TWM649063U - Carrying device for use in semiconductor fabrication - Google Patents

Abstract

A carrying device used in semiconductor manufacturing processes is used to set a wafer, and includes a carrying platform, a flow channel unit, and an air hole unit. The bearing platform has a bearing surface and a bottom surface opposite to each other. The flow channel unit is located between the bearing surface and the bottom surface, and has two oblique flow channels that intersect at an intersection point, and a straight flow channel that passes through the intersection point. The air hole unit has a plurality of air outlets distributed at equal intervals and penetrating the load-bearing surface, and two air inlets corresponding to both sides of the straight flow channel and penetrating the bottom surface, and the air outlets and air inlets are respectively connected with the inclined The vertical flow channel is connected to the straight flow channel. By setting up two air inlets and evenly distributed air outlets, the air flow derived from the air outlets is evenly distributed on the bearing surface, and is not easily deflected when the wafer is lifted, thus avoiding alignment between the wafer and the photomask. deviation from expectations.

Description

Carrier device for semiconductor manufacturing process

The present invention relates to a carrying device, in particular to a carrying device used in semiconductor manufacturing processes.

With the sophistication and complexity of the semiconductor manufacturing process, as long as there is a slight deviation in the circuit patterns formed on different build-up layers, it will cause abnormal electrical connections between the front and rear build-up layers, causing the semiconductor elements to be disconnected or short-circuited. Therefore, it is used to generate circuits. The pattern lithography process is crucial in the entire semiconductor manufacturing process.

Referring to Figure 1, currently, in the photolithography process, a wafer (not shown) is usually placed on a carrier 1, and a photomask of a photomask (not shown) is placed during the process. Pattern pairs are positioned over the wafer to form circuit patterns. The carrying device 1 generally includes a carrying platform 11 for placing the wafer, a plurality of air outlets 12 formed on the top surface of the carrying platform 11, and a gas outlet formed on the bottom surface of the carrying platform 11 and connected with the air outlets 12. The air inlet 13 and a plurality of openings 14 form the bearing platform 11 and are used for back-to-wafer alignment. When performing the lithography process, an air flow is first introduced from the air inlet 13, and the air flow is blown out through the air outlets 12, so that the wafer placed on the top surface of the carrying platform 11 is lifted upward in accordance with the air flow. The wafer is closer to the photomask located above.

However, during the process of the airflow lifting the wafer, since the carrying device 1 is only provided with a single air inlet 13 for introducing the airflow, the airflow can be introduced uniformly and the openings 14 are arranged. , as well as problems such as inconsistent diameters and uneven distribution positions of the air outlets 12, resulting in uneven distribution of airflow used to lift the wafer, so the wafer is prone to skew during the lifting process, causing the wafer to Displacement during the lithography process causes the alignment between the photomask and the wafer to deviate from expectations.

Therefore, the purpose of the present invention is to provide a carrying device for semiconductor manufacturing processes to prevent the alignment between the wafer and the photomask from shifting during the manufacturing process.

Therefore, the new type of carrying device for semiconductor manufacturing is used to set a wafer for a photolithography process, and includes a carrying table, a channel unit, and an air hole unit.

The carrying platform has a carrying surface and a bottom surface opposite to each other, and the carrying surface is used for placing the wafer.

The flow channel unit is located between the bearing surface and the bottom surface, and has two oblique flow channels that are strip-shaped and diagonally distributed and intersect each other at an intersection point, and an oblique flow channel that is between the oblique flow channels and passes through the The straight flow channels at the intersection point, and the oblique flow channels and the straight flow channels are connected to each other through the intersection point.

The air hole unit has a plurality of air outlets penetrating the bearing surface and two air inlets penetrating the bottom surface. The air outlets are distributed at equidistant intervals and are corresponding to the positions of the oblique flow channels and are in contact with the oblique flow channels. Connected to the straight flow channel, the air inlets are correspondingly located at both sides of the straight flow channel and connected to the straight flow channel.

The function of this new model is that by providing two air inlets, an air flow can be more evenly supplied to the bearing platform, and the air flow is introduced into the oblique flow channels through the intersection point and then exported from the equidistantly spaced air outlets. The airflow used to lift the wafer is more evenly distributed, which can prevent the wafer from positioning during the lifting process, and facilitates the alignment between the wafer and the photomask.

Before the present invention is described in detail, it should be noted that similar components are represented by the same numbers in the following description. The relevant technical contents, features and functions of the present invention will be clearly presented in the following detailed description of the embodiments with reference to the drawings. In addition, it should be noted that the drawings of the present invention only represent the relative structure and/or positional relationship between components, and are not related to the actual size of each component.

Referring to Figures 2 and 3, an embodiment of the new carrying device 200 for semiconductor processing is used to set a wafer 101 for a lithography process, and includes a carrying table 2, a channel unit 3, and an air hole unit. 4. A groove unit 5 and a fixing unit 6. 3 is a schematic side view showing the wafer 101 and a photomask 102 disposed on the carrier device 200 .

The carrying platform 2 has a carrying surface 21 and a bottom surface 22 opposite to each other. The carrying surface 21 is used for placing the wafer 101 . In this embodiment, the bearing platform 2 is not provided with an opening for wafer back alignment (as shown in FIG. 1 ).

The flow channel unit 3 is located between the bearing surface 21 and the bottom surface 22 and has two oblique flow channels 31 that are strip-shaped and diagonally distributed and intersect each other at an intersection point 33, and a channel between the oblique flow channels. 31 and pass through the intersection 33 , and the oblique flow channels 31 and the straight flow channel 32 are connected to each other through the intersection 33 .

The air hole unit 4 has a plurality of air outlet holes 42 penetrating the bearing surface 21 and two air inlet holes 41 penetrating the bottom surface 22 . The air inlets 41 are correspondingly located on both sides of the straight flow channel 32 and are connected with the straight flow channel 32 for introducing an air flow from the bottom surface 22 into the straight flow channel 32 . The air outlets 42 are distributed at equal intervals on the bearing surface 21 , and are disposed corresponding to the positions of the oblique flow channels 31 and connected with the oblique flow channels 31 for discharging the airflow from the bearing surface 21 Export externally. Preferably, the air outlets 42 are symmetrically distributed on the bearing surface 21 .

In this embodiment, the air hole unit 4 has thirteen air outlets 42 with the same diameter as an example, but the number thereof is not limited to this.

The groove unit 5 has two oblique grooves 51 formed downwardly from the bearing surface 21 and corresponding to the oblique flow channels 31 , and a plurality of concentric annular grooves 51 formed downwardly from the bearing surface 21 . Distributed annular grooves 52. The air outlets 42 are correspondingly arranged on the oblique grooves 51 .

It should be noted that the number and shape of the grooves of the groove unit 5 can be different according to needs, and are not limited to the above examples. In some embodiments, the carrying device 200 may not be provided with the groove unit 5 .

The fixing unit 6 includes a support member 61 disposed on the periphery of the bearing platform 2 , a plurality of fixing members 63 disposed on the support member 61 , and a plurality of vacuum suction members 62 disposed on the support member 61 . Among them, the height of the supporting members 61 is higher than the height of the carrying surface 21 of the carrying platform 2, and is used to support the photomask 102 so that it is placed above the wafer 101. The vacuum adsorbing members 62 are used to evacuate air. A negative pressure is formed between the support member 61 and the photomask 102 to fix the photomask 102 on the support member 61. The fixing members 63 are used to sandwich the photomask 102 to further avoid The mask 102 is shifted.

During use, the wafer 101 is first placed on the carrying surface 21, the photomask 102 is placed on the support 61 and aligned with the wafer 101, and after alignment, the photomask 102 is adsorbed by the vacuum The parts 62 and the fixing parts 63 cooperate to fix the photomask 102 to prevent the photomask 102 from shifting during the manufacturing process; then, the airflow is introduced from the air inlets 41 on the bottom surface 22 of the bearing platform 2, so that the airflow is along the The straight flow channel 32 flows into the oblique flow channels 31 from the intersection 33 and is led out from the air outlets 42 connected with the oblique flow channels 31, and can be disposed on the bearing surface 21 The wafer 101 is lifted upward so that the wafer 101 can be closer to the photomask 102 .

Among them, since the air inlet holes 41 are respectively located on both sides of the straight flow channel 32 and are symmetrically distributed, the air flow can be evenly introduced into the bearing platform 2 and evenly flow into the oblique flow channels from the intersection 33 31, the apertures of the air outlets 42 are consistent and equidistantly spaced on the bearing surface 21 corresponding to the oblique flow channels 31, so that the airflow can be evenly directed outward from the air outlets 42, so as to Steadyly lift the wafer 101 to reduce the uneven flow distribution of the blown air flow that causes the wafer 101 to be skewed when it is lifted, thereby preventing the wafer 101 and the photomask 102 from being skewed. The alignment deviates from expectations.

To sum up, the new carrying device 200 utilizes the two symmetrically distributed air inlets 41 and the equidistantly spaced air outlets 42 to enable the air flow to be evenly introduced and exported, so that the air flow can be stabilized on the ground. Lifting the wafer 101 prevents the wafer 101 from being deflected during the lifting process, and the configuration of the fixing members 63 and the vacuum suction members 62 can also prevent the photomask 102 from being deflected during the process. The movement is beneficial to the alignment between the wafer 101 and the photomask 102, so the purpose of cost-effectiveness can indeed be achieved.

However, the above are only examples of the present invention, and should not be used to limit the scope of the present invention. All simple equivalent changes and modifications made based on the patent scope of the present invention and the content of the patent specification are still within the scope of the present invention. Within the scope covered by this new patent.

101:wafer 102: Photomask 200: Carrying device 2: Bearing platform 21: Bearing surface 22: Bottom surface 3:Flower unit 31: Oblique flow channel 32: Straight flow channel 33:Intersection point 4: Stomatal unit 41: Air inlet hole 42:Exhaust hole 5:Trench unit 51: oblique groove 52: Annular groove 6: Fixed unit 61:Support 62: Vacuum adsorption parts 63: Fixtures

Other features and functions of the present invention will be clearly presented in the embodiments with reference to the drawings, in which: Figure 1 is a schematic top view, illustrating an existing carrying device for carrying wafers; Figure 2 is a schematic top view, Describe an embodiment of the new type of carrier device for semiconductor manufacturing processes; and FIG. 3 is a schematic side view illustrating the side view structure of the carrier device of this embodiment provided with a wafer and a photomask.

200: Carrying device

2: Bearing platform

21: Bearing surface

3:Flower unit

31: Oblique flow channel

32: Straight flow channel

33:Intersection point

4: Stomatal unit

41: Air inlet hole

42:Exhaust hole

5:Trench unit

51: oblique groove

52: Annular groove

6: Fixed unit

61:Support

62: Vacuum adsorption parts

63: Fixtures

Claims (5)

A carrying device for semiconductor manufacturing processes, used to set a wafer for a photolithography process, including: A carrying platform has a carrying surface and a bottom surface facing each other, and the carrying surface is used to place the wafer; A flow channel unit is located between the load-bearing surface and the bottom surface, and has two oblique flow channels that are strip-shaped and diagonally distributed and intersect each other at an intersection point, and an oblique flow channel that is between the oblique flow channels and passes through the The straight flow channels at the intersection point, and the oblique flow channels and the straight flow channels are connected to each other through the intersection point; and An air hole unit has a plurality of air outlets penetrating the bearing surface and two air inlets penetrating the bottom surface. The air outlets are distributed at equidistant intervals and are located correspondingly to the positions of the oblique flow channels and the The oblique flow channels are connected, and the air inlets are correspondingly located on both sides of the straight flow channel and connected with the straight flow channel. The carrying device for semiconductor manufacturing process as described in claim 1, further comprising a fixing unit for placing a photomask above the wafer, including a device provided on the periphery of the carrying platform and used to support the photomask. a support member, and a plurality of fixing members provided on the support member and used to hold the photomask. The carrier device for semiconductor manufacturing process according to claim 2, wherein the fixing unit further includes a plurality of vacuum suction members disposed on the support member for fixing the photomask. The carrier device for semiconductor manufacturing process according to claim 1, further comprising a trench unit with two oblique trenches formed downwardly from the carrier surface and corresponding to the positions of the oblique flow channels, and a plurality of Annular grooves are formed downward from the bearing surface and distributed in a concentric ring. The carrying device for a semiconductor manufacturing process as claimed in claim 1, wherein the apertures of the air outlets are the same as each other.