JP2013089906A - Acf sticking device and acf sticking method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of improving the operation efficiency of an ACF sticking device by reducing type changing operation.SOLUTION: The ACF sticking device includes mounting position setting means provided with a sticking head and a mounting place where a mounted component is mounted in series in a conveyance direction of the mounted component after the mounted component is mounted on an ACF 6A, and setting a mounting position on the mounting place for the mounted component based upon a length of the mounted component in the conveyance direction so that an edge of the mounted component on the downstream side in the conveyance direction is aligned with a position which is a clearance L between the sticking head and a supply conveyance part away from an end part of the sticking head on the upstream side in the conveyance direction, so that the ACF 6A is stuck on a connection terminal by conveying the mounted component intermittently at a predetermined pitch based upon the length of the mounted component in the conveyance direction while the set state is maintained.

Description

  The present invention relates to an ACF sticking apparatus and an ACF sticking method in an ACF (Anisotropic Conductive Film) sticking process in a module assembly line for mounting electronic components on a display substrate of a liquid crystal display.

  The module assembly line includes display components such as COF (Chip On Film) and TCP (Tape Carrier Package) on the periphery and periphery of display substrates such as liquid crystal displays, plasma displays, and organic EL (Electro-Luminescence) displays. Or, a device for mounting a PCB (Printed Circuit Board) or the like which is a peripheral substrate.

  An adhesive tape called ACF (Anisotropic Conductive Film) is used for mounting. Conductive particles are kneaded in the ACF, and the display substrate and the PCB are connected via the ACF.

  Here, an electronic component referred to as a mounted component in the present invention is referred to as COF, TCP, or TAB (Tape Automated Bonding) due to the difference in the detailed shape and thickness of members. These COF, TCP, and TAB are configured by mounting an IC chip on an FPC (Flexible Printed Circuit) in which a long polyimide film having sprocket holes is wired and cutting it out. There is no difference. Further, depending on the design of the display substrate, only an FPC without an IC chip may be mounted. In the module assembling apparatus line, since there is no difference in mounting between these components, they are referred to as mounted components in the present invention.

  An adhesive tape called ACF is used for mounting. Conductive particles are kneaded in the ACF, and the display substrate and the mounting component or the PCB and the mounting component are connected via the ACF.

  The step of the ACF sticking apparatus is a step of sticking the ACF for connecting the mounting component and the display substrate or PCB to the mounting component in advance. Note that, depending on the circuit design, the ACF attachment site is on both sides (input terminal, output terminal) of the mounted component. In addition, it may be attached only to one side (output terminal). There are many types of mounted components and PCBs depending on the specifications of the display substrate. As for the mounted parts, there are various shaped mounted parts as shown in FIGS. Patent Document 1 discloses a technique for efficiently attaching ACF to a mounted component.

JP 2009-26830 A

  Here, when changing the type of the mounted component, various changes such as the ACF pasting length, the pasting position on the mounting component, and the pasting temperature are required.

  For this reason, the labor of positioning adjustment in a mechanism part, such as positioning of the half cut position of an ACF cutting member, ACF sticking position, and fixed positioning of mounted components, is great. However, in Patent Document 1, there is no detailed description of the contents related to the positioning of each mechanism unit.

  In a conventional ACF sticking device known in the art, an operator performs an adjustment operation for changing the positioning of each mechanism section that performs the ACF sticking process by stopping the device and performing a part replacement work, etc., during a product type switching operation. It was. Therefore, there has been a problem that the operating efficiency of the apparatus is lowered.

  Therefore, the problem to be solved by the present invention is to reduce the type change work and improve the operation efficiency of the ACF sticking apparatus.

In order to solve the above problems, the present invention has at least the following features.
The present invention is directed to an ACF adhering apparatus comprising: a supply conveying unit that supplies and conveys a mounted component and places a connection terminal of the mounted component on an ACF; and an adhering head that adheres the ACF to the connecting terminal. And a mounting location for mounting the mounting component are provided in series in the transport direction of the mounting component after the mounting component is mounted on the ACF, and based on the length of the mounting component in the transport direction The front of the mounting component is arranged so that the edge on the downstream side in the transport direction of the mounted component is aligned with the clearance L separation between the pasting head and the supply transport unit from the upstream end in the transport direction of the pasting head. A placement position setting means for setting a placement position on the placement location, maintaining the set state, and interposing the mounted components at a predetermined pitch based on a length in a conveyance direction of the mounted components; It is conveyed to have the characteristics to paste the ACF to the connection terminals.

  Further, the present invention provides a mounting step of transporting the mounted component in the supply transport unit and mounting the connection terminal on the mounted component on the ACF on the mounting location, the mounted component mounted on the pasting head, The mounting component is intermittently transported at a predetermined pitch based on the length in the transporting direction of the mounted component, up to the pasting step of pasting the ACF, and the position where the mounted component is discharged through the pasting position. A position where the clearance L between the pasting head and the supply transport unit is separated from the end of the pasting head on the upstream side in the transport direction of the mounted component based on the transport step to be performed and the length in the transport direction of the mounted component. And a mounting position setting step for setting a mounting position for mounting the mounted component so that an edge on the downstream side in the transport direction of the mounted component matches, and after the setting, the AC is applied to the connection terminal. With a paste features a.

  According to the present invention, the position change of each part in the ACF attaching process is automatically performed based on the data such as the dimensions of the mounted parts, thereby reducing the type switching work and improving the apparatus operating efficiency.

It is a figure which shows the schematic of mounted components. It is a figure which shows the structure of an ACF tape. It is an elevation view which shows the side of the ACF sticking apparatus of Embodiment 1 of this invention. It is the figure which looked at the cross section of the virtual line shown by the dashed-two dotted line in Fig.3 (a) from the arrow A direction. FIG. 6 is a diagram illustrating operations of an ACF supply unit bias X-direction drive unit and an ACF supply unit anti-X-direction drive unit in the first embodiment. FIG. 6 is a plan view of the ACF pasting state as viewed from the upper side of the mounting component 7. FIG. 5 is an elevational view of the ACF pasting state as viewed from the side surface of the mounting component 7. It is a figure which shows an example of the process flow of the setup change performed at the beginning of the operation | work when the dimension and edge part space | interval of mounted components in Embodiment 1 are changed. It is a figure which shows the mounting component 7M which has the largest dimension which the ACF sticking apparatus of Embodiment 1 can process. It is the figure which looked at the cross section corresponding to the virtual line shown with the dashed-two dotted line which showed the ACF sticking apparatus of Embodiment 2 of this invention in Fig.3 (a) from arrow A direction. The top view which looked at the ACF sticking state of the ACF sticking apparatus of Embodiment 2 of this invention from the upper side of the mounting component is shown.

  An embodiment for carrying out the present invention will be described with reference to FIGS. In addition, the same code | symbol is attached | subjected to the common member in each figure.

  First, the mounted component 7 will be described. FIG. 1 shows a schematic diagram of mounted components. The mounting component 7 has a connection terminal 101 for connecting to a display substrate or a PCB on a side edge portion on the base film 100, and an IC chip 102 is mounted thereon. The mounted parts have various shapes as shown in FIGS. 1 (a) to 1 (d). Like the mounting component 7α in FIG. 1 (a), those having large dimensions, those having the gaps E and F between the end of the mounting component 7α and the connection terminal 101, and like the mounting component 7β in FIG. 1 (b). In addition, there are those having a small size and those having no gap between the end of the mounted component and the connection terminal 101. In addition, there is a case where the terminal 101 is only on one end side as in the mounting component γ in FIG. 1C and a trapezoidal shape as in the mounting component 7δ in FIG. However, in recent years, trapezoidal mounting parts δ as shown in FIG.

  Next, the ACF tape 6 used for connecting the display substrate or PCB and the mounting component 7 will be described. FIG. 2 shows a cross-sectional view of the ACF tape 6. The ACF tape 6 is a tape obtained by applying ACF6A, which is an adhesive portion having a thickness of about 20 to 40 μm, to a strip-shaped separator film 6B made of a PET (Poly Ethylene Terephthalate) film having a thickness of about 35 to 70 μm. For example, the ACF 6A is affixed on the connection terminal 101 of the mounting component, and only the ACF 6A adheres to the mounting component 7 by peeling the separator film 6B. Note that the mounting component 7 to which the ACF 6A is attached by the ACF attaching device of the present invention is electrically connected to the display substrate and the PCB by thermocompression bonding by heat and pressure in a subsequent process.

  Hereinafter, the ACF sticking apparatus (hereinafter simply referred to as the present apparatus) according to the first embodiment of the present invention will be described. FIG. 3 is an elevation view showing a side surface of the apparatus 300 according to the first embodiment of the present invention. FIG. 3A is a diagram showing the overall configuration of the apparatus 300, and FIG. 3B is a diagram showing an ACF supply unit 200 for attaching ACF 6A, which is one of the main parts of the apparatus, to a mounted component. FIG. 4 is a view of a cross section of the phantom line indicated by a two-dot chain line in FIG.

  As shown in FIG. 3B, the ACF supply unit 200 has an ACF reel 4 attached to a drive base 3 that is a frame portion, and an ACF guide that stretches an ACF tape 6 drawn from the ACF reel 4. 5. Feed conveyance lower support 8 which is a mounting location to which the mounting component 7 is supplied, affixing head lower support 9 for attaching the ACF 6A to the mounting component 7, a peeling pin 17 for peeling the ACF 6A from the separator film 6B, and driving the peeling pin The peeling drive unit 18 that performs the above operation, the ACF tape feeding unit 16 that is a feeding drive unit for the ACF tape 6, and the ACF separator film winding unit 11 that winds the separated separator film 6B are attached.

  As shown in FIG. 4, the apparatus 300 is an apparatus for simultaneously bonding the ACF 6A for connection to the display substrate and the ACF 6A for connection to the PCB to the mounting component 7. Therefore, this apparatus 300 is installed in the right and left so that both ACF supply unit 200 may oppose. In order to distinguish between the display substrate side and the PCB side of the ACF supply unit 200, subscripts a (display substrate side) and b (PCB side) are attached to the reference numerals of the members, respectively. In FIG. 4, the display substrate side (subscript a) is shown on the right and the PCB (subscript b) is shown on the left. Of course, it is possible to configure the apparatus in the opposite direction in terms of the layout.

  Further, the apparatus 300 includes an ACF supply unit anti-X direction drive unit 2 (2a, 2b) that moves the left and right ACF supply units 200a and 200b in the X direction in the opposite directions, and a left and right ACF supply unit 200. The ACF supply unit Y-direction drive unit 1 for moving the ACF supply unit anti-X direction drive unit 2 in the Y direction, and the ACF supply unit bias X direction for moving the entire area above the ACF supply unit Y-direction drive unit 1 in the X direction. And a drive unit 23. The operation of each drive unit will be described later.

  Furthermore, as shown in FIG. 3A, the apparatus 300 is provided with a supply conveyance unit 12 supported by a frame (not shown) above the ACF supply unit 200. Adjacent to this, the pasting head Y direction driving unit 19, the pasting head anti-X direction driving unit 15, and the pasting head 13 are assembled based on the pasting head bias X direction driving unit 22. Further, a discharge transport unit 14 is disposed adjacent to the discharge transport Y-direction drive unit 20 for discharging the mounted component 7 to which the ACF 6B is attached.

  The supply conveyance unit 12 according to the first embodiment picks up the mounted component 7 from a mounting component supply unit (not shown) and conveys it to the supply conveyance support 8. Further, the supply conveyance unit 12 always has the same center position of the outer diameter of the base film 100 even if the dimensions of the base film 100 and the distance (end portion interval) from the ends of the two connection terminals 101 are different. In addition, the mounted component 7 is placed across the supply and conveyance receivers 8a and 8b. For this purpose, alignment is performed so that the ACF tapes 6a and 6b and the supply and conveyance receivers 8a and 8b are positioned in advance at the positions of the two connection terminals 101 on the base film 100. Positioning of the pasting head underlays 9a and 9b for temporarily attaching the tape 6 and the corresponding two pasting heads 13 is performed.

  Note that, in the discharge conveyance unit 14, as in the case of the supply conveyance unit 12, the center position of the outer diameter of the base film 100 is always the same even if the dimensions of the base film 100 and the distance between the end portions of the two connection terminals 101 are different. Since the mounted component 7 is conveyed so as to be in the same position, a driving unit in the X direction is not necessary.

  Further, in this apparatus 300, a half-cut portion 21 assembled to a frame (not shown) is arranged on the side of the ACF supply unit 200, and the control apparatus 30 is provided to control the speed and position of the drive system. Have.

  The mechanism of the present apparatus in the first embodiment has been described above. Next, in this apparatus, the setup change when the dimensions of the mounting component 7 and the end interval are changed will be described.

  First, setup change by alignment in the X direction will be described. In the first embodiment, the positioning of the supply conveyance lower support 8 and the pasting head lower support 9 is performed by adjusting the ACF supply unit bias X-direction drive unit 23 of the ACF supply unit 200 and the ACF supply unit opposite to the X-direction. The positioning is performed by the driving unit 2 and the positioning of the pasting head 13 is performed by the head bias X direction driving unit 22 and the head anti-X direction driving unit 15.

  As the name indicates, the ACF supply unit bias X-direction drive unit 23 and the head bias X-direction drive unit 22, and the ACF supply unit anti-X direction drive unit 2 and the head anti-X direction drive unit 15 perform the same operation. Therefore, here, as an example, the operation of the ACF supply unit bias X-direction drive unit 23 and the ACF supply unit anti-X-direction drive unit 2 will be described with reference to FIG.

  FIG. 5A shows the mounting component 7C used for the finished current work, and the two connection terminals in the case where the distance between the end portions of the base film 100 and the connection terminal 101 is equal on both sides. An example in which the interval 101 is Lx1 is shown. FIG. 5B shows a mounting component 7D used for the next operation, having end intervals E and F of different lengths (exaggerated for easy splitting), and the interval between the two connection terminals 101. Shows an example of Lx2.

  In the current work (FIG. 5A), the distance between the two connection terminals and the end of the base film is equal to G on both sides, so that the center line Ct of the base film 100 of the mounting component and the two connection terminals 101, that is, the center line Ck of the ACF tapes 6a and 6b (ACF supply units 200a and 200b). However, in the next operation (FIG. 5 (b)), Ck has a bias deviated by ΔC = (E−F) / 2 from Ct that is always at the same position due to the influence of the end intervals E and F. Yes. In the first embodiment, the two ACF supply units 200a and 200b are entirely connected by the ACF supply unit bias X-direction drive unit 23 shown in FIG. 4 so that the bias is eliminated, that is, Ck matches Ct. It is moved upward in FIG. 5 by the bias amount ΔC shown in FIG. Thereafter, the ACF tape 6 corresponding to each connection terminal 101 is aligned. Therefore, two ACFs are driven by the ACF supply unit anti-X direction drive unit 2 so that the distance from the center line Ct becomes equal, that is, from Lx1 / 2 to Lx2 / 2 in FIG. The supply units 200a and 200b are moved in the opposite direction by the same distance. The driving method for moving in the opposite direction can be realized, for example, by using a ball joint threaded in the opposite direction and engaging a nut (not shown) fixed to the ACF supply unit with each screw.

  Similarly to the ACF supply unit bias X-direction drive unit 23 and the ACF supply unit anti-X-direction drive unit 2, the head bias X-direction drive unit 22 and the head anti-X-direction drive unit 15 eliminate the bias and provide two pasting heads. The positions of the two affixing heads 13 in the X direction are adjusted so that 13 can press the two connection terminals 101 on the mounting component 7, that is, the corresponding ACF tapes 6a and 6b.

  In the above description, the two ACF supply units 200 or the two pasting heads 13 are controlled by using the bias X direction driving unit and the anti-X direction driving unit. It may be used.

  Next, setup change by alignment in the Y direction will be described. FIG. 6 is a plan view of the ACF attached state as viewed from the upper side of the mounting component 7, and FIG. 7 is an elevational view of the same state as viewed from the side. FIG. 6A and FIG. 7A show a state where the mounting component 7A having a wide width and a long length is pasted. As described above, the mounting component 7 is conveyed by the supply conveyance unit 12 so that the outer center of the base film is at the same position, that is, the intersection of the alternate long and short dash lines 41 and 42 shown in FIG. For this reason, when the mounting component 7B having a small width and a short length is supplied as it is, the interval between the two ACF supply units 200 described above is merely reduced, and FIG. 6 (b) and FIG. 7 (b). As shown in FIG. 4, the edge 7Bt of the mounted component 7B is not aligned with the end 8t of the supply and conveyance receiver 8. Here, if the edge 7Bt of the mounting component 7B shown in FIG. 6B and FIG. 7B can be aligned with the end 8t of the supply conveyance lower support 8, FIG. 6A and FIG. 7A. Similarly, after that, the ACF 6A can be continuously attached to the mounting component 7A (7B) at a pitch of LyA (LyB) + L obtained by adding the clearance L to the width LyA (LyB) of the mounting component 7A (7B). Ideally, if the necessary clearance (dimensional allowance) L is not required between the pasting head 13 and the supply conveyance unit 12, the ACF 6A is pasted at a pitch of the width LyA (LyB) of the mounted component 7A (7B). Can be attached.

  Further, in order to attach the ACF 6A to the mounting component 7B, the position of the end 13t (see FIG. 7B) on the right side (upstream side of the drawing) of the pasting head 13 is set in advance by the half-cut portion 21 at an interval L. If the cut half-cut can be matched with the half-cut position on the downstream side in the interval L, the ACF 6A can be pasted with a necessary width.

  That is, in order to efficiently attach the ACF 6A to the mounting component 7B and peel it from the separator film 6B, the position of the edge 7Bt on the left side (downstream of conveyance) of the mounting component 7B is the end of the upstream side of the affixing head 13 on the conveyance side. It is necessary to make the position as close as possible to the portion 13t, and to bring the half-cut position on the downstream side in the interval L of the ACF 6A to the position of the end portion 13t.

  In order to approach this requirement, when the mounting component 7B is moved from the solid line state shown in FIG. 6B to the thick line state, the edge on the opposite side of the edge 7Bt of the mounting component 7B is transferred downstream of the pasting head 13. The ACF 6A can be attached to the mounting component 7B so as to coincide with the side end portion 13t.

  However, in this method, a portion not used for attaching the ACF for the length L + y caused by the movement is generated. In addition, it takes time to move and processing time becomes long.

  Note that y is the difference between the downstream edge 7Bt of the mounted component 7B in FIG. 6B and the downstream end 8t of the supply support 8. In other words, the mounting component 7B is placed on the two supply receptacles 8a and 8b so that the center of the outer shape of the base film is at the same position regardless of the size of the mounting component 7B. The length Wy in the Y direction and half the length LyB in the Y direction of the mounted component 7B, that is, Expression (1).

y = | Wy-LyB | / 2 (1)
Therefore, in the first embodiment, the two ACF supply units 200 and the two pasting heads 13 are moved to the right side in FIGS. The end 13t of the pasting head 13 can be aligned.

  The position defined by the difference y is a mounting position, and an example of a mounting position setting unit that sets the mounting position and moves the ACF supply unit 200 and the pasting head 13 based on the set mounting position. It is.

  Then, this state is maintained without moving the ACF supply units 200a and 200b and the two pasting heads 13 until the operation is completed, as shown in FIGS. 6 (c) and 7 (c). The ACF 6A can be continuously attached to the mounting component 7B by intermittently moving the ACP tape 6 at a pitch of the length LyB + L in the Y direction of the mounting component.

  In order to perform this continuous processing, the discharge transport unit 14 also moves its position at the discharge transport Y-direction drive unit 20 so that the mounted parts transported at the above-mentioned LyB + L pitch can be discharged at the pitch position. adjust.

In the present embodiment, the gap between the supply receiver 8 and the adhesive receiver 9 is the same as the gap L between the supply conveyance unit 12 and the adhesive head 13, and the interval between the blades of the half-cut part 21 is set to L according to the interval L. Is set.
However, the gaps are not necessarily equal. For example, the length of the sticking support 9 may be increased to enter the region L, and in an extreme case, the supply support 8 and the sticking support 9 may be integrated. For example, in an integrated configuration, y may be obtained using LyA instead of Wy shown in Equation (1). In short, regardless of the size of the mounted component 7, the edge 7 </ b> Bt on the downstream side of the mounted mounted component 7 </ b> B is positioned away from the end 13 t on the upstream side of the pasting head 13 by the clearance L. The ACF supply unit 200 and the pasting head 13 may be moved to each other.

  The reason why the both sides are cut at the clearance L at the half-cut portion 21 is that a portion unnecessary for ACF attachment is generated by the length L, but after the half-cut at the half-cut portion 21, the length of the clearance L is increased. The reason is that only the length ACF 6A necessary for the mounting component 7 can be reliably attached by supplying, attaching, and discharging the mounting component 7 after the ACF 6A is removed in advance.

  As shown in FIGS. 7A and 7B, the width in the Y direction of the supply conveyance unit 12 is changed in accordance with the width in the Y direction of the mounted component 7. However, even if the width in the Y direction of the mounted component 7 changes, the width in the Y direction of the supply conveyance unit 12 is constant, and the supply conveyance unit 12 has an edge 7Bt on the conveyance downstream side of the conveyance component 7 at its downstream end. You may make it hold | maintain a mounting component so that it may correspond (refer FIG.6 (b)).

  FIG. 8 shows an example of the process flow of the setup change performed at the beginning of the operation when the dimensions and end portion intervals of the mounted parts described above are changed. In the example of this processing flow, unlike the example shown in FIG. 5, a command is issued to each drive unit based on the mounted component having the maximum dimension, and the controlled object is positioned. FIG. 9 shows the mounted component 7M having the maximum dimensions that can be handled by the apparatus 300. FIG. The processing target is a mounted component 7D shown in FIG. The unit of length shown in FIGS. 9 and 5B is mm.

  First, the values of the end portion distances E and F of the mounted component 7D, the Y-direction width Ly2 and the distance Lx2 between the two connection terminals 101 are read from the memory of the control device 30 (see FIG. 3B) (step 1).

  Next, setup change by alignment in the X direction is entered. As described with reference to FIG. 5, the bias ΔC between the center line Ck of the two connection terminals and the center line Ct of the mounted component 7D is obtained from the equation (2) using the end portion distances E and F (step 2).

ΔC = (E−F) / 2 (2)
Then, it is checked whether or not ΔC is larger than the X-direction width of the mounted component 7M, that is, the allowable value LxM / 2 (step 3). If it is larger, the process is terminated as outside the allowable range (step 4).

  If it is smaller, the movement of the bias amount of the entire ACF supply unit 200a, 200b by the ACF supply unit bias X direction drive 23 based on the bias ΔC (step 5) and the two pasting heads 13 by the head bias X direction drive unit 22 are performed. The bias amount is moved (step 6).

  Next, it is checked whether the distance Lx2 between the two connection terminals 101 of the mounted component 7D is larger than the width LxM in the X direction of the mounted component 7M (step 7). If it is larger, the processing is terminated as out of the processing range (step 4).

  If it is smaller, the interval width XWg or XWc in the X direction is obtained from the equation (3) or the equation (4) so that the ACF tape supply units 200a and 200b and the two pasting heads 13 fit the interval between the two connection terminals 101 ( Step 8).

XWg = (LxM-Lx2) / 2 (3)
XWc = Lx2 / 2 (4)
XWg obtains the amount of change in the interval width in the X direction between the ACF tapes 6a and 6b and the two pasting heads from the positions of the two connection terminals 101 of the mounting component 7M and the mounting component 7C. On the other hand, XWc indicates the distance from the center line Ck of the two connection terminals of the two connection terminals 101 shown in FIG. 5, and obtains a target value of the ACF tapes 6a and 6b and the two interval widths in the X direction. Either method may be used. Here, XWg is used. Based on XWg, the ACF supply unit 200a, 200b is moved in the opposite X direction by the ACF supply unit anti-X direction drive 2 (step 9), and the head 13 is oppositely attached to the two by the head anti-X direction drive unit 15 Is moved in the X direction (step 10).

Next, setup change by alignment in the Y direction is entered. First, it is checked whether or not the Y direction width Lx2 of the mounted component 7D is larger than the Y direction width LyM of the mounted component 7M (step 11). If it is larger, the processing is terminated as out of the processing range (step 4).
If smaller, the difference y, which is the amount of movement in the Y direction described with reference to FIGS. 6 and 7, is calculated. In the first embodiment, since the length Wy in the Y direction of the two supply receptacles 8a and 8b in Formula (1) corresponds to the length LyM in the Y direction of the mounting component 7M having the maximum dimension, the difference y is expressed by the formula (5) can be obtained (step 12).

y = (LyM-Ly2) / 2 (5)
Next, the ACF supply units 200a and 200b are moved by y in the y direction by the ACF supply unit Y-direction drive unit 1 and step 13). The two pasting heads 13 are moved by y in the y direction by the pasting head Y drive unit 19. (Step 14). Then, the position of the discharge transport unit 14 is adjusted by the discharge transport Y-direction drive unit 20 (step 15) so that the mounted components transported at the pitch of Ly2 + L can be discharged at the position of the pitch (step 15). Terminate.

  The data defining the mounted component 7D is not limited to that shown in step 1, and can be defined by other data. For example, instead of the distance Lx2 between the two connection terminals 101, the width in the X direction may be used.

  According to the first embodiment described above, it is possible to reduce the set-up work by automatically switching the product type based on the predetermined data of the mounted component 7, shorten the product type change work time, and attach an ACF with a high operating rate. An apparatus and an ACF sticking method can be provided.

  In addition, according to the first embodiment described above, the mounted component 7 is moved as close as possible to the end of the pasting head 13 by moving the ACF supply unit 200 in response to the type switching of the mounted component. Is placed at a position where the clearance between the affixing head 13 and the supply conveyance unit 12 is separated, thereby shortening the ACF affixing processing time.

  Next, an ACF sticking apparatus (hereinafter simply referred to as the present apparatus) 300A according to the second embodiment of the present invention will be described. FIG. 10 is a view of the cross section of the phantom line of the second embodiment corresponding to the phantom line shown by the two-dot chain line shown in FIG. It is.

  The apparatus 300A according to the second embodiment is an apparatus that can cope with the case where the PCB is not required, as shown in FIG. 1C, that is, when the connection terminal 101 of the mounted component is only on one side. Alternatively, even if there are connection terminals 101 on both sides of the mounting component 7, the apparatus can cope with the case where the ACF 6A is attached only to the connection terminal on one side. FIG. 11 is a plan view of the ACF attached state as viewed from the upper side of the mounted component.

The second embodiment is different from the first embodiment in the following two points. The first point is that the mounted component receiver 24 is assembled to the ACF supply unit 200b as shown in FIG. 10 in order to carry the mounted component 7 stably. The slide surface of the mounting component receiver 24 is higher than the lower support surface of the supply conveyance lower support 8 and the pasting head lower support by the thickness of the connection terminal 101 and the ACF tape 6. The second point is that the setup change of the alignment in the X direction is different with the assembly of the mounting component receiver 24.
The other points are basically the same as in the first embodiment. In particular, the setup change of the alignment in the Y direction in which the edge of the mounting component 7 is aligned with the end of the supply unit lower support 8 can be performed in the same manner as in the first embodiment. That is, aligning the pasting head 13 so that the end portion thereof is a half-cut position is the difference between the end portion of the mounted component 7 and the end portion of the supply support 8 in the supply conveyance unit 12 (as in the first embodiment). This can be done by moving the ACF supply units 200a, 200b (supply conveyance lower receptacles 8a, 8b, adhesive head lower receptacles 9a, 9b) and the adhesive head 13 to the right in FIG.

Next, a setup change method in the X direction by automatic control in the second embodiment will be described with reference to FIG.
FIG. 11A shows a state where the mounting component 7E having a wide width and a long length is being pasted. Here, the mounting component 7E is conveyed by the supply conveyance unit 12 so that the outer center of the base film is at the same position. When the mounted component 7F having a small width and a short length is supplied in this state, the interval between the ACF supply units 200a and 200b is not reduced as in the first embodiment, but the ACF supply unit bias X-direction drive unit in the second embodiment. 23, the entire ACF supply units 200a and 200b are moved. For example, in the case shown in FIG. 11B, in order to align the upper end of the connection terminal 101 of the mounting component 7F with the upper end of the ACF tape 6a, the ACF supply unit is equal to the difference x between the both ends. The bias X direction driving unit 23 moves the ACF supply units 200a and 200b to the lower side of the drawing.
As shown in FIG. 11A, the maximum interval between the ACF supply units 200a and 200b is a constant interval (h) that can process the mounted component 7E having the maximum width in the X direction, including the mounted component receiver 24. Have.

  In the second embodiment described above, an example of a common type has been described in which the mounting component receiver 24 can be attached or raised as required, and the mounting component 7 having the connection terminals 101 on both side edges can be processed. However, the ACF supply unit 200b side may not be provided, and the mounting component 7γ type dedicated machine having the connection terminals 101 on the side edges only on one side may be used.

  According to the second embodiment described above, the setup in the X direction is automatically performed based on the data indicating the length in the X direction of the mounted component in response to the type switching of the mounted component of the type shown in FIG. The setup work can be shortened.

  Next, a third embodiment of the present invention will be described. In the second embodiment, a mounting component receiver 24 that is higher than the lower receiving surface of the supply conveyance lower support 8 and the pasting head lower support 9 is provided by the thickness of the connection terminal 101 and the ACF tape 6 to keep the conveyance of the mounting component 7 stable. It was. In the third embodiment, in FIG. 4, a dummy ACF tape thicker than the normal ACF tape 6 is used as the ACF tape 6 b. In the ACF supply unit 200b, the dummy ACF tape is simply transported without operating the pasting head 13 and the peeling drive unit 18. By adopting such an apparatus configuration, in the third embodiment as well, as in the first embodiment, it is possible to carry out a setup change of alignment in the X and Y directions.

  As a result, also in the third embodiment, the same effect as in the first embodiment can be obtained.

  Next, a fourth embodiment of the present invention will be described with reference to FIG. The supply and conveyance unit 12 of the first to third embodiments places the mounting component 7B on the two supply receptacles 8a and 8b so that the outer center of the base film is at the same position regardless of the size of the mounting component 7B. It was. On the other hand, the supply conveyance unit 12A according to the fourth embodiment has a degree of freedom in the Y direction so that the mounting component 7B can be placed by aligning the edge of the mounting component 7B directly with the end of the supply unit lower support 8.

  As a result, it is possible to efficiently perform the ACF pasting operation on the mounted component 7 having various dimensions and the arrangement of the connection terminals without performing the Y-direction alignment setup change by the ACF supply unit 200. In the fourth embodiment, the change of the alignment in the X direction is performed in the same manner as in the first embodiment.

  In the fourth embodiment described above, the same effects as those in the first embodiment can be obtained.

DESCRIPTION OF SYMBOLS 1 ... ACF supply unit Y direction drive part 2 ... ACF supply unit non-X direction drive part 2a ... ACF supply unit anti X direction drive part (display substrate or PCB side)
2b ... ACF supply unit anti-X direction drive unit (display substrate or PCB side)
DESCRIPTION OF SYMBOLS 3 ... Drive base 4 ... ACF reel 5 ... ACF guide 6 ... ACF tape 6A ... ACF (adhesion part) 6B ... Separator film 6a, 6b ... ACF tape (display substrate or PCB side)
7, 7α, 7β, 7γ, 7δ, 7A, 7B, 7C, 7D, 7E, 7F, 7M ... mounted components
8a, 8b ... Supply conveyance underlay (display substrate or PCB side)
9 ... Pasting head support 9a, 9b ... Pasting head support (display substrate or PCB side)
DESCRIPTION OF SYMBOLS 11 ... ACF separator film winding part 12 ... Supply conveyance part 13 ... Pasting head 14 ... Discharge conveyance part 15 ... Pasting head anti-X direction drive part 16 ... ACF tape feeding part 17 ... Peeling pin 18 ... Peeling drive part 19 ... Pasting head Y drive unit 20 ... discharge conveyance Y direction drive unit 21 ... half cut unit 22 ... pasting head bias X direction drive unit 23 ... ACF supply unit bias X direction drive unit 24 ... mounted component receiver 100 ... base film 101 ... connection terminal 102 ... IC chip 200 ... ACF supply unit
200a, 200b ... ACF supply unit (display substrate or PCB side)
300, 300A ... ACF pasting device

Claims (15)

In an ACF adhering device having a supply conveying unit for supplying and conveying a mounted component and placing a connection terminal of the mounted component on the ACF, and an adhering head for adhering the ACF to the connecting terminal,
The affixing head and the mounting location for mounting the mounting component are provided in series in the transport direction of the mounting component after the mounting component is mounted on the ACF, and the length of the mounting component in the transport direction Based on the above, the edge on the downstream side in the transport direction of the mounted component coincides with the position where the clearance L separation between the pasting head and the supply transport unit is separated from the end portion on the upstream side in the transport direction of the transport component of the pasting head The mounting position setting means for setting the mounting position on the mounting position of the mounting component as described above, and maintaining the set state, a predetermined pitch based on the length of the mounting component in the transport direction The ACF attaching device characterized in that the mounted component is intermittently conveyed and the ACF is attached to the connection terminal.   Regardless of the length of the mounting component in the transport direction, the mounting position setting means sets the previous mounting position at the same position on the mounting location, based on the length of the mounting component in the transport direction, The ACF sticking apparatus according to claim 1, wherein the sticking head is moved based on the mounting position.   The position of the pasting head is the same regardless of the length of the mounted component in the transport direction, and the mounting position setting means sets the mounting position based on the length of the mounted component in the transport direction. The ACF sticking device according to claim 1, wherein:   The mounting component has the connection terminals on opposite side edges of the two sides, and the two pasting heads are provided facing each other across a transport path for transporting the mounting component placed on the ACF. The ACF sticking device according to claim 1, wherein   The mounting component has the connection terminal on a side edge of one side, and a mounting component receiver for stably transporting the mounting component on the side opposite to the one side in a transport path for transporting the mounting component. The ACF sticking apparatus according to claim 1, wherein the ACF sticking apparatus is provided.   It has a discharge conveyance part which discharges the mounting parts which pasted the ACF, and has a mechanism which adjusts the discharge position of the discharge conveyance part to the position of the mounting parts conveyed by the predetermined pitch, The ACF sticking device according to claim 1.   When affixing the mounting component to the ACF in a conveyance path for conveying the mounting component after being placed on the ACF, the affixing head lower support for supporting the affixing head and the clearance L are spaced apart from each other. The above-mentioned mounting position setting means is provided with the above-mentioned pasting head underlay and the above-mentioned supply transportation underlay based on the length of the mounting component in the carrying direction. The ACF sticking apparatus according to claim 1, wherein the ACF sticking apparatus is moved based on a placement position.   Based on the length of the mounted component in the direction perpendicular to the conveying direction of the mounted component and the length of the connection terminal on the mounted component, the two pasting heads provided opposite to each other The ACF sticking device according to claim 4, wherein a vertical position is set.   The vertical position of the application head is set based on the length of the mounted component in a direction perpendicular to the conveying direction of the mounted component and the length of the connection terminal on the mounted component. The ACF sticking device according to claim 5. A mounting step of transporting the mounted component in the supply transport unit and mounting the connection terminal on the mounted component on the ACF on the mounting location;
A pasting step for pasting the mounted component and the ACF placed by a pasting head;
A transport step of intermittently transporting the mounted component at a predetermined pitch based on the length in the transport direction of the mounted component, up to a position at which the mounted component is ejected through a pasting position;
Based on the length of the mounting component in the transport direction, the clearance between the mounting head and the supply transport unit is separated from the end of the mounting head on the upstream side in the transport direction of the mounting component. A mounting position setting step for setting a mounting position for mounting the mounting component such that the downstream edge in the transport direction matches,
After the setting, the ACF attachment method is characterized in that the ACF is attached to the connection terminal.   In the placement position setting step, the placement position is set at the same position in the installation location regardless of the length of the mounted component in the transport direction, and the length of the mounted component in the transport direction of the mounted component is The ACF sticking method according to claim 10, wherein the sticking head is moved based on a placement position.   The position of the pasting head is the same regardless of the length of the mounted component in the conveyance direction, and the setting position setting step sets the mounting position based on the length of the mounting component in the conveyance direction. The ACF sticking method according to claim 10, wherein:   The ACF attaching method according to claim 10, further comprising an adjustment step of adjusting a discharge position for discharging the mounted component to which the ACF is attached to a position of the mounted component conveyed at the predetermined pitch.   The mounting component has the connection terminals at the side edges of two opposite sides, and two units provided facing each other across a transport path for transporting the mounting component after being placed on the ACF. The ACF attaching method according to claim 10, wherein the ACF is attached to the corresponding connection terminals by the attaching head.   Based on the length of the mounted component in the direction perpendicular to the conveying direction of the mounted component and the length of the connection terminal on the mounted component, the two of the pasting heads provided facing each other. The ACF sticking method according to claim 14, wherein a position in a vertical direction is set.

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