TWI717775B - Needle device for die - Google Patents
Needle device for die Download PDFInfo
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- TWI717775B TWI717775B TW108122359A TW108122359A TWI717775B TW I717775 B TWI717775 B TW I717775B TW 108122359 A TW108122359 A TW 108122359A TW 108122359 A TW108122359 A TW 108122359A TW I717775 B TWI717775 B TW I717775B
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- thimble
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Abstract
Description
本揭露係有關於頂針裝置,特別是有關用於晶粒之頂針裝置。This disclosure relates to a thimble device, especially to a thimble device for die.
製作積體電路時,需在晶圓上經過多道半導體製程。在晶圓(wafer)製作完畢進行切單(singulation)成複數個晶粒(die)後,該等晶粒會暫時黏貼於一膠帶上,再自膠帶上分別拾取(pick up)晶粒以進行下一道製程步驟,其中最常見的晶粒拾取作法,係於膠帶下方設有一頂針裝置,而晶粒上方設有一真空吸頭,待頂針裝置對準所欲拾取之晶粒位置後,頂針裝置向上抬升該晶粒,使該晶粒凸出於其他晶粒,以使該晶粒靠近真空吸頭,再由真空吸頭將該晶粒吸取脫離該膠帶。上述步驟可重覆,直至膠帶上之晶粒被拾取完畢。When making an integrated circuit, multiple semiconductor processes are required on the wafer. After the wafer is fabricated and singulation is performed into a plurality of dies, the dies are temporarily pasted on a tape, and then the dies are picked up from the tape for processing. In the next process step, the most common die picking method is to set a thimble device under the tape and a vacuum suction head above the die. After the thimble device is aligned with the position of the die to be picked up, the thimble device moves upward Lifting the crystal grain to make the crystal grain protrude from other crystal grains so that the crystal grain is close to the vacuum suction head, and then the vacuum suction head sucks the crystal grain away from the adhesive tape. The above steps can be repeated until the die on the tape is picked up.
目前之頂針裝置包含複數個頂針,其分別以夾爪及螺絲固定於夾板上。然而,由於頂針底部並無任何支撐構件(即頂針下方為中空),故組裝多個頂針時容易產生頂針間的高低落差。此外,在頂針裝置高速與長時間連續動作下,亦容易使頂針鬆脫,產生高低差。使用具有高低差的頂針頂起晶粒時,會使晶粒並非垂直上升,產生傾斜,進而碰撞鄰近的晶粒,造成晶粒損毀。The current thimble device includes a plurality of thimble pins, which are respectively fixed on the splint by clamping jaws and screws. However, since there is no supporting member at the bottom of the thimble (that is, the bottom of the thimble is hollow), the height difference between the thimble is prone to occur when multiple thimbles are assembled. In addition, under the high-speed and long-term continuous operation of the thimble device, the thimble is easy to loosen, resulting in a height difference. When a thimble with a height difference is used to push up the crystal grains, the crystal grains will not rise vertically, causing a tilt, and then colliding with adjacent crystal grains, causing damage to the crystal grains.
本揭露之一實施例係關於一種一種頂針裝置,其包含一頂針座、一頂針夾板及一頂針。該頂針座具有一平台及一側壁,該側壁位於該平台之周圍。該頂針夾板配置於該頂針座之該側壁上。該頂針夾板具有複數個孔洞。該頂針位於該頂針座之該平台上 ,並貫穿該頂針夾板之該複數個孔洞之一者。An embodiment of the present disclosure relates to a thimble device, which includes a thimble holder, a thimble clamp and a thimble. The thimble seat has a platform and a side wall, and the side wall is located around the platform. The thimble clamping plate is arranged on the side wall of the thimble seat. The thimble splint has a plurality of holes. The thimble is located on the platform of the thimble seat and penetrates one of the plurality of holes of the thimble splint.
本揭露之另一實施例係關於一種頂針裝置,其包含一或多個頂針及一外蓋。該外蓋於該頂針裝置未使用時覆蓋該一或多個頂針。該外蓋具有一頂部表面,該頂部表面具有複數個孔洞。該外蓋之該複數個孔洞係以M×N之陣列排列,且M、N為大於0之正整數。該一或多個頂針之位置係相對於該外蓋之該複數個孔洞之一或多者。Another embodiment of the present disclosure relates to a thimble device, which includes one or more thimble and an outer cover. The outer cover covers the one or more thimble when the thimble device is not in use. The outer cover has a top surface, and the top surface has a plurality of holes. The plurality of holes of the outer cover are arranged in an M×N array, and M and N are positive integers greater than 0. The position of the one or more thimble is relative to one or more of the plurality of holes of the outer cover.
圖1是根據本揭露之部分實施例的一種頂針裝置1之爆炸圖。圖2是根據本揭露之部分實施例的一種頂針裝置1之立體剖面圖。如圖1及2所示,該頂針裝置1包括一氣壓缸連接器10、一頂針座11、一頂針夾板12、頂針13及一外蓋14。FIG. 1 is an exploded view of a
該氣壓缸連接器10係連接至一氣缸(未顯示於圖上),隨著氣缸活塞之往復運動,該氣壓缸連接器10驅動該頂針座11、該頂針夾板12於該外蓋14內往復運動。根據本揭露之部分實施例,該氣壓缸連接器10可連接至電動氣缸、氣動氣缸、液壓氣缸或其他合適之汽缸。The
該頂針座11與該氣壓缸連接器10耦接。如圖1及圖2所示,該頂針座11具有一凸出部11a,其可對準插入該氣壓缸連接器10之一凹陷部10a。該頂針座11可用於放置該頂針夾板12及該頂針13。例如,該頂針座11具有一平台11b及側壁11c,該側壁11c位於該平台11b之周圍,並至少部分地環繞該平台11b。該頂針夾板12係放置於該頂針座11之側壁11c上。該頂針座11與該頂針夾板12具有對應之螺絲孔,以藉由螺絲15將頂針座11及頂針夾板12接合(如拴緊)。如圖2所示,該等頂針13係放置於該頂針座11之平台11b上(例如該頂針座係頂觸該等頂針13),由該頂針座11之平台11b對該等頂針13提供支撐,確保該等頂針13係位於同一水平面上(如沒有高低差)。如此可確保該等頂針13將晶粒往上頂時,可使晶粒垂直上升,避免因晶粒傾斜而碰撞鄰近的晶粒。The
該頂針夾板12具有多個孔洞12h,該等孔洞12h貫穿頂針夾板12,以供頂針13貫穿該等孔洞12h,於該等孔洞12h中移動。如圖3所示(其揭示根據本揭露之部分實施例之頂針夾板12之俯視圖),頂針夾板12具有10
10個孔洞12h,該等孔洞12h以正方形排列於該頂針夾板12之中央位置。該等孔洞12h以正方形排列可增加頂針13之排列上之靈活度。例如,可依晶粒之不同形狀及大小,選取需配置頂針13之孔洞12h位置及數量,以達到穩定抬升晶粒之目的。例如,當所欲抬升之晶粒為正方形、長方形或圓形時,則可將頂針13配置於符合該晶粒大小形狀之相對孔洞12h內。
The
根據不同的設計需求,頂針夾板12可具有M
N個孔洞,其中M、N為大於0之正整數。根據不同的設計需求,孔洞12h之排列位置及形狀可任意調整改變。孔洞12h之直徑及相鄰孔洞之間距可依設計或應用需求(如晶粒大小、形狀等)任意調整。根據本揭露之部分實施例,孔洞12h之直徑為0.2毫米(mm)至0.5mm。根據本揭露之部分實施例,相鄰孔洞間的距離為0.5mm。根據本揭露之部分實施例,該頂針夾板12具有一機構(如類似子母螺絲之機構),可將穿過該等孔洞12h之多個頂針13一次夾緊,進而節省半導體製程中替換頂針所需之時間。
According to different design requirements, the
如圖1及圖2所示,該外蓋14具有一空腔以容置氣壓缸連接器10、頂針座11、頂針夾板12及頂針13。換言之,該外蓋14包覆氣壓缸連接器10、頂針座11、頂針夾板12及頂針13,以保護氣壓缸連接器10、頂針座11、頂針夾板12及頂針13。根據本揭露之部分實施例,該外蓋14為一圓桶狀。根據不同的設計需求,該外蓋14可為其他形狀。As shown in FIGS. 1 and 2, the
該外蓋14之頂部表面具有多個孔洞14h,該等孔洞14h之大小及位置係相對於該頂針夾板12之孔洞12h之大小及位置。例如,該外蓋14之該等孔洞14h之位置係與該頂針夾板12之孔洞12h之位置在垂直該外蓋14之頂部表面之方向上對齊,以供頂針13於該等孔洞14h中移動。如圖2所示,當頂針裝置1未使用時,該等頂針13係穿出該頂針夾板12上之孔洞12h,但未穿出該外蓋14之孔洞14h。換言之,當頂針裝置1未使用時,該等頂針13係內縮於該外蓋14內(或該等孔洞14h之下方),以保護該等頂針13。如圖4所示(其為圖1及2之頂針裝置1之一部分之立體圖),當使用頂針裝置1抬升晶粒20時,氣壓缸連接器10受氣缸驅動,以帶動該頂針座11、該頂針夾板12朝晶粒移動,使頂針13凸出於該外蓋14之孔洞14h,以抬升晶粒20。The top surface of the
根據本揭露之部分實施例,頂針裝置1可進一步包含一底座(未顯示於圖上),其用以承載氣壓缸連接器10、頂針座11、頂針夾板12、頂針13及外蓋14。該底座之上表面或側表面可具有一限位部(如凹槽、孔洞等),其可限制該外蓋14蓋住氣壓缸連接器10、頂針座11、頂針夾板12及頂針13後之位置,進而確保該外蓋14之孔洞14h與頂針夾板12之孔洞12h互相對齊。According to some embodiments of the present disclosure, the
根據本揭露之部分實施例,氣壓缸連接器10、頂針座11、頂針夾板12、頂針13及外蓋14可包含不鏽鋼,如304不銹鋼。根據本揭露之其他實施例,氣壓缸連接器10、頂針座11、頂針夾板12、頂針13及外蓋14亦可包含其他材質。根據本揭露之部分實施例,該外蓋14具有一塗層,可防止靜電累積,進而保護晶粒不受靜電破壞。According to some embodiments of the present disclosure, the
雖然本發明之技術內容與特徵係如上所述,然於本發明之技術領域具有通常知識者仍可在不悖離本發明之教導與揭露下進行許多變化與修改。因此,本發明之範疇並非限定於已揭露之實施例而係包含不悖離本發明之其他變化與修改,其係如下列申請專利範圍所涵蓋之範疇。Although the technical content and features of the present invention are as described above, those with ordinary knowledge in the technical field of the present invention can still make many changes and modifications without departing from the teaching and disclosure of the present invention. Therefore, the scope of the present invention is not limited to the disclosed embodiments but includes other changes and modifications that do not deviate from the present invention, which are the scope covered by the following patent applications.
1 頂針裝置
10 氣壓缸連接器
10a 凹陷部
11 頂針座
11a 凸出部
11b 平台
11c 側壁
12 頂針夾板
12h 孔洞
13 頂針
14 外蓋
14h 孔洞
15 螺絲
20 晶粒
1
圖1是根據本揭露之部分實施例的一種頂針裝置之爆炸圖。 圖2是根據本揭露之部分實施例的一種頂針裝置之立體剖示圖。 圖3是根據本揭露之部分實施例的一種頂針夾板之俯視圖。 圖4是根據本揭露之部分實施例的一種頂針裝置之部分結構之立體圖。 Fig. 1 is an exploded view of a thimble device according to some embodiments of the disclosure. 2 is a perspective cross-sectional view of a thimble device according to some embodiments of the disclosure. Figure 3 is a top view of a thimble clamp according to some embodiments of the present disclosure. 4 is a perspective view of a partial structure of a thimble device according to some embodiments of the disclosure.
1 頂針裝置
10 氣壓缸連接器
10a 凹陷部
11 頂針座
11a 凸出部
11b 平台
11c 側壁
12 頂針夾板
12h 孔洞
13 頂針
14 外蓋
14h 孔洞
15 螺絲
1
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TW108122359A TWI717775B (en) | 2019-06-26 | 2019-06-26 | Needle device for die |
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TW108122359A TWI717775B (en) | 2019-06-26 | 2019-06-26 | Needle device for die |
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TW202101653A TW202101653A (en) | 2021-01-01 |
TWI717775B true TWI717775B (en) | 2021-02-01 |
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Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200735232A (en) * | 2006-03-03 | 2007-09-16 | King Yuan Electronics Co Ltd | Integrated module of ejector pin for chip detachment |
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Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200735232A (en) * | 2006-03-03 | 2007-09-16 | King Yuan Electronics Co Ltd | Integrated module of ejector pin for chip detachment |
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