TWI609766B - Attachment device and attachment method - Google Patents

Attachment device and attachment method Download PDF

Info

Publication number
TWI609766B
TWI609766B TW102137552A TW102137552A TWI609766B TW I609766 B TWI609766 B TW I609766B TW 102137552 A TW102137552 A TW 102137552A TW 102137552 A TW102137552 A TW 102137552A TW I609766 B TWI609766 B TW I609766B
Authority
TW
Taiwan
Prior art keywords
small piece
piece member
heating
fixed
holding
Prior art date
Application number
TW102137552A
Other languages
Chinese (zh)
Other versions
TW201424999A (en
Original Assignee
Yamaha Fine Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaha Fine Technologies Co Ltd filed Critical Yamaha Fine Technologies Co Ltd
Publication of TW201424999A publication Critical patent/TW201424999A/en
Application granted granted Critical
Publication of TWI609766B publication Critical patent/TWI609766B/en

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/281Applying non-metallic protective coatings by means of a preformed insulating foil
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Labeling Devices (AREA)

Description

構件之貼附裝置及貼附方法 Attachment device and attachment method

本發明係關於一種將構件貼附於被定置構件之構件之貼附裝置及貼附方法。 The present invention relates to an attachment device and a attachment method for attaching a member to a member to be fixed.

自先前起,例如於製成撓性印刷基板時,將包含覆蓋膜之構件貼附於形成有配線圖案之樹脂製之基板之配線圖案形成面而保護配線圖案。於此種情形時,使用將切斷為特定形狀之構件貼附於基板之貼附裝置(例如參照日本專利第4719790號公報)。於該貼附裝置中,由加強板貼附臂將利用加強板產生裝置形成之加強板(構件)貼附於被保持於基礎膜保持台之基礎膜之特定位置,並利用基礎膜搬送裝置將貼附有加強板之基礎膜搬送至熱壓接裝置,其後利用熱壓接裝置對基礎膜與加強板進行熱壓接。 When a flexible printed circuit board is produced, for example, a member including a cover film is attached to a wiring pattern forming surface of a resin-made substrate on which a wiring pattern is formed, and the wiring pattern is protected. In such a case, an attachment device that attaches a member cut into a specific shape to a substrate is used (for example, refer to Japanese Patent No. 4719790). In the attaching device, a reinforcing plate (member) formed by the reinforcing plate generating device is attached to a specific position of the base film held by the base film holding table by the reinforcing plate attaching arm, and the base film conveying device is used The base film to which the reinforcing plate is attached is conveyed to the thermocompression bonding device, and then the base film and the reinforcing plate are thermocompression bonded by a thermocompression bonding device.

然而,於上述之先前之貼附裝置中,由於加強板貼附於基礎膜之基礎膜保持台與加強板熱壓接於基礎膜之熱壓接裝置係獨立地設置,故而必須利用基礎膜搬送裝置使貼附有加強板之狀態之基礎膜移動。因此,即便將加強板準確地位置對準於基礎膜,於自基礎膜保持台移動至熱壓接裝置之期間,亦存在於加強板產生偏移之情況。又,於熱壓接裝置中,由於對貼附有加強板之狀態之基礎膜整體加熱,故而產生能量損耗較大之問題、或因熱之影響導致精度變得不穩定之問題。進而亦存在如下問題。即於熱壓接裝置之構成零件易於產生由熱 所致之劣化。又,被加熱之基礎膜之溫度分佈易於變得不均勻,由此導致加強板相對於基礎膜之熱壓接之強度易於產生不均。 However, in the above-mentioned attachment device, since the base film holding table to which the reinforcing plate is attached to the base film and the thermocompression bonding device in which the reinforcing plate is thermocompression-bonded to the base film are independently provided, it is necessary to carry out the use of the base film. The device moves the base film in a state in which the reinforcing plate is attached. Therefore, even if the reinforcing plate is accurately aligned with the base film, there is a case where the reinforcing plate is displaced during the movement from the base film holding table to the thermocompression bonding device. Further, in the thermocompression bonding apparatus, since the entire base film in which the reinforcing plate is attached is heated as a whole, there is a problem that the energy loss is large or the accuracy is unstable due to the influence of heat. Further, the following problems also exist. That is, the components of the thermocompression bonding apparatus are prone to heat generation Deterioration caused. Further, the temperature distribution of the heated base film tends to become uneven, thereby causing unevenness in the strength of the thermocompression bonding of the reinforcing plate with respect to the base film.

本發明係為處理所述問題而完成者,其目的在於提供一種藉由同時進行構件相對於被定置構件之設置與利用貼附之固定,而可進行高速且高精度之處理之構件之貼附裝置。再者,於下述本發明之各構成要件之記載中,為了易於理解本發明,而將實施形態之對應部位之符號記載於括弧內,但本發明之構成要件不應限定性地解釋為藉由實施形態之符號所示之對應部位之構成。 The present invention has been made in order to solve the above problems, and an object thereof is to provide a member capable of performing high-speed and high-precision processing by simultaneously setting a member with respect to a member to be fixed and fixing by attachment. Device. In the following description of the constituent elements of the present invention, in order to facilitate the understanding of the present invention, the symbols of the corresponding portions of the embodiments are described in parentheses, but the constituent elements of the present invention are not to be construed as limiting. The configuration of the corresponding portion indicated by the symbol of the embodiment.

為了達成上述之目的,本發明之構件之貼附裝置之構成上之特徵在於,其係利用搬送裝置(10a)搬送被加熱之構件(A、B、C)並壓接、貼附於被定置構件(13)之被定置部(13a)之構件之貼附裝置(10),且於搬送裝置包含:保持部(24、45、55、65、75、85),其保持構件;加熱部(23b、44a、54a、74a),其藉由加熱保持部,而經由保持部對構件進行加熱;及按壓部(21、22、32、34、43),其將構件按壓於被定置構件之被定置部。 In order to achieve the above object, the attachment device of the member of the present invention is characterized in that the member (A, B, C) that is heated by the transfer device (10a) is pressed and attached to the fixed device. a bonding device (10) for a member of the fixed portion (13a) of the member (13), and the conveying device includes: a holding portion (24, 45, 55, 65, 75, 85), a holding member thereof, and a heating portion ( 23b, 44a, 54a, 74a), which heats the member via the holding portion by heating the holding portion; and a pressing portion (21, 22, 32, 34, 43) that presses the member against the member to be fixed Fixed position.

於本發明之構件之貼附裝置中,構件與貼附構件之被定置部包含在被加熱之狀態下藉由相互壓接而接著之材料。而且,於搬送構件之搬送裝置不僅包含用以保持構件之保持部,亦包含經由保持部對構件進行加熱之加熱部。因此,可於搬送構件之同時進行加熱,藉由將該被加熱之構件經由按壓部按壓於被定置構件之被定置部,而可直接將構件貼附並固定於被定置部。藉此,可同時進行構件相對於被定置構件之設置與利用貼附之固定,從而可進行高速且高精度之處理。即,根據本發明,將構件設置於被定置構件後不會產生偏移,故而成為高精度。 In the attaching device of the member of the present invention, the member and the fixed portion of the attaching member include a material which is followed by being pressed against each other in a heated state. Further, the conveying device of the conveying member includes not only a holding portion for holding the member but also a heating portion that heats the member via the holding portion. Therefore, heating can be performed simultaneously with the conveyance member, and the member to be heated can be directly attached to the fixed portion by pressing the member to be fixed to the fixed portion of the fixed member via the pressing portion. Thereby, the fixing of the member to the fixed member and the attachment by the attachment can be performed at the same time, so that high-speed and high-precision processing can be performed. That is, according to the present invention, since the member is placed on the member to be fixed, no offset occurs, so that the member has high precision.

又,構件係藉由利用加熱部之發熱而被加熱之保持部加熱,故而對各構件之加熱變得均勻,並且可進行有效率之加熱。進而,由於 成為僅對構件進行加熱之構成,故而可使熱能之損耗、或於搬送裝置之構成零件產生由熱所致之劣化之情況為最小限度。再者,作為構成構件或被定置部之材料,可使用藉由加熱而軟化從而黏著性增強之接著劑、或者熱塑性或熱硬化性之樹脂材料等。包含該材料之部分可設置於構件與被定置部之一者,亦可設置於兩者,於設置於一者之情形時,較佳為設置於被直接加熱之構件側。於此情形時,可使構件或被定置部之整體包含該材料,亦可僅使對向之面側部分包含該材料。 Further, since the member is heated by the holding portion heated by the heat generated by the heating portion, the heating of each member becomes uniform, and efficient heating can be performed. Further, because Since the structure is heated only by the member, the loss of thermal energy or the deterioration of the components of the conveying device due to heat is minimized. Further, as a material constituting the member or the fixed portion, an adhesive which is softened by heating to enhance adhesion, or a thermoplastic or thermosetting resin material or the like can be used. The part including the material may be provided in one of the member and the fixed portion, or may be provided in both. When it is provided in one case, it is preferably provided on the side of the member to be directly heated. In this case, the member may be contained in the entire member or the fixed portion, or only the opposing side portion may be included.

於包含上述之材料之被定置部之情形時,可包含該材料之被定置構件之整體,亦可僅使被定置部之表面包含該材料。再者,於包含上述之材料之被定置部之情形時,被定置部藉由接觸於構件而被加熱。又,作為上述之材料,例如較佳為使用於200℃左右或其以下之溫度變化而可接著之材料。總之,重要的是根據所使用之材料,以於保持後至貼附前之期間成為最佳溫度之方式控制溫度。進而,保持部與加熱部較佳為具備複數組。而且,進而較佳為使該情形之各組中之保持部間之間隔與保持於保持部前之構件(於托盤配置有複數個)之間隔相同。藉此,可同時進行複數個構件之貼附,故而可進行更高速且更高效率之處理。 In the case of the fixed portion including the above-mentioned material, the entire member of the material may be included, or only the surface of the fixed portion may be included. Further, in the case of including the fixed portion of the above-described material, the fixed portion is heated by being in contact with the member. Further, as the material described above, for example, a material which can be used in a temperature change of about 200 ° C or lower is preferably used. In summary, it is important to control the temperature in such a manner as to maintain an optimum temperature from the time after the retention to the time of attachment, depending on the materials used. Further, it is preferable that the holding portion and the heating portion have a plurality of arrays. Further, it is preferable that the interval between the holding portions in each of the groups is the same as the interval between the members held in front of the holding portion (the plurality of trays are arranged). Thereby, the attachment of a plurality of members can be performed at the same time, so that higher speed and higher efficiency processing can be performed.

本發明之構件之貼附裝置之另一構成上之特徵在於,搬送裝置包含使保持部、加熱部及按壓部於左右方向、前後方向、上下方向及以沿上下延伸之軸為中心之旋轉方向移動之移動機構(15、16、17、18),且保持部之下端部配置於加熱部及按壓部之下方。 Another aspect of the attachment device of the member of the present invention is characterized in that the conveying device includes a rotation direction centering on the axis of the holding portion, the heating portion, and the pressing portion in the left-right direction, the front-rear direction, the up-and-down direction, and the axis extending upward and downward. The moving mechanism (15, 16, 17, 18) is moved, and the lower end of the holding portion is disposed below the heating portion and the pressing portion.

根據本發明,可將保持於保持部之構件之朝向變更為任何方向。因此,可將構件準確地設置於被定置部。再者,本發明之移動機構包含:左右方向移動機構,其使保持部、加熱部及按壓部於左右方向移動;前後方向移動機構,其使保持部、加熱部及按壓部於前後方向移動;升降機構,其使保持部、加熱部及按壓部於上下方向移動; 及旋轉機構,其使保持部、加熱部及按壓部於繞軸之方向旋轉。 According to the present invention, the orientation of the member held by the holding portion can be changed to any direction. Therefore, the member can be accurately placed in the fixed portion. Furthermore, the moving mechanism of the present invention includes: a left-right direction moving mechanism that moves the holding portion, the heating portion, and the pressing portion in the left-right direction, and a front-rear direction moving mechanism that moves the holding portion, the heating portion, and the pressing portion in the front-rear direction; a lifting mechanism that moves the holding portion, the heating portion, and the pressing portion in the vertical direction; And a rotating mechanism that rotates the holding portion, the heating portion, and the pressing portion in a direction around the axis.

本發明之構件之貼附裝置之又一構成上之特徵在於,保持部(24、45、55)包含在下部中央與側部之間形成有吸引孔(45a)之導熱體,藉由自吸引孔之側部之開口吸引而可於保持部之下部保持構件。 A further configuration of the attachment device of the member of the present invention is characterized in that the holding portion (24, 45, 55) includes a heat conductor formed with a suction hole (45a) between the center and the side portion of the lower portion, by self-priming The opening of the side of the hole is attracted to hold the member below the holding portion.

根據本發明,可利用簡單之構造構成可一面保持構件一面加熱之保持部。即,由於保持部之下部之中央部分成為吸附構件之吸引孔之開口,且該吸引孔之開口之周圍成為對構件進行加熱之部分,故而可有效地利用保持部之下部而使構造變得簡單。又,由於構件之固定於被定置部之部分成為環狀,故而可增大其外周部,藉此,更確實地向被定置部固定構件。再者,亦可使保持部之下部能相對於上部裝卸,從而可根據構件之種類更換保持部之下部。藉此,可進行與構件之形狀對應之最佳之貼附。 According to the present invention, the holding portion which can heat the member while maintaining the member can be constructed with a simple structure. In other words, since the central portion of the lower portion of the holding portion serves as an opening of the suction hole of the adsorption member, and the periphery of the opening of the suction hole serves as a portion for heating the member, the lower portion of the holding portion can be effectively utilized to simplify the structure. . Further, since the portion of the member fixed to the fixed portion is formed in a ring shape, the outer peripheral portion thereof can be enlarged, whereby the member can be more reliably fixed to the fixed portion. Further, the lower portion of the holding portion can be attached to and detached from the upper portion, and the lower portion of the holding portion can be replaced depending on the type of the member. Thereby, the best attachment to the shape of the member can be performed.

本發明之構件之貼附裝置之又一構成上之特徵在於,保持部(65、75)包含可握持構件之握持部。作為該握持部,例如可由包含能夾著而夾持構件之兩側之複數個爪者構成。根據本發明,可由機械式構造直接保持構件,故而可使保持部為簡單之構造。 A further constitution of the attachment device of the member of the present invention is characterized in that the holding portion (65, 75) includes a grip portion of the grippable member. The grip portion may be composed of, for example, a plurality of claws that can sandwich both sides of the member. According to the present invention, the member can be directly held by the mechanical structure, so that the holding portion can be made simple.

本發明之構件之貼附裝置之又一構成上之特徵在於:構件(C)之至少上表面包含具有磁性之吸附面,且保持部(85)包含利用由磁力所產生之吸引力之吸引機構。 Still another constitution of the attachment device of the member of the present invention is that at least the upper surface of the member (C) includes a magnetic adsorption surface, and the holding portion (85) includes a suction mechanism that utilizes an attractive force generated by a magnetic force. .

根據本發明,可藉由利用磁力吸引而保持構件,故而可使保持部為簡單之構造。又,作為利用磁力產生吸引力者,可使用磁產生螺線管、或將永久磁鐵與磁產生螺線管組合而成者。若使用磁產生螺線管,則可使電源成為接通狀態而吸附構件,使電源成為斷開狀態而解除構件之吸附。又,於將永久磁鐵與磁產生螺線管組合之情形時,在吸附構件時,利用永久磁鐵之吸引力,在解除構件之吸附時,對磁產生螺線管通電而使之產生與永久磁鐵相反之磁極。藉此,可解除利用 永久磁鐵對構件之吸附。 According to the present invention, since the member can be held by magnetic attraction, the holding portion can be made simple. Further, as a person who generates an attractive force by a magnetic force, a magnetic generating solenoid or a permanent magnet and a magnetic generating solenoid can be used. When a magnetic generating solenoid is used, the power source can be turned on to adsorb the member, and the power source can be turned off to release the adsorption of the member. Further, when the permanent magnet is combined with the magnetic generating solenoid, the attraction force of the permanent magnet is used to adsorb the magnetic generating solenoid to generate the permanent magnet when the member is adsorbed. The opposite pole. Thereby, the use can be released Adsorption of components by permanent magnets.

再者,於本發明中,可使構件包含藉由加熱而變化從而可接著於被定置部之樹脂材料之成形體、或於金屬板之下表面貼附有樹脂材料之積層體。藉此,由於可接著之面形成於藉由保持部加熱之構件,故而於搬送構件之期間,可以使構件之接著面成為可接著之狀態之方式進行加熱。藉此,可使將構件貼附於被定置部之時間最短。又,於包含樹脂材料之構件之情形時,可作為用於撓性印刷基板之覆蓋膜而使用,於包含積層體之構件之情形時,可作為用於軟硬複合基板之加強板而使用。再者,於構件為覆蓋膜之情形時,為了防止過於軟化,必須以保持部之溫度成為最佳溫度之方式進行溫度控制。 Further, in the present invention, the member may include a molded body of a resin material which is changed by heating to be adhered to the fixed portion, or a laminated body in which a resin material is attached to the lower surface of the metal plate. Thereby, since the connectable surface is formed in the member heated by the holding portion, it is possible to heat the bonding surface of the member while the conveying member is in the state in which it can be continued. Thereby, the time for attaching the member to the fixed portion can be minimized. Further, in the case of a member including a resin material, it can be used as a cover film for a flexible printed circuit board, and when it is a member including a laminate, it can be used as a reinforcing plate for a soft and hard composite substrate. Further, in the case where the member is a cover film, in order to prevent excessive softening, temperature control must be performed such that the temperature of the holding portion becomes an optimum temperature.

又,於本發明中,亦可使被定置部包含藉由加熱而變化從而可接著於構件之樹脂材料。藉此,構件即便包含即使加熱亦無法接著之材料、例如金屬,亦可貼附於被定置部。於此情形時,被定置部藉由接觸於被加熱之構件而成為可接著之狀態。又,被定置部之可接著之部分只要至少形成於與構件接觸之表面即可。進而,亦可使被定置構件之整體包含藉由加熱而可接著之樹脂材料,只要至少被定置部之表面包含上述樹脂材料即可。 Further, in the present invention, the fixed portion may include a resin material which is changed by heating to be adhered to the member. Thereby, the member can be attached to the fixed portion even if it contains a material that cannot be adhered even if heated, for example, metal. In this case, the fixed portion is brought into a state in which it can be brought into contact by contacting the member to be heated. Further, the subsequent portion of the fixed portion may be formed at least on the surface in contact with the member. Further, the entire member to be fixed may include a resin material that can be heated by heating, and the surface of at least the fixed portion may include the resin material.

進而,於實施本發明時,本發明並不限定於構件之貼附裝置之發明,亦可作為構件之貼附方法之發明而實施。 Further, in the practice of the present invention, the present invention is not limited to the invention of the attachment device of the member, and may be implemented as an invention of the attachment method of the member.

10‧‧‧貼附裝置 10‧‧‧ Attachment device

10a‧‧‧搬送裝置 10a‧‧‧Transporting device

11‧‧‧托盤 11‧‧‧Tray

12‧‧‧固定台 12‧‧‧ fixed table

13‧‧‧被定置構件 13‧‧‧Fixed components

13a‧‧‧被定置部 13a‧‧‧Departed

14a‧‧‧圖像識別裝置 14a‧‧‧Image recognition device

14b‧‧‧構件用狀態檢測裝置 14b‧‧‧ Component state detection device

15‧‧‧左右方向移動機構 15‧‧‧ moving direction mechanism

15a‧‧‧X軌道 15a‧‧‧X track

15b‧‧‧X軌道 15b‧‧‧X track

15c‧‧‧腿部 15c‧‧‧ legs

15d‧‧‧腿部 15d‧‧‧ legs

16‧‧‧前後方向移動機構 16‧‧‧ Moving direction mechanism

16a‧‧‧Y軌道 16a‧‧‧Y track

16b‧‧‧Y軌道 16b‧‧‧Y track

16c‧‧‧前後方向驅動裝置 16c‧‧‧ front and rear direction drive

17‧‧‧升降機構 17‧‧‧ Lifting mechanism

17a‧‧‧保持單元升降軸 17a‧‧‧Holding unit lifting shaft

17b‧‧‧基部 17b‧‧‧ base

18‧‧‧旋轉機構 18‧‧‧Rotating mechanism

18a‧‧‧保持單元回旋軸 18a‧‧‧Keep unit revolving axis

20‧‧‧保持單元 20‧‧‧Holding unit

21‧‧‧保持器具升降機構 21‧‧‧ Keeping the appliance lifting mechanism

22‧‧‧加熱保持器具 22‧‧‧heating fixtures

23‧‧‧加熱冷卻機器 23‧‧‧heating and cooling machine

23a‧‧‧加熱冷卻機器主體 23a‧‧‧heating and cooling machine body

23b‧‧‧加熱器 23b‧‧‧heater

24‧‧‧保持部 24‧‧‧ Keeping Department

30‧‧‧保持單元 30‧‧‧Holding unit

31‧‧‧基部 31‧‧‧ base

32‧‧‧保持器具升降機構 32‧‧‧ Keeping the appliance lifting mechanism

33‧‧‧保持器具獨立回旋軸 33‧‧‧ Maintaining the independent revolving axis of the appliance

33a‧‧‧回旋軸主體 33a‧‧‧ gyroscopic main body

33b‧‧‧滑動部 33b‧‧‧Sliding section

33c‧‧‧軸部 33c‧‧‧Axis

34‧‧‧加熱保持器具 34‧‧‧heating fixtures

41‧‧‧加熱保持器具 41‧‧‧heating fixtures

42‧‧‧滑動構件 42‧‧‧Sliding members

42a‧‧‧支持片 42a‧‧‧Support tablets

42b‧‧‧固定片 42b‧‧‧Fixed piece

43‧‧‧缸體 43‧‧‧Cylinder

43a‧‧‧伸縮軸 43a‧‧‧ Telescopic shaft

43b‧‧‧連接器 43b‧‧‧Connector

43c‧‧‧軟管 43c‧‧‧Hose

44‧‧‧加熱機器 44‧‧‧heating machine

44a‧‧‧加熱器 44a‧‧‧heater

44b‧‧‧連接器 44b‧‧‧Connector

44c‧‧‧配線 44c‧‧‧Wiring

45‧‧‧保持部 45‧‧‧ Keeping Department

45a‧‧‧吸引孔 45a‧‧‧Attraction hole

45b‧‧‧軟管 45b‧‧‧Hose

46‧‧‧導引部 46‧‧‧Guidance

46a‧‧‧導引部主體 46a‧‧‧The main body of the guide

46b‧‧‧連結部 46b‧‧‧Connecting Department

51‧‧‧加熱保持器具 51‧‧‧heating fixtures

54‧‧‧加熱機器 54‧‧‧heating machine

54a‧‧‧加熱器 54a‧‧‧heater

54b‧‧‧配線 54b‧‧‧Wiring

55‧‧‧保持部 55‧‧‧ Keeping Department

55a‧‧‧軟管 55a‧‧‧Hose

57‧‧‧殼體 57‧‧‧Shell

57a‧‧‧導引部 57a‧‧‧Guide

61‧‧‧加熱保持器具 61‧‧‧heating fixtures

65‧‧‧保持部 65‧‧‧ Keeping Department

71‧‧‧加熱保持器具 71‧‧‧heating fixtures

74‧‧‧加熱機器 74‧‧‧heating machine

74a‧‧‧加熱器 74a‧‧‧heater

75‧‧‧保持部 75‧‧‧ Keeping Department

77‧‧‧殼體 77‧‧‧Shell

81‧‧‧加熱保持器具 81‧‧‧heating fixtures

85‧‧‧保持部 85‧‧‧ Keeping Department

85a‧‧‧收容部 85a‧‧‧Receiving Department

85b‧‧‧螺線管 85b‧‧‧ Solenoid

85c‧‧‧配線 85c‧‧‧Wiring

91‧‧‧加熱保持器具 91‧‧‧heating fixtures

95‧‧‧螺線管 95‧‧‧ Solenoid

95a‧‧‧配線 95a‧‧‧Wiring

97‧‧‧殼體 97‧‧‧Shell

A‧‧‧小片構件 A‧‧‧ small piece components

B‧‧‧小片構件 B‧‧‧Small components

C‧‧‧小片構件 C‧‧‧ small piece components

圖1係表示本發明之第1實施形態之構件之貼附裝置的立體圖。 Fig. 1 is a perspective view showing a sticking device for a member according to a first embodiment of the present invention.

圖2係表示構件之貼附裝置所具備之保持單元之立體圖。 Fig. 2 is a perspective view showing a holding unit provided in the attachment device of the member.

圖3係表示第1實施形態之第1變化例之構件之貼附裝置所具備的保持單元之立體圖。 FIG. 3 is a perspective view showing a holding unit provided in the attachment device of the member according to the first modification of the first embodiment.

圖4係表示第1實施形態之第2變化例之構件之貼附裝置所具備的加熱保持器具之剖面圖。 Fig. 4 is a cross-sectional view showing a heating holder provided in a bonding apparatus for a member according to a second modification of the first embodiment.

圖5係表示第1實施形態之第3變化例之構件之貼附裝置所具備的加熱保持器具之剖面圖。 Fig. 5 is a cross-sectional view showing a heating holder provided in a bonding apparatus for a member according to a third modification of the first embodiment.

圖6係表示本發明之第2實施形態之構件之貼附裝置所具備的加熱保持器具之剖面圖。 Fig. 6 is a cross-sectional view showing a heating holder provided in the attachment device of the member according to the second embodiment of the present invention.

圖7係表示第2實施形態之變化例之構件之貼附裝置所具備的加熱保持器具之剖面圖。 Fig. 7 is a cross-sectional view showing a heating holder provided in a bonding apparatus for a member according to a modification of the second embodiment.

圖8係表示本發明之第3實施形態之構件之貼附裝置所具備的加熱保持器具之剖面圖。 Fig. 8 is a cross-sectional view showing a heating holder provided in a sticking device for a member according to a third embodiment of the present invention.

圖9係表示第3實施形態之變化例之構件之貼附裝置所具備的加熱保持器具之剖面圖。 Fig. 9 is a cross-sectional view showing a heating holder provided in a sticking device for a member according to a modification of the third embodiment.

(第1實施形態) (First embodiment)

以下,使用圖式對本發明之第1實施形態進行說明。圖1表示本實施形態之構件之貼附裝置10。該構件之貼附裝置10係用以搬送配置於托盤11之上表面之膜狀之小片構件A並貼附於設置於固定台12之上表面之包含電子基板之被定置構件13之被定置部13a的裝置。小片構件A包含熱塑性聚醯亞胺,若加熱至200℃左右則塑化而產生接著性,並且硬化後固定於被定置部13a。又,作為構成小片構件A之材料,亦可使用聚醯亞胺以外之熱塑性樹脂材料、或熱硬化性樹脂材料。 Hereinafter, a first embodiment of the present invention will be described using the drawings. Fig. 1 shows a sticking device 10 of the member of the present embodiment. The attaching device 10 of the member is for transporting the film-shaped small piece member A disposed on the upper surface of the tray 11 and attached to the fixed portion of the fixed member 13 including the electronic substrate provided on the upper surface of the fixed table 12. 13a device. The small-piece member A contains a thermoplastic polyimide, and if it is heated to about 200 ° C, it is plasticized to produce adhesiveness, and after curing, it is fixed to the fixed portion 13a. Further, as the material constituting the small-piece member A, a thermoplastic resin material other than polyimide or a thermosetting resin material may be used.

又,被定置構件13包含聚醯亞胺等樹脂材料。於構件之貼附裝置10,除上述之托盤11及固定台12以外,亦包含搬送小片構件A之搬送裝置10a、圖像識別裝置14a及構件用狀態檢測裝置14b。又,雖省略圖示,但亦包含搬送托盤11之托盤搬送裝置、及搬送固定台12之固定台搬送裝置。 Further, the fixed member 13 contains a resin material such as polyimide. In addition to the above-described tray 11 and fixing table 12, the member attaching device 10 includes a conveying device 10a for conveying the small-piece member A, an image recognition device 14a, and a member state detecting device 14b. Moreover, although not shown in the figure, the tray conveyance device of the conveyance tray 11 and the fixed-table conveyance apparatus of the conveyance fixing base 12 are also included.

搬送裝置10a包含保持單元20、及使保持單元20於各種方向移動 之移動機構。而且,移動機構包含使保持單元20於左右方向(圖1中箭頭X所示之方向)移動之左右方向移動機構15、使保持單元20於前後方向(圖1中箭頭Y所示之方向)移動之前後方向移動機構16、使保持單元20於上下方向(圖1中箭頭Z所示之方向)移動之升降機構17及使保持單元20於旋轉方向(圖1中箭頭R所示之繞Z軸之方向)旋轉之旋轉機構18(參照圖2)。 The conveying device 10a includes the holding unit 20 and moves the holding unit 20 in various directions The moving mechanism. Further, the moving mechanism includes a left-right direction moving mechanism 15 that moves the holding unit 20 in the left-right direction (the direction indicated by the arrow X in Fig. 1), and moves the holding unit 20 in the front-rear direction (the direction indicated by the arrow Y in Fig. 1). The front-rear direction moving mechanism 16, the elevating mechanism 17 that moves the holding unit 20 in the up-and-down direction (the direction indicated by the arrow Z in Fig. 1), and the holding unit 20 in the rotation direction (the arrow Z shown in the arrow R in Fig. 1) The direction of rotation) of the rotating mechanism 18 (see Fig. 2).

左右方向移動機構15包含:一對X軌道15a、15b,其等於前後保持間隔而配置且於左右方向平行地延伸;腿部15c,其可於X軌道15a移動地設置;腿部15d,其可於X軌道15b移動地設置;及左右方向驅動裝置(未圖示)。左右方向驅動裝置包含螺合於腿部15c、15d中之一者之滾珠螺桿、及使該滾珠螺桿旋轉之X軸馬達,藉由X軸馬達之驅動而使滾珠螺桿旋轉,從而使腿部15c、15d沿X軌道15a、15b移動。 The left-right direction moving mechanism 15 includes a pair of X rails 15a, 15b which are disposed to be spaced apart from each other in front and rear and extend in parallel in the left-right direction; a leg portion 15c which is movably disposed on the X rail 15a; and a leg portion 15d which can be The X rail 15b is movably disposed; and the left and right direction driving device (not shown). The left-right direction driving device includes a ball screw that is screwed to one of the leg portions 15c and 15d, and an X-axis motor that rotates the ball screw. The ball screw is rotated by the X-axis motor to drive the leg portion 15c. 15d moves along the X-tracks 15a, 15b.

前後方向移動機構16包含:桿狀之一對Y軌道16a、16b,其等以於左右保持固定間隔之狀態平行地架設於腿部15c、15d之上端側部分,且沿前後方向延伸;及前後方向驅動裝置16c。前後方向驅動裝置16c包含可沿Y軌道16a、16b移動之移動軸部、及設置於該移動軸部之Y軸馬達(未圖示),且藉由Y軸馬達之驅動而沿Y軌道16a、16b移動。而且,保持單元升降軸17a自前後方向驅動裝置16c之移動軸部向下方延伸,且於該保持單元升降軸17a之下部安裝有保持單元20。 The front-rear direction moving mechanism 16 includes a pair of rod-shaped Y-tracks 16a and 16b that are erected in parallel on the upper end side portions of the leg portions 15c and 15d in a state in which the left and right are kept at a fixed interval, and extend in the front-rear direction; Direction drive device 16c. The front-rear direction driving device 16c includes a moving shaft portion movable along the Y-tracks 16a, 16b, and a Y-axis motor (not shown) provided on the moving shaft portion, and is driven along the Y-track 16a by the Y-axis motor. 16b moves. Further, the holding unit lifting shaft 17a extends downward from the moving shaft portion of the front-rear direction driving device 16c, and the holding unit 20 is attached to the lower portion of the holding unit lifting shaft 17a.

升降機構17包含保持單元升降軸17a、及設置於保持單元20之內部之Z軸馬達(未圖示),且藉由Z軸馬達之驅動而使保持單元20沿保持單元升降軸17a升降。又,於保持單元20亦設置有使保持單元20於繞保持單元升降軸17a之軸之方向旋轉之旋轉機構18,旋轉機構18包含圖2所示之保持單元回旋軸18a、及使保持單元回旋軸18a旋轉之R軸馬達(未圖示)。因此,保持單元20藉由左右方向移動機構15之驅動而於左右方向移動,藉由前後方向移動機構16之驅動而於前後方向移動, 藉由升降機構17之驅動而於上下方向移動,進而藉由旋轉機構18之驅動旋轉。 The elevating mechanism 17 includes a holding unit elevating shaft 17a and a Z-axis motor (not shown) provided inside the holding unit 20, and the holding unit 20 is moved up and down along the holding unit elevating shaft 17a by driving of the Z-axis motor. Further, the holding unit 20 is also provided with a rotating mechanism 18 for rotating the holding unit 20 in the direction of the axis of the holding unit lifting shaft 17a. The rotating mechanism 18 includes the holding unit turning shaft 18a shown in Fig. 2, and the holding unit is rotated. An R-axis motor (not shown) in which the shaft 18a rotates. Therefore, the holding unit 20 is moved in the left-right direction by the driving of the right and left direction moving mechanism 15, and is moved in the front-rear direction by the driving of the front-rear direction moving mechanism 16. It is moved in the up and down direction by the driving of the elevating mechanism 17, and is further rotated by the driving of the rotating mechanism 18.

保持單元20係如圖2所示般構成,於構成升降機構17之下部之基部17b,隔著5個保持器具升降機構21而安裝有5個加熱保持器具22。由該保持器具升降機構21及加熱保持器具22構成本發明之按壓部。各加熱保持器具22包含加熱冷卻機器23、及保持部24,雖於圖2中省略圖示,但於保持部24連接有吸引用之軟管。加熱冷卻機器23包含加熱冷卻機器主體23a、及自加熱冷卻機器主體23a向下方突出之桿狀之加熱器23b,且加熱器23b藉由通電而發熱。 The holding unit 20 is configured as shown in FIG. 2, and five heating holders 22 are attached to the base portion 17b constituting the lower portion of the elevating mechanism 17 via the five holder elevating mechanisms 21. The holding device elevating mechanism 21 and the heating holder 22 constitute the pressing portion of the present invention. Each of the heating and holding devices 22 includes a heating and cooling device 23 and a holding portion 24. Although not shown in FIG. 2, a hose for suction is connected to the holding portion 24. The heating and cooling device 23 includes a heating and cooling device main body 23a and a rod-shaped heater 23b that protrudes downward from the heating and cooling device main body 23a, and the heater 23b generates heat by energization.

於加熱冷卻機器主體23a包含檢測加熱器23b之溫度之溫度感測器及對加熱器23b進行冷卻之冷卻裝置,根據溫度感測器檢測出之溫度而對加熱器23b通電,或停止其通電。又,冷卻裝置藉由將外部之空氣吸入至加熱冷卻機器主體23a內,而視需要對加熱器23b進行冷卻。保持部24包含導熱性佳之矩形鋼材,且上表面中央連結於加熱器23b之下部。又,雖於圖2中省略圖示,但於保持部24之下表面中央與側部之間形成有吸引孔。 The heating and cooling machine main body 23a includes a temperature sensor that detects the temperature of the heater 23b and a cooling device that cools the heater 23b, and energizes or stops the energization of the heater 23b based on the temperature detected by the temperature sensor. Further, the cooling device cools the heater 23b as needed by sucking the outside air into the heating and cooling machine main body 23a. The holding portion 24 includes a rectangular steel material having excellent thermal conductivity, and the upper surface is centrally coupled to the lower portion of the heater 23b. Further, although not shown in FIG. 2, a suction hole is formed between the center and the side portion of the lower surface of the holding portion 24.

而且,於保持部24之側部之開口連接有吸引用之軟管之前端部。該吸引用軟管之基端部連接有吸引裝置(未圖示),藉由吸引裝置之作動,可吸引小片構件A並將其保持於保持部24之下表面,藉由停止吸引裝置之作動而可釋放小片構件A。於小片構件A保持於保持部24之期間,小片構件A藉由保持部24加熱,但以此時之保持部24之溫度成為最適於保持及貼附小片構件A之溫度、例如200℃左右之方式,控制加熱器23b。又,各加熱保持器具22可分別藉由對應之保持器具升降機構21之作動而獨立地升降。保持器具升降機構21包含升降馬達及滾珠螺桿。 Further, a front end portion of the suction hose is connected to the opening of the side portion of the holding portion 24. A suction device (not shown) is connected to the proximal end portion of the suction hose, and by the action of the suction device, the small piece member A can be attracted and held on the lower surface of the holding portion 24, by stopping the operation of the suction device. The small piece member A can be released. While the small piece member A is held by the holding portion 24, the small piece member A is heated by the holding portion 24, but the temperature of the holding portion 24 at this time becomes the temperature most suitable for holding and attaching the small piece member A, for example, about 200 ° C. In the manner, the heater 23b is controlled. Further, each of the heating and holding devices 22 can be independently raised and lowered by the action of the corresponding holding device lifting mechanism 21, respectively. The holding device lifting mechanism 21 includes a lifting motor and a ball screw.

又,於保持單元20安裝有圖像識別裝置14a。該圖像識別裝置14a 可包含例如CCD(Charge Coupled Device,電荷耦合器件)相機,固定於保持單元20之側部,且與保持單元20一同移動。而且,圖像識別裝置14a檢測配置於托盤11之上表面之小片構件A之狀態,或確認其位置。又,該圖像識別裝置14a係用於確認被定置構件13之上表面之固定小片構件A之被定置部13a的位置,或確認固定於被定置構件13之上表面之小片構件A之配置等而使用。 Further, the image recognition device 14a is attached to the holding unit 20. The image recognition device 14a A CCD (Charge Coupled Device) camera, for example, may be attached to the side of the holding unit 20 and moved together with the holding unit 20. Further, the image recognition device 14a detects the state of the small-piece member A disposed on the upper surface of the tray 11, or confirms the position thereof. Further, the image recognition device 14a is for confirming the position of the fixed portion 13a of the fixed small piece member A on the upper surface of the fixed member 13, or confirming the arrangement of the small piece member A fixed to the upper surface of the fixed member 13 or the like. And use.

又,構件用狀態檢測裝置14b係設置於托盤11之設置位置與固定台12之設置位置之間,可包含例如CCD相機。該構件用狀態檢測裝置14b自下方確認保持於保持部24而搬送之小片構件A之狀態。所謂此情形之小片構件A之狀態係小片構件A之朝向或向保持部24之吸附狀態等。 Further, the member state detecting device 14b is provided between the installation position of the tray 11 and the installation position of the fixed table 12, and may include, for example, a CCD camera. The member state detecting device 14b confirms the state of the small piece member A held by the holding portion 24 and conveyed from below. The state of the small-piece member A in this case is the orientation of the small-piece member A or the state of adsorption to the holding portion 24, and the like.

於構件之貼附裝置10,除上述裝置以外,亦包括CPU(Central Processing Unit,中央處理單元)、包含ROM(Read Only Memory,唯讀記憶體)及RAM(Random Access Memory,隨機存取記憶體)之記憶裝置、圖像處理裝置、輸入裝置及包含感測器等之各種檢測裝置等用於使構件之貼附裝置10作動所必需之各種裝置。於記憶裝置記憶有用以使構件之貼附裝置10所具備之各裝置作動之各種程式、或者與托盤11之設置位置、小片構件A之設置位置或形狀、被定置構件13之設置位置、被定置部13a之位置或形狀等相關之資料等各種資料。 The component attaching device 10 includes a CPU (Central Processing Unit), a ROM (Read Only Memory), and a RAM (Random Access Memory) in addition to the above devices. The memory device, the image processing device, the input device, and various detecting devices including the sensor and the like are various devices necessary for the component attaching device 10 to operate. The memory device stores various programs for causing the respective devices of the member attaching device 10 to operate, or the position of the tray 11, the position or shape of the small member A, the position of the fixed member 13, and the position. Various materials such as the position or shape of the part 13a.

圖像處理裝置係連接於圖像識別裝置14a及構件用狀態檢測裝置14b,對圖像識別裝置14a及構件用狀態檢測裝置14b之攝影圖像進行圖像處理,而作為圖像資料記憶於記憶裝置。輸入裝置係用於進行用以選擇記憶於記憶裝置之程式之輸入、或各種資料等之輸入。又,檢測裝置係檢測X軸馬達、Y軸馬達等各種馬達之旋轉數,而識別保持單元20之左右、前後、上下及旋轉方向之位置。而且,CPU係基於記憶裝置所記憶之程式或各種資料、輸入裝置之輸入資料及檢測裝置之 檢測值等,而使構件之貼附裝置10所具備之各裝置作動。 The image processing device is connected to the image recognition device 14a and the component state detecting device 14b, and performs image processing on the image recognition device 14a and the image detection device 14b, and stores the image as image data in the memory. Device. The input device is used to perform input for selecting an input of a program stored in the memory device, or various materials. Further, the detecting device detects the number of rotations of various motors such as the X-axis motor and the Y-axis motor, and recognizes the positions of the left and right, front and rear, up and down, and rotation directions of the holding unit 20. Moreover, the CPU is based on a program or various data stored in the memory device, input data of the input device, and detection device. The detection value and the like are used to activate the respective devices provided in the attachment device 10 of the member.

使用以此方式構成之構件之貼附裝置10,將小片構件A貼附於被定置構件13之被定置部13a之情形之處理,藉由CPU執行上述各種程式而進行。於此情形時,首先,將配置有複數個小片構件A之托盤11設置於保持單元20之移動範圍之下方,並且將被定置構件13設置於保持單元20之移動範圍之下方。繼而,使保持單元20位於托盤11之上方。此時,一面利用圖像識別裝置14a確認小片構件A之位置一面使保持單元20移動。 The attaching device 10 of the member configured in this manner performs the process of attaching the small-piece member A to the fixed portion 13a of the fixed member 13, and the CPU executes the above various programs. In this case, first, the tray 11 in which the plurality of small pieces A are disposed is disposed below the moving range of the holding unit 20, and the fixed member 13 is disposed below the moving range of the holding unit 20. Then, the holding unit 20 is placed above the tray 11. At this time, the holding unit 20 is moved while confirming the position of the small piece member A by the image recognition device 14a.

繼而,對加熱器23b通電,藉由加熱器23b之發熱而將保持部24加熱至例如200℃,並使保持單元20下降。然後,當保持部24接近於小片構件A時,使吸引裝置作動而使小片構件A吸附於保持部24之下表面。於此情形時,亦可使複數個小片構件A同時吸附於複數個保持部24。繼而,使保持單元20上升,並移動至被定置構件13之上方。於其移動時,使保持單元20通過構件用狀態檢測裝置14b之上方,而藉由構件用狀態檢測裝置14b確認吸附於保持部24之小片構件A之狀態。 Then, the heater 23b is energized, and the holding portion 24 is heated to, for example, 200 ° C by the heat generated by the heater 23b, and the holding unit 20 is lowered. Then, when the holding portion 24 is close to the small piece member A, the suction device is actuated to cause the small piece member A to be attracted to the lower surface of the holding portion 24. In this case, a plurality of small piece members A may be simultaneously adsorbed to the plurality of holding portions 24. Then, the holding unit 20 is raised and moved to above the fixed member 13. At the time of the movement, the holding unit 20 is passed over the member state detecting device 14b, and the state of the small-piece member A adsorbed to the holding portion 24 is confirmed by the member state detecting device 14b.

繼而,利用圖像識別裝置14a確認被定置構件13之被定置部13a之位置,使保持單元20旋轉而使小片構件A之朝向與被定置部13a之朝向一致。然後,使保持單元20下降,使小片構件A重合於被定置部13a。小片構件A於自托盤11搬送之期間被加熱而變化,成為易於接著於被定置部13a之狀態。因此,小片構件A被按壓於被定置部13a而接著於被定置部13a。 Then, the image recognition device 14a confirms the position of the fixed portion 13a of the fixed member 13, and rotates the holding unit 20 so that the orientation of the small piece member A coincides with the direction of the fixed portion 13a. Then, the holding unit 20 is lowered to cause the small piece member A to overlap the fixed portion 13a. The small-sized member A is heated and changed during the conveyance from the tray 11, and is easily attached to the fixed portion 13a. Therefore, the small piece member A is pressed against the fixed portion 13a and follows the fixed portion 13a.

於小片構件A貼附並固定於被定置部13a之狀態下,使吸引裝置停止,並使保持單元20上升。藉此,如圖1所示,例如2個小片構件A分別固定於2個部位之被定置部13a。繼而,使保持單元20再次移動至托盤11之上方,並重複上述之操作,藉此所有小片構件A固定於被定 置部13a。再者,於圖1所示之被定置構件13,僅圖示一部分被定置部13a。 In a state in which the small-piece member A is attached and fixed to the fixed portion 13a, the suction device is stopped and the holding unit 20 is raised. Thereby, as shown in FIG. 1, for example, the two small-piece members A are respectively fixed to the fixed portions 13a of the two locations. Then, the holding unit 20 is moved again above the tray 11, and the above operation is repeated, whereby all the small piece members A are fixed to be fixed The portion 13a. Further, in the fixed member 13 shown in Fig. 1, only a part of the fixed portion 13a is shown.

如上所述,於本實施形態之構件之貼附裝置10中,小片構件A包含藉由加熱而塑化從而亦可作為接著劑發揮功能之熱塑性聚醯亞胺。而且,於搬送小片構件A之搬送裝置10a之加熱保持器具22,不僅包含用以保持小片構件A之保持部24,亦包含經由保持部24對小片構件A進行加熱之加熱器23b。因此,可一面搬送小片構件A,一面對其進行加熱,藉由將該被加熱之小片構件A按壓於被定置構件13之被定置部13a,而可直接將小片構件A貼附並固定於被定置部13a。藉此,可同時進行小片構件A相對於被定置構件13之設置與貼合,從而可進行高速處理,並且由於將小片構件A設置於被定置構件13之後不會產生偏移,故而可進行精度佳之貼附。 As described above, in the attaching device 10 of the member of the present embodiment, the small-piece member A includes a thermoplastic polyimide which can be plasticized by heating and can function as an adhesive. Further, the heating holder 22 of the conveying device 10a that conveys the small-piece member A includes not only the holding portion 24 for holding the small-piece member A but also the heater 23b that heats the small-piece member A via the holding portion 24. Therefore, the small piece member A can be conveyed while being heated, and by pressing the heated small piece member A against the fixed portion 13a of the fixed member 13, the small piece member A can be directly attached and fixed to the small piece member A. The fixed portion 13a is fixed. Thereby, the setting and bonding of the small piece member A with respect to the fixed member 13 can be performed at the same time, so that high-speed processing can be performed, and since the small piece member A is disposed after being placed on the fixed member 13, no offset occurs, so accuracy can be performed. Good attached.

又,由於小片構件A藉由接觸於保持部24之下表面而被加熱,故而對各小片構件A之加熱變得均勻,並且可進行有效率之加熱。進而,由於保持部24僅對與下表面接觸之小片構件A進行加熱,故而可使熱能之損耗、或於搬送裝置10a之其他構成零件產生由熱所致之劣化之情況為最小限度。又,由於在搬送裝置10a包含使保持單元20於左右方向、前後方向、上下方向及旋轉方向移動之左右方向移動機構15、前後方向移動機構16、升降機構17及旋轉機構18,故而可將保持於保持部24之小片構件A之朝向變更為任何方向。進而,由於各加熱保持器具22可藉由保持器具升降機構21而獨立地升降,故而可對複數個加熱保持器具22獨立地進行升降控制。因此,可將小片構件A相對於被定置部13a準確地固定。 Further, since the small-piece member A is heated by being in contact with the lower surface of the holding portion 24, the heating of the small-piece members A becomes uniform, and efficient heating can be performed. Further, since the holding portion 24 heats only the small-piece member A that is in contact with the lower surface, it is possible to minimize the loss of thermal energy or the deterioration of heat caused by heat to other components of the conveying device 10a. Further, since the conveying device 10a includes the left-right direction moving mechanism 15, the front-rear direction moving mechanism 16, the elevating mechanism 17, and the rotating mechanism 18 that move the holding unit 20 in the left-right direction, the front-rear direction, the vertical direction, and the rotation direction, it can be held. The orientation of the small piece member A of the holding portion 24 is changed to any direction. Further, since each of the heating and holding devices 22 can be independently moved up and down by the holding device lifting and lowering mechanism 21, the plurality of heating and holding devices 22 can be independently controlled to be lifted and lowered. Therefore, the small piece member A can be accurately fixed with respect to the fixed portion 13a.

又,由於保持部24之上部連結於加熱器23b之下部,故而加熱器23b兼作支持保持部24之構件、及對保持部24進行加熱之構件,從而可減少構件之件數,而使加熱保持器具22之構造較為簡單。又,由於 利用設置於保持部24之下表面中央之吸引孔之開口吸附小片構件A,故而小片構件A之中央部分被吸引,從而可進行穩定之吸附。而且,由於保持部24之下表面之吸引孔之開口的周圍部分整體成為對小片構件A進行加熱之部分,故而可使小片構件A之固定於被定置部13a之部分之面積變大,從而更確實地向被定置部13a固定小片構件A。 Further, since the upper portion of the holding portion 24 is coupled to the lower portion of the heater 23b, the heater 23b also serves as a member for supporting the holding portion 24 and a member for heating the holding portion 24, thereby reducing the number of members and maintaining the heat. The construction of the appliance 22 is relatively simple. Again, because The small piece member A is sucked by the opening provided in the suction hole at the center of the lower surface of the holding portion 24, so that the central portion of the small piece member A is attracted, so that stable adsorption can be performed. Further, since the entire peripheral portion of the opening of the suction hole on the lower surface of the holding portion 24 is a portion for heating the small-piece member A, the area of the portion of the small-piece member A fixed to the fixed portion 13a can be increased, thereby further The small piece member A is fixed to the fixed portion 13a.

(第1變化例) (First variation)

圖3表示上述第1實施形態之第1變化例之構件之貼附裝置所具備的保持單元30。於該保持單元30中,在構成上下方向移動機構之下部之基部31設置有5個保持器具升降機構32,且於該保持器具升降機構32分別經由保持器具獨立回旋軸33而安裝有加熱保持器具34。保持器具獨立回旋軸33包含:矩形之回旋軸主體33a,其構成上部;滑動部33b,其自回旋軸主體33a之後部向下方延伸,可滑動地卡合於保持器具升降機構32,且接受保持器具升降機構32之作動力;及軸部33c,其自回旋軸主體33a之下表面向下方延伸。而且,於回旋軸主體33a之內部,設置有使軸部33c於繞軸之方向旋轉之旋轉驅動馬達。 Fig. 3 shows a holding unit 30 included in the attachment device of the member according to the first modification of the first embodiment. In the holding unit 30, five holder elevating mechanisms 32 are provided in the base portion 31 constituting the lower portion of the vertical movement mechanism, and the holder holder elevating mechanism 32 is attached to the heating holder by the holder independent revolving shaft 33. 34. The holding device independent turning shaft 33 includes a rectangular turning shaft main body 33a constituting an upper portion, and a sliding portion 33b extending downward from the rear portion of the turning shaft main body 33a to slidably engage with the holder lifting mechanism 32 and receiving and holding The power of the appliance lifting mechanism 32; and the shaft portion 33c extending downward from the lower surface of the swing shaft main body 33a. Further, inside the turning shaft main body 33a, a rotary drive motor that rotates the shaft portion 33c in the direction of the shaft is provided.

加熱保持器具34係由與上述加熱保持器具22相同之器具構成。即,該保持單元30係設置有5個保持器具獨立回旋軸33代替使上述保持單元20旋轉之旋轉機構18,藉此,可使各加熱保持器具34獨立地旋轉。該保持單元30之除此以外之部分之構成與上述保持單元20相同。因此,對同一部分標記同一符號而省略說明。又,保持單元30可代替上述之保持單元20而於上述構件之貼附裝置10使用,於此情形時,基部31連結於上述保持單元升降軸17a。 The heating holder 34 is composed of the same device as the heating holder 22 described above. That is, the holding unit 30 is provided with five holder independent turning shafts 33 instead of the rotating mechanism 18 for rotating the holding unit 20, whereby the respective heating holders 34 can be independently rotated. The configuration of the other portions of the holding unit 30 is the same as that of the above-described holding unit 20. Therefore, the same portions are denoted by the same reference numerals, and the description is omitted. Further, the holding unit 30 can be used in the above-described member attachment device 10 instead of the above-described holding unit 20, and in this case, the base portion 31 is coupled to the holding unit lifting shaft 17a.

又,於圖3中表示有小片構件B作為吸附於保持部24之小片構件。該小片構件B包含四邊形之較薄之不鏽鋼板、及形成於該不鏽鋼板之下表面之藉由加熱而變化從而可接著之接著層。即便使用該小片構件B,亦可與上述之小片構件A同樣地進行高速且高精度之處理。 包含該保持單元30之構件之貼附裝置之除此以外的作用效果與上述構件之貼附裝置10之作用效果相同。 Moreover, in FIG. 3, the small piece member B is shown as a small piece member adsorbed to the holding part 24. The small piece member B includes a thinner stainless steel plate of a quadrangular shape, and a lower layer formed by heating on the lower surface of the stainless steel plate. Even if the small piece member B is used, high-speed and high-precision processing can be performed similarly to the above-described small piece member A. The other effects of the attachment device including the member of the holding unit 30 are the same as those of the attachment device 10 of the above-described member.

(第2變化例) (2nd variation)

圖4表示上述之第1實施形態之第2變化例之構件之貼附裝置所具備的加熱保持器具41。該加熱保持器具41包含滑動構件42、缸體43、加熱機器44、保持部45、及導引部46。滑動構件42係剖面形狀為使L形上下反轉而成之形狀,且包含沿上下延伸之支持片42a、及自支持片42a之上端沿水平方向延伸之固定片42b。該滑動構件42係藉由與上述保持器具升降機構21、32同樣之保持器具升降機構之作動而升降。又,雖已省略圖示,但於支持片42a之內表面(圖4之左側之面)形成有沿上下延伸之槽狀之軌道部(未圖示),於固定片42b之中央附近設置有沿上下貫通之軸插通孔。 Fig. 4 shows a heating holder 41 included in the attachment device of the member according to the second modification of the first embodiment. The heating holder 41 includes a sliding member 42, a cylinder 43, a heating device 44, a holding portion 45, and a guiding portion 46. The sliding member 42 has a cross-sectional shape in which the L-shape is reversed up and down, and includes a support piece 42a extending upward and downward, and a fixing piece 42b extending in the horizontal direction from the upper end of the support piece 42a. The sliding member 42 is raised and lowered by the action of the holding device lifting mechanism similar to the above-described holder lifting and lowering mechanisms 21 and 32. Moreover, although the illustration is omitted, a groove-shaped rail portion (not shown) extending upward and downward is formed on the inner surface (the left side surface of FIG. 4) of the support piece 42a, and is provided near the center of the fixing piece 42b. Insert the through hole along the shaft that penetrates up and down.

而且,於固定片42b之上表面設置有缸體43。該缸體43係以使向下方延伸之伸縮軸43a插通於固定片42b之軸插通孔之狀態固定於固定片42b。又,於缸體43之側部經由連接器43b而連接有軟管43c,且於軟管43c之基端部連接有空氣壓縮機(未圖示)。缸體43係藉由自空氣壓縮機供給壓縮空氣,而使伸縮軸43a向下方突出,若停止壓縮空氣之供給,則使伸縮軸43a上升。 Further, a cylinder 43 is provided on the upper surface of the fixing piece 42b. The cylinder 43 is fixed to the fixing piece 42b in a state in which the telescopic shaft 43a extending downward is inserted into the shaft insertion hole of the fixing piece 42b. Further, a hose 43c is connected to the side portion of the cylinder 43 via the connector 43b, and an air compressor (not shown) is connected to the base end portion of the hose 43c. The cylinder 43 is supplied with compressed air from an air compressor to project the telescopic shaft 43a downward, and when the supply of the compressed air is stopped, the telescopic shaft 43a is raised.

加熱機器44包含加熱器44a、及檢測加熱器44a之溫度之溫度感測器。即,該加熱機器44係自上述之加熱冷卻機器23除去冷卻裝置之構成。又,於加熱機器44之上部經由連接器44b而連接有用以供給電源之配線44c。保持部45設為與上述之保持部24相同之構成,且上表面中央連結於加熱器44a之下部。而且,於保持部45之下表面中央與側部之間形成有吸引孔45a,且於吸引孔45a之保持部45之側部之開口連接有吸引用之軟管45b。該吸引用之軟管45b之基端部係連接於吸引裝置(未圖示)。 The heating machine 44 includes a heater 44a and a temperature sensor that detects the temperature of the heater 44a. That is, the heating device 44 is configured to remove the cooling device from the above-described heating and cooling device 23. Further, a wiring 44c for supplying power is connected to the upper portion of the heating device 44 via the connector 44b. The holding portion 45 has the same configuration as the above-described holding portion 24, and the center of the upper surface is connected to the lower portion of the heater 44a. Further, a suction hole 45a is formed between the center and the side portion of the lower surface of the holding portion 45, and a suction hose 45b is connected to the opening of the side portion of the holding portion 45 of the suction hole 45a. The proximal end portion of the suction hose 45b is connected to a suction device (not shown).

導引部46包含可沿滑動構件42之軌道部升降之導引部主體46a、及連結導引部主體46a與加熱器44a之桿狀之連結部46b,並追隨於藉由缸體43之作動而升降之加熱機器44而升降。藉此,加熱機器44及保持部45能以不晃動而穩定之狀態升降。包含以此方式構成之加熱保持器具41之構件之貼附裝置的除此以外之部分之構成,與上述構件之貼附裝置10相同。 The guiding portion 46 includes a guiding portion main body 46a that can be raised and lowered along the rail portion of the sliding member 42, and a rod-shaped connecting portion 46b that connects the guiding portion main body 46a and the heater 44a, and follows the movement of the cylinder 43 The lifting machine 44 is raised and lowered. Thereby, the heating device 44 and the holding portion 45 can be raised and lowered in a state where they are not shaken and stabilized. The other components of the attaching device including the member of the heating holder 41 configured in this manner are the same as those of the above-described member attaching device 10.

根據包含該加熱保持器具41之構件之貼附裝置,可於將小片構件A貼附並固定於被定置部13a時,使缸體43作動而相對於被定置部13a更牢固地壓接小片構件A,故而可使小片構件A相對於被定置部13a之固定更確實。包含該加熱保持器具41之構件之貼附裝置之除此以外的作用效果,與上述之構件之貼附裝置10之作用效果相同。 According to the attaching device including the member of the heating holder 41, when the small piece member A is attached and fixed to the fixed portion 13a, the cylinder 43 can be actuated to press the small piece member more firmly with respect to the fixed portion 13a. Therefore, the fixing of the small piece member A with respect to the fixed portion 13a can be made more sure. The other effects of the attachment device including the member of the heating holder 41 are the same as those of the attachment device 10 of the above-described member.

(第3變化例) (3rd variation)

圖5表示上述第1實施形態之第3變化例之構件之貼附裝置所具備的加熱保持器具51。於該加熱保持器具51中,在殼體57設置有構成加熱保持器具51之主體部分之加熱機器54及保持部55。該殼體57係下部構成保持部55之一部分,並且於內部之下部設置加熱機器54而構成。保持部55係藉由在下表面中央與位於殼體57之下部之側部形成開口,且使吸引用之軟管55a自外部穿過側部之開口並將其前端部固定於下表面中央之開口而形成。即,於該保持部55,軟管55a之位於兩開口之間之部分成為本發明之吸引孔。 Fig. 5 shows a heating holder 51 included in the attachment device of the member according to the third modification of the first embodiment. In the heating holder 51, a heating device 54 and a holding portion 55 that constitute a main portion of the heating holder 51 are provided in the casing 57. The casing 57 has a lower portion constituting one portion of the holding portion 55, and is configured by providing a heating machine 54 at the lower portion. The holding portion 55 is formed by opening at the center of the lower surface and the side portion located at the lower portion of the casing 57, and allowing the suction hose 55a to pass through the opening of the side portion from the outside and fixing the front end portion thereof to the center of the lower surface. And formed. That is, in the holding portion 55, the portion of the hose 55a between the two openings serves as the suction hole of the present invention.

而且,加熱機器54包含加熱器54a、及檢測加熱器54a之溫度之溫度感測器,且加熱器54a形成為於中央形成有沿上下貫通之孔之板狀。該加熱器54a係以使軟管55a穿過中央之孔之狀態設置於保持部55之內部之下部,並藉由通電而對保持部55之下表面部進行加熱。又,於殼體57之側部之上下方向之中央部分形成有插通孔,連接於加熱機器54之配線54b通過該插通孔而向外部延伸。 Further, the heating device 54 includes a heater 54a and a temperature sensor that detects the temperature of the heater 54a, and the heater 54a is formed in a plate shape having a hole penetrating vertically in the center. The heater 54a is provided below the inside of the holding portion 55 in a state in which the hose 55a passes through the center hole, and the lower surface portion of the holding portion 55 is heated by energization. Further, an insertion hole is formed in a central portion of the side portion of the casing 57 in the up-down direction, and the wiring 54b connected to the heating device 54 extends to the outside through the insertion hole.

而且,於殼體57之側部之較上下方向之中央略靠上部側形成有導引部57a。該導引部57a之前端部(圖之右側之端部)係形成為與上述導引部46之導引部主體46a相同之形狀。該加熱保持器具51之除此以外之部分之構成與上述加熱保持器具41相同。因此,對同一部分標記同一符號而省略說明。又,包含以此方式構成之加熱保持器具51之構件之貼附裝置的除此以外之部分之構成,與上述之構件之貼附裝置10相同。 Further, a guide portion 57a is formed on the upper side of the side portion of the casing 57 in the vertical direction. The front end portion (the end portion on the right side of the drawing) of the guiding portion 57a is formed in the same shape as the guiding portion main body 46a of the guiding portion 46. The other components of the heating holder 51 are the same as those of the heating holder 41 described above. Therefore, the same portions are denoted by the same reference numerals, and the description is omitted. Further, the other components of the attaching device including the member of the heating holder 51 configured in this manner are the same as those of the above-described member attaching device 10.

根據包含該加熱保持器具51之構件之貼附裝置,可有效率地對保持部55之下表面部進行加熱。又,可堅固地形成包含加熱機器54與保持部55之加熱保持器具51之主體部分。包含該加熱保持器具51之構件之貼附裝置之除此以外的作用效果,與包含上述加熱保持器具41之構件之貼附裝置之作用效果相同。 According to the attaching device including the member of the heating holder 51, the lower surface portion of the holding portion 55 can be efficiently heated. Further, the main body portion of the heating holder 51 including the heating device 54 and the holding portion 55 can be formed firmly. The other effects of the attachment device including the member of the heating holder 51 are the same as those of the attachment device including the member of the heating holder 41.

(第2實施形態) (Second embodiment)

圖6表示本發明之第2實施形態之構件之貼附裝置所具備的加熱保持器具61。於該加熱保持器具61中,保持部65並非藉由吸引而保持小片構件A或小片構件B,而以可藉由使用機械機構握持而保持之方式構成。作為該保持部65,可使用各種物體,可使用例如:形成為框狀並可藉由將小片構件A或小片構件B插入至框內而保持者、或包含複數個爪部並可藉由利用該爪部夾持小片構件A或小片構件B而保持者。該加熱保持器具61之除此以外之部分之構成,與上述加熱保持器具41相同。因此,對同一部分標記同一符號而省略說明。 Fig. 6 shows a heating holder 61 included in the attachment device of the member according to the second embodiment of the present invention. In the heating holder 61, the holding portion 65 is not configured to hold the small piece member A or the small piece member B by suction, and is configured to be held by being held by a mechanical mechanism. As the holding portion 65, various objects can be used, and for example, it can be formed in a frame shape and can be held by inserting the small piece member A or the small piece member B into the frame, or can include a plurality of claw portions and can be utilized by The claw portion holds the small piece member A or the small piece member B to hold the holder. The other components of the heating holder 61 are the same as those of the heating holder 41 described above. Therefore, the same portions are denoted by the same reference numerals, and the description is omitted.

又,包含以此方式構成之加熱保持器具61之構件之貼附裝置的除此以外之部分之構成,亦與上述之構件之貼附裝置10相同。包含該加熱保持器具61之構件之貼附裝置,尤其於將如小片構件B般具有某種程度之硬度而不易變形之小片構件貼附於被定置部13a之情形時,可進行確實之保持,故而較佳。包含該加熱保持器具61之構件之貼附 裝置之除此以外的作用效果,與上述構件之貼附裝置10之作用效果相同。 Further, the other components of the attaching device including the member of the heating holder 61 configured in this manner are the same as those of the above-described member attaching device 10. The attaching device including the member of the heating holder 61 can be reliably held even when a small piece member having a certain degree of hardness such as the small piece member B is not easily deformed and attached to the fixed portion 13a. Therefore, it is better. Attachment of the member including the heating holder 61 The other effects of the device are the same as those of the attachment device 10 of the above-described member.

(第2實施形態之變化例) (Variation of the second embodiment)

圖7表示上述第2實施形態之變化例之構件之貼附裝置所具備的加熱保持器具71。於該加熱保持器具71中,殼體77之下部與上述保持部65同樣地包含可藉由夾持小片構件B而保持之保持部75。而且,加熱機器74之加熱器74a形成為無孔之板狀。該加熱保持器具71之除此以外之部分之構成,與上述加熱保持器具51相同。因此,對同一部分標記同一符號而省略說明。又,包含以此方式構成之加熱保持器具71之構件之貼附裝置的除此以外之部分之構成,亦與上述之構件之貼附裝置10相同。 Fig. 7 shows a heating holder 71 included in the attachment device of the member according to the modification of the second embodiment. In the heating holder 71, the lower portion of the casing 77 includes a holding portion 75 that can be held by sandwiching the small piece member B, similarly to the holding portion 65. Further, the heater 74a of the heating machine 74 is formed in a plate shape without a hole. The other components of the heating holder 71 are the same as those of the heating holder 51 described above. Therefore, the same portions are denoted by the same reference numerals, and the description is omitted. Further, the other components of the attaching device including the member of the heating holder 71 configured in this manner are the same as those of the above-described member attaching device 10.

根據包含該加熱保持器具71之構件之貼附裝置,可有效率地對保持部75之下表面部進行加熱。又,可堅固地形成包含加熱機器74與保持部75之加熱保持器具71之主體部分。包含該軸部71之構件之貼附裝置之除此以外的作用效果,與包含上述加熱保持器具61之構件之貼附裝置之作用效果相同。 According to the attaching device including the member of the heating holder 71, the lower surface portion of the holding portion 75 can be efficiently heated. Further, the main body portion of the heating holder 71 including the heating device 74 and the holding portion 75 can be firmly formed. The other functions and effects of the attaching device including the member of the shaft portion 71 are the same as those of the attaching device including the member of the heating holder 61.

(第3實施形態) (Third embodiment)

圖8表示本發明之第3實施形態之構件之貼附裝置所具備的加熱保持器具81。於該加熱保持器具81中,保持部85係於包含鋼板之箱狀之收容部85a之內部收容磁產生用之螺線管85b而構成。而且,連接於螺線管85b之配線85c自收容部85a之上部向外部延伸。該保持部85藉由螺線管85b所產生之磁之吸引力,而將小片構件C吸附於收容部85a之下表面。該小片構件C係與小片構件B同樣地包含較薄之不鏽鋼板、及形成於該不鏽鋼板之下表面之接著層,但於該不鏽鋼板使用具有磁性之不鏽鋼。該加熱保持器具81之除此以外之部分之構成,與上述加熱保持器具41相同。因此,對同一部分標記同一符號而省略說 明。 Fig. 8 shows a heating holder 81 provided in the attachment device of the member according to the third embodiment of the present invention. In the heating and holding device 81, the holding portion 85 is configured to accommodate the magnetic generating solenoid 85b inside the box-shaped housing portion 85a including the steel sheet. Further, the wiring 85c connected to the solenoid 85b extends outward from the upper portion of the accommodating portion 85a. The holding portion 85 attracts the small piece member C to the lower surface of the accommodating portion 85a by the magnetic attraction force generated by the solenoid 85b. Similarly to the small piece member B, the small piece member C includes a thin stainless steel plate and an adhesive layer formed on the lower surface of the stainless steel plate, but a stainless steel having magnetic properties is used for the stainless steel plate. The other components of the heating holder 81 are the same as those of the heating holder 41 described above. Therefore, the same part is marked with the same symbol and is omitted. Bright.

又,包含以此方式構成之加熱保持器具81之構件之貼附裝置的除此以外之部分之構成,亦與上述構件之貼附裝置10相同。包含該加熱保持器具81之構件之貼附裝置可用於將如小片構件C般具有磁性之小片構件貼附於被定置部13a之情形。而且,根據包含該加熱保持器具81之構件之貼附裝置,亦可獲得與包含加熱保持器具41之構件之貼附裝置同樣之作用效果。 Further, the other components of the attaching device including the member of the heating holder 81 configured in this manner are also the same as the attaching device 10 of the above member. The attaching means including the member of the heating holder 81 can be used to attach a small piece member having magnetic properties like the small piece member C to the fixed portion 13a. Further, according to the attaching device including the member of the heating holder 81, the same effects as those of the attaching device including the member of the heating holder 41 can be obtained.

(第3實施形態之變化例) (Variation of the third embodiment)

圖9表示上述第3實施形態之變化例之構件之貼附裝置所具備的加熱保持器具91。於該加熱保持器具91中,在殼體97內之上部設置有與上述之螺線管85b同樣之螺線管95,且連接於螺線管95之配線95a自殼體97之上部向外部延伸。又,殼體97之下表面形成為平面狀。即,於該加熱保持器具91中,由殼體97與螺線管95構成保持部。該加熱保持器具91之除此以外之部分之構成,與上述之加熱保持器具71相同。因此,對同一部分標記同一符號而省略說明。又,包含以此方式構成之加熱保持器具91之構件之貼附裝置的除此以外之部分之構成,亦與上述之構件之貼附裝置10相同。 Fig. 9 shows a heating holder 91 provided in the attachment device of the member according to the modification of the third embodiment. In the heating holder 91, a solenoid 95 similar to the above-described solenoid 85b is provided in the upper portion of the casing 97, and the wiring 95a connected to the solenoid 95 extends from the upper portion of the casing 97 to the outside. . Further, the lower surface of the casing 97 is formed in a planar shape. That is, in the heating holder 91, the housing 97 and the solenoid 95 constitute a holding portion. The other components of the heating holder 91 are the same as those of the above-described heating holder 71. Therefore, the same portions are denoted by the same reference numerals, and the description is omitted. Further, the other components of the attaching device including the member of the heating holder 91 configured in this manner are the same as those of the above-described member attaching device 10.

包含該加熱保持器具91之構件之貼附裝置亦可用於將如小片構件C般具有磁性之小片構件貼附於被定置部13a之情形。而且,根據該加熱保持器具91,可堅固地形成包含加熱機器74與螺線管95之加熱保持器具91之主體部分。包含該加熱保持器具91之構件之貼附裝置之除此以外的作用效果,與包含上述加熱保持器具81之構件之貼附裝置之作用效果相同。 The attaching device including the member of the heating holder 91 can also be used to attach a small piece member having magnetic properties like the small piece member C to the fixed portion 13a. Further, according to the heating holder 91, the main portion of the heating holder 91 including the heating device 74 and the solenoid 95 can be firmly formed. The other effects of the attachment device including the member of the heating holder 91 are the same as those of the attachment device including the member of the heating holder 81.

再者,亦可使用僅由金屬材料等即便加熱亦不會產生接著性之材料構成之小片構件,而代替上述之各實施形態或各變化例中所使用之小片構件A、B、C。該情形時,於使用第3實施形態及其變化例之 構件之貼附裝置之情形時,亦設為具有磁性之小片構件。而且,被定置構件13包含若加熱至200℃以下之溫度則變化而產生接著性之熱塑性聚醯亞胺、或其他熱塑性樹脂材料或者熱硬化性樹脂材料等。於此情形時,被定置構件13之被定置部13a藉由接觸於小片構件而被加熱,從而接著於小片構件。 Further, instead of the small-diameter members A, B, and C used in the above-described respective embodiments or modifications, a small-piece member made of a material that does not cause an adhesive property even if heated by a metal material or the like may be used. In this case, the third embodiment and its modifications are used. In the case of the attachment means of the member, it is also set as a small piece member having magnetic properties. Further, the fixed member 13 includes a thermoplastic polyimide, or another thermoplastic resin material or a thermosetting resin material which changes to a temperature of 200 ° C or lower and which changes in temperature. In this case, the fixed portion 13a of the fixed member 13 is heated by contact with the small piece member to be followed by the small piece member.

又,於上述之各實施形態或各變化例中,對將薄板狀之小片構件A、B、C貼附於被定置構件13之被定置部13a之例進行了說明。然而,貼附於被定置構件13之被定置部13a之構件可不為小片構件,亦可不為薄板狀。例如,可不為薄板狀且不為小片之IC(Integrated Circuit,積體電路)、略厚之不為小片之包含多層基板之各種電子零件。進而,亦可不為電子零件。 Moreover, in each of the above-described embodiments and the respective modifications, the example in which the thin plate-shaped small-piece members A, B, and C are attached to the fixed portion 13a of the fixed member 13 has been described. However, the member attached to the fixed portion 13a of the fixed member 13 may not be a small piece member, and may not be in the form of a thin plate. For example, an IC (Integrated Circuit) which is not a thin plate and is not a small piece, and various electronic parts including a multilayer substrate which are not thickly small may be used. Furthermore, it may not be an electronic component.

又,本發明之構件之貼附裝置並不限定於上述之各實施形態及各變化例,可進行適當變更而實施。例如,於上述之各實施形態等中,分別設置有5個加熱保持器具22、34等,但該加熱保持器具22、34等可設置為5個以外之複數個,亦可僅設置為1個。又,於設置複數個加熱保持器具22、34等之情形時,較佳為使各加熱保持器具22、34等之間隔與配置於托盤11上之小片構件A、B、C等之間隔相同。 Moreover, the attachment device of the member of the present invention is not limited to the above-described respective embodiments and modifications, and can be modified as appropriate. For example, in each of the above-described embodiments and the like, five heating holders 22 and 34 are provided, but the heating holders 22 and 34 may be provided in a plurality of five or more, or may be provided as one. . Moreover, when a plurality of heating holders 22, 34 and the like are provided, it is preferable that the interval between the respective heating holders 22, 34 and the like is the same as the interval between the small-piece members A, B, C and the like disposed on the tray 11.

又,亦可將保持部24、45等之下部設為可相對於上部裝卸,而可將保持部24、55等之下部更換為與小片構件A、B、C等之形狀對應者。藉此,可進行與小片構件A、B、C等之形狀對應之最佳之貼附。又,於上述之第3實施形態及其變化例之構件之貼附裝置中,作為利用磁力產生吸引力者,使用螺線管85b、95,但亦可使用將永久磁鐵與螺線管組合而成者來代替此。於此情形時,利用永久磁鐵之吸引力吸附小片構件C,於解除小片構件C之吸附時,使螺線管產生與永久磁鐵相反之磁極。藉此,可解除藉由永久磁鐵對小片構件C之吸附。又,對構成本發明之構件之貼附裝置之除此以外之部分,亦可於本發 明之技術範圍內進行適當變更。 Further, the lower portions of the holding portions 24 and 45 may be detachably attached to the upper portion, and the lower portions of the holding portions 24 and 55 may be replaced with the shapes corresponding to the small pieces A, B, and C. Thereby, the best attachment to the shape of the small pieces A, B, C, etc. can be performed. Further, in the attaching device of the member according to the third embodiment and the modified example described above, the solenoids 85b and 95 are used as the attractive force by the magnetic force, but the permanent magnet and the solenoid may be combined. The winner is to replace this. In this case, the small piece member C is adsorbed by the attraction force of the permanent magnet, and when the adsorption of the small piece member C is released, the solenoid is made to have a magnetic pole opposite to the permanent magnet. Thereby, the adsorption of the small piece member C by the permanent magnet can be released. Further, other parts of the attaching device constituting the member of the present invention may also be used in the present invention. Appropriate changes are made within the technical scope of Ming.

10‧‧‧貼附裝置 10‧‧‧ Attachment device

10a‧‧‧搬送裝置 10a‧‧‧Transporting device

11‧‧‧托盤 11‧‧‧Tray

12‧‧‧固定台 12‧‧‧ fixed table

13‧‧‧被定置構件 13‧‧‧Fixed components

13a‧‧‧被定置部 13a‧‧‧Departed

14a‧‧‧圖像識別裝置 14a‧‧‧Image recognition device

14b‧‧‧構件用狀態檢測裝置 14b‧‧‧ Component state detection device

15‧‧‧左右方向移動機構 15‧‧‧ moving direction mechanism

15a‧‧‧X軌道 15a‧‧‧X track

15b‧‧‧X軌道 15b‧‧‧X track

15c‧‧‧腿部 15c‧‧‧ legs

15d‧‧‧腿部 15d‧‧‧ legs

16‧‧‧前後方向移動機構 16‧‧‧ Moving direction mechanism

16a‧‧‧Y軌道 16a‧‧‧Y track

16b‧‧‧Y軌道 16b‧‧‧Y track

16c‧‧‧前後方向驅動裝置 16c‧‧‧ front and rear direction drive

17‧‧‧升降機構 17‧‧‧ Lifting mechanism

17a‧‧‧保持單元升降軸 17a‧‧‧Holding unit lifting shaft

20‧‧‧保持單元 20‧‧‧Holding unit

A‧‧‧小片構件 A‧‧‧ small piece components

Claims (9)

一種小片構件之貼附裝置,其特徵在於:其係利用搬送裝置搬送被加熱之上述小片構件並壓接、貼附於被定置構件之被定置部者,且於上述搬送裝置包含:保持部,其保持上述小片構件;加熱部,其藉由對上述保持部進行加熱,而經由上述保持部對上述小片構件進行加熱;及按壓部,其將上述小片構件按壓於上述被定置構件之被定置部,且上述搬送裝置係一面搬送上述小片構件一面加熱上述小片構件。 A device for attaching a small piece member, wherein the small piece member to be heated is conveyed by a conveying device, and is pressed and attached to a fixed portion of the fixed member, and the conveying device includes a holding portion. Holding the small piece member; the heating portion heating the small piece member via the holding portion by heating the holding portion; and the pressing portion pressing the small piece member to the fixed portion of the fixed member And the conveying device heats the small piece member while conveying the small piece member. 如請求項1之小片構件之貼附裝置,其中上述小片構件及上述被定置部之至少一者之整體或一部分,包含在被加熱之狀態下藉由相互壓接而接著之材料。 The attaching device for a small piece member according to claim 1, wherein the whole or a part of at least one of the small piece member and the fixed portion includes a material which is pressed by being pressed against each other in a heated state. 如請求項2之小片構件之貼附裝置,其中上述材料係藉由加熱而軟化從而黏著性增強之接著劑、熱塑性之樹脂或熱硬化性之樹脂。 The attaching device for a small piece member of claim 2, wherein the material is an adhesive which is softened by heating to enhance adhesion, a thermoplastic resin or a thermosetting resin. 如請求項1之小片構件之貼附裝置,其中上述搬送裝置包含使上述保持部、上述加熱部及上述按壓部於左右方向、前後方向、上下方向及以沿上下延伸之軸為中心之旋轉方向移動之移動機構,且上述保持部之下端部配置於上述加熱部及上述按壓部之下方。 The attaching device for a small piece member according to claim 1, wherein the conveying device includes the holding unit, the heating unit, and the pressing unit in a left-right direction, a front-rear direction, a vertical direction, and a rotation direction centering on an axis extending upward and downward The moving mechanism is moved, and the lower end portion of the holding portion is disposed below the heating portion and the pressing portion. 如請求項1之小片構件之貼附裝置,其中上述搬送裝置包含複數組上述保持部及上述加熱部。 The attaching device for a small piece member according to claim 1, wherein the conveying device includes a plurality of the holding portions and the heating portion. 如請求項1至5中任一項之小片構件之貼附裝置,其中上述保持部包含在下部中央與側部之間形成有吸引孔之導熱體,且藉由自上述吸引孔之側部之開口吸引,而可於上述保持部之下部保持上述小片構件。 The attaching device for a small piece member according to any one of claims 1 to 5, wherein the holding portion includes a heat conductor having a suction hole formed between a center portion and a side portion of the lower portion, and is provided by a side portion of the suction hole The opening is attracted, and the small piece member can be held under the holding portion. 如請求項1至5中任一項之小片構件之貼附裝置,其中上述保持部包含可握持上述小片構件之握持部。 The attaching device for a small piece member according to any one of claims 1 to 5, wherein the holding portion includes a grip portion that can hold the small piece member. 如請求項1至5中任一項之小片構件之貼附裝置,其中上述小片構件之至少上表面包含具有磁性之吸附面,且上述保持部包含利用由磁力所產生之吸引力之吸引機構。 The attaching device for a small piece member according to any one of claims 1 to 5, wherein at least an upper surface of the small piece member includes a magnetic adsorption surface, and the holding portion includes an attraction mechanism that utilizes an attractive force generated by a magnetic force. 一種小片構件之貼附方法,其特徵在於:其係使用搬送裝置搬送上述小片構件並壓接、貼附於被定置構件之被定置部者,且於上述搬送裝置,保持並搬送上述小片構件,且一面搬送上述小片構件一面加熱上述小片構件,其後,使上述小片構件按壓於上述被定置小片構件之被定置部。 A method of attaching a small piece member, wherein the small piece member is conveyed by a conveying device, and is pressed and attached to a fixed portion of the fixed member, and the small member is held and conveyed by the conveying device. The small piece member is heated while the small piece member is conveyed, and then the small piece member is pressed against the fixed portion of the fixed small piece member.
TW102137552A 2012-11-13 2013-10-17 Attachment device and attachment method TWI609766B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012248992A JP6045310B2 (en) 2012-11-13 2012-11-13 Small piece material pasting device

Publications (2)

Publication Number Publication Date
TW201424999A TW201424999A (en) 2014-07-01
TWI609766B true TWI609766B (en) 2018-01-01

Family

ID=50709671

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102137552A TWI609766B (en) 2012-11-13 2013-10-17 Attachment device and attachment method

Country Status (4)

Country Link
JP (1) JP6045310B2 (en)
KR (1) KR101601368B1 (en)
CN (1) CN103813643B (en)
TW (1) TWI609766B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104202908B (en) * 2014-08-28 2017-06-13 珠海市运泰利自动化设备有限公司 A kind of FPC reinforcing chips mounting head device
JP6495631B2 (en) * 2014-11-28 2019-04-03 ムネカタインダストリアルマシナリー株式会社 Heat welding equipment
KR101713193B1 (en) * 2016-09-21 2017-03-07 한국컴퓨터주식회사 Bending jig for printed board assembly
CN107846835B (en) * 2017-10-27 2024-01-09 东莞东聚电子电讯制品有限公司 Patch device with heating function
CN112352476A (en) * 2018-07-12 2021-02-09 迪睿合株式会社 Pickup apparatus, mounting apparatus, pickup method, and mounting method

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09102572A (en) * 1995-10-06 1997-04-15 Ibiden Co Ltd Device for sticking and mounting substrate for chip
US6347734B1 (en) * 2000-03-27 2002-02-19 Emc Corporation Methods and apparatus for installing a module on a circuit board using heating and cooling techniques
TWI264781B (en) * 2004-03-05 2006-10-21 Towa Corp Method for sticking adhesive tape for die bonding and method for mounting electronic component
KR20070014300A (en) * 2005-07-28 2007-02-01 기아자동차주식회사 Apparatus for moving panel during manufacturing process
CN101953238A (en) * 2009-01-19 2011-01-19 雅马哈精密科技株式会社 The transfer setting device and the head device thereof of film laminating device, little chip part
US20110168761A1 (en) * 2010-01-11 2011-07-14 Samsung Electronics Co., Ltd. Apparatus for repairing semiconductor module

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0664414B2 (en) * 1985-11-08 1994-08-22 株式会社サトー Label for automatic application
JP2764446B2 (en) * 1989-12-21 1998-06-11 株式会社バルダン Label supply device and label supply method
JP4372605B2 (en) * 2004-04-15 2009-11-25 パナソニック株式会社 Electronic component mounting apparatus and electronic component mounting method
JP5107273B2 (en) * 2009-01-26 2012-12-26 ヤマハファインテック株式会社 Film sticking device
CN102291944B (en) * 2010-06-21 2013-06-19 王定锋 Method for pasting electronic components by groups by using SMT
CN202523694U (en) * 2012-01-16 2012-11-07 刘义清 IC conveying structure of packaging machine

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09102572A (en) * 1995-10-06 1997-04-15 Ibiden Co Ltd Device for sticking and mounting substrate for chip
US6347734B1 (en) * 2000-03-27 2002-02-19 Emc Corporation Methods and apparatus for installing a module on a circuit board using heating and cooling techniques
TWI264781B (en) * 2004-03-05 2006-10-21 Towa Corp Method for sticking adhesive tape for die bonding and method for mounting electronic component
KR20070014300A (en) * 2005-07-28 2007-02-01 기아자동차주식회사 Apparatus for moving panel during manufacturing process
CN101953238A (en) * 2009-01-19 2011-01-19 雅马哈精密科技株式会社 The transfer setting device and the head device thereof of film laminating device, little chip part
US20110168761A1 (en) * 2010-01-11 2011-07-14 Samsung Electronics Co., Ltd. Apparatus for repairing semiconductor module

Also Published As

Publication number Publication date
CN103813643A (en) 2014-05-21
JP2014097581A (en) 2014-05-29
KR20140061250A (en) 2014-05-21
TW201424999A (en) 2014-07-01
CN103813643B (en) 2018-05-08
JP6045310B2 (en) 2016-12-14
KR101601368B1 (en) 2016-03-08

Similar Documents

Publication Publication Date Title
TWI609766B (en) Attachment device and attachment method
KR20060087513A (en) Electronic component mounting apparatus and method of mounting electronic components
JP2013222771A (en) Holding nozzle and electronic component mounting apparatus
JP4371619B2 (en) Reflow device
KR20140086789A (en) Component inversion unit
JP6499768B2 (en) Component mounter, component holding member imaging method
JP5730664B2 (en) Electronic component mounting machine
JP6283819B2 (en) Insert head, component insertion device and component mounting line
JP5372661B2 (en) Electronic component mounting device
KR102486302B1 (en) Machining apparatus
JP2020192638A (en) Pickup device and workpiece carrying method
JP2002148307A (en) Conveyance method of ic handler
JP6571201B2 (en) Component mounting method
JP2011251453A (en) Reinforcing plate sticking apparatus
JP5211295B2 (en) Component supply apparatus and component supply method
JP7075498B2 (en) Working machine
JP6842948B2 (en) Positioning device and positioning method
KR101815415B1 (en) Object processing apparatus
JP2002158496A (en) Component mounting method, suction nozzle and component mounting equipment suitably used therefor
JP2005223241A (en) Apparatus and method for bonding electronic component, and apparatus for mounting the electronic component
JP6715169B2 (en) Component mounting device
KR101358275B1 (en) A sheet attachment head of pcb
JP2015123571A (en) Substrate sucking and conveying mechanism
JP4909804B2 (en) Surface mount equipment
JP6004879B2 (en) Cutting equipment