JP2009295757A - Method and device for peeling protective tape - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method and a device for peeling a protective tape, which can accurately peel off a protective film without using a peeling tape, can keep high workability without increasing wastes and causes no damage to a semiconductor wafer. <P>SOLUTION: The tape peeling device is provided with a table 15 wherein a semiconductor wafer 12 with a protective tape 14 adhered to its surface is placed. It is also provided with a peeling piercing projection 26 to be inserted into the end face of the protective tape 14, a peeling portion 22 for holding the peeling piercing projection 26, a movable base 18 for elevating the peeling portion 22, and a base mount 16 wherein the movable base 18 is provided in freely movable manner in the horizontal direction. A pinching portion 28 is provided in the peeling portion 22 to pinch the protective tape 14 peeled by the peeling piercing projection 26. The end edge of the protective tape 14 is rolled up by the peeling piercing projection 26, and the rolled-up end edge of the protective tape 14 is pinched and held by the pinching portion 28. The movable base 18 is moved to peel of the protective tape 14 from the semiconductor wafer 12. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a protective tape peeling method and apparatus for peeling off and removing a protective tape attached to a semiconductor wafer.

  In the manufacture of semiconductor devices such as ICs, wafers with large bumps and the like formed on the wafer surface as the density of semiconductors has increased in recent years, and wafers with large bumps on the surface such as MEMS (microelectromechanical system) Has increased. On the other hand, with the progress of miniaturization and thinning of semiconductor packages, there is a demand for thinning of semiconductor wafers themselves.

  Therefore, in the semiconductor product manufacturing process, each functional element is subjected to a polishing (back grind) process for polishing and thinning the back surface of the semiconductor wafer having a large number of circuit patterns and elements formed on the surface as described above. Each semiconductor chip is divided through a dicing process for cutting every time. Here, when polishing or etching the back surface of the semiconductor wafer, an adhesive protective tape is applied to the surface of the semiconductor wafer to protect the surface of the semiconductor wafer, and the protective tape is peeled off from the semiconductor wafer after polishing. The

  Conventionally, as disclosed in Patent Document 1, the protective tape is peeled off by applying a peeling tape on the protective tape attached to the surface of the semiconductor wafer using an edge member or the like and pulling the peeling tape. As a result, the protective tape was peeled off from the surface of the semiconductor wafer.

Further, as disclosed in Patent Document 2, a needle having a sharp tip perpendicular to the surface of the protective tape is hooked on the peripheral edge of the surface of the semiconductor wafer to which the protective tape is affixed. An apparatus has also been proposed in which a part of the protective tape is peeled off by moving the needle in parallel with the needle. This apparatus also peels off the protective tape from the surface of the semiconductor wafer by attaching the peeling tape to the peeling portion of the protective tape and peeling the peeling tape from the peeling portion as a base point.
JP 2007-43047 A JP 2007-31735 A

  When a protective tape is peeled off by applying a peeling tape as in Patent Document 1, a peripheral portion that is not in an arc shape is used as a trigger for peeling, such as a notch portion or an orientation flat portion of a semiconductor wafer. This is because the notch portion and orientation flat portion partially have non-bonded portions compared to the arc-shaped peripheral edge portion of the semiconductor wafer, and the bonded state is weak and easy to peel off.

  However, in order to peel off the protective tape from the notch part or orientation flat part of the semiconductor wafer, it is necessary to locate the part, which complicates the peeling device and takes work time. Furthermore, the method using a release tape requires a separate release tape for peeling off the protective tape, which increases the waste and increases the environmental load. Further, since the protective tape is peeled off after polishing the semiconductor wafer, polishing powder or the like is attached to the surface of the protective tape, the adhesiveness of the peeling tape is lowered, and peeling mistakes are likely to occur.

  Also, the peeling method disclosed in Patent Document 2 has the same problem as described above in that a peeling tape is used. Further, when the needle is hooked on the protective tape in order to create a trigger for peeling, the needle is a semiconductor. Since it is oriented perpendicular to the wafer, the surface of the semiconductor wafer may be damaged depending on the position of the tip of the needle.

  The present invention has been made in view of the above-mentioned problems of the prior art. The protective tape can be accurately peeled off without using a peeling tape, the waste does not increase, the workability is good, and the semiconductor wafer is damaged. It is an object of the present invention to provide a method and apparatus for peeling off a protective tape that does not occur.

  The present invention is a tape peeling method for peeling off a protective tape attached to the surface of a semiconductor wafer, piercing a peeling puncture protrusion on an end surface of the protective tape, and rolling up an edge of the protective tape, A tape peeling method for peeling the protective tape from the semiconductor wafer.

  Furthermore, the present invention provides a tape peeling method for peeling off a protective tape attached to the surface of a semiconductor wafer, and a puncture protrusion for peeling is pierced on an end surface of the protective tape, and the edge of the protective tape is rolled up. Then, an insertion portion is inserted between the edge portion of the protective tape and the semiconductor wafer, and the protective tape is sandwiched between the insertion portion and a holding portion provided on the opposite side of the protective tape. And the tape is peeled off from the semiconductor wafer in this state.

  Furthermore, before peeling off the protective tape, the tip position of the peeling puncture protrusion is measured in advance, and the peeling puncture protrusion is inserted into the end face of the protective tape.

  Further, the present invention is a tape peeling apparatus that includes a table on which a semiconductor wafer having a protective tape affixed is mounted, and that peels off the protective tape on the surface of the semiconductor wafer, the peeling being inserted into the end face of the protective tape Puncture protrusion, a peeling part holding the peeling puncture protrusion, a movable base for raising and lowering the peeling part, a base provided with the movable base movably in a horizontal direction, and the peeling part A holding portion for holding the protective tape peeled off by the peeling puncture protrusion, and the edge portion of the protective tape is rolled up by the peeling puncture protrusion, and the raised edge portion of the protective tape is It is a tape peeling apparatus which is held by the holding part and moves the movable base to peel off the protective tape from the semiconductor wafer.

  The peeling part is provided with a plurality of peeling puncture protrusions, the insertion part formed in a comb-blade shape is located between the peeling puncture protrusions, and the protection is raised by the peeling puncture protrusions The insertion part is inserted into the back side of the tape, the protective tape edge is sandwiched between the insertion part and the holding part, and the protective tape is peeled off.

  Moreover, it is preferable that the peeling puncture protrusion is formed with a return protrusion that engages with the back surface of the protective tape, and an anti-slip material such as an uneven surface or a rough surface.

  Further, a heating means for heating the protective tape may be provided to reduce the adhesiveness of the protective tape and facilitate peeling.

  Further, a measurement block for measuring the tip position of the peeling puncture protrusion, and a moving distance from the position of the peeling puncture protrusion measured by the measurement block to the position of the end face of the protective tape into which the peeling puncture protrusion is inserted Is provided with computing means for computing.

  The measuring means includes a non-contact sensor that detects the measurement block and the surface position of the protective tape, measures the surface position of the protective tape with the non-contact sensor, and uses the computing means to perform the peeling puncture. The movement distance to the position of the end face of the protective tape into which the protrusion is inserted is calculated.

  According to the protective tape peeling method and apparatus of the present invention, the protective tape affixed to the surface of the semiconductor wafer is accurately partly peeled and held and peeled by the clamping part, so that the peeling tape is peeled off reliably. In addition, there is no increase in waste, and environmental load can be suppressed and the protective tape can be efficiently peeled off. In addition, the working time can be shortened, the type of the peeling tape can be easily selected regardless of the type of the protective tape, and the cost can be reduced.

  Hereinafter, an embodiment of a tape peeling apparatus of the present invention will be described with reference to FIGS. The tape peeling apparatus 10 of this embodiment is used for peeling the protective tape 14 attached to the surface of the semiconductor wafer 12. As shown in FIG. 1, the configuration of the tape peeling apparatus 10 of this embodiment includes a base 16 and a mounting portion 16 a provided in the horizontal direction above the base 16. Furthermore, it comprises a movable base 18 provided on the base 16 and movable in the horizontal direction, and an elevating unit 20 provided on the movable base 18 and provided so as to be movable in the vertical direction. The elevating part 20 is provided with a peeling part 22 for peeling the protective tape 14.

  The movable table 18 is provided so as to be movable on a pair of guide rails (not shown) on the base 16 by a motor (not shown). Further, on the side of the base 16, a sensor rail 17 that detects the moving distance of the movable base 18 is provided. The elevating unit 20 is provided so as to be able to move up and down along a guide rail 21 provided on the movable table 18, and a driving device such as a motor 23 and a ball screw 25 for moving up and down is provided on the movable table 18.

  As shown in FIG. 2, the peeling portion 22 is located between the insertion portion 24 that protrudes in a comb-like shape in the horizontal direction, and protrudes obliquely with respect to the protruding direction of the insertion portion 24. The plurality of peeling puncture protrusions 26 are arranged in the horizontal direction at equal intervals. As shown in FIG. 3, a return protrusion 26 a that pierces the protective tape 14 is formed on the upper surface of the peeling puncture protrusion 26. Further, in addition to the return protrusion 26a, a non-slip portion such as an uneven portion or a rough surface may be formed. On the upper side in the vertical direction of the insertion portion 24 and the peeling puncture protrusion 26, a holding portion 28 that holds the protective tape 14 by the insertion portion 24 is urged downward in the closing direction by a coil spring 29 so as to be swingable. Is provided.

  A portion where the peeling puncture protrusion 26 is located is cut out in an arc shape in the holding portion 28 to form a recess 30. Further, the sandwiching portion 28 is formed in an L shape, and is provided so as to be swingable around the swing center 28b as shown in FIG. And the clamping part 28 is comprised so that the protection tape 14 can be clamped between the front-end | tip part 28a and the front-end | tip part 24a of the insertion part 24. As shown in FIG. Two types of strong and weak springs (not shown) are provided on the side of the swing center 28b, and a cam follower 33 provided on the movable base 18 along the fixed cam member 31 shown in FIG. However, it is energized by a strong spring (not shown) and rotates following it to open and close the clamping unit 28.

  As shown in FIG. 3, a measurement block 30 that detects the position of the peeling puncture protrusion 26 of the peeling portion 22 as a distance from the origin of the movable base 18 is fixed to the base 16.

Next, operation | movement of the tape peeling apparatus 10 of this embodiment is demonstrated. First, as shown in FIG. 3, the distance Do from the origin O of the movable base 18 is measured in order to position the peeling puncture protrusion 26 of the peeling portion 22. This is performed in order to detect and correct a slight misalignment of the peeling puncture protrusion 26 due to bending of the peeling puncture protrusion 26 or the like. When the peeling puncture protrusion 26 comes into contact with the measurement block 30, an electric current is passed between the peeling puncture protrusion 26 and the measurement block 30 to detect contact, and the position is set as a distance Do from the origin O. As a result, the position where the peeling puncture protrusion 26 pierces the end face of the protective tape 14 is calculated. This calculation is based on the following equation (1) as shown in FIG. The descending amount D1 from the origin O to the piercing position is:
D1 = Do−Bo−Tw−Tt + To (1)
Here, Bo is the offset amount between the measurement block 30 and the table 15 on which the semiconductor wafer 12 is placed, Tw is the thickness of the semiconductor wafer 12, Tt is the thickness of the protective tape 14, and To is the puncture protrusion for peeling from the surface of the protective tape 14 It is the distance to 26 insertion positions.

  When the descending amount D1 from the origin O to the position where the peeling puncture protrusion 26 pierces is obtained, the elevating unit 20 descends from the origin O by the distance D1 and stops at the position shown in FIG. In this state, the clamping unit 28 is in an open state.

  Next, the movable base 18 advances slightly, and the puncture protrusion 26 for peeling is pierced into the end surface of the protective tape 14 as shown in FIG. At this time, the distance that the peeling puncture protrusion 26 penetrates inward from the edge of the semiconductor wafer 12 is a range in which the surplus portion of the semiconductor wafer 12 is not used as an element, for example, 2.5 mm. As a result, even if the peeling puncture protrusion 26 comes into contact with the surface of the semiconductor wafer 12, the portion that becomes the electronic element is not damaged.

  Thereafter, the elevating unit 20 slightly rises, and as shown in FIG. 6, the edge portion of the protective tape 14 pierced by the peeling puncture protrusion 26 is pulled up from the surface of the semiconductor wafer 12. Further, as shown in FIG. 7, the peeling puncture protrusion 26 of the peeling portion 22 slightly rises, the movable base 18 also moves slightly forward, and the edge of the protective tape 14 is inclined obliquely upward by the peeling puncture protrusion 26. Pull up. Further, in this state, as shown in FIG. 8, the movable base 18 is slightly advanced to further peel off the protective tape 14.

  Then, as shown in FIG. 9, the insertion part 24 of the peeling part 22 is advanced and brought into contact with the back surface of the protective tape 14 and inserted between the protective tape 14 and the semiconductor wafer 12. Here, the movement of the clamping unit 28 is set by two types of springs (not shown). First, as the movable table 18 moves, the cam follower 33 provided on the movable table 18 is urged by a strong spring (not shown) to rotate along the fixed cam member 31 shown in FIG. The part 28 is advanced. Thereafter, the sandwiching portion 28 is swung in the closing direction, and the protective tape 14 is sandwiched and held between the insertion portion 24 and the sandwiching portion 28 as shown in FIG. Next, the movable base 18 is further moved in the horizontal direction to peel off the protective tape 14 from the surface of the semiconductor wafer 12. After peeling, the clamping between the insertion part 24 and the clamping part 28 is released, and the protective tape 14 is discarded at a predetermined lateral position. The movement of the clamping unit 28 may be performed by a separate driving source regardless of the spring and the cam member.

  According to the tape peeling apparatus 10 of this embodiment, the protective tape 14 affixed to the surface of the semiconductor wafer 12 can be surely peeled without using a member such as a peeling tape, and the peeling puncture protrusion 26 is The semiconductor wafer 12 moves parallel to the surface of the semiconductor wafer 12 from the end face of the protective tape 14 and is inserted into the end face of the protective tape 14 without damaging the semiconductor wafer surface. Furthermore, the waste is only the peeled protective tape 14, and the environmental load due to the waste is small.

  The tape peeling apparatus of the present invention is not limited to the above embodiment, and as shown in FIG. 11, the position of the peeling puncture protrusion 26 is measured by the measurement block 30 and the position of the surface of the protective tape 14 May be measured by the laser displacement meter 32, and the movement distance of the peeling puncture protrusion 26 may be calculated from the measured position of the surface of the protective tape and the tip position of the peeling puncture protrusion 26 measured by the measurement block 30.

  Thereby, it is possible to calculate the moving distance of the peeling puncture protrusion 26 in consideration of variations in the thickness of the semiconductor wafer 12 and the thickness of the protective tape 14 and other thickness errors due to irregularities on the surface of the semiconductor wafer 12. The peeling puncture protrusion 26 can be accurately moved and positioned, and reliable peeling is possible even with a thinner semiconductor wafer or protective tape.

  Further, the table on which the semiconductor wafer is placed may be provided with a heater for heating the protective tape through the semiconductor wafer. Alternatively, a heating lamp or heater may be provided above the table. Thereby, the adhesiveness of a protective tape can be reduced and peeling can be made easier. In addition, the puncture protrusion for peeling of the present invention may be a needle-like member or a protrusion with a sharp tip, as long as it can be peeled off with a protective tape. Moreover, the shape and number of insertion parts, the shape of a clamping part, etc. can also be set suitably, and are not limited to the said embodiment. Further, the peeling direction and the holding means can be arbitrarily set.

It is a perspective view which shows the tape peeling apparatus of one Embodiment of this invention. It is a schematic perspective view which shows the peeling part of the tape peeling apparatus of this embodiment. It is a schematic side view which shows the structure for positioning of the tape peeling apparatus of this embodiment. It is a schematic side view which shows peeling operation | movement of the tape peeling apparatus of this embodiment. It is a schematic side view which shows peeling operation | movement of the tape peeling apparatus of this embodiment. It is a schematic side view which shows peeling operation | movement of the tape peeling apparatus of this embodiment. It is a schematic side view which shows peeling operation | movement of the tape peeling apparatus of this embodiment. It is a schematic side view which shows peeling operation | movement of the tape peeling apparatus of this embodiment. It is a schematic side view which shows peeling operation | movement of the tape peeling apparatus of this embodiment. It is a schematic side view which shows peeling operation | movement of the tape peeling apparatus of this embodiment. It is a schematic side view which shows the structure for positioning of the tape peeling apparatus of other embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Tape peeling apparatus 12 Semiconductor wafer 14 Protection tape 16 Base 18 Movable stand 20 Lifting part 22 Peeling part 24 Insertion part 26 Puncture protrusion 26a Returning protrusion 28 Holding part 30 Measurement block

Claims (9)

  In a tape peeling method for peeling off a protective tape affixed to the surface of a semiconductor wafer, a puncture protrusion for peeling is pierced on an end surface of the protective tape, the edge of the protective tape is rolled up, and the protective tape is attached to the semiconductor A tape peeling method comprising peeling from a wafer.   In a tape peeling method for peeling off a protective tape attached to a surface of a semiconductor wafer, a puncture protrusion for peeling is pierced on an end surface of the protective tape, and an edge portion of the protective tape is rolled up, and then an end of the protective tape Insert the insertion portion between the edge portion and the semiconductor wafer, and hold the protective tape between the insertion portion and the clamping portion provided on the opposite side of the protective tape. A tape peeling method, wherein the protective tape is peeled from the semiconductor wafer.   3. The tape peeling method according to claim 2, wherein a tip position of the peeling puncture protrusion is measured in advance before the protective tape is peeled, and the peeling puncture protrusion is inserted into the end face of the protective tape.   In a tape peeling apparatus comprising a table on which a semiconductor wafer having a protective tape affixed is mounted, and peeling off the protective tape on the surface of the semiconductor wafer, a peeling puncture protrusion inserted into an end face of the protective tape, and the peeling A peeling part holding the puncture protrusion for use, a movable base for moving the peeling part up and down, a base on which the movable base is provided so as to be movable in the horizontal direction, and peeling by the peeling puncture protrusion provided in the peeling part A holding portion for holding the protective tape, the edge portion of the protective tape is rolled up by the puncture protrusion for peeling, and the edge portion of the raised protective tape is held by the holding portion. And moving the movable table to separate the protective tape from the semiconductor wafer.   The peeling part is provided with a plurality of peeling puncture protrusions, the insertion part formed in a comb-blade shape is located between the peeling puncture protrusions, and the protection is raised by the peeling puncture protrusions 5. The tape according to claim 4, wherein the insertion portion is inserted into a back surface side of the tape, the protective tape edge is sandwiched between the insertion portion and the sandwiching portion, and the protection tape is peeled off. Peeling device.   6. The tape peeling apparatus according to claim 5, wherein a return protrusion that engages with the protective tape is formed on the peeling puncture protrusion.   The tape peeling apparatus according to claim 5, further comprising a heating unit that heats the protective tape to reduce the adhesiveness of the protective tape.   A measurement block for measuring the tip position of the peeling puncture protrusion and a measuring means for detecting a distance from the predetermined position to the block are provided, and from the position of the peeling puncture protrusion measured using the measurement block 6. The tape peeling apparatus according to claim 5, further comprising a calculating means for calculating a moving distance to the position of the end face of the protective tape into which the peeling puncture protrusion is inserted. The measuring means includes a non-contact sensor that detects the measurement block and the surface position of the protective tape, measures the surface position of the protective tape with the non-contact sensor, and uses the computing means to perform the peeling puncture. 9. The tape peeling apparatus according to claim 8, wherein a movement distance to the position of the end face of the protective tape into which the protrusion is inserted is calculated.

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