KR102298472B1 - Bonding apparatus and bonding method - Google Patents

Abstract

The time required for a sticking process is short, and the sticking apparatus with high productivity is provided. A substrate holding table 11 for holding the substrate Wb, and a temporary bonding film Wf disposed above the substrate holding table 11 and temporarily bonded to the lower surface of the transparent film 200 by the affixing member Ws are placed at a predetermined position. The conveying apparatus 20 conveyed by , the imaging device 30 which is arrange|positioned above the temporary bonding film Wf, and image the pasting plan position of the pasting member Ws in the board|substrate Wb, and the pasting member Ws, and the imaging device 30 ), a correction device 70 for correcting the position and posture of the substrate Wb or the affixing member Ws, and the temporary bonding film Wf or the substrate Wb vertically moved to press the affixing member Ws to the substrate Wb A sticking device provided with a crimping device.

Description

A sticking device and a sticking method {BONDING APPARATUS AND BONDING METHOD}

The present invention relates to a sticking device and a sticking method.

Conventionally, in the process of forming a flexible wiring board etc. (henceforth "substrate"), in order to raise the intensity|strength of a board|substrate, the pasting process of sticking sticking members, such as a reinforcing plate, to a board|substrate is performed. As a sticking apparatus which performs such a sticking process, the apparatus which moves a sticking member to the sticking position of a board|substrate in the state which adsorb|sucked by the adsorption|suction part, and sticks a sticking member to a board|substrate is mentioned (for example, refer patent document 1). .

18 : is a figure for demonstrating the conventional sticking apparatus.

In patent document 1, the adsorption|suction part 924 which adsorb|sucks the reinforcing plate 903 from upper direction, this adsorption|suction part 924 is moved horizontally, and the reinforcing plate 903 is conveyed to the upper direction of the flexible wiring board stock part 902. An apparatus comprising a conveying mechanism 925 to be used and a lifting mechanism 926 for attaching the reinforcing plate 903 to the flexible wiring board 901 by lowering the suction unit 924 is disclosed. Thus, according to the conventional apparatus, a reinforcing plate can be stuck with respect to a board|substrate automatically.

Japanese Patent Laid-Open No. Hei 02-26095

However, since the apparatus of patent document 1 required the adsorption|suction operation|movement which makes the reinforcing plate adsorb|suck to an adsorption|suction part, there existed a possibility that the attitude|position of a reinforcing plate may shift|deviate at the time of adsorption|suction operation|movement. For this reason, the operation|work which an operator confirms the attitude|position of the reinforcing plate adsorb|sucked by the adsorption|suction part as needed arises, and there exists a problem that it will become an obstacle in improving productivity. Moreover, in the apparatus of patent document 1, since adsorption|suction operation|movement is required with respect to each reinforcement plate each, there exists a problem that the time required for a sticking process becomes long.

In addition, such a problem is not a problem which can arise only in the apparatus which sticks a reinforcing plate to a board|substrate, It is a problem which can arise similarly also to the pasting apparatus which sticks sticking members other than a reinforcing plate to a board|substrate.

Then, this invention was made|formed in order to solve the above problems, and the time required for a sticking process is short, and an object of this invention is to provide the sticking apparatus and sticking method with high productivity.

[1] The sticking device of the present invention is a sticking device for sticking a sticking member to a predetermined position on a substrate, comprising: a substrate holding table for holding the substrate to which the sticking member is to be pasted; It is arranged on the upper side, the conveying apparatus which conveys the temporary bonding film by which the said pasting member was temporarily bonded to the lower surface of a transparent film to a predetermined position, and it arrange|positioned above the said provisional bonding film, The pasting of the said pasting member in the said board|substrate An imaging device for imaging the predetermined position and the affixing member, and the position of the substrate or the affixing member is corrected based on the positional shift information of the predetermined affixing position and the position of the affixing member imaged by the imaging device, A correction device for correcting the posture of the substrate or the pasting member based on the posture information of the pasting member with respect to the intended pasting position imaged by the imaging device; and a crimping device for crimping the affixing member to the substrate.

The affixing apparatus of this invention is based on the conveyance apparatus which conveys a temporary bonding film to a predetermined position, and the information of the position and attitude|position of a pasting position and the pasting member imaged by the imaging apparatus, The position and attitude|position of a board|substrate or a affixing member A correction device for correcting the sizing, and a crimping device for crimping the affixing member to the substrate by moving the temporary bonding film or the substrate in an up-down direction. For this reason, according to the sticking apparatus of this invention, the adsorption|suction operation|movement which makes the sticking member adsorb|suck like the prior art becomes unnecessary, a temporary bonding film can be moved, and the position and attitude|position of a sticking member can be corrected. Therefore, the time required for a sticking process becomes short, and productivity can be raised.

In addition, in this specification, a "substrate" means a member to which an affixing member is affixed, For example, the base film as a substrate material, such as a flexible substrate, a rigid substrate, a glass substrate, is mentioned. In addition, in this specification, a "sticking member" means a member affixed to a board|substrate, For example, a reinforcing plate, a heat sink, a protective film, a coverlay film, etc. are mentioned. In addition, in this specification, "apposition plan position" means to use as a reference|standard of the position in a board|substrate, For example, the circuit pattern formed in the board|substrate, a device hole, a through hole, an alignment mark, etc. are mentioned. have. In addition, in this specification, "a sticking process" means one manufacturing process of sticking a sticking member to a board|substrate by the sticking method using the sticking apparatus of this invention.

[2] In the pasting apparatus of the present invention, the crimping apparatus is configured such that the temporary bonding film can be moved up and down with respect to the substrate along an X axis parallel to the upper surface of the substrate holding table and a Z axis perpendicular to the Y axis. It is preferred to be constructed.

In this way, since the crimping apparatus is configured such that the temporarily bonded film can be moved up and down with respect to the substrate along the X axis parallel to the upper surface of the substrate holding table and the Z axis perpendicular to the Y axis, the provisional bonding film is moved along the X axis and the Y axis. By moving it along the Z-axis perpendicular|vertical to an axis, it can press-bond in the state arrange|positioned at the appropriate position with respect to a board|substrate with respect to a sticking member.

[3] In the pasting apparatus of this invention, it is preferable that the said crimping|compression-bonding apparatus is equipped with the pressure head which presses the surface of the said temporary bonding film corresponding to the planar position of the said pasting member from the said transparent film side.

In this way, since the crimping device includes a pressure head that presses the surface of the temporary bonding film corresponding to the planar position of the pasting member from the transparent film side, the pasting member can be easily crimped to the substrate, and productivity is further improved. can

[4] In the pasting apparatus of the present invention, the pressure head has at least a tip portion that can be in contact with the surface of the temporary bonding film along the X axis parallel to the upper surface of the substrate holding table and the Z axis perpendicular to the Y axis. It is preferable to be configured to be liftable.

In this way, since the pressure head is configured such that at least the tip portion capable of contacting the surface of the temporary bonding film can be raised and lowered along the X axis parallel to the upper surface of the substrate holding table and the Z axis perpendicular to the Y axis, It can easily contact the surface of the temporary bonding film corresponding to the planar position of a member, and press the said surface.

[5] In the pasting apparatus of the present invention, the pressure head moves at least the tip along the Z axis from a state in which the temporary bonding film and the substrate are spaced apart by a predetermined distance, corresponding to the planar position of the pasting member It is preferable to press the surface of the temporary bonding film.

In this way, the pressing head moves the tip portion capable of contacting at least the surface of the temporary bonding film from the state in which the temporary bonding film and the substrate are spaced apart by a predetermined distance, and presses the surface of the temporary bonding film corresponding to the planar position of the affixing member. . For example, in a state in which the temporary bonding film and the substrate are in contact, when the surface of the temporary bonding film corresponding to the planar position of the pasting member to be pasted is pressed, the temporary bonding film is in contact with the substrate, so that the bonding member is in a planar position. There exists a possibility that parts other than the surface of the corresponding temporary bonding film may be bonded to a board|substrate, or there exists a possibility that other sticking members which are not going to stick may fall off from a temporary bonding film. However, according to the present invention, in the provisional bonding film, portions other than the surface of the temporary bonding film corresponding to the planar position of the pasting member remain spaced apart from the substrate, and therefore, provisional bonding corresponding to the planar position of the pasting member is maintained. While being able to suppress the situation where parts other than the surface of a film are bonded to a board|substrate, the situation where the said other affixing member falls off from a temporary bonding film can be suppressed.

[6] In the pasting apparatus of the present invention, the pressure head is configured to be expandable and contractible along the Y-axis, and a tip portion capable of contacting the surface of the temporary bonding film includes a crimping position above the temporary bonding film, and It is preferable to be comprised so that movement between the retreat positions retreated from the upper direction of a temporary bonding film is possible.

In this way, the pressure head is configured such that the tip portion of the pressure head capable of contacting the surface of the provisional bonding film is movable between the upper pressing position of the provisional bonding film and the retracting position retracted from above the provisional bonding film. For example, when the area of the part in contact with the temporary bonding film surface is larger than the sticking member, since the sticking member is covered by the front-end|tip part of a pressure head, imaging of the sticking member by an imaging device is difficult. Even in such a case, according to the present invention, since the tip of the pressure head can be moved to the retracted position at the time of imaging by the imaging device, positional shift information between the intended sticking position and the position of the sticking member and the sticking member relative to the intended sticking position. of posture information can be obtained appropriately.

[7] In the pasting apparatus of this invention, it is preferable that the said pressure head is arrange|positioned with the heater which heats the surface of the said temporary bonding film corresponding to the planar position of the said pasting member.

A thermosetting adhesive may be used in pasting of an affixing member. In this case, for example, by applying the adhesive in advance to the contact surface with respect to the substrate in the affixing member, when the affixing member is heated in a state in which the affixing member is in contact with the substrate, the adhesive is softened or melted, The affixing member can be affixed to a board|substrate. According to the present invention, since a heater for heating the surface of the temporary bonding film corresponding to the planar position of the affixing member is disposed in the pressure head, the portion in contact with the surface of the temporary bonding film is heated by conducting heat from the heater. can do. For this reason, in a state in which the pressure head is sufficiently heated, the pressure head can be brought into contact with the surface of the temporary bonding film, so that the adhesive can be easily softened or melted, and the pasting member can be reliably attached to the substrate, The time required for the pasting process can be shortened.

[8] In the pasting apparatus of the present invention, the pressure head is preferably formed so that the area of the portion in contact with the surface of the temporary bonding film is the same size as the pasting member or smaller than the size of the pasting member. .

In this way, since the pressure head is formed so that the area of the portion in contact with the surface of the temporary bonding film is the same size as that of the pasting member or smaller than the size of the pasting member, the situation of simultaneously pressing a plurality of pasting members is suppressed, The sticking member which is going to stick can be affixed reliably at the sticking plan position in a board|substrate. In particular, when the sticking device of the present invention is a pressure bonding device, it is preferable to form the pressure head as described above, since at least a part of the sticking member may be reliably pressed against the substrate by the pressure head as pressure bonding.

[9] In the pasting apparatus of the present invention, the transparent film is a film whose adhesive strength is lowered by heating to a predetermined temperature or higher, and the temporary bonding film has the pasting member bonded to the lower surface of the transparent film, and the pressure It is preferable that the head heats the surface of the said temporary bonding film corresponding to the planar position of the said affixing member to the said predetermined temperature or more with the said heater, and reduces the adhesive force of the said transparent film with respect to the said affixing member.

As described above, since the provisional bonding film is a film in which the adhesive force is lowered by heating at a predetermined temperature or higher, the adhesive member is bonded to the lower surface of the transparent film, so that the pressing head heated to the predetermined temperature or higher by the heater is the plane of the sticking member scheduled to be pasted. By pressing the surface of the temporary bonding film corresponding to a position, the adhesive force of the transparent film with respect to the pasting member which is going to stick can be reduced. Therefore, the pasting apparatus can peel easily the pasting member which is going to stick from a transparent film among a temporary bonding film. In addition, in the process of pressing the affixing member to the substrate with the pressure head, since the affixed member can be peeled from the transparent film, there is no need to separately provide a step for peeling the affixed member from the transparent film, which is required in the affixing process. time can be shortened.

[10] In the sticking device of the present invention, the sticking member is preferably a member in which the adhesive force of the surface on the opposite side to the surface to be bonded to the transparent film is increased by heating.

As described above, since the affixing member is a member in which the adhesive force of the surface on the opposite side to the surface to be bonded to the transparent film is increased by heating, the pressing head is placed on the surface of the temporary bonding film while the pressing head is sufficiently heated by the heater. By making it contact, the adhesive force of the surface on the opposite side to the surface bonded to the transparent film of an affixing member can be raised. Therefore, since the sticking device can simultaneously pressurize and heat with a pressure head, while sticking a sticking member to a board|substrate reliably, the time required for a sticking process can be shortened.

[11] In the pasting apparatus of the present invention, the correcting apparatus moves at least one of the substrate holding table and the conveying device along X and Y axes parallel to the upper surface of the substrate holding table, and , it is preferable to rotate around the X-axis and the Z-axis perpendicular to the Y-axis.

In this way, the compensating device moves at least one of the substrate holding table and the transfer device along the X and Y axes parallel to the upper surface of the substrate holding table, and the circumference of the Z axis perpendicular to the X and Y axes. In order to rotate it, the temporary bonding film or the substrate may be moved along the X-axis and Y-axis, and also rotated about the Z-axis. Therefore, the sticking apparatus correct|amends easily and appropriately the position and attitude|position of a board|substrate or a sticking member based on the information of the position and attitude|position of the sticking member in the board|substrate imaged by the imaging device, and the position and attitude|position of the sticking member. can do.

[12] In the pasting apparatus of the present invention, the conveying apparatus comprises: a feeding apparatus for feeding the elongated temporary bonding film wound into a roll into a sheet shape along a predetermined direction; It is preferable to provide the winding-up apparatus which winds up a film in roll shape, and to convey the said conveying apparatus intermittently along the said predetermined direction the said temporary bonding film drawn out from the said feeding|feeding apparatus.

In this way, the conveying device comprises a feeding device for feeding a long temporary bonding film wound in a roll shape into a sheet, and a winding device for winding the transparent film from which the affixing member has peeled from the temporary bonding film in a roll shape, The temporary bonding film is intermittently conveyed. For this reason, since an affixing apparatus can stick an affixing member to a board|substrate sequentially, conveying intermittently conveying the elongate temporary bonding film wound in roll shape, productivity can be improved.

[13] In the pasting apparatus of the present invention, it is preferable that, in the provisional bonding film, a plurality of the above bonding members are temporarily bonded to the lower surface of the transparent film.

As described above, in the provisional bonding film, since a plurality of affixing members are temporarily bonded to the lower surface of the transparent film, for example, after the affixing of one affixing member to the substrate is completed, the temporary bonding film is applied with a new affixing member. An operation such as replacing it with a bonded temporary bonding film becomes unnecessary. Therefore, the pasting apparatus only moves the temporary bonding film suitably by a conveying apparatus and a correction|amendment apparatus so that the pasting member scheduled to be next attached may be suitably arrange|positioned at the pasting schedule position in a board|substrate, and the said pasting member in a board|substrate It can be affixed suitably to a pasting schedule position, and productivity can be raised.

[14] In the sticking device of the present invention, the sticking member is preferably a reinforcing plate for reinforcing the substrate.

Thus, since an affixing member is a reinforcing plate which reinforces a board|substrate, a pasting apparatus can produce|generate the board|substrate with which the reinforcing board was affixed at the appropriate position with high precision.

[15] It is preferable that the pasting apparatus of this invention is a press-bonding apparatus which press-bonds the said pasting member to the predetermined position of the said board|substrate.

Thus, since the pasting apparatus is a press-bonding apparatus which press-bonds the pasting member to the predetermined position of a board|substrate, it can produce|generate the board|substrate with which the reinforcing plate was press-bonded in the appropriate position with high precision.

[16] The sticking method of the present invention is a sticking method using a sticking device for sticking a sticking member to a predetermined position on a substrate, wherein the temporary joining film to which the sticking member is temporarily joined to the lower surface of a transparent film is provided, wherein the sticking member is A transfer step of conveying the substrate to a predetermined position above a substrate holding table holding the substrate to be affixed, and an imaging device disposed above the temporary bonding film, the affixing schedule of the affixing member on the substrate An imaging process of imaging a position and the said affixing member, based on the position shift information of the said pasting scheduled position imaged by the said imaging process, and the position of the said affixing member, correct|amend the position of the said board|substrate or the said affixing member, and said A correction step of correcting the posture of the substrate or the pasting member based on the posture information of the pasting member with respect to the intended pasting position imaged by the imaging step, and the temporary bonding film or the substrate moving in the vertical direction It is characterized by including the crimping|compression-bonding process of crimping|bonding the said sticking member to the said board|substrate.

In the pasting method of this invention, the conveyance process of conveying a temporary bonding film to the predetermined position above a board|substrate holding table, the imaging process of imaging the pasting position and the pasting member of the pasting member in a board|substrate, and an imaging process A correction step of correcting the position and posture of the substrate or the affixing member based on the information captured by the device, and a crimping step of pressing the affixing member to the substrate by moving the temporary bonding film or substrate in the vertical direction. For this reason, according to the pasting method of this invention, the adsorption|suction operation|movement which makes the pasting member adsorb|suck like the prior art becomes unnecessary, a temporary bonding film can be moved, and the position and attitude|position of a pasting member can be corrected. Therefore, the time required for a sticking process becomes short, and productivity can be raised.

In the pasting method of this invention, in the said crimping|compression-bonding process, it is preferable to raise and lower the said temporary bonding film with respect to the said board|substrate along an X-axis parallel to the upper surface of the said board|substrate holding table, and Z-axis perpendicular to a Y-axis.

In the pasting method of this invention, in the said crimping|compression-bonding process, it is preferable to press the surface of the said temporary bonding film corresponding to the planar position of the said pasting member from the said transparent film side with a pressure head.

In the pasting method of the present invention, in the crimping step, at least along the X-axis parallel to the upper surface of the substrate holding table and the Z-axis perpendicular to the Y-axis, a tip portion capable of contacting the surface of the temporary bonding film can be raised and lowered. It is preferable to press the surface of the said temporary bonding film corresponding to the planar position of the said affixing member by this.

In the pasting method of the present invention, in the pressing step, from a state in which the temporary bonding film and the substrate are spaced apart by a predetermined distance, at least the leading end of the pressure head is moved along the Z axis, and to a planar position of the pasting member It is preferable to press the surface of the corresponding provisional bonding film.

In the pasting method of this invention, in the said imaging process, the front-end|tip part of the pressure head expandable and contractible along the said Y-axis from the upper compression position of the said temporary bonding film which can contact the surface of the said temporary bonding film, above the said temporary bonding film. It is preferable to move it to the retracted position retracted from the .

In the pasting method of this invention, as for the said pressure head, it is preferable that the heater which heats the surface of the said temporary bonding film corresponding to the planar position of the said pasting member is arrange|positioned.

In the pasting method of this invention, it is preferable that the said pressure head is formed so that the area of the part in contact with the surface of the said temporary bonding film is the same size as the said pasting member, or smaller than the size of the said pasting member.

In the pasting method of the present invention, the transparent film is a film whose adhesive strength is lowered by heating to a predetermined temperature or higher, and the temporary bonding film has the pasting member bonded to the lower surface of the transparent film, and the pressure head is , It is preferable to heat the surface of the said temporary bonding film corresponding to the planar position of the said affixing member to the said predetermined temperature or more with the said heater, and to reduce the adhesive force of the said transparent film with respect to the said affixing member.

In the sticking method of this invention, it is preferable that the said sticking member is a member whose surface adhesive force on the opposite side to the surface joined to the said transparent film becomes high by heating.

In the pasting method of this invention, the said correction|amendment process moves at least one of the said board|substrate holding table and the said conveyance apparatus along X-axis and a Y-axis parallel to the upper surface of the said board|substrate holding table, and the said X It is preferred to rotate about an axis and a Z axis perpendicular to the Y axis.

In the pasting method of the present invention, the conveying step includes a feeding step of feeding the elongated temporary bonding film wound into a roll into a sheet shape along a predetermined direction, and the transparent film from which the pasting member is peeled from the temporary bonding film in a roll form. It is preferable that the said conveying process intermittently conveys the said temporary bonding film drawn out by the said feeding|feeding-out process along the said predetermined direction, including the winding-up process of winding up with

In the pasting method of this invention, as for the said temporary bonding film, it is preferable that the some said pasting member is temporarily bonded to the lower surface of the said transparent film.

In the pasting method of this invention, it is preferable that the said pasting member is a reinforcing plate which reinforces the said board|substrate.

It is preferable that the sticking method of this invention is a method of press-bonding the said sticking member to the predetermined position of the said board|substrate.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure for demonstrating the board|substrate Wb to which the reinforcement board Ws was affixed.
2 : is a figure for demonstrating the temporary bonding film Wf.
3 : is a perspective view of the sticking apparatus 1 which concerns on this embodiment.
4 : is a front view of the pasting apparatus 1 which concerns on this embodiment.
5 : is an enlarged view of the area|region A in the front view of the pasting apparatus 1 shown in FIG.
6 : is a perspective view of the pressure head 50 with which the sticking apparatus 1 which concerns on this embodiment is equipped.
7 is a flowchart including main steps of the pasting method according to the present embodiment.
8 : is a principal part top view for demonstrating the sticking method which concerns on this embodiment.
9 : is a principal part top view for demonstrating the sticking method which concerns on this embodiment.
10 : is a principal part top view for demonstrating the sticking method which concerns on this embodiment.
11 : is a principal part top view for demonstrating the sticking method which concerns on this embodiment.
12 : is a principal part front view for demonstrating the sticking method which concerns on this embodiment.
13 : is a principal part front view for demonstrating the pasting method which concerns on this embodiment.
14 : is a principal part front view for demonstrating the sticking method which concerns on this embodiment.
15 : is a figure for demonstrating the modified example of the board|substrate Wb1 to which the reinforcement board Ws1 was affixed.
It is a figure for demonstrating the modified example of a press head.
17 : is a figure for demonstrating the modification of a press head.
18 : is a figure for demonstrating the conventional sticking apparatus.

EMBODIMENT OF THE INVENTION Hereinafter, the sticking apparatus of this invention is demonstrated based on embodiment shown in drawing. In addition, each drawing is a schematic diagram, and does not necessarily reflect an actual structure, an external appearance, etc. strictly.

1. Composition of substrate and pasting member

The board|substrate and sticking member which are the handling object of the sticking apparatus 1 of this invention are demonstrated.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure for demonstrating the board|substrate Wb to which the reinforcement board Ws was affixed. 2 : is a figure for demonstrating the temporary bonding film Wf.

The board|substrate Wb is a member to which the pasting member Ws mentioned later is pasted, Preferably it is a member which requires reinforcement. In addition, the board|substrate Wb may be a member of any shape as long as it is a member to which the sticking member Ws is affixed, Preferably it is a member made into flat plate shape. In addition, the board|substrate Wb is mounted on the upper surface of the board|substrate holding table 11 mentioned later. In this embodiment, as a board|substrate Wb, it is a base film as a flexible board|substrate material, and is demonstrated taking as an example the member in which the circuit pattern 110 was formed in matrix form (refer FIG. 1). In addition, although the size and shape of the board|substrate Wb can be suitably designed and changed according to the kind, use, etc. of the board|substrate Wb, it is comprised, for example in a planar view in a rectangle of about 250 mm x 250 mm. In addition, the board|substrate Wb does not need to be a member which requires reinforcement, as long as the sticking member Ws is a stickable member. In addition, the board|substrate Wb is not limited to the base film as a flexible board|substrate material, For example, board|substrates, such as a rigid board|substrate and a glass substrate, may be sufficient.

The affixing member Ws is a member affixed to the board|substrate Wb, Preferably it is a member which reinforces the said board|substrate Wb for the purpose of mechanical reinforcement of the board|substrate Wb, heat radiation, electromagnetic shielding, etc. The sticking member Ws is preferably formed of a metal such as stainless steel or aluminum, or a resin flat plate, and more preferably a metal flat plate. In addition, the pasting member Ws is not limited to the reinforcing plate which reinforces the board|substrate Wb, For example, metal members, such as a heat sink, resin members, such as a protective film and a coverlay film, Any member attached to the board|substrate Wb. may be In addition, although the shape and size of the sticking member Ws can be suitably designed and changed according to the purpose of sticking the sticking member Ws, the shape of the sticking position of a board|substrate, etc., the said magnitude|size is, for example, the length Sx of the horizontal direction in planar view is 5 mm, the length Sy in the longitudinal direction is about 5 mm (refer to Fig. 2). In this embodiment, the reinforcing plate affixed to the part which needs reinforcement in the circuit pattern 110 formed in the board|substrate Wb as an affixing member Ws is mentioned as an example and demonstrated (refer FIG. 1). In addition, in the following description, "reinforcing plate as affixing member Ws" is also simply called "reinforcing plate Ws."

In FIG. 1, the film by which the reinforcement board Ws was affixed to the part which needs reinforcement with respect to the board|substrate Wb is called the reinforcement plate pasting completion board|substrate 100. By cutting out a portion of each circuit pattern 110f from the reinforcing plate pasted substrate 100 as shown in Fig. 1, the flexible substrate FPC for the circuit pattern 110f reinforced with the reinforcing plate Wsf (Fig. 1). See in the dashed circle) can be obtained. In addition, in this embodiment, as shown in FIG. 1, as for the board|substrate Wb, the circuit pattern 110 in the state in which two circuit patterns 110f which one flexible board|substrate FPC has are connected is formed in the matrix type. In addition, in this embodiment, as shown in FIG. 1, the sticking apparatus 1 sticks and reinforces the reinforcement board Ws of the state which two reinforcement board Wsf which one flexible board|substrate FPC has connected to the board|substrate Wb. The board|board pasting completion board|substrate 100 is produced|generated. Flexible board|substrate FPC is produced|generated by cutting off the part of 110f of one circuit pattern to which one reinforcing board Wsf was pasted from this reinforcing plate pasting completion board|substrate 100. In the pasting apparatus 1 which concerns on this embodiment, the circuit pattern 110 currently formed in the board|substrate Wb can be used as a reference|standard of the pasting plan position of the reinforcement board Ws in the board|substrate Wb. That is, in this embodiment, the circuit pattern 110 corresponds to the pasting plan position of the pasting member of this invention. In addition, the shape of the circuit pattern 110 is not limited to the shape shown in FIG. 1, The design can be changed suitably according to the kind, use, etc. of the board|substrate Wb. In addition, the reinforcing plate pasted board|substrate 100 has circuit pattern 110f and reinforcing board Wsf which the circuit pattern 110f which forms one flexible board|substrate FPC, and the reinforcing board Wsf, respectively connected two by two, and reinforcing board Wsf, but this invention It is not limited to this, For example, the circuit pattern 110f and the reinforcing plate Wsf may be arrange|positioned in the board|substrate Wb, without multiple connection.

The pasting member Ws is held as a temporary bonding film Wf temporarily bonded to the lower surface of the transparent film 200 in the state before being stuck to the board|substrate Wb (refer FIG. 2). As shown in FIG. 2 , the temporary bonding film Wf is a long film in which a plurality of reinforcing plates Ws are aligned and temporarily bonded to the lower surface of the transparent film 200 , and is wound and held by a feeding device 22 to be described later in a roll shape. is supported In addition, arrangement|positioning of the reinforcement board Ws in the temporary bonding film Wf is not specifically limited, For example, it may be arrange|positioned irregularly without aligning, and may be arrange|positioned in a line and may be arrange|positioned. In addition, the number of objects of the reinforcing plate Ws in the temporary bonding film Wf is not specifically limited, One may be sufficient as it, and multiple pieces may be sufficient as it. In addition, the temporary bonding film Wf is not limited to a film in which a plurality of reinforcing plates Ws of the same shape are temporarily bonded as shown in FIG. may be

The transparent film 200 is a film composed of a resin or the like having a predetermined adhesive force, and is a thermal release film whose adhesive strength is lowered by heating at a predetermined temperature, for example, 100°C or higher. That is, when the temporary bonding film Wf is heated to a predetermined temperature or more, the bonded reinforcing plate Ws is peeled from the transparent film 200 . As for the reinforcing plate Ws, the surface on the opposite side to the surface joined to the transparent film 200 is affixed to the board|substrate Wb. The reinforcing plate Ws is preferably configured such that the adhesive force of the surface on the opposite side to the surface bonded to the transparent film 200 (that is, the surface affixed to the substrate Wb) becomes high. More specifically, as for the reinforcement board Ws, the adhesive layer is formed in the surface affixed to the board|substrate Wb. This adhesive layer is composed of a solid adhesive containing a thermoplastic resin component and is hardened at room temperature, but melts or softens when heated to a predetermined temperature, for example, 80°C or higher.

The sticking apparatus 1 peels the said reinforcement board Ws from the transparent film 200 by heating the surface of the temporary bonding film Wf corresponding to the planar position of the reinforcement board Ws which is going to stick to at least the temperature T, and, further, the said reinforcement In a state in which the adhesive layer of the plate Ws is melted or softened, the reinforcing plate Ws is pressed against the substrate Wb. And by cooling the board|substrate Wb by which the reinforcement board Ws was crimped|bonded in this way to room temperature, an adhesive layer hardens|cures, and the reinforcement board pasting completion board|substrate 100 to which the reinforcement board Ws was affixed is formed. In addition, the temperature T is higher than the temperature at which the adhesive force of the transparent film 200 decreases and the temperature at which the adhesive layer is melted or softened, and is lower than the temperature at which the transparent film 200 is melted, there is no particular restriction, preferably is 100°C to 120°C. The detail of the method of affixing the reinforcing plate Ws to the board|substrate Wb is mentioned later.

2. Configuration of the affixing device (1)

The structure of the pasting apparatus 1 of this invention is demonstrated with reference to drawings.

3 : is a perspective view of the sticking apparatus 1 which concerns on this embodiment. 4 : is a front view of the pasting apparatus 1 which concerns on this embodiment. 5 : is an enlarged view of the area|region A in the front view of the pasting apparatus 1 shown in FIG. 6 : is a perspective view of the pressure head 50 with which the sticking apparatus 1 which concerns on this embodiment is equipped.

2-1. Outline of the configuration of the pasting device 1

The sticking apparatus 1 is a pressure bonding apparatus which press-bonds the reinforcing plate Ws to the board|substrate Wb. The reinforcing plate pasted board|substrate 100 produced|generated by the pasting apparatus 1 is the main crimping|compression-bonding process performed by this crimping apparatus (for example, vacuum press machine etc.) after the process performed by the pasting apparatus 1 Thereby, the reinforcement board Ws currently press-bonded to the said reinforcement board pasting completion board|substrate 100 is main-compression-bonded. In this way, in the state in which the reinforcing plate Ws is main crimped, a portion of each circuit pattern 110f is cut off, so that the flexible substrate FPC for the circuit pattern 110f reinforced with the reinforcing plate Wsf (refer to the broken line circle in FIG. 1 ). is created In addition, detailed description is abbreviate|omitted about this crimping|compression-bonding apparatus and this crimping|compression-bonding process. In addition, unless otherwise indicated, in this specification, the reinforcing plate Ws "sticks" to the board|substrate Wb is demonstrated as meaning equivalent to "temporarily press-bonded" the reinforcing board Ws to the board|substrate Wb.

The sticking apparatus 1 is equipped with the base 10, the board|substrate holding table 11, the conveying apparatus 20, the imaging apparatus 30, the correction|amendment apparatus 70, and the crimping|compression-bonding apparatus 40. (see FIGS. 3 to 5). The base 10 is a member for mounting and fixing various devices on the upper surface thereof, and may be a metal die or a die using a natural object such as marble. Note that the base 10 may be the ground itself (that is, the substrate holding table 11, the compensating device 70, etc. may be installed directly on the floor surface of the factory). As for the base 10, the board|substrate holding table 11 is arrange|positioned on the upper surface, and is a stand used as the reference|standard of the XY plane and Z-axis which are mentioned later.

In the following description, a plane parallel to the upper surface of the substrate holding table 11 is defined as an XY plane including an X-axis and a Y-axis orthogonal to each other, and an axis perpendicular to the XY plane is defined as the Z-axis ( 3 and 4). Moreover, as shown in FIG. 4, when the sticking apparatus 1 is seen from the front, the direction which goes to the right is +X direction, the direction perpendicular to the +X direction, and the direction which goes upward is +Z direction, +X direction. and a direction perpendicular to the +Z direction and a forward direction is defined as a +Y direction, and a clockwise direction when viewed along the +Z axis is defined as a +θ direction. In addition, let the name which attached|subjected the code|symbol - to each direction opposite to each direction (for example, -X direction).

2-2. Substrate holding table (11)

The board|substrate holding table 11 is a member which holds the board|substrate Wb to which the reinforcing board Ws is going to stick. The sticking apparatus 1 is a pair of rails 12 extending along the X-axis direction used as the orbit of the board|substrate holding table 11, and the holding|maintenance which drives the board|substrate holding table 11 along the X-axis direction. A support table driving device (not shown) is provided (see Fig. 3). The board|substrate holding table 11 can move to the predetermined position below the conveyance apparatus 20 along the X-axis direction by a holding table drive device (refer FIG. 4). Further, the holding table driving device is not particularly limited as long as it is a device capable of driving the substrate holding table 11 along the X-axis direction, such as a servo motor, an air cylinder, a cam, or the like.

2-3. conveying device (20)

The conveying apparatus 20 is arrange|positioned above the board|substrate holding table 11, and is an apparatus which conveys the temporary bonding film Wf to a predetermined position (refer FIGS. 4 and 5). The conveying device 20 preferably includes a feeding device 22 for feeding a long temporary bonding film Wf wound in a roll shape in a sheet shape along a predetermined direction, and a transparent film 200 from which the reinforcement plate Ws is peeled from the temporary bonding film Wf. It is provided with the winding device 24 which winds up in roll shape, and guide rollers 26, 27, 28 and 29 which convey the temporary bonding film Wf.

The feeding device 22 has a feeding roller 23 as shown in FIG. 5 . The feeding roller 23 is configured to feed the roll-shaped temporary bonding film Wf into a sheet by rotation (rotation in the direction of the broken-line arrow shown in Fig. 5) driven by a torque motor (not shown). The winding-up device 24 has the winding-up roller 25, as shown in FIG. The winding roller 25 is a transparent film 200 from which the reinforcement plate Ws is peeled from the temporary bonding film Wf by rotation (rotation in the direction of the broken arrow shown in FIG. 5) by driving a torque motor (not shown). It is configured to wind up. The conveying apparatus 20, Preferably, the temporary bonding film Wf fed out from the feeding apparatus 22 is directed along the guide rollers 26, 27, 28, 29 in a predetermined direction (a broken-line arrow direction shown in FIG. 5). intermittently returning In addition, the conveyance direction of the temporary bonding film Wf by the conveying apparatus 20 is not limited to the broken-line arrow direction shown in FIG. 5, For example, the direction opposite to the said broken-line arrow direction may be sufficient. The conveying apparatus 20 is comprised so that movement is possible with the movement along the X-axis direction, the Y-axis direction, the Z-axis direction, and the (theta)-axis direction of the correction|amendment apparatus 70. As shown in FIG.

2-4. imaging device (30)

The imaging device 30 is arrange|positioned above the temporary bonding film Wf, and is an apparatus which image the pasting plan position of the reinforcement board Ws in the board|substrate Wb, and reinforcement board Ws (refer FIG. 5). More specifically, the imaging device 30 images the circuit pattern 110 formed in the reinforcement plate Ws and the board|substrate Wb from the transparent film 200 side (refer FIG. 8). In addition, the imaging range imaged by the imaging device 30 is the reinforcing plate Ws (reinforcing plate Wsa shown in FIG. 8) scheduled to be pasted, and the circuit pattern 110 on the board|substrate Wb which is the pasting position of the said reinforcement board Ws (reinforcement board Wsa) ( As long as it is an imaging range including at least the circuit pattern 110a shown in FIG. 8), there will be no restriction|limiting in particular. The imaging device 30 is configured to be movable with movement along the X-axis direction, the Y-axis direction, the Z-axis direction, and the θ-axis direction of the correction device 70 .

2-5. Calibration device (70)

The correction|amendment apparatus 70 is the circuit pattern 110 (circuit pattern 110a shown in FIG. 8) which is a pasting schedule position imaged by the imaging device 30, and reinforcement board Ws (reinforcement board Wsa shown in FIG. 8). ) is an apparatus for correcting the position of the reinforcing plate Ws based on the position shift information of the position (refer to FIG. 2 ). Moreover, the correction|amendment apparatus 70 is an apparatus which correct|amends the attitude|position of the reinforcement board Ws based on the information of the attitude|position of the reinforcement board Ws with respect to the circuit pattern 110 imaged by the imaging device 30 (refer FIG. 2). ). The correction device 70 is disposed above (+Z direction side) of the transport device 20 , the imaging device 30 , and the crimping device 40 , preferably the transport device 20 , the imaging device 30 . ), and the crimping device 40 is moved in the X-axis direction, the Y-axis direction, the Z-axis direction, and the θ-axis direction. More specifically, the correction device 70 includes a Y-axis drive unit 72 that reciprocates the transport device 20 , the imaging device 30 , and the crimping device 40 in the Y-axis direction, and the transport device 20 . ), an X-axis driving unit 74 for reciprocating the imaging device 30 and the crimping device 40 in the X-axis direction, and the conveying device 20 , the imaging device 30 , and the crimping device 40 in the Z-axis A Z-axis drive unit 76 for reciprocating in the direction is provided; In addition, the Y-axis drive unit 72 , the X-axis drive unit 74 , the Z-axis drive unit 76 , and the θ-axis drive unit 78 are, for example, a servo motor, an air cylinder, a cam, or the like, the conveying device 20 . , the imaging device 30 , and the crimping device 40 are not particularly limited as long as they are movable in the Y-axis direction, the X-axis direction, the Z-axis direction, and the θ-axis direction, respectively.

The sticking apparatus 1 image-processes image data (image data corresponding to the circuit pattern 110 and the reinforcement board Ws) of the object imaged by the imaging apparatus 30. More specifically, the pasting apparatus 1 extracts the outline of an object by performing processes, such as binarization. And the sticking apparatus 1 calculates the information regarding the position and attitude|position of the reinforcement board Ws with respect to the circuit pattern 110 based on such an image process. More specifically, for example, with respect to the circuit pattern 110, the reinforcing plate Ws calculates the shift|offset|difference amount, such as how much position shift|deviated and how much attitude|position shift|deviated with respect to the circuit pattern 110. The correction apparatus 70 correct|amends the position and attitude|position of the reinforcing plate Ws so that the said shift|offset|difference amount may become small based on the shift|offset|difference amount calculated in this way. Moreover, positional shift information of the position of the circuit pattern 110 (circuit pattern 110a shown in FIG. 8) and reinforcement board Ws (reinforcement board Wsa shown in FIG. 8) which are pasting scheduled positions, and the said circuit pattern 110 ), the information on the posture of the reinforcing plate Ws is not limited to the above-described shift amount (relative amount), for example, the absolute position (X-axis and Y-axis coordinates) and the posture (theta-axis of the reinforcing plate Ws). coordinates) can be calculated.

2-6. Crimping Device (40)

The crimping apparatus 40 is an apparatus which moves the temporary bonding film Wf in an up-down direction (Z-axis direction), and crimps|bonds the reinforcing plate Ws to the board|substrate Wb (refer FIG. 5). The crimping apparatus 40 is provided with the base part 42 and the pressure head 50 which presses the surface of the temporary bonding film Wf corresponding to the planar position of the reinforcing plate Ws from the transparent film 200 side (FIG. 5). and FIG. 6). The crimping device 40 is preferably configured to be movable in the X-axis direction, the Y-axis direction, the Z-axis direction, and the θ-axis direction by the correction device 70 . The pressure head 50 moves in the X-axis direction, the Y-axis direction, the Z-axis direction, and the θ-axis direction with the movement of the crimping device 40 (the base part 42 ) by the compensating device 70 . made possible.

The pressure head 50 is equipped with the pressure iron 52 comprised from the substantially L-shaped metal piece at the front-end|tip (+Y direction front-end|tip) which can contact the surface of the temporary bonding film Wf (refer FIG. 6). The pressure iron 52 is configured such that the end of the substantially L-shaped short side is in contact with the surface of the temporary bonding film Wf. The pressure head 50 is preferably configured to be reciprocally movable in the Z-axis direction with respect to the pressure head body 54 by an elevating mechanism (not shown). In the pressure head 50, preferably, the area of the contact surface of the pressure iron 52 with respect to the surface of the temporary bonding film Wf (approximately L-shaped short side end surface) is the size of the reinforcing plate Ws (XY plane of the reinforcing plate Ws). It is formed so that it may become less than the area in ), More preferably, it is formed so that it may become smaller than the magnitude|size of the said reinforcement board Ws. More specifically, for example, when the size of the reinforcing plate Ws is 5 mm in the horizontal direction and 5 mm in the vertical direction when viewed in plan, the surface of the temporary bonding film Wf of the pressure iron 52 is applied to the surface of the reinforcing plate Ws. As for the size of the contact surface, it is preferable that the length Px in the transverse direction is 2 to 3 mm and the length Py in the longitudinal direction is 2 to 4 mm (see FIG. 10 ).

The pressure head 50, Preferably, the heater 53 which heats the surface of the temporary bonding film Wf corresponding to the planar position of the reinforcement plate Ws is arrange|positioned inside it (refer FIG. 12). The path between the heater 53 and the contact surface of the temporary bonding film Wf of the pressure iron 52 is made of, for example, a metallic material, and is configured to conduct heat. Thereby, heat from the heater 53 disposed in the pressure head 50 is conducted to the pressure iron 52 , and the pressure iron 52 can be heated to at least the temperature T. The temperature T is, for example, 100 to 120 ° C., higher than the temperature at which the adhesive force of the transparent film 200 decreases and the temperature at which the adhesive layer is melted, and lower than the temperature at which the transparent film 200 is melted. desirable. Thus, when the pressure iron 52 heated to the temperature T comes into contact with the surface of the temporary bonding film Wf, the sticking apparatus 1 reduces the adhesive force of the transparent film 200 with respect to the reinforcement board Ws, and the said reinforcement The adhesive layer of the plate Ws can be melted. Therefore, the sticking apparatus 1 can peel the reinforcing plate Ws from the transparent film 200. As shown in FIG. In addition, since the pressure iron 52 presses the reinforcing plate Ws in the state in which the adhesive layer is melted, the sticking device 1 can press the reinforcing plate Ws to the substrate Wb. In addition, the heater 53 is always turned on. Although the heater 53 is arrange|positioned inside the pressure head 50 as shown in FIG. 12, it is not limited to this, You may arrange|position inside or its periphery of another component.

3. Operation and sticking method of sticking device 1

Next, the operation|movement and sticking method of the sticking apparatus 1 of this invention are demonstrated with reference to drawings.

7 is a flowchart including main steps of the pasting method according to the present embodiment. 8-11 are main part top views for demonstrating the sticking method which concerns on this embodiment. 12 to 14 are main part front views for demonstrating the sticking method which concerns on this embodiment.

The sticking method which concerns on this embodiment includes a board|substrate arrangement|positioning process (S100), a conveyance process (S110), an imaging process (S120), a correction|amendment process (S130), and a crimping|compression-bonding process (S140). Hereinafter, each process is demonstrated.

3-1. Substrate arrangement process (S100)

A board|substrate arrangement|positioning process is a process of arrange|positioning the board|substrate holding table 11 which hold|maintains the board|substrate Wb to which the reinforcement board Ws is going to be affixed in the lower side predetermined position of the conveyance apparatus 20. As shown in FIG. More specifically, in the board|substrate arrangement|positioning process, the board|substrate holding table 11 is moved along the rail 12 by the holding table drive apparatus (not shown), and the predetermined position below the conveyance apparatus 20. The process of placing it in The predetermined position arranged by the substrate arrangement step is not particularly limited as long as it is at least below the conveying device 20, but it is preferably disposed immediately below the temporary bonding film Wf conveyed by the conveying device 20 ( 8 and 12).

3-2. Conveying process (S110)

The conveying step is a step of conveying the temporary bonding film Wf to a predetermined position above the substrate holding table 11 holding the substrate Wb (refer to FIGS. 8 and 12 ). More specifically, the conveying step is a step of conveying the provisional bonding film Wf so that a predetermined region of the temporary bonding film Wf is disposed at a predetermined position above the substrate holding table 11 holding the substrate Wb. In a conveyance process, as shown in FIG. 12, by the conveying apparatus 20, the provisional bonding film Wf drawn out from the feeding apparatus 22 is conveyed intermittently, and the reinforcement of the pasting plan joined to the provisional bonding film Wf is reinforced. It is conveyed to the position where the board Ws is arrange|positioned above the board|substrate Wb. In Fig. 8, among the nine reinforcing plates Ws joined to the provisional bonding film Wf, the reinforcing plate Ws in which the reinforcing plate Wsa of the upper left portion is scheduled to be affixed (hereinafter, "reinforcement plate Wsa to be affixed" or simply "reinforcement plate Wsa" Also called ').

3-3. Imaging process (S120)

An imaging process is a process of imaging the pasting plan position of the reinforcement board Ws in the board|substrate Wb, and reinforcement board Ws with the imaging device 30 arrange|positioned above the temporary bonding film Wf (refer FIG. 8 and FIG. 12). . More specifically, an imaging process is a process of imaging the circuit pattern 110 and reinforcement board Ws formed in the board|substrate Wb from the transparent film 200 side with the imaging device 30, as shown in FIG. am. Moreover, in FIG. 8, the circuit pattern 110a shown in the 3rd stage from the upper end from the left among the circuit patterns 110 formed in the board|substrate Wb is the circuit pattern 110 which is the pasting position of the reinforcement board Wsa (the following) . Imaging process WHEREIN: The imaging device 30 images pasting schedule reinforcement board Wsa, and the predetermined range containing at least the circuit pattern 110a which is the pasting schedule position of reinforcement board Wsa. In addition, in the conveyance process S110 and the imaging process S120, the space|interval Dz (distance Dz in the Z-axis direction) of the temporary bonding film Wf and the board|substrate Wb does not contact the board|substrate Wb in a conveyance process, but is temporary bonding. If the film Wf can be conveyed and the distance in which the circuit pattern 110 and the reinforcing plate Ws can be imaged by the imaging device 30 in the imaging process, there will be no particular restrictions, but it is preferably about 1 to 2 mm. .

3-4. Calibration process (S130)

A correction process correct|amends the position of the reinforcement board Ws based on the position shift information of the circuit pattern 110 and the position of the reinforcement board Ws imaged by the imaging process S120, and the circuit imaged by the imaging process S120 It is a process of correcting the attitude|position of the reinforcement plate Ws based on the information of the attitude|position of the reinforcement plate Ws with respect to the pattern 110 (refer FIGS. 8 and 9). More specifically, in a correction|amendment process, the correction|amendment apparatus 70 is information regarding the attitude|position of the reinforcement plate Wsa with respect to the circuit pattern 110a calculated based on image processing (reinforcement plate Wsa with respect to the circuit pattern 110a) Based on the amount of displacement of the posture of ), the θ-axis driving unit 78 is driven by a required amount, and the conveying device 20 is moved in the θ direction ( +θ direction or -θ direction), and corrects the posture of the reinforcing plate Wsa (see FIGS. 8 and 9 ). At this time, it is preferable that the correction|amendment apparatus 70 rotates the conveyance apparatus 20 to (theta) direction so that the shift|offset|difference amount of the attitude|position of the reinforcement board Wsa with respect to the circuit pattern 110a may become zero. Moreover, the correction|amendment apparatus 70 is information regarding the positional shift of the position of the circuit pattern 110a and the reinforcement board Wsa calculated based on image processing (the shift amount of the position of the reinforcement board Wsa with respect to the circuit pattern 110a) Based on the , the X-axis drive unit 74 and the Y-axis drive unit 72 are driven by a required amount, and the conveying device 20 is moved in the XY plane so that the amount of displacement of the reinforcing plate Wsa with respect to the circuit pattern 110a becomes small. moves along and corrects the position of the reinforcing plate Wsa (see FIGS. 8 and 9). At this time, it is preferable that the correction|amendment apparatus 70 moves the conveyance apparatus 20 along XY plane so that the shift|offset|difference amount of the position of the reinforcement board Wsa with respect to the circuit pattern 110a may become zero. By performing the correction process in this way, as shown in FIG. 8, from the state in which the circuit pattern 110a on the board|substrate Wb and the reinforcement board Wsa shifted, as shown in FIG. The plate Wsa is placed in a state exactly above the circuit pattern 110a.

In addition, the order of correcting the posture of the reinforcing plate Ws and correcting the position of the reinforcing plate Ws may be reversed. In addition, the shift amount of the position and attitude|position of the reinforcing plate Ws with respect to the circuit pattern 110 is not limited to the shift|offset|difference amount of the position and attitude|position of the reinforcement board Wsa which is going to stick with respect to the circuit pattern 110a which is a affixing position, Other circuits You may calculate the shift|offset|difference amount using the pattern 110 and another reinforcing plate Ws. Correction process WHEREIN: The correction|amendment apparatus 70 moves and rotates the conveyance apparatus 20 with the imaging device 30 and the crimping|compression-bonding apparatus 40. As shown in FIG. In addition, in this embodiment, even if the shift|offset|difference amount of the position of the reinforcing plate Ws with respect to the circuit pattern 110 computed based on image processing was zero, it is considered that the correction|amendment process was performed. In addition, in this embodiment, even if the shift|offset|difference amount of the attitude|position of the reinforcement board Ws with respect to the circuit pattern 110 computed based on image processing was zero, it is considered that the correction|amendment process was performed.

3-5. Compression process (S140)

The crimping step is a step of moving the temporary bonding film Wf in the vertical direction (Z direction) and crimping the reinforcing plate Ws to the substrate Wb (see FIGS. 10, 13 and 14 ). Moreover, in a crimping|compression-bonding process, the surface of the temporary bonding film Wf corresponding to the planar position of the reinforcement board Ws is pressed. More specifically, first, the pasting apparatus 1 applies the pressurizing iron 52 to the pressurizing head body 54 from a state in which the temporary bonding film Wf and the substrate Wb are spaced apart by a distance Dz (see FIG. 12 ). It is moved by a distance Dz along the Z-axis in the -Z direction (in the direction of the broken line arrow shown in FIG. 13 ) (refer to FIG. 13 ). And the sticking apparatus 1 applies an appropriate pressure to the surface of the temporary bonding film Wf with the press iron 52, as shown in FIG. At this time, as shown in FIG. 10, the pasting apparatus 1 presses the surface of the temporary bonding film Wf corresponding to the planar position of the reinforcement board Wsa which is going to stick with the press iron 52. As shown in FIG. More specifically, the pasting apparatus 1 presses the position where the reinforcement board Wsa is joined to the back side in the temporary bonding film Wf with the press iron 52 from the front side. In addition, in a crimping|compression-bonding process, the pasting apparatus 1 may move the press iron 52 along the Z-axis from the state in which the temporary bonding film Wf and the board|substrate Wb are spaced apart larger or smaller than the distance Dz. In this case, first, the pasting apparatus 1 makes the distance between the temporary bonding film Wf and the board|substrate Wb larger or smaller than the distance Dz by moving the crimping|compression-bonding apparatus 40 along the Z-axis with the correction|amendment apparatus 70. In the pasting device 1 , the pressure iron 52 may be moved in the -Z direction only by the distance between the temporary bonding film Wf and the substrate Wb with respect to the pressure head base 54 .

In the present embodiment, the pressure iron 52 is heated to a temperature T by conduction of heat from the heater 53 disposed in the pressure head 50 . The temperature T is, for example, 100 to 120 ° C., higher than the temperature at which the adhesive force of the transparent film 200 decreases and the temperature at which the adhesive layer is melted, and lower than the temperature at which the transparent film 200 is melted. desirable. By pressing the surface of the temporary bonding film Wf corresponding to the planar position of the reinforcing plate Wsa with the pressure iron 52 heated to the temperature T in this way, the adhesive force of the transparent film 200 to the reinforcing plate Wsa is reduced, and The adhesive layer of the reinforcing plate Wsa is melted. Therefore, the reinforcing plate Wsa is peeled from the transparent film 200 . In addition, since the pressure iron 52 presses the reinforcing plate Wsa in the state in which the adhesive layer is melted, the reinforcing plate Wsa can be press-bonded to an appropriate position of the circuit pattern 110a of the substrate Wb.

In this way, when the reinforcing plate Wsa is press-bonded to the substrate Wb, the sticking device 1 moves the pressurizing iron 52 in the +Z direction with respect to the pressurizing head body 54 as shown in Fig. 14 (Fig. 14). By moving in the direction shown by the broken line arrow), the temporary bonding film Wf is separated from the surface of the substrate Wb, and the pressing of the temporary bonding film Wf by the pressing iron 52 on the surface is finished. In this way, the pasting apparatus 1 can produce|generate the reinforcement board pasting completion base film 100 which press-bonded the reinforcement board Wsa which is going to stick to the appropriate position of the circuit pattern 110a of the board|substrate Wb (refer FIG. 11). . The pasting apparatus 1 can produce|generate the reinforcement plate pasting completion base film 100 by which several reinforcement board Ws was affixed to the board|substrate Wb by repeating this pasting method (S100-S140) (refer FIG. 1).

According to the pasting apparatus 1 which concerns on this embodiment, the conveyance apparatus 20 which conveys the temporary bonding film Wf to a predetermined position, and the circuit pattern 110 which is the pasting position of the reinforcement board Ws in the board|substrate Wb (circuit Based on the information of the imaging device 30 which images the pattern 110a) and the reinforcement board Ws (reinforcement board Wsa), and the information of the position and attitude|position of the attachment plan position and reinforcement board Ws imaged by the imaging device 30, A correction device 70 for correcting the position and posture of the reinforcing plate Ws, and a crimping device 40 for crimping the reinforcing plate Ws to the substrate Wb by moving the temporary bonding film Wf in the vertical direction are provided. In this way, since the adsorption|suction operation|movement which makes the reinforcing plate Ws adsorb|suck to the adsorption|suction part is unnecessary by configuring the pasting apparatus 1 in this way, the situation where the attitude|position of the reinforcing board Ws shifts at the time of the said adsorption|suction operation|movement does not arise, but an operator The operation of confirming the posture of the reinforcing plate Ws adsorbed to the temporary adsorption unit becomes unnecessary. Therefore, according to the sticking apparatus 1 which concerns on this embodiment, the time required for a sticking process becomes short, and productivity can be raised. Moreover, since the said adsorption|suction operation|movement becomes unnecessary, the sticking apparatus 1 does not need to be equipped with an adsorption|suction part. Conventionally, it is necessary to create an adsorption|suction part suitably according to the shape of the reinforcing plate Ws which is an adsorption object, and creation of an adsorption|suction part may become difficult depending on adsorption object. However, since the sticking apparatus 1 which concerns on this embodiment does not need to be equipped with the said adsorption|suction part, productivity can be improved more. In addition, in this specification, "a sticking process" means one manufacturing process of sticking reinforcing plate Ws to the board|substrate Wb using the sticking method mentioned above. More specifically, a "pasting process" shows one manufacturing process of affixing the reinforcing plate Ws to the board|substrate Wb (press-bonding) among the manufacturing methods of manufacturing a flexible board|substrate FPC.

Moreover, according to the pasting apparatus 1 which concerns on this embodiment, the crimping|compression-bonding apparatus 40 is a temporary bonding film Wf along an X-axis parallel to the upper surface of the board|substrate holding table 11, and a Z-axis perpendicular|vertical to a Y-axis. Since the temporary bonding film Wf is moved along the Z-axis perpendicular to the X-axis and the Y-axis since it is configured to be able to move up and down with respect to the substrate Wb, the reinforcing plate Ws can be crimped in a state in which it is disposed at an appropriate position with respect to the substrate Wb. .

Moreover, according to the pasting apparatus 1 which concerns on this embodiment, the crimping|compression-bonding apparatus 40 presses the surface of the temporary bonding film Wf corresponding to the planar position of the reinforcing plate Ws from the transparent film 200 side ( 50), the reinforcing plate Ws can be easily pressed against the substrate Wb, and productivity can be further improved.

Moreover, according to the pasting apparatus 1 which concerns on this embodiment, the pressure head 50 has the pressure iron 52 which is a front-end|tip part which can come into contact with the surface of the temporary bonding film Wf on the upper surface of the board|substrate holding table 11. Since it is configured so as to be able to move up and down along the parallel X-axis and the Z-axis perpendicular to the Y-axis, it easily contacts the surface of the temporary bonding film Wf corresponding to the planar position of the reinforcing plate Ws (reinforcement plate Wsa) to be affixed, and the surface can be pressurized. In particular, since the pressure head 50 is configured such that the pressure iron 52 can reciprocate in the Z-axis direction with respect to the pressure head base 54 by an elevating mechanism (not shown), the reinforcing plate to be attached is It is possible to fine-tune the movement in the Z-axis direction to contact the surface of the temporary bonding film Wf corresponding to the planar position of the Ws (reinforcing plate Wsa), so that the pressure iron 52 more appropriately contacts the surface of the temporary bonding film Wf can do it

Moreover, according to the pasting apparatus 1 which concerns on this embodiment, the pressure head 50 comes into contact with the surface of the temporary bonding film Wf from the state (refer FIG. 12) which the temporary bonding film Wf and the board|substrate Wb were spaced apart by the distance Dz. The pressing iron 52, which is a possible tip, is moved to press the surface of the temporary bonding film Wf corresponding to the planar position of the reinforcing plate Ws (see Fig. 13). For example, in a state in which the temporary bonding film Wf and the substrate Wb are brought into contact, when the surface of the temporary bonding film Wf corresponding to the planar position of the reinforcing plate Ws (reinforcement plate Wsa) to be affixed is pressed, the temporary bonding film Wf is the substrate By contacting Wb, portions other than the surface of the temporary bonding film Wf corresponding to the planar position of the reinforcing plate Wsa are bonded to the substrate Wb, or there is a fear that other reinforcing plates Ws that are not scheduled to be pasted may fall off from the temporary bonding film Wf. However, according to the pasting apparatus 1, among the temporary bonding films Wf, parts other than the surface of the temporary bonding film Wf corresponding to the planar position of the reinforcing plate Ws (reinforcing plate Wsa) scheduled to be pasted are separated from the substrate Wb. Since it is maintained, while being able to suppress the situation where parts other than the surface of the temporary bonding film Wf corresponding to the planar position of the reinforcement board Wsa are joined to the board|substrate Wb, the said other reinforcement board Ws falls off from the temporary bonding film Wf situation can be suppressed.

Further, according to the sticking device 1 according to the present embodiment, in the pressure head 50, the area of the contact surface of the pressure iron 52 with respect to the surface of the temporary bonding film Wf (approximately L-shaped short side end surface) is , since it is formed so that it may become below the magnitude|size of the reinforcing plate Ws (refer FIG. 10), the situation in which several reinforcing plate Ws is pressed can be suppressed at the same time. That is, according to the pasting apparatus 1 which concerns on this embodiment, since the situation where the reinforcing plate Ws is affixed to the position different from the pasting plan position in the board|substrate Wb can be suppressed, the reinforcing plate Ws (reinforcement board Wsa) which is going to stick can be suppressed. ) can be reliably affixed to the affixing scheduled position (circuit pattern 110a) in the board|substrate Wb. In particular, since the pasting apparatus 1 which concerns on this embodiment is a pressure bonding apparatus, as pressure bonding of the reinforcement board Ws with respect to the board|substrate Wb, at least a part of reinforcement board Ws to the board|substrate Wb by the pressure head 50 reliably It should be able to be compressed. According to the pasting apparatus 1 which concerns on this embodiment, since at least one part of reinforcing plate Ws can be pressurized with the pressure iron 52, at least one part of reinforcing board Ws can be crimped|bonded to the board|substrate Wb reliably.

Moreover, according to the pasting apparatus 1 which concerns on this embodiment, the reinforcing plate Ws contains a thermoplastic resin component on the surface opposite to the surface joined to the transparent film 200, ie, the surface affixed to the board|substrate Wb. An adhesive layer composed of a solid adhesive is formed. Moreover, according to the pasting apparatus 1 which concerns on this embodiment, the heater 53 which heats the surface of the temporary bonding film Wf corresponding to the planar position of the reinforcing plate Ws in the pressure head 50 is arrange|positioned. For this reason, by bringing the pressure iron 52 into contact with the surface of the temporary bonding film Wf in a state in which the pressure head 50 is sufficiently heated by the heater 53, the adhesive force of the surface of the reinforcing plate Ws to be adhered to the substrate Wb is increased. can be raised Therefore, since the sticking apparatus 1 can simultaneously pressurize and heat with the press head 50, while sticking the reinforcing plate Ws to the board|substrate Wb reliably, the time required for a sticking process can be shortened. can

Further, according to the pasting device 1 according to the present embodiment, the temporary bonding film Wf is a film in which the reinforcing plate Ws is bonded to the lower surface of the transparent film 200 whose adhesive force is lowered by heating to a predetermined temperature or higher, so a heater By pressing the surface of the temporary bonding film Wf corresponding to the planar position of the reinforcing plate Ws (reinforcement plate Wsa) which the press head 50 heated to the predetermined temperature or more by (53) is affixed, the reinforcing plate Ws (reinforcement board Ws (reinforcement) scheduled to be attached) is pressed. The adhesive force of the transparent film 200 to the plate Wsa) may be reduced. Therefore, the pasting apparatus 1 can peel easily from the transparent film 200 the reinforcement board Ws (reinforcement board Wsa) which is going to stick among the temporary bonding films Wf. In addition, in the process of pressing the reinforcing plate Ws to the substrate Wb by the pressure head 50, since the reinforcing plate Ws can be peeled from the transparent film 200, separate the reinforcing plate Ws from the transparent film 200 It is not necessary to provide a process for this, and the time required for a sticking process can be shortened.

Moreover, according to the pasting apparatus 1 which concerns on this embodiment, the correction|amendment apparatus 70 moves the conveyance apparatus 20 along the X-axis and Y-axis parallel to the upper surface of the board|substrate holding table 11, In addition, since it rotates around the Z-axis perpendicular to the X-axis and the Y-axis, the temporary bonding film Wf can be moved along the X-axis and the Y-axis, and can also be rotated about the Z-axis. Therefore, the pasting apparatus 1 is based on the information of the pasting plan position (circuit pattern 110a) of the reinforcing plate Ws in the board|substrate Wb imaged by the imaging apparatus 30, and the position and attitude|position of the reinforcing board Wsa. , the position and posture of the reinforcing plate Wsa can be easily and appropriately corrected.

Moreover, according to the pasting apparatus 1 which concerns on this embodiment, the conveyance apparatus 20 feeds the elongate temporary bonding film Wf wound in roll shape in sheet form, the reinforcing plate Ws from the feeding apparatus 22 and the provisional bonding film Wf. The winding apparatus 24 which winds up the transparent film 200 from which the provisionally peeled is provided in roll shape is provided, and the provisional bonding film Wf fed out from the feeding apparatus 22 is conveyed intermittently (refer FIG. 5). For this reason, since the reinforcing plate Ws can be affixed sequentially to the board|substrate Wb, productivity can be improved, since the sticking apparatus 1 can affix the elongate temporary bonding film Wf wound in roll shape intermittently conveying.

Moreover, according to the pasting apparatus 1 which concerns on this embodiment, since the some reinforcing plate Ws is temporarily joined to the lower surface of the transparent film 200 as for the temporary bonding film Wf, for example, one with respect to the board|substrate Wb. After affixing of the reinforcing plate Ws is completed, it is not necessary to replace|exchange the said temporary bonding film Wf for the temporary bonding film Wf to which the reinforcement board Ws which is going to be pasted next was bonded. Therefore, the pasting apparatus 1 moves the temporary bonding film Wf suitably by the conveying apparatus 20 and the correction|amendment apparatus 70 so that the reinforcing plate Ws of next pasting plan may be arrange|positioned suitably at the pasting plan position in the board|substrate Wb. By only making it, the said reinforcing plate Ws can be properly affixed to the pasting schedule position in the board|substrate Wb, and productivity can be raised.

As mentioned above, although this invention was demonstrated based on the said embodiment, this invention is not limited to the said embodiment. It is possible to implement in various forms in the range which does not deviate from the meaning. For example, a modification as shown below is also possible.

(1) In the above embodiment, as the substrate Wb, a member (refer to Fig. 1) in which the circuit pattern 110 is formed in a matrix has been described as an example, but the present invention is not limited thereto. For example, as the board|substrate Wb of this invention, you may employ|adopt the member in which the alignment mark was formed in the matrix form (refer FIG. 15).

15 : is a figure for demonstrating the modified example of the board|substrate Wb1 to which the reinforcement board Ws1 was affixed.

As for the substrate Wb1, as shown in Fig. 15, alignment marks 150 are formed in a matrix form as a reference for positions on the substrate Wb1. When using this board|substrate Wb1, the sticking apparatus 1 can use each of the said alignment marks 150 as a reference|standard of the sticking plan position of the reinforcement board Ws1 in the board|substrate Wb1. Therefore, in this modification, the alignment mark 150 corresponds to the "apposition scheduled position" of this invention. The sticking apparatus 1 can press-bond the reinforcement board Ws1 to the position of the alignment mark 150 of the board|substrate Wb1, respectively, and can produce|generate the reinforcement board pasting completion board|substrate 101.

The shape of the affixing member Ws of the present invention is not limited to the shape of the reinforcing plate Ws shown in Fig. 1, and may be, for example, a square like the reinforcing plate Ws1 shown in Fig. 15, a rectangle, a polygon, or the like. In addition, as long as it uses as a reference|standard of the position in the board|substrates Wb and Wb1, "the pasting plan position" of this invention is not limited to the circuit pattern 110 and the alignment mark 150, For example, a device hole, a through A hall or the like may be used.

(2) In the above embodiment, the pressure head 50 moves in the X-axis direction, the Y-axis direction, and Z Although configured to be movable in the axial direction and the θ-axis direction, the present invention is not limited thereto, and in addition to the movement accompanying the movement of the base portion 42 , the pressure iron 52 serving as the tip portion of the pressure head 50 . The pressurization head movable part 56 including the may be configured to be reciprocally movable in the Y-axis direction with respect to the pressurization head base 54 .

16 and 17 are diagrams for explaining a modified example of the pressing head. Fig. 16 is a diagram schematically showing the positional relationship between the provisional bonding film and the substrate when the tip end of the pressure head is in the crimping position. Fig. 17 is a diagram schematically showing the positional relationship between the temporary bonding film and the substrate when the tip portion of the pressure head is in the retracted position.

As shown in FIGS. 16 and 17 , the pressure head 50 is configured such that the pressure head movable part 56 can reciprocate in the Y-axis direction with respect to the pressure head base 54 . More specifically, in the pressure head 50, with the movement of the pressure head movable part 56, the pressure iron 52, which is the tip end of the pressure head 50, is positioned above the temporary bonding film Wf at the crimping position (Fig. 16) and the retracted position (refer FIG. 17) retreated from above of the temporary bonding film Wf so that a movement is possible. The crimping position is a position at which the pressing iron 52 provided in the pressing head movable part 56 is disposed above the temporary bonding film Wf, as shown in FIG. 16 . The retracted position is a position where the pressure iron 52 is retracted in the -Y direction from above the temporary bonding film Wf, as shown in FIG. 17, and the temporary bonding film Wf does not exist immediately below the pressure iron 52. a location that does not

In the state where the pressure iron 52 is arrange|positioned at the crimping|compression-bonding position, the imaging device 30 can image the sticking planned position in the pressure iron 52, the reinforcement board Ws, and the board|substrate Wb. For example, when the area of the contact surface of the pressure iron 52 with respect to the surface of the temporary bonding film Wf is larger than the reinforcing plate Ws, the reinforcing plate Ws is covered by the pressurizing iron 52, so that the imaging device 30 ), it is difficult to image the reinforcing plate Ws. In this modification, in the imaging step (S120), the pressing iron 52 disposed in the crimping position is moved to the retracted position, and the circuit pattern 110 formed on the substrate Wb from the transparent film 200 side and It is preferable to image the reinforcing plate Ws (refer to the broken-line arrow in FIG. 16). By performing the imaging process in this way, for example, even when the area of the contact surface of the pressure iron 52 with respect to the surface of the temporary bonding film Wf is larger than the reinforcing plate Ws, the sticking device 1 is attached to the imaging device 30 . Since the pressurizing iron 52 can be moved to the retracted position during imaging by can

(3) In the above-described embodiment, the sticking device 1 is configured such that the transport device 20 is movable along the X-axis direction, the Y-axis direction, the Z-axis direction, and the θ-axis direction, and the transport device ( By moving 20), although the position and attitude|position of the reinforcement board Ws with respect to the pasting plan position of the reinforcement board Ws in the board|substrate Wb are correct|amended, this invention is not limited to this. For example, in the sticking device 1 , the substrate holding table 11 is moved in the X-axis direction, the Y-axis direction, the Z-axis direction, and the θ-axis direction by a correction device (not shown) provided on the base 10 . It may be configured to be movable along the In this case, the conveying apparatus 20 may be fixed to the sticking apparatus 1, and may be comprised so that it may become immovable along an X-axis direction, a Y-axis direction, a Z-axis direction, and the (theta)-axis direction. By comprising in this way, the sticking apparatus 1 can correct the position and attitude|position of the reinforcement board Ws with respect to the pasting plan position of the reinforcement board Ws in the board|substrate Wb by moving the board|substrate holding table 11.

Moreover, the sticking apparatus 1 uses both the correction|amendment apparatus 70 and the correction|amendment apparatus (not shown) with which the base 10 was equipped, the board|substrate holding table 11, the conveyance apparatus 20, and imaging. The device 30 and the crimping device 40 may be configured to be movable. For example, the sticking apparatus 1 is comprised so that the board|substrate holding table 11 is movable along an X-axis direction and a Y-axis direction with the correction|amendment apparatus with which the base 10 was equipped, and a correction|amendment apparatus ( 70), the conveying device 20, the imaging device 30, and the crimping device 40 may be configured to be movable along the Z-axis direction and the θ-axis direction.

(4) In the above-mentioned embodiment, the sticking apparatus 1 integrates the conveyance apparatus 20, the imaging apparatus 30, and the crimping|compression-bonding apparatus 40 integrally by the correction|amendment apparatus 70 in the X-axis direction. , the Y-axis direction, the Z-axis direction, and the θ-axis direction are configured to be movable, but the present invention is not limited thereto. Another correction device may be configured to be movable along the X-axis direction, the Y-axis direction, the Z-axis direction, and the θ-axis direction. In addition, the imaging device 30 and the crimping|compression-bonding apparatus 40 do not need to be comprised so that rotation is possible along the (theta)-axis direction. In addition, the imaging device 30 may be comprised so that a movement is possible only in the X-axis direction and the Y-axis direction, and may be fixed to the sticking apparatus 1 .

(5) In the above-described embodiment, the pressure head 50 is configured such that the pressure iron 52 can reciprocate in the Z-axis direction with respect to the pressure head body 54 by an elevating mechanism (not shown). However, the present invention is not limited to this, and the pressurizing iron 52 does not need to be configured to be reciprocally movable in the Z-axis direction with respect to the pressurizing head body 54 . That is, the pressing iron 52 may be configured to be movable only with movement in the X-axis direction, the Y-axis direction, the Z-axis direction, and the θ-axis direction by the crimping device 40 . In addition, the pressure head 50 may be comprised so that a reciprocating movement in the Z-axis direction is possible with respect to the base part 42 of the crimping|compression-bonding apparatus 40 by an elevating mechanism (not shown).

(6) In the above-mentioned embodiment, the board|substrate Wb is a sheet-like member (refer FIG. 1), and in the state hold|maintained by the board|substrate holding table 11 by the board|substrate conveyance process S100, the rail ( 12) and disposed at a predetermined position below the conveying device 20, the present invention is not limited thereto. For example, the pasting apparatus 1 may employ|adopt the elongate base film wound in roll shape as the board|substrate Wb. In this case, the sticking apparatus 1 is arrange|positioned on the upstream side of the conveyance direction (+X direction) rather than the board|substrate holding table 11, for example, and the board|substrate feeding apparatus (not shown) which feeds out the board|substrate Wb to +X direction. ) and a substrate winding device (not shown) arranged on the downstream side in the conveyance direction from the substrate holding table 11 and for winding the reinforcing plate pasted substrate 100 to which the reinforcing plate Ws is affixed to the substrate Wb. you should be doing Moreover, the sticking apparatus 1 should just be comprised so that the board|substrate Wb fed out from the board|substrate feeding apparatus may be conveyed to the board|substrate holding table 11 along the rail 12. As shown in FIG.

In addition, the sticking apparatus 1 does not need to be comprised so that the board|substrate holding table 11 is movable along the rail 12. For example, the board|substrate holding table 11 may be fixed to the lower side predetermined position of the conveyance apparatus 20. As shown in FIG. In this case, what is necessary is just to mount the board|substrate Wb on the said board|substrate holding table 11 by an operator etc.

(7) In the above-described embodiment, in the pasting device 1, the pressurizing iron 52 is heated by the heater 53, but the present invention is not limited thereto, for example, a substrate holding table ( 11) You may heat the predetermined range including the pasting position of the reinforcing board Ws in the board|substrate Wb with the heater (not shown) provided in the etc.

(8) In the above-described embodiment, the sticking device 1 presses and heats the surface of the temporary bonding film Wf with the pressurizing iron 52 heated by the heater 53, but the present invention does not provide for this. It is not limited, You may press-bond the reinforcing plate Ws to the board|substrate Wb only by pressing, without heating the surface of the temporary bonding film Wf with the press iron 52. In this case, the pressure head 50 does not need to arrange the heater 53 .

(9) In the above-described embodiment, in the pasting device 1, the heater 53 is always on. However, the present invention is not limited to this. For example, the output of the heater 53 and the pressure iron You may perform control which switches on/off suitably, adjusting the heat capacity, set temperature, etc. of , suitably. By controlling in this way, the electric power consumed by the pasting apparatus 1 can be saved.

(10) In the above-described embodiment, the pasting apparatus 1 adheres the reinforcing plates Ws to the substrate Wb one by one by the above-described pasting methods (S100 to S140), but the present invention is limited to this. Instead, for example, a plurality of reinforcing plates Ws may be simultaneously affixed to the substrate Wb. In this case, for example, the sticking device 1 includes a pressure iron 52 having a contact surface capable of contacting the surface of the temporary bonding film Wf corresponding to the planar position of the plurality of reinforcing plates Ws, and a crimping step (S140) WHEREIN: What is necessary is just to pressurize and heat the position where the said some reinforcement plate Wsa is joined to the back side with the said press iron 52 from the front side in the provisional bonding film Wf.

(11) In the above-described embodiment, the pasting device 1 moves the pressing iron 52 along the Z axis from the state in which the temporary bonding film Wf and the substrate Wb are separated by a distance Dz, and the planar position of the reinforcing plate Ws Although the surface of the corresponding temporary bonding film Wf is pressed, the present invention is not limited thereto. For example, the pasting apparatus 1 presses the surface of the temporary bonding film Wf corresponding to the planar position of the reinforcement board Ws in the state which made the reinforcement board Ws contact the surface of the board|substrate Wb in the crimping|compression-bonding process S140. You can do it. More specifically, first, the pasting apparatus 1 is the conveyance apparatus 20 only by the space|interval Dz of the temporary bonding film Wf and the board|substrate Wb by the correction|amendment apparatus 70 so that the reinforcement board Ws may contact the surface of the board|substrate Wb. ) is moved in the -Z direction. Then, the sticking device 1 is configured to move the pressure iron 52 in the -Z direction with respect to the pressure head body 54 and apply an appropriate pressure to the surface of the temporary bonding film Wf by the pressure iron 52 . Do it.

1: Pasting device (Pressure bonding device)
11: Substrate holding table
20: conveying device
22: feeding device
24: winding device
30: imaging device
40: crimping device
50: pressure head
52: pressure iron (tip portion capable of contacting the surface of the temporary bonding film of the pressure head)
53: heater
70: correction device
100, 101: reinforcing plate affixed complete substrate (substrate)
110: circuit pattern (scheduled affixing position)
150: alignment mark (scheduled affixing position)
200: transparent film
Wb, Wb1: reinforcing plate (sticking member)
S110: conveying process
S120: imaging process
S130: Calibration process
S140: crimping process

Claims (16)

An affixing apparatus for affixing an affixing member to a predetermined position on a substrate, comprising:
a substrate holding table for holding the substrate to which the affixing member is to be affixed;
a conveying device disposed above the substrate holding table and conveying the temporary bonding film in which the pasting member is temporarily bonded to a lower surface of the transparent film to a predetermined position;
An imaging device disposed above the temporary bonding film and imaged an image of the affixing position and the affixing member of the affixing member in the substrate;
Based on the position shift information of the said sticking position imaged by the said imaging device, and the position of the said sticking member, correct|amend the position of the said board|substrate or the said sticking member, About the said sticking plan position imaged by the said imaging device a correction device for correcting the posture of the substrate or the pasting member based on the posture information of the pasting member;
A crimping device for pressing the affixing member to the substrate by moving the temporary bonding film or the substrate in an up-down direction
to provide
the pressure bonding device includes a pressure head for pressing the surface of the temporary bonding film corresponding to the planar position of the pasting member from the transparent film side;
the pressure head, at least a tip portion capable of contacting the surface of the temporary bonding film is movable along an X-axis parallel to the upper surface of the substrate holding table and a Z-axis perpendicular to the Y-axis, and is expandable and contractible along the Y-axis, The tip portion is configured to be movable between a crimping position above the provisional bonding film and a retraction position retracted from above the provisional bonding film,
the imaging device, in a state in which the pressure head has moved from the crimping position to the retracted position, images the pasting position of the pasting member and the pasting member on the substrate from the upper side of the temporary bonding film,
The said crimping|compression-bonding apparatus presses the surface of the said temporary bonding film from the said transparent film side with the said pressure head moved from the said retracted position to the said crimping|compression-bonding position, The pasting apparatus characterized by the above-mentioned. According to claim 1,
The said crimping|compression-bonding apparatus is comprised so that the said temporary bonding film can raise/lower with respect to the said board|substrate along the said Z-axis, The sticking apparatus characterized by the above-mentioned. 3. The method of claim 1 or 2,
The pressure head, from a state in which the temporary bonding film and the substrate are spaced apart by a predetermined distance, move at least the tip along the Z-axis, and press the surface of the temporary bonding film corresponding to the planar position of the affixing member. A patching device characterized in that. 3. The method of claim 1 or 2,
In the pressure head, a heater for heating the surface of the temporary bonding film corresponding to the planar position of the pasting member is disposed. 5. The method of claim 4,
The pressing head is formed so that an area of a portion in contact with the surface of the temporary bonding film is formed to be the same size as that of the pasting member or smaller than the size of the pasting member. 5. The method of claim 4,
The transparent film is a film whose adhesive strength is lowered compared to before heating by heating at a predetermined temperature or higher,
In the provisional bonding film, the affixing member is bonded to a lower surface of the transparent film,
The pressure head heats the surface of the temporary bonding film corresponding to the planar position of the affixing member above the predetermined temperature with the heater to lower the adhesive force of the transparent film to the affixing member compared to before heating. A patching device made with 5. The method of claim 4,
The said sticking member is a member whose surface adhesive force on the opposite side to the surface joined to the said transparent film becomes high compared with before heating by heating, The sticking apparatus characterized by the above-mentioned. 3. The method of claim 1 or 2,
The said correction device moves at least one of the said board|substrate holding table and the said conveyance apparatus along the said X-axis and the said Y-axis, and also rotates it around the said Z-axis. 3. The method of claim 1 or 2,
The conveying device is
a feeding device for feeding the temporary bonding film wound in a roll shape in a sheet shape along a predetermined direction;
Winding apparatus which winds up the said transparent film from which the said affixing member peeled from the said temporary bonding film in roll shape
to provide
The said conveying apparatus conveys the said temporary bonding film fed out from the said feeding|feeding apparatus intermittently along the said predetermined direction, The sticking apparatus characterized by the above-mentioned. 3. The method of claim 1 or 2,
As for the said temporary bonding film, the some said pasting member is temporarily bonded to the lower surface of the said transparent film, The pasting apparatus characterized by the above-mentioned. 3. The method of claim 1 or 2,
Said sticking member is a reinforcing plate which reinforces the said board|substrate, The sticking apparatus characterized by the above-mentioned. 3. The method of claim 1 or 2,
The pasting apparatus is a pressure bonding apparatus which press-bonds the said pasting member to the predetermined position of the said board|substrate, The pasting apparatus characterized by the above-mentioned. A sticking method using a sticking device for sticking a sticking member to a predetermined position on a substrate,
a conveying step of conveying the temporary bonding film in which the affixing member is temporarily bonded to the lower surface of the transparent film to a predetermined position above a substrate holding table holding the substrate to which the affixing member is to be affixed;
An imaging process of imaging the affixing planned position of the said affixing member in the said board|substrate, and the said affixing member with the imaging device arrange|positioned above the said temporary bonding film;
Based on the position shift information of the said pasting position imaged by the said imaging process, and the position of the said pasting member, correct|amend the position of the said board|substrate or the said pasting member, and to the said pasting schedule position imaged by the said imaging process a correction step of correcting the posture of the substrate or the pasting member based on the posture information of the pasting member;
A crimping step of moving the temporary bonding film or the substrate in an up-down direction to press the affixing member to the substrate
including,
In the crimping step, at least a front end portion capable of contacting the surface of the temporary bonding film is movable along an X-axis parallel to the upper surface of the substrate holding table and a Z-axis perpendicular to the Y-axis, and is expandable and contractible along the Y-axis. by pressing the surface of the temporary bonding film corresponding to the planar position of the affixing member from the transparent film side,
In the imaging step, the pressure head is moved from a crimping position in which the tip portion is located above the temporary bonding film to a retracted position retracted from above the provisional bonding film, in the substrate from above the provisional bonding film An image of the affixed position of the affixing member and the affixing member are imaged;
In the crimping step, the surface of the temporary bonding film is pressed from the transparent film side by the pressing head moved from the retracted position to the crimping position.
A pasting method, characterized in that. delete delete delete

Images