WO2020024837A1

WO2020024837A1 - Device for operating substrate

Info

Publication number: WO2020024837A1
Application number: PCT/CN2019/097130
Authority: WO
Inventors: 弓利军; 袁福顺
Original assignee: 北京北方华创微电子装备有限公司
Priority date: 2018-08-01
Filing date: 2019-07-22
Publication date: 2020-02-06
Also published as: JP2021530104A; JP7134267B2

Abstract

Disclosed is a device for operating a substrate, comprising: a grabbing disc structure having an adsorption surface. The grabbing disc structure is provided with an air suction channel; the air suction channel comprises a plurality of air suction openings distributed on an annular edge area of the adsorption surface; when the device operates the substrate, the air suction channel sucks air between the substrate and the adsorption surface to adsorb the substrate. The device in the present invention requires less air suction volume and small suction force, and the pressure applied on the edge of the substrate is uniform, thus avoiding the problem that the substrate is deformed and even crushed and contaminated due to concentration of action areas of the adsorption force.

Description

Equipment for handling substrates

Technical field

The present invention relates to the technical field of semiconductor manufacturing, and in particular, to an apparatus for operating a substrate.

Background technique

In the field of semiconductor integrated circuit manufacturing, an epitaxial reactor is usually used to manufacture an epitaxial coating of a semiconductor substrate, that is, a deposition gas is passed into the epitaxial chamber, and the deposition gas deposits an epitaxial material when passing through the surface of the semiconductor substrate. In the process of manufacturing an epitaxial coating using an epitaxial reactor, substrate transfer is a very important content.

The substrate is generally circular and has a front side and a back side. The front side of the substrate is used to manufacture integrated circuit structures, so it is very important to protect the front side of the substrate from damage during the substrate transfer process. For this reason, it is usually chosen to act on the backside of the substrate (such as adsorption) to transfer the substrate. However, this transfer method cannot be applied to certain areas of epitaxial reactions. For these areas, it can only act on the front side of the substrate for lining. Bottom of the transmission. However, not the entire front side of the substrate is used to manufacture integrated circuit structures. The area a few millimeters from the edge of the front side of the substrate is a non-operational area and is not used for manufacturing integrated circuit structures. Therefore, the substrate can be transferred by acting on the edge region of the front surface of the substrate.

At present, although there are various apparatuses for transferring substrates, these apparatuses all have disadvantages. For example, a conventional wafer picking method of a substrate transfer device is to use a vacuum adsorption method to act on a central area of a front surface of a substrate, and only contact an edge area of the front surface of the substrate. Although this can protect the front side of the substrate from damage, because the suction holes are concentratedly arranged in the central area of the substrate, on the one hand, a large flow of suction is required to have sufficient adsorption force, and on the other hand, excessive adsorption force may also be possible. As a result, the substrate is deformed too much, so that a bruise is easily formed.

Summary of the invention

In view of this, an embodiment of the present invention provides an apparatus for operating a substrate.

According to an aspect of an embodiment of the present invention, an apparatus for operating a substrate is provided, including:

The gripping disc structure has an adsorption surface, and an extraction channel is provided in the gripping disc structure, and the exhaustion channel includes a plurality of exhaustion ports distributed in an annular edge region of the adsorption surface. When the substrate is operated, air is sucked out between the substrate and the adsorption surface through the suction channel to adsorb the substrate.

Optionally, the maximum radius of the annular edge region is equal to the radius of the substrate; the ratio of the minimum radius of the annular edge region to the radius of the substrate is 7/10.

Optionally, the plurality of air suction ports are evenly distributed on a circumference or a plurality of circumferences having different radii with the center of the adsorption surface as a circle center.

Optionally, an adsorption tank is provided on the adsorption surface, and all of the suction ports are in communication with the adsorption tank.

Optionally, a side surface of the adsorption groove includes a first annular surface and a second annular surface which are sequentially arranged from an edge of the adsorption surface toward a center, wherein the first annular surface is inclined with respect to the adsorption surface. And the vertical gap between the substrate and the substrate gradually increases from the edge of the adsorption surface toward the center; the second annular surface is inclined or perpendicular to the adsorption surface.

Optionally, at least one circumference where the suction port is located is distributed on the first torus; or at least one circumference where the suction port is located on both the first torus and the bottom surface of the adsorption tank .

Optionally, the gripping disc structure includes:

A carrier disk has the adsorption surface, and a plurality of first through holes penetrating the carrier disk along its axial direction are provided in the carrier disk. Ports of the first through holes on the adsorption surface are used for the ports. Making the suction port; and

A gas-homing disk is connected to the carrier disk and is located on a side of the carrier disk facing away from the adsorption surface; and a gas-homing channel is provided in the gas-homing disk, and the gas-homing channels are connected to each of the The first through hole communicates with each other to form the suction channel.

Optionally, the device further includes: a first annular elastic element and a second annular elastic element, both of which are located between the air homogenizing disc and the bearing disc, so as to form an annular sealed space therebetween. To communicate the uniform air passage with each of the first through holes.

Optionally, an annular groove is provided on the opposite surface of the air uniform plate and / or the carrier plate and is located in the annular sealed space, and the annular groove is connected to the air uniform channel and each of the The first through hole communicates.

Optionally, the air homogenization plate includes:

An annular body is connected to the carrying plate; the first annular elastic element and the second annular elastic element are located between the annular body and the carrying plate, and a plurality of annular elastic elements are provided along the annular body. A second through hole axially penetrating the annular body, a plurality of the second through holes are evenly distributed along a circumferential direction of the annular body, and each of the second through holes communicates with the annular sealed space;

The ventilation structure has a plurality of shunt channels with the same structure, the number of the shunt channels is the same as the number of the second through holes, and one end of the plurality of shunt channels is in one-to-one correspondence with a plurality of the second communication channels. The holes communicate, and the other end converges to the center position of the ring body.

Optionally, the ventilation structure includes a plurality of linear ducts disposed along a radial direction of the annular body, and an inner cavity of each of the linear ducts is used as the shunt channel.

Optionally, the device further includes:

One end of the suction pipe is in communication with the other end of each of the shunt channels converging to the center position of the annular body, and the other end of the suction pipe is used to connect with the suction system.

Optionally, the ventilation structure further includes:

A central disc, which is located at a central position of the annular body and is fixedly connected to each of the straight pipelines, and a connecting channel communicating with each of the diverting channels is provided in the central disc; the central circle The disk is fixedly connected to the exhaust pipe, and both have abutment surfaces. The connection channel and the inner cavity of the exhaust pipe are respectively provided with annular butt openings on the abutting surface of the central disc and the exhaust pipe. ;

The device further includes: a third annular elastic element and a fourth annular elastic element, both of which are coaxially disposed between the central disk and the abutting surface of the suction pipe, and are respectively located inside the annular butt joint. And outside.

The device for operating the substrate provided by the present invention can disperse the adsorption force in the area closer to the edge of the substrate by setting the suction port in the annular edge area of the adsorption surface, which is compared with the prior art. The required pumping volume and pumping force are smaller, and the negative pressure at the edge of the substrate is uniform, thereby avoiding deformation of the substrate and even crushing and pollution due to the concentration of the area where the suction force acts.

Additional aspects and advantages of the embodiments of the present invention will be given in the following description, which will become apparent from the following description or be learned through the practice of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to more clearly explain the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings in the following description These are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without paying creative labor:

FIG. 1 is a schematic perspective structural view of an embodiment of an apparatus for operating a substrate according to the present invention; FIG.

FIG. 2 is a schematic exploded structure diagram of an embodiment of an apparatus for operating a substrate according to the present invention; FIG.

FIG. 3 is a schematic structural cross-sectional view of an embodiment of an apparatus for operating a substrate according to the present invention.

detailed description

The invention is described more fully hereinafter with reference to the accompanying drawings, in which exemplary embodiments of the invention are described. In the following, the technical solutions in the embodiments of the present invention will be clearly and completely described with reference to the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention. The technical solution of the present invention will be described in various aspects with reference to the drawings and embodiments.

For the convenience of description, the "left", "right", "up", and "down" referred to in the following are consistent with the left, right, up, and down directions of the drawing itself.

The terms "first" and "second" in the following are only used to describe the differences and have no other special meanings.

The present invention provides an apparatus for operating a substrate, wherein the substrate may be a plurality of semiconductor wafers. The device has a function of taking or placing a film, such as a substrate transfer device. The device includes a gripping disc structure having a suction surface that can be positioned opposite the substrate when the device handles the substrate. An extraction channel is also provided in the gripping disc structure. The extraction channel includes a plurality of extraction ports distributed in the annular edge area of the adsorption surface. When the device operates the substrate, the extraction channel is used to extract the substrate and the adsorption through the extraction channel. The air between the surfaces attracts the substrate.

In some fields of epitaxial reaction, the substrate can only be transferred on the front side of the substrate. In this case, the adsorption surface of the gripping disk structure described above is used to adsorb the front side of the substrate, and only on the edge of the substrate. Contact the non-operational areas to avoid affecting the fabrication of subsequent integrated circuits.

By setting the suction port in the annular edge area of the suction surface, the suction force can be dispersed in the area closer to the edge of the substrate. Compared with the prior art, the required suction volume and suction force are smaller, and the edge of the substrate is smaller. The negative pressure is uniform, which can avoid deformation of the substrate and even pressure injury and pollution due to the concentration of the area where the adsorption force is applied.

It should be noted that the above-mentioned annular edge region can be any designated region on the adsorption surface, and the setting of the region satisfies: the adsorption force can be dispersed in the region closer to the edge of the substrate to reduce the amount of air extraction and increase the adsorption force The purpose of uniformity.

For example, the maximum radius of the annular edge region is equal to the radius of the substrate; the ratio of the minimum radius of the annular edge region to the radius of the substrate is 7/10. In this region, the adsorption force can be effectively dispersed in the region closer to the edge of the substrate. Hereinafter, specific embodiments of the apparatus for operating a substrate provided by the present invention will be described in detail. As shown in FIG. 1 to FIG. 3, in one embodiment, the gripping disc structure includes: a uniform air disc 182 and a carrier disc 183. The carrying tray 183 has the above-mentioned suction surface, and a plurality of first through holes (38, 39) penetrating the carrying tray along its axial direction are provided in the carrying tray 183. The first through holes (38, 39) are formed in the carrying tray 183. The port on the suction surface is used as a suction port.

In this embodiment, the plurality of first through holes are all located in the above-mentioned annular edge region, and are evenly distributed on two circles with different radii having the center of the adsorption surface as the center of the circle. Specifically, the radius of the circumference where the first through hole 38 is located is greater than the radius of the circumference where the first through hole 39 is located. Of course, in practical applications, the number of circles, the size of the radius, the number of first through holes on each circle, the size of the diameter, etc. can be set according to specific needs. For example, the circumference of the first through hole may also be one or more than three.

In this embodiment, an adsorption groove 41 is provided on the adsorption surface, and all the suction ports are communicated with the adsorption groove 41. When the substrate is operated by the device, it is ensured that the space between the substrate 40 and the entire adsorption surface can be evacuated. Air, thereby firmly adsorbing the substrate 40.

Optionally, the side surface of the adsorption groove 41 includes a first annular surface and a second annular surface that are sequentially arranged from the edge of the adsorption surface toward the center, wherein the first annular surface is inclined with respect to the adsorption surface and is opposite to the substrate 40. The vertical gap between them gradually increases from the edge of the adsorption surface toward the center; the second annular surface is inclined or perpendicular to the adsorption surface. In this way, the contact position between the adsorption surface and the substrate can be made closer to the edge of the substrate, and by making the first torus inclined relative to the adsorption surface, the contact area between the adsorption surface and the substrate 40 can be effectively reduced, thereby ensuring that It can be in contact with only the non-working area at the edge of the substrate 40 to avoid affecting the fabrication of subsequent integrated circuits.

Further optionally, the circumference of the first through hole 38 is distributed on the first torus, and the circumference of the first through hole 39 is distributed on the bottom surface of the adsorption groove 41. In this way, the adsorption force can be effectively dispersed in the area closer to the edge of the substrate, and the air between the substrate 40 and the entire adsorption surface can be evacuated, so that the substrate 40 can be firmly adsorbed. Of course, in practical applications, multiple circumferential suction ports may be distributed on the first annular surface, or multiple circumferential suction ports may be distributed on both the first annular surface and the bottom surface of the adsorption tank.

The air distribution plate 182 is connected to the bearing plate 183, and the two can be detached by screw connection or snap-on connection, for example, the connection screw 111 is used to fix the gas distribution plate 182 and the bearing plate 183 together. The gas distribution plate 182 is located on the side of the bearing plate 183 facing away from the adsorption surface, and a gas distribution channel is provided in the gas distribution plate 182, and the gas distribution channel communicates with each of the first through holes (38, 39) to form an air suction channel .

In this embodiment, the device further includes a first annular elastic element 221 and a second annular elastic element 222, both of which are located between the air homogenizing plate 182 and the carrying plate 183, and are used between the air homogenizing plate 182 and the carrying plate 183 A ring-shaped sealed space is enclosed to communicate the uniform air passage with each first through hole (38, 39).

With the above-mentioned first annular elastic element 221 and second annular elastic element 222, it can not only play a sealing role, but also form an elastic buffer structure, which can play a buffer function when the carrier tray 183 contacts the substrate, so as to reduce The substrate is under pressure to avoid crushing the substrate during the pick-and-place process. In practical applications, each of the first annular elastic element 221 and the second annular elastic element 222 may be an O-shaped rubber ring, and the O-shaped rubber ring can work for a long time in a temperature range of 350-400 ° C. Alternatively, the first ring-shaped elastic element 221 and the second ring-shaped elastic element 222 may be adhered between the air homogenizing plate 182 and the bearing plate 183 with a high elastic polymer glue, and other sealing elastic members such as a sealing butterfly spring may also be used.

In this embodiment, an annular groove is provided on the opposite side of the air uniformity disk 182 and the bearing plate 183 and is located in the annular sealed space. The annular groove and the air uniformity channel and each first through hole (38, 39 ) Connected. In this way, the volume of the annular sealed space can be increased, and the smoothness and uniformity of the airflow can be improved. Of course, in practical applications, an annular groove may also be provided only on the opposite side of the air homogenizing disc 182 or the bearing disc 183.

The air distribution plate 182 includes a ring-shaped body 171 and a ventilation structure, wherein the ring-shaped body 171 is connected to the bearing plate 183; the first ring-shaped elastic element 221 and the second ring-shaped elastic element 222 are located between the ring-shaped body 171 and the bearing plate 183, and, in The ring body 171 is provided with a plurality of second through holes 37 penetrating through the ring body 171 along its axial direction. The plurality of second through holes 37 are evenly distributed along the circumferential direction of the ring body 171. Each of the second through holes 37 and the ring shape The sealed space communicates.

The ventilation structure has a plurality of shunt channels 36 having the same structure, the number of the shunt channels 36 is the same as the number of the second through holes 37, and one end of the plurality of shunt channels 36 communicates with the plurality of second through holes 37 one by one, The other end converges to the center position of the ring body 171. In this embodiment, the ventilation structure includes a plurality of linear ducts 161 disposed along the radial direction of the annular body 171, and the inner cavity of each linear duct 161 is used as a 36-split channel. In this way, the air extraction mode in which the airflow converges from the periphery to the center can be realized, and because the paths of the air passing through each of the shunt channels 36 are the same, this can ensure that the air extraction volume in the circumferential direction of the substrate is consistent, so that the negative pressure at the edge of the substrate is uniform. Of course, in practical applications, the shunt channel of any other structure may also be used, for example, a shunt channel capable of extracting air from the edge point to the center, and the edge point to the edge, etc.

In this embodiment, the device further includes an exhaust pipe 181, one end of which is in communication with the other end of each of the distribution channels 36 converging to the center position of the annular body 171, and the other end of the exhaust pipe 181 is used to communicate with the suction system (in the figure) (Not shown) connected.

In this embodiment, the ventilation structure includes a central disc 151 located at the center position of the ring-shaped body 171 and fixedly connected to each of the linear pipes 161, such as welding or gluing or integral molding. In addition, a connecting channel communicating with each of the diverting channels 36 is provided in the central disk 151; the central disk 151 and the exhaust pipe 181 are fixedly connected with the connecting screw 101, and the two have a butting surface, a connecting channel and The inner cavity 35 is oppositely provided with annular butt openings on the abutting surfaces of the central disc 151 and the suction pipe 181, respectively, for achieving communication between the connection channel and the inner cavity 35 of the suction pipe 181. In addition, the device further includes a third annular elastic element 121 and a fourth annular elastic element 122, both of which are coaxially disposed between the abutting surface of the central disc 151 and the suction pipe 181, and are located inside and outside the annular butt joint respectively. .

The third ring-shaped elastic element 121 and the fourth ring-shaped elastic element 122 have the same functions as the first ring-shaped elastic element 221 and the second ring-shaped elastic element 222 described above, and can both play a sealing role and form an elastic cushioning structure. On the basis of the first annular elastic element 221 and the second annular elastic element 222, a heavy buffer is added to further reduce the pressure on the substrate and avoid damaging the substrate during the process of picking and placing the wafer. In practical applications, both the third annular elastic element 121 and the fourth annular elastic element 122 may be O-shaped rubber rings, and the O-shaped rubber rings can work for a long time in a temperature range of 350-400 ° C. Alternatively, the third ring-shaped elastic element 121 and the fourth ring-shaped elastic element 122 may also be bonded between the abutting surface of the central disc 151 and the suction pipe 181 with a high elastic polymer glue, and other sealing elasticity such as a sealing butterfly spring may also be used. Pieces.

A method for performing a pick-and-place operation using the apparatus for operating a substrate in the above embodiment includes:

In step one, the apparatus 200 for operating the substrate is horizontally moved until the carrier tray 183 is positioned directly above the substrate 40.

In step two, the apparatus 200 is lowered until the suction surface of the carrier tray 183 touches at least one point of the upper edge of the substrate 40.

Step three, continue to slowly lower the device 200 so that the air-distributing disk 182 rotates relative to its horizontal axis but not relative to its vertical symmetrical axis until the suction surface of the carrier disk 183 touches the entire upper edge of the substrate 40.

In step three, during the process of slowly lowering the device 200, under the effect of the device 200's own gravity, the carrier plate 183 will exert continuous pressure on the substrate 40. At this time, the first A ring-shaped elastic element 221 and a second ring-shaped elastic element 222, and a third ring-shaped elastic element 121 and a fourth ring-shaped elastic element 122 between the abutting surface of the central disk 151 and the suction pipe 181 provide double elastic cushioning, which can eliminate the lining. Part of the pressure on the bottom 40 prevents the substrate from being crushed during the pick-and-place process.

Step four, the suction chamber is used to sequentially pass through the inner cavity 35 of the suction pipe 181, the inner cavity of each linear pipe 161 (that is, the shunt channel 36), each second through hole 37, and each first through hole (38, 39). The gas in the adsorption groove 41 between the substrate 40 and the adsorption surface of the carrier disk 183 is evacuated to form a vacuum negative pressure. This negative pressure will "press" the substrate 40 onto the adsorption surface of the carrier disk 183. The ports (ie, suction ports) of the through holes (38, 39) on the adsorption surface are arranged in the annular edge region of the adsorption surface, which can disperse the adsorption force in the region closer to the edge of the substrate, which is compared with the prior art. The required pumping volume and pumping force are smaller, and the negative pressure at the edge of the substrate is uniform, thereby avoiding deformation of the substrate and even crushing and pollution due to the concentration of the area where the suction force acts.

In step five, the apparatus 200 with the substrate 40 is moved horizontally after being lifted.

Unless otherwise stated in any of the technical solutions disclosed in the present invention, if it discloses a numerical range, the disclosed numerical ranges are all preferred numerical ranges. Any person skilled in the art should understand that the preferred numerical ranges are merely Among the many values that can be implemented, the technical effect is obvious or representative. Because there are many values and cannot be exhausted, only some values are disclosed in the present invention to illustrate the technical solution of the present invention, and the values listed above should not limit the scope of protection of the invention.

At the same time, if the above-mentioned present invention discloses or relates to parts or structural parts that are fixedly connected to each other, unless otherwise stated, a fixed connection can be understood as: a detachably fixed connection (such as a bolt or screw connection), or It is understood as: non-removable fixed connection (such as riveting, welding), of course, the fixed connection to each other can also be replaced by an integrated structure (such as manufactured by integral molding using a casting process) (except that an integral molding process cannot obviously be used).

In addition, the terms used to indicate the positional relationship or shape applied in any of the above technical solutions disclosed in the present invention include, unless otherwise stated, their meanings including states, shapes, or shapes that are similar, similar, or close to each other. Any component provided by the present invention can be assembled from a plurality of separate components, or it can be a separate component manufactured by an integral molding process.

The above embodiments are only used to illustrate the technical solution of the present invention and are not limited thereto. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that specific embodiments of the present invention can still be performed. Modifications or equivalent replacements of some technical features; without departing from the spirit of the technical solution of the present invention, they should all be included in the scope of the technical solution claimed by the present invention.

The description of the present invention has been presented for purposes of illustration and description, and is not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described in order to better explain the principles and practical applications of the invention, and to enable others of ordinary skill in the art to understand the invention to design various embodiments with various modifications as are suited to particular uses.

Claims

An apparatus for operating a substrate, characterized in that the apparatus includes:

A gripping disc structure having an adsorption surface, and an extraction channel is provided in the gripping disc structure, and the exhaust channel includes a plurality of extraction channels distributed in an annular edge region of the adsorption surface. An air port, when the device is operating the substrate, sucks the substrate through the suction channel to extract air between the substrate and the adsorption surface.
The apparatus according to claim 1, wherein a maximum radius of the annular edge region is equal to a radius of the substrate; a ratio of a minimum radius of the annular edge region to a radius of the substrate is 7 / 10.
The apparatus according to claim 1, wherein the plurality of suction ports are evenly distributed on a circle or a plurality of circles having different radii with the center of the adsorption surface as a circle center.
The device according to claim 3, wherein an adsorption groove is provided on the adsorption surface, and all of the air suction ports are in communication with the adsorption groove.
The device according to claim 4, wherein the side surface of the adsorption groove comprises a first annular surface and a second annular surface which are sequentially arranged from an edge of the adsorption surface toward a direction near the center, wherein the first An annular surface is inclined with respect to the adsorption surface, and a vertical gap with the substrate gradually increases from an edge of the adsorption surface toward a center; the second annular surface is inclined with respect to the adsorption surface Or vertical.
The apparatus according to claim 5, wherein a plurality of said air outlets are distributed on said first torus.
The apparatus according to claim 6, wherein a plurality of said air outlets are distributed on the bottom surface of said adsorption tank.
The device according to any one of claims 1-7, wherein the grasping disc structure comprises:

A carrier disk has the adsorption surface, and a plurality of first through holes penetrating the carrier disk along its axial direction are provided in the carrier disk. Ports of the first through holes on the adsorption surface are used for the ports. Making the suction port; and

A gas-homing disk is connected to the carrier disk and is located on a side of the carrier disk facing away from the adsorption surface; and a gas-homing channel is provided in the gas-homing disk, and the gas-homing channels are connected to each of the The first through hole communicates with each other to form the suction channel.
The device according to claim 8, further comprising: a first ring-shaped elastic element and a second ring-shaped elastic element, both of which are located between the air homogenizing plate and the bearing plate, for An annular sealed space is enclosed between the two to communicate the uniform air passage with each of the first through holes.
The device according to claim 9, characterized in that an annular groove is provided on the opposite side of the air homogenizing disc and / or the carrier disc and is located in the annular sealed space, and the annular groove It is in communication with the uniform air passage and each of the first through holes.
The apparatus according to claim 9, wherein the air homogenizing plate comprises:

An annular body is connected to the carrying plate; the first annular elastic element and the second annular elastic element are located between the annular body and the carrying plate, and a plurality of annular elastic elements are provided along the annular body. A second through hole axially penetrating the annular body, a plurality of the second through holes are uniformly distributed along a circumferential direction of the annular body, and each of the second through holes communicates with the annular sealed space;

The ventilation structure has a plurality of shunt channels with the same structure, the number of the shunt channels is the same as the number of the second through holes, and one end of the plurality of shunt channels is in one-to-one correspondence with a plurality of the second communication channels. The holes communicate, and the other end converges to the center position of the ring body.
The device according to claim 11, wherein the ventilation structure comprises a plurality of linear pipes disposed along a radial direction of the annular body, and an inner cavity of each of the linear pipes is used as the shunt channel.
The device according to claim 12, further comprising:

One end of the suction pipe is in communication with the other end of each of the shunt channels converging to the center position of the annular body, and the other end of the suction pipe is used to connect with the suction system.
The device according to claim 13, wherein the ventilation structure further comprises:

A central disc, which is located at a central position of the annular body and is fixedly connected to each of the straight pipelines, and a connecting channel communicating with each of the diverting channels is provided in the central disc; the central circle The disk is fixedly connected to the exhaust pipe, and both have abutment surfaces. The connection channel and the inner cavity of the exhaust pipe are respectively provided with annular butt openings on the abutting surface of the central disc and the exhaust pipe ;

The device further includes: a third annular elastic element and a fourth annular elastic element, both of which are coaxially disposed between the central disk and the abutting surface of the suction pipe, and are respectively located inside the annular butt joint. And outside.