CN113437010B - Manipulator and semiconductor processing equipment - Google Patents
Manipulator and semiconductor processing equipment Download PDFInfo
- Publication number
- CN113437010B CN113437010B CN202110608342.1A CN202110608342A CN113437010B CN 113437010 B CN113437010 B CN 113437010B CN 202110608342 A CN202110608342 A CN 202110608342A CN 113437010 B CN113437010 B CN 113437010B
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- circular arc
- negative pressure
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 12
- 238000001179 sorption measurement Methods 0.000 claims abstract description 141
- 238000007664 blowing Methods 0.000 claims description 2
- 239000006227 byproduct Substances 0.000 abstract description 22
- 238000000034 method Methods 0.000 abstract description 14
- 230000008569 process Effects 0.000 abstract description 14
- 238000005516 engineering process Methods 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 description 4
- 230000002745 absorbent Effects 0.000 description 3
- 239000002250 absorbent Substances 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
- B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Landscapes
- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manipulator (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The application discloses a manipulator and semiconductor processing equipment, the manipulator comprises a support arm (100) and an adsorption piece (200), the support arm (100) is fixedly connected with the adsorption piece (200), the adsorption piece (200) is provided with a negative pressure adsorption hole, the outer side edge of the adsorption piece (200) is provided with a circular arc-shaped opening (211), and the circular arc-shaped opening (211) and the support arm (100) are respectively positioned on two opposite sides of the adsorption piece (200). The technical scheme adopted by the application can solve the problem that the mechanical arm in the background technology is easier to attach byproducts generated in the processing process of the process cavity to the workpiece to be processed, and finally the quality of the workpiece to be processed is poor.
Description
Technical Field
The application relates to the technical field of semiconductor processing technology, in particular to a mechanical arm and semiconductor processing equipment.
Background
In the related art, a semiconductor processing apparatus conveys a workpiece to be processed by a robot. In a specific working process, the manipulator can transmit the to-be-machined piece from the bearing cavity to the process cavity, so that the to-be-machined piece is machined in the process cavity. Because the process cavity can produce byproducts in the processing process, the mechanical arm is easy to be stained with the byproducts when the processed workpiece to be processed is taken out of the process cavity. This results in the fact that the next time the robot picks up the workpiece from the carrier chamber and conveys it to the process chamber, these byproducts adhere to the unprocessed workpiece, which results in problems with the quality of the workpiece during processing in the process chamber. Through detection, the problem is that polycrystalline phenomenon can appear on the workpiece to be processed, and finally the quality of the workpiece to be processed is poor.
Disclosure of Invention
The embodiment of the application aims to disclose a manipulator and semiconductor processing equipment, which are used for solving the problem that the manipulator in the related art is easier to attach byproducts generated in the processing process of a process cavity to a workpiece to be processed, and finally the quality of the workpiece to be processed is poor.
In order to solve the technical problems, the application adopts the following technical scheme:
In a first aspect, an embodiment of the present application provides a manipulator, where the disclosed manipulator includes a support arm and an adsorption element, the support arm is fixedly connected with the adsorption element, the adsorption element is provided with a negative pressure adsorption hole, an outer edge of the adsorption element is provided with a circular arc opening, and the circular arc opening and the support arm are respectively located at two opposite sides of the adsorption element.
In a second aspect, embodiments of the present application provide a semiconductor processing apparatus, the disclosed semiconductor processing apparatus comprising a robot as described above.
The technical scheme adopted by the application can achieve the following beneficial effects:
According to the manipulator disclosed by the embodiment of the application, through improving the structure of the manipulator in the related technology and arranging the circular arc-shaped openings in the area which is distributed on the adsorption piece and is opposite to the support arm, the phenomenon that byproducts are easy to occur in the area which is provided with the circular arc-shaped openings is relieved, so that the condition that the workpiece to be processed is polluted by the manipulator can be relieved indirectly, less byproducts are polluted by the workpiece to be processed, the influence of the byproducts on the quality of the workpiece to be processed can be relieved, and the quality of the workpiece to be processed can be improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments or the background art of the present application, the following description will briefly explain the drawings required to be used in the embodiments or the background art, and it will be obvious to those skilled in the art that other drawings can be obtained according to these drawings without inventive effort.
Fig. 1 is a top view of a manipulator according to an embodiment of the present application.
Reference numerals illustrate:
100-supporting arms;
200-adsorption parts, 210-outer ring adsorption areas, 211-arc-shaped openings, 212-first adsorption holes, 220-inner ring adsorption areas, 221-second adsorption holes and 230-connection holes.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions of the present application will be clearly and completely described below with reference to specific embodiments of the present application and corresponding drawings. It will be apparent that the described embodiments are only some, but not all, embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
The technical scheme disclosed by each embodiment of the application is described in detail below with reference to the accompanying drawings.
Referring to fig. 1, an embodiment of the present application discloses a robot and a semiconductor processing apparatus, wherein the robot includes a support arm 100 and an adsorption member 200.
The supporting arm 100 is a supporting structure of a manipulator, and can play a supporting role on the adsorbing member 200, and the adsorbing member 200 is a main functional structure of the manipulator, and can pick up a machined workpiece to be machined, such as a wafer, under the supporting role of the supporting arm 100. The support arm 100 is fixedly connected with the adsorption member 200, so that the connection relationship between the support arm 100 and the adsorption member 200 is stable, and the support arm 100 can stably play a supporting role on the adsorption member 200.
The suction piece 200 is provided with a negative pressure suction hole, and the pressure in the negative pressure suction hole is negative pressure, so that when the negative pressure suction hole is close to a workpiece to be picked up, the workpiece to be picked up can be sucked onto the suction piece 200, and the picking up function of the manipulator is realized. The outer edge of the absorbing member 200 is provided with a circular arc opening 211, and the circular arc opening 211 and the supporting arm 100 are respectively positioned at two opposite sides of the absorbing member 200. In the related experiment, the opposite side of the adsorption member 200 to the support arm 100 is the reference side opposite to the reference side, the opposite area of the reference side is the area with more byproducts, and the circular arc-shaped notch 211 is formed in the opposite area of the reference side, so that more byproducts are prevented from occurring in the opposite area of the reference side, and the manipulator is prevented from polluting the workpiece to be processed when picking up the workpiece to be processed.
The manipulator disclosed in the embodiment of the application is used for alleviating the phenomenon that byproducts are easy to occur in the area opposite to the reference edge where the circular arc-shaped notch 211 is formed by forming the circular arc-shaped notch 211 in the area where the adsorbing member 200 is distributed opposite to the supporting arm 100 by improving the structure of the manipulator in the related art, so that the condition that the workpiece to be polluted by the manipulator is polluted by the byproducts can be indirectly relieved, less byproducts are polluted by the workpiece to be treated, the influence of the byproducts on the quality of the workpiece to be treated can be relieved, and the quality of the workpiece to be treated can be improved.
In the manipulator disclosed in the embodiment of the present application, the center of the circular arc opening 211 and the center of the adsorbing member 200 may coincide, so that a circle formed by the radius of the circular arc opening 211 and a circle formed by the radius of the adsorbing member 200 may be concentric circles, so that the circular arc opening 211 may be easily opened on the adsorbing member 200, thereby manufacturing of the circular arc opening 211 in the manipulator may be simplified, and in a related experiment, it is known that a byproduct of a workpiece is mostly present in a region within an angle range opposite to the reference edge, in this case, a central angle of the circular arc opening 211 may be greater than or equal to 60 ° and less than or equal to 120 °, so that a region where a byproduct is intensively present may be cut off, thereby forming the circular arc opening 211, and further reducing a region where a byproduct is intensively present in the manipulator, so as to reduce pollution of the byproduct to the workpiece to be processed.
Meanwhile, the arc-shaped notch 211 is formed in the absorbing member 200, namely, the part of the structure on the absorbing member 200 is cut off, so that the weight of the absorbing member 200 can be reduced, the supporting arm 100 is helped to support the absorbing member 200 more stably, the sagging of the manipulator when the manipulator moves to take a workpiece to be processed can be improved, and the phenomenon that the workpiece to be processed is polluted by a byproduct due to uneven stress when the manipulator moves to take the workpiece to be processed under the relatively uneven condition can be avoided.
In a further embodiment, the center line of the circular arc-shaped opening 211 along the radial direction of the absorbent member 200 may be a first center line, the center line of the support arm 100 along the radial direction of the absorbent member 200 may be a second center line, and the first center line and the second center line are collinear and all pass through the center of the absorbent member 200. In this case, the center line of the circular arc-shaped opening 211 coincides with the center line of the support arm 100, that is, the circular arc-shaped opening 211 and the support arm 100 are symmetrically arranged in the manipulator, so that the support of the adsorption member 200 by the support arm 100 can be balanced. Optionally, the whole absorbing member 200 and the supporting arm 100 may be axisymmetric structures, so that the supporting arm 100 can uniformly support the whole structure of the absorbing member 200, thereby being beneficial to the absorbing member 200 to stably realize negative pressure absorption of a workpiece to be processed through the negative pressure absorption holes in the working process of the manipulator.
In the manipulator disclosed in the embodiment of the present application, the adsorbing member 200 may include an inner ring adsorption region 220 and an outer ring adsorption region 210, where the inner ring adsorption region 220 and the outer ring adsorption region 210 are coaxially disposed, and the inner ring adsorption region 220 is located within the outer ring adsorption region 210. In this case, the adsorption member 200 has different adsorption regions, specifically, an inner ring adsorption region 220 and an outer ring adsorption region 210, and the outer ring adsorption region 210 is disposed around the inner ring adsorption region 220.
In an alternative solution, the circular arc-shaped opening 211 may be formed on the edge of the outer ring adsorption area 210 facing away from the inner ring adsorption area 220, and the negative pressure adsorption hole is formed on at least one of the inner ring adsorption area 220 and the outer ring adsorption area 210, specifically, the negative pressure adsorption hole may be formed in the inner ring adsorption area 220, and in the case that the inner ring adsorption area 220 is concave in the outer ring adsorption area 210, the inner ring adsorption area 220 in the adsorption piece 200 may form a negative pressure cavity, and a relatively balanced pressure value in the negative pressure cavity may be beneficial for the adsorption piece 200 to pick up the workpiece stably, so as to avoid pollution caused by unstable contact between the adsorption piece 200 and the workpiece to be processed, and meanwhile, the usability of the manipulator may also be improved. Of course, the negative pressure adsorption hole may also be formed on the outer ring adsorption region 210, or the negative pressure adsorption hole may be formed on both the inner ring adsorption region 220 and the outer ring adsorption region 210, which is not limited by the specific position of the negative pressure adsorption hole.
In a further aspect, the negative pressure adsorption hole may include a plurality of first adsorption holes 212 and a plurality of second adsorption holes 221, where the plurality of first adsorption holes 212 are disposed in the outer ring adsorption region 210 at intervals, and the plurality of second adsorption holes 221 are disposed in the inner ring adsorption region 220 at intervals. In this case, the inner ring adsorption area 220 and the outer ring adsorption area 210 are both provided with negative pressure adsorption holes, so that the larger area on the adsorption piece 200 can realize the function of negative pressure adsorption, and meanwhile, the interval arrangement of the first adsorption holes 212 and the second adsorption holes 221 can be beneficial to forming a negative pressure cavity in the inner ring adsorption area 220 more quickly, so that the starting efficiency of the adsorption piece 200 for picking up workpieces can be improved.
In another alternative, the plurality of second adsorption holes 221 may include a strip-shaped hole and a plurality of round holes, the strip-shaped hole is disposed at an inner side of the circular arc-shaped opening 211, and the plurality of second adsorption holes 221 are spaced apart along a circumferential direction of the inner ring adsorption region 220. In this case, the flow area of the strip-shaped hole is larger than that of the round hole, that is, the flow rate of the gas passing through the strip-shaped hole can be larger than that of the gas passing through the round hole at the same time, so that the strip-shaped hole can further improve the starting efficiency when the adsorbing member 200 picks up the workpiece to be machined. Meanwhile, the strip-shaped holes can be arranged as holes capable of adjusting the air flow, so that staff can adjust the air flow through the strip-shaped holes according to actual demands, and the suction fitting 200 is used for meeting different pickup demands of workpieces to be processed.
In the manipulator disclosed in the embodiment of the present application, the plurality of first adsorption holes 212 may include a first group of first adsorption holes 212 and a second group of first adsorption holes 212, where the first group of first adsorption holes 212 and the second group of first adsorption holes 212 are symmetrically arranged through a line passing through the center of the circular arc-shaped opening 211 and the center of the circle of the adsorption member 200. In this case, the first set of first adsorption holes 212 and the second set of first adsorption holes 212 are symmetrically disposed at two sides of the circular arc-shaped opening 211, that is, the first set of first adsorption holes 212 and the second set of first adsorption holes 212 are symmetrically disposed on the adsorption member 200, so that the adsorption member 200 can balance the pick-up function of the adsorption member 200 and the support function of the support arm 100 on the adsorption member 200.
In a further technical solution, the first group of first adsorption holes 212 may be distributed in a preset shape, and the first group of first adsorption holes 212 exhibiting the distribution in the preset shape may be relatively concentrated at a point, and the distances between the first group of first adsorption holes 212 and the center of the circle of the adsorption piece 200 may not be completely equal, so that the first group of first adsorption holes 212 may exert adsorption effects on the workpiece to be processed in multiple directions, so that the workpiece to be processed may receive adsorption forces from different directions, and thus the adsorption piece 200 may achieve stability when adsorbing the workpiece to be processed in a negative pressure with a smaller flow.
In an alternative solution, the preset shapes may be multiple, and generally for the first group of the first adsorption holes 212 to be relatively symmetrical and concentrated, the preset shapes may be W-shaped, V-shaped or S-shaped, so that the preset shapes can avoid a sliding vane phenomenon caused by uneven stress on the workpiece to be processed to a certain extent, and further reduce the possibility that the manipulator is stained with byproducts in the process of repeatedly picking up the workpiece to be processed. The embodiment of the application does not limit the specific shape of the preset shape.
In the manipulator disclosed in the embodiment of the present application, the distances between the first set of first adsorption holes 212 and the second set of first adsorption holes 212 and the circular arc-shaped opening 211 may be a first distance, the distances between the first set of first adsorption holes 212 and the second set of first adsorption holes 212 and the support arm 100 are a second distance, the first distance is the distance between the centers of the first set of first adsorption holes 212 and the second set of first adsorption holes 212 and the center of the circular arc-shaped opening 211, and the second distance is the distance between the centers of the first set of first adsorption holes 212 and the second set of first adsorption holes 212 and the center of the support arm 100.
In an alternative solution, the first distance may be smaller than the second distance, in this case, the first set of first adsorption holes 212 and the second set of first adsorption holes 212 are formed at positions relatively close to the circular arc-shaped opening 211, and the area on the adsorption piece 200 where the circular arc-shaped opening 211 is formed cannot be provided with the negative pressure adsorption holes, so that the phenomenon that the workpiece to be processed is picked up unevenly may occur on the adsorption piece 200, and the first set of first adsorption holes 212 and the second set of first adsorption holes 212 are close to the circular arc-shaped opening 211, so that the problem that the workpiece to be processed is picked up unevenly by the adsorption piece 200 can be relieved to a certain extent because the area on the adsorption piece 200 cannot be provided with the negative pressure adsorption holes.
In the manipulator disclosed in the embodiment of the present application, the circular arc-shaped opening 211 may have a first size in the radial direction of the adsorbing member 200, and the outer ring adsorption region 210 may have a second size in the radial direction of the adsorbing member 200, where the first size is smaller than the second size. In this case, the circular arc-shaped opening 211 is formed at the edge of the outer ring adsorption region 210, that is, only the region with more byproducts is cut off, so that the integrity of the adsorption member 200 can be ensured to a greater extent, and the circular arc-shaped opening 211 is not contacted with the inner ring adsorption region 220, so that the inner ring adsorption region 220 is complete, and further, the inner ring adsorption region 220 can be ensured to be provided with a negative pressure adsorption hole, so as to ensure that the adsorption member 200 realizes functions.
In the manipulator disclosed in the embodiment of the present application, a connection hole 230 may be formed on a surface of the suction member 200 facing away from the negative pressure suction hole, the connection hole 230 is communicated with the negative pressure suction hole, the manipulator may further include a negative pressure air suction pipe and a positive pressure air supply pipe, the air pressure in the negative pressure air suction pipe is less than atmospheric pressure, the air pressure in the positive pressure air supply pipe may be higher than atmospheric pressure, and the negative pressure air suction pipe and the positive pressure air supply pipe are both connected with the connection hole 230, so that the connection hole 230 may be in a negative pressure environment or a positive pressure environment.
Specifically, the manipulator may have different states, and in the case that the manipulator is in the first state, the manipulator is in a working state, the negative pressure air suction pipe is communicated with the connection hole 230, and the positive pressure air supply pipe is blocked from the connection hole 230, and the negative pressure air suction pipe is used for sucking air from the connection hole 230; at this time, the connection hole 230 is in a negative pressure environment, and the negative pressure adsorption hole can be communicated with a negative pressure air suction pipeline through the connection hole 230, so as to realize the negative pressure environment of the surface of the adsorption piece 200, so that the manipulator can realize negative pressure pickup of the workpiece to be processed. And under the condition that the manipulator is in the second state, the manipulator can also be after finishing the work for a long time, before the manipulator starts, the negative pressure air suction pipeline is blocked with the connecting hole 230, and the positive pressure air supply pipeline is communicated with the connecting hole 230, and the positive pressure air supply pipeline is used for blowing air to the connecting hole 230, at this time, the negative pressure adsorption hole can be communicated with the positive pressure air supply pipeline through the connecting hole 230, so that the negative pressure adsorption hole in the adsorption piece 200 can be purged by the gas with higher pressure, thereby realizing the cleaning function of the adsorption piece 200, and further avoiding the pollution of the original by-product on the adsorption piece 200 to the workpiece to be picked up later.
Based on the manipulator, the embodiment of the application also discloses a semiconductor processing device, and the manipulator is any one of the manipulator.
The foregoing embodiments of the present application mainly describe differences between the embodiments, and as long as there is no contradiction between different optimization features of the embodiments, the embodiments may be combined to form a better embodiment, and in view of brevity of line text, no further description is provided herein.
The foregoing is merely exemplary of the present application and is not intended to limit the present application. Various modifications and variations of the present application will be apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the application are to be included in the scope of the claims of the present application.
Claims (12)
1. The manipulator is characterized by comprising a supporting arm (100) and an adsorption piece (200), wherein the supporting arm (100) is fixedly connected with the adsorption piece (200), a negative pressure adsorption hole is formed in the adsorption piece (200), a circular arc-shaped opening (211) is formed in the outer side edge of the adsorption piece (200), and the circular arc-shaped opening (211) and the supporting arm (100) are respectively positioned on two opposite sides of the adsorption piece (200);
The adsorbing member (200) comprises an inner ring adsorbing region (220) and an outer ring adsorbing region (210), the inner ring adsorbing region (220) and the outer ring adsorbing region (210) are coaxially arranged, the inner ring adsorbing region (220) is located in the outer ring adsorbing region (210), the circular arc-shaped opening (211) is formed in the edge, opposite to the inner ring adsorbing region (220), of the outer ring adsorbing region (210), negative pressure adsorption Kong Kaishe is arranged on at least one of the inner ring adsorbing region (220) and the outer ring adsorbing region (210), and the inner ring adsorbing region (220) is inwards concave in the outer ring adsorbing region (210).
2. The manipulator according to claim 1, characterized in that the centre of the circular arc-shaped opening (211) coincides with the centre of the suction piece (200), the centre angle of the circular arc-shaped opening (211) being greater than or equal to 60 ° and less than or equal to 120 °.
3. The manipulator according to claim 2, wherein the center line of the circular arc-shaped cutout (211) along the radial direction of the suction member (200) is a first center line, the center line of the support arm (100) along the radial direction of the suction member (200) is a second center line, and the first center line and the second center line are collinear and each pass through the center of the suction member (200).
4. The manipulator of claim 1, wherein the negative pressure suction holes comprise a plurality of first suction holes (212) and a plurality of second suction holes (221), the plurality of first suction holes (212) being disposed at intervals in the outer ring suction region (210), and the plurality of second suction holes (221) being disposed at intervals in the inner ring suction region (220).
5. The manipulator according to claim 4, wherein the plurality of second adsorption holes (221) comprise a strip-shaped hole and a plurality of round holes, the strip-shaped hole is arranged on the inner side of the circular arc-shaped opening (211), and the plurality of round holes are distributed at intervals along the circumferential direction of the inner ring adsorption region (220).
6. The manipulator according to claim 4, wherein the plurality of first suction holes (212) includes a first set of first suction holes (212) and a second set of first suction holes (212), the first set of first suction holes (212) and the second set of first suction holes (212) being symmetrically arranged with respect to a line passing through a center of the circular arc-shaped cutout (211) and a center of the suction member (200).
7. The manipulator according to claim 6, wherein the first set of first suction holes (212) are distributed in a preset shape, and the first set of first suction holes (212) are not all equidistant from the center of the suction member (200).
8. The manipulator of claim 7, wherein the preset shape is W-shaped, V-shaped, or S-shaped.
9. The manipulator of claim 6, wherein the first set of first suction holes (212) and the second set of first suction holes (212) are each a first distance from the circular arc-shaped cutout (211), wherein the first set of first suction holes (212) and the second set of first suction holes (212) are each a second distance from the support arm (100), and wherein the first distance is less than the second distance.
10. The manipulator according to claim 1, wherein the circular arc-shaped cutout (211) has a first dimension in a radial direction of the suction member (200), and the outer ring suction region (210) has a second dimension in the radial direction of the suction member (200), the first dimension being smaller than the second dimension.
11. The manipulator according to claim 1, wherein a connection hole (230) is provided on a surface of the adsorbing member (200) facing away from the negative pressure adsorption hole, the connection hole (230) is communicated with the negative pressure adsorption hole, the manipulator further comprises a negative pressure air suction pipe and a positive pressure air supply pipe, both of which are connected with the connection hole (230), wherein:
When the manipulator is in a first state, the negative pressure air suction pipeline is communicated with the connecting hole (230), the positive pressure air supply pipeline is blocked from the connecting hole (230), and the negative pressure air suction pipeline is used for sucking air from the connecting hole (230);
When the manipulator is in the second state, the negative pressure air suction pipeline is blocked from the connecting hole (230), the positive pressure air supply pipeline is communicated with the connecting hole (230), and the positive pressure air supply pipeline is used for blowing air to the connecting hole (230).
12. A semiconductor processing apparatus comprising the robot of any one of claims 1 to 11.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110608342.1A CN113437010B (en) | 2021-06-01 | 2021-06-01 | Manipulator and semiconductor processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110608342.1A CN113437010B (en) | 2021-06-01 | 2021-06-01 | Manipulator and semiconductor processing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113437010A CN113437010A (en) | 2021-09-24 |
| CN113437010B true CN113437010B (en) | 2024-05-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110608342.1A Active CN113437010B (en) | 2021-06-01 | 2021-06-01 | Manipulator and semiconductor processing equipment |
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| CN (1) | CN113437010B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115229832A (en) * | 2022-09-02 | 2022-10-25 | 中国电子科技集团公司第二十六研究所 | Scratch-proof vacuum adsorption type wafer taking and placing device and manufacturing method thereof |
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