JP5061324B2 - Wafer protective tape peeling method and apparatus - Google Patents

Description

  The present invention relates to a method and apparatus for peeling a protective tape attached to a semiconductor wafer. More specifically, the present invention relates to a method of thermocompression bonding a peeling tape to a protective tape on the surface of a semiconductor wafer mounted on a dicing frame via a dicing tape. The present invention relates to a protective tape peeling method and apparatus for winding the protective tape integrally with a peeling tape for peeling.

  Conventionally, due to the demand for miniaturization of semiconductor devices, in a semiconductor chip manufacturing process, a protective tape is attached on a circuit pattern forming surface of a semiconductor wafer (hereinafter simply referred to as a wafer) on which a circuit pattern is formed. Thinning is performed by grinding the back surface of the wafer. The thinned wafer is mounted on a dicing frame with a circuit pattern forming surface facing upward, and then the protective tape on the surface is peeled off, and a dicing process is performed to form a chip.

  The above-mentioned protective tape is peeled off by attaching the release tape on the protective tape on the wafer surface and winding the protective tape and the release tape together, or by stripping the strip-like release tape on the protective tape on the semiconductor wafer surface. The protective tape is peeled off by thermocompression bonding and pulling a strip-like peeling tape.

  Since the adhesive tape of the dicing tape exposed between the dicing frame and the wafer outer periphery and the adhesive surface of the peeling tape may come into contact with each other and adhere to the protective tape, The surface is covered with a non-adhesive leaf spring to prevent the adhesive surface of the dicing tape from coming into contact with the release tape (see, for example, FIGS. 1 to 8 in Patent Document 1).

  There is also a method of avoiding adhesion between the peeling tape and the dicing tape by pressing down the position of the dicing frame with respect to the wafer when the peeling tape is stuck on the protective tape on the wafer surface (for example, FIG. 9 to 11).

Also, hold one end of the release tape with a tape chuck, heat-press the release tape to the protective tape with a heater, cut the rear end of the release tape, and pull the end of the release tape with the tape chuck to remove the protective tape. Peeling is performed (for example, refer to Patent Document 2).
Japanese Patent No. 3737118 JP 2000-68293 A

  By the way, when the peeling tape is bonded to a part of the protective tape and wound, or when the strip-shaped peeling tape is thermocompression bonded to the protective tape and pulled, the peeled rear end portion of the peeled protective tape is the dicing tape. The wafer may hang down and adhere to the adhesive surface, and the wafer may be lifted and damaged.

  Also, when the protective tape is peeled off, the width of the peeling tape is narrower than that of the protective tape, so it is easy to apply a squeezing force to the protective tape by being pulled by the peeling tape. As a result, the protective tape that protrudes from the peeling tape There is a case where the wafer is lifted and curled to come into contact with the adhesive surface of the dicing tape and the wafer is lifted and damaged.

  Moreover, in the peeling method of the protective tape of patent document 1, the mechanism which drives a non-adhesive leaf | plate spring to the adhesive surface of a dicing tape is required, and there exists a problem that the cost of an apparatus starts.

  In addition, since the peeling tape is pressed against the protective tape on the wafer by the sticking roller and peeled off while being stuck, a load due to pressing by the sticking roller is applied, and this is the case with a wafer thinned to less than 100 μm recently. May be damaged by excessive load.

  In addition, if the positioning accuracy of the wafer is poor, the leaf spring may come into contact with the wafer when the leaf spring is attached or rotated, and the wafer may be damaged.

  In addition, a leaf spring is used, and when the leaf spring is pressed by the sticking roller, it is restored by an elastic force. There is also the problem of having to exchange.

  Also, if the leaf spring is thicker than the wafer, the peeling roller will run over the step of the leaf spring and the peeling tape cannot be applied to the full peeling start, and the wafer tip may be lifted and damaged during peeling. . In particular, in recent wafers of 100 μm or less, it has become difficult to maintain the balance between the elastic force of the leaf spring and the thickness.

  Further, the configuration in which the dicing frame is pushed down to protrude the wafer portion in Patent Document 1 requires a mechanism for pushing down the dicing frame, which complicates the apparatus and increases costs. Further, when the dicing frame is pushed down, a load is applied to the dicing tape and the dicing tape may be broken.

  In Patent Document 2, the thermocompression heater is linear, and when the outer peripheral edge of the wafer is thermocompression bonded, the portion protruding from the wafer is crimped to the adhesive surface of the dicing tape. There is a problem that the wafer is lifted and damaged.

  Also, if the inner part of the outer peripheral edge that does not protrude from the wafer is pressed in order to prevent the above damage, it will come into contact with the circuit forming surface of the wafer or the peeling tape is not adhered to the outer peripheral edge of the wafer. Sometimes, there is a problem that a load is applied to the wafer tip and the wafer is damaged.

  In addition, there is no mechanism to prevent the tape from loosening when the release tape is pressed down near the adhesive surface of the dicing tape by the tape press in front of the heater and when the release tape piece is gripped by the chuck. There is a problem that the peeling tape contacts and adheres, and the wafer is damaged at the time of peeling.

  Also, instead of winding the release tape, a strip-like release tape is pressure-bonded to cut the rear end of the release tape, and one end of the release tape adhered in a strip shape is pulled to release, so the release tape cutting mechanism In addition, there is a need for a space for discarding the peeled protective tape, which complicates the apparatus and increases the apparatus area.

  In addition, when the conventional peeling table sucks and holds the wafer via the dicing tape, when sucking the entire surface of the table, on the lower surface of the dicing frame, at the stepped portion of the dicing tape outermost part and the dicing frame, A gap between the suction portion and the dicing frame is generated, and an intake air leak for suction occurs in the gap, so that the suction force is weakened and the dicing tape is easily lifted.

  On the other hand, a device that adsorbs a portion having substantially the same diameter as the wafer may not sufficiently hold the dicing tape at the portion outside the wafer, and the dicing tape may be wavy.

  Furthermore, if the suction part is larger than the wafer outer shape and smaller than the inner diameter of the dicing frame, the part that sticks out of the wafer attracts a flexible dicing tape, so it is difficult to increase the degree of vacuum and the overall suction force. There is a problem of weakening.

  When the adsorption force is weakened due to the phenomenon at the time of adsorption on the peeling table as described above, and the dicing tape is lifted or wavy, the peeling tape or the peeled protective tape and the adhesive surface of the dicing tape are easily in contact with each other. This will lead to damage due to the lifting of the wafer. In addition, the wafer is easily lifted due to a decrease in the attractive force.

  Then, the subject of this invention is sticking a peeling tape on the protective tape affixed on the surface side of the wafer mounted in the dicing frame through the dicing tape on the back surface side, and then removing the protective tape integrally with the peeling tape. In the method and apparatus for peeling off the protective tape on the wafer, when the peeling tape is pressure-bonded to the protective tape, the peeling tape does not adhere to the dicing tape, or the peeled protective tape does not adhere to the dicing tape. It is an object of the present invention to provide a peeling method and apparatus capable of preventing the wafer from jumping together with the dicing tape along with winding and capable of peeling the protective tape without damaging the wafer even if the wafer is thinned to 100 μm or less.

In order to solve the problems as described above, the invention of claim 1 is that the back side is attached to the protective tape attached to the front side of the wafer mounted on the dicing frame via the dicing tape. In the method for peeling off the protective tape of the wafer, in which the protective tape is removed together with the peeling tape,
A long and narrow release tape that is narrower than the wafer approaches the outer peripheral edge of the wafer surface,
While holding the release tape located outside the wafer in an inclined state so as to be separated from the dicing tape, the release tape is thermocompression bonded over almost the entire width along the outer peripheral edge of the peeling start end of the protective tape,
After crimping the thermocompression heater, unfasten the thermocompression heater in a state where the release tape located outside the wafer is supported from below and the tension is relaxed,
At least one of the release tape and the wafer is moved horizontally along the length direction of the release tape, and the vicinity of the thermocompression bonding portion of the release tape is folded back to approximately 180 °.
Subsequently, after fixing the supply side and the collection side part of the release tape,
Relatively moving the peeling unit and the wafer along the length direction of the peeling tape to peel off the protective tape from the wafer;
After releasing the fixed state of the peeling tape in the middle of peeling of the protective tape, the reeling tape and the protective tape are wound up and collected,
A configuration is adopted in which the protective tape is separated from the wafer in the vicinity of the peeling end portion of the protective tape.

The invention according to claim 2 is characterized in that a peeling tape is attached to a peeling table for adsorbing and holding a wafer mounted on a dicing frame with a dicing tape on the back surface side, and a protective tape attached to the front surface side of the wafer on the peeling table. In a wafer protective tape peeling apparatus comprising a peeling unit for removing the protective tape and the peeling tape integrally after being attached,
The peeling table and the peeling unit are provided with a relative approach and separation movement relative to the wafer surface and a relative horizontal movement along the length direction of the peeling tape.
The peeling unit is a stripping tape running mechanism that supplies and collects a stripping tape that is long and narrower than the wafer;
When the peeling tape is brought close to the outer peripheral edge of the wafer surface, the peeling tape is held in an inclined state so as to be separated from the dicing tape at a position outside the wafer, and when the peeling of the protective tape is started. A release tape holding mechanism for fixing the supply side and the recovery side of the release tape;
A thermocompression heater for thermocompression bonding over substantially the entire width of the peeling tape along the outer peripheral edge of the peeling start end of the protective tape;
It is configured to be movable back and forth with respect to the peeling tape. At the advanced position, the peeling tape is positioned below the peeling tape located outside the wafer to support the peeling tape from below, and the peeling unit and the peeling table are peeled off. When moving relatively horizontally along the length direction of the tape, the release tape located outside the wafer is pushed back to the upper surface side of the wafer to form a fold of about 180 ° on the release tape. The structure which has a guide pin which retracts toward the width direction outer side of a peeling tape is employ | adopted.

According to a third aspect of the invention, in the invention of the second aspect , air blow is performed from the rear end side of the wafer toward the protective tape during the peeling process, and the protective tape is lifted so as not to contact the dicing tape. A configuration having an air blowing device is employed.

According to a fourth aspect of the invention, in the invention of the second or third aspect , the peeling table employs a configuration in which the wafer mounting portion has an inclined surface and rises from the periphery.

According to a fifth aspect of the present invention, in the invention according to any one of the second to fourth aspects, the suction portion of the peeling table is smaller than the outer diameter of the dicing tape, and the lower surface of the dicing tape pasted to the dicing frame. The structure formed so that it may straddle a part is employ | adopted.

  In the present invention described above, the protective tape is peeled off only by forming a thermocompression bonding portion between the protective tape and the peeling tape by a thermocompression heater, and the subsequent peeling is performed by relative movement of the peeling table and the peeling unit and winding of the peeling tape. It is done by taking power.

  As the release tape in this invention, either adhesive or non-adhesive can be used as long as it can be bonded to the protective tape by thermocompression bonding.

  The thermocompression bonding portion formed by thermocompression bonding is determined by the shape of the thermocompression bonding pressure bonding portion, and is formed over the entire width of the peeling tape in a shape having an R corresponding to the outer peripheral edge of the wafer. In that case, you may make it the whole thermocompression-bonding part or form a thermocompression-bonding part in at least 3 points | pieces of peeling tape both ends and center.

  The thermocompression bonding part is formed over almost the entire width of the release tape, but when the thermocompression heater protrudes from the release tape, the protective tape part is also heated, and if the protective tape does not have heat resistance, it will melt and the wafer will melt. Therefore, it is preferable that the thermocompression-bonding heater is pressure-bonded in a range slightly narrower than the width of the peeling tape.

  At the time of thermocompression bonding, the peeling tape is inclined so as to be separated from the dicing tape outside the wafer so that the peeling tape and the adhesive surface of the dicing tape exposed on the outer peripheral side of the wafer do not contact each other.

  When pulling the peeling tape at the time of peeling, the thermocompression bonding part uses almost the whole width of the peeling tape, and it peels without concentrating the pulling force on one point of the peeling tape by peeling in the direction parallel to the wafer surface. Since it is possible, an excessive force is not applied to the thin wafer. Moreover, smooth peeling can be obtained by starting peeling of the protective tape in order from the outer peripheral edge of the wafer.

  By the relative movement of the peeling table and the peeling unit, the peeling tape is bitten into the wafer side by the guide pins, and the leading edge of the peeling tape is folded back in a substantially 180 ° direction. With the peeling tape folded back in a direction of approximately 180 °, the protective tape is peeled off by the relative movement of the peeling table and the peeling unit. After the peeling start end, the chuck is released and the protective tape is peeled off. The peeling tape and the protective tape are peeled together by winding up.

  In the vicinity of the peeling end of the protective tape, the part of the protective tape that protrudes from the peeling tape comes into contact with the adhesive surface of the dicing tape near the peeling end by further separating the peeling tape on the recovery side from the wafer. To prevent it.

  Also, if tension remains on the peeling tape outside the wafer after thermocompression bonding, an upward force is applied to the thermocompression bonding part with the separation of the thermocompression heater, so the peeling tape may come off or the wafer may jump Since breakage occurs, it is preferable to uncompress the thermocompression heater in a state where the tension of the peeling tape is relaxed.

  In addition, when the protective tape is peeled off, the width of the peeling tape is narrower than that of the protective tape. In order to prevent the occurrence of an accident in which the undulated portion undulates or curls and adheres to the adhesive surface of the dicing tape due to gravity, air blow is performed from the rear edge side of the wafer toward the protective tape, and the protective tape It is preferable to float so as not to contact the dicing tape.

  Note that air blow lowers the heat of the heater during thermocompression bonding, and also interferes with the 180 ° folding work of the peeling tape at the beginning of peeling, so it should be performed after the protective tape peeling process has started. In particular, it is particularly preferable to carry out from the middle to the end of the peeling process in which the portion of the protective tape that has been peeled off protrudes from the peeling tape.

  In addition, air blow is for floating the protective tape, but it is not always necessary to apply it over the entire width of the protective tape, it may be determined appropriately together with the angle and strength of the air blow, and in short, the protective tape peeling process In this case, an air blow that can sufficiently float the protective tape so as not to contact the dicing tape may be used.

  Moreover, if the structure which the wafer mounting part of a peeling table rises from the circumference | surroundings is employ | adopted and a wafer protrudes from a dicing tape surface, the distance of a peeling tape and the adhesion surface of a dicing tape can be earned. In order to prevent the dicing tape from being broken, it is preferable that the wafer mounting portion is a turret-like table and the step portion of the outer peripheral portion of the wafer is inclined downward in a tapered shape.

  In addition, the suction part of the peeling table is smaller than the outer diameter of the dicing tape and is formed so as to straddle part of the lower surface of the dicing frame to which the dicing tape is attached. It is preferable because it can hold the wafer and the wafer firmly, prevents the dicing tape from lifting and wavy, and does not cause a damage accident due to the lifting of the wafer.

  As described above, according to the present invention, a thermocompression bonding portion having a shape along the outer peripheral edge portion is formed at the peeling start end portion of the protective tape affixed on the wafer surface, and the peeling tape outside the wafer from the thermocompression bonding portion. Is held away from the adhesive surface of the dicing tape exposed on the outer peripheral side of the wafer by the tape holding means, so that the peeling tape does not adhere to the adhesive surface of the dicing tape during thermocompression bonding.

  Since the peeling tape and the protective tape are bonded only by thermocompression bonding, without using a leaf spring or sticking roller as in the prior art, the wafer can be peeled off without being subjected to a load caused by pressing with the sticking roller, etc. Even if the wafer is made into a wafer, the wafer will not be damaged and the release tape can be crimped onto the protective tape full of the wafer tip, and the wafer will not be lifted due to insufficient adhesion at the wafer tip during peeling. There is no damage.

  Since a long continuous tape is used as the peeling tape and the peeled protective tape is taken up, there is no need to provide a cutting mechanism for cutting the peeling tape into a strip shape or a protective tape disposal section, and the apparatus can be simplified and miniaturized. .

  Since the width of the thermocompression bonding portion by thermocompression bonding is widened and almost the entire width of the peeling tape is thermocompression bonded, stable crimping can be performed and no peeling mistake occurs. In addition, since the peeling force is received over almost the entire width of the peeling tape, the peeling force is not concentrated at one point, and can be peeled in parallel, and the adhesive tape remains on the wafer.

  After thermocompression bonding of the peeling tape to the protective tape, the guide pin is used to give a peeling trigger in a direction of approximately 180 °, so that the force acting in the direction perpendicular to the wafer surface can be prevented, especially protection from a thin wafer (100 μm or less). The wafer is not damaged when the tape is peeled off.

  In addition, this invention can be similarly applied even when a die bond tape is attached to the back surface of the wafer or when a die bond tape is formed on the dicing tape, and the release tape and the die bond tape are bonded. Can be prevented.

  In addition, after the thermocompression heater is crimped, those that release the thermocompression heater while the tension of the release tape on the outside of the wafer is relaxed will cause the tension of the release tape on the thermocompression bonding part as the thermocompression heater is separated. It is not added, and the peeling tape does not come off and damage due to the jumping of the wafer does not occur.

  Also, in the peeling process of the protective tape adhered to the peeling tape from the wafer, air blow was performed from the rear end side of the wafer toward the protective tape, and the protective tape was lifted so as not to contact the dicing tape. Of the protective tape after peeling, the part that protrudes from the peeling tape is wavy or curled and comes into contact with the adhesive surface of the dicing tape due to gravity. And no damage to the wafer due to adhesion.

  In addition, when the shape of the peeling table is a shape in which the wafer mounting part is raised from the surroundings in advance, a gap is maintained between the adhesive surfaces of the peeling tape and the dicing tape, and the accident of contact between the two is reduced. There is no need for a push-down mechanism, etc., the apparatus can be simplified and the cost can be reduced, and the dicing tape will not be pulled, and the dicing tape will not be broken.

  In addition, the suction part is smaller than the outer diameter of the dicing tape and spans a part of the dicing tape attaching lower surface of the dicing frame, and there is no suction part in the step portion generated in the outer peripheral part of the dicing tape. There is no intake leak in the area.

  In addition, the outermost periphery of the suction part is adsorbing a hard dicing frame, so that the sealing performance of the suction part is enhanced, and the dicing tape between the dicing frame having a strong suction force and the wafer suction part is wavy. The dicing tape does not adhere to the peeling tape or the protective tape, and the holding power of the wafer and the dicing tape is increased, so that the wafer is not lifted and the wafer is not damaged.

  Hereinafter, an embodiment of the present invention will be described with reference to FIGS.

  FIGS. 1 to 3 show a peeling process for peeling off a protective tape 5 attached to an upper surface having a circuit pattern 4 of a wafer 3 attached to a dicing frame 1 to which the present invention is applied via a dicing tape 2 from the wafer 3. An embodiment of the apparatus is shown, and this apparatus will be described as a first embodiment.

  In front of the machine base 6, the wafer 3 to which the protective tape 5 is applied in the previous process is stored in a state mounted on the dicing frame 1 via the dicing tape 2 (hereinafter referred to as a mount wafer 7). A mounting wafer storage unit 8 before protective tape peeling and a mounting wafer storage unit 9 after peeling of the protective tape are provided, and a transfer robot 11 having a suction hand 10 is provided between them.

Alignment unit 12 is composed of a suction table 13 and the alignment sensor 14, in particular although not shown the structure in detail, the suction table 13 is freely rotation and vertical movement by adsorbing mount wafer 7 on the upper surface, the alignment sensor 14 detects the notch or orientation flat of the wafer 3 on the mount wafer 7 that rotates together with the suction table 13 to accurately position the wafer 3.

  At this time, if the wafer 3 is accurately mounted on the dicing frame 1, positioning may be performed using the frame notch 48 of the dicing frame 1, but accurate positioning is performed on the wafer 3. Is preferred.

The rear on the machine base 6 provided horizontal or One two parallel rails 15 and 15, the separation table 17 fixed on the pair of sliders 16 slidably fitted in each of the rails 15 The peeling table 17 can be moved in the left-right direction along the rail 15 by an appropriate driving means (not shown).

  The upper surface of the peeling table 17 is provided with a suction portion 18 made up of a number of suction holes, and the wafer 3 of the mount wafer 7 is placed on the suction portion 18 after being properly positioned by means of suction. The wafer 3 is sucked and fixed from the dicing tape 2 side by the suction action from the suction hole of the portion 18.

  The dicing tape 2 is not attached to the entire outer periphery of the dicing frame 1, and a step corresponding to the thickness of the tape is generated in the middle of the dicing frame 1, so that if there is the suction portion 18 in this portion, the step is reduced. Since suction leakage occurs in the portion, only the wafer 3 portion is sucked.

  A machine frame 19 is erected at the rear end portion of the machine base 6. Although not shown, the machine frame 19 is provided with elevating means such as a rail extending in the vertical direction and a slider or the like that is movably fitted to the machine frame 19. A support frame 20 that can be moved up and down by the elevating means is provided. A cylinder shaft of the elevating cylinder 21 provided in the machine frame 19 is connected to the support frame 20, and the entire support frame 20 is the elevating cylinder. By the action of 21, as shown by an arrow in FIG.

  The machine frame 19 is provided with a peeling tape supply reel 23 that supplies and collects the peeling tape 22, a protective tape winding prevention guide roll 24, and a peeling tape collection reel 25.

  The peeling tape supply reel 23 is rotatable, and the peeling tape 22 is wound around the outer periphery thereof. The peeling tape 22 is supplied by rotating, and the cylinder 26 acts on the peeling tape supply reel 23 by the action of the cylinder 26. A tape fixing chuck 27 that can be moved forward and backward is provided. The tape fixing chuck 27 is pressed from above the peeling tape 22 wound around the peeling tape supply reel 23 to stop its rotation to stop the supply of the peeling tape 22 and supply the peeling tape 22 by retreating. It can be made possible. The tape supply system and the tape fixing chuck are not limited to these configurations, and a mechanism can be used as appropriate.

  The support frame 20 is provided with a peeling unit 28 that faces the peeling table 17. As the constituent members of the peeling unit 28, the tension roller 29, the guide roller 30 group, the thermocompression heater 31, the guide pin 32, the guide roller 33, the guide roller 34, the tape chuck 35, and the guide roller 36 group in the traveling order of the peeling tape 22. Is placed.

  Further, a protective tape rear end detection sensor 38 that detects the presence or absence of the protective tape by light reflected on the reflection plate 37 provided on the support frame 20 on the collection side from the guide roller 36 group is provided on either the support frame 20 or the machine frame 19. Is provided.

  The tension roller 29 is attached to the tip of the action shaft of the cylinder 39 attached to the support frame 20 and is in contact with the release tape 22. The tension of the release tape 22 is adjusted by controlling the expansion and contraction action of the cylinder 39. It is supposed to be. Instead of the tension roller 29, the tension of the peeling tape 22 may be adjusted using a dancer roller or the like.

The thermocompression heater 31 is provided integrally with a rail 41 that is vertically fitted to a guide 40 that extends in the vertical direction on the front side of the support frame 20. The cylinder 42 having the operating shaft side connected to 41 is movable up and down with respect to the support frame 20. In the lowered state, the peeling tape 22 is brought into contact with the protective tape 5 on the wafer 3, and in this state the heater wire so that the Nau rows thermocompression bonding of the release tape 22 to the protection tape 5 in Rukoto be heated through electricity 43.

As shown in FIG. 3, the guide pins 32 are rotatable to a pair of support frames 44 that can be moved forward and backward from the support frames 20 provided on both sides of the release tape 22 to the release tape 22 side. Is provided. The guide pin 32 is configured to hold both sides of the peeling tape 22 from below when the support frame 44 is advanced by the action of the piston 45, and the guide pin 32 does not interfere with the peeling tape 22 due to the contraction of the piston 45. Retreat to the position of the two-dot chain line in the figure. The guide pin 32 may be subjected to a mold release process or the like when the release tape 22 is adhesive.

  The tape chuck 35 is a holding mechanism for the peeling tape 22 and is composed of two members so as to hold the peeling tape 22 by sandwiching the peeling tape 22 from both sides, one of which has a concave portion and runs between the guide rollers 33 and 36. Attached to the working shaft of a cylinder 46 fixed along the tape 22 and the other having a convex part that matches the concave part and fixed to the support frame 20, the cylinder 46 expands and retracts relative to one side. It is supposed to be.

  As a travel mechanism of the release tape 22 supplied from the release tape supply reel 23, the release roller 22 is sequentially wound around a tension roller 29, a guide roller 30 group, a guide roller 33, a guide roller 36, and a protective tape entrainment prevention guide roller 24. The recovery reel 25 is rotated by an appropriate drive means such as a take-up motor (not shown) and recovered to run from the supply side of the release tape 22 to the recovery side. If necessary, the release tape supply reel 23 Is rotated by an appropriate means such as a motor (not shown), or an appropriate drive means (not shown) such as a pinch roller rotating with the peeling tape 22 interposed therebetween.

  Since the protective tape 5 that has been peeled off from the wafer 3 and taken up together with the peeling tape 22 is curled, the portions protruding from both sides of the peeling tape 22 are curled. By keeping a gap in the prevention guide roller 24, the bent side portions of the protective tape 5 passing therethrough are widened so as not to be caught in other portions.

Figure 4 shows a first thermocompression bonding heating another embodiment of the present invention, on the separation table 17, relative to the surface having the circuit pattern 4 of the placed wafer 3, the peeling tape 22 faces The thermocompression bonding portion 47 is formed by the thermocompression heater 31.

  The thermocompression bonding portion 47 in this case is formed along the circular shape of the outer peripheral end portion at the peeling start end portion of the protective tape 5 of the wafer 3 and is formed in a range slightly narrower than the width of the peeling tape 22. . In the figure, reference numeral 48 denotes a notch for positioning the dicing frame.

  FIG. 5 shows a thermocompression-bonding heater according to a second embodiment of the present invention. In this case, the thermocompression-bonding portion 47 is formed at three points on both ends and the center of the peeling tape 22.

  If the thermocompression bonding portion 47 shown in FIGS. 4 and 5 is formed, the force at the time of peeling is applied over almost the entire width of the peeling tape 22, and the wafer 3 can be peeled without excessive force, and the thermocompression bonding portion 47. Is formed along the outer peripheral edge of the wafer, the protective tape 5 can be peeled off from the end of the wafer 3 and smooth peeling can be performed.

  FIG. 6 shows a thermocompression bonding heater according to the third embodiment of the present invention. In this case, the thermocompression bonding portion 47 has the same shape as that of the first embodiment, but is adhesive to the peeling tape 22. The release tape rear end pressing portion 49 was formed by lightly pressing and adhering with a pressing member such as a sponge inside the wafer near both sides of the thermocompression bonding portion 47.

  By forming the peeling tape rear end pressing portion 49, it is possible to reinforce both end portions of the pressure-bonding portion 47 that are easily removed when the peeling tape 22 is peeled off, and to eliminate as much as possible a peeling error due to the pressure-bonding portion 47 being unbonded. be able to.

  Further, since the release tape 22 has adhesiveness, the release tape rear end pressing portion 49 can be formed only by lightly pressing with a member such as a sponge, and an unreasonable burden is not applied to the wafer 3.

  Next, a method of peeling the protective tape 5 on the surface of the wafer 3 will be described with reference to the operation diagrams shown in FIGS. 7 to 11 (a) to (i), taking the first embodiment as an example.

  First, after the mount wafer 7 positioned by the alignment unit 12 is sucked by the suction hand 10 of the transfer robot 11 and transferred onto the peeling table 17, the support frame 20 has two points due to the extending action of the lifting cylinder 21. It descends from the position indicated by the chain line to the lowered position indicated by the solid line (see FIG. 7A).

  At this time, the outer side of the peeling tape 22 from the wafer 3 is held at an inclination, so that it does not hang down and adhere to the adhesive surface of the dicing tape 2.

  Next, the thermocompression heater 31 is moved downward by the extending action of the cylinder 42 and comes into contact with the protective tape 5 near the collection-side end portion of the peeling tape 22 on the upper surface of the wafer 3, and in this state, thermocompression bonding is performed (FIG. 7). (See (b)).

  Next, when the peeling tape take-up reel 25 is rotated to the rewinding side, the peeling tape 22 causes a slack between the portion crimped by the thermocompression heater 31. At this time, even if the release tape 22 is loosened, the lower surface of the release tape 22 is held by the guide pins 32, so that the release tape 22 hangs down between the guide pins 32 and the guide rollers 34, and the dicing is directly underneath. There is no contact with the tape 2 and adhesion. Note that the drawing is exaggerated for easy understanding (see FIG. 8C).

  Next, the peeling tape 22 in a state where the cylinder 46 is stretched and loosened and hung is held by the tape chuck 35 and the loosening state of the peeling tape 22 is held, and then the thermocompression heater 31 is expanded and contracted. (See FIG. 8D).

  The slack state of the release tape 22 is formed in advance because if the tension remains in the release tape 22, the release tape 22 jumps and rises when the thermocompression heater 31 is raised after thermocompression bonding. This is because there is a possibility that the wafer 3 may be damaged due to a jumping force applied to the wafer 3.

  The peeling table 17 is moved to the peeling tape collecting side (right side), and the peeling unit 28 integrated with the support frame 20 is moved relative to the peeling table 17 to the tape supply side (left side). Then, since the peeling tape 22 is bonded to the peeling start end portion of the protective tape 5 of the wafer 3 by thermocompression bonding at the tape collecting side end portion of the wafer 3, the thermocompression bonding portion is spaced from the wafer 3 below the guide pins 32. Then, it is further sandwiched between the guide rollers 34 and folded at the end of the wafer 3 at an angle of about 180 ° (see FIG. 9E).

  Thereafter, the guide pin 32 is retracted, the peeling unit 28 is slightly raised together with the support frame 20 by the expansion / contraction action of the elevating cylinder 21, and the tape fixing chuck 27 is attached to the peeling tape 22 outside the peeling tape supply reel 23 by the extension action of the cylinder 26. And the supply of the peeling tape 22 is stopped (see FIG. 9F).

  Here, the peeling unit 28 is slightly lifted to hold and fix the peeling tape 22 in order to remove the slack generated in the peeling tape 22 and when an adhesive tape that adheres to the peeling tape 22 other than by thermocompression bonding is used. This is to prevent the peeling tape 22 from adhering to the protective tape 5 on the wafer 3.

Furthermore, moving the separation table 17 to release tape recovery side, protection tape 5 on the wafer 3, while stuck are thermally pressure wear folded part of the release tape 22, the angle of approximately 180 ° from the wafer 3 top It is peeled off while being held (see FIG. 10 (g)).

  Since the protective tape 5 is pulled by the thermocompression bonding portion with the peeling tape 22 and peeled off at a peeling angle of about 180 °, a force is applied in a direction parallel to the surface of the wafer 3 and applied perpendicularly to the wafer 3. The force is almost zero, and even an extremely thin wafer 3 is not damaged by chipping or the like due to lifting when the protective tape 5 is peeled off.

When you reach the peeling of the protective tape 5, the peeling unit 28 is raised, thereby releasing the tape chuck 35, to release the tape fixing chuck 27, the peeling tape winding reel 25 by rotating the winding the peeling tape 22 Rukoto Thus, the protective tape 5 is peeled off from the upper surface of the wafer 3 (see FIG. 10H).

  At the final peeling end on the left side of the wafer 3, the above-described peeling unit 28 is in the raised position, so that the protective tape 5 protruding from both end portions of the peeling tape 22 contacts the dicing tape 2 also at the final peeling end. Do not stick.

  When the protective tape 5 is wound around the release tape take-up reel 25 as the release tape 22 is rolled up, the rear end detection sensor 38 of the protective tape observes the transmittance of the light reflected from the reflection plate 37 and returns. If the rear end portion of the protective tape 5 is detected by utilizing the difference in light transmittance between the case where only the peeling tape 22 is used and the state where the protective tape 5 is attached to the peeling tape 22, the tape The supply is stopped (see FIG. 11 (i)).

  In this case, the protective tape 5 is wider than the release tape 22 and the wide portion hangs or curls, but curls by passing through a pair of protective tape entrainment guide rollers 24 provided at a slight interval. After the portion is corrected, it is wound around the peeling tape recovery reel 25.

The mount wafer 7 that has finished the peeling process of the protective tape 5 is sent from the peeling table 17 to the mounted wafer storage section 9 after the protective tape has been peeled off by the transfer robot 11, and then transferred to the dicing apparatus or the like in the next process. After 17 moves to the left side, another mount wafer 7 is handed over with the protective tape 5 attached to the surface, returning to the position of FIG. 7A, and performing the next peeling operation.

  The operation of the peeling device of the first embodiment has been described above as an example, but the operation is the same even if the thermocompression heater 47 is of the second and third embodiments.

  12 and 13 show a fourth embodiment of a wafer protective tape peeling apparatus to which the present invention is applied. The same parts as those of the first embodiment shown in FIGS. The code | symbol is attached | subjected.

  The transfer robot 11 having the mount wafer storage unit 8 before peeling off the protective tape, the mounted wafer storage unit 9 after peeling off the protective tape, and the suction hand 10 on the machine base 6 shown in FIG. 1 according to the previous first embodiment. The alignment unit 12 including the suction table 13 and the alignment sensor 14 and the like are similarly arranged in the fourth embodiment.

  In FIG. 12, a machine base 6, rails 15 and 15, a slider 16, a peeling table 17 having a suction portion 18, a machine frame 19, a support frame 20, an elevating cylinder 21, a peeling tape 22, a peeling tape supply reel 23, and a protective tape involved. Prevention guide roll 24, peeling tape collection reel 25, tape fixing chuck 27 that moves forward and backward by cylinder 26, peeling unit 28, reflecting plate 37, protective tape rear end detection sensor 38, and tension roller 29 provided on the peeling unit 28 The functions of the guide roller 30 group, thermocompression heater 31, guide pin 32, guide roller 33, guide roller 34, tape chuck 35, and guide roller 36 group are the same as those in the first embodiment. Omitted.

  In the fourth embodiment, as an air blowing device, a peeling tape is provided in the horizontal direction on the upper end portion of a support frame 60 having an L-shaped cross section which is provided on the peeling rear end side of the peeling table 17 and moves integrally with the peeling table 17. A long air pipe 61 provided in a direction orthogonal to the peeling traveling direction 22 is fixed so as to be slightly away from the peeling table 17 and slightly above the upper surface of the peeling table 17.

  This air pipe 61 is in a hollow state and is provided over substantially the same length as one side of the peeling rear end side of the peeling table 17 as shown in FIG. 13, and has a plurality of holes at equal intervals toward the peeling table 17 side. 62 is provided over at least the entire width of the wafer 3 placed on the peeling table 17.

  The air pipe 61 is supplied with air into a hollow interior by appropriate means (not shown), and the supplied air is ejected from the hole 62 to the upper surface side of the peeling table 17 as an air blow.

  The angles of the holes 62 with respect to the air pipe 61 are, for example, about 45 ° in the obliquely upward direction of all the holes 62 toward the peeling table 17 side, but are not limited to this. In the process, it is only necessary to enable air blow so that the protective tape 5 is lifted and does not contact the dicing tape 2.

  Further, the shape of the hole 62 is not limited to the round hole as shown in the drawing as long as the above-described object can be achieved, and can be appropriately changed such as a hole having another shape or a slit shape.

  The thermocompression heater 31 in the fourth embodiment is not limited to the shape shown in FIG. 13 as in the first embodiment, and the second heater shown in FIGS. 5 and 6 is used. A thermocompression heater 31 that performs heat welding in the shape of the embodiment and the third embodiment can be used.

  Next, a method for removing the protective tape 5 on the surface of the wafer 3 using the apparatus of the fourth embodiment will be described with reference to the operation diagrams shown in FIGS. 14 to 18 (a) to (j). The description of the portions having the same operation as the operation diagrams in the first embodiment of FIGS. 7 to 11 will be simplified.

  First, with respect to the wafer 3 mounted on the dicing frame 1 mounted on the peeling table 17, the support frame 20 is lowered from the position indicated by the two-dot chain line to the lowered position indicated by the solid line by the extending action of the elevating cylinder 21. Subsequently, the thermocompression heater 31 is moved downward by the extending action of the cylinder 42 and comes into contact with the protective tape 5 near the collection side end of the peeling tape 22 on the upper surface of the wafer 3, Thermocompression bonding is performed (see FIG. 14B).

  Next, the release tape take-up reel 25 is rotated to the rewind side to cause the release tape 22 to be slack (see FIG. 15C). In this state, the release tape 22 is chucked and held by the tape chuck 35. After that, the thermocompression heater 31 is pulled up by the expansion and contraction action of the cylinder 42 to prevent the wafer 3 from being damaged due to jumping up by the residual tension of the peeling tape 22 (see FIG. 15D).

  Next, the peeling unit 17 is moved relatively to the tape supply side by moving the peeling table 17 to the peeling tape collecting side (right side), and the thermocompression bonding portion of the peeling tape 22 with the protective tape 5 is located below the guide pin 32. The wafer 3 is drawn into the gap with the wafer 3 on the side, and is further sandwiched between the guide rollers 34 to be folded back at an angle of about 180 ° at the end of the wafer 3 (see FIG. 16E). The guide pin 32 is retracted, and the peeling unit 28 is slightly raised together with the support frame 20 by the expansion and contraction action of the elevating cylinder 21, and the tape fixing chuck 27 is attached to the peeling tape 22 outside the peeling tape supply reel 23 by the extension action of the cylinder 26. The supply of the peeling tape 22 is stopped by press contact (see FIG. 16F).

Furthermore, moving the separation table 17 to release tape recovery side, protection tape 5 on the wafer 3, while stuck are thermally pressure wear folded part of the release tape 22, the angle of approximately 180 ° from the wafer 3 top It is peeled off while being held (see FIG. 17 (g)).

  When the peeling of the protective tape 5 proceeds, the peeling unit 28 is raised, the tape chuck 35 is released, the tape fixing chuck 27 is released, the peeling tape take-up reel 25 is rotated, and the peeling tape 22 is wound up. Then, the protective tape 5 is peeled off from the upper surface of the wafer 3.

  Furthermore, the fact that the peeling point of the protective tape 5 has reached the middle of the wafer reaches the center of the wafer, for example, from a position signal from a pulse motor that moves the peeling table 17 and position information of the peeling table 17 using various sensors. Judgment is made, and at this time, the air pipe 61 performs an air blow indicated by an arrow (see FIG. 17H).

  The rear end of the protective tape 5 is still bonded to the wafer 3 in the middle of the peeling, but by blowing air from the middle of the peeling, the protective tape 5 that has fallen off due to being peeled off from the wafer 3 and curled or the like is floated by air blow, Bonding to the dicing tape 2 can be prevented.

  At the final stage of peeling, air blow from the air pipe 61 continues at the final peeling end on the left side of the wafer 3, so that the rear end portion of the protective tape 5 completely peeled off from the wafer 3 is lifted and is applied to the dicing tape 2. It does not stick in contact (see FIG. 18 (i)).

  When the protective tape 5 is wound around the release tape take-up reel 25 as the release tape 22 is wound up, the protective tape rear end detection sensor 38 detects the rear end of the protective tape 5 and stops the tape supply and air blow. (See FIG. 18 (j)) Thereafter, the mounting wafer 7 with the protective tape peeled off is sent to the mounting wafer housing 9 with the protective tape peeled off, and another mounting wafer 7 is delivered with the protective tape 5 attached to the surface. Then, returning to the position of FIG. 14A, the next peeling operation is performed.

  FIG. 19 is a fifth embodiment showing another example of the structure of the suction part in the peeling table 17, and the suction part 50 is raised in a turret shape on the mounting surface of the wafer 3. In the suction portion 50 of this embodiment, the mounting portion of the mount wafer 7 on which the wafer 3 is placed is flat, but the outer peripheral portion is inclined. In addition, although it is more preferable to make it taper like this figure, you may provide only a level | step difference.

  If the suction part has such a shape, the mounting position of the dicing tape 2 is lowered and the distance from the peeling tape 22 is reduced without giving a burden to the wafer 3 or providing a complicated moving mechanism. Thus, accidents due to contact between the peeling tape and the dicing tape can be further prevented. In addition, although the thing of illustration is exaggerated so that an understanding may be easy, about 1-2 mm is preferable as a height difference of a level | step difference.

  FIG. 20 is a sixth embodiment that adopts another example of the structure of the suction portion in the peeling table 17. The suction portion 63 has a range smaller than the outer diameter of the dicing tape 2 and a dicing frame. 1 dicing tape 2 is formed so as to straddle part of the lower surface.

  In this embodiment, since the adsorbing portion 63 is smaller than the outer diameter of the dicing tape 2, the gap between the peeling table 17 and the dicing frame 6 generated outside the step generated at the outermost peripheral portion of the dicing tape 2. There is no suction part 63 in the part, and intake leak does not occur in this step part.

  Further, the adsorbing portion 63 is formed so as to straddle a part of the lower surface of the dicing frame 1 where the dicing tape 2 is applied, and can adsorb the dicing frame 1 having hardness and the dicing tape 2 located on the lower surface of the wafer 3. As a result, the sealing performance of the suction portion 63 is enhanced, and the suction force of the suction portion 63 as a whole is increased, and the dicing tape 2 between the dicing frame 1 and the wafer 3 is closely attached to the suction portion 63 and is lifted. Further, since the wafer 3 and the dicing tape 2 are held more strongly, the peeling tape 22 and the protective tape 5 do not adhere to the dicing tape 2 even if adhesion occurs. There will be no damage caused by lifting.

  FIG. 21 shows a tape holding chuck 51 for stopping the rotation of the peeling tape collecting reel 25 in place of the tape chuck 35 shown in FIGS. 7 to 11 and FIGS. In the seventh embodiment, a roller 52 is provided, and the same reference numerals are given to portions that are the same as those in the embodiment shown in FIGS.

  In this embodiment, the release tape 22 is fixedly held by the tape fixing chuck 51 coming into contact with the release tape collection reel 25 by the extending action of the cylinder 53, and the release tape 22 is loosened during thermocompression bonding. Is obtained by adjusting the tension of the peeling tape 22 by moving the tension roller 52 by the stretching or contracting action of the cylinder 54 and rotating the peeling tape collecting reel 25 forward and backward as necessary.

  The embodiments of the present invention are as described above. However, the present invention can be implemented by combining the embodiments to the extent possible, and is not limited to the embodiments described above. The present invention can be implemented with appropriate modifications within the scope of the object of the invention.

  For example, in the above-described embodiment, the separation table 17 and the separation unit 28 are moved up and down only in the direction perpendicular to the wafer surface, but the separation table 17 and the separation unit 28 are relatively moved. The separation table 17 may be moved up and down, or only the separation table 17 side or both the separation table 17 and the separation unit 28 may be moved up and down.

  The protective tape 5 is peeled off by moving the peeling table 17 holding the wafer 3 and the like in the horizontal direction. However, if the peeling table 17 and the peeling unit 28 move relative to each other. The protective tape 5 can be peeled off by moving only the peeling unit 28 side or both the peeling table 17 and the peeling unit 28 horizontally.

  Further, a tape fixing chuck 27 is provided for fixing the peeling tape supply reel 23, and a tape fixing chuck 51 is provided for the peeling tape collecting reel 25. However, the present invention is not limited to this. A mechanism or a torque motor may be provided.

The top view showing 1st Embodiment of the peeling apparatus to which this invention apparatus is applied. The II-II direction arrow directional cross-sectional view of FIG. The principal part enlarged plan view of 1st Embodiment. The top view which shows the thermocompression-bonding heater part of 1st Embodiment. The top view which shows the thermocompression bonding heater part of 2nd Embodiment. The top view which shows the thermocompression-bonding heater part of 3rd Embodiment. (A) and (b) are operation | movement diagrams of the protective tape peeling method of 1st Embodiment. (C) (d) is an operation | movement figure of the protective tape peeling method of 1st Embodiment. (E) and (f) are operation | movement diagrams of the protective tape peeling method of 1st Embodiment. (G) (h) is an operation | movement figure of the protective tape peeling method of 1st Embodiment. (I) Operation | movement figure of the masking tape peeling method of 1st Embodiment. The front view which shows 4th Embodiment of this invention apparatus. The principal part enlarged plan view of 4th Embodiment. (A) and (b) are operation | movement diagrams of the protective tape peeling method of 4th Embodiment. (C) (d) is an operation | movement figure of the protective tape peeling method of 4th Embodiment. (E) and (f) are operation | movement diagrams of the protective tape peeling method of 4th Embodiment. (G) (h) is an operation | movement figure of the protective tape peeling method of 4th Embodiment. (I) and (j) are operation | movement diagrams of the protective tape peeling method of 4th Embodiment. The front view which shows the peeling table of 5th Embodiment. The front view which shows the peeling table of 6th Embodiment. The front view which shows the tape holding mechanism of 7th Embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Dicing frame 2 Dicing tape 3 Wafer 4 Circuit pattern 5 Protective tape 6 Machine base 7 Mount wafer 8 Mount wafer storage part 9 before protective tape peeling Protection tape peeling mounted wafer storage part 10 Suction hand 11 Transport robot 12 Alignment part 13 Suction table 14 Alignment Sensor 15 Rail 16 Slider 17 Peeling Table 18 Suction Unit 19 Machine Frame 20 Support Frame 21 Lifting Cylinder 22 Peeling Tape 23 Peeling Tape Supplying Reel 24 Protective Tape Entrainment Prevention Guide Roller 25 Peeling Tape Recovery Reel 26 Cylinder 27 Tape Fixing Chuck 28 Peeling Unit 29 Tension roller 30 Guide roller 31 Thermocompression heater 32 Guide pin 33 Guide roller 34 Guide roller 35 Tape chuck 36 Guide roller 37 Reflecting plate 38 Rear end detection sensor 39 Cylinder 40 Guide 41 Rail 42 Cylinder 43 Heater wire 44 Support frame 45 Cylinder 46 Cylinder 47 Thermocompression bonding part 48 Frame cutout part 49 Release tape rear end pressing part 50 Adsorption part 51 Tape fixing chuck 52 Tension roller 53 Cylinder 54 Cylinder 60 Support frame 61 Air pipe 62 Hole 63 Adsorption part

Claims (5)

A method for peeling off a protective tape on a wafer, wherein a peeling tape is attached to a protective tape attached to the front side of a wafer whose back side is mounted on a dicing frame via a dicing tape, and then the protective tape is removed together with the peeling tape. In
A long and narrow release tape that is narrower than the wafer approaches the outer peripheral edge of the wafer surface,
While holding the release tape located outside the wafer in an inclined state so as to be separated from the dicing tape, the release tape is thermocompression bonded over almost the entire width along the outer peripheral edge of the peeling start end of the protective tape,
After crimping the thermocompression heater, unfasten the thermocompression heater in a state where the release tape located outside the wafer is supported from below and the tension is relaxed,
At least one of the release tape and the wafer is moved horizontally along the length direction of the release tape, and the vicinity of the thermocompression bonding portion of the release tape is folded back to approximately 180 °.
Subsequently, after fixing the supply side and the collection side part of the release tape,
Relatively moving the peeling unit and the wafer along the length direction of the peeling tape to peel off the protective tape from the wafer;
After releasing the fixed state of the peeling tape in the middle of peeling of the protective tape, the reeling tape and the protective tape are wound up and collected,
A method for peeling off a protective tape from a wafer, wherein the protective tape is separated from the wafer in the vicinity of a peeling termination portion of the protective tape. A peeling table for adsorbing and holding a wafer mounted on a dicing frame with a dicing tape on the back side, and a protective tape attached to the front surface of the wafer on the peeling table, and then the protective tape In the wafer protective tape peeling device comprising a peeling unit that removes the peeling tape and the wafer,
The peeling table and the peeling unit are provided with a relative approach and separation movement relative to the wafer surface and a relative horizontal movement along the length direction of the peeling tape.
The peeling unit is a stripping tape running mechanism that supplies and collects a stripping tape that is long and narrower than the wafer;
When the peeling tape is brought close to the outer peripheral edge of the wafer surface, the peeling tape is held in an inclined state so as to be separated from the dicing tape at a position outside the wafer, and when the peeling of the protective tape is started. A release tape holding mechanism for fixing the supply side and the recovery side of the release tape;
A thermocompression heater for thermocompression bonding over substantially the entire width of the peeling tape along the outer peripheral edge of the peeling start end of the protective tape;
It is configured to be movable back and forth with respect to the peeling tape. At the advanced position, the peeling tape is positioned below the peeling tape located outside the wafer to support the peeling tape from below, and the peeling unit and the peeling table are peeled off. When moving relatively horizontally along the length direction of the tape, the release tape located outside the wafer is pushed back to the upper surface side of the wafer to form a fold of about 180 ° on the release tape. A peeling device for a protective tape on a wafer, comprising a guide pin that moves away toward the outside in the width direction of the peeling tape. 3. The wafer according to claim 2 , further comprising an air blowing device that blows air from a rear end side of the wafer toward a protective tape in a peeling process and floats the protective tape so as not to contact the dicing tape. Protective tape peeling device. Separation table, the release device of the protective tape of the wafer according to claim 2 or 3 wafer mounting portion is characterized in that it raised above ambient. Adsorption portion of the separation table is smaller than the outer diameter of the dicing tape, and, one of the claims 2 to 4, characterized in that it is formed so as to straddle a part of the dicing tape attaching the lower surface of the dicing frame 1 The apparatus for peeling off a protective tape for a wafer according to the item.

Images