TWI427713B - Seperation method for a chip from tape film and a chip pickup method - Google Patents

Description

Wafer and film separation method and wafer removal method

The present invention relates to a method of packaging a semiconductor wafer, and more particularly to a method of separating a wafer from a film thereof and a method of removing the wafer in a packaging method.

Generally, in the sealing process of a semiconductor, a film having an adhesive force is attached to the back surface of the formed wafer for the purpose of the process, which is generally called a BLUE TAPE. After the process of attaching the film, the wafer is cut. By attaching the blue film described above, the wafer after the wafer is diced (Die/die) can be prevented from being lost and arranged in a regular manner. Then, the process of bonding can be performed, and the wafer is separated from the wafer by a die-bonding or wafer pick-and-place device to facilitate the subsequent process.

A prior art technique for the wafer ejecting mechanism for separating a wafer from a blue film, as disclosed in the prior art of the Chinese Patent No. 470210, M335012, I224843 and I295825, etc., which prior art tends to focus on the improvement of the wafer when it is ejected, so that The wafer is more effectively separated from the film. However, the above-mentioned conventional technology, due to the complexity of the construction device, is not only time-consuming to manufacture, but also costly, and it is still difficult to meet the needs of the industry in terms of timeliness and productivity. Most importantly, as the package size grows thinner and lighter, today, due to the increasing importance of the package type of stacked wafers, the crystallization process of thin wafers below 60 microns is the key to the success of the die process. Thin wafers used for special processes are often susceptible to brittle fracture or failure to pick up smoothly, causing significant production problems. Moreover, some existing methods, for example, a thin wafer multi-stage ejection method can take out a thin wafer, but it is necessary to replace the thimble device or the jig according to the size of the wafer. Therefore, for the practice of packaging production of diverse wafer sizes, it is necessary to invest a high cost to meet the production requirements, so it is not practical and needs to be improved.

In order to solve the above-mentioned prior art unsatisfactory, the present invention firstly provides a method for separating a wafer and a film. The thimble device including the squeegee can separate the wafer on the wafer from the film, and the following steps are included: (1) applying a positioning procedure to position the wafer at a first position above the ejector device; (2) horizontally moving the wafer at an appropriate distance along the first direction such that the wafer is in the second position and the ejector device is scraped Located adjacent to the edge portion of the wafer; (3) opening a vacuum to adsorb the wafer and the film downward; (4) moving the squeegee of the thimble device from the first squeegee position to the second squeegee Positioning the blade against the film, and (5) moving the wafer horizontally along the film in a second direction by a distance of one wafer length, wherein the second direction is opposite to the first direction, thereby enabling the wafer to be glued to the wafer Membrane separation.

Accordingly, it is a primary object of the present invention to provide a wafer and film separation method which does not cause wafer cracking during wafer and film separation, and can be used for a general wafer or a thin wafer.

A secondary object of the present invention is to provide a wafer and film separation method. By appropriately squeegee of the ejector device, the wafer can be applied to different sizes without replacing the entire thimble device, and the thimble device used can be reduced. the cost of.

Another object of the present invention is to provide a method for separating a wafer and a film. By using a squeegee of an appropriate size of the ejector device, the wafer size can be used without limitation, thereby facilitating the process, and the tool can be saved without replacing the fixture. The cost of replacing the fixture.

The present invention further provides another wafer removing method for separating a wafer from a film thereof by a thimble device including a squeegee, and then removing the wafer from which the bottom film has been separated. The method comprises the following steps: (1) applying a positioning program to position the wafer at a first position above the ejector device; (2) horizontally moving the wafer at an appropriate distance along the first direction, so that the wafer is in the second position, and the thimble The squeegee of the device is located adjacent to an edge portion of the wafer; (3) a vacuum is opened to adsorb the wafer and the film downward; (4) the squeegee of the thimble device is moved upward from the first squeegee position to Second squeegee position, making The squeegee is pressed against the film; (5) the wafer and the film are horizontally moved by a distance of one wafer length in the second direction, wherein the second direction is opposite to the first direction, so that the wafer is separated from the film; 6) closing the vacuum and moving the squeegee downward to the first squeegee position; (7) horizontally moving the wafer at an appropriate distance in the first direction; (8) applying a secondary positioning procedure, The wafer is positioned at a first position above the thimble device; (9) a vacuum is opened to attract the film downward; and (10) the wafer with the bottom film separated is removed.

Accordingly, it is still another object of the present invention to provide a wafer removal method which does not cause wafer cracking during wafer and film separation, and which can be used for a general wafer or a thin wafer.

A further object of the present invention is to provide a wafer removing method, which can change the position of the needle by the squeegee of the appropriate size of the ejector device and the thimble on both sides of the squeegee, and can be applied to different sizes without replacing the entire thimble device. The wafer can reduce the cost of the thimble device used.

A further object of the present invention is to provide a wafer removing method, which can be used without any wafer size by using a squeegee of an appropriate size of the ejector device, thereby facilitating the process, and saving a large number of replacement fixtures without replacing the fixture. the cost of.

The present invention further provides a method for separating a wafer and a film. The wafer on the wafer is separated from the film by a thimble device including a squeegee, and the method comprises the following steps: (1) applying a positioning program to the wafer Positioned at a predetermined position above the squeegee of the thimble device such that the squeegee of the thimble device is located adjacent to the edge portion of the wafer; (2) opening a vacuum to adsorb the wafer with the film downward; (3) The squeegee of the thimble device moves upward from the first squeegee position to the second squeegee position such that the squeegee is held against the film; (4) the wafer is moved horizontally along the first direction by a distance of about one wafer length, ie Separating the above wafer from its film; and (5) Turn off the vacuum and move the squeegee down to the first squeegee position.

Accordingly, it is still another object of the present invention to provide a wafer and film separation method which does not cause wafer cracking during wafer and film separation, and can be used for a general wafer or a thin wafer.

A further object of the present invention is to provide a method for separating a wafer from a film. By appropriately squeegee of the ejector device, the wafer can be applied to different sizes without replacing the entire thimble device, and the thimble device used can be reduced. the cost of.

A further object of the present invention is to provide a method for separating a wafer and a film. By using a squeegee of an appropriate size of the ejector device, the wafer size can be used without any chip size, thereby facilitating the process, and the tool can be saved without replacing the fixture. The cost of replacing the fixture.

Since the present invention discloses a wafer separation method and a wafer removal method, the basic structure and mechanism principle of the semiconductor ejector device used therein have been known to those skilled in the relevant art, and therefore, the following description will not be made. Full description. At the same time, the drawings referred to in the following texts express the structural schematics related to the features of the present invention, and need not be completely drawn according to the actual size, which is first described.

The first preferred embodiment of the present invention is a wafer and film separation method for use in a semiconductor die bonding process, which mainly comprises the following steps: (1) Please refer to FIGS. 1A and 1B to provide a thimble device. 1. The ejector device 1 has a squeegee 11 which is located at the first squeegee position 51, and the squeegee 11 is a plate-like structure or may be formed by arranging a plurality of needle bodies. In addition, the thimble device 1 may further include a plurality of thimbles 12, and a plurality of thimbles 12 are distributed on both sides of the squeegee 11. It is to be particularly noted that the width w _{0 of the} squeegee 11 should be less than the width w _{1 of the} wafer 91, and the preferred width w ₀ of the squeegee 11 is between 85% and 98% of the width w ₁ of the wafer 91 to be separated. (2) Referring to FIG. 1B, at least one wafer 91 is provided, and a film 92 is adhered to the bottom of the wafer 91, wherein the length of the wafer 91 is L. In the preferred embodiment, the wafer 91 is intended to be glued. Membrane-separated wafer 91; (3) Please continue to refer to FIG. 1B, firstly applying a positioning procedure to the wafer 91, for example, via a CCD (CHARGE-COUPLED DEVIC/Charge Coupled Device) image sensor, of course, Alternatively, the image sensor of similar function may be located as long as the wafer 91 can be positioned at the first position 21 above the thimble device 1; (4) refer to the 1C figure, at an appropriate distance level along the first direction 31. The wafer 91 is moved such that the wafer 91 is at the second position 22, and the squeegee 11 of the thimble device 1 is located at an edge portion of the adjacent wafer 91. The appropriate distance is one-half of the length of the wafer 91, and of course other lengths are also Yes, as long as the squeegee 11 is located adjacent to the edge portion of the wafer 91; (5) please refer to the 1D figure, The vacuum 4 of the thimble device 1 is opened, so that the wafer 91 and its film 92 are sucked downward in the direction toward the vacuum 4; (6) Please continue to refer to FIG. 1D, and then the squeegee 11 of the thimble device 1 is first The squeegee position 51 is moved upward to the second squeegee position 52, so that the squeegee 11 is pressed against the adhesive film 92. At this time, the preferred position of the second squeegee position 52 is that the squeegee 11 is against the adhesive film 92 and is slightly convex. The upper surface of the ejector device 1; and (7) please refer to FIG. 1E. At this time, the wafer 91 is horizontally moved by a distance of one wafer 91 in the second direction 32, and the second direction 32 is opposite to the first direction 31. However, at the same time, the squeegee 11 is still against the adhesive film 92, so that the attraction force of the vacuum film 4 to the adhesive film 92 can be utilized, so that the splicing state of the wafer 91 and the adhesive film 92 is destroyed as if the adhesive film 92 is gradually peeled off. The wafer 91 is separated from its film 92.

In the above embodiment, after the wafer 91 is separated from the film 92, the wafer 91 can be further moved back to the previously positioned first position 21. Referring to FIG. 1F, the vacuum 4 can be closed first, then the squeegee 11 is moved back down to the first squeegee position 51, and then the wafer 91 is horizontally moved at an appropriate distance in the first direction 31, followed by a second time. A positioning procedure whereby the separated wafer 91 can be positioned back to the previously positioned first position 21 above the thimble device 1, and, in the preferred embodiment, the appropriate distance is two-thirds of the wafer 91. One length.

The wafer 91 can be easily separated from the film 92 by using the wafer separation method of the present invention, whether it is using a more viscous UV tape (UV TAPE) or a cheaper blue film. In addition, the above-mentioned wafer 91 is mainly a thin wafer required for a special process, and its thickness is less than 60 micrometers. Of course, the general wafer 91 can also be used. More importantly, the method of the present invention does not cause the wafer 91 to be cracked during the separation process of the wafer 91 and the film 92, and the wafer 11 size can be used only by the appropriate size of the squeegee 11 of the ejector device 11. In addition, the process is convenient to use, and the cost of replacing the jig can be saved because the jig is not required to be replaced.

The present invention further provides a second preferred embodiment, which is a wafer removal method for use in a semiconductor die bonding process, and mainly includes: (1) Please refer to FIGS. 1A and 1B to provide a thimble device 1 and a thimble device. 1 has a squeegee 11 which is located at the first squeegee position 51, and the squeegee 11 is a plate-like structure or may be formed by arranging a plurality of needle bodies. In addition, the thimble device 1 further includes a plurality of thimbles 12, and a plurality of thimbles 12 are distributed on both sides of the squeegee 11. It is to be particularly noted that the width w _{0 of the} squeegee 11 should be less than the width w _{1 of the} wafer 91, and the preferred width w ₀ of the squeegee 11 is between 85% and 98% of the width w ₁ of the wafer 91 to be separated. (2) Referring to FIG. 1B, at least one wafer 91 is provided, and a film 92 is adhered to the bottom of the wafer 91, wherein the length of the wafer 91 is L. In the preferred embodiment, the wafer 91 is intended to be glued. Membrane-separated wafer 91; (3) Please continue to refer to FIG. 1B. First, the wafer 91 is subjected to a positioning procedure, for example, assisted by a CCD image sensor, or, of course, a similar image sensor. Yes, as long as the wafer 91 can be positioned at the first position 21 above the ejector device 1; (4) Referring to FIG. 1C, the wafer 91 is horizontally moved at an appropriate distance along the first direction 31, so that the wafer 91 is located at the second position. Position 22, and the squeegee 11 of the thimble device 1 is located at an edge portion of the adjacent wafer 91, and the appropriate distance is one-half of the length of the wafer 91. Of course, other lengths may be used as long as the squeegee 11 is located adjacent to the wafer. The edge of 91 can be used; (5) Please refer to Figure 1D, and then open the vacuum 4 of the thimble device 1, so that The wafer 91 along with its film 92 is sucked downward in the direction toward the vacuum 4; (6) Please continue to refer to FIG. 1D, and then the squeegee 11 of the thimble device 1 is moved upward from the first squeegee position 51 to the second squeegee The plate position 52 causes the squeegee 11 to bear against the film 92. At this time, the preferred position of the second squeegee position 52 is that the squeegee 11 is against the film 92 and slightly protrudes from the upper surface of the thimble device 1; Referring to FIG. 1E, at this time, the wafer 91 is horizontally moved by a distance of one wafer 91 in the second direction 32, and the second direction 32 is opposite to the first direction 31. However, while the squeegee 11 is still resisting The adhesive film 92 can utilize the attraction force of the vacuum 4 to the adhesive film 92, so that the bonding state of the wafer 91 and the adhesive film 92 is destroyed as if the adhesive film 92 is gradually peeled off, so that the wafer 91 is separated from the adhesive film 92 thereof. The wafer 91 is still lying on the film 92; (8) please refer to FIGS. 1E and 1F, then the vacuum 4 of the thimble device 1 is closed, and the squeegee 11 is moved downward from the original second squeegee position 52. Go to the first squeegee position 51; (9) continue to refer to the 1F, and then move the wafer 91 back horizontally in the first direction 31 at an appropriate distance. For example, in the preferred embodiment, the appropriate distance is one-half of the length of the wafer 91; (10) please continue to refer to the first F-figure, and then perform the second positioning procedure, thereby The wafer 91 is positioned back to the first position 21 previously positioned above the thimble device 1; (11) please refer to FIG. 2A, and then the vacuum 4 is opened to hold the film 92 downward; and (12) please continue to refer to the 2A In the figure, since the vacuum has absorbed the film 92, the wafer 91 can be taken out by any of the pick-and-place machines 6, for example, a wafer take-up device.

Further, please refer to FIG. 2B. In order to accommodate the different sizes of the wafer 91, if it is a smaller wafer 91, a plurality of ejector pins 12 on both sides of the squeegee 11 can be further ejected upward to achieve a better wafer 91. Take out the effect. Therefore, the previous steps are continued, and then after the second positioning procedure is applied, the vacuum 4 is turned on to adsorb the film 92 downward, and then the plurality of thimbles 12 are pushed up, at which time the plurality of thimbles 12 will top the wafer 91. Up, so it is easier to apply the film with the bottom The 92 separated wafers 91 are taken out.

With the wafer separation method of the present invention, the wafer 91 can be easily separated from the film 92 regardless of whether a more viscous UV tape is used or a less expensive blue film is used for cost considerations. In addition, the above-mentioned wafer 91 is mainly a thin wafer required for a special process, and its thickness is less than 60 micrometers. Of course, the general wafer 91 can also be used. More importantly, the method of the present invention does not cause the wafer 91 to be cracked during the separation process of the wafer 91 and the film 92, and the wafer 11 size can be used only by the appropriate size of the squeegee 11 of the ejector device 11. In addition, the process is convenient to use, and the cost of replacing the jig can be saved because the jig is not required to be replaced.

The present invention further provides a third preferred embodiment, which is another method for separating a wafer and a film for use in a semiconductor die bonding process, and mainly includes: (1) Please refer to FIG. 3A to provide a thimble device 1 and a thimble device. 1 has a squeegee 11 which is located at the first squeegee position 51, and the squeegee 11 is a plate-like structure or may be formed by arranging a plurality of needle bodies. In addition, the thimble device 1 may further include a plurality of thimbles 12, and a plurality of thimbles 12 are distributed on both sides of the squeegee 11; (2) Please continue to refer to FIG. 3A to provide at least one wafer 91 with a film 92 adhered to the bottom of the wafer 91. The wafer 91 has a length L, and the wafer 91 described in the preferred embodiment is a wafer 91 to be separated from the film. Further, as described in the first preferred embodiment, the width w _{0 of the} squeegee 11 should be smaller than the width w _{1 of the} wafer 91, and the width of the squeegee 11 is preferably 85% of the width of the wafer 91 to be separated from the film. Between 98%; (3) Please continue to refer to Figure 3A. First, the wafer 91 is subjected to a positioning procedure, for example, assisted by a CCD image sensor. Of course, or similar image sensors can also be used. As long as the wafer 91 can be positioned at a predetermined position 71 above the ejector device 1, and the squeegee 11 of the thimble device 1 is located at an edge portion of the adjacent wafer 91; (4) refer to FIG. 3B, and then the ejector device is turned on. The vacuum 4 of 1 causes the wafer 91 to be adsorbed downward along with its film 92 in the direction toward the vacuum 4; (5) Please continue to refer to FIG. 3B, and then the squeegee 11 of the thimble device 1 is removed from the first squeegee position 51. Moving upward to the second squeegee position 52, the squeegee 11 is pressed against the adhesive film 92. At this time, the preferred position of the second squeegee position 52 is that the squeegee 11 is pressed against the adhesive film 92, and the thimble device 1 is slightly protruded. (6) Please refer to FIG. 3C, in which case the wafer 91 is horizontally moved by a distance of one wafer 91 in the second direction 32, The second direction 32 is opposite to the first direction 31. However, while the squeegee 11 is still against the adhesive film 92, the attraction force of the vacuum film 4 to the adhesive film 92 can be utilized, so that the adhesive film 92 is gradually peeled off. Destroying the bonding state of the wafer 91 and its film 92, so that the wafer 91 is separated from its film 92, while the wafer 91 is still lying on the film 92; and (7) please continue to refer to the 3C and 3D figures, and then close The vacuum of the thimble device 1 is 4, and the squeegee 11 is moved downward from the original second squeegee position 52 to the first squeegee position 51.

With the wafer separation method of the present invention, the wafer 91 can be easily separated from the film 92 regardless of whether a more viscous UV tape is used or a less expensive blue film is used for cost considerations. In addition, the above-mentioned wafer 91 is mainly a thin wafer required for a special process, and its thickness is less than 60 micrometers. Of course, the general wafer 91 can also be used. More importantly, the method of the present invention does not cause the wafer 91 to be cracked during the separation process of the wafer 91 and the film 92, and the wafer 11 size can be used only by the appropriate size of the squeegee 11 of the ejector device 11. In addition, the process is convenient to use, and the cost of replacing the jig can be saved because the jig is not required to be replaced.

The above description is only the preferred embodiment of the present invention, and is not intended to limit the patent application rights of the present invention. The above description should be understood and implemented by those skilled in the art, so that the other embodiments are not deviated from the present invention. Equivalent changes or modifications made in the spirit of the disclosure should be included in the scope of the patent application.

1. . . Thimble device

11. . . Scraper

12. . . thimble

twenty one. . . First position

twenty two. . . Second position

31. . . First direction

32. . . Second direction

4. . . vacuum

51. . . First screed position

52. . . Second screed position

6. . . Take out device

71. . . Predetermined location

91. . . Wafer

92. . . Film

w ₀ . . . Scraper width

w ₁ . . . Wafer width

L. . . Wafer length

1A is a perspective view showing a thimble device according to a first or second preferred embodiment of the present invention.

1B is a cross-sectional view showing a thimble device and a wafer in accordance with a first or second preferred embodiment of the present invention.

1C is a cross-sectional view showing a thimble device and a wafer in accordance with a first or second preferred embodiment of the present invention.

1D is a cross-sectional view showing a thimble device and a wafer in accordance with a first or second preferred embodiment of the present invention.

1E is a cross-sectional view showing a thimble device and a wafer in accordance with a first or second preferred embodiment of the present invention.

1F is a cross-sectional view showing a thimble device and a wafer in accordance with a first or second preferred embodiment of the present invention.

2A is a cross-sectional view showing a second preferred embodiment of the present invention, which is a take-up device, a thimble device, and a wafer.

2B is a cross-sectional view showing a second preferred embodiment of the present invention, which is a take-up device, a thimble device, and a wafer.

3A is a cross-sectional view showing a thimble device and a wafer in accordance with a third preferred embodiment of the present invention.

Figure 3B is a cross-sectional view showing a thimble device and a wafer in accordance with a third preferred embodiment of the present invention.

Figure 3C is a cross-sectional view showing a thimble device and a wafer in accordance with a third preferred embodiment of the present invention.

3D is a cross-sectional view showing a thimble device and a wafer in accordance with a third preferred embodiment of the present invention.

1. . . Thimble device

11. . . Scraper

12. . . thimble

91. . . Wafer

92. . . Film

twenty one. . . First position

51. . . First screed position

L. . . Wafer length

Claims (41)

A method for separating a wafer from a film for use in a semiconductor die bonding process, comprising: providing a thimble device having a squeegee; providing at least one wafer having a film adhered to the bottom; applying a positioning a process of positioning the wafer at a first position above the thimble device; moving the wafer horizontally at an appropriate distance in a first direction such that the wafer is in a second position, and the squeegee of the thimble device is located adjacent the edge of the wafer Part: opening a vacuum to adsorb the wafer together with the film downward; moving the squeegee of the thimble device upward from the first squeegee position to the second squeegee position, causing the squeegee to withstand the film; And moving the wafer along with the film horizontally in a second direction by a length of the wafer, the second direction being opposite to the first direction. The wafer and film separation method according to the first aspect of the patent application, wherein the squeegee is a sheet-like structure. The wafer and film separation method according to the first aspect of the patent application, wherein the squeegee is formed by arranging a plurality of needles. The wafer and film separation method according to claim 1, wherein the width of the squeegee is smaller than the width of the wafer. A method of separating a wafer from a film according to claim 4, wherein the width of the blade is between 85% and 98% of the width of the wafer. The method for separating a wafer and a film according to claim 1 of the patent application, wherein the positioning program is assisted by an image sensor of a CCD (CHARGE-COUPLED DEVICE). The wafer and film separation method according to claim 1, wherein the wafer is a thin wafer. A wafer and film separation method according to claim 7 wherein the thin wafer has a thickness of less than 60 μm. A method for separating a wafer and a film according to claim 1 of the patent application, wherein the water is in the second direction After moving the wafer flat along with the length of the wafer for one wafer length, further comprising: closing the vacuum and moving the squeegee downward to the first squeegee position. The wafer and film separation method according to claim 9 , wherein the vacuum is turned off and the squeegee is moved downward to the first squeegee position, further comprising: at an appropriate distance level along the first direction The wafer is moved. The wafer and film separation method according to claim 10, wherein after the wafer is horizontally moved at an appropriate distance in the first direction, the method further comprises: applying a secondary positioning program to position the wafer above the thimble device The first position. A wafer and film separation method according to claim 1, 10 or 11, wherein the appropriate distance is one-half of the length of the wafer. A wafer and film separation method according to the first aspect of the patent application, wherein the film is a UV tape. The method for separating a wafer from a film according to the first aspect of the patent application, wherein the film is a blue film. The wafer and film separation method according to claim 1, wherein the thimble device further comprises a plurality of thimbles. The wafer and film separation method according to claim 15 , wherein the plurality of thimbles are distributed on both sides of the squeegee. A wafer removal method for use in a semiconductor die bonding process, comprising: providing a thimble device having a squeegee; providing at least one wafer with a film adhered to the bottom; applying a positioning program Positioning the wafer at a first position above the ejector device; moving the wafer horizontally at an appropriate distance along the first direction such that the wafer is in the second position, and the squeegee of the thimble device is located adjacent to an edge portion of the wafer; Opening a vacuum to adsorb the wafer together with the film downward; moving the squeegee of the thimble device upward from the first squeegee position to the second squeegee position, causing the squeegee to withstand the film; Moving the wafer along with the film horizontally in a second direction by a distance of one wafer length, the second direction being opposite to the first direction; closing the vacuum and moving the squeegee downward to the first squeegee position Moving the wafer horizontally at an appropriate distance along the first direction; applying a secondary positioning procedure to position the wafer at a first position above the thimble device; opening a vacuum to adsorb the film downward; and taking a The player removes the wafer from which the bottom film has been separated. The wafer takeout method according to claim 17, wherein the appropriate distance is one-half of the length of the wafer. The wafer removing method according to claim 17, wherein the squeegee is a sheet-like structure. The wafer removing method according to claim 17, wherein the squeegee is formed by arranging a plurality of needles. The wafer removing method according to claim 17, wherein the width of the squeegee is smaller than the width of the wafer. A wafer takeout method according to claim 21, wherein the width of the squeegee is between 85% and 98% of the width of the wafer. According to the wafer take-out method of claim 17, wherein the positioning program and the secondary positioning program are assisted by a CCD image sensor. A wafer takeout method according to claim 17, wherein the wafer is a thin wafer. The wafer removing method according to claim 24, wherein the thin wafer has a thickness of less than 60 μm. The wafer removing method according to claim 17, wherein the thimble device further comprises a plurality of thimbles, and after applying the secondary positioning program, the vacuum is turned on to adsorb the film downward, and the plurality of thimbles are pushed upwards so that The wafer whose bottom film has been separated is taken out. According to the wafer take-out method of claim 26, wherein the plurality of thimbles are distributed The sides of the scraper. The wafer removing method according to claim 17, wherein the film is a UV tape. The wafer removing method according to claim 17, wherein the film is a blue film. A method for separating a wafer from a film for use in a semiconductor die bonding process, comprising: providing a thimble device having a squeegee; providing at least one wafer having a film adhered to the bottom; applying a positioning a process of positioning the wafer at a predetermined position above the thimble device such that the squeegee of the thimble device is located adjacent to an edge portion of the wafer; opening a vacuum to adsorb the wafer along with the film downward; the thimble device The squeegee moves upward from the first squeegee position to the second squeegee position to cause the squeegee to withstand the film; the wafer is moved horizontally along the first direction by a distance of about one wafer length; and the wafer is closed The vacuum is moved and the squeegee is moved down to the first squeegee position. The wafer and film separation method according to claim 30, wherein the squeegee is a sheet-like structure. The wafer and film separation method according to claim 30, wherein the squeegee is formed by arranging a plurality of needles. The wafer and film separation method according to claim 30, wherein the width of the squeegee is smaller than the width of the wafer. The wafer and film separation method according to claim 33, wherein the width of the blade is between 85% and 98% of the width of the wafer. The wafer and film separation method according to claim 30, wherein the positioning program is assisted by a CCD image sensor. A wafer and film separation method according to claim 30, wherein the wafer is a thin wafer. A wafer and film separation method according to claim 36, wherein the thin wafer has a thickness of less than 60 μm. The wafer and film separation method according to claim 30, wherein the film is a UV tape. The wafer and film separation method according to claim 30, wherein the film is a blue film. The wafer and film separation method according to claim 30, wherein the thimble device further comprises a plurality of thimbles. The wafer and film separation method according to claim 40, wherein the plurality of thimbles are distributed on both sides of the squeegee.