CN101192552A - Semiconductor apparatus balling procedure and soldering flux tainting and printing tool used therefor - Google Patents
Semiconductor apparatus balling procedure and soldering flux tainting and printing tool used therefor Download PDFInfo
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- CN101192552A CN101192552A CNA2006101608611A CN200610160861A CN101192552A CN 101192552 A CN101192552 A CN 101192552A CN A2006101608611 A CNA2006101608611 A CN A2006101608611A CN 200610160861 A CN200610160861 A CN 200610160861A CN 101192552 A CN101192552 A CN 101192552A
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- semiconductor device
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- scaling powder
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
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Abstract
The invention relates to a process for manufacturing solder sphere placement of a semiconductor device and a touching and printing fixture of flux used in the process. The process for manufacturing the solder sphere placement of the semiconductor device includes the processes that: first, a touching and printing fixture of flux is provided, one surface of which is wall-attached to a soft-quality impression having a plurality of array touching and printing bumps; second, the flux is touched with and attached to the plurality of touching and printing bumps; third, the flux on the plurality of touching and printing bumps are transferred and printed on a semiconductor device; then, a plurality of free wielding balls are arranged on the semiconductor device and are touched and fixed by the transferred and printed flux; at last, the plurality of free wielding balls are return-wielded to be fixed on the semiconductor device. The touching and printing fixture of the flux is applicable to the process for manufacturing the solder sphere placement of the semiconductor device. One surface of the touching and printing fixture of the flux is wall-attached with a soft-quality impression having a plurality of array touching and printing bumps. The invention has the effect of non-needle type touching and printing flux, can solve the known problem of needle damage and fracture caused due to using individual touching and printing fixture of the flux with a touching and printing needle, and has the advantages of low wear, easy displacement and low cost.
Description
Technical field
The present invention relates to a kind of semiconductor device of scaling powder that adopts and plant the playing skill art, particularly relate to and a kind ofly have needle-free and be stained with the seal scaling powder, can not exist and be stained with seal pin abrasion and cause damage and broken needle problem, make and be stained with printing tool and have low abrasion, change easily and the scaling powder of planting ball processing procedure and use thereof of the semiconductor device of advantage of low cost is stained with printing tool.
Background technology
Semiconductor device is the active electric sub-element for a kind of microminiaturization, and the external terminal that connects of semiconductor device can be the lead foot of lead frame, the lead-in wire or the soldered ball of film usually.Wherein, soldered ball is arranged on the bottom surface of semiconductor device, can dwindle the area coverage of surface engagement, can reach highdensity configuration.
See also shown in Figure 1A to 1D, what relate to a kind of existing known semiconductor device plants the ball processing procedure.Shown in Figure 1A, provide a scaling powder to be stained with printing tool 110, surface thereof 111 is to be connected with a plurality of seal pins 120 of being stained with.Then, this scaling powder is stained with printing tool 110 descends, make those be stained with seal pin 120 and attach scaling powder 130.
Then, shown in Figure 1B, this scaling powder that attaches scaling powder 130 is stained with printing tool 110 drops to contact semiconductor device 140, will be stained with a plurality of ball pads 141 that the scaling powder 130 that prints on the pin 120 is needed on this semiconductor device 140 at those.A kind of existing known relevant ball attachment machine scaling powder that similarly uses this scaling powder to be stained with printing tool 110 is stained with a mechanism can be with reference to TaiWan, China letters patent M285034 number.
Afterwards, then shown in Fig. 1 C, utilize a plurality of free soldered balls 150 of a ball attachment machine sucker 160 absorption, those free soldered balls 150 are arranged at this semiconductor device 140.
At last, shown in Fig. 1 D, utilize the reflow technology that those free soldered balls 150 are fixed on this semiconductor device 140.Along with the highdensity configuration of soldered ball, it is at interval more and more littler to plant ball, and those intervals of being stained with seal pin 120 also need to dwindle synchronously, become to be more prone to damage and fracture.In addition, those are stained with seal pin 120 and are for hard and are connected this scaling powder individually and are stained with printing tool 110, cause manufacturing cost to improve.When the seal pin 120 of being stained with of part causes damage or bending to take place because of the copline error of impression, can influence the quality of planting ball and improve and plant the ball cost.
This shows, above-mentioned existing semiconductor devices plant the ball processing procedure in manufacture method, product structure and use, obviously still have inconvenience and defective, and demand urgently further being improved.In order to solve the problem of above-mentioned existence, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but do not see always that for a long time suitable design finished by development, and general manufacture method and product do not have appropriate method and structure to address the above problem, and this obviously is the problem that the anxious desire of relevant dealer solves.Therefore that how to found a kind of new semiconductor device plants the ball processing procedure, real one of the current important research and development problem that belongs to, and also becoming the current industry utmost point needs improved target.
Because the defective of planting the existence of ball processing procedure of above-mentioned existing semiconductor devices, the inventor is based on being engaged in this type of product design manufacturing abundant for many years practical experience and professional knowledge, and the utilization of cooperation scientific principle, actively studied innovation, be stained with printing tool in the hope of the scaling powder of planting ball processing procedure and use thereof of founding a kind of new semiconductor device, that can improve general existing semiconductor devices plants the ball processing procedure, makes it have more practicality.Through constantly research, design, and after studying repeatedly and improving, create the present invention who has practical value finally.
Summary of the invention
Main purpose of the present invention is, overcome the defective that the ball processing procedure exists of planting of existing semiconductor devices, and provide a kind of new semiconductor device plant the ball processing procedure and the employed scaling powder of this processing procedure is stained with printing tool, technical problem to be solved is to make it have the effect that needle-free is stained with the seal scaling powder, make and be stained with printing tool and have low abrasion, change easily and advantage cheaply, thereby be suitable for practicality more.
The object of the invention to solve the technical problems realizes by the following technical solutions.A kind of semiconductor device that proposes according to the present invention plant the ball processing procedure, may further comprise the steps: at first, provide a scaling powder to be stained with printing tool, surface thereof is to be pasted with a soft die, and this soft die be have a plurality of arrays be stained with the seal projection.Then, attach scaling powder and be stained with the seal projection in those.Then, transfer printing those be stained with the scaling powder of seal on the projection to the semiconductor device.Afterwards, a plurality of free soldered balls are set, and it is fixed to be stained with cementation with the scaling powder of transfer printing in this semiconductor device.At last, those free soldered balls of reflow anchor on this semiconductor device it.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid semiconductor device plant the ball processing procedure, wherein said soft die is to can be the rubber material.
Aforesaid semiconductor device plant the ball processing procedure, wherein said semiconductor device is to have a plurality of ball pads, its position is that to be stained with the seal projection corresponding with those.
Aforesaid semiconductor device plant the ball processing procedure, wherein said semiconductor device is to be selected from one of them of semiconductor packaging part, semiconductor wafer and semiconductor wafer.
The object of the invention to solve the technical problems also realizes by the following technical solutions.The present invention has also disclosed a kind of employed scaling powder of above-mentioned processing procedure of complying with in addition and has been stained with printing tool.Be stained with printing tool according to a kind of scaling powder that the present invention proposes, its be applicable to semiconductor device plant the ball processing procedure, the surface that this scaling powder is stained with printing tool is to be pasted with a soft die, and this soft die be have a plurality of arrays be stained with the seal projection.
The object of the invention to solve the technical problems can also be further achieved by the following technical measures.Aforesaid scaling powder is stained with printing tool, and wherein said soft die is to be the rubber material.
By technique scheme, the scaling powder of planting ball processing procedure and use thereof of semiconductor device of the present invention is stained with printing tool and is had following advantage at least: the planting in the ball processing procedure of semiconductor device of the present invention, use has the scaling powder of soft die and is stained with printing tool, replace known having and be stained with the scaling powder of seal pin and be stained with printing tool, do not wear away the problem that causes damaging with broken needle so can not have the existing known seal pin of being stained with.In addition, this soft die can be changed by full slice system, makes this scaling powder be stained with printing tool and has more the good effect that is easy to change trimming.
In sum, the scaling powder of planting ball processing procedure and use thereof of the semiconductor device of novelty of the present invention is stained with printing tool, it has the effect that needle-free is stained with the seal scaling powder, can solve the problem of being stained with pin damage that printing tool causes and fracture that seal pin scaling powder is stained with in known use individually, make and be stained with printing tool and have low abrasion, change easily and advantage cheaply.The present invention has above-mentioned plurality of advantages and practical value, no matter it all has bigger improvement on manufacture method, product structure or function, obvious improvement is arranged technically, and produced handy and practical effect, and the outstanding effect that the ball processing procedure has enhancement of planting than existing semiconductor devices, thereby being suitable for practicality more, and having the extensive value of industry, really is a new and innovative, progressive, practical new design.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of specification, and for above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Figure 1A to 1D is a kind of existing known schematic cross-section of semiconductor device in planting the ball processing procedure.
Fig. 2 A to Fig. 2 E is according to a specific embodiment of the present invention, the schematic cross-section of a kind of semiconductor device in planting the ball processing procedure.
Fig. 3 is according to a specific embodiment of the present invention, this semiconductor device plant the schematic side view that a scaling powder is stained with printing tool in the ball processing procedure.
Fig. 4 is that this scaling powder is stained with the schematic bottom view of printing tool according to a specific embodiment of the present invention.
110: scaling powder is stained with printing tool 111: the surface
120: be stained with seal pin 130: scaling powder
140: semiconductor device 141: the ball pad
150: free soldered ball 160: ball attachment machine sucker
210: scaling powder is stained with printing tool 211: the surface
220: soft die 221: be stained with the seal projection
230: scaling powder 240: semiconductor device
241: ball pad 242: substrate
243: adhesive body 250: free soldered ball
260: the ball attachment machine sucker
Embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, the scaling powder of planting ball processing procedure and use thereof of the semiconductor device that foundation the present invention is proposed is stained with its embodiment of printing tool, processing procedure, step, structure, feature and effect thereof, describe in detail as after.
In a specific embodiment of the present invention, please cooperate and consult shown in Fig. 2 A to 2E, be according to a specific embodiment of the present invention, the schematic cross-section of a kind of semiconductor device in planting the ball processing procedure.Below disclose a kind of semiconductor device plant the ball processing procedure and the employed scaling powder of this processing procedure is stained with printing tool.
At first, shown in Fig. 2 A, provide a scaling powder to be stained with printing tool 210.See also Fig. 3 and shown in Figure 4, this scaling powder be stained with printing tool 210 be applicable to semiconductor device plant the ball processing procedure, the surface 211 that this scaling powder is stained with printing tool 210 is to be pasted with a soft die 220, and it is to be sheet, and this soft die 220 is to have being stained with of a plurality of arrays to print projection 221.This soft die 220 is to can be rubber (rubber) material.Then, this scaling powder that descends is stained with the load plate that printing tool 210 to contains scaling powder 230, is stained with seal projection 221 to attach scaling powder 230 in those.
Shown in Fig. 2 B, those are stained with the scaling powder 230 of seal on the projection 221 to semiconductor device 240 transfer printing.This semiconductor device 240 is to have a plurality of ball pads 241, its position be with those be stained with the seal projection 221 corresponding.Those ball pads 241 are to be arranged on the substrate of this semiconductor device 240 242.In the present embodiment, this semiconductor device 240 is to can be selected from one of them of semiconductor packaging part, semiconductor wafer and semiconductor wafer.With the semiconductor package part is example, and this semiconductor device 240 is to comprise an adhesive body 243 in addition, for example comprises the mould adhesive body (molding compound) of curing agent and inorganic filler, and it is sealing one wafer (not drawing among the figure).After the transfer printing, shown in Fig. 2 C, scaling powder 230 is those ball pads 241 that transfer printing is formed up to this semiconductor device 240.
Afterwards, shown in Fig. 2 D, in a ball attachment machine, utilize a plurality of free soldered balls 250 of a ball attachment machine sucker 260 absorption, be stained with when those free soldered balls 250 and stick to the scaling powder 230 that is transferred, promptly discharge the absorption affinity of this ball attachment machine sucker 260, so that those free soldered balls 250 are arranged at this semiconductor device 240, and it is fixed to be stained with cementation with the scaling powder 230 of transfer printing.At this indication " free soldered ball " is the soldered ball that exists for independent individual, under no absorption affinity, can move freely.Perhaps, can utilize and plant the ball steel plate, be arranged at those free soldered balls 250 on this semiconductor device 240 and in alignment with those ball pads 241.
At last, shown in Fig. 2 E, those free soldered balls 250 of reflow.In a reflow stove, those free soldered balls 250 can be welded to those ball pads 241.So those free soldered balls 250 can be anchored on this semiconductor device 240.
Therefore, planting in the ball processing procedure of above-mentioned semiconductor device, use has the scaling powder of soft die 210 and is stained with printing tool 210, replaces existing known having and is stained with the scaling powder of seal pin and is stained with printing tool, does not wear away the problem that causes damaging with broken needle so can not have the known seal pin of being stained with.In addition, this soft die 210 can be changed by full slice system, makes this scaling powder be stained with printing tool 210 and has more the effect that is easy to change trimming.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be not break away from the technical solution of the present invention content, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (6)
- A semiconductor device plant the ball processing procedure, it is characterized in that it may further comprise the steps:Provide a scaling powder to be stained with printing tool, surface thereof is to be pasted with a soft die, and this soft die be have a plurality of arrays be stained with the seal projection;Attach scaling powder and be stained with the seal projection in those;Those are stained with the scaling powder of seal on the projection to the semiconductor device transfer printing;A plurality of free soldered balls are set in this semiconductor device, and it is fixed to be stained with cementation with the scaling powder of transfer printing; AndThose free soldered balls of reflow anchor on this semiconductor device it.
- Semiconductor device according to claim 1 plant the ball processing procedure, it is characterized in that wherein said soft die is to be the rubber material.
- Semiconductor device according to claim 1 plant the ball processing procedure, it is characterized in that wherein said semiconductor device is to have a plurality of ball pads, its position is that to be stained with the seal projection corresponding with those.
- Semiconductor device according to claim 1 plant the ball processing procedure, it is characterized in that wherein said semiconductor device is to be selected from one of them of semiconductor packaging part, semiconductor wafer and semiconductor wafer.
- 5. a scaling powder is stained with printing tool, its be applicable to semiconductor device plant the ball processing procedure, it is characterized in that it is to be pasted with a soft die that this scaling powder is stained with a surface of printing tool, and this soft die be have a plurality of arrays be stained with the seal projection.
- 6. scaling powder according to claim 5 is stained with printing tool, it is characterized in that wherein said soft die is to be the rubber material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006101608611A CN101192552A (en) | 2006-11-30 | 2006-11-30 | Semiconductor apparatus balling procedure and soldering flux tainting and printing tool used therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006101608611A CN101192552A (en) | 2006-11-30 | 2006-11-30 | Semiconductor apparatus balling procedure and soldering flux tainting and printing tool used therefor |
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| Publication Number | Publication Date |
|---|---|
| CN101192552A true CN101192552A (en) | 2008-06-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2006101608611A Pending CN101192552A (en) | 2006-11-30 | 2006-11-30 | Semiconductor apparatus balling procedure and soldering flux tainting and printing tool used therefor |
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| Country | Link |
|---|---|
| CN (1) | CN101192552A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105470145A (en) * | 2015-12-16 | 2016-04-06 | 华进半导体封装先导技术研发中心有限公司 | Template-free dual-roller-shaft wafer ball mounting process |
| CN111128769A (en) * | 2019-11-29 | 2020-05-08 | 中国电子科技集团公司第十三研究所 | Ball mounting structure and ball mounting method for ball grid array package |
| CN111816568A (en) * | 2020-07-28 | 2020-10-23 | 东莞记忆存储科技有限公司 | Processing method of tin-printing ball-planting steel mesh |
-
2006
- 2006-11-30 CN CNA2006101608611A patent/CN101192552A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105470145A (en) * | 2015-12-16 | 2016-04-06 | 华进半导体封装先导技术研发中心有限公司 | Template-free dual-roller-shaft wafer ball mounting process |
| CN105470145B (en) * | 2015-12-16 | 2017-11-24 | 华进半导体封装先导技术研发中心有限公司 | Ball technique is planted without the double roller bearing wafers of template |
| CN111128769A (en) * | 2019-11-29 | 2020-05-08 | 中国电子科技集团公司第十三研究所 | Ball mounting structure and ball mounting method for ball grid array package |
| CN111816568A (en) * | 2020-07-28 | 2020-10-23 | 东莞记忆存储科技有限公司 | Processing method of tin-printing ball-planting steel mesh |
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