JP5021384B2 - Printed wiring board sticking device and sticking method - Google Patents

Description

  The present invention relates to a printed wiring board sticking apparatus and a sticking method, and more particularly to sticking a surface protective cover film on an inner layer of a flexible printed wiring board (hereinafter referred to as FPC) or a multilayer FPC.

  This type of printed wiring board is manufactured by forming a circuit on a long board material and then bonding a cover film cut into a sheet to the long board material. For example, FIG. 8 is an explanatory view showing a conventional printed wiring board pasting device, (a) is a plan view, and (b) is a side view from the direction of arrow C in (a). The long cover film 10 wound in a roll shape is pulled out to a predetermined length by a transport clamp 21 and a fixed clamp 22 and is cut into a sheet shape by a cutting mechanism 23. The cut cover film 11 is placed on a placement bed (lower heat plate described later) 25 and fixed by suction. The sheet-like cover film 11 is moved to the lower position of the FPC 30 unwound from the roll, as indicated by a two-dot chain line, while being adsorbed and fixed to the mounting bed 25. Reference numeral 24 denotes a collection box for the release film peeled off from the sheet-like cover film 11.

  A heating bed such as a heater is built in the mounting bed 25 to which the sheet-like cover film 11 is fixed by suction, and acts as the lower heating plate 25. On the other hand, a temporary bonding mechanism 40 is formed by disposing the upper hot plate 26 above the FPC 30 so as to face the lower hot plate 25, and an alignment mechanism (not shown) provided on the lower hot plate 25. ), The cover film 11 is aligned with the work 31 of the FPC 30, and then the lower hot plate 25 and the upper hot plate 26 are joined to temporarily fix the cover film 11. After temporarily fixing the cover film 11, the cover film 11 is bonded by the hot press 41.

  In general, it is known that when a cover film is bonded, an image of a positioning mark is read and the cover film is positioned and temporarily bonded to a substrate material that is adsorbed and fixed on a stage (for example, see Patent Document 1). .

  Here, since the long FPC repeats unwinding and winding from the roll for circuit formation or the like, a dimensional change may occur. In particular, in the etching process, a tension is applied to stretch the copper foil, so that the film tends to shrink when the tension is released thereafter. In general, the cut dimensions of the cover film are corrected based on experience values, but the FPC may shrink more than expected or, conversely, may not shrink as much as expected. In particular, the FPC undergoes dimensional changes depending on the roll start, roll end, or apparatus used between the rolls, resulting in misalignment when the cover film is bonded to the workpiece.

  FIG. 9 is an explanatory diagram for bonding the cover film 11 having the same shape as the rectangular work 31 formed on the long FPC 30. As shown in FIG. 9A, when the dimensional change between the L side and the R side of the roll is as expected, the cover film 11 can be bonded to the shape of the work 31 without causing a shift. . On the other hand, as shown in FIG. 9B, when the dimensional change between the L side and the R side of the roll is biased, the work 31 becomes trapezoidal and the rectangular cover film 11 is bonded. As a result, there will be a deviation from each other.

In response to the recent demand for higher density and miniaturization, the tolerance of positional deviation when bonding a cover film is becoming stricter, and a technique for bonding more accurately is demanded.
JP 2004-319688 A

  In the invention described in Patent Document 1, the cover film is positioned by image processing. However, when the FPC is stretched in one direction (one-sided contraction) in the vertical direction or the horizontal direction, it cannot be handled, and the cover film is displaced.

  Therefore, the present invention makes it possible to make the positional accuracy more accurate and prevent deviation when the cover film is bonded to the surface of the printed circuit board, even if the dimensional change of the printed circuit board is biased. Objective.

  The present invention has been proposed in order to achieve the above object, and the invention according to claim 1 is unwound from a roll so as to insulate and protect a printed circuit board comprising a circuit formed on an insulating base material. An apparatus for continuously laminating a cover film cut to a predetermined size on a long printed circuit board, and placing the cut cover film on the lower surface of the long printed circuit board A lower heat plate, and an upper heat plate placed above the elongated printed circuit substrate so as to face the lower heat plate, and position the workpiece and cover film of the printed circuit substrate. The temporary adhesive mechanism that temporarily fixes the upper and lower thermal plates together, the printed circuit board moved in the winding direction, and the cover film temporarily fixed to the printed circuit board Heat pre A first image reading stage for detecting a dimensional change of a workpiece by imaging a target provided in advance on a printed circuit board substrate before temporarily fixing the cover film. And a control mechanism for controlling the temperature of the lower hot plate and the upper hot plate based on the workpiece size data detected by the first image reading stage and correcting the dimensions of the cover film and the printed circuit board. Provided is a printed wiring board pasting device characterized in that it is provided.

  According to this configuration, before temporarily fixing the cover film, the first image reading stage captures an image of the target provided on the printed circuit board and detects a change in the dimension of the workpiece. When temporarily fixing the cover film, the control mechanism independently controls the temperature of the lower hot plate and the upper hot plate based on the detected dimensional change of the workpiece. Dimension correction is performed using thermal expansion, and the printed circuit board workpiece and the cover film are aligned.

  According to a second aspect of the present invention, at least the lower heat plate of the upper and lower heat plates is divided into a plurality of blocks so that the temperature can be controlled for each block, and the control mechanism includes the first image. 2. The printed wiring board according to claim 1, wherein the cover film is forcibly changed in size by partially changing the temperature of the hot plate based on a change in the size of the workpiece detected by a reading stage. A sticking device is provided.

  According to this configuration, based on the dimensional change of the workpiece detected by the first image reading stage, the control mechanism controls the temperature at least for each block of the lower heat plate to partially change the temperature of the heat plate. The cover film is forcibly changed in size by the difference in thermal expansion.

  According to a third aspect of the present invention, in the printed circuit base material, a target by circular punching is formed in advance on the cover film corresponding to the target at the four corners of the workpiece, The center of the cover film and the center of the target of the cover film are obtained by image processing, and the control mechanism is formed so as to perform temperature control of the hot plate so that both centers coincide with each other. A printed circuit board pasting device is provided.

  According to this configuration, the target of the circular pattern provided at the four corners of the workpiece of the printed circuit board and the center of the target formed by the circular punching provided on the cover film corresponding to the target are subjected to image processing. In the case where the centers of the two are displaced, the control mechanism controls the temperature of the hot plate and corrects the dimensions so that the centers of the two coincide.

  According to a fourth aspect of the present invention, there is provided a second image reading stage that, after temporarily fixing the cover film, images the target of the printed circuit board and the target of the cover film and confirms the presence or absence of mutual displacement. A printed wiring board pasting apparatus according to claim 1, 2 or 3, characterized by the above.

  According to this configuration, after temporarily fixing the cover film, the target of the printed circuit board and the target of the cover film are imaged at the second image reading stage, and whether or not the centers of both targets are coincident with each other Check for misalignment.

  According to the fifth aspect of the present invention, there is provided a cover film cut to a predetermined size on a long printed circuit substrate unwound from a roll in order to insulate and protect the printed circuit substrate formed of a circuit formed on the insulating base material. In a method of continuously laminating, a lower heat plate on which a target film provided in advance on the printed circuit board substrate is imaged to detect a dimensional change of the workpiece by image processing and a cut cover film is placed, The dimensions of the workpiece when the printed circuit board and the cover film are sandwiched and temporarily fixed by the upper heated board installed above the elongated printed circuit board so as to face the lower heated board According to the change, the temperature of the hot plate is partially changed to forcibly change the size of the cover film so that the positional deviation of the cover film with respect to the printed circuit board is eliminated. It provides a sticking method that the printed wiring board.

  According to this configuration, before temporarily fixing the cover film, the target provided on the printed circuit board is imaged to detect a dimensional change of the workpiece, and the temperature of the hot plate is determined based on the detected dimensional change of the workpiece. The cover film is aligned with the workpiece of the printed circuit board by forcibly changing the size of the cover film and changing the size of the cover film.

  According to the first aspect of the present invention, before temporarily fixing the cover film, the first image reading stage picks up an image of the target provided on the printed circuit board substrate to detect a dimensional change of the workpiece, and detects the detected workpiece. Since the control mechanism controls the temperature of the lower hot plate and the upper hot plate independently based on the dimensional change, the dimensional correction can be performed using the thermal expansion of both the printed circuit board and the cover film. It is possible to accurately align the workpiece of the printed circuit board and the cover film during temporary fixing.

  According to the second aspect of the present invention, at least the lower heat plate is divided into a plurality of blocks so that the temperature can be controlled for each block. In addition to the effects of the first aspect, the printed circuit board Even if there is a bias in the dimensional change of the material, the position of the printed circuit board work and the cover film can be more accurately aligned by forcibly changing the cover film by partially changing the temperature of the hot plate. In addition, it is possible to use even a printed circuit base material workpiece with a biased dimensional change as a product, and the yield of the product can be improved.

According to the third aspect of the present invention, the circular pattern target provided at the four corners of the workpiece of the printed circuit base material and the center of each target by circular punching provided on the cover film corresponding to the target are imaged. Since the size correction is performed so that both centers coincide with each other, in addition to the effect of the invention of claim 1 or 2, the alignment of the work of the printed circuit board and the cover film can be accurately and easily performed. It can be carried out.

  Since the invention according to claim 4 confirms whether or not the target of the work of the printed circuit base material and the cover film is misaligned at the second image reading stage after temporarily fixing the cover film. In addition to the effects of the invention described in 1, 2 or 3, in the unlikely event that the misalignment between the printed circuit board substrate and the cover film exceeds the allowable range, an alarm is issued to stop the line or It is possible to feed back to the temperature control program of the hot plate, and it is possible to suppress the problem of temporary fixing.

  According to the fifth aspect of the present invention, before temporarily fixing the cover film, a target provided on the printed circuit board is imaged to detect a dimensional change of the workpiece, and based on the detected dimensional change of the workpiece, Since the cover film is forcibly changed in size by partially changing the temperature, it is possible to accurately and easily align the workpiece of the printed circuit board and the cover film during temporary fixing. Further, even a printed circuit board workpiece having a biased dimensional change can be used as a product, and the yield of the product can be improved.

DESCRIPTION OF THE PREFERRED EMBODIMENTS A printed wiring board sticking apparatus and sticking method according to the present invention will be described below with reference to preferred embodiments. In order to achieve the purpose of making the positional accuracy more accurate and preventing deviation even when the dimensional change of the printed circuit board is biased when the cover film is bonded to the surface of the printed circuit board ,
In order to insulate and protect a printed circuit board made of a circuit formed on an insulating base material, the present invention continuously applies a cover film cut to a predetermined size to a long printed circuit board unwound from a roll. An apparatus for combining, a lower heat plate placed on the lower surface of the long printed circuit board by placing the cut cover film, and the long heat plate facing the lower heat plate A temporary bonding mechanism comprising an upper thermal plate installed above the printed circuit board base material, and aligning a workpiece and a cover film of the printed circuit base material and temporarily fixing them with the lower thermal plate and the upper thermal plate; In the pasting device for a printed wiring board composed of the printed circuit board moved in the winding direction and a heat press for crimping the cover film temporarily fixed to the printed circuit board,
Before temporarily fixing the cover film, a first image reading stage that detects a dimensional change of the workpiece by imaging a target provided in advance on a printed circuit base material, and a workpiece detected by the first image reading stage This was realized by providing a control mechanism for controlling the temperature of the lower hot plate and the upper hot plate based on the dimension data and correcting the dimensions of the cover film and the printed circuit board.

  1A and 1B are explanatory views showing a printed wiring board pasting apparatus according to the present invention, in which FIG. 1A is a plan view and FIG. 1B is a side view from the direction of arrow A in FIG. The long cover film 10 wound in a roll shape is pulled out to a predetermined length by a transport clamp 21 and a fixed clamp 22 and is cut into a sheet shape by a cutting mechanism 23. The cover film 11 cut into a sheet shape is placed on a placement bed (lower heat plate described later) 25A and fixed by suction. The sheet-like cover film 11 is moved to the lower position of the FPC 30 unwound from the roll, as indicated by a two-dot chain line, while being adsorbed and fixed to the mounting bed 25A. Reference numeral 24 denotes a collection box for the release film peeled off from the sheet-like cover film 11.

As will be described later, the mounting bed 25A incorporates a heating element such as a heater and acts as the lower heat plate 25A. Further, an upper heat plate 26A with a built-in heater is disposed above the FPC 30 so as to face the lower heat plate 25A, and a temporary bonding mechanism 40 formed from the lower heat plate 25A and the upper heat plate 26A. Thus, the cover film 11 is temporarily fixed to the work 31 of the FPC 30.

  Here, a first image reading stage 42 is provided at a pre-process position of the temporary bonding mechanism 40 in the conveyance path of the FPC 30 unwound from the roll. In the first image reading stage 42, a target provided in advance in the FPC 30 is imaged, and a dimensional change from the standard dimension of the work 31 is detected. The dimension data of the workpiece 31 detected by the first image reading stage 42 is sent to the control mechanism 50. Based on this data, the control mechanism 50 detects the temperatures of the lower hot plate 25A and the upper hot plate 26A as will be described later. To correct the dimensions of the cover film 11 and the FPC 30.

  A second image reading stage 43 is provided at a post-process position of the temporary bonding mechanism 40. In the second image reading stage 43, the target of the FPC 30 and the target of the cover film 11 temporarily fixed are imaged, and the presence or absence of mutual positional deviation is confirmed. The positional deviation data detected by the second image reading stage 43 is sent to the control mechanism 50. Based on this data, as will be described later, it is fed back to the temperature control program for the upper and lower hot plates 26A, 25A, or the line Or stop. When the second image reading stage 43 confirms that the temporarily displaced cover film 11 is displaced within the allowable range, the cover film 11 is permanently bonded to the work 31 of the FPC 30 by the hot press 41.

  In the present invention, when the circuit of the FPC 30 is formed, as shown in FIG. 2, a circular pattern target 32 is provided in advance at the four corners of the work 31 with copper foil. A target 12 by circular punching is formed at a corner. The diameter of the target 12 of the cover film 11 is slightly larger than the diameter of the target 32 of the work 31. When the work 31 of the FPC 30 and the cover film 11 are bonded together, if there is no positional deviation and is in the correct state, the center of the target 12 of the cover film 11 and the center of the target 32 of the work 31 are shown in FIG. Match, and both targets 12 and 32 are concentric circles.

  On the other hand, when the position shift occurs between the work 31 of the FPC 30 and the cover film 11, the center of the target 12 of the cover film 11 and the center of the target 32 of the work 31 are located as shown in FIG. It will shift. If the diameters of the targets 12 and 32 are appropriately set in advance, and if the positional deviation exceeds the allowable range, and if both the targets 12 and 32 are formed so as to overlap, the occurrence of the positional deviation is clearly recognized. be able to.

  Of the upper and lower hot plates 26A, 25A, at least the lower hot plate 25A is divided into a plurality of blocks. As shown in FIG. 3A, for example, the vertical column is divided into the first column to the fifth column and the horizontal column is divided into a block to f block, and the temperature of the hot plate can be controlled independently for each block. Has been. As will be described later, the control mechanism 50 performs different temperature control for each block of the lower hot plate 25A, thereby partially changing the temperature of the lower hot plate 25A and forcibly changing the dimensions of the cover film 11. be able to.

  As shown in FIG. 9B, when there is a deviation in the dimensional change between the L side and the R side of the roll and the work 31 has a trapezoidal shape, as shown in FIG. The temperature of the L-side blocks 1a to 1f of the lower hot plate 25A is increased, and the R-side blocks 5a to 5f decrease the temperature displacement in an oblique direction. Therefore, as shown in FIG. 4, the thermal expansion on the L side of the cover film 11 is larger than that on the R side, and the cover film 11 can be aligned with the work 31 whose dimensions have been changed to a trapezoidal shape.

Thus, by dividing the upper and lower hot plates 26A and 25A into a plurality of blocks and controlling the temperature, the cover film 11 can be forcibly changed in size and aligned with respect to the change in size of the work 31. It becomes. When both the upper and lower hot plates 26A and 25A are blocked, it is desirable to increase the number of divisions of the lower hot plate 25A rather than the upper hot plate 26A. This is because the thermal expansion coefficient of the cover film 11 is larger than that of the FPC 30, so that the number of divided blocks of the lower hot plate 25A that is in direct contact with the cover film 11 is increased.

  Next, a method for attaching a printed wiring board according to the present invention will be described. As described above with reference to FIG. 1, the cover film 11 cut into a sheet shape is adsorbed and fixed to the lower heat plate (mounting bed) 25 </ b> A and moved to a lower position of the FPC 30. The FPC 30 unwound from the roll is detected by the first image reading stage 42 for the change in the dimension of the workpiece 31, and the dimension data of the workpiece 31 is sent to the control mechanism 50.

  FIG. 5 shows an example in which 30 products 33 are laid out on one workpiece 31. The dimensional change of the workpiece 31 is as expected, and the dimensional change on the L side and the R side is the same. The vertical dimension of the target 32 provided at the four corners of the work 31 is the dimension D on both the left and right sides. The dimension data of the workpiece 31 detected by the first image reading stage 42 is sent to the control mechanism 50, and the temperature of the upper and lower hot plates 26A, 25A is controlled by the control mechanism 50. When the left and right dimensional changes of the workpiece 31 are the same, the upper and lower hot plates 26A and 25A are also controlled to have the same temperature distribution on the left and right, and the cover film 11 is dimensioned to the same left and right according to the dimension data of the workpiece 31 Let them adjust.

  Therefore, in the temporary fixing mechanism 40, the circular pattern target 32 provided at the four corners of the work 31 and the target 12 by the circular punching provided on the cover film 11 exactly match, and the work 31 of the FPC 30 is covered with the work 31. The film 11 can be temporarily fixed.

  Subsequently, in the second image reading stage 43, the target 32 of the work 31 and the target 12 of the cover film 11 are imaged, and whether or not there is a positional shift is confirmed based on whether or not the centers of both the targets coincide. When both targets are misaligned, the misalignment data is fed back to the control mechanism 50, and the temperature control of the upper and lower hot plates 26A and 25A is corrected when temporarily fixed later. To adjust the position accurately. In the unlikely event that both target positions are out of tolerance, an alarm is issued to stop the line or remove it as a defective product.

  If the centers of the two targets coincide with each other in the second image reading stage 43, confirmation data without misalignment is fed back to the control mechanism 50, and the FPC 30 is sent to the next process. The film 11 is permanently bonded to the work 31 of the FPC 30.

  Here, if temperature control of the upper and lower hot plates 26A and 25A is described, since the thermal expansion coefficient is different between the FPC 30 and the cover film 11, if the temperature difference between the lower hot plate 25A and the upper hot plate 26A is extremely changed. Warpage occurs in the FPC 30, which is a circuit substrate. Therefore, in order to keep the warpage of the FPC 30 within the standard, the upper hot plate 26A on the FPC 30 side is in the range of 70 to 90 ° C, and the lower hot plate 25A on the cover film 11 side is in the range of 40 to 70 ° C. Perform block temperature control.

  Within this temperature range, the warpage amount per 100 mm of the length of the FPC 30 can be suppressed to 2 mm or less. Moreover, the size length of the work 31 can follow the dimensional change up to +0.07 mm with respect to 300 mm.

In addition, when the setting of the temperature range mentioned above exceeds 90 degreeC, the adhesive agent of the cover film 11 will solidify in the stage of temporary fix | stop, and adhesive force will fall when the hot press 41 is performed after that. This is because there is a problem, and the maximum temperature difference needs to be up to 50 ° C. so that the temperature of the upper hot plate 26A is not transmitted to the lower hot plate 25A.

  FIG. 6 shows a case where the dimensional change of the work 31 is not expected and the dimensional change on the L side and the R side is different. The vertical dimension of the target 32 provided at the four corners of the work 31 is the dimension D on the right side and the dimension D + α slightly larger on the left side. Therefore, in the same left and right temperature distribution control explained in FIG. 5, even if the target 32 of the work 31 and the target 12 of the cover film 11 are matched on the R side, the target 32 of the work 31 is on the L side. The target 12 of the cover film 11 is greatly displaced.

  In this case, the cover film 11 can be matched to the individual products 33 by partially changing the temperature of the lower hot plate 25 </ b> A and forcibly changing the dimensions of the cover film 11. For example, as shown in FIG. 3B, the temperature of the L-side blocks 1a to 1f of the lower heat plate 25A is increased, and the R-side blocks 5a to 5f are decreased in the amount of temperature displacement in an oblique direction. If it goes, thermal expansion on the L side of the cover film 11 becomes larger than that on the R side.

  Therefore, as shown in FIG. 7, the target 32 of the work 31 and the target 12 of the cover film 11 are matched on the R side, and the target 32 of the work 31 and the target 12 of the cover film 11 are also matched on the L side. And the dimensions of the respective product 33 and the cover film 11 can be aligned.

  As described above, even if the work 31 is uneven in dimensional change, it can be used as a product by forcibly changing the temperature of the upper and lower hot plates 26A and 25A and forcibly changing the size of the cover film 11. And the yield of products can be improved.

  It should be noted that the present invention can be variously modified without departing from the spirit of the present invention, and the present invention naturally extends to the modified ones.

Explanatory drawing which shows the sticking apparatus of the printed wiring board which concerns on this invention. Explanatory drawing of the target provided in the workpiece | work and cover film of FPC. Explanatory drawing of a lower thermal plate. Explanatory drawing which shows the difference of the thermal expansion of a cover film. Explanatory drawing which shows an example which laid out the product on the workpiece | work. Explanatory drawing which shows the case where the dimensional change of the L side and R side of a workpiece | work differs. Explanatory drawing which shows the result of having changed the dimension of the cover film corresponding to the workpiece | work. Explanatory drawing which shows the pasting apparatus of the conventional printed wiring board. Explanatory drawing of the process of bonding the conventional workpiece | work and a cover film.

Explanation of symbols

10 (long) cover film 11 (sheet-like) cover film 12 (cover film) target 25A Lower heat plate (mounting bed)
26A Upper heat plate 30 Flexible printed circuit board (FPC)
31 Work 32 Target (work) 33 Product 40 Temporary fixing mechanism 41 Heat press 42 First image reading stage 43 Second image reading stage 50 Control mechanism

Claims (5)

In order to insulate and protect a printed circuit board composed of circuits formed on an insulating base material, it is an apparatus that continuously bonds a cover film cut to a predetermined size onto a long printed circuit board unwound from a roll. And
A lower heat plate placed on the lower surface of the long printed circuit board with the cut cover film placed thereon, and an upper side of the long printed circuit board facing the lower heat plate A temporary bonding mechanism that aligns the workpiece and the cover film of the printed circuit base material and temporarily fixes them with the lower thermal plate and the upper thermal plate,
In the pasting device for a printed wiring board composed of the printed circuit board moved in the winding direction and a heat press for crimping the cover film temporarily fixed to the printed circuit board,
Before temporarily fixing the cover film, a first image reading stage that images a target provided in advance on a printed circuit board substrate and detects a dimensional change of the workpiece;
A control mechanism for controlling the temperature of the lower hot plate and the upper hot plate based on the workpiece size data detected by the first image reading stage and correcting the dimensions of the cover film and the printed circuit board. A printed circuit board pasting device characterized by the above.   Of the upper and lower hot plates, at least the lower hot plate is divided into a plurality of blocks so that the temperature can be controlled for each block, and the control mechanism is configured to detect the workpiece detected by the first image reading stage. 2. The printed wiring board pasting apparatus according to claim 1, wherein the cover film is forcibly changed in size by partially changing the temperature of the hot plate based on the change in dimensions.   The printed circuit base material is previously provided with a circular pattern target made of copper foil at the four corners of the workpiece, and a target is formed by circular punching on the cover film corresponding to the target. The center of the target and the center of the target of the cover film are obtained by image processing, and the control mechanism is formed so as to control the temperature of the hot plate so that both centers coincide. 3. A printed wiring board pasting apparatus according to 1 or 2.   A second image reading stage is provided, wherein after the cover film is temporarily fixed, an image of the target of the printed circuit board and the target of the cover film is imaged to confirm the presence or absence of mutual displacement. A printed wiring board pasting device according to claim 1, 2 or 3. In the method of continuously laminating a cover film cut into a predetermined size on a long printed circuit substrate unwound from a roll in order to insulate and protect a printed circuit substrate composed of circuits formed on an insulating base material,
The target previously provided on the printed circuit board is imaged, a dimensional change of the workpiece is detected by image processing, and the lower heat plate on which the cut cover film is placed is opposed to the lower heat plate. When the printed circuit board and the cover film are sandwiched and temporarily fixed by the upper hot plate installed above the long printed circuit board, the hot board is changed according to the dimensional change of the workpiece. A method of attaching a printed wiring board, wherein the cover film is forcibly changed in size by partially changing the temperature of the printed circuit board so as to eliminate the positional deviation of the cover film with respect to the printed circuit board substrate.

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