200822242 九、發明說明： 【發明所屬之技術領域】 本發明係有關於採用助銲劑之半導體裝置植球技術，特 別係有關於一種半導體裝置之植球製程。 【先前技術】200822242 IX. Description of the Invention: [Technical Field] The present invention relates to a semiconductor device ball-planting technique using a flux, and in particular to a ball-planting process for a semiconductor device. [Prior Art]
技，半導體裝置係為一種微小化的主動式電子元件，通 $半導體裝置對外連接的端子可以是導線架之導腳、薄膜之 引線、或是銲球。其中，銲球係設置在半導體裝置之底面， 可以縮小表面接合的覆蓋面積，能達到高密度的配置。 第1A至1D圖係有關於一種習知半導體裝置之植球製 耘。如第1A圖所示，提供一助銲劑沾印治具丨丨〇，其一表 面111係一體連接有複數個沾印針12〇。接著，將該助銲劑 沾印治具110下降，使該些沾印針120沾附上助銲劑13〇。 接著，如第1B圖所示，將沾附有助銲劑13〇之該助銲劑沾 印治具U0下降至接觸一半導體裝置14〇,將在該些沾印針 120上之助銲劑13〇轉印於該半導體裝置14〇之複數個球墊 mi。一種習知同樣地使用該助銲劑沾印治具11〇之相關植 球機助銲劑沾點機構可參照本國專利證號M285〇34號。 之後，如第1C圖所示，利用一植球機吸盤16〇吸附複數 個自由銲球150,將該些自由銲球15G設置於該半導體裝置 140。最後’如第1D圖所示，利用回銲技術將該些自由銲球 15〇固定在該半導體裝4 14Gi。隨著銲球高密度之配置， 植球間隔越來越小，該些沾印針12〇《間隔亦需要同步縮 小’變得更加容易損傷與斷裂。此外，該些沾印針12〇係為 5 200822242 硬質且個料接在該助銲劑沾印治具UG，導致製造成 高。當部分之沾印針120因壓印的共平面誤差導致損 折發生，會影響植球品質並提高植球成本。 【發明内容】 本發明之主要目的係在於提供—種半導體裝置之植球 =及該製程所使用之—助銲心印治具，具有無針式沾印助 Ο = 丨之功效’使沾印治具具有低磨耗、更換容易與低成本之 慢點。 本發明的目的及解決其技術問題是採用以下技術方案來 現的。依據本發明揭示__種半導體裝置之植球製程。首 =，提供-助銲劑沾印治具，其—表面係貼附有_軟質印 且該軟f印模係、具有複數個陣列之沾印凸塊。接著，、、、占 :二銲劑於該些沾印凸塊。接著，轉印該些沾印凸塊上之助 Μ至一 +導體裝置。之後’設置複數個自由銲球於該半導 =裝置’並以轉印之助銲劑沾枯固^。最後，回銲該此自由 銲球，使其固著在該半導體裝置 用之助銲劑沾印治具。 。另揭不依上述製程所使 本發明的目的及解決苴祜游Ρ卩 進-步實現。#、’、技街問以可採用以下技術掛施 在前述的半導體裝置之植球製程中，該軟質印 像膠材質。 在^ 述的半導體裝置之植球製程中，該半導體裝置係可 複數個球塾’其位置係與該些沾印凸塊相對岸。 在前述的半導體裝置之植球製程中，該半導體裝置係可 6 200822242 一半導體晶圓與一半導體晶片之其 選自於一半導體封裝件、 中之一。 【實施方式】The semiconductor device is a miniaturized active electronic component, and the externally connected terminals of the semiconductor device may be a lead leg of a lead frame, a lead of a film, or a solder ball. Among them, the solder ball is disposed on the bottom surface of the semiconductor device, and the coverage area of the surface bonding can be reduced, and a high-density configuration can be achieved. The 1A to 1D drawings relate to a ball-making process of a conventional semiconductor device. As shown in Fig. 1A, a flux-implanting jig is provided, and a surface 111 is integrally connected with a plurality of dip pins 12 〇. Next, the flux-carrying jig 110 is lowered, and the dipsticks 120 are adhered with the flux 13 。. Next, as shown in FIG. 1B, the flux-carrying fixture U0 to which the flux 13 is adhered is lowered to contact a semiconductor device 14A, and the flux 13 on the pasting pins 120 is turned. A plurality of ball pads mi printed on the semiconductor device 14A. A conventional ball-use flux-welding mechanism for the same use of the flux-carrying jig 11 can refer to the national patent number M285〇34. Thereafter, as shown in Fig. 1C, a plurality of free solder balls 150 are adsorbed by a ball sputter chuck 16 to mount the free solder balls 15G on the semiconductor device 140. Finally, as shown in Fig. 1D, the free solder balls 15 are fixed to the semiconductor package 4 14Gi by a reflow soldering technique. With the high density of the solder balls, the ball placement interval is getting smaller and smaller, and the squeezing pins 12 〇 "intervals need to be simultaneously reduced" become more susceptible to damage and breakage. In addition, the squeegee 12 〇 is 5 200822242 hard and the material is attached to the flux smudge UG, resulting in a high manufacturing. When part of the dip needle 120 is damaged due to the coplanar error of the imprint, it will affect the quality of the ball and increase the cost of the ball. SUMMARY OF THE INVENTION The main object of the present invention is to provide a semiconductor device for ball placement = and the use of the process of the flux-welding fixture, with needle-free printing aid 丨 丨 功效 ' 使 使 使 使 沾 沾 沾The fixture has a low point of wear, easy replacement and low cost. The object of the present invention and solving the technical problems thereof are achieved by the following technical solutions. According to the present invention, a ball placement process of a semiconductor device is disclosed. First =, provide - flux smear fixture, the surface of the affixed with _ soft print and the soft f impression system, with a plurality of arrays of imprinted bumps. Then, , , , and : 2 fluxes are applied to the bumps. Next, the auxiliary on the imprinted bumps is transferred to a + conductor device. Thereafter, a plurality of free solder balls are placed on the semiconductor device = device and dried with a transferred flux. Finally, the free solder ball is reflowed to be adhered to the flux-carrying fixture for the semiconductor device. . Further, the object of the present invention and the solution are not implemented according to the above process. The ##, ', technical street can be applied to the above-mentioned semiconductor device ball processing process, the soft printing material. In the ball implantation process of the semiconductor device described above, the semiconductor device can have a plurality of balls 塾 whose positions are opposite to the smudge bumps. In the foregoing ball implantation process of the semiconductor device, the semiconductor device can be selected from one of a semiconductor package and a semiconductor wafer. [Embodiment]
在本毛明之一具體實施例中，配合參閱第2A至2D 圖以T冑τ牙重帛導體裝置之植球製程以及該製程所使 用之一助銲劑沾印治具。 々首先如第2 A圖所示，提供一助銲劑沾印治具2丨〇。如 第3及4圖所不，該助銲劑沾印治具2iq係適用於半導體裝 置之植球製程，該助銲劑沾印治具21〇之一表面2ιι係貼二 有一軚貝印杈220，其係為片狀，並且該軟質印模係具 有複數㈣狀沾印凸塊221。該軟f印模⑽係可為橡膠 (rubber)材質。接著，下降該助銲劑沾印治具21〇至一含有 助銲劑230之載盤，以沾附助銲劑23〇於該些沾印凸塊u卜 如第2B圖所示，轉印該些沾印凸塊221上之助銲劑23〇 至一半導體裝置240。該半導體裝置24〇係可具有複數個球 墊24卜其位置係與該些沾印凸塊221相對應。該些球墊a" 係可設置於該半導體裝置24〇之_基板上242。在本實施例 中，該半導體裝置240係可選自於一半導體封裝件、一半導 體晶圓與一半導體晶片之其中之一。以半導體封裝件為例， 該半導體裝置240係可另包含一封膠體243，例如包含固化 劑與無機填料之模封膠體（molding c〇mp〇und)，其係密封一 晶片（圖未繪出）。轉印之後，如第2C圖所示，助銲劑 係轉印形成至該半導體裝置240之該些球墊241。 之後，如第2D圖所示，在一植球機内，利用一植球機吸 7 200822242 盤260吸附複數個自由銲球250，當該些自由銲球25〇沾枯 至被轉印之助銲劑230，即釋放該植球機吸盤26〇之吸附 力，以將該些自由銲球250設置於該半導體裝置24〇，並以 轉印之助麵劑2 3 0沾钻固定。在此所指「自由銲球」係為獨 立個體存在之銲球，在無吸附力下，可自由移動。或者，可 以利用植球鋼板，將該些自由銲球25〇設置於該半導體裝置 240上並對準於該些球塾241。In one embodiment of the present invention, the ball processing process of the T胄τ tooth heavy conductor device and the flux soldering tool used in the process are matched with reference to Figures 2A to 2D. 々 First, as shown in Figure 2A, a flux-carrying fixture is provided. As shown in Figures 3 and 4, the flux-imprinting fixture 2iq is suitable for a ball-planting process of a semiconductor device, and the surface of the flux-carrying fixture 21 is 22 ι 系 二 軚 , , , It is in the form of a sheet, and the soft stamp has a plurality of (four) shaped bumps 221 . The soft f stamp (10) can be a rubber material. Then, the flux is rubbed onto the fixture 21 〇 to a carrier containing the flux 230 to adhere the flux 23 to the smudge bumps as shown in FIG. 2B, and the smear is transferred. The flux 23 on the printed bumps 221 is transferred to a semiconductor device 240. The semiconductor device 24 can have a plurality of ball pads 24 corresponding to the position of the smear bumps 221. The ball pads a" can be disposed on the substrate 242 of the semiconductor device 24 . In this embodiment, the semiconductor device 240 can be selected from one of a semiconductor package, a semiconductor wafer, and a semiconductor wafer. Taking a semiconductor package as an example, the semiconductor device 240 may further comprise a colloid 243, such as a molding compound comprising a curing agent and an inorganic filler, which seals a wafer (not shown) ). After the transfer, as shown in Fig. 2C, the flux is transferred to the ball pads 241 of the semiconductor device 240. Thereafter, as shown in FIG. 2D, in a ball planting machine, a plurality of free solder balls 250 are adsorbed by a ball planter 7 200822242 disk 260, and when the free solder balls 25 are wetted to the transferred flux 230, that is, the adsorption force of the ball suction cup 26 is released, and the free solder balls 250 are placed on the semiconductor device 24, and fixed by the transfer of the co-agent 203. The term "free solder ball" as used herein refers to a solder ball that exists as an independent individual and is free to move without adsorption. Alternatively, the free solder balls 25 may be disposed on the semiconductor device 240 and aligned with the ball 241 by using a ball-and-ball steel plate.
最後’如第2F圖所示，回銲該些自由銲球25〇。在一回 銲爐内，該些自由銲球25〇會熔接至該些球墊241。故使該 些自由銲球250會固著在該半導體裝置24〇上。 所因此，在上述之半導體裝置之植球製程中，使用具有軟 質印模210之助銲劑沾印治具21〇，取代習知具有沾印針之 助銲劑沾印治具，故不會有習知沾印針磨耗導致損傷與斷針 的問題。此外’在該軟質印模210可整片式進行更換，使得 該助㈣沾印治具21G具有Μ更換整修之功效。 明/上所述、’僅是本發明的較佳實施例而已，並非對本發 任何形式上的限制，雖然本發明已以較佳實施例揭露如 ㈣2並非心^本發明，任何熟悉本項技術者，在不 X明之中料利範圍内，所作的任何 性變化與修飾，皆涵蓋於本發明的技術範圍内。專效 【圖式簡單說明】 k ⑴ϋ . -種習知半導體裝置在植球製程中之截 示意圖。 ★ Α至2D圖：依據本發明之—具體實施例，—種半導體 200822242 Ο 襄置在植球製m中之冑面示意圖 第3 圖 :依據本發明之- 一具體實施例 ，該半導 體 裝置之植球 製程中 一助銲劑沾印治具之 側視示意 圖 〇 第4 圖 •依據本發明之- 一具體實施例 ，該助銲 劑 沾印治具之 底面示 意圖。 【主要 -元件符號說明: 1 110 助 銲劑沾印 治具 111 表 面 120 沾 印針 130 助銲劑 140 半 導體裝置 141 球墊 150 由銲球 160 植球機吸盤 210 助 銲劑沾印 治具 211 表 面 220 軟 質印模 221 沾印凸塊 230 助 銲劑 240 半 導體裝置 241 球墊 242 基板 243 封 膠體 250 1 由銲球 260 植球機吸盤 9Finally, as shown in Fig. 2F, the free solder balls 25 are reflowed. In a reflow oven, the free solder balls 25 are welded to the ball pads 241. Therefore, the free solder balls 250 are fixed to the semiconductor device 24A. Therefore, in the above-mentioned ball-planting process of the semiconductor device, the flux-carrying jig 21 with the soft stamp 210 is used, instead of the flux-carrying jig with the paste needle, it is not a habit. Knowing that the needle wear causes damage and broken needles. In addition, the soft stamp 210 can be replaced in a single piece, so that the auxiliary (4) printing jig 21G has the effect of replacement and refurbishment. The present invention has been described in terms of a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and the present invention has been disclosed in the preferred embodiments. Any changes and modifications made within the scope of the present invention are encompassed within the technical scope of the present invention. Special effects [Simple description of the diagram] k (1) ϋ . - A schematic diagram of a conventional semiconductor device in a ball placement process. Α to 2D diagram: a schematic diagram of a semiconductor device 200822242 襄 在 in a ball-making m according to the present invention. FIG. 3 is a view of the semiconductor device according to the present invention. A side view of a flux smear fixture in a ball placement process. FIG. 4 is a schematic view of the underside of the flux smear fixture according to the present invention. [Main-component symbol description: 1 110 Flux paste fixture 111 Surface 120 Squeegee 130 Flux 140 Semiconductor device 141 Ball pad 150 Ball ball 160 Ball machine suction cup 210 Flux paste 211 Surface 220 Soft Die 221 Dip bump 230 Flux 240 Semiconductor device 241 Ball pad 242 Substrate 243 Encapsulant 250 1 Sucker plate by solder ball 260