CN214592142U - Emergent medical equipment PCBA MOS pipe assembly structure - Google Patents
Emergent medical equipment PCBA MOS pipe assembly structure Download PDFInfo
- Publication number
- CN214592142U CN214592142U CN202121101596.6U CN202121101596U CN214592142U CN 214592142 U CN214592142 U CN 214592142U CN 202121101596 U CN202121101596 U CN 202121101596U CN 214592142 U CN214592142 U CN 214592142U
- Authority
- CN
- China
- Prior art keywords
- mos
- pcba
- mos pipe
- radiating block
- backing plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000017525 heat dissipation Effects 0.000 claims abstract description 26
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 claims abstract description 25
- 239000003292 glue Substances 0.000 claims abstract description 10
- 238000009434 installation Methods 0.000 claims abstract description 8
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 239000004519 grease Substances 0.000 claims description 2
- 229920001296 polysiloxane Polymers 0.000 claims description 2
- 239000010410 layer Substances 0.000 claims 2
- 239000012790 adhesive layer Substances 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 10
- 230000008569 process Effects 0.000 abstract description 5
- 230000007547 defect Effects 0.000 abstract description 3
- 230000009471 action Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 206010037660 Pyrexia Diseases 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to an emergent medical equipment PCBA MOS pipe package assembly, contain insulating backing plate and radiating block, the pin of MOS pipe contains major part and lower minister, form L type installation face, the insulating backing plate is arranged in on the PCBA board, each MOS pipe installation position is equipped with and is used for the pin with the MOS pipe under the minister complex mounting hole, be equipped with on the insulating backing plate be used for with the MOS pipe on the pin most complex through-hole, the radiating block erects to be arranged in on the insulating backing plate and be located by the through-hole, the MOS pipe is laminated with the radiating block mutually, be equipped with the heat dissipation glue film on its faying face, manage a plurality of MOS and radiating block pressfitting by the fixed strip. The L-shaped mounting surface of the MOS tube is flatly pasted with the PCBA, the problem that pins cannot be accurately aligned to holes in the PCBA due to the fact that pins of the MOS tube are offset in the process of assembling the MOS tubes to the radiating block is solved, and the defect that the pins are placed at the tips of the MOS tubes to burn the PCB in high-voltage electrifying operation of a product is overcome.
Description
Technical Field
The utility model relates to an emergent medical equipment PCBA MOS nest of tubes package assembly structure.
Background
At present, during the equipment of PST contravariant board MOS pipe, on a plurality of MOS pipes wholly assembled the PCBA board together, the problem of PIN skew can appear in the equipment process to lead to the difficult accurate perfect counterpoint of hole on every MOS pipe PIN foot and the PCBA board, the MOS pipe can't paste in the PCBA board.
SUMMERY OF THE UTILITY MODEL
The utility model aims at overcoming the deficiencies in the prior art and providing an emergent medical equipment PCBA MOS pipe assembly structure.
The purpose of the utility model is realized through the following technical scheme:
emergent medical equipment PCBA MOS pipe assembly structure, characteristics are: contain insulating backing plate and radiating block, the pin of MOS pipe contains major part and lower minor part, form L type installation face, insulating backing plate arranges in on the PCBA board, each MOS pipe installation position is equipped with and is used for the minor part complex mounting hole under the pin with the MOS pipe on the PCBA board, be equipped with on the insulating backing plate be used for with the pin of MOS pipe on major part complex through-hole, the radiating block erects to be arranged in on the insulating backing plate and be located by the through-hole, the MOS pipe laminates with the radiating block mutually, be equipped with the heat dissipation glue film on its faying face, by the fixed strip with a plurality of MOS pipes and radiating block pressfitting.
Further, above-mentioned emergent medical equipment PCBA MOS pipe assembly structure, wherein, screw in from PCBA board through insulating backing plate to the radiating block by the allen key, connect it as an organic whole.
Further, the assembly structure of the PCBA MOS tube of the emergency medical equipment is characterized in that the fixing strips on two sides of each MOS tube are connected with the heat dissipation block through screws.
Further, foretell emergency medical equipment PCBA MOS pipe assembly structure, wherein, the fixed strip is rectangular shape stainless steel sheet.
Further, the assembly structure of the PCBA MOS tube of the emergency medical equipment is described above, wherein the insulating pad is an FR4 insulating pad.
Further, above-mentioned emergent medical equipment PCBA MOS pipe package assembly, wherein, heat dissipation glue layer is heat dissipation silicone grease layer.
Compared with the prior art, the utility model have apparent advantage and beneficial effect, the concrete aspect that embodies is in following:
the utility model relates to a novelty realizes that the L type installation face of MOS pipe is flat pastes PCBA board, has not only solved a plurality of MOS pipe and has assembled the problem that the skew appears in the radiating block in-process MOS pipe pin and lead to the unable accurate counterpoint PCBA board upper hole of pin, still eliminates the defect that the electric board of burning is put to MOS pipe tip when the electric operation on the product high pressure, is showing the quality that provides the product.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and drawings.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1: the structure of the utility model is shown schematically;
FIG. 2: the structure of the MOS tube is schematically shown.
The meanings of the reference symbols in the figures are given in the following table:
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiment of the present invention, all other embodiments obtained by the person skilled in the art without creative work belong to the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures. Meanwhile, in the description of the present invention, the directional terms and the sequence terms and the like are used only for distinguishing the description, and are not to be construed as indicating or implying relative importance.
As shown in fig. 1 and fig. 2, an assembly structure of a PCBA MOS tube of an emergency medical device includes an insulating pad 2 and a heat dissipation block 3, pins of MOS tubes 4 include an upper major part and a lower minor part, forming an L-shaped mounting surface 401, the insulating pad 2 is disposed on the PCBA plate 1, each mounting position of the MOS tubes on the PCBA plate 1 is provided with a mounting hole for fitting with the lower minor part of the pins of the MOS tubes, the insulating pad 2 is provided with a through hole for fitting with the upper major part of the pins of the MOS tubes, the heat dissipation block 3 is vertically disposed on the insulating pad 2 and beside the through hole, an inner hexagonal screw 8 is screwed into the heat dissipation block 3 from the PCBA plate 1 through the insulating pad 2, the heat dissipation block is integrally connected, the MOS tubes 4 are attached to the heat dissipation block 3, a heat dissipation glue layer 6 is disposed on a bonding surface of the heat dissipation glue layer 6, and a plurality of MOS tubes 4 are press-bonded to the heat dissipation block 3 by a fixing strip 7.
The fixing strips 7 on two sides of each MOS tube 4 are connected with the radiating block 3 by screws 5, and the fixing strips 7 are strip-shaped stainless steel sheets.
The insulating pad 2 is made of FR4 insulating material.
The heat dissipation glue layer 6 is used for heat transfer between the MOS tube 4 and the heat dissipation block 3, and the working heat of the MOS tube is effectively transferred to the heat dissipation block 3, so that sufficient heat dissipation is realized.
During assembly, firstly, coating a proper amount of heat dissipation glue on the part, corresponding to the MOS tube 4, of the heat dissipation block 3 through the heat dissipation block placing jig and the gluing jig;
placing the radiating block 3 coated with the radiating glue and the insulating base plate 2 in an assembly jig together, combining the insulating base plate 2 with the radiating block 3, then combining the PCBA board 1 with the PCBA board, and connecting and fixing the PCBA board 1, the insulating base plate 2 and the radiating block 3 together through the inner hexagonal screws 8;
the MOS tubes 4 are inserted into the corresponding holes of the PCBA board 1, the side faces of the MOS tubes are tightly attached to the heat dissipation glue on the heat dissipation block 3, and the MOS tubes are vertically distributed;
placing a limiting jig into a gap between the MOS tube and the radiating block to limit the MOS from being lifted, so that the L-shaped mounting surface 401 of the MOS tube 4 is tightly attached to the PCBA board;
and a plurality of MOS tubes are fixed with the radiating block by using screws 5 and fixing strips 7.
To sum up, the utility model relates to a novelty, the L type installation face of MOS pipe is flat pastes PCBA board, has not only solved a plurality of MOS pipe and has assembled the problem that the skew appears in the radiating block in-process MOS pipe pin and lead to the unable accurate counterpoint PCBA board upper hole of pin, and the MOS pipe tip is put the defect of electric fever board when still avoiding the power-on operation of product high pressure, is showing the quality that provides the product.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and all should be covered within the protection scope of the present invention.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Claims (6)
1. Emergent medical equipment PCBA MOS pipe assembly structure, its characterized in that: contain insulating backing plate (2) and radiating block (3), the pin of MOS pipe (4) contains major part and lower tip, form L type installation face (401), PCBA board (1) is arranged in to insulating backing plate (2), each MOS pipe installation position is equipped with and is used for with the pin of MOS pipe under tip complex mounting hole on PCBA board (1), be equipped with on insulating backing plate (2) be used for with the pin of MOS pipe on major part complex through-hole, radiating block (3) are erect and are arranged in on insulating backing plate (2) and are located the through-hole other, MOS pipe (4) and radiating block (3) are laminated mutually, be equipped with heat-radiating glue layer (6) on its bonding surface, by fixed strip (7) with a plurality of MOS pipe (4) and radiating block (3) pressfitting.
2. The emergency medical device PCBA MOS tube assembly structure as in claim 1, wherein: the inner hexagonal screw (8) is screwed into the heat dissipation block (3) from the PCBA board (1) through the insulating base plate (2) to connect the PCBA board and the heat dissipation block into a whole.
3. The emergency medical device PCBA MOS tube assembly structure as in claim 1, wherein: the fixed strips (7) on the two sides of each MOS tube (4) are connected with the radiating block (3) by screws (5).
4. The emergency medical device PCBA MOS tube assembly structure as claimed in claim 1 or 3, wherein: the fixing strip (7) is a long-strip-shaped stainless steel sheet.
5. The emergency medical device PCBA MOS tube assembly structure as in claim 1, wherein: the insulating pad (2) is an FR4 insulating pad.
6. The emergency medical device PCBA MOS tube assembly structure as in claim 1, wherein: the heat dissipation adhesive layer (6) is a heat dissipation silicone grease layer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202121101596.6U CN214592142U (en) | 2021-05-21 | 2021-05-21 | Emergent medical equipment PCBA MOS pipe assembly structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202121101596.6U CN214592142U (en) | 2021-05-21 | 2021-05-21 | Emergent medical equipment PCBA MOS pipe assembly structure |
Publications (1)
Publication Number | Publication Date |
---|---|
CN214592142U true CN214592142U (en) | 2021-11-02 |
Family
ID=78329722
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202121101596.6U Expired - Fee Related CN214592142U (en) | 2021-05-21 | 2021-05-21 | Emergent medical equipment PCBA MOS pipe assembly structure |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN214592142U (en) |
-
2021
- 2021-05-21 CN CN202121101596.6U patent/CN214592142U/en not_active Expired - Fee Related
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN202884521U (en) | Light-emitting diode (LED) module with high thermal conductivity structure | |
CN202262031U (en) | Heat dissipation type led flexible circuit board | |
CN214592142U (en) | Emergent medical equipment PCBA MOS pipe assembly structure | |
CN106061102A (en) | Production process of high-heat-conductivity circuit board | |
CN108124378A (en) | A kind of bent aluminum substrate | |
CN205755051U (en) | A kind of novel high heat-conduction circuit board | |
CN214627473U (en) | Bottom surface cooling system of cooling chip | |
CN206365149U (en) | A kind of bent aluminium base | |
CN210670724U (en) | Modularized printed circuit board heat radiation structure | |
CN209170736U (en) | A kind of device flush type rigid-flex circuit board | |
CN102612254A (en) | Heat radiation type LED (Light-Emitting Diode) flexible circuit board | |
CN210807782U (en) | Substrate heat dissipation substrate structure | |
CN101652027B (en) | Making process of circuit board with radiation fins | |
CN102427665B (en) | Manufacturing technology of three-dimensional double-face aluminium substrate | |
CN111954368A (en) | Thermoelectric separation filling electroplated double-sided metal substrate and manufacturing method thereof | |
CN219759128U (en) | Liquid crystal display screen capable of improving heat dissipation and overhaul capacity of FPC | |
CN207305059U (en) | A kind of PCB circuit board of high efficiency and heat radiation multilayer | |
JP5906621B2 (en) | Electronic component manufacturing method and fixing jig | |
CN112576963A (en) | Discontinuously layered flexible laminated circuit board lamp strip and manufacturing method thereof | |
CN218299491U (en) | Electrical appliance insulation assembly and electronic equipment with same | |
CN211457575U (en) | Tool of whole epiphragma of laminating | |
CN215647605U (en) | FPC structure | |
CN212786029U (en) | Novel double-sided printed circuit board | |
TW201414376A (en) | Circuit board having heat sink, circuit board having component mounted thereon and heat sink, and production methods thereof | |
CN216905425U (en) | All-new tin conduction process circuit board |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20211102 |
|
CF01 | Termination of patent right due to non-payment of annual fee |