CN106409745A - Peeling method and peeling apparatus - Google Patents
Peeling method and peeling apparatus Download PDFInfo
- Publication number
- CN106409745A CN106409745A CN201610607279.9A CN201610607279A CN106409745A CN 106409745 A CN106409745 A CN 106409745A CN 201610607279 A CN201610607279 A CN 201610607279A CN 106409745 A CN106409745 A CN 106409745A
- Authority
- CN
- China
- Prior art keywords
- stripping
- sheet material
- plate
- shaped member
- starting point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/7806—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices involving the separation of the active layers from a substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3512—Cracking
- H01L2924/35121—Peeling or delaminating
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
It is possible to peel off the protective tape (sheet) to be adhered to the semiconductor wafer (plate-like member) without using a tape having a large structure and a large operating cost for the peeling. According to the present application, there is provided a peeling method and a peeling device capable of executing the peeling method, the method comprising at least a first peeling step of bringing the front end portion of the distal needle-like member against the sheet of the plate-like member held by the holding table And a part of which is peeled off from the plate-like member, and a starting point portion generating step of blowing air between the partially peeled sheet and the plate-like member, and generating a portion And a final peeling step, and the peeling starting point is used as a starting point to separate the unintentional residual portion of the sheet from the plate-like member.
Description
Technical field
The present invention relates to the stripping means peeling off the sheet material being pasted onto on the plate-shaped members such as semiconductor wafer fills with peeling off
Put.
Background technology
In the manufacturing process of semiconductor device, the front of the semiconductor wafer of substantially circular plate shape is passed through be configured to
Cancellate segmentation preset lines mark off multiple regions, form the device such as IC, LSI in the region that this marks off.And
And, by grinding attachment, the back side of this semiconductor wafer is carried out grinding and be formed as specify thickness after, pass through
Dicing device, laser processing device etc. cut off this semiconductor wafer thus to the area being formed with device along segmentation preset lines
Domain is split and is produced each semiconductor device.
In order that the semiconductor chip miniaturization such as above-mentioned IC, LSI, preferably make as much as possible in above-mentioned grinding process
The back-thinned of semiconductor wafer (plate-shaped member), in grinding in order to protect the formation of semiconductor wafer to have device
Front and paste the protection band (sheet material) being made up of adhesive film etc..
After grinding process terminates, need to make described protection band peel off from semiconductor wafer, as the stripping of this protection band
From method, be known to the end that the adhesive tape hot pressing peeled off is connected to protection band, this adhesive tape of tractive and make this protection
Band is peeled off from semiconductor wafer, and wherein, this protection band is pasted onto on the front of semiconductor wafer (for example, referring to patent
Document 1,2).
Patent documentation 1：Japanese Unexamined Patent Publication 11-016862
Patent documentation 2：Japanese Unexamined Patent Publication 2003-338477
In the stripping off device of the above-mentioned protection band based on conventional technology, there is a problem of as follows：Due to protection band
The pressing force that produces during because of grinding process and be pasted onto on the front of semiconductor wafer, so becoming when from semiconductor wafer
Front peel off and during protection band, the stripping band playing stronger bonding force pasted in protection band and this stripping is used
Band carries out tractive thus peeling off the structure of protection band, in order to realize this structure, at least need stripping band connecting gear,
The shut-off mechanism of stripping band, the compression joint mechanism of stripping band, construction becomes complicated.And then, also create and ask as follows
Topic：As described above, to peeling off with the band stronger bonding force of requirement, and require it to be resistant to paste securely
The intensity of the stripping process of protection band, the operating cost of the stripping band of this stripping off device using as consumable goodss becomes
High.
And, in above-mentioned conventional technology, there is a problem of as follows：Stripping band is being crimped on protection band
End and after being peeled off, when in discarding the protection band after peeling off to the disposable containers of stripping off device, peel off
Can be attached on side wall of disposable containers etc. with the bonding plane of band, no matter whether the capacity of disposable containers also has residue, stripping
From after protection band can block disposable containers peristome it is impossible to fully utilize disposable containers capacity.
Content of the invention
It is an object of the invention to provide a kind of stripping means and stripping off device, do not use structure or the operating cost of complexity
The protection band (sheet material) being pasted onto on semiconductor wafer (plate-shaped member) just can be shelled by the big band peeled off of burden
From.
In order to solve above-mentioned technical task, according to the present invention, provide a kind of stripping means, will be pasted onto on plate-shaped member
Sheet material peel off from plate-shaped member, wherein, this stripping means includes at least following operation：1st stripping process, makes
The periphery of this sheet material against this plate-shaped member keeping workbench to be kept for the leading section of front end needle-like member is at least
A part, and so that this part is peeled off from this plate-shaped member；Stripping starting point portion generation process, peels off to this part
This sheet material and this plate-shaped member between be blown into air, generate by the extended stripping area comprising this part
The stripping starting point portion being formed；And final stripping process, with this stripping starting point portion as starting point, make the unstripped of this sheet material
Nubbin from this plate-shaped member separate and peeled off.
In above-mentioned stripping means, this stripping means has stripping starting point portion clamping operation, generates in this stripping starting point portion
After operation, this stripping starting point portion being generated is clamped, clamp operation through this stripping starting point and execute this
Whole stripping process.And, in this stripping starting point portion generation process, it is possible to have the 2nd stripping process, to this piece
It is blown into air, after generating stripping starting point portion, further against front end needle-like member between material and this plate-shaped member
Leading section and make stripping area expand.
And then, according to the present invention, provide a kind of stripping off device, it is by the sheet material being pasted onto on plate-shaped member from plate-like portion
Part is peeled off, and wherein, this stripping off device has：Keep workbench, it has the plate-shaped member having pasted this sheet material is entered
The holding face that row keeps；Stripping starting point portion signal generating unit, it makes the leading section of needle-like member against this holding workbench institute
Keep at least a portion of the periphery of this sheet material of this plate-shaped member and make this part from this plate-shaped member peel off, right
It is blown into air between this sheet material of this part stripping and this plate-shaped member, generate by the quilt comprising this part
The stripping starting point portion that the stripping area expanding is formed；Grip unit, it clamps to the stripping starting point portion of this stripping；
Separative element, it makes this grip unit having clamped this stripping starting point portion separate upward with respect to this holding workbench；
Flexing roll, it is viscous to this sheet material peeled off from this plate-shaped member in the lower section of this grip unit having separated upward
Junction side is acted on, and this sheet material is peeled off while bending on peeling direction from this plate-shaped member；And it is mobile
Unit, it makes at least one party in this flexing roll and this holding workbench in the peeling direction parallel with this plate-shaped member
Relatively move, so as this sheet material from this plate-shaped member peel off, by the movement of this mobile unit make this sheet material all from
This plate-shaped member is peeled off.
In above-mentioned stripping off device, have：Sheet material holding unit, it enters to this sheet material peeled off from this plate-shaped member
Row attracting holding；And disposable containers, it is received to the described sheet material after peeling off, is preferably configured as：This sheet material
, after carrying out attracting holding to this sheet material, the mobile surface to this disposable containers, in this disposable containers for holding unit
Surface release the attraction to this sheet material of institute's attracting holding, this sheet material is accommodated in this disposable containers.
The stripping means of the present invention is made up of above-mentioned, is to shell the sheet material being pasted onto on plate-shaped member from plate-shaped member
From stripping means, because this stripping means includes at least：1st stripping process, makes the leading section of front end needle-like member
Against at least a portion of the periphery of this sheet material of this plate-shaped member keeping workbench to be kept, and make this part from
This plate-shaped member is peeled off；Stripping starting point portion generation process, to this sheet material of this part stripping and this plate-shaped member it
Between be blown into air, generate the stripping starting point portion being formed by the extended stripping area comprising this part；And
Final stripping process, with this stripping starting point portion as starting point, the unstripped nubbin making this sheet material is from this plate-shaped member
Separate and peeled off, so not needing the transmission of band peeled off, cut-out, compression joint mechanism it is not necessary to the stripping of high price
From with consumable goodss such as bands, operating cost when executing stripping process can be suppressed.
And then, the stripping off device of the present invention is that the stripping peeling off the sheet material being pasted onto on plate-shaped member from plate-shaped member fills
Put, because this stripping off device has：Keep workbench, it has the plate-shaped member having pasted this sheet material is kept
Holding face；Stripping starting point portion signal generating unit, it makes the leading section of needle-like member be kept against this holding workbench
At least a portion of the periphery of this sheet material of this plate-shaped member and make this part from this plate-shaped member peel off, to this
Point it has been blown into air between this sheet material of stripping and this plate-shaped member, generated by comprising the extended of this part
The stripping starting point portion that stripping area is formed；Grip unit, it clamps to the stripping starting point portion of this stripping；Separate
Unit, it makes this grip unit having clamped this stripping starting point portion separate upward with respect to this holding workbench；Bending
Roller, its bonding plane to this sheet material peeled off from this plate-shaped member in the lower section of this grip unit having separated upward
Side is acted on, and this sheet material is peeled off while bending on peeling direction from this plate-shaped member；And mobile unit,
It makes this flexing roll relative in the peeling direction parallel with this plate-shaped member with least one party in this holding workbench
Ground is mobile, so that this sheet material is peeled off from this plate-shaped member, makes this sheet material all from this plate by the movement of this mobile unit
Shape part peel off, so as described above it is not necessary to peel off the transmission of band, cut-out, compression joint mechanism it is not necessary to
The consumable goodss such as the stripping band of high price, can suppress operating cost when executing stripping process.
And, preferably above-mentioned stripping off device has：Sheet material holding unit, it is to this piece peeled off from this plate-shaped member
Material carries out attracting holding；And disposable containers, it is received to this sheet material after peeling off, and this sheet material holding unit has
There is discard unit, after attracting holding has been carried out to this sheet material, the mobile surface to this disposable containers, useless at this
The surface abandoning container releases the attraction of this sheet material to institute's attracting holding, and this sheet material is accommodated in this disposable containers.
In the stripping off device that the present invention is utilized, due to not using stripping band etc. to have the consumable goodss of cementability, so
Do not exist and be attached to the inlet portion of disposable containers or the worry of inner side surface when being accommodated in this sheet material in disposable containers,
Easily by way of sheet material holding unit is with from the bottom of disposable containers overlap, this sheet material can be discarded, Neng Gouchong
Divide ground using the capacity of disposable containers.
Brief description
Fig. 1 is the axonometric chart of the stripping off device being constituted according to the present invention.
(a), (b), (c) of Fig. 2 is the axonometric chart of the sheet material holding unit illustrating the stripping off device shown in Fig. 1.
Fig. 3 is the axonometric chart illustrating to constitute the scaffold of the flexing roll of stripping off device shown in Fig. 1.
Fig. 4 is the axonometric chart of the stripping starting point portion signal generating unit of the stripping off device shown in Fig. 1.
Fig. 5 is the major part side view of the stripping off device shown in Fig. 1.
Fig. 6 is to illustrate under the state shown in fig. 5, the semiconductor wafer being pasted with protection band to be placed on holding work
The major part side view of the state on platform.
Fig. 7 is to illustrate to make holding movable workbench from the state of Fig. 6 and makes the main of the state of semiconductor wafer movement
Partial side elevation view.
Fig. 8 is to illustrate to make front end needle-like member move and the state close to semiconductor wafer downwards from the state of Fig. 7
Major part side view.
Fig. 9 be illustrate to make from the state of Fig. 8 front end needle-like member with respect to semiconductor wafer against state main
Partial side elevation view.
Figure 10 is to illustrate from the state of Fig. 9 from air nozzle between the released part of protection band and semiconductor wafer
The major part side view of the state of injection air.
Figure 11 is to illustrate to make hold assembly to carry out action from the state of Figure 10 and the outer circumference end to the protection band after peeling off
The major part side view of the state that portion is clamped.
Figure 12 is the master of the state illustrating to make flexing roll mobile from the state of Figure 11 and contacting with the bonding plane of protection band
Want partial side elevation view.
Figure 13 is to illustrate to make flexing roll from the state of Figure 12 and keep movable workbench so that protection band is bent, make stripping
Figure from the state of propulsion.
Figure 14 is the state illustrating to make flexing roll mobile from the state of Figure 13 and making protection band peel off from semiconductor wafer
Figure.
Figure 15 be illustrate from the state of Figure 14 by peel off after protection band attracting holding sheet material holding plate lower surface
State figure.
Figure 16 is the state in the lower surface in sheet material holding plate by protection band attracting holding from the state of Figure 15 that illustrates
Under make the major part side view of the state to disposable containers for the sheet material holding unit movement.
Figure 17 is the figure illustrating to make sheet material holding plate drop to the state in disposable containers from the state of Figure 16.
Label declaration
1：Stripping off device；2：Static base station；3：Keep table mechanism (holding workbench)；4：Sheet material keeps
Unit；5：Flexing roll mobile unit；6：Stripping starting point portion signal generating unit；7：Disposable containers；10：Semiconductor die
Piece (plate-shaped member)；11：Protection band (sheet material)；12：Stripping starting point portion；31、31：Guide rail；32：Mobile base
Platform；36：Workbench main body；41：1st cylinder；44：2nd cylinder；47：3rd cylinder；48：Hold assembly；
55：Flexing roll；61：4th cylinder；64：Front end component；65：Front end needle-like member；66：Air nozzle.
Specific embodiment
Hereinafter, the stripping to the stripping means being constituted according to the present invention and for executing this stripping means referring to the drawings
Preferred embodiment being described in detail of device.
Figure 1 illustrates the axonometric chart of an embodiment of the stripping off device 1 constituting according to the present invention.Diagram
Stripping off device 1 in embodiment has：Static base station 2, keep table mechanism 3, sheet material holding unit 4,
Flexing roll mobile unit 5, stripping starting point portion signal generating unit 6 and disposable containers 7.
As illustrated, described holding table mechanism 3 comprises：Article two, guide rail 31,31, it is on static base station 2
Stripping processing direction of feed (peeling direction) shown in along arrow X arranges；Movable drill base 32, it slides freely
Be disposed on this 2 guide rail 31,31；Ballscrew shaft 33, it moves base along guide rail 31,31 with this
The nut portions engaging of the lower surface of platform 32；Bearing 34, it is in a side of this ballscrew shaft 33 by this ball wire
Thick stick axle 33 rotatably supports；And pulse motor 35, it is used for making this ballscrew shaft 33 in another side
Rotate and make this movable drill base 32 to move in the way of freely moving back and forth in the X direction.
This movable drill base 32 has：Cylindric workbench main body 36, it is disposed in this movable drill base 32；With
And absorption chuck 37, it is disposed in the upper surface of this workbench main body 36.Absorption chuck 37 is by porous ceramic film material
Formed and be connected with attraction unit (not shown), suitable negative pressure is produced on the surface of this absorption chuck 37.Therefore,
Carry out action and the plate-like portion of the composition present invention on absorption chuck 37 will be positioned in by making attraction unit (not shown)
Semiconductor wafer 10 attracting holding of part is on absorption chuck 37.
Shown in (a) as shown in Figure 1, Figure 2～(c), sheet material holding unit 4 is disposed on static base station 2, this piece
Material holding unit 4 has：1st cylinder 41, its setting is arranged on this static base station 2；And keep pedestal 43,
It is supported by the axle 42 extending from the 1st cylinder 41.This holding pedestal 43 is equipped：2nd cylinder 44,
It erects setting on an upper；Sheet material holding plate 46, it is by from the 2nd cylinder 44 insertion to holding pedestal 43
Lower face side and the axle 45 free to advance or retreat of the 2nd cylinder 44 support；3rd cylinder 47, it is disposed in this holding
On pedestal 43, in end, there is holding piece 48a and there is axle free to advance or retreat in the horizontal direction；And holding piece
48b, it is located at the described lower face side keeping pedestal 43, configures in the position relative with this holding piece 48a, with folder
Hold piece 48a and constitute grip unit 48 together.
Described sheet material holding plate 46 is configured to inner hollow, is provided with multiple (not shown) in the entire surface of lower surface
Micropore, be configured to by inside the axle that the 2nd cylinder 44 and sheet material holding plate 46 are linked to sheet material holding plate
Attracted inside 46, by described micropore, negative pressure can be produced on sheet material holding plate lower surface.
Described holding pedestal 43 is configured to move up and down together with axle 42, and this axle 42 is in the way of can retreating
Driven by described 1st cylinder 41, and then, as shown in the arrow in (b) of Fig. 2, keep the pedestal 43 can be with
Rotate in the horizontal direction centered on this axle 42.In addition, by making this holding pedestal 43 from positioned at guide rail 31,31
On (a) of Fig. 2 be positioned against the position shown in (b) of Fig. 2 according to being rotated clockwise, can be by institute
State the surface of the mobile disposable containers 7 to the vicinity being arranged on static base station 2 of sheet material holding plate 46.
As shown in figure 3, described flexing roll mobile unit 5 is made up of the scaffold 51 in gate shape, this supporting
Framework 51 has：Post portion 52,52, it sets at spaced intervals side by side along the guide rail 31,31 on supporting base station 2
Put；Support 53, the upper end in this post portion 52,52 is linked by it；And flexing roll 55, it is located at this by interior
Drive mechanism (not shown) in bearing portion 53 is mobile along the bullport 54 of this support 53.This flexing roll 55 can
Around the axle central rotation of length direction, at least than the sheet material being pasted onto on semiconductor wafer 10 and constituting the present invention
The diameter of protection band 11 is long, and, is coated with fluororesin on the front face so that the bonding plane of the protection band after peeling off
Will not adhere to.
As shown in figure 4, described stripping starting point portion signal generating unit 6 comprises：4th cylinder 61；Axle 62, its from this
4 cylinder 61 extends and in the way of freely retreating, the position in short transverse can be micro-adjusted；Arm member 63；
And front end component 64, it is arranged on the leading section of this arm member 63 and has front end needle-like member 65 and air spray
Mouth 66.By this structure, front end component 64 is configured to move up and down, and is configured to high by adjusting it
The leading section of needle-like member is positioned at the height and position of the protection band on this plate-shaped member by degree position.And, air
Nozzle 66 is configured to supply air via the 4th cylinder 61, axle 62 to it, and can spray air as needed.
As described in Fig. 1, disposable containers 7 are configured to configure the sheet material holding unit 4 in static base station 2
Vicinity, be formed as the open cylindrical shape in top, and be formed as the protection band 11 using than being cut into circular shape
A big circle, can will be layered in container by this protection band 11 that the stripping off device of the present invention is peeled off.
Stripping off device 1 in embodiment illustrated by constituting as indicated above, with reference to Fig. 5 to 17 1
While it is acted on illustrating.In addition, Fig. 5 to Figure 15 is the major part side view of the stripping off device 1 of Fig. 1,
In order to easy to understand, action is illustrated, suitably eliminate static base station 2, scaffold 51, the 1st cylinder
41st, the structure with action specification no direct relation such as the 4th cylinder 61, motor 35.
In this stripping off device 1, proceeding by the stripping that the protection band 11 being pasted onto on semiconductor wafer 10 is peeled off
From operation when, first, as shown in figure 5, make movable drill base 32 keep table mechanism 3 guide rail 31,31
On standby in position of readiness (on the right side of in figure), and using the 2nd cylinder 44, sheet material holding plate 46 is promoted to and goes up most
The position of position.And, flexing roll 55 is positioned in the position of readiness side leaning on movable drill base 32 than air nozzle 66.
As shown in Figure 5,6, first, the semiconductor wafer 10 that front is pasted with protection band 11 is placed on movement
On the absorption chuck 37 of the workbench main body 36 of base station 32.Now, by adsorb chuck 37 dorsal part space with not
The attraction unit of diagram links and produces negative pressure on absorption chuck 37, and semiconductor wafer 10 is attracted and is fixed on absorption
On chuck 37, wherein, this absorption chuck 37 is made up of porous ceramic film material, is formed as ventilating between the positive back side.
After being fixed on semiconductor wafer 10 on absorption chuck 37, driving pulse motor 35 simultaneously makes ball wire
Thick stick axle 33 rotates, and thus, so that this movable drill base 32 is moved along guide rail 31 from the position of readiness of Fig. 6 and protects to sheet material
Hold unit 4 and the lower section of stripping starting point portion signal generating unit 6.Now, it is pasted onto the protection band on semiconductor wafer 10
The somewhat Outboard Sections of 11 peripheral end are positioned in the front end needle-like member 65 of stripping starting point portion signal generating unit 6
The underface (with reference to Fig. 7) of front end.
(the 1st stripping process)
The somewhat Outboard Sections of the peripheral end of semiconductor wafer 10 are being positioned at stripping starting point portion signal generating unit 6
After the underface of front end needle-like member 65, the 4th cylinder 61 action is made to make the leading section of front end needle-like member 65
Drop to the position (with reference to Fig. 8) of the peripheral end of protection band 11 close to semiconductor wafer 10.
Front according to this protection band 11 is highly micro-adjusted to the height of the leading section of this front end needle-like member 65,
So that the front end of front end needle-like member 65 is close to the outer peripheral portion of the protection band 11 of semiconductor wafer 10, in this front end
In the state of portion is close, this movable drill base is moved slightly towards in figure right, thus, this front end needle-like member 65
Front end is resisted against the outer peripheral portion (with reference to Fig. 9) of this protection band 11.Furthermore it is possible to as shown in Figure 9 from protection band 11
Outer circumferential against this leading section it is also possible to from the top of the outer peripheral portion of this protection band 11 against this leading section.
And, after this leading section is resisted against the outer peripheral portion of this protection band 11, make the 4th cylinder 61 enter action
Make, so that this front end needle-like member 65 is somewhat increased and so that this movable drill base is moved to the right further, thus, should
A part for the outer peripheral portion of protection band 11 is peeled off well.
(stripping starting point portion generation process)
After this part of this protection band 11 is stripped, as shown in Figure 10, this fore-end 64 is made to increase,
And spray pressure-air from air nozzle 66, thus, the outer peripheral portion of this protection band 11 is from this front end needle-like member
65 leading section departs from, this part of stripping area of stripping before comprising in the outer peripheral portion of this protection band 11
Domain expands, and generates the stripping starting point portion 12 being suitable for being clamped by grip unit 48 described later.In addition, to stripping starting point
The height of this holding pedestal 43 in portion's generation process is adjusted, so that when this stripping starting point portion 12 is by from air
When the pressure-air of nozzle 66 is peeled off, this stripping starting point portion 12 is in the clamping list being arranged on this holding pedestal 43
Between holding piece 48a, 48b of unit 48.Alternatively, it is also possible to pressure-air is being sprayed by described air nozzle 66
And when so that stripping area is expanded, make further used in the 1st above-mentioned stripping process front end needle-like member 64 against.
So, generate stripping starting point portion well.
(final stripping process)
When the peripheral end of described protection band 11 is started by the pressure-air from air nozzle 66, temporarily cease this
Movable drill base 32, towards the movement in position of readiness direction, makes hold assembly 48a move by the action of the 3rd cylinder 47
To hold assembly 48b side, (ginseng is clamped by the peripheral end of the protection band 11 to stripping for the grip unit 48
According to Figure 11).Then, make the 1st cylinder 41 action, thus, so that flexing roll 55 can be made to enter grip unit 48
The degree of lower section make that sheet material holding unit 4 is overall to be moved upward.
While making described sheet material holding unit 4 be moved upward and so that movable drill base 32 is moved to standby direction,
Bullport 54 along the support 53 of the scaffold 51 of described gate makes flexing roll 55 mobile single to sheet material holding
First 4 sides (with reference to Figure 12).In addition, for flexing roll 55, in order to protection band 11 with respect to half
The bonding surface side of conductor chip 10 abuts while making stripping advance, and is coated with fluororesin in its surface and allows it to
Around the axle central rotation of length direction and the bonding plane of the protection band 11 being contacted will not adhere to thereon.
Although in the present embodiment, the protection band 11 on semiconductor wafer 10 is towards the direction (in figure peeled off
Left) double flat (with reference to Figure 13), but this bending angle it is not absolutely required to as 180 degree.But, partly lead
The back side of body chip 10 is ground and is formed as very thin tabular, can exist when this bending angle is less to work as and be protected
Cause the worry of rupture, the breakage of semiconductor wafer 10 etc. during the stripping of protecting band 11, so as much as possible preferably 180
Degree or the angle close with 180 degree are being bent.
When the other end of flexing roll 55 movement to the in figure left side of sheet material holding plate 46 lower surface, protection band
11 are completely exfoliated (with reference to Figure 14) from semiconductor wafer 10.So, final stripping process completes.
As shown in figure 15, when the protection band 11 after peeling off is deployed in the lower surface of sheet material holding plate 46, by not
The unit that attracts of diagram is carried out to the inside of the sheet material holding plate 46 being formed as hollow and being provided with micropore on the lower surface
Attract, attracting holding is carried out to the protection band 11 after peeling off.And, movable drill base 32 and flexing roll 55 are mobile extremely
The position of readiness being positioned when stripping process starts, and by the action of the 3rd cylinder 47 make grip unit 48a with
Another grip unit 48b separates and the peripheral end of release guard band 11.
Next, according to Fig. 2,16,17, discarding to then described stripping process, by the protection band 11 after peeling off
Discarded operation to disposable containers 7 illustrates.
As previously mentioned, the protection band 11 peeled off from semiconductor wafer 10 is positioned static in sheet material holding plate 46
It is attracted to maintain in the state of the top of guide rail 31,31 of base station 2.
From this state, keep by protection band 11 attracting holding in sheet material holding plate 46 state unchangeably, make the 1st
The axle 42 of cylinder 41 turns clockwise around vertical view, this sheet material holding plate 46 is positioned at the surface of disposable containers 7,
Wherein, this disposable containers 7 is disposed in the vicinity (with reference to (b), Figure 16 of Fig. 2) of static base station 2.In addition, figure
16th, 17 be from static base station 2 arranged the unilateral observation of disposable containers to side view, for convenience of explanation,
Illustrate only sheet material holding unit 4 and disposable containers 7, disposable containers 7 are sectional view.
After sheet material holding plate 46 is positioned at the surface of disposable containers 7, the 2nd cylinder 44 action is made to make piece
Material holding plate 46 drops to (with reference to Figure 17) in disposable containers 7.For lower end position during this decline, can make
Made according to the stratification level of discarded protection band 11 with the horizon sensor (not shown) being arranged in disposable containers 7
Its suitably change is it is also possible to make it change according to the number that discarded number is counted and counted out.
After making sheet material holding plate 46 drop in disposable containers, stop being derived from sheet material holding plate 46 in bottom
The micropore of lower surface attraction, so that protection band 11 is fallen.Now, can be by making air from sheet material holding plate 46
Lower surface micropore spray and more reliably execute the disengaging of protection band 11.And, by disposable containers 7
The amount that horizon sensor detects the protection band 11 after the stripping being layered in disposable containers to specify is stored in discarded appearance
In the case of in device, or in the case that the number counting out has reached the amount of regulation, to promote to being stored in discarded appearance
The discarded mode of the protection band 11 in device 7 executes following measures：Produce to this stripping off device operator notify
Alarm song, light warning light etc..
Stripping off device based on the present invention, by constituting as indicated above, can need to carry out the stripping of protection band
Widely utilize in various fields, and easy use, due to not using the consumable goodss such as the band peeled off, it is possible to
So that the mode that this stripping off device complicates is constituted, and, due to can efficiently will stripping protection band stacking useless
Abandon in disposable containers, it is possible to fully utilizing the capacity of disposable containers.
In addition, though plate-shaped member is set to semiconductor wafer in above-mentioned embodiments of the present invention, but do not limit
In this, for example, it is being used as plate-shaped member using sapphire substrate and protection band is being pasted onto on this sapphire substrate
When situation is inferior, as long as being used in the plate-shaped member of the part of pasted sheet-shaped on front and so that the part of lamellar is peeled off
Situation, then can be suitable for the present application.
Claims (6)
1. a kind of stripping means, the sheet material being pasted onto on plate-shaped member is peeled off from plate-shaped member, wherein, this stripping
Method includes at least following operation：
1st stripping process, the leading section making front end needle-like member is against this plate-shaped member keeping workbench to be kept
At least a portion of the periphery of this sheet material, and so that this part is peeled off from this plate-shaped member；
Stripping starting point portion generation process, is blown into air between this sheet material to this part stripping and this plate-shaped member,
Generate the stripping starting point portion being formed by the extended stripping area comprising this part；And
Final stripping process, with this stripping starting point portion as starting point, the unstripped nubbin making this sheet material is from this tabular
Isolation of components and peeled off.
2. stripping means according to claim 1, wherein,
This stripping means has stripping starting point portion clamping operation, after this stripping starting point portion generation process, to being generated
This stripping starting point portion clamped, through this stripping starting point clamp operation and execute this final stripping process.
3. stripping means according to claim 1 and 2, wherein,
In this stripping starting point portion generation process, make the leading section of front end needle-like member further against and expanding stripping
Region.
4. a kind of stripping off device, the sheet material being pasted onto on plate-shaped member is peeled off by it from plate-shaped member, wherein, this stripping
Have from device：
Keep workbench, it has the holding face that the plate-shaped member having pasted this sheet material is kept；
Stripping starting point portion signal generating unit, it makes this tabular that the leading section of needle-like member is kept against this holding workbench
At least a portion of the periphery of this sheet material of part and make this part from this plate-shaped member peel off, this part is shelled
From this sheet material and this plate-shaped member between be blown into air, generate by the extended stripping area comprising this part
The stripping starting point portion that domain is formed；
Grip unit, it clamps to the stripping starting point portion of this stripping；
Separative element, it makes this grip unit having clamped this stripping starting point portion divide upward with respect to this holding workbench
From；
Flexing roll, it is in the lower section of this grip unit having separated upward to this sheet material peeled off from this plate-shaped member
Bonding surface side acted on, this sheet material is peeled off bending on peeling direction on one side from this plate-shaped member；And
Mobile unit, it makes at least one party in this flexing roll and this holding workbench in the stripping parallel with this plate-shaped member
Relatively move on direction, so that this sheet material is peeled off from this plate-shaped member,
This sheet material is made all to peel off from this plate-shaped member by the movement of this mobile unit.
5. stripping off device according to claim 4, wherein,
This stripping off device has sheet material holding unit, and this sheet material holding unit is to this sheet material peeled off from this plate-shaped member
Carry out attracting holding.
6. the stripping off device according to claim 4 or 5, wherein,
This stripping off device has disposable containers, and this disposable containers is received to the described sheet material after peeling off, and this sheet material is protected
Hold unit after attracting holding has been carried out to this sheet material, the mobile surface to this disposable containers, in this disposable containers
Surface release the attraction to this sheet material of institute's attracting holding, this sheet material is accommodated in this disposable containers.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015-150397 | 2015-07-30 | ||
| JP2015150397A JP6580408B2 (en) | 2015-07-30 | 2015-07-30 | Peeling method and peeling device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106409745A true CN106409745A (en) | 2017-02-15 |
| CN106409745B CN106409745B (en) | 2021-10-29 |
Family
ID=57986353
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610607279.9A Active CN106409745B (en) | 2015-07-30 | 2016-07-28 | Peeling method and peeling apparatus |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6580408B2 (en) |
| KR (1) | KR102391268B1 (en) |
| CN (1) | CN106409745B (en) |
| TW (1) | TWI720992B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108630582A (en) * | 2017-03-22 | 2018-10-09 | 株式会社迪思科 | Band stripping off device |
| CN110416114A (en) * | 2018-04-26 | 2019-11-05 | 株式会社迪思科 | Band stripping off device |
| CN111498579A (en) * | 2019-01-30 | 2020-08-07 | 日机装株式会社 | Stripping device |
| CN115458468A (en) * | 2022-11-11 | 2022-12-09 | 扬州韩思半导体科技有限公司 | Semiconductor wafer laser cutting device and method |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6960626B2 (en) | 2017-06-20 | 2021-11-05 | トヨタ自動車九州株式会社 | Film pasting device and film pasting method |
| JP6975056B2 (en) * | 2018-01-29 | 2021-12-01 | 株式会社ディスコ | Transport mechanism |
| KR102369893B1 (en) * | 2021-09-29 | 2022-03-03 | 오토이엠 주식회사 | Insulation sheet attachment device for top frame used in electric vehicle battery case |
| CN115339219B (en) * | 2022-08-16 | 2024-03-19 | 迈为技术(珠海)有限公司 | Stripping device and stripping method thereof |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09309664A (en) * | 1996-05-20 | 1997-12-02 | Sony Corp | Protective sheet peeling method and peeling device used therefor |
| CN1260779C (en) * | 2001-06-11 | 2006-06-21 | 日东电工株式会社 | Method and device for removing useless materials from semiconductor wafers |
| EP1777734A2 (en) * | 2005-10-14 | 2007-04-25 | Tokyo Seimitsu Co.,Ltd. | Method and apparatus for peeling a surface protective film |
| CN1977371A (en) * | 2004-06-25 | 2007-06-06 | 琳得科株式会社 | Sheet peeling device and method |
| CN101060068A (en) * | 2006-04-18 | 2007-10-24 | 日东电工株式会社 | Method for separating protective tape, and apparatus using the same |
| CN101404241A (en) * | 2007-10-04 | 2009-04-08 | 日东电工株式会社 | Protective tape separation method and apparatus using the same |
| JP2009295757A (en) * | 2008-06-04 | 2009-12-17 | Tateyama Machine Kk | Method and device for peeling protective tape |
| JP2010206088A (en) * | 2009-03-05 | 2010-09-16 | Tateyama Machine Kk | Tape peeling device |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4204653B2 (en) * | 1997-06-20 | 2009-01-07 | リンテック株式会社 | Sheet peeling apparatus and method |
| JP4060641B2 (en) * | 2002-05-22 | 2008-03-12 | 株式会社ディスコ | Tape peeling method |
| US7846288B2 (en) * | 2006-05-10 | 2010-12-07 | Micron Technology, Inc. | Methods and systems for removing protective films from microfeature workpieces |
| JP2012224469A (en) * | 2011-04-22 | 2012-11-15 | Mitsubishi Electric Corp | Film stripping method and film stripping device |
-
2015
- 2015-07-30 JP JP2015150397A patent/JP6580408B2/en active Active
-
2016
- 2016-06-22 TW TW105119566A patent/TWI720992B/en active
- 2016-07-18 KR KR1020160090555A patent/KR102391268B1/en active IP Right Grant
- 2016-07-28 CN CN201610607279.9A patent/CN106409745B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09309664A (en) * | 1996-05-20 | 1997-12-02 | Sony Corp | Protective sheet peeling method and peeling device used therefor |
| CN1260779C (en) * | 2001-06-11 | 2006-06-21 | 日东电工株式会社 | Method and device for removing useless materials from semiconductor wafers |
| CN1977371A (en) * | 2004-06-25 | 2007-06-06 | 琳得科株式会社 | Sheet peeling device and method |
| EP1777734A2 (en) * | 2005-10-14 | 2007-04-25 | Tokyo Seimitsu Co.,Ltd. | Method and apparatus for peeling a surface protective film |
| CN101060068A (en) * | 2006-04-18 | 2007-10-24 | 日东电工株式会社 | Method for separating protective tape, and apparatus using the same |
| CN101404241A (en) * | 2007-10-04 | 2009-04-08 | 日东电工株式会社 | Protective tape separation method and apparatus using the same |
| JP2009295757A (en) * | 2008-06-04 | 2009-12-17 | Tateyama Machine Kk | Method and device for peeling protective tape |
| JP2010206088A (en) * | 2009-03-05 | 2010-09-16 | Tateyama Machine Kk | Tape peeling device |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108630582A (en) * | 2017-03-22 | 2018-10-09 | 株式会社迪思科 | Band stripping off device |
| TWI752197B (en) * | 2017-03-22 | 2022-01-11 | 日商迪思科股份有限公司 | Tape peeling device |
| CN108630582B (en) * | 2017-03-22 | 2024-02-02 | 株式会社迪思科 | Tape stripping device |
| CN110416114A (en) * | 2018-04-26 | 2019-11-05 | 株式会社迪思科 | Band stripping off device |
| CN110416114B (en) * | 2018-04-26 | 2024-02-20 | 株式会社迪思科 | Tape stripping device |
| CN111498579A (en) * | 2019-01-30 | 2020-08-07 | 日机装株式会社 | Stripping device |
| CN111498579B (en) * | 2019-01-30 | 2024-03-19 | 日机装株式会社 | Stripping device |
| CN115458468A (en) * | 2022-11-11 | 2022-12-09 | 扬州韩思半导体科技有限公司 | Semiconductor wafer laser cutting device and method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2017034015A (en) | 2017-02-09 |
| CN106409745B (en) | 2021-10-29 |
| JP6580408B2 (en) | 2019-09-25 |
| TWI720992B (en) | 2021-03-11 |
| KR20170015156A (en) | 2017-02-08 |
| TW201724337A (en) | 2017-07-01 |
| KR102391268B1 (en) | 2022-04-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106409745A (en) | Peeling method and peeling apparatus | |
| US10566319B2 (en) | Apparatus for direct transfer of semiconductor device die | |
| KR101066510B1 (en) | Method for attaching and peeling pressure-sensitive adhesive sheet, and attaching apparatus of pressure-sensitive adhesive sheet and peeling apparatus of pressure-sensitive adhesive sheet | |
| KR20160018401A (en) | Method and apparatus for separating adhesive tape | |
| CN101529575A (en) | Chip pickup method and chip pickup apparatus | |
| JP2007109869A (en) | Transfer device and transfer method | |
| JP2003209082A (en) | Sticking method for protecting tape, device therefor and releasing method for protecting tape | |
| TWI419217B (en) | Device manufacturing method | |
| KR102464297B1 (en) | Adhesion method of protective tape and adhesion apparatus for protective tape | |
| JP6695173B2 (en) | Substrate transfer method and substrate transfer apparatus | |
| JP2017191810A (en) | Peeling method of protective tape | |
| CN109103126A (en) | Paster apparatus and method of attaching | |
| JP4632313B2 (en) | Pasting device and pasting method | |
| CN113799402A (en) | Assembly equipment | |
| JP2009032853A (en) | Sheet pasting apparatus and pasting method | |
| TW201622038A (en) | Method and apparatus for separating protective tape | |
| TWI663045B (en) | Coating method for protecting film | |
| JP5135085B2 (en) | Foil deburring device | |
| JP2003197715A (en) | Equipment for pasting semiconductor chip to reel tape | |
| JP2008159829A (en) | Sheet attacher and attachment method | |
| JP4108628B2 (en) | Plate separator | |
| JP2011129807A (en) | Tape sticking device | |
| JP2003228057A (en) | Polarizing plate feeding device | |
| JP6521739B2 (en) | Peeling device | |
| JP4600831B2 (en) | Plate-like material separating apparatus and plate-like material separating method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |