JP7187034B2 - Sticking device and sticking method - Google Patents

Description

TECHNICAL FIELD The present invention relates to a sticking device and a sticking method.

2. Description of the Related Art Conventionally, there is an attaching device for attaching an attaching member such as a reinforcing plate or an insulating plate to a flexible wiring substrate (hereinafter simply referred to as substrate). The sticking member is provided with a heat-curable adhesive layer. Such a sticking device is one in which a sticking member is formed in advance by punching from a tape or the like, and the sticking member is picked up, conveyed to a predetermined position on a substrate, heated and pressed, and stuck to the substrate with an adhesive. is. Such a sticking device requires transport means for picking up and transporting the sticking member, which causes problems such as an increase in the size of the sticking device and a problem of low productivity.

Therefore, in order to solve the above conventional problems, a tape punching mechanism consisting of a punch and a die plate is used above the substrate to punch out the sticking member from the tape. Then, the sticking device and the sticking device and the sticking device and the sticking device which extend the punching stroke of the punch toward the substrate as it is, presses the sticking member punched out by the punch and the pressing table against the substrate, and sticks the adhesive layer by heating. There is a method (see Patent Document 1, for example).

JP 2015-40066 A

However, in the sticking device described in Patent Document 1, the lower die including the die plate is fixed to the sticking device main body via the crimping plate. It is a configuration that cannot move in the height direction, or a configuration that cannot rotate in the plane direction. In other words, the sticking members are punched out in one row in the longitudinal direction of the long tape, and stuck in one row on the substrate. For this reason, there is a problem that it cannot be applied when the bonding positions are arranged at a plurality of positions in the width direction with respect to the feeding direction of the substrate, or when the bonding positions are arranged irregularly. .

SUMMARY OF THE INVENTION Accordingly, the present invention has been made to solve at least one of the problems described above. To provide a sticking device and a sticking method capable of sticking, shortening tact time, and remarkably improving productivity.

[1] A sticking device according to the present invention is a sticking device that punches sticking members out of a tape having a thermosetting adhesive layer and sticks them to a plurality of sticking positions on a substrate, and supports the back surface of the substrate. a heating table for heating the substrate while heating the substrate; a head unit disposed with a gap above the surface of the substrate; and a substrate for feeding the substrate between the heating table and the head unit. a feeding mechanism, wherein the head unit comprises a tape punching mechanism having a mold consisting of a punch and a die plate; a tape feeding mechanism for feeding the tape between the punch and the die plate; an imaging device that captures images of alignment marks provided corresponding to positions one by one and specifies the pasting position of the pasting member from the positions of the alignment marks; a head unit moving mechanism that moves to the affixing position according to the posture and defines a gap between the substrate and the die plate; a head unit moving mechanism that punches the affixing member from the tape; and a punch driving mechanism for moving the punch to a height position at which the punch can be attached to the substrate.

In the prior art described above, the mold is fixed to the apparatus main body. On the other hand, the affixing apparatus of the present invention has a structure in which a head unit having a mold and an imaging device can be freely moved with respect to the substrate by a head unit moving mechanism. The head unit identifies the attachment position by scanning the imaging device and capturing an image of each of the alignment marks provided corresponding to the attachment position. The head unit aligns the mold with the posture of the pasting member, moves the mold to the specified pasting position, drives the punch to punch out the pasting member from the tape, and extends the stroke of the punch. to press the sticking member against the substrate.

According to the affixing apparatus of the present invention as described above, in the affixing apparatus described in Patent Document 1, the affixing members are punched out in a line in the longitudinal direction from a long tape to form a long substrate. is pasted in one column. On the other hand, according to the affixing apparatus of the present invention as described above, it is possible to affix the affixing member to a large number of affixing positions that are regularly or irregularly arranged in the feeding direction and the width direction of the substrate. In addition, it is possible to shorten the tact time and significantly improve the productivity.

A flexible wiring board, a flexible board, or a rigid wiring board can be applied to the substrate. Alignment marks may also be markers for position detection, wiring patterns of substrates, through holes, and holes for element placement.

[2] In the adhering apparatus of the present invention, the head unit moving mechanism includes an X-axis driving mechanism that moves the head unit in the X-axis direction parallel to the upper surface of the heating table, A Y-axis drive mechanism that moves in the Y-axis direction perpendicular to the X-axis, a Z-axis drive mechanism that moves in a direction perpendicular to the XY plane, and a θ-axis drive mechanism that rotates about the Z-axis as a rotation axis. It is preferable to have

Here, the substrate feed direction is the X-axis direction, the width direction of the substrate is the Y-axis direction, and the direction perpendicular to the XY plane is the Z-axis direction. Also, the direction of rotation about the Z-axis is defined as the θ-axis direction. The head unit moving mechanism moves the mold to the specified sticking position by means of the X-axis driving mechanism and the Y-axis driving mechanism. The Z-axis movement mechanism is controlled to a height position where the die (punch) can stick the sticking member to the substrate or a height position where the substrate can be fed. The .theta.-axis drive mechanism adjusts the posture of the mold to a predetermined posture when the sticking member is stuck. With such a configuration, the sticking member can be stuck to the specified sticking position on the substrate in an appropriate posture.

[3] In the sticking apparatus of the present invention, it is preferable that the punch has a suction hole that vacuum-sucks the surface of the sticking member and a pressing surface that presses the sticking member against the substrate.

As described above, since the punch has the suction holes, the sticking member punched out from the tape is vacuum-sucked until the sticking member is stuck to the substrate. becomes possible. Further, since the punch has a pressing surface and the outer shape of the sticking member is the same as the outer shape of the punch, the whole sticking member can be uniformly pressed.

[4] In the pasting device of the present invention, the punch drive mechanism has an air cylinder for moving the punch up and down and a connecting member for connecting a piston of the air cylinder and a guide plate holding the punch, It is preferable that the connecting member is provided with a vacuum suction path that communicates with the suction holes.

The punch is moved up and down by an air cylinder. The air cylinder has a tape punching force within the range of the drive stroke, and can be controlled with an appropriate pressing force that does not damage the substrate when the attaching member is attached to the substrate. Also, the air cylinder can be unitized with a simple structure, and the size of the tape punching mechanism can be reduced. Since the connecting member is provided with a vacuum suction path that communicates with the suction holes, it is possible to stably perform vacuum suction on the punched pasting member even with a vertically moving punch.

[5] In the attaching apparatus of the present invention, when the punch presses the attaching member against the substrate, the air cylinder is arranged so that the lower limit position of the pressing surface is within the range of the allowable compression amount of the substrate. is preferably adjusted and fixed in position from the heating table.

The position of the air cylinder from the heating table is adjusted and fixed so that the lower limit position of the pressing surface is within the allowable compression amount of the substrate when the punch presses the attaching member against the substrate. As a result, it is possible to prevent the substrate from being warped or deformed due to excessive compression of the substrate, or prevent the substrate from being unable to be pressed. The allowable amount of compression of the substrate is a value of the amount of compression within a range in which the substrate is not warped or deformed. The lower limit position (the position closest to the substrate) of the pressing surface is defined by the bottom dead center of the piston and the position of the air cylinder.

[6] The affixing apparatus of the present invention further includes a stripper for pressing the tape against the die plate around the punch when the affixing member is punched out from the tape by the punch, the stripper comprising: A stripper plate that presses the tape against the die plate, a spring that biases the stripper plate toward the die plate, and guide pins that can be inserted into guide holes provided in the die plate. is preferred.

By providing the stripper, the tape can be punched out by pressing with an appropriate pressing force so that the tape is free from wrinkles and slack due to the urging force of the spring. Further, the stripper plate is provided with a guide pin to suppress positional displacement with respect to the die plate and to suppress the clearance from the punch 44, making it possible to form a bonding member with small sag and fracture surface.

[7] In the adhering apparatus of the present invention, the tape feeding mechanism includes a tape feeding roll for feeding the long tape wound in a roll between the punch and the die plate; a tape take-up roll for taking up the punched tape; and a nip roll disposed between the tape take-up roll and the head unit for intermittently feeding the tape to the tape take-up roll side. It is preferable to have

Since the tape feeding mechanism has a tape feeding roll, a tape winding roll, and a nip roll, it is possible to feed the tape intermittently at a predetermined feeding pitch while applying an appropriate tension to the tape. Also, by arranging the nip rolls, it is possible to feed a thin, flexible tape at a fixed pitch.

[8] In the affixing device of the present invention, the tape has a protective tape that protects the adhesive layer, and the head unit winds up the peeled protective tape before punching out the affixing member. It is preferable to further have a protective tape take-up roll.

A protective tape is laminated on the surface of the adhesive layer provided on the tape in order to prevent dirt and unexpected attachment of an adhesive. Therefore, the protective tape is peeled off before the sticking member is punched out. At this time, since the head unit has a protective tape take-up roll, it is possible to perform the punching operation while peeling and removing the protective tape. A thermosetting adhesive is used as the adhesive layer. Since the adhesive layer does not develop adhesion unless it is heated, even if the protective tape is peeled off, the presence of the adhesive layer does not affect the transfer and punching of the tape.

[9] In the affixing apparatus of the present invention, the substrate feeding mechanism includes a substrate feeding roll for feeding the long substrate wound into a roll onto the heating table, and It is preferable to further have a substrate take-up roll for taking up the substrate.

Since the substrate delivery roll and the substrate take-up roll are arranged on the apparatus main body side independently of the head unit, it is possible to minimize the labor involved in supplying and removing substrate material. Further, by synchronously controlling the substrate delivery roll and the substrate take-up roll, it is possible to ensure the substrate feeding accuracy.

[10] In the affixing apparatus of the present invention, the die plate is fixed to the lower surface side of the die plate base, the die plate base has a through hole through which the stripper plate can be inserted, and the The bonding surface between the die plate and the die plate base has a tape insertion hole that communicates with the through hole from the outer surface of the die plate and allows the tape to be inserted therethrough, and the lower surface of the tape insertion hole is the upper surface of the die plate. Preferably.

The joint surface between the die plate and the die plate base has a tape insertion hole communicating with the through hole from the outer surface of the die plate and through which the tape is inserted. As a result, it is possible to suppress positional deviation and floating of the tape in the width direction during tape punching. Further, when the tape is set in the tape punching mechanism, if the tape is inserted through the tape insertion hole in advance, it is possible to easily set a thin film tape having a thickness of, for example, 10 μm to 50 μm in the tape punching mechanism. becomes possible.

[11] The lamination apparatus of the present invention further includes a pressing device disposed between the heating table and the substrate take-up roll for sandwiching and pressing the substrate to which the lamination member is affixed. preferably.

The sticking member punched out from the tape is pressed and stuck to the substrate by a punch. Therefore, a pressing device is further provided for sandwiching and pressing the board to which the sticking member is stuck, and when the sticking in the sticking area is completed, the sticking area is collectively pressed to roll up the board. It is possible to prevent the sticking member from being peeled off from the substrate or being misaligned. Since the pressing operation by the pressing device can be performed between the punching operation and the sticking operation of the sticking member, it does not affect the tact time.

[12] A pasting method in which the pasting member is punched out from the tape having the adhesive layer and pasted onto the substrate using the pasting device according to any one of [1] to [11] above. a step of heating the heating table to a temperature at which the adhesive layer can be adhered; A step of capturing an image of each one and specifying the sticking position; a step of adjusting the mold to a predetermined posture when sticking the sticking member; and a step of moving the mold to the specified sticking position. a step of punching out the pasting member from the tape while the punched portion of the pasting member of the tape is vacuum-adsorbed by the punch; a step of pasting the pasting member to the substrate; It is characterized by including a step of canceling the adsorption and a step of raising the punch.

In addition, the sticking member punching part refers to the position of the sticking member before punching out from the tape. In such a bonding method, first, the heating table is heated to a temperature at which the adhesive layer can be bonded, the imaging device is scanned over the substrate, and a plurality of alignment marks provided corresponding to the bonding positions are scanned. The attachment position is specified by taking an image of each one. Then, after the mold is adjusted to a predetermined posture for affixing the specified sticking member, the mold is moved to the specified sticking position, and while vacuum-sucking the punched part of the sticking member of the tape with a punch, An attachment member is punched out from the tape and the attachment member is attached to the substrate. After pasting, raise the punch. According to such an affixing method, it is possible to affix an affixing member to a large number of affixing positions that are regularly or irregularly arranged in the feed direction and the width direction of the substrate, thereby significantly improving productivity. It becomes possible to

[13] In the affixing method of the present invention, after the step of affixing the affixing member in the affixing target area of the substrate is completed, the step of transferring the affixing area to which the affixing member is affixed to a pressing device. and further pressing the substrate to which the sticking member is stuck with an upper pressing plate and a lower pressing plate.

According to this attaching method, the pressing device further presses the substrate to which the attaching member is attached, so that when the substrate is taken up by the substrate take-up roll, the attaching member may be peeled off from the substrate or misaligned. You can prevent it from happening. The pressing operation by the pressing device does not affect the tact time because it is performed during the sticking operation of the sticking member by the tape punching mechanism.

FIG. 2 is a diagram showing a part of a long tape 2 that is a material to be formed by punching the sticking member 1. FIG. 3 is a plan view showing a portion of the substrate 3; FIG. 2 is a perspective view showing a schematic configuration of the entire sticking device 20. FIG. 2 is a front view showing the configuration of a head unit 23; FIG. 5 is a rear view of the head unit 23 as seen from the rear side of the main plate 50 shown in FIG. 4. FIG. FIG. 5 is a cross-sectional view of the tape punching mechanism 24 taken along the line AA shown in FIG. 4; 4 is a top plan view of a die plate 40 and a die plate base 42 corresponding to the lower mold of the mold 55. FIG. FIG. 8 is a cross-sectional view taken along the line AA shown in FIG. 7; FIG. 8 is a cross-sectional view taken along the line BB shown in FIG. 7; 4 is a plan view showing an alignment structure between a die plate 40 and a stripper plate 71; FIG. FIG. 11 is a cross-sectional view taken along the line AA shown in FIG. 10; It is a process flow figure which shows the main processes of the sticking method. FIG. 10 is an explanatory diagram for explaining a process of specifying a sticking position 8; FIG. 10 is a diagram showing a state in which a mold 55 has been moved to an affixing position; FIG. 2 is a diagram showing a state in which the sticking member 1 is punched out from the tape 2; FIG. 3 is a diagram showing a state in which the sticking member 1 is stuck to the substrate 3; Fig. 3 is a plan view showing a part of the substrate 3 to which the sticking member 1 is stuck;

A sticking device 20 and a sticking method using the sticking device 20 according to an embodiment of the present invention will be described below with reference to FIGS. 1 to 17. FIG. Each drawing described below is a schematic diagram in which a part of the shape is simplified, exaggerated, or partly omitted. Also, the scale of each figure is different.

[Structure of tape 2 and substrate 3]
First, the structure of the tape 2 that is the material of the sticking member 1 and the substrate 3 that is the member to be stuck onto which the sticking member 1 punched out from the tape 2 is stuck will be described.

FIG. 1 is a diagram showing a part of a long tape 2 that is a material from which the sticking member 1 is punched. FIG. 1(a) is a plan view, and FIG. 1(b) is a sectional view taken along line AA in FIG. 1(a). The tape 2 has a width that allows the attachment member 1 to be punched out, and has a thickness of, for example, 10 μm to 50 μm. The tape 2 includes a base tape 4 having heat resistance such as polyimide (PI), a thermosetting adhesive layer 5 laminated on one surface of the base tape 4, and a protective tape 6 for protecting the adhesive layer 5. It consists of The tape 2 has such flexibility that it can be wound into a roll. Before the sticking member 1 is punched out from the tape 2, at least the protective tape 6 at the punched portion is peeled off.

Accordingly, the punched sticking member 1 is composed of the base tape 4 and the adhesive layer 5 . The sticking member 1 can have a function as a coverlay film for the substrate 3 and a function such as reinforcement or insulation. It may be made of metal. Arrows in the drawing indicate the feeding direction of the tape 2 . Moreover, the shape of the sticking member 1 shown in FIG. 1( a ) is an example and is not limited to this, and it is possible to correspond to any shape according to the function of the sticking member 1 . In the following description, the adhesive layer 5 laminated on the base tape 4 may be referred to as the tape 2 .

2A and 2B are diagrams showing a part of the substrate 3, FIG. 2A is a plan view, and FIG. 2B is an enlarged view of the area surrounded by the dotted line A in FIG. It is a figure explaining. An example of the substrate 3 shown in FIG. 2 is a long, wide tape-shaped substrate having a width of 250 mm, such as a flexible wiring substrate. The substrate 3 has such a thickness and flexibility that it can be wound into a roll. The substrate 3 shown in FIG. 2 is an example in which four product units 7 are aligned vertically and horizontally to form a single product by being cut after the sticking member 1 is attached. However, this arrangement is only an example and is not particularly limited, and can be set as appropriate, such as a larger number or a smaller number. In some cases, they may not be aligned vertically or horizontally. In FIG. 2, the upper side of the paper (the surface shown) is the front side, and the back side is the back side.

Affixing positions 8 are indicated on the product unit 7 . The sticking position 8 is a range surrounded by a circle in the illustrated example, and represents a stickable range of the sticking member 1 . The surface of the attachment position 8 can be formed by removing the uppermost film if the substrate 3 is a laminated wiring board, and a part of the wiring pattern (not shown) is formed on the surface of the attachment position 8. expose. A cross-shaped alignment mark 9 is formed at the attachment position 8 . The position and shape of the alignment mark 9 are not limited to the example shown in FIG. For example, the alignment marks 9 may be arranged at two spaced apart locations in the product unit 7, and if a portion of the wiring pattern or the like can be identified, the alignment marks can be used.

As shown in FIG. 2B, the sticking member 1 is stuck at a predetermined position in the sticking position 8 in a predetermined posture. A sticking region 10 surrounded by a virtual line in FIG. 2 is one unit of a sticking process (pressing process) of the sticking member 1 to be described later. Details will be described in the section of the attaching method, but after attaching the attaching members 1 to all the 16 product units 7, the substrate 3 is transferred to the next attaching area 10. FIG. Therefore, this one unit becomes one cycle of the sticking (pressing) process. That is, when the attachment of the attachment member 1 is completed in the attachment area 10 shown in FIG. Arrows in the drawing indicate the feeding direction of the substrate 3 . In FIG. 2A, the length direction (feeding direction) of the substrate 3 is the X axis, and the width direction is the Y axis.

[Configuration of the sticking device 20]
FIG. 3 is a perspective view showing a schematic configuration of the entire sticking device 20. As shown in FIG. In the following description, the longitudinal direction of the bonding apparatus 20 shown in FIG. Description will be made with the Z axis or the vertical direction, and the rotation axis with the Z axis as the center of rotation as the θ axis. A main mechanism of the sticking device 20, which will be described later, is arranged above a base 21 in which a control device, a compressed air supply device, and the like (not shown) are housed.

The bonding device 20 is arranged above a heating table 22 that heats the substrate 3 while supporting the back surface of the substrate 3 , and above the heating table 22 , that is, with a gap above the front surface of the substrate 3 . and a head unit 23 . The head unit 23 has a tape punching mechanism 24 for punching the sticking member 1 from the tape 2 and sticking the stamped sticking member 1 to a predetermined position on the substrate 3 . Detailed configurations of the head unit 23 and the tape punching mechanism 24 will be described later with reference to FIGS. 4 to 6. FIG.

The pasting device 20 includes, as a head unit moving mechanism, an X-axis drive mechanism 25 that moves the head unit 23 in the X-axis direction parallel to the upper surface of the heating table 22, and a Y-axis drive mechanism that moves the head unit 23 in the Y-axis direction. 26, 26, a Z-axis drive mechanism 27 that moves the head unit 23 in the Z-axis direction, and a θ-axis drive mechanism 28 that rotates the head unit 23 around the Z-axis. Further, the head unit 23 has a tape feeding mechanism 29 that intermittently feeds the tape 2 to the tape punching mechanism 24 . Therefore, the tape feed mechanism 29 can move in the X-, Y-, and Z-axis directions integrally with the head unit 23, and can rotate about the Z-axis. In the example shown in FIG. 3, the X-axis drive mechanism 25 and Y-axis drive mechanism 26 use ball screw mechanisms as drive sources, and the Z-axis drive mechanism 27 and θ-axis drive mechanism 28 use servo motors as drive sources. there is A detailed description of the tape feeding mechanism 29 will be given later with reference to FIG. The attaching device 20 also has a substrate feeding mechanism 30 that feeds the substrate 3 between the tape punching mechanism 24 and the heating table 22 .

The substrate feeding mechanism 30 has a substrate feeding roll 31 arranged at the left end of the head unit 23 in the X-axis direction in the drawing, and a substrate take-up roll 32 arranged at the right end. there is The substrate take-up roll 32 intermittently transports the substrate 3 rightward in the drawing while applying a constant tension to the substrate 3 . Specifically, as shown in FIG. 2, the transfer of the substrate 3 is stopped during the bonding operation in the bonding area 10, and when one cycle of the bonding operation in the bonding area 10 is completed, the next bonding area 10 is moved. The substrate 3 is transferred to and stopped. The substrate take-up roll 32 is driven by a servomotor (not shown) provided within the drive device 36 . A pressing device 33 is arranged between the heating table 22 and the substrate take-up roll 32 . The pressing device 33 has an upper pressing plate 34 and a lower pressing plate 35. Between the upper pressing plate 34 and the lower pressing plate 35, the substrate 3 to which the attaching member 1 is attached in the head unit 23 is placed. It is a device that passes through and presses the entire inside of the pasting area 10 again. Therefore, since the pressing device 33 performs the pressing operation while the transfer of the substrate 3 is stopped, it does not affect the tact time. However, the pressing device 33 can be omitted if it can be confirmed that a sufficient adhesive strength of the sticking member 1 can be obtained in the head unit 23 . In addition, the arrow shown in FIG. 3 represents the feed direction of the board|substrate 3. As shown in FIG.

FIG. 4 is a front view showing the configuration of the head unit 23. As shown in FIG. The head unit 23 is composed of a tape punching mechanism 24 and a tape feeding mechanism 29 . The tape punching mechanism 24 has a die plate 40, a die plate base 42 for fixing and supporting the die plate 40, a stripper 43, a punch 44 (see FIG. 6), and an air cylinder 56 as a punch driving mechanism. The die plate base 42 and the air cylinder 56 are fixed to the head block 41 , and the head block 41 is fixed to the main plate 50 . The die plate 40 may be generally called a die. Moreover, the stripper 43 is a so-called movable stripper.

The tape feeding mechanism 29 includes a tape feeding roll 45 that feeds the long tape 2 wound in a roll shape to the tape punching mechanism 24, and a tape winding roll 46 that winds the tape 2 from which the pasting member 1 has been punched. have. A nip roll 47 for intermittently feeding the tape 2 to the tape take-up roll 46 side is arranged between the tape take-up roll 46 and the tape punching mechanism 24 . Further, the tape feeding mechanism 29 has a protective tape take-up roll 48 that separates and winds the protective tape 6 from the tape 2 wound around the tape delivery roll 45 . The tape delivery roll 45 , the tape winding roll 46 and the protective tape winding roll 48 are controlled to rotate in synchronization with the intermittent tape feeding operation of the nip roll 47 . A pair of rollers 49, 49 are arranged in front and behind the tape feeding direction of the tape punching mechanism 24, and the height position and the width direction position are adjusted so that the tape 2 follows the upper surface of the die plate 40 while applying tension to the tape 2. is regulated. In FIG. 4, the feeding directions of the tape 2 and protective tape 6 are indicated by arrows.

The tape punching mechanism 24, the tape delivery roll 45, the tape take-up roll 46, the nip roll 47, and the rollers 49, 49 are arranged on the same side of the main plate 50, and integrally extend in the X-axis direction, the Y-axis direction, and the Y-axis direction. It is configured to be able to move in the Z-axis direction and rotate around the Z-axis. The example shown in FIG. 4 represents a state during substrate feeding with a gap of about 20 mm between the die plate 40 and the substrate 3 supported on the heating table 22 .

FIG. 5 is a rear view of the head unit 23 viewed from the rear side of the main plate 50 shown in FIG. An imaging device 51 is attached to the back surface of the main plate 50 . The image pickup device 51 is, for example, a CCD camera, picks up an image of the alignment marks 9 provided on the substrate 3 described above, and specifies the position of each alignment mark. The optical axis P of the imaging device 51 is parallel to the main plate 50, perpendicular to the heating table 22, and fixed at a constant distance from the central axis of the punch 44 (see FIG. 6). there is The imaging device 51 moves while maintaining a constant distance from the tape punching mechanism 24 . Therefore, the imaging device 51 does not change its relative positional relationship with the tape punching mechanism 51 even if the head unit 23 moves. The sticking position of the sticking member 1 is specified from the position of the alignment mark 9 specified by the imaging device 51 , and the tape punching position by the tape punching mechanism 24 , that is, the die plate 40 and the punch 44 (see FIG. 6 ) is the sticking position 8 . match the Next, the configuration of the tape punching mechanism 24 will be described with reference to FIG.

FIG. 6 is a cross-sectional view of the tape punching mechanism 24 cut along the line AA shown in FIG. Note that FIG. 6 shows the state before the tape is punched out. The tape punching mechanism 24 includes a die 55 composed of a punch 44 as an upper die, a die plate 40 as a lower die, and a stripper 43, and an air cylinder 56 as a punch driving mechanism for moving the punch 44 and the stripper 43 up and down. have. The air cylinder 56 is vertically fixed to the top plate portion 57 of the head block 41 . That is, the air cylinder 55 drives the punch 44 and stripper 43 in the direction perpendicular to the surface of the heating table 22 .

The air cylinder 56 is a single acting cylinder having a piston 59 inside a cylinder tube 58 . The air cylinder 56 has L-shaped air supply pipes 60 and 61, and supplies air from the air supply pipe 60 through an air passage 62 to push down the piston 59 toward the top dead center (virtual line in the figure). ). On the other hand, by supplying air from the air supply pipe 61, the piston 59 is pushed up toward the bottom dead center. The piston 59 is connected to the guide plate 64 via the connecting member 63 . The connecting member 63 has one end screwed to the piston rod 65 and the other end fitted to the punch fixing block 66 fixed to the guide plate 64 . An air suction pipe 67 is arranged in the connecting member 63 . The air suction pipe 67 communicates with a vacuum suction path 68 provided in the connecting member 63 and the punch fixing block 66 , and the vacuum suction path 68 communicates with a suction hole 69 axially penetrating the punch 44 . The suction holes 69 vacuum-suck the punched sticking member 1 so that the sticking member 1 does not deviate in position or posture during the movement from punching the sticking member 1 to sticking to the substrate 3 . the vacuum adsorption. The guide plate 64 is sometimes called a punch holder because it fixes the punch 44 . The air supply pipes 60 and 61 shown in FIG. 6 are actually arranged in the X-axis direction of the cylinder tube 58 .

The punch 44 is axially fixed to the guide plate 64 and reinforced by a punch fixing block 66 so as not to slip out of the guide plate 64 when the tape 2 is punched and when the sticking member 1 is stuck to the substrate 3 . The punch 44 penetrates the guide plate 64 , the upper plate 70 of the stripper 43 and the stripper plate 71 , punches the sticking member 1 from the tape 2 , and moves to a position where the sticking member 1 thus punched is stuck to the substrate 3 . The end face of the punch 44 on the heating table 22 side is a pressing surface 72 for pressing the pasted member 1 against the substrate 3 .

The punch 44 punches out the sticking member 1 from the tape 2 and presses it against the substrate 3 . When the punch 44 presses (sticks) the sticking member 1 onto the substrate 3, a pressing force is applied to the substrate 3 (including the sticking member 1). The substrate 3 may be compressed by this pressing force. If this amount of compression becomes too large, the substrate 3 will be warped or deformed. Moreover, the sticking member 1 cannot be stuck unless it comes into contact with the substrate 3 . The lower limit position (the position closest to the substrate 3 ) of the pressing surface 72 of the punch 44 is defined by the top dead center of the piston 59 and the attachment position of the air cylinder 56 to the head unit 23 . Since the air cylinder 56 of this example is a single-acting cylinder, the stroke of the piston 59 is constant. Therefore, the Z-axis driving mechanism 27 is used to adjust the distance of the head unit 23 from the heating table 22 to a position where the substrate is not compressed too much or cannot be pressed, and the position is fixed.

The die plate 40 is fixed to the lower surface of the die plate base 42 , and the die plate base 42 is fixed to the lower end surface of the head block 41 . In the die 55 , the die plate 40 is generally fixed to the upper surface of the die plate base 42 . Since the die plate 40 is pressed, the die plate 40 is fixed to the lower surface of the die plate base 42 in order to suppress the punch stroke after punching. The position of the die plate 40 is defined with respect to the die plate base 42 by four positioning pins 73 (see FIG. 7) erected on the die plate base 42, and is firmly fixed by fixing members such as screws (not shown). be done.

The stripper 43 has an upper plate 70 that fixes the stripper 43 itself to the guide plate 64 , a stripper plate 71 that presses the tape 2 against the die plate 40 , and stripper bolts 74 that connect the upper plate 70 and the stripper plate 71 . The upper side of the stripper bolt 74 is inserted through the upper plate 70 and the lower side thereof is screwed to the stripper plate 71 . The head 75 of the stripper bolt 74 regulates the movement of the stripper plate 71 toward the die plate 40 . A spring 76 is arranged between the upper plate 70 and the stripper plate 71 so as to wind the stripper bolt 74 . The stripper bolts 74 are arranged at the four corners of the stripper plate 71 (see FIG. 10). A guide pin pressing plate 90 is fixed to the stripper plate 71 with screws 91 . The guide pin holding plate 90 is provided to prevent the removal of guide pins 92 (see FIGS. 10 and 11) that regulate the positions of the stripper plate 71 and the die plate 40, which will be described later.

When the guide plate 64 is pushed down by the piston 59 , the upper plate 70 descends together with the guide plate 64 , and the stripper plate 71 presses the tape 2 against the die plate 40 with the biasing force of the spring 76 . When the guide plate 64 is lifted by the piston 59 , the upper plate 70 and the stripper bolt 74 are lifted together with the guide plate 64 , the stripper plate 71 is lifted to release the pressure of the tape 2 , and the gap between the stripper plate 71 and the die plate 40 is released. A clearance is formed through which the tape 2 can be sent.

Guide posts 77 are fixed to the four corners in the planar direction of the die plate base 42 (see FIG. 7). The guide post 77 is inserted through a guide bush 78 provided on the guide plate 64 . Guide posts 77 determine the position of guide plate 64 relative to die plate base 42 . 6 shows a state in which the stripper plate 71 presses the tape 2. As shown in FIG. The tip of the punch 44 on the die plate 40 side is formed to have the outer shape of the sticking member 1 and is inserted through the punch insertion hole 79 of the stripper plate 71 . The smaller the clearance between the punch insertion hole 79 and the punch 44, the more accurately the adhesive member 1 can be formed. Next, configurations of the die plate 40 and the die plate base 42 will be described with reference to FIGS. 6 and 7 to 9. FIG.

FIG. 7 is a top plan view illustrating the die plate 40 and the die plate base 42 corresponding to the lower mold of the mold 55. FIG. 8 is a cross-sectional view taken along line AA shown in FIG. 7, and FIG. 9 is a cross-sectional view taken along line BB shown in FIG. 7 to 9 show the state in which the tape 2 is inserted between the die plate 40 and the die plate base 42, and the stripper plate 71 is shown by imaginary lines. In addition, in FIG.8 and FIG.9, the thickness direction is exaggerated and described.

The die plate 40 has a punch hole 80 for punching out the sticking member 1 from the tape 2 in its central portion, and is fixed to the lower surface 42 a of the die plate base 42 . A rectangular through hole 81 is formed in the center of the die plate base 42 , and the punch holes 80 and the tape 2 are exposed inside the through hole 81 . A stripper plate 71 is inserted into the through hole 81 , and the stripper plate 71 moves up and down within the through hole 81 . A groove 82 through which the tape 2 can be inserted is formed in the lower surface 42 a of the die plate base 42 along the feeding direction of the tape 2 .

The groove 82 serves as a tape insertion hole 83 in the range where the die plate base 42 and the die plate 40 intersect vertically. The tape insertion holes 83 are arranged on both sides of the punch hole 80 in the X-axis direction. By inserting the tape 2 through the tape insertion hole 83 , the widthwise central portion of the tape 2 is positioned so as to intersect substantially the central portion of the punch hole 80 . Since the lower surface of the tape insertion hole 83 is aligned with the upper surface 40a of the die plate 40, the tape can be fed without any trouble.

The tape insertion hole 83 shown in FIGS. 7 to 9 is formed by forming the groove 82 in the die plate base 42 and fixing the die plate 40. It may be configured by fixing the plate base 42 . Alternatively, it is also possible to form the tape insertion hole 83 by interposing a spacer between the die plate 40 and the die plate base 42 .

As shown in FIGS. 6 and 7, four guide posts 77 are erected on the die plate base 42, and the guide posts 77 guide the guide plate 64 axially movably. Further, the position of the die plate 40 is restricted with respect to the die plate base 42 by four positioning pins 73 erected on the die plate base 42 . Thus, the positions of the die plate base 42 and the guide plate 64 and the positions of the die plate 40 and the die plate base 42 are regulated. In this embodiment, the tape 2 is a thin resin tape such as polyimide having a thickness of 10 μm to 50 μm. The stripper 43 presses the periphery. Therefore, the smaller the clearance between the punch 44 and the punch insertion hole 79 of the stripper plate 71, the better. This will be described with reference to FIGS. 10 and 11. FIG. The relative positions of the die plate 40 and the punch 44 are aligned with high accuracy during tooling.

10 is a plan view showing the alignment structure between the die plate 40 and the stripper plate 71. FIG. FIG. 11 is a cross-sectional view taken along line AA shown in FIG. Four guide pins 92 are erected on the stripper plate 71 . The guide pin 92 has a collar 92a. The collar 92a is held by a guide pin holding plate 90 so as not to come off from the stripper plate 71. As shown in FIG. The guide pin pressing plate 90 is fixed to the stripper plate 71 with two screws (see FIG. 6). As shown in FIG. 11, the guide pin 92 is inserted into a guide hole 93 provided in the die plate 40 so as to be able to advance and retreat, and moves up and down as the stripper plate 71 moves up and down. With such a configuration, the stripper plate 71 can move up and down while maintaining its planar position with respect to the die plate 40 with high accuracy.

The sticking device 20 described above is a sticking device that punches out the sticking members 1 from the tape 2 having the thermosetting adhesive layer 5 and sticks them to a plurality of sticking positions 8 on the substrate 3 . The attaching device 20 includes a heating table 22 that heats the substrate 3 while supporting the back surface of the substrate 3, a head unit 23 that is arranged with a gap above the front surface of the substrate 3, and a heating table. 22 and the head unit 23, a substrate feeding mechanism 30 for feeding the substrate 3 is provided. The head unit 23 corresponds to a tape punching mechanism 24 having a die 55 consisting of a punch 44 and a die plate 40, a tape feeding mechanism 29 to feed the tape 2 between the punch 44 and the die plate 40, and the sticking position 8. and an imaging device 51 for picking up images of the alignment marks 9 provided one by one and specifying the sticking position 8 of the sticking member 1 from the positions of the alignment marks 9 . Further, the lamination device 20 moves the mold 55 to the lamination position 8 in accordance with the posture of the lamination member 1 during lamination, and moves the head unit to define the gap between the substrate 3 and the die plate 40. and a punch drive mechanism 54 for punching the sticking member 1 from the tape 2 and moving the punch 44 to a height position where the sticking member 1 thus punched can be stuck to the substrate 3 .

In the above-described prior art, the mold is fixed to the main body of the apparatus. It is designed to be freely movable. The head unit 23 identifies the attachment position 8 by scanning the imaging device 51 and capturing an image of each of the alignment marks 9 provided corresponding to the attachment position 8 . The head unit 23 aligns the die 55 with the attitude of the sticking member 1 at the time of sticking, moves the die to the specified sticking position, drives the punch 44 to punch out the sticking member 1 from the tape 2, and furthermore. The stroke of the punch 44 is extended to press the sticking member 1 against the substrate 3 .

According to such a sticking device 20, in the sticking device described in Patent Document 1, the sticking member 1 is punched out in a row in the longitudinal direction of the long tape 2, and the sticking member 1 is punched onto the long substrate 3. It is pasted in one line. On the other hand, according to the attaching device 1, the attaching member 1 can be attached to a large number of attaching positions 8 that are regularly or irregularly arranged in the feed direction and the width direction of the substrate 3, and the tact time is reduced. can be shortened and productivity can be significantly improved.

The head unit moving mechanism includes an X-axis driving mechanism 25 that moves the head unit 23 in the X-axis direction parallel to the upper surface of the heating table 22, and a Y-axis driving mechanism 25 that moves the head unit 23 in the direction parallel to the upper surface of the heating table 22 and perpendicular to the X axis. It has a Y-axis drive mechanism 26 that moves in the axial direction, a Z-axis drive mechanism 27 that moves in a direction perpendicular to the XY plane, and a θ-axis drive mechanism that rotates around the Z-axis.

The head unit moving mechanism moves the mold 55 to the specified sticking position 8 by the X-axis driving mechanism 25 and the Y-axis driving mechanism 26 . The Z-axis moving mechanism 27 controls the mold 55 to a height position at which the attaching member 1 can be attached to the substrate 3 and at a height position at which the substrate can be fed. The .theta.-axis drive mechanism 28 adjusts the posture of the mold 55 to the posture of the sticking member 1 at the time of sticking. With such a configuration, the sticking member 1 can be stuck to the specified sticking position 8 on the substrate 3 in an appropriate posture.

The punch 44 also has a suction hole 69 that vacuum-sucks the surface of the sticking member 1 and a pressing surface 72 that presses the sticking member 1 against the substrate 3 . As described above, since the punch 44 has the suction holes 69 , the sticking member 1 punched out from the tape 2 is vacuum-sucked until the sticking member 1 is stuck to the substrate 3 . As a result, it is possible to transport and attach the attaching member 1 to the substrate 3 without positional deviation. Further, since the punch 44 has the pressing surface 72 and the external shape of the sticking member 1 is the same as the external shape of the punch 44, the whole sticking member can be uniformly pressed.

The punch driving mechanism 54 also has an air cylinder 56 for moving the punch 44 up and down, and a connecting member 63 for connecting a piston 59 of the air cylinder 56 and a guide plate 64 holding the punch 44 . , a vacuum suction path 68 to which the suction holes 69 communicate.

If the air cylinder 56 is used as the driving source of the punch driving mechanism 54, the punching force of the tape 2 within the range of the driving stroke of the air cylinder 56, and the air damper-like property of the air cylinder when affixing the attaching member 1 to the substrate 3 are obtained. can be used to prevent the substrate 3 from being damaged. In addition, the air cylinder 56 can be unitized with a simple structure, and the tape punching mechanism 24 can be miniaturized. Since the connecting member 63 is provided with the vacuum suction path 68 communicating with the suction holes 69, it is possible to stably perform the vacuum suction of the sticking member 1 even if the punch 44 moves up and down.

The Z-axis driving mechanism 27 also controls the heating table of the air cylinder 56 so that the lower limit position of the pressing surface 72 is within the range of the allowable compression value of the substrate 3 when the punch 4 presses the attaching member 1 against the substrate 3 . Adjust the position from 22 and fix it.

When the punch 44 presses (sticks) the sticking member 1 onto the substrate 3, a pressing force is applied to the substrate 3. If this pressing force exceeds the allowable amount of compression of the substrate 3, the substrate 3 warps. or deformation occurs. The Z-axis is driven so that the lower limit position (the position closest to the heating table 22 ) of the pressing surface 72 is within the allowable compression amount of the substrate 3 when the punch 44 presses the attaching member 1 against the substrate 3 . The position of the air cylinder 56 from the heating table 22 is adjusted and fixed by the mechanism 27 . As a result, it is possible to prevent the substrate 3 from being warped or deformed due to excessive compression of the substrate 3, or from being unable to be pressed.

The pasting device 20 further has a stripper 43 that presses the tape 2 against the die plate 40 around the punch 44 when the pasting member 1 is punched out from the tape 2 by the punch 44. The stripper 43 presses the tape 2 onto the die plate. 40 , springs 76 that urge the stripper plate 71 toward the die plate 40 , and guide pins 92 that can be inserted into guide holes 93 provided in the die plate 40 .

By providing the stripper 43, the biasing force of the spring 76 presses the tape 2 with an appropriate pressing force so that the tape 2 is free from wrinkles and slack, and the tape 2 can be punched out. Further, by providing the guide pin 92, it is possible to suppress the displacement of the stripper 43 with respect to the die plate 40, suppress the clearance from the punch 44, and form the joining member 1 with small sag and fracture surface. .

The tape feeding mechanism 29 includes a tape feeding roll 45 that feeds the long tape 2 wound in a roll shape between the punch 44 and the die plate 40, and a tape winding that winds the tape 2 from which the pasting member 1 is punched. It has a take-up roll 46 and a nip roll 47 which is arranged between the tape take-up roll 46 and the head unit 23 and feeds the tape 2 to the tape take-up roll 46 side.

Since the tape feed mechanism 29 has a tape feed roll 45, a tape take-up roll 46, and a nip roll 47, it is possible to feed the tape 2 intermittently at a predetermined feeding pitch while applying an appropriate tension to the tape 2. Become. Also, by arranging the nip rolls 47, the thin and flexible tape 2 can be fed at a determined pitch.

The tape 2 has a protective tape 6 for protecting the adhesive layer 5, and the head unit 23 further has a protective tape take-up roll 48 for taking up the peeled protective tape 6 before punching out the sticking member 1. is doing. A protective tape 6 is laminated on the surface of the adhesive layer 5 provided on the tape 2 in order to prevent dirt and unexpected adhesion of adhesives. Therefore, the protective tape 6 is peeled off before the sticking member 1 is punched out. At this time, since the head unit 23 has the protective tape take-up roll 48 , it is possible to perform the punching operation while peeling off the protective tape 6 . In addition, since the adhesive layer 5 is a thermosetting adhesive, the adhesive layer 5 does not generate adhesive force unless it is heated after the protective tape 6 is peeled off. The presence of the adhesive layer 5 does not affect the time.

Further, the substrate feeding mechanism 30 includes a substrate feeding roll 31 for feeding the long substrate 3 wound in a roll shape onto the heating table 22, and a substrate winding roll for winding the substrate 3 to which the attaching member 1 is adhered. 32. Since the substrate delivery roll 31 and the substrate take-up roll 32 are arranged on the apparatus main body side independently of the head unit 23, it is possible to minimize the labor involved in feeding and removing the substrate 3. Become. Further, by synchronously controlling the substrate delivery roll 3 and the substrate take-up roll 31, it is possible to secure the feeding accuracy of the substrate 3. FIG.

The die plate 40 is fixed to the lower surface 42a side of the die plate base 42. The die plate base 42 has a through hole 81 through which the stripper plate 71 can be inserted. The bonding surface of the die plate 40 has a tape insertion hole 83 that communicates with the through hole 81 from the outer surface of the die plate 40 and allows the tape 2 to be inserted therethrough.

When the punch 44 is the upper die, the die plate 40 and the die plate 42 are the lower die. A joint surface between the die plate and the die plate base has a tape insertion hole communicating with the through hole from the outer surface of the die plate and through which the tape is inserted. As a result, it is possible to suppress positional deviation and floating of the tape in the width direction during tape punching. Further, when the tape is set in the tape punching mechanism, if the tape is inserted through the tape insertion hole in advance, it is possible to easily set a thin film tape having a thickness of, for example, 10 μm to 50 μm in the tape punching mechanism. becomes possible. Further, by providing the tape insertion hole 83 in the lower mold, it is possible to suppress the positional deviation and floating of the tape 2 in the width direction at the time of tape punching. Furthermore, by aligning the lower surface of the tape insertion hole 83 with the upper surface 40a of the die plate 40, the flat tape 2 can be punched out.

The attaching device 20 further includes a pressing device 33 which is arranged between the heating table 22 and the substrate take-up roll 32 and which sandwiches and presses the substrate 3 to which the attaching member 1 is attached. The sticking member 1 punched out from the tape 2 is pressed and stuck to the substrate 3 by the punch 44 . Therefore, when the sticking member 1 has been stuck to the sticking region 10 , the sticking region 10 is collectively pressed by the pressing device 33 , so that the sticking member 1 is peeled off from the substrate 3 when the substrate 3 is wound. It is possible to prevent occurrence of misalignment. Since the pressing operation by the pressing device 33 can be performed between the punching operation and the attaching operation of the adhesive member 1, it does not affect the tact time. Incidentally, if it can be confirmed that a sufficient adhesive force can be obtained when the sticking member 1 is stuck by the punch 44, the pressing device 33 can be omitted. Next, a pasting method using the pasting device 20 will be described.

[Paste method]
FIG. 12 is a process flow diagram showing the main steps of the sticking method using the sticking device 20. As shown in FIG. Description will be made with reference to FIGS. 13 to 17 along the process flow of FIG. 13 to 17 are diagrams for explaining each step, and are schematic diagrams showing the constituent elements in a simplified manner. First, as preparatory work for starting the operation of the attaching device 20 , the tape 2 is set in the tape feeding mechanism 29 and the substrate 3 is set in the substrate feeding mechanism 30 . At that time, the tape 2 is passed through the tape insertion hole 83 and wound around the tape take-up roll 46 via the tape insertion hole 83 and the nip roll 47 from the tape delivery roll 45 .

The substrate feeding mechanism 30 sets the position of the substrate 3 so that all the alignment marks 9 in the bonding area 10 are within the field of view of the imaging device 51 when the imaging device 51 is scanned within the bonding region 10 . . The heating table 22 is heated when the tape 2 and the substrate 3 are set on the bonding device 20 (step S1). The heating temperature is the temperature at which the adhesive layer 5 of the tape 2 is softened and can be adhered. Subsequently, the imaging device 51 is scanned over the substrate 3 to identify the attachment position 8 .

13A and 13B are explanatory diagrams for explaining the process of specifying the sticking position 8. FIG. First, the imaging device 51 is moved to the initial position P0. Although the initial position P0 is the center of the pasting area 10 in FIG. 13, the initial position P0 can be any specific position. For example, it may be one of the alignment marks 9 . The initial position P0 is a reference position that serves as a starting point for scanning the imaging device 51 . Next, the imaging device 51 is scanned in the direction of the illustrated arrow from the initial position P0 to image the alignment mark 9, and the position (coordinates, for example) of the alignment mark 9 is specified from the movement direction and movement distance of the imaging device 51 by image processing. (step S2).

If the position (coordinates) of the initial position P0 is specified, the position (coordinates) of each alignment mark 9 can be specified from the moving direction and moving distance of the imaging device 51 . Scanning of the imaging device 51 is controlled by a program, and the scanning path is not limited, but is preferably programmed to shorten the scanning trajectory. The specified pasting position 8 is stored in a storage device of the controller (not shown). Further, if the positional relationship between the bonding position 8 and the alignment mark 9 is specified in advance, the bonding position 8 and the alignment mark 9 do not have to match each other. The affixing position 8 referred to here refers to a predetermined position where the affixing member 1 is actually affixed. 13, the thick arrow indicates the feeding direction of the substrate 3. As shown in FIG.

Subsequently, the head unit 23 is rotated to align the mold 55 with the posture (inclination with respect to the X-axis or the Y-axis) when the attaching member 1 is attached (step S3). For example, when the sticking member 1 is rotated by 90 degrees from the posture shown in FIG. Since the posture of the sticking member 1 at the time of sticking is known in advance by design, steps S2 and S3 may be exchanged. That is, after adjusting the mold 55 to the posture at the time of sticking the sticking member 1 , the sticking position 8 may be specified by scanning the imaging device 51 . If the orientation of the sticking member 1 is not constant in one substrate 3, the head unit 23 is rotated by the posture control program each time, and the punch 44 (or the punch hole 80) of the die 55 is aligned with the sticking member 1. It should match the posture of Also, in the case of attaching an attaching member having a new shape to a new substrate, the attaching device 20 can be applied by exchanging the mold 55 with one having a new shape for the attaching member 1 . Subsequently, the head unit 23 is moved to move the mold 55 to the identified sticking position 8 (step S4).

FIG. 14 is a diagram showing a state in which the mold 55 has been moved to the affixing position 8. As shown in FIG. In this state, the stripper plate 71 is in a remote position not pressing the tape 2 . Also, the punch 44 is at a position retracted from the tape-side surface of the stripper plate 71 . That is, it represents the state immediately before the tape punching operation in which the air cylinder 56 is not driven and the tape 2 can be transported. The distance between the die plate 40 and the substrate 3 is set so that the die plate 40 does not come into contact with the substrate 3 when the head unit 23 is moved. Subsequently, the sticking member 1 is punched out from the tape 2 while the sticking member punching portion is vacuum-sucked (step S5).

FIG. 15 is a diagram showing a state in which the sticking member 1 is punched out from the tape 2. As shown in FIG. When the sticking member 1 is punched out from the tape 2, air is sucked from the suction hole 69 of the punch 44 to vacuum-suck the sticking member punching portion, and the punch 44 is lowered by the air cylinder 56 to punch out the tape 2 (step S5). Since the spring 76 is bent by the downward stroke of the punch 44 , the stripper plate 71 strongly presses the tape 2 while smoothing out wrinkles. After punching, the punch 44 is further lowered to adhere the punched sticking member 1 to the substrate 3 (step S6).

FIG. 16 is a diagram showing a state where the sticking member 1 is stuck to the substrate 3. FIG. The punch 44 moves and presses the punched sticking member 1 against the substrate 3 while vacuum-adsorbing it. Since the substrate 3 is heated to a bonding temperature, the thermosetting adhesive layer 5 is immediately softened, and the sticking member 1 can be pressure-bonded to the substrate 3 by pressing with the punch 44 . It should be noted that the stripper plate 71 continues to press the tape 2 with the spring 76 during the steps S5 and S6. By stopping or reducing the air supply of the air cylinder 56 at the moment the tape 2 is punched out, the substrate 3 is prevented from being damaged by an excessive pressing force when the attaching member 1 is attached to the substrate 3.例文帳に追加When the pasting process is completed, the vacuum suction of the pasting member 1 is released (step S7), the punch 44 and the stripper plate 71 are lifted by the air cylinder 56 (step S8), and the next pasting position 8 is reached by the process of step S4. Move the mold 8 to .

In the affixing method described above, the tact time required from the step of moving the mold 55 to the specified affixing position (step S4) to the step of raising the punch and stripper plate 71 (step S8) is reduced to 1 second. became possible.

Steps S4 to S8 are the sticking operations of the sticking members 1 one by one. The head unit 23 , that is, the mold 55 is controlled to move following the scanning locus of the imaging device 51 . A step of transferring the substrate 3 to the next bonding area 10 and specifying the bonding position of the substrate 3 when the bonding member 1 has been completely bonded to all the product units 7 arranged in the bonding area 10 (step S2). ) to step S8 are repeated.

FIG. 17 is a plan view showing part of the substrate 3 to which the sticking member 1 is stuck. The sticking member 1 is stuck to the sticking position 8 of each product unit 7 on the substrate 3 . Even when a plurality of sticking positions 8 exist in one product unit 7 and a plurality of sticking members 1 are stuck, the sticking member 1 is stuck in the same process as in the case where there is one sticking position 8. can be attached. The same idea can also be followed when there are a plurality of sticking positions 8 in one product unit 7 and the sticking member 1 is stuck while changing its posture. For example, when the sticking member 1 is stuck to the substrate 3 in the first posture and the second posture, the following sticking method can be used.

When the sticking member 1 in the first posture is to be pasted, first, the posture of the mold 55 is adjusted to the first posture, and then the alignment mark 9 at the sticking target position in the first posture is captured by the imaging device 51. The sticking position is specified by scanning, and the sticking member 1 is stuck to the substrate 3 continuously at the specified sticking position by following the scanning locus. When the sticking member 1 in the second posture is to be pasted, the posture of the mold 55 is adjusted to the second posture, and then the alignment mark 9 of the pasting target position in the second posture is scanned by the imaging device 51 . to specify the sticking position, and the sticking member 1 is stuck to the substrate 3 continuously to the specified sticking position by tracing the scanning path.

Alternatively, after scanning all the alignment marks 9 with an imaging device to specify the pasting positions, the program discriminates the pasting target positions in the first posture and the pasting target positions in the second posture in groups. It is also possible to punch out and stick the sticking member 1 in the first posture, and then punch out and stick the sticking member 1 in the second posture.

The sticking method described above is a method of punching out the sticking member 1 from the tape 2 having the adhesive layer 5 using the sticking device 1 and sticking it to the substrate 3 . First, the heating table 22 is heated to a temperature at which the adhesive layer 5 can be adhered. Then, the attachment position is specified by scanning the imaging device 51 and imaging each alignment mark 9 . Next, after adjusting the die 55 to the specified posture for sticking the sticking member 1 , the die 55 is moved to the specified sticking position 8 , the sticking member 1 is punched out from the tape 2 , and the punch 44 remains as it is. , the sticking member 1 is stuck to the preheated substrate 3 by extending the punching stroke of . After pasting, the punch 44 and the stripper plate 71 are lifted to move the die 55 to the next pasting position 8, and a series of pasting operations are repeated.

According to the affixing method described above, it is possible to affix the affixing member 1 to a large number of affixing positions 8 that are regularly or irregularly arranged in the feed direction and the width direction of the substrate 3, thereby improving productivity. Significant improvement is possible.

Further, in the above sticking method, after the step of sticking the sticking member 1 in the sticking target area 10 of the substrate 3 is completed, the sticking area 10 to which the sticking member 1 is stuck is transferred to the pressing device 33 and stuck. The substrate 3 to which the member 1 is attached is further pressed by the upper pressing plate 34 and the lower pressing plate 35 .

According to such an attaching method, if the substrate 3 to which the attaching member 1 is attached is further pressed by the pressing device 33, the attaching member 1 is removed from the substrate 3 when the substrate 3 is taken up by the substrate take-up roll 32. It is possible to prevent peeling and misalignment. Since the application area 10 is collectively pressed and the pressing by the pressing device 33 is performed during the operation of attaching the application member 1 by the tape punching mechanism 24, the tact time is not affected.

It should be noted that the present invention is not limited to the above-described embodiments, and includes modifications, improvements, etc. within the scope of achieving the object of the present invention. For example, in the above-described embodiment, the sticking member 1 punched out from the tape 2 is attached to the long substrate 3 wound on the roll, but not only the long substrate 3 but also the sheet substrate can be used. It is possible to apply In the case of a single substrate, the attaching device 20 can be applied by providing a substrate conveying device, vacuum-sucking the substrate on the heating table 22, providing a positioning member or the like, or attaching the substrate with an adhesive tape or the like. becomes possible.

DESCRIPTION OF SYMBOLS 1... Pasting member, 2... Tape, 3... Substrate, 5... Adhesive layer, 6... Protective tape, 8... Pasting position, 9... Alignment mark, 10... Pasting area, 20... Pasting device, 22... Heating Table 23 Head unit 24 Tape punching mechanism 25 X-axis drive mechanism (head unit drive mechanism) 26 Y-axis drive mechanism (head unit drive mechanism) 27 Z-axis drive mechanism (head unit drive mechanism ), 28... θ-axis drive mechanism (head unit drive mechanism), 29... Tape feed mechanism, 30... Substrate feed mechanism, 31... Substrate delivery roll, 32... Substrate take-up roll, 33... Press device, 34... Upper press Plate 35 Lower pressing plate 40 Die plate 42 Die plate base 42a Back surface 43 Stripper 44 Punch 45 Tape delivery roll 46 Tape take-up roll 47 Nip roll 48 Protective tape take-up roll 51 Imaging device 54 Punch driving mechanism 55 Mold 56 Air cylinder 59 Piston 63 Connecting member 68 Vacuum suction path 69 Suction hole 71 Stripper plate 72 Pressing surface 76 Spring 81 Through hole 83 Tape insertion hole 92 Guide pin 93 Guide hole

Claims (15)

A sticking device for punching sticking members out of a tape having a thermosetting adhesive layer and sticking the sticking members to a plurality of sticking positions on a substrate,
a heating table that heats the substrate while supporting the back surface of the substrate;
a head unit disposed with a gap above the surface of the substrate;
a substrate feeding mechanism for feeding the substrate between the heating table and the head unit;
has
The head unit
a tape punching mechanism having a die consisting of a punch and a die plate;
a tape feeding mechanism that feeds the tape between the punch and the die plate;
an imaging device that captures images of alignment marks provided corresponding to the attachment positions one by one and identifies the attachment position of the attachment member from the positions of the alignment marks;
a head unit moving mechanism that moves the mold to the bonding position in accordance with the posture of the bonding member during bonding, and defines a gap between the substrate and the die plate;
a punch driving mechanism for punching the sticking member from the tape and moving the punch to a height position where the sticking member thus punched can be stuck to the substrate;
have,
A pasting device characterized by: The sticking device according to claim 1,
The head unit moving mechanism includes an X-axis driving mechanism that moves the head unit in an X-axis direction parallel to the top surface of the heating table, a Y-axis driving mechanism that moves the head unit in a direction parallel to the top surface of the heating table and perpendicular to the X-axis direction . It has a Y-axis drive mechanism that moves in the axial direction, a Z-axis drive mechanism that moves in a direction perpendicular to the XY plane, and a θ-axis drive mechanism that rotates about the Z-axis as a rotation axis.
A pasting device characterized by: The sticking device according to claim 1,
The punch has a suction hole that vacuum-sucks the surface of the pasting member, and a pressing surface that presses the pasting member against the substrate.
A pasting device characterized by: The sticking device according to claim 3 ,
The punch drive mechanism has an air cylinder that moves the punch up and down, and a connecting member that connects a piston of the air cylinder and a guide plate that holds the punch .
A pasting device characterized by: The sticking device according to claim 4,
The connecting member is provided with a vacuum suction path that communicates with the suction holes,
A pasting device characterized by: Claim 4 or 5 In the pasting device according to
When the punch presses the affixing member against the substrate, the lower limit position of the pressing surface is within the allowable compression amount range of the substrate.airadjusting and fixing the position of the cylinder from the heating table;
A pasting device characterized by: The sticking device according to claim 1,
further comprising a stripper that presses the tape against the die plate around the punch when the pasting member is punched out from the tape by the punch;
The stripper has a stripper plate that presses the tape against the die plate, a spring that biases the stripper plate toward the die plate, and guide pins that can be inserted into guide holes provided in the die plate. is doing,
A pasting device characterized by: The sticking device according to claim 1,
The tape feeding mechanism includes a tape feeding roll that feeds the long tape wound in a roll shape between the punch and the die plate;
a tape take-up roll for taking up the tape from which the pasting member has been punched;
a nip roll disposed between the tape take-up roll and the head unit for intermittently feeding the tape to the tape take-up roll;
have,
A pasting device characterized by: The sticking device according to claim 1,
The tape has a protective tape that protects the adhesive layer,
The head unit further comprises a protective tape take-up roll for taking up the peeled protective tape before punching out the sticking member.
A pasting device characterized by: The sticking device according to claim 1,
The substrate feeding mechanism includes a substrate feeding roll for feeding the long substrate wound in a roll shape onto the heating table, and a substrate winding roll for winding the substrate to which the attaching member is attached. further have
A pasting device characterized by: The application device according to claim 7 , wherein
The die plate is fixed to the lower surface side of the die plate base,
The die plate base has a through hole through which the stripper plate can be inserted,
A tape insertion hole communicating with the through hole from the outer surface of the die plate and through which the tape is inserted is provided on the joint surface between the die plate and the die plate base,
The lower surface of the tape insertion hole is the upper surface of the die plate,
A pasting device characterized by: The application device according to claim 10 , wherein
a pressing device disposed between the heating table and the substrate take-up roll for sandwiching and pressing the substrate to which the attaching member is attached;
A pasting device characterized by: 13. A pasting method in which the pasting member is punched out from the tape having the adhesive layer and pasted onto the substrate using the pasting device according to any one of claims 1 to 12 , comprising:
heating the heating table to a temperature at which the adhesive layer can adhere;
a step of scanning the imaging device over the substrate and capturing an image of each of the plurality of alignment marks provided corresponding to the bonding positions to specify the bonding positions;
a step of adjusting the mold to a predetermined posture when the attaching member is attached;
moving the mold to the identified attachment position;
a step of punching out the pasting member from the tape while vacuum-sucking the pasting member punched portion of the tape with the punch;
a step of attaching the attaching member to the substrate;
releasing the vacuum suction between the pasted sticking member and the punch;
and elevating the punch.
A pasting method characterized by: In the affixing method according to claim 13 ,
After the step of attaching the attachment member within the attachment target area of the substrate is completed,
a step of transferring the pasting area to which the pasting member is pasted to a pressing device;
a step of further pressing the substrate to which the sticking member is stuck with an upper pressing plate and a lower pressing plate;
including,
A pasting method characterized by: A head unit for use in an affixing device for punching out affixing members from a tape having an adhesive layer and affixing them to a plurality of affixing positions on a substrate,
arranged with a gap on the upper side with respect to the surface of the substrate,
a tape punching mechanism having a die consisting of a punch and a die plate;
a tape feeding mechanism that feeds the tape between the punch and the die plate;
an imaging device that captures images of alignment marks provided corresponding to the attachment positions one by one and identifies the attachment position of the attachment member from the positions of the alignment marks;
a head unit moving mechanism that moves the mold to the bonding position in accordance with the posture of the bonding member during bonding, and defines a gap between the substrate and the die plate;
a punch driving mechanism for punching the sticking member from the tape and moving the punch to a height position where the sticking member thus punched can be stuck to the substrate;
have,
A head unit characterized by:

Images