JP4500173B2 - Static electricity removing method and substrate processing apparatus - Google Patents

Description

  The present invention relates to a static electricity removing method and a substrate processing apparatus for removing static electricity generated between a substrate such as a liquid crystal glass substrate or a semiconductor wafer and a substrate mounting table on which the substrate is placed.

  Conventionally, in a manufacturing process of a substrate such as a liquid crystal glass substrate or a semiconductor wafer, when a substrate placed on the upper surface in a surface contact state is lifted and separated from a substrate mounting table that supports the substrate, Static electricity called so-called peeling charging may occur. This peeling electrification not only causes dust adhesion to the substrate, but also, as the peeled portion expands, the charged charge becomes large, causing discharge, and may damage the substrate. For this reason, it is calculated | required that the electric charge of a peeling part is lose | eliminated at the time of peeling of a board | substrate.

As a method for removing the static electricity from the substrate, for example, a method of jetting ionized gas from the outer peripheral portion of the substrate placed on the substrate mounting table to the space between the substrate and the substrate mounting table, or a back surface of the substrate on the substrate mounting table. For example, there is a method in which an emission hole orthogonal to is provided and ionized gas is emitted from the emission hole toward the back surface of the substrate.
In the former, when the substrate placed on the heater plate of the heating device is peeled off, ionized gas is supplied to the gap between the outer peripheral portion of the substrate pushed up by the lifting pins and the substrate mounting table, and static electricity generated on the substrate is eliminated. (For example, refer to Patent Document 1).
On the other hand, in the latter case, when the substrate mounted on the substrate mounting table is peeled off, the ionization gas is supplied to the back surface of the substrate from the discharge hole provided at a position away from the lift pins, thereby eliminating the charge on the back surface of the substrate. (For example, refer to Patent Document 2).
JP-A-7-326598 JP 2000-216228 A

  However, in the method disclosed in Patent Document 1, at the stage where the back surface of the substrate is pressed with the lifting pins, there is no gap in which ionized gas can be supplied between the outer peripheral portion of the substrate and the substrate mounting table, In some cases, the peeled portion is enlarged without the ionized gas being supplied to the peeled portion. In this case, there is a problem that the peeling charge of the peeling portion is discharged and the substrate is damaged.

  In particular, a mother glass substrate for a liquid crystal display has been produced with a very thin thickness of 0.5 to 0.7 mm and a substrate size exceeding 2000 mm. Because of this increase in size and thickness, the rigidity of the substrate is reduced, so even if the back surface of the substrate is pushed up with the lifting pins, the substrate is easily bent, and if the substrate is pushed up slightly, the outer periphery of the substrate sticks to the substrate mounting surface. There is no gap. In the case of this patent document 1, since there is no gap between the substrate mounting table and the outer peripheral portion of the substrate at the initial stage of pushing up the substrate, the ionized gas cannot be supplied to the back surface of the substrate. For this reason, in this static elimination method, since the static elimination is started in a state where the substrate is pushed up to some extent, the above problem tends to occur frequently. In addition, if the lifting force of the lifting pins is increased for the purpose of creating a gap in the outer periphery of the substrate, the peeling proceeds rapidly, so that peeling electrification is likely to occur and the substrate is stuck to the substrate mounting surface. If the substrate is pushed up by the lifting pins in a state where the substrate is in a raised state, concentrated stress acts on the back surface of the substrate, causing a problem of damaging the substrate.

  On the other hand, in the method as disclosed in Patent Document 2, the through-hole through which the elevating pin is inserted and the discharge hole for supplying the ionized gas are provided individually and at positions separated from each other. Until the part reaches the discharge hole, the ionized gas is not supplied to the peeling part, and during this time, the peeling part is charged due to peeling charging, and there is a possibility that the substrate is damaged. In particular, as shown in FIG. 2 of Patent Document 2, since the discharge hole is not provided on the short side of the substrate with respect to the lifting pins, the ionized gas is not sufficiently supplied to the short side of the substrate, and peeling is caused. Discharge tends to occur.

  In view of the above circumstances, an object of the present invention is to provide a static electricity removing method and a substrate processing apparatus that reliably remove static electricity generated when a substrate is peeled from a substrate mounting table.

  In order to achieve the above object, the present invention provides the following means.

In the electrostatic removal method of the present invention, a substrate mounting table on which a plate-shaped substrate is mounted, and a lifting pin that moves up and down from the upper surface of the substrate mounting table to raise and lower the substrate, the substrate being a plurality of lifting pins When the substrate is lifted from the substrate mounting table, the ionized gas is caused to flow from a conduction path centered on the lifting pin to the peeling portion of the substrate pushed up by the lifting pin and in a direction intersecting the lifting direction of the lifting pin. The static electricity generated is removed between the substrate mounting table and the substrate.

In the substrate processing apparatus of the present invention, in the substrate processing apparatus manufactured by inspecting and manufacturing a plate-shaped substrate, the substrate mounting table on which the substrate is mounted and the substrate mounting table can appear at a plurality of locations. And a lift pin for raising and lowering the substrate , and an ionizer for supplying ionized gas from a conduction path centered on the lift pin and in a direction intersecting with the lift direction of the lift pin, and pushed up by the lift pin The ionized gas is released to the peeled portion of the substrate, and static electricity generated between the substrate mounting table and the substrate is removed.

  According to the static electricity removing method of the present invention, when a substrate is lifted and separated by a plurality of lifting pins, ions are released from the peeling center portion by the lifting pins, thereby preventing static electricity generated between the substrate and the substrate mounting table. Can be removed. For this reason, the peeling electrification of the peeled portion can be eliminated, and the substrate can be peeled without causing discharge. This can prevent the substrate from being damaged.

  In addition, according to the static electricity removing method of the present invention, by supplying ionized gas from the peeling center portion by the lifting pins, the substrate is peeled by the lifting pins and the ionized gas can be supplied to the peeling portions. Thereby, peeling electrification at the peeling portion can be eliminated and the substrate can be peeled without causing discharge, so that it is possible to prevent the substrate from being damaged.

  Further, according to the substrate processing apparatus of the present invention, the ionization gas is reliably supplied to the peeling portion of the substrate peeled by the lifting pins by providing the lifting pins or the ionizer that supplies the ionized gas to the peripheral portion of the lifting pins. Can be supplied to. This can prevent the substrate from being damaged.

  Hereinafter, a substrate processing apparatus A according to a first embodiment of the present invention will be described with reference to FIGS.

As shown in FIGS. 1 and 2, the first embodiment of the present invention is a substrate mounting table that supports a mother glass substrate 1 (hereinafter referred to as a substrate) for an FPD (Flat Panel Display) such as a wafer or a liquid crystal display. Reference numeral 2 denotes a single component, which relates to a substrate processing apparatus A for manufacturing a substrate by inspecting the substrate and performing various processes on the substrate 1. This type of substrate processing apparatus A having a substrate mounting table 2 on which a plate-like substrate 1 is mounted on an upper surface (front surface) 2a as one constituent element is used in many steps in the manufacturing process of the substrate 1. An example is an appearance inspection apparatus that ensures the flatness of the substrate 1 by being mounted on the mounting table 2 and inspects the pattern formed on the surface 1 a of the substrate 1.
The substrate mounting table 2 is formed in a rectangular disk shape, and a plurality of through holes 2b penetrating in the thickness direction are arranged in a distributed manner. A plurality of elevating pins 3 that are connected to driving means (not shown) and that can be projected and retracted with respect to the upper surface 2 a of the substrate platform 2 are inserted into the through-hole 2 b. The elevating pins 3 press the back surface 1b of the plate-like substrate 1 placed on the upper surface 2a of the substrate platform 2 and stuck to the upper surface 2a when the processing such as the appearance inspection is finished, This is for peeling the substrate 1 from the substrate mounting table 2. The lift pins 3 are movable up and down (movable up and down) with respect to the back surface 1b of the substrate 1, and when the substrate 1 is processed on the substrate mounting table 2, the tip 3a is in the through-hole 2b. Is held in a state where it is not in contact with the back surface 1 b of the substrate 1. Further, a plurality of electrostatic measurement sensors 4 for measuring the charge of static electricity generated between the substrate mounting table 2 and the substrate 1 are distributed on the upper surface 2 a of the substrate mounting table 2.
Incidentally, the sticking phenomenon between the substrate 1 and the substrate mounting table 2 is caused by, for example, charging (static electricity) on the respective surfaces 2 a and 1 b due to contact between the back surface 1 b of the substrate 1 and the upper surface 2 a of the substrate mounting table 2. The reason is that the substrate mounting table 2 attracts each other.

  As shown in FIGS. 1 to 3, the elevating pin 3 of the present embodiment is formed in a spherical and cylindrical rod shape with a tip 3 a protruding upward. Further, a flow passage 3b opened from the rear end toward the front end 3a is formed inside, and a plurality of vent holes 3d communicating with the internal flow passage 3b are formed in the front end portion 3c of the elevating pin 3. Has been. Each of the vent holes 3d communicates from the flow passage 3b to the side surface 3e of the elevating pin 3 and is formed obliquely so that the side surface 3e side gradually approaches the tip end 3a side with respect to the connection portion 3f with the flow passage 3b. Yes. As shown in FIG. 2, a nitrogen gas supply source 8 is connected to the flow passage 3 b of the elevating pin 3 through an ionizer 7. Thus, the elevating pin 3 has a front end portion through which the nitrogen gas from the nitrogen gas supply source 8 is ionized by the ionizer 7 and the ionized gas (ionized nitrogen gas) blown by the ionizer 7 passes through the flow passage 3b and the vent hole 3d. It can be released from 3c.

  Next, with reference to FIG. 1 to FIG. 4, a method for removing the substrate 1 and peeling the substrate 1 in the substrate processing apparatus A configured as described above will be described.

As shown in FIG. 4, the substrate 1 in which the sticking phenomenon has occurred is pressed with lifting pins 5 formed in a spherical and cylindrical rod shape with the tip 5a protruding upward, and the substrate 1 is peeled off only by this pressing force. In this case, the substrate 1 is peeled off from the substrate mounting table 2 locally around the portion pressed by the lifting pins 5. At this time, a phenomenon in which positive and negative charges different from each other, which are referred to as peeling charging, are charged in the substrate mounting table 2 and the peeling portion 6 of the substrate 1 which are locally peeled. For this reason, a potential difference is generated between the substrate 1 and the substrate mounting table 2 due to static electricity charged on the peeling portion 6, and when this is discharged and sparked, the substrate 1 is damaged.
In this embodiment, as shown in FIG. 1 to FIG. 3, the drive connected to the lift pins 3 at the stage where, for example, the appearance inspection or the like is finished on the substrate 1 placed on the substrate placing table 2. The means is driven to move the elevating pin 3 to the back surface 1b side of the substrate 1. At this time, when the tip 3a of the elevating pin 3 is brought into contact with the back surface 1b of the substrate 1, ionized gas is supplied from the nitrogen gas supply source 8 and the ionizer 7, and the ionized gas is released from the vent 3d. Furthermore, the movement of the lifting pins 3 is continued, the tip 3a of the lifting pins 3 is pressed against the back surface 1b of the substrate 1, and the portion pressed by the lifting pins 3 and the peripheral portion of the substrate 1 are separated from the substrate mounting table 2. . At the same time, the ionized gas released from the vent hole 3d is separated from the lifting pin 3 or the separation center portion of the gap between the lifting pin 3 and the through hole 2b (periphery of the lifting pin 3) directly or through the through hole 2b. The air is fed and supplied to the entire peeling portion 6. The ionized gas that has entered the peeling portion 6 causes the static electricity on the upper surface 2a of the substrate mounting table 2 and the back surface 1b of the substrate 1 to disappear due to the ions, and the potential difference generated between the substrate 1 and the substrate mounting table 2 is simultaneously removed. Let go. Further, when the ionized gas blown by the ionizer 7 is supplied to the peeling portion 6, peeling of the substrate 1 is promoted by the blowing pressure, and the substrate 1 is peeled off while discharging static electricity. Here, the electric charge between the substrate 1 and the substrate mounting table 2 is measured by the static electricity measuring sensors 4 distributed on the upper surface 2a side of the substrate mounting table 2, and the effect of removing static electricity by the ionized gas is confirmed. ing. Furthermore, by continuing the movement of the elevating pin 3, the peeling portion 6 is enlarged by the lifting force of the elevating pin 3 and the blowing pressure of the ionized gas, and the ionized gas sent to the enlarged peeling portion 6 Static electricity will be removed. Finally, the substrate 1 is completely peeled from the substrate mounting table 2 and the substrate 1 is supported by the lift pins 3.

  Therefore, according to the substrate processing apparatus A described above, the flow passage 3b for releasing the ionized gas from the tip portion 3c and the vent hole 3d are formed in the lift pin 3, so that the lift pin 3 presses the substrate 1. In addition, the ionized gas can be supplied to the peeling portion 6 while being peeled from the substrate mounting table 2, and the static electricity of the peeling portion 6 can be quickly eliminated. Thereby, it is possible to prevent the substrate 1 from being damaged by the discharge of the peeling charge.

  Moreover, according to said substrate processing apparatus A, ionization gas is ventilated by the ionizer 7 to the peeling part 6, At this time, peeling of the board | substrate 1 can be accelerated | stimulated with the ventilation pressure of ionized gas, and the peeling part 6 At the same time, the static electricity can be removed.

  Further, according to the substrate processing apparatus A described above, the through hole 2b through which the elevating pin 3 is inserted is formed in the substrate mounting table 2, and ionized gas is supplied directly from the vent hole 3d of the elevating pin 3 or through the through hole 2b. Since it can supply to the peeling part 6, the peeling center part of the board | substrate 1 and the supply position of ionized gas can be made into the substantially same position, and ionized gas is reliably supplied to the peeling part 6 peeled by the raising / lowering pin 3. Is possible.

  In addition, this invention is not limited to said 1st Embodiment, In the range which does not deviate from the meaning, it can change suitably. For example, the elevating pin 3 is formed in a cylindrical rod shape with a spherical shape with the tip 3a protruding upward, but the shape is not particularly limited. The vent hole 3d formed in the elevating pin 3 is formed only in the tip portion 3c, and the side surface 3e side gradually approaches the tip portion 3a with respect to the connection portion 3f with the flow passage 3b formed inside. Although it is assumed that it is formed obliquely so as to approach the side, the formation position and the shape of the vent 3d are not particularly limited. Further, in this embodiment, the ionized gas is an ionized nitrogen gas. However, for example, air sent from a compressor may be ionized by the ionizer 7, and the types of gas to be ionized are limited. It is not a thing. Further, although the ionized gas is supplied to the back surface 1b of the substrate 1 through the flow passage 3b and the vent hole 3d, the ions themselves may be discharged and supplied to the back surface 1b of the substrate 1. . Further, the release of the ionized gas from the vent hole 3d is performed from the stage where the tip 3a of the lift pin 3 comes into contact with the back surface 1b of the substrate 1. For example, the ionized gas is released before the lift pin 3 is moved. May be performed, or may be performed when the peeled portion 6 becomes apparent. Further, the peeling of the substrate 1 proceeds by both the lifting force of the lifting pins 3 and the blowing pressure of the ionized gas from the ionizer 7. The lifting force contributes to the peeling of the substrate 1. Moreover, when the peeling of the board | substrate 1 can be achieved with the ventilation pressure from the ionizer 7, the board | substrate 1 may be peeled without using the raising force of the raising / lowering pin 3. FIG.

  Furthermore, in this embodiment, the flow path 3b and the vent hole 3d are formed in the raising / lowering pin 3, and it is set as the structure which supplies ionized gas to the peeling center part of the board | substrate 1 back surface 1b through this flow path 3b and the vent hole 3d. However, as shown in FIG. 5, for example, a vent hole 9a is formed which communicates with the inner surface of the through hole 2b allowing the elevating pin 5 to move up and down, and the ionized gas is separated from the vent hole 9a through the through hole 2b. May be supplied. At this time, as shown in FIG. 5, the vent 9a located near the inner surface of the through hole 2b may be formed to be inclined toward the back surface 1b of the substrate 1, and the vent 9a and the through hole 2b A ring-shaped valve 9b whose outer peripheral surface is fixed to the inner surface of the through-hole 2b may be provided in the through-hole 2b below the position to which the is connected. It becomes possible to reliably supply the ionized gas released into the through-hole 2b through the vent 9a to the peeling portion 6 of the back surface 1b of the substrate 1.

  Next, a second embodiment of the present invention will be described with reference to FIGS. 1 to 2 and FIG. In the description of the present embodiment, the same reference numerals are assigned to configurations common to the substrate processing apparatus A according to the first embodiment, and the detailed description thereof is omitted.

  Similar to the first embodiment, the substrate processing apparatus B according to the second embodiment of the present invention is a substrate mounting for supporting an FPD mother glass substrate 1 (hereinafter referred to as a substrate) used in, for example, a wafer, a liquid crystal display or the like. The mounting table 2 is one component. The configuration of the substrate mounting table 2 is substantially the same as that of the first embodiment. On the other hand, as shown in FIG. 6, the lifting pins 10 that can be moved up and down in the through-hole 2b are provided with a pin main body portion 10a and a head portion. 10b. The pin body portion 10a is formed in a cylindrical shape, and the inner hole serves as a flow passage 10c. The flow passage 10c is connected to the nitrogen gas supply source 8 via the ionizer 7 as in the first embodiment. Has been. Further, an annular projecting portion 10e is attached to the upper end surface 10d located on the substrate 1 side of the pin main body portion 10a along the outer periphery of the flow passage 10c, and the outer peripheral surface of the projecting portion 10e is a curved surface. It is made into a shape. On the other hand, the head portion 10b is formed of, for example, a rubber material having moderate elasticity, and is formed into a spherical substantially cylindrical shape with a tip 10f located on the substrate 1 side protruding upward, and on the rear end 10g side. A small-diameter cylindrical portion is extended. Here, a cylindrical portion having a spherical tip 10f is a large diameter portion 10h, and a cylindrical portion having a small diameter on the rear end 10g side is a small diameter portion 10i. Further, the large diameter portion 10h and the small diameter portion 10i are formed such that the axis O1 coincides. Further, the diameter of the flow passage 10c of the pin body portion 10a is slightly larger than the diameter of the small diameter portion 10i of the head portion 10b, and the small diameter portion 10i of the head portion 10b is located on the upper end surface 10d side of the pin body portion 10a. By being inserted into the flow passage 10c, one lifting pin 10 is formed. At this time, a slight gap is defined between the small diameter portion 10i inserted into the flow passage 10c and the flow passage 10c, and the gap communicated with the flow passage 10c is defined as a ventilation groove 10j.

  Next, with reference to FIG. 6, a description will be given of a method of removing the substrate and peeling off the substrate in the substrate processing apparatus B having the above-described configuration.

  When the substrate 1 placed on the substrate platform 2 is subjected to, for example, appearance inspection and the like, the driving means connected to the lifting pins 10 is driven, and the lifting pins 10 are moved to the back surface 1b side of the substrate 1. Move to. At this time, the head portion 10b of the lifting pin 10 has a small diameter portion 10i stored in the flow passage 10c of the pin main body portion 10a, and a rear end 10g of the large diameter portion 10h formed on the upper end surface 10d of the pin main body portion 10a. It is in contact with the portion 10e. Further, the movement of the elevating pin 10 is continued, and the ionized gas is supplied from the nitrogen gas supply source 8 and the ionizer 7 at the stage where the tip 10 f is pressed against the back surface 1 b of the substrate 1. At this stage, the tip 10f of the head portion 10b is pressed by a reaction force that presses the back surface 1b of the substrate 1. At the same time, pressurized ionized gas is urged and supplied to the peeling portion 6 from the ventilation groove 10j. The ionized gas that has been blown into the peeling portion 6 has eliminated the static electricity on the upper surface 2a of the substrate mounting table 2 and the back surface 1b of the substrate 1 due to the ions, and the potential difference generated between the substrate 1 and the substrate mounting table 2 is eliminated. Let Further, since the ionized gas is energized when the ionized gas is supplied to the exfoliated part 6, the exfoliated part 6 is enlarged by the blowing pressure of the ionized gas energized simultaneously with the supply, and the substrate is being discharged. 1 peeling is promoted. Next, by continuing the movement of the elevating pin 10, the peeling portion 6 is enlarged, and ionized gas enters the enlarged peeling portion 6 and static electricity is discharged. Eventually, the substrate 1 is completely peeled off from the substrate mounting table 2, and the substrate 1 is supported by the head portion 10 b of the lift pins 10.

  Therefore, according to the substrate processing apparatus B described above, the ventilation groove 10j is defined in the gap between the small diameter portion 10i of the head portion 10b and the flow passage 10c, and the ionized gas is supplied from the ventilation groove 10j to the peeling portion 6. be able to. In addition, since the ionized gas is pressurized in the flow passage 10c and the ventilation groove 10j at the initial stage when the ionized gas is released, the ionized gas can be supplied with the blowing pressure biased to the separation portion 6. . As a result, while removing static electricity from the peeling portion 6, the peeling portion 6 can be enlarged by the blowing pressure, and peeling of the substrate 1 can be promoted. Therefore, the substrate 1 can be peeled reliably and promptly without damaging it.

  In addition, this invention is not limited to said 2nd Embodiment, In the range which does not deviate from the meaning, it can change suitably. For example, in this embodiment, the ionized gas is supplied from the gap (ventilation groove 10j) between the small diameter portion 10i of the head portion 10b and the flow passage 10c of the pin main body portion 10a. An inner hole that communicates with 10c and a hole that communicates from the inner hole to the outer peripheral surface of the small-diameter portion 10i are provided. It may be supplied from a hole and a hole communicating with the side surface. Therefore, in the raising / lowering pin 10 which consists of the head part 10b and the pin main-body part 10a, it does not need to specifically limit about the position where ionized gas is discharge | released, and the structure which performs this. Moreover, although the head part 10b shall be formed with the rubber material which has moderate elasticity, it is not this limitation and the material in particular is not limited.

  Next, a third embodiment of the present invention will be described with reference to FIGS. 2 to 3 and FIGS. 7 to 8. In the description of the present embodiment, the same reference numerals are assigned to configurations common to the substrate processing apparatus A according to the first embodiment, and the detailed description thereof is omitted.

In the present embodiment, as shown in FIG. 7, a substrate in which a groove 20 for supplying ionized gas between the substrate mounting table 2 and the substrate 1 (the back surface 1b of the substrate 1) is formed on the upper surface (front surface) 2a. The present invention relates to a substrate processing apparatus C provided with a mounting table 2. The substrate mounting table 2 has a plurality of through-holes 2b as in the first embodiment. Here, it is assumed that the lifting pins 3 shown in the first embodiment are provided as lifting pins for peeling the substrate 1 placed on the substrate placing table 2.
The groove 20 has a plurality of circular circular grooves 20a (annular grooves) each having a circular shape with different sizes around each through-hole 2b, and a plurality of rectangular grooves 20b (annular) having a square shape centering on the through-hole 2b. Groove), and an elliptical groove 20c (annular groove) that connects a part of the rectangular groove 20b extending outward of the substrate mounting table 2 and a part of the circular groove 20a. In addition, the circular groove 20a, the square groove 20b, and the elliptical groove 20c are connected to each other to form a single groove 20, and are continuously connected to all the through holes 2b. Further, one groove 20 including a circular groove 20 a, a square groove 20 b, and an elliptical groove 20 c is formed so as to be located immediately below the substrate 1 placed on the substrate platform 2.

  Next, with reference to FIG. 7 to FIG. 8, a method for removing the substrate 1 and peeling the substrate 1 in the substrate processing apparatus C having the above configuration will be described.

  As shown in the first embodiment, ionized gas is supplied from the nitrogen gas supply source 8 and the ionizer 7 when the elevating pin 5 is moved toward the back surface 1b of the substrate 1 placed on the substrate platform 2. Then, ionized gas is released from the vent 3d. As shown in FIG. 8, the released ionized gas flows into the rectangular groove 20b connected to the through-hole 2b, and further flows into the circular groove 20a connected to the rectangular groove 20b. The movement of the lifting pins 3 is continued, and the tip 3a presses the back surface 1b of the substrate 1 to separate the substrate 1 from the substrate mounting table 2. At the stage where the substrate 1 is separated from the substrate mounting table 2, the ionized gas is formed in the groove 20 located immediately below the substrate 1. Is supplied, static electricity is eliminated, and no peeling charge is generated in the peeling portion 6. In addition, a large amount of ionized gas is supplied to the peeled portion 6 peeled at this stage via the flow passage 3b and the vent hole 3d of the elevating pin 3, and accordingly, the back surface of the substrate 1 that has not yet peeled off. The ionized gas flows into the square groove 20b and the circular groove 20a located immediately below 1b. Eventually, the ionized gas flows into the elliptical groove 20c, and the ionized gas is supplied to the entire groove 20. Therefore, even when the movement of the elevating pin 3 is continued and the peeling portion 6 is enlarged, the ionized gas is supplied to the back surface 1b of the substrate 1 through the groove 20, so that static electricity is removed and the peeling portion 6 is discharged. It is assumed that no peeling electrification occurs. Thereby, even when the peeling portion 6 is sequentially enlarged by the lifting pins 3, peeling charging does not occur. Finally, the substrate 1 is completely peeled from the substrate mounting table 2, and the substrate 1 is lifted by the lifting pins 3. Is supported.

  Therefore, according to the substrate processing apparatus C described above, one continuous groove 20 composed of the circular groove 20a, the rectangular groove 20b, and the elliptical groove 20c is formed on the upper surface 2a of the substrate mounting table 2, and the substrate mounting table 2 Since all the through-holes 2b formed in this and the groove 20 are connected continuously, ionized gas can be supplied to the back surface 1b of the substrate 1 through the groove 20, and static electricity can be removed. . As a result, even when the substrate 1 is peeled off from the substrate mounting table 2 by the lifting pins 3, no peeling charging occurs in the peeling portion 6, and damage to the substrate 1 can be prevented.

  In addition, this invention is not limited to said 3rd Embodiment, In the range which does not deviate from the meaning, it can change suitably. For example, in the present embodiment, the rectangular groove 20b is formed with the through-hole 2b as a vertex. However, the present invention is not limited to this rectangular groove 20b, and a plurality of circular grooves 20a and elliptical grooves 20c are provided around the through-hole 2b. It may be formed. Further, the groove 20 is composed of a circular groove 20a, a square groove 20b, and an elliptical groove 20c, each of which is an annular groove 20. However, the present invention is not limited to this, and the groove 20 is formed from, for example, the through-hole 2b. It may be formed radially, and the shape is not particularly limited. Moreover, the groove | channel 20 may be a continuous groove | channel, a discontinuous groove | channel, and the continuous and discontinuous groove | channel may be mixed.

  Next, a fourth embodiment of the present invention will be described with reference to FIGS. 4 and 9 to 10. In the description of the present embodiment, the same reference numerals are given to the components common to the substrate processing apparatus C according to the third embodiment, and the detailed description thereof is omitted.

  This embodiment relates to a substrate processing apparatus D including the substrate mounting table 2 in which the groove 20 shown in the third embodiment is formed on the upper surface 2a. However, unlike what is shown in FIGS. 7 to 8 of the third embodiment, in this embodiment, as shown in FIG. 9, the groove 20 is an annular groove independent of the through-hole 2b. Also, as shown in FIGS. 9 to 10, the substrate mounting table 2 is formed with a plurality of discharge holes 21 capable of supplying ionized gas toward the back surface 1b of the substrate 1 close to the through hole 2b. The discharge hole 21 is connected to and communicated with a groove 20 formed independently of the through-hole 2b. Furthermore, here, it is assumed that the lifting pins 5 shown in FIG. 4 are provided as lifting pins for peeling the substrate 1 placed on the substrate placing table 2.

  Next, with reference to FIG. 9 to FIG. 10, a method for removing the substrate 1 and peeling the substrate 1 in the substrate processing apparatus D having the above configuration will be described.

  The ionized gas is discharged from the discharge hole 21 when the elevating pin 5 is moved toward the back surface 1b of the substrate 1 placed on the substrate platform 2. The released ionized gas flows into the groove 20 and is supplied to the back surface 1b of the substrate 1 as indicated by an arrow. Further, since the discharge hole 21 is provided close to the through-hole 2b, the peeling portion 6 of the substrate 1 peeled by the elevating pins 5 reaches the discharge hole 21 and the groove 20 almost simultaneously with the peeling. At the stage where the peeled portion 6 reaches the discharge hole 21 and the groove 20, ionized gas enters the peeled portion 6 and static electricity is eliminated. Further, even when the movement of the lifting pin 5 is continued and the peeling portion 6 is enlarged, since the ionized gas discharged from the discharge hole 21 is supplied to the groove 20, static electricity is removed and the peeling portion 6 is peeled off. It is assumed that no charging occurs. Finally, the substrate 1 is completely peeled from the substrate mounting table 2, and the substrate 1 is supported by the lift pins 5.

  Therefore, according to the substrate processing apparatus D described above, the discharge hole 21 for discharging the ionized gas communicates with the groove 20 provided independently of the through-hole 2b, so that the ionized gas is transferred to the substrate through the groove 20. 1 can be supplied to the back surface 1b. Further, since the discharge hole 21 is provided close to the through-hole 2b, when the substrate 1 is peeled off by the lift pins 5, the peeled portion 6 reaches the discharge hole 21 and the groove 20 almost at the same time. An ionized gas can be supplied to the. Thereby, peeling electrification does not occur in the peeling portion 6, and damage to the substrate 1 can be prevented.

  In addition, this invention is not limited to said 4th Embodiment, In the range which does not deviate from the meaning, it can change suitably. For example, in the present embodiment, a plurality of discharge holes 21 are provided close to the through-hole 2b. However, the discharge holes 21 are in surface contact with the substrate 1 in addition to the proximity position of the through-hole 2b. It may be distributed on the upper surface 2 a of the substrate mounting table 2.

1 is a plan view of a substrate processing apparatus according to a first embodiment of the present invention. It is sectional drawing of the substrate processing apparatus shown in FIG. It is a figure which shows the structure of the raising / lowering pin of the substrate processing apparatus which concerns on 1st Embodiment of this invention. It is a figure which shows the state of peeling charging at the time of peeling a board | substrate using the conventional raising / lowering pin. It is a figure which shows the modification of the substrate processing apparatus which concerns on 1st Embodiment of this invention. It is a figure which shows the structure of the raising / lowering pin of the substrate processing apparatus which concerns on 2nd Embodiment of this invention. It is a top view which shows the substrate mounting base of the substrate processing apparatus which concerns on 3rd Embodiment of this invention. It is a figure which shows the groove | channel formed in the board | substrate mounting base of FIG. It is a figure which shows the groove | channel and discharge | release hole which were formed in the substrate mounting base of the substrate processing apparatus which concerns on 4th Embodiment of this invention. It is sectional drawing of the substrate processing apparatus which concerns on 4th Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Substrate 1a Substrate surface 1b Substrate back surface 2 Substrate mounting base 3 Lifting pin 3a Tip 3b Flow path 3c Tip part 3d Vent hole 3e Side face 6 Separating part 7 Ionizer 10 Lifting pin 10a Pin body part 10b Head part 10c Flow path 10f Tip 10h Diameter portion 10i Small diameter portion 10j Ventilation groove 20 Groove 20a Circular groove (annular groove)
20b Square groove (annular groove)
20c Oval groove (annular groove)
21 Release hole

Claims (19)

A substrate mounting table on which a plate-shaped substrate is mounted;
Elevating pins for raising and lowering the substrate by raising and lowering from the upper surface of the substrate mounting table,
When the substrate is lifted from the substrate mounting table by a plurality of lifting pins, the peeling portion of the substrate pushed up by the lifting pins is directed to the direction intersecting the lifting direction of the lifting pins with the lifting pins as the center. Discharging the ionized gas from the conduction path ;
A static electricity removing method for removing static electricity generated between the substrate mounting table and the substrate. Electrostatic removing method according to claim 1, characterized in that releasing the ionizable gas the lift pin or al. The ionized gas is discharged radially from the lift pins
The static electricity removing method according to claim 2. The static electricity removing method according to claim 1, wherein the ionized gas is discharged from a through hole of the substrate mounting table through which the elevating pin is inserted. An annular groove is formed around each through hole of the substrate mounting table through which the elevating pin is inserted,
2. The static electricity removing method according to claim 1, wherein the ionized gas is discharged from each annular groove. A groove is formed radially from each through-hole of the substrate mounting table through which the lifting pins are inserted,
The method of removing static electricity according to claim 1, wherein the ionized gas is discharged from each groove. The blows ionized gas to the substrate back surface, according to claim 1 to 5 gall displacement of the substrate by feeding air pressure of the ionizable gas while eliminating the static electricity of the substrate rear surface, characterized in that for peeling from the substrate mounting table The method for removing static electricity according to crab. In a substrate processing apparatus that manufactures a plate-shaped substrate by performing inspections and various processes,
A substrate mounting table for mounting the substrate;
Elevating pins for raising and lowering the substrate provided so as to be able to appear and appear at a plurality of locations on the substrate mounting table,
An ionizer that supplies ionized gas from a conduction path centered on the lifting pin and in a direction that intersects the lifting direction of the lifting pin ;
Discharging the ionized gas to the peeled portion of the substrate pushed up by the lifting pins;
A substrate processing apparatus for removing static electricity generated between the substrate mounting table and the substrate. Release the ionized gas from the lifting pins
The substrate processing apparatus according to claim 8. The elevating pin has a flow path formed therein for supplying the ionized gas,
It is made form radially distal end portion of the vent the lift pins that communicates with the flow passage,
The substrate processing apparatus according to claim 9 , wherein the ionizer supplies the ionized gas through the flow path and the vent hole. The substrate processing apparatus according to claim 10 , wherein the vent hole is provided so as to be inclined so that the opening of the vent hole is positioned above the connecting portion of the flow passage. The elevating pin has a pin body portion in which a flow path for supplying the ionized gas is formed, and
A head portion for supporting the substrate at the tip of the pin body portion;
An annular ventilation groove communicating with the flow passage is formed between the pin body portion and the head portion,
The substrate processing apparatus according to claim 9 , wherein the ionizer supplies the ionized gas through the flow path and the ventilation groove. The head portion has a small diameter portion smaller than the inner diameter of the flow passage,
The small diameter portion is inserted into the flow path substrate processing apparatus according to claim 1 2, characterized in that to form a ventilation groove communicating with the flow passage between the flow passage and the small diameter portion. The substrate mounting table is formed by dispersing a plurality of through holes through which the elevating pins are inserted,
The substrate processing apparatus according to claim 8 , wherein the ionizer supplies the ionized gas through the through hole. The substrate mounting table is formed by dispersing a plurality of through holes through which the lifting pins are inserted,
A continuous or discontinuous groove is formed on the upper surface of the substrate mounting table around the through hole,
The substrate processing apparatus according to claim 8 , wherein the ionizer supplies the ionized gas through the groove. The substrate mounting table is formed by dispersing a plurality of through holes through which the lifting pins are inserted,
A plurality of continuous or discontinuous annular grooves are formed on the upper surface of the substrate mounting table around the through hole,
The substrate processing apparatus according to claim 8 , wherein the ionizer supplies the ionized gas through the groove. The substrate mounting table is formed by dispersing a plurality of through holes through which the lifting pins are inserted,
A continuous or discontinuous groove is formed radially from the through hole on the upper surface of the substrate mounting table,
The ionizer, a substrate processing apparatus according to claim 8, characterized by supplying the ionized gas through before Kimizo. Blowing the ionized gas to the back of the substrate;
The substrate processing apparatus according to claim 8 to 1 7 Neu deviation crab wherein it is peeled off the said substrate by wind pressure feeding of the ionized gas while static electricity to dissipate the back surface of the substrate from the substrate mounting table. In a substrate processing apparatus that manufactures a plate-shaped substrate by performing inspections and various processes,
A substrate mounting table for mounting the substrate;
Elevating pins for raising and lowering the substrate provided so as to be able to appear and appear at a plurality of locations on the substrate mounting table,
An ionizer for supplying ionized gas from the lifting pins,
The elevating pin has a flow path formed therein for supplying the ionized gas,
A vent hole communicating with the flow passage is formed radially at a tip portion of the lift pin,
The ionizer discharges the ionized gas to the peeling portion of the substrate pushed up by the lift pins through the flow passage and the vent hole,
Static electricity generated between the substrate mounting table and the substrate is removed.
A substrate processing apparatus.

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