JP2022174060A - Substrate assembling apparatus and substrate assembling method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate assembling apparatus and a substrate assembling method capable of reducing deflection of a substrate.

SOLUTION: A substrate assembling apparatus 1 can hold one substrate on a lower table 10 and hold the other substrate on an upper table 9 so as to face the one substrate to bond them with an adhesive provided on one of the substrates in a vacuum chamber. The substrate assembling apparatus includes, on surfaces holding the substrates of the upper table 9 and/or the lower table 10, a plurality of projections and depressions adjacently arranged to each other, where width of the depression has ratio of from 10^-6 to 10^-5 with respect to widths of the upper table 9 and/or the lower table 10.

SELECTED DRAWING: Figure 1

COPYRIGHT: (C)2023,JPO&INPIT

Description

The present invention relates to a substrate assembling apparatus and a substrate assembling method for manufacturing a liquid crystal display, an organic EL display, or the like in which substrates are bonded together in a vacuum.

As a technology related to a substrate assembling apparatus that bonds substrates together in a vacuum, for example, Patent Document 1 discloses that the separation distance between the upper substrate and the lower substrate is changed by moving the upper substrate up and down during the evacuation process. discloses a substrate assembly apparatus that efficiently eliminates gas from between an upper substrate and a lower substrate.
Further, Japanese Patent Laid-Open No. 2002-200000 proposes a workpiece bonding apparatus having an antistatic means on a table.
In Patent Document 3, in order to reduce distortion due to adiabatic compression and temperature change of the table, a plurality of convex portions and concave portions are formed on the surfaces of the first and second holding members that contact the non-bonding surface of the work, A vacuum bonding apparatus is disclosed that suppresses the influence of temperature change on a workpiece due to adiabatic expansion or adiabatic compression in a minute space by improving exhaustion during decompression (vacuum drawing).

Further, Japanese Patent Application Laid-Open No. 2002-200000 discloses a board assembly apparatus in which irregularities and grooves are formed on the sheet surface in order to improve the problem of positional deviation of the lower board due to expansion of residual air on the side of the lower table under reduced pressure.
Patent Literature 5 discloses a substrate assembling apparatus capable of precisely bonding substrates without causing deviation in a peeling pin vertical mechanism or an adhesive pad vertical mechanism.

JP 2017-80868 A Japanese Patent No. 5654155 Japanese Patent No. 6255546 JP-A-2003-283185 JP 2005-134687 A

However, in recent years, glass substrates to be bonded together in a vacuum have become larger, and in the assembling apparatus disclosed in Patent Documents 1 to 3, the air remaining in the table groove or the like during evacuation is exhausted at high speed. There is concern about the generation of static electricity or the bending of the glass substrate.

Also, in the assembling apparatuses disclosed in Patent Documents 4 and 5, there is a concern that bending may occur during the board rising operation due to speeding up.

Accordingly, the present invention provides a board assembly apparatus and a board assembly method that can reduce the bending of the board.

In order to solve the above-described problems, a board assembly apparatus according to the present invention holds one board on a lower table, holds the other board on an upper table so as to face the one board, and A substrate assembling apparatus that performs bonding in a vacuum chamber with an adhesive provided in a substrate assembly apparatus, wherein a plurality of protrusions arranged adjacent to each other are provided on surfaces of the upper table and/or the lower table that hold the substrate. and a concave portion, and the width of the concave portion has a ratio of 10 ⁻⁶ to 10 ⁻⁴ with respect to the width of the upper table and/or the lower table.

In the board assembly apparatus according to the present invention, the plurality of protrusions and recesses arranged adjacent to each other are formed on the embossed sheet, and adhesive is applied to the surfaces of the upper table and/or the lower table for holding the board. characterized in that it is affixed

The board assembly apparatus according to the present invention is characterized in that the embossed sheet is made of polyethylene terephthalate and has a wavy longitudinal section.

In the board assembly apparatus according to the present invention, the plurality of protrusions and recesses arranged adjacent to each other are formed on an elastic plate provided on a surface of the upper table and/or the lower table for holding the board. It is characterized by

A substrate assembly apparatus according to the present invention includes a vacuum suction mechanism having a plurality of suction pins on a suction pin plate that can move up and down independently of the upper table on the upper table provided inside the chamber. It is characterized by having a purge gas blow mechanism.

In another board assembly apparatus according to the present invention, one board is held on a lower table, and the other board is held on an upper table so as to face the one board. A substrate assembly apparatus for bonding substrates in a vacuum chamber with an adhesive, comprising a first lifter that is loosely arranged and a second lifter that is densely arranged, wherein the second lifter is the After the substrate is lifted by a predetermined amount by the second lifter, the substrate is further lifted by the first lifter, which can pass through the lower table.

Another board assembly apparatus according to the present invention is characterized in that the amount by which the board is lifted by the first lifter is greater than the amount by which the board is lifted by the second lifter.

Another board assembly apparatus according to the present invention is characterized in that the amount of lifting of the board by the first lifter is approximately 33 to 200 times the amount of lifting of the board by the second lifter.

In another board assembly apparatus according to the present invention, the lower table has a through hole through which the second lifter can pass, and when the board is lifted by the second lifter by a predetermined amount, the inside of the through hole is lifted. It is characterized in that purge gas or air enters the back surface of the substrate through a gap between the peripheral surface and the outer peripheral surface of the second lifter.

Further, the substrate assembly method according to the present invention includes the steps of: holding one substrate on a lower table; holding the other substrate on an upper table so as to face the one substrate; and bonding the substrates in a vacuum chamber with a provided adhesive, wherein the substrates are arranged adjacent to each other on the substrate holding surfaces of the upper table and/or the lower table. A plurality of protrusions and recesses are provided, and the width of the recesses has a ratio of 10 ⁻⁶ to 10 ⁻⁴ with respect to the width of the upper table and/or the lower table.

Another board assembly method according to the present invention comprises a step of holding one of the boards on a lower table and a step of holding the other board on an upper table so as to face the one board. and a step of bonding the substrates together in a vacuum chamber using an adhesive provided on the substrates, the substrate assembling method comprising a first lifter loosely arranged and a second lifter densely arranged. and the second lifter can pass through the lower table, and after the substrate is lifted by a predetermined amount by the second lifter, the substrate is further lifted by the first lifter. do.

ADVANTAGE OF THE INVENTION According to this invention, it becomes possible to provide the board|substrate assembly apparatus and board|substrate assembly method which can reduce the bending of a glass substrate.
Problems, configurations, and effects other than those described above will be clarified by the following description of the embodiments.

1 is a schematic configuration diagram of a board assembly apparatus of Example 1 according to an embodiment of the present invention; FIG. FIG. 2 is an explanatory diagram of a guide mechanism that constitutes the board assembly apparatus shown in FIG. 1; It is a schematic explanatory drawing of an adhesive pin mechanism. 4 is a longitudinal sectional view of elastic bodies on the surfaces of the upper and lower tables shown in FIG. 3; FIG. 2 is a flow chart showing an operation flow of the board assembly apparatus shown in FIG. 1; FIG. 10 is a schematic diagram of a substrate assembly apparatus of Example 2 according to another example of the present invention, which is a top view and a side view of a lower table; 10 is a flow chart showing the operation flow of the board assembly apparatus of Example 2. FIG. 7 is a longitudinal sectional view showing a state in which the lower glass substrate is lifted by a predetermined amount by the second lifter shown in FIG. 6; FIG. 7 is a longitudinal sectional view showing a state in which the lower glass substrate is lifted by a predetermined amount by the first lifter shown in FIG. 6; FIG.

In this specification, a glass substrate is used as an example of substrates to be bonded together in a vacuum, but substrates to be bonded together are not limited to glass substrates.
Hereinafter, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a schematic configuration diagram of a board assembly apparatus of Example 1 according to one embodiment of the present invention. As shown in FIG. 1, the substrate assembly apparatus 1 has a base 15 and an upper frame 5 as rigid support members, and an upper chamber 7 and a lower chamber 8 inside thereof. The upper frame 5 rotates the ball screw 2b of the Z-axis drive motor 2a that constitutes the Z-axis drive mechanism 2 provided on the pedestal 15 side. 5 moves vertically with respect to the base 15 . Four sets of guide mechanisms 3 are provided when the upper frame 5 moves up and down.
FIG. 2 shows an explanatory diagram of a guide mechanism that constitutes the substrate assembly apparatus shown in FIG. FIG. 2 shows a partial cross-sectional view of the guide mechanism 3. As shown in FIG. As shown in FIG. 2, two linear guides 3a are provided on a beam 17 fixed to the pedestal 15 side, and a linear moving part 3b is provided on a beam 18 fixed to the upper frame 5 side. As shown in FIG. 2, one guide surface is combined so as to be perpendicular to the other guide surface.

Returning to FIG. 1 , a plurality of lower shafts 12 for supporting the lower table 10 are attached above the mount 15 . Each lower shaft 12 protrudes into the lower chamber 8 via a vacuum seal (not shown) in order to keep the inside of the lower chamber 8 airtight. Further, between each lower shaft 12 and the lower table 10, an XY.theta. moving unit 13 configured to be independently movable in the XY.theta. directions is attached. The XYθ moving unit 13 may be configured by a mechanism using a ball bearing or the like that is fixed in the vertical direction and freely movable in the horizontal direction. A plurality of lower table horizontal drive mechanisms (not shown) are provided outside the lower chamber 8 in the horizontal direction (X and Y directions) of the lower table 10, and the shafts provided in the drive mechanisms move the side of the lower table (thickness direction of the lower table). It is configured so that positioning in the XYθ direction can be performed by pressing .
Further, the lower chamber 8 and the upper chamber 7 are configured to be separable, and a seal ring (not shown) is provided at the connecting portion thereof, whereby the upper chamber 7 and the lower chamber 8 are united, and when the inside is evacuated. Prevents air leakage.

A load cell 4 is provided at each connecting portion between the upper frame 5 and the Z-axis drive mechanism 2 . An upper chamber 7 is attached inside the upper frame 5 . The upper chamber 7 is suspended from the upper frame 5 by a support shaft 6c and a bracket 7b, and the upper chamber 7 can be separated from the lower chamber 8 by moving the upper frame 5 up and down. Further, the upper frame 5 is provided with a plurality of upper shafts 6 toward the inside of the upper chamber 7 for supporting the upper table 9 . The upper shaft 6 and the upper chamber 7 are connected by a vacuum seal to keep the chamber airtight. Further, the upper table 9 is fixed to the upper shaft 6, and has a structure in which the load cell 4 can detect the force when the glass substrate is pressed. The Z-axis drive mechanism 2 can move the upper chamber 7 and the upper table 9 up and down. A support shaft (upper shaft 6) is provided separately. Therefore, the support shaft 6c of the upper chamber 7 has a playful support structure so that when the upper chamber 7 is combined with the lower chamber 8, no downward force acts on the lower chamber 8 from the upper chamber 7. there is That is, a bracket 7b having a predetermined height is attached to the upper portion of the upper chamber 7, and the end of the support shaft 6c of the upper chamber 7 is brought into contact with the flange portion inside the bracket 7b. When the upper chamber 7 is lifted, the flange portion of the support shaft 6c contacts (contacts) with the bracket 7b so that the upper chamber 7 and the upper table 9 can move upward together. That is, when the upper shaft 6 is raised and the upper table 9 is moved upward by a predetermined amount in the upper chamber 7, the flange portion of the support shaft 6c abuts against the bracket 7b. It is configured to move upward together. In addition, the upper chamber 7 and the upper table 9 move together until the upper chamber 7 moves downward and becomes integrated with the lower chamber 8, and after the upper chamber 7 and the lower chamber 8 become integrated, the upper table moves downward. 9 can move independently to the lower table 10 side.

In addition, as described above, in this embodiment, the upper table 9 and the lower table 10 are arranged apart from the upper chamber 7 and the lower chamber 8, so that the chamber deforms when the pressure inside the chamber is reduced. The glass substrate can be held horizontally without this deformation being transmitted to the upper table 9 and the lower table 10 .

The upper table 9 is provided with an elastic plate 11 made of iron. An elastic member 11a is provided over the entire surface of the elastic plate 11 that contacts the glass substrate. The elastic plate 11 is fixed by the magnetic force of a plurality of magnets embedded in the upper table 9 and screw fastening, and is configured to be replaceable. Here, the upper table 9 is made of, for example, an aluminum alloy, and although omitted in FIG. An elastic body 11b is provided over the entire surface that contacts the glass substrate. In this embodiment, the elastic plate 11 and the elastic body 11a are provided on the upper table 9, and the elastic plate 11 and the elastic body 11b are provided on the lower table 10. However, the configuration is not necessarily limited to this. That is, the elastic plate and the elastic body may be provided only on either the upper table 9 or the lower table 10 .

FIG. 3 is a schematic illustration of the adhesive pin mechanism. As shown in FIG. 3, on the upper chamber 7 or on the upper frame 5, an adhesive pin driving mechanism 14 that can operate independently of the upper table 9 is installed. The adhesive pin drive mechanism 14 is composed of a vertical drive motor 14a, an adhesive pin plate 14b to which a plurality of adhesive pins 14c are attached, and an adhesive pin vertical mechanism 14d. The adhesive pin plate 14b and the adhesive pin 14c have a vacuum adsorption mechanism, and an adhesive sheet 14e is attached to the tip of the adhesive pin 14c. Further, the adhesive pin 14c has a structure that can be removed from the adhesive pin plate 14b (it is detachable by a screw mechanism) and can be replaced. Inside the adhesive pin plate 14b, a negative pressure chamber for supplying negative pressure is connected to a negative pressure channel (not shown) provided in the center of the adhesive pin 14c from the negative pressure chamber. A negative pressure can be supplied to the hole. An adhesive sheet 14e is provided at the tip of the adhesive pin 14c except for the opening. The adhesive pin lifting mechanism 14d for moving the adhesive pin plate 14b up and down and the upper chamber 7 are connected by a bellows-like elastic body, thereby maintaining a vacuum state.

FIG. 4 is a longitudinal sectional view of elastic bodies (11a, 11b) on the surfaces of the upper table 9 and the lower table 10 shown in FIG. FIG. 4 shows a vertical cross-sectional view of the elastic body 11b on the surface of the lower table 10. In the vertical cross-section, the structure is such that the rear surface of the glass substrate can abut on the top. Therefore, strictly speaking, the elastic body 11a on the surface of the upper table 9 is upside down in the longitudinal sectional view shown in FIG. In addition, FIG. 4 is an enlarged view to show an example of the cross-sectional shape and dimensions of the elastic body having projections and recesses. As shown in FIG. 4, the elastic body 11b on the surface of the lower table 10 has a plurality of protrusions and recesses arranged adjacent to each other. The height of the projections is, for example, 25 μm, and the pitch of the projections (pitch along the width direction of the lower table 10) is approximately 500 μm.
The length of the protrusion along the width direction of the lower table 10 is about 460 μm, and the length of the recess along the width direction of the lower table 10 is about 40 μm. The elastic bodies (11a, 11b) having a plurality of protrusions and recesses arranged adjacent to each other in this manner have a plurality of protrusions arranged in a square lattice shape, a triangular lattice shape, or a zigzag pattern when viewed from above (not shown). arranged in a grid. On the other hand, as described above, in recent years, glass substrates that are bonded together in a vacuum have become larger. Therefore, the width of the elastic body 11a and/or the elastic body 11b (along the width direction of the upper table 9 and/or the lower table 10) width) is in the ratio of 10 ⁻⁶ to 10 ⁻⁴ .
As a result, it is possible to prevent a large amount of airflow from being generated when the air remaining in the recesses (grooves) of the elastic bodies 11a and/or the elastic bodies 11b is exhausted during evacuation. In other words, a plurality of narrow exhaust flow paths are formed on the surface of the elastic body 11a and/or the elastic body 11b, and it is possible to disperse the exhaust of the air remaining in the recess (groove). As a result, it is possible to reduce the occurrence of unevenness due to triboelectrification with the substrate, prevent the occurrence of unevenness due to temperature drops due to rapid adiabatic expansion, and improve the accuracy of substrate bonding. It is possible to contribute to the manufacture of displays without color unevenness in fine patterning.

In this embodiment, the upper table 9 is provided with the elastic plate 11 and the elastic body 11a, and the lower table 10 is provided with the elastic plate 11 and the elastic body 11b. Although the configuration in which only one side is provided with the elastic plate and the elastic body has been described, the present invention is not limited to this. For example, an embossed sheet having a plurality of protrusions and recesses arranged adjacent to each other as described above may be attached with an adhesive to the surface of the aluminum alloy upper table 9 that holds the glass substrate. Here, the embossed sheet is formed into a corrugated shape by embossing a sheet of polyethylene terephthalate (referred to as PET), for example. Similarly, an embossed sheet having a plurality of protrusions and recesses arranged adjacent to each other as described above is attached with an adhesive to the surface of the aluminum alloy lower table 10 that holds the glass substrate. Also good. Alternatively, the embossed sheet may be attached to only one of the upper table 9 and the lower table 10 with an adhesive.
By using an embossed sheet having a plurality of protrusions and recesses arranged adjacent to each other in this way, the above-described embossed sheet can be attached to the upper table and/or the lower table constituting the existing board assembly apparatus with an adhesive. It is possible to obtain the board assembly apparatus 1 of the present embodiment only by sticking.

Next, the operation of the board assembly apparatus 1 will be described. FIG. 5 is a flow chart showing the operation flow of the board assembly apparatus 1 shown in FIG.
As shown in FIG. 5, in step S11, a robot hand (not shown) is used to load the upper glass substrate with the bonding surface facing the lower table 10 side onto the lower surface of the upper table 9 . A plurality of suction support nozzles (not shown) and an adhesive pin driving mechanism 14 (FIG. 3) are lowered from the upper table 9, and the upper glass substrate is first sucked onto the tips of the suction support nozzles (not shown). After that, the suction support nozzle is raised until the tip of the suction support nozzle reaches the position of the adhesive pin surface, and negative pressure is supplied to the adhesive pin suction hole (not shown) provided in the adhesive pin 14c (FIG. 3). The glass substrate is held on the surface of the adhesive sheet 14e. In the present embodiment, the configuration is such that the suction support nozzle is used separately from the adhesive pin mechanism. However, the configuration is not limited to this. good. While the upper glass substrate is held by the adhesive sheet 14e provided at the tip of the adhesive pin 14c, the adhesive pin 14c is raised and the upper glass substrate is held in contact with the elastic body 11a surface of the elastic plate 11 attached to the upper table 9.

In step S12, an adhesive (sealing agent) is applied to the surface of the lower glass substrate in an annular shape, and the lower glass substrate, with an appropriate amount of liquid crystal dropped onto the area surrounded by the adhesive, is moved to the position of the lower table 10 by a robot hand. and place it on the support pins. Instead of providing the adhesive on the lower glass substrate, the adhesive may be provided on the upper glass substrate side, or may be provided on both the upper and lower glass substrates.

Next, the support pin is retracted toward the lower table 10 until the tip end is on the table surface or inside the table surface, and negative pressure is supplied to the suction hole provided in the lower table 10 to hold the support pin. The lower table 10 is provided with an electrostatic chucking mechanism so that the glass substrate can be held without shifting even when the chamber is evacuated. Note that the lower table 10 may also be configured to have an adhesive pin mechanism like the upper table 9 . In this case, the moving distance of the adhesive pins can be set smaller than that of the upper table 9 .

In step S13, when the upper and lower glass substrates are respectively held by the adhesive pins 14c and the lower table 10, the Z-axis driving mechanism 2 is operated to lower the upper frame 5, the upper chamber 7, and the upper table 9. and the lower chamber 8 are combined through a seal ring to form a vacuum chamber. In synchronism with this operation, the adhesive pin drive mechanism 14 is also lowered using the vertical drive motor 14a and the adhesive pin vertical mechanism 14d so that the positional relationship with the upper table 9 does not change. At this time, the upper substrate held by the upper table 9 and the lower substrate held by the lower table 10 are separated from each other by a distance of several millimeters, and the upper substrate and the lower substrate are not brought into contact with each other. Thereafter, although not shown, the air in the vacuum chamber is exhausted from an exhaust port provided on the lower chamber 8 side to reduce the pressure in the vacuum chamber. When the inside of the vacuum chamber becomes decompressed for bonding, a camera (not shown) with a deep focal depth provided on the lower unit side is used to detect the misalignment of the positioning marks previously provided on the upper glass substrate and the lower glass substrate. ask for quantity. However, if the depth of focus of the camera is shallow, a mechanism for moving the camera up and down should be provided. A method of obtaining the deviation amount of the positioning mark of the substrate is adopted. Thereafter, by driving the XY.theta. moving unit 13, the lower table 10 is moved to correct the deviation of the upper and lower substrates in the XY.theta.
It should be noted that this positioning operation can also be performed in the middle of the depressurization process for bonding.
In step S14, when the alignment of the upper and lower substrates is completed, the Z-axis drive mechanism 2 is operated to move the upper table 9 via the frame 5, and in synchronization with this, the adhesive pin drive mechanism 14 is moved to the lower table 10 side. By moving, the upper and lower glass substrates are brought into contact with each other. While the upper and lower glass substrates are in contact with each other, the displacement amount of the positioning marks of the upper and lower glass substrates is checked again, and if there is any displacement, the positioning operation is performed again. When the confirmation and positioning operations are completed, only the upper table 9 is further lowered to apply pressure and separate the upper glass substrate from the adhesive pins 14c. When the substrate is pressed, the elastic member 11a on the elastic plate 11 attached to the upper table 9 is deformed, so that the entire substrate can be uniformly pressed. Note that the glass substrates held on both tables may be displaced during pressurization, so it is better to observe the positioning marks from time to time to correct the misalignment.

In step 15, when the upper and lower glass substrates are pressurized and bonded together, a purge gas is introduced into the vacuum chamber from a purge gas blow mechanism (not shown). At this time, air is also introduced to restore the atmospheric pressure. By returning the pressure to the atmospheric pressure, the glass substrate is further pressed to a specified thickness. In this state, a UV irradiation mechanism (not shown) is operated to harden the adhesive at a plurality of locations for temporary fixing, thereby completing the bonding of the liquid crystal substrates.

In the above operation, the substrates are held by the adhesive pins 14c until the upper and lower glass substrates come into contact with the adhesive (sealant) provided on either one of the glass substrates, after which the adhesive pins 14c are moved downward. The adhesive pin 14c is peeled off from the substrate surface by moving only the upper table 9 downward. At this time, by moving the adhesive pins 14c in a direction opposite to the moving direction of the glass substrate, the adhesive pins 14c can be reliably peeled off from the substrate surface.
When pressure is applied to the substrate, the adhesive pins are also moved toward the lower table 10 at the same time. , the adhesive pin driving mechanism 14 can be lifted to remove the adhesive pin from the substrate. At this time, the adhesive pin can be easily peeled off from the substrate surface by raising the adhesive pin while sending positive pressure gas or clean air into the suction/suction hole at the tip of the adhesive pin.

In step S16, the bonded substrates are carried out of the vacuum chamber using a robot hand (not shown).

As described above, according to this embodiment, it is possible to provide a substrate assembling apparatus and a substrate assembling method that can reduce the bending of the glass substrate.
In addition, according to this embodiment, it is possible to reduce the occurrence of unevenness due to triboelectrification with the substrate, prevent the occurrence of unevenness due to a temperature drop due to rapid adiabatic expansion, and improve the accuracy of substrate bonding.・It is possible to contribute to the manufacturing of displays with no color unevenness for thinning and fine patterning.

6A and 6B are schematic diagrams of a substrate assembly apparatus of Embodiment 2 according to another embodiment of the present invention, and are a top view and a side view of a lower table. The present embodiment differs from the above-described first embodiment in that first lifters 21 arranged loosely and second lifters 22 arranged densely so as to be able to pass through the lower table 10 are provided. Below, the same reference numerals are given to the same constituent elements as in the first embodiment, and the description overlapping with the first embodiment is omitted.

FIG. 6 shows a top view and a side view of the lower table 10 that constitutes the board assembly apparatus 1 of this embodiment. As shown in the top view, the board assembly apparatus 1 of this embodiment includes a bar-shaped first lifter 21 extending in one direction, and a through hole 23 provided in the lower table 10 as shown in the side view. and a second lifter 22 which is arranged in the vertical direction. For convenience of explanation, FIG. 6 shows a case in which two first lifters 21 and 24 second lifters 22 are provided, but the number of first lifters 21 and second lifters 22 is not limited to this. do not have. However, as shown in FIG. 6, the arrangement density of the first lifters 21 is coarse, and the arrangement density of the second lifters 22 is dense. In other words, if the first lifters 21 are arranged sparsely and the second lifters 22 are arranged densely, the numbers of the first lifters 21 and the second lifters 22 may be appropriately set.

FIG. 7 is a flow chart showing the operation flow of the board assembly apparatus of this embodiment.
Steps S21 to S25 in FIG. 7 are the same as steps S11 to S15 shown in FIG. 5 in the above-described first embodiment, so descriptions thereof are omitted here.

In step S27, the second lifter 22 is raised by a predetermined amount, and the substrates after bonding are protruded from the holding surface (surface) of the lower table 10 by a predetermined amount. float the substrate. Here, FIG. 8 shows a longitudinal sectional view showing a state in which the lower glass substrate 16 is lifted by a predetermined amount by the second lifter 22 shown in FIG. For convenience of explanation, FIG. 8 shows a state in which the lower glass substrate 16 is raised by a predetermined amount, which means the substrates after bonding. As shown in FIG. 8, the pitch P1 of the second lifter 22 (pitch along the width direction of the lower table 10) is, for example, 80 mm to 100 mm, the diameter D1 of the second lifter 22 is, for example, 5 mm, The hole diameter of the through hole 23 is, for example, 8 mm. The amount h1 of elevation of the second lifter 22 from the holding surface (surface) of the lower table 10 is, for example, 1 mm to 3 mm. The second lifter 22 is made of, for example, a resin such as PEEK (polyetheretherketone), and has a curved surface with a predetermined radius of curvature at its tip that contacts the back surface of the lower glass substrate 16 . Therefore, the rear surface of the lower glass substrate 16 can be prevented from being damaged or scratched. The purge gas introduced from the purge gas blowing mechanism or the atmosphere passes through the gap between the inner peripheral surface of the through hole 23 and the outer peripheral surface of the second lifter 22 as indicated by the arrows in FIG. Sprayed on the back. In other words, the purge gas or the atmosphere enters the rear surface of the lower glass substrate 16 through the gap between the inner peripheral surface of the through hole 23 and the outer peripheral surface of the second lifter 22 .

Returning to FIG. 7 , in step S<b>27 , the first lifter 21 is raised by a predetermined amount to further separate the lower glass substrate 16 from the holding surface (surface) of the lower table 10 . Here, FIG. 9 shows a longitudinal sectional view showing a state in which the lower glass substrate 16 is lifted by a predetermined amount by the first lifter 21 shown in FIG. As in FIG. 8, FIG. 9 also shows a state in which the lower glass substrate 16 is raised by a predetermined amount for convenience of explanation, but this means the substrates after bonding. As shown in FIG. 9, the pitch P2 of the first lifter 21 (the pitch along the width direction of the lower table 10) is, for example, 200 mm to 250 mm. ) is, for example, 100 to 200 mm. Therefore, the lift h2 of the first lifter 21 from the holding surface (surface) of the lower table 10 is approximately 33 times the lift h1 of the lower table 10 from the holding surface (surface) of the second lifter 22 to 200 times. Double.

As described above, at the initial stage when the back surface of the lower glass substrate 16 constituting the substrates after bonding is separated from the holding surface (surface) of the lower table 10 in the above-described step S26, the purge gas or the air is introduced into the through holes. It enters the back surface of the lower glass substrate 16 through the gap between the inner peripheral surface of the second lifter 23 and the outer peripheral surface of the second lifter 22 . At this time, the negative pressure between the back surface of the lower glass substrate 16 and the holding surface (front surface) of the lower table 10 is released through the through holes 23 to prevent the substrates from bending after bonding due to the negative pressure. becomes possible. In step S27 described above, the lower glass substrate 16 is further separated from the holding surface (surface) of the lower table 10 by the first lifter 21, so that the substrates after bonding are prevented from bending and can be preferably bonded. It is possible to further separate the substrates after being combined from the holding surface (surface) of the lower table 10 . As a result, it prevents the occurrence of unevenness due to bending of the glass substrate, contributes to the production of displays without color unevenness, and improves the quality and yield of next-generation high-definition display manufacturing.・It is possible to reduce costs and improve productivity.

Returning to FIG. 7, in step S28, the bonded substrate separated from the holding surface (surface) of the lower table 10 by the first lifter 21 is transferred to a robot hand (not shown), and the robot hand lifts the vacuum chamber. carried outside.

As described above, according to this embodiment, it is possible to provide a substrate assembling apparatus and a substrate assembling method that can reduce the bending of the glass substrate.
In addition, according to this embodiment, the occurrence of unevenness due to the bending of the glass substrate is prevented, and it contributes to the production of displays without color unevenness in the production of large, thin, and fine patterns in the production of next-generation high-definition displays. improvement, yield improvement, cost reduction, and productivity improvement.

In addition, the present invention is not limited to the above-described embodiments, and includes various modifications.
For example, the above-described embodiments have been described in detail in order to explain the present invention in an easy-to-understand manner, and are not necessarily limited to those having all the described configurations. In addition, it is possible to replace part of the configuration of one embodiment with the configuration of another embodiment, and it is also possible to add the configuration of another embodiment to the configuration of one embodiment.

Reference Signs List 1 Board assembly device 2 Z-axis drive mechanism 2a Z-axis drive motor 2b Ball screw 2c Ball screw receiver 3 Guide mechanism 3a Linear guide 3b Linear moving unit 4 Load cell 5 Upper frame 6 Upper shaft 7 Upper chamber 7b Bracket 8 Lower chamber 9 Upper table 10 Lower table 11 Elastic plates 11a, 11b Elastic body 12 Lower shaft 13 XYθ moving unit 14 Adhesive pin drive mechanism 14a Vertical drive motor 14b Adhesive pin plate 14c Adhesive pin 14d Adhesive pin vertical mechanism 14e Adhesive sheet 15 Base 16 Lower glass substrate 17, 18 Beam 21 First lifter 22 Second lifter 23 Through hole

In order to solve the above-described problems, a board assembly apparatus according to the present invention holds one board on a lower table, holds the other board on an upper table so as to face the one board, and A first bar-shaped lifter extending in one direction and a through-hole provided in the lower table. and a second lifter that can move up and down. The second lifter is lifted by a predetermined amount, and the purge gas or the atmosphere is discharged from the gap between the inner peripheral surface of the through hole and the outer peripheral surface of the second lifter. After that, the first lifter rises by a predetermined amount to further separate the substrate from the substrate-holding surface of the lower table and transfer the substrate to the robot hand.

In the circuit board assembly apparatus according to the present invention, the second lifter is made of a resin material containing polyetheretherketone, and the shape of the tip of the second lifter that contacts the back surface of the circuit board has a predetermined radius of curvature. It is characterized by having a curved surface with

The board assembly apparatus according to the present invention is characterized in that the amount by which the board is lifted by the first lifter is greater than the amount by which the board is lifted by the second lifter.

The board assembly apparatus according to the present invention is characterized in that the lift amount of the board by the first lifter is approximately 33 to 200 times the lift amount of the board by the second lifter.

Further, the substrate assembly method according to the present invention includes the steps of: holding one substrate on a lower table; holding the other substrate on an upper table so as to face the one substrate ; and a step of bonding in a vacuum chamber with a provided adhesive, wherein the substrate assembly method comprises a rod-shaped first lifter extending in one direction and a through hole provided in the lower table . and a second lifter arranged inside and capable of moving up and down, wherein the second lifter is raised by a predetermined amount, and the purge gas or the purge gas is discharged from the gap between the inner peripheral surface of the through hole and the outer peripheral surface of the second lifter. Air is allowed to enter the back surface of the substrate, and then the first lifter is raised by a predetermined amount to further separate the substrate from the substrate-holding surface of the lower table to transfer the substrate to a robot hand. and

In the substrate assembly method according to the present invention, the second lifter is made of a resin material containing polyetheretherketone, and the shape of the tip of the second lifter that contacts the back surface of the substrate has a predetermined radius of curvature. It is characterized by having a curved surface with

The board assembly method according to the present invention is characterized in that the amount by which the board is lifted by the first lifter is greater than the amount by which the board is lifted by the second lifter.

The board assembly method according to the present invention is characterized in that the lift amount of the board by the first lifter is approximately 33 to 200 times the lift amount of the board by the second lifter.

Claims (17)

One substrate is held on the lower table, the other substrate is held on the upper table so as to face the one substrate, and the substrates are bonded together in a vacuum chamber with an adhesive provided on either one of the substrates. An assembly device,
The surface of the upper table and/or the lower table that holds the substrate has a plurality of protrusions and recesses that are arranged adjacent to each other, and the width of the recess is the width of the upper table and/or the lower table. , a ratio of 10 ⁻⁶ to 10 ⁻⁴ . The board assembly apparatus according to claim 1,
The plurality of protrusions and recesses arranged adjacent to each other are formed on an embossed sheet and adhered with an adhesive to surfaces of the upper table and/or the lower table that hold the substrate. board assembly equipment. In the board assembly apparatus according to claim 2,
The board assembly apparatus, wherein the embossed sheet is made of polyethylene terephthalate and has a corrugated longitudinal section. The board assembly apparatus according to claim 1,
The substrate assembly, wherein the plurality of protrusions and recesses arranged adjacent to each other are formed on an elastic plate provided on a surface of the upper table and/or the lower table for holding the substrate. Device. The board assembly apparatus according to any one of claims 2 to 4,
The upper table provided inside the chamber is provided with a vacuum adsorption mechanism having a plurality of adsorption pins on a adsorption pin plate capable of moving up and down independently of the upper table, and a purge gas blow mechanism. board assembly equipment. One substrate is held on the lower table, the other substrate is held on the upper table so as to face the one substrate, and the substrates are bonded together in a vacuum chamber with an adhesive provided on either one of the substrates. An assembly device,
It has a first lifter that is sparsely arranged and a second lifter that is densely arranged. A board assembly apparatus, wherein after the board is lifted, the board is further lifted by the first lifter. In the board assembly apparatus according to claim 6,
A board assembly apparatus, wherein the amount of lifting of the board by the first lifter is larger than the amount of lifting of the board by the second lifter. In the board assembly apparatus according to claim 6 or 7,
A board assembly apparatus, wherein the amount of lifting of the board by the first lifter is approximately 33 to 200 times the amount of lifting of the board by the second lifter. The board assembly apparatus according to any one of claims 6 to 8,
The lower table has a through hole through which the second lifter can pass. A substrate assembly apparatus characterized in that a purge gas or air enters the rear surface of the substrate from a gap between the substrate and the substrate. holding one of the substrates on the lower table;
holding the other substrate on an upper table so as to face the one substrate;
and a step of bonding the substrates together in a vacuum chamber with an adhesive provided on one of the substrates, the substrate assembling method comprising:
The surface of the upper table and/or the lower table that holds the substrate has a plurality of protrusions and recesses that are arranged adjacent to each other, and the width of the recess is the width of the upper table and/or the lower table. , a ratio of 10 ⁻⁶ to 10 ⁻⁴ . In the substrate assembly method according to claim 10,
The plurality of protrusions and recesses arranged adjacent to each other are formed on an embossed sheet and adhered with an adhesive to surfaces of the upper table and/or the lower table that hold the substrate. board assembly method. The substrate assembly method according to claim 11,
The substrate assembly method, wherein the embossed sheet is made of polyethylene terephthalate and has a corrugated longitudinal section. In the substrate assembly method according to claim 10,
The substrate assembly, wherein the plurality of protrusions and recesses arranged adjacent to each other are formed on an elastic plate provided on a surface of the upper table and/or the lower table for holding the substrate. Method. holding one of the substrates on the lower table;
holding the other substrate on an upper table so as to face the one substrate;
and a step of bonding the substrates together in a vacuum chamber with an adhesive provided on one of the substrates, the substrate assembling method comprising:
It has a first lifter that is sparsely arranged and a second lifter that is densely arranged. A method of assembling a board, characterized in that after the board is lifted, the board is further lifted by the first lifter. 15. The method for assembling a substrate according to claim 14,
The board assembly method, wherein the amount of lift of the board by the first lifter is greater than the amount of lift of the board by the second lifter. In the substrate assembly method according to claim 14 or 15,
A board assembly method, wherein the amount of lifting of the board by the first lifter is approximately 33 to 200 times the amount of lifting of the board by the second lifter. The substrate assembly method according to any one of claims 14 to 16,
The lower table has a through hole through which the second lifter can pass. A method of assembling a substrate, wherein a purge gas or air enters the back surface of the substrate through a gap between the substrate and the substrate.

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