CN1260779C - Method and device for removing useless materials from semiconductor wafers - Google Patents
Method and device for removing useless materials from semiconductor wafers Download PDFInfo
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- CN1260779C CN1260779C CN 02103461 CN02103461A CN1260779C CN 1260779 C CN1260779 C CN 1260779C CN 02103461 CN02103461 CN 02103461 CN 02103461 A CN02103461 A CN 02103461A CN 1260779 C CN1260779 C CN 1260779C
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- fringeware
- wafer
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Abstract
An apparatus for removing an unwanted substance from a semiconductor wafer, according to this invention, applies a peeling tape T to a protective tape P on the surface of the semiconductor wafer W. An edge member 28 is placed in contact with the surface of the peeling tape T and run along the protective tape P. The peeling tape T is peeled as being folded back by a large angle of 90 degrees or more at the tip of edge member 28. The protective tape P is peeled and removed along with the peeling tape T from the surface of the wafer. As a result, the unwanted substance is removed with high precision without breaking the wafer W.
Description
Technical field
The present invention relates to use and peel off band from the surperficial removing useless materials of semiconductor wafer (below abbreviation wafer), such as the method for boundary belt, protective layer etc. with make in this way device.
Background technology
Usually; during the back side of grinding wafers after figure forms technology (grinding behind); one wide boundary belt at first is provided on the surface of wafer; the a part of boundary belt outstanding from the neighboring of wafer is cut along wafer perimeter; then wafer is carried out milled processed; and the protected band protection in its whole surface, and by the suction supporting in its surface by a sucker.Then, sur-face peeling and the removing from wafer has been the boundary belt of useless material now.
The sweep-out method that band is peeled off in use occurs with the form of the device of peeling boundary belt off, and its outward appearance as shown in figure 30.In this sweep-out method, will have than more strongly adherent the peeling off of boundary belt P and be with T to offer boundary belt (useless material) P that is bonded in the wafer W surface.It is rolled-up to peel off band T, and stripper roll 40 is rolled on wafer simultaneously, and moves right in Figure 30, and thus, shown in the dotted line among Figure 30, boundary belt P is stripped from peeling off band T.
Like this, peeling off band T is reeled with the curvature of stripper roll 40.Boundary belt P be stripped from from the surface of wafer W a bit, boundary belt P is very little with respect to the peel angle of wafer surface, approaches zeroly, and peeling force applies with the direction perpendicular to wafer W almost.As a result, at the wafer W weakness, as shown in figure 31, wafer may break at an A place.
In addition, shown in figure 32, the wafer W with hypotenuse b (this hypotenuse by inclined cut neighboring form) may be ground to a big degree behind, be arrived the horizontal G place of hypotenuse b.For this thin wafer W, as shown in figure 33, the outstanding end Pa of boundary belt P may descend and stick on the hypotenuse b.In this case, it may be difficult beginning to peel off boundary belt P in the end.When peeling off band T and roll with the stripper roll 40 of rolling along this state, wafer W is easy to break.
Above-mentioned phenomenon, promptly peel off the belt peeling force that applies when being stripped from of band and make wafer breakage also can directly offer the surface of wafer so that generation when peeling off tape erasure and stay the protective layer of wafer surface (useless material) peeling off band.
Summary of the invention
The present invention has considered the situation of above-mentioned prior art, its objective is that providing a kind of utilization to peel off band peels off and remove the sweep-out method and the device of useless material from wafer, avoids making wafer breakage because of the belt peeling force simultaneously.
To achieve these goals, the invention provides and a kind ofly bring semiconductor wafer by providing to peel off, from the semiconductor wafer removing useless materials, and from semiconductor wafer, peel off the method for useless material with peeling off band, described method comprises the following steps: a fringeware is arranged to contact with the surface of peeling off band that offers semiconductor wafer, and peel off this and peel off band, the peel angle that end was provided with this fringeware turns back simultaneously, and when the end of described fringeware is moved beyond a terminal of described semiconductor wafer, prevent that the end of this fringeware from falling.
In said method, the band of peeling off that offers wafer is folded back at the peel angle place that the fringeware end provides.The belt peel angle of wafer surface is greater than the peel angle that uses stripper roll like this, relatively.Therefore, peeling off band can give under the situation of wafer and be stripped from not applying strong peeling force.Even useless material can be stripped from and remove with peeling off band from the surface of thin wafer, and does not damage wafer.
Removing according to the present invention in the method for useless material, the end by fringeware offers peel angle preferably an acute angle or an obtuse angle of peeling off band.More preferably, the obtuse angle is 90 degree at least, and acute angle is less than 90 degree.
That is, the height of fringeware end remains unchanged.The fringeware end begins to finishing to remain on a Metacentre Height from moving.
Removing according to the present invention in the method for useless material, the end of fringeware preferably moves back and forth by a little stroke in the end of wafer.
Peel off band and arrive the end of wafer and can be efficiently peel off and band is peeled off in removing by moving back and forth fringeware from wafer.
In the method according to the useless material of removing of the present invention, the useless material on semiconductor wafer preferably is applied to the boundary belt of wafer surface or is formed on the protective layer of wafer surface.
The present invention also provides a kind of device from the semiconductor wafer removing useless materials, and this device comprises: the stripping table of a support semi-conductor wafers; One provides the belt of peeling off the semiconductor wafer that brings on stripping table server; One admits and to peel off band and to provide this to peel off the belt that the brings semiconductor wafer unit of applying ointment or plaster; One has fringeware so that the belt of peeling off band from semiconductor wafer is peeled off the unit, and it is from the end of semiconductor wafer, makes by the peel angle of peeling off band with the end of fringeware relatively and providing and peels off band and turn back; An and tape collector; so that collect peel off from wafer, have useless material peel off band; described belt is peeled off the unit and is had a holding device; described protective device is used for preventing that the end of described fringeware from falling when the described end of peeling off the described fringeware that band peels off from described semiconductor wafer is moved beyond a terminal of described semiconductor wafer.
In said apparatus, operation can be on stripping table provides the fringeware of big peel angle will peel off band by use to offer wafer continuously and peel off band and carry out.Also can use series of steps to provide and band is peeled off in collection.Like this, can remove useless material from the surface of wafer effectively, therefore, many wafers are handled serially.
Because the device of regulating the fringeware angle has been arranged, and belt can be stripped from suitable peel angle.Owing to had holding device, the height of fringeware end can keep stable, like this, the end of fringeware can begin to finishing to keep a stable height from moving.
In the device according to the useless material of removing of the present invention, belt is peeled off the unit and is preferably comprised: unit, an edge, it have fixed thereon, and can peel off the fringeware that the cell moving direction is supported with swinging back and forth along belt; One angle regulator is so that regulate the angle of the relative wafer surface of fringeware; And a holding device, fall when the end of peeling off the fringeware of band from wafer is moved beyond the terminal of wafer so that prevent the end of fringeware; Angle regulator has the parts that make the edge cells swing, so that regulate the angle of fringeware end; And holding device has parts, so that the vertical moving of the fringeware end that restriction takes place with the swing of unit, edge.
Edge cells is supported to and can swings back and forth along the moving direction that belt is peeled off the unit.Edge cells can be swung by angle regulator, can easily set or change the angle and the height of fringeware thus.
The vertical moving that holding device restriction fringeware end takes place with the swing of unit, edge.This will prevent that the fringeware end from falling when the fringeware end of peeling off band is moved beyond the wafer end.That is, preventing to peel off band directly sticks on the wafer.
In device, offer peel angle preferably an acute angle or an obtuse angle of peeling off band by the fringeware end according to the useless material of removing of the present invention.More preferably, the obtuse angle is 90 degree at least, and acute angle is less than 90 degree.
In the device according to the useless material of removing of the present invention, holding device preferably comprises micrometer.
Device according to the useless material of removing of the present invention can comprise a device, and it makes the end of fringeware move back and forth by a little stroke in the end of wafer.
The end of peeling off the fringeware of band and arrival wafer end moves back and forth by a little stroke.As a result, can be efficiently peel off and band is peeled off in removing from wafer.
Description of drawings
Fig. 1 is the stereogram of the whole protecting band stripping off device among first embodiment;
Fig. 2 is the front view of the whole protecting band stripping off device among first embodiment;
Fig. 3 is the plane graph of the whole protecting band stripping off device among first embodiment;
Fig. 4 is that apply ointment or plaster unit and a belt of a belt peeled off the front view of unit;
Fig. 5 shows to be used for the front view that belt is peeled off the supporting structure of fringeware;
Fig. 6 is the stereogram that shows the major part of belt strip operation;
Fig. 7 is the front view that shows the belt stripping technology;
Fig. 8 is the front view that shows the belt stripping technology;
Fig. 9 is the front view that shows the belt stripping technology;
Figure 10 is the front view that shows the belt stripping technology;
Figure 11 is the front view that shows the belt stripping technology;
Figure 12 is the front view of amplification of the major part of belt stripping technology;
Figure 13 is the front view of amplification of the major part of belt stripping technology;
Figure 14 is the front view of amplification of the major part of belt stripping technology;
Figure 15 is the front view of amplification of the major part of belt stripping technology;
Figure 16 is the stereogram that shows the whole protecting band stripping off device among second embodiment;
Figure 17 is the front view of the whole protecting band stripping off device among second embodiment;
Figure 18 is the plane graph of the whole protecting band stripping off device among second embodiment;
Figure 19 is that apply ointment or plaster unit and belt of a belt peeled off the front view of unit;
Figure 20 shows to be used for the front view that belt is peeled off the supporting structure of fringeware;
Figure 21 is the stereogram that shows the major part of belt strip operation;
Figure 22 is the front view that shows the belt stripping technology;
Figure 23 is the front view that shows the belt stripping technology;
Figure 24 is the front view that shows the belt stripping technology;
Figure 25 is the front view that shows the belt stripping technology;
Figure 26 is the front view that shows the belt stripping technology;
Figure 27 is the front view that the belt of the device among demonstration the 3rd embodiment is peeled off the major part of unit;
Figure 28 is the plane graph of major part that shows the belt strip operation of the device among the 3rd embodiment;
Figure 29 is the front view that shows the major part of belt strip operation;
Figure 30 is the front view of amplification of the major part of the belt stripping technology that undertaken by conventional apparatus;
Figure 31 is the front view of amplification of the major part of the belt stripping technology that undertaken by conventional apparatus;
Figure 32 is the front view that has the part of semiconductor wafer boundary belt, bevel that applies thereon; And
Figure 33 is the front view of amplification of the major part of the technology of being undertaken by conventional apparatus, so as rearward after the attrition process semiconductor wafer from bevel peel boundary belt.
Embodiment
Following structure will be used to solve the problems of the prior art.
(first embodiment)
Describe first embodiment below with reference to the accompanying drawings, this embodiment implements a kind of form of the present invention.Fig. 1 is the stereogram that shows a whole protecting band stripping off device, and it is an example according to useless material scavenge unit of the present invention.Fig. 2 is a front view, and Fig. 3 is its plane graph.Fig. 4 is that apply ointment or plaster unit and a belt of a belt peeled off the front view of unit.Fig. 5 shows to be used for the front view that belt is peeled off the supporting structure of fringeware.Fig. 6 is the stereogram that shows the major part of belt strip operation.
This wafer protection tape erasure device comprises: a wafer supply station 1 is used to admit a box C1 of the wafer W of wherein piling up; Wafer transfer mechanism 3 with manipulator 2; Regulate the alignment stage 4 of wafer W position; Be supplied to one to peel off the belt server 5 of position with peeling off band T; Support the stripping table 6 of a wafer W with suction; Belt that band T is applied to the wafer W on the stripping table 6 unit 7 of applying ointment or plaster will be peeled off; The belt of being with T to peel of peeling off that applies is peeled off unit 8; Pick up and collect the tape collector 9 of peeling off band Ts that is peeled; And the wafer gathering station 10 that is used for admitting box C2, box C2 stores treated wafer 10 with stack manner; And a unit drive 11, it makes apply ointment or plaster unit 7 and belt of belt peel off unit 8 left and right sides reciprocating motion independently of each other.These parts are installed on the base plate 12 or the top.Wafer supply station 1, wafer transfer mechanism 3, alignment stage 4, stripping table 6 and wafer gathering station 10 are installed on the upper surface of base plate 12, and belt server 5 and tape collector 9 are installed on the front surface of vertical wall 13, and vertical wall 13 stands upright on the upper surface of base plate 12.Apply ointment or plaster unit 7 and belt of belt peeled off near the lower openings that unit 8 is installed in vertical wall 13, and unit drive 11 is installed in the rear side of vertical wall 13.
The manipulator 2 of connecting gear 3 can move horizontally and pivot, so that take each wafer W from wafer supply station 1, wafer W is offered alignment stage 4, send the wafer W on the alignment stage 4 to stripping table 6, unload each treated wafer W from stripping table 6, and treated wafer W is put into wafer gathering station 10.
As shown in Figure 3, stripping table 6 comprises and is installed in its center, vertically moving suction pads 18 that this spacer has the upper surface as the negative pressure of vacuum face.Stripping table 6 has negative pressure of vacuum face upwards, does not have the wafer W that moves with supporting.
As shown in Figure 4, belt apply ointment or plaster unit 7 comprise one that be supported, can be along the travelling frame 22 of track 21 move left and right.By the feed screw 23 of the reversible driving of motor M1, travelling frame 22 can about move back and forth a fixing stroke.Travelling frame 22 has an applicator roll 25, but by rocking arm 24 its quilt vertical moving ground supporting.
Belt peel off unit 8 also comprise one that be supported, can be along the travelling frame 26 of track 21 move left and right.By the feed screw 27 of the reversible driving of motor M2, travelling frame 26 can about move back and forth a fixing stroke.This travelling frame 26 has a belt and peels off driven outlet roller 30 of fringeware 28, a guide roller 29, one and a hold-down roller 31 relative with it.
As illustrated in Figures 5 and 6, belt is peeled off fringeware 28 and is formed by a plate, and it forms a sharp edges at its far-end, and has the width greater than wafer diameter.Fringeware 28 is fixedly connected on the swivel bearing axle 32, and bolster 32 is given prominence to by the front surface supporting of travelling frame 26 and from this front surface.Fringeware 28 is connected by notch 33 and bolt 34, and can be conditioned by the extension and the withdrawal of relative axle 32.Control arm 35 is fixed on the near-end of swivel bearing axle 32.Control arm 35 has a free end, and this end is connected on the connecting rod 37 pivotly, and connecting rod 37 is connected on the piston rod 36a of cylinder 36, and cylinder 36 is installed on the front surface of travelling frame 26.Piston rod 36a is scalable, thereby makes control arm 35 swings, swivel bearing axle 32 is rotated, last vertical moving fringeware 28.
The connecting rod 37 that extends out from the free end of control arm 35 is threaded with the piston rod 36a of cylinder 36.By regulating the length of thread engagement (LE) of connecting rod 37, can regulate the pendulum angle of control arm 35, this angle is the angle when piston rod 36a extends to its end of travel, when fringeware 28 is in lower limit position.
According to the parts of boundary belt stripping off device of the present invention as mentioned above.Introduce the basic process of peelling off boundary belt P from the wafer W surface below with reference to Fig. 7 to 11.
At first, manipulator 2 suction support a wafer W, and it from taking out in the box C1 in wafer supply station 1, and is placed on wafer W on the alignment stage 4.At this, wafer W is carried out position adjustments according to the directional plane of the wafer W that detects or the direction of recess.Wafer W through position adjustments is supported and is transmitted by manipulator 2 again, offers stripping table 6.
The wafer W that is placed on the stripping table 6 is admitted by the suction pads 18 of giving prominence to from stripping table 6.When suction pads 18 descended, wafer W was placed on the upper surface of stripping table 6 with predetermined attitude and position, and by the suction supporting thereon, and above apply the surface of wafer W of boundary belt P towards last.At this moment, as shown in Figure 7, apply ointment or plaster unit 7 and belt of belt peeled off unit 8 and remained on backward on the spare space away from stripping table 6.
When wafer W was placed on the stripping table 6, as shown in Figure 8, the apply ointment or plaster applicator roll 25 of unit 7 of belt dropped to a predeterminated level.Then, whole unit moves forward, and applicator roll 25 rolls on wafer W, is with T to offer the surface of boundary belt P with peeling off.
Peel off band during T when providing, as shown in Figure 9, the cylinder 36 that belt is peeled off unit 8 extends to end of travel, makes control arm 35 swings, thereby fringeware 28 is dropped to lower limit position.
Then, as shown in figure 10, belt is peeled off unit 8 and is moved forward, and the pointed end of fringeware 28 will peel off the band T be pressed on the surface of boundary belt P.Meanwhile, outlet roller 30 is to transmit the synchronous peripheral speed rotation of translational speed of peeling off band T with the unit.Like this, peel off band T and sentence an angle θ in the pointed end of fringeware 28 and turn back, and guiding is directed to a position between outlet roller 30 and the hold-down roller 31 by guide roller 29.As shown in Figure 6, peel off band T and take away firmly bonding boundary belt P thereon, thereby from the sur-face peeling boundary belt P of wafer W.
Like this, fringeware 28 is set to forward a low speed, begins to peel off from it boundary belt P when moving through the end of wafer W.Then, the speed that moves forward increases, so that increase work efficiency.Outlet roller 30 is by a slip-clutch that slides when load surpasses predetermined torque, by a unillustrated drive unit driving.Like this, peeling off band T is removed by the predetermined pulling force that applies thereon.
Finished a belt stripping process thus, and device prepares to handle next piece wafer.
The process of peeling off boundary belt P from a LED reverse mounting type W who grinds to form a hypotenuse b (seeing Figure 32) is behind described below with reference to Figure 12 to 15.
As shown in figure 12, the pointed end of the fringeware on lower limit position 28 is slightly below boundary belt P surface.Like this, when processing has the LED reverse mounting type W of hypotenuse b and the outstanding end Pa of boundary belt P when being bonded on the hypotenuse, also will peel off the outstanding end Pa that band T offers boundary belt P near the pointed end of the fringeware 28 of wafer W end.
Like this, when fringeware 28 moved forward and is positioned at the end of wafer W, as shown in figure 14, the outstanding end Pa that is bonded in the boundary belt P on the hypotenuse b was peeled off from hypotenuse b reliably.Stripping process is afterwards carried out with being stabilized, as shown in figure 15.
Preferably, the bending angle θ that is provided by fringeware 28 is set to 90 obtuse angles of spending or bigger, more preferably 100 degree or bigger.Yet according to adhesive force or the toughness or the intensity of wafer W, this angle can be less than 90 degree (near 90 degree).Preferably, the toughness of boundary belt P is big more, and the bending angle θ of belt is more little.Thereby this adjusting can be adjusted in the angle of the fringeware 28 of lower limit position by the extension of regulating connecting rod 37 and realize.The variation of the fringeware height that causes owing to the variation of fringeware 28 angles can obtain correction by the installation site of regulating fringeware 28 relative swivel bearing axles 32.
(second embodiment)
Second embodiment is described below with reference to the accompanying drawings.
Figure 16 is the stereogram that shows whole protecting band stripping off device, and it is an example according to useless material scavenge unit of the present invention.Figure 17 is a front view, and Figure 18 is its plane graph.Figure 19 is that apply ointment or plaster unit and belt of belt peeled off the front view of unit.Figure 20 demonstration is used for the front view that belt is peeled off the supporting structure of fringeware.Figure 21 is the stereogram that shows the major part of belt strip operation.
The place that this embodiment is different from first embodiment only is that belt peels off unit 8.The part identical with part among first embodiment represented with identical label, no longer introduces here.
Belt is peeled off unit 8 and is comprised that one can be along the travelling frame 26 of track 21 move left and right by a fixed journey system.Travelling frame 26 has a belt and peels off fringeware 28, an angular adjustment roller 29, one driven outlet roller 30 and the hold-down roller 31 relative with it.
Shown in Figure 20 and 21, belt is peeled off fringeware 28 by dull and stereotyped formation, and it forms a sharp edges at its far-end, and has the width greater than wafer diameter.Fringeware 28 is fixedly connected on the swivel bearing axle 32, and bolster 32 is also outstanding from it by the front surface supporting of travelling frame 26.Fringeware 28 is connected with bolt 34 by notch 33, and its relative axle 32 of scalable is flexible.
The connecting rod 37 that extends from the free end of control arm 35 is threaded on the piston rod 36a of cylinder 36.By regulating the length of thread engagement (LE) of connecting rod 37, can regulate the pendulum angle of control arm 35, this adjusting is when occurring in piston rod 36a and extending to its end of travel, the angle when fringeware 28 is in lower limit position.
Preferably, the toughness of boundary belt P is big more or to peel off the toughness of band T big more, and the belt bending angle θ that sets by angular adjustment roller 29 is more little.
Describe from the basic process of the sur-face peeling boundary belt P of wafer W below with reference to Figure 22 to 26.Provide the process of wafer W identical for stripping table 6 with first embodiment.Like this, this process with reference to shown in Figure 22, be placed on stripping table 6 from wafer and begin to describe.
When wafer W had been placed on the stripping table 6, as shown in figure 23, the apply ointment or plaster applicator roll 25 of unit 7 of belt was lowered by a predetermined altitude.Then, whole unit moves forward, and applicator roll 25 rolls on wafer W, is with T to offer the surface of boundary belt P with peeling off.
Peel off band during T when providing, as shown in figure 24, the cylinder 36 that belt is peeled off unit 8 is stretched to end of travel, makes control arm 35 swings, makes fringeware 28 drop to lower limit position thus.Meanwhile, cylinder 38 is contracted to end of travel, thus angular adjustment roller 29 is set in an angle θ.In this embodiment, angle θ is 90 degree or littler acute angles.
Then, as shown in figure 25, belt is peeled off unit 8 and is moved forward, and the pointed end of fringeware 28 will peel off the band T be pressed on the surface of boundary belt P.Meanwhile, outlet roller 30 rotates to peel off the synchronous peripheral speed of the translational speed of unit of band T with transmission.Like this, peel off band T and sentence angle θ at angular adjustment roller 29 and turn back, and be directed to a position between outlet roller 30 and the hold-down roller 31 by dancer rools 29.As shown in figure 21, peel off band T and take away fixing bonding boundary belt thereon, therefore from the sur-face peeling boundary belt P of wafer W.
Like this, fringeware 28 is set to forward a low speed, begins to peel off from it boundary belt P when moving through the end of wafer W.Then, the speed that moves forward increases, so that increase work efficiency.Outlet roller 30 is by a slip-clutch that slides when load surpasses predetermined torque, by a unillustrated drive unit driving.Like this, peeling off band T is removed by the predetermined pulling force that applies thereon.
Finished a belt stripping process thus, and device prepares to handle next piece wafer.
(the 3rd embodiment)
The 3rd embodiment is described below with reference to the accompanying drawings.
Figure 27 is the front view that the demonstration belt is peeled off the major part of unit.Figure 28 is the plane graph that belt is peeled off the major part of unit.
The place that present embodiment is different from first embodiment only is that belt peels off unit 8.The part identical with part among first embodiment represented with identical label, no longer introduces here.
As shown in figure 27, belt is peeled off fringeware 28 and is made by a flat board, and it forms a sharp edges at its far-end, and has the width greater than wafer diameter.Fringeware 28 is fixed on by belt and peels off on the edge cells 41 of rotating shaft 40 supporting of unit 8.Also install one and peel off band transfer roller R.
The torque actuated of pulse motor PM sends the end of edge cells 41 away from cylinder 36 to.Edge cells 41 has two micrometers 43 that are fixed on its left and right sides, but but and the de-rotation of adjusting rod 44 response impulse motor PM and stretching.
Specifically, as shown in figure 28, two micrometers 43 accept from individual pulse motor PM, by surround with the coaxial belt pulley K of gear G on the torque actuated that equates rotating speed of belt V.That is, the rotation of pulse motor PM directly sends a gear G to, sends a micrometer 43 then to.This rotation sends another gear G to by belt V, sends another micrometer 43 then to.The adjusting rod 44 scalable identical distances of left and right sides micrometer 43.
The keep to the side both sides of framework of unit 41 of the end of the adjusting rod 44 of micrometer 43.Make edge cells 41 tilt to a predetermined angular by piston rod 36a.The adjusting rod 44 of framework of unit 41 of keeping to the side prevents that as retainer edge cells 41 from tilting to surpass predetermined angular, make edge-perpendicular, particularly moving down.By the position of built-in edge unit 41 as mentioned above, following trouble just can be avoided.
When strip operation, along with this edge contacts with the surface of peeling off band T, band T is peeled off in the edge pushing.When this edge of the end that arrives wafer W moved through this end, the position of built-in edge unit 41 not, this edge sizable degree that will have a down dip as shown in figure 29 promptly, contacted with wafer W by distance H.Because this phenomenon, the bonding surface of peeling off band T is along with peeling off of boundary belt P will be bonded in the end of wafer W once more.When peeling off unit 8 and return in this stage, the end of wafer W will be bent upwards, and this will cause damaging.
In present embodiment, can avoid above-mentioned trouble, this is because fixed edge cells 41 by adjusting rod 44, prevents its vertical moving.
The peel angle of edge cells 41, be that the terminal position at edge can and be peeled off the thickness appropriate change of band T according to the thickness of the boundary belt P that offers wafer W.Adjusting rod 44 does not need to keep contacting with edge cells 41, but a slit (gap) can be provided according to the thickness of two belts, is bonded on the surface of wafer W so that prevent to peel off band T.Micrometer 43 is equivalent to holding device of the present invention.
The operation of peeling off boundary belt is same as the previously described embodiments, therefore no longer introduces.
The invention is not restricted to the foregoing description, also can change as follows:
(1) when arriving the end of wafer W, fringeware 28 can the reciprocal back and forth one little stroke of being scheduled to.Then, peel off band T and can offer the end of boundary belt P, thereby can carry out complete substantially peeling off effectively with the reliability that increases.When processing has the wafer W of hypotenuse b, this will be effective especially.
(2) will peel off band T offer boundary belt P in the end of wafer W can be with a ccd video camera or similar machine monitors.Predetermined strip operation can begin after determining to peel off the end that band offered boundary belt P.
(3) the present invention also is applicable to the situation of peeling off boundary belt P with adhesive tape from annular frame wafer supported W.
(4) the present invention also is applicable to directly to provide and peels off the surface that brings wafer so that will stay the situation that the useless protective layer (useless material) on the wafer surface is disposed.
(5) holding device of the brim height of stabilised edge part 28 is not limited to micrometer 43 in the 3rd embodiment.This device can have any other structure, directly is bonded on the wafer W so that prevent to peel off band T the sequence of operations process of peeling off band T from wafer W.
Belt among (6) the 3rd embodiment is peeled off the height and the angle at the edge of unit 8 by making edge cells 41 oscillation adjustment fringewares 28.This structure does not limit.For example, have only fringeware 28 to regulate separately, so that change angle.
Commercial Application
As mentioned above, according to of the present invention, peel off by use from the device of semiconductor wafer removing useless materials Useless material is peeled off and removed to band from wafer, thereby wafer can not ruptured because of the peeling force of belt or damage.
Claims (17)
1. one kind brings semiconductor wafer, peels off the method for useless material from the semiconductor wafer removing useless materials and from semiconductor wafer with peeling off band by providing to peel off, and it is characterized in that described method comprises the following steps:
One fringeware is arranged to contact with the surface of peeling off band that offers semiconductor wafer, and peels off this and peel off band, the peel angle that end was provided with this fringeware turns back simultaneously, and
When the end of described fringeware is moved beyond a terminal of described semiconductor wafer, prevent that the end of this fringeware from falling.
2. the method for the useless material of removing as claimed in claim 1 is characterized in that, it is an acute angle that the end by described fringeware offers the described described peel angle of peeling off band.
3. the method for the useless material of removing as claimed in claim 2 is characterized in that, the described peel angle of the end of described fringeware is 90 degree at least.
4. the method for the useless material of removing as claimed in claim 1 is characterized in that, it is an obtuse angle that the end by described fringeware offers the described described peel angle of peeling off band.
5. the method for the useless material of removing as claimed in claim 4 is characterized in that, the described peel angle of the end of described fringeware is less than 90 degree.
6. the method for the useless material of removing as claimed in claim 1 is characterized in that the end of described fringeware moves back and forth by a bit of stroke in the end of described semiconductor wafer.
7. the method for the useless material of removing as claimed in claim 1 is characterized in that, the useless material on described semiconductor wafer is the lip-deep boundary belt that is applied to described semiconductor wafer.
8. the method for the useless material of removing as claimed in claim 1 is characterized in that, the useless material on described semiconductor wafer is formed in the lip-deep protective layer of described semiconductor wafer.
9. device from the semiconductor wafer removing useless materials comprises:
The stripping table of one support semi-conductor wafers;
One provides the belt of peeling off the semiconductor wafer that brings on stripping table server;
One admits and to peel off band and to provide this to peel off the belt that the brings semiconductor wafer unit of applying ointment or plaster;
One has fringeware so that the belt of peeling off band from semiconductor wafer is peeled off the unit, and it is from the end of semiconductor wafer, and the end by fringeware makes the peel angle of peeling off band and providing and peels off band and turn back; And
One tape collector, so as to collect peel off from wafer, have useless material peel off band;
Described belt is peeled off the unit and is had a holding device; described protective device is used for preventing that the end of described fringeware from falling when the described end of peeling off the described fringeware that band peels off from described semiconductor wafer is moved beyond a terminal of described semiconductor wafer.
10. the device of the useless material of removing as claimed in claim 9 is characterized in that, described belt is peeled off the unit and had a device that is used to regulate the angle of the relative wafer surface of described fringeware.
11. the device of the useless material of removing as claimed in claim 9 is characterized in that, described belt is peeled off the unit and is comprised:
Unit, one edge, it have fixed thereon, and can peel off the fringeware that the cell moving direction is supported with swinging back and forth along belt;
One angle regulator is so that regulate the angle of the relative wafer surface of described fringeware; And
One holding device falls when the end of peeling off the fringeware of band from wafer is moved beyond the terminal of wafer so that prevent the end of fringeware;
Described angle regulator has the parts that make described edge cells swing, so that regulate the angle of fringeware end; And
Described holding device has parts, so that the vertical moving of the fringeware end that restriction takes place with the swing of described edge cells.
12. the device of the useless material of removing as claimed in claim 9 is characterized in that, offering the peel angle of peeling off band by described fringeware end is an acute angle.
13. the device of the useless material of removing as claimed in claim 12 is characterized in that, the described peel angle in the fringeware end is 90 degree at least.
14. the device of the useless material of removing as claimed in claim 9 is characterized in that, offering the peel angle of peeling off band by described fringeware end is an obtuse angle.
15. the device of the useless material of removing as claimed in claim 14 is characterized in that, spends less than 90 at the described peel angle of fringeware end.
16. the device of the useless material of removing as claimed in claim 9 is characterized in that described holding device comprises micrometer.
17. the device of the useless material of removing as claimed in claim 9 is characterized in that, a device also is provided, it makes the end of described fringeware move back and forth by a little stroke in the end of wafer.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP175812/01 | 2001-06-11 | ||
| JP175812/2001 | 2001-06-11 | ||
| JP2001175812A JP4502547B2 (en) | 2000-08-07 | 2001-06-11 | Method and apparatus for removing protective tape of semiconductor wafer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1391262A CN1391262A (en) | 2003-01-15 |
| CN1260779C true CN1260779C (en) | 2006-06-21 |
Family
ID=19016883
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 02103461 Expired - Fee Related CN1260779C (en) | 2001-06-11 | 2002-01-30 | Method and device for removing useless materials from semiconductor wafers |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1260779C (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106409745A (en) * | 2015-07-30 | 2017-02-15 | 株式会社迪思科 | Peeling method and peeling apparatus |
| CN107615475A (en) * | 2015-08-31 | 2018-01-19 | 琳得科株式会社 | Sheet peeling device and stripping means |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4592289B2 (en) * | 2004-01-07 | 2010-12-01 | 日東電工株式会社 | Unnecessary semiconductor wafer removal method |
| JP4641984B2 (en) * | 2006-07-31 | 2011-03-02 | 日東電工株式会社 | Adhesive tape affixing method to semiconductor wafer and protective tape peeling method from semiconductor wafer |
| JP4740296B2 (en) * | 2008-08-28 | 2011-08-03 | リンテック株式会社 | Sheet peeling apparatus and peeling method |
| JP5149122B2 (en) * | 2008-10-22 | 2013-02-20 | リンテック株式会社 | Sheet peeling apparatus and peeling method |
| JP5381821B2 (en) * | 2010-03-10 | 2014-01-08 | 三菱電機株式会社 | Protective tape peeling method and protective tape peeling apparatus |
-
2002
- 2002-01-30 CN CN 02103461 patent/CN1260779C/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106409745A (en) * | 2015-07-30 | 2017-02-15 | 株式会社迪思科 | Peeling method and peeling apparatus |
| CN106409745B (en) * | 2015-07-30 | 2021-10-29 | 株式会社迪思科 | Peeling method and peeling apparatus |
| CN107615475A (en) * | 2015-08-31 | 2018-01-19 | 琳得科株式会社 | Sheet peeling device and stripping means |
| CN107615475B (en) * | 2015-08-31 | 2021-01-15 | 琳得科株式会社 | Sheet peeling device and peeling method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1391262A (en) | 2003-01-15 |
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