TWI846653B - Groove shaped device for stripping die and method for the same - Google Patents

Abstract

A groove shaped device for stripping die includes a main body and a vacuum device. The main body has a film stripping groove, a comb-shaped structure, a channel, and a plurality of through holes. The film stripping groove is configured on a top surface of the main body. The comb-shaped structure is disposed at a first end of the film stripping groove and includes a plurality of teeth and a plurality of recesses, and each recess is formed between two adjacent recesses. The channel is configured in the main body. The through holes are in communication with the channel respectively, and at least one through hole is in communication with the first end of the film stripping groove. The vacuum device is connected to the channel. Such that, the groove shaped device for stripping die can separate a target die from a film with a moderate manner by the film stripping groove and the comb-shaped structure as well as a negative pressure, the stress concentration cannot be happened, and the target die can avoid from damaging or the film can avoid from damaging and remaining on a surface of the target die.

Description

Grooved die stripping device and method

The present invention relates to a die stripping device and method, and in particular to a groove-shaped die stripping device and method.

After the wafer is cut into multiple dies, the dies will be transferred from the carrier film to the substrate. During the transfer process, first, the support device supports the die placement area of the carrier film; then, under ideal conditions, multiple pushers rise from the inside of the support device to the outside of the support device and push the target die up through the die placement area of the carrier film, so that the periphery of the target die is separated from the periphery of the die placement area of the carrier film, and the center of the target die is separated from the center of the die placement area of the carrier film; during the rise of the target die, the target die contacts the die bonding device, and the die bonding device absorbs the target die; finally, the pushers descend to the inside of the support device, and the die bonding device moves the target die to the substrate.

However, when the pushers push the target die up through the die placement area of the carrier film, the top of the pushers is sharp and the stress is easily over-concentrated, resulting in damage to the target die or damage to the carrier film and residues on the surface of the target die.

The main purpose of the present invention is to provide a groove-shaped die stripping device and method, which can separate the target die from the die placement area of the carrier film in a gentle manner.

In order to achieve the above-mentioned purpose, the present invention provides a groove-shaped grain stripping device, comprising a body and a vacuum device. The body comprises a film stripping groove, a comb-shaped structure, a channel and a plurality of through holes, the film stripping groove is arranged on the top surface of the body, the comb-shaped structure is arranged at a first end of the film stripping groove, and comprises a plurality of teeth and a plurality of grooves, each of which is formed between two adjacent teeth, the channel is arranged inside the body, the through holes are respectively connected to the channel, and at least one of the through holes is connected to the first end of the film stripping groove. The vacuum device is connected to the channel.

In some embodiments, the bottom of the stripping groove has a slope extending upward from the first end of the stripping groove toward a second end of the stripping groove, and the width of the stripping groove is greater than the width of a die.

In some embodiments, the slope is a plane.

In some embodiments, at least two of the through holes are respectively located on one side of at least two of the teeth.

In some embodiments, the grooved die stripping device further includes an image capture unit and a processing unit, wherein the image capture unit is disposed above the center of the body and is electrically connected to the processing unit.

In order to achieve the above-mentioned purpose, the present invention provides a method for stripping a grooved die, comprising the following steps: (a) moving a carrier film onto a body of a grooved die stripping device; (b) moving the body so that a first end of a target die on a die placement area of the carrier film exceeds a plurality of teeth of a comb-like structure of the body; (c) a vacuum device evacuates a channel of the body to generate a vacuum and provide a negative pressure, the The negative pressure sequentially passes through the channel, the plurality of through holes and the plurality of grooves of the comb-shaped structure of the body to absorb the grain placement area of the carrier film and fix the target grain. At the same time, another grain placement area of the carrier film is bent and enters a film stripping groove of the body, so that the first end of the target grain is separated from the grain placement area of the carrier film; (d) the vacuum device stops evacuating the channel to stop providing the negative pressure, so that the carrier film The other die placement area is restored to its original state by atmospheric pressure and is away from the film stripping groove, and the first end of the target die remains away from the die placement area of the carrier film; (e) repeatedly performing steps (b) to (d) so that the target die gradually separates from the die placement area of the carrier film from its first end to its second end; (f) when the second end of the target die is located above the toothed portion, the vacuum device is applied to the channel Pumping air to generate a vacuum and provide the negative pressure, the negative pressure passes through the channel, at least one of the through holes and the grooves to adsorb the grain placement area of the carrier film and fix the second end of the target grain; and (g) moving the body so that the second end of the target grain exceeds the equal tooth portion, and at the same time the vacuum device stops pumping air to the channel to stop providing the negative pressure, so that the target grain is completely separated from the grain placement area of the carrier film.

In some embodiments, step (c) further includes: the other grain placement area of the carrier film is against a slope at the bottom of the stripping groove, the slope extends upward from the first end of the stripping groove toward a second end of the stripping groove, the width of the stripping groove is greater than the width of a grain, and the other grain on the other grain placement area of the carrier film is located in the stripping groove.

In some embodiments, step (c) further includes: the bottom surface of the another die placement area of the carrier film is flatly attached to the slope, so that the bottom surface of the another die is flatly attached to the another die placement area of the carrier film.

In some embodiments, step (c) further includes: at least two of the through holes are respectively located on one side of at least two of the equal tooth portions, and the negative pressure uniformly adsorbs the grain placement area of the supporting film through at least two of the through holes, so that the first end of the target grain can completely detach from the grain placement area of the supporting film.

In some embodiments, between step (a) and step (b), further included is: step (h), an image capture unit of the grooved grain stripping device captures the image of the target grain; a processing unit of the grooved grain stripping device receives the image of the target grain and calculates the distance between the target grain and the center of the body based on the image of the target grain; and the processing unit controls the carrier film to move the target grain to the center of the body based on the distance between the target grain and the center of the body, so that the target grain is aligned with the film stripping groove.

The effect of the present invention is that the present invention can separate the target crystal grain from the carrier film in a relatively gentle manner by using the film stripping groove and the comb-shaped structure in combination with negative pressure, without the problem of stress concentration, thereby avoiding damage to the target crystal grain or damage to the carrier film and residues remaining on the surface of the target crystal grain.

The following is a more detailed description of the implementation of the present invention with reference to the drawings and component symbols, so that those skilled in the art can implement the present invention accordingly after reading this specification.

Fig. 1 is a three-dimensional diagram of the groove-shaped grain stripping device of the present invention. Fig. 2 is a top view of the groove-shaped grain stripping device of the present invention. Fig. 3 is a cross-sectional view of the groove-shaped grain stripping device of the present invention. Fig. 4A is a schematic diagram of the connection relationship between the vacuum device 20 and the channel 13 of the present invention. Fig. 4B is a schematic diagram of the connection relationship between the image capture unit 30 and the processing unit 40 of the present invention. As shown in Figs. 1 to 4B, the present invention provides a groove-shaped grain stripping device, comprising a body 10, a vacuum device 20, an image capture unit 30 and a processing unit 40. The body 10 includes a film stripping groove 11, a comb-shaped structure 12, a channel 13 and a plurality of through holes 14. The stripping groove 11 is disposed on the top surface of the main body 10. The comb-shaped structure 12 is disposed at a first end of the stripping groove 11, and has a plurality of teeth 121 and a plurality of grooves 122, each groove 122 being formed between two adjacent teeth 121. The channel 13 is disposed inside the main body 10. The through holes 14 are respectively connected to the channels 13, and three of the through holes 14 are connected to the first end of the stripping groove 11. The vacuum device 20 is connected to the channel 13. The image capture unit 30 is disposed above the center of the main body 10 and is electrically connected to the processing unit 40.

Fig. 5 is a flow chart of the groove-shaped grain stripping method of the present invention. Fig. 6A is a top view of step S10 of the groove-shaped grain stripping method of the present invention. Fig. 6B is a cross-sectional view of step S10 of the groove-shaped grain stripping method of the present invention. Fig. 7A is a top view of step S20 of the groove-shaped grain stripping method of the present invention. Fig. 7B is a cross-sectional view of step S20 of the groove-shaped grain stripping method of the present invention. Fig. 8A is a top view of step S30 of the groove-shaped grain stripping method of the present invention. Fig. 8B is a cross-sectional view of step S30 of the groove-shaped grain stripping method of the present invention. Fig. 9 is a cross-sectional view of step S40 of the groove-shaped grain stripping method of the present invention. Fig. 10 is a cross-sectional view of step S50 of the groove-shaped grain stripping method of the present invention. Fig. 11 is a cross-sectional view of step S60 of the groove-shaped grain stripping method of the present invention. Fig. 12A is a top view of step S70 of the groove-shaped grain stripping method of the present invention. Fig. 12B is a cross-sectional view of step S70 of the groove-shaped grain stripping method of the present invention. Fig. 13A is a top view of step S80 of the groove-shaped grain stripping method of the present invention. Fig. 13B is a cross-sectional view of step S80 of the groove-shaped grain stripping method of the present invention. The grooved grain stripping method of the present invention comprises the following steps:

In step S10, as shown in FIG. 5 , FIG. 6A and FIG. 6B , a carrier film 50 is moved onto the body 10 .

In step S20, as shown in FIG. 5 , FIG. 7A and FIG. 7B , the image capture unit 30 captures an image of a target grain 60 on a grain placement area 51 of the carrier film 50; the processing unit 40 (see FIG. 4B ) receives the image of the target grain 60 and calculates the distance between the target grain 60 and the center of the body 10 according to the image of the target grain 60; and the processing unit 40 controls the carrier film 50 to move the target grain 60 to the center of the body 10 according to the distance between the target grain 60 and the center of the body 10, so that the target grain 60 is aligned with the film stripping groove 11.

In step S30, as shown in FIG. 5 , FIG. 8A and FIG. 8B , the main body 10 is moved so that a first end of the target die 60 is beyond the tooth portion 121 .

In step S40, as shown in FIG. 5 and FIG. 9, the vacuum device 20 evacuates the channel 13 to generate a vacuum and provides a negative pressure 21. The negative pressure 21 sequentially passes through the channel 13, the through holes 14 and the grooves 122 to adsorb the grain placement area 51 of the carrier film 50 and fix the target grain 60. At the same time, another grain placement area 52 of the carrier film 50 is bent and enters the film stripping groove 11, so that the first end of the target grain 60 is separated from the grain placement area 51 of the carrier film 50.

In step S50, as shown in FIG. 5 and FIG. 10, the vacuum device 20 stops evacuating the channel 13 to stop providing the negative pressure 21, so that the other die placement area 52 of the carrier film 50 is restored to its original state by the atmospheric pressure and is away from the film stripping groove 11, and the first end of the target die 60 remains away from the die placement area 51 of the carrier film 50.

Step S60, as shown in FIG5 and FIG11, repeats step S30, step S40 and step S50, so that the target die 60 gradually leaves the die placement area 51 of the carrier film 50 from the first end to the second end. Specifically, step S30, step S40 and step S50 are repeated with a cycle of 15 milliseconds. In each cycle, the moving time of the carrier film 50 is 5 milliseconds, the moving distance of the carrier film 50 is 0.2 mm, and the switching time of the negative pressure 21 is 3 milliseconds.

In step S70, as shown in FIG. 5 , FIG. 12A and FIG. 12B , when the second end of the target grain 60 is located above the tooth portions 121, the vacuum device 20 evacuates the channel 13 to generate a vacuum and provides a negative pressure 21. The negative pressure 21 passes through the channel 13, three of the through holes 14 and the grooves 122 to adsorb the grain placement area 51 of the carrier film 50 and fix the second end of the target grain 60.

In step S80, as shown in FIG. 5 , FIG. 13A and FIG. 13B , the main body 10 is moved so that the second end of the target crystal grain 60 exceeds the tooth portion 121 , and at the same time, the vacuum device 20 stops evacuating the channel 13 to stop providing the negative pressure 21 , so that the target crystal grain 60 is completely separated from the crystal grain placement area 51 of the carrier film 50 .

Thus, the present invention can separate the target crystal grain 60 from the carrier film 50 in a gentle manner by means of the stripping groove 11 and the comb-shaped structure 12 in conjunction with the negative pressure 21, without causing stress concentration problems, thereby preventing the target crystal grain 60 from being damaged or the carrier film 50 from being damaged and remaining on the surface of the target crystal grain 60.

Furthermore, the cooperation between the image capture unit 30 and the processing unit 40 can ensure that the target die 60 is aligned with the film stripping groove 11, and prevent one side of the target die 60 from deviating outside the film stripping groove 11, resulting in the target die 60 being unable to be separated from the carrier film 50.

As shown in FIG. 1 and FIG. 3 , in a preferred embodiment, the bottom of the stripping groove 11 has a slope 111, and the slope 111 extends upward from a first end of the stripping groove 11 to a second end of the stripping groove 11, and the width of the stripping groove 11 is greater than the width of the die. In other words, the first end of the stripping groove 11 is the lowest point of the slope 111, and the second end of the stripping groove 11 is the highest point of the slope 111. Step S40, as shown in FIG. 9 , in a preferred embodiment, another die placement area 52 of the carrier film 50 abuts against the slope 111, and another die 61 on another die placement area 52 of the carrier film 50 is located in the stripping groove 11 to prevent the other die 61 from being broken.

Preferably, the width of the stripping groove 11 is about 240 to 260 mm greater than the width of the die. The width difference is within a range that can better ensure that the other die 61 will not be broken. is better.

Preferably, the slope 111 is a plane. In other words, the slope 111 does not have any protrusions. Step S40 further includes: the bottom surface of another die placement area 52 of the carrier film 50 is flatly attached to the slope 111, so that the bottom surface of another die 61 is flatly attached to the other die placement area 52 of the carrier film 50.

As shown in Fig. 1, Fig. 2 and Fig. 3, in a preferred embodiment, three of the through holes 14 are respectively located on one side of three of the teeth 121. As shown in Fig. 9, in a preferred embodiment, step S40 further includes: negative pressure 21 passes through three of the through holes 14 to uniformly absorb the die placement area 51 of the carrier film 50, so that the first end of the target die 60 can completely separate from the die placement area 51 of the carrier film 50. To be more clear, the bending surface of the other die placement area 52 of the carrier film 50 is quite smooth without any ups and downs, so the first end of the target die 60 can completely break away from the die placement area 51 of the carrier film 50, and there will not be a problem that only a portion of the first end of the target die 60 breaks away from the die placement area 51 of the carrier film 50, but the other portion of the first end of the target die 60 is still attached to the die placement area 51 of the carrier film 50.

The above is only used to explain the preferred embodiments of the present invention, and is not intended to limit the present invention in any form. Therefore, any modifications or changes made to the present invention under the same spirit of the invention should still be included in the scope of protection of the present invention.

10: body 11: film stripping groove 111: slope 12: comb-like structure 121: teeth 122: groove 13: channel 14: through hole 20: vacuum device 21: negative pressure 30: image capture unit 40: processing unit 50: carrier film 51: die placement area 52: another die placement area 60: target die 61: another die S10～S80: steps

FIG. 1 is a perspective view of the groove-shaped grain stripping device of the present invention. FIG. 2 is a top view of the groove-shaped grain stripping device of the present invention. FIG. 3 is a cross-sectional view of the groove-shaped grain stripping device of the present invention. FIG. 4A is a schematic diagram of the connection relationship between the vacuum device and the channel of the present invention. FIG. 4B is a schematic diagram of the connection relationship between the image capture unit and the processing unit of the present invention. FIG. 5 is a flow chart of the groove-shaped grain stripping method of the present invention. FIG. 6A is a top view of step S10 of the groove-shaped grain stripping method of the present invention. FIG. 6B is a cross-sectional view of step S10 of the groove-shaped grain stripping method of the present invention. FIG. 7A is a top view of step S20 of the groove-shaped grain stripping method of the present invention. FIG. 7B is a cross-sectional view of step S20 of the groove-shaped grain stripping method of the present invention. FIG. 8A is a top view of step S30 of the groove-shaped grain stripping method of the present invention. FIG. 8B is a cross-sectional view of step S30 of the groove-shaped grain stripping method of the present invention. FIG. 9 is a cross-sectional view of step S40 of the groove-shaped grain stripping method of the present invention. FIG. 10 is a cross-sectional view of step S50 of the groove-shaped grain stripping method of the present invention. FIG. 11 is a cross-sectional view of step S60 of the groove-shaped grain stripping method of the present invention. FIG. 12A is a top view of step S70 of the groove-shaped grain stripping method of the present invention. FIG. 12B is a cross-sectional view of step S70 of the groove-shaped grain stripping method of the present invention. FIG. 13A is a top view of step S80 of the groove-shaped grain stripping method of the present invention. FIG. 13B is a cross-sectional view of step S80 of the groove-shaped grain stripping method of the present invention.

10: Body

11: Stripping groove

111: Slope

12: Comb structure

121: Teeth

122: Groove

14:Through hole

Claims (10)

A groove-shaped grain stripping device comprises: a body, comprising a stripping groove, a comb-shaped structure, a channel and a plurality of through holes, wherein the stripping groove is arranged on the top surface of the body, the comb-shaped structure is arranged at a first end of the stripping groove and comprises a plurality of teeth and a plurality of grooves, each of which is formed between two adjacent teeth, the channel is arranged inside the body, the through holes are respectively connected to the channel, and at least one of the through holes is connected to the first end of the stripping groove; and a vacuum device connected to the channel. A groove-shaped chip stripping device as described in claim 1, wherein the bottom of the stripping groove has a slope, the slope extends upward from the first end of the stripping groove toward a second end of the stripping groove, and the width of the stripping groove is greater than the width of a chip. A groove-shaped die stripping device as described in claim 2, wherein the slope is a plane. A groove-shaped die stripping device as described in claim 1, wherein at least two of the through holes are respectively located on one side of at least two of the equal tooth portions. The grooved die stripping device as described in claim 1 further includes an image capture unit and a processing unit, wherein the image capture unit is disposed above the center of the main body and is electrically connected to the processing unit. A method for stripping a grooved grain comprises the following steps: (a) moving a carrier film onto a body of a grooved grain stripping device; (b) moving the body so that a first end of a target grain on a grain placement area of the carrier film exceeds a plurality of teeth of a comb-shaped structure of the body; (c) a vacuum device evacuates a channel of the body to generate a vacuum and provide a negative pressure, the negative pressure sequentially passes through the channel of the body, a plurality of through holes and a plurality of grooves of the comb-shaped structure to adsorb the grain placement area of the carrier film and fix the target grain, while another grain placement area of the carrier film is bent and enters a film stripping groove of the body, so that the first end of the target grain is separated from the grain placement area of the carrier film; (d) The vacuum device stops evacuating the channel to stop providing the negative pressure, so that the other die placement area of the carrier film is restored to its original state by atmospheric pressure and is away from the film stripping groove, and the first end of the target die remains separated from the die placement area of the carrier film; (e) Repeating steps (b) to (d), the target die gradually separates from the die placement area of the carrier film from its first end to its second end; (f) When the second end of the target crystal grain is located above the toothed portion, the vacuum device evacuates the channel to generate a vacuum and provides the negative pressure, and the negative pressure passes through the channel, at least one of the through holes and the grooves to adsorb the crystal grain placement area of the carrier film and fix the second end of the target crystal grain; and (g) Move the body so that the second end of the target crystal grain exceeds the toothed portion, and at the same time, the vacuum device stops evacuating the channel to stop providing the negative pressure, so that the target crystal grain completely leaves the crystal grain placement area of the carrier film. A groove-shaped grain stripping method as described in claim 6, wherein step (c) further includes: the other grain placement area of the carrier film abuts against a slope at the bottom of the stripping groove, the slope extends upward from the first end of the stripping groove toward a second end of the stripping groove, the width of the stripping groove is greater than the width of a grain, and the other grain on the other grain placement area of the carrier film is located in the stripping groove. The grooved die stripping method as described in claim 7, wherein step (c) further includes: the bottom surface of the other die placement area of the carrier film is flat against the slope, so that the bottom surface of the other die is flat against the other die placement area of the carrier film. A groove-shaped grain stripping method as described in claim 6, wherein step (c) further includes: at least two of the through holes are respectively located on one side of at least two of the equal tooth portions, and the negative pressure passes through at least two of the through holes to uniformly adsorb the grain placement area of the supporting film, so that the first end of the target grain can be completely separated from the grain placement area of the supporting film. A grooved grain stripping method as described in claim 6, further comprising between step (a) and step (b): step (h), wherein an image capture unit of the grooved grain stripping device captures the image of the target grain; a processing unit of the grooved grain stripping device receives the image of the target grain and calculates the distance between the target grain and the center of the body based on the image of the target grain; and the processing unit controls the carrier film to move the target grain to the center of the body based on the distance between the target grain and the center of the body, so that the target grain is aligned with the film stripping groove.

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