CN115831829A - Soft solder chip mounting machine for electronic chip - Google Patents
Soft solder chip mounting machine for electronic chip Download PDFInfo
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- CN115831829A CN115831829A CN202310120089.4A CN202310120089A CN115831829A CN 115831829 A CN115831829 A CN 115831829A CN 202310120089 A CN202310120089 A CN 202310120089A CN 115831829 A CN115831829 A CN 115831829A
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Abstract
The invention relates to the field of chip welding, in particular to a soft solder chip mounting machine for an electronic chip. Wherein the stamp member comprises: fix the driving motor in the supporting seat upper end, drive mechanism is connected with driving motor's output shaft transmission, pushing down the mechanism, set up in the drive mechanism below, drive mechanism links to each other with pushing down the mechanism, the bracing piece links to each other with pushing down the mechanism, slewing mechanism, set up in the bracing piece lower extreme, rotatory plectane links to each other with the bracing piece, three through-hole is seted up at even interval on the rotatory plectane, impression subassembly the same with through-hole quantity, all overlap and locate in the through-hole that corresponds, every impression subassembly all includes impression spring, impression pole and impression syringe needle, the impression pole sets up in the through-hole, the impression spring cover is located on the impression pole, the impression syringe needle sets up in the lower extreme of impression pole, every impression subassembly below corresponds lead frame, adhesive cartridge and purger respectively, this device can incessant impression adhesive, shorten impression time, improve chip welding process efficiency.
Description
Technical Field
The invention relates to the field of chip welding, in particular to a soft solder chip mounting machine for an electronic chip.
Background
The semiconductor chip is soldered to the lead frame with an adhesive such as epoxy resin. In the bonding process of such semiconductor chips, an automated machine called a die bonding apparatus is used. The die bonding apparatus includes a feeder for supplying the lead frame in units of work, an adhesive stamping device for stamping the lead frame with an adhesive, a bonding device for mounting the semiconductor chip on the lead frame stamped with the adhesive, a discharger for discharging the lead frame mounted with the semiconductor chip from a work position, and the like.
Since the semiconductor chip is small in size, it is suitable to stamp the adhesive on the lead frame by using the adhesive stamping device, compared with directly dispensing the adhesive on the lead frame to solder the semiconductor chip. The adhesive stamping device has an elongated bar-shaped stamping member, which is dipped with an adhesive at its distal end and is stamped on the lead frame, thereby supplying the adhesive to the lead frame.
However, since the conventional adhesive imprinting apparatus performs the imprinting operation using one imprinting unit, there is a problem in that the imprinting time and the semiconductor chip bonding time are prolonged.
In order to solve such a problem, a method using a plurality of platen assemblies has been proposed, but this method requires an increase in the number of drivers to be mounted for driving the platen assemblies, and thus has a problem of an increase in manufacturing cost.
Disclosure of Invention
In view of the foregoing, there is a need to provide a soft solder die bonder for electronic chips.
In order to solve the problems of the prior art, the invention adopts the technical scheme that:
electronic chip's soft solder chip bonding machine including the carousel with fixed the carrier that sets up on the carousel, the carrier internal fixation is provided with the lead frame, still includes impression part, including:
the supporting seat is arranged beside the turntable in a vertical state;
the driving motor is fixedly arranged on one side of the upper end of the supporting seat;
the transmission mechanism is arranged on the other side of the supporting seat in a vertical state and is in transmission connection with an output shaft of the driving motor;
the pressing mechanism is arranged below the transmission mechanism in a vertical state, and the power output end of the transmission mechanism is movably connected with the power input end of the pressing mechanism;
the supporting rod is vertically arranged below the pressing mechanism and is fixedly connected with the power output end of the pressing mechanism;
the rotating mechanism is arranged at the lower end of the supporting rod and comprises a rotating connecting plate, three abutting brackets, a rotating circular plate and a fixing bracket, the rotating connecting plate is in a horizontal state and is fixedly connected with the lower end of the supporting rod coaxially, three abutting short rods are uniformly and fixedly arranged on the side wall of the rotating connecting plate along the circumferential direction, the abutting brackets are arranged below the rotating connecting plate and are fixedly connected with the supporting seats, abutting protrusions used for the sliding of the abutting short rods are formed on one side of each abutting bracket, the fixing bracket is arranged below the rotating connecting plate in a horizontal state and is fixedly connected with the supporting seats, the rotating circular plate is rotatably connected with the fixing bracket through bearings, and three through holes are uniformly formed in the edge of the rotating circular plate along the circumferential direction;
the number of the embossing assemblies is the same as that of the through holes, the embossing assemblies are movably sleeved in the corresponding through holes in a vertical state, all the embossing assemblies are uniformly and fixedly arranged below the rotary connecting plate along the circumferential direction of the rotary connecting plate, each embossing assembly is connected with the rotary circular plate in a sliding mode through a linear bearing, each embossing assembly comprises an embossing spring, an embossing rod and an embossing needle head, the embossing rod is fixedly arranged at the bottom of the rotary connecting plate in a vertical state, the embossing spring is coaxially sleeved on the embossing rod in a vertical state, two ends of the embossing spring respectively abut against the top of the rotary circular plate and the bottom of the rotary connecting plate, and the embossing needle head is movably arranged at the lower end of the embossing rod;
adhesive box and purger all are vertical state and set up in supporting seat lower extreme one side, every impression subassembly below corresponds lead frame, adhesive box and purger respectively.
Further, drive mechanism is including bad gear, axis of rotation, slip box and slip ring, and the axis of rotation passes through shaft coupling and driving motor's output shaft coaxial line fixed connection, the bad gear of one end coaxial line fixed connection of axis of rotation, and the slip ring is vertical state and sets up in one side of supporting seat and the slip ring links to each other with pushing down the power input end transmission of mechanism, bad gear and slip ring intermittent type transmission are connected, and the slip box is vertical state and fixed the setting in supporting seat upper end one side.
Further, its characterized in that, drive mechanism still includes two slide bars, and two slide bars are fixed respectively and set up both ends about the slip ring, and the slide bar that is located the slip ring lower extreme is connected with the power input end transmission of pushing down the mechanism, the shaping has the slip tooth on one side inner wall of slip ring, inferior gear and slip tooth meshing, and the shaping has the slip sand grip on the both sides outer wall of slip ring, and the slip box is vertical state fixed and sets up in supporting seat upper end one side, offers on the inside wall of slip box and supplies slip ring gliding spacing spout from top to bottom, the slip sand grip slides in spacing spout.
Furthermore, the utility model is characterized in that, the mechanism that pushes down is including roof, movable rod, first support frame, rotating member, rotatory sleeve and bottom plate, and the roof is that the horizontal state coaxial line is fixed to be set up in the slide bar below, and first support frame is fixed to be set up in one side of supporting seat, the roof is fixed to be set up in the one end of first support frame, and the movable rod is vertical state coaxial line cover and locates on the roof to the upper end of movable rod passes through the bearing and fixes the slide bar activity that sets up in the slip ring lower extreme and links to each other, the movable rod is the power input end of the mechanism that pushes down, and the rotatory sleeve is vertical state coaxial line and passes through the bearing activity and sets up in the roof below, and the bottom plate is horizontal state movable sleeve and locates outside the bracing piece and fixed the linking to each other with the bottom of rotatory sleeve, and the rotating member is vertical state activity and sets up in the rotatory sleeve, and the upper end of rotating member is fixed with the lower extreme of movable rod and links to each other, and the upper end of bracing piece is the power output end of the mechanism that pushes down.
Further, its characterized in that, pushing down the mechanism still including fixed sleeve, fixed sleeve is vertical state and sets up in the roof below, sets up three perpendicular spout along circumferencial direction evenly distributed on the fixed sleeve outer wall, and above-mentioned rotating member upper end shaping has three along circumferencial direction evenly distributed slip short column, and all slip short columns and all perpendicular spout one-to-ones, and the shaping has a plurality of along circumferencial direction evenly distributed's bar spout on the rotating member lower extreme outer wall, the shaping has the spacing sand grip of a plurality of on rotating sleeve's the inner wall, the spacing sand grip of a plurality of and all bar spout one-to-ones.
Further, its characterized in that pushes down the mechanism and still including first buffer spring and second support frame, first buffer spring is vertical state coaxial line cover and locates on the movable rod, and first buffer spring's both ends respectively with roof lower extreme and the lower extreme of movable rod inconsistent, still set up three chute along circumferencial direction evenly distributed on the fixed sleeve lateral wall, every chute is located between per two perpendicular chutes, the second support frame is the horizontality and sets up in supporting seat one side and is connected with the rotating sleeve rotation through the bearing.
Further, its characterized in that, every the impression subassembly still includes the suction head mounting, seals plectane and buffer gear, and the suction head mounting is the fixed one end that sets up in the impression pole of vertical state, and the shaping has a plurality of strip arch on the suction head mounting inner wall, seals the plectane and is the fixed setting in suction head mounting lower extreme of horizontality, and the impression syringe needle passes seals the plectane and with seal plectane sliding connection, and buffer gear slides and sets up in the suction head mounting, every the spacing breach of a plurality of, every strip arch and spacing breach one-to-one have been seted up on the buffer gear top.
Further, its characterized in that, every buffer gear all includes telescopic link and second buffer spring, the stiff end of telescopic link and suction head mounting upper end fixed connection and telescopic link expansion end and impression syringe needle top fixed connection, and on the telescopic link was located to the coaxial cover of second buffer spring, impression syringe needle top and telescopic link stiff end were contradicted respectively at second buffer spring's both ends.
Compared with the prior art, the invention has the beneficial effects that:
one is as follows: according to the invention, the time for stamping the adhesive is shortened, the time for welding the chip is shortened, and the production efficiency of the chip welding process is improved;
and the second step is as follows: according to the invention, the positions of the three stamping assemblies can be alternately changed, so that the adhesive can be continuously stamped without stopping the equipment midway and dipping the adhesive again, and the time for stamping the adhesive is shortened;
and thirdly: the invention is provided with the buffer mechanism, so that the lead frame is prevented from being damaged in the imprinting process;
fourthly, the method comprises the following steps: the invention has simple structure, high equipment integration level and production cost saving.
Drawings
FIG. 1 is an elevational isometric view of a three-dimensional structure of the present invention;
FIG. 2 is an exploded perspective view of the transmission of the present invention;
FIG. 3 is a perspective elevation view of the hold-down mechanism of the present invention;
FIG. 4 is a perspective elevational view of the hold-down mechanism of the present invention;
FIG. 5 is a front isometric view of the three-dimensional structure of the hold-down mechanism of the present invention;
FIG. 6 is an exploded perspective view of the hold-down mechanism of the present invention;
FIG. 7 is an isometric elevational view of the rotational mechanism of the present invention;
FIG. 8 is a schematic perspective view of the punch assembly and cushion mechanism of the present invention;
FIG. 9 is an enlarged view of the structure at A in FIG. 7;
FIG. 10 is a schematic perspective view of the platen and turntable of the present invention;
fig. 11 is a side view of the present invention.
The reference numbers in the figures are: 1. a lead frame; 2. a carrier; 3. a turntable; 4. an impression member; 5. an adhesive agent box; 6. a washer; 7. a supporting seat; 8. a drive motor; 9. a transmission mechanism; 10. a bad gear; 11. a rotating shaft; 12. a slide cassette; 13. a limiting chute; 14. a slip ring; 15. sliding the convex strip; 16. a sliding tooth; 17. a slide bar; 18. a pressing mechanism; 19. a top plate; 20. a movable rod; 21. a first support frame; 22. a first buffer spring; 23. fixing the sleeve; 24. a vertical chute; 25. a chute; 26. a rotating member; 27. a sliding stub; 28. a strip-shaped chute; 29. a second support frame; 30. rotating the sleeve; 31. limiting convex strips; 32. a base plate; 33. a support bar; 34. a rotating mechanism; 35. rotating the connecting plate; 36. against the short rod; 37. abutting against the bracket; 38. abutting against the protrusion; 39. rotating the circular plate; 40. a through hole; 41. a fixed bracket; 42. an imprinting assembly; 43. stamping a spring; 44. a coining rod; 45. a suction head fixing piece; 46. strip-shaped bulges; 47. a buffer mechanism; 48. a telescopic rod; 49. a second buffer spring; 50. sealing the circular plate; 51. stamping a needle head; 52. and limiting the gap.
Detailed Description
For further understanding of the features and technical means of the present invention, as well as the specific objects and functions attained by the present invention, the present invention will be described in further detail with reference to the accompanying drawings and detailed description.
Referring to fig. 1 to 11, the soft solder die bonder for electronic chips comprises a turntable 3 and a carrier 2 fixedly arranged on the turntable 3, wherein a lead frame 1 is fixedly arranged in the carrier 2;
it should be noted that the device adopts a stepping motor and a cam divider, wherein an output shaft of the stepping motor is connected with an input end of the cam divider through an intermediate product for transmitting torque such as a gear box, and an output end of the cam divider is connected with the rotating disc 3. The stepping motor in the device can be replaced by other modes, such as: a common motor and a speed reducer (low cost); servo motors (fast speed response); a stepper motor (self-contained brake function); in addition, the cam divider in the device is a standard part as the cylinder, and the cam divider is a device which depends on the gapless fit between the cam and the roller pin (the meshing transmission mode is similar to worm and gear transmission) and carries out repeated transmission operation along a given cam curve; the types of the product can be selected as follows: PU flat plate conjugate type cam dividers (50 PU, 60PU, 65PU, 80PU and 100 PU) and DT platform desktop type cam dividers (80 DT, 110DT and 140 DT); the connection mode between the output end of the cam divider and the rotary disc 3 is as follows: the tightening mode that the direct connection mode adopted, the most is that the method of selecting the output ring flange of decollator to carry out many screws fastening with carousel 3 accomplishes, wherein introduces about the specific patent of cam decollator application in the graduation pay-off field: CN 113000306B;
also included is a stamp member 4 comprising:
the supporting seat 7 is arranged beside the turntable 3 in a vertical state;
the driving motor 8 is fixedly arranged on one side of the upper end of the supporting seat 7;
the transmission mechanism 9 is vertically arranged on the other side of the supporting seat 7, and the transmission mechanism 9 is in transmission connection with an output shaft of the driving motor 8;
the pressing mechanism 18 is vertically arranged below the transmission mechanism 9, and the power output end of the transmission mechanism 9 is movably connected with the power input end of the pressing mechanism 18;
the supporting rod 33 is vertically arranged below the pressing mechanism 18 and is fixedly connected with the power output end of the pressing mechanism 18;
the rotating mechanism 34 is arranged at the lower end of the supporting rod 33, the rotating mechanism 34 comprises a rotating connecting plate 35, an abutting support 37, a rotating circular plate 39 and a fixing support 41, the rotating connecting plate 35 is in a horizontal state and is fixedly connected with the lower end of the supporting rod 33 coaxially, three abutting short rods 36 are uniformly and fixedly arranged on the side wall of the rotating connecting plate 35 along the circumferential direction, the abutting support 37 is arranged below the rotating connecting plate 35 and is fixedly connected with the supporting seat 7, an abutting protrusion 38 used for sliding the abutting short rods 36 is formed on one side of the abutting support 37, the fixing support 41 is arranged below the rotating connecting plate 35 in a horizontal state and is fixedly connected with the supporting seat 7, the rotating circular plate 39 is rotatably connected with the fixing support 41 through a bearing, and three through holes 40 are uniformly formed in the edge of the rotating circular plate 39 along the circumferential direction;
the number of the stamping assemblies 42 is the same as that of the through holes 40, the stamping assemblies 42 are movably sleeved in the corresponding through holes 40 in a vertical state, all the stamping assemblies 42 are uniformly and fixedly arranged below the rotary connecting plate 35 along the circumferential direction of the rotary connecting plate 35, each stamping assembly 42 is in sliding connection with the rotary circular plate 39 through a linear bearing, each stamping assembly 42 comprises a stamping spring 43, a stamping rod 44 and a stamping needle head 51, the stamping rod 44 is fixedly arranged at the bottom of the rotary connecting plate 35 in a vertical state, the stamping spring 43 is coaxially sleeved on the stamping rod 44 in a vertical state, two ends of the stamping spring 43 respectively abut against the top of the rotary circular plate 39 and the bottom of the rotary connecting plate 35, and the stamping needle head 51 is movably arranged at the lower end of the stamping rod 44;
and the adhesive agent box 5 and the cleaner 6 are vertically arranged on one side of the lower end of the support seat 7, and each stamping component 42 corresponds to the lead frame 1, the adhesive agent box 5 and the cleaner 6 below.
When the device runs, the step of pressing down: the driving motor 8 is started to drive the transmission mechanism 9 to operate, the transmission mechanism 9 transmits power to the pressing mechanism 18 to drive the supporting rod 33 to press downwards, the supporting rod 33 presses downwards to drive the rotary connecting plate 35 to move downwards, in the pressing process of the rotary connecting plate 35, the short abutting rod 36 touches the abutting protrusion 38 to drive the rotary connecting plate 35 to rotate for a small angle and then continue to press downwards linearly, so that the rotary connecting plate 35 drives all the stamping rods 44 to rotate for a small angle together and then continue to press downwards linearly, in the process, the rotary circular plate 39 rotates in the fixed support 41 at the same angle as the rotary connecting plate 35 and all the stamping assemblies 42, then all the stamping rods 44 move downwards through the through holes 40 in the rotary circular plate 39 to stamp, at the moment, the spring 43 sleeved on the stamping rods 44 is compressed under force, the stamping needle 51 connected to the lower ends of the stamping rods 44 also moves downwards together, and at this moment, the needle stamping 51 positioned above the adhesive box 5 stretches into the adhesive box 5 to dip the adhesive. Lifting: after the pressing-down step is completed, the transmission mechanism 9 temporarily loses the contact force against the pressing-down mechanism 18, the impression spring 43 releases the pressure, and pushes the rotating connecting plate 35 to drive the supporting rod 33 to move upwards and drive the impression rod 44 to return to the original height, in the process, the interference protrusion 38 loses the limit on the contact short rod 36, and the supporting rod 33 moves upwards to drive the power output end of the pressing-down mechanism 18 to lift upwards and rotate clockwise, so that each impression assembly 42 exchanges positions. The power output end of the transmission mechanism 9 moves upward together with the upward rotation and lifting of the pressing mechanism 18. After the stamping spring 43 releases pressure, all stamping rods 44 and the power output end of the transmission mechanism 9 are driven to move upwards and return to the initial state, at the moment, the turntable 3 drives the lead frame 1 arranged on the carrier 2 to rotate for a certain angle until the position below a stamping needle 51 dipped with adhesive is positioned, the transmission mechanism 9 drives the power transmission mechanism 18 to drive the device to repeat the pressing step, so that the stamping needle 51 positioned above the lead frame 1 stamps the adhesive on the lead frame 1, the stamping needle 51 positioned above the adhesive box 5 extends into the box to dip the adhesive, the stamping needle 51 positioned on the cleaner 6 extends into the cleaner 6 to clean the stamping needle 51, after the adhesive stamping of one lead frame 1 is completed, the device releases pressure through the stamping spring 43 again to repeat the lifting step, the stamping assembly 42 is driven to rotate and return to the initial height to wait for the transmission mechanism 9 to transmit the power to drive the device to perform the pressing step, then the turntable 3 rotates again to drive the next lead frame 1 needing stamping adhesive to rotate to the position below the stamping assembly 42 dipped with the adhesive, the stamping assembly 42 waits for stamping adhesive stamping, the step of the stamping assembly to be stamped, the stamping assembly is cyclically repeated, and the adhesive can improve the efficiency of the subsequent chip welding.
In order to ensure that the driving motor 8 transmits power to the pressing mechanism 18 through the transmission mechanism 9 when the device operates, the following characteristics are specifically provided:
the transmission mechanism 9 comprises a inferior gear 10, a rotating shaft 11, a sliding box 12 and a sliding ring 14, the rotating shaft 11 is fixedly connected with an output shaft of the driving motor 8 through a shaft coupling in a coaxial line manner, one end of the rotating shaft 11 is fixedly connected with the inferior gear 10 in a coaxial line manner, the sliding ring 14 is arranged on one side of the supporting seat 7 in a vertical state and is connected with a power input end of the pressing mechanism 18 in a transmission manner, the inferior gear 10 is connected with the sliding ring 14 in an intermittent transmission manner, and the sliding box 12 is fixedly arranged on one side of the upper end of the supporting seat 7 in a vertical state.
When the device operates, the driving motor 8 is started to drive the rotating shaft 11 to rotate, then the inferior gear 10 fixed at one end of the rotating shaft 11 starts to rotate, as the inferior gear 10 is in transmission connection with the sliding ring 14, the sliding ring 14 is driven to move downwards in the sliding box 12 when the inferior gear 10 rotates, then the sliding ring 14 transmits the downward pressing motion to the power input end of the downward pressing mechanism 18, and then the downward pressing mechanism 18 operates to enable the impression spring 43 to be stressed and compressed.
In order to ensure that the inferior gear 10 is in intermittent transmission connection with the sliding ring 14 when the device is in operation, the following characteristics are specifically provided:
When the device is operated, the inferior gear 10 is meshed with the sliding teeth 16, so that when the inferior gear 10 rotates, the sliding ring 14 is driven to move downwards in the sliding box 12 along the length direction of the limiting sliding chute 13, then the sliding rods 17 fixed at two ends of the sliding ring 14 are driven to move downwards, the sliding rod 17 at the lower end is abutted against the power input end of the pressing mechanism 18 to drive the pressing mechanism 18 to operate, so that the stamping spring 43 is stressed and compressed, after one pressing movement is completed, the inferior gear 10 rotates until one side without teeth is not meshed with the sliding teeth 16, at the moment, the stamping spring 43 releases pressure, so that the power input end of the pressing mechanism 18 is restored to the initial height, the sliding rod 17 at the lower end of the sliding ring 14 pushes the sliding ring 14 to move upwards to the initial height, meanwhile, the inferior gear 10 rotates until one side with teeth is meshed with the sliding teeth 16 again, and drives the sliding rod 17 again to convey pressing power to the pressing mechanism 18, so as to provide pressing power for the whole device.
The downward pressing mechanism 18 comprises a top plate 19, a movable rod 20, a first support frame 21, a rotating part 26, a rotating sleeve 30 and a bottom plate 32, wherein the top plate 19 is in a horizontal state and coaxially and fixedly arranged below the sliding rod 17, the first support frame 21 is fixedly arranged on one side of the support base 7, the top plate 19 is fixedly arranged at one end of the first support frame 21, the movable rod 20 is in a vertical state and coaxially sleeved on the top plate 19, the upper end of the movable rod 20 is movably connected with the sliding rod 17 fixedly arranged at the lower end of the sliding ring 14 through a bearing, the movable rod 20 is the power input end of the downward pressing mechanism 18, the rotating sleeve 30 is in a vertical state and coaxially and movably arranged below the top plate 19 through a bearing, the bottom plate 32 is in a horizontal state and movably sleeved outside the support rod 33 and fixedly connected with the bottom of the rotating sleeve 30, the rotating part 26 is movably arranged in the rotating sleeve 30, the upper end of the rotating part 26 is fixedly connected with the lower end of the movable rod 20, the upper end of the support rod 33 penetrates through the bottom plate 32 and is fixedly connected with the rotating part 26, and the power output end of the downward pressing mechanism 18 is the rotating part.
When the device operates, the transmission mechanism 9 drives the sliding rod 17 to move downwards, the sliding rod 17 fixedly arranged at the lower end of the sliding ring 14 is movably connected with the movable rod 20, so as to drive the movable rod 20 to move downwards, the movable rod 20 abuts against the rotating piece 26 to drive the rotating piece 26 to move downwards, the rotating piece 26 abuts against the supporting rod 33 to drive the supporting rod 33 to move downwards, so that the downward pressing power of the transmission mechanism 9 is transmitted to the supporting rod 33, and the supporting rod 33 drives the rotating mechanism 34 and the imprinting assembly 42 to move downwards.
In order to ensure that the device is operated, the rotating element 26 can stably move downwards in the vertical direction in the rotating sleeve 30, the following features are provided:
the lower pressing mechanism 18 further comprises a fixing sleeve 23, the fixing sleeve 23 is arranged below the top plate 19 in a vertical state, three vertical sliding grooves 24 which are uniformly distributed along the circumferential direction are formed in the outer wall of the fixing sleeve 23, sliding short columns 27 which are uniformly distributed along the circumferential direction are formed in the upper end of the rotating piece 26, all the sliding short columns 27 correspond to all the vertical sliding grooves 24 in a one-to-one mode, a plurality of strip-shaped sliding grooves 28 which are uniformly distributed along the circumferential direction are formed in the outer wall of the lower end of the rotating piece 26, a plurality of limiting convex strips 31 are formed in the inner wall of the rotating sleeve 30, and the plurality of limiting convex strips 31 correspond to all the strip-shaped sliding grooves 28 in a one-to-one mode.
When the device is operated, the movable rod 20 drives the rotating part 26 to move downwards, the three sliding short columns 27 formed on the rotating part 26 slide downwards along the length direction of the three vertical sliding grooves 24, and the strip-shaped sliding grooves 28 formed at the lower end of the rotating part 26 are matched with the limiting convex strips 31 formed on the inner wall of the rotating sleeve 30 to ensure that the rotating part 26 can stably move downwards along the axial direction of the rotating sleeve 30.
In order to ensure that the device operates, the support rod 33 moves upwards and rotates 120 degrees after being released from the pressure of the stamping spring 43, the following characteristics are specifically provided:
the downward pressing mechanism 18 further comprises a first buffer spring 22 and a second support frame 29, the first buffer spring 22 is coaxially sleeved on the movable rod 20 in a vertical state, two ends of the first buffer spring 22 are respectively abutted to the lower end of the top plate 19 and the lower end of the movable rod 20, three chutes 25 which are uniformly distributed along the circumferential direction are further formed in the side wall of the fixed sleeve 23, each chute 25 is located between every two vertical chutes 24, and the second support frame 29 is arranged on one side of the support base 7 in a horizontal state and is rotatably connected with the rotary sleeve 30 through a bearing.
When the device is operated, when the movable rod 20 pushes the rotary member 26 to move downwards, the support rod 33 pushes the rotary mechanism 34 to enable the rotary mechanism 34 to operate, when the rotary mechanism 34 operates, the support rod 33 rotates clockwise by a small angle along with the downward pressing movement, so as to drive the sliding short column 27 to rotate by the same small angle as the support rod 33 after the vertical sliding chute 24 runs along the total length of the vertical sliding chute 24, the rotary sleeve 30 rotates by a small angle along with the rotary sleeve, and as the downward pressing continues, the lead frame 1 is stamped with the adhesive, then the stamping spring 43 releases the pressure to push the support rod 33 to move upwards, the support rod 33 pushes the rotary member 26 to move upwards in the rotary sleeve 30 until the sliding short column 27 touches the chute 25, the sliding short column 27 slides to the other vertical sliding chute 24 along the chute 25, the sliding short column 27 is protected from being damaged by the impact of the hard stamping sliding short column 24 due to the overlarge resilience force under the action of the first buffer spring 22, and the rotary member 26 rotates clockwise by 120 degrees, thereby driving the support rod 33 and the rotary sleeve 30 to rotate 120 degrees, and transmitting through the rotary mechanism 34, driving all the stamping assemblies 42 to complete the clockwise rotation by 120 degrees, and enabling each stamping assemblies 42 to alternate the transposition assemblies 42.
In order to ensure that the device is operated, the swivel mechanism 34, when moved downwards, causes the swivel part 26 to swivel through a small angle, so that the sliding stub 27 is offset from the vertical sliding slot 24, the following features are provided:
every impression subassembly 42 still includes suction head mounting 45, seals plectane 50 and buffer gear 47, and suction head mounting 45 is the fixed one end that sets up in impression pole 44 of vertical state, and the shaping has the strip protruding 46 of a plurality of on the 45 inner walls of suction head mounting, seals plectane 50 and is the fixed setting in suction head mounting 45 lower extreme of horizontality, and impression syringe needle 51 passes and seals plectane 50 and with seal plectane 50 sliding connection, and buffer gear 47 slides and sets up in suction head mounting 45, every the spacing breach 52 of a plurality of has been seted up on buffer gear 47 top, every strip protruding 46 and spacing breach 52 one-to-one.
When the device is operated, the stamping rod 44 pushes the sucker fixing piece 45 to move downwards, and with the progress of the downward pressing movement, the stamping needle head 51 can limit the stamping needle head 51 not to rotate left and right during stamping under the matching of the limiting notch 52 and the strip-shaped bulge 46 and only can move along the length direction of the strip-shaped bulge 46.
In order to ensure that the stamping needle 51 does not damage the lead frame 1 when stamping the lead frame 1 with the adhesive, the following structure is specifically arranged:
every buffer gear 47 all includes telescopic link 48 and second buffer spring 49, and telescopic link 48's stiff end and suction head fixing piece 45 upper end fixed connection and telescopic link 48 expansion end and impression syringe needle 51 top fixed connection, and on second buffer spring 49 coaxial cover was located telescopic link 48, second buffer spring 49's both ends were contradicted impression syringe needle 51 top and telescopic link 48 stiff end respectively.
When the device operates, the stamping needle head 51 moves downwards to stamp the adhesive, when the adhesive collides with the lead frame 1, the second buffer spring 49 is stressed and compressed, the movable end of the telescopic rod 48 buffers the downward pressure of the stamping needle head 51 on the lead frame 1, and the damage caused by overlarge pressure is avoided.
The working principle is as follows: when the device is pressed down: the driving motor 8 is started first to drive the inferior gear 10 to rotate and be meshed with the sliding teeth 16, the sliding ring 14 is driven to move downwards along the limiting sliding groove 13, the sliding ring 14 drives the sliding rod 17 to move downwards to push the movable rod 20 to move downwards, the movable rod 20 abuts against the rotating part 26 to move downwards, at the moment, the short sliding column 27 starts to slide downwards from the top end of the vertical sliding groove 24, the strip-shaped sliding groove 28 starts to slide downwards from the top end of the limiting protruding strip 31, so that the rotating part 26 pushes the supporting rod 33 to move downwards, the supporting rod 33 pushes the rotating connecting plate 35 to move downwards, in the downward movement process of the rotating connecting plate 35, the short abutting rod 36 can contact with the abutting protrusion 38, the rotating connecting plate 35 is driven to rotate by a small angle when moving downwards, the rotating part 26 and the rotating sleeve 30 are driven by the supporting rod 33 to rotate together by a small angle which is the same as that of the rotating connecting plate 35, and the short sliding column 27 can deviate from the vertical sliding groove 24 along with the rotation of the rotating part 26 when sliding out of the vertical sliding groove 24. When the rotary connecting plate 35 rotates a small angle, all the stamping rods 44 will rotate the same angle along with the rotary connecting plate 35, because all the stamping rods 44 pass through the through holes 40 of the rotary circular plate 39, thereby driving the rotary circular plate 39 to rotate together, then the rotary connecting plate 35 drives all the stamping rods 44 to continue to move vertically downwards under the matching of the short abutting rods 36 and the protruding abutting protrusions 38, at this time, all the stamping springs 43 are compressed under force, along with the continuous downward movement of the stamping rods 44, the suction head fixing member 45 drives the stamping needles 51 to move downwards, under the matching of the strip-shaped protrusions 46 and the limiting notches 52, the stamping needles 51 can only be pressed vertically downwards and cannot rotate until one stamping needle 51 extends into the adhesive box 5 to dip the adhesive, and after the stamping needles 51 dip the adhesive, the device completes the pressing step. Then the device carries out a lifting step: the inferior gear 10 rotates to a half without teeth, the inferior gear 10 is not meshed with the sliding teeth 16, at this time, the stamping spring 43 releases pressure to drive the rotating connecting plate 35 to move upwards and transmit to the rotating piece 26 through the supporting rod 33 until the sliding short column 27 abuts against the inclined groove 25, the sliding short column 27 slides along the inclined groove 25 to drive the rotating piece 26 to rotate 120 degrees until the top end of the vertical sliding groove 24, connected with the inclined groove 25, of the sliding short column 27, so that the rotating piece 26 is restored to the initial height position, and when the sliding short column 27 slides to the top end of the vertical sliding groove 24 along the inclined groove 25, the impact force of the sliding short column 27 is buffered under the action of the first buffer spring 22, and the sliding short column 27 is protected from being damaged. As the rotary member 26 rotates 120 degrees, the support rod 33 and the rotary sleeve 30 rotate 120 degrees together, and the rotary connecting plate 35 connected to the support rod 33 also rotates 120 degrees together, so as to drive all the stamping rods 44 and the stamping needles 51 to rotate 120 degrees. When the rotary member 26 returns to the initial height, the movable rod 20 also drives the slide ring 14 upward through the slide rod 17 until returning to the initial position. Meanwhile, the inferior gear 10 rotates to the toothed side and is engaged with the sliding teeth 16 again, at this time, the turntable 3 drives the lead frame 1 on the carrier 2 to rotate to the position below the imprinting needle 51 dipped with the adhesive, and then the device performs a pressing step: the inferior gear 10 is meshed with the sliding ring 14, the stamping needle 51 is driven by the whole device to stamp the adhesive on the lead frame 1, the second buffer spring 49 is compressed under force during stamping, the telescopic rod 48 is contracted, the downward pressure of the stamping needle 51 on the lead frame 1 is buffered, and damage caused by overlarge pressure is avoided. Meanwhile, another stamping needle 51 extends into the adhesive box 5 to dip the adhesive, and then the rotary table 3 rotates to drive the lead frame 1 which is stamped with the adhesive to rotate to the next station, and drive the next lead frame 1 which needs to be stamped with the adhesive to the position of the lead frame 1 which is stamped with the adhesive. After that, the stamp pin 51 which has stamped the adhesive under the rebound of the stamp spring 43 is rotated 120 degrees until above the washer 6, and the stamp pin 51 dipped with the adhesive is rotated to above another lead frame 1 to be stamped with the adhesive, until the apparatus completes one cycle of stamping steps. And then, the device repeats the pressing step and the lifting step in a circulating manner, adhesive imprinting can be continuously carried out on the lead frame 1 needing to be imprinted with the adhesive, and the imprinted imprinting needle 51 can be cleaned under the rotation of the device after one imprinting is finished, so that the next time the adhesive is dipped and taken, and the influence of the residual adhesive on the subsequent work is avoided.
The above examples only show one or more embodiments of the present invention, and the description is specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (8)
1. Electronic chip's soft solder chip bonding machine sets up carrier (2) on carousel (3) including carousel (3) and fixed, and carrier (2) internal fixation is provided with lead frame (1), its characterized in that still includes impression part (4), including: the supporting seat (7) is arranged beside the turntable (3) in a vertical state; the driving motor (8) is fixedly arranged on one side of the upper end of the supporting seat (7); the transmission mechanism (9) is arranged on the other side of the supporting seat (7) in a vertical state, and the transmission mechanism (9) is in transmission connection with an output shaft of the driving motor (8); the pressing mechanism (18) is vertically arranged below the transmission mechanism (9), and the power output end of the transmission mechanism (9) is movably connected with the power input end of the pressing mechanism (18); the supporting rod (33) is vertically arranged below the pressing mechanism (18) and is fixedly connected with the power output end of the pressing mechanism (18); the rotating mechanism (34) is arranged at the lower end of the supporting rod (33), the rotating mechanism (34) comprises a rotating connecting plate (35), a collision support (37), a rotating circular plate (39) and a fixing support (41), the rotating connecting plate (35) is in a horizontal state and is fixedly connected with the lower end of the supporting rod (33) coaxially, three collision short rods (36) are uniformly and fixedly arranged on the side wall of the rotating connecting plate (35) along the circumferential direction, the collision support (37) is arranged below the rotating connecting plate (35) and is fixedly connected with the supporting seat (7), collision protrusions (38) used for sliding the collision short rods (36) are formed on one side of the collision support (37), the fixing support (41) is arranged below the rotating connecting plate (35) in a horizontal state and is fixedly connected with the supporting seat (7), the rotating circular plate (39) is rotatably connected with the fixing support (41) through a bearing, and three through holes (40) are uniformly formed in the edge of the rotating circular plate (39) along the circumferential direction; the number of the stamping assemblies (42) is the same as that of the through holes (40), the stamping assemblies (42) are movably sleeved in the corresponding through holes (40) in a vertical state, all the stamping assemblies (42) are uniformly and fixedly arranged below the rotary connecting plate (35) along the circumferential direction of the rotary connecting plate (35), each stamping assembly (42) is in sliding connection with the rotary circular plate (39) through a linear bearing, each stamping assembly (42) comprises a stamping spring (43), a stamping rod (44) and a stamping needle head (51), the stamping rod (44) is fixedly arranged at the bottom of the rotary connecting plate (35) in a vertical state, the stamping spring (43) is coaxially sleeved on the stamping rod (44) in a vertical state, two ends of the stamping spring (43) are respectively abutted against the top of the rotary circular plate (39) and the bottom of the rotary connecting plate (35), and the stamping needle head (51) is movably arranged at the lower end of the stamping rod (44); the adhesive box (5) and the cleaner (6) are both arranged on one side of the lower end of the supporting seat (7) in a vertical state, and each stamping component (42) corresponds to the lead frame (1), the adhesive box (5) and the cleaner (6) below.
2. The soft solder die-bonding machine for electronic chips as claimed in claim 1, characterized in that the transmission mechanism (9) comprises a inferior gear (10), a rotation shaft (11), a sliding box (12) and a sliding ring (14), the rotation shaft (11) is coaxially and fixedly connected with the output shaft of the driving motor (8) through a shaft coupling, one end of the rotation shaft (11) is coaxially and fixedly connected with the inferior gear (10), the sliding ring (14) is vertically arranged at one side of the supporting base (7) and is in transmission connection with the power input end of the pressing mechanism (18), the inferior gear (10) is intermittently in transmission connection with the sliding ring (14), and the sliding box (12) is vertically and fixedly arranged at one side of the upper end of the supporting base (7).
3. The soft solder die bonder of electronic chip as claimed in claim 2, wherein the transmission mechanism (9) further comprises two sliding rods (17), the two sliding rods (17) are respectively fixed on the upper and lower ends of the sliding ring (14), the sliding rod (17) at the lower end of the sliding ring (14) is in transmission connection with the power input end of the pressing mechanism (18), a sliding tooth (16) is formed on the inner wall of one side of the sliding ring (14), the inferior gear (10) is engaged with the sliding tooth (16), a sliding convex strip (15) is formed on the outer wall of the two sides of the sliding ring (14), the sliding box (12) is fixed on the upper end side of the supporting base (7) in a vertical state, a limiting sliding slot (13) for the sliding ring (14) to slide up and down is formed on the inner side wall of the sliding box (12), and the sliding convex strip (15) slides in the limiting sliding slot (13).
4. The soft solder die bonder of electronic chips according to claim 3, wherein the pressing mechanism (18) comprises a top plate (19), a movable rod (20), a first supporting frame (21), a rotating member (26), a rotating sleeve (30) and a bottom plate (32), the top plate (19) is coaxially and fixedly disposed under the sliding rod (17) in a horizontal state, the first supporting frame (21) is fixedly disposed at one side of the supporting base (7), the top plate (19) is fixedly disposed at one end of the first supporting frame (21), the movable rod (20) is coaxially sleeved on the top plate (19) in a vertical state, an upper end of the movable rod (20) is movably connected with the sliding rod (17) fixedly disposed at a lower end of the sliding ring (14) through a bearing, the movable rod (20) is a power input end of the pressing mechanism (18), the rotating sleeve (30) is movably disposed under the top plate (19) through a bearing in a vertical state, the bottom plate (32) is movably sleeved outside the supporting rod (33) in a horizontal state and is fixedly connected with a bottom of the sleeve (30), the rotating member (26) is fixedly disposed at an upper end of the rotating sleeve (26) and is connected with the rotating member (26), the rotating piece (26) is a power output end of the pressing mechanism (18).
5. The soft solder die bonder of the electronic chip as claimed in claim 4, wherein the pressing mechanism (18) further comprises a fixing sleeve (23), the fixing sleeve (23) is vertically disposed below the top plate (19), three vertical sliding grooves (24) are formed in the outer wall of the fixing sleeve (23) and uniformly distributed in the circumferential direction, three sliding short columns (27) are formed in the upper end of the rotating member (26) and uniformly distributed in the circumferential direction, all the sliding short columns (27) are in one-to-one correspondence with all the vertical sliding grooves (24), a plurality of strip-shaped sliding grooves (28) are formed in the outer wall of the lower end of the rotating member (26) and uniformly distributed in the circumferential direction, a plurality of limiting convex strips (31) are formed in the inner wall of the rotating sleeve (30), and a plurality of limiting convex strips (31) are in one-to one correspondence with all the strip-shaped sliding grooves (28).
6. The soft solder die bonder of the electronic chip as claimed in claim 5, wherein the pressing mechanism (18) further comprises a first buffer spring (22) and a second support frame (29), the first buffer spring (22) is coaxially sleeved on the movable rod (20) in a vertical state, two ends of the first buffer spring (22) respectively contact with the lower end of the top plate (19) and the lower end of the movable rod (20), the side wall of the fixed sleeve (23) is further provided with three chutes (25) uniformly distributed along the circumferential direction, each chute (25) is located between every two vertical chutes (24), and the second support frame (29) is horizontally arranged on one side of the support base (7) and is rotatably connected with the rotary sleeve (30) through a bearing.
7. The soft solder die bonder of electronic chips of claim 1, wherein each of the stamping assemblies (42) further comprises a suction head fixing member (45), a sealing circular plate (50) and a buffering mechanism (47), the suction head fixing member (45) is fixedly arranged at one end of the stamping rod (44) in a vertical state, a plurality of strip-shaped protrusions (46) are formed on the inner wall of the suction head fixing member (45), the sealing circular plate (50) is fixedly arranged at the lower end of the suction head fixing member (45) in a horizontal state, the stamping needle (51) penetrates through the sealing circular plate (50) and is slidably connected with the sealing circular plate (50), the buffering mechanism (47) is slidably arranged in the suction head fixing member (45), a plurality of limiting notches (52) are formed at the top end of each of the buffering mechanism (47), and each strip-shaped protrusion (46) corresponds to one limiting notch (52).
8. The soft solder die bonder of electronic chips according to claim 7, wherein each of the buffer mechanisms (47) comprises a telescopic rod (48) and a second buffer spring (49), a fixed end of the telescopic rod (48) is fixedly connected with an upper end of the suction head fixing member (45), a movable end of the telescopic rod (48) is fixedly connected with a top end of the imprinting needle (51), the second buffer spring (49) is coaxially sleeved on the telescopic rod (48), and two ends of the second buffer spring (49) respectively abut against the top end of the imprinting needle (51) and the fixed end of the telescopic rod (48).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310120089.4A CN115831829B (en) | 2023-02-16 | 2023-02-16 | Soft solder chip mounting machine for electronic chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310120089.4A CN115831829B (en) | 2023-02-16 | 2023-02-16 | Soft solder chip mounting machine for electronic chip |
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| Publication Number | Publication Date |
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| CN115831829A true CN115831829A (en) | 2023-03-21 |
| CN115831829B CN115831829B (en) | 2023-04-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202310120089.4A Active CN115831829B (en) | 2023-02-16 | 2023-02-16 | Soft solder chip mounting machine for electronic chip |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB691243A (en) * | 1948-05-29 | 1953-05-06 | R Hoe & Crabtree Ltd | Improvements in rotogravure impression mechanism |
| US20030197048A1 (en) * | 2002-04-22 | 2003-10-23 | Story Huang | Position-, speed- and force-controllable chip accessing apparatus |
| CN101452865A (en) * | 2007-12-07 | 2009-06-10 | 先进自动器材有限公司 | Dispensing solder for mounting semiconductor chips |
| CN102163541A (en) * | 2010-02-24 | 2011-08-24 | 普罗科技有限公司 | Chip welding device |
| CN104637830A (en) * | 2014-12-31 | 2015-05-20 | 吴华 | Soft solder die bonder of microelectronic chip |
| US20150325507A1 (en) * | 2014-05-12 | 2015-11-12 | Invensas Corporation | Conductive connections, structures with such connections, and methods of manufacture |
| CN216462329U (en) * | 2021-11-29 | 2022-05-10 | 昆山顺灵达智能科技有限公司 | Automatic welding equipment for printed circuit board |
-
2023
- 2023-02-16 CN CN202310120089.4A patent/CN115831829B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB691243A (en) * | 1948-05-29 | 1953-05-06 | R Hoe & Crabtree Ltd | Improvements in rotogravure impression mechanism |
| US20030197048A1 (en) * | 2002-04-22 | 2003-10-23 | Story Huang | Position-, speed- and force-controllable chip accessing apparatus |
| CN101452865A (en) * | 2007-12-07 | 2009-06-10 | 先进自动器材有限公司 | Dispensing solder for mounting semiconductor chips |
| CN102163541A (en) * | 2010-02-24 | 2011-08-24 | 普罗科技有限公司 | Chip welding device |
| CN102163565A (en) * | 2010-02-24 | 2011-08-24 | 普罗科技有限公司 | Chip welding device |
| US20150325507A1 (en) * | 2014-05-12 | 2015-11-12 | Invensas Corporation | Conductive connections, structures with such connections, and methods of manufacture |
| CN104637830A (en) * | 2014-12-31 | 2015-05-20 | 吴华 | Soft solder die bonder of microelectronic chip |
| CN216462329U (en) * | 2021-11-29 | 2022-05-10 | 昆山顺灵达智能科技有限公司 | Automatic welding equipment for printed circuit board |
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|---|---|
| CN115831829B (en) | 2023-04-25 |
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