1264781 九、發明說明： 【發明所屬之技彳衧領域】 發明領域 51264781 IX. Description of the invention: [Technical field to which the invention belongs] Field of the invention 5
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20 本發明係有關於一種用以於基板之預定位置安裝電子 零件的晶片結合用黏著帶之貼附方法，及利用該黏著帶之 貼附方法將料料安練基板”子零狀安裝方法。 背景技術 以往，利用黏著帶將電子零件貼附於基板之方法甚為 =及。該方法是使用兩主表面具有黏著性之晶片結合用黏 著帶。該方法如下進行。 首先，將附有剝離帶之黏著帶切斷。藉此準備好附有 _帶之個片。藉㈣機構保持前述個片之狀態下使其移 動。之後’藉保持機構將前述個片載置於基板之預定位置。 此步驟稱為暫時壓著步驟。 然後，藉壓著機構將載置於基板上之前述個片壓著在 絲上。料，於基板之預定位置遂貼有前述㈣。即， 黏著膜之其中—主表面貼附於基板。此步驟稱為直壓 Γ在此步㈣束後，㈣與騎錢之蚊彳目反側的個 片主表面仍殘留剝離膜。 接著，將接著帶按壓於基板上之個片之剝離膜 使接著帶與__接。之後，若將接㈣料，就^ 基板上除去剝離膜。因此，基板上僅殘留黏著膜。此牛驟 稱為剝離步驟。在剝離步驟之後，就可露出黏著臈之另二 5 1264781 主表面。 4後，於黏著膜之另一主表面貼附電子零件。即，轉 由黏著膜將電子零件安裝於基板上。此步_為晶片結二 步驟。 ° 則述這種電子零件之安裝方法揭示於例如日本專利公 開公報特開200M35653號。 ‘ 又，在前述暫時壓著步驟時，如第9圖〜第13圖所示， 保持機構101與攝像機構102—體地移動。 接下來，更具體說明前述暫時壓著步驟。 百先，如第9圖所示，在位置1〇5將黏著帶1〇4切斷成所 要尺寸。藉此形成黏著膜103a上附有剝離膜1〇3b之個片 103。然後，藉保持機構1〇1保持個片1〇3。舉例而言，可由 保持機構101吸附剝離膜103b之主表面。第9圖所示之此步 驟稱為保持步驟S。 接著，如第10圖所示，藉保持機構101保持個片1〇3之 狀恶下，保持機構1〇1及攝像機構102—體地自位置105移動 直至基板100之上方。第1〇圖所示之此步驟稱為移動步驟了。 接著，如第11圖所示，當到達基板1〇〇上方時，攝像機 構102會辨識基板1〇〇上可安裝電子零件之位置。第n圖所 示之此步驟稱為辨識步驟u。 然後，如第12圖所示，當辨識步驟u結束後，保持機構 101及攝像機構102—體地移動直至在辨識步驟1；時所辨識 之位置之上方。第12圖所示之此步驟稱為移動步驟v。 之後，如第13圖所示，當保持機構1〇1到達在辨識步驟 6 Ϊ64781 才所辨4之位置之上方時，保持機構ι〇ι將個片載置於 基板⑽之預疋位置。此時，個片1G3可與基板1GG黏接。此 步驟稱為載置步驟W。 第9圖帛13圖所示，前述習知暫時壓著步，驟，係依序 進行步驟S〜步驟w之5個步驟。 專利文獻1 ·曰本專利公開公報特開2001-135653號（第 13頁，第1圖） 【令务明内】 發明課題 近年來，為達到降低基板成本之目標，大多是使用一 片基板上可★裝大量電子零件之矩陣型基板。此外，矩陣 型基板讀安裝之電子零件也是輕薄短小。因此，如何可 迅速又w精度地於矩㈣基板上安裝大量電子零件成為一 重要課題。 技術中，保持機構101與攝像機； 102設為一體，因此，必葙 义肩依序進行步驟s〜步驟w。於 即使步驟s〜步驟W各自妁1 >、、 =進仃迅速，仍舊很難大幅縮短暫 時壓著步驟整體之時間。兴 曰 舉例而g，由於在保持步驟3時， =冓1:無法進行辨識步驟u，所以暫卿 迅速進订0又，如果將牛 ^ ‘‘S〜步驟w個別所需之時間壓 太短，就無法高精度地士 、、、 進仃g %壓著步驟。總之，就盔 法既迅速又高精度地叫料壓著步驟。 - 又，雖然未圖示，不、a AΜ 不過剝離步驟所用之接著帶及剝籬 膜均為透明的，因此當佶田4 L 判雕 吏用紅外線感測器時，無法檢 1264781 是否已自黏著帶上除去剝離膜。又，即使剝離膜材料是不 透明的，要藉紅外線感測器迅速檢測出是否已除去剝離膜 亦很困難。因此，根本無法在黏著帶貼附於基板後，迅速 將電子零件貼附於黏著帶上。 5 另，由於前述用以進行將黏著帶貼附於基板之步驟之 裝置及用以進行將電子零件安裝於黏著帶之步驟之裝置是 個別設置，所以無法連續進行該等步驟。因此，極難縮短 整體電子零件安裝作業時間。 # 本發明係有鑑於前述問題而作成者，目的在於提供一 10 種可迅速且高精度地將前述晶片結合用黏著帶（黏著膜） 貼附於基板之預定位置之晶片結合用黏著帶之貼附方法。 - 又，本發明另一目的在於提供一種可迅速檢測出前述 . 晶片結合用黏著帶之剝離構件是否已除去之晶片結合用黏 著帶之貼附方法。 15 此外，本發明另一目的在於提供一種由於可連續進行 從將前述晶片結合用黏著帶載置於基板之預定位置的步 ^ 驟，到藉由該晶片結合用黏著帶將電子零件安裝於基板之 預定位置的步驟所有步驟，所以可迅速且高精度地將電子 零件安裝於基板之預定位置的電子零件之安裝方法。 20 發明概要 本發明之一態樣之晶片結合用黏著帶之貼附方法，係 首先藉攝像機構辨識基板上之預定位置；接著，利用保持 機構保持兩主表面具有黏著性之黏著膜；然後，依前述預 定位置之辨識結果，使前述保持機構移動並將前述黏著膜 8 1264781 貼附於前述預定位置。又，前述保持機構與前述攝像機構 可相互獨立地移動，且前述辨識步驟與前述保持步驟可同 時進行。 依前述方法，可縮短辨識預定位置之步驟及保持黏著 5 膜之步驟所需作業時間。 本發明之另一態樣之晶片結合用黏著帶之貼附方法， 係首先在剝離構件上一種顏色；接著，在接著帶加上與前 述一種顏色不同之顏色；之後，將其中一主表面安裝有剝 離構件，且兩主表面具有黏著性之黏著帶貼附於基板。然 10 後，利用前述接著帶將前述剝離構件自前述黏著帶上除 去。再接著，利用色檢測器檢測前述接著帶上是否黏接有 前述剝離構件。 依前述方法，可迅速檢測出是否已除去剝離構件。 本發明之又另一態樣之電子零件之安裝方法，係首先 15 第1步驟，將其中一主表面安裝有剝離構件且兩主表面具有 黏著性之黏著膜載置於基板之預定位置；第2步驟，利用壓 著機構將載置於前述預定位置之前述黏著膜壓著在前述基 板上；第3步驟，使前述剝離構件與接著帶黏接以自前述黏 著膜除去該剝離構件，並使前述基板上僅殘留前述黏著 20 膜；及第4步驟，藉由前述黏著膜將電子零件安裝於前述預 定位置。用以執行前述第1〜第3步驟之裝置與用以執行前述 第4步驟之裝置設為一體，且前述第1〜第3步驟及前述第4 步驟可連續進行。 依前述方法，可在除去剝離膜後立刻將電子零件安裝 1264781 於殘留於基板上之黏著膜。 自以下配合圖式朗之詳細内容，可更清楚地理解本 發明之刖述及其他目的、特徵、態樣和優點。 圖式簡單說明 5 第1圖係一實施形態之晶片結合用黏著帶之貼附方法 所使用之貼附裝置的平面圖。 第2圖係藉第1圖所示之貼附裝置貼附黏著膜之基板的 立體圖。 第3圖係顯不第1圖所示之貼附裝置連結晶片結合裝置 10 之狀態的平面圖。 第4圖係祝明藉第i圖所示之貼喊置進行暫時壓著步 驟之A步驟的圖。 第5圖係係說明藉圖所示之貼附裝置進行暫時壓著 步驟之B步驟的圖。20 The present invention relates to a method of attaching an adhesive tape for wafer bonding for mounting an electronic component to a predetermined position of a substrate, and a method for mounting a substrate by using a method of attaching the adhesive tape to a substrate. BACKGROUND ART Conventionally, a method of attaching an electronic component to a substrate by an adhesive tape has been used. This method uses an adhesive tape for bonding a wafer having adhesiveness on both main surfaces. The method is as follows. First, a peeling tape is attached. The adhesive tape is cut off, thereby preparing a sheet with the _ belt. The mechanism is held by the (4) mechanism while maintaining the aforementioned sheets. Then the borrowing mechanism holds the aforementioned sheets on the predetermined position of the substrate. The step is called a temporary pressing step. Then, the aforementioned pieces placed on the substrate are pressed against the wire by means of a pressing mechanism. The material is attached to the predetermined position of the substrate (4). That is, the adhesive film is- The main surface is attached to the substrate. This step is called direct pressing. After this step (4), (4) the release film remains on the main surface of the opposite side of the mosquito-carrying mosquito. Then, the tape is pressed onto the substrate. It The release film of the sheet is connected to the __. Then, if the material is connected, the release film is removed from the substrate. Therefore, only the adhesive film remains on the substrate. This is called a peeling step. After the peeling step, The main surface of the other 5 1264781 can be exposed to the adhesive. After 4, the electronic component is attached to the other main surface of the adhesive film. That is, the electronic component is mounted on the substrate by the adhesive film. This step is the wafer junction two. The method of mounting such an electronic component is disclosed, for example, in Japanese Laid-Open Patent Publication No. 200M35653. In addition, in the aforementioned temporary pressing step, as shown in Figs. 9 to 13 , the holding mechanism 101 and The image pickup mechanism 102 is physically moved. Next, the temporary pressing step will be described in more detail. As shown in Fig. 9, the adhesive tape 1〇4 is cut into a desired size at a position of 1〇5. The sheet 103 of the release film 1〇3b is attached to the adhesive film 103a. Then, the sheet 1〇3 is held by the holding mechanism 1〇1. For example, the main surface of the release film 103b can be adsorbed by the holding mechanism 101. Fig. 9 This step shown is referred to as holding step S. As shown in Fig. 10, the holding mechanism 101 and the image pickup mechanism 102 are moved from the position 105 to the upper side of the substrate 100 by the holding mechanism 101 in the form of a sheet 1〇3. This step is referred to as a moving step. Next, as shown in Fig. 11, when reaching the upper side of the substrate 1, the image pickup mechanism 102 recognizes the position at which the electronic component can be mounted on the substrate 1. This step is referred to as the identification step u. Then, as shown in Fig. 12, after the end of the identification step u, the holding mechanism 101 and the camera mechanism 102 are physically moved until the position recognized by the identification step 1; This step shown in Fig. 12 is referred to as a moving step v. Thereafter, as shown in Fig. 13, when the holding mechanism 1〇1 reaches above the position recognized by the identification step 6 Ϊ64781, the holding mechanism ι〇 ι Place a piece on the pre-twisted position of the substrate (10). At this time, the individual sheets 1G3 can be bonded to the substrate 1GG. This step is called placement step W. As shown in Fig. 9 and Fig. 13, in the above-mentioned conventional temporary pressing step, the steps S to w are sequentially performed in five steps. [Patent Document 1] Japanese Patent Laid-Open Publication No. 2001-135653 (page 13, first figure) [Instructions] In recent years, in order to achieve the goal of reducing the cost of substrates, most of them are used on one substrate. ★ A matrix substrate with a large number of electronic components. In addition, the electronic components of the matrix substrate read and install are also light and thin. Therefore, how to quickly and accurately mount a large number of electronic components on a rectangular (four) substrate becomes an important issue. In the technique, the holding mechanism 101 and the camera; 102 are integrated, and therefore, steps s to w are sequentially performed. Even if the respective steps s to W are fast, it is still difficult to greatly shorten the time of the temporary pressing step. For example, g, because in the maintenance of step 3, = 冓 1: can not carry out the identification step u, so the temporary Qing quickly ordered 0 again, if the time required for the cattle ^ ''S ~ step w individual is too short Therefore, it is impossible to accurately measure the steps of the geologists, and the 仃g %. In short, the helmet method is called the pressing step quickly and accurately. - In addition, although not shown, it does not, a AΜ, but the adhesive tape and the peeling film used in the peeling step are transparent. Therefore, when the Putian 4 L is inspected with an infrared sensor, it is impossible to check whether the 1264781 has been self-tested. The release film was removed from the adhesive tape. Further, even if the release film material is opaque, it is difficult to quickly detect whether or not the release film has been removed by an infrared sensor. Therefore, it is impossible to quickly attach the electronic component to the adhesive tape after the adhesive tape is attached to the substrate. Further, since the above-described means for attaching the adhesive tape to the substrate and the means for performing the step of attaching the electronic component to the adhesive tape are individually provided, the steps cannot be continuously performed. Therefore, it is extremely difficult to shorten the installation time of the entire electronic parts. The present invention has been made in view of the above problems, and an object of the present invention is to provide a sticker for a wafer bonding adhesive tape which can adhere the adhesive tape (adhesive film) for bonding a wafer to a predetermined position of a substrate quickly and accurately. Attached method. Further, another object of the present invention is to provide a method of attaching an adhesive tape for wafer bonding which can quickly detect whether or not the peeling member for the adhesive tape for wafer bonding has been removed. Further, another object of the present invention is to provide a step of mounting the electronic component to the substrate by the bonding tape for wafer bonding by continuously performing the step of placing the adhesive tape for wafer bonding on a predetermined position of the substrate. Since all the steps of the predetermined position are performed, the mounting method of the electronic component in which the electronic component is mounted on the predetermined position of the substrate can be quickly and accurately performed. 20 SUMMARY OF THE INVENTION A method for attaching an adhesive tape for wafer bonding according to an aspect of the present invention is to first identify a predetermined position on a substrate by an image pickup mechanism; and then, to maintain an adhesive film having adhesive surfaces on both main surfaces by using a holding mechanism; According to the identification result of the predetermined position, the holding mechanism is moved and the adhesive film 8 1264781 is attached to the predetermined position. Further, the holding mechanism and the image pickup mechanism are movable independently of each other, and the recognizing step and the holding step can be performed simultaneously. According to the foregoing method, the step of recognizing the predetermined position and the operation time required for the step of holding the film 5 can be shortened. Another aspect of the present invention relates to a method of attaching an adhesive tape for wafer bonding by first applying a color to the peeling member; then, adding a color different from the foregoing one color to the subsequent tape; and then mounting one of the main surfaces An adhesive tape having a peeling member and having adhesive surfaces on both main surfaces is attached to the substrate. After 10, the peeling member is removed from the adhesive tape by the aforementioned adhesive tape. Next, the color detector is used to detect whether or not the peeling member is adhered to the tape. According to the foregoing method, it is possible to quickly detect whether or not the peeling member has been removed. Another method for mounting an electronic component according to another aspect of the present invention is the first step of the first step of placing an adhesive film on which a main surface is provided with a peeling member and having adhesive surfaces on both main surfaces at a predetermined position of the substrate; In the second step, the adhesive film placed on the predetermined position is pressed against the substrate by a pressing mechanism; and in the third step, the peeling member is bonded to the adhesive tape to remove the peeling member from the adhesive film, and Only the adhesive 20 film remains on the substrate; and in the fourth step, the electronic component is attached to the predetermined position by the adhesive film. The apparatus for performing the first to third steps described above is integrated with the apparatus for performing the fourth step, and the first to third steps and the fourth step can be continuously performed. According to the above method, the electronic component can be mounted 1264781 to the adhesive film remaining on the substrate immediately after the release film is removed. The above description of the present invention and other objects, features, aspects and advantages will be more clearly understood from the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view showing a method of attaching an adhesive tape for wafer bonding according to an embodiment. Fig. 2 is a perspective view of the substrate to which the adhesive film is attached by the attaching device shown in Fig. 1. Fig. 3 is a plan view showing a state in which the attaching device shown in Fig. 1 is connected to the wafer bonding apparatus 10. Fig. 4 is a diagram showing the A step of the temporary pressing step by the placard shown in Fig. i. Fig. 5 is a view for explaining the step B of the temporary pressing step by the attaching device shown in the drawing.
第6圖係係說明藉圖所示之貼附裝置進行暫時壓著 步驟之C步驟的圖。 第7圖係顯示第1圖所示之貼附裝置之保持機構的圖。 第8圖係說明藉第1圖所示之_裝置進行之剝離步驟 的圖。 第9圖係說明習知暫時壓著步驟之3步驟的圖。 第10圖係說明習知暫時壓著步驟之τ步驟的圖。 第11圖係說明習知暫時壓著步驟步驟的圖。 第12圖係說明習知暫時壓著步驟（V步驟的圖。 第13圖係說明習知暫時壓著步驟之⑺步驟的'圖。 10 1264781 I：實施方式3 較佳實施例之詳細說明 以下，利用圖式說明本發明之實施形態之晶片結合用 黏著帶之貼附方法及電子零件之安裝方法。 5 首先，參照第1圖及第2圖，說明本發明一實施形態之 將黏著膜貼附於基板之晶片結合用黏著帶之貼附方法。 該實施形態之晶片結合用黏著帶（以下只稱為「黏著 帶」）之貼附方法使用貼附裝置50。如第1圖及第2圖所示， 貼附裝置50是用以將黏著膜10貼附於基板1之位置2。黏著 10 膜10是用以將電子零件之半導體晶片（以下只稱為「晶片」） 40安裝於基板1。 貼附裝置50包含有可將黏著帶3切斷為所需尺寸之個 片12的切斷部。另，個片12上黏有作為晶片結合材之黏著 膜10及作為剝離構件之剝離膜11。又，黏著膜10是兩主表 15 面均具有接著力之雙面接著膜。因此，最後，黏著膜10以 其中一主表面貼附於基板1，另一主表面則與晶片40貼附。 另，剝離膜11係在黏著膜10之另一主表面與晶片40貼附之 前用以保護該另一主表面的構件，亦係當個片12移動時可 由保持機構13吸附的構件。 20 又，貼附裝置50包含有用以將個片12貼附於基板1之貼 附部4。此外，貼附部4之其中一側設有用以收納貼有個片 12前之基板1的内收納部5。貼附部4之另一側設有用以收納 貼有黏著膜10後之基板1的外收納部6。 首先，將基板1自内收納部5搬送至貼附部4。然後，在 11 1264781 後述之貼附步驟時，於基板1貼附個片12。接著，將基板1 自貼附部4搬送至外收納部6。在貼附步驟時，基板丨之移動 路位大略王直線。因此，貼附步驟可有效率地進行。另， 貼附部4、内收納部5、及外收納部6設置成相互之間可自由 5裝卸’俾權宜變更該等結構之配置。 又忒貫施形怨之黏著帶3具有黏著膜1〇與剝離膜^組 成之兩層構造，不過，亦可具有僅黏著膜1〇組成之單層構 造，或者亦可具有黏著膜10之兩主表面分別設有剝離助 的三層構造。 10 如第1圖所示，自内收納部5朝外收納部6方向，貼附部 4依序設有暫時壓著單元7、真壓著單元8、及剝離單元9。 由於暫時壓著單元7、真壓著單元8、及剝離翠元9設置成相 互f間可自由裝卸，所以可權宜變更简單元之配置。另， 剝離早心是用以自黏著_上除去__。Fig. 6 is a view for explaining the C step of the temporary pressing step by the attaching device shown in the drawing. Fig. 7 is a view showing a holding mechanism of the attaching device shown in Fig. 1. Fig. 8 is a view showing a peeling step by the apparatus shown in Fig. 1. Fig. 9 is a view for explaining the steps of the conventional temporary pressing step. Figure 10 is a diagram illustrating the τ step of a conventional temporary pressing step. Figure 11 is a diagram illustrating a conventional temporary pressing step. Fig. 12 is a view showing a conventional temporary pressing step (step V). Fig. 13 is a view showing a step (7) of the conventional temporary pressing step. 10 1264781 I: Embodiment 3 Detailed description of the preferred embodiment A method of attaching an adhesive tape for wafer bonding and a method of attaching an electronic component according to an embodiment of the present invention will be described with reference to the drawings. First, an adhesive film will be described as an embodiment of the present invention with reference to FIGS. 1 and 2 . Attachment method of a wafer bonding adhesive tape attached to a substrate. The attachment method of the wafer bonding adhesive tape (hereinafter simply referred to as "adhesive tape") is used as the attachment device 50. As shown in Fig. 1 and Fig. 2 As shown in the figure, the attaching device 50 is for attaching the adhesive film 10 to the substrate 2. The adhesive film 10 is a semiconductor wafer (hereinafter simply referred to as "wafer") 40 for mounting electronic components on the substrate. 1. The attaching device 50 includes a cut portion that can cut the adhesive tape 3 into pieces 12 of a desired size. Further, the adhesive film 10 as a wafer bonding material and the peeling off as a peeling member are adhered to the individual sheets 12. Membrane 11. Again, the adhesive film 10 is two main tables 15 The surface has a double-sided adhesive film with an adhesive force. Therefore, finally, the adhesive film 10 is attached to the substrate 1 with one of the main surfaces, and the other main surface is attached to the wafer 40. Further, the release film 11 is attached to the adhesive film 10. The other major surface is attached to the wafer 40 prior to attachment to the other major surface, and is also a member that can be attracted by the retaining mechanism 13 as the sheet 12 moves. 20 Again, the attachment device 50 contains useful The sheet 12 is attached to the attachment portion 4 of the substrate 1. Further, one side of the attachment portion 4 is provided with an inner housing portion 5 for accommodating the substrate 1 before the sheets 12 are attached. The other side of the attachment portion 4 The outer housing portion 6 for accommodating the substrate 1 to which the adhesive film 10 is attached is provided. First, the substrate 1 is transported from the inner housing portion 5 to the attaching portion 4. Then, in the attaching step of 11 1264781, the substrate is attached. 1A sheet 12 is attached. Next, the substrate 1 is transferred from the attaching portion 4 to the outer housing portion 6. At the attaching step, the moving path of the substrate 大 is substantially straight. Therefore, the attaching step can be performed efficiently In addition, the attaching portion 4, the inner housing portion 5, and the outer housing portion 6 are disposed to be freely detachable from each other.俾 俾 变更 变更 变更 变更 变更 变更 变更 变更 变更 变更 变更 变更 变更 变更 变更 变更 变更 变更 变更 变更 变更 变更 变更 变更 变更 变更 变更 变更 变更 变更 变更 变更 变更 变更 变更 变更 变更 变更 变更 变更 变更 变更 变更 变更 变更 变更 变更 变更 变更 变更 变更 变更Alternatively, the two main surfaces of the adhesive film 10 may be provided with a three-layer structure of peeling assistance. 10 As shown in Fig. 1, the attaching portion 4 is temporarily provided in the direction from the inner housing portion 5 toward the outer housing portion 6. The pressing unit 7, the pressing unit 8, and the peeling unit 9. Since the temporary pressing unit 7, the pressing unit 8, and the peeling casket 9 are detachably arranged between the mutual f, the unit can be easily changed. Configuration. In addition, the peeling of the early heart is used to remove the __.
15 内收納部5收納貼有個片12前之基如，外收納部6收納 2個片12後之基板1 ’兩者均是用以收納基板卜兩者基 構成要件彼此大致相同。内收納部5及外收納部6中，分 別在鉛直方向上相隔間距疊放多片基板i。 前述外收納部6用以收納多片貼有黏著獅之基板卜 因此，在前述純㈣6 ’必須在相關距之狀態下疊收基 板！’使其不致藉由黏著膜10而相互轉。但是，在用以收 納多片貼有黏著膜H)前之基幻的内收納部5,基板！並不會 糟由黏著卿而相絲接，㈣村在^基板冰互接觸 之狀態下疊收基板1。 12 1264781 又’為依内收納部5、貼附部4、及外收納部6之順序搬 送基板1，第1圖所示之貼附裝置50在貼附部4内設有2條大 略王直線狀之搬送執21。如第4圖〜第6圖所示，2條搬送軌 21各自之鉛直截面之形狀均為C字形。此2條C字形之搬送 5軌21之凹部分別可插入基板1之兩側端部。又，搬送執21設 有基板失頭機構（未圖示）。目此，可沿搬送執21依内收納 部5、貼附部4、及外收納部6之順序搬送基板1。 使用珂述暫時壓著單元7、真壓著單元8、及剝離單元 9，可執行以下貼附步驟。 10 15 20 百先，於暫龍著單元7巾，在藉保持機構13保持個片 12之狀態下搬運個片12，並載置於基如之主表面上之位置 2。此步驟稱為暫時壓著步驟。接著，於真壓著單元8中， 錯壓者機構15將載置於基板丨之個片12壓著在基板丨上。此 步驟稱為真壓著步驟。藉此，基板1之主表面上之位置2貼 有個片12。此時’個片12上仍殘留剝離膜u。 “然後，使用剝離膜除去機構16以除去剝離膜u。剝離 版除去機構16具有為單面黏著帶之接著帶η及按壓機構 .按壓機構以將接著帶17之接著面按壓於基板i之個 二2二糟此，接著帶17與剝離膜11黏接。又，接著帶Π ‘後，著。因此’在接著帶17之接著面與剝離膜Η =’：按壓機構18自接著帶17上離開，隨著接著帶η 之私動，就可自黏著咖上除去剝_u。因此，基 :殘留黏著咖。於是，完成於基板貼附黏著帶:貼附步 13 1264781 第2圖係在8處位置2a〜2h顯示8個步驟之貼附狀態。第2 圖如此顯示之理由是為求階段性顯示前述貼附步驟（暫時 壓著步驟、真壓著步驟、及剝離步驟）時個片12之貼附狀 態，以及貼附步驟前後之步驟時個片12之貼附狀態。 5 位置2b顯示進行暫時壓著步驟前之基板1的狀態。又， 位置2a顯示藉保持機構13將個片12載置於基板1時的狀 態，即暫時壓著步驟時之基板1的狀態。 位置2c及2d顯示藉壓著機構15將載置於基板1之個片 12壓著在基板1後的基板1狀態，即真壓著步驟結束後之基 10 板1的狀態。 位置2f顯示在剝離單元9中除去剝離膜11之前之基板1 的狀態。又，位置2e顯示藉剝離膜除去機構16除去剝離膜 11時之基板1的狀態，即剝離步驟時之基板1的狀態。 位置2g顯示將晶片40安裝於黏著膜10前之狀態。又， 15 位置2h顯示晶片40完全安裝於黏著膜10後之基板1的狀 態，即晶片結合步驟結束後之基板1的狀態。 總而言之，自位置2a到位置2f是顯示藉貼附裝置50進 行之貼附步驟，位置2g、2h則顯示藉後述之第3圖所示之晶 片結合裝置60進行之晶片結合步驟。另，晶片40是藉設在 20 晶片結合裝置60之安裝機構20安裝於黏著膜10。 接著，利用第3圖說明晶片結合裝置60。 又，第3圖所示之本實施形態之電子零件之安裝方法所 使用的電子零件之安裝裝置90中，第1圖所示之貼附裝置50 與第3圖所示之晶片結合裝置60相互連結。因此，貼附步驟 14 1264781 結束後’可連續進行晶片結合步驟。所以，使得電子, 安裝到基板1的整體安裝程序之時間縮短。 件 在兒子零件之安裝裝置90，為依内收納部5、貼附部4 曰曰片結合裝置60、及外收納部6之順序搬送基板1，於貼 5 。卩4及曰曰片結合裝置60内設有2條大略呈直線狀之搬送軌 21。2條搬送執21各自之鉛直截面之形狀與第丨圖所示< = 附裝置50中的是相同。即，如第4圖〜第6圖所示之c字形 此2條C字形之搬送軌21之凹部分別可插入基板丨之兩側端 部。又，搬送軌21設有基板夾頭機構（未圖示）。因此，^ 10沿搬送軌21依内收納部5、貼附部4、晶片結合裝置6〇、 外收納部6之順序搬送基板！。 又，如第3圖所示，當晶片結合裝置6〇與貼附裝置沁 欲相互連結時，首先將貼附裝置50之外收納部6自貼附部4 卸下，接著，將晶片結合裝置60安裝於貼附裝置5〇。然後， 15再將外收納部6安裝於晶片結合裝置60。此時，外收納部6 可收納已安裝有晶片40之基板1。 本實施形態之電子零件之安裝方法所使用的電子零件 之安裝裝置90，由於將貼附裝置50與晶片結合裝置6〇相互 連結，所以可更迅速且高精度地將晶片4〇貼附於黏著膜 20 1〇。於是，可縮短安裝電子零件之一系列相關步驟所需之 所有時間，即週期時間。 又，如果可使貼附裝置50之暫時壓著單元7、真壓著單 兀8、剝離單元9，及晶片結合裝置6〇之晶片結合單元19沿 搬送軌21滑動，還可進一步縮短週期時間。 15 1264781 接著，利用第1圖〜第6圖說明前述暫時壓著單元7及暫 時壓著步驟。 θ 如第4圖〜第6圖所示，暫時壓著單元7設有用以邊保持 基板1邊使其移動之保持機構13及用以辨識基板丨之攝像機 5構14。除前述2個機構以外，暫時壓著單元7還包含有用以 導引保持機構13及攝像機構14之移動的移動執22、用以辨 識個片12之攝像機構23、用以切斷黏著帶3之切斷機構24、 用以送出黏著帶3之送出機構25、可載置個片12之載置台 26。又，前述保持機構13、攝像機構14、攝像機構23、切 10斷機構24、送出機構25、及載置台26設置成相互之間可自 由裝卸，所以可變更該等位置關係。 又，保持機構13及攝像機構μ分別可移動地設於移動 執22上。保持機構π及攝像機構14可相互獨立地由移動執 22導引而移動。因此，保持機構13及攝像機構14各自可沿 15相對於第1圖所示之搬送執21延伸方向大約為直交的方向 移動。所以，保持機構13及攝像機構14可大致同時地進行 保持步驟及攝像步驟。 如第4圖〜第6圖所示，保持機構13可沿移動軌22而在載 置著切斷後之個片12的位置27與將貼附個片12之基板^上 20的位置2之間移動。又，攝像機構14可沿寬度方向自載置台 26之一側端部到另一側端部移動： 另一方面，電子零件之安裝裝置90在基板辨識用之攝 像機構14外，另設有帶辨識用之攝像機構^。又，基板辨 識用之攝像機構14可沿移動執22往復移動，但是攝像機構 16 1264781 23是固定在位置27上方之位置。不過，攝像機構23亦可與 攝像機構14同樣地可沿移動執22往復移動。如第4圖〜第6 圖所示，藉攝像機構23，可辨識個片12由保持機構13保持 之狀態、藉切斷機構24切斷黏著帶3之狀態、及藉送出機構 5 25送出黏著帶3之狀態等。 又’切斷機構24及送出機構25玎與貼附裝置50設成一 體，且該兩機構是於貼附裝置50之内部或外部設成相互之 間可自由裝卸。 ® 又，达出機構25可將粘著帶3供給至切斷機構24形成個 1〇片12之位置27。切斷機構24用以切斷黏著帶3。 切斷黏著帶3，係由第1圖所示之切斷機構24a之切割構 件（未圖不）進行。切割構件可沿寬度方向切斷送出機構 25a送出之著帶3。又，本實施形態在切斷黏著帶時，除 珂述切告彳構件以外，尚使用切斷機構24b之沖壓構件（未圖 15示）。沖壓構件可藉沖壓來切斷送出機構25b送出之黏著帶3 ^ 之一部分。切割構件與沖壓構件是設成相互獨立。 迟出機構25具有繞捲收納黏著帶3之收納部（未圖 示）°該收納部可捲繞各種黏著帶3。 ^又雖然說明的是藉切割方式之切斷機構24a切斷黏著 2〇帶3之例，不過可依基板1及黏著帶3來變換切割方式及沖墨 方式。為了可變換方式，切斷機構24及送出機構25是設成 可沿基板1之搬送方向滑動。 接下來，利用第4圖詳細說明暫時壓著步驟。 第4圖顯示用以保持黏著帶3之保持機構13與用以_ 17 1264781 並同時執行保持步驟與辨 土板之攝像機構I4獨立地移動， 。线步驟的保持·辨識步驟。 ^圖所示之保持.辨識步驟A，首先自送出機構挪The inner storage unit 5 accommodates the base before the individual sheets 12 are attached. For example, the outer storage unit 6 accommodates the two substrates 12, and both of the substrates 1' are used to accommodate the substrates. In the inner housing portion 5 and the outer housing portion 6, a plurality of substrates i are stacked at intervals in the vertical direction. The outer housing portion 6 is for accommodating a plurality of substrates to which the lions are attached. Therefore, the substrate must be stacked at the relevant distance in the pure (four) 6'! 'It is not allowed to rotate each other by the adhesive film 10. However, in the inner accommodating portion 5 for accommodating a plurality of base phantoms to which the adhesive film H) is attached, the substrate! It is not bad to be bonded by the bonding, and (4) the village stacks the substrate 1 in the state where the substrate ice is in contact with each other. 12 1264781 Further, the substrate 1 is transported in the order of the inner housing portion 5, the attaching portion 4, and the outer housing portion 6, and the attaching device 50 shown in Fig. 1 is provided with two straight lines in the attaching portion 4. The transfer of the shape is 21. As shown in Figs. 4 to 6 , the shape of the vertical cross section of each of the two transport rails 21 is C-shaped. The recesses of the two C-shaped halves of the two rails 21 can be inserted into the both end portions of the substrate 1, respectively. Further, the transport tray 21 is provided with a substrate head loss mechanism (not shown). Thus, the substrate 1 can be transported in the order of the transfer holder 21 in the order of the inner housing portion 5, the attaching portion 4, and the outer housing portion 6. The following attaching step can be performed by using the temporary pressing unit 7, the true pressing unit 8, and the peeling unit 9. 10 15 20 100 first, in the case of the temporary dragon 7 unit, the sheet 12 is carried by the holding mechanism 13 while holding the sheet 12, and placed on the surface of the main surface of the base 2 . This step is called a temporary crimping step. Next, in the true pressing unit 8, the erroneous mechanism 15 presses the sheet 12 placed on the substrate 压 on the substrate 。. This step is called the true crimping step. Thereby, the sheet 2 is attached to the position 2 on the main surface of the substrate 1. At this time, the release film u remains on the individual sheets 12. "Therefore, the release film removing mechanism 16 is used to remove the release film u. The release plate removing mechanism 16 has a bonding tape η and a pressing mechanism which are single-sided adhesive tapes. The pressing mechanism presses the bonding surface of the bonding tape 17 against the substrate i. After the second and the second, the tape 17 is adhered to the release film 11. Again, it is followed by the tape Π ', and then 'after the tape 17 and the release film Η = ': the pressing mechanism 18 is attached to the tape 17 Leaving, with the private movement of η, you can remove the peeling from the sticky coffee. Therefore, the base: residual adhesive coffee. So, the adhesive tape is attached to the substrate: Attachment step 13 1264781 Figure 2 8 positions 2a to 2h show the attachment state of 8 steps. The reason why the second figure is displayed is to display the above-mentioned attachment steps (temporary pressing step, true pressing step, and peeling step) in stages. The attached state of 12, and the attached state of the sheets 12 at the steps before and after the attaching step. 5 Position 2b shows the state of the substrate 1 before the temporary pressing step. Further, the position 2a shows the sheet by the holding mechanism 13. a state in which the substrate 12 is placed on the substrate 1, that is, a temporary pressing step The state of the substrate 1 at the time. The positions 2c and 2d show the state of the substrate 1 after the sheet 12 placed on the substrate 1 is pressed against the substrate 1 by the pressing mechanism 15, that is, the base 10 plate 1 after the end of the true pressing step The position 2f shows the state of the substrate 1 before the peeling film 11 is removed in the peeling unit 9. Further, the position 2e shows the state of the substrate 1 when the peeling film 11 is removed by the peeling film removing mechanism 16, that is, the substrate at the peeling step Position 2g shows the state in which the wafer 40 is attached to the adhesive film 10. Further, the position 15h shows the state of the substrate 1 after the wafer 40 is completely mounted on the adhesive film 10, that is, the substrate 1 after the wafer bonding step is completed. In other words, the position 2a to the position 2f are the attachment steps by the attachment device 50, and the positions 2g and 2h are the wafer bonding steps by the wafer bonding apparatus 60 shown in Fig. 3 which will be described later. The wafer 40 is attached to the adhesive film 10 by the mounting mechanism 20 of the 20 wafer bonding apparatus 60. Next, the wafer bonding apparatus 60 will be described with reference to Fig. 3. Further, the electronic component mounting method of the embodiment shown in Fig. 3 is provided. Used In the electronic component mounting device 90, the attaching device 50 shown in Fig. 1 and the wafer bonding device 60 shown in Fig. 3 are connected to each other. Therefore, after the attaching step 14 1264781 is completed, the wafer bonding step can be continuously performed. Therefore, the time for mounting the electronic device to the entire mounting process of the substrate 1 is shortened. The mounting device 90 for the son component is the inner housing portion 5, the attaching portion 4, the die attaching device 60, and the outer housing portion 6. The substrate 1 is sequentially transferred, and two substantially linear transport rails 21 are provided in the cymbal 4 and the cymbal bonding device 60. The shape of the vertical cross section of each of the two transporting handles 21 is shown in the figure below. ; = The same is attached to device 50. Namely, the concave portions of the two C-shaped transfer rails 21, as shown in Figs. 4 to 6 can be inserted into the both end portions of the substrate stack. Further, the transport rail 21 is provided with a substrate chuck mechanism (not shown). Therefore, the substrate is transported in the order of the inner storage unit 5, the attaching unit 4, the wafer bonding apparatus 6A, and the outer housing unit 6 along the transport rail 21! . Further, as shown in FIG. 3, when the wafer bonding apparatus 6A and the attaching apparatus are to be connected to each other, first, the accommodating portion 6 other than the attaching device 50 is detached from the attaching portion 4, and then the wafer bonding device is attached. 60 is attached to the attachment device 5〇. Then, the outer housing portion 6 is attached to the wafer bonding apparatus 60. At this time, the outer housing portion 6 can accommodate the substrate 1 on which the wafer 40 is mounted. In the mounting device 90 for an electronic component used in the method of mounting an electronic component according to the present embodiment, since the bonding device 50 and the wafer bonding device 6 are connected to each other, the wafer 4 can be attached to the bonding film more quickly and accurately. The film 20 is 1 〇. Thus, all the time required to install a series of steps related to electronic components, that is, the cycle time, can be shortened. Further, if the temporary pressing unit 7, the true pressing unit 8, the peeling unit 9, and the wafer bonding unit 19 of the wafer bonding apparatus 6 can be slid along the conveying rail 21, the cycle time can be further shortened. . 15 1264781 Next, the temporary pressing unit 7 and the temporary pressing step will be described with reference to Figs. 1 to 6 . θ As shown in Figs. 4 to 6, the temporary crimping unit 7 is provided with a holding mechanism 13 for moving the substrate 1 while moving, and a camera structure 14 for recognizing the substrate. In addition to the above two mechanisms, the temporary crimping unit 7 further includes a movement handle 22 for guiding the movement of the holding mechanism 13 and the image pickup mechanism 14, an image pickup mechanism 23 for recognizing the pieces 12, and for cutting the adhesive tape 3 The cutting mechanism 24, the feeding mechanism 25 for feeding the adhesive tape 3, and the mounting table 26 on which the sheets 12 can be placed. Further, since the holding mechanism 13, the image pickup unit 14, the image pickup unit 23, the cutting mechanism 24, the feed mechanism 25, and the mounting table 26 are detachably attached to each other, the positional relationship can be changed. Further, the holding mechanism 13 and the image pickup mechanism μ are movably provided on the movement holder 22, respectively. The holding mechanism π and the image pickup mechanism 14 are movable independently of each other by the movement controller 22. Therefore, each of the holding mechanism 13 and the image pickup unit 14 can be moved in a direction orthogonal to the direction in which the conveyance guide 21 shown in Fig. 1 extends. Therefore, the holding mechanism 13 and the image pickup mechanism 14 can perform the holding step and the image capturing step substantially simultaneously. As shown in FIGS. 4 to 6 , the holding mechanism 13 is movable along the moving rail 22 between the position 27 where the cut pieces 12 are placed and the position 2 of the substrate 20 to which the sheets 12 are to be attached. mobile. Further, the imaging unit 14 is movable from one end side to the other end side of the mounting table 26 in the width direction. On the other hand, the electronic component mounting device 90 is provided with a belt outside the imaging unit 14 for substrate identification. Identify the camera mechanism ^. Further, the imaging mechanism 14 for substrate recognition can reciprocate along the movement holder 22, but the imaging mechanism 16 1264781 23 is fixed at a position above the position 27. However, the imaging unit 23 can also reciprocate along the movement control 22 in the same manner as the imaging unit 14. As shown in Figs. 4 to 6 , by the image pickup mechanism 23, it is possible to recognize the state in which the sheets 12 are held by the holding mechanism 13, the state in which the adhesive tape 3 is cut by the cutting mechanism 24, and the dispensing mechanism 5 25 to convey the adhesive. With the status of 3 and so on. Further, the cutting mechanism 24 and the feeding mechanism 25 are integrally formed with the attaching device 50, and the two mechanisms are detachably attached to each other inside or outside the attaching device 50. Further, the reaching mechanism 25 can supply the adhesive tape 3 to the cutting mechanism 24 to form the position 27 of the one piece 12. The cutting mechanism 24 is used to cut the adhesive tape 3. The cutting of the adhesive tape 3 is performed by a cutting member (not shown) of the cutting mechanism 24a shown in Fig. 1. The cutting member cuts the tape 3 fed from the feeding mechanism 25a in the width direction. Further, in the present embodiment, when the adhesive tape is cut, a punching member (not shown in Fig. 15) of the cutting mechanism 24b is used in addition to the above-described cutting member. The punching member can cut a part of the adhesive tape 3^ sent out by the feeding mechanism 25b by punching. The cutting member and the punching member are disposed independently of each other. The ejecting mechanism 25 has a housing portion (not shown) that winds up the adhesive tape 3, and the storage portion can wind the various adhesive tapes 3. Further, although the cutting mechanism 24a is used to cut the adhesive tape 2, the cutting method and the ink filling method can be changed depending on the substrate 1 and the adhesive tape 3. The cutting mechanism 24 and the delivery mechanism 25 are slidable in the transport direction of the substrate 1 in a switchable manner. Next, the temporary pressing step will be described in detail using FIG. Fig. 4 shows that the holding mechanism 13 for holding the adhesive tape 3 and the image pickup mechanism I4 for performing the holding step and the soil plate are simultaneously moved independently. The step of maintaining and identifying the line step. ^Retention shown in the figure. Identification step A, first self-delivery mechanism
5成著$」後’在位置27如靖機構24將黏著帶3切斷 所需尺寸。之後’藉保持機構13保持個片η。保持機構 ^糸利用泵等吸引裝置吸_離助之主表面來保持個片 2°又’由於攝像機構14可不管保持機構13之動作而獨立 移動，所以當藉保持機構吸附個片U期間，可使用ccd (電荷搞合元件）相機等來辨識基板U之位置2。另，除 10基板1之位置2以外，攝像機構14亦可監看個片以保持狀 况及個片12之切斷狀況。 第5圖顯示包含第1〇圖及第12圖所示之習知移動步驟τ 及V、第11圖所示之習知辨識步驟υ兩者的移動.辨識步驟 Β。第5圖所示之步驟係藉保持機構13及攝像機構14同時進 15 行移動步驟與辨識步驟。 第5圖所示之移動·辨識步驟β時，藉保持機構13保持 之個片12可自位置27朝基板1之位置2移動。另一方面，攝 像機構14在個片12載置於位置2之前，持續拍攝位置2。 時，送出機構25送出接著要切斷之黏著帶3。如此，如第5 2〇圖所示，藉本電子零件之安裝裝置90，可同時進行習知# 動步驟T與移動步驟V，所以可縮短安裝電子雨 I丁令件所需時 間。 第6圖顯示同時進行對應於第13圖所示之習知載置牛 驟W之步驟，及對應於第11圖所示之習知辨識步 乂 驟 18 1264781 的狀態。 第6圖所示之載置·辨識步驟c時，個片12可載置於由 攝像機構14所辨識之位置2。在此步驟中第一個個片12可載 置於位置2。即，結束一個個片12之暫時壓著步驟。此時， 5攝像機構Μ移動到下一個位置2之上方，且拍攝位置2。 前述第4圖〜第6圖所示之實施形態之黏著帶之貼附方 法與習知黏著帶之貼附方法相較，減少了步驟數。更具體 而言，習知暫時壓著步驟須執行第9圖〜第13圖所示5個步驟 S〜W，但是實施形態之暫時壓著步驟只須執行4圖〜第6圖所 1〇 示之3個步驟Α〜C，所以可縮短執行一系列步驟所需之所有 時間。 接著，利用第2圖所示之基板1更詳細說明前述第4圖〜 弟6圖所示之步驟。 首先，將個片12載置於位置2h及位置2g。然後，保持 15 機構13及攝像機構14沿搬送執21往復移動，將個片12載置 於位置2e及位置2f。接著，保持機構π及攝像機構14再度 沿搬送執21往復移動，將個片12載置於位置2c及位置2d。 再一次保持機構13及攝像機構14沿搬送執22往復移動，將 個片12載置於位置2a及位置2b。結果，將個片12載置於基 20 板1之所有位置2。 另，第4圖〜第6圖所示之暫時壓著步驟之步驟A〜c是使 用藉吸附剝離膜11來保持個片12之保持機構13，不過亦可 使用其他保持機構。 又’如第7圖所不，保持機構13包含有前端部29、軸部 19 1264781 30、及負載部31。前端部29安裝有可對應個片12種類而更 換之前端治具28。轴部30安裝有包含前端治具28之前端部 29。轴部30嵌入負載部31，呈可移動狀態。負載部31具有 可使前端部29 (包含前端治具28)及軸部30沿上下方向往 5 復移動的功能。 又，在暫時壓著步驟時，保持機構13使軸部30朝下方 移動第7圖所示之預定單次長度P，且以預定負載按壓個片 12。為執行該軸部30之移動，藉磁氣對軸部30施加負載。 用以執行之構造，係軸部30及負載部31分別具有磁鐵32a及 10 32b。軸部30嵌入負載部31，磁鐵32a安裝於軸部30，磁鐵 32b安裝於負載部31。利用磁鐵32a與磁鐵32b之間之相斥力 及相吸力，軸部30可沿上下方向移動。另，保持機構13亦 可藉壓縮彈簧等彈性材料（未圖示）使軸部30沿上下方向 移動。 15 前述暫時壓著步驟之後，在真壓著單元8進行真壓著步 驟。以下，說明真壓著步驟。 如第1圖及第3圖所示，真壓著單元8設有壓著機構15。 壓著機構15具有可對黏著帶3施加較保持機構13大之負載 之能力。雖未圖示，不過基板1是載置於壓著台上。 20 載置台26及壓著台分別設有加熱機構（未圖示）。藉該 等加熱機構之作用，可將個片12貼附於基板1。因此，黏著 膜10會更易黏於基板1。另，加熱機構不設於載置台26及壓 著台，亦可設於保持機構13或壓著機構15。 接著，利用第8圖詳細說明剝離單元9及剝離步驟。 20 1264781 剝離單元9設有第8圖所示之剝離膜除去機構I6。剝離 膜除去機構16設有制離膜除去用之接著帶17及按壓機構 18。又，剝離膜除去機構16包含有剝離台33、繞捲滾筒34、 色檢測器35、及檢測板36。剝離台％設置成隔著基如與按 5壓機構18相對。繞捲滚筒34用以繞捲接著帶。色檢測器％After 5", the position of the adhesive tape 3 is cut at the position 27, and the adhesive tape 3 is cut to the required size. Thereafter, the holding mechanism 13 holds the pieces η. The holding mechanism 糸 糸 糸 泵 泵 泵 泵 泵 泵 泵 泵 泵 泵 泵 泵 泵 泵 泵 泵 泵 泵 泵 泵 泵 泵 泵 泵 泵 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于The position 2 of the substrate U can be identified using a ccd (charge matching component) camera or the like. Further, in addition to the position 2 of the substrate 1, the image pickup unit 14 can monitor the sheets to maintain the condition and the cut state of the sheets 12. Fig. 5 shows a movement. Identification step 包含 including both the conventional movement steps τ and V shown in Figs. 12 and 12, and the conventional identification steps shown in Fig. 11. The steps shown in Fig. 5 are carried out by the holding mechanism 13 and the image pickup unit 14 simultaneously with 15 steps of movement and identification. In the movement/recognition step β shown in Fig. 5, the pieces 12 held by the holding mechanism 13 are movable from the position 27 toward the position 2 of the substrate 1. On the other hand, the photographing mechanism 14 continues the photographing position 2 until the individual sheets 12 are placed at the position 2. At this time, the delivery mechanism 25 sends out the adhesive tape 3 which is to be cut. Thus, as shown in Fig. 5, with the mounting device 90 of the electronic component, the conventional moving step T and the moving step V can be simultaneously performed, so that the time required for installing the electronic rain I can be shortened. Fig. 6 shows the state in which the conventional loading step W corresponding to Fig. 13 is simultaneously performed, and the state corresponding to the conventional identification step 12 18 1264781 shown in Fig. 11 is performed. In the placement/recognition step c shown in Fig. 6, the individual pieces 12 can be placed at the position 2 recognized by the imaging unit 14. The first slice 12 in this step can be placed in position 2. That is, the temporary pressing step of the individual sheets 12 is ended. At this time, the imaging mechanism Μ moves to the upper position 2 and the shooting position 2 is taken. The attachment method of the adhesive tape of the embodiment shown in the above Figs. 4 to 6 reduces the number of steps compared with the attachment method of the conventional adhesive tape. More specifically, the conventional temporary pressing step has to perform the five steps S to W shown in FIGS. 9 to 13 , but the temporary pressing step of the embodiment only needs to be performed in the FIG. The three steps Α ~ C, so all the time required to perform a series of steps can be shortened. Next, the steps shown in Figs. 4 to 6 will be described in more detail using the substrate 1 shown in Fig. 2 . First, the pieces 12 are placed at the position 2h and the position 2g. Then, the holding mechanism 15 and the image pickup unit 14 reciprocate along the transport tray 21, and the individual sheets 12 are placed at the position 2e and the position 2f. Then, the holding mechanism π and the image pickup mechanism 14 reciprocate along the conveyance guide 21 to place the individual pieces 12 on the position 2c and the position 2d. Once again, the holding mechanism 13 and the imaging unit 14 reciprocate along the transport tray 22, and the individual sheets 12 are placed at the position 2a and the position 2b. As a result, the sheets 12 are placed at all positions 2 of the base 20 plate 1. Further, steps A to c of the temporary pressing step shown in Figs. 4 to 6 are the holding means 13 for holding the sheets 12 by the adsorption peeling film 11, but other holding means may be used. Further, as shown in Fig. 7, the holding mechanism 13 includes a front end portion 29, a shaft portion 19 1264781 30, and a load portion 31. The front end portion 29 is attached to the front end fixture 28 in accordance with the type of the sheet 12. The shaft portion 30 is mounted with a front end portion 29 including a front end jig 28. The shaft portion 30 is fitted into the load portion 31 and is in a movable state. The load portion 31 has a function of moving the distal end portion 29 (including the distal end jig 28) and the shaft portion 30 in the vertical direction. Further, at the time of the temporary pressing step, the holding mechanism 13 moves the shaft portion 30 downward by a predetermined single length P shown in Fig. 7, and presses the pieces 12 with a predetermined load. To perform the movement of the shaft portion 30, a load is applied to the shaft portion 30 by the magnetic gas. For the structure to be executed, the shaft portion 30 and the load portion 31 have magnets 32a and 10 32b, respectively. The shaft portion 30 is fitted into the load portion 31, the magnet 32a is attached to the shaft portion 30, and the magnet 32b is attached to the load portion 31. The shaft portion 30 is movable in the vertical direction by the repulsive force and the suction force between the magnet 32a and the magnet 32b. Further, the holding mechanism 13 may move the shaft portion 30 in the vertical direction by an elastic material (not shown) such as a compression spring. After the temporary pressing step, the true pressing unit 8 performs the pressing step. Hereinafter, the true pressing step will be described. As shown in FIGS. 1 and 3, the pressing unit 8 is provided with a pressing mechanism 15. The crimping mechanism 15 has the ability to apply a larger load to the adhesive tape 3 than the holding mechanism 13. Although not shown, the substrate 1 is placed on the pressing table. 20 The mounting table 26 and the pressing table are respectively provided with heating means (not shown). The sheets 12 can be attached to the substrate 1 by the action of the heating means. Therefore, the adhesive film 10 is more likely to adhere to the substrate 1. Further, the heating means is not provided on the mounting table 26 and the pressing table, and may be provided in the holding mechanism 13 or the pressing mechanism 15. Next, the peeling unit 9 and the peeling step will be described in detail using FIG. 20 1264781 The peeling unit 9 is provided with a peeling film removing mechanism I6 shown in Fig. 8. The peeling film removing mechanism 16 is provided with an adhesive tape 17 for removing the film and a pressing mechanism 18. Further, the release film removing mechanism 16 includes a peeling stage 33, a winding drum 34, a color detector 35, and a detecting plate 36. The peeling station % is disposed so as to be opposed to the pressing mechanism 18 via the base. The winding drum 34 is used to wind the belt. Color detector%
用以辨識剝離膜11。檢測板36設置成隔著接著帶17與1检 測器35相對。 X • 剥_ 口 33。又有冷部機構（未圖示），俾輕易自雙層構造 之個片12僅除去剝離膜u。該冷卻機構是用以在剝離步驟 守~部發熱之部分（基板1上之個片12部分）。 按壓機構18之前端部分之材質是氣樹脂等具有彈力之 =材料。這種結構可防止過度之按壓力損傷黏著卿。又， 延可對接著帶17施加大致均一之壓力。 15 又，第8圖所示之剝離膜除去機構16設有可賦與接著帶 他:力，及緩和該拉伸力之接著帶供給機構（未圖示）。 • '接著f供給機構具有一對捲輪。該-對捲輪，係-用以 於基板1之個片12送出接著帶17之送出捲輪，及另一用 、，捲人自個片12除去之剝離膜11黏接之接著帶17的繞捲 捲輪。 20 又剝離台33與繞捲捲輪之間設有色檢測器35。色檢測 可檢測顏色之檢測器。因此，若在剝離膜⑽先上有 一種顏色，而在接著帶17上有與前述一種顏色不同之顏 色就可輕易檢測出剝離膜11。結果，可迅速掌握剝離膜 11疋否已自黏著帶3上除去。另，亦可當色檢測器％檢測到 21 1264781 剝離㈣ι執行例如將晶請_已剝離檢測到之剝 之基板1上的點著膜10的步驟。又，亦可當色檢測器 “ 時’不執行將晶片40貼附於尚未剝離 仍^未檢測到之制離膜11之基板！上的黏著膜1〇的步 驟，並停止該作業。 ^ 卜，亦可§色檢測器35未檢測到剝 會視為黏著膜1G未以適當狀態貼附於基板1上的 里二現’且透過警報器等警告設備來告知作業者此 異常現象的發生。 10 15 20Used to identify the release film 11. The detecting plate 36 is disposed opposite to the detector 35 via the subsequent belt 17. X • Stripping _ mouth 33. Further, there is a cold portion mechanism (not shown), and the peeling film u is removed only from the sheet 12 having a double-layer structure. The cooling mechanism is a portion (the portion of the sheet 12 on the substrate 1) for heating in the peeling step. The material of the front end portion of the pressing mechanism 18 is a material having elasticity such as a gas resin. This structure prevents excessive pressure from damaging the adhesive. Further, the extension can exert a substantially uniform pressure on the subsequent belt 17. Further, the release film removing mechanism 16 shown in Fig. 8 is provided with an adhesive tape supply mechanism (not shown) which can impart a force to the tape and relax the tensile force. • 'The f supply mechanism has a pair of reels. The pair of reeling wheels are used for feeding the reel of the belt 17 on the sheet 12 of the substrate 1, and the stripping film 11 for bonding the stripping film 11 which is removed by the sheet 12 from the sheet. Winding reels. Further, a color detector 35 is provided between the peeling table 33 and the winding reel. Color detection A detector that detects color. Therefore, if the release film (10) has a color first, and the subsequent tape 17 has a color different from the above one, the release film 11 can be easily detected. As a result, it is possible to quickly grasp whether the release film 11 has been removed from the adhesive tape 3. Alternatively, the color detector % may detect that 21 1264781 peeling (tetra) is performed, for example, to smear the film 10 on the substrate 1 which has been peeled off and detected. Further, the color detector "when" does not perform the step of attaching the wafer 40 to the adhesive film 1 on the substrate of the film 11 which has not been peeled off yet, and stops the operation. Alternatively, the color detector 35 may detect that the adhesive film 1G is not attached to the substrate 1 in an appropriate state, and the warning device such as an alarm is used to notify the operator of the occurrence of the abnormal phenomenon. 10 15 20
^圖斤不之檢測板36是用以藉色檢測器35更正確 地檢測加在剝離膜U 之顏色。因此，在檢測板36靠接著 ::之面上有與加在剝離膜11上之-種顏色不同的顏 色。唯，測板36非本發明必要之構成要素。 如前所述，依本電子零件之安裝裝置90，縱使假設剝 =膜η及接㈣17是透明的，但是由於在_前及接著 ▼上刀別上有相互不同之顏色，所以可藉色檢測器^正 確且迅速地檢《μ已自场去㈣膜u。 另，本實施形態中，黏著帶3為雙層構造，不過，若使 用單層構造之黏著帶’亦可不進行前述剝離步驟，而僅進 行暫時壓著步驟及真壓著步驟。又，㈣帶3之構造不限於 雙層構造’亦可是三層以上之多層構造。 又，本實施形態中，當使用倒裝晶片基板作為基板i 時，晶片40亦可糾凸塊（連接電極）安裝於基板卜又， 亦可於第1晶片4〇之上面，藉由另—兩主表面具有黏著性之 I占著膜再將第2晶片安裝於基板1。 22 1264781 前述詳細地說明本發明’不過僅為顯示範例而已，並 非用來限疋本發明者，本發明的界定在於發明精神與範圍 及申請專利範圍所示者。 【圖式簡單說明】 第1圖係貝施形恶之晶片結合用黏著帶之貼附方法 所使用之貼附裝置的平面圖。 第2圖係藉W圖所示之貼附裝置貼附黏著膜之基板的 立體圖。 第3圖係顯示第1圖所示之貼附裝置連結晶片結合裝置 10 之狀態的平面圖。 第4圖係說明藉第i圖所示之貼附裝置進行暫時壓著步 驟之A步驟的圖。 第5圖係係說明藉第i圖所示之貼附裝置進行暫時壓著 步驟之B步驟的圖。 15 第6圖係係說明藉第1圖所示之貼附裝置進行暫時壓著 步驟之C步驟的圖。The detection plate 36 is used to more accurately detect the color applied to the release film U by the color detector 35. Therefore, the color of the detection plate 36 on the surface following the following is different from the color applied to the release film 11. Only the measuring plate 36 is not a necessary component of the present invention. As described above, according to the mounting device 90 of the electronic component, even if the peeling film η and the joint (four) 17 are transparent, since the sigma and the sigma are different in color, the color detection can be performed. The device ^ correctly and quickly checks that "μ has been self-fielded (four) film u. Further, in the present embodiment, the adhesive tape 3 has a two-layer structure. However, the adhesive tape of the single-layer structure may be subjected to the temporary pressing step and the true pressing step without performing the peeling step. Further, the structure of the (four) belt 3 is not limited to the two-layer structure', and may be a multilayer structure of three or more layers. Further, in the present embodiment, when a flip chip substrate is used as the substrate i, the wafer 40 may be mounted on the substrate or the bumps (connecting electrodes), or may be on the top surface of the first wafer 4, by another The two main surfaces have adhesiveness I occupy the film and the second wafer is mounted on the substrate 1. 22 1264781 The foregoing detailed description of the present invention is intended to be illustrative and not restrictive, and the invention is defined by the scope of the invention and the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view of a patching device used in a method of attaching an adhesive tape for a bonded wafer. Fig. 2 is a perspective view showing the substrate to which the adhesive film is attached by the attaching device shown in Fig. 2. Fig. 3 is a plan view showing a state in which the attaching device shown in Fig. 1 is connected to the wafer bonding apparatus 10. Fig. 4 is a view showing the A step of the temporary pressing step by the attaching device shown in Fig. i. Fig. 5 is a view for explaining the step B of the temporary pressing step by the attaching device shown in Fig. i. 15 Fig. 6 is a view showing the C step of the temporary pressing step by the attaching device shown in Fig. 1.
第7圖係顯示第1圖所示之貼附裝置之保持機構的圖。 第8圖係說明藉第i圖所示之貼附裝置進行之剝離步驟 的圖。 20 第9圖係說明習知暫時壓著步驟之8步驟的圖。 第10圖係說明習知暫時壓著步驟之T步驟的圖。 第11圖係說明習知暫時壓著步驟之U步驟的圖。 第12圖係說明習知暫時壓著步驟步驟的圖。 第13圖係說明習知暫時壓著步驟之W步驟的圖。 23 1264781 主要元件符號說明】 1...基板 25 (25a、25b)…送出機構 2(2a〜2h)，27…位置 26...載置台 3...黏著帶 28...前端治具 4...貼附部 29...前端部 5...内收納部 30...軸部 6...外收納部 31...負載部 7...暫時壓著單元 32 (32a,32b) ···磁鐵 8·.·真壓著單元 33...剝離台 9...剝離單元 34...繞捲滾筒 10...黏著膜 35...色檢測器 11...剝離膜 36...檢測板 12…個片 40…晶片 13...保持機構 50…貼附裝置 14,23...攝像機構 60...晶片結合裝置 15.. .壓著機構 16.. .剝離膜除去機構 17.. .接著帶 18.. .按壓機構 19.. .晶片結合單元 20.. .安裝機構 21.. .搬送軌 22.. .移動軌 24 (24a、24b)…切斷機構 90...電子零件之安裝裝置 24Fig. 7 is a view showing a holding mechanism of the attaching device shown in Fig. 1. Fig. 8 is a view showing a peeling step by the attaching device shown in Fig. i. 20 Figure 9 is a diagram illustrating the steps of the conventional temporary pressing step 8. Figure 10 is a diagram illustrating the T step of the conventional temporary pressing step. Figure 11 is a diagram illustrating the U step of the conventional temporary pressing step. Figure 12 is a diagram illustrating a conventional temporary pressing step. Figure 13 is a diagram illustrating the W step of the conventional temporary pressing step. 23 1264781 Explanation of main component symbols] 1...substrate 25 (25a, 25b)...feeding mechanism 2 (2a to 2h), 27...position 26...mounting table 3...adhesive tape 28...front end fixture 4...attachment portion 29...front end portion 5...inner housing portion 30...shaft portion 6...outer housing portion 31...load portion 7...temporary pressing unit 32 (32a 32b) ··· magnet 8···true pressing unit 33...peeling table 9...peeling unit 34...winding roll 10...adhesive film 35...color detector 11... The release film 36...the detection plate 12...the piece 40...the wafer 13...the holding mechanism 50...the attachment device 14,23...the imaging mechanism 60...the wafer bonding device 15...the pressing mechanism 16 .. . Release film removal mechanism 17 . . . Next to the belt 18.. Pressing mechanism 19.. Wafer bonding unit 20.. Mounting mechanism 21.. Transport rail 22.. Moving rail 24 (24a, 24b) ...cutting mechanism 90... mounting device for electronic components 24