CN208478312U - Equipment for operating substrate - Google Patents
Equipment for operating substrate Download PDFInfo
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- CN208478312U CN208478312U CN201821232301.7U CN201821232301U CN208478312U CN 208478312 U CN208478312 U CN 208478312U CN 201821232301 U CN201821232301 U CN 201821232301U CN 208478312 U CN208478312 U CN 208478312U
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- annular
- aspirating hole
- substrate
- disk
- exhaust tube
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Abstract
The utility model embodiment discloses a kind of equipment for operating substrate, comprising: exhaust tube (181) and grabs disc-dismounting device；Multiple first aspirating holes (38,39) being along the circumferential direction uniformly arranged are provided in the bottom for grabbing disc-dismounting device, multiple first aspirating holes are connected to exhaust tube (181)；Multiple first aspirating holes (38,39) it is distributed in the specific region of crawl disk bottom of device, when substrate (40) and crawl disk bottom of device contact, multiple first aspirating holes are located at substrate (40) outer edge, the air between substrate (40) and the bottom for grabbing disc-dismounting device is extracted out by exhaust tube (181) and multiple first aspirating holes, to adsorb substrate (40).The equipment of the utility model, when generating negative pressure, required sucking rate, draft are smaller, and edges of substrate negative pressure is uniform, avoid weighing wounded and polluting for substrate；Double buffering is provided, avoids that chip is weighed wounded and polluted during picking and placing piece, improves product yield.
Description
Technical field
The utility model relates to semiconductor Integrated-manufacturing Techniques field more particularly to a kind of equipment for operating substrate.
Background technique
In semiconductor integrated circuit manufacturing field, in order to generate the semiconductor crystal wafer of extension coating, generally use externally
Prolong the semiconductor crystal wafer in reactor and carry out epitaxial coating, deposition gases pass through epitaxial reactor, can be in the table of semiconductor crystal wafer
Epitaxial material is deposited on face.In epitaxial reactor, wafer substrates transmission belongs to very important content.Chip is typically round
, there is front and back, front wafer surface is to form the wafer face for realizing integrated circuit structure；In addition, the edge of chip is several
Millimeter region is without in realization IC manufacturing.So in chip transmit process, protect that front wafer surface is not damaged to be
It is very important.
Currently, having a variety of equipment for transmitting substrate in existing epitaxial reactor, but there is shortcoming.Example
Such as, for the equipment for operating substrate in a kind of epitaxial reactor, during taking piece, the suction of formation at each aspirating hole
Attached power acts on the front center of substrate, and the adsorption capacity of substrate center effect will make substrate deformation excessive, thus pressure easy to form
Wound；In addition, substrate has remained certain temperature when taking piece in by process cavity, exist centainly between the grabbing device of equipment
Adhesiveness, substrate very may not be able to be adsorbed horizontally, not can guarantee steady absorption, to cause to take piece failure or fall
It falls；For the equipment for operating substrate in another epitaxial reactor, the absorption hole on the grabbing device of equipment is arranged not
Rationally, it needs to aspirate using big flow if there is vacuum between grabbing device and substrate, the big adsorption capacity of generation often makes
Substrate deforms.Therefore, it is necessary to a kind of new equipment for transmitting substrate.
Utility model content
In view of this, the utility model embodiment provides a kind of equipment for operating substrate.
According to the one aspect of the utility model embodiment, a kind of equipment for operating substrate is provided, comprising: exhaust tube
With grab disc-dismounting device；One end of the exhaust tube is connect with the disc-dismounting device of grabbing；It is arranged in the bottom for grabbing disc-dismounting device
There are multiple first aspirating holes, the multiple first aspirating hole is connected to the exhaust tube；The multiple first aspirating hole is distributed in
The specific region of the crawl disk bottom of device, so that in the state that substrate and the bottom for grabbing disc-dismounting device contact, institute
It states multiple first aspirating holes and is located at the substrate outer edge；It is extracted out by the exhaust tube and the multiple first aspirating hole
Air between the substrate and the bottom for grabbing disc-dismounting device, to adsorb the substrate.
Optionally, the specific region is annular region, and the multiple first aspirating hole is in the annular region along circle
Circumferential direction is uniformly arranged；The maximum radius of the annular region is equal with the radius of the substrate；The minimum of the annular region
Radius and the ratio of the substrate radius are 7/10.Optionally, the disc-dismounting device of grabbing includes: even gas disk and carrier；It is described
Even gas disk is connected with the carrier；The bottom of the carrier is arranged in the multiple first aspirating hole；The exhaust tube
One end is connect with the even gas disk, and the even gas disk is provided with ventilation pipe, and the multiple first aspirating hole passes through the ventilation
Pipeline is connected to the exhaust tube.
Optionally, further includes: first annular elastic element and the second annular elastic element；The first annular elastic element
And second annular elastic element is between the even gas disk and the carrier；The first annular elastic element and institute
It states the second annular elastic element and surrounds annular sealing cavity region, the snorkel between the even gas disk and the carrier
Road and the multiple first aspirating hole, which are located in the annular sealing cavity region with the connectivity part of the ventilation pipe, to be connected to.
Optionally, the multiple first aspirating hole includes: the first aspirating hole of at least two groups, and at least two groups first are evacuated
Hole is all distributed uniformly and circumferentially in arranged in concentric circles and every group of first aspirating hole；Wherein, at least two groups first are taken out
Stomata is all located in the annular sealing cavity region.
Optionally, the multiple first aspirating hole includes: two group of first aspirating hole；First group of first aspirating hole is relative to
Outer edge of two group of first aspirating hole close to the carrier；The bottom of the carrier is provided with adsorption tank, and described first group
First aspirating hole is connected to the adsorption tank with second group of first aspirating hole.
Optionally, the even gas disk includes: device for disc；It is provided on the device for disc empty with the ring packing
The second aspirating hole that cavity region is connected；Wherein, the annular sealing cavity region is led to by second aspirating hole with described
Feed channel is connected.
Optionally, the ventilation pipe includes: multiple suction branches；The multiple suction branch setting is filled in the disk
It sets；One end of the multiple suction branch is all connected to one end of the exhaust tube, each suction branch with the exhaust tube
Junction centered on be radially distributed；The other end of the multiple suction branch passes through second aspirating hole and the ring
Shape sealing cavity region is connected.
Optionally, third annular elastic element and fourth annular elasticity are set between the even gas disk and the exhaust tube
Element；Wherein, the third annular elastic element and the fourth annular elasticity element are coaxial arrangement, the third annular elastomeric
Property element is sealed to the junction to the multiple suction branch and the exhaust tube, the fourth annular elasticity element
It is in contact positioned at the periphery of the third annular elastic element, and respectively with the even gas disk with the exhaust tube.
Optionally, the device for disc includes: center disk and annular disk, and the center disk and the annular disk are concentric
Setting, and the both ends of multiple suction branches are separately connected the center disk (151) and the annular disk is fixed；The center
One end of disk and the exhaust tube is tightly connected；Wherein, second aspirating hole is arranged on the annular disk.
Optionally, multiple second aspirating holes by circular arrangement and are distributed uniformly and circumferentially, wherein described
Two aspirating holes are correspondingly arranged with the suction branch.
Aspirating hole, is dispersed in the edge of substrate by the equipment for operating substrate of the utility model, is served as a contrast generating
Between bottom and equipment when negative pressure, required sucking rate, draft are smaller, and edges of substrate negative pressure is uniform, can reduce the suffered work of substrate
Firmly, weighing wounded and polluting for substrate is avoided；The buffer system constituted using the Crossed Circle sealing element of " ladder-like ", can make to set
The standby process in contact liner, provides double buffering, avoids that chip is weighed wounded and polluted during picking and placing piece, and it is good to improve product
Rate.
The additional aspect of the utility model embodiment and advantage will be set forth in part in the description, these will be from following
Description in become obvious, or recognized by the practice of the utility model.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is only some embodiments of the utility model, for those of ordinary skill in the art, in not making the creative labor property
Under the premise of, it can also be obtained according to these attached drawings other attached drawings:
Fig. 1 is the schematic perspective view according to one embodiment of the equipment for operating substrate of the utility model；
Fig. 2 is the decomposition texture schematic diagram according to one embodiment of the equipment for operating substrate of the utility model；
Fig. 3 is the structural profile illustration according to one embodiment of the equipment for operating substrate of the utility model.
Specific embodiment
The utility model is described more fully with reference to the accompanying drawings, wherein illustrating the exemplary reality of the utility model
Apply example.The following will be combined with the drawings in the embodiments of the present invention, carries out clearly the technical scheme in the embodiment of the utility model
Chu is fully described by, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole realities
Apply example.Based on the embodiments of the present invention, those of ordinary skill in the art institute without making creative work
The every other embodiment obtained, fall within the protection scope of the utility model.It is practical new to this below with reference to figure and embodiment
The technical solution of type carries out various descriptions.
Hereafter in order to describe conveniently, hereinafter so-called "left", "right", "upper", "lower" and attached drawing itself it is left and right, upper,
Lower direction is consistent.
" first " hereinafter, " second " etc. are only used for distinguishing in description, and there is no other special meanings.
As shown in Figures 1 to 3, the utility model provides a kind of for operating the equipment 200 of substrate, comprising: 181 He of exhaust tube
Grab disc-dismounting device.Grabbing disc-dismounting device can be implemented as a variety of specific structures, and exhaust tube 181 has hollow cavity 35.Exhaust tube
181 one end is connect with disc-dismounting device is grabbed, and the bottom for grabbing disc-dismounting device is provided with multiple be along the circumferential direction uniformly arranged
One aspirating hole, multiple first aspirating holes are connected to exhaust tube 181.Multiple first aspirating holes 38,39 are distributed in the crawl disk dress
The specific region in bottom set portion, the quantity and specific arrangement method of the first aspirating hole can be configured according to design requirement.
Substrate 40 can be a variety of semiconductor wafer substrates.In the state that substrate 40 is contacted with the bottom for grabbing disc-dismounting device
Under, multiple first aspirating holes are located at 40 outer edge of substrate, by exhaust tube 181 and the extraction of multiple first aspirating holes in substrate
40 and grab disc-dismounting device bottom between air, to adsorb substrate 40 so that adsorption capacity is dispersed in the outer edge of substrate 40,
The deformation of substrate 40 can be reduced.Wherein, substrate outer edge can be according to those skilled in the art for the middle part and side of substrate
Edge is generally understood to assert, for example, regard the annular region that radius is substrate radius 70%-100% as substrate outer edge, this
In the case of kind, specific region is annular region, and multiple first aspirating holes 38,39 are along the circumferential direction uniformly set in annular region
It sets.The maximum radius of annular region is equal with the radius of substrate 40；The least radius of annular region and the ratio of 40 radius of substrate
It is 7/10.
In one embodiment, grabbing disc-dismounting device includes: even gas disk 182 and carrier 183.Even gas disk 182 and carrier
183 connections, can use a variety of connection types.The bottom of carrier 183 is arranged in multiple first aspirating holes.Exhaust tube 181
One end is connect with even gas disk 182, and a variety of connection types, such as exhaust tube 181 can be used to pass through attachment screw 101 and even gas disk
182 are connected and fixed.Even gas disk 182 is provided with ventilation pipe, and ventilation pipe can have a variety of structures and form, multiple first pumpings
Hole is connected to by ventilation pipe with exhaust tube 181.
First annular elastic element 221 and the second annular elastic element 222 are between even gas disk 182 and carrier 183.
It is close that first annular elastic element 221 and the second annular elastic element 222 surround annular between even gas disk 182 and carrier 183
The connectivity part of envelope cavity area, multiple first aspirating holes and ventilation pipe is located in annular sealing cavity region.For example, even gas disk
182 can be connected and fixed by attachment screw 111 and carrier 183, first annular elastic element 221 and the second cyclic spring member
Part 222 is placed between even gas disk 182 and carrier 183, provides the cavity of sealing.
By first annular elastic element 221 and the second annular elastic element 222 can be formed it is " ladder-like " distribution, two
The elastic buffer system that annular elastic element is constituted, while having the function that provide sealing.First annular elastic element 221 and
Second ring elastic element 222 can be sealed for O-shaped rubber ring, and O-shaped rubber ring can between 350 ~ 400 DEG C permanent worker
Make.It can also realize that " ladder-like " distribution, annular sealing cavity region are constituted using high resiliency polymerization glue sticking, sealing butterfly spring etc.
Elastic buffer.
Multiple first aspirating holes can be for by the first aspirating hole of at least two groups 38,39 of circular arrangement, at least two groups first
Aspirating hole 38,39 is all distributed uniformly and circumferentially in arranged in concentric circles and every group of first aspirating hole, and at least two groups first are taken out
Stomata is all located in annular sealing cavity region, and it is close that aperture of first aspirating hole 38,39 at 183 top of carrier is all located at annular
It seals in cavity area.For example, multiple first aspirating holes include two group of first aspirating hole, first group of first aspirating hole 38 is relative to the
For two group of first aspirating hole 39 close to the outer edge of carrier 183, the bottom of carrier 183 is provided with adsorption tank 41, and second group
One aspirating hole 39 is located in adsorption tank 41, and first group of first aspirating hole 38 and second group of first aspirating hole 39 connect with adsorption tank 41
It is logical, so as to which the air in adsorption tank 41 is extracted out.
Even gas disk 182 includes device for disc, and device for disc can use various structures.For example, device for disc includes center
Disk 151 and annular disk 171, center disk 151 and annular disk 171 are arranged concentrically, and center disk 151 and annular disk 171
It is fixedly connected, one end of center disk 151 and exhaust tube 181 is tightly connected.It is provided on device for disc and ring packing sky
The second aspirating hole 37 that cavity region is connected, the second aspirating hole 37 can be set on annular disk 171, annular sealing cavity region
It is connected by the second aspirating hole 37 with ventilation pipe.
Ventilation pipe can have a variety of structures.For example, ventilation pipe includes multiple suction branches 161, multiple suction branches
161 are arranged on device for disc.One end of multiple suction branches 161 is all connected to one end of exhaust tube 181, each suction branch
161 are radially distributed centered on the junction of exhaust tube 181.The other end of multiple suction branches 161 is taken out by second
Stomata 37 is connected with annular sealing cavity region.Multiple second aspirating holes 37 are pressed circular arrangement and are along the circumferential direction uniformly divided
Cloth, the second aspirating hole 37 are correspondingly arranged with suction branch 161.Center disk 151 and annular disk 171 pass through multiple suction branches
161 are fixed to each other, and the both ends of multiple suction branches 161 are separately connected center disk 151 and annular disk 171.It can use and pass through
The mode of the center even gas of homogeneous radiation around, can also using from edge a little to the even gas in center, edge a little to edge four
The modes such as all even gas.For example, even gas disk 182 can be by center disk 151, multiple suction branches 161 radially and
The entirety that annular disk 171 is composed by the modes such as welding or being glued.
Suction branch 161 possesses hollow cavity 36, is provided on annular disk 171 corresponding multiple with suction branch 161
Second aspirating hole 37.Third annular elastic element 121 and fourth annular elasticity are set between even gas disk 182 and exhaust tube 181
Element 122；Wherein, third annular elastic element 121 and fourth annular elasticity element 122 are coaxial arrangement, third cyclic spring
Element 121 is sealed to the junction to multiple suction branches 161 and exhaust tube 181, fourth annular elasticity element 122
In third annular elastic element 12) periphery, and be in contact respectively with even gas disk 182 with exhaust tube 181.Fourth annular elasticity member
Part 122 and third annular elastic element 121 play the role of buffering, sealing.
The method for carrying out substrate-operations using the equipment for operating substrate in embodiment as above, comprising:
Step 1 moves horizontally the equipment 200 for operating substrate, until carrier 183 is located at the surface of substrate 40.
Step 2 reduces equipment 200 until carrier 183 touches at least one point of the top edge of substrate 40.
Step 3 continues slowly to reduce equipment 200, so that even gas disk 182 is not relative to horizontal axis but perpendicular relative to it
The straight axis of symmetry rotates movement, until the entire top edge of 183 bottom surface of carrier touching substrate 40.It is right in carrier 183
During substrate 40 applies continuous, it is slow that first annular elastic element 221, the second annular elastic element 222 provide elasticity
Punching.
During continuing slowly reduces equipment 200, due to the dead weight of equipment 200, carrier 183 will be to substrate
40 apply continuous, and the third annular seal element 221,222 between even gas disk 182 and carrier 183 provides elasticity at this time
A part of pressure is fallen in buffering, resolution, meanwhile, the annular seal element 121,122 between exhaust tube 181 and even gas disk 182 will make
The even gas disk 182 and carrier 183 to link together is via any level axis relative to equipment 200 but not relative to equipment
200 vertically symmetrical axis rotates movement, to make the entire top edge of 183 bottom surfaces of carrier touching substrate 40.
Step 4, by suction system via exhaust tube 181, suction branch 161, the second aspirating hole 37, the first aspirating hole
38,39 take the gas in the adsorption tank 41 between substrate 40 and carrier 183 away, negative pressure of vacuum are formed, to adsorb substrate
40。
Air is extracted by means of the suction system of equipment 200, the gas in adsorption tank 41 between substrate 40 and carrier 183
Body is pumped via cavity 35, cavity 36, then by the second aspirating hole 37, the first aspirating hole 38,39, forms negative pressure of vacuum, this is negative
Pressure will oppress substrate 40 " absorption " on carrier 183, since the first aspirating hole 38,39 enclosed diameters are small in carrier 183
Diameter, be evacuated needed for flow it is smaller, 40 edge stress of substrate is also smaller, simultaneously because the second aspirating hole 37, the first aspirating hole
38, it 39 is uniformly distributed, substrate 40 edge uniform force.
Step 5 is horizontally moved after promoting the equipment 200 with substrate 40.
Aspirating hole, is dispersed in the edge of substrate, in life by the equipment provided by the above embodiment for operating substrate
At when negative pressure, required sucking rate, draft are smaller between substrate and equipment, edges of substrate negative pressure is uniform, can reduce substrate institute
By active force, weighing wounded and polluting for substrate is avoided；The buffer system constituted using the Crossed Circle sealing element of " ladder-like ", can
Make equipment in the process of contact liner, double buffering is provided, avoids that chip is weighed wounded and polluted during picking and placing piece, improves and produce
Product yield.
Above-mentioned any technical solution disclosed in the utility model unless otherwise stated, if it discloses numberical range,
So disclosed numberical range is preferred numberical range, and any it should be appreciated by those skilled in the art preferred numerical value
Range is only the numerical value that technical effect is obvious or representative in many enforceable numerical value.Since numerical value is more,
It is impossible to exhaust, so the utility model discloses component values just to illustrate the technical solution of the utility model, also, above-mentioned
The numerical value enumerated should not constitute the limitation that protection scope is created to the utility model.
Meanwhile if above-mentioned the utility model discloses or relates to the components or structural member of connection fastened to each other,
Unless otherwise stated, it is fixedly connected it is to be understood that connection (such as connecting using bolt or screw) can be removedly fixed,
It is to be understood that non-removable be fixedly connected with (such as riveting, welding), certainly, connection fastened to each other or integral type
Structure (such as manufacturing using casting technique is integrally formed) is replaced (obviously can not be using except integrally formed technique).
In addition, for indicating positional relationship or shape applied in above-mentioned any technical solution disclosed by the utility model
Term its meaning includes approximate with its, similar or close state or shape unless otherwise stated.It is provided by the utility model
Either component by multiple individual component parts either assembled, or the list that integrally formed technique manufactures
Only component.
Above embodiments are only to illustrate the technical solution of the utility model rather than its limitations；Although implementing referring to preferable
The utility model is described in detail in example, it should be understood by those ordinary skilled in the art that: still can be to this reality
It is modified with novel specific embodiment or some technical features can be equivalently replaced；Without departing from the utility model
The spirit of technical solution should all be covered within the scope of the technical scheme claimed by the utility model.
Description of the utility model is given for the purpose of illustration and description, and is not that exhaustively or incite somebody to action this
Utility model is limited to disclosed form.Many modifications and variations are obvious for the ordinary skill in the art.
Embodiment was chosen and described in order to better illustrate the principle and practical application of the utility model, and makes the common skill of this field
Art personnel it will be appreciated that the utility model to designing various embodiments suitable for specific applications with various modifications.
Claims (11)
1. a kind of equipment for operating substrate characterized by comprising
Exhaust tube (181) and grab disc-dismounting device；One end of the exhaust tube (181) is connect with the disc-dismounting device of grabbing；Described
The bottom for grabbing disc-dismounting device is provided with multiple first aspirating holes (38,39), the multiple first aspirating hole and the exhaust tube
(181) it is connected to；The multiple first aspirating hole (38,39) is distributed in the specific region of the crawl disk bottom of device, so that
In the state that substrate (40) is contacted with the bottom for grabbing disc-dismounting device, the multiple first aspirating hole is located at the substrate (40)
Outer edge；It is grabbed in the substrate (40) with described by the exhaust tube (181) and the extraction of the multiple first aspirating hole
Air between the bottom of disc-dismounting device, to adsorb the substrate (40).
2. equipment as described in claim 1, which is characterized in that the specific region is annular region, and the multiple first takes out
Stomata (38,39) is along the circumferential direction uniformly arranged in the annular region；The maximum radius of the annular region and the lining
The radius at bottom (40) is equal；The ratio of the least radius of the annular region and the substrate (40) radius is 7/10.
3. equipment as described in claim 1, which is characterized in that the disc-dismounting device of grabbing includes: even gas disk (182) and carrier
(183)；
The even gas disk (182) and the carrier (183) connection；The multiple first aspirating hole is arranged in the carrier
(183) bottom；One end of the exhaust tube (181) is connect with the even gas disk (182), and the even gas disk (182) is provided with
Ventilation pipe, the multiple first aspirating hole are connected to by the ventilation pipe with the exhaust tube (181).
4. equipment as claimed in claim 3, which is characterized in that further include: first annular elastic element (221) and the second annular
Elastic element (222)；
The first annular elastic element (221) and second annular elastic element (222) be located at the even gas disk (182) and
Between the carrier (183)；The first annular elastic element (221) and second annular elastic element (222) are in institute
It states and surrounds annular sealing cavity region between even gas disk (182) and the carrier (183), the ventilation pipe and the multiple
First aspirating hole with the annular sealing cavity regional connectivity.
5. equipment as claimed in claim 4, which is characterized in that
The multiple first aspirating hole includes: the first aspirating hole of at least two groups (38,39), and first aspirating hole of at least two groups is in
Arranged in concentric circles and every group of first aspirating hole is all distributed uniformly and circumferentially；Wherein, first aspirating hole of at least two groups
It is all located in the annular sealing cavity region.
6. equipment as claimed in claim 5, which is characterized in that
The multiple first aspirating hole includes: two group of first aspirating hole；First group of first aspirating hole (38) is relative to second group
Outer edge of one aspirating hole (39) close to the carrier (183)；The bottom of the carrier (183) is provided with adsorption tank
(41), first group of first aspirating hole (38) is connected to the adsorption tank (41) with second group of first aspirating hole (39).
7. equipment as claimed in claim 4, which is characterized in that
The even gas disk includes: device for disc；It is provided on the device for disc and is connected with the annular sealing cavity region
Logical the second aspirating hole (37)；Wherein, the annular sealing cavity region passes through second aspirating hole (37) and the ventilation
Pipeline is connected.
8. equipment as claimed in claim 7, which is characterized in that
The ventilation pipe includes: multiple suction branches (161)；The multiple suction branch (161) setting is filled in the disk
It sets；One end of the multiple suction branch (161) is all connected to one end of the exhaust tube (181), each suction branch (161)
It is radially distributed centered on the junction of the exhaust tube (181)；The other end of the multiple suction branch (161) is logical
Second aspirating hole (37) is crossed to be connected with the annular sealing cavity region.
9. equipment as claimed in claim 8 characterized by comprising
Third annular elastic element (121) and fourth annular are set between the even gas disk (182) and the exhaust tube (181)
Elastic element (122)；
Wherein, the third annular elastic element (121) and the fourth annular elasticity element (122) are coaxial arrangement, described
Third annular elastic element (121) is carried out to the junction to the multiple suction branch (161) and the exhaust tube (181)
Sealing, the fourth annular elasticity element (122) is located at the periphery of the third annular elastic element (121), and respectively with institute
Even gas disk (182) is stated to be in contact with the exhaust tube (181).
10. equipment as claimed in claim 8, which is characterized in that
The device for disc includes: center disk (151) and annular disk (171), the center disk (151) and the annular disk
(171) it is arranged concentrically, and the both ends of multiple suction branches (161) are separately connected the center disk (151) and the annular
Disk (171)；One end of the center disk (151) and the exhaust tube (181) is tightly connected；Wherein, second aspirating hole
(37) it is arranged on the annular disk (171).
11. equipment as claimed in claim 10, which is characterized in that
Multiple second aspirating holes (37) are by circular arrangement and are distributed uniformly and circumferentially, wherein second pumping
Hole (37) is correspondingly arranged with the suction branch (161).
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821232301.7U CN208478312U (en) | 2018-08-01 | 2018-08-01 | Equipment for operating substrate |
| JP2020572714A JP7134267B2 (en) | 2018-08-01 | 2019-07-22 | Equipment for manipulating substrates |
| PCT/CN2019/097130 WO2020024837A1 (en) | 2018-08-01 | 2019-07-22 | Device for operating substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821232301.7U CN208478312U (en) | 2018-08-01 | 2018-08-01 | Equipment for operating substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208478312U true CN208478312U (en) | 2019-02-05 |
Family
ID=65208075
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821232301.7U Active CN208478312U (en) | 2018-08-01 | 2018-08-01 | Equipment for operating substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208478312U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020024837A1 (en) * | 2018-08-01 | 2020-02-06 | 北京北方华创微电子装备有限公司 | Device for operating substrate |
-
2018
- 2018-08-01 CN CN201821232301.7U patent/CN208478312U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020024837A1 (en) * | 2018-08-01 | 2020-02-06 | 北京北方华创微电子装备有限公司 | Device for operating substrate |
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