CN102381053A - Rigid printed circuit board printing vacuum clamping method - Google Patents
Rigid printed circuit board printing vacuum clamping method Download PDFInfo
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- CN102381053A CN102381053A CN2011103150064A CN201110315006A CN102381053A CN 102381053 A CN102381053 A CN 102381053A CN 2011103150064 A CN2011103150064 A CN 2011103150064A CN 201110315006 A CN201110315006 A CN 201110315006A CN 102381053 A CN102381053 A CN 102381053A
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- ceramic plate
- circuit board
- spray printing
- printed circuit
- rigid printed
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Abstract
The invention relates to a rigid printed circuit board printing vacuum clamping method. The method is characterized in that: a micro-pore ceramic plate is arranged on a jet-printing table surface; a bottom of the ceramic plate is connected with a ventilation pipeline; the ventilation pipeline is connected with an air blower; through ventilation of the air blower, orifices of the micro-pore ceramic plate on the jet-printing table surface generate a negative pressure adsorption effect; a micro-pore diameter of the micro-pore ceramic plate is 20-100 micron; a porosity of the whole micropores is 20-50%. In the invention, the micro-pore diameter of the ceramic plate on the jet-printing table is set to an appropriate size and the micropores are uniformly and equidistantly distributed as a proper distance. An adsorption effect of the ceramic plate to the circuit board is uniform and powerful. A vacuum clamping function of the rigid printed circuit board printing stable surface can be realized and the circuit board can not generate displacement during a moving process of the printing stable surface. And the vacuum adsorption effect of the printing stable surface can be guaranteed. A circuit board warping problem caused by adsorption deformation in the current equipment can be overcome.
Description
Technical field
The invention belongs to rigid printed circuit boards spray printing vacuum clamping method technical field.
Background technology
In the prior art, for plank is adsorbed on the work top, prevent that plank is subjected to displacement in the spray printing process during rigid printed circuit boards spray printing, below table top, vacuumize the formation negative pressure usually.This method is called the vacuum clamping method, specifically is the capillary ceramic plate that has certain porosity behind the sintering curing is installed on the spray printing table top, makes the aperture on the ceramic plate produce negative pressure through the air blast exhausting, thereby realizes the vacuum suction effect of spray printing table top.
But in esse problem is, very easily produces the absorption distortion when printing slim rigid circuit board again.
Summary of the invention
The object of the invention just provides a kind of new rigid printed circuit boards spray printing vacuum clamping method; Utilize this method not only can realize the vacuum clamping function of rigid printed circuit boards spray printing table top; Prevent that spray printing table top wiring board in motion process from producing displacement; Can also guarantee that the vacuum suction effect on the spray printing table top is evenly strong, overcome wiring board because the warpage issues that the absorption distortion produces.
The inventor of this patent is through scrutinizing discovery, and the distortion of circuit board is because the excessive and skewness of aperture design on the existing ceramic wafer that uses causes the vacuum suction dynamics on the spray printing table top inhomogeneous, is easy to generate the absorption distortion for thin plate.
Given this, for reaching above-mentioned purpose, the technical scheme that the present invention takes is following:
Rigid printed circuit boards spray printing vacuum clamping method; This method is on the spray printing table top, capillary ceramic plate to be set; Ceramic wafer the below be connected with air draft pipe, air draft pipe is connected with air blast, the exhausting through air blast makes the aperture of capillary ceramic plate on the spray printing table top produce the negative-pressure adsorption effect; Said micropore ceramics panel aperture is at 20～100 μ m.For thicker circuit board, select the capillary ceramic plate that porosity is big, the aperture is less more suitable.
Above-mentioned rigid printed circuit boards spray printing vacuum clamping method; Not only the pore size of ceramic wafer influences adsorption effect; And the distribution in aperture and the appropriate design of spacing also can influence the vacuum suction effect that produces on the spray printing table top; Therefore, preferable scheme is: the micropore behind the sintering curing on the ceramic wafer needs evenly to distribute, and micropore accounts for whole plate area 20～50% (being porosity).
The size of ceramic wafer below negative pressure also can produce certain influence to the circuit board distortion, and the inventor herein debugs through reality repeatedly, find negative pressure-45～-effect is more satisfactory during 90kPa.
Produce scratch for exempting to treat the spray printing wiring board, the ceramic plate light requirement is clean, and overlap or burr can not be arranged.Between air blast and air draft pipe, two three-way electromagnetic valves can also be installed, in order to switch according to vacuum clamping on the need of work control spray printing table top.
Beneficial effect of the present invention:
Inventor of the present invention is through research and repeatedly practise discovery; The aperture of ceramic wafer on the spray printing platform is set to suitable size; And when the equidistant even distribution of suitable distance; Then ceramic wafer is all strong to the adsorption effect of circuit board, not only can realize the vacuum clamping function of rigid printed circuit boards spray printing table top, prevents that spray printing table top wiring board in motion process from producing displacement; Can also guarantee the vacuum suction effect on the spray printing table top, overcome wiring board in the existing equipment because the warpage issues that the absorption distortion produces.
Further specify the specific embodiment of the present invention below in conjunction with accompanying drawing 1:
Description of drawings
Fig. 1 is a rigid printed circuit boards spray printing vacuum mounting and clamping system sketch map of the present invention
Description of reference numerals:
1, capillary ceramic plate 2, interval 31, first pipeline in spray printing table top below
32, second pipeline 4, two three-way electromagnetic valves 5, ring drums blower fan
6, spray printing platform upper plate 7, spray printing platform lower plate
The specific embodiment
As shown in Figure 1, rigid printed circuit boards spray printing vacuum clamping method of the present invention:
1) selecting the sintering curing back aperture is that 20～100 μ m, porosity are 20～50% capillary ceramic plate 1; Ceramic plate can not have overlap and burr simultaneously, produces scratch in order to avoid treat the spray printing wiring board.
After completing, above capillary ceramic plate is installed on the spray printing table top.
2) air draft pipe of ring drums blower fan and the following side space of work top are connected; The action of the exhausting of air blast will make the aperture of capillary ceramic plate on the work top produce negative pressure (45～-90kPa) suction-operated; The even distribution of micro-hole and the appropriate design of micropore spacing will make on the spray printing table top and to produce uniform vacuum suction effect, simultaneously not to wiring board plate face particularly thin plate produce damage.
3) two three-way electromagnetic valves are installed between ring drums blower fan and work top, in order to switch according to vacuum clamping on the need of work control spray printing table top.
Embodiment 1
Select that the sintering curing back aperture is that 60 μ m, porosity are 40%, the equally distributed capillary ceramic plate of micropore any direction on the ceramic wafer, install on the spray printing table top of rigid printed circuit boards equipment according to position shown in Figure 1.The workbench below is connected with first air draft pipe 31, and first air draft pipe, 31 other ends are connected with magnetic valve 4, and magnetic valve 4 is connected with second air draft pipe 32, and the other end of second air draft pipe 32 is connected with the ring drums blower fan.During work, ring drums blower fan exhausting make the following side space of work top form-50～-negative pressure of 60kPa.Circuit board be close to capillary ceramic plate do not have mobile, no buckling deformation etc.
Embodiment 2
Select that the sintering curing back aperture is that 20 μ m, porosity are 50%, the equally distributed capillary ceramic plate 1 of micropore any direction on the ceramic wafer, install on the spray printing table top of rigid printed circuit boards equipment according to position shown in Figure 1.The workbench below is connected with first air draft pipe 31, and first air draft pipe, 31 other ends are connected with magnetic valve 4, and magnetic valve 4 is connected with second air draft pipe 32, and the other end of second air draft pipe 32 is connected with the ring drums blower fan.During work, ring drums blower fan exhausting make workbench below form-80～-negative pressure of 90kPa.Circuit board be close to capillary ceramic plate do not have mobile, no buckling deformation.
Embodiment 3
Select that the sintering curing back aperture is that 80 μ m, porosity are 30%, the equally distributed capillary ceramic plate 1 of micropore any direction on the ceramic wafer, install on the spray printing table top of rigid printed circuit boards equipment according to position shown in Figure 1.The workbench below is connected with first air draft pipe 31, and first air draft pipe, 31 other ends are connected with magnetic valve 4, and magnetic valve 4 is connected with second air draft pipe 32, and the other end of second air draft pipe 32 is connected with the ring drums blower fan.During work, ring drums blower fan exhausting make workbench below form-50～-negative pressure of 60kPa.Circuit board be close to capillary ceramic plate do not have mobile, no buckling deformation.
The uneven drawback of vacuum clamping table top absorption dynamics before this present invention rigid printed circuit boards spray printing vacuum clamping method has effectively overcome can not produce damage to the plate face when having guaranteed that wiring board carried out effective clamping.
Claims (3)
1. rigid printed circuit boards spray printing vacuum clamping method; This method is on the spray printing table top, capillary ceramic plate to be set; Ceramic wafer the below be connected with air draft pipe; Air draft pipe is connected with air blast, makes the aperture generation negative-pressure adsorption effect of capillary ceramic plate on the spray printing table top through the exhausting of air blast; The micropore size of said capillary ceramic plate is at 20～100 μ m.
2. rigid printed circuit boards spray printing vacuum clamping method as claimed in claim 1, it is characterized in that: the micropore of ceramic wafer evenly distributes, and whole plate micropore porosity is 20～50%.
3. rigid printed circuit boards spray printing vacuum clamping method as claimed in claim 1 is characterized in that: ceramic wafer below negative pressure-45～-90kPa.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103150064A CN102381053A (en) | 2011-10-17 | 2011-10-17 | Rigid printed circuit board printing vacuum clamping method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103150064A CN102381053A (en) | 2011-10-17 | 2011-10-17 | Rigid printed circuit board printing vacuum clamping method |
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| Publication Number | Publication Date |
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| CN102381053A true CN102381053A (en) | 2012-03-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2011103150064A Pending CN102381053A (en) | 2011-10-17 | 2011-10-17 | Rigid printed circuit board printing vacuum clamping method |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102975149A (en) * | 2012-11-22 | 2013-03-20 | 浙江维涅斯装饰材料有限公司 | Adsorption plate for quality inspection of wallpaper |
| CN107053860A (en) * | 2016-09-05 | 2017-08-18 | 广东聚华印刷显示技术有限公司 | Inkjet-printing device and inkjet printing methods |
| CN109228690A (en) * | 2018-10-29 | 2019-01-18 | 嘉兴诚信达服饰有限公司 | A kind of digital decorating machine of Continuous maching feeding mechanism |
| CN110879909A (en) * | 2019-11-15 | 2020-03-13 | 江苏上达电子有限公司 | Design method of universal vacuum absorption plate |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US3763730A (en) * | 1972-01-27 | 1973-10-09 | O Ahlegian | Optical hole film punch |
| JPH065652A (en) * | 1992-06-18 | 1994-01-14 | Nec Corp | Wire bonding device |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102975149A (en) * | 2012-11-22 | 2013-03-20 | 浙江维涅斯装饰材料有限公司 | Adsorption plate for quality inspection of wallpaper |
| CN107053860A (en) * | 2016-09-05 | 2017-08-18 | 广东聚华印刷显示技术有限公司 | Inkjet-printing device and inkjet printing methods |
| CN107053860B (en) * | 2016-09-05 | 2019-02-01 | 广东聚华印刷显示技术有限公司 | Inkjet-printing device and inkjet printing methods |
| CN109228690A (en) * | 2018-10-29 | 2019-01-18 | 嘉兴诚信达服饰有限公司 | A kind of digital decorating machine of Continuous maching feeding mechanism |
| CN110879909A (en) * | 2019-11-15 | 2020-03-13 | 江苏上达电子有限公司 | Design method of universal vacuum absorption plate |
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| ASS | Succession or assignment of patent right |
Owner name: JIANGSU HI-PRINT TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: JIANGSU RUIBILI INDUSTRIAL CO., LTD. Effective date: 20121206 |
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| C41 | Transfer of patent application or patent right or utility model | ||
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Effective date of registration: 20121206 Address after: 224056 Yancheng City province high tech Industrial Zone, Phoenix South Road, No. 18, No. Applicant after: Jiangsu Hi-Print Technology Co., Ltd. Address before: 224056 Yancheng City province high tech Industrial Zone, Phoenix South Road, No. 18, No. Applicant before: Jiangsu Rabily Industry Co., Ltd. |
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Application publication date: 20120321 |