200532816 九、發明說明： 【考务明戶斤屬 發明領域 之技姆領域】 ^日5转關於-種用以於基板之狀位置安裝電子 令件的晶片結合用黏著帶之貼附、 、电 去，及利用該黏著帶之 貼附方絲電子讀安裝於基 r杰一 κ 攸的电子零件之安裝方法。 L先月，j彻r】 背景技術200532816 IX. Description of the invention: [Examination of households belonging to the technical field of the invention] ^ Day 5 turns about-a kind of wafer bonding adhesive tape for mounting electronic order parts on the substrate-like position. And a method for mounting electronic components mounted on a base plate using an adhesive square wire electronic reader. L 先 月 ， j 彻 r】 BACKGROUND
10 15 主以往，利用黏著帶將電子零件貼附於基板之方法甚為 曰及。忒方法是使用兩主表 著帶。該方法如下進行。4黏者性之晶片、结合用黏 百先’將附有剥離帶之黏著帶切斷。藉此準備好附有 剝離帶之個片。藉伴ft +備好附有 …、冓保持刖述個片之狀態下使其移 動1之後’稭保持機構將前述個片載置於基板之預定位置。 此步驟稱為暫時壓著步驟。10 15 In the past, the method of attaching electronic parts to a substrate using an adhesive tape was very simple.忒 The method is to use two main watch straps. This method is performed as follows. 4 Adhesive wafers, bonding adhesives 100 'Cut off the adhesive tape with the release tape. This prepares a sheet with a release tape. With the companion ft + ready, after the pieces are held, they are moved 1 after they are moved. The straw holding mechanism places the pieces on a predetermined position on the substrate. This step is called the temporary crimping step.
;隻藉【著機構將載置於基板上之前述個片壓著在 基，上。於疋，於基板之預定位置遂貼有前述個片。即， '著'U主表面軸於基板。此步轉為真壓著步 驟。在此步驟結束後，個片與基板接觸之面之相反側的個 20片主表面仍殘留剝離膜。 接者，將接著帶按壓於基板上之個片之剝離膜。藉此 使接著π與難難接。之後，若將接著帶搬走，就可自 基板上除去剝m gj此，基板上僅殘留黏著膜。此步驟 #為&離n在剝離步驟之後’就可露出黏著膜之另一 200532816 主表面 藉 合 二後，於點著膜之另—主表面貼附電子零件。即， 由黏著膜將電+^ h # 士人甘、 步驟 ▼件女衣於基板上。此步驟稱為晶片於 月过乂種包子零件之安裝方法揭示於例如日本專利八 開公報特開200L135653號。 “ 又，在前述暫時壓著步驟時，如第9圖〜第13圖所示， 保持機構101與攝像機構102—體地移動。 接下來，更具體說明前述暫時壓著步驟。 1〇 Τ先’如第9圖所示，在位置奶將黏著帶1〇4切斷成所 要尺寸藉此形成黏著膜l〇3a上附有剝離膜1〇3b之個片 1〇3。然後，藉保持機構101保持個片1〇3。舉例而言，可由 保持機構101吸附剝離膜1031)之主表面。第9圖所示之此步 驟稱為保持步驟s。 15 接著，如第10圖所示，藉保持機構101保持個片103之 狀悲下，保持機構1 〇 1及攝像機構1 〇2 —體地自位置1 移動 直至基板1 〇〇之上方。第10圖所示之此步驟稱為移動步驟T。 接著，如第11圖所示，當到達基板1〇〇上方時，攝像機 構102會辨識基板1〇〇上可安裝電子零件之位置。第u圖所 20 示之此步驟稱為辨識步驟U。 然後，如第12圖所示，當辨識步驟U結束後，保持機構 101及攝像機構102—體地移動直至在辨識步驟u時所辨識 之位置之上方。第12圖所示之此步驟稱為移動步驟v。 之後，如第13圖所示，當保持機構101到達在辨識步驟 6 200532816 u時所辨識之位置之上方時，保持機構1〇1將個片1〇3載置於 基板100之預定位置。此時，個片103可與基板100黏接。此 步驟稱為載置步驟W。 第9圖〜第13圖所示，前述習知暫時壓著步驟，係依序 5 進行步驟S〜步驟W之5個步驟。 專利文獻1:日本專利公開公報特開2001_135653號（第 13頁，第1圖） 【發明内容3 發明課題 〇 近年來，為達到降低基板成本之目標，大多是使用一 片基板上可安裝大量電子零件之矩陣型基板。此外，矩陣 里基板上所女裝之電子零件也是輕薄短小。因此，如何可 迅速又高精度地於矩陣型基板上安裝大量電子零件成為一 重要課題。 另方面，刖述習知技術中，保持機構101與攝像機構 為體因此，必須依序進行步驟s〜步驟w。於是， /驟S步驟W各自均進行迅速，仍舊很難大幅縮短暫 Μ著步驟整體之時間。舉例而言，由於在保持步驟s時， 、象機構1G2無錢仃辨識步卿，所以暫賴著步驟難以 迅速進行。又，如果JJ定 ^ v驟5〜步驟W個別所需之時間壓縮 短’就無法高精度地進行暫時壓著步驟。總之，就是無 法既高精度地進㈣時壓著步驟。 ’不㈣彳離步驟所肖之接著帶及剝離 均為透日㈣’因此Μ用紅外線感測科，無法檢測到 7 200532816 f已自黏著帶上除去剝離膜。x，即使剝離膜材料是不 透明的’要精紅外線感測器迅速檢測出是否已除去剝離膜 因此，根本無法在黏著帶貼附於基板後，迅速 將電子苓件貼附於黏著帶上。 另’由於前述用以進行將黏著帶貼附於基板之步驟之 裝置及用以進行將電子零件安裝於黏㈣之步驟之裝置是 :=:所:無法連續進行該等步驟。因此，極難縮短 正體电子令件女裝作業時間。 10 15 20 本發明係有鑑於前述問題而作成者，目的在於提供— 種可迅速且高精度地將前述晶片結合用黏著帶（黏著膜） 貼附於基板之預定位置之^結合⑽著帶之_方法。 又’本發明另_目的在於提供—種可迅速檢測出前述 “結合用黏著帶之剝離構件是否已除去之晶片結合用黏 者f之貼附方法。 卜本毛明另-目的在於提供—種由於可連續進行 從將前述晶片結合用黏著帶載置於基板之肢位置的步 結合_著帶將電子零件安裝於基板之 預疋m‘所有步驟，所以可迅速且高精度地將電子 零件安裝於純之狀位置的電子料之安裝方法。 發明概要 本1明之-態樣之晶片結合用黏著帶之貼附方法，係 首先藉攝像機構辨識基板上之預定位置；接著，利用保持 ，構保持兩主表面具有黏著性之黏著膜；然後，依前述預 置輯、、、。果，使雨述保持機構移動並將前述黏著膜 8 200532816 貼附於前述子g宋#里 、， 膜之=Γ，可縮短辨識預定位置之步驟及保持黏著 膜之步驟所需作業時間。 者 10 15 20 係首11=另'態樣之晶片結合用黏著帶之貼附方法， 述種ΓΓ構件上一種顏色；接著，在接著帶加上盘前 ::顏=顏色;之後’將其中—主表面安裝有 後，利用此表面具有一黏著性之黏著帶貼附於基板。然 H 接著帶將前述剝離構件自前_ ”上除 “’彻色檢測ϋ檢顺述接 珂述剝離構件。 疋古黏接有 Τ前述料，可迅速檢測岐否已除去剝離構件。 第1步：另'Γ之電子零件之安裝方法，係首先 其中—主表面安裝有剝離構件且兩主表面具有 著載置於基板之預定位置;第一^ 板上.=置於W述預定位置之前__㈣在前述基 著膜除去=驟’使前述剝離構件與接著帶黏接以自前述黏 膜；、及^亥剝離構件，並使前述基板上僅殘留前述黏著 定位署4步驟’藉由前述黏著膜將電子零件安裝於前述預 第4牛驟用以執行前述第1〜第3步驟之裝置與用以執行前述 步驟可設為—體，且前述第1〜第3步驟及前述第4 依前述方法，可在除去剝離膜後立刻將電子零件安裝 9 200532816 於殘留於基板上之黏著膜。 自以下配合圖式說明之詳細内容，可更清楚地理解本 發明之前述及其他目的、特徵、態樣和優點。 圖式簡單說明 5 第1圖係一實施形態之晶片結合用黏著帶之貼附方法 所使用之貼附裝置的平面圖。 第2圖係藉第1圖所示之貼附裝置貼附黏著膜之基板的 立體圖。 # 第3圖係顯示第1圖所示之貼附裝置連結晶片結合裝置 10 之狀態的平面圖。 第4圖係說明藉第1圖所示之貼附裝置進行暫時壓著步 驟之A步驟的圖。 第5圖係係說明藉第1圖所示之貼附裝置進行暫時壓著 步驟之B步驟的圖。 15 第6圖係係說明藉第1圖所示之貼附裝置進行暫時壓著 步驟之C步驟的圖。 ® 第7圖係顯示第1圖所示之貼附裝置之保持機構的圖。 第8圖係說明藉第1圖所示之貼附裝置進行之剝離步驟 的圖。 20 第9圖係說明習知暫時壓著步驟之S步驟的圖。 第10圖係說明習知暫時壓著步驟之T步驟的圖。 第11圖係說明習知暫時壓著步驟之U步驟的圖。 第12圖係說明習知暫時壓著步驟之V步驟的圖。 第13圖係說明習知暫時壓著步驟之W步驟的圖。 10 200532816 【實施方式】 較佳實施例之詳細說明 以下，利用圖式說明本發明之實施形態之晶片結合用 黏著帶之貼附方法及電子零件之安裝方法。 首先第1圖及第2圖，說明本發明一實施形態之 將黏著膜貼附於基板之晶片結合用黏著帶之貼附方法。 該實施形態之晶片結合用黏著帶（以下只稱為「黏著 帶」）之貼附方法使用貼附裝置5〇。如第丨圖及第2圖所示， 貼附裝置50是用以將黏著膜1〇貼附於基板〗之位置2。黏著 1〇膜10是用以將電子零件之半導體晶片（以下只稱為「晶片」） 4〇安裝於基板1。 貼附裝置50包含有可將黏著帶3切斷為所需尺寸之個 片12的切斷部。另，個片12上黏有作為晶片結合材之黏著 膜10及作為剝離構件之剝離膜11。又，黏著膜1〇是兩主表 15面均具有接著力之雙面接著膜。因此，最後，黏著膜10以 其中一主表面貼附於基板1，另一主表面則與晶片40貼附。 另’剝離膜11係在黏著膜10之另一主表面與晶片40貼附之 前用以保護該另一主表面的構件，亦係當個片12移動時可 由保持機構13吸附的構件。 20 又，貼附裝置50包含有用以將個片12貼附於基板1之貼 附部4。此外，貼附部4之其中一側設有用以收納貼有個片 U前之基板1的内收納部5。貼附部4之另一側設有用以收納 貼有黏著膜10後之基板1的外收納部6。 首先，將基板1自内收納部5搬送至貼附部4。然後，在 11 200532816 後述之貼附步驟時，於基板1貼附個片12。接著，將基板工 自貼附。卩4搬送至外收納部6。在貼附步驟時，基板丨之移動 路I大略呈直線。因此，貼附步驟可有效率地進行。另， 貼附部4、内收納部5、及外收納部6設置成相互之間可自由 5裝卸，俾權宜變更該等結構之配置。 又，該實施形態之黏著帶3具有黏著膜1〇與剝離膜^組 成之兩層構造，不過，亦可具有僅黏著膜1〇組成之單層構 造，或者亦可具有黏著膜10之兩主表面分別設有剝離膜^ 的三層構造。 1〇 如第1圖所示，自内收納部5朝外收納部6方向，貼附部 4依序設有暫時壓著料7、真壓著單元S、及剝離單元^ 由於暫時壓著單元7、真壓著單元8、及剝離單元9設置成相 互之間可自由裝卸，所以可權宜變更該等單元之配置。另， 剝離單元9是用以自黏著膜10上除去剝離臈u。 15 时納部5收納貼有個片12前之基板1，外收納部6收納 貼有個片12後之基板丨，兩者均是用以收納基板丨。兩者基 本構成要件纽大致相同。内收納部5及外收納部艸，分 別在鉛直方向上相隔間距疊放多片基板j。 前述外收納部6用以收納多片貼有黏著膜川之 扣因此，在前述外收納部6,必須在相隔間距之狀能下聂收基 板1 ’使其不致藉由黏著膜·相絲接。但是，在用叫 納多片貼有黏著㈣前之基板！的内收納部5,基板i並不會 藉由黏著膜10而相互黏接，所以亦可在多片基板冰互接觸 之狀態下疊收基板1。 12 200532816 又，為依内收納部5、貼附部4、及外收納部6之順序搬 送基板1，第1圖所示之貼附裝置5〇在貼附部4内設有2條大 略呈直線狀之搬送軌21。如第4圖〜第6圖所示，2條搬送軌 21各自之鉛直截面之形狀均為c字形。字形之搬送 5執21之凹部分別可插入基板1之兩側端部。又，搬送執21設 有基板夾頭機構（未圖示）。因此，可沿搬送軌21依内收納 部5、貼附部4、及外收納部6之順序搬送基板1。 使用前述暫時壓著單元7、真壓著單元8、及剝離單元 9，可執行以下貼附步驟。 1〇 首先，於暫時壓著單元7中，在藉保持機構13保持個片 12之狀態下搬運個片12，並載置於基板〗之主表面上之位置 2。此步驟稱為暫時壓著步驟。接著，於真壓著單元8中， 藉壓著機構15將載置於基板丨之個片12壓著在基板丨上。此 步驟稱為真壓著步驟。藉此，基板i之主表面上之位置2貼 15有個片12。此時，個片12上仍殘留剝離膜n。 然後，使用剝離膜除去機構16以除去剝離膜u。剝離 膜除去機構16具有為單面黏著帶之接著帶17及按壓機構 18。按壓機構18用以將接著帶17之接著面按壓於基板丨之個 片12上。藉此，接著帶17與剝離膜丨丨黏接。又，接著帶工了 由繞捲裝置捲著。因此，在接著帶之接著面與剝離膜U 黏接後，若按壓機構18自接著帶17上離開，隨著接著帶17 之移動，就可自黏著膜1〇上除去剝離膜u。因此，基板1上 僅殘留黏著膜1〇。於是，完成於基板貼附黏著帶之貼附步 驟。 13 200532816 第2圖係在8處位置2a〜2h顯示8個步驟之貼附狀態。第2 圖如此顯不之理由是為求階段性顯示前述貼附步驟（暫時 壓著步驟、真壓著步驟、及剝離步驟）時個片12之貼附狀 態，以及貼附步驟前後之步驟時個片12之貼附狀態。 5 位置2b顯示進行暫時壓著步驟前之基板1的狀態。又， 位置2a顯示藉保持機構13將個片12載置於基板丨時的狀 態’即暫時壓著步驟時之基板^勺狀態。 位置2c及2d顯示藉壓著機構15將載置於基板丨之個片 12壓著在基板1後的基板丨狀態，即真壓著步驟結束後之基 !〇 板1的狀態。 位置2f顯不在剝離單元9中除去剝離膜u之前之基板工 的狀悲。又，位置2e顯示藉剝離膜除去機構16除去剝離膜 11時之基板1的狀態，即剝離步驟時之基板丨的狀態。 位置2g顯示將晶片4〇安裝於黏著膜1〇前之狀態。又， 15位置2h顯示晶片40完全安裝於黏著膜10後之基板1的狀 態’即晶片結合步驟結束後之基板丨的狀態。 總而言之，自位置2a到位置2f是顯示藉貼附裝置刈進 行之貼附步驟，位置2g、2h則顯示藉後述之第3圖所示之曰 片結合裝置60進行之晶片結合步驟。$，晶片4〇是:設: 20晶片結合裝置60之安裝機構20安裝於黏著膜1〇。 接著，利用第3圖說明晶片結合裝置6〇。 令件之安裝方法所 所示之貼附裝置50 〇 ®此’貼附步驟 又’第3圖所示之本實施形態之電子 使用的電子零件之安裝裝置90中，第1圖 與第3圖所示之晶片結合裝置60相互連結 200532816 結束後，可連續進行晶月結合步驟。所以，使得電子零件 安裝到基板1的整體安裝程序之時間缩短。 在電子零件之安裝裝置90,為依内收納部5 、貼附部4、 晶片結合裝置60、及外收納部6之順序搬送基幻，於貼附 5部4及晶片結合農置60内設有2條大略呈直線狀之搬送軌 21。2條搬迗執21各自之船直截面之形狀與第i圖所示之貼 附裝置5G中的是相同。即，如第4圖〜第_所示之c字形。 此2條C子形之搬送軌21之凹部分別可插入基板丨之兩側端 部。又，搬送軌21設有基板夾頭機構（未圖示）。因此，可 1〇沿搬送軌21依内收納部5、貼附部4、晶片結合裝置6〇、及 外收納部6之順序搬送基板1。 ,、又，如第3圖所示，當晶片結合裝置60與貼附裝置50 欲相互連結時，首先將貼附裝置50之外收納部6自貼附部4 卸下，接著，將晶片結合裝置6〇安裝於貼附裝置5〇。然後， 再將外收納部6安裝於晶片結合裝置6〇。此時，外收納部6 可收納已安裝有晶片40之基板1。 本貝苑形態之電子零件之安裝方法所使用的電子零件 之女裝裝置90，由於將貼附裝置5〇與晶片結合裝置6〇相互 衾士 9 戶斤、 以可更迅速且高精度地將晶片4〇貼附於黏著膜 20 1〇。是，一 細短安裝電子零件之一系列相關步驟所需之 所有時間，即週期時間。 又’如果可使貼附裝置50之暫時壓著單元7、真壓著單 凡8、剝離單元9，及晶片結合裝置60之晶片結合單元19沿 搬送|九21滑動’還可進_步縮短週期時間。 15 200532816 接著，利用第1圖〜第6圖說明前述暫時壓著單元7及暫 時壓著步驟。 如第4圖〜第6圖所示，暫時壓著單元7設有用以邊保持 基板1邊使其移動之保持機構13及用以辨識基板丨之攝像機 5構14。除前述2個機構以外，暫時壓著單元7還包含有用以 導引保持機構13及攝像機構14之移動的移動執22、用以辨 識個片12之攝像機構23、用以切斷黏著帶3之切斷機構％、 用以送出黏著帶3之送出機構25、可載置個片12之載置台 26又，兩述保持機構I〗、攝像機構14、攝像機構23、切 10斷機構以、送出機構25、及載置台26設置成相互之間可自 由裝卸，所以可變更該等位置關係。 又，保持機構13及攝像機構14分別可移動地設於移動 軌22上。保持機構13及攝像機構Η可相互獨立地由移動執 22導引而移動。因此，保持機構13及攝像機構叫自可沿 15相對於第！圖所示之搬送㈣延伸方向大約為直交的方向 移動。所以，保持機構13及攝像機構14可大致同時地進行 保持步驟及攝像步驟。 20 如第4圖〜第6圖所示，保持機構13可沿移動執22而在載 置著切斷後之個片12的位置27與㈣附個片12之基板】上 的位置2之間移動。又，攝像機構14可沿寬度方向自載置台 26之一側端部到另一側端部移動。 另一方面 像機構14外， 識用之攝像機 電子零件之安«置90在基板辨識用之攝 另設有帶辨識用之攝像機構23。χ，基板辨 構14可沿移動軌22往復移動，是攝像機構 16 200532816 23是固定在位置27上方之位置。不過，攝像機構23亦可與 攝像機構14同樣地可沿移動執22往復移動。如第4圖〜第6 圖所示，藉攝像機構23，可辨識個片12由保持機構13保持 之狀態、藉切斷機構24切斷黏著帶3之狀態、及藉送出機構 5 25送出黏著帶3之狀態等。 又，切斷機構24及送出機構25可與貼附裝置％設成_ 體，且該兩機構是於貼附裝置50之内部或外部設成相互之 間可自由裝卸。 又，送出機構25可將粘著帶3供給至切斷機構24形成個 10片12之位置27。切斷機構24用以切斷黏著帶3。 切斷黏著帶3，係由第1圖所示之切斷機構24a之切割構 件（未圖示）進行。切割構件可沿寬度方向切斷送出機構 25a送出之黏著帶3。又，本實施形態在切斷黏著帶時，除 丽述切割構件以外，尚使用切斷機構24b之沖壓構件（未圖 15示）。沖壓構件可藉沖壓來切斷送出機構况送出之黏著帶3 之一部分。切割構件與沖壓構件是設成相互獨立。 又，送出機構25具有繞捲收納黏著帶3之收納部（未圖 示）。該收納部可捲繞各種黏著帶3。 又，雖然說明的是藉切割方式之切斷機構24a切斷黏著 2〇 ▼ 3之例不過可依基板1及黏著帶3來變換切割方式及沖壓 方式。為了可變換方式，切斷機構24及送出機構25是設成 可沿基板1之搬送方向滑動。 接下來，利用第4圖詳細說明暫時壓著步驟。 第4圖顯示用以保持黏著帶3之保持機構13與用以辨識 17 200532816 基板之攝像機構u獨立地移動，並同時執行保持步驟與辨 谶步驟的保持·辨識步驟。 第4圖所不之保持·辨識步驟A，首先自送出機構25送 出黏著然、後，在位置2?藉切斷機構24將黏著帶3切斷 成所而尺寸。之後，藉保持機構13保持個片12。保持機構 13係利用泵等吸引裝置吸附剝離膜u之主表面來保持個片 12。又’由於攝像機構1何不管保持機構13之動作而獨立 移動，所以當藉保持機構13吸附個片12期間，可使用⑽ (電餘合元件）相機等來辨識基板1上之位置2。另，除 10基板1之位置2以外，攝像機構14亦可監看個片以保持狀 況及個片12之切斷狀況。 第5圖顯示包含第10圖及第12圖所示之習知移動步驟τ 及V、第11圖所示之習知辨識步驟1；兩者的移動·辨識步驟 第5圖所示之步‘係藉保持機構丨3及攝像機構14同時進 15 行移動步驟與辨識步驟。 第5圖所示之移動·辨識步驟科，藉保持機構13保持 之個片12可自位置27朝基板i之位置2移動。另一方面，攝 像機構14在個片12載置於位置2之前，持續拍攝位置2。此 時，送出機構25送出接著要切斷之黏著帶3。如此，如第5 20圖所示，藉本電子零件之安裝裝置9〇,可同時進行習知移 動步驟T與移動步驟V，所以可縮短安裝電子零件所需時; Only by pressing the aforementioned piece placed on the substrate on the substrate by the mechanism. Yu Li, the aforementioned piece was pasted on a predetermined position of the substrate. That is, the main surface of the "U" U is axial to the substrate. This step turns into a true pressure step. After this step is completed, a peeling film remains on the main surfaces of the 20 pieces on the opposite side of the surface where the pieces are in contact with the substrate. Then, a peeling film which is pressed on a piece on the substrate is then attached. This makes it difficult to follow π. After that, if the adhesive tape is removed, the mgj can be removed from the substrate, and only the adhesive film remains on the substrate. This step # & n after the peeling step ’, the other main surface of the adhesive film can be exposed. In other words, the electric film + ^ h # 士人 甘, steps ▼ pieces of women's clothing on the substrate by the adhesive film. This step is referred to as a method for mounting a kind of steamed bun parts on a wafer, and is disclosed in, for example, Japanese Patent Publication No. 200L135653. “Also, during the aforementioned temporary pressing step, as shown in FIGS. 9 to 13, the holding mechanism 101 and the imaging mechanism 102 are moved integrally. Next, the aforementioned temporary pressing step will be described in more detail. 'As shown in FIG. 9, at the position, the adhesive tape 10 is cut to a desired size to form a single piece 10 of the adhesive film 103 with a release film 103b attached thereto. Then, the holding mechanism is used. 101 holds a piece 103. For example, the main surface of the release film 1031) can be adsorbed by the holding mechanism 101. This step shown in FIG. 9 is called a holding step s. 15 Next, as shown in FIG. The holding mechanism 101 holds the piece 103, and the holding mechanism 1 〇1 and the imaging mechanism 1 〇2 move from the position 1 to the substrate 100. The step shown in FIG. 10 is called a moving step. T. Next, as shown in FIG. 11, when reaching the top of the substrate 100, the imaging mechanism 102 recognizes the position where electronic components can be mounted on the substrate 100. This step shown in FIG. 20 is called an identification step U. Then, as shown in FIG. 12, after the identification step U is completed, the holding mechanism 101 and the camera Mechanism 102—moves physically until it is above the position identified during the identification step u. This step shown in FIG. 12 is referred to as the moving step v. Then, as shown in FIG. 13, when the holding mechanism 101 reaches the identification step, 6 200532816 Above the identified position, the holding mechanism 101 places the piece 103 on a predetermined position of the substrate 100. At this time, the piece 103 can be bonded to the substrate 100. This step is called loading Set step W. As shown in Fig. 9 to Fig. 13, the aforementioned conventional temporary pressing step is performed in order of 5 steps from step S to step W. Patent Document 1: Japanese Patent Laid-Open Publication No. 2001_135653 ( (Page 13 and Figure 1) [Summary of the Invention 3 Objects of the Invention In recent years, in order to achieve the goal of reducing the cost of a substrate, a matrix substrate that can mount a large number of electronic components on one substrate has been used. In addition, the substrates in the matrix The installed electronic parts are also thin and short. Therefore, how to quickly and accurately mount a large number of electronic parts on a matrix substrate becomes an important issue. On the other hand, in the conventional technology, the holding mechanism 101 and the camera are described. Therefore, it is necessary to perform steps s to w in order. Therefore, each step / step W is performed quickly, and it is still difficult to greatly reduce the time for temporarily holding the entire step. For example, while maintaining step s, Since the 1G2 institution has no money to identify the step prince, it is difficult to quickly perform the steps temporarily. Also, if the time required for JJ is fixed to step 5 ~ step W, the time required for individual compression is short, and the temporary pressing step cannot be performed with high accuracy In short, it is impossible to advance the pressing process with high precision. 'The adhesive tape and peeling of the non-detaching step are transparent.' Therefore, the infrared sensing section cannot detect 7 200532816 f. The release film was removed from the adhesive tape. x, even if the release film material is opaque, the infrared sensor quickly detects whether the release film has been removed. Therefore, it is not possible to quickly attach the electronic ling on the adhesive tape after the adhesive tape is attached to the substrate. In addition, because the aforementioned device for performing the step of attaching the adhesive tape to the substrate and the device for performing the step of mounting electronic parts on the adhesive tape are: =: so: these steps cannot be performed continuously. Therefore, it is extremely difficult to shorten the operation time of women's electronic body parts. 10 15 20 The present invention has been made in view of the foregoing problems, and an object thereof is to provide a ^ bonding tape which can quickly and accurately attach the aforementioned wafer bonding adhesive tape (adhesive film) to a predetermined position on a substrate. _method. It is another object of the present invention to provide a method for attaching a wafer bonding adhesive f that can quickly detect whether or not the peeling member of the bonding tape for bonding has been removed. The other purpose of this book is to provide a method Since all steps from the step of mounting the aforementioned adhesive tape for wafer bonding to the limb position of the substrate can be performed continuously, all steps of mounting the electronic component on the substrate can be performed in advance, so that the electronic component can be mounted quickly and with high accuracy. A method for mounting electronic materials in a pure position. Summary of the Invention The method for attaching an adhesive tape for wafer bonding according to the present invention is to first identify a predetermined position on a substrate by an imaging mechanism; Both main surfaces have adhesive adhesive films; then, according to the above-mentioned preset series, the movement of the rain-holding mechanism and the aforementioned adhesive film 8 200532816 is attached to the aforementioned sub-song # 里 ,, of the film = Γ, which can shorten the operation time required for the steps of identifying the predetermined position and the step of maintaining the adhesive film. 10 15 20 The first 11 = another method of attaching the adhesive tape for wafer bonding. ΓΓ a color on the component; then, before the tape is added to the disk :: Yan = color; after 'after which-the main surface is mounted, use this surface with an adhesive tape to adhere to the substrate. Then H then Remove the aforementioned peeling member from the front _ "" through the color detection and inspection of the peeling member. The ancient material is bonded with the aforementioned material to quickly detect whether the peeling member has been removed. Step 1: Another ' The installation method of electronic components of Γ is firstly in which-the main surface is provided with a peeling member and both main surfaces have a predetermined position on the substrate; the first ^ board. = Placed before the predetermined position described above __㈣ in the foregoing Removal of the base film = step 'adhesive the aforementioned peeling member and the adhesive tape to self-adhesive film; and peel the member and leave only the aforementioned adhesive positioning agent on the substrate 4 steps' to electronic components through the aforementioned adhesive film The device installed in the aforementioned pre-fourth step to perform the foregoing steps 1 to 3 and the device for performing the foregoing steps may be set as a single body, and the foregoing steps 1 to 3 and the foregoing step 4 may be performed in accordance with the foregoing method. Immediately after removing the release film Sub-component installation 9 200532816 on the adhesive film remaining on the substrate. The foregoing and other objects, features, aspects, and advantages of the present invention can be more clearly understood from the following detailed descriptions with the drawings. Brief description of the drawings 5 Chapter Fig. 1 is a plan view of an attaching device used in the method of attaching an adhesive tape for wafer bonding according to an embodiment. Fig. 2 is a perspective view of a substrate on which an adhesive film is attached by the attaching device shown in Fig. 1. # 第Fig. 3 is a plan view showing a state where the attaching device shown in Fig. 1 is connected to the wafer bonding device 10. Fig. 4 is a view explaining step A of the temporary pressing step by the attaching device shown in Fig. 1. Fig. 5 is a diagram illustrating step B of the temporary pressing step by the attachment device shown in Fig. 1. 15 Fig. 6 is a diagram illustrating C of the temporary pressing step by the attachment device shown in Fig. 1 Diagram of steps. ® Figure 7 shows the holding mechanism of the attachment device shown in Figure 1. Fig. 8 is a diagram illustrating a peeling step performed by the attachment device shown in Fig. 1. 20 FIG. 9 is a diagram explaining step S of the conventional temporary pressing step. Fig. 10 is a diagram illustrating the T step of the conventional temporary pressing step. Fig. 11 is a diagram explaining the U step of the conventional temporary pressing step. Fig. 12 is a diagram explaining the V step of the conventional temporary pressing step. Fig. 13 is a diagram explaining the W step of the conventional temporary pressing step. 10 200532816 [Embodiment] Detailed description of the preferred embodiment The method of attaching the adhesive tape for wafer bonding according to the embodiment of the present invention and the method of mounting electronic parts will be described below using drawings. First, FIG. 1 and FIG. 2 illustrate a method for attaching an adhesive tape for wafer bonding in which an adhesive film is attached to a substrate according to an embodiment of the present invention. The method for attaching the wafer bonding adhesive tape (hereinafter simply referred to as "adhesive tape") of this embodiment uses an attaching device 50. As shown in FIG. 丨 and FIG. 2, the attaching device 50 is used to attach the adhesive film 10 to the position 2 of the substrate. The adhesive 10 film 10 is used for mounting a semiconductor wafer (hereinafter simply referred to as a "wafer") 40 of an electronic component on the substrate 1. The attaching device 50 includes a cutting portion that can cut the adhesive tape 3 into individual pieces 12 of a desired size. An adhesive film 10 as a wafer bonding material and a release film 11 as a release member are adhered to the individual sheets 12. The adhesive film 10 is a double-sided adhesive film having adhesive force on both sides of the main surface 15. Therefore, in the end, the adhesive film 10 is attached to the substrate 1 with one main surface and the other main surface is attached to the wafer 40. The peeling film 11 is a member for protecting the other main surface of the adhesive film 10 before it is attached to the wafer 40, and also a member that can be adsorbed by the holding mechanism 13 when the sheet 12 is moved. 20 Also, the attaching device 50 includes an attaching portion 4 for attaching the individual pieces 12 to the substrate 1. In addition, one side of the attaching portion 4 is provided with an inner accommodating portion 5 for accommodating the substrate 1 before the piece U is attached. The other side of the attachment portion 4 is provided with an outer accommodation portion 6 for accommodating the substrate 1 to which the adhesive film 10 is attached. First, the substrate 1 is transferred from the inner storage portion 5 to the attaching portion 4. Then, in the attaching step described later in 11 200532816, a piece 12 is attached to the substrate 1. Next, the substrate is attached manually.卩 4 is transported to the outer storage section 6. During the attaching step, the movement path I of the substrate 丨 is approximately straight. Therefore, the attaching step can be performed efficiently. In addition, the attachment portion 4, the inner storage portion 5, and the outer storage portion 6 are provided so as to be freely attachable and detachable to each other, and it is appropriate to change the configuration of these structures. In addition, the adhesive tape 3 of this embodiment has a two-layer structure consisting of an adhesive film 10 and a release film ^, but it may also have a single-layer structure consisting of only an adhesive film 10, or it may have two main layers of an adhesive film 10 The surface is provided with a three-layer structure of a release film ^. 10 As shown in FIG. 1, from the inner storage portion 5 to the outer storage portion 6, the attaching portion 4 is provided with a temporary pressing material 7, a true pressing unit S, and a peeling unit in sequence. 7. The true pressing unit 8 and the peeling unit 9 are arranged to be freely attachable and detachable to each other, so it is expedient to change the configuration of these units. The peeling unit 9 is used to remove the peeling film 9 from the adhesive film 10. At 15 o'clock, the receiving part 5 stores the substrate 1 before the piece 12 is pasted, and the outer storage part 6 stores the substrate 1 after the piece 12 is pasted, both of which are used to store the substrate. The basic components of the two are basically the same. The inner housing portion 5 and the outer housing portion 艸 are stacked with a plurality of substrates j spaced apart from each other in the vertical direction. The outer storage portion 6 is used to store a plurality of buckles with adhesive films. Therefore, the outer storage portion 6 must be capable of receiving the substrate 1 at a distance from each other so as not to be connected by an adhesive film and a wire. . However, before the substrate with adhesive pads was pasted with a piece called Nado! In the inner accommodating portion 5, the substrate i is not adhered to each other by the adhesive film 10. Therefore, the substrate 1 can also be stacked in a state where a plurality of substrates are in contact with each other. 12 200532816 In order to transport the substrate 1 in the order of the inner storage section 5, the attachment section 4, and the outer storage section 6, the attachment device 50 shown in FIG. 1 is provided with two outlines in the attachment section 4. The linear conveying rail 21. As shown in FIGS. 4 to 6, the vertical cross-sectional shapes of the two transport rails 21 are all c-shaped. The zigzag conveying 5 recesses 21 can be inserted into the ends of both sides of the substrate 1, respectively. The transfer holder 21 is provided with a substrate chuck mechanism (not shown). Therefore, the substrate 1 can be transported in the order of the inner storage portion 5, the attachment portion 4, and the outer storage portion 6 along the transport rail 21. Using the temporary pressing unit 7, the true pressing unit 8, and the peeling unit 9, the following attaching steps can be performed. 10 First, in the temporary pressing unit 7, the pieces 12 are conveyed while being held by the holding mechanism 13 and placed on the main surface of the substrate at position 2. This step is called the temporary crimping step. Next, in the true pressing unit 8, the piece 12 placed on the substrate 丨 is pressed onto the substrate 丨 by the pressing mechanism 15. This step is called the true compression step. Thereby, a piece 12 is affixed to position 2 on the main surface of the substrate i. At this time, the release film n remains on the individual sheets 12. Then, the release film removing mechanism 16 is used to remove the release film u. The release film removing mechanism 16 includes a single-sided adhesive tape 17 and a pressing mechanism 18. The pressing mechanism 18 is used to press the adhesive surface of the adhesive tape 17 on a piece 12 of the substrate. Thereby, the tape 17 is adhered to the release film. Then, the tape was rolled by the winding device. Therefore, after the adhesive surface of the adhesive tape is adhered to the release film U, if the pressing mechanism 18 leaves the adhesive tape 17 and the adhesive tape 17 moves, the release film u can be removed from the adhesive film 10. Therefore, only the adhesive film 10 remains on the substrate 1. Thus, the attaching step of attaching the adhesive tape to the substrate is completed. 13 200532816 Figure 2 shows the 8-step attachment status at 8 positions 2a ~ 2h. The reason why the second figure is so unobtrusive is for the purpose of displaying the attachment state of the sheet 12 during the aforementioned attaching steps (temporary pressing step, true pressing step, and peeling step) and the steps before and after the attaching step. The attached state of each piece 12. 5 Position 2b shows the state of substrate 1 before the temporary pressing step. The position 2a indicates the state when the sheet 12 is placed on the substrate by the holding mechanism 13, that is, the state of the substrate during the temporary pressing step. Positions 2c and 2d show the state of the substrate 1 placed on the substrate 1 by the pressing mechanism 15 after being pressed on the substrate 1, that is, the state of the substrate 1 after the end of the true pressing step. The position 2f shows the state of the substrate worker before removing the release film u in the release unit 9. The position 2e indicates the state of the substrate 1 when the peeling film 11 is removed by the peeling film removing mechanism 16, that is, the state of the substrate 1 at the peeling step. The position 2g shows a state before the wafer 40 is mounted on the adhesive film 10. Further, 15 position 2h shows the state of the substrate 1 after the wafer 40 is completely mounted on the adhesive film 10, that is, the state of the substrate 1 after the wafer bonding step is completed. In a word, from the position 2a to the position 2f, the attaching steps performed by the attaching means 显示 are displayed, and at the positions 2g and 2h, the wafer attaching steps performed by the post attaching device 60 shown in FIG. 3 described later are displayed. $, The wafer 40 is set up: 20 The mounting mechanism 20 of the wafer bonding device 60 is mounted on the adhesive film 10. Next, the wafer bonding apparatus 60 will be described using FIG. 3. The attaching device 50 shown in the installation method of the order piece. Among the attaching device 90 of the electronic component for electronic use of this embodiment shown in FIG. 3, FIG. 1 and FIG. After the wafer bonding device 60 shown in the figure is connected to each other 200532816, the crystal moon bonding step can be continuously performed. Therefore, the time required for the entire mounting process for mounting the electronic component to the substrate 1 is shortened. The electronic device mounting device 90 is used to transport the basic magic in the order of the inner storage section 5, the attachment section 4, the wafer bonding device 60, and the outer storage section 6, and is installed inside the attached 5 sections 4 and the wafer bonding farm 60. There are two approximately linear transfer rails 21. The shape of the straight cross-section of each of the two transfer holders 21 is the same as that in the attachment device 5G shown in FIG. I. That is, it is c-shaped as shown in FIGS. 4 to _. The recesses of the two C-shaped conveying rails 21 can be respectively inserted into the two end portions of the base plate 丨. The transport rail 21 is provided with a substrate chuck mechanism (not shown). Therefore, the substrate 1 can be transported along the transport rail 21 in the order of the inner accommodating section 5, the attaching section 4, the wafer bonding apparatus 60, and the outer accommodating section 6. As shown in FIG. 3, when the wafer bonding device 60 and the attaching device 50 are to be connected to each other, the storage portion 6 other than the attaching device 50 is first removed from the attaching portion 4, and then the wafer is bonded The device 60 is mounted on the attachment device 50. Then, the external storage section 6 is mounted on the wafer bonding apparatus 60 again. At this time, the outer storage portion 6 can store the substrate 1 on which the wafer 40 is mounted. The dressing device 90 of the electronic component used in the installation method of the electronic component in the form of this shell garden, because the attaching device 50 and the wafer bonding device 60 are connected to each other by 9 households. The wafer 40 is attached to the adhesive film 20 1O. Yes, all the time required for a series of steps related to the short installation of electronic parts is cycle time. And 'if the temporary pressing unit 7, the true pressing unit 8, the peeling unit 9, the peeling unit 9, and the wafer bonding unit 19 of the wafer bonding device 60 along the transport | nine 21 slide can be made further' period time. 15 200532816 Next, the temporary pressing unit 7 and the temporary pressing step will be described with reference to FIGS. 1 to 6. As shown in Figs. 4 to 6, the temporary pressing unit 7 is provided with a holding mechanism 13 for moving the substrate 1 while holding it, and a camera 14 for identifying the substrate. In addition to the two aforementioned mechanisms, the temporary pressing unit 7 also includes a moving handle 22 for guiding the movement of the holding mechanism 13 and the imaging mechanism 14, an imaging mechanism 23 for identifying the individual pieces 12, and an adhesive tape 3 for cutting % Of the cutting mechanism, the feeding mechanism 25 for feeding the adhesive tape 3, the mounting table 26 on which the piece 12 can be placed, the holding mechanism I, the camera mechanism 14, the camera mechanism 23, the cutting mechanism 10, Since the sending-out mechanism 25 and the mounting base 26 are provided to be freely attachable and detachable to each other, these positional relationships can be changed. The holding mechanism 13 and the imaging mechanism 14 are movably provided on the moving rail 22, respectively. The holding mechanism 13 and the imaging mechanism Η can be moved by being guided by the moving actuator 22 independently of each other. Therefore, the holding mechanism 13 and the imaging mechanism are called since can be along 15 relative to the first! The conveyance / stretching direction shown in the figure moves approximately perpendicularly. Therefore, the holding mechanism 13 and the imaging mechanism 14 can perform the holding step and the imaging step substantially simultaneously. 20 As shown in FIGS. 4 to 6, the holding mechanism 13 can be moved along the moving handle 22 between the position 27 on which the cut piece 12 is placed and the position 2 on the substrate on which the piece 12 is attached]. . In addition, the imaging mechanism 14 is movable in the width direction from one side end portion of the mounting table 26 to the other side end portion. On the other hand, in addition to the image mechanism 14, the camera used for identification of electronic components is placed at 90 for substrate identification, and a camera 23 for identification is provided. χ, the substrate identification 14 can reciprocate along the moving rail 22, and the imaging mechanism 16 200532816 23 is fixed above the position 27. However, the imaging mechanism 23 may be reciprocated along the moving handle 22 similarly to the imaging mechanism 14. As shown in FIGS. 4 to 6, the imaging mechanism 23 can recognize the state of the piece 12 held by the holding mechanism 13, the state where the adhesive tape 3 is cut by the cutting mechanism 24, and the loan-out mechanism 5 25 to send out the adhesive. Status of band 3. In addition, the cutting mechanism 24 and the feeding mechanism 25 may be provided as a single body with the attachment device, and the two mechanisms may be provided inside and outside the attachment device 50 so as to be freely attachable to and detachable from each other. Further, the feeding mechanism 25 can supply the adhesive tape 3 to the cutting mechanism 24 to form a position 27 of 10 pieces of 12 pieces. The cutting mechanism 24 is used to cut the adhesive tape 3. The cutting of the adhesive tape 3 is performed by a cutting member (not shown) of the cutting mechanism 24a shown in Fig. 1. The cutting member can cut the adhesive tape 3 fed from the feeding mechanism 25a in the width direction. In addition, in the present embodiment, when cutting the adhesive tape, a punching member (not shown in Fig. 15) of the cutting mechanism 24b is used in addition to the cutting member. The stamping member can cut a part of the adhesive tape 3 sent out by the sending mechanism by punching. The cutting member and the stamping member are provided independently of each other. The feeding mechanism 25 has a storage portion (not shown) for accommodating the adhesive tape 3 around the roll. This storage portion can wind various adhesive tapes 3. In addition, although the example of cutting the adhesive by the cutting mechanism 24a of the cutting method is described, the cutting method and the pressing method can be changed depending on the substrate 1 and the adhesive tape 3. In order to change the method, the cutting mechanism 24 and the feeding mechanism 25 are provided so as to be slidable in the carrying direction of the substrate 1. Next, the temporary pressing step will be described in detail using FIG. 4. Figure 4 shows the holding mechanism 13 for holding the adhesive tape 3 and the imaging mechanism u for identifying the 200520051616 substrate independently moving, and the holding and identification steps of the holding step and the identification step are performed simultaneously. In the holding / identifying step A shown in FIG. 4, first, the adhesive is sent out from the feeding mechanism 25, and then, at the position 2? The adhesive tape 3 is cut by the cutting mechanism 24 to the desired size. Thereafter, the pieces 12 are held by the holding mechanism 13. The holding mechanism 13 holds the main sheet 12 by sucking the main surface of the release film u with a suction device such as a pump. Since the imaging mechanism 1 moves independently regardless of the operation of the holding mechanism 13, the position 2 on the substrate 1 can be identified by using a ⑽ (electric residual element) camera or the like while the holding mechanism 13 is holding the piece 12. In addition to the position 2 of the substrate 10, the imaging mechanism 14 can also monitor the individual pieces to maintain the condition and the cut-off condition of the individual pieces 12. Fig. 5 shows the conventional movement steps τ and V shown in Figs. 10 and 12, and the conventional recognition step 1 shown in Fig. 11; the movement and identification steps of both are shown in Fig. 5 ' The holding mechanism 3 and the camera mechanism 14 perform 15 movement steps and identification steps simultaneously. In the moving and identifying step section shown in Fig. 5, the individual piece 12 held by the holding mechanism 13 can be moved from the position 27 to the position 2 of the substrate i. On the other hand, the imaging mechanism 14 continues to photograph position 2 until the piece 12 is placed at position 2. At this time, the feeding mechanism 25 sends out the adhesive tape 3 to be cut next. In this way, as shown in FIGS. 5 and 20, the conventional moving step T and the moving step V can be performed simultaneously by using the electronic device mounting device 90, so that the time required for mounting electronic parts can be shortened.
間。 V 第6圖顯示同時進行對應於第13圖所示之習知載置步 驟W之步驟’及對躲第Η圖所示之習知辨識步驟u之步琢 18 200532816 的狀態。 置於由 12可裁 此時， 2 〇 第6圖所示之載置·辨識步驟c時，個片12可栽 攝像機構14所辨識之位置2。在此步驟中第一個個片 置於位置2。即，結束一個個片之暫時壓著步驟。 5攝像機構14移動到下一個位置2之上方，且拍攝位置 前述第4圖〜第6圖所示之實施形態之黏著帶之貼附方 法與習知黏著帶之貼附方法相較，減少了步驟數。 更具體between. V Fig. 6 shows a state in which the steps corresponding to the conventional placement step W shown in Fig. 13 and the steps of hiding the conventional identification step u shown in Fig. 18 are performed simultaneously. It can be cut by 12 at this time. At the placement and identification step c shown in FIG. 6, the individual piece 12 can be placed at the position 2 recognized by the imaging mechanism 14. The first slice is placed in position 2 in this step. That is, the temporary pressing step of each piece is ended. 5 The imaging mechanism 14 is moved above the next position 2 and the shooting position of the adhesive tape according to the embodiment shown in FIG. 4 to FIG. 6 described above is reduced compared with the conventional adhesive tape attaching method. Number of steps. more detail
而言，習知暫時壓著步驟須執行第9圖〜第13圖所示5個弁^ S〜W，但是實施形態之暫時壓著步驟只須執行4圖〜第6圖戶 1〇示之3個步驟A〜C，所以可縮短執行一系列步驟所需之戶所 α士 b曰 丨为 接著，利用第2圖所示之基板丨更詳細說明前述第*圖〜 第6圖所示之步驟。 首先，將個片12載置於位置2h及位置2g。然後，保持 15機構13及攝像機構14沿搬送軌21往復移動，將個片12載置 於位置2e及位置2f。接著，保持機構13及攝像機構14再度 沿搬送軌21往復移動，將個片12載置於位置及位置2d。 再一次保持機構13及攝像機構14沿搬送執22往復移動，將 個片12載置於位置2a及位置2b。結果，將個片12載置於基 20 板1之所有位置2。 另，第4圖〜第6圖所示之暫時壓著步驟之步驟A〜c是使 用错吸附剝離膜11來保持個片12之保持機構13，不過亦可 使用其他保持機構。 又，如第7圖所示，保持機構13包含有前端部29、軸部 19 200532816 30、及負載部31。前 換之前^± u 可對應個片12種類而更 換之心料28。㈣3Q絲有 部31，呈可移動狀 移動第7fT曰^【著步驟時’保持機構13使軸部3〇朝下方 =7圖所示之預定單次長奸，且以預定負載按壓個片 為執行該軸部3°之移動，藉磁氣對軸部观加負載。 10 用以執行之構造，_物及輯仙分祕有磁鐵❿及 32b。軸部3G嵌人負栽部3卜磁鐵仏安|於軸獅，磁鐵 32b安裝於負載部31。利用磁鐵32&與磁鐵伽之間之相斥力 及相吸力’軸部3G可沿上下方向移動。另保持機構⑽ 可藉壓縮彈簧轉性㈣（未圖示）使㈣30沿上下方向 移動。 前述暫時壓著步驟之後，在真壓著單元8進行真壓著步 驟。以下，說明真壓著步驟。 如第1圖及第3圖所示，真壓著單元8設有壓著機構15。 壓著機構15具有可對黏著帶3施加較保持機構13大之負載 之能力。雖未圖示，不過基板1是載置於壓著台上。 載置台26及壓著台分別設有加熱機構（未圖示）。藉該 等加熱機構之作用，可將個片12貼附於基板1。因此，黏著 膜10會更易黏於基板1。另，加熱機構不設於載置台26及壓 著台，亦可設於保持機構13或壓著機構15。 接著，利用第8圖詳細說明剝離單元9及剝離步驟。 20 200532816 剝離單元9設有第8圖所示之剝離膜除去機構16。剝離 膜除去機構16設有剝離膜除去用之接著帶17及按麼機構 18。又，剝離膜除去機構16包含有剝離台33、繞捲滾筒34、 色檢測器35、及檢測板36。剝離台33設置成隔著基板丨與按 5壓機構18相對。繞捲滾筒34用以繞捲接著帶。色檢測器％ 用以辨識剝離膜11。檢測板36設置成隔著接著帶17與色檢 測器35相對。 剝離台33設有冷卻機構（未圖示），俾輕易自雙層構造 之個片12僅除去剝離膜11。該冷卻機構是用以在剝離步驟 10時冷卻發熱之部分（基板1上之個片12部分）。 按壓機構18之前端部分之材質是氟樹脂等具有彈力之 的材料。這種結構可防止過度之按壓力損傷黏著膜1〇。又， 還可對接著帶17施加大致均一之壓力。 又，第8圖所示之剝離膜除去機構16設有可賦與接著帶 15 17拉伸力，及緩和該拉伸力之接著帶供給機構（未圖示）。 該接著帶供給機構具有一對捲輪。該一對捲輪，係一用以 朝貼於基板1之個片12送出接著帶17之送出捲輪，及另一用 以繞捲與自個片12除去之剝離膜n黏接之接著帶17的繞捲 捲輪。 2〇 又，剝離台33與繞捲捲輪之間設有色檢測H35。色檢測 器35是可檢測顏色之檢測器。因此，若在剝離膜_先上有 -種顏色，而在接著帶17上有與前述_種顏色不同之顏 色，就可輕易檢測出剝離膜n。結果，可迅速掌握剝離膜 η是否已自黏著帶3上除去。[亦可當色檢測器35檢測到 21 200532816 剝離膜11時’執行例如將晶片4〇貼附於已剝離檢測到之剝 離膜11之基板1上的黏著膜1〇的步驟。又，亦可當色檢測器 35未檢測到剝離膜丨丨時，不執行將晶片4〇貼附於尚未剝離 仍殘留未檢測到之剝離膜丨丨之基板1上的黏著膜1〇的步 5驟，並停止該作業。此外，亦可當色檢測器35未檢測到剝 離膜11時，會視為黏著膜1〇未以適當狀態貼附於基板丨上的 作業異常現象，且透過警報器等警告設備來告知作業者此 異常現象的發生。In terms of the conventional temporary pressing step, it is necessary to execute 5 steps S ^ W shown in Fig. 9 to Fig. 13; 3 steps A to C, so you can shorten the number of houses α and b required to perform a series of steps step. First, the pieces 12 are placed at positions 2h and 2g. Then, the holding mechanism 15 and the imaging mechanism 14 are reciprocated along the transport rail 21, and the individual pieces 12 are placed at positions 2e and 2f. Next, the holding mechanism 13 and the imaging mechanism 14 move back and forth along the transport rail 21 again, and place the individual pieces 12 at the position and the position 2d. The holding mechanism 13 and the image pickup mechanism 14 are reciprocated along the transfer holder 22 again, and the pieces 12 are placed at positions 2a and 2b. As a result, the pieces 12 are placed at all positions 2 of the base plate 1. The steps A to c of the temporary pressing step shown in Figs. 4 to 6 are the holding mechanisms 13 for holding the individual sheets 12 using the mis-adsorption peeling film 11, but other holding mechanisms may be used. As shown in FIG. 7, the holding mechanism 13 includes a tip portion 29, a shaft portion 19 200532816 30, and a load portion 31. Before the change ^ ± u can be changed according to the 12 types of tablets and replaced by the heart 28. ㈣The 3Q wire has a part 31, which can be moved in a movable manner. 7fT ^ [At the time of the step, the holding mechanism 13 causes the shaft part 30 to face downward = the scheduled single rape shown in FIG. 7 and presses a piece with a predetermined load to execute The shaft is moved by 3 °, and the shaft is subjected to a load by magnetic gas. 10 The structure used for implementation. There are magnets and 32b. The shaft portion 3G is embedded in the human load bearing portion 3 and the magnet 32 | is mounted on the load portion 31 in the shaft lion. The shaft portion 3G can be moved in the vertical direction by the repulsive force and the attracting force between the magnet 32 & and the magnet gamma. In addition, the holding mechanism ⑽ can move ㈣30 in the up-and-down direction by the compression spring rotation ㈣ (not shown). After the foregoing temporary pressing step, a true pressing step is performed in the true pressing unit 8. Hereinafter, the true pressing step will be described. As shown in FIGS. 1 and 3, the true pressing unit 8 is provided with a pressing mechanism 15. The pressing mechanism 15 has the ability to apply a larger load to the adhesive tape 3 than the holding mechanism 13. Although not shown, the substrate 1 is placed on a pressure table. The mounting table 26 and the pressing table are each provided with a heating mechanism (not shown). By virtue of these heating mechanisms, the individual pieces 12 can be attached to the substrate 1. Therefore, the adhesive film 10 is more likely to adhere to the substrate 1. The heating mechanism is not provided on the mounting table 26 and the pressing table, but may be provided on the holding mechanism 13 or the pressing mechanism 15. Next, the peeling unit 9 and the peeling step will be described in detail with reference to FIG. 8. 20 200532816 The peeling unit 9 is provided with a peeling film removing mechanism 16 as shown in FIG. 8. The peeling film removing mechanism 16 is provided with a peeling film removing adhesive tape 17 and a pressing mechanism 18. The peeling film removing mechanism 16 includes a peeling table 33, a winding drum 34, a color detector 35, and a detection plate 36. The peeling table 33 is provided so as to be opposed to the pressing mechanism 18 via the substrate 丨. The winding drum 34 is used for winding the tape. The color detector% is used to identify the peeling film 11. The detection plate 36 is provided so as to face the color detector 35 with the adhesive tape 17 therebetween. The peeling table 33 is provided with a cooling mechanism (not shown) so that only the peeling film 11 can be easily removed from the single sheet 12 having a double-layer structure. This cooling mechanism is used to cool the heat-generating portion (the piece 12 portion on the substrate 1) during the peeling step 10. The material of the front end portion of the pressing mechanism 18 is an elastic material such as fluororesin. This structure prevents the adhesive film 10 from being damaged by excessive pressing force. Further, a substantially uniform pressure may be applied to the adhesive tape 17. Further, the peeling film removing mechanism 16 shown in FIG. 8 is provided with an adhesive tape supply mechanism (not shown) that can apply a tensile force to the adhesive tape 15 to 17 and reduce the tensile force. This adhesive tape supply mechanism has a pair of reels. The pair of reels are a reel for sending out toward the piece 12 attached to the substrate 1 followed by a tape 17, and another adhesive tape for winding and adhering to the release film n removed from the piece 12 17 reels. 20 In addition, a color detection H35 is provided between the peeling table 33 and the take-up reel. The color detector 35 is a detector capable of detecting a color. Therefore, if there is a color on the release film _ first and a color different from the foregoing color on the adhesive tape 17, the release film n can be easily detected. As a result, whether or not the release film? Has been removed from the adhesive tape 3 can be grasped quickly. [When the color detector 35 detects 21 200532816 peeling film 11 ', for example, a step of attaching the wafer 40 to the adhesive film 10 on the substrate 1 of the peeling film 11 of which peeling is detected is performed. In addition, when the peeling film 丨 丨 is not detected by the color detector 35, the step of attaching the wafer 40 to the adhesive film 10 on the substrate 1 that has not been peeled off but remains undetected 丨 丨 may not be performed. 5 steps and stop the operation. In addition, when the peeling film 11 is not detected by the color detector 35, it may be regarded as an abnormal operation of the adhesive film 10 that is not attached to the substrate in an appropriate state, and the operator is notified through a warning device such as an alarm. This anomaly occurs.
另，第8圖所示之檢測板36是用以藉色檢測器35更正確 10 2檢測加在剝離臈11上之顏色。因此，在檢測板36靠接著 帶17侧之面上有與加在剝離膜UJL之—種顏色不同的顏 色。唯，檢測板36非本發明必要之構成要素。 如前所述，依本電子零件之安裝裝置9〇，縱使假設剝 離膜1!及接著帶17是透明的，但是由於在剝離膜^及接著 15帶17上分別上有相互不同之顏色，所以可藉色檢測器35正 確且迅速地檢測出是否已自黏著膜1〇上除去剝離膜心 另，本實施形態中，黏著帶3為雙層構造，不過，若使 用單層構造之黏著帶，亦可不進行前述剝離步驟，而僅進 行暫時壓著步驟及真壓著步驟。又，黏著帶3之構造不限於 2〇雙層構造，亦可是三層以上之多層構造。 7 士 使用倒裝晶片基板作為基板1 日令’晶片40亦可藉由凸塊（連接電極）安裝於基板i。又， 村t第1晶片4〇之上面，藉由另—兩主表面具有黏著性之 黏著膜再將第2晶片安裝於基板^。 22 200532816 前述詳細地說明本發明，不過僅為顯示範例而已，並 非用來限定本發明者，本發明的界定在於發明精神與範圍 及申請專利範圍所示者。 【圖式簡單:¾¾明】 5 fl®係—實施㈣之晶片結合用黏著帶之貼附方法 所使用之貼附裝置的平面圖。 第2圖係藉第1圖所示之貼附裝置貼附黏著膜之基㈣ 立體圖。 第3圖係顯示第1圖所示之貼附裝置連結晶片結合裝置 10 之狀態的平面圖。 第4圖係說明藉第1圖所示之貼附裝置進行暫時壓著步 驟之A步驟的圖。 第5圖係係說明藉第1圖所示之貼附裝置進行暫時壓著 步驟之B步驟的圖。 15 第6圖係係說明藉第1圖所示之貼附裝置進行暫時壓著 步驟之C步驟的圖。 第7圖係顯示第1圖所示之貼附裝置之保持機構的圖。 第8圖係說明藉第1圖所示之貼附裝置進行之剝離步驟 的圖。 20 第9圖係說明習知暫時壓著步驟之s步驟的圖。 第10圖係說明習知暫時壓著步驟之τ步驟的圖。 第11圖係說明習知暫時壓著步驟步驟的圖。 第12圖係說明習知暫時壓著步驟之丨步驟的圖。 第13圖係說明習知暫時壓著步驟之…步驟的圖。 23 200532816 【主要元件符號說明】 1.. .基板 2(2a 〜2h)，27···位置 3.. .黏著帶 4.. .貼附部 5.. .内收納部 6.. .外收納部 7.. .暫時壓著單元 8.. .真壓著單元 9.. .剝離單元 10.. .黏著膜 11.. .剝離膜 12.. .個片 13.. .保持機構 14.23.. .攝像機構 15.. .壓著機構 16.. .剝離膜除去機構 17.. .接著帶 18.. .按壓機構 19.. .晶片結合單元 20.. .安裝機構 21.. .搬送執 22.. .移動執 24 (24a、24b)…切斷機構 25 (25a、25b) ···送出機構 26.. .載置台 28.. .前端治具 29.. .前端部 30…軸部 31.. .負載部 32 (32a，32b) ···磁鐵 33.. .剝離台 34.. .繞捲滾筒 35.. .色檢測器 36.. .檢測板 40…晶片 50…貼附裝置 60.. .晶片結合裝置 90.. .電子零件之安裝裝置 24In addition, the detection plate 36 shown in FIG. 8 is used to more accurately detect the color added to the peeling roll 11 by the color detector 35. Therefore, the surface of the detection plate 36 on the side adjacent to the belt 17 has a color different from that applied to the release film UJL. However, the detection plate 36 is not an essential component of the present invention. As described above, according to the mounting device 90 of this electronic component, although the release film 1 and the adhesive tape 17 are assumed to be transparent, the release film ^ and the adhesive tape 15 are different in color from each other, so The color detector 35 can accurately and quickly detect whether the release film core has been removed from the adhesive film 10. In addition, in this embodiment, the adhesive tape 3 has a double-layered structure. However, if a single-layered adhesive tape is used, Instead of performing the aforementioned peeling step, only the temporary pressing step and the true pressing step may be performed. In addition, the structure of the adhesive tape 3 is not limited to a 20-double-layer structure, and may also be a multilayer structure of three or more layers. 7 person using a flip chip substrate as the substrate 1 Day's wafer 40 can also be mounted on the substrate i by a bump (connecting electrode). In addition, on the first wafer 40, the second wafer is mounted on the substrate through another adhesive film having adhesiveness on both main surfaces. 22 200532816 The foregoing describes the present invention in detail, but it is only for showing examples and is not intended to limit the present inventor. The present invention is defined by the spirit and scope of the invention and the scope of patent application. [Simple diagram: ¾¾ Ming] 5 fl® system—Plane view of the attachment device used to implement the method of attaching the adhesive tape for wafer bonding. Fig. 2 is a perspective view of the base film to which the adhesive film is attached by the attaching device shown in Fig. 1. Fig. 3 is a plan view showing a state where the attaching device and the wafer bonding device 10 shown in Fig. 1 are connected. Fig. 4 is a diagram illustrating step A of the temporary pressing step by the attachment device shown in Fig. 1; Fig. 5 is a diagram for explaining step B of the temporary pressing step by the attachment device shown in Fig. 1; 15 Fig. 6 is a diagram illustrating step C of the temporary pressing step by the attachment device shown in Fig. 1. Fig. 7 is a view showing a holding mechanism of the attachment device shown in Fig. 1. Fig. 8 is a diagram illustrating a peeling step performed by the attachment device shown in Fig. 1. 20 FIG. 9 is a diagram illustrating the step s of the conventional temporary pressing step. Fig. 10 is a diagram explaining the τ step of the conventional temporary pressing step. Fig. 11 is a diagram explaining the steps of the conventional temporary pressing step. FIG. 12 is a diagram illustrating steps of the conventional temporary pressing step. FIG. 13 is a diagram explaining the steps of the conventional temporary pressing step. 23 200532816 [Description of main component symbols] 1... 2 (2a ~ 2h), 27 ... Position 3.. Adhesive tape 4.. Attachment part 5.. Inner storage part 6.. Outer Storage section 7 .... Temporary pressing unit 8 .... True pressing unit 9 .... Peeling unit 10 .... Adhesive film 11 .... Peeling film 12 .... Piece 13 .... Holding mechanism 14.23. .............. Camera ............ 22 ... Move the handle 24 (24a, 24b) ... Cut-off mechanism 25 (25a, 25b) ..... Sending mechanism 26 ... Mounting table 28 .. Front end fixture 29 .. Front end portion 30 ... Shaft portion 31 .. Load section 32 (32a, 32b) ... Magnet 33 .. Stripping table 34 .. Winding roller 35 .. Color detector 36 .. Detection plate 40. Wafer 50. Attachment device 60 .. Wafer bonding device 90 .. Electronic component mounting device 24