JP4097679B2 - Coverlay film laminating device - Google Patents

Description

  The present invention relates to a cover lay film laminating apparatus for laminating a cover lay film to a base film for forming a flexible substrate.

  Generally, in the process of forming a flexible substrate, a polyimide resin having a thermosetting adhesive layer on a pattern forming surface of a base film made of a polyimide resin, a PET resin, a polyester resin or the like on which a conductive pattern such as a copper foil is formed. It is known that there is a step of bonding a coverlay film made of PET resin or the like.

  Conventionally, this kind of coverlay film laminating operation is performed after a base film and a coverlay film are manually inserted and positioned with respect to a large number of positioning pins standing on a work table.

  By the way, the cover lay film usually has a large number of holes corresponding to the conductor pattern of the base film. Therefore, in order to perform the bonding operation of the cover lay film, a release film or a release paper (hereinafter referred to as this film) In the specification, it is called “release film”.) When the film is peeled off, the coverlay film loses its elasticity and is very difficult to handle.

  For this reason, productivity in the bonding operation | work of such a coverlay film is very low, and it was desired to automate the bonding operation using a coverlay film bonding apparatus.

  FIG. 10 is a view for explaining a conventional coverlay film laminating apparatus. As shown in FIG. 10, a conventional cover lay film laminating apparatus 800 includes a base film feeding roll 801A, a cover lay film feeding roll 802A, release film feeding rolls 803A and 804A, two pairs of rolls 805, 805, 807, 807, a laminated film winding roll 801B, release film winding rolls 803B and 804B, and heating presses 806 and 806 are provided (see, for example, Patent Document 1).

  In the conventional cover lay film laminating apparatus 800, the base film W11 fed out from the base film feed roll 801A and the cover lay film W12 fed out from the cover lay film feed roll 802A are integrally overlapped and further separated. In a state of being sandwiched between release films W13 and W14 fed out from the mold film feeding rolls 803A and 804A, the laminated films W15 and 806 are integrally bonded together to form a laminated film W15. It is wound up.

  Therefore, according to the conventional cover lay film laminating apparatus 800, the laminating operation between the base film W11 and the cover lay film W12 can be automated. As a result, the laminating between the base film W11 and the cover lay film W12 is possible. Productivity in the alignment work can be increased.

JP-A-2-226793 (FIG. 1)

  However, in the above-described cover lay film laminating apparatus 800, the base film W11 and the cover lay film W12 are bonded together in a state in which long films are superposed together. For this reason, since the alignment errors in the longitudinal direction of the base film accumulate as the films are fed out, it is difficult to ensure the alignment accuracy in the longitudinal direction of the base film. In addition, since the alignment error in the short direction of the base film occurs due to the meandering phenomenon generated by feeding out these films, it is not easy to ensure the alignment accuracy of the base film in the short direction. For this reason, it is not easy to increase the bonding position accuracy of the coverlay film with respect to the base film, and as a result, there is a problem that it is not easy to increase the quality of the flexible substrate.

  Therefore, the present invention has been made to solve such problems, and it is easy to increase the bonding position accuracy of the coverlay film with respect to the base film, and as a result, to improve the quality of the flexible substrate. An object of the present invention is to provide a coverlay film laminating apparatus that is easy to handle.

(1) The coverlay film laminating device of the present invention includes a base film supply device for intermittently feeding a roll-shaped base film into a sheet shape, and a sheet-like base film fed by the base film supply device Temporarily crimping a strip-shaped coverlay film against the base film and forming a sheet-like laminated film in which the coverlay film is temporarily crimped on the base film, and a sheet formed by the temporary crimping apparatus A coverlay film laminating device comprising a laminated film collecting device for winding up the laminated film into a roll shape, wherein the temporary crimping device is a region for temporarily crimping the coverlay film to the base film (hereinafter referred to as “ And a position where the coverlay film is supplied toward the temporary crimping region (hereinafter referred to as “temporary crimping region”) A provisional crimping table capable of supplying a coverlay film along a coverlay film supply path that connects to the base film and adjusting the position and orientation of the coverlay film relative to the base film. It is characterized by that.

For this reason, according to the cover lay film laminating device of the present invention, since the strip-shaped cover lay film is temporarily press-bonded to the sheet-like base film fed out intermittently, the long base Even when a film is used, the alignment error in the longitudinal direction of the base film does not accumulate, and the alignment accuracy in the longitudinal direction of the base film does not decrease.
Moreover, according to the cover lay film laminating apparatus of the present invention, the cover lay film is supplied to the temporary press bonding region by the temporary press bonding table capable of adjusting the position and orientation of the cover lay film with respect to the base film. It becomes easy to increase the bonding position accuracy of the coverlay film with respect to the base film. As a result, it is easy to improve the quality of the flexible substrate, and the object of the present invention is achieved.

In order to bond the coverlay film to the base film, at least the coverlay film supplying step for supplying the coverlay film to the bonding area on the base film supply path, and the coverlay film being bonded to the base film. The bonding process is required, but when the coverlay film is completely bonded to the base film in one step, this bonding process becomes extremely long, improving overall productivity. Difficult to do.
For this reason, in the cover lay film laminating apparatus of the present invention, instead of completely laminating the cover lay film to the base film to form a laminated film, the cover lay film is temporarily bonded to the base film. A laminated film is to be formed. As a result, the above-described bonding step is greatly shortened to improve productivity as a whole. In this case, in order to completely bond the cover lay film to the base film, a dedicated main pressure bonding apparatus (for example, a vacuum press) for pressure bonding (main pressure bonding) the laminated film on which the cover lay film is temporarily pressure bonded. May be prepared separately, and the coverlay film may be completely bonded to the base film using this main pressure bonding apparatus.

  Here, the “strip shape” in this specification does not necessarily mean only a long and narrow shape when viewed from a plane, but means a substantially rectangular shape including a square shape.

(2) In the coverlay film laminating apparatus according to (1), the coverlay film supply path is orthogonal to a base film supply path that connects the base film supply apparatus and the laminated film collection apparatus. It is preferable.

  By comprising in this way, the area of the part which a cover-lay film supply path cross | intersects a base film supply path can be made small, As a result, the length of a base film supply path can be shortened and an apparatus can be made compact. .

(3) In the coverlay film laminating apparatus described in (1) above, a roll-shaped base film is used as the base film, but the present invention is not limited to this. Even when a strip-shaped base film is used as the base film, the same effect as that of the coverlay film laminating apparatus described in (1) above is obtained.

  That is, the cover lay film laminating device of the present invention includes a base film supply device for supplying a strip-shaped base film toward the temporary press-bonding region, and a strip-shaped base film supplied by the base film supply device. On the other hand, a temporary cover crimping device for temporarily bonding a strip-shaped coverlay film to form a strip-shaped laminated film, and a laminated film collecting for collecting the strip-shaped laminated film formed by this temporary crimping device A cover lay film laminating apparatus comprising the apparatus, wherein the temporary pressure bonding apparatus is capable of supplying a cover lay film along a cover lay film supply path connecting a temporary pressure bonding region and a cover lay film supply position, and And having a temporary crimping table that can adjust the position and orientation of the coverlay film relative to the base film And features.

For this reason, according to the cover lay film laminating device of the present invention, since the strip-shaped base film is used, there is no possibility that the alignment error in the longitudinal direction of the base film accumulates. The alignment accuracy in the long direction is not lowered.
Further, according to the cover lay film laminating apparatus of the present invention, the cover lay film has the position and orientation of the cover lay film with respect to the base film as in the case of the cover lay film laminating apparatus described in (1) above. Since it is supplied to the temporary press-bonding region by an adjustable temporary press-bonding table, it becomes easy to increase the bonding position accuracy of the coverlay film with respect to the base film. As a result, it is easy to improve the quality of the flexible substrate, and the object of the present invention is achieved.

(4) In the coverlay film laminating device according to any one of (1) to (3), the temporary press-bonding table is movable in two horizontal directions orthogonal to each other and in a horizontal plane. It is preferable to be able to rotate in the circumferential direction about the virtual point.

  By comprising in this way, since it becomes possible to arrange | position a cover-lay film with respect to a base film with a sufficient position (and attitude | position) precision, it can raise the bonding position accuracy of the cover-lay film with respect to a base film. It becomes easy.

  In this case, it is preferable to select a direction along the base film supply path and a direction along the coverlay film supply path as the two horizontal directions orthogonal to each other. Moreover, it is preferable to select the center point in the surface where the coverlay film of a temporary crimping | compression-bonding table is mounted as a virtual point in a horizontal surface.

(5) In the cover lay film laminating device described in (4) above, the provisional crimping table is provided with at least two imaging holes that are spaced apart from each other. It is preferable that an image sensor is provided corresponding to the above.

  By comprising in this way, the position and attitude | position of a cover-lay film with respect to a base film can be accurately measured now with at least two image sensors. For this reason, it becomes possible to arrange | position a cover-lay film with respect to a base film with a sufficient position (and attitude | position) precision, and it becomes easy to make the bonding position precision of the cover-lay film with respect to a base film high.

  In this case, it is preferable that at least two imaging holes are disposed at both ends of the temporary press bonding table.

(6) In the coverlay film laminating device according to any one of (1) to (5), the temporary pressure bonding table may perform a temporary pressure bonding operation by moving upward in the temporary pressure bonding region. preferable.

  By configuring in this way, the coverlay film moves relative to the base film while the coverlay film is positioned with high accuracy in position (and posture), and the temporary crimping table moves upward as it is. Temporary pressure bonding can be performed while maintaining a state in which the position (and posture) is accurately arranged. For this reason, it becomes easy to raise the bonding position accuracy of the coverlay film with respect to the base film.

(7) In the coverlay film laminating device according to (6), the temporary crimping device receives the temporary crimping table when the temporary crimping table performs a temporary crimping operation in the temporary crimping region. It is preferable to further have.

  By comprising in this way, the whole cover-lay film can be temporarily crimped | bonded with a uniform force with respect to a base film.

(8) In the cover lay film laminating device described in (7) above, it is preferable that the buffer mechanism is provided with a large number of base film adsorption holes for adsorbing the base film.

  By comprising in this way, a base film can be made to adsorb | suck to many base film adsorption | suction holes, and a base film can be fixed in a temporary crimping | compression-bonding area | region.

(9) In the coverlay film laminating device according to (8), the temporary pressure bonding device may further include a pressing mechanism that presses the base film against the buffer mechanism before the temporary pressure bonding operation is performed. preferable.

With this configuration, the pressing mechanism presses the base film against the buffer mechanism, so that the base film can be more reliably adsorbed to the numerous base film adsorption holes.
Further, since the pressing operation by the pressing mechanism is performed before the temporary pressing operation is performed, the pressing operation can be smoothly performed without being disturbed by the temporary pressing operation by the temporary pressing table. Before the temporary crimping operation is performed, the temporary crimping table for which the temporary crimping operation has been completed is moved from the temporary crimping area to the coverlay film supply position, and a new coverlay film is placed and returned to the temporary crimping area. This is the time until the product comes in. Since this time is used to perform the pressing operation by the pressing mechanism, it is not necessary to spend a special time to perform the pressing operation, thus reducing the overall productivity. I will not let you.

In this case, when the temporary pressure bonding table moves from the temporary pressure bonding area toward the coverlay film supply position, the pressing mechanism moves from outside the temporary pressure bonding area into the temporary pressure bonding area, and the pressing mechanism moves to the temporary pressure bonding area. It is preferable that the temporary pressure bonding table is configured to move from the coverlay film supply position toward the temporary pressure bonding area when moved from the pressure bonding area to the outside of the temporary pressure bonding area.
Thereby, both the operation | movement of the temporary crimping operation by a temporary crimping table and the pressing operation by a pressing mechanism can be performed smoothly.

(10) In the cover lay film laminating device according to any one of (1) to (9), it is preferable that the temporary pressure bonding table has a heater for heating the cover lay film.

  With this configuration, the temperature of the cover lay film can be increased in advance in the process of supplying the cover lay film to the base film prior to the temporary pressure bonding. The temporary pressure bonding of the film can be performed smoothly in a shorter time.

(11) In the cover lay film laminating device according to any one of (1) to (10), a cover lay film feeding device for feeding the roll-shaped cover lay film into a sheet shape intermittently; A coverlay film cutting device for cutting a sheet-like coverlay film fed by the coverlay film feeding device to form a strip-shaped coverlay film, and a strip shape formed by the coverlay film cutting device It is preferable to further include a cover lay film cutting / mounting device having a cover lay film mounting device for mounting the cover lay film on the temporary compression bonding table.

  By comprising in this way, it becomes possible to form a strip-shaped cover-lay film from a roll-shaped cover-lay film, and to supply the strip-shaped cover-lay film to a temporary press-bonding table. Ray film can be used. For this reason, productivity as a whole can be further increased.

(12) In the cover lay film laminating device according to (11), the cover lay film cutting device includes a cutting blade mold having a cutting blade for cutting a sheet-like cover lay film into a strip shape, and The cover lay film cutting / mounting device has a receiving die for receiving the press cutting blade die, and the coverlay film cutting / mounting device feeds the blade receiving sheet for receiving the press cutting blade between the press cutting blade die and the receiving die. It is preferable to further include a receiving sheet feeding device and a blade receiving sheet winding device for winding the blade receiving sheet.

  By configuring in this way, when the sheet-like cover lay film is cut into a strip shape, the blade receiving sheet fed by the blade receiving sheet feeding device can always receive the push blade, so the cover lay film Can be cut well. Further, it is possible to prevent the cutting edge of the press cutting blade from being damaged.

(13) In the cover lay film laminating device according to any one of (1) to (12) above, a large number of cover lay films adsorbed to adsorb the strip-shaped cover lay film on the temporary crimping table. It is preferable that a hole is provided.

  By comprising in this way, the coverlay film supplied in the coverlay film supply position can be smoothly conveyed to a temporary crimping | compression-bonding area | region by a temporary crimping | compression-bonding table.

(14) In the cover lay film laminating device described in (13) above, the cover lay film cutting / mounting device is a release film in a cover lay film adsorbed in the numerous cover lay film suction holes. It further has a release film gripping device for gripping the end portion, and the release film gripping device grips the end portion of the release film, and then from the cover lay film supply position toward the temporary press-bonding region. It is preferable that the release film is peeled from the cover lay film by moving the temporary pressure bonding table.

By comprising in this way, since a release film can be peeled from a coverlay film during the process of conveying a coverlay film to a temporary crimping | compression-bonding area | region, a release film is purposely peeled from a coverlay film. Therefore, it is not necessary to provide a special process for this. For this reason, the bonding operation | work of the coverlay film with respect to a base film can be shortened.
Further, since the coverlay film can be handled with the release film attached until the coverlay film is placed on the temporary pressure bonding table, the handling becomes extremely easy.

(15) In the cover lay film laminating device described in (14) above, the cover lay film cutting / mounting device partially separates the release film from the cover lay film prior to cutting the cover lay film. It is preferable to further have a release film peeling blade for peeling off partially to form a partially peeled portion.

  By comprising in this way, since the partial peeling part comes to be previously formed by the release film peeling blade, the release film holding | grip apparatus of a coverlay film mounted in the temporary crimping | compression-bonding table is a release film. The end portion can be easily gripped.

(16) In the cover lay film laminating device according to (15), the cover lay film placing device conveys the cover lay film cut by the cover lay film cutting device to the temporary pressure bonding table. The suction pad has a portion from the time when the coverlay film is placed on the temporary pressure bonding table until the end of the release film is gripped by the release film gripping device. It is preferable to adsorb the peeling portion.

  By configuring in this way, in the coverlay film placed on the temporary pressure bonding table, the partial peeling portion of the release film is sucked and turned up by the suction pad. The end of the release film can be gripped more easily.

(17) In the coverlay film laminating device according to any one of (1) to (16), the coverlay film laminating device is disposed on the laminated film collecting device side of the temporary pressure bonding device in a base film supply path, It is preferable to further include an auxiliary temporary pressing device for temporarily pressing the cover lay film temporarily bonded to the base film by the pressing device to the base film.

  In the cover lay film laminating device according to (17) above, after the step of temporarily bonding the cover lay film to the base film to form the laminated film, the laminated film is supplied to the region where the auxiliary temporary pressure bonding is performed. A step of supplying a new base film to the temporary pressure bonding region and a step of moving the temporary pressure bonding table to supply a new coverlay film to the temporary pressure bonding region on the base film supply path are performed. In this case, since the required time for the latter process is considerably longer than that for the former process, a special process for performing the auxiliary temporary pressure bonding is performed by performing the auxiliary temporary pressure bonding process using a time difference between these processes. The auxiliary temporary press-bonding process can be performed without taking time. For this reason, it becomes possible to shorten the time of the first temporary pressure bonding, and it is possible to further improve the productivity as a whole.

(18) In the cover lay film laminating device according to (17), at least two image sensors are separated from each other between the auxiliary temporary pressure bonding device and the laminated film collecting device in the base film supply path. It is preferable that it is disposed.

  By comprising in this way, when an image pick-up element image | photographs a laminated | multilayer film, before the laminated | multilayer film collection | recovery apparatus collect | recovers laminated | multilayer films, it becomes possible to confirm the temporary crimping | compression-bonding state. As a result of photographing with the above imaging device, if the position of the coverlay film attached to the base film is misaligned or temporary crimping is incomplete, stop the operation of the device, It is possible to prevent the formation of such a laminated film incompletely temporarily bonded.

(19) In the coverlay film laminating device according to (17) or (18), the base film supply device, the laminated film recovery device, the temporary pressure bonding device, and the auxiliary temporary pressure bonding device operate in synchronization. It is preferable to further include a controller for causing the above to occur.

  By comprising in this way, since it becomes possible to perform a temporary crimping | compression-bonding process and an auxiliary | assistant temporary crimping | compression-bonding process, adjusting the tact time, as a whole, keeping the bonding position accuracy of the coverlay film with respect to the base film high. It becomes possible to perform temporary bonding with high productivity.

FIG. 1 is a plan view showing a cover lay film laminating apparatus according to Embodiment 1. FIG.
FIG. 2 is a plan view showing the coverlay film laminating apparatus according to Embodiment 1 in a simplified manner.
FIG. 3 is a front view showing the cover lay film laminating apparatus according to Embodiment 1.
[FIG. 4] It is the principal part enlarged view shown in order to demonstrate a temporary crimping | compression-bonding apparatus.
FIG. 5 is a side view for explaining the temporary pressure bonding device and the coverlay film cutting / mounting device.
FIG. 6 is a rear view showing the coverlay film cutting / mounting apparatus.
FIG. 7 is a side view showing a coverlay film cutting / mounting apparatus.
FIG. 8 is a flowchart for explaining a method for temporarily pressing the coverlay film to the base film.
FIG. 9 is a plan view showing a coverlay film laminating apparatus according to Embodiment 2 in a simplified manner.
FIG. 10 is a front view showing a conventional coverlay film laminating apparatus.

  Hereinafter, the coverlay film laminating apparatus of the present invention will be described based on the embodiments shown in the drawings.

[Embodiment 1]
First, the coverlay film bonding apparatus according to the first embodiment will be described with reference to FIGS.
FIG. 1 is a plan view showing a cover lay film laminating apparatus according to Embodiment 1. FIG. FIG. 2 is a plan view schematically showing the coverlay film laminating apparatus according to the first embodiment. FIG. 3 is a front view showing the cover lay film laminating apparatus according to the first embodiment. FIG. 4 is an enlarged view of a main part shown to explain the provisional pressure bonding apparatus. FIG. 5 is a side view for explaining the temporary pressure bonding device and the coverlay film cutting / mounting device. FIG. 6 is a rear view showing the coverlay film cutting / mounting apparatus. FIG. 7 is a side view showing the coverlay film cutting / mounting apparatus.

  In the following description, the three directions orthogonal to each other are defined as the x-axis direction (parallel to the paper surface in FIG. 1 and the left-right direction), the y-axis direction (direction parallel to the paper surface in FIG. 1 and perpendicular to the x-axis), and The z-axis direction (direction perpendicular to the paper surface in FIG. 1) is used.

The coverlay film laminating apparatus 1 according to Embodiment 1 includes an apparatus main body 100 for mounting and fixing various apparatuses (described later), and a roll-shaped base film Wb, as shown in FIGS. A base film supply device 200 for intermittently feeding the sheet into a sheet shape, and a strip-shaped coverlay film Wc temporarily bonded to the sheet-like base film Wb fed by the base film supply device 200 In order to wind the sheet-like laminated film Ws formed by the temporary pressure bonding apparatus 400 for forming the sheet-shaped laminated film Ws in which the coverlay film Wc is temporarily pressure-bonded to the film Wb into a roll shape. Between the laminated film collection device 300, the base film supply device 200, and the laminated film collection device 300. A pair of existing tension devices 250 and 350, and an auxiliary temporary press-bonding device 500 for further press-bonding the coverlay film Wc temporarily press-bonded to the base film Wb to the base film Wb by the temporary press-bonding device 400; A cover lay film cutting / supplying device 600 is provided behind the device main body 100 and supplies a strip-shaped cover lay film Wc to the provisional pressure bonding device 400.
The laminated film Ws has a structure in which a strip-shaped coverlay film Wc is temporarily press-bonded to one pattern forming surface side of the base film Wb.

  The apparatus main body 100 is configured by a machine base having a substantially rectangular shape in plan view. As shown in FIG. 3, a controller for operating the base film supply device 200, the laminated film collecting device 300, the temporary pressure bonding device 400, and the auxiliary temporary pressure bonding device 500 is incorporated in the right side of the apparatus main body 100. A controller box 110 is provided.

  As shown in FIG. 2, the apparatus main body 100 includes a base film supply path L1 that connects the base film supply apparatus 200 and the laminated film collection apparatus 300, and a coverlay that connects the coverlay film supply position P1 and the temporary pressure bonding area P2. A film supply path L2 and a coverlay film conveyance path L3 that connects a coverlay film feeding device 610 described later and a coverlay film supply position P1 are formed.

As shown in FIG. 3, the base film supply device 200 includes a feeding roller 210 and a guide roller 220.
The feeding roller 210 is rotatably supported at the upper end portion of the roller support base 150. And it is comprised so that the roll-shaped base film Wb may be let out in a sheet form by rotation by the drive of the torque motor 212.
The guide roller 220 is rotatably supported by the apparatus main body 100 and is configured to guide the sheet-like base film Wb to the laminated film collecting apparatus 300 side.

As shown in FIG. 3, the laminated film collecting apparatus 300 includes a winding roller 310 and a guide roller 320.
The take-up roller 310 is rotatably supported at the upper end of the roller support base 152. And it is comprised so that the sheet-like laminated film Ws may be wound up in roll shape by rotation by the drive of the torque motor 312.
The guide roller 320 is rotatably supported by the apparatus main body 100 and is configured to guide the sheet-like laminated film Ws to the take-up roller 310 side.

  As shown in FIG. 3, the tension device 250 on the base film supply device 200 side includes an elevating roller 252 and is disposed below the base film supply device 200. The elevating roller 252 has a roller shaft 254 supported by an elevating guide 256 so that it can rotate and elevate. And it is comprised so that the base film Wb may be loosened by the raise by the drive of a cylinder (not shown), and the base film Wb may be tensioned by the fall by its own weight.

  As shown in FIG. 3, the tension device 350 on the laminated film collection device 300 side has an elevating roller 352 and is disposed below the laminated film collection device 300. The elevating roller 352 has a roller shaft 354 supported by an elevating guide 356 so as to be rotatable and elevate. And it is comprised so that the laminated | multilayer film Ws may be loosened by the raise by the drive of a cylinder (not shown), and the laminated | multilayer film Ws may be tensioned by the fall by own weight.

  As shown in FIGS. 1 to 5, the temporary pressure bonding apparatus 400 can supply the coverlay film Wc along the coverlay film supply path L2 and adjust the position and posture of the coverlay film Wc with respect to the base film Wb. Possible temporary pressure bonding table 410, buffer mechanism 480 for receiving temporary pressure bonding table 410 when temporary pressure bonding table 410 performs a temporary pressure bonding operation in temporary pressure bonding region P2, and buffer mechanism for buffering base film Wb before the temporary pressure bonding operation is performed. And a pressing mechanism 490 that presses against 480.

  As shown in FIG. 4, the temporary crimping table 410 is placed on the coverlay film on which the first moving device 420, the second moving device 430, the third moving device 440, the fourth moving device 450, and the coverlay film Wc are placed. A placement portion 460 is provided.

  4 and 5, the first moving device 420 includes a servo motor 422, a screw shaft 424 supported by the servo motor 422, a first table 426, and a guide 428 extending along the y-axis direction. And disposed on the apparatus main body 100. The first moving device 420 is configured such that the first table 426 moves on the guide 428 along the y-axis direction by the rotation of the screw shaft 424 driven by the servo motor 422.

  The second moving device 430 includes a servo motor 432, a screw shaft 434 that is pivotally supported by the servo motor 432, a second table 436, and a guide 438 that extends along the x-axis direction, and is arranged on the first table 426. It is installed. The second moving device 430 is configured such that the second table 436 moves on the guide 438 along the x-axis direction by the rotation of the screw shaft 434 driven by the servo motor 432.

  The third moving device 440 includes a servo motor 442, a screw shaft 444 that is pivotally supported by the servo motor 442, a third table 446, and a moving element 447 that applies rotational force to the third table 446. It is arranged. The third table 446 is pivotally supported by a pivot 448 on the second table 436 and is swingably disposed via a table receiver 449. The third moving device 440 is configured to rotate in the circumferential direction (around the z axis) with the pivot 448 as the rotation center by the rotation of the screw shaft 444 driven by the servo motor 442.

  The fourth moving device 450 includes a servo motor 452, a screw shaft 454 supported by the servo motor 452, a fourth table 456, and a guide 458 extending along the x-axis direction. The fourth moving device 450 is arranged on the third table 446. It is installed. The fourth moving device 450 is configured such that the fourth table 456 moves on the guide 458 along the x-axis direction by the rotation of the screw shaft 454 driven by the servo motor 452.

  As shown in FIG. 4, the cover lay film mounting portion 460 is disposed on the fourth table 456 via an inclined portion 462 and a roller 464 having a gradient that rises from the left side toward the right side. Further, a spring 466 is locked to the fourth table 456 and the cover lay film mounting portion 460. Accordingly, when the fourth table 456 moves in the left direction in FIG. 4, the cover lay film mounting portion 460 is raised, and when the fourth table 456 moves in the right direction in FIG. 4, the cover lay film mounting portion 460 is moved. It will descend.

In the coverlay film laminating apparatus 1 according to the first embodiment, the temporary press bonding table 410 is movable in two horizontal directions (x-axis direction and y-axis direction) orthogonal to each other, and a virtual point in the horizontal plane. Can be rotated in the circumferential direction (around the z-axis) centered on.
Accordingly, the cover lay film Wc can be arranged with high positional (and posture) accuracy with respect to the base film Wb, so that it is easy to increase the bonding position accuracy of the cover lay film Wc with respect to the base film Wb. It becomes.

  In the coverlay film laminating apparatus 1 according to Embodiment 1, the two horizontal directions (x-axis direction and y-axis direction) orthogonal to each other are the direction along the base film supply path L1 and the coverlay film supply path L2. (See FIG. 2). In addition, the virtual point in the horizontal plane is the center point of the coverlay film mounting portion 460 of the temporary pressure bonding table 410.

In the coverlay film laminating apparatus 1 according to the first embodiment, as shown in FIGS. 2 and 4, the provisional crimping table 410 is provided with two imaging holes 470 a that are spaced apart from each other. An imaging element 470 is provided corresponding to each of the imaging holes 470a.
As a result, the position and orientation of the coverlay film Wc relative to the base film Wb can be accurately measured by the two imaging elements 470. For this reason, it becomes possible to arrange the coverlay film Wc with respect to the base film Wb with high positional (and posture) accuracy, and it is easy to increase the accuracy of the bonding position of the coverlay film Wc with respect to the base film Wb. Become.
Note that the two imaging holes 470a are disposed at both ends of the temporary press bonding table 410 (see FIG. 2).

In the coverlay film laminating apparatus 1 according to the first embodiment, the temporary pressure bonding table 410 is configured to perform a temporary pressure bonding operation by moving upward in the temporary pressure bonding region P2.
As a result, the cover-laying film Wc is moved relative to the base film Wb while the cover-laying film Wc is accurately positioned (and posture) with respect to the base film Wb. Temporary pressure bonding can be performed while maintaining the state where the position (and posture) is accurately placed. For this reason, it becomes easy to raise the bonding position accuracy of the coverlay film Wc with respect to the base film Wb.

In the coverlay film laminating apparatus 1 according to the first embodiment, as shown in FIGS. 4 and 5, the temporary pressure bonding apparatus 400 performs the temporary pressure bonding when the temporary pressure bonding table 410 performs a temporary pressure bonding operation in the temporary pressure bonding region P2. A buffer mechanism 480 for receiving the table 410 is further provided.
As a result, the entire cover lay film Wc can be temporarily pressure-bonded to the base film Wb with a uniform force.

In the cover lay film laminating apparatus 1 according to the first embodiment, the buffer mechanism 480 is provided with a number of base film suction holes (not shown) for sucking the base film Wb.
Thereby, base film Wb can be made to adsorb | suck to many base film adsorption | suction holes, and base film Wb can be fixed in temporary crimping | compression-bonding area | region P2.

In the coverlay film laminating apparatus 1 according to the first embodiment, as illustrated in FIGS. 1 and 5, the temporary pressure bonding apparatus 400 presses the base film Wb against the buffer mechanism 480 before the temporary pressure bonding operation is performed. A holding mechanism 490 is further provided.
Thereby, since the pressing mechanism 490 presses the base film Wb against the buffer mechanism 480, the base film Wb can be more reliably adsorbed to a large number of base film adsorbing holes.
In addition, since the pressing operation by the pressing mechanism 490 is performed before the temporary pressing operation is performed, the pressing operation can be smoothly performed without being interrupted by the temporary pressing operation by the temporary pressing table 410. Before the pre-bonding operation is performed, the pre-bonding table 410 that has completed the pre-bonding operation is moved from the pre-bonding region P2 to the cover lay film supply position P1, and a new cover lay film Wc is placed and temporarily bonded again. This is a period until the region P2 is returned, and since the pressing operation by the pressing mechanism 490 is performed using this time, it is not necessary to spend a special time for performing the pressing operation. As a result, productivity is not reduced.

In the coverlay film laminating apparatus 1 according to the first embodiment, when the temporary pressure bonding table 410 moves from the temporary pressure bonding area P2 toward the coverlay film supply position P1, the pressing mechanism 490 moves from outside the temporary pressure bonding area to within the temporary pressure bonding area. When the pressing mechanism 490 moves from the inside of the temporary pressure bonding area to the outside of the temporary pressure bonding area, the temporary pressure bonding table 410 moves from the coverlay film supply position P1 toward the temporary pressure bonding area P2.
Thereby, both the temporary crimping operation by the temporary crimping table 410 and the pressing operation by the pressing mechanism 490 can be performed smoothly.

In the coverlay film laminating apparatus 1 according to the first embodiment, the temporary press bonding table 410 has a heater (not shown) for heating the coverlay film Wc.
Accordingly, in the process of supplying the cover lay film Wc to the base film Wb prior to the temporary pressure bonding, the temperature of the cover lay film Wc can be increased in advance, so that the cover lay film for the base film Wb It becomes possible to perform the temporary pressure bonding of Wc smoothly in a shorter time.

In the coverlay film laminating apparatus 1 according to the first embodiment, the temporary crimping table 410 is provided with a number of coverlay film suction holes (not shown) for sucking the strip-shaped coverlay film Wc. ing.
As a result, the coverlay film Wc supplied at the coverlay film supply position P1 can be smoothly transported to the temporary pressure bonding region P2 by the temporary pressure bonding table 410.

  As shown in FIGS. 1 to 3, fixed clampers 120 and 130 are provided upstream (base film supply device 200 side) and downstream (laminated film collection device 300 side) of the temporary pressure bonding device 400 in the base film supply path L1. A movable clamper 140 is disposed between an auxiliary temporary press-bonding device 500 and a laminated film collecting device 300, which will be described later.

As shown in FIGS. 1 to 3, the auxiliary temporary pressure bonding device 500 is disposed on the laminated film collecting device 300 side of the temporary pressure bonding device 400 in the base film supply path L <b> 1, and is temporarily attached to the base film Wb by the temporary pressure bonding device 400. The coverlay film Wc that has been pressure-bonded is configured to be temporarily pressure-bonded to the base film Wb.
The auxiliary temporary pressure bonding time by the auxiliary temporary pressure bonding apparatus 500 is set to a desired time by the controller 110.

As shown in FIGS. 1 and 2, the cover lay film cutting / mounting device 600 includes a cover lay film feeding device 610 for intermittently feeding a roll-shaped cover lay film Wc0 into a sheet, and a cover lay film. A cover lay film cutting device 630 for cutting the sheet-like cover lay film Wc0 fed by the feeding device 610 to form a strip-shaped cover lay film Wc, and a strip shape formed by the cover lay film cutting device 630. The cover lay film mounting device 650 for mounting the cover lay film Wc on the temporary press bonding table 410 is provided.
As a result, a strip-shaped cover lay film Wc can be formed from the roll-shaped cover lay film Wc0, and the strip-shaped cover lay film Wc can be supplied to the temporary crimping table 410. The film Wc0 can be used. For this reason, productivity as a whole can be further increased.

As shown in FIGS. 6 and 7, the cover lay film feeding device 610 includes a feeding roller 612, a driving roller 616, and a guide roller 620.
The feeding roller 612 is rotatably supported on the upper end portion of the roller support base 160. And it is comprised so that roll-shaped coverlay film Wc0 may be drawn out in a sheet form by rotation by the drive of torque motor 614.
The drive roller 616 is rotatably supported on the roller support base 162. And it is comprised so that the sheet-like cover-lay film Wc0 may be let out to the guide roller 620 side by rotation by the drive of the torque motor 618.
The guide roller 620 is rotatably supported by the apparatus main body 100 and is configured to guide the sheet-like cover lay film Wc0 to the cover lay film cutting apparatus 630 side.

  Below the cover lay film feeding device 610, an elevating roller 622 for relaxing and tensioning the cover lay film Wc0 is disposed.

  On the cover lay film cutting device 630 side of the guide roller 620, a drawing roller 624 for pulling the sheet-like cover lay film Wc0 from the cover lay film feeding device 610 and a moving clamper 626 are disposed.

As shown in FIG. 6, the coverlay film cutting device 630 has a cutting blade die 632 having a cutting blade for cutting the sheet-like coverlay film Wc0 into a strip shape, and a receiving die that receives the cutting blade die 632. 634. Further, the coverlay film cutting / mounting device 600 includes a blade receiving sheet feeding device 640 that feeds the blade receiving sheet Wh that receives the press cutting blade between the press cutting blade mold 632 and the receiving mold 634, and a blade receiving sheet Wh. And a blade receiving sheet winding device 642 for winding.
Thereby, when cutting the sheet-like cover lay film Wc0 into a strip shape, the blade receiving sheet Wh fed by the blade receiving sheet feeding device 640 can always receive a push blade, so that the cover lay film is good. Can be cut into pieces. Further, it is possible to prevent the cutting edge of the press cutting blade from being damaged.

  As shown in FIG. 2, the coverlay film placing device 650 includes a moving clamper 652 for transferring the strip-shaped coverlay film Wc cut by the coverlay film cutting device 630 to the coverlay film transfer position P3, And a suction pad 654 for transporting the coverlay film Wc placed at the coverlay film delivery position P3 to the temporary pressure bonding table 410 at the coverlay film supply position P1. The suction pad 654 can move in the x-axis direction, and can move up and down at the cover lay film supply position P1 and the cover lay film delivery position P3.

In the cover lay film laminating apparatus 1 according to the first embodiment, the cover lay film cutting / mounting apparatus 600 is, as shown in FIG. 1, FIG. 2, and FIG. A release film gripping device 660 that grips an end of the release film in the coverlay film Wc placed on 410 is further included. Then, in the state where the release film gripping device 660 grips the end of the release film, the temporary pressure bonding table 410 moves from the coverlay film supply position P1 toward the temporary pressure bonding area P2, thereby removing the coverlay film Wc. It is comprised so that a release film may be peeled.
Thereby, since it becomes possible to peel the release film from the coverlay film during the process of transporting the coverlay film Wc to the temporary press-bonding region P2, it is purposely for peeling the release film from the coverlay film Wc. It is not necessary to provide a special process separately. For this reason, the bonding operation | work of the coverlay film Wc with respect to the base film Wb can be shortened.
Further, since the coverlay film Wc can be handled with the release film attached until the coverlay film Wc is placed on the temporary pressure bonding table 410, the handling becomes extremely easy.

In the cover lay film laminating apparatus 1 according to the first embodiment, as shown in FIG. 7, the cover lay film cutting / mounting apparatus 600 starts from the cover lay film Wc0 before cutting the cover lay film Wc0. It further has a release film peeling blade 670 for partially peeling the release film to form a partially peeled portion.
Thereby, the coverlay film Wc placed on the temporary pressure bonding table 410 is formed with a partial peeling portion in advance by the release film peeling blade 670, so that the release film gripping device 660 is connected to the end of the release film. The part can be easily gripped.

In the cover lay film laminating apparatus 1 according to the first embodiment, the suction pad 654 is placed on the end of the release film by the release film gripping device 660 after the cover lay film Wc is placed on the temporary pressure bonding table 410. The partial peeling portion is also adsorbed until the portion is gripped.
As a result, in the coverlay film Wc placed on the temporary press bonding table 410, the partial peeling portion of the release film is attracted and turned up by the suction pad 654, and therefore the release film gripping device 660 is released. The end of the mold film can be gripped more easily.

  As shown in FIG. 5, two light emitting elements 170 for illumination are disposed at an intermediate position between the coverlay film supply position P1 and the temporary pressure bonding area P2 in the coverlay film supply path L2.

  As described above, the coverlay film laminating apparatus 1 according to the first embodiment is fed by the base film supply apparatus 200 for intermittently feeding the roll-shaped base film Wb into a sheet shape and the base film supply apparatus 200. Temporary pressure bonding for forming a sheet-like laminated film Ws in which a strip-like cover lay film Wc is temporarily pressure-bonded to the sheet-like base film Wb and the cover lay film Wc is temporarily pressure-bonded to the base film Wb. The apparatus 400 and the laminated film collection | recovery apparatus 300 for winding up the sheet-like laminated film Ws formed with the temporary crimping | compression-bonding apparatus 400 in roll shape are provided. Further, the temporary crimping apparatus 400 has a temporary crimping table 410 that can supply the coverlay film Wc along the coverlay film supply path L2 and can adjust the position and posture of the coverlay film Wc with respect to the base film Wb. is doing.

For this reason, according to the coverlay film laminating apparatus 1 according to the first embodiment, the strip-shaped coverlay film Wc is temporarily press-bonded to the sheet-like base film Wb that is intermittently drawn. Even when a long base film is used, alignment errors in the long direction of the base film are not accumulated, and the alignment accuracy in the long direction of the base film is not reduced.
Further, according to the cover lay film laminating apparatus 1 according to the first embodiment, the cover lay film Wc is placed in the temporary pressure bonding region P2 by the temporary pressure bonding table 410 capable of adjusting the position and posture of the cover lay film Wc with respect to the base film Wb. Since it will be supplied, it becomes easy to raise the bonding position accuracy of the coverlay film Wc with respect to the base film Wb. As a result, it is easy to improve the quality of the flexible substrate.

In the coverlay film laminating apparatus 1 according to the first embodiment, as shown in FIGS. 1 and 3, two images are taken between the auxiliary temporary pressure bonding apparatus 500 and the laminated film collecting apparatus 300 in the base film supply path L1. Elements 180 are spaced apart from one another.
As a result, the imaging element 180 captures the laminated film Ws, so that the provisional pressure-bonding state can be confirmed before the laminated film collecting apparatus 300 collects the laminated film Ws. As a result of photographing with the image sensor 180, if the attachment position of the coverlay film Wc with respect to the base film Wb is shifted or the temporary pressure bonding is incomplete, the operation of the apparatus is stopped, It becomes possible to prevent the formation of such a laminated film incompletely temporarily bonded.

In the coverlay film laminating apparatus 1 according to the first embodiment, as described above, the base film supply apparatus 200, the laminated film collection apparatus 300, the temporary pressure bonding apparatus 400, and the auxiliary temporary pressure bonding apparatus 500 are operated in synchronization. A controller 110 is further provided.
Thereby, since it becomes possible to perform the temporary press-bonding process and the auxiliary temporary press-bonding process while adjusting the tact time, the overall productivity of the cover lay film Wc with respect to the base film Wb is kept high. High temporary pressure bonding can be performed.

  Next, a method for temporarily bonding the coverlay film Wc to the base film Wb when the coverlay film laminating apparatus 1 according to Embodiment 1 is used will be described with reference to FIGS. FIG. 8 is a flowchart for explaining a method of temporarily pressing the coverlay film to the base film.

The method of temporarily pressing the coverlay film Wc to the base film Wb when using the coverlay film laminating apparatus 1 according to the first embodiment supplies the base film Wb toward the temporary pressing apparatus 400 “base film supplying step”. A “coverlay film supply step” for supplying the strip-shaped coverlay film Wc to the temporary pressure bonding table 410, and a “temporary pressure bonding / auxiliary temporary pressure bonding step” for temporarily pressure bonding the coverlay film Wc to the base film Wb. And a “laminated film collecting step” for collecting the laminated film Ws on which the coverlay film Wc is temporarily press-bonded. Hereinafter, each of these steps will be described sequentially.
In carrying out the bonding of the coverlay film, as shown in FIG. 2, the moving clamper 140 is disposed in the vicinity of the auxiliary temporary pressure bonding device 500, and the moving clamper 652 of the coverlay film mounting device 650 is the coverlay film. It is assumed that the suction pad 654 of the cover lay film placement device 650 is disposed in the vicinity of the cutting device 630 and is disposed at the cover lay film delivery position P3. Further, it is assumed that the temporary press bonding table 410 is disposed at the coverlay film supply position P1.

1. Base Film Supply Process First, the base film Wb is intermittently fed out along the base film supply path L1 by driving the base film supply device 200, the moving clamper 140, and the laminated film collection device 300 (step Q1 in FIG. 8). .

  When the cover lay film attaching position on the base film Wb comes to the temporary press-bonding region P2, the base film Wb is temporarily stopped, and the base film Wb is held by the fixed clampers 120 and 130. At this time, the pressing mechanism 490 presses the base film Wb against the buffer mechanism 480, so that the base film Wb in the temporary press-bonding region P2 is vacuum-adsorbed and fixed by a large number of base film suction holes provided in the buffer mechanism 480. (Step Q2 in FIG. 8).

2. Cover Lay Film Supply Process First, the cover lay film feeding device 610 is driven to form a roll-shaped cover lay film Wc0 into a sheet shape and intermittently fed along the cover lay film conveyance path L3 (step R1 in FIG. 8). ). At this time, in the coverlay film Wc0, the release film in the coverlay film Wc0 is partially peeled off by the release film peeling blade 670, and a partial peeling portion is formed.

  The sheet-like cover lay film Wc0 fed from the cover lay film feeding device 610 is supplied between the press cutting blade die 632 and the receiving die 634 in the cover lay film cutting device 630 by the moving clamper 626. Then, the cover lay film cutting device 630 cuts the cover-lay film delivery position P3 side edge of the sheet-like cover lay film Wc0 by the moving clamper 652 (step R2 in FIG. 8). At this time, the cover lay film Wc0 is cut in a state where the blade receiving sheet Wh is always drawn between the sheet-like cover lay film Wc0 and the receiving mold 634.

  The cover lay film Wc cut into strips by the cover lay film cutting device 630 is placed at the cover lay film delivery position P3 by the moving clamper 652. The coverlay film Wc disposed at the coverlay film delivery position P3 is sucked by the suction pad 654, and is transported and placed from the coverlay film delivery position P3 onto the temporary pressure bonding table 410 at the coverlay film supply position P1 ( Step R3 in FIG.

In the cover lay film Wc placed on the temporary pressure bonding table 410, the lower surface of the cover lay film Wc is adsorbed by a number of cover lay film adsorption holes provided in the temporary pressure bonding table 410. In addition, on the upper surface of the cover lay film Wc, that is, the release film surface, the suction of the suction pad 654 that sucks a portion other than the partial peeling portion is released. When the temporary press-bonding table 410 is lowered in this state, in the coverlay film Wc placed on the temporary press-bonding table 410, the partial peeling portion of the release film is sucked by the suction pad 654 and turned up. Then, the peeled part peeling portion is gripped by the release film gripping device 660, and the temporary pressure-bonding table 410 is moved toward the temporary pressure-bonding region P2, so that the release film is easily peeled from the coverlay film Wc. (Step R4 in FIG. 8).
In addition, this peeled release film is collect | recovered by the release film collection | recovery box (not shown) arrange | positioned beside the coverlay film supply position P1.

3. Temporary pressure bonding / auxiliary temporary pressure bonding step First, the temporary pressure bonding table 410 to which the coverlay film Wc is supplied at the coverlay film supply position P1 is moved to the position where the light emitting element 170 is disposed in the coverlay film supply path L2. At this position, the coverlay film Wc is photographed by the two image pickup devices 470 disposed on the temporary pressure bonding table 410, and the position of the coverlay film Wc on the temporary pressure bonding table 410 is measured based on the photographing result ( Step S1 in FIG.

  Next, the temporary pressure bonding table 410 is moved to the temporary pressure bonding area P2. At this time, the pressing mechanism 490 is disposed outside the temporary press-bonding region. In the pre-bonding region P2, the base film Wb is photographed by the two imaging elements 470, and the position of the base film Wb based on the position of the pre-bonding table 410 is measured based on the photographing result (step S2 in FIG. 8). ). Then, the relative deviation amount is calculated from the measured values of the coverlay film Wc and the base film Wb, and based on the calculation result, the temporary pressure bonding table 410 is driven to move in the horizontal direction (x-axis direction and y-axis direction). Adjustment and / or rotation adjustment in the circumferential direction (around the z axis) is performed to align the coverlay film Wc with the base film Wb (step S3 in FIG. 8).

When the alignment of the coverlay film Wc with respect to the base film Wb is completed, the fourth moving device 450 of the temporary pressure bonding table 410 is driven to move the temporary pressure bonding table 410 upward, and the coverlay film Wc is temporarily attached to the base film Wb. Crimping is performed (step S4 in FIG. 8). Thereby, the laminated film Ws in which the coverlay film Wb is temporarily press-bonded to the base film Wb is formed. After the temporary crimping operation is finished, the gripping of the fixed clampers 120 and 130 is released.
When this temporary press-bonding operation is completed, the temporary press-bonding table 410 moves to the cover lay film supply position P1 in order to receive a new cover lay film Wc from the cover lay film cutting / mounting device 600.

  The sheet-like laminated film Ws formed by the temporary pressure bonding device 400 is sent to the auxiliary temporary pressure bonding device 500 by driving the base film supply device 200, the moving clamper 140, and the laminated film collecting device 300. Then, the auxiliary temporary pressure bonding device 500 performs auxiliary temporary pressure bonding, thereby forming a laminated film Ws in which the coverlay film Wc is further firmly pressure bonded to the base film Wb (step S5 in FIG. 8).

4). Laminated Film Collection Step The laminated film Ws that has been subjected to auxiliary temporary pressure bonding is sent toward the laminated film collection device 300 by the moving clamper 140. At this time, the confirmation operation of the temporarily press-bonded state of the laminated film Ws is performed by the imaging elements 180 disposed at both ends in the width direction of the movable clamper 140 (step SQ1 in FIG. 8). Then, by driving the base film supply device 200, the moving clamper 140, and the laminated film collecting device 300, the sheet-like laminated film Ws is wound around the take-up roller 310 (step SQ2 in FIG. 8). Thereby, the sheet-like laminated film Ws is wound up in a roll shape and collected as a roll-like laminated film Ws.

  Through the above steps, the laminated film Ws in which the coverlay film Wc is temporarily press-bonded to the base film Wb can be formed.

In order to bond the coverlay film Wc to the base film Wb, at least a coverlay film supply step for supplying the coverlay film Wc to the bonding region on the base film supply path, and a cover for the base film Wb. A laminating step for laminating the lay film Wc is required, but when the cover lay film Wc is completely pasted to the base film Wb in one step, this laminating step becomes extremely long, It becomes difficult to improve productivity as a whole.
For this reason, in the coverlay film laminating apparatus 1 according to the first embodiment, instead of completely laminating the coverlay film Wc on the base film Wb to form a laminated film, the coverlay film laminating apparatus 1 on the base film Wb. The laminated film Ws is formed by temporarily pressing the film Wc. As a result, the above-described bonding step is greatly shortened to improve productivity as a whole.
In the cover lay film laminating apparatus 1 according to Embodiment 1, in order to completely bond the cover lay film Wc to the base film Wb, the laminated film Ws on which the cover lay film Wc is temporarily pressure-bonded is pressure-bonded (main pressure bonding). ) Is prepared separately, and the cover lay film Wc is completely bonded to the base film Wb using the vacuum press.

  In the above-described method of temporarily pressing the coverlay film to the base film, after the step of forming the laminated film Ws by temporarily pressing the coverlay film Wc to the base film Wb, the laminated film Ws is placed in the region where the auxiliary temporary pressing is performed. Supplying a new base film Wb to the temporary pressure bonding area P2 and moving the temporary pressure bonding table 410 to supply a new coverlay film Wc to the temporary pressure bonding area P2 on the base film supply path L1. And a process of performing. In this case, since the required time for the latter process is considerably longer than that for the former process, a special process for performing the auxiliary temporary pressure bonding is performed by performing the auxiliary temporary pressure bonding process using a time difference between these processes. The auxiliary temporary press-bonding process can be performed without taking time. According to the coverlay film laminating apparatus 1 according to the first embodiment, since the auxiliary temporary pressure bonding apparatus 500 configured as described above is provided, the time for the first temporary pressure bonding can be shortened. The overall productivity can be further improved.

[Embodiment 2]
A coverlay film laminating apparatus according to Embodiment 2 will be described with reference to FIG. FIG. 9 is a plan view illustrating a coverlay film laminating apparatus according to Embodiment 2 in a simplified manner. In FIG. 9, the same members as those in FIG. 2 are denoted by the same reference numerals, and detailed description thereof is omitted.

  The coverlay film laminating apparatus 2 according to the second embodiment has basically the same configuration as the coverlay film laminating apparatus 1 according to the first embodiment, but is not a roll but a strip as a base film. The difference is that a base film Wb is used.

  That is, the coverlay film laminating apparatus 2 according to the second embodiment is supplied by the base film supply apparatus 1200 and the base film supply apparatus 1200 for supplying the strip-shaped base film Wb toward the temporary press-bonding region P2. A strip-shaped cover film Wc is temporarily press-bonded to the strip-shaped base film Wb to form a strip-shaped laminated film Ws, and a strip-shaped strip formed by the temporary-bonding device 400. A cover lay film laminating device provided with a laminated film collecting device 1300 for collecting the laminated film Ws, wherein the temporary pressure bonding device 400 connects the temporary pressure bonding region P2 and the cover lay film supply position P1. Coverlay film Wc can be supplied along supply path L2, and base fill And a cover lay film temporary bonding table 410 position and orientation can be adjusted in Wc for wb.

For this reason, according to the coverlay film laminating apparatus 2 according to the second embodiment, since the strip-shaped base film Wb is used, there is no possibility that the alignment errors in the longitudinal direction of the base film accumulate. The alignment accuracy in the longitudinal direction of the base film does not decrease.
Further, according to the coverlay film laminating apparatus 2 according to the second embodiment, the coverlay film Wc is the same as the coverlay film Wc with respect to the base film Wb, as in the case of the coverlay film laminating apparatus 1 according to the first embodiment. Is supplied to the temporary press-bonding region P2 by the temporary press-bonding table 410 whose position and orientation can be adjusted, and it becomes easy to increase the bonding position accuracy of the coverlay film Wc with respect to the base film Wb. As a result, it is easy to improve the quality of the flexible substrate.

  Thus, the coverlay film laminating apparatus 2 according to the second embodiment uses the strip-shaped base film Wb instead of the roll as the base film, and thus the coverlay film laminating apparatus according to the first embodiment. 1, but has the same configuration as the coverlay film laminating device 1 according to the first embodiment in other points, the coverlay film laminating device 1 according to the first embodiment is It has the effect that it has.

  In addition, well-known conveyance means, such as a suction pad and a moving table, can be used as a conveyance means for conveying the strip-shaped base film Wb and the strip-shaped laminated film Ws along the base film supply path L1.

Claims (27)

A base film supply device for intermittently feeding a roll-shaped base film into a sheet,
A strip-shaped coverlay film is temporarily pressure-bonded to a sheet-like base film fed out by the base film supply device, thereby forming a sheet-like laminated film in which the coverlay film is temporarily pressure-bonded to the base film. A temporary crimping device;
A cover lay film laminating apparatus comprising a laminated film collecting apparatus for winding a sheet-like laminated film formed by the temporary pressure bonding apparatus into a roll shape,
The temporary crimping apparatus covers a coverlay film supply path that connects a temporary crimping region for temporarily crimping a coverlay film to a base film and a coverlay film supply position for supplying the coverlay film toward the temporary crimping region. A cover lay film laminating apparatus comprising a temporary pressure bonding table capable of supplying a lay film and capable of adjusting a position and a posture of the cover lay film with respect to a base film. In the coverlay film bonding apparatus according to claim 1,
The coverlay film laminating apparatus, wherein the coverlay film supply path is orthogonal to a base film supply path connecting the base film supply apparatus and the laminated film collection apparatus. A base film supply device for supplying a strip-shaped base film toward the temporary press-bonding region;
Temporary pressure bonding apparatus for temporarily bonding a strip-shaped coverlay film to the strip-shaped base film supplied by the base film supply apparatus, and forming a strip-shaped laminated film;
A coverlay film laminating device comprising a laminated film collecting device for collecting a strip-like laminated film formed by this temporary pressure bonding device,
The temporary crimping apparatus covers a coverlay film supply path that connects a temporary crimping region for temporarily crimping a coverlay film to a base film and a coverlay film supply position for supplying the coverlay film toward the temporary crimping region. A cover lay film laminating apparatus comprising a temporary pressure bonding table capable of supplying a lay film and capable of adjusting a position and a posture of the cover lay film with respect to a base film. In the coverlay film bonding apparatus according to any one of claims 1 to 3,
Bonding a coverlay film, wherein the temporary crimping table is movable in two horizontal directions orthogonal to each other and is rotatable in a circumferential direction with a virtual point in a horizontal plane as a rotation center. apparatus. In the coverlay film bonding apparatus according to claim 4,
The provisional crimping table is provided with at least two imaging holes that are spaced apart from each other,
A coverlay film laminating apparatus, wherein an image sensor is provided corresponding to each of the imaging holes. In the coverlay film bonding apparatus according to any one of claims 1 to 5,
The coverlay film laminating apparatus, wherein the temporary pressure bonding table performs a temporary pressure bonding operation by moving upward in the temporary pressure bonding region. In the coverlay film bonding apparatus according to claim 6,
The said temporary crimping | bonding apparatus further has a buffer mechanism which receives the said temporary crimping | compression-bonding table when the said temporary crimping | compression-bonding table performs a temporary crimping | compression-bonding operation | movement in the said temporary crimping | compression-bonding area | region. In the coverlay film bonding apparatus according to claim 7,
A coverlay film laminating apparatus, wherein the buffer mechanism is provided with a large number of base film suction holes for adsorbing a base film. In the coverlay film bonding apparatus according to claim 8,
The coverlay film laminating apparatus, further comprising a pressing mechanism that presses the base film against the buffer mechanism before the temporary pressing operation is performed. In the coverlay film bonding apparatus according to any one of claims 1 to 9,
The said temporary crimping | compression-bonding table has a heater for heating a coverlay film, The coverlay film bonding apparatus characterized by the above-mentioned. In the coverlay film bonding apparatus according to any one of claims 1 to 10,
Coverlay film feeding device for intermittently feeding a roll-shaped coverlay film into a sheet shape, and a strip-shaped coverlay film by cutting the sheet-shaped coverlay film fed by the coverlay film feeding device A cover lay film cutting device for forming a cover lay, and a cover lay film mounting device for mounting a strip-shaped cover lay film formed by the cover lay film cutting device on the temporary crimping table A cover lay film laminating apparatus, further comprising a lay film cutting / mounting apparatus. In the coverlay film bonding apparatus according to claim 11,
The cover lay film cutting device has a cutting blade mold having a cutting blade for cutting a sheet-like cover lay film into a strip shape, and a receiving mold for receiving this cutting blade mold,
The coverlay film cutting / mounting device includes a blade receiving sheet feeding device that feeds a blade receiving sheet that receives the push cutting blade between the press cutting blade mold and the receiving mold, and a blade receiver that winds the blade receiving sheet. A coverlay film laminating device, further comprising a sheet winding device. In the coverlay film bonding apparatus according to any one of claims 1 to 12,
A coverlay film laminating apparatus, wherein the temporary crimping table is provided with a number of coverlay film adsorption holes for adsorbing a strip-shaped coverlay film. In the coverlay film bonding apparatus according to claim 13,
The cover lay film cutting / mounting device further includes a release film gripping device that grips an end portion of the release film in the cover lay film adsorbed in the numerous cover lay film suction holes,
With the release film gripping device gripping the end of the release film, the temporary pressure-bonding table moves from the coverlay film supply position toward the temporary pressure-bonding area, thereby releasing the coverlay film from the coverlay film. A coverlay film laminating apparatus characterized by peeling a mold film. In the coverlay film bonding apparatus according to claim 14,
Prior to cutting the coverlay film, the coverlay film cutting / mounting device includes a release film peeling blade for partially peeling the release film from the coverlay film to form a partial peeling portion. Furthermore, the coverlay film bonding apparatus characterized by having. In the coverlay film bonding apparatus according to claim 15,
The cover lay film mounting device has a suction pad for transporting the cover lay film cut by the cover lay film cutting device to the temporary pressure bonding table,
The suction pad sucks the partial peeling portion even after the coverlay film is placed on the temporary pressure bonding table until the end portion of the release film is gripped by the release film gripping device. A coverlay film laminating device characterized. In the coverlay film bonding apparatus according to any one of claims 1 to 16,
A coverlay film that is disposed on the laminated film collecting device side of the temporary pressure bonding device in the base film supply path and is temporarily pressure-bonded to the base film by the temporary pressure bonding device is further firmly pressure-bonded to the base film. A coverlay film laminating apparatus, further comprising an auxiliary temporary crimping apparatus. In the coverlay film bonding apparatus according to claim 17,
A coverlay film laminating apparatus, wherein at least two image sensors are disposed apart from each other between the auxiliary temporary pressure bonding apparatus and the laminated film collecting apparatus in a base film supply path. In the coverlay film bonding apparatus according to claim 17 or 18,
A coverlay film laminating apparatus, further comprising a controller for operating the base film supply device, the laminated film collecting device, the temporary pressure bonding device, and the auxiliary temporary pressure bonding device in synchronization. After adjusting the relative position and orientation between the coverlay film and the base film with the strip-shaped coverlay film adsorbed to the temporary crimping table, the coverlay film and the base film are temporarily crimped. A coverlay film laminating apparatus characterized by the above. In the coverlay film laminating device according to claim 20,
A coverlay film laminating apparatus that performs temporary pressure bonding between a coverlay film and a base film in a state in which the base film is adsorbed to a buffer mechanism. A coverlay film cutting and placing device used for the coverlay film laminating device according to any one of claims 1 to 21,
A coverlay film feeding device for intermittently feeding a roll-shaped coverlay film into a sheet,
A cover lay film cutting device for cutting a sheet-like cover lay film fed by the cover lay film feeding device to form a strip-shaped cover lay film;
A cover lay film cutting / mounting device comprising: a cover lay film mounting device for mounting a strip-shaped cover lay film formed by the cover lay film cutting device on the temporary pressure bonding table. . In the coverlay film cutting / mounting apparatus according to claim 22,
The cover lay film cutting device has a cutting blade mold having a cutting blade for cutting a sheet-like cover lay film into a strip shape, and a receiving mold for receiving this cutting blade mold,
The coverlay film cutting / mounting device includes a blade receiving sheet feeding device that feeds a blade receiving sheet that receives the push cutting blade between the press cutting blade mold and the receiving mold, and a blade receiver that winds the blade receiving sheet. A coverlay film cutting / mounting device, further comprising a sheet winding device. In the coverlay film cutting and placing device according to claim 22 or 23,
A coverlay film cutting / mounting apparatus, wherein the temporary pressure bonding table is provided with a number of coverlay film suction holes for sucking a strip-shaped coverlay film. In the coverlay film cutting / mounting apparatus according to claim 24,
A release film gripping device for gripping an end of the release film in the coverlay film adsorbed in the numerous coverlay film suction holes;
With the release film gripping device gripping the end of the release film, the temporary pressure-bonding table moves from the coverlay film supply position toward the temporary pressure-bonding area, thereby releasing the coverlay film from the coverlay film. A coverlay film cutting / mounting apparatus, characterized in that the mold film can be peeled off. In the coverlay film cutting and placing device according to claim 25,
Prior to cutting the coverlay film, the coverlay film cutting further comprises a release film peeling mechanism for partially peeling the release film from the coverlay film to form a partially peeled portion -A mounting device. In the coverlay film cutting and placing device according to claim 26,
A suction pad for transporting the coverlay film cut by the coverlay film cutting device to the temporary pressure bonding table;
The suction pad sucks the partial peeling portion even after the coverlay film is placed on the temporary pressure bonding table until the end portion of the release film is gripped by the release film gripping device. A coverlay film cutting / mounting device.

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