TWI443781B - Chip bonding apparatus - Google Patents

Description

Wafer bonding device

BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to a wafer bonding apparatus, and more particularly to a wafer bonding apparatus for imprinting an adhesive on a lead frame to place a semiconductor wafer at an embossed position to continuously bond the semiconductor wafer to the lead frame.

As shown in Fig. 1, an imprint apparatus which has conventionally imprinted an adhesive on a lead frame has an imprint pin (1). The embossing needle (1) is coated with an adhesive so that the embossing needle (1) contacts the position of the lead frame to which the wafer is to be mounted, and the embossing operation is performed in this manner.

However, this embossing needle is a consumable. If the imprinting operation is repeated, the embossing needle (1) is worn, the embossing accuracy is lowered, and the embossing operation cannot be performed efficiently. Therefore, after the life of the embossing needle (1) is exhausted, the new embossing needle (1) is replaced to continue the embossing operation.

The conventional embossing needle (1) is bonded to the wafer bonding apparatus in a structure as shown in FIG. The embossing needle (1) is screwed to the needle fixing portion (2), and then the fixing nut (3) is coupled to the needle fixing portion (2) as shown in Fig. 1 to prevent the embossing needle (1) from loosening during operation. Take off.

However, when the embossing needle (1) is attached by such a screwing method, there are many inconveniences in replacement work. If the height of the replaced embossing pin (1) changes, the lead frame may be damaged during the embossing operation, and the embossing pin may be damaged or shortened.

Therefore, it is very important to accurately adjust the height of the platen needle (1) and then attach it to the needle fixing portion (2). The embossing needle (1) height adjustment method is to rotate the embossing needle (1) with respect to the needle fixing portion (2). However, since the operator adjusts the height of the embossing needle by trial and error, the embossing needle (1) is loosened a plurality of times or loosened. This method of operation is not only time consuming, but also has a problem that it is difficult to accurately operate. Further, after adjusting the height of the embossing needle (1), if the fixing nut (3) is fastened with respect to the needle fixing portion (2), the height of the embossing needle (1) may vary, and therefore, the height adjustment operation is performed. more difficult.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object thereof is to provide a wafer bonding apparatus which can be conveniently mounted and replaced with a embossing needle, and the embossing needle height can be easily set.

To achieve the above object, a wafer bonding apparatus for mounting a wafer at an embossed position for embossing an adhesive on a sequentially supplied lead frame, the present invention is characterized by comprising: an embossing assembly having an embossing pin a needle collet and an imprinting magnet, the embossing needle contacting the lead frame, embossing the adhesive, the needle collet is combined with the embossing needle, and the embossing magnet is mounted on the needle collet and the embossing needle One, combining the needle collet and the embossing needle by supplying a magnetic force to the approaching method with respect to the other; embossing the lifting portion to lift the embossing assembly up and down; and embossing the conveying portion to be transferred in the horizontal direction The above embossing assembly.

The wafer bonding apparatus of the present invention has an effect that the embossing needle can be mounted and replaced quickly and easily.

Moreover, the present invention has an effect that the height of the embossing needle can be easily set.

The above and other objects, features and advantages of the present invention will become more <RTIgt;

Advantageous embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

Figure 2 is a perspective view of a wafer bonding apparatus in accordance with one embodiment of the present invention. As shown in FIG. 1, the wafer bonding apparatus of the present embodiment includes an imprint transfer portion (60) and an imprint assembly (10) mounted on a susceptor (100), an adsorption transfer portion (70), and an adsorption assembly (80). .

On the susceptor (100), a lead frame transfer portion (103) that sequentially supplies the lead frame (102) and transports it in the horizontal direction is mounted.

That is, the lead frame transfer portion (103) sequentially transfers the lead frame (102), and the imprint assembly (10) and the imprint transfer portion (60) imprint the adhesive (R) to the respective packages of the lead frame (102). The embossed lead frame (102) is transported to the adsorption transfer portion (70) by the lead frame transfer portion (103), and the adsorption transfer portion (70) and the adsorption assembly (80) transfer the wafer adsorption to the lead frame (102). The position of the adhesive (R) is embossed.

The embossing transfer portion (60) is attached to the susceptor (100) and transports the embossed elevating portion (50) in the horizontal direction. The embossing lifting portion (50) is attached to the embossing transfer portion (60) to raise and lower the embossing unit (10) in the up and down direction.

As shown in Figures 3 and 4, in the present embodiment, there are four embossing assemblies (10). The main body portion (30) is coupled to the imprint transfer portion (60) on which four imprint assemblies (10) are mounted, and the imprint transfer portion (60) is transferred in the horizontal direction. A rotating disk (20) is mounted on the main body portion (30) and is rotatable. Four embossing assemblies (10) are mounted on the rotating disk (20) and can be raised and lowered. The rotating disk (20) has four embossing springs (22) corresponding to the respective embossing assemblies (10), and the embossing springs (22) elastically support the respective embossing assemblies (10) upward. The four embossing assemblies (10) are arranged at an angular interval along the circumferential direction of rotation of the rotating disk (20). In the present embodiment, each of the imprint assemblies (10) are arranged at intervals of 90°.

The embossing lifting portion (50) is attached to the main body portion (30) to raise and lower the embossing assembly (10). The embossed lifting portion (50) has a pressing member (53) and a pressurizing driver (51). The pressing member (53) is located on the upper side of the embossing assembly (10), is mounted to the main body portion (30), and is slidable in the up and down direction. A guide groove (31) extending in the up and down direction is formed on the main body portion (30), and a sliding protrusion (56) is formed on the pressing member (53), and the sliding protrusion (56) is inserted into the guiding groove (31) and Slide up and down. The pressurizing actuator (51) is attached to the upper side of the main body portion (30), and the elevating rod (52) is coupled to the pressing member (53). The pressurizing actuator (51) operates to advance or retract the elevating rod (52), and the pressing member (53) connected to the elevating rod (52) rises or falls as the pressurizing actuator (51) operates.

At least one component through hole (55) is formed in the pressing member (53). When the pressurizing actuator (51) lowers the pressing member (53), at least one imprinting assembly (10) does not descend while passing through the component through hole (55), and the remaining imprinting assembly (10) is pressurized. The member (53) is lowered by pressing. In the present embodiment, as shown in Fig. 4, a pressing member (53) which forms three (i.e., one less than the number of the imprinting assemblies (10)) of the module through-holes (55) is used.

A rotary unit (40) that rotates the rotary disk (20) is located on the upper side of the rotary disk (20) and the pressing member (53). The rotating unit (40) has a motor (41) and a rotating shaft (42). The motor (41) is fixed to the main body portion (30), and the rotating shaft (42) is rotated by the motor (41), and the through hole (54) passing through the pressing member (53) is inserted into the fixing groove coupled to the rotating plate (20). (twenty one). Due to such a configuration of the rotary unit (40), the rotary disk (20) can be rotated, and the relative position between the imprint assembly (10) and the component through hole (55) is determined according to the rotation angle of the rotary disk (20).

As shown in FIGS. 5 and 6, the embossing assembly (10) includes an embossing pin (12) and a needle nipple (11), and an embossing magnet (13). The needle holder (11) is fixed to the rotary disk (20) and can be lifted and lowered, and the embossing needle (12) is inserted into the needle holder (11). A magnet groove (1223) is provided on a surface of the platen needle (12) facing the needle chuck (11). The embossing magnet (13) is formed in a ring shape, inserted into the magnet groove (1223) of the embossing pin (12), and fixed. The embossing magnet (13) combines the needle holder (11) with the embossing needle (12) by providing a magnetic force in the direction of tensioning the needle holder (11). Preferably, the depth of the magnet slot (1223) is greater than the length of the stamping magnet (13) so that the stamping magnet (13) does not contact the needle collet (11). By preventing the imprint magnet (13) from coming into contact with the needle collet (11), it is possible to prevent the imprint magnet (13) from being damaged by the impact.

The embossing needle (12) includes a needle fixing portion (122), a needle portion (121), and a needle elastic portion (123). The needle fixing portion (122) is a portion to which the impression magnet (13) is attached and inserted into the needle holder (11). The needle portion (121) is attached to the needle fixing portion (122) and is slidable in the up and down direction. The needle elastic portion (123) is attached between the needle fixing portion (122) and the needle portion (121), and provides an elastic force in a direction away from the needle portion (121) and the needle fixing portion (122). In the present embodiment, as shown in Fig. 6, a spring is used as the needle elastic portion (123). The needle elastic portion (123) functions as a damper in the process of the needle portion (121) contacting the lead frame (102) and performing the adhesive (R) imprinting to buffer the impact applied to the needle portion (121).

As shown in FIGS. 5 and 6, a fixing groove (111) is formed in the needle chuck (11). A stud bolt is protruded from the embossing needle (12) to form a fixing protrusion (1222). The fixing projection (1222) of the embossing needle (12) is caught in the fixing groove (111) of the needle holder (11) to prevent relative rotation between the embossing needle (12) and the needle holder (11).

Further, a sliding groove (1221) extending in the vertical direction is formed in the needle fixing portion (122), and a sliding projection (1211) inserted into the sliding groove (1221) is joined to the needle portion (121) in the form of a headless bolt. . The sliding projections (1211) and the sliding grooves (1221) allow relative movement in the up and down direction while preventing relative rotation between the needle portion (121) and the needle fixing portion (122).

The adsorption transfer unit (70) is attached to the susceptor (100) and transports the adsorption unit (80) in the vertical direction and the horizontal direction. Further, means for supplying air pressure is attached to the adsorption transfer portion (70) so that the semiconductor wafer can be adsorbed and transferred. The adsorption assembly (80) is coupled to the adsorption transfer portion (70) to communicate air pressure so that the adsorption assembly (80) can adsorb the wafer.

The adsorption assembly (80) includes a adsorption tube (82), a adsorption tube holder (81), and an adsorption magnet (83). The adsorption tube chuck (81) is coupled to the adsorption transfer portion (70). The adsorption tube (82) is inserted into the adsorption tube holder (81), and the adsorption tube holder (81) and the adsorption tube (82) are combined with each other by the adsorption magnet (83). A magnet groove (84) is formed in the adsorption tube (82), and the adsorption magnet (83) is inserted into the magnet groove (84) and fixed. The adsorption magnet (83) supplies a magnetic force in a direction in which the adsorption tube holder (81) is pulled, and the adsorption tube holder (81) and the adsorption tube (82) are coupled to each other. The adsorption magnet (83) is formed in a ring shape, and is easily inserted into the magnet groove (84). Preferably, the depth of the magnet groove (84) is deeper than the thickness of the adsorption magnet (83) so that the adsorption magnet (83) does not contact the adsorption tube holder (81). With this configuration, there is an effect that the adsorption magnet (83) can be prevented from being damaged.

A channel that penetrates vertically is formed in the adsorption tube collet (81) and the adsorption tube (82), and air pressure is transmitted through the passage. The adsorption tube (82) can adsorb and transfer the wafer under the vacuum pressure formed in the adsorption tube (82).

Next, the operation of the wafer bonding apparatus of the present embodiment configured as above will be described.

As shown in FIG. 2, the lead frame transfer portion (103) transfers the lead frame (102) to the vicinity of the imprint transfer portion (60).

The embossing transfer unit (60) moves the embossed elevating portion (50) mainly including the embossing unit (10) toward the upper side of the adhesive container (101) attached to the susceptor (100). As shown in FIGS. 2 and 8, the adhesive container (101) contains an adhesive (R). In this state, the embossing lifter (50) is activated, and the embossing assembly (10) is lowered to immerse the needle portion (121) of the embossing assembly (10) in the adhesive (R). The action of lowering the embossing assembly (10) is described in further detail below.

First, the rotating unit (40) is activated to rotate the rotating disk (20) to the state shown in FIG. That is, the rotary disk (20) is rotated so that the imprint assembly (10) arranged at intervals of 90° on the rotary disk (20) and the component through-hole (55) of the pressing member (53) cross each other at intervals of about 45°. arrangement. In this state, as shown in Fig. 8, if the pressurizing actuator (51) is activated, the pressing member (53) is lowered and the four imprinting assemblies (10) are pressurized to lower the imprinting assembly (10). . Thus, the needle portion (121) of the embossing assembly (10) is immersed in the adhesive (R), and the needle portion (121) is immersed in the adhesive liquid.

The pressurizing actuator is activated again to raise the pressing member (53), and the stamping spring (22) is elastically restored to raise the imprinting assembly (10) relative to the rotating disc (20).

In this state, the imprint transfer portion (60) is activated to move the imprint elevating portion (50) mainly composed of the imprint assembly (10) toward the upper side of the lead frame (102). Then, the rotating unit (40) is activated to rotate the rotating disk (20) to the state shown in FIG. That is, except for one imprint assembly (10), the remaining three imprint assemblies (10) are located at the same position as the component through holes (55) of the rotary disk (20). In this state, the pressurizing actuator (51) is activated, and as shown in Fig. 10, the pressing member (53) is lowered to pressurize one of the four imprinting assemblies (10). At this time, the remaining three embossing members (10) pass through the component through-holes (55) of the pressing member (53) while being unpressurized and maintained in the original state. The needle portion (121) of the lowered embossing assembly (10) contacts the package of the lead frame (102) and embosses the adhesive (R) at the package.

The pressing member (53) is raised again to rotate the rotary disk (20) by 90°, and the next imprint assembly (10) is at a position that can be lowered by the pressing member (53). The imprint transfer portion (60) transfers the imprint assembly (10) to the next package position of the lead frame (102), and the imprint assembly (10) is lowered by the pressurizing driver (51) to imprint the adhesive ( R). If this process is repeated two more times, four imprints can be performed using four imprint assemblies (10) mounted on the rotating disk (20).

That is, the embossing assembly (10) 蘸 one time of the adhesive (R) can perform four embossing operations, and has the advantage that the embossing operation speed is very fast.

On the other hand, as shown in Fig. 6, the needle portion (121) is slidable relative to the needle fixing portion (122), and between the needle portion (121) and the needle fixing portion (122) is a needle elastic portion (123). During the embossing of the embossing assembly (10), even if the impact between the needle portion (121) and the lead frame (102) is large, the needle elastic portion (123) cushions the impact and has the needle portion ( 121) The effect of damage.

The embossing operation is repeated a plurality of times by the embossing needle (12) as described above, and the needle portion (121) needs to be replaced due to wear. However, the embossing needle (12) of the wafer bonding apparatus of the present invention is bonded to the needle holder (11) by means of an embossing magnet (13), and has the advantage that it can be easily and quickly disassembled. In addition, instead of using the screw combination method, the magnets are combined, and the relative displacement between the needle chuck (11) and the embossing needle (12) is always kept constant, and the user does not need to adjust the height of the needle portion (121) separately. .

Further, as described above, the nip pin (12) and the needle chuck (11) are prevented from rotating relative to each other by the fixing groove of the needle chuck (11) and the fixing projection of the nip pin (12). Therefore, there is an advantage in that the position of the needle portion (121) embossed on the lead frame (102) does not change and is always kept constant. Similarly, under the action of the sliding groove (1221) and the sliding protrusion (1211), the relative rotation between the needle fixing portion (122) and the needle portion (121) is also prevented, and the needle portion (121) can be imprinted. The position remains certain.

The lead frame (102) on which the adhesive (R) imprinting operation is completed is transferred to the lower side of the adsorption transfer portion (70) by the lead frame transfer portion (103). The adsorption transfer unit (70) sucks the semiconductor wafer one by one, and the adsorption transfer unit (70) transfers the adsorption unit (80) in the horizontal direction and the vertical direction, and places the wafer at each position where the lead frame (102) is imprinted. The semiconductor wafer is bonded to the lead frame (102). As shown in Fig. 11, the adsorption tube (82) of the adsorption module (80) and the adsorption tube holder (81) are also combined by an adsorption magnet (83), and the adsorption tube (82) can be easily attached to the adsorption tube holder. (81) The correct position or removal.

The wafer bonding apparatus of the present invention has been described above by taking advantage of the advantageous embodiments, but the scope of the present invention is not limited to the foregoing description and the scope of the drawings.

For example, as mentioned above, the embossing magnet (13) is mounted on the embossing pin (12), but it is also possible that the embossing magnet is not mounted on the embossing pin, but is mounted on the needle holder or the magnet is mounted on the ejector pin. Emboss the needle and the sides of the needle holder. Further, the shape of the imprint magnet is not limited to the ring shape, and may be formed in other various shapes. For example, two or more embossed magnets can be mounted on the embossing needle.

In addition, as mentioned above, the number of embossing components mounted on the rotating disk is four, but the number of embossing components can be varied in more than two ranges, and the angular interval between the embossing components can also be Variantly deformed.

Further, the structure of the imprint transfer portion (60), the imprint pressurizing driver (51), the pressing member (53), the rotating unit (40), and the adsorption transfer portion (70) may be different from the structure shown in the drawings. A variety of deformations.

While the present invention has been described in its preferred embodiments, the present invention is not intended to limit the invention, and the present invention may be modified and modified without departing from the spirit and scope of the invention. The scope of protection is subject to the definition of the scope of the patent application.

1. . . Imprint pin

2. . . Needle fixation

3. . . Fixing nut

10. . . Imprinting assembly

11. . . Needle chuck

12. . . Imprint pin

13. . . Imprinted magnet

20. . . Rotating disk

twenty one. . . Fixed slot

twenty two. . . Imprinted spring

30. . . Main body

31. . . Boot slot

40. . . Rotating unit

41. . . motor

42. . . Rotary axis

50. . . Embossing lift

51. . . Pressurized drive

52. . . Lifting rod

53. . . Pressurized member

54. . . Through hole

55. . . Component through hole

56. . . Sliding bulge

60. . . Imprint transfer department

70. . . Adsorption transfer unit

80. . . Adsorption assembly

81. . . Adsorption tube chuck

82. . . Adsorption tube

83. . . Adsorption magnet

84. . . Magnet slot

100. . . Pedestal

101. . . Adhesive container

102. . . Lead frame

103. . . Lead frame transfer unit

111. . . Fixed slot

121. . . Needle

122. . . Needle fixation

123. . . Needle elastic

1211. . . Sliding bulge

1221. . . Sliding slot

1222. . . Fixed bulge

1223. . . Magnet slot

1 is a partial cross-sectional view showing a conventional wafer bonding apparatus.

Figure 2 is a perspective view of a wafer bonding apparatus in accordance with one embodiment of the present invention.

Figure 3 is a partially enlarged perspective view of the wafer bonding apparatus of Figure 2;

Figure 4 is a partially exploded perspective view of the wafer bonding apparatus of Figure 3.

Figure 5 is a perspective elevational view of the embossing assembly of the wafer bonding apparatus of Figure 2;

Figure 6 is a cross-sectional view taken along line VI-VI of the stamping assembly of the wafer bonding apparatus shown in Figure 5.

7 to 10 are drawings for explaining the operation method of the wafer bonding apparatus shown in Fig. 2.

Figure 11 is a cross-sectional view of the adsorption assembly of the wafer bonding apparatus of Figure 2.

30. . . Main body

40. . . Rotating unit

50. . . Embossing lift

60. . . Imprint transfer unit

70. . . Adsorption transfer unit

80. . . Adsorption assembly

100. . . Pedestal

101. . . Adhesive container

102. . . Lead frame

103. . . Lead frame transfer unit

Claims (7)

A wafer bonding apparatus for embossing an adhesive on a lead frame sequentially supplied, and mounting the wafer at an embossed position, characterized by comprising: a plurality of embossing assemblies having embossing pins and needle holders a head and an imprinting magnet, the embossing needle contacting the lead frame, embossing the adhesive, the needle collet is coupled to the embossing needle, and the embossing magnet is mounted on the needle collet and the embossing needle Firstly, the needle collet and the embossing needle are combined by providing a magnetic force to a method of approaching the other; the embossing portion is embossed, and the embossing assembly is lifted up and down; the embossing portion is horizontally Transferring the above-mentioned imprinting assembly; the rotating disc has a plurality of embossing springs, and elastically supports a plurality of embossing assemblies upwardly, the plurality of embossing assemblies are respectively mounted on the rotating disc and movable up and down; the main body portion is coupled to the pressing portion a printing transfer unit, wherein the rotating disk is rotatably attached to the main body portion; and a rotating unit that rotates the rotating disk relative to the main body portion; the embossing lifting portion includes a pressing member and And a pressing member located at an upper portion of the plurality of embossing assemblies and movable up and down, pressurizing at least one of the plurality of embossing assemblies to a lower side, and having at least one component through hole, the component through hole being The remaining imprinting assembly other than the pressurized imprinting assembly penetrates; the pressurizing actuator is coupled to the pressing member to raise and lower the pressing member with respect to the main body portion. The wafer bonding apparatus according to claim 1, wherein the embossing needle comprises a needle fixing portion, is attached to the needle fixing portion, and a needle portion that slides in the vertical direction, and a needle elastic portion that is attached between the needle fixing portion and the needle portion and that provides an elastic force in a direction away from the needle portion and the needle fixing portion. The wafer bonding apparatus according to claim 1 or 2, wherein the embossing needle has a magnet groove facing the needle chuck face, and the embossing magnet is formed in a ring shape and inserted into the embossing pin magnet. The slot is fixed. The wafer bonding apparatus according to claim 3, wherein: a fixing groove is formed on one of the nip roller and the needle nip, and a fixing protrusion inserted into the fixing groove is formed on the other, In order to prevent the above-mentioned embossing needle from rotating relative to the above-mentioned needle holder. The wafer bonding apparatus according to claim 1, wherein the number of the through holes of the pressing member is one less than the number of the imprinting assemblies. The wafer bonding apparatus according to claim 5, wherein the plurality of imprinting assemblies are arranged at equal angular intervals in the circumferential direction on the rotating disk. The wafer bonding apparatus according to claim 3, wherein the adsorption module has: an adsorption tube that adsorbs the wafer so that the wafer can be attached to a lead frame on which the adhesive is embossed; the adsorption tube chuck And combining the adsorption tube; the adsorption magnet is mounted on one of the adsorption tube holder and the adsorption tube, and supplies a magnetic force in an approaching direction with respect to the other, in combination with the adsorption tube holder and the adsorption tube; The adsorption transfer unit transfers the adsorption unit in the vertical direction and the horizontal direction.