JP2002028568A - Transfer pin, collet and die bonder using them - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a transfer pin, a collet and a die bonder capable of efficiently transferring an adhesive, and transporting a semiconductor device bonding a chip by flip-chip bonding without reducing the yield. SOLUTION: Since the tip part of the transfer pin 9 has two projected parts having a length longer than the depth to which an adhesive 2 in a storage saucer 3 is subsided from the surface, the pin can transfer the adhesive 2 to two points by one time transferring operation. The suction hole of the collet 10 has a diameter larger than a semiconductor chip, the collect 10 can lower the load to be applied to the bump which connects the semiconductor chip to a sub-mount substrate at the time of picking up or stopping the movement after adsorption.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transfer pin and a collet for mounting a semiconductor device on a circuit board, and a die bonder using the same. In particular, the present invention can efficiently transfer an adhesive. A transfer pin capable of transferring a semiconductor device in which a semiconductor chip is flip-chip bonded onto a substrate without lowering the yield;
The present invention relates to a collet and a die bonder using the same.

[0002]

2. Description of the Related Art A semiconductor chip (in a bare chip state) including an LED has at least two electrodes, positive and negative, of which one pole is on the bottom and the other pole is on the top or the bottom. Generally had no electrode and only had an electrode on the upper surface.

FIG. 6 shows a conventional die bonder in which such a semiconductor chip is mounted on a substrate. This die bonder 1
A tray 3 on which a plurality of semiconductor chips 16 are placed via an adhesive sheet; a receiving tray 3 for storing the adhesive 2; a substrate supporting portion 5 for supporting the circuit board 4 movably in the X and Y directions; A tray support 8 for movably supporting the tray 7 in the X and Y directions, a transfer pin 9 for transferring and applying the adhesive 2 in the storage plate 3 to a bonding position 4 a on the circuit board 4, A collet 10 for adsorbing the semiconductor chip 16 and transferring it to the bonding position 4a on the circuit board 4 to which the adhesive 2 has been applied, mounting it, an arm 11 supporting the transfer pin 9 and the collet 10, and an arm X It has an X stage 12 for moving in the direction and a Z stage 13 for moving the arm 11 in the Z direction.

FIG. 7 shows a transfer pin 9. Transfer pin 9
Is a tip 9a having a substantially hemispherical projection 90a at the tip.
And a mounting portion 9b, which is detachable from the holding portion 110b of the pin holder 11a attached to the arm 11.

FIG. 8 shows the collet 10. Collet 1
0 has a flat suction surface 10a provided at the tip and a mounting portion 10c as shown in FIG.
Holder 110 of collet holder 11b attached to
b. The collet 10 has suction holes 10a extending from the suction surface 10a at the front end to the rear end surface 10d.
b, 10b 'are formed. The suction hole 10b on the suction surface 10a has an outer diameter D smaller than the size S of the semiconductor chip 16, and the suction hole 10b on the rear end face 10d has an outer diameter larger than the outer diameter D of the suction hole 10b on the front end. D ′. The collet shown in FIG. 1B is also conventionally used. The collet 10 has a pyramid-shaped suction surface 10a at the tip, and is configured to suction the semiconductor chip 16 by vacuuming from a suction hole 10b having a diameter smaller than the size S of the semiconductor chip 16 as well.

FIG. 9 shows the operation of the die bonder 1. First, as shown in FIG. 7A, the arm 11 is moved to the left in FIG. 6 along the X direction by the X stage 12, and the arm 11 is lowered along the Z direction by the Z stage 13, so that the transfer pins 9 are moved. Is made to sink into the adhesive 2 in the receiving tray 3. Next, as shown in FIG. 3B, the arm 11 is raised along the Z direction by the Z stage 13 and the arm 11 is moved by the X stage 12.
6 is moved to the right in FIG. 6 along the X direction, the arm 11 is lowered along the Z direction by the Z stage 13, and the adhesive 2 attached to the projection 90 a of the transfer pin 9 is moved to the bonding position 4 a of the circuit board 4. And the semiconductor chip 16 is sucked on the suction surface 10a of the collet 10 as shown in FIG. Next, the arm 11 is moved up in the Z direction by the Z stage 13, the arm 11 is moved to the left in FIG. 6 along the X direction by the X stage 12, and the arm 11 is moved by the Z stage 13.
Is lowered along the Z direction, and as shown in FIG.
Semiconductor chip 1 adsorbed on adsorption surface 10a of collet 10
6 is transferred to the bonding position 4a of the circuit board 4 to which the adhesive 2 has been applied, and the semiconductor chip 16 is mounted on the circuit board 4. At this time, the projection 90a of the tip 9a of the transfer pin 9
Is submerged in the adhesive 2 in the receiving tray 3, so that the above operation is repeated, so that the transfer of the adhesive 2 and the transfer and mounting of the semiconductor chip 16 are performed in parallel. Thus, the plurality of semiconductor chips 16 can be efficiently mounted on the circuit board 4.

[0007]

However, according to the conventional die bonder, the transfer pin can transfer the adhesive to only one place in one transfer operation, so that when mounting a large number of semiconductor chips, it is not efficient. Transfer cannot be performed. In addition, since the collet adsorbs the semiconductor chip itself, when a semiconductor device in which the semiconductor chip is flip-chip bonded in advance by a bump made of gold, solder, or the like to a submount substrate that is larger than the semiconductor chip is to be adsorbed, The load is applied to the bump when the collet collides with the semiconductor chip during pickup or when the semiconductor device is lifted from the adhesive sheet, and the load is also applied to the bump due to the inertial force of the submount substrate generated when the movement is stopped after suction. For this reason, cracks and the like may be generated in the bumps, which may lower the yield.

Accordingly, it is an object of the present invention to provide a transfer pin capable of performing efficient transfer of an adhesive. Another object of the present invention is to provide a collet that can transfer a semiconductor device in which a semiconductor chip is flip-chip bonded onto a substrate without lowering the yield. Another object of the present invention is to
An object of the present invention is to provide a die bonder which can transfer an adhesive efficiently and can transfer a semiconductor device in which a semiconductor chip is flip-chip bonded onto a substrate without lowering the yield.

[0009]

According to the present invention, there is provided a transfer pin for attaching an adhesive to a tip and transferring the adhesive to a predetermined position, wherein the tip is settled from the surface of the adhesive. A transfer pin having a height longer than a predetermined depth and having a plurality of projections for transferring the attached adhesive to a plurality of the positions. According to the above configuration, the adhesive is transferred to a plurality of locations by one transfer operation.

In order to achieve the above object, the present invention provides a collet for adsorbing and transporting a semiconductor device in which a semiconductor chip is flip-chip bonded onto a substrate, the collet contacting the substrate when the semiconductor device is adsorbed. Surface, and a suction hole provided in the suction surface, wherein at least a portion of the suction hole near the suction surface has a size that can accommodate the semiconductor chip when the semiconductor device is suctioned. Provide a collet with features. According to the above configuration, the substrate is directly sucked because at least a portion of the suction hole near the suction surface has a size that can accommodate the semiconductor chip.

In order to achieve the above object, the present invention provides a semiconductor device in which an adhesive is attached to a tip of a transfer pin and transferred to a bonding position on a circuit board, and a semiconductor chip is flip-chip bonded on a submount board. In the die bonder, which is transferred to the bonding position where the adhesive on the circuit board is transferred by being sucked by a collet and mounted, the tip of the transfer pin is longer than a depth of sinking from the surface of the adhesive. A plurality of protrusions having a height and transferring the attached adhesive to a plurality of the positions, wherein the collet has a suction surface that contacts the substrate when the semiconductor device is suctioned; A suction hole provided on a surface, at least a portion of the suction hole near the suction surface, when the semiconductor device is sucked, the semiconductor chip is Providing a die bonder, characterized in that it has a size capable of volume.

[0012]

FIG. 1 shows a die bonder according to an embodiment of the present invention. The die bonder 1 includes a receiving plate 3 that stores a conductive adhesive 2 such as an Ag paste, a substrate supporting portion 5 that supports a circuit board 4 movably in X and Y directions, and an LED as a plurality of semiconductor devices. A tray 7 on which the light source 6 is mounted, a tray support 8 for supporting the tray 7 so as to be movable in the X and Y directions, and the adhesive 2 in the storage tray 3 at two bonding positions 4a on the circuit board 4. At the same time, a transfer pin 9 to be transferred and applied, and a collet 10 for adsorbing the LED light source 6 on the tray 7 and transferring to the two bonding positions 4a where the adhesive 2 is applied on the circuit board 4 for mounting
And an arm 1 supporting a transfer pin 9 and a collet 10
1 and an X stage 12 for moving the arm 11 in the X direction
And a Z stage 13 for moving the arm 11 in the Z direction
And a control unit 15 for controlling each part of the die bonder 1.

FIGS. 2A and 2B show the transfer pin 9. FIG. The transfer pin 9 has two convex portions 9 each having a tip having a substantially semicircular cross section.
0a and a holding portion 11 of a pin holder 11a attached to the arm 11 and having a mounting portion 9b.
0b. Further, the transfer pin 9
The concave portion 90b is formed between the two convex portions 90a, and the height L of the two convex portions 90a from the concave portion 90b is longer than the depth sinking from the surface of the adhesive 2 in the storage tray 3. Further, the two convex portions 90a have, for example, a radius R0.2.
mm, width d1.2 mm, and pitch P1.2 mm.
In addition, the shape of the convex portion 90a may be a shape according to the range in which the adhesive 2 is applied, and may be, for example, a substantially hemispherical shape. Further, the number of the convex portions 90a may be three or more as necessary.

FIGS. 3A and 3B show the collet 10. FIG. As shown in FIG. 1A, the collet 10 includes a flat suction surface 10a provided at the tip and a mounting portion 10c, and a collet holder 11 attached to the arm 11.
b is detachable from the holding portion 110b. The collet 10 has a suction hole 10b having the same diameter D formed from the suction surface 10a to the rear end surface 10d.
This suction hole 10b communicates with a vacuum source such as a vacuum pump via a collet holder 11b. Suction hole 10b
Has a diameter larger than the size S of the LED chip 14. In the case of the present embodiment, the LED chip 14
Is 0.34 mm, and the diameter D of the suction hole 10b is 1.0 mm. In addition, although the suction hole 10b has a columnar shape in the present embodiment, it may have a prismatic shape. Further, the suction surface 10a may have a pyramid shape or a conical shape as shown in FIG.

FIG. 4 shows the LED light source 6. This LED
The light source 6 includes a submount substrate 60 and the LED chip 14 mounted on the submount substrate 60 by FCB.

In the LED chip 14, a semiconductor layer such as gallium nitride is laminated on a sapphire substrate, which is a transparent insulator, and as shown in FIG. And the negative electrode 140b are formed, and the bottom surface of the sapphire substrate serving as the upper surface 14a of the chip 14 becomes the light emitting surface. In this embodiment, for example, a GaN (gallium nitride) -based semiconductor is used.

The submount substrate 60 has a base material 61, and a positive lead 62a and a negative lead 62b are formed on a surface 61a of the base material 61, as shown in FIG.
A positive lead 63a and a negative lead 63b are formed on the back surface 61b of the base material 61 as shown in FIG.
a positive lead 62a, negative lead 62b and back surface 61b
Are connected to the positive lead 63a and the negative lead 63b by through-hole plating 64a, 64b, respectively.
A positive display portion 65 for indicating that it is on the positive side is extended and formed on the positive lead 62a of FIG. Also, the surface 61
The positive lead 62a and the negative lead 62b of FIG.
There is a pair of triangular test regions 68a and 68b for applying a voltage to a region other than the region where the LED chip 14 of FIG.
The leads 62a, 62b, 63a, 63b and the positive display section 65 are formed by using an electrode wiring technique in a normal semiconductor manufacturing technique such as an etching method. For example, Au or the like is formed on a base metal layer such as Cu + Ni. Are formed by laminating metal plating layers. Also, the surface 61a of the base material 61
On the diagonal line of the positive lead 62a and the negative lead 62b of
Position recognition plating bumps 66a, 6 made of a pair of Au
6b, the mounting lead bumps 67a made of Au are formed on the positive leads 62a and the negative leads 62b on the front surface 61a.
67b are formed. These plated bumps 66
The components a, 66b, 67a, and 67b are collectively formed by, for example, photolithography. The area other than the area where the LED chip 14 is mounted on the front surface 61a serves as a suction surface for handling the submount substrate 60 on which the LED chip 14 is mounted via a pair of mounting plating bumps 67a and 67b. .

The base material 61 has heat resistance and a low coefficient of expansion so as not to cause deformation and a decrease in strength when the LED chip 14 is mounted, and further has a light emission wavelength of the LED chip 14 (for example, a wavelength of ultraviolet light). A material having a high light reflectance and a low light absorptance with respect to (1) is preferable. As such a material,
For example, a glass epoxy resin having a high light reflectance of about 42% with respect to ultraviolet rays can be used. In addition, an insulator such as another resin or ceramic may be used according to required characteristics.

FIG. 5 shows the operation of the die bonder 1 according to the present embodiment. It is assumed that a wiring pattern is formed at the bonding position 4a of the circuit board 4. First, as shown in FIG. 1A, under the control of the control unit 15, the X stage 12 moves the arm 11 to the left in FIG. 1 along the X direction, and the Z stage 13 moves the arm 11 in the Z direction. , The two protrusions 90 a of the tip 9 a of the transfer pin 9 are sunk into the adhesive 2 in the storage tray 3, which is shallower than the height L of the protrusion 90 a. Next, as shown in FIG. 2B, under the control of the control unit 15, the arm 11 is raised along the Z direction by the Z stage 13, and the arm 11 is moved along the X direction by the X stage 12. 1, the arm 11 is moved down in the Z direction by the Z stage 13, and the adhesive 2 attached to the two convex portions 90 a of the transfer pin 9 is removed from the circuit board 4.
At the same time to the two bonding positions 4a,
As shown in FIG. 3C, the LED light source 6 is sucked on the suction surface 10a of the collet 10 by evacuation by a vacuum source. Next, under the control of the control unit 15, the Z stage 1
3, the arm 11 is raised along the Z direction, the X stage 12 moves the arm 11 to the left in FIG. 1 along the X direction, and the Z stage 13 lowers the arm 11 along the Z direction. As shown in (d), the LED light source 6 adsorbed on the adsorption surface 10a of the collet 10 is transferred to the bonding position 4a of the circuit board 4 on which the adhesive 2 is applied, and the LED light source 6 is mounted on the circuit board 4.
That is, the positive lead 63 a and the negative lead 63 b formed on the back surface 61 b of the submount substrate 60 are connected to the wiring pattern on the circuit board 4 via the conductive adhesive 2.
At this time, since the convex portion 90a of the tip 9a of the transfer pin 9 is submerged in the adhesive 2 in the receiving tray 3, the above operation is repeated to transfer the adhesive 2 and to suck and mount the LED light source 6. Are performed in parallel. The control unit 15 controls the substrate support unit 5 so that the bonding position to be mounted next is at the mounting position, and controls the tray support unit 8 so that the LED light source 6 to be next suctioned is at the suction position. .
Thus, the plurality of LED light sources 6 can be efficiently mounted on the circuit board 4.

According to the above embodiment, the adhesive 2 can be transferred to two places by one transfer operation, so that the adhesive 2 can be efficiently transferred. Also, the suction hole 10b
By making the diameter D larger than the size S of the semiconductor chip 14, the submount substrate 30 can be directly sucked, so that the load applied to the bumps 67a and 67b at the time of pickup and at the time of stopping the movement after the suction can be reduced. As a result, the LED light source 6 in which the semiconductor chip 14 is flip-chip bonded on the submount substrate 60 can be transferred without lowering the yield. Further, it is possible to use a conventional die bonder only by replacing the transfer pin and the collet with those of the present embodiment.

[0021]

As described above, according to the present invention, 1
Since the adhesive is transferred to multiple locations in a single transfer operation,
An efficient transfer of the adhesive can be performed. Further, since at least a portion of the suction hole near the suction surface has a size capable of accommodating the semiconductor chip, the substrate can be directly sucked, so that the load applied to the bump at the time of pickup and at the time of stopping the movement after the suction is reduced. And as a result,
A semiconductor device in which a semiconductor chip is flip-chip bonded to a substrate can be transferred without lowering the yield.

[Brief description of the drawings]

FIG. 1 is a diagram showing an overall configuration of a die bonder according to an embodiment of the present invention.

FIG. 2A is a diagram illustrating a transfer pin according to the embodiment;
(B) is the figure seen from the convex part side.

FIG. 3A is a longitudinal sectional view of a collet of the present embodiment,
(B) is a sectional view taken along line AA in (a).

FIG. 4A is a diagram showing an LED light source of the present embodiment,
(B) is a sectional view taken along line BB in (a), and (c) is a bottom view.

FIGS. 5A to 5D are diagrams illustrating the operation of the die bonder according to the present embodiment.

FIG. 6 is a diagram showing an entire configuration of a conventional die bonder.

FIG. 7 is a view showing a conventional transfer pin.

8A is a diagram showing a conventional collet, and FIG. 8B is a diagram showing another conventional collet.

FIGS. 9A to 9D are diagrams showing the operation of a conventional die bonder.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Die bonder 2 Adhesive 3 Receiving tray 4 Circuit board 4a Bonding position 5 Substrate support 6 LED light source 7 Tray 8 Tray support 9 Transfer pin 9a Tip 9b Mounting part 10 Collet 10a Suction surface 10b, 10b 'Suction hole 10c Mounting part 10d Rear end face 11 Arm 11a Pin holder 11b Collet holder 12 X stage 13 Z stage 14 LED chip 14a Upper surface 14b Lower surface 16 Semiconductor chip 60 Submount substrate 61 Base material 61a Surface 61b Back surface 62a Positive lead 62b Negative lead 63a Positive lead 63b Negative lead 65 Positive display section 66a, 66b Position recognition plating bump 67a, 67b Mounting plating bump 68a, 68b Inspection area 110a, 110b Holding section 140a Positive electrode 140b Negative electrode D, D 'Diameter L length S P Pitch S Size W Width

Claims (5)

[Claims] 1. A transfer pin for attaching an adhesive to a tip and transferring the adhesive to a predetermined position, wherein the tip has a height longer than a depth of sinking from the surface of the adhesive, and A transfer pin comprising a plurality of projections for transferring an agent to a plurality of positions. 2. The transfer pin according to claim 1, wherein said projection has a substantially semicircular cross section. 3. A collet for adsorbing and transferring a semiconductor device in which a semiconductor chip is flip-chip bonded onto a substrate, wherein the collet is provided on the adsorbing surface that contacts the substrate when the semiconductor device is adsorbed. A collet, wherein at least a portion of the suction hole near the suction surface has a size that can accommodate the semiconductor chip when the semiconductor device is suctioned. 4. The collet according to claim 3, wherein said suction hole has the same diameter from the rear end face to said suction face. 5. A circuit board, wherein an adhesive is adhered to a tip of a transfer pin and transferred to a bonding position on a circuit board, and a semiconductor device in which a semiconductor chip is flip-chip bonded on a submount board is attracted by a collet to the circuit board. In the die bonder to be transferred to and mounted on the bonding position where the adhesive is transferred, the tip of the transfer pin has a height longer than a depth of sinking from the surface of the adhesive, and is attached. A plurality of protrusions for transferring the adhesive to a plurality of the positions, wherein the collet has a suction surface that contacts the substrate when the semiconductor device is sucked, and a suction hole provided in the suction surface. At least a portion of the suction hole near the suction surface has a size that can accommodate the semiconductor chip when the semiconductor device is suctioned. Die bonder to.