CN114258207B - Method for manufacturing cover film, cover film and bonding method thereof - Google Patents
Method for manufacturing cover film, cover film and bonding method thereof Download PDFInfo
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- CN114258207B CN114258207B CN202111399257.5A CN202111399257A CN114258207B CN 114258207 B CN114258207 B CN 114258207B CN 202111399257 A CN202111399257 A CN 202111399257A CN 114258207 B CN114258207 B CN 114258207B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
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Abstract
The application relates to the technical field of printed circuit boards, and provides a cover film manufacturing method, a cover film and a laminating method thereof. The manufacturing method of the cover film comprises the following steps: providing a base film, wherein the base film comprises a first film layer, a bonding layer and a second film layer which are sequentially laminated; and cutting a separation boundary on one surface of the first film layer far away from the bonding layer, wherein the depth of the separation boundary is larger than or equal to the sum of the thicknesses of the first film layer and the bonding layer and smaller than the sum of the thicknesses of the first film layer, the bonding layer and the second film layer, and the separation boundary separates one surface of the first film layer far away from the bonding layer into a first area and a second area. The method for manufacturing the cover film can manufacture the cover film with any shape, does not need to cut the cover film during bonding, saves time and labor, and reduces the production cost.
Description
Technical Field
The application relates to the technical field of printed circuit boards, in particular to a cover film manufacturing method, a cover film and a laminating method thereof.
Background
The rigid-flex circuit board generally comprises a hard board and a soft board, and in the manufacturing process, the soft board on the flex area of the finished product of the rigid-flex circuit board needs to be adhered with a covering film so as to protect the circuit from oxidation, and the flexible performance of the soft board can be improved while the circuit is used as an insulating layer.
At present, the common method for attaching the cover film on the flexible board mainly comprises machine attachment, wherein the machine needs to cut the cover film into preset sizes in advance when attaching the cover film, and the cut cover film is manufactured into a roll form, so that the machine can automatically grasp and attach the cover film to the appointed position on the flexible board conveniently. This method requires that the conformable cover film be of a regular shape and relatively small size.
Disclosure of Invention
The application provides a method for manufacturing a cover film, the cover film and a bonding method thereof, which can bond the cover film with irregular shape and relatively larger size.
An embodiment of a first aspect of the present application provides a method for manufacturing a cover film, including:
providing a base film, wherein the base film comprises a first film layer, a bonding layer and a second film layer which are sequentially laminated;
and cutting a separation boundary on one surface of the first film layer far away from the bonding layer, wherein the depth of the separation boundary is larger than or equal to the sum of the thicknesses of the first film layer and the bonding layer and smaller than the sum of the thicknesses of the first film layer, the bonding layer and the second film layer, and the separation boundary separates one surface of the first film layer far away from the bonding layer into a first area and a second area.
In some of these embodiments, when a separation boundary is cut on a side of the first film layer remote from the adhesive layer, the distance between the bottom of the separation boundary and the adhesive layer is 1/5-2/5 of the thickness of the second film layer.
An embodiment of the second aspect of the present application provides a cover film manufactured by the cover film manufacturing method according to the first aspect.
An embodiment of the third aspect of the present application provides a covering film attaching method, including:
providing a cover film, wherein the cover film is manufactured by the cover film manufacturing method according to the first aspect;
providing a soft board, wherein at least one surface of the soft board is provided with a circuit area;
peeling the second film layer, the adhesive layer in the second region, and the first film layer in the second region;
and attaching the soft board to the covering film, wherein the circuit area is attached to the adhesive layer positioned in the first area.
In some of these embodiments, the first film layer located inside the first region is secured prior to peeling the second film layer and the adhesive layer in the second region, the first film layer in the second region.
In some of these embodiments, the securing the first film layer inside the first region includes:
providing a jig plate, wherein the jig plate is provided with a first surface and a second surface which are oppositely arranged, a plurality of adsorption holes are formed in the jig plate, the adsorption holes penetrate through the first surface and the second surface, and one end, far away from the first surface, of each adsorption hole is communicated with a vacuumizing device;
attaching the first film layer to the first surface, wherein the first film layer positioned in the first area is attached to one end of the adsorption hole away from the second surface;
and starting the vacuumizing device to adsorb and fix the first film layer positioned in the first area.
In some of these embodiments, the walls of the adsorption holes are from 0.5mm to 1.0mm from the separation boundary.
In some embodiments, the pore size of the adsorption holes is 0.5mm-1.0mm, and the distance between two adjacent adsorption holes is 3mm-5mm.
In some embodiments, a first positioning hole is machined in the flexible board and a second positioning hole is machined in the cover film before the flexible board is attached to the cover film; the jig plate is provided with a third positioning hole; when the first film layer is attached to the first surface, the cover film and the jig plate are positioned through positioning pins penetrating through the first positioning holes and the third positioning holes; when the soft board is attached to the covering film, the positioning pins penetrate into the second positioning holes so as to position the soft board and the jig board.
In some embodiments, after the soft board is attached to the cover film, the soft board is heated first, and then the vacuumizing device is turned off.
The method for manufacturing the cover film provided by the embodiment of the application has the beneficial effects that: through cut out the separation boundary that separates into first region and second region with the one side that the tie coat was kept away from to first rete on the one side that the tie coat was kept away from to first rete, can make the covering film of arbitrary shape, and the degree of depth that separates the boundary is greater than or equal to the sum of thickness of first rete and tie coat and is less than the sum of thickness of first rete, tie coat and second rete, only need peel off first rete in tie coat in second rete and the second region, the second region during the use, again with the laminating of soft board on the covering film can, also need not to tailor the covering film again during the laminating, labour saving and time saving has reduced manufacturing cost.
The cover film of this embodiment, because set up the separation boundary that separates into first region and second region with the one side that the tie coat was kept away from to first rete on the one side that the tie coat was kept away from to first rete, and the degree of depth that separates the boundary is greater than or equal to the sum of the thickness of first rete and tie coat and is less than the sum of thickness of first rete, tie coat and second rete, so only need peel off first rete in tie coat in second rete and the second region, the second region when using, again with the soft board laminating on the cover film can, need not tailor the cover film again, cover film shape and size select more, laminating process labour saving and time saving has reduced manufacturing cost.
According to the laminating method of the covering film, when laminating, the second film layer and the bonding layer in the second area are peeled off firstly, and the first film layer in the second area can directly laminate the soft board on the covering film, so that the covering film with any shape and size can be laminated rapidly, one-time laminating of the covering film with multiple areas is realized, the production cost is lower, the laminating efficiency of laminating the covering film in the soft board area of the rigid-flex printed circuit board can be improved, and meanwhile, the hidden danger of residual risk of the covering film is avoided.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a flow chart of a method of making a cover film in one embodiment of the application;
FIG. 2 is a bottom view of the base film of FIG. 1;
FIG. 3 is a cross-sectional view of the base film of FIG. 2 taken along the direction D-D;
FIG. 4 is a bottom view of the cover film of FIG. 1;
FIG. 5 is a cross-sectional view of the cover film of FIG. 4 taken along the E-E direction;
FIG. 6 is a bottom view of the flexible board in one embodiment of the application;
FIG. 7 is a schematic view showing the connection of the cover film of FIG. 5 to the flexible board of FIG. 6;
FIG. 8 is a bottom view of a jig plate according to one embodiment of the application;
FIG. 9 is a schematic diagram illustrating the connection of the cover film of FIG. 5 to the jig plate of FIG. 8;
FIG. 10 is a schematic diagram showing the connection between the cover film of FIG. 5 and the jig plate of FIG. 8 after peeling off the second film layer, the adhesive layer in the second region, and the first film layer in the second region;
FIG. 11 is a top view of FIG. 10;
FIG. 12 is a schematic diagram of the connection between the cover film of FIG. 10, the jig plate of FIG. 10 and the flexible board of FIG. 6;
FIG. 13 is a schematic view showing the connection of the cover film to the flexible board in one embodiment of the application;
FIG. 14 is a schematic diagram illustrating the connection of a jig plate to a table according to one embodiment of the present application;
fig. 15 is a top view of the table of fig. 14.
The meaning of the labels in the figures is:
10. a base film; 11. a first film layer; 12. a bonding layer; 13. a second film layer; 14. a separation boundary; 15. a first region; 16. a second region; 17. a first positioning hole; 18. a first positioning protrusion; 19. a second positioning protrusion; 20. a flexible board; 21. a line area; 22. a second positioning hole; 23. a first positioning line; 231. a first positioning notch; 24. a second positioning line; 241. a second positioning notch; 30. a jig plate; 31. a first face; 32. a second face; 33. adsorption holes; 34. a third positioning hole; 35. a countersunk hole; 40. a positioning pin; 50. a work table; 51. a receiving groove; 52. a connection hole; 53. and (3) a threaded hole.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application will be further described in detail below with reference to the accompanying drawings, i.e., embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the application.
It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In order to describe the technical scheme of the application, the following description is made with reference to specific drawings and embodiments.
Referring to fig. 1 to 5, an embodiment of a first aspect of the present application provides a method for manufacturing a cover film, including:
s10: a base film 10 is provided, the base film 10 comprising a first film layer 11, an adhesive layer 12 and a second film layer 13 laminated in this order.
Specifically, the sides of the adhesive layer 12 contacting the first film layer 11 and the second film layer 13 have a certain viscosity, so that the adhesive layer 12 adheres to the first film layer 11 and the adhesive layer 12 adheres to the second film layer 13.
It will be appreciated that both the first film layer 11 and the second film layer 13 may be peeled from the adhesive layer 12.
S20: a separation boundary 14 is cut on the side of the first film layer 11 away from the adhesive layer 12, the depth of the separation boundary 14 being greater than or equal to the sum of the thicknesses of the first film layer 11 and the adhesive layer 12 and less than the sum of the thicknesses of the first film layer 11, the adhesive layer 12 and the second film layer 13, the separation boundary 14 separating the side of the first film layer 11 away from the adhesive layer 12 into a first region 15 and a second region 16.
In particular, the separation boundary 14 may be a slit left after cutting on the side of the first film layer 11 away from the adhesive layer 12, and the bottom of the separation boundary 14 extends to the second film layer 13 but does not penetrate the second film layer 13.
It will be appreciated that the first region 15 is a closed region on the side of the first film layer 11 remote from the adhesive layer 12, the boundary of this closed region being the separating boundary 14, and the remaining regions other than this closed region being the second region 16. Alternatively, the first region 15 is a plurality of closed regions that are not connected to each other on a side of the first film layer 11 away from the adhesive layer 12, the boundaries of these closed regions are all partition boundaries 14, and the remaining regions other than these closed regions are second regions 16. The first region 15 is shown in fig. 4 as three closed regions which are not connected to each other on the side of the first film layer 11 away from the adhesive layer 12, and the remaining regions except for the three closed regions are the second region 16.
The separation boundary 14 may be regular or irregular, as in the figures the separation boundary 14 is rectangular.
According to the method for manufacturing the covering film, provided by the embodiment of the application, the separation boundary 14 for separating the surface of the first film layer 11, which is far away from the bonding layer 12, into the first area 15 and the second area 16 is cut on the surface of the first film layer 11, which is far away from the bonding layer 12, so that the covering film with any shape can be manufactured, the depth of the separation boundary 14 is larger than or equal to the sum of the thicknesses of the first film layer 11 and the bonding layer 12 and is smaller than the sum of the thicknesses of the first film layer 11, the bonding layer 12 and the second film layer 13, and the first film layer 11 in the bonding layer 12 and the second area 16 in use, and the soft board 20 is attached to the covering film without cutting the covering film, so that the time and the labor are saved, and the production cost is reduced.
In an embodiment, the first film layer 11 is a PI (Polyimide) layer, the bonding layer 12 is an AD glue (Acrylic Hot Melt Gclhesive, acrylic hot melt) layer, and the second film layer 13 is a release paper layer.
It will be appreciated that the specific materials of the first film layer 11, the adhesive layer 12 and the second film layer 13 may be other similar materials.
In some of these embodiments, when the separation boundary 14 is cut on the side of the first film layer 11 remote from the adhesive layer 12, the distance between the bottom of the separation boundary 14 and the adhesive layer 12 is 1/5-2/5 of the thickness of the second film layer 13.
By adopting the scheme, the cutting precision is conveniently controlled, the bonding layer 12 is ensured to be completely cut through, the excessive second film layer 13 can be avoided from being cut, the integrity of the second film layer 13 is ensured, and the bonding layer 12 in the second area 16 and the first film layer 11 in the second area 16 can be completely peeled along with the second film layer 13.
For example, when the thickness of the second film layer 13 is 5mm, the distance between the bottom of the partition boundary 14 and the adhesive layer 12 is 1mm, 1.2mm, 1.4mm, 1.6mm, 1.8mm, 2.0mm, or the like.
Referring to fig. 2 to 5, a cover film according to a second aspect of the present application is manufactured by the method of manufacturing a cover film according to the first aspect.
In the present embodiment, the cover film includes a base film 10, and the base film 10 includes a first film layer 11, an adhesive layer 12, and a second film layer 13 laminated in this order; the first film layer 11 is provided with a separation boundary 14 on a side away from the adhesive layer 12, the depth of the separation boundary 14 being greater than or equal to the sum of the thicknesses of the first film layer 11 and the adhesive layer 12 and less than the sum of the thicknesses of the first film layer 11, the adhesive layer 12 and the second film layer 13, and the separation boundary 14 separating the side of the first film layer 11 away from the adhesive layer 12 into a first region 15 and a second region 16.
In the cover film of this embodiment, since the side of the first film layer 11 away from the adhesive layer 12 is provided with the separation boundary 14 separating the side of the first film layer 11 away from the adhesive layer 12 into the first area 15 and the second area 16, and the depth of the separation boundary 14 is greater than or equal to the sum of the thicknesses of the first film layer 11 and the adhesive layer 12 and is smaller than the sum of the thicknesses of the first film layer 11, the adhesive layer 12 and the second film layer 13, when in use, only the second film layer 13, the adhesive layer 12 in the second area 16 and the first film layer 11 in the second area 16 need to be peeled off, and then the soft board 20 needs to be attached to the cover film, without cutting the cover film, the shape and the size of the cover film are more, the attaching process is time-saving and labor-saving, and the production cost is reduced.
Referring to fig. 1 to 7, an embodiment of a third aspect of the present application provides a covering film attaching method, which includes the following steps:
first, a cover film is provided, and the cover film is manufactured by the cover film manufacturing method according to the first aspect.
Specifically, the cover film includes a base film 10, and the base film 10 includes a first film layer 11, an adhesive layer 12, and a second film layer 13 laminated in this order; the first film layer 11 is provided with a separation boundary 14 on a side away from the adhesive layer 12, the depth of the separation boundary 14 being greater than or equal to the sum of the thicknesses of the first film layer 11 and the adhesive layer 12 and less than the sum of the thicknesses of the first film layer 11, the adhesive layer 12 and the second film layer 13, and the separation boundary 14 separating the side of the first film layer 11 away from the adhesive layer 12 into a first region 15 and a second region 16.
Next, a flexible board 20 is provided, and a circuit area 21 is disposed on at least one surface of the flexible board 20.
Specifically, the flexible board 20 may be manufactured by cutting, drilling, line manufacturing, AOI, browning, and the like, and the line area 21 needs to be covered with a cover film.
Then, the second film layer 13, the adhesive layer 12 in the second region 16, and the first film layer 11 in the second region 16 are peeled off.
Specifically, when the second film layer 13 is peeled off, the second film layer 13 will take away the adhesive layer 12 in the second region 16 and the first film layer 11 in the second region 16 together, so that the second film layer 13, the adhesive layer 12 in the second region 16 and the first film layer 11 in the second region 16 are peeled off together, and only the adhesive layer 12 in the first region 15 and the first film layer 11 in the first region 15 remain.
Alternatively, a hand or a manipulator may be used to hold one end of the second film layer 13 and move the second film layer 13 toward the other end of the second film layer 13 to peel the second film layer 13.
Finally, the flexible board 20 is attached to the cover film, and the wiring region 21 is attached to the adhesive layer 12 located in the first region 15.
Specifically, the flexible sheet 20 may be directly attached to the cover film such that the circuit region 21 is attached to the adhesive layer 12 located in the first region 15.
According to the laminating method of the covering film, when laminating, the second film layer 13, the adhesive layer 12 in the second area 16 and the first film layer 11 in the second area 16 are peeled off, so that the soft board 20 can be directly laminated on the covering film, the covering film with any shape and size can be quickly laminated, one-time laminating of the covering film with multiple areas is realized, the production cost is low, the laminating efficiency of laminating the covering film in the soft board 20 area of the rigid-flex printed circuit board can be improved, and meanwhile, the hidden danger of residual risk of the covering film is avoided.
Optionally, after the circuit area 21 on at least one surface of the flexible board 20 is attached to the cover film, the post-process manufacturing is completed according to the conventional manufacturing process of the rigid-flex printed circuit board.
In some of these embodiments, the first film layer 11 located inside the first region 15 is secured, such as by a human hand or machine, prior to peeling the second film layer 13 and the adhesive layer 12 in the second region 16, the first film layer 11 in the second region 16, etc.
By adopting the above-described configuration, when peeling the second film layer 13, the adhesive layer 12 in the second region 16, and the first film layer 11 in the second region 16 are peeled together, and it is ensured that only the adhesive layer 12 in the first region 15 and the first film layer 11 in the first region 15 remain at this time.
Referring to fig. 8 and 12, in some embodiments, the fixing the first film layer 11 located inside the first area 15 includes the following steps:
firstly, a jig plate 30 is provided, the jig plate 30 has a first surface 31 and a second surface 32 which are oppositely arranged, a plurality of adsorption holes 33 are arranged on the jig plate 30, the adsorption holes 33 penetrate through the first surface 31 and the second surface 32, and one end of the adsorption holes 33 far away from the first surface 31 is communicated with a vacuumizing device.
Specifically, the suction holes 33 correspond to the first regions 15, that is, when there are a plurality of the first regions 15, the suction holes 33 may be provided in plural groups, each group of suction holes 33 corresponds to each first region 15, and each group of suction holes 33 includes a plurality of suction holes 33.
Alternatively, the jig board 30 may be an FR4 optical board (epoxy material) or an acrylic board, and the thickness is generally 1.5-2.0mm, such as 1.5mm, 1.6mm, 1.7mm, 1.8mm, 1.9mm, or 2.0mm.
Next, the first film 11 is bonded to the first surface 31, and the first film 11 located in the first region 15 is bonded to one end of the adsorption hole 33 away from the second surface 32.
Specifically, after the first film 11 is attached to the first surface 31, the first film 11 located in the first area 15 seals the end of the adsorption hole 33 away from the second surface 32, so that subsequent adsorption is facilitated.
Finally, the vacuumizing device is started to adsorb and fix the first film layer 11 positioned in the first area 15.
By adopting the scheme, the first film 11 in the first area 15 can be effectively fixed, and the first film 11 in the first area 15 cannot be damaged.
In some embodiments, in order to avoid the first film layer 11 located inside the first area 15 from being sealed by the first film layer 11 and causing air leakage when the vacuum pumping device is started to adsorb and fix, and simultaneously avoid the first film layer 11 near the separation boundary 14 from being adsorbed by the first film layer 11 and causing wrinkles of the first film layer 11, the hole wall of the adsorption hole 33 is 0.5mm-1.0mm, such as 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm or 1.0mm from the separation boundary 14.
In some of these embodiments, in order to avoid that when the suction holes 33 suction the first film layer 11 located inside the first area 15, a hole mark is left on the first film layer 11 located inside the first area 15, which is impossible to remove later, and affects the appearance of the finished product, while ensuring a good vacuum suction effect, the size of the holes 33 is 0.5mm-1.0mm, such as 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm or 1.0mm, and the distance between two adjacent suction holes 33 is 3mm-5mm, such as 3.0mm, 3.5mm, 4.0mm, 4.5mm or 5.0mm, and the like.
In some of these embodiments, the first positioning holes 17 are machined in the flexible board 20 and the second positioning holes 22 are machined in the cover film before the flexible board 20 is attached to the cover film.
The jig plate 30 is provided with a third positioning hole 34.
When the first film 11 is attached to the first surface 31, the cover film and the jig plate 30 are positioned by the positioning pins 40 penetrating through the first positioning holes 17 and the third positioning holes 34.
When the flexible board 20 is attached to the cover film, the positioning pins 40 penetrate into the second positioning holes 22 to position the flexible board 20 and the jig board 30.
By adopting the scheme, the laminating precision of the covering film can be ensured.
In some embodiments, after the flexible board 20 is attached to the cover film, the flexible board 20 is heated and then the vacuum pumping device is turned off.
By adopting the above-described scheme, it is possible to ensure a tighter bond of the cover film and the flexible board 20.
Alternatively, the cover film can be pre-fixed on the flexible board 20 by adopting a heating mode such as a manual soldering iron or an iron for 1-3s, so that the cover film is transferred to the corresponding position of the flexible board 20, then the vacuumizing device is closed to release vacuum, the flexible board 20 with the attached cover film is taken down, and the cover film transfer operation is circularly performed.
Further, after the flexible board 20 is attached to the cover film, the flexible board 20 is heated, and then the flexible board 20 and the cover film are rapidly pressed and cured.
Wherein the rapid pressing can be produced by a special rapid pressing machine, the temperature is 180 ℃, the pressure and the time are designed in two sections, and the time/pressure is 10s/20kgcm in the first section 2 The method comprises the steps of carrying out a first treatment on the surface of the And a second section: time/pressure of 120s/130kgcm 2 。
Wherein, the solidification is to put the soft board 20 which is pressed fast on a multi-layer frame, 1 piece/layer, put the whole multi-layer frame on a vertical oven to bake the board, the temperature of the baking board is 160 ℃, the baking time is 2 hours, take out the soft board 20 after baking the board, and naturally cool to room temperature, so that the covering film is tightly attached on the soft board 20.
Referring to fig. 13, in some embodiments, before the flexible board 20 is attached to the cover film, first positioning lines 23 and second positioning lines 24 are processed on the flexible board 20, wherein the first positioning lines 23 have first positioning notches 231 and the second positioning lines 24 have second positioning notches 241; the base film 10 is provided with a first positioning protrusion 18 and a second positioning protrusion 19 which are arranged at intervals; when the flexible board 20 is attached to the cover film, the cover film is positioned between the first positioning line 23 and the second positioning line 24, the first positioning protrusion 18 is positioned in the first positioning notch 231, and the second positioning protrusion 19 is positioned in the second positioning notch 241.
By adopting the above-mentioned scheme, can carry out the counterpoint precision detection to the tectorial membrane of laminating at soft board 20, whether it is within the deviation scope of inspection.
Alternatively, the line width of the first positioning line 23 and the line width of the second positioning line 24 are each designed to be 0.1mm, so that it is possible to check whether the alignment accuracy of the cover film attached to the flexible board 20 in the direction perpendicular to the first positioning line 23 is within a deviation range of 0.1mm.
Alternatively, along the direction of the first positioning line 23, the distance between the two sidewalls of the first positioning slot 231 and the first positioning protrusion 18 is designed to be 0.1mm, and the distance between the two sidewalls of the second positioning slot 241 and the second positioning protrusion 19 is designed to be 0.1mm. It is thereby possible to check whether or not the alignment accuracy of the cover film attached to the flexible board 20 in the direction parallel to the first alignment line 23 is within the deviation range of 0.1mm.
Alternatively, the first positioning protrusion 18 and the second positioning protrusion 19 are staggered, that is, are not arranged relatively, and can have a foolproof effect.
Referring to fig. 14 and 15, in some embodiments, the fixing the first film layer 11 located inside the first area 15 includes the following steps:
firstly, providing a jig plate 30, wherein the jig plate 30 is provided with a first surface 31 and a second surface 32 which are oppositely arranged, and a plurality of adsorption holes 33 are formed in the jig plate 30, and the adsorption holes 33 penetrate through the first surface 31 and the second surface 32; next, the first film 11 is attached to the first surface 31, and the first film 11 located in the first area 15 is attached to one end of the adsorption hole 33 away from the second surface 32; next, providing a workbench 50, wherein a containing groove 51 for placing the jig plate 30 is arranged on the workbench 50, a connecting hole 52 corresponding to the adsorption hole 33 is arranged at the bottom of the containing groove 51, and the connecting hole 52 is connected with a vacuumizing device; then, the jig plate 30 is placed in the accommodating groove 51; finally, the vacuumizing device is started to adsorb and fix the first film layer 11 positioned in the first area 15.
Through adopting above-mentioned scheme, can be earlier put tool board 30 in holding tank 51 and fixed with workstation 50 to adsorb fixedly to be located the inside first rete 11 of first region 15, rethread locating pin 40 is laminated the tectorial membrane on soft board 20, easy operation, convenient to use, and tool board 30 and workstation 50 and evacuating device detachable setting, convenient processing and clearance.
Further, the gap between the jig plate 30 and the accommodating groove 51 is sealed and fixed by using strippable gummed paper, such as high temperature resistant gummed paper, so as to avoid air leakage between the jig plate 30 and the accommodating groove 51 during vacuum pumping.
Optionally, the jig plate 30 is provided with a counter bore 35, the bottom of the accommodating groove 51 is provided with a threaded hole 53, and the jig plate 30 and the accommodating groove 51 are fixed by mounting screws penetrating through the counter bore 35 and the threaded hole 53. The nut of the mounting screw can sink into the counter bore 35 and does not protrude from the surface of the jig plate 30, and the flatness of the surface is not affected.
The above embodiments are only for illustrating the technical solution of the present application, and are not limiting; although the application has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present application, and are intended to be included in the scope of the present application.
Claims (5)
1. A cover film bonding method, comprising:
providing a cover film, wherein the cover film is manufactured by the following cover film manufacturing method: providing a base film, wherein the base film comprises a first film layer, a bonding layer and a second film layer which are sequentially laminated; cutting a separation boundary on one surface of the first film layer far away from the bonding layer, wherein the depth of the separation boundary is greater than or equal to the sum of the thicknesses of the first film layer and the bonding layer and less than the sum of the thicknesses of the first film layer, the bonding layer and the second film layer, the separation boundary separates one surface of the first film layer far away from the bonding layer into a first area and a second area, and the distance between the bottom of the separation boundary and the bonding layer is 1/5-2/5 of the thickness of the second film layer;
providing a soft board, wherein at least one surface of the soft board is provided with a circuit area;
fixing the first film layer located inside the first region, including: providing a jig plate, wherein the jig plate is provided with a first surface and a second surface which are oppositely arranged, a plurality of adsorption holes are formed in the jig plate, the adsorption holes penetrate through the first surface and the second surface, and one end, far away from the first surface, of each adsorption hole is communicated with a vacuumizing device; attaching the first film layer to the first surface, wherein the first film layer positioned in the first area is attached to one end of the adsorption hole away from the second surface; starting the vacuumizing device to adsorb and fix the first film layer positioned in the first area;
peeling the second film layer, the adhesive layer in the second region, and the first film layer in the second region;
and attaching the soft board to the covering film, wherein the circuit area is attached to the adhesive layer positioned in the first area.
2. The fitting method according to claim 1, wherein a distance between a wall of the suction hole and the partition boundary is 0.5mm to 1.0mm.
3. The bonding method according to claim 1 or 2, wherein the aperture size of the adsorption holes is 0.5mm-1.0mm, and the distance between two adjacent adsorption holes is 3mm-5mm.
4. The cover film attaching method according to claim 1 or 2, wherein a first positioning hole is processed on the flexible board and a second positioning hole is processed on the cover film before attaching the flexible board to the cover film; the jig plate is provided with a third positioning hole; when the first film layer is attached to the first surface, the cover film and the jig plate are positioned through positioning pins penetrating through the first positioning holes and the third positioning holes; when the soft board is attached to the covering film, the positioning pins penetrate into the second positioning holes so as to position the soft board and the jig board.
5. The method according to claim 1 or 2, wherein after the flexible board is attached to the cover film, the flexible board is heated and then the vacuum-pumping device is turned off.
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|---|---|---|---|---|
| WO2005100220A1 (en) * | 2004-04-13 | 2005-10-27 | Beac Co., Ltd. | Coverlay film laminating device |
| CN109466155A (en) * | 2018-10-31 | 2019-03-15 | 珠海杰赛科技有限公司 | A method of it improving rigid-flex combined board cover film and is bonded efficiency |
| CN109587973A (en) * | 2019-01-30 | 2019-04-05 | 高德（无锡）电子有限公司 | A kind of process for pressing of multilayer soft board Rigid Flex |
| JP2019064200A (en) * | 2017-10-03 | 2019-04-25 | 日本メクトロン株式会社 | Multilayer release film and manufacturing method of multilayer release film, and manufacturing method of flexible printed circuit board using the multilayer release film |
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2021
- 2021-11-19 CN CN202111399257.5A patent/CN114258207B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005100220A1 (en) * | 2004-04-13 | 2005-10-27 | Beac Co., Ltd. | Coverlay film laminating device |
| JP2019064200A (en) * | 2017-10-03 | 2019-04-25 | 日本メクトロン株式会社 | Multilayer release film and manufacturing method of multilayer release film, and manufacturing method of flexible printed circuit board using the multilayer release film |
| CN109466155A (en) * | 2018-10-31 | 2019-03-15 | 珠海杰赛科技有限公司 | A method of it improving rigid-flex combined board cover film and is bonded efficiency |
| CN109587973A (en) * | 2019-01-30 | 2019-04-05 | 高德（无锡）电子有限公司 | A kind of process for pressing of multilayer soft board Rigid Flex |
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