CN102163565A - Chip welding device - Google Patents

Chip welding device Download PDF

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Publication number
CN102163565A
CN102163565A CN2011100437306A CN201110043730A CN102163565A CN 102163565 A CN102163565 A CN 102163565A CN 2011100437306 A CN2011100437306 A CN 2011100437306A CN 201110043730 A CN201110043730 A CN 201110043730A CN 102163565 A CN102163565 A CN 102163565A
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CN
China
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mentioned
impression
pin
magnet
die
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Granted
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CN2011100437306A
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Chinese (zh)
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CN102163565B (en
Inventor
辛熺达
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Protec Co Ltd Korea
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Protec Co Ltd Korea
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Publication of CN102163565A publication Critical patent/CN102163565A/en
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Publication of CN102163565B publication Critical patent/CN102163565B/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

The invention provides a chip welding device, an adhesive is stamped on a lead frame, a semiconductor chip is placed at a stamped position, thereby continuously making the semiconductor chip be welded to the lead frame. A chip welding device characterized by adhesives stamped on lead frames successively supplied and chips are plastered to stamped positions comprises: a stamping component provided with a stamping needle, a needle chuck, and a stamping magnet, the stamping needle is in a contact with the lead frame, the adhesive is stamped, the needle chuck is combined with the tamping needle, the stamping magnet is installed on one of the needle chuck and the stamping needle, the needle chuck and the stamping needle are combined via magnetic force provided in a direction approach to the other party; a stamping lifting part making the stamping component lift in an upper-lower direction; and a stamping transfer part transferring the stamping component in a horizontal direction.

Description

Die-bonding device
Technical field
The present invention relates to die-bonding device, particularly relate to a kind of adhesive that on lead frame, impresses, semiconductor chip is positioned over the position that is stamped, thereby makes semiconductor chip be welded in the die-bonding device of lead frame continuously.
Background technology
As shown in Figure 1, in the past on lead frame the impression adhesive imprinting apparatus have the impression pin 1.Dip in adhesive on the impression pin 1, make the position of wanting pasting chip of impression pin 1 contact lead-wire framework, carry out the impression operation with the method.
, this impression pin is a consumptive material.If carry out the impression operation repeatedly, 1 on pin of impression can wear and tear, and the impression accuracy descends, and the impression operation also can't effectively be finished.Therefore, after impression is used up in 1 life-span of pin, more renew impression pin 1 and proceed to impress operation.
Impression pin 1 in the past is incorporated into die-bonding device with structure as shown in Figure 1.Impression pin 1 is incorporated into pin fixed part 2 with screw fashion, is incorporated into pin fixed part 2 as shown in Figure 1 with hold-down nut 3 again, prevents that impression pin 1 gets loose in the operation process.
But, when impression pin 1 being installed, many inconveniences are arranged when changing operation with such screw associated methods.If the height of the impression pin of changing 1 changes, in the impression operation process, may damage lead frame, the impression pin also can damage or reduction of service life.
Therefore, it is very important being installed on pin fixed part 2 behind accurate adjustment impression pin 1 height.Impression pin 1 height control method is with respect to pin fixed part 2 and rotation impression pin 1., because the operator is a height of regulating the impression pin with trial-and-error method, repeatedly fastening impression pin 1 or unclamp, this operational method is not only time-consuming, and has the problem that is difficult to accurate operation.And after regulating impression pin 1 height, if fastening with respect to pin fixed part 2 said fixing nut 3, the height of impression pin 1 may change, and therefore, its Height Adjustment operation is difficulty more.
Summary of the invention
The technical problem that solves
The present invention proposes in order to address the above problem just, and purpose is to provide a kind of die-bonding device, structurally can impress the installation and the replacing of pin expediently, and impression pin height can easily be set.
Technical scheme
For achieving the above object, at on the lead frame of supply successively, impressing adhesive, die-bonding device at the position pasting chip that has impressed, the present invention is characterised in that and comprises: platen assembly, platen assembly has impression pin, needle holder and impression magnet, the impression pin contacts above-mentioned lead frame, impress above-mentioned adhesive, needle holder is for the combination of above-mentioned impression pin, impression magnet is installed on above-mentioned needle holder and impression one of pin, by to provide magnetic force in conjunction with above-mentioned needle holder and impression pin with respect to another person's mean of access; The impression lifting unit makes above-mentioned platen assembly along method lifting up and down; And impression handover portion, along continuous straight runs is transferred above-mentioned platen assembly.
Beneficial effect
Die-bonding device of the present invention has can fast, easily impress the effect that pin is installed and changed.
And the present invention has the effect that impression pin height can easily be set.
Description of drawings
Fig. 1 is the partial section of die-bonding device in the past.
Fig. 2 is the oblique view of the die-bonding device of one embodiment of the invention.
Fig. 3 is the local oblique view that amplifies of die-bonding device shown in Figure 2.
Fig. 4 is the local detachment oblique view of die-bonding device shown in Figure 3.
Fig. 5 is the separation oblique view of the platen assembly of die-bonding device shown in Figure 2.
Fig. 6 is the VI-VI line sectional view of the platen assembly of die-bonding device shown in Figure 5.
Fig. 7 to Figure 10 is the accompanying drawing that is used to illustrate die-bonding device method of operating shown in Figure 2.
Figure 11 is the sectional view of the absorbent module of die-bonding device shown in Figure 2.
Embodiment
With reference to the accompanying drawings, describe advantageous embodiment of the present invention in detail.
Fig. 2 is the oblique view of the die-bonding device of one embodiment of the invention.As shown in Figure 2, the die-bonding device of present embodiment comprises the impression handover portion 60 that is installed on the pedestal 100 and platen assembly 10, absorption handover portion 70, absorbent module 80.
On pedestal 100, the lead frame handover portion 103 that supplies lead frame 102 and along continuous straight runs handover successively is installed.
That is, lead frame handover portion 103 transfers lead frame 102 successively, and platen assembly 10 and impression handover portion 60 are to each encapsulation place impression adhesive R of lead frame 102.The lead frame 102 that has impressed is sent to the position of absorption handover portion 70 by lead frame handover portion 103, and absorption handover portion 70 is transferred to position that lead frame 102 has impressed adhesive R with absorbent module 80 with chip absorption.
Impression handover portion 60 is installed on the pedestal 100, and along continuous straight runs is transferred impression lifting unit 50.Impression lifting unit 50 is installed on impression handover portion 60, makes platen assembly 10 lifting along the vertical direction.
As shown in Figure 3 and Figure 4, in the present embodiment, platen assembly 10 has 4.Main part 30 is incorporated into impression handover portion 60, and 4 platen assemblies 10 are installed on this main part 30, is stamped handover portion 60 along continuous straight runs and transfers.Rotating disk 20 and rotatable is installed on main part 30.4 platen assemblies 10 and liftable are installed respectively on rotating disk 20.Rotating disk 20 has 4 impression springs 22 corresponding with each platen assembly 10, and impression spring 22 is each platen assembly 10 of resiliency supported upward.4 platen assemblies 10 are spaced by certain angle along the rotation round direction of rotating disk 20.In the present embodiment, each platen assembly 10 90 ° of arrangements at interval.
Impression lifting unit 50 is installed on main part 30, makes platen assembly 10 liftings.Impression lifting unit 50 has pressing element 53 and pressurised driving device 51.Pressing element 53 is positioned at the upside of platen assembly 10, is installed on main part 30 and also can slides along the vertical direction.Be formed with the guiding groove 31 that prolongs along the vertical direction on main part 30, be formed with slide protrusion 56 on pressing element 53, slide protrusion 56 inserts guiding groove 31 and slides up and down.Pressurised driving device 51 is installed on the upside of main part 30, and elevating lever 52 is incorporated into pressing element 53.Pressurised driving device 51 moves according to the mode that elevating lever 52 is advanced or retreat, and the pressing element 53 that is connected in elevating lever 52 rises or descends along with the action of pressurised driving device 51
At least form an assembly through hole 55 on the pressing element 53.When pressurised driving device 51 descended pressing element 53, at least one platen assembly 10 can not descend in through assembly through hole 55, and all the other platen assemblies 10 are subjected to pushing of pressing element 53 and descend.In the present embodiment, as shown in Figure 4, used the pressing element 53 that forms 3 (that is, lacking 1) assembly through holes 55 than the number of impression assembly 10.
The rotary unit 40 that rotating disk 20 is rotated is positioned at the upside of rotating disk 20 and pressing element 53.Rotary unit 40 has motor 41 and rotating shaft 42.Motor 41 is fixed in main part 30, and rotating shaft 42 is because of motor 41 rotates, and the through hole 54 that passes pressing element 53 inserts the holddown groove 21 that is incorporated into rotating disk 20.Because this formation of rotary unit 40, rotating disk 20 can rotate, according to the anglec of rotation of rotating disk 20, and the relative position between decision platen assembly 10 and the assembly through hole 55.
As Fig. 5 and shown in Figure 6, platen assembly 10 comprises impression pin 12 and needle holder 11, impresses magnet 13.Needle holder 11 is fixed in rotating disk 20 and liftable, and impression pin 12 is inserted in needle holder 11.Has magnet groove 1223 at impression pin 12 in the face of on the face of needle holder 11.Impression magnet 13 forms ring (ring) shape, and the magnet groove 1223 of insertion impression pin 12 is also fixing.Impression magnet 13 provides magnetic force by the direction to tension needle holder 11, with in conjunction with needle holder 11 and impression pin 12.Preferably the degree of depth of magnet groove 1223 makes impression magnet 13 be unlikely to contact pin chuck 11 greater than impression magnet 13 length.By preventing that impressing magnet 13 contacts with needle holder 11, it is damaged because of impact to prevent to impress magnet 13.
Impression pin 12 comprises pin fixed part 122, pin portion 121 and pin elastic portion 123.Pin fixed part 122 is the parts of impression magnet 13 being installed and inserting needle holder 11.Pin portion 121 is installed on pin fixed part 122 and can slides along the vertical direction.Pin elastic portion 123 is installed between pin fixed part 122 and the pin portion 121, and provides elastic force away from direction to pin portion 121 mutually with pin fixed part 122.In the present embodiment, as shown in Figure 6, spring is used as pin elastic portion 123.Pin elastic portion 123 is at pin portion 121 contact lead-wire frameworks 102 and carry out playing in the process of adhesive R impression the effect of buffer, the impact that pin portion 121 is applied with buffering.
As Fig. 5 and shown in Figure 6, form holddown groove 111 on the needle holder 11.On impression pin 12, protrude, form fixed lobe 1222 in conjunction with stud bolt.The fixed lobe 1222 of impression pin 12 is stuck in the holddown groove 111 of needle holder 11, prevents to impress relative rotation between pin 12 and the needle holder 11.
In addition, on pin fixed part 122, form the sliding tray 1221 that prolongs along the vertical direction, in pin portion 121 with the form of stud bolt in conjunction with the slide protrusion 1211 that is inserted in sliding tray 1221.Slide protrusion 1211 allows mutual above-below direction to relatively move with sliding tray 1221, but prevents the relative rotation between pin portion 121 and the pin fixed part 122 simultaneously.
Absorption handover portion 70 is installed on the pedestal 100, transfers absorbent module 80 with horizontal direction along the vertical direction.And, in absorption handover portion 70 device that air pressure is provided is installed, so that can adsorb and transfer semiconductor chip.This absorbent module 80 is incorporated into absorption handover portion 70, is communicated with air pressure, makes this absorbent module 80 can adsorb chip.
This absorbent module 80 comprises adsorption tube 82, adsorption tube chuck 81 and absorption magnet 83.Adsorption tube chuck 81 is incorporated into absorption handover portion 70.Adsorption tube 82 inserts adsorption tube chuck 81, and under the effect of absorption magnet 83, adsorption tube chuck 81 mutually combines with adsorption tube 82.Be formed with magnet groove 84 on adsorption tube 82, absorption magnet 83 inserts magnet groove 84 and fixing.Absorption magnet 83 provides magnetic force to the direction of this adsorption tube chuck 81 of tension, and this adsorption tube chuck 81 is mutually combined with adsorption tube 82.Absorption magnet 83 forms ring (ring) shape, is easy to insert magnet groove 84 on constituting.Preferably the degree of depth of magnet groove 84 is deeper than absorption magnet 83 thickness, and absorption magnet 83 is not in contact with one another with adsorption tube chuck 81.By this formation, has the effect that can prevent these absorption magnet 83 breakages.
Form the passage of up/down perforation in this adsorption tube chuck 81 and adsorption tube 82, air pressure is transmitted by this passage.Under the vacuum pressure effect that forms in adsorption tube 82, adsorption tube 82 can adsorb, transfer chip.
Effect to the die-bonding device of the present embodiment that as above constitutes describes below.
As shown in Figure 2, lead frame handover portion 103 with lead frame 102 be transplanted on impression handover portion 60 near.
Impression lifting unit 50 side shifting on the adhesive container 101 that is installed on the pedestal 100 that impression handover portion 60 makes based on platen assembly 10.As Fig. 2 and shown in Figure 8, splendid attire adhesive R in adhesive container 101.Start impression lifting unit 50 in this state, fall platen assembly 10, the pin portion 121 of platen assembly 10 is dipped among the adhesive R.Further describe the action of falling this platen assembly 10 below.
At first, start this rotary unit 40, make rotating disk 20 rotate to state as shown in Figure 7.That is, rotate this rotating disk 20, make at interval 90 ° of assembly through holes 55 that are arranged in platen assembly 10 and pressing element 53 on the rotating disk 20 by about 45 ° of mutual cross arrangements in interval.In this state, as shown in Figure 8, if start pressurised driving device 51,53 of pressing elements descend and to 10 pressurizations of 4 platen assemblies, platen assembly 10 are descended.So adhesive R is immersed in the pin portion 121 of platen assembly 10, slurry is stained with in pin portion 121.
Start the pressurised driving device once more, pressing element 53 is risen, 22 elastic recoveries of impression spring make platen assembly 10 rise with respect to rotating disk 20.
In this state, start impression handover portion 60, make impression lifting unit 50 side shifting on lead frame 102 based on platen assembly 10.Then, start this rotary unit 40, make rotating disk 20 rotate to state as shown in Figure 9.That is, except that a platen assembly 10, all the other 3 platen assemblies 10 all are positioned at the position identical with the assembly through hole 55 of rotating disk 20.In this state, start pressurised driving device 51, as shown in figure 10, pressing element 53 descends, to 10 pressurizations of a platen assembly in 4 platen assemblies 10.At this moment, all the other 3 platen assemblies 10 pass the assembly through hole 55 of pressing element 53, are not pressurizeed simultaneously, keep original state.Encapsulation place of the pin portion 121 contact lead-wire frameworks 102 of the platen assembly 10 that descends, R impresses in encapsulation place with adhesive.
Again the pressing element 53 that rises makes rotating disk 20 half-twists, and next platen assembly 10 is in the position of can pressurized member 53 falling.Impression handover portion 60 is transferred to the next package position of lead frame 102 with platen assembly 10, and platen assembly 10 pressurized drivers 51 are fallen, to impress this adhesive R.If this process repeats 2 times again, utilize 4 platen assemblies 10 that are installed on rotating disk 20, can carry out impression 4 times.
That is, platen assembly 10 dips in an adhesive R can carry out the operation of 4 impressions, has the very fast advantage of impression operating speed.
On the other hand, as shown in Figure 6, pin portion 121 can slide with respect to pin fixed part 122, between pin portion 121 and pin fixed part 122, be pin elastic portion 123, in platen assembly 10 descends the process that impresses, even the impact between pin portion 121 and the lead frame 102 is bigger, pin elastic portion 123 also can cushion this impact, has the effect that prevents 121 breakages of pin portion.
Impressing pin 12 repetition multi-impression operations as mentioned above, pin portion 121 needs to change because of wearing and tearing., the impression pin 12 of die-bonding device of the present invention is to utilize impression magnet 13 to be incorporated into needle holder 11, has the easily advantage of rapid dismounting.In addition, do not use the screw combination, and be to use the magnet combination, relative displacement remains necessarily between needle holder 11 and the impression pin 12, has the user and need not to adjust separately pin portion 121 advantage highly.
In addition, as mentioned above, impression pin 12 and needle holder 11 are under the effect of the holddown groove of needle holder 11 and the fixed lobe that impresses pin 12 and prevent relative rotation.Therefore advantage is, pin portion 121 invariant positions of impression on lead frame 102 remain certain.Equally, under the effect of sliding tray 1221 and slide protrusion 1211, also prevented the relative rotation between pin fixed part 122 and the pin portion 121, the position of pin portion 121 impressions is kept necessarily.
The lead frame 102 of having finished the operation of adhesive R impression is transplanted on absorption handover portion 70 belows by lead frame handover portion 103.Absorption handover portion 70 holds semiconductor chip one by one, and absorption handover portion's 70 along continuous straight runs are transferred absorbent module 80 with above-below direction, puts chip in each position that lead frame 102 impresses, and makes semiconductor chip be bonded in lead frame 102.As shown in figure 11, the adsorption tube 82 of absorbent module 80 also combines with absorption magnet 83 with adsorption tube chuck 81, can be installed on adsorption tube 82 tram or the dismounting of adsorption tube chuck 81 easily.
More than enumerate advantageous embodiment, die-bonding device of the present invention is illustrated, but scope of the present invention is not limited to above stated specification and accompanying drawing scope.
For example, the front is mentioned, and impression magnet 13 is installed on the impression pin 12, still, also can be that impression magnet is not installed on the impression pin, but be installed on the needle holder, or make magnet be installed on impression pin and needle holder both sides.In addition, the shape of impression magnet is not limited to ring-type, also can other multiple shape constitute.For example, the impression magnet of installing on the pin more than 2 can impressed.
In addition, the front is mentioned, and the platen assembly number of installing on the rotating disk is 4, and still, the number of platen assembly can be done multiple variation in the scope more than 2, and the angle intervals between the platen assembly also can diversely be out of shape.
In addition, impression handover portion 60, impression pressurised driving device 51, pressing element 53, rotary unit 40, absorption handover portion 70 structures also can be different from the structure that accompanying drawing shows, carry out various deformation.

Claims (8)

1. die-bonding device impresses adhesive on the lead frame of supply successively, the position pasting chip having impressed is characterized in that comprising:
Platen assembly, it has impression pin, needle holder and impression magnet, above-mentioned impression pin contacts above-mentioned lead frame, impress above-mentioned adhesive, above-mentioned needle holder is for the combination of above-mentioned impression pin, impression magnet is installed on one of above-mentioned needle holder and above-mentioned impression pin, by provide magnetic force in conjunction with above-mentioned needle holder and above-mentioned impression pin to the direction approaching with respect to another person;
The impression lifting unit makes the lifting along the vertical direction of above-mentioned platen assembly; And
Impression handover portion, along continuous straight runs is transferred above-mentioned platen assembly.
2. die-bonding device according to claim 1 is characterized in that:
But above-mentioned impression pin comprises the pin fixed part, be installed on pin portion that above-mentioned pin fixed part and above-below direction slide, be installed between above-mentioned pin fixed part and the above-mentioned pin portion and to above-mentioned pin portion and above-mentioned pin fixed part mutually away from direction the pin elastic portion of elastic force is provided.
3. die-bonding device according to claim 1 and 2 is characterized in that:
Above-mentioned impression pin has the magnet groove in the face of on the above-mentioned needle holder face,
Above-mentioned impression magnet forms ring-type, is inserted in above-mentioned impression pin magnet groove and fixing.
4. die-bonding device according to claim 3 is characterized in that:
On one of above-mentioned impression pin and above-mentioned needle holder, form holddown groove, on another person, form the fixed lobe that inserts the said fixing groove, rotate with respect to above-mentioned needle holder to prevent above-mentioned impression pin.
5. die-bonding device according to claim 1 and 2 is characterized in that:
Above-mentioned platen assembly has a plurality of,
Rotating disk has a plurality of impression springs, and a plurality of platen assemblies of resiliency supported upward, above-mentioned a plurality of platen assemblies are installed on the above-mentioned rotating disk respectively and liftable;
Main part is incorporated into above-mentioned impression handover portion, and above-mentioned rotating disk rotatably is installed on this main part;
Rotary unit makes above-mentioned rotating disk rotate with respect to aforementioned body portion;
Above-mentioned impression lifting unit comprises pressing element and pressurised driving device, pressing element is positioned at the top and the liftable of above-mentioned a plurality of platen assemblies, to downside at least one pressurization in above-mentioned a plurality of platen assemblies, and having an assembly through hole at least, this assembly through hole can connect for all the other platen assemblies outside the pressurized platen assembly; The pressurised driving device, the pressurised driving device is incorporated into above-mentioned pressing element, makes above-mentioned pressing element with respect to the lifting of aforementioned body portion.
6. die-bonding device according to claim 5 is characterized in that:
The assembly through hole number of above-mentioned pressing element is lacked one than the number of above-mentioned platen assembly.
7. die-bonding device according to claim 6 is characterized in that:
Above-mentioned a plurality of platen assembly along the circumferential direction is spaced by equal angular on above-mentioned rotating disk.
8. die-bonding device according to claim 3 is characterized in that:
Absorbent module has: adsorption tube, and the absorption said chip is so that can be mounted on the lead frame that has impressed above-mentioned adhesive to said chip; The adsorption tube chuck is in conjunction with above-mentioned adsorption tube; Absorption magnet is installed on one of above-mentioned adsorption tube chuck and adsorption tube, to providing magnetic force with respect to another person's direction of closing, in conjunction with above-mentioned adsorption tube chuck and above-mentioned adsorption tube; And
Absorption handover portion transfers above-mentioned absorbent module with horizontal direction along the vertical direction.
CN201110043730.6A 2010-02-24 2011-02-23 Chip welding device Active CN102163565B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020100016598A KR101122138B1 (en) 2010-02-24 2010-02-24 Chip bonding apparatus
KR10-2010-0016598 2010-02-24

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CN102163565A true CN102163565A (en) 2011-08-24
CN102163565B CN102163565B (en) 2014-07-02

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TW (2) TWI401130B (en)

Cited By (3)

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CN110660691A (en) * 2019-10-28 2020-01-07 四川旭茂微科技有限公司 Lead frame glues core device
CN115831829A (en) * 2023-02-16 2023-03-21 山东睿芯半导体科技有限公司 Soft solder chip mounting machine for electronic chip
CN117123981A (en) * 2023-10-26 2023-11-28 江苏快克芯装备科技有限公司 Micro-pressure device of chip suction mechanism and chip welding machine

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KR101122138B1 (en) * 2010-02-24 2012-03-20 주식회사 프로텍 Chip bonding apparatus
CN104084659B (en) * 2014-07-02 2016-04-20 佛山市施翔腾科技设备有限公司 Hot air welding method is adopted to prepare the production method of transistor
CN104148834B (en) * 2014-08-01 2017-02-15 广州明森科技股份有限公司 Equipment and method for efficiently welding chips of double-interface intelligent cards
KR101642659B1 (en) 2015-06-11 2016-07-26 주식회사 프로텍 Die Bonding Apparatus for Semiconductor Chip
CN106298551B (en) * 2016-08-25 2018-11-13 华东光电集成器件研究所 A kind of chip welding briquetting component
KR101949591B1 (en) * 2017-05-24 2019-02-19 주식회사 프로텍 Apparatus for Bonding Flexible Part Including Inclined Leads
CN112366162B (en) * 2021-01-13 2021-04-09 四川晶辉半导体有限公司 Integrated packaging device for surface mount diodes

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CN110660691A (en) * 2019-10-28 2020-01-07 四川旭茂微科技有限公司 Lead frame glues core device
CN115831829A (en) * 2023-02-16 2023-03-21 山东睿芯半导体科技有限公司 Soft solder chip mounting machine for electronic chip
CN115831829B (en) * 2023-02-16 2023-04-25 山东睿芯半导体科技有限公司 Soft solder chip mounting machine for electronic chip
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CN117123981B (en) * 2023-10-26 2024-03-15 江苏快克芯装备科技有限公司 Micro-pressure device of chip suction mechanism and chip welding machine

Also Published As

Publication number Publication date
KR101122138B1 (en) 2012-03-20
CN102163541A (en) 2011-08-24
KR20110096993A (en) 2011-08-31
TWI443781B (en) 2014-07-01
TW201129439A (en) 2011-09-01
TWI401130B (en) 2013-07-11
CN102163541B (en) 2013-10-23
TW201131706A (en) 2011-09-16
CN102163565B (en) 2014-07-02

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