CN100466211C - Method for sticking adhesive tape for die bonding and method for mounting electronic component - Google Patents
Method for sticking adhesive tape for die bonding and method for mounting electronic component Download PDFInfo
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- CN100466211C CN100466211C CNB2005800008676A CN200580000867A CN100466211C CN 100466211 C CN100466211 C CN 100466211C CN B2005800008676 A CNB2005800008676 A CN B2005800008676A CN 200580000867 A CN200580000867 A CN 200580000867A CN 100466211 C CN100466211 C CN 100466211C
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- substrate
- adhering film
- splicing tape
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- assigned position
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- 238000000034 method Methods 0.000 title claims abstract description 42
- 239000002390 adhesive tape Substances 0.000 title claims abstract description 17
- 239000000758 substrate Substances 0.000 claims abstract description 121
- 230000007246 mechanism Effects 0.000 claims abstract description 102
- 238000009434 installation Methods 0.000 claims description 9
- 238000003825 pressing Methods 0.000 claims description 9
- 238000012423 maintenance Methods 0.000 claims description 8
- 238000001514 detection method Methods 0.000 claims 1
- 239000002313 adhesive film Substances 0.000 abstract 2
- 238000002788 crimping Methods 0.000 description 57
- 230000006835 compression Effects 0.000 description 9
- 238000007906 compression Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 8
- 239000000463 material Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- 239000003086 colorant Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000008030 elimination Effects 0.000 description 2
- 238000003379 elimination reaction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- FFBHFFJDDLITSX-UHFFFAOYSA-N benzyl N-[2-hydroxy-4-(3-oxomorpholin-4-yl)phenyl]carbamate Chemical compound OC1=C(NC(=O)OCC2=CC=CC=C2)C=CC(=C1)N1CCOCC1=O FFBHFFJDDLITSX-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Die Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
A method for sticking adhesive tape for die bonding. First, a prescribed position (2) on a substrate (1) is recognized by an image pick up mechanism (14). Next, a piece (12) including an adhesive film (10) is held by a holding mechanism (13). Then, based on the result of the recognition of the prescribed position (2), the holding mechanism (13) shifts and the adhesive film (10) is stuck at the prescribed position (2). In the steps above, the holding mechanism (13) and the image pick up mechanism (14) can independently move. Therefore, the step of recognizing the prescribed position (2) and the step of holding the piece (12) can be performed at the same time.
Description
Technical field
The present invention relates to the attaching method of the adhesive tape for die bonding that electronic component uses is installed and be utilized the attaching method of this splicing tape electronic component to be installed in the installation method of the electronic component on the substrate at the substrate assigned position.
Background technology
The method of Shi Yonging in the past is to utilize splicing tape that electronic component is attached to method on the substrate.In the method, the small pieces that use two first type surfaces to have cementability engage the splicing tape of usefulness.This method is carried out like that by following.
At first, cut off with the splicing tape of peeling off band.Thus, prepare with the monolithic of peeling off band.This monolithic moves under the state that is kept by maintaining body.Then, utilize maintaining body that monolithic is put on the assigned position of substrate.This step is called interim crimping step.
Then, put at the monolithic on the substrate and utilize compression joint mechanism to be crimped on the substrate.Thus, monolithic is attached on the assigned position of substrate.That is, splicing tape first type surface is attached on the substrate.This step is called main crimping step.After this step finished, also surplus on the monolithic first type surface of the opposition side of the face of monolithic and substrate contacts had a stripping film.
Then, with splicing tape by on the stripping film that is pressed in the monolithic on the substrate.Thus, stripping film and splicing tape are bonding.Then, if the conveyance splicing tape, then stripping film just is removed from substrate.Therefore, only adhering film is stayed on the substrate.This step is called peels off removal process.After peeling off removal process, expose another first type surface of adhering film.
Then, on another first type surface of adhering film, attach electronic component.That is, electronic component is installed on the substrate by adhering film.This step is called the small pieces engagement step.
The installation method of electronic component as described above for example is documented on 2001-No. 135653 communiques of TOHKEMY.
In addition, in aforesaid interim crimping step, as Fig. 9～shown in Figure 13, maintaining body 101 and image mechanism 102 one move.
Specify aforesaid interim crimping step below.
At first, as shown in Figure 9, splicing tape 104 105 is cut to required size in the position.Thus, on adhering film 103a, form the monolithic 103 of having stripping film 103b.Then, monolithic 103 is kept by maintaining body 101.For example, the first type surface of stripping film 103b is by maintaining body 101 absorption.This step shown in Figure 9 is called and keeps step S.
Secondly, as shown in figure 10, under the state that monolithic 103 is kept by maintaining body 101,105 the tops from the position to substrate 100, maintaining body 101 and image mechanism 102 one move.This step shown in Figure 10 is called mobile step T.
Then, as shown in figure 11, when image mechanism 102 arrives substrate 100 tops, the position that electronic component should be installed of substrate 100 is discerned.This step shown in Figure 11 is called identification step U.
Then, as shown in figure 12, after identification step U finished, maintaining body 101 and image mechanism 102 moved to the top of being discerned among the identification step U, position integratedly.This step shown in Figure 12 is called mobile step V.
Then, as shown in figure 13, when maintaining body 101 arrived the top of being discerned among the identification step U, position, maintaining body 101 put monolithic 103 on the assigned position of substrate 100.At this moment, monolithic 103 is bonded on the substrate 100.This step is called and puts step W.
In aforesaid interim crimping step in the past,, carry out 5 steps of step S successively to step W as Fig. 9～shown in Figure 3.
Patent documentation 1: the spy open 2001-No. 135653 communiques (the 13rd page, Fig. 1).
In recent years, owing to more and more wish to reduce the cost of substrate, so often use the matrix form substrate that a large amount of electronic components can be installed on a plate base.In addition, be installed in electronic component on the matrix form substrate Bao Youxiao that just becoming, therefore, as how rapid and higher precision a large amount of electronic components being installed in just becomes important problem on the matrix form substrate.
On the other hand, in aforesaid technology in the past, maintaining body 101 and image mechanism 102 are set as one.Therefore, must therefore carry out step S to step W.So, no matter how promptly to carry out step S separately to step W, all be difficult to shorten significantly the time of interim crimping step integral body.For example, in keeping step S, image mechanism 102 can not carry out identification step U, so be difficult to carry out rapidly interim crimping step.In addition, if the undue step S that shortens then can not carry out interim crimping step with degree of precision to the required separately time of step W.That is, can't carry out interim crimping step rapidly again accurately.
In addition, peeling off employed splicing tape of removal process and stripping film is transparent (not shown).Therefore, when using infrared ray sensor, can not detect the situation that stripping film is removed from splicing tape.Even the material of stripping film is opaque, also be difficult to detect the situation that stripping film is removed rapidly by infrared ray sensor.Therefore, after splicing tape is attached on the substrate, can't promptly electronic component be installed on the splicing tape.
In addition, be used for carrying out aforementioned splicing tape being attached to the device of this step on the substrate and being used for carrying out the device that electronic component is installed in this step on the splicing tape owing to be respectively equipped with, so can't carry out these steps continuously.Therefore, can not shorten the time of electronic component installation exercise integral body.
Summary of the invention
The present invention makes in view of the above problems, and its purpose is, a kind of like this attaching method of adhesive tape for die bonding is provided: can accurately aforesaid small pieces be attached on the assigned position of substrate with splicing tape (adhering film) again rapidly.
Whether another object of the present invention is, a kind of attaching method of adhesive tape for die bonding is provided, can promptly detect aforesaid adhesive tape for die bonding peeling member and be removed.
Another purpose of the present invention is, a kind of installation method of electronic component is provided, by carrying out continuously, thereby can rapidly and accurately electronic component be installed on the assigned position of substrate putting from aforesaid adhesive tape for die bonding at the step on the assigned position of substrate, the Overall Steps of step to the assigned position that electronic component is installed in substrate by this adhesive tape for die bonding.
In the attaching method of the adhesive tape for die bonding of Yi Ji Intraoperative scheme of the present invention, at first, the assigned position on the substrate is discerned by image mechanism.Then, the adhering film of two first type surfaces with cementability keeps with maintaining body.Then, the recognition result of position according to the rules moves maintaining body and adhering film is attached on the assigned position.Maintaining body and image mechanism are independent mutually to be moved, and identification step and maintenance step are carried out simultaneously.
Adopt said method, can shorten step that the precalculated position is discerned and the needed activity duration of step that adhering film is kept.
In the attaching method of the adhesive tape for die bonding of another Ji Intraoperative scheme of the present invention, at first, peeling member is coated a kind of color.Then, on splicing tape, coat other colors that are different from this a kind of color.On a first type surface peeling member is installed, the splicing tape that two first type surfaces is had cementability is attached on the substrate.Then, with splicing tape peeling member is removed from splicing tape.Re-use color sensor, detect peeling member and whether be bonded on the splicing tape.
Adopt said method, can detect peeling member rapidly and whether be removed.
In the installation method of the electronic component of the another Ji Intraoperative of the present invention scheme, at first, in the 1st step, the adhering film that two first type surfaces is had cementability puts on the assigned position of substrate, and on the first type surface of two first type surfaces peeling member is installed.Then, in the 2nd step, will put at the adhering film on the assigned position with compression joint mechanism and be crimped on the substrate.Then, in the 3rd step, peeling member is bonded on the splicing tape, peeling member is removed from adhering film, only remaining adhering film on substrate.Then, in the 4th step, electronic component is installed on the position of regulation by adhering film.The device of carrying out the device of aforementioned the 1st to the 3rd step and carrying out the 4th step is set as one.In addition, the 1st to the 3rd step and the 4th step are carried out continuously.
Adopt said method, after stripping film is removed, can on the adhering film that remains on the substrate, electronic component be installed immediately.
Above-mentioned other purposes, feature, technical scheme and advantage of the present invention, from the apposition figure of institute understand of the present invention below can be understood describing in detail.
Description of drawings
Fig. 1 is the vertical view of employed adhering device in the attaching method of adhesive tape for die bonding of embodiment.
Fig. 2 utilizes the adhering device of Fig. 1 to attach the stereogram of the substrate of adhering film.
Fig. 3 is the vertical view that connects state behind the die bonding apparatus therefor on the expression adhering device shown in Figure 1.
Fig. 4 is the diagrammatic sketch that the A step of the interim crimping step of utilizing adhering device execution shown in Figure 1 is described usefulness.
Fig. 5 is the diagrammatic sketch that the B step of the interim crimping step of utilizing adhering device execution shown in Figure 1 is described usefulness.
Fig. 6 is the diagrammatic sketch that the C step of the interim crimping step of utilizing adhering device execution shown in Figure 1 is described usefulness.
Fig. 7 is the diagrammatic sketch of the maintaining body of expression adhering device shown in Figure 1.
Fig. 8 is to utilizing the diagrammatic sketch that removal process describes usefulness of peeling off of adhering device execution shown in Figure 1.
Fig. 9 is the diagrammatic sketch that the S step of in the past interim crimping step is described usefulness.
Figure 10 is the diagrammatic sketch that the T step of in the past interim crimping step is described usefulness.
Figure 11 is the diagrammatic sketch that the U step of in the past interim crimping step is described usefulness.
Figure 12 is the diagrammatic sketch that the V step of in the past interim crimping step is described usefulness.
Figure 13 is the diagrammatic sketch that the W step of in the past interim crimping step is described usefulness.
Symbol description
The 1st, substrate 2 is that position 3 is that splicing tape 4 is that attaching portion 5 is that interior case 6 is that outer container 7 is that interim crimping unit 8 is that formal crimping unit 9 is to peel off that to eliminate unit 10 be that adhering film 11 is that stripping film 12 is that monolithic 13 is that maintaining body 14 is that image mechanism 15 is that compression joint mechanism 16 is that to remove mechanism 17 be that splicing tape 18 is that pressing mechanism 19 is that small pieces joint unit 20 is that installing mechanism 21 is that conveyance rail 22 is that moving rail 23 is image mechanism 24 (24a to stripping film, 24b) be shut-off mechanism 25 (25a, be that delivering mechanism 26 is that mounting table 27 is that position 28 is that front end anchor clamps 29 are that leading section 30 is that rotary shaft 31 is payload portion 32 (32a 25b), be that magnet 33 is to peel off that to eliminate platform 34 be that winding drum 35 is that color sensor 36 is that check-out console 40 is that chip 50 is that adhering device 60 is that die bonding apparatus therefor A keeps 32b), identification step B is mobile, identification step C puts, identification step P is that haul distance 100 is that substrate 101 is that maintaining body 102 is that image mechanism 103 is that monolithic 103a is that adhering film 103b is that stripping film 104 is that splicing tape 105 is that position S is that maintenance step T is that mobile step U is that identification step V is that mobile step W puts step
Embodiment
Below, the attaching method of the adhesive tape for die bonding of the usefulness description of drawings embodiment of the invention and the installation method of electronic component.
At first, see figures.1.and.2, the attaching method that attaches the adhesive tape for die bonding of adhering film on the substrate of the embodiment of the invention is described.
In the attaching method of the adhesive tape for die bonding of embodiment (below abbreviate " splicing tape " as), use adhering device 50.As depicted in figs. 1 and 2, adhering device 50 is that adhering film 10 is attached to the device of using on the position 2 of substrate 1.Adhering film 10 is to be installed in the device of using on the substrate 1 as the semiconductor chip of electronic component (below abbreviate " chip " as) 40.
Adhering device 50 has the cut-out portion that the 1st splicing tape 3 is cut to the monolithic 12 of required size.Monolithic 12 is to form fitting as the adhering film 10 of chip join material with as the stripping film 11 of peeling member.Adhering film 10 is two sides adhering films that its two first type surface has bonding force.Therefore, be a first type surface attaching substrate 1 at last at adhering film 10, another first type surface attaches chip 40.Stripping film 11 be before on another first type surface that chip 40 is attached to gluing of surfaces 10 during the member of another first type surface of protection, and be the member that when monolithic 12 moves, adsorbs by maintaining body 13.
Adhering device 50 has monolithic 12 is attached to attaching portion 4 on the substrate 1.And, be provided with the interior case portion 5 that monolithic 12 is taken in by the substrate 1 before attaching in a side of attaching portion 4.Opposite side in attaching portion 4 is provided with the outer container portion 6 that adhering film 10 is taken in by the substrate 1 after attaching.
The 1st splicing tape 3 of embodiment has the double-decker that is made of adhering film 10 and stripping film 11, but but the single layer structure that also only constitutes by adhering film 10, or be provided with the three-decker of stripping film 11 respectively at two first type surfaces of adhering film 10.
As shown in Figure 1, in attaching portion 4, be provided with interim crimping unit 7, formal crimping unit 8 from interior case portion 5 towards outer container portion 6 in order and peel off and eliminate unit 9.Interim crimping unit 7, formal crimping unit 8 and peel off and eliminate unit 9 owing to be set as mutual mounting or dismounting freely are so can suitably carry out their configuration change.Peeling off and eliminating unit 9 is unit of stripping film 11 being removed usefulness from adhering film 10.
Monolithic 12 is taken in by the substrate 1 before attaching by interior case portion 5, and monolithic 12 is taken in by the substrate 1 after attaching by outer container portion 6, because they all are used for taking in substrate 1, so their basic structure key element is roughly the same mutually.In each in case portion 5 and the outer container portion 6, with the state that is spaced a distance d from one another along the overlapping multi-piece substrate 1 that is provided with of vertical.
In aforesaid outer container portion 6, take in adhering film 10 by the multi-piece substrate 1 after attaching.Therefore, in above-mentioned outer container portion 6, must take in by adhering film 10 and with the overlapping mutual not bonding substrate 1 of the state that is spaced a distance d from one another.But, in the interior case portion 5 of taking in multi-piece substrate 1 before attaching adhering film 10, because substrate 1 connects by adhering film 10 each other, so also can be set as multi-piece substrate 1 superimposed taking under state of contact.
In addition, on adhering device shown in Figure 1 50,, in attaching portion 4, be provided with 2 conveyance rails 21 that are roughly linearity in order to transfer substrate 1 according to the order of attaching portion 4, outer container portion 6.The shape in each vertical cross section of 2 conveyance rails 21 such as Fig. 4～shown in Figure 6 are the C fonts.Insert the both side ends of substrate 1 respectively at the sunk part of these 2 C font conveyance rails 21.On conveyance rail 21, be provided with substrate clamp system (not shown).Therefore, can transfer substrates 1 along conveyance rail 21 by the order of interior case portion 5, attaching portion 4 and outer container portion 6.
With aforesaid interim crimping unit 7, formal crimping unit 8 and peel off and eliminate unit 9 and carry out following attaching step.
At first, in interim crimping unit 7, monolithic 12 is carried with the state that is held mechanism's 13 maintenances, puts on the position on the first type surface of substrate 12.This step is called interim crimping step.Then, in formal crimping unit 8, put at the monolithic on the substrate 1 12 and utilize compression joint mechanism 15 to be crimped on the substrate 1.This step is called formal crimping step.Thus, monolithic 12 is attached on the position 2 of first type surface of substrate 1.At this moment, residual on monolithic 12 have a stripping film 11.
Then, in order to remove stripping film 11, use stripping film to remove mechanism 16.Stripping film is removed mechanism 16 and is had single face splicing tape i.e. the 2nd splicing tape 17 and pressing mechanism 18.Pressing mechanism 18 with the bonding plane of the 2nd splicing tape 17 by on the monolithic 12 that is pressed in substrate 1.Thus, stripping film 11 is bonded on the 2nd splicing tape 17.In addition, by coiler device the 2nd splicing tape 17 of reeling.Thus, be bonded on the bonding plane of the 2nd splicing tape 17 at stripping film 11 after, when pressing mechanism 18 breaks away from the 2nd splicing tape 17, stripping film 11 is just removed from adhering film 10 along with moving of the 2nd splicing tape 17.Its result, residual on substrate 1 have an adhering film 10.Thus, the attaching step that the 2nd splicing tape 17 is attached on the substrate finishes.
Fig. 2 is illustrated in the position 2a～2h at 8 positions, the attaching state of 8 steps.The reason that Fig. 2 describes like that, be used for the monolithic 12 in the aforesaid attaching step of interim expression (interim crimping step, formal crimping step and peel off removal process) the attaching state and attach the attaching state of the monolithic 12 in the front and back step of step.
For position 2b, the state of the substrate 1 before the interim crimping step is carried out in expression.And for position 2a, the state of expression when utilizing maintaining body 13 to put monolithic 12 on substrate 1, the state of the substrate 1 when promptly representing interim crimping step.
For position 2c and 2d, represented to utilize compression joint mechanism 15 will put state, be the state of the substrate 1 after formal crimping step finishes at the substrate 1 after 12 crimping of the monolithic on the substrate 1.
For position 2f, represented the state of eliminating the substrate 1 before removing stripping film 11 in the unit 9 peeling off.In addition, for position 2e, represented to utilize stripping film to remove the state of the substrate 1 of mechanism 16 when stripping film 11 is removed, the state of the substrate when peeling off removal process 1.
For position 2g, represented that chip 40 is installed in the state that adhering film 10 is gone forward.In addition, for position 2h, represented the substrate 1 after chip 40 is installed on the adhering film 10 fully state, be the state of the substrate 1 after the small pieces engagement step finishes.
In a word, for from position 2a to position 2f, represented the attaching step of being undertaken by adhering device 50, for position 2g, 2h, represented the small pieces engagement step of being undertaken by die bonding apparatus therefor 60 shown in Figure 3 described later.Chip 40 utilizations are located at the installing mechanism 20 on the chip join device 60 and are installed on the adhering film 10.
Then, with Fig. 3 die bonding apparatus therefor 60 is described.
In addition, at the erecting device 90 of the electronic component that is used for electronic component mounting method of present embodiment shown in Figure 3, adhering device 50 shown in Figure 1 is connected with die bonding apparatus therefor 60 shown in Figure 3.Therefore, after attaching the step end, can carry out the small pieces engagement step continuously.Therefore, can shorten electronic component and be installed in integral installation operation on the substrate 1.
On the erecting device 90 of electronic component, transfer substrate 1 for order according to interior case portion 5, attaching portion 4, die bonding apparatus therefor 60, outer container portion 6, be provided with 2 conveyance rails 21 that are roughly linearity in attaching portion 4 with in die bonding apparatus therefor 60.The shape in the vertical cross section separately of 2 conveyance rails 21 is identical with adhering device shown in Figure 1 50.That is, be the C font, as Fig. 4～shown in Figure 6.Insert the both side ends of substrate 1 respectively at the sunk part of the conveyance rail 21 of these 2 C fonts.On conveyance rail 21, be provided with substrate clamp system (not shown).Therefore, can transfer substrates 1 along conveyance rail 21 by the order of interior case portion 5, attaching portion 4, die bonding apparatus therefor 60 and outer container portion 6.
In addition, as shown in Figure 3,, at first, the outer container portion 6 of adhering device 50 is taken off from attaching portion 4 in the occasion that die bonding apparatus therefor 60 is connected with adhering device 50.Then, die bonding apparatus therefor 60 is installed on the adhering device 50.Then, outer container portion 6 is installed on die bonding apparatus therefor 60.At this moment, accommodate substrate 1 in outer container portion 6, this substrate 1 is equipped with chip 40.
Adopt the erecting device 90 of the electronic component that is used for electronic component mounting method of present embodiment,, can further promptly and accurately chip 40 be attached on the adhering film 10 by connecting adhering device 50 and die bonding apparatus therefor 60.Its result can shorten needed whole time of the series of steps that electronic component is installed, the circulation timei of being.
If can make interim crimping unit 7, the formal crimping unit 8 of adhering device 50 and peel off small pieces joint unit 19 slips of eliminating unit 9 and die bonding apparatus therefor 60 along conveyance rail 21, then can further shorten circulation timei.
Then, with Fig. 1～Fig. 6 aforesaid interim crimping unit 7 and interim crimping step are described.
As Fig. 4～shown in Figure 6, interim crimping unit 7 is provided with and makes substrate 1 move its maintaining body that keeps 13 and be used to discern the image mechanism 14 of substrate 1 on one side.Interim crimping unit 7 also has: to the mobile moving rail that leads 22 of maintaining body 13 and image mechanism 14 except aforesaid 2 mechanisms; Be used to discern the image mechanism 23 of monolithic 12; Be used to cut off the shut-off mechanism 24 of the 1st splicing tape 3; Be used to send the delivering mechanism 25 of the 1st splicing tape 3; Put the mounting table 26 of monolithic 12.In addition, because aforesaid maintaining body 13, image mechanism 14, image mechanism 23, shut-off mechanism 24, delivering mechanism 25 and mounting table 26 constitute mounting or dismounting mutually freely, so variable their position concerns.
In addition, on moving rail 22, be respectively equipped with movably maintaining body 13 and image mechanism 14.Maintaining body 13 and image mechanism 14 are independent mutually, can be moved by moving rail 22 guiding.Therefore, maintaining body 13 and image mechanism 14 can move to the direction of the direction approximate vertical of extending with conveyance rail shown in Figure 1 21 separately.Therefore, maintaining body 13 and image mechanism 14 can roughly keep step and shooting step simultaneously.
In addition, as Fig. 4～shown in Figure 6, maintaining body 13 can move along the position that put monolithic 12 27 and attach position 2 substrate 1 of monolithic 12 between of moving rail 21 after just cutting off.And but image mechanism 14 broad wayss move to end side from a side end of mounting table 26.
On the other hand, on the erecting device 90 of electronic component, be provided with the image mechanism 23 of the step identification usefulness that the image mechanism 14 with substrate identification usefulness separates.In addition, the image mechanism 14 of substrate identification usefulness can move back and forth along moving rail 22, and the image mechanism 23 of step identification usefulness is fixed on the position of 27 tops, position.But image mechanism 23 also can move back and forth along moving rail 22 in the same manner with image mechanism 14.As Fig. 4～shown in Figure 6, utilize image mechanism 23, can discern state, the 1st splicing tape 3 that monolithic 12 keeps by maintaining body 13 and be cut off state that state that mechanism 24 cuts off and the 1st splicing tape 3 sent by delivering mechanism 25 etc.
In addition, shut-off mechanism 24 and delivering mechanism 25 can be integrated with adhering device 50, and they are set as in the inside of adhering device 50 or outside the mounting or dismounting freely separately.
In addition, delivering mechanism 25 supplies to the 1st splicing tape 3 on the position 27 of formation monolithic 12 of shut-off mechanism 24.Shut-off mechanism 24 cuts off the 1st splicing tape 3.
The cut-out of the 1st splicing tape 3 is undertaken by the cutter member (not shown) of shut-off mechanism 24a shown in Figure 1.The cutter member broad ways will be cut off by the 1st splicing tape 3 that delivering mechanism 25a sends.In addition, in the present embodiment,, except using described cutter member, can use the die-cut member (not shown) of shut-off mechanism 24b in order to cut off splicing tape.Die-cut member is die-cut by the part of the 1st splicing tape 3 sent by delivering mechanism 25b is carried out, and splicing tape is cut off.Cutter member and die-cut member independently are provided with.
In addition, delivering mechanism 25 has the incorporating section (not shown) that the 1st splicing tape 3 is reeled and taken in.This incorporating section various the 1st splicing tapes 3 of can reeling.
Although the clear example that the 1st splicing tape 3 is cut off with the shut-off mechanism 24a of cutter mode, but can switch cutter mode and die-cut mode according to substrate 1 and the 1st splicing tape 3.In order to switch this mode, shut-off mechanism 24 and delivering mechanism 25 can slide to the conveyance direction of substrate 1.
Below, describe interim crimping step in detail with Fig. 4.
Fig. 4 represents the maintaining body 13 that the 1st splicing tape 3 is kept and is used for maintenance, the identification step that image mechanism 14 independently moves, execution keeps step and identification step simultaneously of substrate identification.
In maintenance shown in Figure 4, identification step A, at first, send the 1st splicing tape 3 from delivering mechanism 25.Then, in the position 27, utilize shut-off mechanism 24 that the 1st splicing tape 3 is cut into required size.Then, utilize maintaining body 13 to keep monolithic 12.The first type surface of the suction device adsorption stripping film 11 of maintaining body 13 by using pump etc. keeps monolithic 12.Because image mechanism 14 can be independent mobile from the action of maintaining body 13, so during being adsorbed by 13 pairs of monolithics 12 of maintaining body, (charge coupling device: Charge Coupled Device) video camera etc. is discerned the position on the substrate 12 with CCD.The position 2 of image mechanism 14 on substrate 1, also can monitor the maintenance situation of monolithic 12 and the cut-out situation of monolithic 12.
Fig. 5 represents to comprise the moving of Figure 10 and mobile step T in the past shown in Figure 12 and V and identification step U both sides in the past shown in Figure 11, identification step B.In step shown in Figure 5, utilize maintaining body 13 and image mechanism 14 to carry out mobile step and identification step simultaneously.
Shown in Figure 5 move, among the identification step B, the monolithic 12 that is kept by maintaining body 13 moves the position 2 on substrate 1 from position 27.On the other hand, image mechanism 14 continues to be photographed in position 2, is put on position 2 up to monolithic 12.At this moment, delivering mechanism 25 is sent the 1st splicing tape 3 of next cut-out.So, adopt the erecting device 90 of this electronic component, as shown in Figure 5,, is installed the required time so can shorten electronic component owing to the mobile step T and the mobile step V that carry out simultaneously in the past.
Fig. 6 represents to carry out simultaneously the state that puts the corresponding step of the corresponding step of step W and identification step U shown in Figure 11 and in the past shown in Figure 13 and in the past.
Shown in Figure 6 putting, among the identification step C, putting monolithic 12 in position 2 by image mechanism 14 identifications.In this step, the 1st monolithic 12 put on position 2.That is, the interim crimping step of 1 monolithic 12 finishes.At this moment, image mechanism 14 moves to the top of the next position 2, is photographed in position 2.
Adopt the attaching method of the splicing tape of above-mentioned Fig. 4～embodiment illustrated in fig. 6, compare, can reduce number of steps with the attaching method of in the past splicing tape.More particularly, in interim crimping step in the past, though 5 step S～W of execution graph 9～Figure 13, in the interim crimping step of embodiment, three steps A～C of execution graph 4～Fig. 6 are so can shorten a series of required time of execution whole steps.
Then, be described in more detail aforesaid Fig. 4～step shown in Figure 6 with substrate shown in Figure 21.
At first, monolithic 12 is put at position 2h and position 2g.Then, maintaining body 13 and image mechanism 14 are moved back and forth along conveyance rail 21, monolithic 12 is put on position 2e and 2f.Then, maintaining body 13 and image mechanism 14 are moved back and forth once more along conveyance rail 21, monolithic 12 is put on position 2c and 2d.Maintaining body 13 and image mechanism 14 are moved back and forth along conveyance rail 21, monolithic 12 is put on position 2a and 2b.Its result puts monolithic 12 on the whole position 2 of substrate 1.
In the steps A～C of the interim crimping step of Fig. 4～shown in Figure 6, use the maintaining body 13 that monolithic 12 is kept by adsorption stripping film 11, but also can use other maintaining body.
As shown in Figure 7, maintaining body 13 has leading section 29, rotary shaft 30 and payload portion 31.On leading section 29, be equipped with according to the removable front end anchor clamps 28 of the kind of monolithic 12.The leading section 29 that comprises front end anchor clamps 28 is installed on rotary shaft 30.Rotary shaft 30 embeds in the payload portion 31 movably.Payload portion 31 has the leading section of making 29 (comprising front end anchor clamps 28) and the rotary shaft 30 reciprocating function of direction up and down.
In addition, maintaining body 13 makes rotary shaft 30 move certain haul distance P shown in Figure 7 downwards in interim crimping step, pushes monolithic 12 with certain load.In order to realize moving this rotary shaft 30, utilize magnetic that load is acted on the rotary shaft 30.As the structure that is used to realize this purpose, rotary shaft 30 and payload portion 31 have magnet 32a, 32b respectively.Embedding on payload portion 31 has rotary shaft 30, magnet 32a to be installed on the rotary shaft 30, and magnet 32b is installed on the payload portion 31.Utilize counter-force and gravitation between magnet 32a and the magnet 32b, make rotary shaft 30 up and down direction move.In addition, maintaining body 13 also utilizes the elastic component (not shown) of compression spring etc. to make rotary shaft 30 mechanism that moves of direction up and down.
After aforesaid interim crimping step, in formal crimping unit 8, carry out formal crimping step.The following describes formal crimping step.
As Fig. 1 and shown in Figure 3, in formal crimping unit 8, be provided with compression joint mechanism 15.Compression joint mechanism 15 has can be with the function that acts on than maintaining body 13 big load on the 1st splicing tape 3.Substrate 1 puts on crimping stations (not shown).
On each mounting table 26 and crimping stations, be provided with heating arrangements (not shown).By the effect of this heating arrangements, monolithic 12 is attached on the substrate 1.Therefore, adhering film 10 is more prone to be bonded on the substrate 1.Heating arrangements also can not be arranged on mounting table 26 and the crimping stations, and is located on maintaining body 13 or the compression joint mechanism 15.
Below, peel off elimination unit 9 and peel off removal process with Fig. 8 detailed description.
Be provided with stripping film shown in Figure 8 on the unit 9 and remove mechanism 16 peeling off to eliminate.Remove at stripping film and to be provided with the 2nd splicing tape 17 and the pressing mechanism 18 that stripping film is removed usefulness in the mechanism 16.Stripping film is removed mechanism 16 and is had to peel off and eliminate platform 33, winding drum 34, color sensor 35 and check-out console 36.Peel off elimination platform 33 and be set as, relative by substrate 1 with pressing mechanism 18.Winding drum 34 is used to the splicing tape of reeling.Color sensor 35 is used to discern stripping film 11.Check-out console 36 is set as, and is relative with color sensor 35 by the 2nd splicing tape 17.
Be provided with cooling body (not shown) peeling off to eliminate on the platform 33, easily only stripping film 11 is removed from double-deck monolithic 12.This cooling structure cools off the part (monolithic 12 parts on the substrate 1) of generating heat in peeling off removal process.
The material of the fore-end of pressing mechanism 18 is materials with elastic force of fluororesin etc.Adopt this structure, can prevent situation because of undue pressing force damage adhering film 10.In addition, can with roughly uniformly pressure act on the 2nd splicing tape 17.
In addition, remove in the mechanism 16, be provided with and give the 2nd splicing tape splicing tape feed mechanism (not shown) that 17 pulling force maybe loosen this pulling force at stripping film shown in Figure 8.This splicing tape feed mechanism has a pair of spool.A pair of spool comprises: send the spool of sending of the 2nd splicing tape 17 to being attached to monolithic 12 on the substrate 1; The wireline reel that the 2nd splicing tape 17 that is bonded with the stripping film of removing from monolithic 12 11 is reeled.
Eliminate between platform 33 and the wireline reel at film, be provided with color sensor 35.Color sensor 35 is the transducers that can detect color.Therefore,, on the 2nd splicing tape 17, scribble the color different, just can easily detect stripping film 11 with this a kind of color if stripping film 11 scribbles a kind of color in advance.Whether its result can hold stripping film 11 rapidly and remove from the 1st splicing tape 3.Carried out the occasion that detects at 35 pairs of stripping films of color sensor 11, for example, also chip 40 can be attached on the adhering film 10 on the substrate 1 that detected stripping film 11 peeled off.In addition, do not detect the occasion of stripping film 11, can not carry out that chip 40 is attached to adhering film 10 on the substrate 1 yet at color sensor 35
On step, stop this operation, and substrate 1 is not stripped from residual the stripping film 11 that is not detected in ground.In addition, do not detect the occasion of stripping film 11 at color sensor 35, it is not unusual with the operation that suitable state is attached on the substrate 1 to be regarded as taking place adhering film 10, can this be informed the operator unusually by warning devices such as buzzers yet.
Check-out console 36 shown in Figure 8 is to utilize 35 pairs of color sensors to be coated in the member that a kind of color on the stripping film 11 more correctly detects usefulness.Therefore, on the face of the 2nd splicing tape 17 sides of check-out console 36, scribble be coated in stripping film 11 on other different colors of a kind of color.But check-out console 36 is not the structural element of necessity of the present invention.
So, adopt the erecting device 90 of this electronic component, even stripping film 11 and 17 supposition of the 2nd splicing tape are transparent, because whether stripping film 11 and the 2nd splicing tape 17 scribble different color mutually respectively, remove from adhering film 10 so also can utilize color sensor 35 correctly and promptly to detect stripping film 11.
In the present embodiment, the 1st splicing tape 3 is double-deckers, if use the splicing tape of single layer structure, also can not carry out the aforesaid removal process of peeling off, and only carry out interim crimping step and formal crimping step.In addition, the structure of the 1st splicing tape 3 is not limited to double-decker, can be the sandwich construction more than three layers.
In addition, in the present embodiment,, also can chip 40 be installed on the substrate 1 by collision (connection electrode) with the occasion of flip-chip substrate as substrate 1.In addition, at the upper surface of the 1st chip 40, also can have the adhering film of cementability and the 2nd chip is installed on the substrate 1 by other two first type surfaces.
Though describe the present invention in detail, it only is used for illustration, and as limiting, aim of the present invention and scope only do not limit according to claims, just can be expressly understood.
Claims (3)
1. the attaching method of an adhesive tape for die bonding is characterized in that, comprises:
Step with the assigned position (2) on image mechanism (14) the identification substrate (1);
With the step that maintaining body (13) keeps adhering film (10), wherein two first type surfaces of adhering film (10) have cementability; And
According to the recognition result to described assigned position (2) make described maintaining body (13) move, described adhering film (10) being attached to the step on the described assigned position (2),
Described maintaining body (13) and image mechanism (14) can independently mutually move,
Carry out described identification step and described maintenance step simultaneously.
2. the attaching method of an adhesive tape for die bonding is characterized in that, comprises:
Step with the assigned position (2) on image mechanism (14) the identification substrate (1);
With the step that maintaining body (13) keeps adhering film (10), wherein two first type surfaces of adhering film (10) have cementability, and on a first type surface peeling member (11) are installed;
Described maintaining body (13) is moved, be attached to step on the described assigned position (2) according to recognition result with another first type surface with described adhering film (10) to the assigned position (2) on the described substrate (1);
Make described peeling member (11) be bonded in the 2nd splicing tape (17) and go up the step of removing from the described adhering film (10) of the assigned position (2) that is attached at described substrate (1) with described peeling member (11); And
Whether described peeling member (11) is bonded in the step that detects on described the 2nd splicing tape (17),
Described maintaining body (13) and image mechanism (14) can independently mutually move,
Carry out described identification step and described maintenance step simultaneously,
On described peeling member (11), scribble a kind of color, on described the 2nd splicing tape (17), scribble the another kind of color different with described a kind of color, utilize color sensor (35) to detect in described detection step, detect thereby whether described peeling member (11) be bonded on described the 2nd splicing tape (17).
3. the installation method of an electronic component is characterized in that, has:
Adhering film (10) is put the 1st step on the assigned position (2) of substrate (1), and wherein two first type surfaces of adhering film (10) have cementability, and on a first type surface peeling member (11) are installed;
To put at the described adhering film (10) on the described assigned position (2) with pressing mechanism (18) and to be crimped on the 2nd step on the described substrate (1);
Make described peeling member (11) be bonded in the 2nd splicing tape (17) go up, with described peeling member (11) from described adhering film (10) remove, only described adhering film (10) remains in the 3rd step on the described substrate (1); And
By described adhering film (10) electronic component (40) is installed in the 4th step on the described assigned position (2),
Carry out the adhering device (50) of described the 1st～the 3rd step and the die bonding apparatus therefor (60) of described the 4th step of execution and be set as one,
Described the 1st～the 3rd step and described the 4th step are carried out continuously.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004063267A JP4538843B2 (en) | 2004-03-05 | 2004-03-05 | How to apply adhesive tape for die bonding |
| JP063267/2004 | 2004-03-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1842908A CN1842908A (en) | 2006-10-04 |
| CN100466211C true CN100466211C (en) | 2009-03-04 |
Family
ID=34918152
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005800008676A Expired - Fee Related CN100466211C (en) | 2004-03-05 | 2005-02-23 | Method for sticking adhesive tape for die bonding and method for mounting electronic component |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JP4538843B2 (en) |
| KR (1) | KR100728442B1 (en) |
| CN (1) | CN100466211C (en) |
| SG (1) | SG125246A1 (en) |
| TW (1) | TWI264781B (en) |
| WO (1) | WO2005086219A1 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006041315A (en) * | 2004-07-29 | 2006-02-09 | Towa Corp | Die bonder |
| JP4975564B2 (en) * | 2007-08-31 | 2012-07-11 | 日東電工株式会社 | Adhesive sheet for manufacturing semiconductor device, and method for manufacturing semiconductor device using the same |
| JP5435861B2 (en) * | 2007-12-13 | 2014-03-05 | 芝浦メカトロニクス株式会社 | Electronic component mounting apparatus and mounting method |
| JP5234755B2 (en) * | 2008-07-09 | 2013-07-10 | リンテック株式会社 | Sheet sticking device and sticking method |
| JP4462638B1 (en) * | 2009-07-17 | 2010-05-12 | 上野精機株式会社 | Pasting device and classification pasting method |
| JP6045310B2 (en) * | 2012-11-13 | 2016-12-14 | ヤマハファインテック株式会社 | Small piece material pasting device |
| JP6598811B2 (en) * | 2017-03-23 | 2019-10-30 | Ｔｏｗａ株式会社 | Semiconductor package placement apparatus, manufacturing apparatus, semiconductor package placement method, and electronic component manufacturing method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0697215A (en) * | 1992-09-11 | 1994-04-08 | Hitachi Ltd | Small article group attached adhesion sheet and method for picking up small article using thereof |
| JP2001135653A (en) * | 1999-11-02 | 2001-05-18 | Mitsubishi Electric Corp | Die-bonding device and semiconductor device |
| CN1334599A (en) * | 2000-07-21 | 2002-02-06 | Esec贸易公司 | Apparatus for forming conductor connection |
| JP2003243484A (en) * | 2002-02-15 | 2003-08-29 | Matsushita Electric Ind Co Ltd | Electronic part supply device, and electronic part mounting device and method for mounting the electronic part |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0547470Y2 (en) * | 1987-02-24 | 1993-12-14 | ||
| JP3885358B2 (en) * | 1998-04-28 | 2007-02-21 | 住友電気工業株式会社 | Oxide high-temperature superconducting wire and method for producing the same |
| JP4120138B2 (en) * | 2000-07-25 | 2008-07-16 | 三井化学株式会社 | Sealing material for double-glazed glass |
| JP2004269197A (en) * | 2003-03-11 | 2004-09-30 | Lintec Corp | Tape sticking device |
-
2004
- 2004-03-05 JP JP2004063267A patent/JP4538843B2/en not_active Expired - Fee Related
-
2005
- 2005-02-23 CN CNB2005800008676A patent/CN100466211C/en not_active Expired - Fee Related
- 2005-02-23 WO PCT/JP2005/002847 patent/WO2005086219A1/en active Application Filing
- 2005-02-23 SG SG200605373A patent/SG125246A1/en unknown
- 2005-02-23 KR KR1020067003499A patent/KR100728442B1/en not_active IP Right Cessation
- 2005-02-25 TW TW094105797A patent/TWI264781B/en active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0697215A (en) * | 1992-09-11 | 1994-04-08 | Hitachi Ltd | Small article group attached adhesion sheet and method for picking up small article using thereof |
| JP2001135653A (en) * | 1999-11-02 | 2001-05-18 | Mitsubishi Electric Corp | Die-bonding device and semiconductor device |
| CN1334599A (en) * | 2000-07-21 | 2002-02-06 | Esec贸易公司 | Apparatus for forming conductor connection |
| JP2003243484A (en) * | 2002-02-15 | 2003-08-29 | Matsushita Electric Ind Co Ltd | Electronic part supply device, and electronic part mounting device and method for mounting the electronic part |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2005086219A1 (en) | 2005-09-15 |
| CN1842908A (en) | 2006-10-04 |
| TWI264781B (en) | 2006-10-21 |
| KR100728442B1 (en) | 2007-06-13 |
| SG125246A1 (en) | 2006-09-29 |
| JP2005252114A (en) | 2005-09-15 |
| KR20060057616A (en) | 2006-05-26 |
| JP4538843B2 (en) | 2010-09-08 |
| TW200532816A (en) | 2005-10-01 |
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