, and a lift member 22 which is provided to move vertically. The tape peeling device also includes a puncture projection 36 for peeling which is inserted into the end face of the protective tape 14, a peeling portion 24 which is formed at the lift member 22 and holds the puncture projection 36 for peeling, and a holding portion 40 which holds the protective tape 14 peeled by the puncture projection 36 for peeling. The tape peeling device is further provided with a stopper shaft 42 which is fixed in such a manner that the position can be adjusted in the vertical direction for a movable table 18 and limits the lowering position of the lift member 22, and a movement controller which controls each movement operation of the lift member 22 and the movable table 18. The relative position of the stopper shaft 42 is fixed to a position where the puncture projection 36 for peeling does not abut on the semiconductor wafer 12 before the puncture projection 36 for peeling is inserted into the end face of the protective tape 14. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a tape peeling apparatus for peeling off and removing a protective tape attached to a semiconductor wafer.

  In the manufacture of semiconductor devices such as ICs, wafers with large bumps and the like formed on the wafer surface as the density of semiconductors has increased in recent years, and wafers with large bumps on the surface such as MEMS (microelectromechanical system) Has increased. On the other hand, with the progress of miniaturization and thinning of semiconductor packages, there is a demand for thinning of semiconductor wafers themselves.

  Therefore, in the manufacturing process of the semiconductor product, after passing through a polishing (back grinding) process for polishing and thinning the back surface of the semiconductor wafer having a large number of circuit patterns and elements formed on the surface as described above, The semiconductor chips are divided into individual semiconductor chips through a dicing process. Here, when polishing or etching the back surface of the semiconductor wafer, an adhesive protective tape is applied to the surface of the semiconductor wafer to protect the surface of the semiconductor wafer, and the protective tape is peeled off from the semiconductor wafer after polishing. The

  Conventionally, as a tape peeling device for peeling a thin plate such as a protective tape affixed to a semiconductor wafer, as disclosed in Patent Document 1, an upper movable plate, a lower insertion plate, There was a peeling device provided with a shaft for supporting the. In this peeling apparatus, the lower insertion plate is inserted between the semiconductor wafer and the thin plate, the upper movable plate is lowered, the end of the thin plate is gripped by the lower insertion plate and the upper movable plate, and then the end is removed. While pulling up, it moves in the direction of folding the thin plate and peels off.

JP 2008-171934 A

  However, the peeling apparatus disclosed in Patent Document 1 cannot satisfactorily peel the thin plate when the variation in the thickness of the semiconductor wafer is large. For example, if the semiconductor wafer varies thinly, the lower insertion plate cannot be inserted between the thin plate and the semiconductor wafer, and the thin plate cannot be lifted up.On the other hand, if the semiconductor wafer varies thickly, the lower insertion plate becomes a semiconductor wafer. In some cases, the expensive semiconductor wafer may be damaged. In addition, since the tip of the lower insertion plate is relatively easily deformed, the height position of the tip may change as the thin plate is repeatedly peeled. Then, similarly to the case where the thickness of the semiconductor wafer varies, there has been a problem that the thin plate cannot be peeled off satisfactorily.

  The present invention has been made in view of the above-described background art, and is capable of reliably and satisfactorily peeling the protective tape without damaging the semiconductor wafer even when the thickness of the semiconductor wafer varies. An object is to provide a peeling apparatus.

  The present invention includes a table on which a semiconductor wafer having a protective tape affixed to a surface is placed, a movable table provided to be movable in a horizontal direction with respect to the table, and movable up and down with respect to the movable table. The lifting member provided, the peeling puncture protrusion inserted into the end face of the protective tape, the peeling portion provided on the lifting member and holding the peeling puncture protrusion, and the protection peeled off by the peeling puncture protrusion A holding part for holding the tape, and the edge part peeled off by the puncturing protrusion for peeling is rolled up, the edge part of the raised protective tape is sandwiched and held by the holding part, and held A tape peeling apparatus for moving the portion to peel the protective tape from the semiconductor wafer, the position being adjusted so as to be vertically adjustable with respect to the movable base, and a lowered position of the elevating member A stopper member that restricts the peeling puncture protrusion to a position higher than the surface position of the semiconductor wafer, and a movement control device that controls each moving operation of the elevating member and the movable base, the stopper member comprising: The relative position with respect to the movable base is fixed before the peeling puncture protrusion is inserted into the end face of the protective tape, and when the elevating member moves downward, the elevating member stops moving downward at a predetermined locking position. It is a tape peeling device provided as possible.

  The stopper member includes a shaft portion that is inserted into the through hole of the elevating member and an abutting portion that is formed at one end of the shaft portion and can be locked to the lower peripheral edge portion of the through hole. When the elevating member moves downward, the part locks the elevating member below the through hole, and stops the elevating member from moving downward.

  Furthermore, a position sensor for detecting a relative positional relationship between the elevating member and the predetermined position of the stopper member is provided, and the position sensor is slightly lower than the position where the elevating member and the stopper are in contact with each other. The elevating member is detected and output at a high position, and the movement control device stops the movement of the elevating member.

  Further, the movement control device compares a predetermined reference value indicating an allowable limit position of the lowering movement of the elevating member with an output of the position sensor, and if the output of the position sensor deviates from the reference value, the elevating / lowering device Stop control means for performing control to stop the movement operation of the member and the movable table, and the allowable limit position is locked by the lowering member moving downward and a part of the lifting member contacting the stopper member It is set to a position higher than the position to be set.

  Further, the position where the stopper member is fixed with respect to the movable base is such that the tip of the peeling puncture protrusion that has moved down together with the elevating member reaches the surface of the semiconductor wafer placed on the table. This is the position where the descending movement of the elevating member is stopped.

  The position sensor is also output when the elevating member moves away from the stopper and the puncture protrusion rises to a height at which the bump of the semiconductor wafer can be avoided, and the movement control device is controlled by the movable table. The semiconductor wafer may be permitted to operate above the bumps.

  The movement control device includes a measurement block that measures a tip position of the puncture protrusion for peeling, and a measurement unit that detects a vertical distance from a predetermined position to the position of the measurement block and the surface of the protective tape. The fixing position of the stopper member and the allowable limit position for the downward movement of the elevating member are calculated based on the measurement result using the measurement block and the detection result of the measuring means.

  Further, the present invention provides a table on which a semiconductor wafer having a protective tape affixed is mounted, a movable table provided to be movable in a horizontal direction with respect to the table, and movable up and down with respect to the movable table. An elevating member provided on the peeling tape, a peeling puncture protrusion inserted into an end face of the protective tape, a peeling portion provided on the elevating member and holding the peeling puncture protrusion, and the peeling puncture protrusion being peeled off by the peeling puncture protrusion A holding part for holding the protective tape, and the edge part peeled off by the puncture protrusion for peeling is lifted up, the edge part of the raised protective tape is held between the holding parts and held. A tape peeling device that moves the portion that has been moved to peel the protective tape from the semiconductor wafer, the movement control device controlling each moving operation of the elevating member and the movable table, and the holding device. A tape detection sensor for detecting the position of the tape surface, wherein the movement control device has a predetermined difference between the position of the protective tape surface detected by the tape detection sensor and a preset protective tape surface position. The tape peeling device includes stop control means for performing control to stop the moving operation of the elevating member and the movable base when the threshold value is exceeded.

  The movement control device has setting means for presetting thickness information of the semiconductor wafer to be used and the protective tape.

  Further, in addition to the stop control means, the movement control device performs a movement operation of the elevating member when the elevating member moves to a position slightly lower than the height at which the peeling puncture protrusion is pierced into the protective tape. Control to stop is performed.

  The tape peeling device of the present invention has a structure that electrically and mechanically restricts the lowering of the elevating member to which the peeling puncture protrusion is attached by a stopper member. For example, the control circuit of the movement control device that operates each member However, even if the elevating member temporarily becomes uncontrollable due to a malfunction caused by external noise or the like, it is possible to reliably restrict the peeling puncture protrusion from falling below a predetermined position. If the position where the lowering of the peeling puncture protrusion is restricted is set to a position slightly higher than the surface of the semiconductor wafer, the peeling puncture protrusion can be prevented from coming into contact with the semiconductor wafer and being damaged. .

  Further, in addition to the above mechanical limiting means, by providing an electrical limiting means for preventing the peeling puncture protrusion from falling below a predetermined position by control by the stop control means of the movement control device, The malfunction of the elevating member can be surely limited.

  Furthermore, by finely adjusting the moving distance of each part for each semiconductor wafer to which a protective tape is attached, by means of a measurement block or measurement means, variations in the thickness of the semiconductor wafer, deformation of the tip of the puncture protrusion for peeling, etc. are corrected, The protective tape can be peeled off better.

It is a schematic diagram which shows the structure of one Embodiment of the protective tape peeling apparatus of this invention. It is a flowchart explaining the initial setting operation | movement before peeling of the protective tape of this embodiment. It is a schematic side view explaining the initial setting operation before protective tape peeling of this embodiment. It is a schematic side view explaining the initial setting operation before protective tape peeling of this embodiment. It is a schematic side view explaining the initial setting operation before protective tape peeling of this embodiment. It is a schematic side view explaining the initial setting operation before protective tape peeling of this embodiment. It is a flowchart explaining the protective tape peeling operation | movement of this embodiment. It is a schematic side view explaining the protective tape peeling operation | movement of this embodiment. It is a schematic side view explaining the protective tape peeling operation | movement of this embodiment. It is a schematic side view explaining the protective tape peeling operation | movement of this embodiment. It is a schematic side view explaining the protective tape peeling operation | movement of this embodiment. It is a schematic side view explaining the protective tape peeling operation | movement of this embodiment. It is a perspective view which shows the tape peeling apparatus of this embodiment. It is a perspective view which shows the peeling part of this embodiment. It is the front view (a), side view (b), and perspective view (c) which show the puncture protrusion for peeling of this embodiment. It is the front view (a), side view (b), and perspective view (c) which show the other puncture protrusion for peeling of this embodiment.

  Hereinafter, an embodiment of a tape peeling apparatus of the present invention will be described with reference to the drawings. The tape peeling apparatus 10 of this embodiment is used for peeling the protective tape 14 attached to the surface of the semiconductor wafer 12. As shown in FIG. 13, the configuration of the tape peeling device 10 includes a base 16 and a mounting portion 16 a provided in the horizontal direction above the base 16. A pair of left and right movable bases 18 provided on the base 16 and movable in the horizontal direction, a horizontal member 20 held at both ends by a pair of pillars 18a of the movable base 18, and a guide rail provided on the pillars 18a The elevating member 22 is provided so as to be movable up and down along the line 21. Further, the elevating member 22 is provided with a peeling portion 24 for peeling the protective tape 14.

  The movable table 18 is provided so as to be movable on a pair of guide rails (not shown) on the base 16 by a motor (not shown). Further, a sensor rail 26 for detecting the moving distance of the movable base 18 is provided on the side of the base 16. The elevating member 22 is provided so as to be able to be raised and lowered along the guide rail 21 provided on the column 18 a of the movable base 18, and a driving device including a motor 28 and a ball screw 30 that moves the elevating member 22 up and down is provided by the horizontal member 20. Is provided.

  As shown in FIG. 14, the peeling portion 24 is positioned between the insertion portion 34 that protrudes in a comb-like shape in the horizontal direction, and protrudes obliquely with respect to the protruding direction of the insertion portion 34. The plurality of peeling puncture protrusions 36 are arranged in the horizontal direction at equal intervals. The insertion portion 34 is attached to the main body of the peeling portion 24 so as to be movable in the protruding direction. In addition, although the puncture protrusion 36 for peeling is the shape shown in FIG. 15, slipperiness, such as an uneven part and a rough surface, may be formed in the upper surface. Further, as shown in FIG. 16, a guide 38 may be provided above the peeling puncture protrusion 36 to prevent the curled up protective tape 14 from warping.

  Further, as shown in FIG. 14, a clamping part 40 that is swingably held by the peeling part 24 is provided above the insertion part 34 and the peeling puncture protrusion 36 in the vertical direction. The pinching portion 40 is formed with a concave portion 40a formed by cutting out the portion where the peeling puncture protrusion 36 is located in an arc shape, and the protective tape 14 is pinched between the tip of the convex portion 40b and the insertion portion 34 between the concave portions 40a. can do.

  A more detailed configuration of the tape peeling apparatus 10 will be described with reference to FIG. The peeling portion 24 is attached to the lower end portion of the elevating member 22 and is provided so as to be movable up and down together with the elevating member 22 by a driving device including a motor 28 and a ball screw 30. A through hole 20a is formed in the movable member 18 side portion of the horizontal member 20, and a through hole 22a is also formed in the elevating member 22 at a position facing the through hole 20a in the vertical direction. A shaft portion 42a of a stopper shaft 42 that is a stopper member is vertically inserted into the through holes 20a and 22a, and a flange portion 42b that is a stopper portion is provided at a lower end portion of the stopper shaft 42 that protrudes downward from the through hole 22a. Is formed. A shaft clamp unit 44 that holds the shaft portion 42 a and moves it up and down with respect to the horizontal member 20 is attached to the lower surface side peripheral portion of the through hole 20 a of the horizontal member 20, and the stopper shaft 42 is attached to the horizontal member 20. It is fixed. Further, a cylindrical main body 46a through which the shaft portion 42a of the stopper shaft 42 is inserted, and a disc-shaped guide 46c provided above the main body 46a with a spring 46b interposed therebetween at the peripheral portion of the through hole 22a of the elevating member 22. A shaft support portion 46 is attached. The shaft support portion 46 supports the shaft portion 42 a of the stopper shaft 42 so as not to tilt, and does not hinder the vertical movement of the stopper shaft 42 and the lifting operation of the lifting member 22. However, since the flange portion 42b of the stopper shaft 42 is formed larger than the inner diameter of the main body 46a, if the flange portion 42b is locked to the lower surface 46d of the main body 46a, it cannot move any further. Further, when the elevating member 22 is raised and the guide 46c of the shaft support portion 46 is brought into contact with the shaft clamp unit 44, a downward biasing force is generated on the spring 46b to prevent the elevating operation of the elevating member 22 and avoid a collision. The

  A position sensor 48 is provided on the lower surface side of the flange portion 42 b of the stopper shaft 42. The position sensor 48 detects the relative positional relationship between the flange portion 42 b and the elevating member 22, and here detects the distance of the gap between the upper surface of the flange portion 42 b and the lower surface 46 d of the shaft support portion 46.

  The elevating member 22 is provided with a measuring means 50 for height detection provided with a contact probe 50a. A measurement block 52 serving as a reference for height detection is fixed to the base 16. The measuring means 50 can measure the height of the semiconductor wafer 12 and the height of the measurement block 52. The measurement block 52 is a member serving as a reference surface for calibration of control system coordinates of the tape peeling apparatus 10.

  A table 54 capable of holding the semiconductor wafer 12 that is the target of the tape peeling operation is fixed on the mounting portion 16a. The semiconductor wafer 12 has a protective tape 14 composed of a tape base material 14a and an adhesive portion 14b attached to the upper surface on which the bumps 12a are formed, and the table 54 air-sucks the lower surface opposite to the protective tape 14. Thus, the semiconductor wafer 12 can be held.

  Further, the tape peeling device 10 includes a movement control device configured by a microcomputer or the like (not shown). The movement control device sends a control command for controlling each moving operation of the elevating member 22, the stopper shaft 42, and the movable table 18 to the driving device for the elevating member 22, the shaft clamp unit 44 that is the driving device for the stopper shaft 42, and the like. Further, the movement control device includes a stop control unit that receives the output of the position sensor element 48 and outputs a control command to stop the moving operation of the elevating member 22 and the movable base 18 when the output of the position sensor 48 deviates from a predetermined reference value. I have. Further, the movement control device has setting means for inputting and setting the thickness information of the semiconductor wafer 12 and the protective tape 14 to be used in advance. Further, in addition to the stop control means, the movement control device, when the elevating member 22 moves so that the puncture protrusion 36 is located at a position slightly lower than the height at which the peeling puncture protrusion 36 is inserted into the protective tape 12, Control to stop the moving operation of the elevating member 22 is performed. The functions of the movement control device and the stop control means will be described in detail later in the explanation of the operation.

  Next, the initial setting operation performed before the tape peeling operation of the tape peeling apparatus 10 will be described based on the flowchart of FIG.

  (Step S11) Each member moves to its initial position. Here, the state shown in FIG. 3 is the origin position, and the holding part 40 is held in a state where the convex part 40b is separated above the peeling puncture protrusion 36, and the insertion part 34 has a tip at the peeling puncture protrusion. It is stored behind the tip of 36.

  3 will be described. Tw is the substrate thickness of the semiconductor wafer 12, Tp is the bump height, and Bo is the height from the upper surface of the measurement block 52 to the upper surface of the table 54. The distance in the vertical direction.

  (Step S12) The elevating member 22 is moved from the origin position together with the horizontal member 20, and as shown in FIG. 4, the contact probe 50a is brought into contact with the upper surface of the measurement block 52, and the distance Ao from the origin position to the measurement block 52 is set. Detect. The detection result is sent to a movement control device (not shown), and the movement control device calibrates the control system coordinates based on the detection result.

  (Step S13) The horizontal member 20 and the elevating member 22 move, and the contact probe 50a is brought into contact with the upper surface of the protective tape 14 affixed on the semiconductor wafer 12 as shown in FIG. The distance Eo is detected. Then, the detection result is sent to a movement control device (not shown).

  (Step S14) The elevating member 22 moves together with the horizontal member 20, and as shown in FIG. 6, the peeling puncture protrusion 36 is brought into contact with the upper surface of the measurement block 52, and the position of the tip of the peeling puncture protrusion 36 is measured from the origin. This is detected as a distance Do to the block 52. Then, the detection result is sent to a movement control device (not shown).

  (Step S15) The movement control device determines whether or not the distance Eo indicating the position of the upper surface of the protective tape 14 affixed on the semiconductor wafer 12 is within a predetermined standard range. When the distance Eo deviates from the standard range, the process proceeds to step S16. When the distance Eo is within the standard range, the process proceeds to step S17.

  (Step S16) When the distance Eo deviates from the standard range, the movement control device issues an alarm and stops the operation of the tape peeling device 10. Therefore, for example, if there is an abnormality such as the semiconductor wafer 12 not being fixed horizontally on the table 54, the distance Eo can be detected by showing a value shorter than the standard range, and the semiconductor wafer transfer mechanism If there is an abnormality such as the semiconductor wafer 12 not being supplied to the table 54 due to the transfer error, the distance Eo can be detected by indicating a value longer than the standard range.

  (Step S17) If the distance Eo is within the standard range, the movement control device determines that there is no abnormality in the state of the semiconductor wafer 12, and the horizontal member 20 and the lifting member 22 move to the initial positions described in Step 11. .

(Step S18) The shaft clamp unit 44 operates according to the control command of the movement control device, and adjusts the height positions of the stopper shaft 42 and the flange 42b. The position where the stopper shaft 42 is fixed is a position where the tip of the peeling puncture protrusion 36 that moves downward integrally with the elevating member 22 can be stopped at a position higher than the surface of the semiconductor wafer 12 by a distance α, and movement control is performed. It is calculated by a calculation process based on position information of each member included in the control system coordinates set in the apparatus. The distance ST1 from the origin position to the stop position at the tip of the peeling puncture protrusion 36 is expressed by Expression (1).

  The distance α is set as short as possible so that the tip of the peeling puncture protrusion 36 does not contact the surface of the semiconductor wafer 12 in consideration of the variation in the thickness of the semiconductor wafer 12 itself and the positioning error of the tape peeling apparatus 10. Therefore, it is preferable that the distance ST1 is set so as to be lower than the position of the tip of the peeling puncture protrusion 36 and the height of the bump 12a.

(Step S <b> 19) A first reference value is set as a criterion for the stop processing means to issue a control command for stopping the moving operation of the elevating member 22 and the movable base 18. Here, the first reference value is the output of the position sensor 48 when the gap between the upper surface of the flange 42b of the stopper shaft 42 and the lower surface 46d of the shaft support portion 46 becomes the distance β1. That is, the first reference value can determine that the tip of the peeling puncture protrusion 36 that moves downward integrally with the elevating member 22 is stopped at a distance (α + β1) higher than the surface of the semiconductor wafer 12. The distance ST2 from the origin position to the stop position at the tip of the peeling puncture protrusion 36 is expressed by Expression (2).

  The distance β1 is a distance for avoiding contact between the upper surface of the flange 42b and the lower surface 46 of the shaft support portion 46, and is set to a relatively short distance in consideration of a normal required time until the operation stop operation.

(Step S <b> 20) A second reference value is set as a determination reference for issuing a control command for the stop processing means to stop the moving operation of the elevating member 22 and the movable base 18. Here, the second reference value is the output of the position sensor 48 when the gap between the upper surface of the flange 42b of the stopper shaft 42 and the lower surface 46d of the shaft support portion 46 becomes the distance β2. That is, the second reference value determines that the tip of the peeling puncture protrusion 36 that moves down integrally with the elevating member 22 is stopped at a distance (α + β2) higher than the bump 12a on the surface of the semiconductor wafer 12. The distance ST2 from the origin position to the stop position of the tip of the peeling puncture protrusion 36 can be expressed by Expression (3).

The distance β2 is set as long as possible within a range that does not interfere with the peeling operation of the protective tape while taking into account the thickness variation of the semiconductor wafer 12 itself so that the tip of the peeling puncture protrusion 36 does not contact the surface of the semiconductor wafer 12. To do. Therefore, it is desirable that the distance β2 is longer than the distance β1. When the steps S10 to S20 described above are completed, the initial setting operation before the tape peeling operation is completed.

Next, the operation | movement which performs the tape peeling operation | work of the tape peeling apparatus 10 is demonstrated based on the flowchart of FIG. First, (step S21) As shown in FIG. 8, the tip of the peeling puncture protrusion 36 is moved to the outer peripheral end position of the semiconductor wafer 12. At this time, the distance D1 from the origin position of the tip of the peeling puncture protrusion 36 to the outer peripheral end position is determined by Expression (4) within the range of the condition of Expression (5).

The distance Eo is the distance from the origin position to the surface of the protective tape 12, and the distance γ is preferably about the thickness of the base material 14a of the protective tape 14 from the viewpoint of ensuring workability of the protective tape peeling. Thereby, the influence of the variation in the thickness of the semiconductor wafer 12 itself can be canceled.

  (Step S22) The peeling puncture protrusion 36 gradually moves in the direction of the tip, and the protective tape 14 is rolled up as shown in FIGS. (Step S23) The movement control device determines whether or not the insertion progress ΔC has reached the distance Tr. The distance Tr is a distance from the outer peripheral edge of the semiconductor wafer 12 and is set in advance as a distance indicating a region where the bumps 12a do not exist, and is generally about 2.5 to 3 mm. The insertion progress ΔC is recognized based on the position information of each member included in the control system coordinates set in the movement control device.

  Then, when the insertion progress ΔC has not reached the distance Tr as in the state shown in FIG. 9, the process returns to step S22. When the insertion progress ΔC reaches the distance Tr as in the state shown in FIG. 10, the process proceeds to step S24.

  (Step S24) The peeling puncture protrusion 36 moves slightly obliquely upward from the entry direction, and the end of the protective tape 14 is pulled upward obliquely. Therefore, even if the peeling puncture protrusion 36 is likely to come into contact with the surface of the semiconductor wafer 12, the bumps 12a on the semiconductor wafer 12 serving as an electronic element are not damaged. And the insertion part 34 moves toward the front of the puncture protrusion 36 for peeling, and at the same time, the clamping part 40 swings downward, so that the tip of the convex part 40b and the insertion part 34 as shown in FIG. The edge part of the protective tape 14 is clamped. Then, as shown in FIG. 12, the peeling unit 24 moves forward while holding the end edge of the protective tape 14, and peels the protective tape 14 from the semiconductor wafer 12 (step S25).

  If there is no abnormality in steps S21 to S25 of the tape peeling operation, the tape peeling apparatus 10 carries the next semiconductor wafer 12 onto the table 54 and repeats the steps S10 to S25 described above.

  If the peeling puncture protrusion 36 moves downward and reaches a position exceeding at least one of the distances ST1, ST2, ST3 in steps S21 to S25 during the tape peeling operation, the tape peeling operation is immediately performed. Stop.

  As described above, in the movement control device, three different distances ST1, ST2 and ST3 are set as allowable limit positions for the downward movement of the tip of the peeling puncture protrusion 36, and further, the tip of the peeling puncture protrusion 36 is the distance ST1, The arrival of ST2 and ST3 is detected by different means, and the downward movement is stopped by a predetermined stop mechanism.

  The distances ST1, ST2 and ST3 have a relationship of distance ST1> distance ST2 and distance ST1> distance ST3 as shown in the equations (1) to (3), and are set with an accuracy of 10 μm or less, for example. The accuracy can be detected. Accordingly, when the tip of the peeling puncture protrusion 36 is lowered beyond either one of the distances ST2 and ST3 during the protective tape peeling operation, the movement of the elevating member 22 and the movable base 18 is promptly performed by the control command of the stop processing means. The operation is stopped, and the peeling puncture protrusion 36 is prevented from contacting the semiconductor wafer 12. Even if stopping of the elevating member 22 and the movable base 18 is delayed more than expected, the flange 42a of the stopper shaft 42 engages the lower surface 46d of the shaft support portion 46 when the tip of the peeling puncture projection 36 reaches the distance ST1. The moving operation can be stopped by a mechanical method without time delay. Therefore, the tape peeling apparatus 10 is configured so that the operation of avoiding the damage of the semiconductor wafer 12 by the triple protection and the operation of the flange 42a engaging the lower surface 46d of the shaft support portion 46 do not occur frequently. The operation | movement which makes it hard to produce wear and damage to a stop part is realizable.

  The tape peeling device of the present invention is not limited to the above embodiment, but includes a movement control device that controls each moving operation of the elevating member and the movable base, and a tape detection sensor that detects the position of the surface of the protective tape. When the difference between the position of the surface of the protective tape detected by the tape detection sensor and the position of the surface of the protective tape that is input and set in advance exceeds a predetermined value, the moving operation of the elevating member and the movable base is stopped. Control may be performed.

  The position sensor has a plurality of outputs, and when the puncture protrusion rises to a height that avoids bumps on the surface of the semiconductor wafer, the output is made, and the puncture protrusion for peeling is movable without contacting the bumps on the surface of the semiconductor wafer. You may control so that a stand may operate | move a bump area | region.

  Furthermore, the stopper member only needs to have a structure that locks the member that moves down integrally with the elevating member, such as a structure that directly locks the lower surface of the elevating member, or the lower surface of a member other than the shaft support portion. It may be a structure.

  Further, when configuring a general-purpose tape peeling device at a low cost, it is not necessary to provide stop control means. Further, when a start-up inspection of the tape peeling device is performed and the control system coordinates are adjusted before the tape peeling work is started, the tape peeling device may not be provided with the measurement block and the measuring means. Even when the stop control means is provided, one or three or more reference values set in the stop control means may be set as necessary.

  Further, the measuring means such as the tape detection sensor and the position sensor is not limited to the contact type sensor, and may be a non-contact type sensor using an optical measuring means such as a laser beam.

DESCRIPTION OF SYMBOLS 10 Tape peeling apparatus 12 Semiconductor wafer 14 Protective tape 16 Base 18 Movable stand 20 Horizontal member 22 Lifting member 24 Peeling part 28 Motor 30 Ball screw 34 Insertion part 36 Peeling protrusion 40 for pinching 42 Stopper shaft 42a Shaft part 42b Flange 44 Shaft clamp unit 46 Shaft support 46a Main body 46d Lower surface 48 Position sensor 50 Measuring means 50a Contact probe 52 Measuring block 54 Table

Claims (10)

A table on which a semiconductor wafer having a protective tape affixed is placed, a movable table provided to be movable in a horizontal direction with respect to the table, and a lift provided to be movable up and down with respect to the movable table A member, a peeling puncture protrusion inserted into an end face of the protective tape, a peeling portion provided on the elevating member and holding the peeling puncture protrusion, and the protective tape peeled off by the peeling puncture protrusion An end edge portion peeled off by the puncture protrusion for peeling, and holding the edge portion of the protective tape sandwiched by the sandwiching portion, and moving the held portion. In the tape peeling apparatus for peeling the protective tape from the semiconductor wafer,
A stopper member that is fixed so as to be vertically adjustable with respect to the movable table, and that restricts the lowered position of the elevating member to a position where the peeling puncture protrusion is higher than the surface position of the semiconductor wafer;
A movement control device for controlling each moving operation of the elevating member and the movable table,
The stopper member is fixed in a relative position with respect to the movable base before the peeling puncture protrusion is inserted into an end surface of the protective tape, and the lifting member is moved to a predetermined locking position when the lifting member is moved downward. A tape peeling device characterized in that it can stop the downward movement of the tape. The stopper member includes a shaft portion inserted into the through hole of the elevating member and an abutting portion formed at one end thereof and engageable with the lower peripheral edge portion of the through hole.
2. The contact portion of the stopper member, when the elevating member moves downward, locks the elevating member below the through hole and stops the lowering movement of the elevating member. The tape peeling apparatus as described. A position sensor for detecting a relative positional relationship between the elevating member and a predetermined position of the stopper member;
The position sensor detects and outputs the elevating member at a position where the elevating member is slightly higher than a position where the elevating member and the stopper are in contact with each other, and stops the movement of the elevating member by the movement control device. The tape peeling apparatus according to claim 1. The movement control device compares a predetermined reference value indicating an allowable limit position of the lowering movement of the elevating member with an output of the position sensor, and when the output of the position sensor deviates from the reference value, the elevating member and Comprising stop control means for performing control to stop the moving operation of the movable table,
4. The tape according to claim 3, wherein the permissible limit position is a position higher than a position where the elevating member moves downward and a part of the elevating member comes into contact with and is locked to the stopper member. Peeling device.   The position where the stopper member is fixed with respect to the movable base is the position where the tip of the peeling puncture protrusion which has moved down together with the lifting member reaches the surface of the semiconductor wafer placed on the table. The tape peeling apparatus according to claim 2, 3 or 4, wherein the tape peeling apparatus is a position where the downward movement of the member is stopped.   The position sensor is also output when the elevating member moves away from the stopper and the puncture protrusion rises to a height at which the bump of the semiconductor wafer can be avoided, and the movement control device is controlled by the movable table. 4. The tape peeling apparatus according to claim 3, wherein an operation of the semiconductor wafer above the bump is permitted.   A measuring block for measuring a tip position of the puncture protrusion for peeling, and a measuring means for detecting a vertical distance from a predetermined position to the position of the measuring block and the surface of the protective tape. 4. The tape peeling according to claim 3, wherein a fixed position of the stopper member and an allowable limit position for the downward movement of the elevating member are calculated based on a measurement result using a measurement block and a detection result of the measuring means. apparatus. A table on which a semiconductor wafer having a protective tape affixed is placed, a movable table provided to be movable in a horizontal direction with respect to the table, and a lift provided to be movable up and down with respect to the movable table A member, a peeling puncture protrusion inserted into an end face of the protective tape, a peeling portion provided on the elevating member and holding the peeling puncture protrusion, and the protective tape peeled off by the peeling puncture protrusion An end edge portion peeled off by the puncture protrusion for peeling, and holding the edge portion of the protective tape sandwiched by the sandwiching portion, and moving the held portion. In the tape peeling apparatus for peeling the protective tape from the semiconductor wafer,
A movement control device for controlling each movement of the elevating member and the movable base;
A tape detection sensor for detecting the position of the surface of the protective tape,
When the difference between the position of the protective tape surface detected by the tape detection sensor and a preset protective tape surface position exceeds a predetermined threshold, the movement control device is A tape peeling apparatus comprising stop control means for performing control to stop the moving operation of the movable table.   9. The tape peeling apparatus according to claim 8, wherein the movement control device has setting means for presetting thickness information of the semiconductor wafer to be used and the protective tape. In addition to the stop control means, the movement control device stops the moving operation of the elevating member when the elevating member moves to a position slightly lower than the height at which the peeling puncture protrusion is inserted into the protective tape. The tape peeling apparatus according to claim 8, wherein control is performed.

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