TWI717775B - Needle device for die - Google Patents

Abstract

The present disclosure relates to a needle device including a needle holder, a needle clamp and a needle. The needle holder has a platform and a sidewall surrounding the platform. The needle clamp is disposed on the sidewall of the needle holder. The needle clamp has a plurality of holes. The needle is disposed on the platform of the needle holder and penetrates one of the holes of the needle clamp.

Description

Die thimble device

This disclosure relates to a thimble device, especially to a thimble device for die.

When making an integrated circuit, multiple semiconductor processes are required on the wafer. After the wafer is fabricated and singulation is performed into a plurality of dies, the dies are temporarily pasted on a tape, and then the dies are picked up from the tape for processing. In the next process step, the most common die picking method is to set a thimble device under the tape and a vacuum suction head above the die. After the thimble device is aligned with the position of the die to be picked up, the thimble device moves upward Lifting the crystal grain to make the crystal grain protrude from other crystal grains so that the crystal grain is close to the vacuum suction head, and then the vacuum suction head sucks the crystal grain away from the adhesive tape. The above steps can be repeated until the die on the tape is picked up.

The current thimble device includes a plurality of thimble pins, which are respectively fixed on the splint by clamping jaws and screws. However, since there is no supporting member at the bottom of the thimble (that is, the bottom of the thimble is hollow), the height difference between the thimble is prone to occur when multiple thimbles are assembled. In addition, under the high-speed and long-term continuous operation of the thimble device, the thimble is easy to loosen, resulting in a height difference. When a thimble with a height difference is used to push up the crystal grains, the crystal grains will not rise vertically, causing a tilt, and then colliding with adjacent crystal grains, causing damage to the crystal grains.

An embodiment of the present disclosure relates to a thimble device, which includes a thimble holder, a thimble clamp and a thimble. The thimble seat has a platform and a side wall, and the side wall is located around the platform. The thimble clamping plate is arranged on the side wall of the thimble seat. The thimble splint has a plurality of holes. The thimble is located on the platform of the thimble seat and penetrates one of the plurality of holes of the thimble splint.

Another embodiment of the present disclosure relates to a thimble device, which includes one or more thimble and an outer cover. The outer cover covers the one or more thimble when the thimble device is not in use. The outer cover has a top surface, and the top surface has a plurality of holes. The plurality of holes of the outer cover are arranged in an M×N array, and M and N are positive integers greater than 0. The position of the one or more thimble is relative to one or more of the plurality of holes of the outer cover.

FIG. 1 is an exploded view of a thimble device 1 according to some embodiments of the disclosure. 2 is a perspective cross-sectional view of a thimble device 1 according to some embodiments of the disclosure. As shown in FIGS. 1 and 2, the thimble device 1 includes a pneumatic cylinder connector 10, a thimble seat 11, a thimble clamping plate 12, a thimble 13 and an outer cover 14.

The pneumatic cylinder connector 10 is connected to an air cylinder (not shown in the figure). With the reciprocating movement of the cylinder piston, the pneumatic cylinder connector 10 drives the thimble seat 11 and the thimble clamping plate 12 to reciprocate in the outer cover 14 movement. According to some embodiments of the present disclosure, the pneumatic cylinder connector 10 can be connected to an electric cylinder, a pneumatic cylinder, a hydraulic cylinder or other suitable cylinders.

The thimble seat 11 is coupled to the pneumatic cylinder connector 10. As shown in FIGS. 1 and 2, the thimble seat 11 has a protruding portion 11 a that can be aligned and inserted into a recessed portion 10 a of the pneumatic cylinder connector 10. The thimble holder 11 can be used to place the thimble clamping plate 12 and the thimble 13. For example, the thimble seat 11 has a platform 11b and a side wall 11c, and the side wall 11c is located around the platform 11b and at least partially surrounds the platform 11b. The thimble clamping plate 12 is placed on the side wall 11c of the thimble seat 11. The thimble holder 11 and the thimble clamping plate 12 have corresponding screw holes, so that the thimble holder 11 and the thimble clamping plate 12 are joined (eg fastened) by screws 15. As shown in FIG. 2, the thimble 13 is placed on the platform 11b of the thimble base 11 (for example, the thimble base touches the thimble 13), and the platform 11b of the thimble base 11 provides support for the thimble 13 , To ensure that the thimble 13 is on the same level (if there is no height difference). In this way, it can be ensured that when the thimbles 13 push up the crystal grains, the crystal grains can rise vertically, and avoid colliding with adjacent crystal grains due to the tilt of the crystal grains.

10個孔洞12h，該等孔洞12h以正方形排列於該頂針夾板12之中央位置。該等孔洞12h以正方形排列可增加頂針13之排列上之靈活度。例如，可依晶粒之不同形狀及大小，選取需配置頂針13之孔洞12h位置及數量，以達到穩定抬升晶粒之目的。例如，當所欲抬升之晶粒為正方形、長方形或圓形時，則可將頂針13配置於符合該晶粒大小形狀之相對孔洞12h內。 The thimble clamping plate 12 has a plurality of holes 12h, and the holes 12h pass through the thimble clamping plate 12, so that the thimble 13 can pass through the holes 12h and move in the holes 12h. As shown in Figure 3 (which reveals a top view of the thimble clamp 12 according to some embodiments of the present disclosure), the thimble clamp 12 has 10

There are ten holes 12h, and the holes 12h are arranged in a square at the center of the thimble clamp plate 12. The arrangement of the holes 12h in a square can increase the flexibility of the arrangement of the thimble 13. For example, according to the different shapes and sizes of the crystal grains, the position and number of the holes 12h where the thimble 13 needs to be arranged can be selected to achieve the purpose of stably raising the crystal grains. For example, when the crystal grain to be lifted is square, rectangular, or circular, the thimble 13 can be arranged in the relative hole 12h corresponding to the size and shape of the crystal grain.

N個孔洞，其中M、N為大於0之正整數。根據不同的設計需求，孔洞12h之排列位置及形狀可任意調整改變。孔洞12h之直徑及相鄰孔洞之間距可依設計或應用需求（如晶粒大小、形狀等）任意調整。根據本揭露之部分實施例，孔洞12h之直徑為0.2毫米（mm）至0.5mm。根據本揭露之部分實施例，相鄰孔洞間的距離為0.5mm。根據本揭露之部分實施例，該頂針夾板12具有一機構（如類似子母螺絲之機構），可將穿過該等孔洞12h之多個頂針13一次夾緊，進而節省半導體製程中替換頂針所需之時間。 According to different design requirements, the thimble splint 12 can have M

N holes, where M and N are positive integers greater than 0. According to different design requirements, the arrangement and shape of the holes 12h can be adjusted and changed at will. The diameter of the hole 12h and the distance between adjacent holes can be adjusted arbitrarily according to design or application requirements (such as grain size, shape, etc.). According to some embodiments of the present disclosure, the diameter of the hole 12h is 0.2 millimeters (mm) to 0.5 mm. According to some embodiments of the present disclosure, the distance between adjacent holes is 0.5 mm. According to some embodiments of the present disclosure, the thimble clamping plate 12 has a mechanism (such as a mechanism similar to a screw-in screw) that can clamp a plurality of thimble 13 passing through the holes 12h at one time, thereby saving the replacement of thimble in the semiconductor manufacturing process. The time needed.

As shown in FIGS. 1 and 2, the outer cover 14 has a cavity for accommodating the pneumatic cylinder connector 10, the thimble seat 11, the thimble clamping plate 12 and the thimble 13. In other words, the outer cover 14 covers the pneumatic cylinder connector 10, the thimble seat 11, the thimble clamping plate 12 and the thimble 13 to protect the pneumatic cylinder connector 10, the thimble seat 11, the thimble clamping plate 12 and the thimble 13. According to some embodiments of the present disclosure, the outer cover 14 has a cylindrical shape. According to different design requirements, the outer cover 14 can have other shapes.

The top surface of the outer cover 14 has a plurality of holes 14h, and the size and position of the holes 14h are relative to the size and position of the hole 12h of the thimble splint 12. For example, the positions of the holes 14h of the outer cover 14 are aligned with the positions of the holes 12h of the thimble clamp plate 12 in a direction perpendicular to the top surface of the outer cover 14 for the thimble 13 to move in the holes 14h. As shown in FIG. 2, when the thimble device 1 is not in use, the thimble 13 passes through the hole 12h on the thimble clamping plate 12, but does not pass through the hole 14h of the outer cover 14. In other words, when the thimble device 1 is not in use, the thimble 13 is retracted in the outer cover 14 (or below the holes 14h) to protect the thimble 13. As shown in Figure 4 (which is a perspective view of a part of the ejector device 1 of Figures 1 and 2), when the ejector device 1 is used to lift the die 20, the pneumatic cylinder connector 10 is driven by the cylinder to drive the ejector pin seat 11, the The thimble clamping plate 12 moves toward the die, so that the thimble 13 protrudes from the hole 14h of the outer cover 14 to lift the die 20.

According to some embodiments of the present disclosure, the thimble device 1 may further include a base (not shown in the figure) for supporting the pneumatic cylinder connector 10, the thimble seat 11, the thimble clamping plate 12, the thimble 13 and the outer cover 14. The upper surface or side surface of the base may have a limiting part (such as a groove, a hole, etc.), which may restrict the outer cover 14 from covering the pneumatic cylinder connector 10, the thimble seat 11, the thimble clamping plate 12 and the rear of the thimble 13 Position to ensure that the hole 14h of the outer cover 14 and the hole 12h of the thimble clamp 12 are aligned with each other.

According to some embodiments of the present disclosure, the pneumatic cylinder connector 10, the thimble seat 11, the thimble clamping plate 12, the thimble 13 and the outer cover 14 may comprise stainless steel, such as 304 stainless steel. According to other embodiments of the present disclosure, the pneumatic cylinder connector 10, the thimble seat 11, the thimble clamping plate 12, the thimble 13 and the outer cover 14 may also include other materials. According to some embodiments of the present disclosure, the outer cover 14 has a coating to prevent static electricity from accumulating, thereby protecting the die from electrostatic damage.

Although the technical content and features of the present invention are as described above, those with ordinary knowledge in the technical field of the present invention can still make many changes and modifications without departing from the teaching and disclosure of the present invention. Therefore, the scope of the present invention is not limited to the disclosed embodiments but includes other changes and modifications that do not deviate from the present invention, which are the scope covered by the following patent applications.

1 Thimble device 10 Air cylinder connector 10a Recessed part 11 Thimble holder 11a Protruding part 11b Platform 11c Sidewall 12 Thimble splint 12h Hole 13 Thimble 14 Outer cover 14h Hole 15 Screw 20 Die

Fig. 1 is an exploded view of a thimble device according to some embodiments of the disclosure. 2 is a perspective cross-sectional view of a thimble device according to some embodiments of the disclosure. Figure 3 is a top view of a thimble clamp according to some embodiments of the present disclosure. 4 is a perspective view of a partial structure of a thimble device according to some embodiments of the disclosure.

1 Thimble device 10 Air cylinder connector 10a Recessed part 11 Thimble holder 11a Protruding part 11b Platform 11c Sidewall 12 Thimble splint 12h Hole 13 Thimble 14 Outer cover 14h Hole 15 Screw

Claims (14)

A thimble device, comprising: a thimble seat with a platform and a side wall, the side wall is located around the platform; a thimble splint arranged on the side wall of the thimble seat, the thimble splint has a plurality of holes, And the thimble seat is joined with the thimble splint; and a thimble is located on the platform of the thimble seat and penetrates one of the plurality of holes of the thimble splint. For example, the thimble device of claim 1, wherein the holes of the thimble clamp are arranged in an M×N array, and M and N are positive integers greater than 0. Such as the thimble device of claim 2, wherein the holes of the thimble clamping plate are arranged in a square. Such as the thimble device of claim 1, which further includes an outer cover covering the thimble seat, the thimble clamping plate and the thimble. Such as the thimble device of claim 4, wherein a top surface of the outer cover has a plurality of holes, and the positions of the holes of the outer cover are aligned with the holes of the thimble splint in a direction perpendicular to the top surface . Such as the thimble device of claim 5, where When the thimble device is operated, the thimble protrudes out of one of the holes of the outer cover to support a semiconductor device; and when the thimble device is not operated, the thimble is retracted in the hole of the outer cover Below. For example, the thimble device of claim 5, which further includes: a pneumatic cylinder connector, which is connected between a pneumatic cylinder and the thimble seat, and is configured to be driven by the pneumatic cylinder, and push the thimble seat along Move in a direction perpendicular to the top surface of the outer cover. For example, the thimble device of claim 5, wherein the thimble seat touches the thimble and is configured to push the thimble out of one of the holes of the outer cover when the thimble device is operated. A thimble device, comprising: one or more thimble; an outer cover that covers the one or more thimble when the thimble device is not in use, the outer cover has a top surface, and the top surface has a plurality of holes; a A thimble splint, the thimble splint is covered by the outer cover; and a thimble holder, which has a platform and a side wall, the side wall is located around the platform, wherein the thimble splint is located on the side wall of the thimble seat, and the The platform of the thimble base touches the one or more thimbles, wherein the plurality of holes of the outer cover are arranged in an M×N array, and M and N are positive integers greater than 0, and the one or more The position of each thimble is relative to one or more of the plurality of holes of the outer cover. Such as the thimble device of claim 9, wherein the plurality of holes of the outer cover are arranged in a square. For example, the thimble device of claim 9, wherein the thimble splint has a plurality of holes, and the one or more thimble penetrates one or more of the holes of the thimble splint. Such as the thimble device of claim 11, wherein the positions of the plurality of holes of the outer cover are aligned with the positions of the plurality of holes of the thimble cleat in a direction perpendicular to the top surface of the outer cover. For example, the thimble device of claim 9, which further includes: a pneumatic cylinder connector, which is connected between a pneumatic cylinder and the thimble seat, and is configured to be driven by the pneumatic cylinder, and push the thimble seat along Move in a direction perpendicular to the top surface of the outer cover. Such as the thimble device of claim 9, wherein when the thimble device is operated, the one or more thimble protrudes out of one or more of the plurality of holes of the outer cover to support a semiconductor device; and when the thimble device is operated When not operating, the one or more thimble is retracted under the plurality of holes of the outer cover.

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