TW200533583A - A cover lay film lamination device - Google Patents

A cover lay film lamination device Download PDF

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Publication number
TW200533583A
TW200533583A TW094111608A TW94111608A TW200533583A TW 200533583 A TW200533583 A TW 200533583A TW 094111608 A TW094111608 A TW 094111608A TW 94111608 A TW94111608 A TW 94111608A TW 200533583 A TW200533583 A TW 200533583A
Authority
TW
Taiwan
Prior art keywords
film
cover
temporary
layer
cover film
Prior art date
Application number
TW094111608A
Other languages
Chinese (zh)
Other versions
TWI308901B (en
Inventor
Kazuhiko Kato
Original Assignee
Beac Co Ltd
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Publication date
Application filed by Beac Co Ltd filed Critical Beac Co Ltd
Publication of TW200533583A publication Critical patent/TW200533583A/en
Application granted granted Critical
Publication of TWI308901B publication Critical patent/TWI308901B/en

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/18Handling of layers or the laminate
    • B32B38/1825Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
    • B32B38/1833Positioning, e.g. registration or centering
    • B32B38/1841Positioning, e.g. registration or centering during laying up
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H37/00Article or web delivery apparatus incorporating devices for performing specified auxiliary operations
    • B65H37/04Article or web delivery apparatus incorporating devices for performing specified auxiliary operations for securing together articles or webs, e.g. by adhesive, stitching or stapling
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H29/00Delivering or advancing articles from machines; Advancing articles to or into piles
    • B65H29/38Delivering or advancing articles from machines; Advancing articles to or into piles by movable piling or advancing arms, frames, plates, or like members with which the articles are maintained in face contact
    • B65H29/46Members reciprocated in rectilinear path
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H5/00Feeding articles separated from piles; Feeding articles to machines
    • B65H5/04Feeding articles separated from piles; Feeding articles to machines by movable tables or carriages
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/281Applying non-metallic protective coatings by means of a preformed insulating foil

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Textile Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

A cover lay film lamination device 1, which is comprised of base film supplying device 200, temporarily bonding device 400 for sheet shape lamination film used for temporarily bonding thin rectangular shape cover lay film onto the sheet shape base film transferred from base film supplying device 200 and shaping cover lay film which is temporarily bonded onto the base film, and lamination film collecting device 300. Temporarily bonding device 400 can supply cover lay film along cover lay film supplying path, and has a temporarily bonding table 410 which can adjust the position and attitude of cover lay film to the base film. Therefore, according to the cover lay film lamination device 1 of this invention, the lamination position accuracy of cover lay film to the base film can be easily improved, and the quality of flexible substrate can also be easily enhanced.

Description

200533583 九、發明說明: 【發明所屬之技術領域】 本發明係有關供貼合覆蓋層薄 的覆蓋層薄膜貼合裝置。 膜於形成可撓性基板用之基底 溥膜而用 【先前技術】 眾所周知,-般於形成可撓性基板之步驟中存在有·使具有熱固性 酸乙, 層的聚峨齡娜二,乙二犧τ)樹賴树蓋層薄膜, 貼5於由形成有銅落之類導體圖案的聚酸亞胺樹脂、聚對苯二甲、 (ΡΕΌ樹脂、聚瞻等而成的基底_之輸彡成面上的步驟。 向來,此種覆蓋層薄膜的貼合作業係對經予直立設置於操作臺上的多數 定位銷’狀伟通基底_及覆絲薄麵予定位後進行的。 然而,於覆盖層薄膜上通常開有絲底薄膜之導體圖案對應的多數孔, 為進行覆蓋層薄膜之貼合作業,若由覆蓋層薄膜剝離脫模薄膜或脫模紙(以 下’於本說明書稱作「脫模薄膜」)時,則覆蓋層薄膜會癱軟,實際上極難 操作。 —因此’於此種覆蓋層薄膜之貼合健的生產效率極低,乃期待採用覆蓋 層薄膜貼合裝置,以使該貼合作業實現自動化。 第10圖係說明習用覆蓋層薄膜貼合裝置而用的示意圖。習用的覆蓋層 薄膜貼合裝置_,如第Η)圖所示,係具有基底_輪送輥輪隨、覆蓋 層薄膜輸送輥輪802Α、脫模薄膜輸送輥輪8〇3Α、804Α、二對輥輪8〇5,8〇5 , 807 ’ 807、層合薄膜捲取輥輪麵、脫模薄膜捲取輥輪803Β、8_及熱壓 200533583 機806、806 (例如,參考專利文獻1 )。 而且,於習用的覆蓋層薄膜貼合裝置_方面,由基底薄膜輸送李昆輪 801A送出的基底義W11與由覆蓋層_輸送輕輪議送出的覆蓋層薄膜 W12經予s合成-體,秘已夾持於由脫模軸輸送餘隱、8嶋送出 的脫模薄膜W13、W14的狀態下,利賴壓機_、經予貼合成一體, 形成層合薄膜W15,然後予以捲取於層合薄膜捲取輕輪誦上。 因此,若採用習用的覆蓋層薄膜貼合裝置_時,則可使基底薄膜川 與覆蓋層薄膜犯_貼合作業實現自動化,結果可提高基底薄膜m與 覆蓋層薄膜W12間的貼合作業之生產效率。 專利文獻1 :日本特開平2—226793號公報(第i圖) 【發明内容】200533583 IX. Description of the invention: [Technical field to which the invention belongs] The present invention relates to a cover film bonding device for bonding a thin cover layer. The film is used to form a base film for a flexible substrate. [Prior art] It is well known that-generally, the step of forming a flexible substrate includes the use of a thermosetting acid, a layer of polyethylenyl, and an ethylene. Sacrifice mulberry tree cover film, affixed to a substrate made of polyimide resin, polyparaxyl, (PEE resin, polyisocyanate, etc.) formed with a conductor pattern such as copper drop. Steps for forming the surface. In the past, this kind of covering film was applied after positioning most of the positioning pins 'like Weitong base_' and the thin surface of the wire covering which were set upright on the operation table. However, The cover film is usually provided with a plurality of holes corresponding to the conductor pattern of the silk-based film. In order to carry out the cover film application, if the release film or release paper is peeled off from the cover film (hereinafter referred to as “the description in this specification”) "Release film"), the cover film will collapse, which is extremely difficult to handle.-Therefore, the production efficiency of this kind of cover film is extremely low, and it is expected to use a cover film bonding device. To make the paste industry Fig. 10 is a schematic diagram for explaining a conventional cover film bonding device. The conventional cover film bonding device _, as shown in the figure ii), has a substrate _feeding roller with a cover film Conveying roller 802A, release film conveying rollers 803A, 804A, two pairs of rollers 805, 805, 807 '807, laminated film take-up roller surface, release film take-up roller 803B , 8_ and hot press 200533583 machines 806, 806 (for example, refer to Patent Document 1). In addition, in the conventional cover film bonding device, the base film W11 sent by the base film conveyer Li Kunlun 801A and the cover film W12 sent by the cover layer transport light wheel are synthesized and integrated. Holding the release film W13 and W14 delivered by the ejection shaft and 8 mm, the press film is integrated with the press to form a laminated film W15, and then it is wound on the laminated film. Take the light wheel to chant. Therefore, if the conventional cover film bonding device is used, the base film and the cover film can be automated. As a result, the adhesion between the base film m and the cover film W12 can be improved. Productivity. Patent Document 1: Japanese Patent Application Laid-Open No. 2-226793 (Figure i) [Summary of the Invention]

^而於上述伋盍層薄膜貼合裝置800,係於使基底薄膜W11及覆蓋層 = W12間的貼合均以長尺度薄膜相互疊合成_體的狀態下進行的。因此, ^愈進行峨轉_,卿梅編嫩嫩對位精確 度。科,由於進行輸送此#_而發生的曲折婉蜒現象,會發生基底薄 \見度方向之對位_ ’亦難以確絲底薄膜於寬度方向之對位精確度 。因此’不易提絲底_相對於覆蓋層_之貼合位置精確度,於是存 在難以提高可撓性基板之品f的問題。 大匕柄明之目的係為解決上述問題而予完成的,提供一種可容易 的提高覆歸_雜底_⑼合位歸麵,從柯容緒高可挽性 200533583 基板之品質的覆蓋層薄膜貼合裝置。 (1 )本發明之覆蓋層薄膜貼合裝置,其特徵在於具有由供使捲筒狀基底 4膜展成板片狀、並間歇送出而用的基底薄膜供給裝置,相對於由此基底 4月果供給裝置經予送出的板片狀基底薄膜暫時壓接薄長方形的覆蓋層薄 膜、,形成覆蓋層祕針暫時壓接於基底薄膜上之板片狀層合薄膜而用 的暫時壓賊置,供捲取由此暫時壓雛置所形成的板片狀層合薄膜成捲 筒狀而用的層合_贼裝置而紅覆蓋層薄寵合裝置,前述暫時壓接 > I置可沿連接暫時壓難蓋層薄膜於基底薄膜上的區域(以下稱為“暫時 壓接,域,,)與朝前述暫時壓接區域供給_薄膜的位置(以下稱為“覆 風g薄膜t、、、、a位置)的覆盍層薄膜供給通路供給覆蓋層薄膜,且可調整 覆蓋層薄膜相對於基底_之位置及姿勢的暫時壓接工作臺。 因此’若採用本發明之覆蓋層薄膜貼合裝置時,則由於薄長方形的覆 蓋層薄膜相對於間歇送出的板錄基底_係予暫時壓接著,故即使使用 長尺度的基底_時,亦不致累積基簡·長度方向之對位誤差,不致 降低基底薄膜於長度方向之對位精確度。 • 另外,若採用本發明之覆蓋層薄膜貼合裝置時 ,則因藉由覆蓋層薄膜可^ In the above-mentioned pumping layer film bonding device 800, the bonding between the base film W11 and the cover layer W12 is performed in a state where the long-scale films are stacked on each other. Therefore, the more the E-turn is performed, the precision of Ningnen's alignment is edited by Qing Mei. Section, due to the tortuous phenomenon that occurs when conveying this #_, it will be difficult to determine the alignment accuracy of the silk bottom film in the width direction. Therefore, it is difficult to improve the accuracy of the bonding position of the wire bottom _ relative to the cover _, so that there is a problem that it is difficult to improve the quality f of the flexible substrate. The purpose of the big dagger is to solve the above problems, and to provide a cover film bonding device that can easily improve the coverage_Miscellaneous_Coupled surface, from Ko Rongxu high resilience 200533583 substrate quality . (1) The cover film bonding device of the present invention is characterized by having a base film supply device for expanding the roll-shaped base film 4 into a sheet shape and intermittently feeding it out. If the feeding device temporarily presses the sheet-shaped base film that is sent out, the thin rectangular cover film is temporarily pressed, and the sheet-shaped laminated film for temporarily pressing the cover pin to the base film is temporarily pressed. The lamination for winding the sheet-like laminated film formed by the temporary pressing device into a roll shape. The thief device and the red cover layer are thinly fitting device. The foregoing temporary crimping device can be connected along the edge. The area where the capping film is temporarily pressed on the base film (hereinafter referred to as "temporary pressure bonding, domain,") and the position where the film is supplied to the aforementioned temporary pressure bonding area (hereinafter referred to as "overwind g film t ,,,, (A, a)) The cover film supply path supplies the cover film, and the position and posture of the cover film relative to the substrate can be adjusted by a temporary crimping table. Therefore, 'if the cover film bonding device of the present invention is used, since the thin rectangular cover film is temporarily pressed against the board recording substrate sent out intermittently, even if a long-size substrate is used, it will not cause Accumulative registration errors in the base and length directions will not reduce the alignment accuracy of the base film in the length direction. • In addition, if the cover film bonding device of the present invention is used,

至少需要供給覆蓋層薄膜至基底薄 供給步驟,及對基底薄膜貼合覆蓋 一個步驟即可完全貼合覆蓋層薄膜 且,對基底薄膜貼合覆蓋層薄膜時,至 膜供給通路上的貼合區域之覆蓋層薄膜供 層溥膜之貼合步驟。但於對基底薄膜以一 7 200533583 時,此貼合步驟變成冗長,難以提高整體的生產效率。 因此,於本發明之覆蓋層薄膜貼合裝置,係對基底薄膜暫時壓接覆蓋層 薄膜並形成層合薄膜,以取代對基底薄膜完全貼合覆蓋層薄膜並形成層合 薄膜。如此,可大幅度縮短上述貼合步驟,謀求整體生產效率之提高。此 時’對基底薄膜完全貼合覆蓋層薄膜時,可另行準備供壓接(正規壓接) 覆蓋層薄膜經予暫時壓接的層合薄膜而狀專用的正式壓接裝置(如真空 熱壓機),採用此正式壓滅置並使縣底細可完全貼合覆蓋層薄膜即 可。 在此’本說明書中所謂的「薄長方形」,並不-定意指由平面觀看僅係 細長的开》狀,意指亦包含正方形的略呈矩形的形狀。 (2) 於上述⑴所述的覆蓋層薄膜貼合裝置,前述覆蓋層薄膜供給 ^路係以對連㈣述基底賴供給裝置及前述層合薄膜回收裝置的基底薄 膜供給通路成垂直相交為宜。 藉由如此構成,可以縮小覆蓋層薄膜供給通路與基底薄膜供給通路交又 • #分的面積’故可縮短基底薄膜供給通路之長度且使襄置成緊密化。 (3) 於上述⑴所述的覆蓋層薄膜貼合裝置,雖係採祕筒狀基底 薄膜作為基底但本發明並非受限於此等者。即使_薄長方形基底 薄膜作為基底薄鱗’亦具有與上述⑴所述的覆蓋層細貼合裝置之情 形同樣的效果。 區域供㈣之覆蓋層_貼合健,其特徵在於具有_暫時壓接 ^置方形基底薄膜而用的基底薄膜供給裝置、對由此基底薄膜供 方开的溥長方形基底薄膜暫時壓接薄長方形覆蓋層薄膜並形成 、方形層δ賴關的暫時顯裝置、供回收由此暫時難裝置所形成 200533583 述暫時壓‘;係具有薄膜:收裝置的覆蓋層薄膜貼合裝置,前 覆蓋層薄膜供給通路供給=層:時M接區域及覆蓋層_供給位置之 位置及姿勢的暫時壓接工作=Λ、,料對基底_娜«層薄膜之 因此,棚本她__齡㈣,㈣箱長方形基 並無累積生成基底_於長度方向之對位誤麵顧慮,故亦不致 ρ牛低基底_值長度方向之對位精確度。 —另外’咖本發明之覆蓋層_貼合裝置時,予上述⑴所述的覆 盘層薄膜貼合裝置之情形同樣的,由於藉由可調整覆蓋層薄膜對基底薄膜 之位置及讀的暫日植私作臺成材予供給至暫時顯區域,故成為可 容易的提繼細纖_之齡峨確度。絲,亦成為可容 易的提高可撓性基板之品質,從而達成本發明之目的。 (4)於上述⑴〜⑻之任_項所述的覆蓋層薄膜貼 :時壓紅作臺係可於相互垂直相交的2個水平方向、:二 平面内的假想點為旋轉中心之圓周方向上進行轉動為宜羯1了於以水 藉由如此構成,_聽底_可雜置(及姿ς)精確度_配 置覆蓋層薄膜,故成為可容㈣提高___膜之貼合位置精 確度。 此時,至於相互垂直相交的2個水平方向,係以選擇沿著基底薄膜供給 通路的方向及沿著覆蓋㈣膜供給通路的方向為宜。另外,至於水平面内 的假想點,以選猶日«接碎臺之紐層薄_讀置㈣之中心點為 宜。 ⑸於上述⑷所述的覆蓋層薄膜貼合|置,以於前述暫時壓接工 200533583 作臺上至少設有2個相互隔離配置的攝像用孔,對應於此等各攝像用孔之 各個設有攝像元件為宜。 藉由如此構成,成為藉由至少2個攝像元件可精確度良好的測定覆蓋層 薄膜對基底薄膜之位置及姿勢。因此,成為可精確度良好的測定覆蓋層薄 膜對基底薄膜之位置(及姿勢),即成可容易的提高覆蓋層薄膜對基底薄膜 之貼合位置精確度。 此時,至少2個攝像用孔以經予配置於暫時壓接工作臺之兩端部為宜。 鲁 (6)於上述(1)〜(5)之任一項所述的覆蓋層薄膜貼合裝置,前述 暫時壓接工作臺係以於前述暫時壓接區域的上方移動進行暫時壓接動作為 宜。 ” 藉由如此構成,對基底薄膜於以精確度良好的配置覆蓋層薄膜之位置 (及姿勢)的狀態下,藉由使暫時壓接工作臺保持原狀的向上方移動,在 ,對基底薄膜保持以精確度良好的配置覆蓋層薄膜之位置(及姿勢)的狀能 下,成為可進行暫時壓接。因此,即成可容易的提高覆蓋層薄膜對基底薄 膜之貼合位置精確度。 鲁 (7)於上述(6)所述的覆蓋層薄膜貼合裝置,前述暫時壓接裝置係 W述暫時壓接工作臺於前述暫時壓接區域進行暫時壓接動作時,再具有承 受前述暫時壓接工作臺之缓衝機構為宜。 藉由如此構成,成為對基底薄膜可以均勻的壓力暫時壓接覆蓋層薄膜 整體。 (8)於上述(7)所述的覆盍層薄膜貼合裝置,於前述緩衝機構上以 σ 又有供吸附基底薄膜而用的多個基底薄膜吸附孔為宜。 藉由如此構成,可使基底薄膜吸附於多個基底薄膜吸附孔上,可於暫 時壓接區域固定基底薄膜。 10 200533583 (9)於上述(8)所述的覆盍層薄膜貼合裝置,前述暫時壓接裝置以 再具有於進碑時壓接動作之麟輯緩衝機構可予壓緊的壓緊機構為 宜。 藉由如此構成,由於壓緊麟係對緩衝機構壓底賊,即成可使基 底薄膜較確實的吸附於多個基底薄膜吸附孔上。At least the step of supplying the cover film to the thin substrate supply step, and the step of laminating and covering the base film can fully adhere the cover film, and when the cover film is adhered to the base film, to the bonding area on the film supply path The cover film is used for the laminating step of the film. However, when the substrate film is used, it is difficult to improve the overall production efficiency. Therefore, in the coverlay film laminating device of the present invention, the coverlay film is temporarily pressure-bonded to the base film to form a laminate film, instead of completely laminating the coverlay film to the base film and forming a laminate film. In this way, the above-mentioned bonding steps can be greatly shortened, and the overall production efficiency can be improved. At this time, when the cover film is completely bonded to the base film, a special formal crimping device (such as vacuum hot pressing) can be prepared separately for pressure-bonding (regular crimping). Machine), using this formal compression and placement can make the county bottom completely fit the cover film. Herein, the "thin rectangle" in the present specification does not mean that it is only elongated when viewed from a plane, and means a slightly rectangular shape including a square. (2) In the coverlay film bonding device described in the above item (2), the coverlay film supply system is preferably adapted to vertically intersect the base film supply path of the above-mentioned substrate supply device and the laminate film recovery device. . With this configuration, it is possible to reduce the cross-section area of the cover film supply path and the base film supply path. Therefore, the length of the base film supply path can be shortened and compacted. (3) In the cover film bonding apparatus described in the above (2), although the cylindrical base film is used as the base, the present invention is not limited to these. Even if a thin rectangular base film is used as the base thin scale ', it has the same effect as in the case of the thin-layer thin-layer laminating device described in (2) above. The covering layer for the area supply is suitable for bonding. It is characterized by having a base film supply device for temporarily crimping a square base film, and temporarily crimping a rectangular base film opened by the base film supplier. The cover film is formed, the temporary display device of the square layer δ is closed, and the recovery is formed by the temporarily difficult device. 200533583 The temporary pressure is described above; it is a cover film bonding device with a film: a take-up device, and a front cover film supply Path supply = layer: temporary M contact area and cover layer _ temporary position of the position and posture of the supply position = Temporary crimping work = Λ ,, material to the base _ Na «layer film There is no concern about the misalignment of the base_length in the length direction, so it does not cause the low base_value alignment accuracy in the length direction. —In addition, when the covering layer of the present invention is applied to the laminating device, the situation of the laminating layer film laminating device described in the above paragraph is the same. Because the position and reading of the base film can be adjusted by adjusting the covering film. Nissei's private planting material is supplied to the temporary display area, so it becomes easy to promote the accuracy of the fine fiber. It also becomes easy to improve the quality of the flexible substrate, thereby achieving the purpose of the invention. (4) The cover film sticker described in any of the items ⑴ ~ ⑻ above: the time pressure red working platform can be perpendicular to each other in 2 horizontal directions: the imaginary point in the two planes is the circumferential direction of the rotation center It is advisable to carry out the rotation on the surface. It is composed of water, so _listening_ can be mixed (and poses) accuracy_ configure the cover film, so it can accommodate _ to increase the position of the film. Accuracy. At this time, as for the two horizontal directions which intersect each other perpendicularly, it is preferable to select a direction along the base film supply path and a direction along the cover film supply path. In addition, as for the imaginary points in the horizontal plane, it is advisable to choose the center point of the thin layer ____ __ __ __ of the bridge layer. (2) The cover film is bonded and placed as described in the above (2), so that at least two imaging holes are arranged on the working table in the aforementioned temporary crimping work 200533583, and corresponding to each of these imaging holes. It is better to have a camera element. With this configuration, it is possible to accurately measure the position and posture of the cover film and the base film with at least two imaging elements. Therefore, it becomes possible to measure the position (and posture) of the cover film to the base film with good accuracy, and it is easy to improve the accuracy of the position of the cover film to the base film. In this case, it is preferable that at least two imaging holes are preliminarily arranged at both ends of the temporary crimping table. Lu (6) The cover film bonding device according to any one of (1) to (5) above, the temporary crimping table is configured to move above the temporary crimping area to perform a temporary crimping operation as should. ”With this structure, the base film is placed in the position (and posture) of the cover film with good accuracy, and the temporary compression table is moved upward in the original state, so that the base film is maintained. The position (and posture) of the coverlay film can be arranged with good accuracy, so that it can be temporarily crimped. Therefore, the accuracy of the position of the coverlay film to the base film can be easily improved. 7) In the cover film bonding device described in the above (6), the temporary crimping device is the temporary crimping table when the temporary crimping table performs a temporary crimping operation in the temporary crimping area, and further has the ability to withstand the temporary crimping. The buffer mechanism of the worktable is suitable. With this structure, the entire cover film can be temporarily pressure-bonded to the base film with uniform pressure. (8) The coating film bonding device described in (7) above, It is preferable that the buffer mechanism has σ and a plurality of base film adsorption holes for adsorbing the base film. With this structure, the base film can be adsorbed on the plurality of base film adsorption holes, The base film can be fixed in the temporary crimping area. 10 200533583 (9) In the laminating film bonding device described in the above (8), the temporary crimping device has a linear buffer for crimping action when entering the monument. The compacting mechanism that can be compacted by the mechanism is suitable. With this structure, since the compaction system presses the bottom of the buffer mechanism, the base film can be reliably adsorbed on the plurality of base film adsorption holes.

另外,由於暫時壓接動作進行之前藉由壓緊機構進行的壓緊動作,故對 由暫時壓接工作臺引起的暫時壓接動作可在無妨礙下平穩的進行壓緊動 作。進行暫時壓接動作之前,暫時壓接動作結束後的暫時壓接工作臺由暫 日守壓接區域向覆盍層細供給位置飾’裝觸的覆蓋層細並再回至暫 時壓接區域為止的間隔’由於利用該時間進行壓緊機構之壓緊動作,因二 進行壓緊動作不需花㈣別的時間,亦不致使整體的生產效率降低。 二此時絲鮮構絲使若前述暫時難卫作臺由前述暫賴接區域向 則^覆蓋賴膜供給位置移麟,則前述壓緊機構由前述暫時壓接區域外 向前述暫時壓接區域内移動’純述㈣機構由前述暫時雜區域内向前 述暫餐接區域外鷄,顺述暫時顧工作臺由前述覆蓋㈣膜供給位 置向上述暫時壓接區域移動。 如此,即可順暢的進行由暫物妾工作臺引起的暫物妾動作及由麗緊 機構引起的摩緊動作之二者動作。 、 H 2)於上述⑴〜⑼中任—項所述的覆蓋層薄賴ah、, 述暫^接功㈣她铺綱_懈㈣宜衣置’所 猎由如此構成,於暫軸之前,縣底_給覆蓋物之過程 、二由糾材預先提高覆蓋層_之溫度,故可於較短的時間内順暢的 進行覆盍層薄膜對基底薄膜之暫時壓接。 、 200533583 A ;述(1)〜(10)中任一項所述的覆蓋層薄膜貼合裝置,官 二壯^供間歇的一捲筒狀覆蓋層薄膜成板片狀而用的覆蓋層薄膜 ==,_雜繼蝴嫩議薄膜並形^ _裝置_成_長方形覆蓋層薄膜於 盘層薄膜載《置而成之《賴職切.載置裝置。 而用的覆 藉由如此構成,成為可由捲筒狀覆蓋層薄膜形成薄長方形覆蓋層薄膜,In addition, since the pressing operation by the pressing mechanism is performed before the temporary pressing operation is performed, the pressing operation can be smoothly performed without any interference on the temporary pressing operation caused by the temporary pressing table. Before the temporary crimping operation is performed, the temporary crimping table after the temporary crimping operation is completed is supplied from the temporary crimping area to the overlay layer, and the covering layer is touched and returns to the temporary crimping area. Since the interval is used for the pressing operation of the pressing mechanism, the second operation does not take any time, and does not reduce the overall production efficiency. At this time, the fresh silk structure makes the pressing mechanism move from the temporary pressing area to the temporary pressing area if the temporarily difficult working platform moves from the temporary pressing area to the covering film supply position. The mobile 'pure description' mechanism moves the chicken from the inside of the temporary miscellaneous area to the outside of the temporary meal receiving area, and the temporary table is moved from the cover film supply position to the temporary pressing area. In this way, it is possible to smoothly perform both the motion of the temporary object caused by the temporary object and the table and the tightening motion caused by the tightening mechanism. , H 2) In the above-mentioned one of the items ⑴ ~ 的, the covering layer is thin and thin, ah, Temporary ^ received, 接 接 铺, she shop outline _ ㈣ ㈣ 宜 衣 置 'is composed of such, before the temporary axis, At the bottom of the county, the temperature of the covering layer is raised in advance by the correcting material, so the temporary pressing of the covering film to the base film can be smoothly performed in a short period of time. , 200533583 A; The cover film bonding device according to any one of (1) to (10), the second layer ^ cover film for intermittent roll-shaped cover film into a sheet shape ==, _Miscellaneous Butterfly Films and Shapes ^ _Device_ 成 _ Rectangular cover film is placed on the disk film "Lai Zhiqie. Placement Device". By using such a structure, a thin rectangular cover film can be formed from a roll-shaped cover film,

且:供給此薄長方形覆絲_至暫_接工作臺,故可使賴筒狀覆蓋 層薄膜。因此,可更提高整體生產效率。 (12)於上述(11)所述的覆蓋層薄賴合裝置,前述覆蓋 具Γί裁切板片狀覆蓋層薄膜成薄長方形而用的壓切刀之壓切刀 二屬^、、、及核此壓切刀金屬模具之金顧座,前述覆蓋層薄膜裁切· 置裝置以再具有將承受上述壓切刀之受刀板片送出至前述壓切刀金屬模 模座之_受刀板片輸送裝置、與捲取受刀板片的受刀板片捲取 藉由如此構成’於將板片狀覆蓋層薄膜裁切成薄長方形時,由受刀板片 輸送裝置送出的受77板制絲可時f接受壓切刀,故可良好喊切覆蓋 層薄膜。另外,可防止壓切刀刀尖受損。 —(13)於上述⑴〜(12)中任—項所述的覆蓋層薄膜貼合|置,以 於前述暫時祕1作臺上設核吸_長謂tM薄膜而關多 層薄膜吸附孔為宜。 1 藉由如此構成,成為可以順暢的由暫時壓接工作臺輸送經予供給至覆 蓋層薄膜供給位置的覆蓋層薄膜至暫時壓接區域。 (14)於上述(13)所述的覆蓋層編貼合裝置,前述覆蓋層薄膜裁 切:載置裝置再具有餅鮮_於上述多健蓋層_吸随上的覆蓋 層薄膜之賴薄賴端部之賴_鱗裝置,膽此賴_夾持裝^ 12 200533583 已夾持前述脫模薄膜的端部之狀態下,藉由 前述暫時壓接工作臺向前述暫時壓接區域移動,由前二!:供給位置使 模薄膜。 ㉟自μ覆|層薄膜剝離脫 藉由如此構成,於搬送覆蓋層薄膜至暫時壓接區域的步驟 由脫模____,故不必咖彳爾蝴 模薄膜的特獅⑽,可賴酬雜峨的貼合作孝。 另外,於暫時壓接工作臺上至載置覆蓋層薄膜 模薄膜的狀態下對覆蓋層薄膜進行操作,故操作極為方便/、可於附有脱 切.載==:===,_ 離脫模薄膜並形成部分㈣部關的脫贿賴離刀==相部分的剝 错由如此構成,由於經予載置於暫時壓接工作臺上的覆蓋層薄膜藉由脫 =膜剝離刀触形成部分剝離部,故脫模薄膜夾持裝置可容易的夹持脫 杈缚膜之端部。 置裝覆蓋層薄膜貼合裝置,前述覆蓋層薄膜載 =祕接工作堂上的吸附墊,此吸附塾 = 内,吸附著前述部分繼部為宜。、火持她賴、部為止的時間 “藉由如此構成,於經予載置於暫時壓接工作臺上的覆蓋層薄膜,因成為 Γ吸附墊使賴叙部繼崎細娜嶋,故脫模薄膜 爽持裝置可更容易的夾持脫模_之端部。 (Π)於上述(1)〜门 再具有經予配設於基底薄膜_通項所述的覆蓋層薄膜貼合裝置,以 膜回收裝置側,供對基底薄的前f日樣接裝置之前述層合薄 -專胺更牛固的進行暫時壓接藉由前述暫時壓接裝 13 200533583 =經予暫時壓接於基底薄膜上之覆蓋層薄膜而用的輔助暫時壓接裝置為 於上述(17)所述的覆蓋層薄膜貼合裝置,於覆蓋層薄膜對基底薄膜進 仃暫時壓接並糊蝴之靖,進行下歸驟:觸合薄膜至 進行輔助暫時壓接的區域,同時向暫«接區域供給新的基底薄膜之步驟 ’及進行暫賴接工作臺的移軸作,域底薄應給通路上的暫時難 _供給新的覆蓋層_之步驟。此時,由於後者的步雜前者的步驟所 需的時間長,故藉由利用此等步驟之間的時間錢行輔助暫時壓接處理, 可不必特意花費進行_暫時壓接麵之時間即可輯_暫時壓接。因 此’可縮短最初的暫時壓接時間,可更提高整體的生產效率。 (18) 於上述(π)所述的覆蓋層薄膜貼合裝置,以於基底薄膜供达 通路内的前述輔助暫_接裝置及前述層合薄膜回收裝置之間至少配設^ 2個相互隔離的攝像元件為宜。 猎由如此構成,以攝像元件對層合薄膜進行攝影,層合薄膜回收裝置 於回收層合_之_絲可確認其暫時醜狀態。設若由上賴像元件 攝得的結果,覆蓋層_對基底薄獻貼合位置偏移,或暫_接不完整 日守,以使裝置停止運轉,即成可防止其後使該暫時壓接形成不完整的層合 溥月美於未然。 (19) 於上述(17)或(18)所述的覆蓋層薄膜貼合裝置中,宜為再 具有供使前述基底薄膜供給裝置及前述層合薄膜回收裝置、前述暫時壓接 裝置與前述輔助暫時壓接裝置同步動作而用的控制器。 藉由如此構成,成為使可配合生產節拍時間並進行暫時壓接步驟及輔助 暫時壓接步驟,故可確保覆蓋層薄膜對基底薄膜之貼合位置精確度的狀態 14 200533583 下,進行整體高生產效率的暫時屋接。 【實施方式】 之覆蓋層薄膜貼合裝置。 以下’根_示的實施例說明本發明 (實施例1 ) =,湖第1圖〜第7 _明實施例1之覆蓋層薄膜貼合裝置。 弟圖係表不與實施例1有關的覆蓋層薄臈貼合褒置之平 第2圖係簡化絲鱗施例錢賴賴 = 有瞻細___ 第5 侧視圖。 弟圖係供_暫時雜裳置而用的主要部分放大圖。 薄膜裁切·载置裝置而用的 圖係表示供說明暫_縣置及覆蓋層 第6圖係絲€朗_裁切.《裝置的後視圖。 第7圖係表示覆蓋層薄膜裁切·載置裝置的側面圖。 於以下的㈣’以相互垂直相交的3個 1圖紙面的左右方W、, 料X軸方向(平行於第 方向)及2蝴㈣咖(平行於第1 _且與⑽垂直相交的 (金直於弟1圖紙面的方向)。 ιΖΓ1有關的觸編嫩1,如第1㈣3 _示,係 出捲⑽紅^各種裝置(如後文所述)而用峡置主體⑽、供間歇送 賴使成板片狀而用的基底軸供給^測、對由基底 物、、叫送出的板片狀基底薄膜Wb暫時壓接薄長方形覆蓋層 嫩亚i、形成覆蓋層輪經予暫時壓接於基底她上之板片狀層 15 200533583 合薄膜ws而用的暫時壓接裝置棚、供捲取由暫時壓接裝置棚所形成的 板片狀層合薄膜%成捲筒狀而㈣層合薄膜回收裝置·、介於基底薄膜 供給裝置200及層合薄膜回收裝置3〇〇之間的-對拉伸裝置25〇、、供 由暫時壓接裝置働對基底薄膜恥進―步牢固的暫時壓接經予暫時壓接於 基底薄膜Wb上之覆蓋層賴此而_輔助暫時壓接裝置·及供給經予 設置於裝置主體⑽之後方的薄長方形覆蓋層薄膜Wc至暫時壓接裝置棚 之覆盍層薄膜裁切•供給裝置β〇〇。 且,層合薄膜Ws係具有於基底薄賴之-側的圖案形成面側上經予暫 日守壓接有薄長方形覆蓋層薄膜之構造。 裝置主體⑽係由平視略呈矩形的底盤所構成。職置主體⑽之右側 部’如第3圖所示,係配設有控制器箱11〇,該箱中内藏有使基底薄膜供給 1置20G及層合薄膜回收裝置咖、暫時壓接裝置棚及輔助暫時壓接裝置 500同步動作的控制器。 士第2圖所不,裝置主體1〇〇上形成有連接基底薄膜供給裝置及層 口細回的基底細供給通路u、連接覆蓋層薄驗給位置η 及暫時壓接區域P2的覆蓋層_供給通糾2、與連接後_覆蓋層薄膜輸 送裝置610及覆蓋層薄驗給位置P1之覆蓋層賴搬送通路L3。 基底4膜供給u 200,係如第3圖所示,具有輸送輥輪21〇及引導棍 輪 220。 ' 輸4輪210係予疑轉自由的支承於報輪支持台π◦之上方端部。因 系予構成至可藉由轉矩電動機212之驅動引起的旋轉使捲筒狀基底薄 16 200533583 膜Wb呈板片狀的送出 引導輥輪则予旋轉自由的支承於裝置主魏上,予以構成至可引 導板片狀基底薄膜Wb至層合薄膜回收裝置3⑽側 具有捲取輥輪310及引導輥 層合薄膜回收裝置300,係如第3圖所示, 輪 320 〇 捲取輥輪310係予旋轉自由的支承於輥輪支持台152之上方端部。因And: supply this thin rectangular covered wire _ to the temporary _ connected to the workbench, so the tube-shaped cover film can be made. Therefore, the overall production efficiency can be further improved. (12) The cover sheet thin laminating device according to the above (11), the two cutting blades of the cutting blade used for covering the sheet-shaped cover sheet with a thin cutting plate and a thin rectangular shape, are: ^,, and Checking the metal seat of the metal mold of the cutting knife, the aforementioned cover film cutting and setting device has the function of sending the receiving plate that receives the cutting knife to the die holder of the cutting knife. The sheet conveying device and the receiving blade sheet winding for winding the receiving blade sheet are constituted in such a way that when the sheet-like cover film is cut into a thin rectangle, the receiving sheet sent by the blade receiving sheet conveying device is 77 When the wire is made, the f cutter can be accepted, so the cover film can be cut well. In addition, the tip of the cutting blade can be prevented from being damaged. — (13) Laminating the cover film according to any of (1) to (12) above, in order to set a nucleation _ long term tM film on the temporary workbench and close the multilayer film adsorption hole as should. 1 With this configuration, it is possible to smoothly transfer the coverlay film pre-supplied to the coverlay film supply position from the temporary press-contact table to the temporary press-contact area. (14) The cover weaving and bonding device described in the above (13), wherein the cover film is cut: the mounting device further has a cake_in the above-mentioned multi-functional cover layer_the cover film of the suction cover Relying on the end of the scale_scale device, daring to hold_clamping ^ 12 200533583 With the end of the release film clamped, the temporary crimping table is moved to the temporary crimping area by the temporary crimping table. The first two !: The supply position enables the mold film. ㉟Self-coating | layer film peeling and peeling is constituted in this way, the step of transporting the cover film to the temporary crimping area is demoulded ____, so it is not necessary to have a special lion of the butterfly film. Filial piety. In addition, the cover film is operated from the state of temporarily crimping the workbench to the state where the cover film mold film is placed, so the operation is very convenient /, and can be cut off. Load ==: ===, _ The film is released from the mold and part of the part is removed. The peeling error of the phase part is constituted by this. Since the cover film pre-loaded on the temporary crimping table is contacted by the release film The partial peeling part is formed, so the release film clamping device can easily clamp the end of the release film. The cover film bonding device is installed, and the cover film is loaded on the adsorption pad on the secret connection work hall, and this adsorption 塾 is suitable for adsorbing the aforementioned part of the relay. The time until the fire held her Lai and Ministry "by this structure, the cover film pre-loaded on the temporary crimping workbench became a Γ adsorption pad and made Lai Xubu Jisaki Sina to be removed The mold film holding device can more easily clamp the end of the mold release. (Π) In the above (1) to the door, there is a cover film bonding device pre-arranged in the base film_ general item, The film recovery device side is used for temporary crimping of the aforementioned laminated thin-special amine of the former f-day sample bonding device with a thin substrate. The foregoing temporary crimping device 13 200533583 = temporarily crimped to the substrate The auxiliary temporary crimping device for the cover film on the film is the cover film bonding device described in the above (17). The cover film is temporarily pressure-bonded to the base film, and the following steps are performed. Return to the final step: contact the film to the area where the auxiliary temporary crimping is performed, and at the same time supply the new substrate film to the temporary `` joining area '' and perform the shifting operation of the temporary connection worktable. Difficult _ steps to supply a new cover layer. At this time, due to the latter's steps The former steps take a long time, so by using the time between these steps to assist the temporary crimping process, you can edit the _temporary crimp without having to spend the time of _temporary crimping. Therefore, ' The initial temporary crimping time can be shortened, and the overall production efficiency can be further improved. (18) The cover film bonding device described in the above (π), the aforementioned auxiliary temporary bonding device in the base film supply path. It is preferable to arrange at least ^ 2 mutually isolated camera elements between the aforementioned laminated film recycling devices. The hunter is constituted in this way, and the laminated film is photographed with the camera element, and the laminated film recycling device is used for recycling and lamination_ 的 _ It can confirm its temporary ugly state. If the result of the image taken by the upper image element, the cover layer is offset from the position of the thin substrate, or the incomplete day guard is temporarily connected to stop the device from running. (19) In the cover film bonding apparatus described in (17) or (18) above, it is preferable to prevent the temporary crimping from forming an incomplete layer. Base film supply device and the aforementioned The controller for synchronizing the film recovery device, the temporary crimping device, and the auxiliary temporary crimping device. With this structure, the temporary crimping step and the auxiliary temporary crimping step can be performed in accordance with the production cycle time. Therefore, it is possible to ensure the accuracy of the bonding position of the cover film to the base film. 14 200533583, the temporary high-efficiency temporary roofing is performed. [Embodiment] The cover film bonding device. The following implementation is shown below. Exemplifying the invention (Embodiment 1) =, Fig. 1 to 7 of the lake _ The cover film laminating device of the first embodiment. The figure shows the cover film lamination arrangement related to Embodiment 1. The 2nd figure of Zhiping is a simplified silk scale example. Qian Lailai = Sophisticated ___ 5th side view. The main figure is an enlarged view of the main part for _ temporarily mixed clothes. The film used for film cutting and placing the device is shown for the purpose of explanation. Temporary setting and cover layer. Figure 6 is silk thread cutting. << The rear view of the device. Fig. 7 is a side view showing a cover film cutting and placing device. The following ㈣ 'intersects the right and left sides of three 1-sheet planes perpendicular to each other, and the X-axis direction (parallel to the first direction) and 2 butterfly coffee (parallel to the first Straight to the direction of the drawing surface of the brother 1.) ι ΓΓ1 related tactile tender 1, as shown in Section 1 _ 3 _, is a roll ⑽ red ^ various devices (as described later) and the main body is used for intermittent delivery. The substrate shaft used to form a sheet is supplied for measurement, and the sheet-like substrate film Wb sent out from the substrate is temporarily crimped to a thin rectangular cover layer tender i, and the cover layer is temporarily crimped to The sheet-like layer on the substrate 15 200533583 The temporary crimping device shed for laminating the film ws, for winding the sheet-like laminated film formed by the temporary crimping device shed% into a roll shape and the laminated film Recycling device ·, between the base film supply device 200 and the laminated film recovery device 300-a pair of stretching devices 25, for the temporary pressing of the base film by a temporary crimping device-a firm temporary pressing The cover layer preliminarily crimped on the base film Wb depends on this _ auxiliary temporary crimping device And supply the thin rectangular coverlay film Wc provided behind the device main body to the coverlay film cutting / supplying device β〇〇 which is temporarily crimped to the device stand. The laminated film Ws is provided on the substrate. On the side of the pattern-forming surface, a thin rectangular cover film is temporarily crimped on the side of the device. The main body of the device is composed of a chassis that is slightly rectangular in plan view. As shown in Figure 3, there is a controller box 110, which contains a set of 20G for base film supply, a laminated film recovery device, a temporary crimping device shed, and an auxiliary temporary crimping device 500. As shown in FIG. 2, the device main body 100 is formed with a thin substrate supply path u for connecting the base film supply device and the layer opening, a thin coating inspection position η for the cover layer, and a temporary crimping area P2. The cover layer_supply pass correction 2, and after connection_the cover layer film conveying device 610 and the cover layer film delivery position P1 are covered by the conveying path L3. The substrate 4 film supply u 200 is shown in Figure 3, With conveying roller 21 and guide roller 220. 'The 4th round 210 is supported by the upper end of the report wheel support table π◦. The roll-shaped base is thin 16 because it is constructed so that it can be rotated by the drive of the torque motor 212. 200533583 Film Wb is a sheet-shaped feed-out guide roller, which is supported by the main device of the device to rotate freely, and is configured to guide the sheet-shaped base film Wb to the laminated film recovery device. A roll-up roller 310 and The guide roller laminated film recovery device 300 is shown in FIG. 3, and the roller 320 and the take-up roller 310 are rotatably supported on the upper end of the roller support table 152.

㈣繼賴自觀_ ♦剛丨__磁狀層合薄 fe Ws捲取成板片狀。 引導輥輪320係予旋轉自由的支承於裝置主體⑽上,予以構成至可引 導板片狀基底薄膜Ws至捲取輥輪31〇側。 基底薄膜供給裝置·側之拉伸裝請,係、如第3 _示,具有昇降 輥輪252 ’並予設置於基底薄膜供給裝置·之下方。昇降親輪咖係以報 4 54雜付支持至可自由的旋轉•昇降於昇降導軌挪上。因此, 係予構成域藉峰(未予圖示)之驅動引起的上昇可使基簡錢鬆 弛而且由自重引起的下降至使基底薄膜Wb拉緊。 曰層合薄膜回收襄置側之拉伸裝置,如第3圖所示,係具有昇降 I輪352 ’並予設置於層合薄膜回收裝置·之下方。昇降輥輪啦係以輕 輪轴354為轴予以支持至可自由的旋轉•昇降於昇降導執356上。因此, 乂予構成至使藉由汽缸(未傾示)之驅動引起的上昇可使層合薄膜^鬆 % ’而Μ自重引起的τ降至使層合_Ws拉緊。 暫议接4置400,如第!圖〜第5圖所示,具有可沿覆蓋層薄膜供給 17 200533583 通路L2供給覆蓋層薄膜Wc、且可調整覆蓋層薄膜Wc對基底薄膜恥之位置 及文勢的暫時壓接工作臺41〇、於暫時壓接區域P2的暫時壓接工作臺&quot;ο 進仃暫時壓接動作時接受暫時壓接工作臺41〇之緩衝機構48〇、於進行暫時 壓接動作前對緩衝機構48〇壓緊基底薄膜Wb之壓緊機構49〇。 暫時壓接工作臺,如第4圖所示,係具有第1移動裝置42〇、第2 移動裝置430、第3移動裝置440、第4移動裝置及可使覆蓋層薄膜 載置的覆蓋層薄膜載置部460。㈣Ji Lai's self-view _ ♦ Gang 丨 __ Magnetic lamination thin fe Ws is rolled into a sheet shape. The guide roller 320 is rotatably supported on the device main body ⑽, and is configured so as to guide the sheet-like base film Ws to the take-up roller 31o side. The base film supply device · side stretcher, as shown in Figure 3_, has a lifting roller 252 'and is provided below the base film supply device ·. The lifting of the pro-round coffee is supported by a 4 54 miscellaneous payment to be able to rotate freely. • The lifting is carried on the lifting guide. Therefore, the rise caused by the driving of the peaks (not shown) constituting the domain can relax the base money and decrease by the self-weight to make the base film Wb tighten. As shown in FIG. 3, the stretching device on the laminated film recovery side is provided with a lifting I-wheel 352 'and is provided below the laminated film recovery device. The lifting roller is supported by the light roller shaft 354 to be freely rotatable and lifted on the lifting guide 356. Therefore, it is configured so that the rise caused by the driving of the cylinder (not tilted) can make the laminated film ^ loose% ′ and the τ caused by the dead weight of M is reduced to make the laminated _Ws tighten. Temporarily pick up 4 sets of 400, as the first! As shown in Figures 5 to 5, there is a temporary crimping table 41 which can supply the cover film Wc along the cover film supply 17 200533583 path L2, and can adjust the position of the cover film Wc on the base film and the style of the base film 41. In the temporary crimping table P2 of the temporary crimping area P2, the buffer mechanism 48 of the temporary crimping table 41 is received during the temporary crimping operation, and the buffering mechanism 48 is pressed before the temporary crimping operation is performed. The pressing mechanism 49 of the base film Wb. As shown in FIG. 4, the temporary crimping table includes a first mobile device 42, a second mobile device 430, a third mobile device 440, a fourth mobile device, and a cover film capable of placing a cover film. Mounting section 460.

第1私動U 420,如第4圖及第5圖所示,係具有舰電動機422、 以飼服電動機似為軸支承的螺旋軸424、第丨工作臺426及沿y轴方向延 伸的導軌428,並予設置於裝置主體刚上。第1移動裝置係予構成至 由飼服電動機422之驅動引起的螺旋軸你之旋轉,至使第i工作臺伽 沿y軸方向移動導軌428。 弟2移動裝置43G,係具有飼服電動機概、以錬電動機伽為轴支The first private U 420, as shown in Figs. 4 and 5, includes a ship motor 422, a screw shaft 424 supported by a feeding motor-like shaft, a 丨 table 426, and a guide rail extending in the y-axis direction. 428, and is set on the main body of the device. The first moving device is configured to rotate the screw shaft caused by the driving of the feeding motor 422 to move the guide rail 428 along the y-axis in the i-th table. Brother 2 mobile device 43G, which has a feeding motor, with a motor shaft

承__ 434、第2讀臺伽及心轴方向延伸的導軌,並予設置 於弟1工作$ 426上。第2移動裳置侧係予構成至由飼服電動機微之 驅動引起的螺旋軸434之旋轉,至使第 438上。 弟2工作室436口 x軸方向移動導執 第3移動裝置440,係具有 服電動機442、以伺服電動機442為軸支 承的螺旋軸444、第3工作臺446乃认, ㊈予第3工作臺446旋轉力的移動元件 447 ’並予設置於第2工作臺伽上 … 動 弟3工作堂446係以弟2工作表 上的樞軸448為樞軸支承著,介M 作至436 孕叉手者_工作臺座梢予以搖動自如的配設著。 18 200533583 ^衣置侧係予構成至藉由伺服電動機442之驅動而引起的螺旋軸 說旋轉,使以樞軸權為旋轉中心的圓周方向(z軸則上轉動。 弟4移動裝置450 ’係具有伺服電動機似、以舰電動議為轴支 綱旋轴454、第4工作臺及沿著X軸方向延伸的導軌458,並予設置於 … 446上第4私動U 450係予構成至藉由伺服電動機452之 驅動而引起峨細鄉,4爾嫌极上沿X轴 方向移動。 覆蓋層薄膜載置部,係、如第4 _示,介經具有由左側部向右側部 的梯度之傾斜部462及輥輪464,經予設置於第4工作臺上。另外,於 第“作臺456及覆蓋層薄臈載置部彻上固定有彈簧466。由而,若第4 工作臺456朝第4圖之左方向移動時,則覆蓋層薄膜載置部460上昇;若 第4工作臺456朝第4圖之右方向移動時,則覆蓋層薄膜載置部糊下降。 於與實施例1有關的覆蓋層薄膜貼合裝置卜暫«接工作臺彻係可 於相互垂直相交的2個水平方向(χ軸方向及y轴方向)上移動,且可以水 平面内的假想點為旋轉中心之圓周方向(z轴周圍)轉動。 由而’因成為可對基底薄膜Wb使覆蓋層薄膜此精確度良好的配置位置 (及姿勢),故成為可容易的提高覆蓋層薄膜Wc對基底薄膜奶之貼合位置 精確度。 與實施例1有_蓋層_合《 1,至於相互垂直相交的2個水 平方向(x抽方向心轴方向),係沿基底薄膜供給通路U的方向及沿覆蓋 層薄tei、、.、口通路L2的方向(茶考第2圖)。另外,至於水平面内的假想點 19 200533583 係暫時壓接工作臺410之覆蓋層薄膜載置部460的中心點。 於與實施例1有關的覆蓋層薄膜貼合裝置1,如第2圖及第4圖所示, 分別對應於暫時壓接工作臺410上設有相互隔離配置的2個攝像用孔470a 與各攝像用孔470a,設有攝像元件470。 由而,藉由2個攝像元件470可以高精確度測定覆蓋層薄膜對基底 薄膜Wb之位置及姿勢。因此,可對基底薄膜恥使覆蓋層薄膜^精確度良 好的配置位置(及姿勢),故成為可容易的提高覆蓋層薄膜Wc對基底薄膜 Wb之貼合位置精確度。 且’ 2個攝像用孔470a係予配置於暫時壓接工作臺41〇之兩端部(參 考第2圖)。 於與實施例1有關的覆蓋層薄膜貼合裝置丨,暫時壓接工作臺41〇係予 構成至藉由移動於暫時壓接區域P2之上方以進行暫時壓接動作。 由而’以對基底薄膜Wb使覆蓋層薄膜Wc進行位置(及姿勢)精確度良 好配置的雜下,藉由暫日樣接讀臺仙鋪原狀的鶴於上方,即成 在保持對基蘭膜Wb使覆μ薄狀進行位置(及姿勢)精確度良好配 置的狀態下可進行暫時壓接。因此,欲提高覆蓋層薄膜Wc對基底薄膜恥 之貼合位置精確度即成容易。 於與實施例i有關的覆蓋層薄膜貼合裝置i,如第4圖及第5圖所示, ㈣壓接裝置侧再具有於暫時壓接區域四中暫時壓接工作臺彻進行暫 時壓接動作時接受暫_接工作臺副之緩衝機構·。 曰 由而,成為可對基底薄膜Wb使覆蓋層薄膜Wc整體以均勾的力量進行斬 20 200533583 時壓接。 於與實施例1有關的覆蓋層薄膜貼合裝置1,於緩衝機構48〇上設有供 吸附基底薄膜Wb而用的多個基底薄膜吸附孔(未予圖示)。 由而,可使基底薄膜Wb吸附於多個基底薄膜吸附孔上,可於暫時壓接 區域P2固定基底薄膜Wb。 於與實施例1有關的覆蓋層薄膜貼合裝置!,如第i圖及第5圖所示,The __ 434, the second reading platform Gamma and the guide rail extending in the direction of the mandrel, and set on the brother 1 job $ 426. The second moving dress side is configured to rotate the screw shaft 434 caused by the micro-drive of the feeding motor to the 438th position. The second mobile studio 436 port x-axis direction moving third guide 440 is provided with a servo motor 442, a screw shaft 444 supported by a servo motor 442 as a shaft, a third table 446, and a third table 446 rotating force moving element 447 'is set on the second work table ... Mobile 3 work hall 446 is supported by the pivot 448 on the work table of Brother 2 as the pivot.者 _ Workbench seat is freely arranged. 18 200533583 ^ The clothing side is pre-configured to rotate the spiral axis caused by the drive of the servo motor 442, so that the circumferential direction with the pivot weight as the center of rotation (the z-axis rotates upward. Brother 4 mobile device 450 'system It has a servo-motor-like rotary shaft 454 with shaft support, a fourth table, and a guide rail 458 extending along the X-axis direction, and is installed on ... 446 The 4th private U 450 series is constructed to borrow It is caused by the drive of the servo motor 452, and it moves along the X axis in the 4th pole. The cover film mounting part is, as shown in Fig. 4, via a gradient from the left part to the right part. The inclined portion 462 and the roller 464 are provided on the fourth workbench. In addition, a spring 466 is fixed to the "workbench 456 and the cover sheet mounting part. Therefore, if the fourth workbench 456 When moving to the left in FIG. 4, the cover film placing portion 460 rises; when the fourth table 456 moves to the right in FIG. 4, the cover film placing portion paste drops. 1 The relevant cover film bonding device is temporarily attached to the workbench and can be perpendicular to each other It can move in two horizontal directions (x-axis direction and y-axis direction) that intersect, and can rotate in the circumferential direction (around the z-axis) with an imaginary point in the horizontal plane as the center of rotation. As a result, it can cover the base film Wb. The layer film has a good positioning position (and posture), so it can easily improve the accuracy of the position of the cover film Wc on the base film milk. It is the same as that of the first embodiment. The two horizontal directions that intersect vertically (x pumping direction mandrel direction) are along the direction of the base film supply path U and the direction of the cover layer tei, ..., and the mouth path L2 (Figure 2 of the tea test). As for the imaginary point 19 200533583 in the horizontal plane, it is the center point of the cover film mounting portion 460 of the temporary crimping table 410. The cover film bonding apparatus 1 according to Example 1 is shown in Figs. 2 and 4 As shown, the imaging element 470 is provided corresponding to the two imaging holes 470a and the imaging holes 470a provided on the temporary crimping table 410, which are arranged in isolation from each other. Therefore, the two imaging elements 470 can be high. Accurate determination of thin coatings The position and orientation of the film to the base film Wb. Therefore, the base film can be used to dispose the cover film ^ with good accuracy (the position and posture), so it can easily improve the adhesion of the cover film Wc to the base film Wb Position accuracy. The two imaging holes 470a are arranged on both ends of the temporary crimping table 41 (refer to FIG. 2). In the cover film bonding apparatus related to Example 1, temporarily The crimping table 41 is configured so as to perform a temporary crimping operation by moving above the temporary crimping area P2. Therefore, the position (and posture) of the cover film Wc with respect to the base film Wb is good, and the accuracy is good. With the miscellaneous arrangement, by reading the original crane of Taixianpu above the temporary sample, it can be performed while maintaining the accuracy of the position (and posture) of the base film Wb to make the μ thickness thin. Crimp temporarily. Therefore, it is easy to improve the accuracy of the position of the cover film Wc on the base film. In the cover film bonding apparatus i related to Example i, as shown in FIG. 4 and FIG. 5, the crimping apparatus side further has a temporary crimping table in the temporary crimping area 4 for temporary crimping. When in action, accept the temporary buffer mechanism of the vice table. In other words, the base film Wb can be pressure-bonded at the time of cutting the entire cover film Wc with a uniform hooking force. In the cover film bonding apparatus 1 according to Example 1, a plurality of base film suction holes (not shown) for suctioning the base film Wb are provided in the buffer mechanism 48. Thereby, the base film Wb can be adsorbed on a plurality of base film adsorption holes, and the base film Wb can be fixed in the temporary compression bonding region P2. In the cover film bonding apparatus related to Example 1! , As shown in Figure i and Figure 5,

暫時壓接裝置棚再具有於進行暫時壓接動作之前對緩衝機構侧壓緊基 底薄膜Wb之壓緊機構490。 由而,因壓緊機構49G可對緩衝機構48G壓緊基底薄膜Wb,成為可使 基底薄膜Wb更確實的吸附於多個基底薄膜吸附孔上。 另外,因於暫時壓接動作進行之前,可進行由M緊機構伽進行的廢緊 動作,可卿的進行無礙於由暫雜接卫作臺·引起的暫龍接動作之 壓緊動作。所謂進行暫時壓接動作之前,係指暫時壓接動作結束後的暫時 顧工作臺剔係由暫時壓接區域p2向覆蓋層薄膜供給位1P1移動,裝 載新的覆蓋層薄膜Wc後再回復至暫時壓接區域p2為止的時間間隔,由於 利用此時間進行由壓緊機構引起的錄動作,因此進棚緊動作不需 花費特別的時間亦可,故不致使整體的生產效率降低。 而 ^於與實補丨有關的覆蓋·獅合錢丨,辭構敍若暫時顯工 作臺_由暫《接區域P2向覆蓋層薄膜供給位置ρι移動時,職緊機 :侧由暫時壓接區域外向暫賴接區域内移動,峨機構彻由暫時 i接區域内向暫賴接區域外轉時,則暫賴接工作臺彻由覆蓋層薄 21 200533583 時壓接。 於與實施例!有關的覆蓋層薄膜貼合裝置】,於緩衝機構上設有供 吸附基底薄膜Wb而用的多個基底薄膜吸附孔(未予圖示) 由而,可使基底薄膜Wb吸附於多個基底薄膜吸附孔上,可於暫時壓接 區域P2固定基底薄膜Wb。 於與實施例!有關的覆蓋層薄膜貼合裝置),如第i圖及第5圖所示, 暫時壓接裝置_再具有於進行暫時壓接動作之前對緩衝機構壓緊基 | 底薄膜Wb之壓緊機構490。 由而,因壓緊機構彻可對緩衝機構壓緊基底薄膜恥’成為可使 基底薄膜Wb更確實的吸隱乡健底賴吸附孔上。 另外,因於暫時壓接動作進行之前,可進行由壓緊機構伽進行的壓緊 動作’可順暢的it行無礙於由暫日樣接工作臺410引起的暫時壓接動作之 壓緊動作。所謂進行暫„接動作之前,係指暫喃接動作結束後的暫時 塵接工作臺4Π)係由暫時壓接區域p2向覆蓋層薄膜供給位置朽移動,裝 鲁載新的覆蓋層薄膜Wc後再回復至暫時壓接區域p2為止的時間間隔,由於 利用此時間進行《緊機構·引起的㈣動作,因此進行壓緊動作不需 花費特別的時間亦可,故不致使整體的生產效率降低。 而 於與實施例1有關的覆蓋層薄膜貼合裝置i,係予構成至若物寺壓接工 作臺由暫日樣接區域p2向覆蓋層薄膜供給位㈣移動時,則壓緊機 • β 〇由曰嗔接區域外向暫時壓接區域内移動,若壓緊機構49〇由暫時 •壓接區域内向暫時區域外移動時,則暫時壓接卫作臺彻由覆朗薄 21 200533583 膜供給位置P1向暫時壓接區域以移動。 由而’即可順暢的進行由暫時壓接工作臺41〇引起的暫時壓接動作及由 壓緊機構490引起的壓緊動作之二者動作。 於與實施例1有關的覆蓋層薄臈貼合褒置卜暫日機妾工作臺仙係呈 有供加熱覆蓋層薄膜Wc而用的加熱器(未予圖示)。 八 由而,暫時壓接之前,於對基底薄膜恥供給覆蓋層薄錢之過程,因 縣可預先提高覆蓋層薄膜Wc之溫度,故可於較短的時間内順暢的進行覆 盍層薄膜Wc對基底薄膜Wb之暫時壓接。 於與實施例1有關的覆蓋層薄膜貼合裝置i,於暫龍接工作臺彻上 設有供吸附薄長方形·賴則“_多個覆蓋層雜吸附孔(未予圖 示)。 由而’成為可由和樣接工作臺·順暢的輸送經予供給於覆蓋層薄膜 (、、、、°位置P1之覆蓋層薄膜Wc至暫時壓接區域p2。 如弟1圖〜第3圖所示’於基底薄膜供給通路[1之暫時壓接裝置侧 的切側(基底薄膜供給裝置綱側)及下游側(層合薄膜回收裝置綱 側)上配置有固定挾持㈣、⑽,於後述的辅助暫日樣接裝置_及層 合溥膜回收裝置_之間配置有移動挾持器14〇。 银辅助暫時顧裳置5⑽係如第i圖〜第3圖所示,經予配置於基底薄膜 1内的暫日守壓接裝置400之層合薄膜回收裝置300側,予以構成 至由暫時壓接裝置侧對基底薄膜Wb可再暫時牢固的暫時壓接經予暫時壓 接於基底上的覆蓋層薄膜Wc。 22 而得的辅助暫時壓接_,係由控織11〇經The temporary crimping device booth further has a pressing mechanism 490 for pressing the base film Wb against the buffer mechanism side before performing the temporary pressing operation. Therefore, the pressing mechanism 49G can press the base film Wb against the buffer mechanism 48G, so that the base film Wb can be more reliably adsorbed on the plurality of base film adsorption holes. In addition, since the temporary crimping operation can be performed before the abandonment operation by the M tightening mechanism can be performed, the crimping operation can be performed without hindering the temporary crimping operation caused by the temporary miscellaneous guard station. Before the temporary crimping operation, it means that the temporary table after the temporary crimping operation is completed is moved from the temporary crimping area p2 to the cover film supply position 1P1, and the new cover film Wc is loaded and then returned to the temporary state. The time interval up to the crimping area p2 uses this time to perform the recording operation caused by the pressing mechanism. Therefore, it does not need to take a special time to enter the booth, and the overall production efficiency is not reduced. And ^ in the cover related to the actual supplement 丨 the lion money 丨, the phrase structure if the temporary display of the table _ from the temporary "connection area P2 to the cover film film supply position ρ, the duty tight machine: side by temporary crimping When the area moves outward from the temporary connection area, when the E mechanism is completely transferred from the temporary connection area to the temporary connection area, the temporary connection work table is crimped when the cover layer is thin 21 200533583. With the examples! Relevant cover film bonding device], the buffer mechanism is provided with a plurality of base film adsorption holes (not shown) for adsorbing the base film Wb, so that the base film Wb can be adsorbed on the plurality of base films On the suction hole, the base film Wb can be fixed in the temporary pressure bonding area P2. With the examples! Relevant cover film bonding device), as shown in FIG. I and FIG. 5, the temporary crimping device _ has a compression mechanism for pressing the buffer mechanism before the temporary crimping operation | the pressing mechanism 490 of the bottom film Wb . Therefore, since the pressing mechanism can completely press the base film against the buffer mechanism, it can make the base film Wb more surely be absorbed on the suction hole. In addition, before the temporary crimping operation is performed, the crimping operation by the crimping mechanism Gamma can be performed. The “smooth it operation” does not affect the crimping operation of the temporary crimping operation caused by the temporary sample joint table 410. . Before the temporary connection operation, it refers to the temporary dust connection table 4Π after the temporary connection operation is completed. It is moved from the temporary crimping area p2 to the cover film supply position, and the new cover film Wc is loaded. The time interval until returning to the temporary crimping area p2 is used to perform the "tightening mechanism and the tuck action caused by this time. Therefore, it does not take special time to perform the crimping operation, so the overall production efficiency is not reduced. When the cover film bonding device i related to Example 1 is configured to move to the cover film supply position from the temporary sample area p2 to the Wooloji Temple crimping table, the compactor • β 〇Move from the outside of the crimping area to the temporary crimping area. If the pressing mechanism 49 moves from the inside of the temporary crimping area to the outside of the temporary area, the temporary crimping platform is completely covered by the film supply position. 21 200533583 P1 moves to the temporary crimping area. As a result, both the temporary crimping operation caused by the temporary crimping table 41 and the crimping operation caused by the crimping mechanism 490 can be smoothly performed. The cover sheet in accordance with Example 1 is thin, laminated, and placed on a temporary machine. The work table is a heater (not shown) for heating the cover film Wc. For this reason, before temporarily crimping In the process of supplying the thin film of the cover film to the base film, the county can raise the temperature of the cover film Wc in advance, so the temporary compression bonding of the cover film Wc to the base film Wb can be smoothly performed in a short time. In the cover film laminating device i related to Example 1, a thin rectangular · Lai Ze "_ multiple cover layer miscellaneous adsorption holes (not shown) are provided on the temporary joint table. As a result, it can be supplied to the cover film (,,,,, and °) at the position P1 to the temporary pressure-bonding area p2 by a smooth transfer via the sample connection table. As shown in Figure 1 to Figure 3 It is shown that the fixed support ㈣ and ⑽ are arranged on the cut side of the base film supply path [1 on the side of the temporary crimping device (side of the base film supply device) and the downstream side (side of the laminated film recovery device). A mobile holding device 14 is arranged between the auxiliary temporary sample connecting device_ and the laminated film recovery device_. The silver auxiliary temporary Gu Shangjia 5 is shown in Fig. I to Fig. 3, which is pre-arranged on the base film. The laminated film recovery device 300 side of the temporary day crimping device 400 in 1 is constituted so that the temporary compression bonding of the base film Wb by the temporary crimping device side can be temporarily and firmly secured, and the cover is temporarily crimped on the substrate. Layer film Wc. 22 The auxiliary temporary crimping _, which is controlled by the weaving 11〇

200533583 由辅助暫時壓接裂置500 予設定成簡待的時間。 的、频㈣繼_ _1 _2邮,具有供間歇 又、狀覆盖層薄膜Wd)成板片狀而用的覆蓋層薄膜輸送裝置⑽、裁 切經由^層__置61Q所送出的板片狀覆蓋層薄誦並形成薄 :幵項1層;I膜We而賴覆蓋層薄膜裁切裝置_、及供載置由覆蓋層 薄膜裁刀衣置630所形成的薄長方形覆蓋層薄膜wc於暫時壓接工作臺仙 上而用的覆蓋層薄膜載置裝置650。 由而’因成為可由捲筒狀覆蓋層薄膜Wc〇形成薄長方形覆蓋層薄膜Wc, 並將該薄長方形的覆蓋層薄膜Wc供給至暫時壓接工作臺41〇,故可採用捲 筒狀覆盍層薄膜WcO。故可進一步提高整體的生產效率。 覆盍層薄膜輸送裝置610係如第6圖及第7圖所示,具有輸送輥輪612、 驅動輥輪616及引導輥輪620。 輸送輥輪612係可予旋轉自如的支承於輥輪支座ΐβ〇之上方端部。因 此,係予構成至藉由轉矩電動機614之驅動引起的旋轉使捲筒狀覆蓋層薄 獏WcO呈板片狀送出。 驅動輥輪616係予旋轉自如的支承於輥輪支座162上。因此,係予構成 至由轉矩電動機618之驅動引起的旋轉使板片狀覆蓋層薄膜WcO輸送至引 導輥輪620側。 引導輥輪620係予旋轉自如的支承於裝置主體100上,予以構成至板片 狀覆蓋層薄膜WcO可引導覆蓋層薄膜裁切裝置630侧。 23 200533583 於復盍層薄膜輸送裝置61〇之下方,配置有供鬆馳•拉緊覆蓋層薄膜 WcO而用的昇降輥輪622。 於引導輥輪620之覆蓋層薄膜裁切裴置63〇侧處,配置有由覆蓋層薄膜 輸达I置61〇供牽引板片狀覆蓋層薄膜Wc〇而用的引出輥輪似4及移動挾 持器626。200533583 The auxiliary temporary crimp cracking 500 is set to a short time. The frequency, following _ _1 _2 post, has a cover film conveying device for intermittent, shaped cover film Wd) into a sheet shape, cuts the sheet shape sent by ^ __ 6161 The cover layer is thinly formed and formed into a thin layer: 1 item; I film We rely on the cover film cutting device_, and a thin rectangular cover film wc formed by the cover film cutting knife set 630 is temporarily A cover film mounting device 650 for crimping on a work table. As a result, a thin rectangular cover film Wc can be formed from the roll-shaped cover film Wc0, and the thin rectangular cover film Wc is supplied to the temporary crimping table 41. Therefore, a roll-shaped cover can be used. Layer film WcO. Therefore, the overall production efficiency can be further improved. As shown in FIG. 6 and FIG. 7, the coated film conveying device 610 includes a conveying roller 612, a driving roller 616, and a guide roller 620. The conveying roller 612 is rotatably supported on the upper end of the roller support ΐβ〇. Therefore, it is configured so that the roll-shaped coating layer 薄 WcO is sent out in a sheet shape by rotation caused by the drive of the torque motor 614. The driving roller 616 is rotatably supported on a roller support 162. Therefore, it is configured so that the rotation by the drive of the torque motor 618 causes the sheet-like coverlay film WcO to be conveyed to the guide roller 620 side. The guide roller 620 is rotatably supported on the apparatus main body 100, and is structured so as to guide the cover film cutting device 630 to the plate-like cover film WcO. 23 200533583 Below the multi-layer film conveying device 61 °, a lifting roller 622 is provided for relaxing and tightening the cover film WcO. At the 63 ° side of the cover film cutting of the guide roller 620, a take-out roller for moving the cover sheet film Wc0 from the cover film to the 61 ° is arranged and moves. Holder 626.

後孤層/專膜裁切裝置630係如第6圖所示,具有供裁切板片狀覆蓋層薄 膜WcO成薄長方形壓切刀而用的壓切刀金屬模咖、及承受壓切刀金屬模 632之至屬板座。另外,覆蓋層薄膜裁切•載置裝置_係再具有將承 受壓切刀的受刀帶Wh送出至壓切刀金屬模632及金屬模座咖之間的受刀 板片輸送衣置β4〇、及捲取受刀板片施之受刀板片捲取裝置⑽。 由而於裁切板片狀覆盍層薄膜Wc〇成薄長方形之際,因成為由受刀板 輸k衣置640所达出的觉刀板片Wh可經常接受壓切刀,故可良好的裁切 覆蓋層薄膜。另外,可防止壓切刀刀刃之損傷。 壯覆蓋層薄膜載置裝置65〇係如第2圖所示,具有供收付由覆蓋層薄膜裁 衣置630所裁切的薄長方形覆蓋層薄膜Wc至覆蓋層薄膜收付位置⑼而 =移動挾持讀、及供搬送經予載置於覆蓋層薄膜收付位置⑺而用的 可昇降於覆蓋層薄膜供給位 «層_ Wc至覆蓋層薄膜供給位置ρι之暫日娜工作請的吸附塾 阳4。此吸附墊654係可移動於X軸方向上, 及覆蓋層薄膜收付位置p3處。 於與實施例1有關的覆蓋層薄膜貼合裝置i係如第i圖、第2圖及第5 圖所不,覆賴_ •觸謂雜細賴膜繼細 24 200533583 夾持經予載置於暫時壓接作臺41Q上的覆M薄膜⑽之脫模細的端部 之脫模薄敲持裝置660。E1此’於雌賊鱗裝置_已姚脫模薄膜 端部之狀態下’軒構成至藉由情難工作臺仙自覆蓋層薄膜供給位 置P1向暫時壓接區域P2移動,由覆蓋層薄膜^剝離脫模薄膜。 因而,於搬送覆蓋層薄膜Wc至暫時壓接區域四之步驟中,因成為可由 覆蓋層薄翻離脫㈣膜,故成為不必另外域蓋層_轉意設置_ 離脫模薄膜之步驟。因此,可縮減覆蓋層薄膜Wc對基底薄膜师之貼合作 業。 另外’載置覆蓋層薄膜Wc至暫時壓接工作臺41()上時,因成為可於覆 蓋層薄膜WC附械模薄膜的狀態ητ進行操作,故操作極為容易。 於與實施例i有關的覆蓋層薄膜貼合裝置!,覆蓋層薄膜裁切·載置裝 置_係如第7圖所示,於裁切覆蓋層薄膜Wd)之前,再具有供由覆蓋層 薄膜W上部分的剝離賴薄膜並形成部分剝離部而用的脫模薄膜剝離刀 670。 由而’經予載置於物夺壓接工作臺410 ±的覆蓋層薄膜Wc,因成為藉 由脫模薄膜㈣㈣0可予航形成部分剝離部,故成為使脫模薄膜爽持 I置660可容易的夾持脫模薄膜之端部。 於與實施例!有關的覆蓋層薄膜貼合裝置丄,上述吸附塾係予構成 至載置覆蓋層薄膜Wc於暫時壓接工作臺侧上至藉由脫模薄膜爽持裝置 660夾持脫模薄膜端部為止的時間,亦可吸附著部分剝離部。 由而,於經予載狄暫時壓紅作臺的覆蓋層薄,因成為於 25 200533583 藉由吸附墊654使脫模薄膜之部分剝離部吸附並捲起的狀態,故脫模薄膜 夾持裝置660成為可更容易的夾持脫模薄膜之端部。 於覆盍層薄膜供給通路L2之覆蓋層薄膜供給位置ρι與暫時壓接區域 P2之中間位置上,如第5圖所示配置有2個照·的發光元件 如上所述’於與實施例丨有_覆蓋層薄膜貼合裝置丨係、具有供間歇送 出捲筒狀基底_ Wb成板片狀_的基底薄膜供給裝置·、對由基底薄 膜供給裝置2GG所送出的板片狀基底薄膜ffb暫時壓接薄長方形覆蓋層薄膜 Wc、供形成覆蓋層_ We經予暫時壓接的板片狀層合_如於基底薄膜 Wb上而用的暫時壓接裝置棚、供捲取由暫時壓接裝置侧所形成的板片 狀層合薄膜Ws成捲筒狀而用的層合薄膜回收裝置3〇〇。另外,暫時壓接裝 置棚係具有沿覆蓋層薄膜供給通路L2可供給覆蓋層薄膜%、且可調整覆 蓋層薄膜Wc對基底薄膜Wb的位置及姿勢之暫時壓接工作臺41〇。 因此,若採用與實施例1有關的覆蓋層薄膜貼合裝置i時,因對經予間 歇达出的板)ί狀基底細Wb係成㈣長方形的覆蓋層薄膜&amp;被暫時壓接 著’故即使_長尺度基底薄断,亦不致累積基底薄膜於長度方向之對 位误差’亦不致使基底薄膜於長度方向之對位精確度降低。 另外,若採用與實施例1有關的覆蓋層薄膜貼合裝置i時,因覆蓋層薄 膜Wc藉由可調整覆蓋層薄膜Wc對基底薄膜ffb之位置及姿勢的物夺壓接工 作臺仙可予供給至暫時壓接區域p2,故成為可提高覆蓋層薄膜*對基底 溥膜Wb之貼合位置精確度。於是,亦可容㈣提高可撓性基板之品質。 於與實施例1有關的覆蓋層薄膜貼合裝置i係如第i圖及第3圖所示, 26 200533583 於基底薄職給通i^L1⑽獅暫啦接裝置5⑽及層合驗回收裝置 300之間,互相隔離的配置有2個攝像元件18q。 由而,需以攝像元件18〇對層合薄膜Ws進行攝影,即可於層合薄膜回 收裝置300回收層合薄膜.之前確認其暫時摩接狀態。假設由攝像元件⑽ 而得的攝影結果,覆蓋層薄膜Wc對基底薄膜奶之貼合位置有偏移或暫時 塵接不完整的情況,需使裝置停止運轉,即可防止其後使該暫賴接形成 不完整的層合薄膜於未然。 旧實施m有μ覆蓋賴_合裝置卜如上所述,係再具有供使 基簡膜供給裝置200、層合薄膜回收裝置3〇〇、暫時壓接裝置侧及辅助 曰日守壓接I置5〇〇同步動作而用的控制器I〗。。 由而,因成為可邊配合生產節拍時間可進行暫時壓接步驟及辅助暫日销 接步驟,故可於確保提高覆蓋層薄膜Wc縣底_ wb之貼合位置精確度 的狀態下,可進行整體高生產效率的暫時壓接。 以下,參考第2圖及第§圖,#明接丨每 人 〖膝用與錢船有關的覆蓋層薄膜貼 S裹置1時之覆蓋層薄膜此對基底 輪b的暫0僅接方法。第8圖係供 呢月復盍層_對基底_之暫時難方法而㈣流程圖。 採用與實施例1有關的覆蓋層薄壯 P 專膑貼a衣置1時之覆蓋層薄膜界 底薄膜Wb的暫賴接松,# 银WC對基 ” 係具有如下步驟:向暫日《接裝置侧卿^ 底缚則b之[基«酿給步 l 口基 . σ溥長方形覆盍層薄膜Wc至暫時厣 接工作臺410之[覆蓋層_供給 σ V 對基底薄膜Wb暫時壓接覆罢尽锋 錢之[暫《接•輔助暫日_ 匕接復现層》專 口收设盍層薄膜Wc經予暫時壓 200533583 接的層σ施Ws之[層合賴时麵]。町,依找日爾各步驟。 且,於實施綱輸奴際,㈣2圖_,嫌細4 配置於輔助暫時壓接裝置_之附近,覆蓋層_載《置_之移動技 持器652係予配置於覆蓋層薄膜裁城置咖之附近,覆蓋層薄膜载置壯 置650之吸附塾654係予配置於覆蓋層薄膜收付位置P3處。另外,暫^ 接工作臺41G係予配置於覆蓋層薄膜供給位置處。 才土 1·基底薄膜供給步驟The rear solitary layer / special film cutting device 630 is provided with a cutting die metal die for cutting a sheet-like cover film WcO into a thin rectangular cutting knife as shown in FIG. The metal mold 632 is a plate seat. In addition, the cover film cutting and placing device _ is further provided with a receiving plate conveying device β4 that sends the receiving belt Wh that receives the cutting blade to the cutting blade metal mold 632 and the metal mold holder. , And the receiving blade coiling device 卷 for winding the receiving blade. Therefore, when the sheet-shaped sheet-like coating film Wc0 is cut into a thin rectangle, the blade sheet Wh obtained by receiving the knives set 640 can often receive a cutting knife, so it is good. Of cut cover film. In addition, it prevents damage to the blade of the cutting blade. As shown in FIG. 2, the strong cover film mounting device 65 is provided with a thin rectangular cover film Wc cut and received by the cover film cutting device 630 to the cover film receiving position.读 Holding and reading, and can be lifted and lowered at the cover film supply position «Layer_ Wc to the cover film supply position 供 for the temporary loading of the cover film receipt and payment position 的 Temporary work, please take care of Liyang 4. The suction pad 654 can be moved in the X-axis direction and the cover film receiving position p3. The cover film bonding device i related to Example 1 is as shown in Fig. I, Fig. 2 and Fig. 5; A mold-thin holding device 660 at the end of the mold-coated thin film ⑽ on the temporary crimping table 41Q. E1 This "in the state of the female thief scale device _ has been released from the end of the film" Xuan composition to move from the cover film supply position P1 to the temporary pressure bonding area P2 by the difficult work table fairy, from the cover film ^ Peel the release film. Therefore, in the step of conveying the coverlay film Wc to the temporary pressure-bonding area 4, since the release film can be peeled off by the coverlay thinly, it becomes a step of not having to cover the cover_inverted installation_release film. Therefore, it is possible to reduce the adhesion of the coverlay film Wc to the substrate filmmaker. In addition, when the cover film Wc is placed on the temporary crimping table 41 (), it can be operated in the state ητ of the cover film WC with a mechanical mold film, so the operation is extremely easy. In the cover film bonding device related to Example i! The cover film cutting and placing device is shown in Fig. 7. Before the cover film Wd) is cut, the cover film W is further provided with a peeling film on the upper part of the cover film W to form a partial peeling part. Release film peeling knife 670. As a result, the cover film Wc, which is placed on the object crimping table 410 ±, becomes a partially peeled part through the release film ㈣㈣0, which makes the release film hold 660. Easy to grip the end of the release film. With the examples! In the cover film bonding apparatus 丄, the above-mentioned adsorption means is preliminarily configured until the cover film Wc is placed on the temporary crimping table side until the end of the release film is held by the release film holder 660. Over time, a part of the peeling part may be adsorbed. As a result, Yu Yingdi temporarily pressed the red cover to make the cover thin. Since it was in a state where the part of the release film was adsorbed and rolled up by the adsorption pad 654 on 25 200533583, the release film holding device The 660 becomes the end where the release film can be held more easily. At the intermediate position between the cover film supply position ρ of the cover film supply path L2 and the temporary crimping area P2, as shown in FIG. 5, two light-emitting elements are arranged as described above in the embodiment. There are _ cover film bonding devices 丨 series, a base film supply device for intermittently feeding a roll-shaped substrate _ Wb into a sheet shape 、, and a sheet-shaped base film fb sent by the base film supply device 2GG temporarily Crimp thin rectangular cover layer film Wc, for forming the cover layer_ We are temporarily laminated with sheet-like lamination _ Temporary crimping device shed such as used on the base film Wb, for winding by temporary crimping device The laminated film recovery device 300 used for the sheet-like laminated film Ws formed on the side is rolled. In addition, the temporary crimping device booth has a temporary crimping table 41 that can supply the cover film% along the cover film supply path L2 and can adjust the position and posture of the cover film Wc to the base film Wb. Therefore, if the cover film bonding apparatus i related to Example 1 is used, the cover film with a thin base and a thin Wb system formed into a rectangular shape will be temporarily pressed. Even if the long-scale substrate is thinly broken, it will not accumulate the alignment error of the substrate film in the length direction, nor will it cause the accuracy of the alignment of the substrate film in the length direction to be reduced. In addition, if the cover film bonding apparatus i according to Example 1 is used, the cover film Wc can adjust the position and posture of the base film ffb by the cover film Wc to adjust the position and posture of the base film ffb. Since it is supplied to the temporary pressure-bonding region p2, it is possible to improve the accuracy of the position where the cover film * is bonded to the base film Wb. Therefore, the quality of the flexible substrate can also be accommodated. The coating film laminating device i related to Example 1 is shown in Fig. I and Fig. 3, 2005200533583. It is a thin film on the base, i ^ L1, the lion temporary connection device 5, and the lamination inspection and recovery device 300. Two image pickup elements 18q are arranged to be isolated from each other. Therefore, the laminated film Ws needs to be photographed with the imaging device 180, and the laminated film can be recovered in the laminated film recovery device 300. Before this, the temporarily rubbed state can be confirmed. Suppose that the photographic result obtained by the imaging element indicates that the cover film Wc is deviated from the bonding position of the base film milk or is temporarily incompletely connected, and the device needs to be stopped to prevent the temporary delay. The incomplete laminate film is then formed. As mentioned above, the old implementation has a μ covering device. As mentioned above, it has a base film supply device 200, a laminated film recovery device 300, a temporary crimping device side, and an auxiliary day-to-day crimping device. Controller I for synchronous operation. . As a result, the temporary crimping step and the auxiliary temporary pinning step can be performed while matching the production cycle time, so it can be performed under the condition that the position accuracy of the cover film Wc county bottom _wb is improved. Temporary crimping of overall high production efficiency. In the following, referring to Figure 2 and Figure §, # 明 接 丨 Everyone [The knee is covered with a covering film related to a money boat, and the covering film when S is wrapped with 1 This method of temporarily connecting the base wheel b only. Figure 8 is a flow chart for the temporarily difficult method of the complex layer of the moon. The cover film of the cover layer P, which is related to Example 1, is used when the cover film Bb of the cover film is temporarily set loose, and # 银 WC 对 基 ”has the following steps: Device side ^ Bottom binding rule b of the [base «brew step l base. Σ 溥 rectangular cover film Wc to the temporary bonding table 410 [cover layer_supply σ V temporarily presses and covers the base film Wb Exhausting Qian Qianzhi's [Temporary "Auxiliary Temporary _ Dagger Reappearance Layer" special collection set up a layer of film Wc to temporarily press the layer 335 applied to 200533583 [Laminated Lai Shimen]. According to the steps of finding the Japanese, and in the implementation of the slavery, ㈣ 2 Figure _, suspected 4 is arranged near the auxiliary temporary crimping device _, and the cover layer __ _ _ _ _ is placed in the mobile holder 652 is configured In the vicinity of the cover film, the cover film is placed on the cover film receiving position P3. In addition, the temporary work platform 41G is placed on the cover layer. Film supply position. Talent 1 · Base film supply step

首先,藉由驅動基底薄膜供給裝置200、移動挾持器刚及層合薄膜回 «置期’使基底她沿基底_供給糊進行継的輪送(、第 8圖之步驟Q1 )。 、基底賴Wb之覆蓋層薄膜貼合位置到達暫時壓接區域π時,暫時停 顧桃Wb之輸送動作,藉由目定挾持請、_縣底薄膜奶。 :f緊機構490對緩衝機構480壓緊基底薄膜Wb,暫時壓接區域First, by driving the base film supply device 200, moving the holder, and the laminated film back to the "setting period", the substrate is rotated along the substrate_supply paste (step Q1 in FIG. 8). 2. When the laminating position of the cover film of the substrate Wb reaches the temporary crimping area π, the transportation action of the peach Wb is temporarily stopped, and please hold it by your eyes. : f pressing mechanism 490 presses the base film Wb against the buffer mechanism 480, and temporarily presses the area

、t 1則由經予設於緩_構上的多健底薄膜吸附孔 予以真空吸附•固定(第8圖之步驟⑻。 2·復蓋層薄膜供給步驟 =動设義層薄膜輸送裝置610,沿覆蓋層薄膜輸送通路L3間歇 的送出捲筒狀霜芸 義g厚膜WcO成板片狀,(第8圖之步驟則)。此時,覆苗 層薄膜WcO係μ ώ + 八Α 、脫模薄膜剝離刀670使於覆蓋層薄膜WcO之脫模薄膜部 刀_,形成部分剝離部。 S薄暝輪廷裝置6 i 〇經予送出的板片狀覆蓋層薄膜㈣係藉由移 28 200533583 動技持邊予以供給至覆蓋層薄膜裁切I置⑽上的壓切刀金屬模咖 及孟屬柄座634之間。因此,於藉由移動挾持器脱使經予夾持於板片狀 錢層薄膜WCQ之覆蓋層薄膜收付位置p3側端緣的狀態下,使藉由覆蓋層 630 ( ^ 8 R2) 〇 ^ ^ 及至屬核座634之間使受刀板片Wh經常被送出的狀態下,成為覆蓋 層薄膜WcO可予裁切。And t 1 are vacuum-adsorbed and fixed by the multi-layer bottom film adsorption holes provided on the slow structure (step 8 in Fig. 8). 2. Covering film supply step = moving device film conveying device 610 The thick film WcO is rolled into a sheet form intermittently along the cover film conveying path L3 (step in FIG. 8). At this time, the cover film WcO is μ PLUS + VIII, The release film peeling knife 670 cuts the release film portion of the cover film WcO to form a partially peeled portion. S thin film wheel device 6 i 〇 The sheet-shaped cover film that is sent out is moved by 28 200533583 The moving edge is supplied between the cutting knife metal mold and the Monk handle 634 on the cover film cutting device I. Therefore, the handle is clamped on the plate by moving the holder. In the state of the cover film receiving position p3 side edge of the cover layer film WCQ, the receiving plate Wh is often sent out between the cover layer 630 (^ 8 R2) 〇 ^ and the core holder 634 In the state of WcO, the cover film WcO can be cut.

稭由覆蓋層薄膜裁切裝置630經予裁切成薄長方形的覆蓋層薄膜此係 _移動挾持器652經予配置於覆蓋層薄膜收付位置p3處。經予配置於覆 蓋層薄膜收付位置P3處的覆蓋層薄錢由吸附塾枕654所吸附著,由覆 g薄膜收付位置P3_搬送•載置向覆蓋層細供給位置pi之暫時壓 接工作臺410上(第8圖之步驟⑹)。 於經予載置於暫時壓接工作臺彻上的覆蓋層薄膜Wc方面,於覆苗層 薄膜Wc之下面係躺軒設於情驗讀臺仙上❹個覆蓋層薄舰 附孔所吸附者。另外,於覆蓋層雜.之上面,亦即脫模薄膜面,正吸附 著部分剝離部以外部分的吸_ 之吸附斜以解除。又,於此狀態下 右使日守[接工作里410下降時,則於經予載置於暫時壓接工作臺仙上 的覆盖層薄膜ffc即成為藉由吸附墊咖使脫模薄膜之部分剝離部受吸附而 予提拉的狀態。因此,藉由脫模薄膜夾持裝置_夾持著該提拉的部分剝 離部,同時藉由使暫時壓接工作臺·向暫賴接區域p2移動,則脫模薄 膜成為可予谷易的由覆蓋層薄膜Wc剝離(第8圖之步驟財)。 且,此經«嫌的雌_舒雜人、針輕於覆蓋層_供給位置 29 200533583 pi附近的脫模薄膜回收箱内(未予圖示)。 3·暫時壓接•輔助暫時壓接步驟 首先’使於覆蓋層薄膜供給位置P1經予供給覆蓋層薄則C的暫時堡 接工作臺41〇,移動至覆蓋層薄膜供給通路L2經予配置發光元件⑺= 置。於此位置處藉由經予配置於暫時襲工作臺仙的2個攝像元件· 對覆蓋層薄膜Wc進行攝影,並根據該攝影結果,浙覆蓋層薄則c 時壓接工作臺410之位置(第8圖之步驟幻)。 其次,使暫時壓紅作臺41〇移動至暫時壓接區域?2處。此時,塵緊 機構49G係予配置於暫時壓舰域外。於暫時壓接_ P2處,藉由^攝 像元件470對基底薄膜Wb進行攝影,並根據該攝影結果,測定以暫時麵 工作臺之位置為準的基底薄膜抓的位置(第8圖之步驟⑵。因此, 由此等覆蓋層_We及基底_Wb之測紐計算出相對偏移量,再根據 該計算結果,驅動暫時壓接工作臺,進行水平方向(·方向及y轴方 向)之移動調整及/或圓周方向(z轴周圍)之轉動調整,進行覆蓋層薄暝 對基底薄膜Wb之對位(第8圖之步驟S3)。 覆蓋層薄膜Wc雌底薄膜Wb之對位結束後,驅動暫時壓接工作臺4ι〇 之第4移動裝置450,使暫時壓接工作臺胸多向上方,使覆蓋層薄至膜知 暫日《接於基底薄膜Wb上(第8圖之步驟S4)。由而,使覆蓋層薄膜此經 予暫時壓接的層合薄則s形成於基絲膜Wb上。暫_接動作結束後, 固定挾持器12〇、13〇之夾持可予解除。 若此暫時壓接動作結束後,則為接受來自覆蓋層薄膜裁切•載置裝置 30 200533583 刪的新覆蓋層薄膜Wc,暫時壓接工作臺410移向覆蓋層薄膜供給位置ρι。 由暫日守壓接m〇〇所形成的板片狀層合薄膜如,係藉由基底薄膜供 給裝置200、移動挾持器14〇及層合薄膜回收裝置3〇〇之驅動而被送往辅助 暫時壓難置5G0。因此,藉由輔助暫時壓接裝置5⑽使進行輔助暫時壓接, 使覆盖層薄膜WC絲底薄膜Wb更牢固的暫時壓接的層合薄膜可予形成 (第8圖之步驟S5)。 4·層合薄膜回收步驟The straw is pre-cut into a thin rectangular cover film by the cover film cutting device 630. The mobile holder 652 is pre-arranged at the cover film receiving position p3. The thin cover film pre-arranged at the cover film receipt and payment position P3 is adsorbed by the adsorption pillow 654, and is temporarily pressed to the cover fine supply position pi by the cover film receipt and payment position P3. On the workbench 410 (step ⑹ in FIG. 8). In terms of the cover film Wc pre-loaded on the temporary crimping workbench, the cover film Wc is lying below the cover film Wc. . In addition, on the cover layer, that is, on the release film side, the adsorption slant of the part other than the part of the peeling part is adsorbed to be released. Also, in this state, when the Nissei [Ringing 410 drops down, the cover film fc placed on the temporary crimping table is preliminarily formed as a part of the release film by adsorption pad coffee. A state where the peeling part is attracted and pulled up. Therefore, by releasing the film holding device _ while holding the partially peeled part of the pull-up, and simultaneously moving the temporary crimping table · to the temporary contact area p2, the release film can be made easy. It is peeled off by the coverlay film Wc (step 8 in FIG. 8). Moreover, the «suspected female _ Shu Zaren, needle is lighter than the cover _ supply position 29 200533583 pi inside the release film recovery box (not shown). 3. Temporary crimping • Auxiliary temporary crimping step First, the temporary film bonding table 41 of the cover film supply position P1 is pre-supplied to the cover film supply position C, and is moved to the cover film supply path L2 to be pre-arranged to emit light. Element ⑺ = is set. At this position, the cover film Wc is photographed by the two imaging elements pre-arranged on the temporary work table. According to the photographic result, the position of the work table 410 is crimped when the cover is thin. Figure 8 steps magic). Next, move the temporary crimping stage 41o to the temporary crimping area? 2 places. At this time, the dust tight mechanism 49G was pre-arranged outside the temporary ship-to-ship area. At the temporary crimping_P2, the base film Wb is photographed by the imaging device 470, and based on the photographic result, the position of the base film grasping based on the position of the temporary surface table is determined (step 8 in FIG. 8) Therefore, the relative offset is calculated from the measurement buttons of the cover layer_We and the substrate_Wb, and then the temporary crimping table is driven to move in the horizontal direction (· direction and y-axis direction) based on the calculation results. After the adjustment and / or the rotation adjustment in the circumferential direction (around the z-axis), the cover film is aligned with the base film Wb (step S3 in FIG. 8). After the cover film Wc is aligned with the female bottom film Wb, The fourth moving device 450 of the temporary crimping table 4m is driven, so that the chest of the temporary crimping table is more upward, so that the covering layer is thin enough to be connected to the base film Wb (step S4 in FIG. 8) As a result, the lamination film that temporarily bonds the cover layer film is formed on the base film Wb. After the temporary connection operation is completed, the holding of the fixed holders 12 and 13 can be released. After this temporary crimping operation is completed, Cutting and placing device 30 200533583 The new cover film Wc deleted is temporarily moved to the cover film supply position ρ. The sheet-like laminated film formed by the temporary pressure bonding m〇〇 It is sent to the auxiliary temporary pressing device 5G0 by the drive of the base film supply device 200, the moving holder 14 and the laminated film recovery device 300. Therefore, the auxiliary temporary pressing device 5 is used to assist Temporarily press-bond the temporary laminated film to make the cover film WC wire-base film Wb firmer (step S5 in FIG. 8). 4. Laminated film recovery step

輔助暫時壓接經予進行的層合 向破送 向層合薄_«置咖。鱗,藉由鮮配置於移紐持器⑽之寬度方 向轉山勺攝像元件18〇對層合薄膜Ws之暫時壓接狀態進行確認作業 U 8圖之步驟SQ1)。因此,藉由驅動基底_供給裝置测 '移動挟持 為140及層合賴回收裝置·,捲取板片狀層合薄錢於捲取輥輪⑽ 上(第8圖之步驟災2)。由 板片狀居口賴Ws係予捲取成捲筒狀,即 成可以捲筒狀層合_ Ws的形式?以回收。 猎由以上的步驟,即可形成覆蓋層薄膜Wc經予暫睥雜於其p 上的層合输s。 4軸接域底缚膜Wb 且/使覆朗_ ff⑽繼_叫物㈣兩步驟··供 給覆盍層薄膜^至某底镇膊他从、;?^ 、及使…s的貼合區域之覆蓋層_供給步驟 、及使復盍層賴阶貼合於基 口步驟。但若以一個階段(步 驟〇使覆謂_Wc完全貼合於基底薄膜 h /兄此貼合步驟即成甚 為几長,而難以提高整體的生產效率。 31 200533583 因此’於與實施例丨有_覆蓋層薄賴合裝置丨,係以對基底薄膜奶 暫時壓接覆蓋層薄膜Wc形成層合薄膜如,以取代完全貼合覆蓋層薄膜如 於基底薄膜Wb並形成層合薄膜。由而,可大幅縮短上述貼合步驟,謀求整 體生產效率之提高。 於與實施例1有關的覆蓋層薄膜貼合裝置卜為使完全貼合覆蓋層薄膜 WC於基底薄錢,可另行準備供壓接(正式雜)經作 賴接的層合薄膜WS_的以鐘機,·««顯使完全貼純 盍層薄膜Wc於基底薄膜恥。 於上逑覆蓋層薄膜對基底薄膜之暫時壓接方法,進行覆蓋層薄膜此對 基底薄則b之暫時壓接,形成層合_Ws的步概,進行下列兩步驟: 供給層合薄膜Ws至進行輔助暫時壓接的區域,同時供給新的基底薄錢 至暫時壓接區域P2之步驟、及進行暫時壓接工作臺41〇之移動動作,供給 ’、2设现層細Wc至基底薄膜供給通路u上之暫時壓接區域μ的步驟。 此時’由於後者之步雜前者之步驟職的時縣,故藉由_鱗步驟 =間的日命進行_暫時難處理,_特意花f進行_時壓接 :驟的時間即可進行輔助暫時壓接步驟。若採用與實施例i有關的覆蓋層 Π由於具備^構造的辅助㈣壓接装置5〇0,故可縮短 、曰%壓接時間,可進一步提高整體的生產效率。 (實施例2) 採用第9圖說明與實施例2有關的覆蓋層薄膜貼合裝置2 仆矣 年y圖係間 人貝靶例2有關的覆盍層薄膜貼合裝置之平面圖。且,對第g囷與 32 200533583 第2财相嶋件係註加相同的圖號,並省略其詳細說明。 的;靡細|賴舰_2,組細實卿有關 的復盍層潯膜貼合裝置}相同的 關 為據〃 σ仁/、不同點係在於基底薄膜採用非 為捲同狀的潯長方形基底薄膜Wb。 亦即,與實施例2有關的覆蓋屑镇 a/#祕料置2係具杨暫時_區域 2長娜編Wb _ 簡祕繼·、對由基底薄 膜供給I置1200所供給的薄吾方开/装一 — 、基底缚膜Wb暫時壓接薄長方形覆蓋層 讀,形臟觸合_w_物樣繼 «接裝置棚所形成的薄長方形層合薄膜^的層合薄膜回收裝由置曰 =中’暫時壓接裝置400係具有沿連接暫時壓接區域p2及覆蓋層薄 丄、毫Η之覆蓋層薄臈供給通路L2可供給覆蓋層輸c,且可調效 覆盖層薄膜Wc對基底薄臈Wb之位置及姿勢而用的暫時壓接工作臺仙。 太因此,若採用與實施例2有關的覆蓋層薄膜貼合褒置時,由於採用薄長 方形基底薄膜Wb,故不致累稽哇j 轉生絲底賴於長度方向之對位誤差的顧 思’因此基賴齡長財向之餘射度林致降低。 另外,若顧與實關2有_«輯難合裝《,顯實施例丨 有關的覆蓋層薄膜貼合裝置1之情況相同,由於覆蓋層薄膜Wc係藉由可調 整覆盘層薄膜Wc對基底薄膜Wb之位置及姿勢的暫時壓接工作臺削可予 供給至暫時壓接區域P2,故成為可容易提高覆蓋層薄則c對基底薄膜恥 之貼合位置精確度。料,亦成為可容易提高可撓性基板之品質。 如此,與實雌有輯酬_合裝置,於細_筒狀基底 33 200533583 缚膜之薄長方形基底薄膜Wb作為基底薄膜的方面,雖與實施例^關的覆 蓋層薄膜貼合裝置丨之情況不同,但其他方面係具有與實施例丨有關的覆 盖層咖咐㈣嗎造,嶋持物具嫩_丨有關的 覆蓋層薄膜貼合裝置1所有的功效。 另外,至於供沿基底薄膜供給通路L1搬送薄長方形基底薄錢及薄長 挪層合薄膜和而用的搬送手段,可採用吸附塾或移動工作臺等公知的搬 送手段。Auxiliary temporary crimping is carried out to the laminating process. In the scale, the temporary lamination state of the laminated film Ws is confirmed by turning the spoon image sensor 18 in the width direction of the knob holder U (step SQ1 in FIG. 8). Therefore, by driving the substrate_supply device to measure the 'moving support is 140 and the lamination depends on the recycling device ·, the laminar lamination is wound on the winding roller ⑽ (step 2 in Fig. 8). Ws is rolled into a roll shape from the sheet-like curiosity Ws, so that it can be rolled into a roll_ Ws form? To recycle. According to the above steps, the cover layer film Wc can be formed by laminating s temporarily doped on its p. The 4-axis connection field bottom film Wb and / make the cover _ ff ⑽ follow _ called the two-step process ... to supply the cover film ^ to a certain bottom to support him from ;; ^, and make ... s the bonding area The cover layer_supply step, and the step of attaching the complex layer to the base step. However, if the covering step _Wc is fully adhered to the base film in one stage (step 0), this laminating step becomes very long, and it is difficult to improve the overall production efficiency. 31 200533583 Therefore, '于 与 实施 例 丨The _ cover layer thin laminating device 丨 is used to temporarily press the cover film Wc to form a laminate film such as, instead of completely laminating the cover film such as the base film Wb and forming a laminate film. The above-mentioned laminating step can be greatly shortened, and the overall production efficiency can be improved. In the cover film laminating device related to Example 1, in order to completely adhere the cover film WC to the substrate, a separate preparation for pressure bonding can be prepared. (Official miscellaneous) The clock machine is used as the laminated laminated film WS_, and «« shows that the pure laminated film Wc is completely adhered to the base film. The temporary compression bonding method of the cover film on the upper film to the base film To perform a temporary compression bonding of the cover film to the substrate thin layer b to form the lamination_Ws, perform the following two steps: Supply the laminated film Ws to the area where the auxiliary temporary compression bonding is performed, and simultaneously supply a new substrate thin film. Money to temporary The step of crimping the region P2 and the movement of the temporary crimping table 41 ° are performed, and the steps of supplying the fine layer Wc to the temporary crimping region μ on the base film supply path u are provided. The step is mixed with the steps of the former step, so it is difficult to handle temporarily by _scale step = daily destiny, and _ hourly crimping by deliberately f: Temporary crimping time can be used to assist the temporary crimping step. If the cover layer according to the embodiment i is used, since the auxiliary crimping device 500 having a ^ structure is used, the crimping time can be shortened, and the overall production efficiency can be further improved. (Embodiment 2) FIG. 9 is a plan view of the coating film bonding apparatus 2 related to Example 2. FIG. 9 is a plan view of the coating film bonding apparatus related to Example 2 of the human shell target example. 2Finance documents are marked with the same drawing number, and detailed descriptions are omitted. ; 细细 | 赖 舰 _2, the relevant multi-layer film bonding device of the group Shi Shiqing, the same reference is based on 〃 σ The difference is that the base film is made of non-rolled rectangular base The film Wb. That is, the covering chip town a / # secret material set 2 related to Example 2 is provided with Yang temporarily _ area 2 Chang Na series Wb _ simple secret, and for the supply from the base film supply I set 1200 Thin my square open / install one—, the base binding film Wb is temporarily crimped with a thin rectangular cover layer, and the shape is dirty. _W_ 物 样 Follow «thick rectangular laminated film formed by the device shed ^ laminated film recovery The installation press means "middle" temporary crimping device 400 has a coating layer L2 along the connection between the temporary crimping area p2 and the coating layer, and the coating layer L2 can supply the coating layer c, and the adjustable coating layer can be adjusted. The temporary pressing of the table Wc to the position and posture of the base sheet Wb. Too much, therefore, if the cover sheet film according to Example 2 is used for lamination, the thin rectangular base film Wb is used, so Gu Si, which does not cause tiredness, depends on the alignment error in the length direction. Therefore, the residual degree of Ji Lai Ling's long wealth is reduced. In addition, if there is _ «Editing Difficult to Install" with Practice 2, the situation of the cover film bonding device 1 related to the embodiment 丨 is the same, because the cover film Wc is adjusted by the adjustable cover film Wc. The temporary crimping table cutting of the position and posture of the base film Wb can be supplied to the temporary crimping region P2, so that it is possible to easily improve the accuracy of the laminating position of the cover film c to the base film. Material, which also can easily improve the quality of the flexible substrate. In this way, there is a pay-combining device with a real female, in terms of a thin-tubular substrate 33 200533583 thin rectangular base film Wb as a base film, although the cover film bonding device related to the embodiment ^ It is different, but in other respects, it has all the effects of the covering layer film bonding device 1 related to the embodiment 丨 and the holding object is tender. In addition, as for the conveying means for conveying the thin rectangular substrate and the thin and long laminated film along the base film supply path L1, well-known conveying means such as a suction pad or a moving table can be used.

【圖式簡單說明】 幻圖係表示與實施例1有關的覆蓋層薄膜貼合裝置之平面圖。 =2圖係簡化表示與實施例1有_覆朗_貼合裝置之平面圖。 第3圖係絲與實施例1有_覆蓋層薄親合裝置之正視圖。 第4圖係供說明暫時壓接裝置而用的主要部分放大圖。 第5圖係表示供說明暫時壓接裝置及覆蓋層薄膜裁切•載置裝置而用的 側視圖。 • 第6圖絲示覆蓋層薄膜裁切•«裝置的後視圖。 第7圖係表示覆蓋層薄膜裁切·載置裝置的側面圖。 第8圖係表示供說明覆蓋層薄膜對基底薄膜的暫時壓接方法而用的流 程圖。 D圖係簡化絲與實施例2有關的紐層_貼合裝置之平面圖 第10圖係表7F習關覆蓋層薄膜貼合裝置之正視圖。 【主要元件符號說明】 34 200533583 裝置主體 控制器箱 ❿ 、130固定挾持器 移動挾持器 輥輪支持台 輥輪支持台 輥輪支座 輥輪支座 發光元件 攝像元件 基底薄膜供給裝置 輸送輥輪 轉矩電動機 引導輥輪 拉伸裝置 昇降輥輪 輥輪軸 昇降導執 層合薄膜回收裝置 捲取概輪 轉矩電動機 35[Brief Description of the Drawings] The magic drawing is a plan view showing the cover film bonding apparatus according to the first embodiment. = 2 The figure is a simplified plan view showing the _overlapping_fitting device with Example 1. Fig. 3 is a front view of the thin-layer and thin-layer affinity device with the first embodiment. Fig. 4 is an enlarged view of a main part for explaining a temporary crimping device. Fig. 5 is a side view for explaining the temporary crimping device and the cover film cutting and placing device. • Figure 6 shows the cutting of the cover film. «Rear view of the device. Fig. 7 is a side view showing a cover film cutting and placing device. Fig. 8 is a flowchart for explaining a method of temporarily crimping the cover film to the base film. Figure D is a plan view of the button-bonding device related to the embodiment 2 of the simplified wire. Figure 10 is a front view of the cover film bonding device of Table 7F. [Description of main component symbols] 34 200533583 Device main controller box 、, 130 fixed holder mobile holder roller support table roller support table roller support roller support light-emitting element camera element base film supply device conveyor roller rotation Torque motor guide roller stretching device lifting roller roller shaft lifting guide laminated film recovery device take-up approximate wheel torque motor 35

200533583 447移動元件 448樞軸 449 工作臺座 450第4移動裝置 452伺服電動機 454 螺旋軸 456第4工作臺 458 導軌 460覆蓋層薄膜載置部 462傾斜部 464輥輪 466彈簧 470攝像元件 470a攝像用孔 480 緩衝機構 490壓緊機構 500輔助暫時壓接裝置 600覆蓋層薄膜裁切•供給裝置 610 覆蓋層薄膜輸送裝置 612輸送輥輪 614轉矩電動機 37 200533583 616 驅動報輪 620引導輥輪 622昇降辕輪 624引出輥輪 626移動挾持器 630覆蓋層薄膜裁切裝置 632壓切刀金屬模 p 634金屬模座 640受刀板片輸送裝置 642受刀板片捲取裝置 650覆蓋層薄膜載置裝置 652移動挾持器 654吸附塾 660脫模薄膜夾持裝置 9 670脫模薄膜剝離刀 800 習用的覆蓋層薄膜貼合裝置 801A基底薄膜輸送輥輪 801B層合薄膜捲取輥輪 802A覆蓋層薄膜輸送輥輪 803A、804A脫模薄膜輸送輥輪 803B、804B脫模薄膜捲取輥輪 38200533583 447 Moving element 448 Pivot 449 Workbench 450 Fourth moving device 452 Servo motor 454 Helical shaft 456 4th working table 458 Guide rail 460 Covering film mounting portion 462 Inclined portion 464 Roller 466 Spring 470 Camera element 470a Camera Hole 480 Cushioning mechanism 490 Pressing mechanism 500 Auxiliary temporary crimping device 600 Cover film cutting / feeding device 610 Cover film conveying device 612 Conveying roller 614 Torque motor 37 200533583 616 Driving wheel 620 Guide roller 622 Lifting 辕Wheel 624 lead out roller 626 mobile gripper 630 cover film cutting device 632 press knife metal mold p 634 metal mold holder 640 receiving blade sheet conveying device 642 receiving blade sheet winding device 650 cover film placing device 652 Mobile holder 654 adsorption 660 660 release film holding device 9 670 release film peeling knife 800 conventional cover film bonding device 801A base film conveying roller 801B laminated film take-up roller 802A cover film conveying roller 803A, 804A release film conveying roller 803B, 804B release film take-up roller 38

200533583 805,807 輥輪 806熱壓機 1200基底薄膜供給裝置 1300層合薄膜回收裝置 L1 基底薄膜供給通路 L2 覆蓋層薄膜供給通路 L3覆蓋層薄膜搬送通路 P1覆蓋層薄膜供給位置 P2暫時壓接區域 P3覆蓋層薄膜收付位置 Wb捲筒狀基底薄膜 WcO捲筒狀覆蓋層薄膜 Wc覆蓋層薄膜 Ws板片狀層合薄膜 W11基底薄膜 W12覆蓋層薄膜 W13、W14脫模薄膜 W15層合薄膜 39200533583 805,807 Roller 806 Hot press 1200 Base film supply device 1300 Laminated film recovery device L1 Base film supply path L2 Cover film supply path L3 Cover film conveyance path P1 Cover film supply position P2 Temporary pressure contact area P3 Cover film receiving position Wb Roll-shaped base film WcO Roll-shaped cover film Wc Cover film Ws Sheet lamination film W11 Base film W12 Cover film W13, W14 Release film W15 Laminate film 39

Claims (1)

200533583 十、申請專利範圍: ι_ 一種覆蓋層薄膜貼合裝置,其特徵在於具有 由供使捲筒狀基底薄膜展成板片狀、並間歇送出而用的基底薄膜供終 裝置, -、m /對由+此基底薄膜I、給以置級予送出的板片狀基底薄膜暫時屢接薄長方 形的覆蓋層_、供形成覆蓋層佩針暫時_於基底薄膜上之板片狀 層合薄膜而用的暫時壓接裝置, 人”供捲取滅暫時m接裝置所形成的㈣狀層合細成捲筒狀而用的層 a潯膜回收i置而成之覆蓋層薄膜貼合裝置, :’且可調整覆蓋層薄膜相對於基底薄膜之位置及姿^的暫時 (以置可沿連接暫日核接覆蓋層薄膜於基底薄膜上的區域 (以下二==域”)與朝前述暫時壓接區域供給基底薄膜的位置 簿膜,日二^=,供給位置”)的覆蓋層薄膜供給通路供給覆蓋層 ㈣1撕觸錢層_貼妓置,射__薄 驗給通路係以對連接前述基 4復里層厚 基底薄臈供給通路成垂直相交-#嵐…衣置及4層合_回«置的 丄一種覆蓋層薄膜貼合裝置,其特徵在於且有 接區域供給薄長方形基底薄膜而用的基底薄膜供,置 方形覆供給裝胁予供給_長方職底_料壓接薄長 方开ς盍層_麵成薄長方形層合薄職 U接屬長 之層合薄膜 :cr=;r_,合 * 二 薄膜供給 薄膜之位置及錢轉_二‘ y、’且可對基底薄膜調整覆蓋層 :,置:===:,_域及覆蓋層 200533583 i★二ΐί:範圍第1項至第3項之任一項所述的覆蓋層薄膜貼合裝置, &quot;中刖述曰時壓接工作臺係可於相互垂直相交的2個水平方向上移動,且 可於以水平面内的假想點為旋轉中心之圓周方向上進行轉動。夕 請專利範圍第4項所述的覆蓋層薄賴合|置,其巾前述暫時壓接 之2個相互_配置__孔’對應於此等各攝像用孔 =^_像元件暫時壓衫作臺上,至少設有2個相互隔離配置的攝 像用孔’與上述各攝像用孔對應地設有攝像元件。 圍第1項至第3項之任—項所述的覆蓋層_貼合裝置, 動^迷日&amp;壓接工作臺係於前述暫日樣接區域的上方軸進行暫時壓接 專利第6項所述的覆蓋層薄舰合裝置,其中前述暫時壓接 :有二作臺於前述暫時壓接區域進行暫時壓接動作時,再 /、有承文則述暫時壓接工作臺之緩衝機構。 利=第7項所述的覆蓋層薄膜貼合裝置,其中前述緩衝機構 糸0又有供吸附基底薄膜而用的多個基底薄膜吸附孔。 ΐϊΓϊίΓ圍第8項所述的覆蓋層薄膜貼合裝置,其中前述暫時壓接 構置係再具有於進行暫時壓接動作之前對前述緩衝機構可予壓緊的壓緊機 =中如前申娜1㈣3項之任—項所述的覆綱賴合裝置, η返日¥麵工作堂係、具有供加熱覆蓋層薄膜的而用加熱器。 ,係0觀t專利範圍第1項至第3項之任—項所述的覆蓋層薄膜貼合裝置 由此覆蓋層㈣送裝置送 裁層,而用的覆蓋層薄膜裁切裝置、與供載置由此覆蓋層‘ 蓋声薄膜的溥長方形覆蓋層薄膜於前述暫時壓接工作臺上而用的覆 曰溥Μ载置I置而成之覆蓋層薄膜裁切·載置裝置。 I ί膜如舞申Λ專利範圍第11項所述的覆蓋層薄膜貼合裝置’其中前述覆蓋展 、刀衣置係具有供裁切板片狀覆蓋層薄膜成薄長方形而用的壓切^ 41 200533583 有將承受上述壓切刀之受刀《卽 之_細職_、娜受刀板㈣咖 α如申請補顧第丨項至第3項之任 ;=?作臺上係設有供吸附薄長方形覆細=二 H請專纖圍㈣·^_歸_齡裝置 ==載置裝置係再具有夹持經予吸附於上述多個覆綱 _ 、復盍層潯臊之脫椟薄膜的端部之脫模薄臈夹持妒置, 旻皿智厚膜I、給位置使河述暫時壓接 動,由前述覆蓋層薄膜剝離脫模接作$向别述暫時壓接區域移 薄膜載置s===相覆蓋層薄膜貼合裝置,其中前述覆蓋層 膜至前述暫日«接〜,膜裁切裝置經予裁切的覆蓋層 作臺上載置覆蓋層薄膜,至由上述暫義接工 為止的時間内,吸附著前述部分剝2賴文縣置夹持脫模薄膜之端部 17.如申清專利範圍第1 係再具有好配辦基賴^薄賴合裝置, 薄膜回收裝置側,供胸内的_樣接裝置之前述層合 _予暫_=======«暫時_ 18.如申請專利範圍第〗 :s物而用的辅助暫時祕裝置。 給通路崎卿細繼_,細底薄膜供 有2個相互隔離的攝像元件。 日口賴回收裝置之間至少配設 42 200533583 19.如申請專利範圍第17項所述的覆蓋層薄膜貼合裝置,係再具有供使前 述基底薄膜供給裝置及前述層合薄膜回收裝置、前述暫時壓接裝置與前述 輔助暫時壓接裝置同步動作而用的控制器。200533583 10. Scope of patent application: ι_ A cover film bonding device, which is characterized by having a base film supply and final device for rolling a roll-shaped base film into a sheet shape and sending out intermittently,-, m / For the sheet-shaped base film sent by + this base film I, and given a grade, the thin rectangular cover layer is temporarily repeatedly connected, and the sheet-shaped laminated film on the base film is temporarily formed for forming the cover needle. The temporary crimping device used by the person "is a cover film bonding device formed by winding and destroying the ㈣-like layer formed by the temporary m-joining device into a roll shape, and the layer a, film recovery, and placement are used: 'And the position and posture of the cover film relative to the base film can be adjusted (to set the area where the cover film is connected to the base film along the connection temporary core (the following two == domains)) and the temporary pressure The location of the base film supply film in the connection area, the second layer ^ =, the supply position ") of the cover film supply path supply cover ㈣1 tear the money layer _ paste prostitute, shoot _ _ thin inspection path to connect the aforementioned Base 4 compound layer The passages intersect perpendicularly-# 兰 ... 衣 置 和 4 层 _ 回 «placed a cover film bonding device, which is characterized by a base film for the supply of a thin rectangular base film in the connection area, a square cover Supply equipment threats to supply_ 长方 职 底 _Material crimping thin rectangular opening layer_face into a thin rectangular layer laminated thin film U connected long laminated film: cr =; r_ , 合 * Two film supply film Position and money transfer _ 2 'y,' and can adjust the cover layer on the base film :, set: === :, _ domain and cover layer 200533583 i ★ 二 ΐί: any one of the range 1 to 3 The cover film bonding device according to the item, "The time-press crimping table can be moved in two horizontal directions that intersect perpendicularly with each other, and can be circled on the imaginary point in the horizontal plane as the center of rotation." Rotate in the direction. The covering layer described in item 4 of the patent is thinly placed, and the two temporary _ configuration __ holes' of the aforementioned temporary crimping correspond to these camera holes = ^ _ The image element is temporarily pressed on the workbench, and at least two imaging holes are arranged at a distance from each other. A camera element is provided correspondingly to the image hole. The covering layer _ laminating device described in any one of the first to the third items, and the moving &amp; crimping table is in the aforementioned temporary sample area. The upper shaft performs temporary crimping of the thin-layer coating device according to item 6 of the patent, wherein the foregoing temporary crimping: when there are two working tables for temporary crimping operation in the foregoing temporary crimping area, and / or there is a text The buffer mechanism of the temporary crimping table is described above. The benefit = the cover film bonding device according to item 7, wherein the buffer mechanism 糸 0 has a plurality of base film adsorption holes for adsorbing the base film. Ϊ́ϊΓϊίΓ 围 第The cover film bonding device according to item 8, wherein the temporary crimping structure further has a pressing machine that can compress the buffer mechanism before performing the temporary crimping operation = Zhongru Shenna 1 to 3 The overlaying device described in any of the items is a heater for the noodles and noodles workshop, which has a film for heating the cover layer. It is the cover film bonding device described in any of items 1 to 3 of the patent scope of 0 view. The cover film feeding device sends the cutting layer from the cover feed device, and the cover film cutting device and A cover film cutting and placing device in which a rectangular cover film of this cover layer and a sound cover film is placed on the above-mentioned temporary pressure-bonding table and placed on the cover. I The film is the cover film bonding device according to item 11 of the Maishin Λ patent scope, wherein the cover and knife are provided with a press-cut for cutting a sheet-like cover film into a thin rectangle ^ 41 200533583 There are recipients who will withstand the above-mentioned cutting knife `` 卽 之 _ Fine Duty__, Na Receiver's Board ㈣ coffee α If you apply to make up for any of the items from item 丨 to item 3; =? Adsorption thin rectangular thin coating = two H, please special fiber encirclement ^ _ return_ age device = = the mounting device has a desorption film that is held by a plurality of overlays _ and complex layer 夹持The release film at the end of the clamp is jealous. The plate is thick and I. The position is temporarily pressed, and the cover film is peeled and released to move the film to the other temporary pressure bonding area. Place the s === phase cover layer film bonding device, where the cover layer film is connected to the aforementioned temporary date, and the film cutting device mounts the cover layer film on the pre-cut cover layer as a table. During the period up to the time of righteous employment, the above part was peeled off. 2 Laiwen County set the end of the clamping release film. The system has a well-equipped base device, a thin film recovery device, and a thin film recovery device side for the aforementioned layering of the _ sample connection device in the chest _ 予 tent _ ======= «temporary_18. Scope: The auxiliary temporary secret device for s objects. To Kazaki Kazumi, the thin-bottom film is provided with two camera elements isolated from each other. At least 42 200533583 is provided between the Japanese recycling facilities. 19. The cover film bonding device according to item 17 of the scope of application for a patent, further comprising a base film supply device, a laminated film recovery device, A controller for the temporary crimping device to operate in synchronization with the auxiliary temporary crimping device. 4343
TW094111608A 2004-04-13 2005-04-13 A cover lay film lamination device TWI308901B (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
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TWI578869B (en) * 2012-07-30 2017-04-11 芝浦機械電子裝置股份有限公司 Substrate bonding apparatus and substrate bonding method
TWI737376B (en) * 2019-07-01 2021-08-21 日商倍科有限公司 Pasting device and pasting method

Also Published As

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CN1910100A (en) 2007-02-07
WO2005100220A1 (en) 2005-10-27
KR20060032213A (en) 2006-04-14
JP4097679B2 (en) 2008-06-11
JPWO2005100220A1 (en) 2007-08-16
TWI308901B (en) 2009-04-21
KR100853342B1 (en) 2008-08-21
CN1910100B (en) 2010-04-14

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