JP7144547B2 - Non-contact substrate handling equipment and epitaxial reactor - Google Patents

Description

The present invention relates to the technical field of integrated semiconductor manufacturing, and more particularly to non-contact substrate handling equipment and epitaxial reactors.

In the field of semiconductor integrated circuit manufacturing, to produce an epitaxially coated semiconductor wafer, it is usually adopted to epitaxially coat the semiconductor wafer in an epitaxial reactor, and the deposition gas passes through the epitaxial reactor to the surface of the semiconductor wafer. Epitaxial material can be deposited thereon. Substrate (wafer) transportation is a very important part of the epitaxial reactor. A wafer is generally circular and has a front side and a back side, the wafer front side being the side of the wafer that forms and implements the integrated circuit structure. Therefore, it is very important to protect the front surface of the wafer from damage during the wafer transfer process.

There are several types of equipment currently used to transport substrates (wafers) in conventional epitaxial reactors, each with their own deficiencies. For example, in the case of a non-contact substrate handling device in a kind of epitaxial reactor, during the substrate pickup process, the adsorption force formed at each bleed hole acts on the front central portion of the substrate and acts on the central portion of the substrate. When the substrate is picked up from the process chamber, the substrate still has a certain temperature, and there is a gap between the pick-up device of the equipment. There is a certain stickiness, the substrate may not be sucked horizontally enough, and the stable sucking cannot be ensured, thereby causing substrate pick-up failure or drop. Furthermore, for example, in the case of another type of non-contact substrate handling equipment in an epitaxial reactor, there are problems with the orientation and layout of the tangential holes of the suction cups, so that neither the magnitude of the air flow nor the rotating vortex of each suction cup There is a difference, the phenomenon of instability, self-rotation and shaking occurs when the wafer is picked up, which cannot meet the needs of positioning, pick and place to a predetermined site, and wafer transfer. Therefore, new equipment for transporting substrates is needed.

In view of the above circumstances, embodiments of the present invention provide a non-contact substrate handling device and an epitaxial reactor.

According to one aspect of an embodiment of the present invention, there is provided a non-contact substrate handling device, wherein the non-contact substrate handling device comprises a pick-up plate device and a plurality of substrates provided on a bottom surface of the pick-up plate device. including an adsorption unit,
The plurality of substrate adsorption units are distributed centrally symmetrically, each of the substrate adsorption units is provided with a cavity, and each of the substrate adsorption units has a plurality of tangential directions in contact with the inner surface of the side wall of the cavity. holes are provided,
A vent passage is provided inside said pick-up plate device, said vent passage communicates with all of said tangential holes, wherein said vent passage directs gas received through said vent passage entrance to said tangential hole. into the corresponding cavity through the gas, whereby the gas forms a rotating vortex in the corresponding cavity, and forms a pressure difference at the opening of the corresponding cavity to adsorb the substrate. .

Optionally, the ventilation passage includes a plurality of first sealed passages, and the plurality of first sealed passages are provided in one-to-one correspondence with the plurality of the substrate adsorption units, and the plurality of first sealed passages are provided. first ends communicate with corresponding tangential holes of the substrate adsorption unit, second ends of the plurality of first sealed passages communicate with each other, and the plurality of first sealed passages are connected to the bottom surface of the pick-up plate device. , wherein compressed gas is introduced through the second ends of the plurality of first sealed passages and into it through the plurality of first sealed passages. It is transported to the tangential hole of the corresponding substrate suction unit.

Optionally, the ventilation passage further includes a second sealed passage, the second sealed passage is located at the center of the pickup plate device, and the extending direction of the second sealed passage is the thickness direction of the pickup plate body. The second ends of the plurality of first sealed passages are all in communication with the second sealed passages, thereby distributing compressed gas through the second sealed passages to the plurality of first sealed passages. .

Optionally, said vent passageway further comprises a third sealed passageway, wherein one end of said third sealed passageway is formed as an inlet of said vent passageway and the other end of said third sealed passageway is formed as said second sealed passageway. communicate with.

optionally, the pick-up plate device includes a base plate and an adapter plate;
the adapter plate comprises an adapter base plate, an intermediate plate and a top plate provided along the thickness direction of the pickup plate device, wherein a bottom surface of the adapter base plate is connected to the base plate;
The third sealing passage includes a first groove formed in a bottom surface of the adapter base plate, a third sealing passage inlet passing through the adapter base plate, and a third sealing passage outlet passing through the adapter base plate, A sealing passage inlet communicates the first groove with an inlet of the ventilation passage, and a portion of the base plate is provided facing the first groove to thereby seal the first groove and the intermediate A second sealed passage inlet is formed at a portion of the plate where it connects with the adapter base plate, the third sealed passage outlet communicates with the second sealed passage inlet, and the second sealed passage is formed in the intermediate plate. and the top plate seals the second sealed passageway.

Optionally, said adapter plate further comprises a radial disc, said radial disc located between said intermediate plate and said base plate, wherein:
A second groove is formed on the upper surface of the base plate, a second closed passage outlet is formed at a position where the intermediate plate is connected to the base plate, and a portion of the radial disc seals the second groove. and thereby forming said first sealed passage, said second sealed passage outlet communicating said first sealed passage and said second sealed passage.

Optionally, bumps are provided on the bottom surface of the base plate, said bumps being used to position and limit the substrate.

Optionally, the bumps are plural, and a plurality of the bumps are evenly distributed on the bottom surface of the base plate along its circumference.

Selectively, a plurality of closed cavities are provided in the pick-up plate device corresponding to the plurality of substrate suction units one-to-one, and the plurality of substrate suction units are respectively provided in the corresponding closed cavities. forming a plurality of annular sealed passages provided in one-to-one correspondence with the plurality of substrate adsorption units, wherein a first end of the first sealed passage communicates with the annular sealed passage, thereby Compressed gas is transported through the first sealed passage and the annular sealed passage to the corresponding tangential holes of the substrate suction unit.

Optionally, a through hole with an exhaust function is provided in the center of the pick-up plate device.

Optionally, the non-contact substrate manipulating device further comprises a pick-up arm, one end of the pick-up arm is connected to the pick-up plate device, a vent pipe is provided inside the pick-up arm, and the vent pipe communicates with the vent. communicates with the passageway thereby supplying gas to said vent passageway;

Selectably, the distance between the entrance of said vent passage and each said substrate adsorption unit is equal, thereby uniformly transporting gas to the tangential holes of each substrate adsorption unit.

Optionally, the cavity within the substrate adsorption unit is a cylindrical cavity, and within the same substrate adsorption unit a plurality of the tangential holes communicate with the cavity at the top of the cavity. and the plurality of tangential holes are located at the same height.

Selectably, the number of said substrate adsorption units is an even number, and the directions of rotating spirals formed in said cavity by two adjacent said substrate adsorption units are opposite.

Optionally, the openings of the cavities of the plurality of substrate suction units are evenly distributed on the bottom of the pick-up plate device along a circumferential direction.

A second aspect of the present invention provides an epitaxial reactor, comprising a non-contact substrate handling device, wherein the non-contact substrate handling device is the non-contact substrate handling device provided by the present invention. .

In the non-contact substrate handling device of the present invention, the plurality of substrate adsorption units are evenly distributed, and the compressed gas is uniformly transported to each substrate adsorption unit, so that the lifting force generated by each substrate adsorption unit is At the same time, the generated rotational forces can cancel each other, eliminating the self-rotation and tilting phenomenon of the substrate (or wafer), improving the accuracy of the equipment, and allowing the substrate pick-and-place and substrate transfer in the floating state. In the process of picking and placing the board, it can effectively avoid the problems such as staining, scratching, etc. on the surface of the board by the board conveying tool, and improve the product quality. It is possible to effectively prevent damage to equipment, etc., to perform board pick-and-place at high temperatures, shorten the cooling time of the equipment, and improve the productivity of the equipment.

Additional aspects and advantages of embodiments of the invention will be set forth, in part, in the description that follows and will be apparent from the description, or may be learned by practice of the invention.

In order to describe the embodiments of the present invention or the technical solutions in the prior art more clearly, the following briefly describes the drawings that need to be used in the description of the embodiments or the prior art one by one, and the obvious As such, the drawings in the following description are merely some embodiments of the present invention, and those skilled in the art can also obtain other drawings based on these drawings under the premise of not doing creative work. .

FIG. 1 is a structural schematic diagram of a ventilation passage according to an embodiment of the non-contact substrate manipulating device of the present invention. FIG. 2 is a structural schematic diagram of a substrate adsorption unit according to an embodiment of the non-contact substrate handling device of the present invention. FIG. 3 is a structural schematic diagram of a substrate adsorption unit according to an embodiment of the non-contact substrate handling device of the present invention. FIG. 4 is a schematic diagram of the principle of operation of the substrate adsorption unit. FIG. 5 is a structural cross-sectional schematic diagram of an embodiment of the non-contact type substrate manipulating device of the present invention.

The invention will now be more fully described with reference to the drawings, where exemplary embodiments of the invention will now be described. The following clearly and completely describes the technical solutions in the embodiments of the present invention together with the drawings in the embodiments of the present invention. Examples, not all implementations. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art under the premise of no creative work shall fall within the protection scope of the present invention. The technical solutions of the present invention are described below from various aspects in conjunction with the drawings and embodiments.

Hereinafter, for convenience of explanation, "left", "right", "top", and "bottom" correspond to the left, right, top, and bottom directions of the drawings themselves.

The following "first", "second", etc. are used only for distinction in explanation and have no other special meaning.

As one aspect of the present invention, the present invention provides a non-contact substrate handling device, which is provided on a pick-up plate device and a bottom surface of the pick-up plate device, as shown in FIGS. It includes a plurality of substrate adsorption units (in the embodiment shown in FIG. 1, the plurality of substrate adsorption units includes a substrate adsorption unit 102 and a substrate adsorption unit 103), and the pickup plate device and the plurality of substrate adsorption units are of multiple types. It can be realized as a typical structure.

As shown in FIG. 1, the plurality of substrate suction units (including the substrate suction unit 102 and the substrate suction unit 103) are distributed centrally symmetrically, and the plurality of substrate suction units are distributed on the same circumference. . In the present invention, the center of symmetry of the plurality of substrate adsorption units is not particularly defined, but the center of symmetry of the plurality of substrate adsorption units may be positioned on the bottom surface of the pickup plate device. In the specific embodiment shown in FIG. 1, the center of symmetry of the plurality of substrate adsorption units is the center of the bottom surface of the pick-up plate device.

Each substrate adsorption unit is provided with a cavity, and each side wall of the cavity of each substrate adsorption unit is provided with a plurality of tangential holes, and the tangential holes are substrate adsorption units in which the tangential holes are provided. contacts the inner surface of the side wall of the cavity of the

A ventilation passage is provided inside the pick-up plate device, and a specific arrangement of the ventilation passage can be provided according to design requirements. Here, as shown in FIG. 4, the vent passages introduce the gas (optionally the gas is a compressed gas) received through the entrance of the vent passages into the corresponding cavity through the tangential holes. , whereby the gas is used to form a rotating vortex within the corresponding cavity. When transferring a substrate using a non-contact substrate handling device including a pick-up plate device, the openings of the cavities of the substrate adsorption units are oriented in the same direction (that is, they all face the substrate), and each substrate adsorption unit A pressurized gas is injected into the tangential holes of the substrate, and the pressure difference (ie, negative pressure) created between the tangential holes and the corresponding cavity opening by the rotating vortex is used to attract the substrate.

The openings of the cavities of the plurality of substrate suction units are evenly distributed on the bottom of the pickup plate device along the circumferential direction, so that the suction points are uniformly distributed on the substrate using the plurality of substrate suction units. can be formed, thereby realizing stable substrate adsorption.

Taking the specific embodiment shown in FIGS. 2 and 3 as an example, FIG. A cavity communicates with the tangential hole 103-1. Compressed gas is introduced into the cavity of the substrate adsorption unit 102 and into the cavity of the substrate adsorption unit 103 through the ventilation passage and the tangential holes 102-1 and 103-1, respectively, and into the cavity of the substrate adsorption unit 102, respectively. A rotating vortex is formed inside the unit and inside the cavity of the substrate adsorption unit 103, and the substrate is adsorbed using a pressure difference caused by the rotating vortex. The substrate may be a plurality of types of semiconductor wafer substrates or the like.

As one specific embodiment, the substrate adsorption unit (including the substrate adsorption unit 102 and the substrate adsorption unit 103) is provided with a cylindrical cavity, and the uppermost portion of the cavity is positioned at the same height. is provided with at least two tangential holes communicating with the cavity, the tangential holes contacting the inner wall of the corresponding cylindrical cavity. Specifically, in the embodiment shown in FIG. 2, two tangential holes 102-1 are provided at the top of the cavity of the substrate adsorption unit 102, and the tangential holes 102-1 are the cavities of the substrate adsorption unit 102. Two tangential holes 103-1 are provided in the uppermost part of the cavity of the substrate adsorption unit 103, the tangential holes 103-1 being in contact with the inner wall of the cylindrical cavity of the substrate adsorption unit 103. contact with the inner wall of the shaped cavity. The plurality of substrate adsorption units (including the plurality of substrate adsorption units 102 and the plurality of substrate adsorption units 103) are evenly distributed, and the total number of substrate adsorption units is an even number, such as 6, 8, and so on. The tangential holes of two adjacent substrate adsorption units may be alternately arranged in a counterclockwise direction and a clockwise direction, and the directions of the rotating spirals formed in the cavity by the adjacent substrate adsorption units 102 and 103 are different. , left-handed and right-handed spirals, respectively, or vice versa.

As shown in FIG. 4, the compressed gas enters the cavity from the top of the substrate adsorption unit along the tangential holes and forms a rotating vortex under the restraint of the walls of the cylindrical cavity. The rapidly rotating gas drives the gas in the central region of the cavity to rotate, causing it to fly to the wall surface by centrifugal action, thereby generating a negative pressure region in the center of the cavity. A silicon wafer placed under the substrate suction unit receives a vertically upward suction force due to the action of the negative pressure, thereby realizing the suction process. Due to the action of the pressure, the gas spirals downward and is discharged radially at the bottom of the substrate suction unit, thereby forming an air cushion between the outer circumference of the silicon wafer and the suction cup, and finally non-removable. Realize contact substrate adsorption. The substrate chucking unit utilizes Bernoulli's principle to use the low pressure formed by the rotating vortex to create a pressure differential to achieve the lifting force, and the vortex formed by a single substrate chucking unit to drive the wafer rotation. Therefore, the substrate adsorption unit adopts central rotational symmetry distribution and is used to balance the rotational force between them.

Optionally, the openings of the cavities of the plurality of substrate-sucking units are evenly distributed on the bottom of the pick-up plate device along the circumferential direction so as to pick up the substrate more stably.

In one embodiment, the vent passage uniformly transports the compressed gas to the tangential holes of each substrate adsorption unit and, specifically, to the tangential holes 102-1 of each substrate adsorption unit 102 and each substrate adsorption unit. 103 can be uniformly transported to tangential holes 103-1.

The distances between the entrances of the ventilation passages and each substrate adsorption unit are equal, thereby allowing compressed gas to flow through the tangential holes of each substrate adsorption unit (specifically, compressed air to the tangential holes 102-1 of the substrate adsorption unit 102). and the tangential hole 103-1 of the substrate adsorption unit 103).

The ventilation passages can be realized as a plurality of specific structures. For example, the ventilation passage includes a plurality of first sealed passages 105, and the plurality of first sealed passages 105 are provided in one-to-one correspondence with the plurality of substrate suction units (including the substrate suction unit 102 and the substrate suction unit 103). be done. The first ends of the plurality of first sealed passages 105 communicate with the corresponding tangential holes of the substrate adsorption unit, the second ends of the plurality of first sealed passages 105 communicate with each other, and the plurality of first sealed passages 105 are distributed radially around the center of the bottom surface of the pickup plate device. Compressed gas is introduced through the second end of the first sealed passage 105 and uniformly transported through the first sealed passage 105 to the corresponding tangential holes of the substrate adsorption unit. The length of each first sealed passage 105 is the same, thereby realizing the equal distance between the entrance of the ventilation passage and each substrate adsorption unit.

The present invention does not particularly limit how the gas is supplied to the first sealed passage 105 . Optionally, the vent passageway further includes a second sealed passageway 104 . The second sealed passage 104 is located at the center of the pickup plate device, and the extending direction (ie, axial direction) of the second sealed passage 104 coincides with the thickness direction of the pickup plate device. It should be understood that the outlet of the second sealed passageway 104 is the inlet of the vent passageway, and the second ends of the plurality of first sealed passageways 105 are all in communication with the second sealed passageway 104, thereby allowing the compressed gas to flow through the second sealed passageway. It is evenly distributed to a plurality of first sealed passages 105 via two sealed passages 104 .

The present invention does not particularly limit how the gas is supplied to the second sealed passage 104. Optionally, the vent passage further includes a third sealed passage 106, and an opening at one end of the third sealed passage 106. is formed as the entrance of the ventilation passage. The third sealed passage 106 is located at the edge of the pickup plate device, and the opening at the other end of the third sealed passage 106 communicates with the second sealed passage 104 . A plurality of third closed passages 106 may be provided.

In order to provide a plurality of substrate adsorption units in the pickup plate device, and to supply gas to each substrate adsorption unit through the ventilation passage of the pickup plate device, selectably, a plurality of substrate adsorption units ( (including the substrate adsorption unit 102 and the substrate adsorption unit 103) are provided with a plurality of sealed cavities corresponding one-to-one. A plurality of substrate adsorption units (including the substrate adsorption unit 102 and the substrate adsorption unit 103) are respectively provided in the corresponding sealed cavities, and the plurality of substrate adsorption units (including the substrate adsorption unit 102 and the substrate adsorption unit 103) are provided in the respective sealed cavities. A plurality of annular sealed passages 130 are formed in a one-to-one correspondence. Here, the first end of the first sealed passage 105 communicates with the annular sealed passage 130, thereby allowing the pressurized gas to flow through the first sealed passage 105 and the annular sealed passage 130 into the corresponding tangential hole of the substrate suction unit. transport to

As shown in FIG. 5, the pickup plate device includes a base plate 101 and an adapter plate device 121, the bottom surface of the base plate 101 is formed as the bottom surface of the pickup plate device, and the adapter plate device 121 can adopt multiple structures. For example, the adapter plate device 121 is provided on the surface of the base plate 101 away from the bottom surface of the base plate 101, and the adapter plate device 121 is provided along the thickness direction of the pickup plate device. Includes plate 109 . A bottom surface of the adapter base plate 110 is connected to the base plate 101 .

A third sealed passage 106 is formed between the adapter base plate 110 , the middle plate 111 and the base plate 101 and a second sealed passage 104 is formed between the middle plate 111 and the top plate 109 . Specifically, the third sealed passage 106 includes a first groove formed in the bottom surface of the adapter base plate 110 , a third sealed passage inlet passing through the adapter base plate 110 , and a third sealed passage outlet passing through the adapter base plate 110 . include. A third sealing passage inlet communicates with the first groove and the inlet of the ventilation passage, and a portion of the base plate 101 is provided facing the first groove, thereby sealing the first groove. A second sealed passage entrance is formed at a position where the intermediate plate 111 is connected to the adapter base plate 110 . The third sealed passageway outlet communicates with the second sealed passageway inlet, the second sealed passageway 104 is formed in the intermediate plate 111 and the top plate 109 seals the second sealed passageway 104 .

Optionally, the adapter plate 121 further includes a radial disc 108 located between the intermediate plate 111 and the base plate 101 .

In embodiments in which adapter plate 121 includes radiating disc 108 , first sealed passage 105 is formed between radiating disc 108 , intermediate plate 111 , and base plate 101 . Specifically, a second recessed groove is formed in the upper surface of the base plate 101, a second sealed passage outlet is formed in a position where the intermediate plate 111 is connected to the base plate 101, and a portion of the radial disc 108 is formed in the second groove. The groove is sealed, thereby forming a first sealed passage 105 , and a second sealed passage outlet communicates the first sealed passage 105 and the second sealed passage 104 .

Optionally, bumps 101-1 are provided on the bottom of the base plate, and bumps 101-1 are used to position and limit the substrate.

Although the number of bumps 101-1 is not particularly limited in the present invention, it is sufficient to position and limit them with respect to the substrate. Optionally, a plurality of bumps 101-1 are provided on the bottom of the base plate, and the plurality of bumps 101-1 are evenly distributed on the bottom surface of the base plate along its circumference. The uniform distribution of the bumps 101-1 on the same circumference provides better positioning and confinement to the substrate.

Optionally, a through-hole 107 is provided in the center of the pick-up plate device with an evacuation function.

When transferring the substrate, it is necessary to move the pick-up plate device. The present invention does not specifically limit how the pick-up plate device is moved. Optionally, the non-contact substrate handling device may further include a pick-up arm 222, one end of which is connected to the pick-up plate device. A vent tube is provided within the pick-up arm 222 and communicates with the vent passageway, thereby supplying gas to the vent passageway (optionally, the gas is a compressed gas). As noted above, in specific embodiments in which the pick-up plate apparatus includes a base plate 101 and an adapter plate apparatus 121, the outlet of the vent tube may communicate directly with the second sealed passageway 104.

A description will now be given of how gas is supplied to the substrate adsorption unit 102 and the substrate adsorption unit 103 of the pickup plate apparatus via the pickup arm 222, thereby realizing non-contact transfer of the substrate. A compressed gas source is connected through a vent pipe provided inside the pickup arm 222, and the compressed gas enters the second sealed passage 104 through the third sealed passage 106 and passes through the center hole of the second sealed passage 104. uniformly enter the first sealed passage 105 and reach the annular sealed passage 130 where the substrate adsorption units are located, thereby making the airflows entering the tangential holes of each substrate adsorption unit all the same, finally forming The magnitude of the lifting force is made the same to prevent the substrate from being sucked while tilted. At the same time, the plurality of substrate adsorption units 102 and 103 are centered and uniformly symmetrically distributed, and the air inlets of the substrate adsorption units (that is, the tangential holes of the substrate adsorption units) are also symmetrically distributed, resulting in a rotational force. cancel each other, so that the substrate is not rotated and the positioning of the substrate is ensured during the transfer process.

The present invention does not particularly limit how the plurality of substrate suction units are provided on the pickup plate device having the base plate 101 and the adapter plate device 121 . In the specific embodiment shown in FIG. 1 , the substrate adsorption unit 102 and the substrate adsorption unit 103 are fitted between the radial disc 108 of the adapter plate 121 and the base plate 101 and form an annular closed passage 130 .

How to insert the substrate suction unit 102 and the substrate suction unit 103 between the radiation disc 108 and the base plate 101 will be briefly described below. As shown in FIG. 5, a plurality of first receiving holes are formed on the radiation disc 108, a plurality of second receiving holes are provided on the base plate 101, and the first receiving holes, the second receiving holes and the substrate suction unit are formed. are provided in one-to-one correspondence, and the first accommodation holes communicate with the corresponding second accommodation holes to form a closed cavity, and the corresponding substrate adsorption unit is accommodated in the closed cavity. . The annular sealed passages also correspond one-to-one with the substrate adsorption units, and the annular sealed passages are located between the corresponding first receiving holes and the corresponding second receiving holes.

The top of the substrate adsorption unit is provided in the corresponding first receiving hole, the middle part of the substrate adsorption unit is located in the corresponding annular closed passage 130, and the bottom of the substrate adsorption unit is in the corresponding second receiving hole. be provided.

In one embodiment, an epitaxial reactor is provided and includes the non-contact substrate handling device of any of the above embodiments.

In the non-contact substrate handling device provided by the above embodiments, the substrate adsorption units are evenly distributed, and the compressed gas is uniformly transported to each substrate adsorption unit, so that the lifting force generated by each substrate adsorption unit is are the same, the generated rotational forces can cancel each other, eliminate the phenomenon of substrate self-rotation and tilting, improve the accuracy of the equipment, and realize substrate pick-and-place and substrate transfer in the floating state, In the process of picking and placing the board, it can effectively avoid problems such as contamination and scratches on the surface of the board by the board transfer tool, improve product quality, and prevent external air passages and equipment from being affected by high temperature gas. It can effectively prevent breakage, can perform substrate pick-and-place at high temperature, shorten the cooling time of the equipment, and improve the productivity of the equipment.

For any of the technical solutions disclosed in the present invention above, unless otherwise stated, if a numerical range is disclosed for it, any numerical range disclosed is a preferred numerical range, It should be understood by those skilled in the art that the preferred numerical ranges are simply those numbers that have a relatively significant or representative technical effect among many possible numbers. Since the numerical values are relatively large and cannot be enumerated individually, the present invention discloses a part of the numerical values to exemplify the technical solution of the present invention, and the enumerated numerical values are limitations on the protection scope of the present invention. should not be configured.

At the same time, the above invention discloses or when pertaining to parts or structures that are fixedly connected to each other, unless otherwise stated, fixed connections may be defined as fixed connections that are removable (e.g., using bolts or screws). may be understood as a fixed connection (e.g. riveted, welded), and of course the fixed connection to each other may be understood as a one-piece construction (e.g. using a casting process). manufactured by integral molding) may be substituted (except where the integral molding process cannot be adopted obviously).

In addition, unless otherwise stated, the term for indicating the positional relationship or shape applied to any of the technical solutions disclosed in the present invention means that the meaning is approximate, similar or close to it including. Any member provided by the present invention may be assembled from a plurality of individual components or may be a single member manufactured by an integral molding process.

The above examples are merely for describing the technical solutions of the present invention, and do not limit it, and the present invention has been described in detail with reference to preferred embodiments. It should be understood that the specific embodiments of the present invention can still be modified or some of the technical features can be replaced by equivalents, and all of them without departing from the spirit of the technical solution of the present invention is included in the scope of the technical solutions that the present invention claims to protect.

The description of the present invention has been presented for purposes of illustration and description, and is not intended to be exhaustive or to limit the invention to the form disclosed. Many modifications and variations will be apparent to those skilled in the art. The selection and description of the embodiments are intended to better illustrate the principles and practical application of the present invention, and to describe various embodiments having various modifications that allow those skilled in the art to understand the present invention and apply it to their particular applications. The purpose is to be able to design

101 base plate 102 substrate suction unit 102-1 tangential hole 103-1 tangential hole 104 second sealed passage 105 first sealed passage 106 third sealed passage 108 radial disk 111 intermediate plate 121 adapter plate device 130 annular sealed passage 222 pickup arm

Claims (15)

A non-contact substrate handling device, the non-contact substrate handling device comprising: a pick-up plate device; and a plurality of substrate suction units (102, 103) provided on the bottom surface of the pick-up plate device;
The plurality of substrate adsorption units (102, 103) are distributed centrally symmetrically, each of the substrate adsorption units (102, 103) is provided with a cavity, and each of the substrate adsorption units (102, 103) is provided with a plurality of tangential holes (102-1, 103-1) that are all in contact with the inner surface of the side wall of the cavity,
A through-hole (107) having an exhaust function is provided in the center of the pickup plate device, and a ventilation passage is provided inside the pickup plate device, and the ventilation passage extends through all the tangential holes (102-1, 103- 1), wherein said vent passages introduce gas received through said vent passage inlets into said corresponding cavities through said tangential holes (102-1, 103-1); A non-contact type substrate characterized in that gas thereby forms a rotating vortex in the corresponding cavity and forms a pressure difference at the corresponding opening of the cavity, which is used to adsorb the substrate . operating equipment. The ventilation passage includes a plurality of first sealed passages (105), the plurality of first sealed passages (105) are provided in one-to-one correspondence with the plurality of substrate adsorption units (102, 103), and a plurality of the first ends of the first sealed passages (105) of the are communicated with the corresponding tangential holes of the substrate adsorption unit, the second ends of the plurality of first sealed passages (105) are communicated with each other, and The plurality of first sealed passages (105) are radially distributed around the center of the bottom surface of the pick-up plate device, wherein the compressed gas is supplied to the second gas passages of the plurality of first sealed passages (105). introduced via the end and transported to the corresponding tangential holes (102-1, 103-1) of the substrate adsorption unit through a plurality of the first closed passages (105). The non-contact substrate handling device according to claim 1. The ventilation passage further includes a second sealed passage (104), the second sealed passage (104) is located in the center of the pick-up plate device, and the extending direction of the second sealed passage extends through the thickness of the pick-up plate device . the second ends of the plurality of first sealed passages (105) are all in communication with the second sealed passages (104), thereby allowing compressed gas to pass through the second sealed passages (104). 3. The non-contact substrate manipulating device according to claim 2, wherein the liquid is distributed to a plurality of the first closed passages (105). The vent passage further includes a third sealed passage (106), wherein one end of the third sealed passage (106) is formed as an inlet of the vent passage and the other end of the third sealed passage (106) is 4. The non-contact substrate handling device of claim 3, wherein the non-contact substrate handling device communicates with the second sealed passageway (104). The pick-up plate device includes a base plate (101) and an adapter plate (121),
The adapter plate (121) comprises an adapter base plate (110), an intermediate plate (111) and a top plate (109) arranged along the thickness direction of the pickup plate device, wherein the adapter base plate (110) a bottom surface is connected to the base plate (101);
The third sealing passage (106) passes through a first groove formed in the bottom surface of the adapter base plate (110), a third sealing passage entrance through the adapter base plate (110), and the adapter base plate (110). said third sealed passage inlet communicates with said first recessed groove and the entrance of said ventilation passage, and a part of said base plate (101) is provided facing said first recessed groove. a second sealed passage inlet is formed at a position where the intermediate plate (111) is connected to the adapter base plate (110), and the third sealed passage outlet is the Communicating with a second sealed passageway inlet, said second sealed passageway (104) is formed in said intermediate plate (111), and said top plate (109) seals said second sealed passageway (104). 5. The non-contact substrate manipulation device according to claim 4. Said adapter plate (121) further comprises a radiating disc (108), said radiating disc (108) located between said intermediate plate (111) and said base plate (101), wherein:
A second groove is formed on the upper surface of the base plate (101), a second sealed passage outlet is formed at a position where the intermediate plate (111) is connected to the base plate (101), and the radial disc (108) ) seals the second groove, thereby forming the first sealed passage (105), and the second sealed passage outlet connects the first sealed passage (105) and the second sealed passage ( 104) are communicated with each other. The non-contact device according to claim 5, characterized in that bumps (101-1) are provided on the bottom surface of said base plate, said bumps (101-1) being used for positioning and limiting said substrate. formula board manipulation equipment. 8. The method according to claim 7, wherein the bumps (101-1) are plural, and the plural bumps (101-1) are uniformly distributed along the circumference of the bottom surface of the base plate. A non-contact substrate handling device as described. A plurality of sealed cavities corresponding to the plurality of substrate suction units (102, 103) one-to-one are provided in the pick-up plate device, and the plurality of substrate suction units (102, 103) respectively correspond to the plurality of closed cavities. A plurality of annular sealed passages (130) are provided in the sealed cavity and provided in one-to-one correspondence with the plurality of substrate adsorption units (102, 103), wherein the first sealed passage ( 105) communicates with said annular sealed passageway (130), thereby allowing compressed gas to pass through said first sealed passageway (105) and said annular sealed passageway (130) to the corresponding said substrate adsorption unit. The non-contact substrate handling device according to any one of claims 2 to 8, characterized in that it is transported to the tangential hole of the. The non-contact type substrate manipulating device further includes a pick-up arm (222), one end of the pick-up arm (222) is connected to the pick-up plate device, a vent pipe is provided inside the pick-up arm, and the vent pipe is 9. The non-contact substrate manipulating device according to claim 1, wherein the non-contact substrate manipulating device communicates with the ventilation passage, thereby supplying gas to the ventilation passage. The distance between the entrance of said ventilation passage and each of said substrate adsorption units (102, 103) is equal, thereby allowing gas to flow through the tangential direction holes (102-1, 103-1) of each of said substrate adsorption units (102, 103). ). The cavities in the substrate adsorption units (102, 103) are cylindrical cavities, and in the same substrate adsorption unit, a plurality of the tangential holes (102-1, 103-1) are formed in the cavities. The non-contact substrate handling device according to any one of claims 1 to 8, characterized in that the plurality of tangential holes are located at the same height and communicate with the cavity at the uppermost part of the device. 13. The method according to claim 12 , characterized in that the number of said substrate adsorption units is an even number, and the directions of rotating spirals formed in said cavity by two said substrate adsorption units (102, 103) adjacent to each other are opposite to each other. A non-contact substrate handling device as described. 9. The apparatus according to any one of claims 1 to 8, wherein the openings of the cavities of the plurality of substrate adsorption units are uniformly distributed along the circumferential direction on the bottom of the pickup plate device. Non-contact board handling equipment. An epitaxial reactor comprising a non-contact substrate handling device, wherein the non-contact substrate handling device is the non-contact substrate handling device according to any one of claims 1 to 14 . .

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