JP2016197620A - Board suction holding stage and printing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a board suction holding stage capable of peeling a board stably in safety without breaking, even if the board is fragile and sticking to a surface plate while being charged electrostatically, and to provide a printing device including the same.SOLUTION: A board suction holding stage includes a surface plate for holding a board, a lift pin penetrating the surface plate so as to move the board up and down, a plurality of suction holes for sucking gas from the surface of the surface plate so as to suck the board thereto, a plurality of floatation holes for blowing gas from the surface of the surface plate so as to float the board therefrom, and a function for blowing gas from the floatation holes, at an intermediate position in a range where the lift pin can move up and down without breaking the board.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a technique that enables a substrate to be adsorbed and held safely even when the adsorbed substrate is brittle and has static electricity and is difficult to exfoliate from the stage.

  In recent years, with the development of electronic devices such as flat-type image display devices (flat panel displays), there has been a demand for technology for forming a uniform film or forming a precise pattern on a predetermined substrate. It is growing.

  Examples of apparatuses that meet such demand include printing apparatuses, coating apparatuses, and exposure apparatuses. Many of such apparatuses include a substrate adsorption / holding stage for accurately placing a substrate at a predetermined position in order to satisfy requirements such as sufficiently high uniformity or precision.

  Typical elements included in the substrate adsorption / holding stage include a surface plate for holding the substrate at a predetermined position, a lift pin penetrating the surface plate and movable up and down, and sucking gas from the surface of the surface plate. And an adsorption hole for adsorbing the substrate.

  In such a substrate suction holding stage, the substrate is received with the lifting pins raised, and then the lifting pins are lowered and the substrate is held on the surface of the surface plate by the suction holes to perform predetermined processing (coating, printing, exposure, etc.) ) Is completed, the lifting pins are raised again to raise the substrate and deliver it.

  However, in such an operation, if the substrate is charged at the time when the predetermined processing is completed, the substrate remains attracted to the surface plate, and the substrate is often damaged when the lifting pins are raised. There was a problem.

  To solve such problems, a holding mechanism that can be raised and lowered and that can hold the substrate (workpiece) in a warped shape is used so that the spaced portion advances from both sides of the substrate toward the intermediate portion. There has been proposed a method of lifting from a position (for example, see Patent Document 1).

  However, such a method requires not only a more complicated mechanism, but also a substrate that has recently appeared in which a side exceeds 2 m needs to be warped in proportion to the size of the substrate. There is a problem that there is.

  On the other hand, a method has also been proposed in which means is provided on a surface plate (set table) for releasing gas to float the substrate, and peeling is performed without damage (see, for example, Patent Document 2).

  However, in such a method, the substrate moves slightly when the gas ascends, and the positional relationship between the substrate and the lifting pins shifts when the substrate is lifted by the lifting pins. There is a problem that it is difficult to fit.

  In response to this problem, Patent Document 2 proposes a configuration in which a lifting table is not used for delivery, and a supply table for feeding workpieces and a material removal table for removing materials are provided on the set table, and delivery is performed there. However, such a method has a problem that the mechanism becomes complicated and the area occupied by the apparatus increases.

JP 2010-15174 A JP 2009-66468 A

  An object of the present invention is to adsorb a substrate that can be stably and safely peeled without damaging it even when the adsorbed substrate is fragile and statically attached to a surface plate. An object of the present invention is to provide a holding stage and a printing apparatus including the holding stage.

As means for solving the above-mentioned problem, the invention according to claim 1 comprises a surface plate for holding a substrate,
In order to move the substrate up and down, lifting pins penetrating the surface plate,
In order to adsorb the substrate to the surface plate, a plurality of suction holes for sucking gas from the surface of the surface plate,
In order to float the substrate from the surface plate, a plurality of floating holes for blowing gas from the surface of the surface plate,
And a function of blowing out gas from the levitation hole at an intermediate position within a range in which the elevating pins can move up and down without damaging the substrate.

The invention according to claim 2 is a surface plate for holding a substrate;
In order to move the substrate up and down, lifting pins penetrating the surface plate,
In order to adsorb the substrate to the surface plate, a plurality of suction holes for sucking gas from the surface of the surface plate,
In order to float the substrate from the surface plate, a plurality of floating holes for blowing gas from the surface of the surface plate,
A function of blowing gas out of the levitation hole at an intermediate position within a range in which the elevating pin can move up and down without damaging the substrate;
And a static electricity removing means for removing static electricity charged on the substrate.

  The invention described in claim 3 is the substrate suction holding stage according to claim 1 or 2, wherein the suction hole also serves as the floating hole.

  The invention according to claim 4 is characterized in that the range of vertical movement without damaging the substrate of the lifting pins is 0.1 mm to 8.0 mm. The substrate suction holding stage described in 1.

  A fifth aspect of the present invention is a printing apparatus comprising the substrate suction holding stage according to any of the first to fourth aspects.

  According to the present invention, there is provided a substrate adsorption / holding stage having a function of blowing gas from a floating hole in a state in which an elevating pin is in an intermediate position within a range in which the raising / lowering pin can move up and down without damaging the substrate. As a result, even when the substrate adsorbed on the surface plate of the stage is brittle and has static electricity, it can be stably and safely peeled off.

The schematic bird's-eye view which showed the one aspect | mode of the board | substrate adsorption | suction holding stage of this invention. The schematic overhead view which showed another one aspect | mode of the board | substrate adsorption | suction holding | maintenance stage of this invention. It is the schematic sectional drawing which showed the one aspect | mode of the die nozzle of this invention, Comprising: (a) is the state at the time of receiving a board | substrate, (b) has each shown the state which adsorb | sucks and hold | maintains a board | substrate. BRIEF DESCRIPTION OF THE DRAWINGS It is the schematic sectional drawing which showed the one aspect | mode of the die nozzle of this invention, Comprising: (c) has shown the state which started peeling of a board | substrate, (d) The state which peeling of the board | substrate was completed, respectively.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In addition, the same referential mark is attached | subjected to the component which exhibits the same or similar function through all the drawings, and the overlapping description is abbreviate | omitted.

  FIG. 1 is a schematic overhead view showing one embodiment of the substrate suction holding stage 100 of the present invention. The substrate suction holding stage 100 includes a surface plate 1. The surface plate 1 is provided with a lifting pin 2 that can move up and down. When the lifting pin 2 moves downward, its upper end is in the same or lower state as the surface of the surface plate 1. When moved to the uppermost position, the surface of the surface plate 1 protrudes greatly. Further, the surface plate 1 includes an adsorption hole 3 that can adsorb the substrate to the surface of the surface plate 1 by sucking a gas, and a floating hole 4 that blows out the gas and floats the substrate.

  The substrate adsorption / holding stage 100 of the present invention has a function of blowing gas from the floating hole 4 in a state where the elevating pins 2 are in an intermediate position within a range in which the lifting pins 2 can move up and down without damaging the substrate. The “intermediate position of the range in which the substrate can be moved up and down without damaging the substrate” is exemplified by a state in which the upper end of the lifting pin 2 protrudes from the surface of the surface plate within a range of 0.1 mm to 8.0 mm. it can.

  The suction hole 3 may also serve as the floating hole 4. In other words, the substrate adsorption / holding stage 100 of the present invention has both a function of adsorbing the substrate by sucking gas instead of the adsorption hole 3 and the floating hole 4 and a function of blowing the gas and floating the substrate. A hole and a floating hole may be provided. An example of the substrate suction holding stage 100 having the suction hole / floating hole 5 is shown in FIG.

  The substrate suction holding stage 100 of the present invention may have a substrate static electricity removing means 6. (Refer to FIG. 2) Examples of the static electricity removing means 6 include a corona discharge type static eliminator, an ionizing radiation type static eliminator, a static elimination string, a static elimination brush, and the like. Any means that can suppress and remove the charge without interfering with the operation of the substrate suction holding stage 100 can be applied.

  Next, a typical operation of the substrate suction holding stage of the present invention will be described with reference to FIGS.

  FIG. 3A shows a state when the substrate suction holding stage of the present invention receives a substrate. The substrate is received with the lifting pins 2 raised, and the substrate is held on the upper ends of the lifting pins 2.

  FIG. 3B shows a state where the lift pin 2 is lowered and the substrate suction holding stage holds the substrate 10 by suction. When the substrate 10 is received, the elevating pins 2 are lowered to the lowest position lower than the surface of the surface plate 1, and when the substrate 10 comes into contact with the surface of the surface plate 1, gas is sucked from the suction holes 3 and the substrate 10 is adsorbed. In this state, predetermined processing (coating, printing, exposure, etc.) is performed.

  FIG. 4C shows a state where the peeling of the substrate 10 is started. The raising / lowering pin 2 is stopped at an intermediate position within a range in which it can move up and down. More specifically, although the upper end of the lift pin 2 protrudes from the surface of the surface plate 1, even if the substrate 10 is charged with static electricity and is attracted to the surface plate 1, it does not break and break. Stopped. In this state, gas is blown out from the floating hole 4.

  The position of the elevating pins 2 satisfying such conditions is affected by the size, thickness, material, charge amount, number of elevating pins 2, installation interval, and the like of the substrate 10. Although it is necessary to set, for example, the range in which the upper end of the elevating pin 2 is 0.1 mm or more and 8.0 mm or less from the surface of the surface plate 1 is shown as a condition that does not damage the substrate 10 for most practical substrates. be able to.

  If the protruding amount of the lifting pins 2 is too small, the substrate 10 lifted by the gas from the floating hole 4 cannot be held. Conversely, if the protruding amount of the lifting pins 2 is too large, the substrate 10 may break through and be damaged. Get higher. From such a point of view, the protrusion amount of the upper end of the elevating pin 2 is more preferably 0.2 mm or more and 5.0 mm or less, and further preferably 0.3 mm or more and 3.0 mm or less.

  FIG. 4D shows a state where the peeling of the substrate 10 is completed. The substrate 10 is separated from the surface of the surface plate 1 and floats by the gas from the floating hole 4, but does not move except in the vertical direction because it is held by the lift pins 2.

  When the peeling of the substrate 10 is completed, the elevating pins 2 are further raised and delivered to an external device.

  It should be noted that the above-described means such as delivery to the external device, operation of the lifting pins, gas suction, gas blowout, substrate handling and transport, control of these individual means, and the substrate suction holding stage of the present invention Although detailed description such as control of the entire operation is omitted, they can be configured by using commercially available apparatuses and techniques.

  As described above, with the substrate adsorption / holding stage of the present invention, even when the adsorbed substrate is fragile and has static electricity, it can be stably and safely peeled without damaging it. It becomes.

  The substrate adsorption / holding stage of the present invention can be suitably used by being incorporated in various apparatuses such as a printing apparatus, a coating apparatus, and an exposure apparatus, but in particular, since other members are in contact with the coated surface of the substrate, Suitable for printing devices that easily generate Furthermore, the printing apparatus is also suitable for a system in which an insulating resin or rubber blanket or the like is brought into contact with the coated surface of the substrate.

  The printing apparatus equipped with the substrate suction holding stage of the present invention may damage the substrate even if static electricity is generated on the substrate by bringing a resin or rubber blanket that is an insulator into contact with the coated surface of the substrate. It is possible to peel stably and safely without doing.

DESCRIPTION OF SYMBOLS 1 ... Surface plate 2 ... Elevating pin 3 ... Adsorption hole 4 ... Levitation hole 5 ... Adsorption hole and levitation hole 6 ... Static electricity removal means 10 ... Substrate 100 ... Substrate adsorption holding stage

Claims (5)

A surface plate for holding the substrate;
In order to move the substrate up and down, lifting pins penetrating the surface plate,
In order to adsorb the substrate to the surface plate, a plurality of suction holes for sucking gas from the surface of the surface plate,
In order to float the substrate from the surface plate, a plurality of floating holes for blowing gas from the surface of the surface plate,
And a function of blowing gas from the levitation hole at an intermediate position within a range in which the elevating pins can move up and down without damaging the substrate. A surface plate for holding the substrate;
In order to move the substrate up and down, lifting pins penetrating the surface plate,
In order to adsorb the substrate to the surface plate, a plurality of suction holes for sucking gas from the surface of the surface plate,
In order to float the substrate from the surface plate, a plurality of floating holes for blowing gas from the surface of the surface plate,
A function of blowing gas out of the levitation hole at an intermediate position within a range in which the elevating pin can move up and down without damaging the substrate;
And a static electricity removing means for removing static electricity charged on the substrate.   The substrate suction holding stage according to claim 1, wherein the suction hole also serves as the floating hole.   The substrate adsorption / holding stage according to any one of claims 1 to 3, wherein a range in which the lift pin can be moved vertically without damaging the substrate is 0.1 mm to 8.0 mm.   A printing apparatus comprising the substrate suction holding stage according to claim 1.

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