CN108933099B - Apparatus for handling substrates - Google Patents
Apparatus for handling substrates Download PDFInfo
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- CN108933099B CN108933099B CN201810867124.8A CN201810867124A CN108933099B CN 108933099 B CN108933099 B CN 108933099B CN 201810867124 A CN201810867124 A CN 201810867124A CN 108933099 B CN108933099 B CN 108933099B
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- 239000000758 substrate Substances 0.000 title claims abstract description 82
- 238000000605 extraction Methods 0.000 claims abstract description 50
- 238000005086 pumping Methods 0.000 claims abstract description 41
- 238000007789 sealing Methods 0.000 claims description 23
- 238000009826 distribution Methods 0.000 claims description 17
- 238000001179 sorption measurement Methods 0.000 claims description 12
- 238000004891 communication Methods 0.000 claims description 6
- 238000009423 ventilation Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 12
- 230000003139 buffering effect Effects 0.000 abstract description 3
- 230000006378 damage Effects 0.000 abstract description 3
- 208000027418 Wounds and injury Diseases 0.000 abstract description 2
- 208000014674 injury Diseases 0.000 abstract description 2
- 239000007789 gas Substances 0.000 description 20
- 235000012431 wafers Nutrition 0.000 description 16
- 239000004065 semiconductor Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 239000000872 buffer Substances 0.000 description 2
- 239000007853 buffer solution Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 208000025962 Crush injury Diseases 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000002459 sustained effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The embodiment of the invention discloses equipment for operating a substrate, which comprises the following steps: an exhaust pipe (181) and a gripping disk device; a plurality of first air suction holes (38, 39) which are uniformly arranged along the circumferential direction are arranged at the bottom of the grabbing disc device, and the first air suction holes are communicated with the air suction pipe (181); the first plurality of air extraction holes (38, 39) are distributed in a specific area of the bottom of the gripping disk device, and when the substrate (40) is contacted with the bottom of the gripping disk device, the first plurality of air extraction holes are positioned at the outer edge of the substrate (40), and air between the substrate (40) and the bottom of the gripping disk device is extracted through the air extraction pipe (181) and the first plurality of air extraction holes so as to adsorb the substrate (40). When the equipment of the invention generates negative pressure, the required pumping quantity and pumping force are smaller, the negative pressure at the edge of the substrate is uniform, and the pressure injury and pollution of the substrate are avoided; double buffering is provided, so that the wafer is prevented from being crushed and polluted in the process of taking and placing the wafer, and the product yield is improved.
Description
Technical Field
The present invention relates to the field of semiconductor integrated manufacturing technology, and more particularly, to an apparatus for handling a substrate.
Background
In the field of semiconductor integrated circuit fabrication, it is common to employ epitaxial coating of semiconductor wafers in an epitaxial reactor through which deposition gases pass to deposit epitaxial material on the surfaces of the semiconductor wafers in order to produce epitaxially coated semiconductor wafers. In epitaxial reactors, wafer substrate transport is of great importance. The wafer is generally circular, having a front side and a back side, the front side of the wafer being the side of the wafer from which the integrated circuit structure is formed; in addition, a few millimeters of area at the edge of the wafer is not used to achieve integrated circuit fabrication. Therefore, it is important to protect the front surface of the wafer from damage during wafer transfer.
Currently, there are a variety of apparatuses for transferring substrates in existing epitaxial reactors, but all have disadvantages. For example, with an apparatus for handling a substrate in an epitaxial reactor, during a wafer taking process, an adsorption force formed at each suction hole acts on the front center of the substrate, and the adsorption force acting on the substrate center will deform the substrate too much, so that a crush injury is easily formed; in addition, when a piece is taken out of the process cavity, the substrate has a certain temperature and has certain adhesiveness with the grabbing device of the equipment, and the substrate can not be adsorbed very horizontally and can not be ensured to be adsorbed stably, so that the piece is taken out to fail or fall; for another apparatus for handling substrates in an epitaxial reactor, the arrangement of suction holes on the gripping means of the apparatus is not reasonable, and if a vacuum occurs between the gripping means and the substrate, a large flow suction is required, and the resulting large suction force tends to deform the substrate. Therefore, a new apparatus for transferring a substrate is required.
Disclosure of Invention
In view of the foregoing, embodiments of the present invention provide an apparatus for handling a substrate.
According to an aspect of an embodiment of the present invention, there is provided an apparatus for handling a substrate, including: the extraction tube and the grabbing disc device; one end of the exhaust pipe is connected with the grabbing disc device; the bottom of the grabbing disc device is provided with a plurality of first air pumping holes which are communicated with the air pumping pipes; the first air extraction holes are distributed in a specific area at the bottom of the grabbing disc device, so that the first air extraction holes are positioned at the outer edge of the substrate in a state that the substrate is contacted with the bottom of the grabbing disc device; and sucking air between the substrate and the bottom of the grabbing disc device through the sucking pipe and the first sucking holes to adsorb the substrate.
Optionally, the specific area is an annular area, and the plurality of first air extraction holes are uniformly arranged in the annular area along the circumferential direction; the maximum radius of the annular region is equal to the radius of the substrate; the ratio of the minimum radius of the annular region to the radius of the substrate is 7/10. Optionally, the gripping disk device includes: a gas homogenizing disc and a bearing disc; the air homogenizing disc is connected with the bearing disc; the first air extraction holes are arranged at the bottom of the bearing disc; one end of the exhaust pipe is connected with the air homogenizing disc, the air homogenizing disc is provided with an air duct, and the plurality of first exhaust holes are communicated with the exhaust pipe through the air duct.
Optionally, the method further comprises: a first annular elastic element and a second annular elastic element; the first annular elastic element and the second annular elastic element are positioned between the gas homogenizing disc and the bearing disc; the first annular elastic element and the second annular elastic element enclose an annular sealing cavity area between the gas homogenizing disc and the bearing disc, and the communication positions of the air duct and the plurality of first air suction holes and the air duct are positioned in the annular sealing cavity area for communication.
Optionally, the plurality of first bleed holes includes: the at least two groups of first air pumping holes are arranged in concentric circles, and each group of first air pumping holes are uniformly distributed along the circumferential direction; wherein the at least two groups of first air pumping holes are all positioned in the annular sealing cavity area.
Optionally, the plurality of first bleed holes includes: two groups of first air pumping holes; the first set of first bleed holes is proximate to an outer edge of the carrier platter relative to the second set of first bleed holes; the bottom of the bearing plate is provided with an adsorption groove, and the first set of first air pumping holes and the second set of first air pumping holes are communicated with the adsorption groove.
Optionally, the gas homogenizing disc comprises: a disc device; a second air pumping hole communicated with the annular sealing cavity area is arranged on the disc device; wherein, annular sealed cavity region is linked together with the breather pipe through the second gas vent.
Optionally, the ventilation duct comprises: a plurality of extraction branch pipes; the plurality of air extraction branch pipes are arranged on the disc device; one end of each of the plurality of air extraction branch pipes is communicated with one end of the air extraction pipe, and each air extraction branch pipe is radially distributed by taking the joint of the air extraction branch pipe and the air extraction pipe as the center; the other ends of the plurality of air extraction branch pipes are communicated with the annular sealing cavity area through the second air extraction holes.
Optionally, a third annular elastic element and a fourth annular elastic element are arranged between the air homogenizing disc and the exhaust pipe; the third annular elastic element and the fourth annular elastic element are coaxially arranged, the third annular elastic element is used for sealing the connection parts of the plurality of air exhaust branch pipes and the air exhaust pipe, and the fourth annular elastic element is positioned on the periphery of the third annular elastic element and is respectively contacted with the air homogenizing disc and the air exhaust pipe.
Optionally, the disc device comprises: the central disc and the annular disc are concentrically arranged, and two ends of the plurality of air extraction branch pipes are respectively connected with the central disc (151) and the annular disc for fixation; the central disc is connected with one end of the exhaust pipe in a sealing way; wherein the second air extraction holes are arranged on the annular disc.
Optionally, the plurality of second air pumping holes are arranged in a ring shape and uniformly distributed along the circumferential direction, wherein the second air pumping holes are correspondingly arranged with the air pumping branch pipes.
According to the equipment for operating the substrate, the air suction holes are uniformly distributed at the edge of the substrate, so that the required air suction quantity and the required air suction force are smaller when negative pressure is generated between the substrate and the equipment, the negative pressure at the edge of the substrate is uniform, the acting force applied to the substrate can be reduced, and the substrate is prevented from being crushed and polluted; the buffer system formed by the stepped double-ring-shaped sealing element can ensure that the equipment can provide double buffering in the process of contacting the lining, avoid the wafer from being crushed and polluted in the process of taking and placing the wafer, and improve the product yield.
Additional aspects and advantages of embodiments of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
Drawings
For a clearer description of embodiments of the invention or of solutions in the prior art, the following description of the drawings which are required to be used in the embodiments or in the prior art will be given in brief, it being obvious that the drawings in the following description are only some embodiments of the invention, and that, without inventive faculty, other drawings can be obtained from them to those skilled in the art:
FIG. 1 is a schematic perspective view of one embodiment of an apparatus for handling substrates according to the present invention;
FIG. 2 is a schematic diagram of an exploded structure of one embodiment of an apparatus for handling substrates according to the present invention;
fig. 3 is a schematic structural cross-sectional view of one embodiment of an apparatus for handling substrates according to the present invention.
Detailed Description
The present invention will now be described more fully hereinafter with reference to the accompanying drawings, in which exemplary embodiments of the invention are shown. The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention. The technical scheme of the present invention is described in various aspects below with reference to the drawings and the embodiments.
Hereinafter, for convenience of description, the terms "left", "right", "upper", "lower" and "upper" are used in accordance with the left, right, upper and lower directions of the drawings themselves.
The following "first", "second", etc. are used merely to describe differences and are not otherwise specifically meant.
As shown in fig. 1 to 3, the present invention provides an apparatus 200 for handling a substrate, comprising: a suction pipe 181 and a gripping disk device. The gripping disk device may be implemented in a variety of specific configurations, with the air extraction tube 181 having a hollow cavity 35. One end of the air extraction pipe 181 is connected with the grabbing disc device, a plurality of first air extraction holes which are uniformly arranged along the circumferential direction are formed in the bottom of the grabbing disc device, and the plurality of first air extraction holes are communicated with the air extraction pipe 181. The plurality of first air extraction holes 38, 39 are distributed in a specific area at the bottom of the grabbing disc device, and the number and specific arrangement of the first air extraction holes can be set according to design requirements.
The substrate 40 may be a variety of semiconductor wafer substrates. In a state that the substrate 40 is in contact with the bottom of the chucking plate device, the plurality of first suction holes are located at the outer edge of the substrate 40, and air between the substrate 40 and the bottom of the chucking plate device is sucked through the suction pipe 181 and the plurality of first suction holes to suck the substrate 40 so that the suction force is dispersed at the outer edge of the substrate 40, and the deformation of the substrate 40 can be reduced. Wherein the outer edge of the substrate may be considered as a general understanding of the middle and edge of the substrate by a person skilled in the art, for example, an annular area having a radius of 70% -100% of the radius of the substrate is considered as the outer edge of the substrate, in which case the specific area is an annular area in which the plurality of first air extraction holes 38, 39 are uniformly arranged in the circumferential direction. The maximum radius of the annular region is equal to the radius of the substrate 40; the ratio of the smallest radius of the annular region to the radius of the substrate 40 is 7/10.
In one embodiment, the gripping disk device includes: a distribution tray 182 and a carrier tray 183. The gas distribution plate 182 is connected with the bearing plate 183 in various connection modes. A plurality of first pumping holes are provided at the bottom of the carrier tray 183. One end of the air extraction pipe 181 is connected with the air homogenizing disc 182, and various connection modes can be adopted, for example, the air extraction pipe 181 is connected and fixed with the air homogenizing disc 182 through a connecting screw 101. The air homogenizing disc 182 is provided with an air duct, which may have various structures and compositions, and the plurality of first air suction holes are communicated with the air suction pipe 181 through the air duct.
The first annular elastic member 221 and the second annular elastic member 222 are located between the distribution plate 182 and the carrier plate 183. The first annular elastic element 221 and the second annular elastic element 222 enclose an annular sealed cavity area between the gas distribution plate 182 and the carrier plate 183, and the communication points of the plurality of first gas pumping holes and the gas pipe are located in the annular sealed cavity area. For example, the gas distribution plate 182 may be fixedly coupled to the carrier plate 183 by coupling screws 111, and the first annular spring element 221 and the second annular spring element 222 may be disposed between the gas distribution plate 182 and the carrier plate 183 to provide a sealed cavity.
By means of the first annular elastic element 221 and the second annular elastic element 222, a "stepped" distribution can be formed, the elastic damping system formed by the two annular elastic elements simultaneously achieving the effect of providing a seal. The first annular elastic element 221 and the second annular elastic element 222 can be O-shaped rubber rings for sealing, and the O-shaped rubber rings can work for a long time at 350-400 ℃. The elastic buffer formed by the step-shaped distribution and the annular sealing cavity area can also be realized by adopting high-elasticity polymer adhesive for bonding, sealing butterfly springs and the like.
The plurality of first air pumping holes may be at least two groups of first air pumping holes 38, 39 arranged in a circular shape, the at least two groups of first air pumping holes 38, 39 are arranged in concentric circles and are uniformly distributed along the circumferential direction, the at least two groups of first air pumping holes are all located in the annular sealing cavity area, and the openings of the first air pumping holes 38, 39 at the top of the bearing disc 183 are all located in the annular sealing cavity area. For example, the plurality of first air pumping holes include two groups of first air pumping holes, the first group of first air pumping holes 38 is close to the outer edge of the bearing plate 183 relative to the second group of first air pumping holes 39, the bottom of the bearing plate 183 is provided with an adsorption groove 41, the second group of first air pumping holes 39 are located in the adsorption groove 41, and the first group of first air pumping holes 38 and the second group of first air pumping holes 39 are communicated with the adsorption groove 41, so that air in the adsorption groove 41 can be pumped out.
The gas distribution plate 182 includes a disk assembly that can take a variety of configurations. For example, the disc device includes a central disc 151 and an annular disc 171, the central disc 151 and the annular disc 171 are concentrically disposed, and the central disc 151 and the annular disc 171 are fixedly connected, and the central disc 151 is hermetically connected with one end of the air suction pipe 181. A second air vent 37 is provided in the disc means in communication with the annular sealed cavity region, which second air vent 37 may be provided in the annular disc 171, the annular sealed cavity region being in communication with the air vent duct via the second air vent 37.
The vent tube may have a variety of configurations. For example, the ventilation duct includes a plurality of suction branches 161, and the plurality of suction branches 161 are provided on the disk device. One end of each of the plurality of air extraction branch pipes 161 is communicated with one end of the air extraction pipe 181, and each of the air extraction branch pipes 161 is radially distributed with a joint with the air extraction pipe 181 as a center. The other ends of the plurality of suction manifold 161 communicate with the annular seal cavity region through the second suction holes 37. The plurality of second suction holes 37 are arranged in a circular ring shape and uniformly distributed in the circumferential direction, and the second suction holes 37 are provided corresponding to the suction manifold 161. The center disk 151 and the annular disk 171 are fixed to each other by a plurality of suction branches 161, and both ends of the plurality of suction branches 161 are connected to the center disk 151 and the annular disk 171, respectively. The method can adopt a mode of uniformly radiating and homogenizing the air from the center to the periphery, or adopts a mode of homogenizing the air from one point at the edge to the center, homogenizing the air from one point at the edge to the periphery at the edge, and the like. For example, the gas distribution plate 182 may be a single body formed by combining the central plate 151, the plurality of radial suction pipes 161, and the annular plate 171 by welding or bonding.
The suction manifold 161 has a hollow channel 36, and the annular disk 171 is provided with a plurality of second suction holes 37 corresponding to the suction manifold 161. A third annular elastic element 121 and a fourth annular elastic element 122 are arranged between the air homogenizing disc 182 and the air exhaust pipe 181; the third annular elastic element 121 and the fourth annular elastic element 122 are coaxially disposed, the third annular elastic element 121 is configured to seal a connection portion between the plurality of air extraction branch pipes 161 and the air extraction pipe 181, and the fourth annular elastic element 122 is located at the periphery of the third annular elastic element 12) and is respectively in contact with the air distribution disc 182 and the air extraction pipe 181. The fourth annular elastic element 122 and the third annular elastic element 121 function as a cushion and seal.
A method of performing a substrate operation using the apparatus for operating a substrate in the above embodiment, comprising:
in step one, the apparatus 200 for operating the substrate is horizontally moved until the carrier tray 183 is located directly above the substrate 40.
Step two, the apparatus 200 is lowered until the carrier platter 183 touches at least one point of the upper edge of the substrate 40.
Step three, the apparatus 200 continues to be slowly lowered such that the gas distribution plate 182 is rotated relative to the horizontal axis but not relative to its vertical axis of symmetry until the bottom surface of the carrier plate 183 touches the entire upper edge of the substrate 40. The first and second annular elastic members 221, 222 provide elastic cushioning during sustained pressure applied by the carrier platter 183 to the substrate 40.
During continued slow lowering of the apparatus 200, the carrier plate 183 will exert a continuous pressure on the substrate 40 due to the self-weight of the apparatus 200, at which time the third annular sealing elements 221, 222 between the gas distribution plate 182 and the carrier plate 183 provide an elastic buffer, counteracting a portion of the pressure, while the annular sealing elements 121, 122 between the gas extraction tube 181 and the gas distribution plate 182 will cause a rotational movement of the gas distribution plate 182 and the carrier plate 183 connected together via any horizontal axis relative to the apparatus 200 but not relative to the vertical symmetry axis of the apparatus 200, such that the lower face of the carrier plate 183 touches the entire upper edge of the substrate 40.
Step four, the gas in the adsorption groove 41 between the substrate 40 and the bearing plate 183 is pumped away by the pumping system through the pumping pipe 181, the pumping branch pipe 161, the second pumping hole 37 and the first pumping holes 38 and 39, so as to form vacuum negative pressure for adsorbing the substrate 40.
By means of the suction system of the apparatus 200, air is sucked out of the adsorption groove 41 between the substrate 40 and the carrier plate 183 through the channels 35 and 36, and is sucked out through the second suction holes 37 and the first suction holes 38 and 39, so that vacuum negative pressure is formed, the negative pressure will press the substrate 40 to be adsorbed on the carrier plate 183, the required flow for sucking is smaller because the diameter enclosed by the first suction holes 38 and 39 is smaller than the diameter of the carrier plate 183, the edge stress of the substrate 40 is smaller, and meanwhile, the edge stress of the substrate 40 is even because of the even distribution of the second suction holes 37 and the first suction holes 38 and 39.
Step five, horizontal movement is performed after lifting the apparatus 200 with the substrate 40.
According to the equipment for operating the substrate, provided by the embodiment, the air suction holes are uniformly distributed at the edge of the substrate, so that the required air suction quantity and the required air suction force are smaller when negative pressure is generated between the substrate and the equipment, the negative pressure at the edge of the substrate is uniform, the acting force of the substrate can be reduced, and the pressure injury and pollution of the substrate are avoided; the buffer system formed by the stepped double-ring-shaped sealing element can ensure that the equipment can provide double buffering in the process of contacting the lining, avoid the wafer from being crushed and polluted in the process of taking and placing the wafer, and improve the product yield.
Any of the above-described embodiments of the present invention disclosed herein, unless otherwise stated, if they disclose a numerical range, then the disclosed numerical range is the preferred numerical range, as will be appreciated by those of skill in the art: the preferred numerical ranges are merely those of the many possible numerical values where technical effects are more pronounced or representative. Since the numerical values are more and cannot be exhausted, only a part of the numerical values are disclosed to illustrate the technical scheme of the invention, and the numerical values listed above should not limit the protection scope of the invention.
Meanwhile, if the above invention discloses or relates to parts or structural members fixedly connected with each other, the fixed connection may be understood as follows unless otherwise stated: detachably fixed connection (e.g. using bolts or screws) can also be understood as: the non-detachable fixed connection (e.g. riveting, welding), of course, the mutual fixed connection may also be replaced by an integral structure (e.g. integrally formed using a casting process) (except for obviously being unable to use an integral forming process).
In addition, terms used in any of the above-described aspects of the present disclosure to express positional relationship or shape have meanings including a state or shape similar to, similar to or approaching thereto unless otherwise stated. Any part provided by the invention can be assembled by a plurality of independent components, or can be manufactured by an integral forming process.
The above embodiments are only for illustrating the technical solution of the present invention and not for limiting the same; while the invention has been described in detail with reference to the preferred embodiments, those skilled in the art will appreciate that: modifications may be made to the specific embodiments of the present invention or equivalents may be substituted for part of the technical features thereof; without departing from the spirit of the invention, it is intended to cover the scope of the invention as claimed.
The description of the present invention has been presented for purposes of illustration and description, and is not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, and to enable others of ordinary skill in the art to understand the invention for various embodiments with various modifications as are suited to the particular use contemplated.
Claims (9)
1. An apparatus for handling a substrate, comprising: an exhaust pipe (181) and a gripping disk device;
one end of the air extraction pipe (181) is connected with the grabbing disc device; a plurality of first air pumping holes are formed in the bottom of the grabbing disc device and are communicated with the air pumping pipe (181); the first air extraction holes are distributed in a specific area at the bottom of the grabbing disc device, so that the first air extraction holes are positioned at the outer edge of the substrate (40) in a state that the substrate (40) is contacted with the bottom of the grabbing disc device, wherein the specific area is an annular area; -sucking air between the substrate (40) and the bottom of the gripping disk means through the suction pipe (181) and the plurality of first suction holes for sucking the substrate (40);
the gripping disk device includes: a gas distribution disc (182), a carrier disc (183), a first annular elastic element (221) and a second annular elastic element (222);
the first annular elastic element (221) and the second annular elastic element (222) are located between the air homogenizing disc (182) and the bearing disc (183), the air homogenizing disc (182) is connected with the bearing disc (183), the first annular elastic element (221) and the second annular elastic element (222) are enclosed between the air homogenizing disc (182) and the bearing disc (183) to form an annular sealing cavity area, the air homogenizing disc (182) is provided with an air duct, a plurality of first air suction holes are formed in the bottom of the bearing disc (183), the air suction pipe (181) is communicated with the air duct, and the air duct and the plurality of first air suction holes are all communicated with the annular sealing cavity area.
2. The apparatus of claim 1, wherein the plurality of first bleed holes are uniformly circumferentially disposed within the annular region; -the maximum radius of the annular region is equal to the radius of the substrate (40); the ratio of the smallest radius of the annular region to the radius of the substrate (40) is 7/10.
3. The apparatus of claim 1, wherein,
the plurality of first bleed holes includes: the at least two groups of first air pumping holes are arranged in concentric circles, and each group of first air pumping holes are uniformly distributed along the circumferential direction; wherein the openings of the at least two groups of first air extraction holes at the top of the bearing disc (183) are all located in the annular sealing cavity area.
4. The apparatus of claim 3, wherein the device comprises a plurality of sensors,
the plurality of first bleed holes includes: two groups of first air pumping holes; the first set of first bleed holes being proximate to an outer edge of the carrier plate (183) relative to the second set of first bleed holes; the bottom of the bearing plate (183) is provided with an adsorption groove (41), and the first set of first air pumping holes and the second set of first air pumping holes are communicated with the adsorption groove (41).
5. The apparatus of claim 1, wherein,
the gas homogenizing disc comprises: a disc device; a second air pumping hole (37) communicated with the annular sealing cavity area is arranged on the disc device; wherein the annular sealed cavity region is in communication with the vent conduit through the second vent hole (37).
6. The apparatus of claim 5, wherein,
the ventilation duct includes: a plurality of suction branch pipes (161); the plurality of air extraction branch pipes (161) are arranged on the disc device; one end of each of the plurality of air extraction branch pipes (161) is communicated with one end of the air extraction pipe (181), and each air extraction branch pipe (161) is radially distributed with the joint of the air extraction pipe (181) as the center; the other ends of the plurality of air extraction branch pipes (161) are communicated with the annular sealing cavity area through the second air extraction holes (37).
7. The apparatus as claimed in claim 6, comprising:
a third annular elastic element (121) and a fourth annular elastic element (122) are arranged between the air homogenizing disc (182) and the air exhaust pipe (181);
the third annular elastic element (121) and the fourth annular elastic element (122) are coaxially arranged, the third annular elastic element (121) is used for sealing the connection part of the plurality of air exhaust branch pipes (161) and the air exhaust pipe (181), and the fourth annular elastic element (122) is positioned at the periphery of the third annular elastic element (121) and is respectively contacted with the air homogenizing disc (182) and the air exhaust pipe (181).
8. The apparatus of claim 6, wherein,
the disc device includes: a center disc (151) and an annular disc (171), wherein the center disc (151) and the annular disc (171) are concentrically arranged, and two ends of a plurality of air extraction branch pipes (161) are respectively connected with the center disc (151) and the annular disc (171); the central disc (151) is connected with one end of the exhaust pipe (181) in a sealing way; wherein the second air suction holes (37) are arranged on the annular disc (171).
9. The apparatus of claim 8, wherein,
the second air suction holes (37) are arranged in a circular shape and uniformly distributed along the circumferential direction, wherein the second air suction holes (37) are arranged corresponding to the air suction branch pipes (161).
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810867124.8A CN108933099B (en) | 2018-08-01 | 2018-08-01 | Apparatus for handling substrates |
| TW107146145A TWI708872B (en) | 2018-08-01 | 2018-12-20 | Equipment for handling substrates |
| JP2020572714A JP7134267B2 (en) | 2018-08-01 | 2019-07-22 | Equipment for manipulating substrates |
| PCT/CN2019/097130 WO2020024837A1 (en) | 2018-08-01 | 2019-07-22 | Device for operating substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810867124.8A CN108933099B (en) | 2018-08-01 | 2018-08-01 | Apparatus for handling substrates |
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| CN108933099A CN108933099A (en) | 2018-12-04 |
| CN108933099B true CN108933099B (en) | 2024-01-05 |
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| JP7134267B2 (en) * | 2018-08-01 | 2022-09-09 | 北京北方華創微電子装備有限公司 | Equipment for manipulating substrates |
| CN115627533B (en) * | 2022-11-01 | 2023-11-14 | 江苏汉印机电科技股份有限公司 | Silicon carbide epitaxial wafer high temperature gets piece equipment |
Citations (5)
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|---|---|---|---|---|
| KR20020038325A (en) * | 2000-11-17 | 2002-05-23 | 고석태 | Substrate fixing chuck and Substrate treating apparatus mounting the same |
| JP2003324143A (en) * | 2002-04-26 | 2003-11-14 | Topcon Corp | Wafer holding device |
| CN204675259U (en) * | 2015-06-04 | 2015-09-30 | 回音必集团抚州制药有限公司 | Bottle finished product grass-hopper easy to break |
| CN106298618A (en) * | 2015-06-26 | 2017-01-04 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Wafer transmission set |
| CN106471614A (en) * | 2014-07-03 | 2017-03-01 | Lpe公司 | For manipulating instrument, method of operating and the epitaxial reactor of substrate |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5423558A (en) * | 1994-03-24 | 1995-06-13 | Ipec/Westech Systems, Inc. | Semiconductor wafer carrier and method |
| JP4108941B2 (en) * | 2000-10-31 | 2008-06-25 | 株式会社荏原製作所 | Substrate gripping apparatus, processing apparatus, and gripping method |
| JP2008147591A (en) * | 2006-12-13 | 2008-06-26 | Nec Electronics Corp | Apparatus and method for manufacturing semiconductor |
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2018
- 2018-08-01 CN CN201810867124.8A patent/CN108933099B/en active Active
- 2018-12-20 TW TW107146145A patent/TWI708872B/en active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020038325A (en) * | 2000-11-17 | 2002-05-23 | 고석태 | Substrate fixing chuck and Substrate treating apparatus mounting the same |
| JP2003324143A (en) * | 2002-04-26 | 2003-11-14 | Topcon Corp | Wafer holding device |
| CN106471614A (en) * | 2014-07-03 | 2017-03-01 | Lpe公司 | For manipulating instrument, method of operating and the epitaxial reactor of substrate |
| CN204675259U (en) * | 2015-06-04 | 2015-09-30 | 回音必集团抚州制药有限公司 | Bottle finished product grass-hopper easy to break |
| CN106298618A (en) * | 2015-06-26 | 2017-01-04 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Wafer transmission set |
Also Published As
| Publication number | Publication date |
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| TW202007798A (en) | 2020-02-16 |
| TWI708872B (en) | 2020-11-01 |
| CN108933099A (en) | 2018-12-04 |
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