JP2005252114A - Method for sticking adhesive tape for die bonding - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an adhesive tape sticking method capable of efficiently shortening operation time by quickly and accurately sticking an adhesive tape for die bonding to a prescribed position of a substrate. <P>SOLUTION: On a first step in the sticking method, the temporary application processes of a sticking means 13 and an imaging means can be independently and approximately simultaneously performed by independently driving the sticking means 13 and the imaging means 14 which are used for temporarily applying an adhesive film 10 (individual piece 12) cut from an adhesive tape 3 to a prescribed position 2 on a substrate 1 in a state that the adhesive film 10 is stuck by the sticking means 13. On a second step, a peeling film 11 and an adhesive tape 17 which are used for removing the peeling film 11 from the adhesive film 10 by sticking the peeling film 11 to the adhesive tape 17 are individually colored so that one color is a complementary color to the other color. On a third step, a die bonding process for mounting a chip 40 on the film 10 stuck to the substrate 1 is performed continuously after the completion of a sticking process for leaving only the film 10 by removing the peeling film 11 from the substrate 1. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  In the present invention, for example, when a semiconductor chip (electronic component) such as an IC is mounted (die bonded) at a predetermined position on the substrate of the electronic component, a die bonding adhesive tape as a die bonding material for mounting the chip on the substrate is used. The present invention relates to an improvement in a method for applying a die-bonding adhesive tape to be applied at a predetermined position.

  Conventionally, a die-bonding adhesive tape (double-sided adhesive tape with a release tape) is applied to an electronic component substrate (before chip mounting). This method is performed as follows. .

For example, in order to cut a die-bonding adhesive tape to a required size and attach an adhesive film with a release film (individual pieces) to a predetermined position of a substrate, first, the individual pieces are engaged with an engaging means. Then, supply and set at a predetermined position on the substrate (temporary crimping step), and then press the individual pieces supplied and set on the substrate with a crimping means (main crimping step), and paste the individual pieces at predetermined positions on the substrate. The At this time, a release film is provided on the surface of the individual piece-attached substrate on the side opposite to the substrate. Next, the release film is removed from the substrate by pressing the individual pieces (release film) on the substrate using an adhesive tape for peeling (single-sided adhesive) to adhere the release film to the adhesive tape. Only the adhesive film remains (peel (peeling member removal) step).
Thereafter, an electronic component (chip) is mounted on the adhesive film (predetermined position on the substrate) on the substrate (die bonding step) (see, for example, Patent Document 1).

Here, as an example of performing the above-described temporary press-bonding process, as shown in steps in FIGS. 6A to 6E, the attachment means 101 is attached to and integrally with the engagement means 101. At least the imaging means 102 that operates in this manner is used.
First, as shown in FIG. 6A, a position (individual piece forming position 105) where the adhesive film 103a (individual piece 103) with the release film 103b obtained by cutting the die-bonding adhesive tape 104 into a required size is formed. ), The piece 103 is engaged by the engagement means 101 (engagement stage S).
Next, as shown in FIG. 6 (2), in the state in which the individual piece 103 is engaged by the engaging means 101, from the individual piece forming position 105 to a predetermined position on the substrate 100, the integral engaging means 101 and imaging means are integrated. 102 moves (movement stage T).
Next, as shown in FIG. 6 (3), when the imaging means 102 moves and reaches the upper part of the predetermined position of the substrate 100, the predetermined position of the substrate 100 is recognized (recognition stage U).
Next, as shown in FIG. 6 (4), after completing the recognition stage U, the engaging means 101 moves to the upper part of the recognized position of the substrate 100 so that the integrated engaging means 101 and the imaging means 102 move. (Movement stage V).
Next, as shown in FIG. 6 (5), when the engaging means 101 moves and reaches the upper part of the predetermined position of the substrate 100, the engaging means 101 moves the attached pieces 103 of the substrate 100. Supply and set at a predetermined position (supply stage W).
Therefore, the conventional temporary press-bonding process is to sequentially perform the above-described five steps S to W as shown in FIG.

In addition, as an example of performing the above-described conventional peeling process, although not shown, an adhesive tape used at least when the release film is removed from an individual piece (adhesive film) by bonding to the above-described release adhesive tape, A transparent film is used as the release film, and an infrared sensor, for example, that detects whether the release film has been completely removed from the adhesive film is used.
JP 2001-135653 A (page 13, FIG. 1)

  By the way, in recent years, since the tendency of cost reduction of the substrate is increasing, there are an increasing number of matrix type substrates on which a large number of electronic components are mounted on one substrate. Furthermore, since electronic components mounted on such a matrix type substrate are also thinned, a large amount of thinned electronic components can be quickly and accurately placed at predetermined positions on the matrix type substrate. Die-bonding adhesive tape (double-sided adhesive tape with release tape) can be applied to remove the release tape, and finally the chip (electronic component) can be mounted (die-bonded) on the adhesive tape (adhesive film). Is a challenge.

For this reason, in order to supply and set the thinned pieces 103 (101, 102) to predetermined positions on the thinned electronic component die-bonded to the matrix type substrate 100 in recent years. If the temporary press-bonding step (steps S to W) shown in FIG. 6 is performed, the capability of each step S to W will be increased individually. Therefore, no matter how much the capacity is increased individually, the temporary crimping process (each step S to W) must be performed in order.
In this case, for example, while the engagement stage S is being performed, the recognition stage U by the imaging unit 14 is not performed, and it is inevitable to enter a standby state. Presumed to be. In other words, overcoming both the problems to be performed quickly and accurately has a limit in the conventional temporary press-bonding process (steps S to W).

  Moreover, according to an infrared sensor that detects whether the thinned release film has been completely removed from a thin electronic component that is die-bonded to a matrix type substrate in recent years, the release film and the adhesive tape are transparent. In combination with this, it cannot be detected sufficiently by an infrared sensor, and even when an opaque one is used, it cannot perform a satisfactory infrared sensor function, and it can be performed quickly and accurately. It is very difficult to do. Also from this, it is presumed that the die bonding process of finally attaching the thinned electronic component to the adhesive tape cannot be performed efficiently.

  Therefore, according to the above-described conventional method of applying the adhesive tape for die bonding, it is difficult to apply quickly and accurately, and it is very difficult to shorten the working time (cycle time). It is presumed that there has been a problem that the electronic component (chip) to be mounted cannot be efficiently mounted.

  That is, the present invention provides a die-bonding adhesive that can efficiently shorten the working time (cycle time) by applying the die-bonding adhesive tape (adhesive film) to a predetermined position of the substrate quickly and accurately. The object is to provide a method for applying a tape.

Accordingly, the die bonding film sticking method according to claim 1 of the present invention for solving the technical problem as described above is the adhesive film 10 (individual piece) obtained by cutting the die bonding adhesive tape 3 into a required size. 12) when attaching the predetermined position 2 to the predetermined position 2 of the substrate 1, the step of recognizing the predetermined position 2 by the imaging means 14, the step of engaging the film 10 (12) by the engagement means 13, A step of supplying and setting the film 10 (12) to the predetermined position 2 of the substrate 1 by the engaging means 13 based on the recognition result of the predetermined position 2,
By making the engaging means 13 and the imaging means 14 independent, the recognition step and the engaging step are performed separately and substantially simultaneously.

Moreover, the die bonding film sticking method according to claim 2 of the present invention for solving the technical problem as described above is applied to the predetermined position 2 of the substrate 1 and the die bonding adhesive tape 3 has a required size. The peeling member 11 provided on the adhesive film 10 (individual piece 12) cut into pieces is adhered to the adhesive tape 17 for removing the peeling member and removed, and the peeling member 11 adhered to the adhesive tape 17 is detected by the detector 35. In the detection method of the peeling member 11 to detect separately in each,
The peeling member 11 and the adhesive tape 17 are colored differently, and the color sensor 35 is used as the detector 35 for detecting the color while the other color is colored opposite to the other color. And the separation member 11 is detected.

The die bonding film sticking method according to claim 3 of the present invention for solving the technical problem as described above is the pressure sensitive adhesive film 10 (individual piece) obtained by cutting the die bonding pressure sensitive adhesive tape 3 into a required size. 12), when the film 10 (12) is attached to the predetermined position 2 of the substrate 1 in a state where the film 10 (12) is engaged by the engaging means 13, the step of supplying and setting the predetermined position 2 of the substrate 1; The film 10 (12) supplied and set on the substrate 1 is crimped by the crimping means 15 and the film 10 (12) is pasted on the predetermined position 2 of the substrate 1, and the film 10 (12 A step of removing the release film 11 from the substrate 1 and leaving only the adhesive film 10 on the substrate 1 by adhering the release member 11 provided on the adhesive member 17 to the adhesive tape 17 for removing the release member; A die bonding adhesive tape method comprising,
The step of attaching electronic components to the adhesive film 10 on the substrate 1 after performing the above-described steps is performed continuously.

  According to the present invention, by efficiently solving the problem of sticking the adhesive tape 3 (adhesive film 10), labor saving of work time (cycle time) on sticking of the adhesive tape and further die-bonding, and There is an excellent effect that it is possible to provide a method of applying the pressure-sensitive adhesive tape 3 for die bonding, which improves the merit of automation.

In the present invention, when a semiconductor chip 40 (electronic component) such as an IC is mounted (die-bonded) at a predetermined position 2 on the substrate 1, a die-bonding adhesive tape 3 as a die-bonding material for mounting the chip 40 on the substrate 1 is provided. The sticking method of the adhesive tape 3 for die bonding, which can reduce the working time (cycle time) efficiently by quickly and accurately sticking to the predetermined position 2 of the substrate 1, Supplying the adhesive tape 3 to a predetermined position 2 on the substrate 1 with the adhesive film 10 (piece 12) with the release film 11 (peeling member) cut to a required size being attached by the engaging means 13. By making the engaging means 13 and the imaging means 14 used for (temporary pressure bonding) independent, the steps performed by the means 13 and 14 are performed separately and substantially simultaneously. .
Secondly, at least the release film 11 and the adhesive tape 17 that are used when the release film 11 is removed from the piece 12 (adhesive film 10) by being adhered to the release adhesive tape 17 are transparent and opaque. Even so, the release film 11 and the adhesive tape 17 are colored separately, and the opposite color is given to one of the colors. At this time, the color sensor 35 is used to detect the release film 11 as a detector 35 that detects whether the release film 11 is completely removed from the adhesive film 10.
Thirdly, after the attaching step of removing the release film 11 from the substrate 1 and leaving only the adhesive film 10 on the substrate 1 is completed, the process continues to the die bonding step of attaching the chip 40 to the adhesive film 10 on the substrate 1. It is what you do.

That is, a method for applying a die-bonding adhesive tape according to the present invention will be described with reference to FIG.
FIG. 1 (1) is a plan view of a sticking device used in the sticking method described above, and FIG. 1 (2) is a schematic perspective view of a substrate to which the adhesive tape is stuck with the device corresponding to FIG. 1 (1). It shows.

For example, the pasting apparatus 50 and the substrate 1 used in the present invention are, as shown in FIGS. 1 (1) and 1 (2), a semiconductor chip 40 such as an IC (electronic) at a predetermined (pasting) position 2 of the substrate 1. When the component is mounted (die-bonded), the pressure-sensitive adhesive tape 10 and the release film 11 (peeling member) are obtained by cutting the die-bonding adhesive tape 3 as a die-bonding material for mounting the chip 40 on the substrate 1 into a required size. ) And the pasting part 4 for pasting the piece 12 on both sides of the pasting part 4 in this case, on the left side of the figure, the board 12 before the pasting the individual piece 12 is accommodated to the pasting part 4 An in-magazine portion 5 for transferring the substrate 1 and an out-magazine portion 6 for transferring and storing the substrate 1 after the adhesive tape 3 is pasted by the pasting portion 4 on the right side of the figure.
And the transfer direction of the board | substrate 1 in the sticking apparatus 50 is transferred from the in magazine part 5 to the sticking part 4, the pasting process mentioned later is performed, and the board | substrate 1 which affixed the piece 12 on the board | substrate 1 is attached to a sticking part. 4 is transferred to the out magazine section 6 and stored, and the substrate 1 can be transferred in a substantially linear manner so that the pasting process can be performed quickly and accurately and efficiently. It is configured. In addition, each of the parts 4, 5, and 6 can be detachably provided, and can be provided by appropriately changing the arrangement.
In addition, although the adhesive tape 3 used for an Example employ | adopts the two-layer structure of the adhesive film 10 part and the peeling film 11 part, the single layer structure of only the adhesive film 10 part, or the double-sided side of the adhesive film 10 Alternatively, a three-layer structure in which the release film 11 is provided separately may be employed.

  As shown in FIG. 1 (1), each of the three units 7, 8, 9 in the temporary bonding unit 7, the main pressing unit 8, and the peel (peeling member removal) unit 9 is provided on the affixing unit 4 from the in-magazine unit 5 side. The peel unit 9 is provided on the out magazine section 6 side. Each of the three units 7, 8, and 9 (including the unit 19 to be described later) is also detachably provided in the same manner as each of the portions 4, 5, and 6, and can be appropriately rearranged.

  The in-magazine portion 5 and the out-magazine portion 6 are different from the substrate 1 before and after the individual piece 12 is affixed, but since both are objects of the substrate 1, the basic components Are configured in substantially the same way. Both the in-out magazine sections 5 and 6 are provided with slit-type magazine cassettes (not shown) for mounting the required plurality of substrates 1 in the vertical direction in a separated state, and each section 5 in the illustrated example. -It has the structure that each board | substrate 1 accommodated in each cassette is mounted in the lower part of 6. FIG. And the mounting state of the board | substrate 1 accommodated in each magazine cassette seems to mount in the state which faced the predetermined position 2 side of the board | substrate 1 in this case according to the sticking process on the board | substrate 1 in this case. It is configured. However, the magazine cassette in the in-magazine portion 5 may have a stack type configuration in which, for example, a plurality of substrates 1 are directly stacked according to the substrate 1.

The pasting process mentioned above is to perform a temporary press-bonding process, a final press-bonding process, and a peeling process in each of the three units 7, 8, and 9. First, in the state where the individual pieces 12 are engaged with the engaging means 13 in the temporary press-bonding unit 7, they are supplied and set at a predetermined position 2 of the substrate 1 (temporary press-bonding step). The individual pieces 12 supplied and set to 1 are bonded to the predetermined position 2 of the substrate 1 in such a manner that the individual pieces 12 supplied and set are crimped by the crimping means 15 (main crimping step). At this time, a release film (peeling member) 11 is provided on the surface of the individual piece 12 of the individual piece 12 stuck substrate 1 on the side opposite to the substrate 1. Next, using the adhesive tape 17 (single-sided adhesive) provided in the release film removing means 16 and the pressing mechanism 18, the pressing mechanism 18 presses the individual pieces 12 (release film 11) on the substrate 1. By attaching the release film 11 to 17, the release film 11 is removed from the substrate 1 so that only the adhesive film 10 remains on the substrate 1 (peeling process), and the attaching process is completed.
In order to clarify the pasting process (temporary crimping process / main crimping process / peeling process) described above and the process of performing the process before and after the pasting process, the individual 12 pieces 12 pasted at predetermined positions 2 of the substrate 1 are clarified step by step. FIG. 1 (2) shows the pasted state of the predetermined positions 2a to 2h changed.
First, the predetermined position (2a, 2b) is the substrate 1 before the temporary pressure bonding process, and the position 2a is in a state before the supply set by the engaging means 13 of the temporary pressure bonding unit 7 (at the time of the temporary pressure bonding process). .
Next, the predetermined position (2c · 2d) is the substrate 1 after the final crimping process in which the individual pieces 12 supplied and set to the substrate 1 are crimped by the crimping means 15 of the final crimping unit 8 after the temporary crimping process. is there.
Next, the predetermined position (2e · 2f) is the substrate 1 from which the peeling film 11 is removed by the peel unit 9 after the final press-bonding step, and the position 2e is pressed by the pressing mechanism 18 to release the peeling film 11. Is removed from the adhesive film 10, and the position 2 f is the substrate 1 after the peeling process is completed, in which the release film 11 is completely removed by the release film removing means 16.
Next, the predetermined position (2g · 2h) is on the substrate 1 at the time of the die bonding process in which the electronic component (chip 40) is mounted on the adhesive film 10 on the substrate 1 after the pasting process is completed, and the position 2g is 2 is a state before being mounted by the mounting means 20 for the chip 40 provided in the die bond unit 19 shown in FIG. 2, and the position 2h is completely mounted on the adhesive film 10 by the mounting means 20. The substrate 1 is completed after the die bonding process.
Therefore, from the predetermined position 2a to the predetermined position 2f shows the sticking process performed by the sticking apparatus 50, and the predetermined position (2g · 2h) shows the die bonding process performed by the die bonding apparatus 60. The sticking device 50 (see FIG. 1 (1)) and the die bonding device 60 (see FIG. 2) can be connected to each other so that the die-bonding process can be efficiently performed after the pasting process is completed. It is configured.

  As a means for transferring the substrate 1 between the parts 4, 5, 6, as shown in FIGS. 1 (1) and 2, at least two transport rails 21 are arranged on a substantially straight line in the left-right direction of the figure. The surface of the transport rail 21 in the vertical direction is formed in a U shape (see FIG. 3). And the thickness part of the board | substrate 1 is put in the hollow of this U-shaped part, and each part 4,5,6 in the sticking apparatus 50 and each part of the sticking part 4 are provided with the board | substrate chuck mechanism (not shown) with which the conveyance rail 21 was equipped. Three units 7, 8, 9, and the die bonding apparatus 60 (die bonding unit 19) are configured so that the substrate 1 can be continuously transferred and stopped by the rail 21 and the substrate chuck mechanism similarly provided. ing.

FIG. 2 shows the above-described die bonding device 60 and the devices 50 and 60 connected to the peel unit 9 side of the sticking device 50 corresponding to FIG. 1 (1).
Thus, when connecting each apparatus 50 * 60, the board | substrate 1 with which the out magazine part 6 of the sticking apparatus 50 was removed and the chip | tip 40 was mounted | worn with the adhesive film 10 is connected with the in magazine part 5 of each apparatus 50 * 60. The out magazine portion 6 is configured to be attached to the facing position. In this case, the substrate 1 on which the chip 40 is mounted is accommodated in the out magazine section 6 attached to the die bonding apparatus 60 side. In addition, when making the sticking apparatus 50 and the die-bonding apparatus 60 into an independent arrangement configuration, the in-out magazine sections 5 and 6 are provided in the apparatuses 50 and 60, respectively.

Therefore, the pressure-sensitive adhesive tape 3 for die bonding (which is the characteristic part of the third aspect), that is, by making the arrangement configuration in which the pasting device 50 and the die-bonding device 60 are connected to each other more quickly and accurately. Since the adhesive film 10) can be attached to the predetermined position 2 of the substrate 1 and then the chip 40 can be efficiently mounted continuously thereafter, the working time (cycle time) can be efficiently reduced. it can.
Furthermore, since it is possible to slide the three units 7, 8, 9 of the sticking device 50 or the unit 19 of the die bonding device 60 in the left-right direction of the figure as appropriate, depending on the substrate 1, In particular, according to the frame length of the substrate 1 (the length in the long side direction in the example), the units 7, 8, 9 or the units 19 are slid and appropriately adjusted to further increase the working time. (Cycle time) can be shortened.

Here, the provisional pressure bonding unit 7 and the provisional pressure bonding process, which are the characteristic parts of the first aspect, will be described with reference to FIGS. 3 and 4 in addition to FIGS. 1 and 2.
3 (1) to FIG. 3 (3) are schematic views showing the temporary press-bonding process in the temporary press-bonding unit 7 corresponding to FIGS. 1 (1) and 2, and FIG. 4 corresponds to FIG. It is the schematic notch figure which expanded and showed an example of the engaging means.

  As shown in FIG. 1 (1) and FIG. 3, in addition to the engaging means 13 and the image recognition means 14 for recognizing the board, the temporary crimping unit 7 includes a moving rail 22 for moving the means 13 and 14. , 23 is an imaging means for recognizing a tape (piece), 24 is a cutting mechanism for cutting a tape, 25 is a loading mechanism for loading a tape, and 26 is a supply set base for a piece supply set, Like the unit 7, the unit 7 is configured to be detachable and can be appropriately rearranged.

  In the moving rail 22, the engaging means 13 and the image recognition means 14 for substrate recognition are provided independently and on the same axis, and further in a direction substantially perpendicular (up and down) to the transport rail 21 shown in FIG. The means 13 and 14 can move so as not to collide with each other, and the means 13 and 14 are configured to perform each step in a temporary press-bonding process described later separately and substantially simultaneously. Therefore, as shown in FIG. 3, in the moving rail 22, the engaging means 13 is at least between the piece forming position 27 where the cut piece 12 waits and the predetermined position 2 of the substrate 1. In addition, the image pickup means 14 is at least between the predetermined position 2 portion of the substrate 1 and a position waiting on the right side of the supply set base 26, and the means 13 and 14 appropriately according to the substrate 1 in FIG. It is configured to be able to move (reciprocate) in the left-right direction.

  The imaging means 23 for tape recognition is provided separately from the imaging means 14 for board recognition, and the imaging means 14 for board recognition can reciprocate, but the imaging means 23 In this case, it is fixedly attached to the upper part of the piece forming position 27. However, it may be configured to move similarly to the imaging unit 14. As shown in FIG. 3, the image pickup means 23 continuously or intermittently engages the cut pieces 12 with the engaging means 13, and in a cutting mechanism 24 and a loading mechanism 25 described later. The adhesive tape 3 is configured to be able to recognize the state of cutting, the state of feeding the tape 3, and the like.

The cutting mechanism 24 and the loading mechanism 25 are configured to be integrated with each other, and can be efficiently attached and detached in and out of the attaching device 50, and are arranged in parallel in the left-right direction of the illustrated example. As shown in (1), the adhesive tape 3 delivered from the loading mechanism 25a is cut by the cutter member (not shown) in the cutting mechanism 24a and the entire adhesive tape 3 is cut, and the adhesive tape 3 is delivered from the loading mechanism 25b. The adhesive tape 3 is arranged and configured separately from the punching method in which only a required portion of the adhesive tape 3 in the cutting mechanism 24b is cut by a punching member (not shown).
The loading mechanism 25 (25a and 25b) supplies the adhesive tape 3 having a required size to the piece forming position 27 in the cutting mechanism 24 (24a and 24b), while winding and storing the adhesive tape 3 itself. A loading cassette unit (not shown) is provided. Various adhesive tapes 3 can be detachably attached to and removed from the loading cassette section.
Moreover, in FIG. 1 (1), although it has shown as the arrangement structure which cuts the adhesive tape 3 to a required magnitude | size with the cutter-type cutting mechanism 24a and the loading mechanism 25a, according to the board | substrate 1 and the adhesive tape 3, As a switching means that is configured to cut by the punching type cutting mechanism 24b and the loading mechanism 25b, it can be slid manually or automatically in the left direction in the figure, that is, the mechanisms 24 and 25 are individually attached. It is configured to be able to slide within the device 50.
Further, in the loading mechanism 25 (25a / 25b), before the one release film 11 in the adhesive tape 3 having the three-layer structure is supplied to the cutting mechanism 24 (24a / 24b), the loading mechanism 25 (25a / 25b) is loaded. As a winding means, a torque clutch which is also a functional characteristic of a drive motor (not shown) used when supplying one or two layers of the adhesive tape 3 to the cutting mechanism 24 (24a, 24b) is adopted. It is configured so that it can also contribute to reduction.
In addition, although the blade part of the cutter member (not shown) in the cutting mechanism 24a is configured by sharpening one side part, so that the member life of the cutter member can be extended more efficiently, It is also possible to sharpen both sides of the member. In addition to this cutter member, a cutter knife blade (not shown) that saves the cutting area and does not depend on the resin characteristics included in the adhesive tape 3 may be employed.
Further, when the high adhesive property of the adhesive tape 3 is strong, the problem that the resin which is a factor of the high adhesive property adheres to a required portion such as the cutting mechanism 24 and the loading mechanism 25 is more likely to occur. Become. In order to prevent this problem, for example, a suitable non-adhesive treatment such as silicone or fluororesin or a member used for the treatment is attached to the required portion, or a material for the treatment is used. The structure which attaches a member may be sufficient.
Therefore, by using the cutting mechanism 24 (24a / 24b) / loading mechanism 25 (25a / 25b), any adhesive tape 3 can be replaced with the loading mechanism 25 (25a / 25b). In other words, the workability (maintenance and operability) has an arrangement configuration that is efficiently considered, and from any pressure-sensitive adhesive tape 3, the pressure-sensitive adhesive film with the release film 11 can be quickly and accurately. Since 10 (individual piece 12) can be formed, the working time (cycle time) of the sticking device 50 can be shortened.

From here, the provisional pressure bonding step will be described in more detail with reference to FIG.
First, in FIG. 3 (1), the conventional engagement stage S (see FIG. 6 (1)) and the recognition means U are separately provided with the engagement means 13 and the imaging means 14 for substrate recognition. It shows a state where the engagement stage and the recognition stage are performed separately and almost simultaneously. This state is referred to as engagement / recognition stage A.
In the engaging / recognizing means A described above, the engaging means 13 is formed at the piece forming position 27 by cutting the adhesive tape 3 delivered from the loading mechanism 25 into a required size by the cutting mechanism 24. The piece 12 is engaged from the piece formation position 27. On the other hand, the imaging unit 14 independently recognizes the predetermined position 2 of the substrate 1 using, for example, a CCD camera regardless of the engagement stage in the engagement unit 13. At this time, separately from the engaging means 13, it is possible to monitor the engagement state of the individual pieces 12 and the cutting state of the individual pieces 12, for example, using the imaging means 23 such as a CCD camera.
Next, in FIG. 3 (2), the conventional moving stage TV (see FIGS. 6 (2) and 6 (4)) and the recognition means U, the independent engaging means 13 and the imaging means 14 are shown. It shows a state where the movement stage and the recognition stage are performed separately and almost simultaneously. This state is referred to as movement / recognition stage B.
In the movement / recognition stage B described above, the engaging means 13 moves from the individual piece forming position 27 toward the predetermined position 2 recognized by the imaging means 14 on the substrate 1 in the engaged state. One imaging means 14 recognizes the predetermined position 2 continuously from the engagement / recognition means A until the individual piece 12 is supplied and set at the predetermined position 2. At this time, in the cutting / loading mechanisms 24 and 25, the adhesive tape 3 to be cut next is delivered in a state recognized by the imaging means 23. As is clear from FIG. 3 (2), since the conventional movement stage T and movement stage V are performed together, the work time (cycle time) can be efficiently reduced even if only this movement stage is taken. Can do.
Next, in FIG. 3 (3), a conventional supply stage W (see FIG. 6 (5)) and a recognition stage U at a predetermined position 2 to be supplied and set next are independently connected to the engaging means 13 and the imaging means. 14 shows a state where the supply stage and the next recognition stage are performed separately and substantially simultaneously. This state is a supply / recognition stage C.
In the supply / recognition stage C described above, the engaging means 13 saves labor from the conventional five stages (S to W) to the three stages (A to C) of the present invention, and the imaging means 14 quickly and accurately. The piece 12 is supplied and set to the recognized predetermined position 2, that is, at this time, the first piece 12 is already supplied and set (preliminary pressure bonding) to the predetermined position 2 to complete the temporary pressure bonding process. To do. One imaging means 14 moves to the upper part of the next predetermined position 2 and recognizes it quickly and accurately.
Here, using the substrate 1 shown in FIG. 1 (2), for example, if the predetermined position 2 of the substrate 1 is set to the position 2h in the temporary press-bonding step shown in FIG. Is set at the position 2g, and when the pieces 12 are separately supplied and set at this position (2g · 2h), the sheet 12 moves along the conveyance rail 21 in the direction of the arrow in the figure, Next, the individual pieces 12 are supplied to the position (2e · 2f) where the pieces 12 are supplied and set, to the position (2c · 2d), and finally to the position (2a · 2b). 3 is performed, the individual pieces 12 are attached to the entire predetermined position 2 of the substrate 1 separately.
Therefore, in the temporary press-bonding process (each stage A to C) according to the present invention, the working time (cycle time) can be significantly reduced as compared with the prior art.

Moreover, as shown in FIG. 4, if an example is given as the engaging means 13 used in the temporary press-bonding process (each step A thru | or C) shown in FIG. 3, it will adsorb | suck to attach the piece 12 (peeling film 11). A fixing method is adopted, a tip portion 29 to which a tip jig 28 replaceable according to the individual piece 12 is attached, a stroke portion 30 to which a tip portion 29 including the tip jig 28 is attached, and a tip portion 29 ( (Including the tip jig 28). At least a load portion 31 having a function of reciprocating the stroke portion 30 in the vertical direction is provided. According to the engaging means 13, it is possible to realize a constant load (constant stroke length P) by moving the pieces 12 downward in the engaged state during the temporary press-bonding step (supply / recognition stage C). The magnetic load method is employed for the fitting portion between the stroke portion 30 and the load portion 31. That is, 32a is a magnet attached to the stroke member 30, and 32b is a magnet attached to the load portion 31.
In addition to the magnetic load method, for example, an elastic load method using an elastic material (not shown) such as a compression spring may be adopted as the engaging means 13.

Furthermore, the substrate 1 that has completed the provisional crimping step is then subjected to a final crimping step in the final crimping unit 8.
The main crimping unit 8 is provided with the crimping means 15, and the crimping means 15 requires a higher load capacity than the engaging means 13 described above. Although not shown, a crimping base is provided on the opposite side of the substrate 1 from the predetermined position 2 in the same manner as the supply set base 26.
The supply set table 26 and the crimping table are provided with a heating mechanism (not shown). By the action of this heating mechanism, the individual pieces 12 are stuck (supply set / crimped) to the substrate 1, so that the resin component of the film 10 can be more easily stuck on the substrate 1. In addition, you may provide a heating mechanism in the engaging means 13 or the crimping | compression-bonding means 15 side, without providing in each stand side.
The crimping means 15 includes, for example, an appropriate pneumatic / hydraulic cylinder (not shown) having a low frictional resistance, and a controller for controlling the load, In this case, an electropneumatic regulator (not shown) is provided.
By such a load part / control part, the predetermined position 2 of the substrate 1 to which the pieces 12 are affixed has a single or a plurality of required rows, in this case, a predetermined position in two pieces, for example, FIG. ) Such that the positions (2a and 2b) and the positions (2c and 2d) as shown in FIG. And according to the crimping | compression-bonding state of the piece 12, it is comprised so that it can crimp by the crimping | compression-bonding means 15, changing a control suitably by a control part.
Further, the tip portion of the crimping means 15 can be exchanged in the same manner as the replaceable tip jig 28 used in the engaging means 13 shown in FIG. A high heat-resistant material (not shown) such as fluororesin rubber can be attached.

Here, in addition to FIG. 1 and FIG. 2, the peel unit 9 and the peel process described above, which are the characteristic parts of claim 2, will be described in detail with reference to FIG.
FIG. 5 is an enlarged schematic view showing a peel process in the peel unit 9 corresponding to FIG. 1 (1) and FIG.

  As shown in FIGS. 1A and 5, the peeling film removing means 16 provided in the peel unit 9 includes, in addition to the peeling film removing adhesive tape 17 and the pressing mechanism 18, 33 a predetermined substrate 1. Peel stand on the opposite side of position 2, 34 is a take-up roller for adhesive tape, 35 is a detector for detecting peeled film (color sensor), and 36 is the opposite side of detector 35 with adhesive tape 17 interposed. In addition, at least a detection board for detection is provided, and similarly to the unit 9, the detection board is configured to be detachable and can be appropriately rearranged.

  As shown in FIG. 5, when removing the peeling film 11 in the two-layered piece 12, the peel table 33 is provided with a heating mechanism in the supply set table 26 or the pressure bonding table, and the resin of the adhesive film 10. Although the component was further stuck on the substrate 1, in order to peel the release film 11 efficiently, for example, a cooling mechanism (not shown) incorporating a piezoelectric element is provided. In this cooling mechanism, for example, a heat sink and / or an air cooling fan is combined with an appropriate detector toward a heat generation portion (12 pieces on the substrate 1) in the peeling process, and a cooling temperature control is performed. And according to the resin characteristic in the piece 12 (adhesive film 10), it is comprised so that it can cool by changing a temperature setting suitably. In addition to this cooling mechanism, for example, an air cooling method that reduces costs may be employed. In this air cooling system, cooling can be performed by providing an air passage (not shown) for circulating air at a required location of the peel table 33. And the amount of circulating air used can be reduced by combining, for example, an ionizer (not shown) with the air passage in this air cooling system. Furthermore, as an example of the air cooling method, a self-cooling system method, for example, a corder method may be adopted. In addition, you may provide in the pressing mechanism 18 side with which this removal means 16 was equipped, without providing cooling systems, such as a cooling mechanism, in the peel stand 33 side.

Further, as shown in FIG. 5, the pressing mechanism 18 on the opposite side of the peel table 33 with the adhesive tape 17 and the piece 12 interposed therebetween presses the entire piece 12 with the adhesive tape 17 interposed therebetween. Since the material (material, processing, etc.) of the tip portion of the mechanism 18 is a very important part, for example, a fluororesin member (not shown) having an appropriate elastic action is used. In this case, the resin is not limited to fluororesin, and may be appropriately changed as long as it has substantially the same elastic action.
Therefore, the resin (glue) traces of the pressure-sensitive adhesive film 10 generated when the individual pieces 12 are excessively pressed through the adhesive tape 17 can be efficiently prevented, and the adhesive tape in the individual pieces 12 can be appropriately pressed. Uniform contact with the surface can be realized by the pressing mechanism 18 described above with respect to the substantially flat surface on the 17 side.

  The take-up roller 34 is configured in conjunction with an adhesive tape supply mechanism (not shown) that stretches or relaxes the adhesive tape 17 with a predetermined tension. In the tape supply mechanism, as shown in FIG. 5, the adhesive tape 17 is delivered to the individual piece 12 affixed (crimped) on the substrate 1 on the left side of the pressing mechanism 18 as shown in FIG. In the right side portion of the delivery reel, the removed release film 17 is adhered to the adhesive tape 17, and the adhesive tape 17 is wound around the take-up reel that takes up the adhesive tape 17 while passing through the take-up roller 34 portion. Has been.

The color sensor 35 (detector) is also a characteristic part of the present invention, and corresponds to the matrix type substrate 1 in recent years, and the release film 11 (release member) in the piece 12 cut from the adhesive tape 3 for die bonding. ) Is also made thinner, and the release film 11 and the adhesive tape 17 itself are also thinner, so that the conventional detector cannot sufficiently detect the release film 11 and the substrate 1 This is employed in order to efficiently solve the problem of performing the next process with the release film 11 remaining at the predetermined position 2.
In other words, to fully exhibit the merit of automation in the color sensor 35, first, whether the release film 11 itself to be detected is transparent or opaque is colored. The adhesive tape 17 to which the peeled release film 11 is bonded is also colored, and the color opposite to the color of the peelable film 11 is applied, so that the peeled release film 11 is further detected by the color sensor 35. It makes things easier. For this reason as well, it is configured not to simply add a color, but to allow the release film 11 and the adhesive tape 17 to have opposite colors so that the release film 11 can be detected clearly. The selection of this color may be appropriately changed as long as the peeling film 11 can be accurately detected without giving the opposite color. In addition, as shown in FIG. 5, the detection board 36 is provided in order to detect the peeling film 11 more clearly and accurately with a color sensor. Also in this detection board, in this case, at least the surface of the adhesive tape 17 is appropriately colored so that the release film 11 can be clearly detected. Further, the inspection board 36 may be removed and carried out.

  Therefore, the release film 11 which is the characteristic part of claim 2, that is, used at least when the release film 11 is removed from the piece 12 (adhesive film 10) by being adhered to the release adhesive tape 17. Even if the adhesive tape 17 is transparent or opaque, the release film 11 and the adhesive tape 17 are colored separately, and the opposite color is applied to one of the colors. At the same time, by adopting the color sensor 35 as a detector that detects whether the release film 11 is completely removed from the adhesive film 10 and is securely adhered to the adhesive tape 17, the working time (cycle) is further improved. Time) can be shortened.

In the present embodiment, the adhesive tape 3 to be applied to the predetermined position 2 of the substrate 1 has been described with a two-layer structure. However, if the adhesive tape has a single-layer structure as described above, the peel in the attaching method (step) of the present invention. Without performing the process, only the temporary pressure bonding / main pressure bonding process or the temporary pressure bonding and the main pressure bonding process may be performed in one process. That is, depending on the pressure-sensitive adhesive tape 3 having a required multi-layer structure or various substrates 1, the temporary pressure bonding, the main pressure bonding, and the peeling process in the bonding process may be appropriately selected and performed.
Further, in accordance with the face-up type substrate 1 in which the chip 40 is mounted on the adhesive film 10 at the predetermined position 2 of the substrate 1 in this embodiment, the connected pasting device 50 and die bonding device 60 (see FIG. 2). As described above, for example, if the adhesive film 10 at the predetermined position 2 of the substrate 1 is the face-up type substrate 1 (flip chip substrate), the die bonding apparatus is mounted with the chip 40 via the bumps (connection electrodes). May be implemented. Further, the adhesive film 10 is further attached by the attaching device 50 on the chip 40 attached to the adhesive film 10 on the face-up type substrate 1, and the second chip 40 is attached by the die bonding device 60. Such a chip 40 and the adhesive film 10 may be carried out on a stack type substrate 1 having a structure in which a plurality of required chips and each of them overlap each other. That is, the arrangement configuration of the sticking device 50 and the die bonding device 60 is not limited to FIG. 2 of the present embodiment, and a plurality of required devices 50 and 60 can also be connected.

  Also from the above, according to the die bonding pressure-sensitive adhesive tape attaching method according to the present invention, when the semiconductor chip 40 (electronic component) such as an IC is mounted (die bonded) to the predetermined position 2 on the substrate 1, the chip 40 is used. By attaching the adhesive tape 3 for die bonding as a die bonding material to the substrate 1 to the predetermined position 2 of the substrate 1 quickly and accurately, the working time (cycle time) can be shortened efficiently. it can.

FIG. 1 (1) is a plan view of a sticking device used in the method for sticking a die-bonding adhesive tape according to the present invention, and FIG. 1 (2) is a sticking tape attached with the sticking device corresponding to FIG. 1 (1). FIG. FIG. 2 is a plan view in which a die bonding apparatus is connected to the sticking apparatus corresponding to FIG. FIG. 3 (1) thru | or FIG. 3 (3) shows the schematic which implements a temporary crimping | compression-bonding process in steps with the said sticking apparatus corresponding to FIG. 1 (1). FIG. 4 is an enlarged schematic cutaway view showing an example of the engaging means used in the sticking device corresponding to FIG. FIG. 5 shows an enlarged schematic view of performing a peel process with the sticking device corresponding to FIG. FIGS. 6 (1) to 6 (5) are schematic views showing a temporary press-bonding process step by step with a conventional sticking apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Board | substrate 2 Predetermined position 3 Adhesive tape 4 Sticking part 5 In magazine part 6 Out magazine part 7 Temporary crimping unit 8 This crimping unit 9 Peel unit 10 Adhesive film 11 Release film (peeling member)
12 pieces 13 engaging means 14 imaging means 15 pressure-bonding means 16 peeling film removing means 17 adhesive tape 18 pressing mechanism 19 die bonding unit 20 mounting means 21 transport rail 22 moving rail 23 imaging means 24 (24a and 24b) cutting mechanism 25 (25a・ 25b) Loading mechanism 26 Supply set base 27 Piece forming position 28 Tip jig 29 Tip portion 30 Stroke portion 31 Load portion 32 (32a, 32b) Magnet 33 Peel stand 34 Winding roller 35 Color sensor (detector)
36 Detection board 40 Semiconductor chip (electronic component)
DESCRIPTION OF SYMBOLS 50 Sticking apparatus 60 Die bonding apparatus A Attachment / recognition stage B Movement / recognition stage C Supply / recognition stage P Stroke length 100 Substrate 101 Attachment means 102 Imaging means 103 Piece 103a Adhesive film 103b Release film (peeling member)
104 Adhesive tape 105 Piece formation position S Engagement stage T Movement stage U Recognition stage V Movement stage W Supply stage

Claims (3)

When a pressure-sensitive adhesive film that has been cut to a predetermined size is attached to a predetermined position on a substrate, a step of recognizing the predetermined position by an imaging unit and a film that is locked by a locking unit A die bonding film sticking method comprising: a step and a step of supplying and setting the film to a predetermined position of the substrate by the engaging means based on the recognition result of the predetermined position;
A sticking method for a die-bonding adhesive tape, wherein the engaging means and the imaging means are made independent to perform the recognition step and the engaging step separately and substantially simultaneously. The peeling member provided on the pressure-sensitive adhesive film pasted at a predetermined position of the substrate and cut to a predetermined size is adhered to the peeling tape for removing the peeling member, and the above-mentioned adhesive tape is removed. It is a detection method of a peeling member that detects a peeling member in a bonded state separately by a detector,
A different color is applied to the peeling member and the adhesive tape, and an opposite color is applied to the other color, and a color sensor is used as the detector for detecting the color. A method for detecting a peeling member, wherein the peeling member is detected. A step of supplying and setting the adhesive film, which has been cut to a predetermined size, to the predetermined position of the substrate in a state where the film is engaged by the engaging means when the adhesive film is bonded to the predetermined position of the substrate; The step of attaching the film to a predetermined position on the substrate and the peeling member provided on the film attached to the substrate by removing the peeling member by causing the film supplied and set to the substrate to be crimped by a crimping means. A method of attaching a pressure-sensitive adhesive tape for die bonding, including a step of removing the release film from the substrate and leaving only the pressure-sensitive adhesive film on the substrate by bonding to the adhesive tape for use,
A method of applying a pressure-sensitive adhesive tape for die bonding, wherein the step of attaching an electronic component to the pressure-sensitive adhesive film on the substrate after performing each step described above is continuously performed.

Images