TWI708872B - Equipment for handling substrates - Google Patents

Abstract

An apparatus for operating a substrate of the present invention includes: a suction pipe and a disk grabbing device; a plurality of first suction holes uniformly arranged in the circumferential direction are arranged at the bottom of the grabbing disk device, and the plurality of first suction holes are The suction pipe is connected; a plurality of first suction holes are distributed in a specific area at the bottom of the grabbing disk device. When the substrate is in contact with the bottom of the grabbing disk device, the plurality of first suction holes are located at the outer edge of the substrate through the suction pipe and The plurality of first suction holes suck out the air between the substrate and the bottom of the gripping disk device to adsorb the substrate. When generating negative pressure, the present invention requires less suction and suction, uniform negative pressure at the edge of the substrate, avoiding crushing and contamination of the substrate; providing double buffering to avoid crushing the wafer during the picking and placing process And pollution, improve product yield.

Description

Equipment for handling substrates

The present invention relates to the field of semiconductor integrated manufacturing technology, and in particular to a device for operating a substrate.

In the field of semiconductor integrated circuit manufacturing, in order to produce epitaxially coated semiconductor wafers, the semiconductor wafer in the epitaxial reactor is usually used for epitaxial coating. The deposition gas passes through the epitaxial reactor and can be on the surface of the semiconductor wafer. Deposit epitaxial material on it. In epitaxial reactors, wafer substrate transfer is a very important content. The wafer is generally circular, with a front surface and a back surface. The front surface of the wafer forms the surface of the wafer to realize the integrated circuit structure; in addition, the area of a few millimeters at the edge of the wafer is not used to realize the integrated circuit manufacturing. Therefore, it is very important to protect the front surface of the wafer from damage during wafer transfer.

At present, there are many kinds of equipment for transferring substrates in existing epitaxial reactors, but all of them have shortcomings. For example, for an equipment used to manipulate the substrate in an epitaxial reactor, during the process of taking the film, the adsorption force formed at each suction hole acts on the front center of the substrate, and the adsorption force acting on the center of the substrate will make the substrate The bottom deformation is too large, which is easy to form a crush; in addition, when the substrate is taken from the process chamber, the substrate still has a certain temperature, and there is a certain adhesion between the gripping device of the equipment, and the substrate may not be completely Accurate adsorption cannot guarantee smooth adsorption, resulting in failure or falling of the chip; for the equipment used to manipulate the substrate in another epitaxial reactor, the arrangement of the suction holes on the grasping device of the equipment is unreasonable. When a vacuum occurs between the gripping device and the substrate, a large flow of suction is required, and the large adsorption force generated tends to deform the substrate. Therefore, a new equipment for transferring substrates is needed.

In view of this, an embodiment of the present invention provides an apparatus for handling a substrate.

According to an aspect of the embodiment of the present invention, there is provided an apparatus for operating a substrate, including: an air suction pipe and a grabbing disk device; one end of the suction pipe is connected to the grabbing disk device; The bottom of the device is provided with a plurality of first exhaust holes, the plurality of first exhaust holes communicate with the exhaust pipe; the plurality of first exhaust holes are distributed in a specific area at the bottom of the grabbing disk device, so that When the substrate is in contact with the bottom of the disk grabbing device, the plurality of first suction holes are located at the outer edge of the substrate; and the plurality of first suction holes are drawn through the suction pipe and the plurality of first suction holes. The air between the substrate and the bottom of the disk grabbing device is used to adsorb the substrate.

Preferably, the specific area is an annular area, and the plurality of first exhaust holes are uniformly arranged in the circumferential direction in the annular area; the maximum radius of the annular area is equal to the radius of the substrate; The ratio of the minimum radius of the annular area to the radius of the substrate is 7/10. Preferably, the disk grabbing device includes: an air evening disk and a supporting disk; the air evening disk is connected to the supporting disk; the plurality of first suction holes are provided at the bottom of the supporting disk; One end of the air suction pipe is connected with the air leveling plate, the air leveling plate is provided with a vent pipe, and the plurality of first suction holes are communicated with the suction pipe through the vent pipe.

Preferably, it further includes: a first ring-shaped elastic element and a second ring-shaped elastic element; the first and second ring-shaped elastic elements are located between the gas distribution plate and the carrier plate; The first ring-shaped elastic element and the second ring-shaped elastic element enclose a ring-shaped sealed cavity area between the air squeeze plate and the carrying plate, the air duct and the plurality of first air extraction holes The communication points with the vent pipe are located in the area of the annular sealed cavity.

Preferably, the plurality of first air extraction holes include: at least two sets of first air extraction holes, the at least two sets of first air extraction holes are arranged in concentric circles and each group of first air extraction holes are evenly distributed along the circumferential direction; wherein , The at least two groups of first air extraction holes are all located in the annular sealed cavity area.

Preferably, the plurality of first exhaust holes includes: two sets of first exhaust holes; the first set of first exhaust holes are closer to the outer edge of the carrier plate than the second set of first exhaust holes; the carrier plate An adsorption tank is provided at the bottom of the, and both the first group of first suction holes and the second group of first suction holes are in communication with the adsorption tank.

Preferably, the air leveling disc includes: a disc device; a second suction hole communicating with the annular sealed cavity area is provided on the disc device; wherein the annular sealed cavity area passes The second suction hole is communicated with the ventilation pipe.

Preferably, the ventilation pipe includes: a plurality of suction branches; the plurality of suction branches are arranged on the disc device; one end of the plurality of suction branches is connected with one end of the suction pipe Each air extraction branch pipe is radially distributed around the connection point with the air extraction tube; the other end of the plurality of air extraction branch pipes communicates with the annular sealed cavity area through the second air extraction hole.

Preferably, a third ring-shaped elastic element and a fourth ring-shaped elastic element are provided between the air leveling plate and the suction pipe; wherein, the third ring-shaped elastic element and the fourth ring-shaped elastic element are coaxially arranged , The third annular elastic element is used to seal the connection between the plurality of exhaust branch pipes and the exhaust pipe, and the fourth annular elastic element is located on the periphery of the third annular elastic element and is respectively connected with The air leveling plate is in contact with the suction pipe.

Preferably, the disc device includes: a central disc and an annular disc, the central disc and the annular disc are arranged concentrically, and the two ends of a plurality of exhaust manifolds are respectively connected to the central disc (151) It is fixed to the annular disc; the central disc is in hermetically connected with one end of the suction pipe; wherein, the second suction hole is provided on the annular disc.

Preferably, a plurality of the second suction holes are arranged in a circular ring shape and evenly distributed along the circumferential direction, wherein the second suction holes are arranged corresponding to the suction branch pipes.

The device of the present invention is used for operating the substrate. The suction holes are evenly dispersed on the edge of the substrate. When a negative pressure is generated between the substrate and the device, the required suction volume and suction force are smaller, and the negative pressure at the edge of the substrate is uniform , It can reduce the force on the substrate to avoid crushing and pollution of the substrate; the buffer system composed of "stepped" double ring sealing elements can provide double buffering when the equipment is in contact with the lining, and avoid The chip is crushed and contaminated in the process of picking and placing, which improves the product yield.

The additional aspects and advantages of the embodiments of the present invention will be partially given in the following description, which will become obvious from the following description, or be understood through the practice of the present invention.

The present invention will be described more fully below with reference to the accompanying drawings, in which exemplary embodiments of the present invention are illustrated. The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention. The technical solutions of the present invention will be described in various aspects below in conjunction with the figures and embodiments.

For the convenience of description hereinafter, the "left", "right", "up" and "down" referred to below are consistent with the left, right, up, and down directions of the drawings themselves.

The following "first", "second", etc., are only used to describe the difference, and have no other special meanings.

As shown in the first to third figures, the present invention provides an apparatus 200 for handling substrates, including: an air suction pipe 181 and a disk grab device. The disk grabbing device can be implemented in a variety of specific structures, and the suction pipe 181 has a hollow cavity 35. One end of the suction pipe 181 is connected to the grabbing disk device, and a plurality of first suction holes evenly arranged in the circumferential direction are provided on the bottom of the grabbing disk device, and the plurality of first suction holes are connected with the suction pipe 181. A plurality of first suction holes 38, 39 are distributed in a specific area at the bottom of the grabbing disk device, and the number and specific arrangement of the first suction holes can be set according to design requirements.

The substrate 40 may be a variety of semiconductor wafer substrates. In the state where the substrate 40 is in contact with the bottom of the disk grab device, a plurality of first suction holes are located at the outer edge of the substrate 40, and are drawn out between the substrate 40 and the grab disk through the suction pipe 181 and the plurality of first suction holes. The air between the bottom of the device is used to adsorb the substrate 40 so that the adsorption force is dispersed on the outer edge of the substrate 40, which can reduce the deformation of the substrate 40. Wherein, the outer edge of the substrate can be determined according to the ordinary understanding of the middle and edge of the substrate by those skilled in the art. For example, an annular area with a radius of 70%-100% of the radius of the substrate is regarded as the outer edge of the substrate. In this case, the specific area is an annular area, and a plurality of first exhaust holes 38, 39 are uniformly arranged in the circumferential direction in the annular area. The maximum radius of the annular region is equal to the radius of the substrate 40; the ratio of the minimum radius of the annular region to the radius of the substrate 40 is 7/10.

In one embodiment, the disk grabbing device includes: an air evening disk 182 and a supporting disk 183. The air evening plate 182 is connected to the carrying plate 183, and multiple connection methods can be adopted. A plurality of first suction holes are provided at the bottom of the carrier tray 183. One end of the air suction pipe 181 is connected to the air leveling plate 182, and various connection methods can be adopted. For example, the air suction pipe 181 is connected and fixed to the air leveling plate 182 by a connecting screw 101. The air leveling plate 182 is provided with a vent pipe. The vent pipe can have various structures and compositions. A plurality of first air extraction holes are connected to the air extraction pipe 181 through the air pipe.

The first ring-shaped elastic element 221 and the second ring-shaped elastic element 222 are located between the air scoring disc 182 and the supporting disc 183. The first ring-shaped elastic element 221 and the second ring-shaped elastic element 222 enclose a ring-shaped sealed cavity area between the air evening plate 182 and the carrying plate 183, and the connection between the plurality of first air extraction holes and the ventilation pipe is located in the ring-shaped sealed cavity within the area. For example, the air evening plate 182 can be connected and fixed with the supporting plate 183 by a connecting screw 111, and the first ring-shaped elastic element 221 and the second ring-shaped elastic element 222 are arranged between the air leveling plate 182 and the supporting plate 183 to provide a sealed cavity .

The first annular elastic element 221 and the second annular elastic element 222 can form a "step-like" distribution. The elastic buffer system formed by the two annular elastic elements simultaneously achieves the function of providing sealing. The first annular elastic element 221 and the second annular elastic element 222 may be O-shaped rubber rings for sealing, and the O-shaped rubber rings can work for a long time between 350°C and 400°C. Adopting high-elastic polymer glue bonding, sealing butterfly springs, etc. can also achieve "step-like" distribution and elastic cushioning formed by the annular sealed cavity area.

The plurality of first suction holes may be at least two groups of first suction holes 38, 39 arranged in a circle, at least two groups of first suction holes 38, 39 are arranged in concentric circles, and each group of first suction holes are uniform along the circumferential direction Distribution, at least two sets of first air extraction holes are located in the annular sealed cavity area, and the openings of the first air extraction holes 38, 39 at the top of the carrier plate 183 are all located in the annular sealed cavity area. For example, the plurality of first exhaust holes includes two sets of first exhaust holes. The first set of first exhaust holes 38 are closer to the outer edge of the carrier plate 183 than the second set of first exhaust holes 39, and the bottom of the carrier plate 183 is provided with suction Tank 41, the second group of first air extraction holes 39 are located in the adsorption tank 41, the first group of first air extraction holes 38 and the second group of first air extraction holes 39 are both connected to the adsorption tank 41, so that the air in the adsorption tank 41 can be removed Pull out.

The aeration disc 182 includes a disc device, and the disc device can adopt various structures. For example, the disc device includes a central disc 151 and an annular disc 171, the central disc 151 and the annular disc 171 are arranged concentrically, and the central disc 151 and the annular disc 171 are fixedly connected, and the central disc 151 is hermetically connected with one end of the exhaust pipe 181 . The disc device is provided with a second exhaust hole 37 communicating with the annular sealed cavity area. The second exhaust hole 37 may be provided on the annular disc 171, and the annular sealed cavity area is connected to the vent pipe through the second exhaust hole 37 through.

The ventilation duct can have various structures. For example, the ventilation duct includes a plurality of exhaust branch pipes 161, and the plurality of exhaust branch pipes 161 are arranged on the disc device. One end of the plurality of suction branch pipes 161 is all connected to one end of the suction pipe 181, and each suction branch pipe 161 is radially distributed around the connection point with the suction pipe 181. The other ends of the plurality of suction branch pipes 161 communicate with the annular sealed cavity area through the second suction hole 37. The plurality of second suction holes 37 are arranged in a circular ring and are evenly distributed along the circumferential direction, and the second suction holes 37 are arranged corresponding to the suction branch pipe 161. The central disc 151 and the annular disc 171 are fixed to each other by a plurality of exhaust branch pipes 161, and the two ends of the plurality of exhaust branch pipes 161 are respectively connected to the central disc 151 and the annular disc 171. The method can be used to radiate the air evenly from the center to the surroundings, or to even the air from a point on the edge to the center, or from a point on the edge to the surrounding edges. For example, the aeration disk 182 may be a whole composed of a central disk 151, a plurality of radial exhaust branch pipes 161, and an annular disk 171 through welding or gluing.

The exhaust branch 161 has a hollow cavity 36, and the annular disk 171 is provided with a plurality of second exhaust holes 37 corresponding to the exhaust branch 161. A third ring-shaped elastic element 121 and a fourth ring-shaped elastic element 122 are arranged between the air squeegee 182 and the suction pipe 181; wherein the third ring-shaped elastic element 121 and the fourth ring-shaped elastic element 122 are coaxially arranged, and the third ring-shaped elastic element 121 is used to seal the connection between a plurality of air extraction branch pipes 161 and air extraction tube 181. The fourth annular elastic element 122 is located on the periphery of the third annular elastic element 121 and is in contact with the air distribution plate 182 and the air extraction tube 181 respectively. The fourth annular elastic element 122 and the third annular elastic element 121 function as buffers and seals.

The method for performing substrate operation using the device for operating the substrate in the above embodiment includes:

Step one: move the device 200 for handling the substrate horizontally until the carrier tray 183 is directly above the substrate 40.

Step two, lower the device 200 until the carrier tray 183 touches at least one point of the upper edge of the substrate 40.

Step three, continue to slowly lower the device 200 so that the air evening plate 182 does not rotate relative to the horizontal axis but relative to its vertical symmetry axis until the bottom surface of the carrier plate 183 touches the entire upper edge of the substrate 40. In the process that the carrier tray 183 applies continuous pressure to the substrate 40, the first annular elastic element 221 and the second annular elastic element 222 provide elastic buffering.

In the process of continuing to slowly lower the device 200, due to the weight of the device 200, the carrier plate 183 will exert continuous pressure on the substrate 40. At this time, the third annular sealing elements 221, 222 between the gas evening plate 182 and the carrier plate 183 Provide elastic cushioning to relieve a part of the pressure. At the same time, the annular sealing elements 121, 122 between the suction pipe 181 and the air distribution plate 182 will make the connected air distribution plate 182 and the carrier plate 183 pass any level relative to the equipment 200 Axis, but does not rotate relative to the vertical symmetry axis of the device 200, so that the lower surface of the carrier tray 183 touches the entire upper edge of the substrate 40.

Step four, through the suction system through the suction pipe 181, the suction branch pipe 161, the second suction hole 37, the first suction holes 38, 39 to suck the gas in the adsorption groove 41 between the substrate 40 and the carrier plate 183, A vacuum negative pressure is formed to suck the substrate 40.

With the aid of the suction system of the device 200 to extract air, the gas in the adsorption tank 41 between the substrate 40 and the carrier plate 183 passes through the cavity 35, the cavity 36, and then passes through the second air extraction hole 37, the first air extraction hole 38, 39 is evacuated to form a vacuum negative pressure, which will press the substrate 40 to "suck" on the carrier plate 183. Since the diameter of the first suction holes 38, 39 is smaller than the diameter of the carrier plate 183, it needs to be pumped The flow rate is small, and the edge of the substrate 40 is also less stressed. At the same time, due to the uniform distribution of the second air extraction holes 37 and the first air extraction holes 38, 39, the edge of the substrate 40 is uniformly stressed.

Step five, after lifting the device 200 with the substrate 40, move it horizontally.

The device for operating the substrate provided by the above embodiment disperses the suction holes evenly on the edge of the substrate. When the negative pressure between the substrate and the device is generated, the amount of suction and the suction force required are smaller, and the edge of the substrate The uniform negative pressure can reduce the force on the substrate and avoid crushing and pollution of the substrate; the buffer system composed of "stepped" double ring sealing elements can provide double buffering when the equipment is in contact with the lining , Avoid crushing and contaminating the chip during the picking and placing process, and improve the product yield.

Unless otherwise stated, if any of the above-mentioned technical solutions disclosed in the present invention discloses a numerical range, then the disclosed numerical range is a preferred numerical range. Any person skilled in the art should understand that the preferred numerical range is only Among the many feasible values, the technical effect is obvious or representative value. Since there are too many numerical values to be exhaustive, the present invention only discloses some numerical values to illustrate the technical solutions of the present invention, and the above-listed numerical values should not constitute a limitation on the protection scope of the present invention.

At the same time, if the above-mentioned present invention discloses or involves parts or structural parts that are fixedly connected to each other, unless otherwise stated, fixed connection can be understood as a fixed connection that can be detached (for example, connected by bolts or screws), or It is understood as: non-detachable fixed connection (such as riveting, welding). Of course, the mutual fixed connection can also be replaced by an integrated structure (for example, manufactured by a casting process) (except obviously that the integrated forming process cannot be used).

In addition, unless otherwise stated, the terms used in any of the technical solutions disclosed in the present invention to indicate a positional relationship or shape include a state or shape similar to, similar to, or close to it, unless otherwise stated. Any component provided by the present invention can be assembled from a plurality of individual components, or can be an individual component manufactured by an integral forming process.

The above embodiments are only used to illustrate the technical solutions of the present invention and not to limit them; although the present invention has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the specific embodiments of the present invention can still be carried out. Modification or equivalent replacement of some technical features; without departing from the spirit of the technical solution of the present invention, all of them shall be covered by the scope of the technical solution claimed by the present invention.

The description of the present invention is given for the sake of example and description, rather than being exhaustive or limiting the present invention to the disclosed form. Many modifications and changes are obvious to those of ordinary skill in the art. The embodiments are selected and described in order to better illustrate the principles and practical applications of the present invention, and to enable those of ordinary skill in the art to understand the present invention so as to design various embodiments with various modifications suitable for specific purposes.

35、36‧‧‧ Cavity 37‧‧‧Second air extraction hole 38,39‧‧‧First air extraction hole 40‧‧‧Substrate 41‧‧‧Adsorption tank 101, 111‧‧‧Screw 121‧‧‧ Three-ring-shaped elastic element 122‧‧‧Fourth-ring-shaped elastic element 151‧‧‧Central disc 161‧‧‧Exhaust branch pipe 171‧‧‧Annular disc 181‧‧‧Exhaust pipe 182‧‧‧Aeration disc 183‧‧‧ Carrier plate 200‧‧‧Equipment for handling substrates 221‧‧‧First annular elastic element 222‧‧‧Second annular elastic element

In order to explain the embodiments of the present invention or the technical solutions in the prior art more clearly, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are merely present For some of the embodiments of the invention, for those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative labor:

The first figure is a three-dimensional schematic diagram of an embodiment of an apparatus for operating a substrate according to the present invention.

The second figure is a schematic diagram of an exploded structure of an embodiment of the apparatus for handling a substrate according to the present invention.

The third figure is a schematic cross-sectional view of an embodiment of the apparatus for handling a substrate according to the present invention.

181‧‧‧Suction pipe

182‧‧‧Smoothing plate

183‧‧‧Carrier plate

200‧‧‧Equipment for handling substrates

Claims (10)

A device for operating a substrate, which is characterized in that it comprises: a suction pipe (181) and a grabbing disk device; one end of the suction pipe (181) is connected to the grabbing disk device; A plurality of first suction holes (38, 39) are provided on a bottom of the disk taking device, and the plurality of first suction holes are connected with the suction pipe (181); the plurality of first suction holes (38, 39) ) Are distributed in a specific area at the bottom of the disk grabbing device, so that when a substrate (40) is in contact with the bottom of the disk grabbing device, the plurality of first suction holes are located on the substrate (40) At the outer edge; the air between the substrate (40) and the bottom of the gripping disk device is drawn through the suction pipe (181) and the plurality of first suction holes for suction The substrate (40); wherein the disk gripping device includes: an air evening plate (182) and a supporting plate (183); the air evening plate (182) and the supporting plate (183) are connected; The plurality of first suction holes are arranged at a bottom of the carrier plate (183); one end of the suction pipe (181) is connected to the air evening plate (182), and the air evening plate (182) is arranged There is a ventilation pipe, and the plurality of first suction holes are communicated with the suction pipe (181) through the ventilation pipe. The device described in item 1 of the scope of patent application, wherein the specific area is an annular area, and the plurality of first exhaust holes (38, 39) are uniformly arranged in the circumferential direction in the annular area; The maximum radius of the region is equal to the radius of the substrate (40); the ratio of the minimum radius of the annular region to the radius of the substrate (40) is 7/10. A device for operating a substrate, which is characterized in that it comprises: a suction pipe (181) and a grabbing disk device; one end of the suction pipe (181) is connected to the grabbing disk device; A plurality of first suction holes (38, 39) are provided on a bottom of the disk taking device, and the plurality of first suction holes are connected with the suction pipe (181); the plurality of first suction holes (38, 39) ) Are distributed in a specific area at the bottom of the grabbing disk device, so that a substrate (40) and the grabbing When the bottom of the disk fetching device is in contact, the plurality of first suction holes are located at the outer edge of the substrate (40); the plurality of first suction holes are drawn out through the suction pipe (181) and the plurality of first suction holes. The air between the substrate (40) and the bottom of the disk grabbing device is used to adsorb the substrate (40); wherein the disk grabbing device includes: an air evening disk (182) and a carrier The tray (183); the air evening tray (182) is connected to the carrying tray (183); the plurality of first air extraction holes are arranged at a bottom of the carrying tray (183); the air extraction pipe (181) One end of) is connected to the air leveling plate (182), the air leveling plate (182) is provided with a vent pipe, and the plurality of first suction holes communicate with the suction pipe (181) through the vent pipe; The device further includes: a first annular elastic element (221) and a second annular elastic element (222); the first annular elastic element (221) and the second annular elastic element (222) are located Between the air evening plate (182) and the supporting plate (183); the first ring-shaped elastic element (221) and the second ring-shaped elastic element (222) are located in the air evening plate (182) An annular sealed cavity area is enclosed with the carrying plate (183), and the vent pipe and the plurality of first air extraction holes are all connected to the annular sealed cavity area. The device described in item 3 of the scope of patent application, wherein the plurality of first exhaust holes include: at least two sets of first exhaust holes (38, 39), the at least two sets of first exhaust holes are arranged in concentric circles and Each group of first exhaust holes is evenly distributed along the circumferential direction; wherein, the at least two groups of first exhaust holes are located in the annular sealed cavity area. The device as described in item 4 of the scope of patent application, wherein the plurality of first exhaust holes include: two sets of first exhaust holes; the first set of first exhaust holes (38) are relative to the second set of first exhaust holes ( 39) Close to the outer edge of the carrier plate (183); a bottom of the carrier plate (183) is provided with an adsorption groove (41), the first group of first exhaust holes (38) and the second group of first The suction holes (39) are all connected with the adsorption tank (41). The device as described in item 5 of the scope of patent application, wherein the air leveling disc comprises: a disc device; a second air extraction hole (s) communicating with the annular sealed cavity area is provided on the disc device ( 37); Wherein, the annular sealed cavity area is communicated with the ventilation pipe through the second suction hole (37). The device described in item 6 of the scope of patent application, wherein the ventilation duct includes: a plurality of exhaust branch pipes (161); the plurality of exhaust branch pipes (161) are arranged on the disc device; the plurality One end of each suction branch pipe (161) is communicated with one end of the suction pipe (181), and each suction branch pipe (161) is radially distributed around the junction with the suction pipe (181); The other ends of the plurality of suction branch pipes (161) are communicated with the annular sealed cavity area through the second suction hole (37). According to the device described in item 7 of the scope of patent application, a third annular elastic element (121) and a fourth annular elastic element (121) are arranged between the air evening plate (182) and the exhaust pipe (181). 122); wherein the third annular elastic element (121) and the fourth annular elastic element (122) are coaxially arranged, and the third annular elastic element (121) is used for the plurality of exhaust branches (161) The connection with the suction pipe (181) is sealed, and the fourth ring-shaped elastic element (122) is located on the periphery of the third ring-shaped elastic element (121), and is respectively connected to the air distribution plate ( 182) is in contact with the exhaust pipe (181). The device as described in item 7 of the patent application, wherein the disc device includes: a central disc (151) and an annular disc (171), the central disc (151) and the annular disc (171) ) Are arranged concentrically, and the two ends of a plurality of exhaust branch pipes (161) are respectively connected to the central disk (151) and the annular disk (171); the central disk (151) and the exhaust pipe (181) ) Is connected in a sealed manner; wherein the second suction hole (37) is provided on the annular disk (171). The device described in item 9 of the scope of patent application, wherein a plurality of the second air extraction holes (37) are arranged in a circular ring shape and are evenly distributed along the circumferential direction, wherein the second air extraction holes (37) and the The exhaust branch pipe (161) is set correspondingly.

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