JP2015204383A - tape peeling device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a tape peeling device capable of peeling a protective tape at a low cost.SOLUTION: A tape peeling device comprises: a chuck table 10 which holds a rear face WR of a wafer W, in which a protective tape TG is adhered to a front face WS thereof, with a holding surface 10a; end portion peeling means 20 that peels an outer peripheral end of the protective tape TG from the wafer W; and peeling drive means 30 that relatively moves the holding surface 10a and the end portion peeling means 20 in a direction parallel with and a direction intersecting with the holding surface 10a. The end peeling means 20 comprises: a peeling knife 22 which has a cutting edge 22a as the lower end and which is inclined at a predetermined angle with respect to the holding surface 10a; and clamp means 23 which are disposed on both sides of the cutting edge 22a and which hold the outer peripheral end of the protective tape TG peeled by the peeling knife 22. The tape peeling device moves the cutting edge 22a positioned slightly above the front face WS of the wafer W in a direction parallel to the holding surface 10a from the outside to inside of the wafer W and thereby lifts the protective tape TG from the wafer to peel.

Description

  The present invention relates to a tape peeling apparatus.

  After a protective tape that protects the device surface is applied, the semiconductor wafer is thinned by grinding the back surface. After the dicing tape is applied to the back surface, the protective tape is peeled off and divided into individual device chips. .

  In the past, the protective tape has been peeled off by sticking the tape that exhibits adhesiveness by heat, which is called heat sealing, to the protective tape by thermocompression bonding, and pulling the heat seal (for example, Patent Documents). 1). There was also a method of peeling off the protective tape with an adhesive tape having adhesiveness at room temperature. In this case, because it is difficult to handle due to adhesiveness (such as sticking to various places), stick the adhesive tape on the entire surface of the protective tape, peel off the protective tape, and protect the next wafer without cutting the adhesive tape as it is Used continuously for tape peeling. By doing so, the protective tape was peeled off by feeding out (feeding out) the entire tape without pulling the end of the tape. However, this method has a problem that the amount of adhesive tape used is large.

JP 2011-204860 A

  In the method disclosed in Patent Document 1, since heat sealing is a special tape, there is a problem that the cost increases or the purchase destination is limited. In the method of using the adhesive tape continuously without cutting, the amount of the adhesive tape used increased and the cost tended to increase.

  This invention is made | formed in view of the above, Comprising: The objective is to provide the tape peeling apparatus which can peel off a protective tape at low cost.

  In order to solve the above-described problems and achieve the object, the tape peeling apparatus of the present invention is a tape peeling apparatus for peeling a protective tape having a size equivalent to that of the wafer attached to the surface of the wafer, A chuck table that holds the back surface of the wafer having the protective tape attached to the front surface with a holding surface, end peeling means for peeling the end of the protective tape from the wafer held on the chuck table, and the holding surface And a peeling driving means for moving the holding surface and the end peeling means relative to each other in a direction parallel to and intersecting with the edge, the edge peeling means having a cutting edge as a lower end and a predetermined angle with respect to the holding surface And a clamping means that is disposed on both sides of the cutting edge and sandwiches the end of the protective tape that has been peeled off from the wafer by the peeling knife, and is slightly above the surface of the wafer. It is moved in a direction parallel with the holding plane cutting edge destination located from the outside of the wafer inward, characterized in that is peeled from the wafer push up the protective tape.

  Further, the end peeling means of the tape peeling device includes a guide surface facing in parallel with the inclined peeling knife, and the protective tape pushed up and peeled by the peeling knife is formed on the peeling knife and the guide surface. It is preferable to be guided.

  Moreover, it is preferable that the said tape peeling apparatus is provided with the blade edge position detection means which detects the height from this holding surface of the said blade edge.

  Moreover, it is preferable that the said tape peeling apparatus is provided with the edge part position detection means which detects the position of the outer peripheral edge part of the wafer hold | maintained at this holding surface of the said chuck table in the surface direction of the said holding surface.

  The tape peeling device includes a driving roller that adjusts the tension of the protective tape when the clamping means holding the protective tape is separated from the wafer and further peels off the protective tape, and the driving roller. It is preferable to include a rotating roller for sandwiching the protective tape.

  Therefore, in the tape peeling device of the present invention, the edge of the protective knife is pressed against the edge of the protective tape to form a peeling starting point, and the outer peripheral edge of the protective tape peeled off from the surface of the wafer is clamped by the clamping means. By peeling, the protective tape can be peeled without using any consumable material.

Drawing 1 is a figure showing the state where the height from the holding surface of the chuck table of the peeling knife of the tape peeling device concerning an embodiment was detected. FIG. 2 is a diagram illustrating a state in which the position of the outer peripheral end portion of the wafer held on the chuck table of the tape peeling device illustrated in FIG. 1 is detected. FIG. 3 is a view showing a state in which the cutting edge of the peeling knife of the tape peeling apparatus shown in FIG. 2 is in contact with the adhesive layer of the protective tape. FIG. 4 is a view showing a state where the outer peripheral end of the protective tape is peeled off by the peeling knife of the tape peeling device shown in FIG. FIG. 5 is a view showing a state in which the cutting edge of the peeling knife of the tape peeling apparatus shown in FIG. 4 is separated from the adhesive layer. FIG. 6 is a view showing a state in which the outer peripheral end of the protective tape is further peeled by the peeling knife of the tape peeling device shown in FIG. FIG. 7 is a view showing a state in which the clamping means of the tape peeling device shown in FIG. 6 sandwiches the outer peripheral end of the protective tape. FIG. 8 is a view showing a state in which the end peeling means of the tape peeling device shown in FIG. 7 is raised. FIG. 9 is a diagram illustrating a state where the driving roller and the rotating roller of the tape peeling device illustrated in FIG. 8 sandwich the protective tape. FIG. 10 is a plan view showing the cutting edge of the peeling knife and the clamping means of the tape peeling apparatus shown in FIG. FIG. 11 is an enlarged view of the cutting edge of the peeling knife of the tape peeling apparatus shown in FIG. FIG. 12 is an enlarged view showing the peeling knife, the clamping means and the like of the tape peeling apparatus shown in FIG.

  DESCRIPTION OF EMBODIMENTS Embodiments (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. The constituent elements described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the structures described below can be combined as appropriate. Various omissions, substitutions, or changes in the configuration can be made without departing from the scope of the present invention.

Embodiment
A tape peeling apparatus according to an embodiment of the present invention will be described with reference to the drawings. Drawing 1 is a figure showing the state where the height from the holding surface of the chuck table of the peeling knife of the tape peeling device concerning an embodiment was detected. FIG. 2 is a diagram illustrating a state in which the position of the outer peripheral end portion of the wafer held on the chuck table of the tape peeling device illustrated in FIG. 1 is detected. FIG. 3 is a view showing a state in which the cutting edge of the peeling knife of the tape peeling apparatus shown in FIG. 2 is in contact with the adhesive layer of the protective tape. FIG. 4 is a view showing a state where the outer peripheral end of the protective tape is peeled off by the peeling knife of the tape peeling device shown in FIG. FIG. 5 is a view showing a state in which the cutting edge of the peeling knife of the tape peeling apparatus shown in FIG. 4 is separated from the adhesive layer. FIG. 6 is a view showing a state in which the outer peripheral end of the protective tape is further peeled by the peeling knife of the tape peeling device shown in FIG. FIG. 7 is a view showing a state in which the clamping means of the tape peeling device shown in FIG. 6 sandwiches the outer peripheral end of the protective tape. FIG. 8 is a view showing a state in which the end peeling means of the tape peeling device shown in FIG. 7 is raised. FIG. 9 is a diagram illustrating a state where the driving roller and the rotating roller of the tape peeling device illustrated in FIG. 8 sandwich the protective tape. FIG. 10 is a plan view showing the cutting edge of the peeling knife and the clamping means of the tape peeling apparatus shown in FIG. FIG. 11 is an enlarged view of the cutting edge of the peeling knife of the tape peeling apparatus shown in FIG. FIG. 12 is an enlarged view showing the peeling knife, the clamping means and the like of the tape peeling apparatus shown in FIG.

  The tape peeling apparatus 1 (hereinafter simply referred to as a peeling apparatus) according to the embodiment is for peeling the protective tape TG attached to the surface WS of the wafer W (shown in FIG. 2 and the like). In the embodiment, the wafer W is a disk-shaped semiconductor wafer or optical device wafer having silicon, sapphire, gallium, or the like as a base material. In the wafer W, devices are formed in regions partitioned by a plurality of division lines formed in a lattice pattern on the surface WS. In the wafer W, the protective tape TG is attached to the front surface WS, and the back surface WR side is ground by a grinding device (not shown) and thinned to a predetermined thickness. The wafer W has a protective tape TG after the dicing tape TD (shown in FIG. 2 or the like) is adhered to the back surface WR side ground by the grinding apparatus and fixed to the annular frame F (shown in FIG. 2 or the like). Is peeled off.

  The protective tape TG is formed in a disk shape having the same size as the wafer W. As shown in FIG. 11, the protective tape TG includes a base material layer BR made of a synthetic resin that transmits ultraviolet rays and the like, and an adhesive that is provided on the surface of the base material layer BR and is attached to the surface WS of the wafer W. And a layer AR. The adhesive layer AR is made of a material that has a very low state due to a decrease in adhesive strength when irradiated with ultraviolet rays.

  As shown in FIG. 1, the peeling apparatus 1 includes a chuck table 10, an end peeling means 20, a peeling driving means 30, a blade edge position detecting means 40, an end position detecting means 50, and a tension adjusting section 60 ( And a control means (not shown).

  The chuck table 10 has the back surface WR of the wafer W with the protective tape TG attached to the front surface WS placed on the holding surface 10a, and holds the back surface WR of the wafer W with the holding surface 10a via the dicing tape TD. Is. The chuck table 10 has a disk shape in which a portion constituting the holding surface 10a is formed of porous ceramic or the like, and is connected to a vacuum suction source (not shown) via a vacuum suction path (not shown) and placed on the holding surface 10a. The wafer W is held by suction. The outer peripheral portion surrounding the holding surface 10a of the chuck table 10 is made of a conductive metal.

  The end peeling means 20 peels the outer peripheral edge of the protective tape TG from the wafer W held on the chuck table 10. The end peeling means 20 includes a peeling head 21, a peeling knife 22, and a pair of clamping means 23 provided so as to be movable up and down in a vertical direction intersecting the holding surface 10 a of the chuck table 10.

  The peeling head 21 is provided with a notch 24 opened in a flat lower surface 21a in the horizontal direction. The notch 24 cuts the base material of the peeling head 21 upward from the lower surface 21a.

  The peeling knife 22 is made of a conductive metal, has a sharp cutting edge 22a, and extends linearly. The peeling knife 22 is inclined at a predetermined angle Θ with respect to the holding surface 10a with the cutting edge 22a as a lower end. In the present embodiment, the angle Θ formed with the holding surface 10a in the longitudinal direction of the peeling knife 22 is about 45 degrees, but may be about 30 degrees. The peeling knife 22 is attached to the peeling head 21 with the cutting edge 22a protruding into the notch 24 and disposed below the lower surface 21a of the peeling head 21. Further, the peeling knife 22 is inclined with respect to the vertical direction and the horizontal direction with the angle Θ described above so as to gradually approach the chuck table 10 toward the cutting edge 22a. As shown in FIG. 10, the cross-sectional shape in the horizontal direction of the cutting edge 22a of the peeling knife 22 is formed in a triangular shape having a vertex on the chuck table 10 side. The peeling knife 22 peels the protective tape TG from the surface WS of the wafer W when the cutting edge 22a enters the adhesive layer AR of the protective tape TG attached to the wafer W held on the chuck table 10.

  As shown in FIG. 10, the clamping means 23 is disposed on both sides of the cutting edge 22 a in the horizontal direction, and clamps the outer peripheral end of the protective tape TG peeled off from the wafer W by the peeling knife 22. The clamp means 23 includes an air cylinder 25 attached to the peeling head 21 and a clamping member 27 attached to the tip of a rod 26 (shown in FIG. 7) of the air cylinder 25. The air cylinder 25 is attached to the peeling head 21 so that the extending and contracting direction of the rod 26 is parallel to the horizontal direction and the extended rod 26 approaches the peeling knife 22. Further, the rod 26 of the air cylinder 25 is arranged in the notch 24.

  A guide surface 24 a facing the clamping member 27 is provided on the inner surface of the notch 24 of the peeling head 21. That is, the end peeling means 20 includes a guide surface 24a. The guide surface 24a is arranged at least on both sides of the peeling knife 22 and is formed in parallel with the inclined peeling knife 22. The sandwiching member 27 includes a sandwiching surface 27a that faces the guide surface 24a and is parallel to the guide surface 24a. Further, when the rod 26 is reduced, the clamping member 27 is disposed on the side away from the peeling knife 22 and the guide surface 24a. The clamp means 23 clamps the end portion of the protective tape TG between the guide surface 24a and the clamping surface 27a as the rod 26 extends.

  The peeling drive means 30 moves the holding surface 10a and the end peeling means 20 relative to each other in a direction parallel to the holding surface 10a and in a vertical direction intersecting the holding surface 10a. The peeling drive means 30 is configured by a motor, a lead screw, or the like attached to the apparatus main body, and supports the chuck table 10 so as to be movable in a direction parallel to the holding surface 10a. The peeling drive means 30 supports the peeling head 21, that is, the end peeling means 20, so as to be movable in the vertical direction. In the present invention, the peeling driving means 30 may support the end peeling means 20 movably not only in the vertical direction but also in various directions as long as it intersects the holding surface 10a.

  The blade edge position detecting means 40 detects the height of the blade edge 22a of the peeling knife 22 from the holding surface 10a. As shown in FIG. 1, the blade edge position detection means 40 includes a DC power source 41 applied to the outer peripheral portion of the chuck table 10 and the peeling knife 22, and a current flowing between the outer peripheral portion of the chuck table 10 and the peeling knife 22. And an ammeter 42 for detection. The blade edge position detection means 40 is configured such that when the chuck table 10 and the blade edge 22a of the peeling knife 22 come into contact with each other, the ammeter 42 detects a current and outputs the detection result to the control means. The position of the peeling head 21 when the cutting knife 22 contacts the cutting edge 22a, that is, the height from the holding surface 10a of the cutting edge 22a of the peeling knife 22 is detected. In the present invention, the blade edge position detecting means 40 may be a non-contact type including a light emitting element and a light receiving element that receives light from the light emitting element.

  The end position detection means 50 detects the position of the outer peripheral end of the wafer W held on the holding surface 10a of the chuck table 10 in the surface direction of the holding surface 10a. The end position detection means 50 is attached to the peeling head 21 and irradiates a laser beam L (shown in FIG. 2) downward in parallel with the vertical direction and receives reflected light of the laser beam L. The end position detecting means 50 receives the reflected light from the surface WS of the wafer W of the laser beam L when the chuck table 10 separated from the lower side of the peeling head 21 is brought closer to the lower side of the peeling head 21. The end position detection means 50 receives the reflected light of the laser beam L, detects the position of the outer peripheral end of the wafer W, and outputs the detection result to the control means so that the control means reflects the reflected light of the laser beam L. Is detected, that is, the position of the outer peripheral end of the wafer W is detected.

  As shown in FIG. 8, the tension adjusting unit 60 includes a driving roller 61 that adjusts the tension of the protective tape TG, a rotating roller 62 that sandwiches the protective tape TG with the driving roller 61, and a roller moving unit (not shown). ing. The driving roller 61 and the rotating roller 62 are provided so as to be movable by a roller moving unit between a position between the chuck table 10 and the peeling head 21 and a position where the driving roller 61 and the rotating roller 62 are retracted from these positions. The shaft centers of the driving roller 61 and the rotating roller 62 are arranged in parallel to the direction in which the pair of clamping means 23 are arranged.

  The drive roller 61 is rotated by a motor (not shown). The rotating roller 62 is moved closer to or away from the driving roller 61 between the chuck table 10 and the peeling head 21 by roller moving means. The rotating roller 62 is rotatably provided. The tension adjusting unit 60 sandwiches the protective tape TG sandwiched between the clamp means 23 between the driving roller 61 and the rotating roller 62, and the driving roller 61 is rotated in a direction in which the protective tape TG is wound. A tension is applied to the TG, and the protective tape TG is peeled off from the surface WS of the wafer W.

  Further, the peeling apparatus 1 includes ultraviolet irradiation means for irradiating the surface WS of the wafer W held on the chuck table 10 with ultraviolet rays. The peeling apparatus 1 is configured so that at least the surface of the peeling device 1 is made of a fluorine-based material in order to restrict the adhesive layer AR from sticking to the peeling knife 22, the clamping member 27, the guide surface 24a, the driving roller 61, the rotating roller 62, and the like. Coated with mold.

  The control means controls the above-described components constituting the peeling device 1. The control means causes the peeling device 1 to perform the peeling operation of the protective tape TG of the wafer W. The control means is composed mainly of a microprocessor (not shown) provided with an arithmetic processing unit constituted by, for example, a CPU or the like, ROM, RAM, etc. It is connected to operation means used when registering information and the like.

  Next, the peeling operation | movement of the protective tape TG of the peeling apparatus 1 which concerns on this embodiment is demonstrated with reference to drawings.

  First, in the peeling operation, the operator registers the processing content information in the control means, and the peeling device 1 starts the peeling operation when there is an instruction to start the peeling operation. In the peeling operation, the control unit positions the chuck table 10 below the peeling head 21 and lowers the peeling head 21. As shown in FIG. 1, the control means brings the cutting edge 22a of the peeling knife 22 into contact with the outer periphery of the chuck table 10 and detects the height of the cutting edge 22a from the holding surface 10a. The control means retracts the driving roller 61 and the rotating roller 62 of the tension adjusting unit 60 from between the chuck table 10 and the peeling head 21 before detecting the height of the cutting edge 22a from the holding surface 10a. .

  The operator places the wafer W on the holding surface 10 a of the chuck table 10, and the control unit sucks and holds the wafer W on the holding surface 10 a of the chuck table 10. The surface WS of the wafer W is irradiated with ultraviolet rays, and the adhesive strength of the adhesive layer AR of the protective tape TG is weakened.

  The control means once separates the chuck table 10 from the lower side of the peeling head 21, and moves the chuck table 10 closer to the lower side of the peeling head 21 while irradiating the laser beam L from the end position detecting means 50, as shown in FIG. Then, the position of the outer peripheral end of the wafer W held on the holding surface 10a of the chuck table 10 is detected. Then, as shown in FIGS. 3 and 10, the control means places the cutting edge 22a on the outer peripheral end of the protective tape TG based on the height of the cutting edge 22a from the holding surface 10a and the position of the outer peripheral end of the wafer W. Make contact. At this time, the control means positions the blade edge 22a slightly above the surface WS of the wafer W, and brings the blade edge 22a into contact with the adhesive layer AR of the protective tape TG as shown in FIG. In the present embodiment, the height of the cutting edge 22a from the holding surface 10a is 10 μm.

  As shown in FIG. 4, the control means moves the chuck table 10 so as to move the blade edge 22a from the outside of the wafer W to the inside in a direction parallel to the holding surface 10a. Then, the cutting edge 22a is cut into the adhesive layer AR exposed at the outer peripheral end of the protective tape TG to form a peeling start point in the adhesive layer AR, and the protective tape TG is peeled from the peeling start point as the chuck table 10 moves. Then, the peeling knife 22 pushes up the outer peripheral end of the peeled protective tape TG. In the present embodiment, the moving speed of the chuck table 10 is 1 mm / sec, and the chuck table 10 is moved by about 5 mm.

  As shown in FIG. 5, the control means once moves the chuck table 10 away from the blade edge 22a, and then moves the blade edge 22a from the outside to the inside of the wafer W in a direction parallel to the holding surface 10a as shown in FIG. Then, the chuck table 10 is moved. Then, the outer peripheral end portion of the protective tape TG peeled from the outer peripheral end portion is pushed up by the peeling knife 22 and further peeled from the wafer W. The protective tape TG pushed up and peeled off by the peeling knife 22 also comes into contact with the guide surface 24a and is guided to the peeling knife 22 and the guide surface 24a as shown in FIGS. At this time, the moving speed of the chuck table 10 is 1 mm / sec, and the chuck table 10 is moved about 20 mm. 4 and 6, when the chuck table 10 is moved so as to move the blade edge 22a from the outside to the inside of the wafer W in the direction parallel to the holding surface 10a, the chuck table 10 is moved along with the movement of the chuck table 10. The peeling head 21, that is, the peeling knife 22, may be moved up and down about several mm.

  Then, the control means extends the rod 26 of the air cylinder 25 of the clamping means 23, and as shown in FIG. 7, the outer peripheral end of the protective tape TG is interposed between the clamping surface 27a of the clamping member 27 and the guide surface 24a. Pinch. The control means raises the peeling head 21 so that the clamping means 23 holding the protective tape TG is separated upward from the wafer W. As shown in FIG. 8, the control means positions the driving roller 61 between the chuck table 10 and the peeling head 21 and outside the outer peripheral end of the protective tape TG, and rotates the rotating roller 62 with the chuck table 10. After being positioned between the peeling head 21 and inside the outer peripheral end of the protective tape TG, it is brought close to the drive roller 61.

  In the control means, the clamping means 23 holding the protective tape TG is spaced upward from the wafer W, and the protective tape TG is further peeled from the surface WS of the wafer W. When the protective tape TG is peeled from the surface WS of the wafer W, the control means holds the outer peripheral end of the protective tape TG between the drive roller 61 and the rotating roller 62 as shown in FIG. Then, the peeling head 21 is moved in the horizontal direction while rotating the driving roller 61 in the direction of winding the protective tape TG, so that the protective tape TG is completely peeled from the surface WS of the wafer W. Thereafter, the control unit discards the protective tape TG peeled off from the surface WS of the wafer W in a dust box (not shown).

  As described above, according to the peeling device 1 according to the embodiment, the cutting edge 22a of the peeling knife 22 is pressed against the adhesive layer AR exposed at the outer peripheral end of the protective tape TG, and the cutting edge 22a is moved from the outside of the wafer W to the inside. Since the chuck table 10 is moved in parallel with the holding surface 10a so as to face toward the surface, a peeling start point can be formed in the adhesive layer AR exposed at the outer peripheral end. Further, the peeling knife 22 is inclined at a predetermined angle Θ with respect to the holding surface 10a so as to gradually approach the chuck table 10 toward the cutting edge 22a. For this purpose, since the chuck table 10 is moved in parallel with the holding surface 10 a, the protective tape TG peeled off from the peeling starting point is pushed up onto the peeling knife 22 and the pushed outer peripheral end is clamped by the clamping means 23. Therefore, the peeling apparatus 1 can peel the protective tape TG from the outer peripheral end from the surface WS of the wafer W without using any consumable material, and can peel the protective tape TG from the wafer W at a low cost. .

  Moreover, since the edge part peeling means 20 is provided with the guide surface 24a which faces the notch 24 of the peeling head 21 in parallel with the peeling knife 22, the protective tape TG peeled off from the outer peripheral edge is added to the peeling knife 22. Can be guided by the guide surface 24a. Therefore, the peeling apparatus 1 can peel the protective tape TG from the outer peripheral end without using a consumable material.

  Furthermore, since the peeling apparatus 1 includes the blade edge position detecting means 40 that detects the height of the blade edge 22a from the holding surface 10a, the adhesive layer that exposes the blade edge 22a of the peeling knife 22 at the outer peripheral end of the protective tape TG. It can be reliably pressed against the AR, and the wafer W is not damaged.

  Moreover, since the peeling apparatus 1 is provided with the edge part position detection means 50 which detects the position of the outer peripheral edge part of the wafer W hold | maintained at the holding surface 10a, the blade edge 22a of the peeling knife 22 is used for the outer peripheral edge of protective tape TG. Can be reliably pressed against the adhesive layer AR exposed at the portion. Furthermore, when the peeling device 1 raises the peeling head 21 and separates the clamp means 23 holding the outer peripheral end of the protective tape TG from the wafer W, the driving roller 61 and the rotating roller 62 of the tension adjusting unit 60 A protective tape TG is sandwiched between them. Since the peeling device 1 rotates the driving roller 61 in the winding direction of the protective tape TG to apply (adjust) the tension to the protective tape TG, the tensile force acts on the protective tape TG with a curved surface. There is no risk of the tape TG being torn off.

  The present invention is not limited to the above embodiment. That is, various modifications can be made without departing from the scope of the present invention.

DESCRIPTION OF SYMBOLS 1 Tape peeling apparatus 10 Chuck table 10a Holding surface 20 End part peeling means 22 Peeling knife 22a Blade edge 23 Clamp means 24a Guide surface 30 Peeling drive means 40 Blade edge position detection means 50 End position detection means 61 Drive roller 62 Rotating roller TG Protection tape W Wafer WS Front WR Back Θ Angle

Claims (5)

A tape peeling device for peeling off a protective tape having the same size as the wafer attached to the surface of a wafer,
A chuck table that holds the back surface of the wafer having the protective tape attached to the front surface with a holding surface, end peeling means for peeling the end of the protective tape from the wafer held on the chuck table, and the holding surface A peeling drive means for relatively moving the holding surface and the end peeling means in a direction parallel to and intersecting with
The end peeling means is
A peeling knife inclined at a predetermined angle with respect to the holding surface, with the cutting edge as a lower end,
Clamping means that is disposed on both sides of the blade edge and clamps the end of the protective tape peeled off from the wafer by the peeling knife;
A tape peeling apparatus, wherein the cutting edge positioned slightly above the surface of the wafer is moved from the outside to the inside of the wafer in a direction parallel to the holding surface, and the protective tape is pushed up and peeled off from the wafer. The end peeling means includes a guide surface facing in parallel with the inclined peeling knife,
The tape peeling apparatus according to claim 1, wherein the protective tape peeled off by the peeling knife is guided by the peeling knife and the guide surface.   The tape peeling apparatus according to claim 1, further comprising a blade edge position detecting unit that detects a height of the blade edge from the holding surface.   The edge part position detection means which detects the position of the outer peripheral edge part of the wafer hold | maintained at this holding surface of the said chuck table in the surface direction of the said holding surface is provided as described in any one of Claims 1-3. Tape peeling device.   A driving roller that adjusts the tension of the protective tape when the clamping means holding the protective tape is separated from the wafer and further peels the protective tape, and a rotating roller that holds the protective tape between the driving roller and the driving roller The tape peeling apparatus as described in any one of Claims 1-4 provided with these.

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