JP2016100543A - Attachment device and attachment method of adhesive tape to substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To attach an adhesive tape to a wafer without being protruded from the wafer at the time of attaching the adhesive tape to the wafer thereby to prevent breakage of the wafer.SOLUTION: An attachment device 1 of an adhesive tape to a substrate W comprises: tape supply means 4 of feeding on a substrate W, an adhesive tape T having an original adhesive tape Ta which is temporarily attached to a surface of a base material Tb; and pressing means 17 of pressing the adhesive tape T to attach the original adhesive tape Ta to the substrate W by pressing the original adhesive tape T by the pressing means 17. The adhesive tape attachment device 1 includes a holding plate 24 for holding the adhesive tape T by suction; a cutter 57 for forming a first cut of an outer shape of the substrate W and a second cut on the original adhesive tape Ta with the base material Tb of the adhesive tape T being left; an attachment table 30 for holding the substrate W; and a peeling unit 60 for peeling the original adhesive tape Ta between the first cut and the second cut, in which the original adhesive tape Ta formed inside the first cut is pressed to the substrate W to be attached after the original adhesive tape Ta is peeled.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an apparatus and method for attaching an adhesive tape to a substrate on which various adhesive tapes are attached to a substrate such as a semiconductor wafer. More specifically, the present invention relates to an adhesive tape attaching device and an attaching method to a substrate for attaching an adhesive tape to a semiconductor wafer mainly by heating such as a die attach film.

  Conventionally, in manufacturing a semiconductor device, a circuit pattern is formed on the surface of a semiconductor wafer (hereinafter simply referred to as a wafer), and a protective tape is attached to the circuit pattern surface of the wafer on which the circuit pattern is formed. The wafer with the protective tape attached to the front surface is ground and thinned on the back surface side.

  A die attach film (hereinafter simply referred to as DAF) is attached to the back surface of the thinned wafer, and then mounted on a dicing frame via a dicing tape. The wafer mounted on the dicing frame has a release tape attached to a protective tape attached to the surface, and the protective tape is peeled from the wafer surface by pulling the release tape.

  The wafer from which the protective tape on the surface has been peeled is diced into chips. The chip is heat-bonded to the die by DAF on the back side, wired by wire bonding or the like, and then sealed with mold resin to manufacture a semiconductor device.

  The DAF is, for example, a film (or tape, sheet) using a polymer alloy type adhesive composed of a thermoplastic resin (polyimide resin, acrylic resin, etc.) and a thermosetting resin (epoxy resin, phenol resin, etc.). The material is usually not sticky, and is formed so as to show stickiness by heating (for example, 100 ° C. to 160 ° C.). In the DAF, the surface of the single-layer DAF in which the adhesive film (hereinafter referred to as the original adhesive tape) is mainly formed on the base film and the surface of the original adhesive tape of the single-layer DAF is covered with a separator. There are two types of two-layer DAF.

  Conventionally, DAF is attached to a wafer by holding the wafer on a sticking table, supplying a DAF wider than the wafer onto the wafer, and pressing the DAF with a sticking roller while heating the wafer. Done in Thereafter, the DAF is cut out with a cutter along the outer shape of the wafer, and the substrate on the DAF is peeled off (for example, Patent Document 1).

JP 2002-134438 A

  The DAF is cut by a conventional apparatus such as Patent Document 1 by a cutter along the outer shape of the wafer. For this reason, the normally cut DAF protrudes from the outer periphery of the wafer. Thereafter, the wafer with the DAF attached to the back surface is mounted on the dicing frame by attaching the DAF side of the back surface to the dicing tape.

  FIG. 10 shows a wafer mounted on a dicing frame by a conventional method. As shown in FIG. 10, a dicing tape 81 is affixed to the dicing frame 80, and a wafer 84 is mounted on the dicing tape 81. The wafer 84 has a protective tape 82 affixed on a circuit pattern on the front surface, and a DAF 83 affixed on the back side by a device such as the conventional patent document 1. Further, as shown in the figure, the DAF 83 is slightly protruded from the outer periphery of the wafer 84 (note that the amount of protrusion of the DAF is exaggerated for easy understanding. Also, the wafer, the protective tape, and the dicing tape are drawn. The thickness is also exaggerated from the actual value so that it is easy to understand.)

  FIG. 11 is an explanatory diagram when the protective tape is peeled from the mounted wafer. A wafer 84 is mounted on a dicing frame 80 held on the peeling table 85 by suction or the like via a dicing tape 81. A protective tape 82 is affixed on the surface of the wafer 84. A peeling tape 86 is pressed and pasted onto the protective tape 82 at the peeling start end of the wafer 84 by a sticking roller 87.

  At this time, the DAF 83 that protrudes from the outer periphery on the back side of the wafer 84 adheres to the release tape 86. If the protective tape 82 is peeled off by pulling the peeling tape 86 in this state, there is a problem that the wafer 84 is lifted together with the DAF 83 and the wafer 84 is damaged. Further, even when the wafer 84 is not damaged, there is a problem that the portion of the DAF 83 that protrudes from the wafer 84 pulls the yarn and is caught in the dicing process.

  Moreover, when the die-bonding tape (equivalent to DAF) is affixed to a wafer as mentioned in the problem of Patent Document 1 and then cut along the wafer outer shape, the cut edges of the cut die-bonding tape are heated again. There is a problem of adhesion.

  Therefore, the method of cutting the DAF after attaching the DAF to the wafer avoids the problem that the cut DAF reattaches, or the DAF protruding from the wafer sticks to the peeling tape when the protective tape is peeled off. There is.

  Further, as a method for solving the above, a method of forming a DAF in a wafer shape in advance and affixing the DAF on the wafer is also conceivable, but this also requires a means for forming the DAF in the wafer shape, or a wafer in advance. It is necessary to prepare DAF formed in a shape, and there is a problem that lacks versatility.

  As described above, the present invention provides a highly versatile apparatus and method for attaching an adhesive tape to a substrate that does not protrude from the wafer and has no problem of reattaching the cutting edge of the adhesive tape. The purpose is to provide.

The invention of claim 1 includes a tape supply means for feeding an adhesive tape having an original adhesive tape temporarily attached onto a base material onto a substrate, and a pressing means for pressing the adhesive tape. In the adhesive tape affixing device to the substrate to be affixed to the substrate by pressing with the pressing means via the base material,
A holding plate for holding the adhesive tape from the substrate side of the adhesive tape;
A first notch that is formed in the outer shape of the substrate on the original adhesive tape leaving the base of the adhesive tape facing the holding plate, and outside the first notch with a gap between the notch of the outer shape. Cutting means for forming a second cut formed;
An affixing table for holding the substrate;
A peeling unit for peeling the original adhesive tape between the first cut and the second cut;
Adhesion to a substrate adopting a configuration in which an original adhesive tape formed inside the first cut is pressed and attached to the substrate after peeling off the original adhesive tape between the first cut and the second cut. It is a tape applicator.

  The invention of claim 2 is an apparatus for attaching an adhesive tape to a substrate adopting a configuration in which the adhesive tape is a heating adhesive tape in the invention of claim 1.

According to a third aspect of the present invention, an adhesive tape having an original adhesive tape temporarily attached to a base material is fed onto the substrate, and the original adhesive tape is attached to the substrate by pressing the adhesive tape through the base material. In the method of attaching the adhesive tape to the substrate to be attached,
Holding the adhesive tape with a holding plate from the base material side of the adhesive tape,
Forming the first cut of the outer shape of the substrate in the original adhesive tape leaving the base material of the adhesive tape;
Forming a second cut formed outside the first cut with a gap from the cut in the outer shape;
After peeling the raw adhesive tape between the first cut and the second cut,
This is a method of attaching an adhesive tape to a substrate that employs a configuration in which an original adhesive tape inside a first cut is opposed to the substrate and the original adhesive tape is pressed and attached to the substrate.

  According to a fourth aspect of the present invention, in the third aspect, the adhesive tape is a heating adhesive tape, and when the original adhesive tape is pressed against the substrate, at least one of the substrate or the adhesive tape is applied while being heated. This is a method for attaching an adhesive tape to a substrate employing the above-described configuration.

  According to the present invention, the first cut along the outer shape of the substrate is made in the original adhesive tape temporarily attached on the base material, the second cut is made outside the first cut, and then the first cut and the first cut are made. Since the original adhesive tape between the two cuts is peeled off and then the original adhesive tape inside the first cut is pressed against the substrate, the adhesive tape does not protrude from the outer periphery of the substrate.

  In addition, since the adhesive tape does not protrude from the outer periphery of the substrate, the release tape does not stick to the adhesive tape that protrudes from the outer periphery of the substrate when the protective tape is peeled off from the surface of the substrate, and the substrate is lifted to the release tape. Will not be damaged.

  Moreover, even if a heat-adhesive tape is used as the adhesive tape, the adhesive tape on the outer periphery of the part to be attached is removed in advance. Does not reattach.

These are the front views of the adhesive tape sticking apparatus of this invention. These are the AA direction arrow top views of FIG. These are the BB direction arrow top views of FIG. (A) And (b) is operation | movement explanatory drawing at the time of making a cut in an adhesive tape. (C) And (d) is operation | movement explanatory drawing at the time of removing DAF of an unnecessary part from the notch | incision put into the adhesive tape. (E) is operation | movement explanatory drawing showing the state from which DAF of the unnecessary part of the adhesive tape was removed. (A) And (b) is operation | movement explanatory drawing at the time of sticking an adhesive tape on a board | substrate. These are operation | movement explanatory drawings at the time of sticking an adhesive tape on a board | substrate. (A) And (b) is operation | movement explanatory drawing at the time of peeling an unnecessary base material. These are conventional examples of a wafer mounted on a dicing frame. Is a conventional example in which a protective tape is peeled from a wafer mounted on a dicing frame.

  Hereinafter, the adhesive tape attaching apparatus and the attaching method of the present invention will be described with reference to FIGS.

  1 is a front view of the adhesive tape attaching apparatus of the present invention, FIG. 2 is a plan view taken along the arrow AA in FIG. 1, and FIG. 3 is a plan view taken along the arrow BB in FIG. The adhesive tape attaching apparatus 1 includes two supporting walls 7 and 7 erected on a base 2 serving as a base, and an adhesive tape T attaching unit 3 provided between the two supporting walls 7 and 7. An affixing table 30 provided on the machine base 2 so as to be movable horizontally, a cutter unit 50 as a cutting means for cutting the adhesive tape T, a peeling unit 60 for peeling the unnecessary adhesive tape T, and the like. Configured.

  The affixing unit 3 includes a supply reel 4 as a tape supply unit around which a wide adhesive tape T is wound, a collection reel 5 that winds up the adhesive tape T, and a tape chuck unit that sandwiches and pulls out the adhesive tape T. 19, a tension roller 15 for applying a predetermined tension to the adhesive tape T, a sticking roller 17 as a pressing means for pressing the adhesive tape T against the wafer W, and an adhesive tape T when the adhesive tape T is cut. A holding plate 24 that holds the adhesive tape T from the back side, and a sensor 23 that detects the attachment position of the adhesive tape T when the adhesive tape T is attached to the wafer W.

  In the present embodiment, a description will be given based on an example in which a single-layer DAF is used as the adhesive tape T. The DAF exhibits an adhesive force when heated, and is formed by temporarily attaching an original adhesive tape Ta on a substrate Tb (see FIG. 8). In the embodiment of the present invention, an example using a single-layer DAF will be described. However, a two-layer DAF and other stacked DAFs are also applied by providing a separate mechanism for separating the separator on the surface and the like. it can.

  The adhesive tape T is fed from the supply reel 4 so that the original adhesive tape Ta is on the lower surface, and is guided to the pinch roller 11 while being guided by the guide roller 10, and a tension roller 15 for applying appropriate tension and a plurality of tension rollers 15. After passing through the guide rollers 12 a and 12 b, an appropriate tension is applied by the tension roller 13, and then guided to the collection roller 5 through the pinch roller 14. Each of the pinch rollers 11 and 14 is provided with an appropriate drive source so as to feed out the adhesive tape T.

  The tension roller 15 is configured to be movable up and down by a cylinder 16 and a guide 26 provided at the top. The tension roller 15 moves up and down to apply tension to the adhesive tape T and control the angle of the adhesive tape T to an appropriate affixing angle.

  Further, between the tension roller 15 and the guide roller 12a, there are provided a sticking roller 17 for sticking the adhesive tape T to the wafer W, and a tape chuck unit 19 for sandwiching and pulling out the adhesive tape T.

  The affixing roller 17 is configured to be movable up and down by a cylinder 18 and a guide 26 provided at the top. Note that an appropriate heater is built in the sticking roller 17 so as to heat the adhesive tape T (a heater that does not contain a heater can be used depending on the adhesive tape T). The affixing roller 17 is slidable via a slider 27 fitted to the rails 8, 8 provided inside the support walls 7, 7. It is connected to a drive belt 42 stretched outside the support wall 7 via a not-shown). A driving source (not shown) is connected to the driving belt 42, and by driving the driving belt 42, the sticking roller 17 moves horizontally between the tension roller 15 and the guide roller 12 a along the rail 8. It is like that.

  The tape chuck unit 19 includes an upper chuck 21 that can be moved up and down by a cylinder 22 and a guide 26, and a peeling roller 20 provided below the upper chuck 21. The tape chuck unit 19 pulls out the adhesive tape T by sandwiching the adhesive tape T between the upper chuck 21 and the peeling roller 20.

  Further, the peeling roller 20 is configured to peel off an excess portion of the adhesive tape T after application, which will be described later, from the application table 30. The tape chuck unit 19 can be moved horizontally through a slider 28 fitted to rails 9, 9 provided inside the support walls 7, 7. The tape chuck unit 19 is connected to a drive belt 41 stretched outside the support wall 7 through one notch (not shown) of the support wall 7, and this drive belt 41 is connected to a drive source (not shown). It can be moved horizontally by driving with.

  Further, above the adhesive tape T, a holding plate 24 for adsorbing and holding the adhesive tape T from the back surface side (base material Tb side) of the adhesive tape T is provided. The holding plate 24 sucks and holds the adhesive tape T from the back surface side when the cutter unit 50 described later cuts the adhesive surface of the adhesive tape T. The holding plate 24 is provided with an appropriate suction hole (not shown) to hold the adhesive tape T by suction. The holding plate 24 moves up and down between a holding position for holding the adhesive tape T by the elevating cylinder 25 and a separated position separated from the adhesive tape T.

  In the vicinity of the holding plate 24, there is provided a positioning sensor 23 for detecting, for example, an optical means, a front end portion of the original adhesive tape Ta when the adhesive tape T is attached to the wafer W. Yes. The sensor 23 is appropriately moved by a driving mechanism (not shown) so as not to interfere with the holding plate 24, the tape chuck unit 19, and the like.

  The pasting table 30 is formed on a table base 31, and the table base 31 is slidable on a rail 6 laid on the machine base 2 via a slider 32. The table base 31 can be moved horizontally along the rail 6 on the machine base 2 by an appropriate drive source (not shown).

  The sticking table 30 includes an inner peripheral table 30a and an outer peripheral table 30b, and the inner peripheral table 30a sucks and holds the wafer W by an appropriate sucking means. The inner peripheral table 30a is provided with a heater 37 inside to heat the wafer W. The outer peripheral table 30b includes a circular opening surrounding the inner peripheral table 30a and a rectangular table frame on the outer side. A silicone sheet (not shown) that holds the adhesive tape T with an appropriate holding force and exhibits releasability when the adhesive tape T is peeled off is provided on the surface of the outer peripheral table 30b that contacts the adhesive tape T. . Further, support frames 34 and 34 are provided downward at both front and rear ends of the outer peripheral table 30b, and both support frames 34 and 34 are provided with sliders 35 and 35, respectively.

  Further, two support columns are erected on the table base 31, and rails 33, 33 are provided along both support columns. The sliders 35 and 35 are slidably fitted to the rails 33 and 33. A cylinder 36 is installed in the center of the table base 31, and the axis of the cylinder 36 is connected to the lower surface of the sticking table 30. When the cylinder 36 is driven, the sticking table 30 moves up and down. It should be noted that the inner peripheral table 30a and the outer peripheral table 30b are appropriately moved up and down, and the surface heights of the inner peripheral table 30a and the outer peripheral table 30b are adjusted according to the thickness of the wafer W. be able to. The inner peripheral table 30a includes a plurality of unillustrated take-out pins, and moves up and down when the wafer W is transferred to separate the wafer W from the surface of the inner peripheral table 30a.

  The cutter unit 50 is formed on a support base 51, and the support base 51 is provided with a slider 52 on the lower surface. The slider 52 is slidably fitted to rails 6, 6 laid on the machine base 2. The support base 51 is connected to the drive belt 67 through a notch provided in the support wall 7. Therefore, the cutter unit 50 moves horizontally along the rails 6 and 6 by driving the drive belt 67 by an appropriate drive source (not shown).

  The cutter unit 50 includes two circular cutters 57 and 57, and both the cutters 57 and 57 are respectively supported by two holders provided on a cutter table 56. The circular cutters 57 and 57 are each provided with a predetermined interval (for example, 5 mm in this embodiment) so that two cuts are made in the adhesive tape T with a predetermined interval. ing. In the present embodiment, two circular cutters are used, but various cutting means can be used, and any cutting means can be used as long as it can be cut at an appropriate interval. Further, it is not necessary to provide two cutters, and even one cutter may be moved once by a predetermined interval after cutting, and another cutter may be made. Alternatively, two substrate-shaped blades may be provided on the die cut roller, and an adhesive tape may be sandwiched between the die cut roller to provide two cuts with an appropriate interval. The interval between the two cuts is not limited to the present embodiment depending on the material of the adhesive tape to be used, and various settings can be made.

  A rotation motor 53 is installed on the support base 51, and the rotation motor 53 is connected to a support plate 59. A cylinder 54 is installed on the support plate 59 so as to move the support table 58 up and down, and the cutter unit 50 moves up and down as the support table 58 moves up and down. Further, an elastic member 55 such as a spring is erected on the support table 58, and the cutter table 56 is urged upward by the elastic member 55. Accordingly, when the cutter 57 is raised, the cutter 57 follows the surface of the adhesive tape T and cuts the adhesive tape T with a predetermined depth with an appropriate pressing force.

  A peeling unit 60 is erected adjacent to the cutter unit 50 of the support base 51 so as not to interfere with the cutter unit 50. The peeling unit 60 includes a cylinder 61 erected on the support base 51, a support frame 65 connected to the cylinder 61, and a suction pad 63 fixed to the shaft 62 of the support frame 65. In addition, a disposal box 40 is disposed in the vicinity of the peeling unit 60 to discard an unnecessary part of the original adhesive tape Ta, which will be described later.

  A suction source such as a vacuum pump (not shown) is connected to the suction pad 63 so as to suck unnecessary portions of the original adhesive tape Ta. The shaft 62 is connected to a motor 64 (see FIG. 2) and is rotatable. Unnecessary portions of the sucked original adhesive tape Ta are released by sucking the suction pads 63 after rotating the suction pads 63 toward the disposal box 40 by rotating the shaft 62 by the motor 64. Is discarded in the disposal box 40.

  The above is the configuration of the embodiment of the present invention. Next, a method of cutting the adhesive tape T and removing unnecessary portions will be described with reference to FIGS. 4 to 6. Note that FIGS. 4 to 6 are schematic explanatory views of the holding plate 24 as viewed from below, and are drawn in the upside down direction.

  FIG. 4A shows a state where the adhesive tape T is cut. First, prior to the state shown in FIG. 4A, the upper chuck 21 of the tape chuck unit 19 is closed by the action of the cylinder 22, and the adhesive tape T is held between the peeling roller 20 and the upper chuck 21. Subsequently, while feeding the adhesive tape T with the supply reel 4, a predetermined amount of the adhesive tape T is pulled out with the tape chuck unit 19. The suction plate 24 is lowered by the action of the cylinder 25, and the suction plate 24 sucks and holds the back side of the drawn adhesive tape T.

  Subsequently, the cutter unit 50 is positioned below (upward in the drawing) of the suction plate 24 (may be moved simultaneously with the drawing of the adhesive tape T). Next, the cutter 57 is raised (lowered in the drawing) by the cylinder 54, and the cutter unit 50 is rotated while pressing the cutter 57 against the adhesive tape T as shown in FIG.

  Subsequently, the cutter 57 is turned as shown in FIG. 4B, whereby a first cut 70 slightly smaller than the outer shape of the wafer W and a second cut 71 slightly larger than the outer shape of the wafer W are formed on the adhesive tape T. . The first cut 70 and the second cut 71 are formed only in the original adhesive tape Ta, leaving only the base material Tb of the adhesive tape T.

  Next, as shown in FIG. 5C, the suction pad 64 is positioned so as to face the unnecessary region 73 between the first cut 70 and the second cut 71, and the suction pad 64 is raised (lowered in the drawing). Thus, the suction pad 64 sucks the unnecessary area 73.

  As shown in FIG. 5D, the unnecessary area 73 is peeled from the base material Tb by the suction pad 64 turning downward (turning upward in the drawing). FIG. 6E shows the adhesive tape T from which the unnecessary region 73 has been peeled off. The adhesive tape T is formed with a closed-loop pasting region 72 (original adhesive tape Ta) slightly smaller than the outer shape of the wafer W and a base material Tb exposed in a donut shape on the outer periphery thereof.

  Next, a method for adhering the adhering region 72 (corresponding to the original adhesive tape Ta) formed in FIG. 6E to the wafer W will be described based on FIG. 7 and FIG. It should be noted that FIG. 7 shows the top and bottom as illustrated.

  As shown in FIG. 7A, the sticking table 30 on which the wafer W is held by suction is positioned so as to face the sticking area 72 (original adhesive tape Ta) formed on the adhesive tape T. In the present embodiment, the back surface of the wafer W is held as the top surface. Subsequently, the sensor 23 moves to position the pasting area 72 and the wafer W. In this positioning, the adhesive tape T may be positioned by winding, or may be positioned by moving the sticking table 30 (relative positioning may be performed).

  As shown in FIGS. 7B and 8, the sticking roller 18 is lowered to the sticking start end side, and the sticking roller 18 is pressed and rolled horizontally to press the sticking area 72 against the wafer W. At this time, the wafer W is heated by the heater 37 built in the sticking roller 18. Moreover, you may make it heat the sticking roller 18 suitably. Further, a silicone sheet may be appropriately provided on a portion of the outer sticking table 30 located on the outer periphery of the wafer W, and the adhesive tape T may be closely attached to the surface of the sticking table 30 when the adhesive tape T is stuck. This silicone sheet also acts as a release sheet when the adhesive tape T in the excess portion is peeled off from the sticking table 30.

  At this time, although the adhesive tape T is heated, the original adhesive tape Ta located on the outer peripheral portion of the wafer W is removed as the unnecessary region 73, so that the original adhesive tape Ta attached to the wafer W is melted. However, it does not protrude from the wafer W. Therefore, when the wafer W is mounted on the dicing frame in the next step and the protective tape 74 on the surface is peeled off, the original adhesive tape Ta does not stick to the peeling tape, and the wafer W is not damaged.

  Next, a method for peeling off the excess portion of the adhesive tape T attached to the wafer W from the attaching table 30 will be described with reference to FIGS. 9 (a) and 9 (b).

  FIG. 9A is a schematic explanatory view showing a state where the application of the adhesive tape T to the wafer W is completed and the application roller 18 is retracted. In this state, the surplus portion of the adhesive tape T is stuck to the outer table 30b in the outer peripheral portion of the wafer W.

  Subsequently, as shown in FIG. 9B, the upper chuck 21 is separated from the sticking roller 18 and horizontally moves from the two-dot chain line position to the solid line position, thereby sticking to the sticking table 30 by the pressing of the peeling roller 20. The adhesive tape T is peeled off. The wafer W to which the original adhesive tape Ta is attached is transferred to the next dicing step, for example. By repeating the above operation, the adhesive tape T is sequentially attached to the wafer W.

  The above is one embodiment of the adhesive tape attaching device and the attaching method of the present invention, but can be appropriately changed within the scope of the invention. For example, in the present embodiment, the DAF that needs to be heated for pasting has been described as an example, but a heating adhesive tape other than the DAF can be used. In addition, various tapes that do not require heating can be attached as appropriate. In the embodiment of the present invention, the adhesive tape T is applied to the back side of the wafer W. However, the adhesive tape T may be applied to the front surface of the wafer W. Further, the present invention can be applied not only to a circular wafer but also to a rectangular or various polygonal substrate. In this case, the cutting shape of the cutting means may be changed according to the outer shape of the various substrates. It can also be applied to the case where the protective tape is peeled off from the wafer before mounting on the dicing frame.

  Further, in this embodiment, the suction pad 63 is used for peeling off the unnecessary portion of the original adhesive tape Ta, but instead of the suction pad 63, an unnecessary portion of the original adhesive tape Ta is used by using an adhesive tape or the like. You may make it peel. In this case, the adhesive tape and the unnecessary portion Ta may be wound together, or the unnecessary portion Ta may be separately removed from the adhesive tape. As the peeling unit 60, various peeling methods can be applied as long as unnecessary raw adhesive tape Ta between the first cut 70 and the second cut 71 can be peeled off.

W Wafer (Substrate)
T Adhesive Tape Ta Original Adhesive Tape Tb Substrate 1 Adhesive Tape Attaching Device 2 Machine Base 3 Adhering Unit 3a Substrate 3b Original Adhesive Tape 4 Supply Reel 5 Collection Reel 6 Rail 7 Support Wall 10 Guide Roller 11 Pinch Roller 12a Guide Roller 12b Guide roller 13 Tension roller 14 Pinch roller 15 Tension roller 16 Cylinder 17 Sticking roller 18 Cylinder 19 Tape chuck unit 20 Peeling roller 21 Upper chuck 22 Cylinder 23 Positioning sensor 24 Holding plate 25 Lifting cylinder 26 Guide 30 Sticking table 30a Inner table 30b Outer table 31 Table stand 32 Slider 33 Rail 34 Support frame 35 Slider 36 Cylinder 37 Heater 40 Waste box 41 Drive belt 42 Drive bell G 50 Cutter unit (cutting means)
51 support base 52 slider 53 rotation motor 54 cylinder 55 elastic member 56 cutter base 57 cutter 58 support base 59 support plate 60 peeling unit 61 cylinder 62 shaft 63 suction pad 64 motor 65 support frame 67 belt 70 first cut 71 second cut 72 Pasting area 73 Unnecessary area 74 Protective tape 80 Dicing frame 81 Dicing tape 82 Protective tape 83 DAF (die attach film)
84 Wafer 85 Sticking table 86 Peeling tape 87 Sticking roller

Claims (4)

A tape supply means for feeding an adhesive tape having an original adhesive tape temporarily attached on a base material onto a substrate; and a pressing means for pressing the adhesive tape, wherein the original adhesive tape is passed through the base material. In the adhesive tape affixing device to the substrate that is affixed to the substrate by pressing with the pressing means,
A holding plate for holding the adhesive tape from the substrate side of the adhesive tape;
A first cut formed in the outer shape of the substrate on the original adhesive tape while leaving the base of the adhesive tape facing the holding plate, and formed outside the first cut with an interval from the first cut. Cutting means to form a second cut made;
An affixing table for holding the substrate;
A peeling unit for peeling the original adhesive tape between the first cut and the second cut;
The original adhesive tape formed between the first notch and the second notch is peeled off and then the original adhesive tape formed on the inner side of the first notch is pressed against the substrate and attached to the substrate. Adhesive tape application device.   The said adhesive tape is a heating adhesive tape, The adhesive tape affixing device to the board | substrate of Claim 1 characterized by the above-mentioned. An adhesive tape having an original adhesive tape temporarily attached on a substrate is fed onto the substrate, and the adhesive tape is applied to the substrate by pressing the adhesive tape through the substrate to attach the original adhesive tape to the substrate. In the attaching method,
Holding the adhesive tape with a holding plate from the base material side of the adhesive tape,
Forming the first cut of the outer shape of the substrate in the original adhesive tape leaving the base material of the adhesive tape;
Forming a second cut formed outside the first cut with a gap from the cut in the outer shape;
After peeling the raw adhesive tape between the first cut and the second cut,
A method for attaching an adhesive tape to a substrate, wherein the original adhesive tape inside the first cut is opposed to the substrate, and the original adhesive tape is pressed and attached to the substrate. 4. The adhesive tape according to claim 3, wherein the adhesive tape is a heat adhesive tape, and when the original adhesive tape is pressed against the substrate, at least one of the substrate or the adhesive tape is applied while being heated. A method of attaching adhesive tape to a substrate.

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