JPH11348950A - Sticking apparatus and method for adhesive film - Google Patents

Sticking apparatus and method for adhesive film

Info

Publication number
JPH11348950A
JPH11348950A JP10166649A JP16664998A JPH11348950A JP H11348950 A JPH11348950 A JP H11348950A JP 10166649 A JP10166649 A JP 10166649A JP 16664998 A JP16664998 A JP 16664998A JP H11348950 A JPH11348950 A JP H11348950A
Authority
JP
Japan
Prior art keywords
adhesive film
die
punch
punched
punching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10166649A
Other languages
Japanese (ja)
Inventor
Ryuji Itagaki
隆二 板垣
Takahito Ando
隆仁 安藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP10166649A priority Critical patent/JPH11348950A/en
Publication of JPH11348950A publication Critical patent/JPH11348950A/en
Pending legal-status Critical Current

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Abstract

PROBLEM TO BE SOLVED: To provide a sticking apparatus for an adhesive film and a sticking method therefor, capable of punching the adhesive film with an adhesive layer on its one face into a predetermined shape and sticking the punched film onto a product which is an object to be stuck with the punched film, in reduced processes and with high accuracy. SOLUTION: This apparatus and method are designed so that a belt-like adhesive film 34 is punched into a predetermined shape with a punch 22 of a mold section 26 and so that the adhesive film thus punched is pushed down to the underside of a die 24 with a top end of the punch 22 to be stuck onto to a switch case 1, which is an object to be stuck with a punched film and is held on a product holding part 30 formed beneath the die 24 of the mold section 26. Accordingly, an apparatus for sticking a adhesive film and a method therefor can be realized in which a adhesive film can be punched and stuck immediately and with high accuracy onto an object to be stuck with the punched film in reduced processes.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、片面に粘着剤を有
する粘着フィルムを所定の形状に打抜き加工し、被着物
である製品上に貼り付ける粘着フィルムの貼り付け装置
および貼り付け方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus and method for sticking an adhesive film having a pressure-sensitive adhesive on one side into a predetermined shape and sticking it on a product to be adhered. is there.

【0002】[0002]

【従来の技術】近年、電子機器の小形・薄形化が進展
し、それに伴って搭載される電子部品も高性能でありな
がら小形・薄形で軽量化したものが要望されているが、
その方法として電子部品の上面にフィルムを貼り付けて
防塵性を高めたものが多く見られるようになってきてお
り、例えば信号切り替え用のスイッチとしては図5に示
すプッシュオンスイッチが知られており、このプッシュ
オンスイッチを例として従来の粘着フィルムの貼り付け
装置および貼り付け方法について説明する。
2. Description of the Related Art In recent years, as electronic devices have become smaller and thinner, electronic components mounted on the electronic devices have been demanded to be smaller, thinner and lighter while having high performance.
As a method for this, a method in which a film is attached to the upper surface of an electronic component to improve dustproofness has come to be often seen. For example, a push-on switch shown in FIG. 5 is known as a signal switching switch. A conventional adhesive film sticking apparatus and sticking method will be described using this push-on switch as an example.

【0003】図5(a)は上記プッシュオンスイッチの
外観斜視図、同(b)は断面図であり、同図において、
1は上方開口の成形樹脂製のスイッチケースで、その内
底面には端子2Aおよび3Aと一体形成された中央およ
び周辺接点2および3がそれぞれインサート成形によっ
て固定されており、周辺接点3上には弾性金属薄板から
なるドーム状の可動接点4が載置されている。
FIG. 5A is an external perspective view of the push-on switch, and FIG. 5B is a cross-sectional view.
Reference numeral 1 denotes a switch case made of a molded resin having an upper opening. Center and peripheral contacts 2 and 3 integrally formed with the terminals 2A and 3A are fixed to the inner bottom surface thereof by insert molding, respectively. A dome-shaped movable contact 4 made of an elastic metal thin plate is mounted.

【0004】そして、5は裏面に粘着剤が塗布された絶
縁性の粘着フィルムで、図5(a)の斜線部分で示すよ
うに、スイッチケース1の開口部分を覆うように貼り付
けられている。
[0005] Reference numeral 5 denotes an insulating adhesive film having an adhesive applied to the back surface, which is attached so as to cover the opening of the switch case 1 as shown by the hatched portion in FIG. .

【0005】上記構成のプッシュオンスイッチは、絶縁
性の粘着フィルム5の中央を押し下げると可動接点4が
反転し、中央および周辺接点2および3すなわち端子2
Aおよび3Aの間を電気的に接続し、上記押圧力を除く
と、可動接点4がその弾性力によって元の形状に復元す
ることにより、中央および周辺接点2および3の間を電
気的に切り離すものとなっている。
In the push-on switch having the above structure, when the center of the insulating adhesive film 5 is depressed, the movable contact 4 is inverted, and the center and peripheral contacts 2 and 3, that is, the terminal 2.
A and 3A are electrically connected, and when the above-mentioned pressing force is removed, the movable contact 4 restores its original shape by its elastic force, thereby electrically disconnecting the central and peripheral contacts 2 and 3. It has become something.

【0006】そして、上記操作時の操作フィーリング
は、可動接点4の動作力に依存するため、良好な操作フ
ィーリングを得るためには、粘着フィルム5は薄いもの
を使用しなければならず、またその裏面には粘着剤が塗
布されているために、個片としての粘着フィルム5の取
り扱いは難しく、本構成のプッシュオンスイッチを製作
する工程の中で粘着フィルム5の貼り付け工程は専用装
置で行うことが多く、以下にその装置および方法につい
て図面を用いて説明する。
Since the operation feeling at the time of the above operation depends on the operating force of the movable contact 4, in order to obtain a good operation feeling, a thin adhesive film 5 must be used. In addition, since the adhesive is applied to the back surface, it is difficult to handle the adhesive film 5 as an individual piece. The apparatus and method will be described below with reference to the drawings.

【0007】図6は従来の粘着フィルムの貼り付け装置
の概念図で、その基部6上には、上記プッシュオンスイ
ッチのスイッチケース1の凹部の中に可動接点4が載置
された連結状態のフープ状仕掛品7およびそれと平行に
粘着フィルム5が所定のピッチで貼り付けられた帯状の
剥離紙8が互いに同期するように、かつ所定の間欠動作
で図6に示すX方向に搬送されており、帯状の剥離紙8
は、同図中のY方向に往復移動可能な基部6の傾斜部6
Aに沿って下方に引っ張られている。
FIG. 6 is a conceptual view of a conventional adhesive film sticking device. On a base portion 6 of the push-on switch, a movable contact 4 is mounted in a recess of a switch case 1 in a connected state. The hoop-shaped work-in-process 7 and the strip-shaped release paper 8 to which the adhesive film 5 is adhered in parallel at a predetermined pitch are conveyed in the X direction shown in FIG. , Strip-shaped release paper 8
Is an inclined portion 6 of the base 6 which can reciprocate in the Y direction in FIG.
A is pulled downward along A.

【0008】そして、スイッチケース1の上面に粘着フ
ィルム5を貼り付ける時の動作は、まずフープ状仕掛品
7と帯状の剥離紙8を、図6に示す基部6の傾斜部6A
端部において所定の粘着フィルム5が帯状の剥離紙8か
ら約半分剥離される状態になるまでX方向に同期させて
搬送し、この状態で吸着チャック9が下降して帯状の剥
離紙8から約半分剥離された粘着フィルム5を吸着し、
続いて基部6の傾斜部6Aが図中のX方向に対して少し
後退する方向に移動することにより、その粘着フィルム
5は帯状の剥離紙8から剥がされて吸着チャック9によ
り完全に吸着保持され、その後吸着チャック9は上昇し
て所定のスイッチケース1の上方位置に移動して下降す
ることにより、保持している粘着フィルム5をスイッチ
ケース1の上面に貼り付けるものであった。
The operation when the adhesive film 5 is stuck on the upper surface of the switch case 1 is as follows. First, the hoop-shaped work-in-progress 7 and the strip-shaped release paper 8 are moved to the inclined portion 6A of the base 6 shown in FIG.
At the end, a predetermined pressure-sensitive adhesive film 5 is conveyed synchronously in the X direction until it is in a state where it is about half peeled off from the strip-shaped release paper 8. Adsorb the half-peeled adhesive film 5,
Subsequently, when the inclined portion 6A of the base 6 moves in a direction slightly retracted with respect to the X direction in the figure, the adhesive film 5 is peeled off from the strip-shaped release paper 8 and is completely sucked and held by the suction chuck 9. Thereafter, the suction chuck 9 moves up to a predetermined position above the switch case 1 and moves down, so that the held adhesive film 5 is attached to the upper surface of the switch case 1.

【0009】[0009]

【発明が解決しようとする課題】しかしながら上記従来
の粘着フィルムの貼り付け装置および貼り付け方法にお
いては、粘着フィルム5を吸着チャック9にて吸着しつ
つ帯状の剥離紙8から剥がすため、吸着時の位置ずれが
発生し易いと共に、その後の吸着チャック9の移動工数
も多いため工数低減が難しく、さらに粘着フィルム5を
貼り付けた帯状の剥離紙8を製作する加工費用も高価な
ものとなるため、高品質で安価な製品を大量に生産する
ことは難しかった。
However, in the above-mentioned conventional adhesive film sticking apparatus and sticking method, since the adhesive film 5 is peeled off from the strip-shaped release paper 8 while being sucked by the suction chuck 9, it is difficult to prevent the adhesive film 5 from sticking. In addition to the occurrence of misalignment, the number of man-hours for moving the suction chuck 9 is large, it is difficult to reduce the man-hour, and the processing cost for manufacturing the strip-shaped release paper 8 to which the adhesive film 5 is attached becomes expensive. It was difficult to mass produce high quality and cheap products.

【0010】本発明は、このような従来の課題を解決す
るものであり、粘着フィルムを少ない工数でしかも精度
良く貼り付けることができる粘着フィルムの貼り付け装
置および貼り付け方法を提供することを目的とする。
An object of the present invention is to solve such a conventional problem, and an object of the present invention is to provide a sticking device and a sticking method of a sticky film capable of sticking the sticky film with a small number of steps and with high accuracy. And

【0011】[0011]

【課題を解決するための手段】上記課題を解決するため
に本発明の粘着フィルムの貼り付け装置および貼り付け
方法は、剥離紙から剥がした状態の粘着フィルムを金型
部のポンチで所定の形状に打ち抜くと共に、打ち抜いた
粘着フィルムをポンチ先端でダイの下方まで押し下げ、
金型部のダイの真下に構成した製品保持部に保持した製
品上に押し付けて貼り付けるものである。
Means for Solving the Problems In order to solve the above-mentioned problems, an adhesive film sticking apparatus and an adhesive method of the present invention are provided. And press down the punched adhesive film to below the die with the tip of the punch.
It is to be pressed onto the product held by the product holding part constructed just below the die of the mold part and to be stuck.

【0012】これにより、ポンチの下降のみの動作すな
わち少ない工数で粘着フィルムを打ち抜くと共に即座に
その粘着フィルムを製品上に精度高く貼り付けることが
できる粘着フィルムの貼り付け装置および貼り付け方法
を得ることができる。
According to the present invention, there is provided an adhesive film sticking apparatus and a sticking method capable of punching the adhesive film with only a lowering operation of the punch, that is, a small number of steps, and immediately sticking the adhesive film on the product with high accuracy. Can be.

【0013】[0013]

【発明の実施の形態】本発明の請求項1に記載の発明
は、打抜き切断用切刃部を残して各々の外径および孔径
を切刃部よりも細径および大径の逃げ部とし、逃げ部に
粘着剤の付き難い表面処理を施したポンチおよびダイか
らなり、下面に粘着剤層を有する粘着フィルムを打抜き
加工して打ち抜かれた粘着フィルムをポンチ先端でダイ
の下方まで押し下げる金型部と、金型部のダイの真下に
被着物である製品を位置決め保持し、ポンチ先端を製品
に押し付けて打抜かれた粘着フィルムを貼り付ける際
に、所定の値以上の力が加わると撓む弾性体を下面に装
着した製品保持部からなる粘着フィルムの貼り付け装置
としたものであり、粘着フィルムの外形の打ち抜きおよ
び打ち抜かれた粘着フィルムの製品上への貼り付け動作
をポンチの下降のみの動作すなわち少ない工数で実現で
き、しかもその貼り付けの際に製品に加わる必要以上の
押圧力は製品保持部にて吸収できるため、高速で精度良
くしかも確実に粘着フィルムを製品上に貼り付けること
ができて高品質な製品を大量かつ安価に提供できるとい
う作用を有する。
DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention is characterized in that each of the outer diameter and the hole diameter is a relief portion having a smaller diameter and a larger diameter than the cutting edge portion except for the cutting edge portion for punching and cutting. A die part consisting of a punch and a die with a relief part that has been subjected to a surface treatment that does not easily have an adhesive, and punching an adhesive film with an adhesive layer on the lower surface and pressing the punched adhesive film down below the die with the punch tip And the elasticity that bends when a force greater than a predetermined value is applied when the product to be adhered is positioned and held directly below the die in the mold part and the punched adhesive film is pressed by pressing the tip of the punch against the product. It is an adhesive film sticking device consisting of a product holding part with the body attached to the lower surface, and punching the outer shape of the adhesive film and sticking the punched adhesive film onto the product only by lowering the punch. It can be realized with less work, that is, less man-hours, and more than necessary pressing force applied to the product at the time of pasting can be absorbed by the product holding part, so that the adhesive film can be stuck on the product at high speed and with high accuracy. It has the effect of being able to provide high quality products in large quantities at low cost.

【0014】請求項2に記載の発明は、請求項1記載の
発明において、製品保持部の下面に装着する弾性体が弾
性金属線からなるスプリングであるものであり、スプリ
ングは占有面積が小さくて伸縮耐久性および応答性が高
いため、小型でしかも長期間に亘って安定した動作を実
現できるという作用を有する。
According to a second aspect of the present invention, in the first aspect of the invention, the elastic body mounted on the lower surface of the product holding portion is a spring made of an elastic metal wire. Since it has high stretch durability and responsiveness, it has the effect of being able to realize a small-sized and stable operation for a long period of time.

【0015】請求項3に記載の発明は、請求項1または
2記載の発明において、ポンチ、ダイ共に打抜き切断用
切刃部の長さが0.4〜0.6mmであると共に、逃げ部
の粘着剤の付き難い表面処理としてテフロンコーティン
グを施したものであり、打抜き切断用切刃部の寸法を長
く、しかもそれ以外は非接着性に優れたテフロンコーテ
ィングで覆っているため、切刃部付近に不要な粘着剤が
こびりつくことが無く、本装置のメンテナンス回数を少
なくできるという作用を有する。
According to a third aspect of the present invention, in the invention of the first or second aspect, both the punch and the die have a punching and cutting edge portion of 0.4 to 0.6 mm, and have a relief portion. The Teflon coating is applied as a surface treatment that does not easily adhere to the adhesive.The dimensions of the cutting blade for punching and cutting are long, and the other parts are covered with a non-adhesive Teflon coating. In addition, unnecessary adhesive is not adhered to the device, and the number of maintenance operations of the apparatus can be reduced.

【0016】請求項4に記載の発明は、請求項1〜3の
いずれか一つに記載の発明において、打ち抜かれた粘着
フィルムを保持するための真空吸着部をポンチに設けた
ものであり、粘着フィルムを切断すると同時にそれを確
実にポンチに吸着することができるため、ポンチの下方
への移動の際の粘着フィルムの位置ずれを少なくできる
という作用を有する。
According to a fourth aspect of the present invention, in the invention according to any one of the first to third aspects, a vacuum suction portion for holding the punched adhesive film is provided on the punch. Since the adhesive film can be cut off at the same time as the adhesive film is cut off, the position of the adhesive film during the downward movement of the punch can be reduced.

【0017】請求項5に記載の発明は、請求項1〜4の
いずれか一つに記載の発明において、粘着フィルムの送
り高さを、ダイ上面よりも1.5〜2.5mm離して設け
たものであり、剥離紙から剥がされた粘着フィルムの粘
着剤面を間隔を保った状態で搬送することができるの
で、粘着フィルムが不用意にダイ等にくっつくことを無
くすことができ、長時間に亘って本装置を稼働させるこ
とができるという作用を有する。
According to a fifth aspect of the present invention, in the invention according to any one of the first to fourth aspects, the feed height of the pressure-sensitive adhesive film is set to be 1.5 to 2.5 mm away from the upper surface of the die. Since the adhesive surface of the adhesive film peeled off from the release paper can be transported with the interval maintained, the adhesive film can be prevented from inadvertently sticking to a die, etc. The operation can be performed over a range of

【0018】請求項6に記載の発明は、請求項1〜5の
いずれか一つに記載の発明において、ダイの打抜き切断
用切刃部の周囲に粘着剤の付き難い処理を施すと共に、
ダイ上面よりも1.5mm以上離れてポンチの上死点より
も低い位置に、粘着フィルムとポンチを離すためのスト
リッパを設けたものであり、繰り返して粘着フィルムを
打ち抜いてもダイに粘着フィルムが貼り付き難く、また
ポンチ周囲に粘着剤が付いてポンチと共に粘着フィルム
が上方に持ち上げられた場合でも、強制的にストリッパ
によって両者を分離させて作業を続行させることができ
るという作用を有する。
According to a sixth aspect of the present invention, in the invention according to any one of the first to fifth aspects, the periphery of the punching and cutting edge portion of the die is subjected to a treatment that does not easily cause an adhesive, and
A stripper for separating the adhesive film and the punch is provided at a position 1.5 mm or more from the die upper surface and lower than the top dead center of the punch, and even if the adhesive film is repeatedly punched, the adhesive film remains on the die. Even when the adhesive film is hardly attached and the adhesive film is lifted upward together with the punch due to the adhesive around the punch, the stripper can forcibly separate the two and continue the operation.

【0019】請求項7に記載の発明は、請求項1〜6の
いずれか一つに記載の発明において、粘着フィルムを打
抜き加工した後のスクラップを送るためのローラを設
け、その外周に針を植設したものであり、残部の少ない
スクラップに対して、ローラの針を突き刺して巻き取る
ことができるため、確実にスクラップを除去することが
できるという作用を有する。
According to a seventh aspect of the present invention, in the invention of any one of the first to sixth aspects, a roller for feeding a scrap after punching the adhesive film is provided, and a needle is provided on the outer periphery thereof. It is planted, and the scrap of the remaining portion can be pierced by a roller needle and wound up, so that the scrap can be reliably removed.

【0020】請求項8に記載の発明は、ポンチおよびダ
イからなる金型部で、下面に粘着剤を有する粘着フィル
ムを打抜き加工し、打ち抜かれた粘着フィルムをポンチ
先端でダイの下方まで押し下げてダイの真下に位置決め
保持した被着物である製品上に押し付けることによっ
て、打ち抜かれた粘着フィルムを製品上に貼り付ける粘
着フィルムの貼り付け方法としたものであり、粘着フィ
ルムの外形の打ち抜きおよび打ち抜かれた粘着フィルム
の製品上への貼り付けをポンチの下降のみの少ない工数
で実現できるため、その製造コストを大幅に低減するこ
とができて、安価で高品質な製品を大量に提供できると
いう作用を有する。
According to the present invention, an adhesive film having an adhesive on the lower surface is punched in a mold portion comprising a punch and a die, and the punched adhesive film is pressed down to below the die at the tip of the punch. This is a method of attaching an adhesive film that sticks the punched adhesive film onto the product by pressing it onto a product that is an adherend that is positioned and held directly below the die, and punches and punches the external shape of the adhesive film. Since the adhesive film can be attached to the product with a small number of steps only by lowering the punch, the production cost can be significantly reduced, and the effect of providing a large number of inexpensive and high-quality products can be achieved. Have.

【0021】以下、本発明の実施の形態による粘着フィ
ルムの貼り付け装置および貼り付け方法について、従来
の技術の場合と同様にプッシュオンスイッチのスイッチ
ケース1上に粘着フィルム5を貼り付けることを例とし
て説明するが、従来の技術の項で説明した構成と同一構
成の部分には同一符号を付して、詳細な説明は省略す
る。
Hereinafter, an apparatus and method for applying an adhesive film according to an embodiment of the present invention will be described with reference to an example in which an adhesive film 5 is attached on a switch case 1 of a push-on switch in the same manner as in the prior art. However, the same reference numerals are given to the same components as those described in the section of the related art, and the detailed description will be omitted.

【0022】図1は本発明の一実施の形態による粘着フ
ィルムの貼り付け装置の断面図であり、同図に示すよう
に、下型21に設けられた支柱21Aに、上型20の支
持用孔部20Aが高精度に挿通されることによって、上
型20は上下動可能に支持されており、その中央にはポ
ンチ22が、通気用の孔を有する止め部材23によって
位置決め装着されている。
FIG. 1 is a sectional view of an adhesive film sticking apparatus according to an embodiment of the present invention. As shown in FIG. 1, a support 21A provided on a lower mold 21 is used to support an upper mold 20. By inserting the hole 20A with high precision, the upper die 20 is supported so as to be able to move up and down, and a punch 22 is positioned and mounted at the center thereof by a stopper 23 having a hole for ventilation.

【0023】このポンチ22は、中心に真空吸着部とな
る中空部22Aを備えると共に、下端の打抜き切断用切
刃部22Bよりも上方部分は細径の逃げ部22Cとなっ
ており、逃げ部22Cには粘着剤の付き難い表面処理と
してテフロンコーティングが施されている。
The punch 22 has a hollow portion 22A serving as a vacuum suction portion at the center thereof, and a portion above the lower cutting edge 22B for punching and cutting is a small-diameter relief portion 22C. Is provided with a Teflon coating as a surface treatment that does not easily adhere to an adhesive.

【0024】そして、ポンチ22と対向する下型21の
中央には、打抜き切断用切刃部24Aの下方が大径の逃
げ部24Bとなったダイ24がダイホルダー25によっ
て保持され、上記ポンチ22とダイ24により金型部2
6を構成している。
In the center of the lower die 21 facing the punch 22, a die 24 having a large-diameter relief portion 24B below the punching cutting blade portion 24A is held by a die holder 25. Mold part 2
6.

【0025】また、ダイホルダー25の下方のダイホル
ダー支持ブロック27にも、ポンチ22の外径よりも大
きい貫通孔27Aが設けられ、この貫通孔27Aおよび
ダイ24の逃げ部24Bの中心軸位置は一致していると
共に、両者の内周面とダイ24の打抜き切断用切刃部2
4Aの周囲部分にはそれぞれポンチ22の逃げ部22C
と同様にテフロンコーティングが施されている。
The die holder support block 27 below the die holder 25 is also provided with a through hole 27A larger than the outer diameter of the punch 22, and the center axis positions of the through hole 27A and the relief portion 24B of the die 24 are as follows. The cutting edge 2 for punching and cutting of the inner peripheral surface of both of them and the die 24
The escape portion 22C of the punch 22 is provided around the 4A.
Teflon coating is applied as well.

【0026】そして、ダイホルダー支持ブロック27の
下方には、フープ状仕掛品7のスイッチケース1を位置
決めする凹部28Aを備えると共に、所定の値以上の力
が加わると撓む弾性金属線からなるスプリング29によ
って常に上方に付勢されている台座部28が設けられ、
この台座部28とスプリング29にて製品保持部30が
構成されている。
Below the die holder support block 27, there is provided a concave portion 28A for positioning the switch case 1 of the hoop-shaped work-in-process 7, and a spring made of an elastic metal wire which bends when a force exceeding a predetermined value is applied. A pedestal portion 28 constantly biased upward by 29 is provided,
The pedestal part 28 and the spring 29 constitute a product holding part 30.

【0027】また、この製品保持部30の台座部28お
よび金型部26は、ダイホルダー支持ブロック27を介
して位置決めピン等により中心位置が一致するように配
列されている。
Further, the pedestal portion 28 and the mold portion 26 of the product holding portion 30 are arranged via a die holder support block 27 by means of positioning pins or the like so that the center positions coincide.

【0028】さらに、下型21にはストリッパ31が装
着されており、ポンチ22の周囲を囲んでいる先端部分
は、ダイ24の打抜き切断用切刃部24Aの上端よりも
1.5mm以上離れ、かつ、ポンチ22の上死点よりも低
い位置に位置している。
Further, a stripper 31 is mounted on the lower die 21, and a tip portion surrounding the periphery of the punch 22 is separated from the upper end of the punching and cutting blade portion 24 A of the die 24 by 1.5 mm or more. The punch 22 is located at a position lower than the top dead center.

【0029】そして、図2の外観斜視図を示すように、
32は帯状の剥離紙33とそれと同形の帯状の粘着フィ
ルム34が貼り付けられている剥離紙付粘着フィルム
で、上記金型部26および製品保持部30の側方に装填
されており、上記フープ状仕掛品7の間欠送りと同期し
て送出され、帯状の剥離紙33は補助ローラ35を介し
て剥離紙巻取りローラ36に巻き取られ、残った帯状の
粘着フィルム34はその粘着面とダイ24上面とが常に
1.5〜2.5mmの距離が開くように金型部26内に挿
通され、最後に外周に針37Aを植設したスクラップ用
補助ローラ37を介してスクラップ巻取りローラ38に
巻き取られるようになっている。
Then, as shown in the external perspective view of FIG.
Reference numeral 32 denotes an adhesive film with a release paper to which a belt-like release paper 33 and a belt-like adhesive film 34 of the same shape are stuck. The adhesive film 32 is loaded on the side of the mold part 26 and the product holding part 30, and The strip-shaped release paper 33 is sent out in synchronization with the intermittent feeding of the work-in-process 7, the strip-shaped release paper 33 is taken up by a release-paper take-up roller 36 via an auxiliary roller 35, and the remaining strip-shaped adhesive film 34 is bonded to the adhesive surface and the die 24 It is inserted into the mold part 26 so that the upper surface always keeps a distance of 1.5 to 2.5 mm, and finally to the scrap take-up roller 38 via the scrap auxiliary roller 37 having the needle 37A implanted on the outer periphery. It can be wound up.

【0030】上記構成の粘着フィルムの貼り付け装置の
動作は、間欠動作で送られるフープ状仕掛品7と同期し
て送出される帯状の粘着フィルム34の停止時に、金型
部26のポンチ22が下降し、帯状の粘着フィルム34
を所定の形状すなわち粘着フィルム5の形状に打ち抜く
と同時に止め部材23を介してポンチ22の中空部22
Aを吸引して打ち抜いた粘着フィルム5をポンチ22先
端に吸着保持し、この状態のままでポンチ22は下降し
続ける。
The operation of the adhesive film sticking apparatus having the above configuration is such that when the band-shaped adhesive film 34 sent out in synchronism with the hoop-shaped work-in-process 7 sent by the intermittent operation is stopped, the punch 22 of the mold part 26 stops. Descending, belt-shaped adhesive film 34
Is punched into a predetermined shape, that is, the shape of the adhesive film 5, and at the same time, the hollow portion 22 of the punch 22 is
The adhesive film 5 that has been punched out by sucking A is sucked and held at the tip of the punch 22, and the punch 22 continues to descend in this state.

【0031】そして、図3の拡大部分断面図に示すよう
に、このポンチ22の下死点位置は、製品保持部30の
台座部28に保持したスイッチケース1上にその打抜き
切断用切刃部22Bが当接するよりも少し下方の位置に
設定されており、このポンチ22の下死点位置付近にお
いて、ポンチ22先端に吸着保持された粘着フィルム5
を、ポンチ22によってスイッチケース1上に押し付け
て貼り付けるものである。
As shown in the enlarged partial sectional view of FIG. 3, the position of the bottom dead center of the punch 22 is set on the switch case 1 held on the pedestal 28 of the product holding portion 30 by the punching and cutting edge portion. 22B is set at a position slightly lower than the position where the adhesive film 22B comes into contact.
Is pressed onto the switch case 1 by the punch 22 and is attached.

【0032】このときに、台座部28の下方にスプリン
グ29を配しているため、樹脂製のスイッチケース1に
は必要以上の押圧力が加わることがなく、スイッチケー
ス1の破損を防止できると共に、粘着フィルム5はスイ
ッチケース1上に所定の押圧力および時間で押し付け続
けられるようになっている。
At this time, since the spring 29 is disposed below the pedestal portion 28, an excessive pressing force is not applied to the switch case 1 made of resin, and the switch case 1 can be prevented from being damaged. The adhesive film 5 can be continuously pressed on the switch case 1 with a predetermined pressing force and a predetermined time.

【0033】その後、ポンチ22の吸引が停止して、ポ
ンチ22は上死点まで上昇し、続いてフープ状仕掛品7
および帯状の粘着フィルム34が所定の距離のみ送ら
れ、再度上記動作が繰り返して行われるものである。
Thereafter, the suction of the punch 22 is stopped, and the punch 22 rises to the top dead center.
The band-shaped adhesive film 34 is fed only for a predetermined distance, and the above operation is repeated again.

【0034】このように、本発明による粘着フィルムの
貼り付け装置および貼り付け方法は帯状の粘着フィルム
34の打ち抜きおよび製品保持部30に保持された製品
への貼り付け作業を、金型部26のポンチ22の上下動
のみで行うようにしたため、装置全体の占有面積および
製品の組立工数が少なくて済むと共に、粘着フィルム5
のポンチ22の吸着時の位置ずれも少なく、常に粘着フ
ィルム5を被着物であるスイッチケース1上の正確な位
置に貼り付けることができるものである。
As described above, the sticking apparatus and the sticking method of the adhesive film according to the present invention perform the punching operation of the band-shaped adhesive film 34 and the attaching operation to the product held in the product holding section 30 by the die section 26. Since the punch 22 is only moved up and down, the area occupied by the entire apparatus and the number of man-hours for assembling the product can be reduced.
The adhesive film 5 can be stuck to an accurate position on the switch case 1, which is an adherend, with little displacement when the punch 22 is sucked.

【0035】そして、金型部26のポンチ22およびダ
イ24は、それぞれの打抜き切断用切刃部22Bおよび
24Aよりも細径および大径の逃げ部22Cおよび24
Bを有すると共に、この部分に加えてダイ24の打抜き
切断用切刃部24Aの上面周囲およびポンチ22が挿通
するダイホルダー支持ブロック27の貫通孔27A内に
も非接着性に優れたテフロンコーティングを施している
ため、不要な粘着剤は金型部26内に付着し難くて、例
えば1分間に60回程度の粘着フィルム5の打ち抜き貼
り付けが容易に実現でき、仮にポンチ22が粘着フィル
ム5を貼り付けた後に、粘着フィルム34の残部で構成
される孔から抜けずに、ポンチ22の上昇に伴って帯状
の粘着フィルム34を一緒に持ち上げたとしても、ポン
チ22の上死点よりも低い位置に配されたストリッパ3
1によって、両者を強制的に引き剥がすことができるた
めに、装置停止を少なくできるものである。
Then, the punch 22 and the die 24 of the mold portion 26 are formed with relief portions 22C and 24 having a smaller diameter and a larger diameter than the respective cutting blade portions 22B and 24A.
B, and in addition to this portion, a Teflon coating excellent in non-adhesiveness is also provided around the upper surface of the cutting blade portion 24A for punching and cutting of the die 24 and in the through hole 27A of the die holder support block 27 through which the punch 22 is inserted. Since the adhesive is applied, unnecessary adhesive hardly adheres to the mold part 26, and for example, punching and sticking of the adhesive film 5 about 60 times per minute can be easily realized. Even if the band-shaped adhesive film 34 is lifted together with the rise of the punch 22 without falling out of the hole formed by the remaining portion of the adhesive film 34 after being attached, the position lower than the top dead center of the punch 22 Stripper 3 arranged in
According to 1, since both can be forcibly peeled off, the stoppage of the apparatus can be reduced.

【0036】また、この帯状の粘着フィルム34の打ち
抜き後のスクラップは残部の少ない巻き取り難いものと
なるが、本装置においてはスクラップ用補助ローラ37
に針37Aを埴設して上記スクラップをムラなく確実に
引っ張るようにしたため、スクラップの排出不良等に起
因する装置停止も低減できるものである。
Further, the scrap after the punching of the belt-shaped adhesive film 34 has a small remaining portion and is difficult to be wound up.
The scrap 37A is laid on the base plate so that the scrap can be pulled evenly and reliably, so that the stoppage of the apparatus due to defective discharge of the scrap can be reduced.

【0037】なお、金型部26のポンチ22およびダイ
24の打抜き切断用切刃部22Bおよび24Aの長さを
0.4〜0.6mmに設定しておけば、不要な粘着剤は打
抜き切断用切刃部22Bおよび24Aに付着し難く、ま
たその刃先が摩耗した際に研磨して再使用できることは
勿論である。
If the lengths of the punching and cutting blades 22B and 24A of the punch 22 and the die 24 of the mold part 26 are set to 0.4 to 0.6 mm, unnecessary adhesive is punched and cut. Needless to say, it hardly adheres to the cutting blade portions 22B and 24A for use, and can be polished and reused when its cutting edge is worn.

【0038】さらに、本発明による粘着フィルムの貼り
付け装置および貼り付け方法においては、帯状の粘着フ
ィルム34をポンチ22で所定の形状に打ち抜いて貼り
付けるため、従来の技術の項で説明した粘着フィルム5
を所定のピッチで帯状の剥離紙上に貼り付けたものを準
備する必要がなく、その加工費を無くすことができる
上、帯状の剥離紙付粘着フィルム32の共用化および標
準化も容易に図ることができるものである。
Further, in the adhesive film sticking apparatus and the sticking method according to the present invention, since the band-shaped sticky film 34 is punched into a predetermined shape by the punch 22 and sticked, the adhesive film described in the section of the prior art is used. 5
Does not need to be prepared on a strip-shaped release paper at a predetermined pitch, the processing cost can be eliminated, and the common use and standardization of the strip-shaped adhesive film 32 with release paper can be easily achieved. You can do it.

【0039】また、上記の説明においてはスプリング2
9を下型21内に配した構成により説明したが、図4の
断面図に示すように、上型20のポンチ22上方に配す
るようにしても良く、さらにスプリングの代わりにゴム
材等の弾性材料により構成しても良いことは言うまでも
ない。
In the above description, the spring 2
Although the description has been made with reference to the configuration in which the lower die 9 is disposed in the lower die 21, it may be disposed above the punch 22 of the upper die 20, as shown in the sectional view of FIG. Needless to say, it may be made of an elastic material.

【0040】[0040]

【発明の効果】以上のように本発明の粘着フィルムの貼
り付け装置および貼り付け方法によれば、薄い粘着フィ
ルムをポンチの上下動のみの少ない工数で、所定の形状
に打ち抜くと共にそれを確実かつ位置ずれが少なく被着
物である製品上に高速で貼り付けることができるため、
製品の組立て効率およびその品質を向上させることがで
き、高品質な製品を大量かつ安価に生産することが可能
となるという有利な効果が得られる。
As described above, according to the adhesive film sticking apparatus and the sticking method of the present invention, a thin adhesive film is punched into a predetermined shape with a small number of man-hours only by moving up and down the punch, and it is reliably and securely punched. Since it can be attached at high speed on products to be adhered with little displacement,
It is possible to improve the assembling efficiency and the quality of the product, and to obtain an advantageous effect that high-quality products can be produced in large quantities at low cost.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施の形態による粘着フィルムの貼
り付け装置の断面図
FIG. 1 is a sectional view of an adhesive film sticking apparatus according to an embodiment of the present invention.

【図2】同外観斜視図FIG. 2 is an external perspective view of the same.

【図3】同ポンチで粘着フィルムをスイッチケース上に
貼り付ける状態を説明する拡大部分断面図
FIG. 3 is an enlarged partial cross-sectional view illustrating a state in which an adhesive film is pasted on a switch case using the punch.

【図4】同他の実施の形態による粘着フィルムの貼り付
け装置の断面図
FIG. 4 is a cross-sectional view of an adhesive film sticking apparatus according to another embodiment.

【図5】(a)プッシュオンスイッチの外観斜視図 (b)同断面図FIG. 5A is an external perspective view of a push-on switch, and FIG.

【図6】従来の粘着フィルムの貼り付け装置の概念図FIG. 6 is a conceptual diagram of a conventional adhesive film sticking apparatus.

【符号の説明】[Explanation of symbols]

1 スイッチケース 5 粘着フィルム 7 フープ状仕掛品 20 上型 20A 支持用孔部 21 下型 21A 支柱 22 ポンチ 22A 中空部 22B ポンチの打抜き切断用切刃部 22C ポンチの逃げ部 23 止め部材 24 ダイ 24A ダイの打抜き切断用切刃部 24B ダイの逃げ部 25 ダイホルダー 26 金型部 27 ダイホルダー支持ブロック 27A 貫通孔 28 台座部 28A 凹部 29 スプリング 30 製品保持部 31 ストリッパ 32 剥離紙付粘着フィルム 33 帯状の剥離紙 34 帯状の粘着フィルム 35 補助ローラ 36 剥離紙巻取りローラ 37 スクラップ用補助ローラ 37A 針 38 スクラップ巻取りローラ Reference Signs List 1 switch case 5 adhesive film 7 hoop-like work-in-progress 20 upper die 20A support hole 21 lower die 21A support post 22 punch 22A hollow portion 22B punch punching and cutting edge portion 22C punch relief portion 23 stopper member 24 die 24A die Cutting edge 24B die relief 25 die holder 26 mold 27 die holder support block 27A through hole 28 pedestal 28A recess 29 spring 30 product holder 31 stripper 32 adhesive film with release paper 33 strip-like peeling Paper 34 Band-shaped adhesive film 35 Auxiliary roller 36 Release paper take-up roller 37 Auxiliary roller for scrap 37A Needle 38 Scrap take-up roller

Claims (8)

【特許請求の範囲】[Claims] 【請求項1】 打抜き切断用切刃部を残して各々の外径
および孔径を切刃部よりも細径および大径の逃げ部と
し、逃げ部に粘着剤の付き難い表面処理を施したポンチ
およびダイからなり、下面に粘着剤を有する粘着フィル
ムを打抜き加工して打ち抜かれた粘着フィルムをポンチ
先端でダイの下方まで押し下げる金型部と、金型部のダ
イの真下に被着物である製品を位置決め保持し、ポンチ
先端を製品に押し付けて打ち抜かれた粘着フィルムを貼
り付ける際に、所定の値以上の力が加わると撓む弾性体
を下面に装着した製品保持部からなる粘着フィルムの貼
り付け装置。
1. A punch in which the outer diameter and the hole diameter are made smaller and larger than the cutting edge portion, while leaving the cutting edge portion for punching and cutting, and the relief portion is subjected to a surface treatment with which adhesive is hardly attached. And a die, which is formed by punching a pressure-sensitive adhesive film having a pressure-sensitive adhesive on its lower surface and pressing down the punched pressure-sensitive adhesive film to below the die at the tip of the punch, and a product to be adhered immediately below the die of the die. The adhesive film consisting of a product holding part with an elastic body attached to the bottom surface that bends when a force of a predetermined value or more is applied when attaching and punching the punched adhesive film by pressing the tip of the punch against the product Mounting device.
【請求項2】 製品保持部の下面に装着する弾性体が弾
性金属線からなるスプリングである請求項1記載の粘着
フィルムの貼り付け装置。
2. The adhesive film sticking device according to claim 1, wherein the elastic body mounted on the lower surface of the product holding portion is a spring made of an elastic metal wire.
【請求項3】 ポンチ、ダイ共に打抜き切断用切刃部の
長さが0.4〜0.6mmであると共に、逃げ部の粘着剤
の付き難い表面処理としてテフロンコーティングを施し
た請求項1または2記載の粘着フィルムの貼り付け装
置。
3. The punch and the die both have a cutting edge for punching and cutting having a length of 0.4 to 0.6 mm, and are provided with a Teflon coating as a surface treatment that does not easily have an adhesive at a relief portion. 3. The adhesive film sticking device according to 2.
【請求項4】 打ち抜かれた粘着フィルムを保持するた
めの真空吸着部をポンチに設けた請求項1〜3のいずれ
か一つに記載の粘着フィルムの貼り付け装置。
4. The pressure-sensitive adhesive film sticking apparatus according to claim 1, wherein a punch is provided with a vacuum suction portion for holding the punched pressure-sensitive adhesive film.
【請求項5】 粘着フィルムの送り高さを、ダイ上面よ
りも1.5〜2.5mm離して設けた請求項1〜4のいず
れか一つに記載の粘着フィルムの貼り付け装置。
5. The adhesive film sticking device according to claim 1, wherein a feeding height of the adhesive film is provided at a distance of 1.5 to 2.5 mm from an upper surface of the die.
【請求項6】 ダイの打抜き切断用切刃部の周囲に粘着
剤の付き難い処理を施すと共に、ダイ上面よりも1.5
mm以上離れてポンチの上死点よりも低い位置に、粘着フ
ィルムとポンチを離すためのストリッパを設けた請求項
1〜5のいずれか一つに記載の粘着フィルムの貼り付け
装置。
6. A process for hardly attaching an adhesive to the periphery of the cutting blade for punching and cutting of the die, and at least 1.5 times higher than the upper surface of the die.
The adhesive film sticking apparatus according to any one of claims 1 to 5, wherein a stripper for separating the adhesive film and the punch is provided at a position separated by at least mm and lower than the top dead center of the punch.
【請求項7】 粘着フィルムを打抜き加工した後のスク
ラップを送るためのローラを設け、その外周に針を植設
した請求項1〜6のいずれか一つに記載の粘着フィルム
の貼り付け装置。
7. The adhesive film sticking apparatus according to claim 1, further comprising a roller for feeding a scrap after punching the adhesive film, and a needle being implanted on an outer periphery of the roller.
【請求項8】 ポンチおよびダイからなる金型部で、下
面に粘着剤を有する粘着フィルムを打抜き加工し、打ち
抜かれた粘着フィルムをポンチ先端でダイの下方まで押
し下げてダイの真下に位置決め保持した被着物である製
品上に押し付けることによって、打ち抜かれた粘着フィ
ルムを製品上に貼り付ける粘着フィルムの貼り付け方
法。
8. An adhesive film having an adhesive on its lower surface is punched by a die portion comprising a punch and a die, and the punched adhesive film is pressed down to below the die with the tip of the punch and positioned and held directly below the die. A method of attaching an adhesive film, in which a punched adhesive film is attached to a product by pressing the product onto a product to be adhered.
JP10166649A 1998-06-15 1998-06-15 Sticking apparatus and method for adhesive film Pending JPH11348950A (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015040066A (en) * 2013-08-23 2015-03-02 千代田インテグレ株式会社 Adhering method and adhering device of plurality of members
CN108247739A (en) * 2017-12-22 2018-07-06 东莞领益精密制造科技有限公司 The lid product processing device that a kind of machine patch materials and parts product section is imposed uniformity without examining individual cases
CN108609252A (en) * 2018-06-28 2018-10-02 东莞理工学院 A kind of packing box automatic labeling machine
DE102018210746A1 (en) * 2018-06-29 2020-01-02 Tesa Se Stamped part applicator and method for applying stamped parts to surfaces as well as a stamped part tape
JP2021009931A (en) * 2019-07-01 2021-01-28 株式会社 ベアック Sticking device and sticking method

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50108900A (en) * 1974-01-31 1975-08-27
JPS50114200A (en) * 1974-02-16 1975-09-06
JPS602429A (en) * 1983-06-03 1985-01-08 株式会社日立製作所 Device for mounting nameplate
JPS638252U (en) * 1986-06-30 1988-01-20
JPH0356227A (en) * 1989-07-19 1991-03-11 Landis & Gyr Betrieps Ag Adhering device for thermal adhesion film
JPH06122435A (en) * 1992-10-05 1994-05-06 Mamoru Kamo Device for affixing label on egg container
JPH0733129A (en) * 1993-07-08 1995-02-03 Sato:Kk Label-affixing device
JPH07205508A (en) * 1994-01-11 1995-08-08 Inoac Corp Carrier roller
JPH09124018A (en) * 1995-10-31 1997-05-13 Osaka Sealing Insatsu Kk Label sticking device
JPH1015893A (en) * 1996-07-03 1998-01-20 Tokuji Komatsu Device for bonding seal and patch and for punching

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50108900A (en) * 1974-01-31 1975-08-27
JPS50114200A (en) * 1974-02-16 1975-09-06
JPS602429A (en) * 1983-06-03 1985-01-08 株式会社日立製作所 Device for mounting nameplate
JPS638252U (en) * 1986-06-30 1988-01-20
JPH0356227A (en) * 1989-07-19 1991-03-11 Landis & Gyr Betrieps Ag Adhering device for thermal adhesion film
JPH06122435A (en) * 1992-10-05 1994-05-06 Mamoru Kamo Device for affixing label on egg container
JPH0733129A (en) * 1993-07-08 1995-02-03 Sato:Kk Label-affixing device
JPH07205508A (en) * 1994-01-11 1995-08-08 Inoac Corp Carrier roller
JPH09124018A (en) * 1995-10-31 1997-05-13 Osaka Sealing Insatsu Kk Label sticking device
JPH1015893A (en) * 1996-07-03 1998-01-20 Tokuji Komatsu Device for bonding seal and patch and for punching

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015040066A (en) * 2013-08-23 2015-03-02 千代田インテグレ株式会社 Adhering method and adhering device of plurality of members
CN108247739A (en) * 2017-12-22 2018-07-06 东莞领益精密制造科技有限公司 The lid product processing device that a kind of machine patch materials and parts product section is imposed uniformity without examining individual cases
CN108609252A (en) * 2018-06-28 2018-10-02 东莞理工学院 A kind of packing box automatic labeling machine
DE102018210746A1 (en) * 2018-06-29 2020-01-02 Tesa Se Stamped part applicator and method for applying stamped parts to surfaces as well as a stamped part tape
US11260644B2 (en) 2018-06-29 2022-03-01 Tesa Se Applicator for die-cut parts and method for applying die-cut parts to surfaces, and a die-cut part strip
JP2021009931A (en) * 2019-07-01 2021-01-28 株式会社 ベアック Sticking device and sticking method

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