CN220041830U

CN220041830U - Die bonding thimble structure and die bonding machine

Info

Publication number: CN220041830U
Application number: CN202223179831.9U
Authority: CN
Inventors: 孟浩浩; 张金刚; 孙天鹏; 张世诚
Original assignee: Shenzhen Zhouming Technology Co Ltd
Current assignee: Shenzhen Zhouming Technology Co Ltd
Priority date: 2022-11-25
Filing date: 2022-11-25
Publication date: 2023-11-17
Anticipated expiration: 2032-11-25

Abstract

The utility model relates to a die bonding thimble structure and a die bonding machine. The die-bonding thimble structure comprises a thimble body, wherein a first end face for facing a wafer is arranged on the thimble body, and a rubber layer is arranged on the first end face. The first end face facing the wafer is arranged on the thimble body, the wafer is jacked up through the first end face, stress of the thimble body on the wafer is reduced, and cracks of the wafer caused by stress concentration are avoided. In addition, the rubber layer is arranged on the surface of the first end face, and the rubber layer is abutted with the blue film, so that the first end face is in indirect contact with the blue film, and the influence of the surface roughness of the first end face on the wafer is avoided, so that the processing precision of the first end face is reduced, the process difficulty is simplified, and the processing cost of the die-bonding thimble structure is reduced; meanwhile, the rubber layer has elasticity, so that stress can be buffered, the probability of chip breakage is reduced, and the yield and efficiency of die bonding are improved.

Description

Die bonding thimble structure and die bonding machine

Technical Field

The utility model relates to the technical field of chip packaging, in particular to a die bonding thimble structure and a die bonding machine.

Background

The die bonder is key equipment in packaging processes such as LED, chip semiconductor, camera mounting and the like, and mainly comprises a material taking mechanism, a material pushing mechanism, a dispensing platform, a swing arm mechanism, a die bonder platform and a discharging mechanism. In the die bonding process, a substrate or a PCB (printed Circuit Board) is conveyed to a dispensing platform by a material taking mechanism, then the dispensing mechanism is adopted to dispense glue at the position of the substrate or the PCB, which is required to be bonded with a wafer, the substrate or the PCB is pushed to the die bonding platform by a material pushing mechanism, the wafer is placed on a wafer disc of an expander supported by a film, a swing arm mechanism moves to the position of the wafer, a thimble below the wafer moves upwards to jack the wafer, a suction nozzle on the swing arm mechanism moves downwards to suck the wafer, and finally the wafer is placed at the position of the substrate or the PCB, which is required to be bonded with the wafer, so that the bonding process of the wafer is completed.

As the wafer is fixed on the blue film through the adhesive layer, the stripping difficulty of the wafer on the blue film is increased along with the thickness of the wafer becoming smaller. The current common thimble comprises a pointed thimble and a flat thimble, the contact area of the pointed thimble to the chip is small, the stress concentration is serious, and the chip is easy to crack; the flat-head thimble has the advantages of larger contact area to the chip, small stress concentration and the like, but the flat-head surface is rough due to the high difficulty and complex process of the flat-head surface processing technology, and the rough surface is easy to scratch the blue film and damage the wafer.

Disclosure of Invention

Accordingly, it is necessary to provide a die bonding ejector pin structure and a die bonder for solving the problem of difficulty in wafer peeling during die bonding.

The utility model provides a solid brilliant thimble structure, includes the thimble body, be equipped with on the thimble body and be used for facing the first terminal surface of wafer, be equipped with the rubber layer on the first terminal surface.

According to the die-bonding thimble structure, in the use process, the die-bonding thimble structure moves towards the direction close to the wafer, and because the elastic modulus difference between the blue film on the wafer and the wafer is large, when the thimble body jacks up the blue film upwards, the blue film is deformed, the edge of the wafer is separated from the blue film, and finally the wafer is sucked from the upper side of the wafer through the suction nozzle, so that the wafer and the blue film are completely separated. The first end face facing the wafer is arranged on the thimble body, the wafer is jacked up through the first end face, stress of the thimble body on the wafer is reduced, and cracks of the wafer caused by stress concentration are avoided. In addition, the rubber layer is arranged on the surface of the first end face, and the rubber layer is abutted with the blue film, so that the first end face is in indirect contact with the blue film, and the influence of the surface roughness of the first end face on the wafer is avoided, so that the processing precision of the first end face is reduced, the process difficulty is simplified, and the processing cost of the die-bonding thimble structure is reduced; meanwhile, the rubber layer has elasticity, so that stress can be buffered, the probability of chip breakage is reduced, and the yield and efficiency of die bonding are improved.

In one embodiment, the end surface of the rubber layer, which is used for facing the wafer, is an arc surface, and the arc surface is raised towards one side far away from the thimble body;

or, the rubber layer is provided with an arc chamfer in the circumferential direction of the end surface facing the wafer.

In one embodiment, the first end face is provided with a groove, and the rubber layer is arranged in the groove and protrudes out of the opening of the groove.

In one embodiment, the groove is a cylindrical groove, and the ratio of the diameter of the groove to the depth of the groove is 1.0-2.5.

In one embodiment, the rubber layer comprises a hard rubber layer having a shore D hardness of 75-80.

In one embodiment, the rubber layer includes at least one of a natural rubber layer, a styrene layer, and a vulcanizing agent layer.

In one embodiment, the die-bonding thimble structure further comprises a fixing seat and a driving motor, one end of the fixing seat is connected with the thimble body, one end of the fixing seat is connected with the driving motor, and the driving motor is used for driving the thimble body to be close to or far away from the wafer.

In one embodiment, the thimble body is in a shape of a circular truncated cone, and the diameter of the thimble body gradually decreases along a direction approaching to the first end surface.

The utility model provides a die bonder, includes get brilliant platform with solid brilliant thimble structure, get brilliant platform and be used for placing the wafer, solid brilliant thimble structure is located get on the brilliant platform and keep away from the one side of wafer, get be equipped with on the brilliant platform with the through-hole that solid brilliant thimble structure corresponds.

According to the die bonder, in the use process, the die bonder ejector pin structure moves towards the direction close to the wafer, and because the elastic modulus difference between the blue film on the wafer and the wafer is large, when the ejector pin body pushes up the blue film, the blue film deforms, the edge of the wafer is separated from the blue film, and finally the wafer is sucked from the upper side of the wafer through the suction nozzle, so that the wafer and the blue film are completely separated. The first end face facing the wafer is arranged on the thimble body, the wafer is jacked up through the first end face, stress of the thimble body on the wafer is reduced, and cracks of the wafer caused by stress concentration are avoided. In addition, the rubber layer is arranged on the surface of the first end face, and the rubber layer is abutted with the blue film, so that the first end face is in indirect contact with the blue film, and the influence of the surface roughness of the first end face on the wafer is avoided, so that the processing precision of the first end face is reduced, the process difficulty is simplified, and the processing cost of the die-bonding thimble structure is reduced; meanwhile, the rubber layer has elasticity, so that stress can be buffered, the probability of chip breakage is reduced, and the yield and efficiency of die bonding are improved.

In one embodiment, the die bonder further includes a suction nozzle assembly, the suction nozzle assembly is located on a side of the die-picking platform away from the die-bonding ejector pin structure, and the suction nozzle assembly is used for sucking the wafer.

Drawings

FIG. 1 is a schematic diagram of a die attach ejector pin structure according to one embodiment;

FIG. 2 is a top view of a die attach ejector pin structure according to one embodiment.

Reference numerals: 100. a die bonding thimble structure; 10. a thimble body; 11. a rubber layer; 12. a groove; 13. a first end face; 20. a fixing seat; 30. a crystal taking platform; 31. a through hole; 40. a wafer; 41. a blue film; 42. a wafer.

Detailed Description

In order that the above objects, features and advantages of the utility model will be readily understood, a more particular description of the utility model will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model. The present utility model may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the utility model, whereby the utility model is not limited to the specific embodiments disclosed below.

The die attach ejector pin structure 100 and the die attach machine in the embodiments are described in detail below with reference to the accompanying drawings.

As shown in fig. 1 and 2, in one embodiment, a die attach ejector pin structure 100 is provided, where the die attach ejector pin structure 100 includes an ejector pin body 10, and a first end surface 13 for facing a wafer 42 is provided on the ejector pin body 10, and a rubber layer 11 is provided on the first end surface 13.

In the above-mentioned die-bonding ejector pin structure 100, during the use process, the die-bonding ejector pin structure 100 moves towards the direction close to the die 42, and because the difference of the elastic modulus between the blue film 41 on the wafer 40 and the die 42 is large, when the ejector pin body 10 pushes up the blue film 41, the blue film 41 deforms, so that the edge of the die 42 is separated from the blue film 41, and finally the die 42 is sucked from the upper side of the wafer 40 through the suction nozzle, so as to complete the complete separation of the die 42 from the blue film 41. The first end face 13 facing the wafer 42 is arranged on the thimble body 10, and the wafer 42 is jacked up through the first end face 13, so that the stress of the thimble body 10 on the wafer 42 is reduced, and the wafer 42 is prevented from being cracked due to stress concentration. In addition, the rubber layer 11 is arranged on the surface of the first end face 13, and the rubber layer 11 is abutted against the blue film 41, so that the first end face 13 is in indirect contact with the blue film 41, and the influence of the surface roughness of the first end face 13 on the wafer 42 is avoided, so that the processing precision of the first end face 13 is reduced, the process difficulty is simplified, and the processing cost of the die-bonding thimble structure 100 is reduced; meanwhile, the rubber layer 11 has elasticity, so that stress can be buffered, the probability of chip breakage is reduced, and the yield and efficiency of die bonding are improved.

Specifically, as shown in fig. 1 and 2, in one embodiment, the end surface of the rubber layer 11 facing the wafer 42 is an arc surface, and the arc surface is convex toward the side away from the thimble body 10. The circular arc surface is used for reducing the contact area between the rubber layer 11 and the wafer 42, which is beneficial to separating the wafer 42 from the blue film 41 with small size.

Alternatively, as shown in fig. 1 and 2, in one embodiment, the rubber layer 11 is provided with a circular arc chamfer in the circumferential direction of the end surface for facing the wafer 42. The circular arc chamfer can also reduce the contact area between the rubber layer 11 and the wafer 42, thereby being suitable for the wafer taking process of the small-size wafer 42.

Specifically, as shown in fig. 1 and 2, in an embodiment, a groove 12 is provided on the first end surface 13, and the rubber layer 11 is disposed in the groove 12 and protrudes out of the opening of the groove 12. After the groove 12 is formed on the first end face 13, on one hand, the rubber layer 11 can be prepared through an impregnation process, namely, the first end face 13 is immersed into the rubber emulsion, a curved surface structure is formed by utilizing the surface tension of the rubber emulsion, and the processing process is simple. On the other hand, the grooves 12 increase the thickness of the rubber layer 11, increase the hardness of the rubber layer 11, prolong the service life of the rubber layer 11, and also can adjust the thickness and surface curvature of the rubber layer 11 by controlling the diameter and depth of the grooves 12.

Specifically, as shown in fig. 1 and 2, in one embodiment, the groove 12 is a cylindrical groove 12, and the ratio of the diameter of the groove 12 to the depth of the groove 12 is 1.0-2.5. As the ratio of the diameter of the groove 12 to the depth of the groove 12 increases, the smaller the thickness of the rubber layer 11, the smaller the surface curvature.

In this embodiment, the ratio of the diameter of the groove 12 to the depth of the groove 12 is 1.0;

in this embodiment, the ratio of the diameter of the groove 12 to the depth of the groove 12 is 1.5;

in this embodiment, the ratio of the diameter of the groove 12 to the depth of the groove 12 is 2.5;

specifically, as shown in fig. 1 and 2, in one embodiment, the rubber layer 11 includes a hard rubber layer 11, and the hardness of the hard rubber layer 11 is 75 to 80 on the shore D scale. The hardness of the rubber layer 11 is large, which is more favorable for separating the wafer 42 from the blue film 41.

In this particular embodiment, the hard rubber layer 11 has a shore D hardness of 75.

In this particular embodiment, the hard rubber layer 11 has a shore D hardness of 78.

In this particular embodiment, the hard rubber layer 11 has a shore D hardness of 80.

Specifically, as shown in fig. 1 and 2, in one embodiment, the rubber layer 11 includes at least one of a natural rubber layer, a styrene layer, and a vulcanizing agent layer.

Wherein the rubber layer 11 comprises 70-97% of natural rubber, 5-20% of styrene and 2-10% of vulcanizing agent.

In this particular embodiment, the rubber layer 11 comprises 97% natural rubber, 5% styrene and 2% vulcanizing agent.

In this particular embodiment, the rubber layer 11 comprises 80% natural rubber, 15% styrene and 5% vulcanizing agent.

In this particular embodiment, the rubber layer 11 comprises 72% natural rubber, 20% styrene and 8% vulcanizing agent.

Specifically, as shown in fig. 1 and 2, in an embodiment, the die-bonding thimble structure 100 further includes a fixing base 20 and a driving motor, one end of the fixing base 20 is connected with the thimble body 10, one end of the fixing base 20 is connected with the driving motor, and the driving motor is used for driving the thimble body 10 to approach or depart from the wafer 42.

Specifically, as shown in fig. 1 and 2, in an embodiment, the thimble body 10 has a truncated cone shape, and the diameter of the thimble body 10 gradually decreases in a direction approaching the first end surface.

As shown in fig. 1 and 2, in an embodiment, a die bonder is provided, the die bonder includes a die-picking platform 30 and a die-bonding thimble structure 100, the die-picking platform 30 is used for placing a wafer 40, the wafer 40 includes a blue film 41 and a plurality of dies 42 on the blue film 41, the die-bonding thimble structure 100 is located on a side of the die-picking platform 30 away from the wafer 40, and through holes 31 corresponding to the die-bonding thimble structure 100 are provided on the die-picking platform 30.

Specifically, as shown in fig. 1 and 2, in one embodiment, the die bonder further includes a suction nozzle assembly located on a side of the die attach platform 30 remote from the die attach pin structure 100, the suction nozzle assembly being configured to suction the die 42.

In this particular embodiment, the nozzle assembly includes a nozzle and a drive member coupled to the nozzle for driving the nozzle toward or away from the wafer 42.

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present utility model, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.

In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present utility model, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.

The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The foregoing examples illustrate only a few embodiments of the utility model, which are described in detail and are not to be construed as limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.

Claims

1. The utility model provides a gu brilliant thimble structure, its characterized in that includes the thimble body, be equipped with on the thimble body and be used for facing the first terminal surface of wafer, be equipped with the rubber layer on the first terminal surface, be equipped with the recess on the first terminal surface, the rubber layer is located in the recess, and protruding in the opening of recess, the recess is cylindrical recess, the diameter of recess with the depth ratio of recess is 1.0 ~ 2.5.

2. The die bonding thimble structure according to claim 1, wherein an end surface of the rubber layer for facing the wafer is an arc surface, and the arc surface is protruded away from one side of the thimble body;

3. The die attach ejector pin structure of claim 1, wherein a ratio of a diameter of the groove to a depth of the groove is 1.0 to 1.5.

4. The die attach ejector pin structure of claim 1, wherein a ratio of a diameter of the groove to a depth of the groove is 1.5 to 2.5.

5. The die attach thimble structure according to claim 1, wherein said rubber layer comprises a hard rubber layer having a shore D hardness of 75-80.

6. The die attach pin structure of claim 1, wherein said rubber layer comprises at least one of a natural rubber layer, a styrene layer, and a vulcanizing agent layer.

7. The die attach ejector pin structure of claim 1, further comprising a fixing base and a driving motor, wherein one end of the fixing base is connected with the ejector pin body, one end of the fixing base is connected with the driving motor, and the driving motor is used for driving the ejector pin body to approach or separate from the wafer.

8. The die bonding thimble structure according to any one of claims 1-7, wherein said thimble body has a circular truncated cone shape, and the diameter of said thimble body gradually decreases in a direction approaching said first end surface.

9. The die bonder is characterized by comprising a die-picking platform and the die-bonding thimble structure according to any one of claims 1-8, wherein the die-picking platform is used for placing a wafer, the die-bonding thimble structure is positioned on one side, far away from the wafer, of the die-picking platform, and a through hole corresponding to the die-bonding thimble structure is formed in the die-picking platform.

10. The die bonder of claim 9, further comprising a suction nozzle assembly positioned on a side of the die attach platform remote from the die attach ejector structure, the suction nozzle assembly configured to pick up the wafer.