JP2007243137A - Ejector pin module for chip take-out assembly - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an ejector pin module capable of lifting a chip evenly without chip slant and ensuring high convenience at maintenance. <P>SOLUTION: This ejector pin module comprises an ejector pin block 51, a connection block 53 and multiple ejector pins 52. The connection block 53 is formed above the ejector pin block 51 and multiple ejector pins 52 are formed on the connection block 53. A vertex 522 in each ejector pin 53 is provided with a vertex edge 5221 and a vertex edge 5221 in each ejector pin 52 is positioned at the same height. In this way, each ejector pin 52 and a chip 10 form a line contact, so that multiple line contacts form a flat planar contact. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to separation of a kind of chip and dicing tape. In particular, it relates to an ejector pin module of a kind of chip take-out mechanism.

  After the wafer is cut, a die attach process is performed. At this time, the chips (or die) are completely separated from each other and are independently adhered to a dicing tape (UV tape or blue tape) having viscosity. In die sort, when a chip is sucked and taken out, a vacuum suction nozzle is sucked and taken out from the chip. At the same time, the lower part of the dicing tape is subjected to the push-up action of the ejector pin, and the chip is taken out from the dicing tape. Furthermore, the chip is placed on a die pad through a mechanical operation.

  In the known technology of the chip take-out mechanism, the main points are to improve the point that the chip is easily ruptured and to separate the chip and the dicing tape more efficiently, but the chip take-out mechanism with many ejector pins is The tip can easily be improved with a single ejector pin. That is, the surrounding ejector pins perform the first stage preliminary ejector, and the central ejector pins perform the second stage ejector. The two-stage take-out mechanism causes the take-out stand to perform the first-stage ejector by the power source, and the ejector pin performs the second-stage take-out. A first stage separation is performed using a vacuum, and a protruding platform having an area smaller than the chip area is placed below the dicing tape. When the platform is evacuated, the dicing tape located on the outer edge of the platform is released, which is advantageous for the second stage separation of the ejector pins.

  As shown in FIG. 1 which is a side sectional view of a known chip take-out mechanism, a plurality of vacuum holes 24 are provided in the vacuum chamber 22. The chip 10 is adhered onto the dicing tape 12, and the dicing tape 12 is set on the vacuum chamber 22. Thus, the vacuum chamber 22 exerts a vacuum suction force with respect to the dicing tape 12 through the vacuum hole path 24, and the chip 10 is localized at an appropriate position.

  Further, a number of ejector pins 20 thereon are raised through the ejector pin base 18, and the dicing tape 12 is pushed up to a certain altitude through the corresponding vacuum holes 24, and the dicing tape 12 and the chip 10. Are separated. At this time, the vacuum sucker 14 located above the chip 10 picks up the chip 10 through a vacuum suction nozzle 16 installed thereon, and further separates the chip 10 and the dicing tape 12.

As shown in FIG. 2, the arrangement of the tip 10, the ejector pin 20, and the ejector pin base 18 is such that the tip 10 is pushed up by the four ejector pins 20, and the single ejector pin and the dicing tape 12 are brought into a single point contact. In comparison, since the number of contact points increases to four, the pushing stress is applied to the dicing tape 12 and the chip 10 on average.
However, the shape and arrangement of the ejector pins are not suitable for a chip having a smaller size, particularly a chip having a large vertical / horizontal ratio difference.

  Next, in FIGS. 3 and 4, the length of the driver chip 10 used for the liquid crystal display is usually 8/10/12 mm, but its width is 1 / 0.8 / 0.5 mm. It is a display figure of a mode that a well-known ejector pin is used when a ratio difference is large. Since the tip 10 has a very narrow width and approaches the diameter of the ejector pin 20, the ejector pins 20 cannot be arranged in two rows.

  Further, as shown in FIG. 5, due to the shape of the ejector pin 20, when the tip 10 is pushed out of the dicing tape 12 by the ejector pin 20, the tip 10 may stick to the vacuum sucker 14 when it is inclined. The vacuum suction nozzle 16 cannot reliably suck the chip 10.

  In addition, the known technology manufactures the ejector pin base 18 and the ejector pin 20 separately, and then assembles both into an ejector pin module. However, since there are manufacturing errors and assembly errors in the component parts, Various error values occur at the height of each ejector pin 20. For this reason, the extruded chip 10 is inclined, and this causes the vacuum sucker 14 not to be reliably adsorbed.

  Therefore, the improved structure of the ejector pin module is submitted, the height of each ejector pin is made to be the same platform, the tip is pushed up smoothly, the contact area when the ejector pin pushes up the tip is appropriately expanded, and the tip is pushed It prevents the tilting when it is raised, effectively improves the vacuum suction effect and stability, and maintains the convenience of work.

  The main object of the present invention is to provide an ejector pin module for a chip take-out mechanism. It mainly provides the ejector pin module of the chip take-out mechanism, and by pushing the surface area in the push-up process by appropriately increasing the contact area between the ejector pin and dicing tape or chip, the chip of the object to be pushed up Can be prevented from tilting, and the effect and stability of vacuum adsorption can be improved efficiently.

  The next object of the present invention is to provide an ejector pin module of a chip take-out mechanism, wherein the connection base and the ejector pin are processed by an integral molding method, and the height of each ejector pin is on the same plane, simultaneously with the dicing tape or chip. It is possible to make contact, so that the chip can be pushed flat.

  Another object of the present invention is to provide an ejector pin module of a chip take-out mechanism, and the ejector pin, the connection base, and the ejector pin base are processed and manufactured by an integral molding method, thereby improving the convenience of maintenance. be able to.

  That is, it provides an ejector pin module of a chip removal mechanism, and includes an ejector pin base, a connection base, and a plurality of ejector pins, the connection base being formed above the ejector pin base, and the plurality of ejector pins being the connection base. The top edge of each ejector pin is formed with a vertex edge, and the top edge of each ejector pin is located at the same height, so that in the push-up process, each ejector pin and tip are in line contact. The flat surface contact is formed by the plurality of line contacts, and the chip can be pushed up flat. At the same time, the integrally formed ejector pin module is convenient and efficient in use and maintenance.

The invention of claim 1 includes an ejector pin base and a plurality of ejector pins.
One end of each ejector pin is installed on the ejector pin base, the opposite end is provided with a vertex edge, and the plurality of vertex edges are located on a plane at the same height,
Thus, when the ejector pin base interlocks the plurality of ejector pins and pushes up the object to be pushed up, each vertex edge pushes up the object to be pushed up in a line contact manner, and the plurality of ejector pins. Is an ejector pin module of a chip take-out mechanism characterized in that the object to be pushed up is pushed up by a surface contact method.
According to a second aspect of the present invention, in the ejector pin module of the chip removal mechanism according to the first aspect, the ejector pin module further includes a connection base, the connection base is located on the ejector pin base, and the connection base and the A plurality of ejector pins are integrally formed as an ejector pin module of a chip take-out mechanism.
According to a third aspect of the present invention, in the ejector pin module of the chip take-out mechanism according to the first aspect, the shape of the vertex edge of the vertex portion of the ejector pin is one of a straight line, a curved line, and a combination thereof. The ejector pin module of the chip take-out mechanism is characterized by this.
According to a fourth aspect of the present invention, there is provided the ejector pin module of the chip ejecting mechanism according to the first aspect, wherein the vertex edges of the plurality of ejector pins are parallel to each other. It is said.
According to a fifth aspect of the present invention, there is provided an ejector pin module for a chip ejecting mechanism according to the first aspect, wherein the ejector pin includes a root on a rectangular column and a triangular spire apex. It is a module.

  The present invention provides an ejector pin module for a chip take-out mechanism, and by appropriately increasing the contact area between the ejector pin and a dicing tape or chip, it is pushed by a surface contact method in the push-up process, and the chip of the object to be pushed up Can be prevented from tilting, and the effect and stability of vacuum adsorption can be improved efficiently.

As shown in FIG. 6 which is an embodiment of the ejector pin module of the present invention, the ejector pin module 5 is divided into three parts: an ejector pin base 51, a plurality of ejector pins 52, and a connection base 53.
The ejector pin module 5 is manufactured by an integral molding method such as line cutting or module molding. When the line cutting method is adopted, the ejector pin 52 and the connection base 53 are cut with the same parameters by the same block material, so that there is almost no manufacturing error. The materials used are stainless steel SUS440, medium carbon steel S45C, Marcagit, etc. In other embodiments, other suitable hardness metals or non-metallic materials can be used.
The shape of the ejector pin base 51 is not limited. In this embodiment, the shape is cylindrical. The diameter of the ejector pin base 51 is substantially equal to the length of the tip, and a connection mechanism (not shown) is provided on the back surface facing the ejector pin 52. Secure with the machine base.
The connection base 53 is formed on the ejector pin base 51 below the plurality of ejector pins 52, and the shape of the connection base 53 is a rod shape, a flat plate shape, a staircase shape, or another change shape. The side surface of the connection base 53 and the ejector pin base 51 can form a guide angle 531. The height H2 of the connection base 53 can be adjusted, and the mechanical strength of the ejector pin 52 can be enhanced. A plurality of ejector pins 52 are formed above the connection base 53, and each ejector pin 52 can be divided into an ejector pin root portion 521 and an ejector pin apex portion 522. The ejector pin root portion 521 has a length H1, a width W1, and a thickness T1, and the ejector pin apex portion 522 has a triangular shape with a bottom width W1 and a thickness T2. T2 in this embodiment is equal to T1, but T2 in other embodiments is not necessarily equal to T1. The ejector pin root portion 521 forms the connection base 53 and a guide angle 5211 to enhance the mechanical strength.
Further, since the function of the connection base 53 of the present invention is to strengthen the ejector pin 52, it can be said that it is not a necessary part if expressed strictly. In another embodiment, the ejector pin 52 can be formed directly on the ejector pin base 51.

When the ejector pin module 5 interlocks the ejector pin and pushes up a dicing tape (not shown), the apex edge 5221 of the ejector pin apex portion 522 is in line contact with the contact area of the tip 10 and the contact length thereof. Is T2. The contact area between the chip 10 and the dicing tape 12 is an important consideration. Since the pushing-up stress of the single ejector pin 52 is excessively concentrated, the chip 10 is easily ruptured, but the plurality of ejector pins 52 can disperse the stress, but if the contact area is excessive, the chip 10 and the dicing The tape is easy to separate.
Therefore, what should be explained here is that the shape of the ejector pin root portion and the ejector pin vertex portion 522 of the present invention is not limited, but the ejector pin vertex portion 522 has a vertex edge 5221 as an important feature. This is the point of forming a line contact with the chip 10. The contact length T2 is substantially equal to the width W2 of the chip 10. In one embodiment, the tip 10 has a width W2 of 0.7 mm and an ejector pin thickness T2 of 0.5 mm.
Moreover, the shape of the vertex edge 5221 of the ejector pin vertex portion 522 is not limited to a straight line, and may be a curved line. Furthermore, a part of the plurality of ejector pins 52 may be a straight line and a part may be a curved line.

At the same time, since the ejector pin base 51, the connection base 53, and the ejector pin 52 are processed by an integral molding method, errors caused by combining the respective components are avoided. Further, the machining method of the single ejector pin module 5 reduces the machining error of the single ejector pin module 5 and further improves the machining accuracy, so that the vertex edges 5221 of all the ejector pins 52 are located on the same altitude plane. Moreover, the vertex edge 5221 of all the ejector pins 52 constitutes a flat surface contact. When the ejector pin 52 pushes up the chip 10 from the dicing tape 12, the chip 10 is kept flat so that no tilting situation occurs.
As described above, the ejector pin base 51, the connection base 53, and the ejector pin 52 are processed by an integral molding method. Further, the connection base 53 and the ejector pin 52 are integrally molded, and then the ejector The pin base 51 can be combined.

  As shown in FIG. 7 which is another embodiment of the ejector pin module of the present invention, the ejector pin base 51 and the connection base are formed in the same manner as in the above embodiment, and the same parts have the same reference numerals. 4 differs from the embodiment shown in FIG. 4 in that the vertex edge 5221 of the ejector pin 52 in FIG. 4 and the width W2 of the chip 10 are parallel, but the vertex edge 5221 of the ejector pin 52 in FIG. The width W2 of this has a certain angle θ and is not parallel.

It is side surface sectional drawing of a well-known chip | tip taking-out mechanism. It is a top view of the relative position arrangement | sequence of the chip | tip of FIG. 1, an ejector pin stand, and an ejector pin. It is a top view of a mode that a chip | tip with a large vertical / horizontal ratio difference is used for a well-known ejector pin. It is a side view of a mode that the chip | tip with a large vertical / horizontal ratio difference is used for a well-known ejector pin. It is a display figure of the inclination situation which occurs when a tip with a large vertical and horizontal ratio difference is used for a known ejector pin and the tip is pushed out by the ejector pin. It is an Example figure of this invention ejector pin module. It is another Example figure of the ejector pin module of this invention.

Explanation of symbols

10 Chip 12 Dicing tape 14 Vacuum suction cup 16 Vacuum suction nozzle 18 Ejector pin base 20 Ejector pin 22 Vacuum chamber 24 Vacuum hole 5 Ejector pin module 51 Ejector pin base 52 Ejector pin 53 Connection base 521 Ejector pin root part 522 Ejector pin vertex part 531 Guide Corner 5211 guide angle 5221 vertex edge

Claims (5)

Ejector pin base, including multiple ejector pins,
One end of each ejector pin is installed on the ejector pin base, the opposite end is provided with a vertex edge, and the plurality of vertex edges are located on a plane at the same height,
Thus, when the ejector pin base interlocks the plurality of ejector pins and pushes up the object to be pushed up, each vertex edge pushes up the object to be pushed up in a line contact manner, and the plurality of ejector pins. Is an ejector pin module of a chip take-out mechanism, wherein the object to be pushed up is pushed up by a surface contact method.   2. The ejector pin module of the chip ejecting mechanism according to claim 1, wherein the ejector pin module further includes a connection base, the connection base is located on the ejector pin base, and the connection base and the plurality of ejector pins are integrally formed. An ejector pin module for a chip take-out mechanism, characterized in that   2. The ejector pin module of the chip ejecting mechanism according to claim 1, wherein the shape of the apex edge of the apex portion of the ejector pin is one of a straight line, a curved line, and a combination thereof. Ejector pin module of mechanism.   2. The ejector pin module of the chip ejecting mechanism according to claim 1, wherein the vertex edges of the plurality of ejector pins are parallel to each other.   2. The ejector pin module of the chip ejecting mechanism according to claim 1, wherein the ejector pin includes a root on a rectangular column and a triangular spire apex.

Images