CN101951731B - Improved heating platform for glue curing - Google Patents
Improved heating platform for glue curing Download PDFInfo
- Publication number
- CN101951731B CN101951731B CN2010105097522A CN201010509752A CN101951731B CN 101951731 B CN101951731 B CN 101951731B CN 2010105097522 A CN2010105097522 A CN 2010105097522A CN 201010509752 A CN201010509752 A CN 201010509752A CN 101951731 B CN101951731 B CN 101951731B
- Authority
- CN
- China
- Prior art keywords
- heating
- glue curing
- plate
- platform
- permeable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a heating platform for glue curing, which comprises a heating plate, a heating table, a vacuum pumping port, a heating pipe and a ventilated ceramic plate, wherein the ventilated ceramic plate is tightly covered on the vacuum pumping port on the surface of the heating table, many honeycomb pores are formed in the ventilated ceramic plate, and air can pass through the pores when the air is pumped through the vacuum pumping port. The ventilated ceramic plate is covered on the surface of the heating table of the heating platform for glue curing, a flexible circuit board product to be processed is heated through the ventilated ceramic plate, meanwhile, many honeycomb pores are formed in the ventilated ceramic plate, and the air can pass through the pores when the air is pumped through the vacuum pumping port, so the heating platform can provide enough adsorptive power for adsorbing the product to be processed and can prevent deformation and poor appearance of the product to be processed in the traditional heating method.
Description
Technical field
The present invention relates to a kind of heating platform that is used for glue curing, particularly relate to and a kind of the improved heating platform that is used for glue curing is carried out on heating station surface on the heating platform.
Background technology
In the processing and making process of flexible circuitry panel products, FPC need be heated under a very smooth condition, thereby makes the glue curing on the FPC.In heating process, the evenness of FPC directly has influence on the quality (FPC after the quality requirements glue curing is very smooth) of product.For the heating that FPC is flattened, in traditional heating means, with reference to Fig. 1, Fig. 2; We are provided with the heating station 13 that uses brass to do on the working face of heating plate 11; Heating station 13 surfaces are smooth as far as possible, and on heating station 13, have aperture 14 or groove, and aperture 14 communicates with through hole 15; Through hole 15 communicates with vacuum-pumping tube, vacuumizes through vacuum-pumping tube.During work, vacuumize after being placed on the heating station 13 together with its support plate FPC, FPC is adsorbed on the surface of brass heating station 13, heat through 12 pairs of heating stations 13 of heating tube simultaneously.But, when taking above-mentioned traditional heating means, after FPC is placed on the heating station 13 together with its support plate; Have only several aperture 14 that it is adsorbed; Though support plate is arranged as support, also only played fixation, there is not the zone of absorption also to have the situation of distortion.In addition,,, in the process of being heating and curing, can stay the vestige of aperture 14 on the FPC, and can not eliminate, directly cause product appearance bad though its absorption dynamics can be big if the method for taking to increase aperture 14 bores increases throughput.
In sum, when taking above-mentioned traditional heating means that the flexible circuitry panel products is heated, the problem of existence is, or because of the absorption dynamics causes the distortion of flexible circuitry panel products inadequately, or spend the vestige that causes staying aperture 14 greatly because of absorption affinity.
Summary of the invention
Technical problem to be solved by this invention is; A kind of heating platform that is used for glue curing is provided; Heating station on it can provide enough absorption dynamics to adsorb processed product, can prevent processed product distortion and bad order that the traditional heating method is caused again.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: a kind of heating platform that is used for glue curing comprises: heating plate; Heating station, it is arranged on the working face of heating plate; Vacuum orifice is arranged at the surface of heating station, and it is through heating plate inside and exterior; Heating tube, it is arranged at the inside of heating plate, and heating station is heated; In addition, also comprise: the permeable-gas ceramics plate, it covers on the vacuum orifice on heating station surface closely, contains a lot of nest honeybee shape apertures in the permeable-gas ceramics plate, and air can pass from aperture when bleeding through vacuum orifice.
The described heating station that is used for the heating platform of glue curing adopts brass material to process.
Permeable-gas ceramics plate on the heating station of the described heating platform that is used for glue curing is a rectangle.
Around the permeable-gas ceramics plate on the heating station of the described heating platform that is used for glue curing with the high-temperature plastic water seal firmly.
The surface of the heating station of the described heating platform that is used for glue curing is provided with a said vacuum orifice at least.
Advantage of the present invention is; Because the heating station surface coverage of the heating platform that is used for glue curing involved in the present invention has the permeable-gas ceramics plate; Treating processing flexibility wiring board product through the permeable-gas ceramics plate heats; Simultaneously, contain a lot of nest honeybee shape apertures in the permeable-gas ceramics plate, air can pass from aperture when bleeding through vacuum orifice; Reach the absorption dynamics that can provide enough and adsorb processed product, can prevent processed product distortion and bad order that the traditional heating method is caused again.
Description of drawings
Fig. 1 is the overall structure sketch map of traditional heating platform that is used for glue curing.
Fig. 2 is the upward view of Fig. 1.
Fig. 3 is used for the overall structure sketch map of the heating platform of glue curing for the present invention.
Fig. 4 is the right view of Fig. 3.
Fig. 5 is the upward view of Fig. 3.
Fig. 6 is used for the structure chart of permeable-gas ceramics plate of the heating platform of glue curing for the present invention.
Embodiment
For further disclosing technical scheme of the present invention, be described with reference to the accompanying drawings execution mode of the present invention now.
Set forth structure and the correlation that the present invention is used for the heating platform of glue curing for following with reference to Fig. 3, Fig. 4, Fig. 5, Fig. 6.
A kind of heating platform that is used for glue curing comprises: heating plate 11; Heating station 13, it is arranged on the working face of heating plate 11, generally adopts brass material to process; Vacuum orifice 16 is arranged at the surface of heating station 13, and it is through heating plate 11 inside and exterior; Heating tube 12, it is arranged at the inside of heating plate 11, and heating station 13 is heated; In addition, also comprise: permeable-gas ceramics plate 17, it covers on the vacuum orifice 16 on heating station 13 surfaces closely, contains a lot of nest honeybee shape apertures in the permeable-gas ceramics plate 17, and air can pass from aperture when bleeding through vacuum orifice 16.Above-mentioned permeable-gas ceramics plate 17 can be processed rectangle but be not limited to rectangle, and is as shown in Figure 6, also need use the high-temperature plastic water seal to live around the ABCD of permeable-gas ceramics plate 17.
The surface of above-mentioned heating station 13 is provided with a said vacuum orifice 16 at least.
Explain that below in conjunction with Fig. 3, Fig. 4, Fig. 5, Fig. 6 the present invention is used for the course of action of the heating platform of glue curing.
During work; Be placed on FPC on the permeable-gas ceramics plate 17 of heating station 13 together with its support plate; Because be covered with pore on the whole permeable-gas ceramics plate 17, and the diameter of pore is very little, live with the high-temperature plastic water seal around the ABCD of permeable-gas ceramics plate 17 in addition; So when bleeding through vacuum orifice 16, whole FPC is by very smooth being adsorbed on the permeable-gas ceramics plate 17.Meanwhile, heat through 12 pairs of heating stations 13 of heating tube, permeable-gas ceramics plate 17 receives the heat conduction of bottom brass heating station 13, and heating is solidified glue under the very smooth situation of FPC to FPC.Reach the absorption dynamics that can provide enough and adsorb processed product, can prevent processed product distortion and bad order that the traditional heating method is caused again.
More than, basic design of the present invention and basic principle have been set forth through introduction to listed execution mode.But the present invention never is limited to above-mentioned listed execution mode, and every equivalent variations, improvement and deliberately of inferior quality behavior of doing based on technical scheme of the present invention of change all should belong to protection scope of the present invention.
Claims (5)
1. a heating platform that is used for glue curing comprises: heating plate (11); Heating station (13), it is arranged on the working face of said heating plate (11); Vacuum orifice (16), it is arranged at the surface of said heating station (13), through the inside and the exterior of said heating plate (11); Heating tube (12), it is arranged at the inside of said heating plate (11), and said heating station (13) is heated; It is characterized in that; Also comprise: permeable-gas ceramics plate (17); It covers on the vacuum orifice (16) on said heating station (13) surface closely, contains a lot of nest honeybee shape apertures in the permeable-gas ceramics plate (17), through said vacuum orifice (16) when bleeding air can from aperture, pass.
2. the heating platform that is used for glue curing according to claim 1 is characterized in that, said heating station (13) adopts brass material to process.
3. the heating platform that is used for glue curing according to claim 1 and 2 is characterized in that, said permeable-gas ceramics plate (17) is a rectangle.
4. the heating platform that is used for glue curing according to claim 3 is characterized in that, lives with the high-temperature plastic water seal around the said permeable-gas ceramics plate (17).
5. the heating platform that is used for glue curing according to claim 1 is characterized in that, the surface of heating station (13) is provided with a said vacuum orifice (16) at least.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105097522A CN101951731B (en) | 2010-10-18 | 2010-10-18 | Improved heating platform for glue curing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105097522A CN101951731B (en) | 2010-10-18 | 2010-10-18 | Improved heating platform for glue curing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101951731A CN101951731A (en) | 2011-01-19 |
| CN101951731B true CN101951731B (en) | 2012-04-18 |
Family
ID=43455040
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010105097522A Expired - Fee Related CN101951731B (en) | 2010-10-18 | 2010-10-18 | Improved heating platform for glue curing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101951731B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102381053A (en) * | 2011-10-17 | 2012-03-21 | 江苏锐毕利实业有限公司 | Rigid printed circuit board printing vacuum clamping method |
| CN103813644B (en) * | 2012-10-31 | 2016-07-06 | 四川虹视显示技术有限公司 | OLED flexible PCB vacuum absorption device |
| CN103464337B (en) * | 2013-08-13 | 2016-02-24 | 昆山龙腾光电有限公司 | Point glue solidify device |
| CN105277584B (en) * | 2014-06-03 | 2018-07-10 | 延锋彼欧汽车外饰系统有限公司 | A kind of glue curing experimental facilities |
| CN111537371A (en) * | 2020-06-11 | 2020-08-14 | 深圳市摩码科技有限公司 | Method for testing hardness of solvent-based and water-based pressure-sensitive adhesive layers |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4700474A (en) * | 1986-11-26 | 1987-10-20 | Multitek Corporation | Apparatus and method for temporarily sealing holes in printed circuit boards |
| JP5021384B2 (en) * | 2007-07-10 | 2012-09-05 | 日本メクトロン株式会社 | Printed wiring board sticking device and sticking method |
| CN201115323Y (en) * | 2007-07-31 | 2008-09-10 | 比亚迪股份有限公司 | A location device with pasted FPC board |
| CN201839530U (en) * | 2010-10-18 | 2011-05-18 | 卓盈微电子（昆山）有限公司 | Improved heating platform for glue curing |
-
2010
- 2010-10-18 CN CN2010105097522A patent/CN101951731B/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN101951731A (en) | 2011-01-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101951731B (en) | Improved heating platform for glue curing | |
| CN102164719B (en) | Suction sheet | |
| CN104080300B (en) | A kind of moistureproof communication outdoor cabinet | |
| WO2011080850A1 (en) | Device and method for thermoforming by hot-plate heating | |
| CN109366656B (en) | Control method for density peak shape of single-side compressed wood | |
| CN102581911A (en) | Double-layer solid wood heating floor production method | |
| CN201839530U (en) | Improved heating platform for glue curing | |
| ZA200903608B (en) | Method for functionalising a textile substrate by cross-linking bonding under a ionising radiation | |
| CN205474047U (en) | Feeding mechanical arm on circuit board adsorption equipment and circuit board | |
| CN102079158B (en) | Circuit board film-adhering method | |
| CN204853176U (en) | LED lamp improves structure | |
| CN202085323U (en) | Energy-saving heating device | |
| CN102381053A (en) | Rigid printed circuit board printing vacuum clamping method | |
| CN105397878A (en) | Splicing and drying integration device for integrated boards | |
| CN106995283A (en) | A kind of hollow insulating glass | |
| CN209334954U (en) | A kind of radium-shine holes drilled through jig | |
| CN204119657U (en) | A kind of FPC plate being used in lamination coating | |
| CN204810690U (en) | Circuit plate voltage stay knot that inlayer has mosaic constructs | |
| CN207660219U (en) | One kind having heat preservation moistureproof Combined decorative board | |
| CN202242179U (en) | Ventilated anti-sticking cloth | |
| CN202996901U (en) | LED base packaged by directly dispensing on PCB surface | |
| CN215848720U (en) | Artificial board purification treatment production system | |
| CN204475740U (en) | A kind of wall cloth that there is suction-operated and can reuse | |
| CN102444031A (en) | Teflon glass fiber sheet demoulding cloth | |
| CN205328075U (en) | Blunt needle holder roller |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120418 Termination date: 20151018 |
|
| EXPY | Termination of patent right or utility model |