JP2021528862A - Non-contact substrate operating equipment and epitaxial reactor - Google Patents

Abstract

A non-contact substrate operating device including a pickup plate device and a plurality of substrate adsorption units (102, 103) provided on the bottom surface of the pickup plate apparatus, and the plurality of substrate adsorption units (102, 103) are centrally symmetrical. Each substrate adsorption unit (102, 103) is provided with a cavity inside, and each substrate adsorption unit (102, 103) is an inner surface of the side wall of the substrate adsorption unit (102, 103). A plurality of tangential holes (102-1, 103-1) in contact with the tangential holes (102-1, 103-1) are provided, and a ventilation passage is provided inside the pickup plate device, and the ventilation passages are all tangential holes (102-1, 103-1). Here, the ventilation passage introduces the gas received through the entrance of the ventilation passage into the corresponding cavity through the tangential holes (102-1, 103-1), whereby the gas corresponds. It is used to form a rotating swirl in the cavity and to create a pressure difference at the corresponding opening in the cavity to adsorb the substrate. Further provided is an epitaxial growth apparatus. The non-contact substrate operating device can eliminate the phenomenon of self-rotation and tilting of the wafer and improve the accuracy of the device.

Description

The present invention relates to the technical field of semiconductor integrated manufacturing, and particularly to non-contact substrate operating equipment and epitaxial reactor.

In the field of manufacturing semiconductor integrated circuits, in order to produce an epitaxially coated semiconductor wafer, it is usually adopted to epitaxially coat the semiconductor wafer in the epitaxial reactor, and the deposited gas passes through the epitaxial reactor and the surface of the semiconductor wafer is used. The epitaxial material can be deposited on top. Substrate (wafer) transfer is a very important part of an epitaxial reactor. The wafer is generally circular and has a front surface and a back surface, and the front surface of the wafer is a wafer surface realized by forming an integrated circuit structure. Therefore, in the wafer transfer process, it is very important to protect the front surface of the wafer from damage.

Currently, there are a plurality of types of equipment used for transporting a substrate (wafer) in a conventional epitaxial reactor, but each has a defect. For example, in the case of a non-contact substrate operating device in one type of epitaxial reactor, in the substrate pickup process, the adsorption force formed at each extraction hole acts on the central portion of the front surface of the substrate and acts on the central portion of the substrate. The adsorption force exerts excessive deformation of the substrate, which tends to form scratches, and when the substrate is picked up from the process chamber, the substrate still has a constant temperature and is connected to the pick-up device of the equipment. There is a certain degree of adhesion, and the substrate may not be sufficiently horizontally adsorbed, and stable adsorption cannot be ensured, which leads to the failure or drop of the substrate pickup. Furthermore, for example, in the case of a non-contact substrate operating device in another type of epitaxial reactor, there is a problem in the direction and layout of the tangential holes of the suction cups, so that the size of the airflow of each suction cup and the rotary swirl can be determined. There is a difference, and when the wafer is sucked, the phenomena of instability, self-rotation, and shaking occur, and the needs of positioning, pick-and-place for a predetermined part, and wafer transfer cannot be satisfied. Therefore, a new device for transporting the substrate is required.

In view of the above circumstances, an embodiment of the present invention provides a non-contact substrate operating device and an epitaxial reactor.

According to one aspect of the embodiment of the present invention, a non-contact type substrate operating device is provided, wherein the non-contact type substrate operating device includes a pickup plate device and a plurality of substrates provided on the bottom surface of the pickup plate device. Including suction unit
The plurality of the substrate adsorption units are distributed symmetrically in the center, each of the substrate adsorption units is provided with a cavity, and each of the substrate adsorption units is in a plurality of tangential directions in contact with the inner surface of the side wall of the cavity. With holes
A ventilation passage is provided inside the pickup plate device, and the ventilation passage communicates with all the tangential holes, wherein the ventilation passage receives gas received through the entrance of the ventilation passage through the tangential hole. It is used to introduce into the corresponding cavity through the cavity so that the gas forms a rotating swirl in the corresponding cavity and creates a pressure difference at the opening of the corresponding cavity to adsorb the substrate. ..

Selectably, the ventilation passage includes a plurality of first closed passages, and the plurality of the first closed passages are provided in a one-to-one correspondence with the plurality of the substrate suction units, and the plurality of the first closed passages are provided. The first end communicates with the tangential hole of the corresponding substrate suction unit, the second ends of the plurality of first sealed passages communicate with each other, and the plurality of first sealed passages are the bottom surface of the pickup plate device. It is distributed radially around the center of the above, where the compressed gas is introduced via the second ends of the first closed passages and through the first closed passages. It is transported to the tangential hole of the corresponding substrate suction unit.

Selectably, the ventilation passage further includes a second closed passage, the second closed passage is located at the center of the pickup plate device, and the extension direction of the second closed passage is the thickness direction of the pickup plate body. Matching, the second ends of the plurality of first closed passages all communicate with the second closed passage, thereby distributing the compressed gas to the plurality of first closed passages via the second closed passage. ..

Optionally, the ventilation passage further includes a third closed passage, where one end of the third closed passage is formed as an entrance to the ventilation passage and the other end of the third closed passage is the second closed passage. Communicate with.

Optionally, the pickup plate device includes a base plate and an adapter plate.
The adapter plate includes an adapter base plate, an intermediate plate and a top plate provided along the thickness direction of the pickup plate device, wherein the bottom surface of the adapter base plate is connected to the base plate.
The third closed passage includes a first concave groove formed on the bottom surface of the adapter base plate, a third closed passage entrance penetrating the adapter base plate, and a third closed passage outlet penetrating the adapter base plate. The closed passage entrance communicates the first concave groove with the entrance of the ventilation passage, and a part of the base plate is provided so as to face the first concave groove, thereby sealing the first concave groove and the intermediate. A second closed passage entrance is formed at a position of the plate connected to the adapter base plate, the third closed passage outlet communicates with the second closed passage entrance, and the second closed passage is formed in the intermediate plate. The top plate seals the second closed passage.

Optionally, the adapter plate further comprises a radiating disc, which is located between the intermediate plate and the base plate, where.
A second concave groove is formed on the upper surface of the base plate, a second closed passage outlet is formed at a position of the intermediate plate connected to the base plate, and a part of the radiation disk seals the second concave groove. Then, the first closed passage is formed, and the second closed passage outlet communicates with the first closed passage and the second closed passage.

Bumps are optionally provided on the bottom surface of the base plate and the bumps are used to position and limit the substrate.

There are a plurality of the bumps that can be selected, and the plurality of the bumps are uniformly distributed on the bottom surface of the base plate along the circumferential direction.

A plurality of sealed cavities corresponding to the plurality of substrate suction units on a one-to-one basis are provided in the pickup plate device so as to be selectable, and the plurality of substrate suction units are each provided in the corresponding sealed cavities. A plurality of annular closed passages are formed so as to be provided in a one-to-one correspondence with the plurality of substrate adsorption units, wherein the first end of the first closed passage communicates with the annular closed passage. The compressed gas is transported to the tangential hole of the corresponding substrate adsorption unit via the first closed passage and the annular closed passage.

A through hole having an exhaust function is provided in the center of the pickup plate device so as to be selectable.

Selectably, the non-contact substrate operating device further includes a pickup arm, one end of the pickup arm is connected to the pickup plate device, a ventilation pipe is provided inside the pickup arm, and the ventilation pipe is the ventilation. It communicates with the aisle, thereby supplying gas to the aisle.

Selectably, the distance between the inlet of the ventilation passage and each of the substrate adsorption units is equal so that the gas is uniformly transported to the tangential holes of each substrate adsorption unit.

Selectably, the cavity in the substrate adsorption unit is a cylindrical cavity, and within the same substrate adsorption unit, a plurality of tangential holes communicate with the cavity at the top of the cavity. Moreover, the plurality of tangential holes are located at the same height.

Selectably, the number of the substrate adsorption units is an even number, and the directions of the rotating swirls formed in the cavity by the two adjacent substrate adsorption units are opposite.

Selectably, the openings of the cavities of the plurality of substrate suction units are uniformly distributed at the bottom of the pickup plate device along the circumferential direction.

A second aspect of the present invention is to provide an epitaxial reactor, including a non-contact substrate operating apparatus, wherein the non-contact substrate operating apparatus is the non-contact substrate operating apparatus provided by the present invention. ..

In the non-contact type substrate operating device of the present invention, a plurality of substrate adsorption units are uniformly distributed, and the compressed gas is uniformly transported to each substrate adsorption unit, so that the lifting force formed by each substrate adsorption unit is generated. It is the same, the generated rotational forces can cancel each other out, the phenomenon of self-rotation and tilt of the substrate (or wafer) is eliminated, the accuracy of the equipment is improved, and the substrate pick-and-place and substrate transfer in the floating state are performed. Realized, it is possible to effectively avoid problems such as dirt and scratches given to the surface of the substrate by the substrate transfer tool in the process of picking and placing the substrate, and improve the quality of the product. Damage to the equipment can be effectively prevented, substrate pick-and-place can be performed at high temperatures, the cooling time for cooling the equipment can be shortened, and the productivity of the equipment can be improved.

Additional aspects and advantages of the embodiments of the present invention are given in part from the following description, which will become apparent from the following description or will be grasped by practice of the present invention.

In order to more clearly explain the technical solutions in the examples or the prior art of the present invention, the drawings that need to be used in the description of the examples or the prior art will be briefly described and clarified below one by one. As such, the drawings in the following description are merely some embodiments of the present invention, and for those skilled in the art, other drawings may be obtained based on these drawings on the premise that no creative labor is carried out. ..

FIG. 1 is a schematic structural diagram of a ventilation passage according to an embodiment of the non-contact substrate operating device of the present invention. FIG. 2 is a schematic structural diagram of a substrate suction unit according to an embodiment of the non-contact substrate operating apparatus of the present invention. FIG. 3 is a schematic structural diagram of a substrate suction unit according to an embodiment of the non-contact substrate operating apparatus of the present invention. FIG. 4 is a schematic diagram of the operating principle of the substrate adsorption unit. FIG. 5 is a schematic structural cross-sectional view according to an embodiment of the non-contact substrate operating device of the present invention.

Hereinafter, the present invention will be described in more detail with reference to the drawings, and here, exemplary embodiments of the present invention will be described. Hereinafter, the technical solutions of the embodiments of the present invention will be clearly and completely described together with the drawings in the embodiments of the present invention, and as is clear, the illustrated examples are merely partial embodiments of the present invention. It is an example, not all examples. Based on the embodiments of the present invention, all other embodiments obtained under the premise that those skilled in the art do not engage in creative labor belong to the scope of protection of the present invention. Hereinafter, the technical solution of the present invention will be described from various points with reference to the drawings and examples.

Hereinafter, for convenience of explanation, the "left", "right", "top", and "bottom" described below correspond to the left, right, top, and bottom directions of the drawing itself.

The following "first", "second", etc. are used only for distinguishing in the explanation, and have no other special meaning.

As one aspect of the present invention, as shown in FIGS. 1 to 5, the present invention provides a non-contact type substrate operating device, and the non-contact type substrate operating device is provided on the pickup plate device and the bottom surface of the pickup plate device. A plurality of substrate adsorption units (in the embodiment shown in FIG. 1, the plurality of substrate adsorption units include the substrate adsorption unit 102 and the substrate adsorption unit 103), and the pickup plate device and the plurality of substrate adsorption units include a plurality of specific types. It can be realized as a typical structure.

As shown in FIG. 1, a plurality of substrate adsorption units (including the substrate adsorption unit 102 and the substrate adsorption unit 103) are distributed symmetrically in the center, and the plurality of substrate adsorption units are distributed on the same circumference. .. In the present invention, the center of symmetry of the plurality of substrate suction units is not particularly specified, but the center of symmetry of the plurality of substrate suction units may be located on the bottom surface of the pickup plate device. In the specific embodiment shown in FIG. 1, the center of symmetry of the plurality of substrate suction units is the center of the bottom surface of the pickup plate device.

Each substrate suction unit is provided with a cavity, and each of the side walls of the cavity of each substrate suction unit is provided with a plurality of tangential holes, and the tangential holes are provided with tangential holes. In contact with the inner surface of the side wall of the cavity.

A ventilation passage is provided inside the pickup plate device, and a specific arrangement method of the ventilation passage can be provided according to the design requirements. Here, as shown in FIG. 4, the ventilation passage introduces a gas (selectably, the gas is a compressed gas) received through the entrance of the ventilation passage into the corresponding cavity through the tangential hole. , Thereby the gas is used to form a rotating swirl within the corresponding cavity. When transferring a substrate using a non-contact substrate operating device including a pickup plate device, the direction of the opening of the cavity of each substrate adsorption unit is the same (that is, both face the substrate), and each substrate adsorption unit. Compressed gas is injected into the tangential hole of the above, and the substrate is adsorbed by utilizing the pressure difference (that is, negative pressure) generated between the tangential hole and the opening of the corresponding cavity by the rotary swirl.

The openings of the cavities of the plurality of substrate adsorption units are uniformly distributed at the bottom of the pickup plate device along the circumferential direction, whereby the adsorption points uniformly distributed on the substrate by utilizing the plurality of substrate adsorption units. Is formed, whereby stable substrate adsorption can be realized.

Taking the specific embodiment shown in FIGS. 2 and 3 as an example, FIG. 2 shows the cavity of the substrate suction unit 102 communicating with the tangential hole 102-1, and FIG. 3 shows the substrate suction unit 103. The cavity communicates with the tangential hole 103-1. The compressed gas is introduced into the cavity of the substrate adsorption unit 102 and the cavity of the substrate adsorption unit 103, respectively, through the ventilation passage, the tangential hole 102-1 and the tangential hole 103-1, respectively, and the cavity of the substrate adsorption unit 102, respectively. A rotating swirl is formed in the portion and in the cavity of the substrate suction unit 103, and the substrate is sucked by utilizing the pressure difference generated by the rotating swirl. The substrate may be a plurality of types of semiconductor wafer substrates and the like.

As one specific embodiment, the substrate suction unit (including the substrate suction unit 102 and the substrate suction unit 103) is provided with a cylindrical cavity, and is located at the top of the cavity and at the same height. Is provided with at least two tangential holes communicating with the cavity, and the tangential holes are in contact with the inner wall of the corresponding cylindrical cavity. Specifically, in the embodiment shown in FIG. 2, two tangential direction holes 102-1 are provided at the uppermost portion of the cavity portion of the substrate suction unit 102, and the tangential direction hole 102-1 is the cavity of the substrate suction unit 102. Two tangential holes 103-1 are provided at the uppermost part of the cavity of the substrate suction unit 103 in contact with the inner wall of the cylindrical cavity of the portion, and the tangential hole 103-1 is the cylinder of the cavity of the substrate suction unit 103. It is in contact with the inner wall of the hollow part. The plurality of substrate adsorption units (including the plurality of substrate adsorption units 102 and the plurality of substrate adsorption units 103) are uniformly distributed, and the total number of substrate adsorption units is an even number, for example, 6 or 8. The tangential holes of the two adjacent substrate adsorption units may be arranged alternately counterclockwise and clockwise, and the directions of the rotary swirls formed in the cavity by the adjacent substrate adsorption unit 102 and the substrate adsorption unit 103 are different. , Left-handed rotating vortex and right-handed rotating vortex, or vice versa.

As shown in FIG. 4, the compressed gas enters the cavity from the uppermost portion of the substrate adsorption unit along the tangential hole, and forms a rotating spiral under the restraint of the wall surface of the cylindrical cavity. The gas rotating at high speed drives the gas in the central region of the cavity to rotate, and causes it to fly to the wall surface by the action of centrifugal force, thereby generating a negative pressure region in the center of the cavity. The silicon wafer placed below the substrate suction unit receives a vertically upward suction force due to the action of negative pressure, and realizes the suction process. Due to the action of pressure, the gas spirals downwards and is discharged radially at the bottom of the substrate adsorption unit, thereby forming an air cushion between the outer circumference of the silicon wafer and the suction cups, and finally non-slip. Achieves contact substrate adsorption. The substrate suction unit uses Bernoulli's principle to generate a pressure difference using the low pressure formed by the rotating swirl to achieve lifting force, and the swirl formed by a single substrate suction unit rotates the wafer. Since it may be invited, the substrate suction unit adopts a central rotational symmetry distribution and is used to balance the rotational forces between them.

In order to suck the substrate more stably, the openings of the cavities of the plurality of substrate suction units are uniformly distributed at the bottom of the pickup plate device along the circumferential direction.

In one embodiment, the ventilation passage uniformly transports the compressed gas to the tangential holes of each substrate adsorption unit, and specifically, the compressed gas is uniformly transported to the tangential holes 102-1 of each substrate adsorption unit 102 and each substrate adsorption unit. It can be uniformly transported to the tangential hole 103-1 of 103.

The distance between the inlet of the ventilation passage and each substrate adsorption unit is equal, so that the compressed gas is tangentially holed in each substrate adsorption unit (specifically, the compressed air is tangentially hole 102-1 of the substrate adsorption unit 102). And to the tangential hole 103-1 of the substrate adsorption unit 103).

The ventilation passage can be realized as a plurality of concrete structures. For example, the ventilation passage includes a plurality of first closed passages 105, and the plurality of first closed passages 105 are provided in a one-to-one correspondence with a plurality of substrate suction units (including the substrate suction unit 102 and the substrate suction unit 103). Be done. The first ends of the plurality of first closed passages 105 communicate with the tangential holes of the corresponding substrate suction units, the second ends of the plurality of first closed passages 105 communicate with each other, and the plurality of first closed passages. Reference numerals 105 are distributed radially around the center of the bottom surface of the pickup plate device. The compressed gas is introduced via the second end of the first closed passage 105 and is uniformly transported through the first closed passage 105 to the corresponding tangential hole of the substrate adsorption unit. The length of each first closed passage 105 is the same, thereby achieving an equal distance between the inlet of the ventilation passage and each substrate suction unit.

In the present invention, there is no particular limitation on how the gas is supplied to the first closed passage 105. Optionally, the vent passage further includes a second closed passage 104. The second closed passage 104 is located at the center of the pickup plate device, and the extending direction (that is, the axial direction) of the second closed passage 104 coincides with the thickness direction of the pickup plate device. It should be understood that the outlet of the second closed passage 104 is the entrance of the ventilation passage, and the second ends of the plurality of first closed passages 105 all communicate with the second closed passage 104, thereby allowing the compressed gas to pass through. 2 Evenly distributed to a plurality of first closed passages 105 via the closed passage 104.

In the present invention, how to supply the gas to the second closed passage 104 is not particularly limited, and the ventilation passage further includes the third closed passage 106, and the opening at one end of the third closed passage 106 is open. Is formed as the entrance to the ventilation passage. The third closed passage 106 is located at the edge of the pickup plate device, and the opening at the other end of the third closed passage 106 communicates with the second closed passage 104. The number of the third closed passages 106 may be plural.

A plurality of substrate adsorption units (multiple substrate adsorption units) can be selectively provided in the pickup plate apparatus in order to provide the pickup plate apparatus with a plurality of substrate adsorption units and to supply gas to each substrate adsorption unit through the ventilation passage of the pickup plate apparatus. The substrate adsorption unit 102 and the substrate adsorption unit 103) are provided with a plurality of closed cavities corresponding to each other on a one-to-one basis. Each of the plurality of substrate adsorption units (including the substrate adsorption unit 102 and the substrate adsorption unit 103) is provided in the corresponding closed cavity, and the plurality of substrate adsorption units (including the substrate adsorption unit 102 and the substrate adsorption unit 103) are provided. A plurality of annular closed passages 130 provided in a one-to-one correspondence are formed. Here, the first end of the first closed passage 105 communicates with the annular closed passage 130, whereby the compressed gas is tangentially holed in the corresponding substrate adsorption unit via the first closed passage 105 and the annular closed passage 130. To transport to.

As shown in FIG. 5, the pickup plate device includes a base plate 101 and an adapter plate device 121, the bottom surface of the base plate 101 is formed as the bottom surface of the pickup plate device, and the adapter plate device 121 can adopt a plurality of types of structures. For example, the adapter plate device 121 is provided on the surface of the base plate 101 away from the bottom surface of the base plate 101, and the adapter plate device 121 is provided along the thickness direction of the pickup plate device, the adapter base plate 110, the intermediate plate 111, and the top. Includes plate 109. The bottom surface of the adapter base plate 110 is connected to the base plate 101.

A third closed passage 106 is formed between the adapter base plate 110, the intermediate plate 111, and the base plate 101, and a second closed passage 104 is formed between the intermediate plate 111 and the top plate 109. Specifically, the third closed passage 106 has a first concave groove formed on the bottom surface of the adapter base plate 110, a third closed passage entrance penetrating the adapter base plate 110, and a third closed passage exit penetrating the adapter base plate 110. include. The third closed passage entrance communicates the first concave groove with the entrance of the ventilation passage, and a part of the base plate 101 is provided so as to face the first concave groove, thereby sealing the first concave groove. A second closed passage entrance is formed at a position where the intermediate plate 111 is connected to the adapter base plate 110. The third closed passage outlet communicates with the second closed passage entrance, the second closed passage 104 is formed in the intermediate plate 111, and the top plate 109 seals the second closed passage 104.

Optionally, the adapter plate 121 further includes a radial disc 108, which is located between the intermediate plate 111 and the base plate 101.

In an embodiment in which the adapter plate 121 includes a radiation disc 108, the first closed passage 105 is formed between the radiation disc 108, the intermediate plate 111, and the base plate 101. Specifically, a second concave groove is formed on the upper surface of the base plate 101, a second closed passage outlet is formed at a position where the intermediate plate 111 is connected to the base plate 101, and a part of the radiation disk 108 is a second. The recess is sealed, thereby forming a first closed passage 105, and the second closed passage outlet communicates the first closed passage 105 and the second closed passage 104.

Bump 101-1 is optionally provided on the bottom of the base plate, which is used to position and limit the substrate.

In the present invention, the number of bumps 101-1 is not particularly limited, but positioning and limitation may be performed on the substrate. A plurality of bumps 101-1 are provided on the bottom of the base plate so as to be selectable, and the plurality of bumps 101-1 are uniformly distributed on the bottom surface of the base plate along the circumferential direction. The plurality of bumps 101-1 are uniformly distributed on the same circumference to better position and limit the substrate.

A through hole 107 having an exhaust function is provided in the center of the pickup plate device so as to be selectable.

When moving the board, it is necessary to move the pickup plate device. In the present invention, there is no particular limitation on how the pickup plate device is moved. Optionally, the non-contact substrate operating device may further include a pickup arm 222, one end of which the pickup arm 222 is connected to a pickup plate device. A ventilation pipe is provided inside the pickup arm 222, and the ventilation pipe communicates with the ventilation passage, thereby supplying gas to the ventilation passage (selectably, the gas is a compressed gas). As described above, in a specific embodiment in which the pickup plate device includes the base plate 101 and the adapter plate device 121, the outlet of the ventilation pipe may communicate directly with the second closed passage 104.

Hereinafter, how to supply gas to the substrate adsorption unit 102 and the substrate adsorption unit 103 of the pickup plate device via the pickup arm 222 to realize non-contact transfer of the substrate will be described. It is connected to the compressed gas source via a ventilation pipe provided inside the pickup arm 222, and the compressed gas enters the second closed passage 104 via the third closed passage 106 and passes through the central hole of the second closed passage 104. It uniformly enters the first closed passage 105 and reaches the annular closed passage 130 in which the substrate suction unit is located, whereby all the airflows that have entered the tangential holes of each substrate suction unit are made the same, and finally formed. The magnitude of the lifting force is the same, and the substrate is not adsorbed while tilted. At the same time, the plurality of substrate suction units 102 and 103 are centered and uniformly and symmetrically distributed, and the intake port of the substrate suction unit (that is, the tangential hole of the substrate suction unit) is also symmetrically distributed, and the generated rotational force is generated. However, since they cancel each other out, the substrate does not rotate and the positioning of the substrate in the transport process is ensured.

In the present invention, there is no particular limitation on how a plurality of substrate suction units are provided on the pickup plate device having the base plate 101 and the adapter plate device 121. In the specific embodiment shown in FIG. 1, the substrate suction unit 102 and the substrate suction unit 103 are fitted between the radiation disk 108 of the adapter plate 121 and the base plate 101 to form an annular closed passage 130.

Hereinafter, how the substrate adsorption unit 102 and the substrate adsorption unit 103 are fitted between the radiation disk 108 and the base plate 101 will be briefly described. As shown in FIG. 5, a plurality of first accommodating holes are formed on the radial disk 108, a plurality of second accommodating holes are provided on the base plate 101, and the first accommodating hole, the second accommodating hole, and the substrate adsorption unit are provided. The three parties are provided in a one-to-one correspondence, the first accommodating hole communicates with the corresponding second accommodating hole to form a closed cavity, and the corresponding substrate adsorption unit is accommodated in the closed cavity. .. The annular closed passage also has a one-to-one correspondence with the substrate adsorption unit, and the annular closed passage is located between the corresponding first accommodating hole and the corresponding second accommodating hole.

The top of the substrate adsorption unit is provided in the corresponding first accommodating hole, the middle portion of the substrate adsorption unit is located in the corresponding annular closed passage 130, and the bottom of the substrate adsorption unit is in the corresponding second accommodating hole. Provided.

In one embodiment, an epitaxial reactor is provided and includes a non-contact substrate operating device in any of the above embodiments.

In the non-contact type substrate operating device provided by the above embodiment, the substrate adsorption units are uniformly distributed, and the compressed gas is uniformly transported to each substrate adsorption unit, so that the lifting force formed by each substrate adsorption unit is formed. Are the same, the generated rotational forces can cancel each other out, eliminate the phenomenon of self-rotation and tilt of the board, improve the accuracy of the equipment, realize board pick-and-place and board transfer in the floating state, It is possible to effectively avoid problems such as dirt and scratches given to the surface of the board by the board transfer tool in the process of picking and placing the board, and improve the quality of the product. Damage can be effectively prevented, the substrate can be picked and placed at high temperatures, the cooling time for cooling the equipment can be shortened, and the productivity of the equipment can be improved.

Unless otherwise stated, if any of the technical solutions disclosed in the present invention is disclosed, the disclosed numerical ranges are all suitable numerical ranges. Those skilled in the art should understand that a suitable numerical range is simply a numerical value having a relatively significant or representative technical effect among many feasible numerical values. Since the numerical values are relatively large and cannot be listed one by one, the present invention discloses a part of the numerical values to exemplify the technical solution of the present invention, and the above-listed numerical values are restrictions on the scope of protection of the present invention. Should not be configured.

At the same time, the present invention discloses or relates to parts or structures that are fixedly connected to each other, unless otherwise stated, the fixed connection shall be a removable fixed connection (eg, using bolts or screws). Can be understood as non-removable fixed connections (eg, riveting, welding), and of course, mutual fixed connections using an integral structure (eg, using a casting process). It may be replaced by (manufactured by integral molding) (except if apparently the integral molding process cannot be adopted).

Further, unless otherwise stated, the meaning of the term for indicating the positional relationship or shape applied to any of the technical solutions disclosed in the present invention is similar to, similar to, or similar to that of the term or shape. including. Any member provided by the present invention may be an assembly of a plurality of independent components, or may be a single member manufactured by an integral molding process.

The above examples are merely for explaining the technical solution of the present invention, and the present invention has been described in detail with reference to preferred examples without limiting the present invention. It should be understood that specific embodiments of the present invention can still be modified or some of the technical features can be equivalently replaced, all of which are not deviating from the spirit of the technical solutions of the present invention. Is included in the scope of the technical solutions to which the present invention requires protection.

The description of the present invention is provided for illustration and explanation purposes only, and the present invention is not limited to the forms described or disclosed without omission. Many changes and changes will be apparent to those skilled in the art. Selecting and describing Examples better describes the principles and practical applications of the present invention, and various examples with various modifications that can be applied to a particular application by those skilled in the art. The purpose is to be able to design.

101 Base plate 102 Substrate suction unit 102-1 Tangent direction hole 103-1 Tangent direction hole 104 Second closed passage 105 First closed passage 106 Third closed passage 108 Radiant disk 111 Intermediate plate 121 Adapter plate device 130 Circular closed passage 222 Pickup arm

Claims (16)

A non-contact substrate operating device, the non-contact substrate operating device includes a pickup plate device and a plurality of substrate suction units (102, 103) provided on the bottom surface of the pickup plate device.
The plurality of the substrate adsorption units (102, 103) are distributed symmetrically in the center, and each of the substrate adsorption units (102, 103) is provided with a cavity, and each of the substrate adsorption units (102, 103) is provided with a cavity. Are provided with a plurality of tangential holes (102-1, 103-1) in contact with the inner surface of the side wall of the cavity.
A ventilation passage is provided inside the pickup plate device, and the ventilation passage communicates with all the tangential holes (102-1, 103-1), where the ventilation passage passes through the entrance of the ventilation passage. The gas received is introduced into the corresponding cavity through the tangential holes (102-1, 103-1), whereby the gas forms a rotating swirl in the corresponding cavity and the corresponding cavity. A non-contact substrate operating device characterized in that it is used to attract the substrate by forming a pressure difference at an opening of a cavity. The ventilation passage includes a plurality of first closed passages (105), and the plurality of first closed passages (105) are provided in a plurality of the substrate suction units (102, 103) in a one-to-one correspondence. The first end of the first closed passage (105) communicates with the tangential hole of the corresponding substrate suction unit, and the second ends of the plurality of first closed passages (105) communicate with each other. The plurality of first closed passages (105) are distributed radially around the center of the bottom surface of the pickup plate device, where the compressed gas is the second of the plurality of first closed passages (105). It is characterized in that it is introduced via the end and transported through the plurality of first closed passages (105) to the corresponding tangential holes (102-1, 103-1) of the substrate suction unit. The non-contact board operating device according to claim 1. The ventilation passage further includes a second closed passage (104), the second closed passage (104) is located at the center of the pickup plate device, and the extension direction of the second closed passage is the thickness of the main body of the pickup plate. Along with the vertical direction, the second ends of the plurality of first closed passages (105) all communicate with the second closed passage (104), whereby the compressed gas passes through the second closed passage (104). The non-contact substrate operating device according to claim 2, wherein the non-contact substrate operating device is distributed to a plurality of the first closed passages (105). The ventilation passage further includes a third closed passage (106), wherein one end of the third closed passage (106) is formed as an entrance of the ventilation passage, and the other end of the third closed passage (106) is formed. The non-contact type substrate operating device according to claim 3, wherein the non-contact substrate operating device communicates with the second closed passage (104). The pickup plate device includes a base plate (101) and an adapter plate (121).
The adapter plate (121) includes an adapter base plate (110), an intermediate plate (111) and a top plate (109) provided along the thickness direction of the pickup plate device, wherein the adapter base plate (110). The bottom surface is connected to the base plate (101),
The third closed passage (106) penetrates the first concave groove formed on the bottom surface of the adapter base plate (110), the entrance of the third closed passage penetrating the adapter base plate (110), and the adapter base plate (110). The third closed passage entrance communicates with the first concave groove and the entrance of the ventilation passage, and a part of the base plate (101) is provided so as to face the first concave groove. A second closed passage entrance is formed at a position where the first concave groove is sealed and the intermediate plate (111) is connected to the adapter base plate (110), and the third closed passage outlet is the said. The second closed passage (104) is formed in the intermediate plate (111), and the top plate (109) seals the second closed passage (104) so as to communicate with the entrance of the second closed passage. The non-contact type board operating device according to claim 4. The adapter plate (121) further includes a radial disc (108), which is located between the intermediate plate (111) and the base plate (101), where.
A second concave groove is formed on the upper surface of the base plate (101), a second closed passage outlet is formed at a position of the intermediate plate (111) connected to the base plate (101), and the radiation disk (108). ) Seals the second concave groove, thereby forming the first closed passage (105), and the second closed passage outlet is the first closed passage (105) and the second closed passage (the second closed passage (105)). The non-contact type substrate operating device according to claim 5, wherein 104) is communicated with each other. The non-contact according to claim 5, wherein a bump (101-1) is provided on the bottom surface of the base plate, and the bump (101-1) is used for positioning and limiting the substrate. Type board operating equipment. 6. The non-contact board operating device described. A plurality of closed cavities corresponding to the plurality of substrate suction units (102, 103) on a one-to-one basis are provided in the pickup plate device, and the plurality of substrate suction units (102, 103) correspond to each of the plurality of closed cavity portions. A plurality of annular closed passages (130) provided in the closed cavity and provided in a one-to-one correspondence with the plurality of substrate adsorption units (102, 103) are formed, and here, the first closed passage (1st closed passage). The first end of 105) communicates with the annular closed passage (130), whereby the compressed gas is passed through the first closed passage (105) and the annular closed passage (130) to correspond to the substrate adsorption unit. The non-contact type substrate operating apparatus according to any one of claims 2 to 8, wherein the device is transported to the tangential hole of the above. The non-contact substrate operating device according to any one of claims 2 to 8, wherein a through hole (107) having an exhaust function is provided at the center of the pickup plate device. The non-contact substrate operating device further includes a pickup arm (222), one end of the pickup arm (222) is connected to the pickup plate device, a ventilation pipe is provided inside the pickup arm, and the ventilation pipe is provided. The non-contact substrate operating device according to any one of claims 1 to 8, wherein the gas is supplied to the ventilation passage by communicating with the ventilation passage. The distance between the inlet of the ventilation passage and each of the substrate adsorption units (102, 103) is equal, thereby allowing gas to flow into the tangential holes (102-1, 103-1) of each of the substrate adsorption units (102, 103). ), The non-contact type substrate operating device according to claim 1. The cavity in the substrate suction unit (102, 103) is a cylindrical cavity, and a plurality of tangential holes (102-1, 103-1) are formed in the same cavity in the same substrate suction unit. The non-contact type substrate operating apparatus according to any one of claims 1 to 8, wherein a plurality of tangential holes are located at the same height in communication with the cavity at the uppermost portion of the above. 13. The non-contact board operating device described. The non-one of claims 1 to 8, wherein the openings of the cavities of the plurality of substrate suction units are uniformly distributed at the bottom of the pickup plate device along the circumferential direction. Contact type board operation device. An epitaxial reactor including a non-contact substrate operating apparatus, wherein the non-contact substrate operating apparatus is the non-contact substrate operating apparatus according to any one of claims 1 to 15. ..

Images