九、發明說明： [發明所屬之技術領域] [0001 ] 本發明係有關印刷電路板之貼附裝置及貼附方法，特 別是有關可撓印刷電路板（下稱FPC)或多層FPC內層中表 面保護用覆蓋薄膜之貼附。 [先前技術] [0002] 此種印刷電路板於長條狀蕋板材料上進行電路形成， 此後，將裁成薄片狀的覆蓋溥膜貼附於長條狀基板材料而 製造。例如，圖8係顯示習知印刷電路板之貼附裝置之說 明圖，圖8(a)係平面圖，圖8(b)係自圖8(a)之箭頭C方 向之側視圖。捲繞成卷筒狀的長條狀覆蓋薄膜1 0藉搬送夾 持器2 1及固宠夾持^ 22拉出固定長度，利用裁斷機構23 裁成薄片狀。裁斷之覆蓋薄膜1 1載置而吸附固定於載置頭 (後述下側熱板）25。薄片狀覆蓋荊膜丨1保持吸附固定於載 置頭25，如二點鏈線所示，朝自卷筒捲出之FPC 30之下 部位置移動。且符號24係自薄片狀覆蓋薄膜1 1剝離之解 除‘薄膜之回收箱。 [0003] 加熱器等發熱體內裝於吸附固定薄片狀覆蓋薄膜11 之載匱頭25，作爲下側熱板25翠撺作用。另一方面，對 向此下側熱板25,配瞪上側熱板26於前述FPC 30之上方， 形成暫時黏接機構40，藉設在下側熱板25之位置對正機IX. Description of the invention: [Technical field to which the invention pertains] [0001] The present invention relates to a device and a method for attaching a printed circuit board, particularly to a flexible printed circuit board (hereinafter referred to as FPC) or a multilayer FPC inner layer. The surface protection is attached with a cover film. [Prior Art] [0002] Such a printed circuit board is formed on a long-shaped slab material by a circuit, and thereafter, a lamella-coated ruthenium film is attached to a long-length substrate material to be manufactured. For example, Fig. 8 is an explanatory view showing a conventional printed circuit board attaching device, Fig. 8(a) is a plan view, and Fig. 8(b) is a side view from the arrow C direction of Fig. 8(a). The long strip-shaped cover film 10 wound in a roll shape is pulled out by the transport gripper 2 1 and the gusset holder 22, and is cut into a sheet shape by the cutting mechanism 23. The cut cover film 1 1 is placed and adsorbed and fixed to a mounting head (lower side hot plate to be described later) 25. The flaky cover film 1 remains adsorbed and fixed to the mounting head 25, as shown by the two-dot chain line, moving toward the lower portion of the FPC 30 that is unwound from the reel. Further, the symbol 24 is a release film of the film which is peeled off from the sheet-like cover film 11 . [0003] A heat generating body such as a heater is attached to the loading head 25 that adsorbs and fixes the sheet-like cover film 11, and functions as a lower side hot plate 25. On the other hand, facing the lower hot plate 25, the upper side hot plate 26 is disposed above the FPC 30 to form a temporary bonding mechanism 40, which is positioned at the position of the lower side hot plate 25.
1376993 1 I 構（未圓示），在相對於FPC 30之工件31，使覆蓋薄膜11 之位置一致之後，接合下側熱板25與上側熱板26，暫時 固定覆蓋薄膜11»在暫時固定覆蓋薄膜11之後，藉熱壓 機41黏接覆蓋薄膜11。 [0004] 一般在貼附覆蓋薄膜之際，影像讀取位置對正標記， 獲知覆蓋薄膜定位於吸附固定在載台上的基板材料（例 如，參照專利文獻1 )。 [0005] 在此，由於長條狀FPC於電路形成等中反覆進行自卷 筒捲出及捲繞，因此，尺寸發生變化。特別是由於在蝕刻 步驟中施以張力使銅箔緊張，因而，此後張力解除時收縮 的傾向很大。一般而言，雖然根據經驗値，校正覆蓋薄膜 之校正尺寸，惟FPC時而會收縮超過預期，或者相反地， 雖如預期卻不收縮。特^是因用於卷筒之捲繞始端、捲繞 終端或卷筒間之裝置而發生FPC 30之尺寸變化，在貼附覆 蓋薄膜於工件之際會發生位置偏差。 [0006] 圖9係貼附形狀與形成於長條狀FPC 30之長方形工件 31相同之覆蓋薄膜11之說明圖。如圖9(a)所示，在卷筒 之L側及R側之尺寸變化如預期情況下，可不發生偏移， 相對於工件3 1之形狀，貼附覆蓋薄膜1 1。相對於此，如 圖9(b)所示|在卷简之L側及R側之尺寸變化不均情況 下，工件31會成爲梯形，蒞貼附長方形之覆蓋薄膜1 1 * 即發生相互偏移。 6 1376993 4 1 [0007] 面對近年來高密度化及微細化的要求，層疊覆蓋薄膜 之際位置偏移的容許値變得很嚴格，要求更髙精度層疊的 技術。 [專利文獻1]日本専利特開2004 - 3 1 9688號公報 [發明內容] [發明欲解決之問題] [0008] 專利文獻1所載發明固然藉由影像處理將覆蓋薄膜定 位，惟在FPC縱向或横向單向仲展（單向收縮）時，無法應 付，覆蓋薄膜會發生位匱偏移。 [0009] 因此，本發明之目的在於，即使於貼附覆蓋薄膜於印 刷電路基材之表面之際\印刷電路栽材之尺寸變化不均情 況下，仍更正確達到位匱精度而不會發生偏移。 [0010] 本發明係爲達成上述目的而提案者，申請專利範圍第 1項所載發明提供一種印刷爾路板之貼附裝匱•係爲絕緣 保護由形成於絕緣甚材之電路構成之印刷電路基材，將裁 斷成既定尺寸之覆蓋薄膜連續貼附於自卷筒捲出之長條狀 印刷電路基材之貼附裝置，其特徵在於，具備：暫時黏接 機構，其載置裁斷之覆蓋薄膜，由配匱於長條狀印刷電路 基材下面之下側熱板以及面對下側熱板而設於該長條狀印 刷電路基材上方之上側熱板構成•使該印刷電路基材之工 7 1376993 t « 件與覆蓋薄膜之位置一致，藉該下側熱板及上側熱板暫時 固定；第1畫像讀取台•其於由將朝捲繞方向移動之該印 刷電路基材與暫時固定於該印刷電路基材之覆蓋薄膜壓接 之熱壓機構成之印刷爾路板之貼附裝置中，在暫時固定該 > 覆蓋薄膜之前，拍攝預先設於印刷電路基材之標靶，檢測 工件之尺寸變化；以及控制機楢，其根據該第1畫像讀取 台所檢測之工件尺寸資料•控制該下側熱板及上側熱板之 溫度，進行覆蓋薄膜及印刷爾路基材之尺寸校正。第1畫 像讀取台，其於由將朝捲繞方向移動之該印刷電路基材與 暫時固定於該印刷電路基材之覆蓋薄膜壓接之熱壓機構成 之印，刷電路板之貼附裝置中，在暫時固定該覆蓋薄膜之 前，拍攝預先設於印刷電路基材之標靶，檢測工件之尺寸 變化；以及控制機構，其根據該第1畫像讀取台所檢測之 工件尺寸資料，控制該下側熱板及上側熱板之溫度，進行 覆蓋薄膜及印刷電路i材之尺寸校正。 [0011 ] 根據該構成，在暫時固定覆蓋薄膜之前，藉第1畫像 讀取台拍攝預先設於印刷電路基材之標靶，檢測工件之尺 寸變化。在暫時固定覆蓋薄膜之際，根據所檢測之工件尺 寸變化，控制機構分別獨立控制下側熱板及上側熱板，利 用印刷電路板及覆蓋薄膜二者的熱膨眼，進行尺寸校正， 進行印刷電路板之工件與覆蓋薄膜之位置對正。 [0012] 申請專利範圍第2項所敝發明提供如申請專利範圍第 1項所載印刷電路板之貼附裝置，上述上下熱板中至少下 8 1376993 側熱板削分成複數塊，形成埒塊可溫度控制，上述控制機 楢形成根據前述第1 Π丨像_丨w台所檢测工件之尺寸變化， 部分地改變前述熱板之溫度，強行變化覆蓋薄膜之尺寸。 [0013] 根據該桢成|依抑茁丨i!t像_収台所檢測之工件尺寸 變化•控制機梆溫坡控制至少下側熱板之塊，部分地改變 熱板之溫度，強行铤化湄為胂脱之K寸》 [0014] 申請珥利範_第3项所戰發明提供如中請琪利範圍第 1或2項所載印刷電路板之貼附裝置•於上述印刷電路基 材，在工件之四隅，對應此標靶*於上述《蓋薄膜形成圆 形衝孔之標靶，藉由影像處理求出前述印刷電路基材之標 靶中心與現蓋溥股·之搮靶屮心，上述控制機榊形成進行上 述熱板之溫度控制使二热之屮心對正。 [0015] ’’ 根據該梢成，Iff山影像處耶求出設於印刷爾路基材之 工件四隅之1R丨肜衡孔之彻靶，以及到應此榴靶股於覆蓋溥 膜之圓形衝孔之標靶之個別屮心，於二者之中心不對正情 況下，控制機榊控制熱板之溫度控制，進行尺寸校正使二 者之中心一致β [0016] 申請專利範圆第4项所賊發明提供如巾請專利範園第 1項、第2項或第3项m敝卬刷m路板之貼附裝圓•其具 備第2畫像讀取台•於师時闪定..丨·.述搜蓋薄膜之後•拍攝 上述印刷電路拣材之標靶及m盖碑膜之標靶，確認有無彼 9 此的位置偏移。 [0017] 根據該構成，於暫時固定覆蓋薄膜之後，藉第2畫像 讀取台拍攝印刷電路基材之標靶及搜蓋薄膜之標靶，根據 二標靶中心是否對正，確認葙無位置偏移。 [0018] 申請專利範圍第5項所載發明提供一種印刷電路板之 貼附方法，係爲絕緣保護由形成於絕緣基材之電路構成之 印刷電路基材，將裁斷成既定尺寸之覆蓋薄膜連續貼附於 自卷筒捲出之長條狀印刷電路基材之貼附方法，其特徵在 於，拍攝預先設於前述印刷爾路菡材之標靶，藉由影像處 理檢測工件之尺寸變化，在藉載置裁斷之覆蓋薄膜之下側 熱板以及對向該下側熱板•設ill於卵述長條狀印刷電路基 材上方之上側熱板，挾持而暫時固定印刷電路基材及覆蓋 薄膜之際，對應前述土件之尺寸變化，部分地改變前述熱 板之溫度，強行變化覆蓋薄膜之尺寸，消除覆蓋薄膜相對 於印刷m路基材之位阍偏移。 [0019] 根據該構成，藉由往暫時固定覆蓋薄膜之前，拍攝設 於印刷電路基材之標靶，檢測工件之尺寸變化，根據所檢 測工件之尺寸變化，部分地改變前述熱板之溫度，強行變 化覆蓋薄膜之尺寸，進行覆蓋薄膜相對於印刷電路基材之 工件的位置對正 1376993 [發明效果] [0020] 由於申請專利範圍第丨項所載發明在暫時固定覆蓋薄 膜之前，藉第1 1像讀取台拍攝設於印刷電路基材之標 靶，檢測工件之尺寸變化，根據所檢測之工件尺寸變化， 控制機構分別獨立控制下側熱板及上側熱板，因此，可利 用印刷電路基材及覆蓋薄膜二者的熱膨脹，進行尺寸校 正，於暫時固定之際，進行印刷電路基材之工件與覆蓋薄 膜之位匱對正。 [0021] 由於申請専利範圍第2項所戦發明係至少下側熱板劃 分成複數塊，形成每塊可溫度控制，因此，除了申請專利 範圍第1項所載發明之效果外，即使在印刷電路基材之尺 寸變化不均情況下，仍可藉由部分地改變熱板之溫度，強 行變化覆蓋薄膜之尺寸•更進一步進行印刷電路基材之工 件與覆蓋薄膜之位置對正，同時，即便是尺寸變化不均之 印刷電路基材之工件，仍可作爲製品來使用，可提髙製品 之生產率。 [0022] .由於申請專利範圍第3項所載發明係藉由影像處理求 出設於印刷電路基材之工件四隅之圆形衝孔之標靶*以及 對應此標靶設於覆蓋薄膜之圓形衝孔之標靶，因此，除了 申請專利範圍第1項或第2項所載發明之效果外，可正確 且容易進行印刷電路蕋材之工件及覆蓋薄膜之位置對正。 11 1376993 [0023] ώ於中、珥利範阅第4项所戦發明於暫時固定覆蓋薄 膜之後，藉第2畫像讀取台確認有無印刷電路基材之工件 與覆蓋薄膜之波此標準標靶的位置偏移，因此，除了申請 專利範圍第1項 '第2項或第3項所載發明之效果外，在 萬一印刷電路越材之工件與褪蓋薄膜之彼此標準標靶的位 . 置偏移超過容許範圍情況下，可發出警報•停止生產線， 或反饋至上下熱板之溫度控制程式，抑制暫時固定的不當。 • [0024] ' 由於申請專利範圍第5項所載發明在暫時固定覆蓋薄 膜之前，拍攝預先設於印刷電路基材之標靶，檢測工件之 尺寸變化，根據所檢測之工件尺寸變化，部分地改變前述 熱.板之溫度，強行變化覆蓋薄膜之尺寸，因此，可正確且 容易進行印刷電路基材之工件與覆蓋薄膜位匱對正。又， 即便是尺寸變化不均之印刷電路蕋材之工件，仍可作爲製 品來使用，提高製品之生產率。 [實施方式] [用以實施發明之最佳形態] [0.025] 以下舉適當實施例•針對本發明之印刷電路板之貼附 裝置及貼附方法加以說明。爲達成在貼附覆蓋薄膜於印刷 電路基材之表面之際，即使於印刷電路基材之尺寸變化不 均情況下，仍可更正確達到位置精度，不會發生偏移的目 的。 12 1376993 本發明藉由提供一種印刷電路板之貼附裝置，其係爲 絕緣保護由形成於絕緣蕋材之電路構成之印刷電路基材· 將裁斷成既定尺寸之覆蓋薄膜連續貼附於自卷筒捲出之長 條狀印刷電路基材之貼附裝置，具備：暫時黏接機構，其 載置裁斷之覆蓋薄膜，由配置於長條狀印刷電路基材下面 之下側熱板以及面對該下側熱板而設於該長印刷電路基材 上方之上側熱板構成，使前述印刷電路基材之工件與覆蓋 薄膜之位匱一致，藉前述下側熱板及上側熱板暫時固定； 第1畫像讀取台，其於由將朝捲繞方向移動之前述印刷電 路基材與暫時固定於前述印刷電路基材之覆蓋薄膜壓接之 熱壓機構成之印刷電路板之貼附裝匱中，在暫時固定前述 覆蓋薄膜之前，拍攝預先設於印刷電路基材之標靶，檢測 工件之尺寸變化：以及控制機構，其根據前述第1畫像讀 取台所檢測之工件尺寸資料，控制該下側熱板及上側熱板 之溫度，進行覆蓋薄膜岌印刷m路越材之尺寸校正來實現》 [0026] 圖1係顯示本發明之印刷爾路板之貼附裝匱之說明 圖，圖1(a)係平面圖，圖1(b)係自圖1(a)之箭頭C方向 之側視圖。捲繞成卷筒狀的長條狀覆蓋薄膜10藉搬送夾持 器21及固定夾持器22拉出固定長度，利用裁斷機構23 裁成薄片狀。裁斷之覆蓋薄膜1 1載置而吸附固定於載置頭 (後述下側熱板）25Α。薄片狀覆蓋薄膜1 1保持吸附固定於 載置頭25Α，如二點鏈線所示，朝自卷简捲出之FPC 30之 下部位置移動。且符號24係自薄片狀覆蓋薄膜1 1剝離之 解除薄膜之回收箱。 13 1376993 [0027] 如後述，加熱器等發熱體內裝於載置頭25A，作爲下 側熱板25A發渾作用。又對向下側熱板25A ·配置內裝加 熱器之上側熱喷26A於前述FPC 30之上方，由下側熱板 25A及上側熱板26A形成暫時黏接機構40，藉暫時黏接機 構40將覆蓋薄膜1 1暫時固定於FPC 30之工件31。 [0028] 在此，於自卷筒捲出之FPC 30之搬送路徑，在暫時黏 接機構40之前工程位㈣設岡第丨癍像讀取台42。第丨畫 像讀取台42拍攝預先設於FPC 30之標靶，檢測工件31 之標準尺寸之尺寸變化。將第丨嶽像讀取台42所檢测之工 件3 1之尺寸資料送至控制機構50 ·根據此資料，如後述· 控制機構50控制下側熱板25A及上側熱板26A之溫度*進 行覆冓薄膜Π及FPC 30之尺寸校正。 [0029] > 又，在暫時黏接機構40之後工程位置設置第2畫像讀 取台43。第2畫像讀取台43拍攝FPC 30之標靶及暫時固 定之覆蓋薄膜丨丨之標靶，確認有無彼此位置偏移。將第2 畫像讀取台43所檢測之位隨偏移資料送至控制機構50。 根據此資料，如後述，反饋至上、下側熱板26A、 25A之 溫度控制程式，或停止生產線。在藉第2畫像讀取台43 確認暫時固定之覆蓋薄膜11之位置偏移在容許範圍內情 況下，藉熱腿機4 1將覆蓋溥膜丨丨正式接合於FPC 30之工 件31。 14 1376993 [0030] 本發明於FPC 30之電路形成時，如圖2所示，預先以 銅箔於工件31之四隅設匱_形圖案之標靶32,對應此標 靶32,於覆蓋薄膜丨丨之四隅形成圓形衝孔之標靶12。 形成覆蓋薄膜11之標靶12之直徭略大於工件31之標靶 32。於FPC 30之工件31與覆蓋薄膜丨1貼附之際，無位置 偏移而成對正狀態情況下，如圖2(a)所示，覆蓋薄膜11 之標靶1 2之中心與工件3 1之標靶3 2之中心一致，雙方之 標靶12、32成同心圓》 [0031] 相對於此，於FPC 30之工件3 1與覆蓋薄膜1 1彼此間 發生位置偏移情況下，如圖2(b)所示，覆蓋薄膜11之標 靶1 2之中心與工件3 1之標靶32之中心偏移。預先將標靶 1 2、32之直徑設定爲適當尺寸•若於位置偏移超過容許範 圍情況下，形成標靶^ 2、32二者重合，即可明確認識位置 偏移的發生。 [0032] 上、下側熱板26A、25A中至少下側熱板25A劃分成複 數塊。如圖3(a)所示，例如刨分成縱第丨行〜第5行，橫 a·塊〜f塊，形成各個塊可獨立控制熱板之溫度。如後述， 藉由以控制機構50進行下側熱板25A之塊各異的溫度控 制，可部分地改變下側熱板25A之溫度，強行變化覆蓋薄 膜1 1之尺寸。 [0033] 如圖9(b)所示，於卷筒之L側及R側之尺寸變化不 151376993 1 I structure (not shown), after the positions of the cover film 11 are made coincident with respect to the workpiece 31 of the FPC 30, the lower side hot plate 25 and the upper side hot plate 26 are joined, and the cover film 11 is temporarily fixed to be temporarily fixed. After the film 11, the cover film 11 is bonded by a heat press 41. [0004] Generally, when the cover film is attached, the image reading position is aligned, and the cover film is known to be positioned on the substrate material adsorbed and fixed on the stage (for example, refer to Patent Document 1). [0005] Here, since the elongated FPC is repeatedly wound up and wound from the reel in circuit formation or the like, the size changes. In particular, since the tension is applied to the copper foil during the etching step, the tendency of shrinkage after the tension is released is large. In general, although the correct size of the cover film is corrected according to experience, the FPC sometimes shrinks more than expected, or conversely, does not shrink as expected. The size change of the FPC 30 occurs due to the device used for the winding start end of the reel, the winding end or the reel, and the positional deviation occurs when the cover film is attached to the workpiece. 9 is an explanatory view of a cover film 11 having the same shape as that of the rectangular workpiece 31 formed in the elongated FPC 30. As shown in Fig. 9(a), the dimensional change of the L side and the R side of the reel is as expected, and the cover film 11 is attached with respect to the shape of the workpiece 31 without offset. On the other hand, as shown in FIG. 9(b), in the case where the dimensional changes on the L side and the R side of the winding are uneven, the workpiece 31 becomes a trapezoid, and the rectangular covering film 1 1 * is mutually offset. shift. 6 1376993 4 1 [0007] In the face of the demand for higher density and miniaturization in recent years, the allowable entanglement of positional deviation when laminating a cover film becomes strict, and a technique of stacking more precision is required. [Patent Document 1] Japanese Patent Application Laid-Open No. 2004-313978-A [Summary of the Invention] [The problem to be solved by the invention] [0008] The invention disclosed in Patent Document 1 locates a cover film by image processing only in the longitudinal direction of the FPC Or when the lateral one-way abduction (one-way contraction) is uncooperative, the film may be displaced. [0009] Therefore, the object of the present invention is to accurately achieve the positional accuracy without unevenness even when the size of the printed circuit board is unevenly changed when the cover film is attached to the surface of the printed circuit substrate. shift. [0010] The present invention has been proposed to achieve the above object, and the invention of claim 1 provides a printed circuit board attached to a printed circuit board. The insulation protection is formed by a circuit formed of an insulating material. A circuit substrate, wherein a cover film cut into a predetermined size is continuously attached to a long printed circuit substrate attached from a reel, and is characterized in that: a temporary bonding mechanism is provided, and the cutting is carried out The cover film is composed of a hot plate disposed on a lower side of the underside of the long printed circuit substrate and a heat plate disposed on the upper side of the elongated printed circuit substrate. The work of the material 7 1376993 t « The position of the cover film is the same as that of the cover film, and the lower heat plate and the upper hot plate are temporarily fixed; the first image reading table is mounted on the printed circuit substrate which is to be moved in the winding direction In the attaching device of the printing circuit board which is temporarily fixed to the hot press of the cover film crimping of the printed circuit substrate, before the covering film is temporarily fixed, the target previously set on the printed circuit substrate is photographed , Measuring the dimensional change of the workpiece; and controlling the size of the workpiece according to the workpiece size data detected by the first image reading table, controlling the temperature of the lower hot plate and the upper hot plate, and measuring the size of the cover film and the printed substrate Correction. a first image reading table, which is composed of a printing press substrate that is pressed in a winding direction and a heat press that is temporarily bonded to a cover film of the printed circuit substrate, and a device for attaching the printed circuit board Before temporarily fixing the cover film, photographing a target set in advance on the printed circuit substrate to detect a dimensional change of the workpiece; and controlling a mechanism for controlling the lower portion based on the workpiece size data detected by the first image reading table The temperature of the side hot plate and the upper hot plate is corrected for the size of the cover film and the printed circuit. According to this configuration, the target image set in advance on the printed circuit board is photographed by the first image reading table before the cover film is temporarily fixed, and the dimensional change of the workpiece is detected. When temporarily fixing the cover film, the control mechanism independently controls the lower side hot plate and the upper side hot plate according to the detected change in the size of the workpiece, and performs dimensional correction and printing by using the thermal expansion eyes of both the printed circuit board and the cover film. The position of the workpiece of the board and the cover film are aligned. [0012] The invention of claim 2 provides an apparatus for attaching a printed circuit board as set forth in claim 1, wherein at least the lower thermal plate of the upper and lower hot plates is divided into a plurality of blocks to form a block. The temperature control may be such that the control device forms a change in the size of the workpiece detected by the first image, and partially changes the temperature of the hot plate to forcibly change the size of the cover film. [0013] According to the change of the workpiece size detected by the | ! ! i! t image _ 收 收 收 收 收 收 收 收 收 收 收 收 收 收 收 收 收 收 收 收 收 收 收 收 收 收 收 收 收 收 收 收 收 收 收 收 收 收K为之的的K寸》 [0014] Applying for the invention of the _利范_3rd invention provides the attachment device for the printed circuit board contained in the first or second item of the Qi Li range. In the four 工件 of the workpiece, corresponding to the target* in the above-mentioned "cover film forming a circular punching target, the target center of the printed circuit substrate and the target 屮 · 求出 求出 求出 求出 求出The control device is configured to perform temperature control of the hot plate to align the two heats. [0015] '' According to the tip formation, the Iff Mountain image is obtained by finding the target of the 1R 丨肜 孔 hole of the workpiece placed on the substrate of the printing road, and the circle of the scorpion The individual defects of the target of the punching are controlled by the machine to control the temperature control of the hot plate, and the dimensional correction is made to make the center of the two uniform. [0016] Patent application No. 4 In the case of the thief of the item, the company provided the first round, the second item or the third item of the patent garden, such as the towel, and the m-shaped board attached to the circle. It has a second picture reading station.丨·. After the cover film is covered, • Take the target of the printed circuit picking material and the target of the m monument film to confirm the positional deviation. [0017] According to this configuration, after the cover film is temporarily fixed, the target of the printed circuit board and the target of the cover film are imaged by the second image reading station, and the position of the second target is aligned, and the position is confirmed. Offset. [0018] The invention of claim 5 provides a method for attaching a printed circuit board, which is a printed circuit substrate composed of a circuit formed on an insulating substrate, and is cut into a continuous film of a predetermined size. A method for attaching a long printed circuit board substrate that is attached to a self-reel, characterized in that a target previously set in the printed circuit board is photographed, and a dimensional change of the workpiece is detected by image processing. Temporarily fixing the printed circuit substrate and the cover film by holding the underside hot film of the cover film and the upper side hot plate facing the upper side of the long printed circuit substrate At the same time, corresponding to the dimensional change of the soil member, the temperature of the hot plate is partially changed, the size of the cover film is forcibly changed, and the positional deviation of the cover film with respect to the printed m-way substrate is eliminated. [0019] According to this configuration, before the cover film is temporarily fixed, the target provided on the printed circuit substrate is photographed, the dimensional change of the workpiece is detected, and the temperature of the hot plate is partially changed according to the change in the size of the detected workpiece. The size of the cover film is forcibly changed, and the position of the cover film with respect to the workpiece of the printed circuit substrate is aligned. 137693 [Invention Effect] [0020] Since the invention contained in the third application of the patent application temporarily fixes the cover film, the first 1 The reading station photographs the target set on the substrate of the printed circuit to detect the dimensional change of the workpiece. According to the change of the detected workpiece size, the control mechanism independently controls the lower hot plate and the upper hot plate, respectively, so that the printed circuit can be utilized. The thermal expansion of both the substrate and the cover film is dimensionally corrected, and when temporarily fixed, the position of the workpiece of the printed circuit substrate and the cover film are aligned. [0021] Since the invention according to item 2 of the application for profit range is divided into a plurality of blocks by at least the lower side hot plate, each block can be temperature-controlled, and therefore, in addition to the effect of the invention contained in the first application of the patent scope, even in printing When the size of the circuit substrate is uneven, the temperature of the cover film can be forcibly changed by partially changing the temperature of the hot plate. Further, the position of the workpiece and the cover film of the printed circuit substrate can be further aligned, and even It is a workpiece of a printed circuit substrate with uneven dimensional change, which can still be used as a product to improve the productivity of the product. [0022] The invention contained in claim 3 is a target for circular punching of a workpiece disposed on a substrate of a printed circuit by image processing, and a circle corresponding to the target disposed on the cover film. Since the target of the punching is targeted, in addition to the effects of the invention as set forth in claim 1 or 2, the position of the workpiece and the cover film of the printed circuit board can be correctly and easily aligned. 11 1376993 [0023] After the invention of the temporary fixed cover film, the second image reading table confirms the presence or absence of the printed circuit substrate workpiece and the cover film wave of the standard target. The positional offset, therefore, in addition to the effect of the invention contained in item 1 of item 2 or item 3 of the patent application, in the case of a printed circuit, the workpiece of the printed circuit and the surface of the fading film are in common with each other. When the offset exceeds the allowable range, an alarm can be issued. • Stop the production line, or feed back to the temperature control program of the upper and lower hot plates to suppress improper temporary fixing. [0024] 'Because the invention contained in the fifth application of the patent application forms a target previously set on the printed circuit substrate before temporarily fixing the cover film, detecting the dimensional change of the workpiece, depending on the size of the detected workpiece, partially The temperature of the heat plate is changed to forcibly change the size of the cover film, so that the workpiece of the printed circuit substrate and the cover film can be aligned correctly and easily. Further, even a workpiece of a printed circuit coffin having an uneven size can be used as a product to improve the productivity of the product. [Embodiment] [Best Mode for Carrying Out the Invention] [0.025] Hereinafter, a suitable embodiment will be described. The attachment device and the attachment method of the printed circuit board of the present invention will be described. In order to achieve the purpose of attaching the cover film to the surface of the printed circuit board, even if the size of the printed circuit board is not uniform, the positional accuracy can be more accurately achieved without causing offset. 12 1376993 The present invention provides a printed circuit board attaching device which is an insulating circuit for protecting a printed circuit substrate formed of a circuit formed of an insulating material, and continuously attaches a cover film cut into a predetermined size to a self-rolling film. The attaching device for the long strip-shaped printed circuit substrate which is rolled out is provided with a temporary bonding mechanism for placing the cut cover film, and is disposed on the lower side of the long printed circuit substrate under the hot plate and facing The lower side hot plate is disposed on the upper side of the long printed circuit substrate, and is configured such that the workpiece of the printed circuit substrate and the cover film are aligned, and the lower side hot plate and the upper side hot plate are temporarily fixed; The first image reading table is attached to a printed circuit board comprising a printed circuit board that is moved in a winding direction and a heat press that is temporarily bonded to a cover film of the printed circuit substrate. Before temporarily fixing the cover film, photographing a target previously provided on the printed circuit substrate, detecting a dimensional change of the workpiece: and a control mechanism that is inspected according to the first image reading table The workpiece size data is measured, and the temperature of the lower side hot plate and the upper side hot plate is controlled, and the size correction of the cover film 岌 printing m path is performed to achieve the realization. [0026] FIG. 1 shows the sticker of the printing road board of the present invention. Fig. 1(a) is a plan view, and Fig. 1(b) is a side view in the direction of arrow C of Fig. 1(a). The long cover film 10 wound in a roll shape is pulled out by the transport gripper 21 and the fixed gripper 22, and cut into a sheet shape by the cutting mechanism 23. The cut cover film 1 1 is placed and adsorbed and fixed to a mounting head (lower side hot plate to be described later) 25 turns. The sheet-like cover film 1 1 is adsorbed and fixed to the loading head 25, and is moved toward the lower position of the FPC 30 which is unwound from the roll as indicated by the two-dot chain line. Further, the symbol 24 is a recovery box for releasing the film from the sheet-like cover film 1 1 . 13 1376993 As will be described later, a heat generating body such as a heater is attached to the placing head 25A, and acts as a lower side hot plate 25A. Further, the lower side hot plate 25A is disposed above the FPC 30, and the temporary heat bonding mechanism 40 is formed by the lower side hot plate 25A and the upper side hot plate 26A, by the temporary bonding mechanism 40. The cover film 11 is temporarily fixed to the workpiece 31 of the FPC 30. Here, in the transport path of the FPC 30 that is unwound from the reel, the work position (4) is set in front of the temporary bonding mechanism 40. The second drawing image reading table 42 photographs a target previously set in the FPC 30, and detects the dimensional change of the standard size of the workpiece 31. The size data of the workpiece 3 1 detected by the Dijon image reading table 42 is sent to the control unit 50. According to this data, the control unit 50 controls the temperature of the lower hot plate 25A and the upper hot plate 26A as will be described later*. Overprint film inspection and FPC 30 size correction. [0029] Further, the second image reading table 43 is provided at the engineering position after the temporary bonding mechanism 40. The second image reading table 43 captures the target of the FPC 30 and the target of the temporarily fixed cover film ,, and confirms whether or not the position is shifted from each other. The position detected by the second portrait reading table 43 is sent to the control unit 50 along with the offset data. According to this information, as will be described later, feedback is made to the temperature control program of the upper and lower hot plates 26A, 25A, or the production line is stopped. When the second image reading table 43 confirms that the positional deviation of the temporarily fixed cover film 11 is within the allowable range, the cover film 丨丨 is integrally joined to the workpiece 31 of the FPC 30 by the hot leg machine 4 1 . 14 1376993 [0030] When the circuit of the FPC 30 is formed, as shown in FIG. 2, a target 32 of a 匮-shaped pattern is provided in advance on the workpiece 31 by a copper foil, corresponding to the target 32, in the cover film 丨The four turns of the crucible form a target 12 of circular punching. The target 12 forming the cover film 11 is slightly larger than the target 32 of the workpiece 31. When the workpiece 31 of the FPC 30 is attached to the cover film 丨1, in the case where there is no positional deviation and is aligned, as shown in FIG. 2(a), the center of the target 12 of the cover film 11 and the workpiece 3 are The center of the target 3 2 is identical, and the targets 12 and 32 of the two sides are concentric. [0031] In contrast, when the workpiece 3 1 of the FPC 30 and the cover film 1 1 are displaced from each other, As shown in Fig. 2(b), the center of the target 12 of the cover film 11 is offset from the center of the target 32 of the workpiece 31. The diameter of the targets 1 2, 32 is set to an appropriate size in advance. If the positional deviation exceeds the allowable range, the formation of the targets ^ 2, 32 coincides to clearly recognize the occurrence of the positional offset. [0032] At least the lower side hot plate 25A of the upper and lower side hot plates 26A, 25A is divided into a plurality of blocks. As shown in Fig. 3(a), for example, the planer is divided into a vertical row to a fifth row, and a horizontal block a block to a f block, and each block is formed to independently control the temperature of the hot plate. As will be described later, by controlling the temperature of the lower hot plate 25A by the control unit 50, the temperature of the lower hot plate 25A can be partially changed, and the size of the cover film 1 1 can be forcibly changed. [0033] As shown in FIG. 9(b), the dimensional change on the L side and the R side of the reel is not 15
1376993 • I 均，工件31會成爲梯形情況下，如圖3(b)所示，下側熱 板25A之L側之塊la〜1 f的溫度增高，R側之塊5a〜5f 的溫度變位量沿傾斜方向變小。因此，如圖4所示，覆蓋 薄膜1 1之L側之熱膨脹變得較R側大，可使覆蓋薄膜1 1 與呈梯形尺寸變化之工件3丨位置一致。 [0034] 藉由將上、下側熱板26A、2 5A则分成複數塊，予以溫 度控制，可相對於工件3 1之尺寸變化，強行變化覆蓋薄膜 11之尺寸，使位置對正。且在將上、下側熱板26A、25A 二者塊化情況下，較佳係下側熱板25A之劃分數較上側熱 板26A多。其因覆蓋薄膜丨1之熱膨脹係數較FPC 30大， 以致加大直接接合於覆蓋薄膜1丨之下側熱板25A之塊劃分 數。 [0035] 其次，對本發明1¾刷電路板之貼附方法加以說明。如 前面以圖1說明，裁成薄片狀之覆蓋薄膜11吸附固定於下 側熱板（載置頭）25A，朝FPC 30之下部位置移動。自卷筒 捲出之FPC 30藉第丨畫像讀取台42檢測工件31之尺寸變 化，將該工件3 1之尺寸資料送至控制機構50。 [0036] 圖5係於一工件3丨上佈瞪30個製品33之例子|其顯 示工件3 1之之尺寸變化如預期，L側與R側之之尺寸變化 相同的情形。設於工件3 1四隅之標靶32之縱向尺寸於左 右均爲尺寸D。將藉第丨窬像讀取台42檢測之工件3 1之 尺寸資料送至控制機構50，藉該控制機構50進行上、下 16 1376993 • · 側熱板26A ’ 25A之溫度控制。於工件3丨之左右尺寸變化 相同情況下|控制成上，下flllj熱板26Λ，25A之溫度分布亦 左右相同，使覆蓋薄膜丨丨與工件3丨之尺寸資料一致，將 其尺寸調整成左右相同。 [0037] 因此，暫時固定機構40可使設於工件31之四隅之圓 形圖案之標靶32與設於覆蓋薄膜1丨之圓形沖孔之標靶12 正確地一致，將覆蓋薄膜11暫時固定於FPC 30之工件31。 [0038] 接著，於第2畫像讀取台43拍攝工件31之標靶32 與覆蓋薄膜11之標靶丨2,根據二標靶之中心是否一致， 確認有無位置偏移。於二標靶有位置偏移情況下，朝控制 機構50反饋位置偏移资料，於此後皙時固定之際，修正 上、下側熱板26Α，25Α之溫度控制，俾可調整覆蓋薄膜 11之尺寸變化，正確地使位圆一致。迕萬一，二標靶之位 置偏移超過容許範圍情況下，發出餐報，時而停止生產線， 時而作爲劣品而去除。 [0039] 若於第2靈像讀取台43，二標靶之中心一致，即朝控 制機構50反饋無位置偏移的確認資料，同時將FPC 30送 至次一步驟，藉熱壓機4 1將覆蓋薄膜1 1正式接合於FPC 30 之工件31。.1376993 • I, when the workpiece 31 is trapezoidal, as shown in Fig. 3(b), the temperature of the blocks 1a to 1f on the L side of the lower hot plate 25A increases, and the temperature of the blocks 5a to 5f on the R side changes. The amount of bits becomes smaller in the oblique direction. Therefore, as shown in Fig. 4, the thermal expansion of the L side of the cover film 1 becomes larger than that of the R side, and the cover film 1 1 can be aligned with the position of the workpiece 3 呈 which has a trapezoidal size change. The upper and lower side hot plates 26A and 25A are divided into a plurality of blocks and temperature-controlled, and the size of the cover film 11 is forcibly changed with respect to the dimensional change of the workpiece 31 to align the position. Further, in the case where both the upper and lower hot plates 26A, 25A are formed, it is preferable that the number of divisions of the lower side hot plate 25A is larger than that of the upper side hot plate 26A. Since the thermal expansion coefficient of the cover film 丨1 is larger than that of the FPC 30, the number of divisions directly joined to the lower heat plate 25A of the cover film 1 。 is increased. [0035] Next, a method of attaching the brush board of the present invention will be described. As described above with reference to Fig. 1, the cover film 11 cut into a sheet shape is adsorbed and fixed to the lower side hot plate (mounting head) 25A, and moved toward the lower portion of the FPC 30. The FPC 30 that has been unwound from the reel detects the dimensional change of the workpiece 31 by the second image reading table 42, and sends the size information of the workpiece 31 to the control mechanism 50. [0036] FIG. 5 is an example of fabricating 30 articles 33 on a workpiece 3, which shows a case where the dimensional change of the workpiece 31 is as expected, and the dimensional changes of the L side and the R side are the same. The longitudinal dimension of the target 32 disposed on the workpiece 3 1 is the dimension D on the left and right. The size data of the workpiece 3 1 detected by the second image reading table 42 is sent to the control unit 50, and the control unit 50 performs temperature control of the upper and lower sides 16 1376993 • the side hot plates 26A' 25A. In the case where the left and right dimensional changes of the workpiece 3 are the same, the temperature distribution of the upper and lower flllj hot plates is 26 Λ, and the temperature distribution of the 25A is also the same, so that the size of the cover film 丨丨 and the workpiece 3 一致 are the same, and the size is adjusted to be left and right. the same. Therefore, the temporary fixing mechanism 40 can correctly match the target 32 of the circular pattern provided on the workpiece 31 with the target 12 provided in the circular punching of the cover film 1 , and temporarily cover the cover film 11 The workpiece 31 is fixed to the FPC 30. Then, the target 32 of the workpiece 31 and the target 丨2 of the cover film 11 are imaged by the second image reading table 43 to confirm whether or not there is a positional shift based on whether or not the centers of the two targets match. In the case where the two targets have a positional deviation, the positional deviation data is fed back to the control mechanism 50, and after the time is fixed, the temperature control of the upper and lower hot plates 26Α, 25Α is corrected, and the cover film 11 can be adjusted. Dimensional changes, correctly aligning the circle. In the unlikely event that the position of the two targets exceeds the allowable range, the meal will be issued and the production line will be stopped and sometimes removed as a defective product. [0039] If the center of the two targets is the same, that is, the center of the two targets is the same, that is, the confirmation information of the positional offset is fed back to the control unit 50, and the FPC 30 is sent to the next step, and the hot press 4 is used. 1 The cover film 11 is formally joined to the workpiece 31 of the FPC 30. .
[0040] 在此，對上、下側熱板26Α、25Α之溫度控制加以說明， 由於FPC 30與覆蓋薄膜1 1之熱膨脹係數不同，因此， 17 1376993 • « 若極端改變下側熱板25A與上側熱板26A、下側熱板25A 之溫度差，即會在1於電路莲板的FPC 30發生翹曲。因此， 爲了將FPC 30之翹曲納入基準內，FPC 30側之上側熱板 26A於70〜90°C，覆蓋薄膜Π側之下側熱板25A於40〜 7(TC的範圍內，進行熱板之各塊的溫度控制。 [0041] 若在此溫度範圍內，FPC30之每lOOmm長度之翹曲量 即可抑制在2mm以下。又，工件3 1之尺寸長度可遵循相對 於300關達到+ 0.07mm之尺寸變化。 [0042] 且，上述溫度範圍之設定雄於茬超過90°C，即有覆蓋 薄膜11之黏接劑會於暫時固定階段固化，此後在進行熱壓 4 1時|黏接力降低的問題，以及爲了使上側熱板26A之溫 度不傳至下側熱板25A，最大溫度差須到達50°C等理由。 [0043] ; 圖6顯示工件3 1之尺寸變化與預期相反，L側與R側 之尺寸變化不同的情形。設於工件3 1之四隅之標靶32之 縱向尺寸之右側爲尺寸D，左側較此略大，成爲尺寸D + a » 因此，圖5所說明左右相同溫度之分布控制即使例如針對 R側.，使工件3 1之標靶32與覆蓋薄膜丨1之標靶.1 2 —致， 仍針對L側，使工件3丨之標靶32與覆Ιί薄膜1 1之標靶 1 2大幅偏移* [0044] 於此情況下，可藉凼部分地改變下側熱板25A之溫 度，強行變化覆蓋薄膜丨丨之尺寸，使覆蓋薄膜11與各個 18 1376993 • t 製品33 —致。例如依圖3(b)所示，若下側熱板25A之L 側的塊la〜If之溫度增高，R側之塊5a〜5f·沿傾斜方向 減小溫度變位量，覆蓋菏膜丨丨之L側的熱膨脹即變得較R 側大。 [0045] * .因此，如圖7所示，可針對R側，使工件31之標靶 • 32與覆蓋薄膜11之標靶12 —致，同時針對L側，使工件 31之標靶32與覆蓋薄膜11之標靶12 —致，可將個別製 ® 品33與覆蓋薄膜1丨之尺寸的位置對正。 [0046] 即使是尺寸變化如此不均的工件3 1，藉由部分地改變 上，下側熱板26A、25A之溫度，強行變化覆蓋薄膜1丨之 .尺寸，仍可作爲製品來使用，可提高製品的生產率。 [0047] 且，本發明可往不饽離木發明之精神範圍內作種種改 變，而且，本發明當然涵蓋該改變內容。 [圖式簡單說明] [0048] [圖1 ( a)〜圖1 ( b )】係顯示本發明之印刷電路板之貼 附裝匱的說明圖。 [圖2 ( a )〜圖2 ( b )】係設於FPC之工件及覆蓋薄膜之 閘極之說明圖。 [圖3 ( a )〜圖3 ( b )]係下側熱板之說明_。 [圖4】係顯示覆蓋溥膜之熱膨脹差之說明圖。 19 1376993 [圖5】係顯示將製品佈局於工件上之一例子的說明圖。 【圖6]係顯示工件之L側及R側之尺寸變化不同之情 形的說明圖。 [圖7】係顯示對應工件改變覆蓋薄膜尺寸之結果之說 明圖。 [圓8(a)〜圖8(b)]係顯示習知印刷電路板之貼附裝 置的說明圖。 [圖9(a)〜圖9(b)]係習知貼附工件與覆蓋薄膜之步 驟之說明圖。 [主要元件符號說明] 10 (長條狀）覆蓋薄膜 11 (薄片狀）覆蓋薄膜 12 (覆蓋薄膜之）標靶 21. 搬送夾持辦 22 固定夾持器 23 裁斷機構 24 回收箱 25 下側熱板（載丨置頭） 26 上側熱板 25Α 下側熱板（戦匬底板） 26Α 上側熱板 30 可撓印刷電路板（FPC) 31 工件 20[0040] Here, the temperature control of the upper and lower side hot plates 26Α, 25Α is explained. Since the thermal expansion coefficients of the FPC 30 and the cover film 11 are different, 17 1376993 • « If the lower side hot plate 25A is extremely changed The temperature difference between the upper side hot plate 26A and the lower side hot plate 25A is warped at the FPC 30 of the circuit board. Therefore, in order to incorporate the warp of the FPC 30 into the reference, the upper side hot plate 26A of the FPC 30 side is at 70 to 90 ° C, and the hot plate 25A of the lower side of the film cover side is heated within the range of 40 to 7 (TC). Temperature control of each block of the board. [0041] If the temperature of the FPC30 is less than 2mm, the length of the workpiece can be reduced to less than 2mm. The size of the above-mentioned temperature range is set to be more than 90 ° C, that is, the adhesive having the cover film 11 is solidified in a temporary fixing stage, and thereafter, when hot pressing 4 1 | The problem of the relay reduction, and the reason why the temperature of the upper side hot plate 26A is not transmitted to the lower side hot plate 25A, the maximum temperature difference has to reach 50 ° C, etc. [0043] Fig. 6 shows that the dimensional change of the workpiece 31 is contrary to expectations. The case where the size changes of the L side and the R side are different. The right side of the vertical dimension of the target 32 provided on the workpiece 3 1 is the dimension D, and the left side is slightly larger than this to become the size D + a » Therefore, Fig. 5 Explain that the distribution control of the same temperature on the left and right makes the mark of the workpiece 3 1 even if, for example, for the R side. 32 and the target of the cover film 丨1. 1 2 , still for the L side, the target 32 of the workpiece 3 与 is significantly offset from the target 1 2 of the film 1 1 [0044] In this case By partially changing the temperature of the lower side hot plate 25A, forcibly changing the size of the cover film to make the cover film 11 coincide with each of the 18 1376993 • t products 33. For example, as shown in Fig. 3(b), The temperature of the blocks 1a to 1f on the L side of the lower hot plate 25A is increased, and the blocks 5a to 5f on the R side are reduced in temperature direction in the oblique direction, and the thermal expansion of the L side of the film is improved. [0045] Therefore, as shown in FIG. 7, the target 32 of the workpiece 31 can be made to coincide with the target 12 of the cover film 11 for the R side, while the workpiece 31 is marked for the L side. The target 32 is aligned with the target 12 of the cover film 11, and the position of the individual product 33 and the size of the cover film 1 can be aligned. [0046] Even the workpiece 3 1, which is so uneven in size, is partially The ground temperature is changed, and the temperature of the lower side hot plates 26A, 25A is forcibly changed to cover the film. The size can still be used as a product, and the productivity of the product can be improved. Further, the present invention can be variously changed without departing from the spirit of the invention, and the present invention of course covers the modification. [Simplified illustration] [0048] [Fig. 1 (a) to Fig. 1 (b) is an explanatory view showing the attachment of the printed circuit board of the present invention. [Fig. 2 (a) to Fig. 2 (b)] are explanatory views of the gate of the FPC and the gate of the cover film. [Fig. 3 (a) to Fig. 3 (b)] is a description of the lower side hot plate. Fig. 4 is an explanatory view showing a difference in thermal expansion covering the ruthenium film. 19 1376993 [Fig. 5] is an explanatory view showing an example of arranging an article on a workpiece. Fig. 6 is an explanatory view showing a situation in which the dimensional changes of the L side and the R side of the workpiece are different. Fig. 7 is an explanatory view showing the result of changing the size of the cover film corresponding to the workpiece. [Circles 8 (a) to 8 (b)] are explanatory views showing attachment means of a conventional printed circuit board. [Fig. 9 (a) to Fig. 9 (b)] are explanatory views of a conventional step of attaching a workpiece and a cover film. [Main component symbol description] 10 (long strip) cover film 11 (sheet-like) cover film 12 (covering film) target 21. Transfer gripper 22 Fixing gripper 23 Cutting mechanism 24 Recycling box 25 Lower side heat Plate (loading head) 26 Upper side hot plate 25Α Lower side hot plate (戦匬 bottom plate) 26Α Upper side hot plate 30 Flexible printed circuit board (FPC) 31 Workpiece 20
1376993 Λ I 32 (工件）之標靶 33 製品 40 暫時固定機構 41 熱壓機 42 第1畫像讀収台 43 第2畫像讀収台 50 .控制機構1376993 Λ I 32 (workpiece) target 33 Product 40 Temporary fixing mechanism 41 Hot press 42 First image reading and receiving table 43 Second image reading and receiving table 50. Control mechanism
21twenty one